JPH09214182A - Electronic component carriage height control method of electronic component equipping machine - Google Patents
Electronic component carriage height control method of electronic component equipping machineInfo
- Publication number
- JPH09214182A JPH09214182A JP8013130A JP1313096A JPH09214182A JP H09214182 A JPH09214182 A JP H09214182A JP 8013130 A JP8013130 A JP 8013130A JP 1313096 A JP1313096 A JP 1313096A JP H09214182 A JPH09214182 A JP H09214182A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- height
- suction nozzle
- circuit board
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を回路基
板上に装着する電子部品装着機の装着方法に関し、特
に、電子部品装着機の電子部品搬送高さ制御方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method of an electronic component mounting machine for mounting electronic components on a circuit board, and more particularly to a method of controlling an electronic component carrying height of the electronic component mounting machine.
【０００２】[0002]
【従来の技術】従来から、電子部品装着機には、多種多
様な電子部品を信頼性高く、且つ、高速で装着すること
が求められている。2. Description of the Related Art Conventionally, electronic component mounting machines have been required to mount various electronic components with high reliability and at high speed.
【０００３】電子部品装着機において、多種多様な電子
部品を信頼性高く、且つ、高速で装着する従来例を図
１、図３に基づいて説明する。A conventional example of mounting various electronic components with high reliability and at high speed in an electronic component mounting machine will be described with reference to FIGS. 1 and 3.
【０００４】電子部品装着機の斜視図である図１におい
て、１は電子部品９を装着する回路基板、２は前記回路
基板１を搬入・搬出する搬送手段、３、３は電子部品供
給部、４は電子部品９を吸着する吸着ノズル５を備えて
上下方向に移動する装着ヘッド、６は前記装着ヘッド４
をＸＹの水平２方向に移動し位置決めするＸＹロボッ
ト、７は前記吸着ノズル５が吸着した電子部品９の位置
補正量を計測する認識カメラ、８は装置全体のコントロ
ーラである。In FIG. 1, which is a perspective view of an electronic component mounting machine, 1 is a circuit board on which an electronic component 9 is mounted, 2 is a transfer means for loading and unloading the circuit board 1, 3 and 3 are electronic component supply parts, Reference numeral 4 denotes a mounting head that is equipped with a suction nozzle 5 that sucks an electronic component 9 and moves vertically, and 6 denotes the mounting head 4 described above.
Is an XY robot for moving and positioning in two horizontal directions of XY, 7 is a recognition camera for measuring the position correction amount of the electronic component 9 sucked by the suction nozzle 5, and 8 is a controller of the entire apparatus.
【０００５】次に、電子部品９を装着する場合の動作を
図１、図３に基づいて説明する。Next, the operation of mounting the electronic component 9 will be described with reference to FIGS. 1 and 3.
【０００６】予め、図３に示すように、吸着ノズル５が
吸着した電子部品９を搬送して、認識カメラ７の上方位
置から電子部品装着位置に移動する際に、前記電子部品
装着機が装着できる最大厚みの電子部品が回路基板１に
装着されており、且つ、前記電子部品装着機が装着でき
る最大厚みの電子部品が吸着ノズル５に吸着されている
と仮定した場合に、これらの電子部品を干渉させない吸
着ノズル５の先端の高さである固定電子部品搬送高さＨ
F を設定し、コントローラ８に記憶させる。In advance, as shown in FIG. 3, when the electronic component 9 adsorbed by the adsorption nozzle 5 is conveyed and moved from the position above the recognition camera 7 to the electronic component mounting position, the electronic component mounting machine mounts it. If it is assumed that the electronic component having the maximum possible thickness is mounted on the circuit board 1 and the electronic component having the maximum thickness that can be mounted by the electronic component mounting machine is sucked by the suction nozzle 5. Fixed electronic component transfer height H, which is the height of the tip of the suction nozzle 5 that does not interfere with
Set F and store in controller 8.
