WO2016151797A1

WO2016151797A1 - Mounting device and mounting method

Info

Publication number: WO2016151797A1
Application number: PCT/JP2015/059108
Authority: WO
Inventors: 康平杉原; 秀徳後藤
Original assignee: 富士機械製造株式会社
Priority date: 2015-03-25
Filing date: 2015-03-25
Publication date: 2016-09-29
Also published as: JPWO2016151797A1; JP6673900B2

Abstract

In a mounting device (11), mounting processing is carried out on a normal component P (first component) by a mounting unit (13) via a general-purpose adsorption operation, and, furthermore, when carrying out mounting processing on a characteristic component (60), on an upper surface of which a characteristic part (61) is formed, the mounting processing is carried out by the mounting unit (13) via a predetermined inhibition adsorption operation that is different from the general-purpose adsorption operation. In such case, the mounting device (11) carries out the inhibition adsorption operation, which imparts negative pressure to an adsorption nozzle (24) more slowly than in the general-purpose adsorption operation, and which, after adsorption, moves the characteristic component (60) with an acceleration that is slower than that in the general-purpose adsorption operation.

Description

Mounting apparatus and mounting method

The present invention relates to a mounting apparatus and a mounting method.

Conventionally, as a mounting apparatus, an LED chip is made to emit light, its light emission center is recognized, an outer shape reference coordinate with respect to the coordinates of the light emission center is image-recognized, and the LED chip is positioned at a bonding position on the substrate based on the outer shape reference coordinate. Have been proposed (see, for example, Patent Document 1). In this apparatus, the light emission center of the light emitting element can be accurately positioned at a predetermined position on the substrate.

JP 2000-150970 A

However, in the mounting apparatus disclosed in Patent Document 1, although positioning is performed at a predetermined position on the substrate based on the coordinates of the light emission center, component adsorption has not been studied. For this reason, in this apparatus, the components may be displaced when the components are attracted.

The present invention has been made in view of such a problem, and a main object of the present invention is to provide a mounting apparatus and a mounting method that can further suppress the adsorption displacement of a component having a characteristic portion formed on the upper surface.

The present invention adopts the following means in order to achieve the main object described above.

The mounting apparatus of the present invention is
A mounting head that has one or more suction nozzles for picking up the components and mounts the picked-up components on a substrate;
The mounting head is controlled so that the first component is mounted by the general-purpose suction operation, and the predetermined restraint suction different from the general-purpose suction operation is performed when the feature component having the predetermined feature portion formed on the upper surface is mounted. A control unit for controlling the mounting head so as to perform mounting processing by operation;
It is equipped with.

In this apparatus, the first component is mounted by a general-purpose suction operation, and the mounting process is performed by a predetermined restraining suction operation different from the general-purpose suction operation when mounting a feature component having a predetermined feature portion formed on the upper surface. To do. In this apparatus, by performing the suppression suction operation different from the general-purpose suction operation, it is possible to further suppress the suction shift of the characteristic component having the characteristic portion formed on the upper surface.

In the mounting apparatus according to the aspect of the invention, the control unit may perform the suppression adsorption operation that applies a negative pressure to the adsorption nozzle at a timing that is slower than the general-purpose adsorption operation, and the acceleration that is slower than the general-purpose adsorption operation. The mounting head may be controlled so as to perform any one or more of the restraining suction operations for moving the feature parts after suction. Generally, in a mounting apparatus, a negative pressure may be supplied to a suction nozzle before the suction nozzle comes into contact with a component. In general, in a mounting apparatus, a mounting head may move a component that is not a feature component and a feature component with the same acceleration. In such a mounting apparatus, the components are easily displaced. In this apparatus, it is possible to further suppress the adsorption deviation of the characteristic parts by further delaying the timing at which the negative pressure is applied to the adsorption nozzle and the movement acceleration after the adsorption.

The mounting apparatus of the present invention includes an imaging unit capable of imaging the upper surface of the component, and a mounting table on which the component is mounted, and the control unit is configured to mount the characteristic component on the mounting table before mounting. After the upper surface of the characteristic part is imaged by the imaging unit on the mounting table and the characteristic part is recognized, the characteristic part is mounted by the suppression suction operation different from the pre-placement suction operation. The mounting head may be controlled to process. In this apparatus, since the part is moved to the mounting table and the position of the characteristic part of the characteristic part is recognized on the mounting table, the characteristic part can be recognized more accurately. Furthermore, since this apparatus performs the suppression suction operation after recognizing the feature portion, it is possible to further suppress the suction displacement of the feature component. Here, the “pre-placement suction operation” and the “general suction operation” may be the same operation or different operations.