【０００７】次に、回路基板１が搬送手段２によって搬
入され、電子部品装着位置に位置決めされる。Next, the circuit board 1 is carried in by the carrying means 2 and positioned at the electronic component mounting position.
【０００８】次に、装着ヘッド４が、ＸＹロボット６に
移動させられて、先ず、電子部品供給部３の上方に移動
し位置決めし下降して、吸着ノズル５に電子部品９を吸
着させる。Next, the mounting head 4 is moved by the XY robot 6, and first, it is moved above the electronic component supply unit 3, positioned and lowered, and the electronic component 9 is sucked by the suction nozzle 5.
【０００９】次に、ＸＹロボット６の移動により、図３
に示すように、電子部品９を吸着した吸着ノズル５を認
識カメラ７の上に位置決めし、認識カメラ７が、前記吸
着ノズル５が吸着した電子部品９の位置補正量を計測す
る。Next, by moving the XY robot 6, the XY robot 6 is moved as shown in FIG.
As shown in FIG. 5, the suction nozzle 5 that has sucked the electronic component 9 is positioned on the recognition camera 7, and the recognition camera 7 measures the position correction amount of the electronic component 9 that the suction nozzle 5 has sucked.
【００１０】次に、図３に示すように、ＸＹロボット６
が移動すると同時に、装着ヘッド４を、前記固定電子部
品搬送高さＨF まで下降する。前記固定電子部品搬送高
さＨF まで下降した後は、前記固定電子部品搬送高さＨ
F を維持して部品装着位置まで移動し、位置決めする。
次に、吸着ノズル５を前記固定電子部品搬送高さＨFか
ら下降させて、電子部品９を回路基板１の所定位置に装
着する。Next, as shown in FIG. 3, the XY robot 6
At the same time, the mounting head 4 is lowered to the fixed electronic component carrying height H F. After descending to the fixed electronic component carrying height H F, the fixed electronic component carrying height H F
While maintaining F , move to the component mounting position and position.
Next, the suction nozzle 5 is lowered from the fixed electronic component carrying height H F , and the electronic component 9 is mounted on the circuit board 1 at a predetermined position.
【００１１】上記の装着後、装着ヘッド４が上昇し、再
び、電子部品装着位置に位置決めされ、上記の動作を繰
り返す。After the above-mentioned mounting, the mounting head 4 is raised and positioned again at the electronic component mounting position, and the above-mentioned operation is repeated.
【００１２】[0012]
【発明が解決しようとする課題】しかし、上記の従来例
の構成では、回路基板１に電子部品装着機が装着できる
最大厚みの電子部品９が装着されていない場合、又は、
吸着ノズル５が電子部品装着機が装着できる最大厚みの
電子部品９を吸着していない場合にも、前記固定電子部
品搬送高さＨF を維持して吸着ノズル５の先端が移動
し、部品装着位置に位置決めされる。従って、部品装着
時に、装着ヘッド４が上下方向に移動する距離が不必要
に長くなり、電子部品装着タクトが長くなり、電子部品
装着機の高速化を阻害する大きな要因になるという問題
点がある。However, in the configuration of the above conventional example, when the electronic component 9 having the maximum thickness that can be mounted by the electronic component mounting machine is not mounted on the circuit board 1, or
Even when the suction nozzle 5 does not suck the electronic component 9 having the maximum thickness that can be mounted by the electronic component mounting machine, the tip of the suction nozzle 5 moves while maintaining the fixed electronic component transport height H F , and the component mounting is performed. Be positioned in position. Therefore, there is a problem that the distance that the mounting head 4 moves in the vertical direction at the time of component mounting becomes unnecessarily long, the electronic component mounting tact becomes long, and it becomes a major factor that impedes the speedup of the electronic component mounting machine. .