Alternatively, the mounting apparatus of the present invention is
A mounting head that has one or more suction nozzles for picking up the components and mounts the picked-up components on a substrate;
An imaging unit capable of imaging the upper surface of the component;
A mounting table for mounting the components;
A feature part having a predetermined feature portion formed on the upper surface is placed on the mounting table by the pre-mounting suction operation, and the upper surface of the feature part is imaged by the imaging unit on the mounting table to recognize the feature portion. Later, a control unit that controls the mounting head so as to mount the characteristic component with a predetermined restraining suction operation different from the pre-placement suction operation described above,
It is good also as a thing provided.

In this apparatus, a feature part having a predetermined feature portion formed on the upper surface is placed on the placement table by an adsorption operation before placement, and the upper surface of the feature component is imaged by the imaging unit on the placement table, and then the feature portion is recognized. In addition, the characteristic component is mounted by a predetermined restraining suction operation different from the pre-mounting suction operation. In this apparatus, by performing the suppression suction operation different from the pre-mounting suction operation, it is possible to further suppress the suction displacement of the characteristic component having the characteristic portion formed on the upper surface. Further, in this apparatus, since the part is moved to the mounting table and the position of the characteristic part of the characteristic part is recognized on the mounting table, the characteristic part can be recognized more accurately. Furthermore, since this apparatus performs the suppression suction operation after recognizing the feature portion, the feature component can be sucked at a more accurate position of the feature portion.

In the mounting device according to the aspect of the invention including the imaging unit and the mounting table, the control unit applies the negative suction pressure to the suction nozzle at a timing slower than the pre-placement suction operation described above, In addition, the mounting head may be controlled to perform any one or more of the restraining suction operations in which the feature parts are moved after suction at a slower acceleration than the pre-placement suction operation described above. Generally, in a mounting apparatus, a negative pressure may be supplied to a suction nozzle before the suction nozzle comes into contact with a component. In general, in a mounting apparatus, a mounting head may move a component that is not a feature component and a feature component with the same acceleration. In such a mounting apparatus, the components are easily displaced. In this apparatus, it is possible to further suppress the adsorption deviation of the characteristic parts by further delaying the timing at which the negative pressure is applied to the adsorption nozzle and the movement acceleration after the adsorption.

The mounting apparatus of the present invention includes an imaging unit capable of imaging the upper surface of the component, and the control unit images the upper surface of the characteristic component by the imaging unit and recognizes the characteristic unit, and then performs the suction. The mounting head may be controlled by the suppression suction operation in which a negative pressure is applied to the suction nozzle after the nozzle abuts on the characteristic part. In general, in a mounting apparatus, if a negative pressure is applied before the suction nozzle abuts on a component, the position of the component may be shifted due to the suction nozzle sucking up a characteristic component. In this apparatus, since the negative pressure is applied to the suction nozzle after the suction nozzle comes into contact with the characteristic part, the suction shift can be further suppressed. Moreover, since this apparatus performs the suppression suction operation after recognizing the feature portion, the feature component can be sucked at a more accurate position of the feature portion.

The mounting apparatus of the present invention includes an imaging unit capable of imaging the upper surface of the component, a supply unit that supplies the component, a mounting table that includes the suction unit that mounts the component and sucks the mounted component, The control unit controls the mounting head to suck the characteristic component from the supply unit by the restraining suction operation, and images the upper surface of the characteristic component on the mounting table by the imaging unit. When picking up the characteristic part after recognizing the characteristic part, the mounting head is controlled so that the characteristic part is mounted by a post-mounting suction operation different from the general-purpose suction operation or the suppression suction operation. Also good. In this apparatus, the characteristic component is adsorbed from the supply unit by the suppression adsorption operation, and after the characteristic part is recognized on the mounting table, the characteristic component is mounted by the general-purpose adsorption operation or the post-installation adsorption operation. In this apparatus, the adsorption | suction shift | offset | difference of the components in a mounting base can be suppressed with the suction part of a mounting base. In this apparatus, the adsorption | suction shift | offset | difference of the characteristic components in a supply part can be suppressed by suppression adsorption | suction operation | movement. Here, the “post-mounting suction operation” and the “general suction operation” may be the same operation or different operations.