【００１３】本発明は、上記の問題点を解決するため
に、電子部品装着機の電子部品装着タクトを短くする電
子部品装着機の電子部品搬送高さ制御方法の提供を課題
とする。In order to solve the above problems, it is an object of the present invention to provide an electronic component carrying height control method for an electronic component mounting machine which shortens the electronic component mounting tact time of the electronic component mounting machine.
【００１４】[0014]
【課題を解決するための手段】本発明の電子部品装着機
の電子部品搬送高さ制御方法は、上記の課題を解決する
ために、回路基板を搬入・位置決め・搬出する搬送手段
と、電子部品供給部と、電子部品を吸着する吸着ノズル
を備えて上下方向に移動する装着ヘッドと、前記装着ヘ
ッドをＸＹの水平２方向に移動し位置決めするＸＹロボ
ットとを有する電子部品装着機において、前記吸着ノズ
ルの移動中に吸着している電子部品と実装されている電
子部品とが干渉し合わない変動電子部品搬送高さＨ
V を、前記吸着ノズルが前記電子部品供給部から電子部
品を吸着する都度、回路基板に装着されている電子部品
の装着位置と高さと、前記吸着ノズルが吸着している電
子部品の高さとから更新する。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a method for controlling the height of carrying electronic parts in an electronic parts mounting machine according to the present invention includes a carrying means for carrying in, positioning and carrying out a circuit board, and electronic parts. In the electronic component mounting machine, the electronic component mounting machine includes a supply unit, a mounting head that includes a suction nozzle that suctions an electronic component, and moves in the vertical direction; and an XY robot that moves and positions the mounting head in two horizontal directions of XY. Fluctuating electronic component conveyance height H in which the electronic component attracted during the movement of the nozzle does not interfere with the mounted electronic component
Every time the suction nozzle sucks an electronic component from the electronic component supply unit, V is determined from the mounting position and height of the electronic component mounted on the circuit board and the height of the electronic component suctioned by the suction nozzle. Update.
【００１５】このようにすると、装着動作の都度、変動
電子部品搬送高さＨV を実態に合わせて更新するので、
部品装着時に、装着ヘッドが上下方向に移動する距離
が、電子部品の干渉を避けうる最低の高さになるので、
装着ヘッドの上下動作に無駄な動きが無くなり、電子部
品装着機の電子部品装着タクトを、信頼性を維持しなが
ら短くできる。By doing so, the variable electronic component carrying height H V is updated in accordance with the actual condition each time the mounting operation is performed.
When mounting components, the distance that the mounting head moves in the vertical direction is the minimum height to avoid interference of electronic components,
There is no unnecessary movement in the vertical movement of the mounting head, and the electronic component mounting tact of the electronic component mounting machine can be shortened while maintaining reliability.
【００１６】又、本発明の電子部品装着機の電子部品搬
送高さ制御方法は、電子部品搬送高さＨV を、回路基板
に装着されている最も高い電子部品の高さと前記吸着ノ
ズルが吸着している電子部品の高さとの和に余裕高さを
加えて更新すると、電子部品装着機の電子部品装着タク
トを、信頼性を維持しながら短くできる。Further, according to the electronic component carrying height control method of the electronic component mounting machine of the present invention, the electronic component carrying height H V is the height of the highest electronic component mounted on the circuit board and the suction nozzle sucks it. If the margin is added to the sum of the heights of the electronic components used, the electronic component mounting tact of the electronic component mounting machine can be shortened while maintaining reliability.
【００１７】又、本発明の電子部品装着機の電子部品搬
送高さ制御方法は、電子部品搬送高さＨV を、回路基板
に装着され、且つ、吸着ノズルの移動軌跡にある電子部
品の中で最も高い電子部品の高さと前記吸着ノズルが吸
着している電子部品の高さとの和に余裕高さを加えて更
新すると、電子部品装着機の電子部品装着タクトを更に
短くできる。Further, according to the electronic component carrying height control method of the electronic component mounting machine of the present invention, the electronic component carrying height H V is mounted on the circuit board, and the electronic component carrying height H V among the electronic components located on the moving path of the suction nozzle. If the margin height is added to the sum of the highest electronic component height and the electronic component height sucked by the suction nozzle, the electronic component mounting tact of the electronic component mounting machine can be further shortened.