Alternatively, the mounting apparatus of the present invention is
A mounting head that has one or more suction nozzles for picking up the components and mounts the picked-up components on a substrate;
An imaging unit capable of imaging the upper surface of the component;
When mounting a feature part having a predetermined feature portion formed on the upper surface, after the upper surface of the feature component is imaged by the imaging unit and the feature portion is recognized, the suction nozzle touches the feature component. A control unit that controls the mounting head in a suppression suction operation that applies a negative pressure to the suction nozzle after contact;
It is good also as a thing provided.

In this apparatus, after imaging the upper surface of the characteristic part and recognizing the characteristic part, the mounting process is performed by a suppression adsorption operation in which a negative pressure is applied to the adsorption nozzle after the adsorption nozzle comes into contact with the characteristic part. In general, in a mounting apparatus, if a negative pressure is applied before the suction nozzle abuts on a component, the position of the component may be shifted due to the suction nozzle sucking up a characteristic component. In this apparatus, since the negative pressure is applied to the suction nozzle after the suction nozzle comes into contact with the characteristic part, the suction shift can be further suppressed. Moreover, since this apparatus performs the suppression suction operation after recognizing the feature portion, the feature component can be sucked at a more accurate position of the feature portion.

The mounting method of the present invention is:
A mounting method having one or more suction nozzles for sucking a component and mounting the sucked component on a substrate,
The mounting head is controlled so that the first component is mounted by the general-purpose suction operation, and the predetermined restraint suction different from the general-purpose suction operation is performed when the feature component having the predetermined feature portion formed on the upper surface is mounted. Controlling the mounting head to perform mounting processing in motion;
Is included.

In this method, similarly to the above-described mounting apparatus, when a feature component is mounted, a suppression suction operation different from the general-purpose suction operation is performed, thereby further suppressing the adsorption deviation of the feature component formed on the upper surface. can do. In this mounting method, various aspects of the mounting device described above may be adopted, and steps for realizing each function of the mounting device described above may be added.

1 is a schematic explanatory diagram illustrating an example of a mounting system 10. FIG. An explanatory view showing the outline of the composition of mounting device. The block diagram showing the electrical connection relation of the mounting apparatus. The flowchart showing an example of a mounting process routine. Explanatory drawing of adsorption | suction operation | movement. Explanatory drawing of adsorption | suction operation | movement with the mounting base 18B provided with the suction part 19. FIG.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram illustrating an example of the mounting system 10. FIG. 2 is an explanatory diagram illustrating the outline of the configuration of the mounting apparatus 11. FIG. 3 is a block diagram illustrating an electrical connection relationship of the mounting apparatus 11. The mounting system 10 is a system that executes a mounting process related to a process of mounting a component on the board S, for example. The mounting system 10 includes a mounting device 11 and a management computer 50. In the mounting system 10, a plurality of mounting apparatuses 11 that perform a mounting process for mounting components on a substrate S are arranged from upstream to downstream. In FIG. 1, only one mounting apparatus 11 is shown for convenience of explanation. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.

As shown in FIGS. 1 to 3, the mounting apparatus 11 includes a board transfer unit 12, a mounting unit 13, a pressure applying unit 27, a component supply unit 14, a parts camera 15, a mounting table 18, and a control device 40. And. The substrate transport unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position. The substrate transport unit 12 has a pair of conveyor belts provided at intervals in the front-rear direction of FIG. 1 and spanned in the left-right direction. The board | substrate S is conveyed by this conveyor belt.

As shown in FIG. 1, the mounting apparatus 11 has a feature part 61 on the upper surface side in addition to the normal component P that can grasp the shape of the component by imaging from the lower surface side and does not need to recognize the upper surface side. The component 60 is mounted. The characteristic component 60 has a characteristic portion 61 that requires recognition (also referred to as upper surface recognition) of its position, shape, and the like from the upper surface side, and an abutment surface 62 that is an upper surface that abuts at the time of collection. The feature unit 61 may be, for example, a light emitter that emits light. That is, the characteristic component 60 may be an LED component having an upper portion formed of a transparent resin having light transmittance. The normal part P and the characteristic part 60 are collectively referred to as “parts”.