【００１８】又、本発明の電子部品装着機の電子部品搬
送高さ制御方法は、吸着ノズルの移動軌跡を回路基板に
装着されている最も高い電子部品を避けるように設定す
ると、電子部品搬送高さＨV を低くできるので、電子部
品装着機の電子部品装着タクトを更に短くできる。Further, according to the electronic component carrying height control method of the electronic component mounting machine of the present invention, when the moving locus of the suction nozzle is set so as to avoid the highest electronic component mounted on the circuit board, the electronic component carrying height is set. Since the height H V can be lowered, the electronic component mounting tact of the electronic component mounting machine can be further shortened.
【００１９】[0019]
【発明の実施の形態】本発明の電子部品装着機の電子部
品搬送高さ制御方法の一実施の形態を図１、図２に基づ
いて説明する。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of an electronic component carrying height control method for an electronic component mounting machine according to the present invention will be described with reference to FIGS.
【００２０】電子部品装着機の斜視図である図１におい
て、１は電子部品９を装着する回路基板、２は前記回路
基板１を搬入・搬出する搬送手段、３、３は電子部品供
給部、４は電子部品９を吸着する吸着ノズル５を備えて
上下方向に移動する装着ヘッド、６は前記装着ヘッド４
をＸＹの水平２方向に移動し位置決めするＸＹロボッ
ト、７は前記吸着ノズル５が吸着した電子部品９の位置
補正量を計測する認識カメラ、８は装置全体のコントロ
ーラである。In FIG. 1, which is a perspective view of an electronic component mounting machine, 1 is a circuit board on which an electronic component 9 is mounted, 2 is a conveying means for loading and unloading the circuit board 1, 3 and 3 are electronic component supply parts, Reference numeral 4 denotes a mounting head that is equipped with a suction nozzle 5 that sucks an electronic component 9 and moves vertically, and 6 denotes the mounting head 4 described above.
Is an XY robot for moving and positioning in two horizontal directions of XY, 7 is a recognition camera for measuring the position correction amount of the electronic component 9 sucked by the suction nozzle 5, and 8 is a controller of the entire apparatus.
【００２１】次に、電子部品９を装着する場合の動作を
図１、図２に基づいて説明する。Next, the operation of mounting the electronic component 9 will be described with reference to FIGS.
【００２２】本実施の形態の特徴は、図２に示すよう
に、前記吸着ノズル５が吸着している電子部品９と、実
際に回路基板１に実装されている電子部品９、９、９、
・・とが干渉し合わない回路基板１から前記吸着ノズル
５までの距離を決める変動電子部品搬送高さＨV を、前
記吸着ノズル５による装着動作の都度、更新することで
ある。As shown in FIG. 2, the features of the present embodiment are that the electronic component 9 that is sucked by the suction nozzle 5 and the electronic components 9, 9, 9, which are actually mounted on the circuit board 1.
The variable electronic component conveyance height H V that determines the distance from the circuit board 1 to the suction nozzle 5 where they do not interfere with each other is updated every time the mounting operation by the suction nozzle 5 is performed.
【００２３】前記変動電子部品搬送高さＨV の更新は次
のようにして行う。The variable electronic component carrying height H V is updated as follows.
【００２４】先ず、電子部品装着機が実装する総ての電
子部品の品名、形状、寸法等の部品データをコントロー
ラ８に格納しておき、更に、実装する回路基板における
各部品の実装位置データを格納する。First, the controller 8 stores the component data such as the product names, shapes and dimensions of all the electronic components mounted by the electronic component mounting machine, and further the mounting position data of each component on the circuit board to be mounted. Store.