The mounting unit 13 collects components from the component supply unit 14 and arranges them on the substrate S fixed to the substrate transport unit 12. The mounting unit 13 includes a head moving unit 20, a mounting head 22, and a suction nozzle 24. The head moving unit 20 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider. The mounting head 22 is detachably mounted on the slider and is moved in the XY direction by the head moving unit 20. One or more suction nozzles 24 are detachably mounted on the lower surface of the mounting head 22. The suction nozzle 24 is a collection member that collects components using pressure, and is detachably attached to the mounting head 22. The mounting head 22 incorporates a Z-axis motor 23, and the height of the suction nozzle 24 is adjusted along the Z-axis by the Z-axis motor. The mounting head 22 includes a rotating device that rotates (spins) the suction nozzle 24 by a drive motor (not shown), and can adjust the angle of the component sucked by the suction nozzle 24.

The mark camera 25 is, for example, an imaging device that can image the substrate S and components from above. The mark camera 25 is disposed on the lower surface side of the mounting head 22 (or slider), and moves in the XY directions as the mounting head 22 moves. The mark camera 25 has an imaging region 26 (see FIG. 2) below, images a reference mark attached to the substrate S and used for grasping the position of the substrate S, and outputs the image to the control device 40. Further, the mark camera 25 images the upper surface of the feature component 60 and outputs the image to the control device 40.

The pressure applying unit 27 is a unit that supplies a negative pressure and a positive pressure required for the operation of the apparatus. The pressure applying unit 27 includes a vacuum pump 28, an electromagnetic valve 29, an intake port 30, and an air pipe 27a (see FIG. 1). The air pipe 27 a is connected to either the vacuum pump 28 or the intake port 30 via the electromagnetic valve 29. The pressure applying unit 27 applies a negative pressure to the air pipe 27 a when the electromagnetic valve 29 is operated so as to communicate with the vacuum pump 28, and the air pipe when the electromagnetic valve 29 is operated so as to communicate with the intake port 30. A positive pressure is applied to 27a. The suction nozzle 24 is connected to the tip of the air pipe 27a.

The component supply unit 14 has a plurality of feeders 32 each having a reel 33 detachably attached to a mounting portion 31 disposed on the front side of the mounting apparatus 11. A tape 34 is wound around each reel 33, and a plurality of components are held on the tape 34 along the longitudinal direction of the tape 34. The tape 34 is unwound from the reel 33 toward the rear, and is sent out to a sampling position 36 (see FIG. 2) where it is sucked by the suction nozzle 24 with the components exposed. The component supply unit 14 includes a tray unit 35 having a tray on which a plurality of components are arranged and placed.

The parts camera 15 is disposed between the board transfer unit 12 and the component supply unit 14. The imaging range of the parts camera 15 is above the parts camera 15. When the suction nozzle 24 that sucks a part passes above the part camera 15, the parts camera 15 captures the part sucked by the suction nozzle 24 from below and outputs the image to the control device 40.

The mounting table 18 is disposed between the substrate transport unit 12 and the component supply unit 14 and beside the parts camera 15. The mounting table 18 is supported so that the upper surface on which the component is mounted is horizontal, and is used as a temporary mounting table for the characteristic component 60. When the characteristic component 60 is mounted on the mounting table 18, its posture is likely to be stabilized as compared with the case where the characteristic component 60 is stored in the storage portion of the tape 34. The mounting table 18 may be formed in such a size that the maximum number of characteristic components 60 that are attracted to the mounting head 22 at a time can be mounted.

As shown in FIG. 3, the control device 40 is configured as a microprocessor centered on a CPU 41, and includes a ROM 42 that stores a processing program, an HDD 43 that stores various data, a RAM 44 that is used as a work area, an external device and an electrical device. An input / output interface 45 for exchanging signals is provided, and these are connected via a bus 46. The control device 40 outputs control signals to the substrate transport unit 12, the mounting unit 13, the component supply unit 14, the parts camera 15, and the pressure applying unit 27, and signals from the mounting unit 13, the component supply unit 14, and the parts camera 15. Enter.

The management computer (PC) 50 is a computer that manages information of each device of the mounting system 10. The management PC 50 includes a control device configured as a microprocessor centered on a CPU. The control device includes a ROM that stores processing programs, an HDD that stores various data, a RAM used as a work area, and an external device. It has an input / output interface for exchanging electrical signals with it. The management PC 50 includes an input device 52 such as a keyboard and a mouse for an operator to input various commands, and a display 54 for displaying various information.

Next, the operation of the mounting system 10 of this embodiment configured as described above, specifically, the mounting process of the mounting apparatus 11 will be described. FIG. 4 is a flowchart illustrating an example of a mounting process routine executed by the CPU 41 of the control device 40. This routine is stored in the HDD 43 of the control device 40, and is executed by a start instruction from the operator. Here, a case where the normal component P and the characteristic component 60 are mounted on the substrate S by the suction nozzle 24 will be described. When this routine is started, the CPU 41 of the control device 40 first acquires mounting job information from the management computer 50 (step S100). The mounting job information includes information about the mounting order of components, the type of component to be mounted, and information on a suction nozzle that sucks the component.

Next, the CPU 41 performs the transporting and fixing process of the substrate S (step S110), and sets the parts to be attracted (step S120). Next, the CPU 41 determines, based on the mounting job information, whether the part sucked by the suction nozzle 24 is the normal part P or the characteristic part 60 (step S130). When the component to be sucked is the normal component P, the CPU 41 causes the normal component P to be sucked and moved by the general-purpose sucking operation (Step S140), and the normal component P is arranged at the mounting position of the substrate S (Step S200). .

FIG. 5 is an explanatory view of the suction operation, FIG. 5 (a) is an explanatory view of the suction operation of the normal part P, and FIG. 5 (b) is an explanatory view of the suction operation of the characteristic part 60. As shown in FIG. 5A, in the mounting process of the normal component P, the CPU 41 performs the suction nozzle on the normal component P accommodated in the tape 34 in a state where negative pressure is applied to the suction nozzle 24 as a general-purpose suction operation. The normal part P is sampled by bringing 24 into contact therewith. Further, as a general-purpose suction operation, the CPU 41 moves the suction nozzle 24 sucking the normal component P at the acceleration α1 after sucking the normal component P to the suction nozzle 24. At this time, the CPU 41 controls the mounting head 22 so as to pass over the parts camera 15, corrects the suction position deviation based on the imaging result of the parts camera 15, and places the normal component P on the substrate S. In general, when an attempt is made to collect the normal part P stored in the tape 34 with negative pressure applied to the suction nozzle 24, the normal part P is sucked up when the suction nozzle 24 approaches the normal part P. The adsorption position shift of P may occur. Further, when the normal part P is moved with a relatively large acceleration, the suction position shift of the normal part P may occur due to the acceleration. In the mounting process of the normal part P, the suction position deviation can be corrected by the imaging result of the parts camera 15, so that the normal part P is collected from the tape 34 with a negative pressure applied, or the normal part P is normally used with a relatively large acceleration α1. The part P can be moved.

On the other hand, when the part sucked by the suction nozzle 24 is the characteristic part 60 in step S130, the CPU 41 causes the feature part 60 to be sucked and moved by the pre-placement suction operation (step S150), and the process goes to the placement table 18. The characteristic component 60 is placed (step S160). The characteristic part 60 has a characteristic part 61 on the upper surface side, and it is necessary to mount it on the substrate S more accurately so that the position of the optical axis does not shift. In the tape 34, the posture of the characteristic component 60 may not be stable. For this reason, the CPU 41 recognizes the position of the characteristic part 61 in a state where the characteristic part 60 is once placed on the mounting table 18 and the posture of the characteristic part 60 is stabilized, and the position of the characteristic part 61 is determined based on the recognized position. It is assumed that the characteristic component 60 is mounted on the substrate S so that is in the correct position. In the mounting process of the characteristic component 60, the CPU 41 brings the suction nozzle 24 into contact with the characteristic component 60 accommodated in the tape 34 in a state where a negative pressure is applied to the suction nozzle 24 as a pre-mounting suction operation. The part 60 is collected. Further, as shown in FIG. 5B, the CPU 41 moves the suction nozzle 24 sucking the characteristic component 60 at an acceleration α2 after sucking the characteristic component 60 to the suction nozzle 24 as the pre-mounting suction operation. Let In addition, since accurate suction of the feature component 60 is performed on the mounting table 18, the sampling of the feature component 60 from the tape 34 may be performed by the pre-mounting suction operation that is the same operation as the general-purpose suction operation described above. Good. That is, the acceleration α1 and the acceleration α2 may be different, but may be the same.

Next, the CPU 41 causes the mark camera 25 to capture an image of the characteristic component 60 on the mounting table 18, and executes processing for recognizing the position of the characteristic portion 61 (step S170). In this process, for example, the captured image may be binarized to determine a pixel value region corresponding to the feature 61 and obtain the coordinates of the feature 61. In this way, the CPU 41 can obtain the exact position (coordinates) of the feature 61 on the mounting table 18. Next, the CPU 41 determines whether or not the recognition processing of the feature section 61 has been completed based on whether or not it has been performed on all of the feature components 60 on the mounting table 18 (step S180), and the recognition processing. If is not completed, the process of step S170 is executed.