【００２５】次に、装着すべき回路基板１に前工程で装
着されている部品があれば、その部品に品名、形状、寸
法等の部品データをコントローラ８に入力する。Next, if there is a component mounted in the previous process on the circuit board 1 to be mounted, the component data such as the product name, shape, and size of the component is input to the controller 8.
【００２６】次に、コントローラ８は、回路基板１に実
際に装着されている電子部品の高さと、吸着ノズル５が
吸着している電子部品の高さとから、双方の電子部品が
干渉し合わない回路基板１から前記吸着ノズル５までの
距離である変動電子部品搬送高さＨV を更新する。Next, the controller 8 determines that the height of the electronic component actually mounted on the circuit board 1 and the height of the electronic component picked up by the suction nozzle 5 do not interfere with each other. The variable electronic component carrying height H V , which is the distance from the circuit board 1 to the suction nozzle 5, is updated.
【００２７】この場合、電子部品が装着されていない回
路基板１に最初に電子部品を装着する場合には、吸着ノ
ズル５に吸着されている電子部品９の高さに余裕高さを
加えたものが変動電子部品搬送高さＨV になる。余裕高
さは経験的に設定する。In this case, when the electronic component is first mounted on the circuit board 1 on which the electronic component is not mounted, the height of the electronic component 9 sucked by the suction nozzle 5 is added with a margin height. Becomes the fluctuating electronic component conveyance height H V. The surplus height is set empirically.
【００２８】２個目以後の電子部品９を装着する場合に
は、下記の２つの方法がある。When mounting the second and subsequent electronic parts 9, there are the following two methods.
【００２９】第１の方法は、吸着ノズル５に吸着されて
いる電子部品９の高さと、すでに回路基板１に装着され
ている電子部品の中で最も高い電子部品の高さとの和に
余裕高さを加えた変動電子部品搬送高さＨV に更新す
る。余裕高さは経験的に設定する。In the first method, the height of the electronic component 9 sucked by the suction nozzle 5 and the height of the highest electronic component among the electronic components already mounted on the circuit board 1 have a high margin. The variable electronic component transport height H V is added to the above. The surplus height is set empirically.
【００３０】第２の方法は、回路基板に装着され、且
つ、今回の装着における吸着ノズルの移動軌跡にある電
子部品の中で最も高い電子部品の高さと前記吸着ノズル
が吸着している電子部品の高さとの和に余裕高さを加え
てた変動電子部品搬送高さＨVに更新する。余裕高さは
経験的に設定する。The second method is the highest electronic component among the electronic components mounted on the circuit board and on the movement trajectory of the suction nozzle in this mounting, and the electronic component sucked by the suction nozzle. The height is changed to the variable electronic component transport height H V , which is the sum of the height and the margin height. The surplus height is set empirically.
【００３１】上記のようにして、変動電子部品搬送高さ
ＨV を更新する条件において、下記の装着動作を行う。As described above, the following mounting operation is performed under the condition that the variable electronic component carrying height H V is updated.
【００３２】先ず、回路基板１が搬送手段２によって搬
入され、電子部品装着位置に位置決めされる。First, the circuit board 1 is carried in by the carrying means 2 and positioned at the electronic component mounting position.
【００３３】次に、装着ヘッド４が、ＸＹロボット６に
移動させられて、先ず、電子部品供給部３の上方に移動
し位置決めし下降して、吸着ノズル５に電子部品９を吸
着させる。この時点で、コントローラ８は上記の変動電
子部品搬送高さＨV を更新する。Next, the mounting head 4 is moved by the XY robot 6, and first, it is moved above the electronic component supply unit 3, positioned and lowered, and the suction nozzle 5 sucks the electronic component 9. At this point, the controller 8 updates the variable electronic component carrying height H V.
【００３４】次に、ＸＹロボット６の移動により、図２
に示すように、電子部品９を吸着した吸着ノズル５を認
識カメラ７の上に位置決めし、認識カメラ７が、前記吸
着ノズル５が吸着した電子部品９の位置補正量を計測す
る。Next, the movement of the XY robot 6 causes the movement of FIG.
As shown in FIG. 5, the suction nozzle 5 that has sucked the electronic component 9 is positioned on the recognition camera 7, and the recognition camera 7 measures the position correction amount of the electronic component 9 that the suction nozzle 5 has sucked.
【００３５】次に、図２に示すように、ＸＹロボット６
が移動すると同時に、装着ヘッド４を、前記の更新され
た変動電子部品搬送高さＨV まで下降する。前記変動電
子部品搬送高さＨV まで下降した後は、前記変動電子部
品搬送高さＨV を維持して部品装着位置まで移動し、位
置決めする。Next, as shown in FIG. 2, the XY robot 6
At the same time as moves, the mounting head 4 is lowered to the updated variable electronic component transport height H V. After descending to the changing electronic component conveying height H V is to maintain the variation electronic component conveying height H V moves to the component mounting position, for positioning.
【００３６】次に、吸着ノズル５を前記変動電子部品搬
送高さＨV から下降させて、電子部品９を回路基板１の
所定位置に装着する。Next, the suction nozzle 5 is lowered from the variable electronic component carrying height H V to mount the electronic component 9 on the circuit board 1 at a predetermined position.
【００３７】上記の装着後、装着ヘッド４が上昇し、再
び、電子部品装着位置に位置決めされ、上記の動作を繰
り返す。After the above-mentioned mounting, the mounting head 4 is lifted and positioned at the electronic component mounting position again, and the above-mentioned operation is repeated.
【００３８】尚、吸着ノズルの移動軌跡を、コントロー
ラ８に格納されている電子部品の部品データと回路基板
への装着位置データとから、回路基板に装着されている
最も高い電子部品を避けるように設定すると、電子部品
搬送高さＨV を低くできるので、電子部品装着機の電子
部品装着タクトを更に短くできる。It should be noted that the movement locus of the suction nozzle should be determined based on the component data of the electronic component stored in the controller 8 and the mounting position data on the circuit board so as to avoid the highest electronic component mounted on the circuit board. If set, the electronic component transport height H V can be lowered, and therefore the electronic component mounting tact of the electronic component mounting machine can be further shortened.
【００３９】上記のようにすると、装着動作の都度、最
適高さである変動電子部品搬送高さＨV を更新するの
で、部品装着時に、装着ヘッドが上下方向に移動する距
離が、電子部品の干渉を避けうる最低の高さになるの
で、装着ヘッドの上下動作に無駄な動きが無くなり、電
子部品装着機の電子部品装着タクトを、信頼性を維持し
ながら短くできる。In the above-described manner, the variable electronic component carrying height H V , which is the optimum height, is updated every time the mounting operation is performed. Since the height is the minimum height at which interference can be avoided, there is no unnecessary movement in the vertical movement of the mounting head, and the electronic component mounting tact of the electronic component mounting machine can be shortened while maintaining reliability.
【００４０】[0040]
【発明の効果】本発明の電子部品装着機の電子部品搬送
高さ制御方法は、装着動作の都度、電子部品搬送高さ
を、回路基板に実装されている電子部品と吸着ノズルに
吸着されている電子部品の高さに合わせて、最適高さに
設定するので、部品装着時に、装着ヘッドが上下方向に
移動する距離が、電子部品の干渉を避けうる最低の高さ
になるので、装着ヘッドの上下動作に無駄な動きが無く
なり、電子部品装着機の電子部品装着タクトを、信頼性
を維持しながら短くできるという効果が得られる。According to the electronic component carrying height control method of the electronic component mounting machine of the present invention, the electronic component carrying height is sucked by the electronic component mounted on the circuit board and the suction nozzle each time the mounting operation is performed. Since the optimum height is set according to the height of existing electronic components, the distance that the mounting head moves in the vertical direction when mounting components is the minimum height that can avoid electronic component interference. There is no unnecessary movement in the vertical movement of the electronic component mounting machine, and the electronic component mounting tact of the electronic component mounting machine can be shortened while maintaining reliability.
【図１】電子部品装着機の斜視図である。FIG. 1 is a perspective view of an electronic component mounting machine.
【図２】本発明の電子部品装着機の電子部品搬送高さ制
御方法の一実施の形態の動作を示す図である。FIG. 2 is a diagram showing an operation of an embodiment of an electronic component carrying height control method for an electronic component mounting machine of the present invention.
【図３】電子部品装着機の電子部品搬送高さ制御方法の
従来例の動作を示す図である。FIG. 3 is a diagram showing an operation of a conventional example of an electronic component carrying height control method for an electronic component mounting machine.
１ 回路基板 ２ 搬送手段 ３ 電子部品供給部 ４ 装着ヘッド ５ 吸着ノズル ６ ＸＹロボット ７ 認識カメラ ８ コントローラ DESCRIPTION OF SYMBOLS 1 Circuit board 2 Conveying means 3 Electronic component supply section 4 Mounting head 5 Suction nozzle 6 XY robot 7 Recognition camera 8 Controller
Claims (4)
送手段と、電子部品供給部と、電子部品を吸着する吸着
ノズルを備えて上下方向に移動する装着ヘッドと、前記
装着ヘッドをＸＹの水平２方向に移動し位置決めするＸ
Ｙロボットとを有する電子部品装着機において、前記吸
着ノズルの移動中に吸着している電子部品と実装されて
いる電子部品とが干渉し合わない変動電子部品搬送高さ
ＨV を、前記吸着ノズルが前記電子部品供給部から電子
部品を吸着する都度、回路基板に装着されている電子部
品の装着位置と高さと、前記吸着ノズルが吸着している
電子部品の高さとから更新することを特徴とする電子部
品装着機の電子部品搬送高さ制御方法。1. A carrying means for carrying in / positioning / carrying out a circuit board, an electronic component supply section, a mounting head equipped with a suction nozzle for sucking an electronic component, and vertically moving, and a mounting head for XY horizontal mounting. X that moves and positions in two directions
In an electronic component mounting machine having a Y robot, a variable electronic component transport height H V at which the electronic component that is attracted while the suction nozzle is moving does not interfere with the mounted electronic component is set to the suction nozzle. Each time the electronic component is sucked from the electronic component supply unit, the electronic component is updated from the mounting position and height of the electronic component mounted on the circuit board and the height of the electronic component sucked by the suction nozzle. Control method of electronic component transfer height of electronic component mounting machine.
着されている最も高い電子部品の高さと前記吸着ノズル
が吸着している電子部品の高さとの和に余裕高さを加え
て更新される請求項１に記載の電子部品装着機の電子部
品搬送高さ制御方法。2. The electronic component carrying height H V is obtained by adding a margin height to the sum of the height of the highest electronic component mounted on the circuit board and the height of the electronic component sucked by the suction nozzle. The electronic component conveyance height control method for an electronic component mounting machine according to claim 1, which is updated.
着され、且つ、吸着ノズルの移動軌跡にある電子部品の
中で最も高い電子部品の高さと前記吸着ノズルが吸着し
ている電子部品の高さとの和に余裕高さを加えて更新さ
れる請求項１に記載の電子部品装着機の電子部品搬送高
さ制御方法。3. The electronic component carrying height H V is the height of the highest electronic component among the electronic components mounted on the circuit board and on the movement locus of the suction nozzle, and the electron attracted by the suction nozzle. The electronic component conveying height control method for an electronic component mounting machine according to claim 1, which is updated by adding a margin height to the sum of the component heights.
されている最も高い電子部品を避けるように設定する請
求項３に記載の電子部品装着機の電子部品搬送高さ制御
方法。4. The electronic component carrying height control method for an electronic component mounting machine according to claim 3, wherein the movement trajectory of the suction nozzle is set so as to avoid the highest electronic component mounted on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01313096A JP3378134B2 (en) | 1996-01-29 | 1996-01-29 | Electronic component mounting machine, electronic component transport height control method, and electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01313096A JP3378134B2 (en) | 1996-01-29 | 1996-01-29 | Electronic component mounting machine, electronic component transport height control method, and electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09214182A true JPH09214182A (en) | 1997-08-15 |
| JP3378134B2 JP3378134B2 (en) | 2003-02-17 |
Family
ID=11824583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01313096A Expired - Lifetime JP3378134B2 (en) | 1996-01-29 | 1996-01-29 | Electronic component mounting machine, electronic component transport height control method, and electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3378134B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002237698A (en) * | 2001-02-08 | 2002-08-23 | Matsushita Electric Ind Co Ltd | Method and apparatus for controlling position of nozzle tip section in electronic component-mounting machine |
| JP2003051698A (en) * | 2001-08-03 | 2003-02-21 | Matsushita Electric Ind Co Ltd | Method and device for mounting electronic component |
| WO2004095903A1 (en) * | 2003-04-22 | 2004-11-04 | Matsushita Electric Industrial Co., Ltd. | Device and method for mounting part |
| JP2008060336A (en) * | 2006-08-31 | 2008-03-13 | Hitachi High-Tech Instruments Co Ltd | Electronic component mounting device and method |
| JP2008141126A (en) * | 2006-12-05 | 2008-06-19 | Juki Corp | Component mounting apparatus and component mounting method |
| WO2015145720A1 (en) * | 2014-03-28 | 2015-10-01 | 富士機械製造株式会社 | Component mounting device |
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| JP6209741B2 (en) | 2014-02-26 | 2017-10-11 | パナソニックＩｐマネジメント株式会社 | Component mounting method and component mounting system |
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1996
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002237698A (en) * | 2001-02-08 | 2002-08-23 | Matsushita Electric Ind Co Ltd | Method and apparatus for controlling position of nozzle tip section in electronic component-mounting machine |
| JP4518682B2 (en) * | 2001-02-08 | 2010-08-04 | パナソニック株式会社 | Method and apparatus for controlling positioning of nozzle tip of electronic component mounting machine |
| JP2003051698A (en) * | 2001-08-03 | 2003-02-21 | Matsushita Electric Ind Co Ltd | Method and device for mounting electronic component |
| WO2004095903A1 (en) * | 2003-04-22 | 2004-11-04 | Matsushita Electric Industrial Co., Ltd. | Device and method for mounting part |
| EP1617717A1 (en) * | 2003-04-22 | 2006-01-18 | Matsushita Electric Industrial Co., Ltd. | Device and method for mounting part |
| US7337533B2 (en) | 2003-04-22 | 2008-03-04 | Matsushita Electric Industrial Co. | Device for mounting component |
| EP1617717A4 (en) * | 2003-04-22 | 2008-05-07 | Matsushita Electric Ind Co Ltd | Device and method for mounting part |
| US8196295B2 (en) | 2003-04-22 | 2012-06-12 | Panasonic Corporation | Component mounting method |
| JP2008060336A (en) * | 2006-08-31 | 2008-03-13 | Hitachi High-Tech Instruments Co Ltd | Electronic component mounting device and method |
| JP2008141126A (en) * | 2006-12-05 | 2008-06-19 | Juki Corp | Component mounting apparatus and component mounting method |
| WO2015145720A1 (en) * | 2014-03-28 | 2015-10-01 | 富士機械製造株式会社 | Component mounting device |
| JPWO2015145720A1 (en) * | 2014-03-28 | 2017-04-13 | 富士機械製造株式会社 | Component mounting equipment |
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| Publication number | Publication date |
|---|---|
| JP3378134B2 (en) | 2003-02-17 |
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