On the other hand, when the recognition process of the feature part 61 is completed, the CPU 41 causes the feature part 60 to be sucked and moved by a predetermined restraining suction operation that further suppresses the positional deviation of the feature part 60 (step S190). The characteristic component 60 is arranged at the mounting position (step S200). In step S <b> 190, the CPU 41 performs position correction using the recognition result of the feature unit 61 and causes the feature component 60 to be sucked. In the mounting process of the characteristic component 60, as shown in FIG. 5B, the CPU 41 applies the negative pressure to the suction nozzle 24 after the suction nozzle 24 is brought into contact with the characteristic component 60 as the suppression suction operation. Then, the characteristic part 60 is collected. Further, the CPU 41 moves the suction nozzle 24 sucking the characteristic component 60 at an acceleration α3 slower than the accelerations α1 and α2 after sucking the characteristic component 60 to the suction nozzle 24 as the suppression suction operation. Thus, after recognizing the exact position of the feature portion 61, the CPU 41 sucks and moves the feature component 60 under a condition that further suppresses the suction position shift.

Subsequently, the CPU 41 determines whether or not the mounting process by the mounting apparatus 11 for the current board S has been completed (step S210). If the mounting process for the current board S has not been completed, the processes after step S120 are executed. To do. In other words, the CPU 41 sets a part to be sucked next, and picks and moves the part under the suction condition according to the set part. On the other hand, when the mounting process of the current substrate S is completed in step S210, the CPU 41 discharges the substrate S that has been mounted (step S220), and determines whether the production is completed (step S230). When the production is not completed, the CPU 41 executes the processes after step S110. That is, the CPU 41 transports and fixes a new substrate S, and executes the processes after step S120. On the other hand, when the production is completed in step S230, the CPU 41 ends this routine as it is.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The mounting head 22 of this embodiment corresponds to the mounting head of the present invention, the mark camera 25 corresponds to the imaging unit, the mounting table 18 corresponds to the mounting table, and the control device 40 corresponds to the control unit. In the present embodiment, an example of the mounting method of the present invention is also clarified by describing the operation of the mounting apparatus 11.

In the mounting apparatus 11 of the above-described embodiment, the normal component P (first component) is mounted by the general-purpose suction operation, while the general-purpose suction operation is performed when the characteristic component 60 having the characteristic portion 61 formed on the upper surface is processed. Mounting processing is performed with a predetermined restraining suction operation different from the suction operation. At this time, the control device 40 applies a negative pressure to the suction nozzle 24 at a timing later than that of the general-purpose suction operation, and suppresses suction that moves the feature component 60 after suction at a slower acceleration than that of the general-purpose suction operation. Do the operation. In general, in a mounting apparatus, if a negative pressure is supplied to the suction nozzle 24 before the suction nozzle comes into contact with the component, the suction position of the component is likely to shift, such as sucking up the component. In addition, when the mounting head moves the normal component P and the characteristic component 60 at the same acceleration, the mounting device is likely to cause the component suction position shift. In the mounting apparatus 11, it is possible to further suppress the displacement of the adsorption position of the characteristic component 60 by further delaying the timing at which the negative pressure is applied to the adsorption nozzle 24 and the movement acceleration after the adsorption.

Further, since the mounting apparatus 11 moves the characteristic part 60 to the mounting table 18 and recognizes the position of the characteristic part 61 of the characteristic part 60 on the mounting table 18, the mounting part 11 can recognize the characteristic part 61 more accurately. Furthermore, since the mounting apparatus 11 performs the suppression suction operation after recognizing the feature portion 61, the suction position shift of the feature component 60 can be further suppressed. Furthermore, the mounting apparatus 11 places the characteristic component 60 on the mounting table 18 by the pre-mounting suction operation, recognizes the characteristic portion 61 on the mounting table 18, and then performs a suppression suction operation different from the pre-mounting suction operation. The characteristic component 60 is mounted. Thus, since the mounting apparatus 11 performs the suppression suction operation after recognizing the feature portion 61, the feature component 60 can be sucked at a more accurate position of the feature portion 61. Further, the control device 40 can further suppress the suction position shift of the characteristic component 60 by further delaying the timing at which the negative pressure is applied to the suction nozzle 24 and the movement acceleration after the suction. Furthermore, in the mounting apparatus 11, since the negative pressure is applied to the suction nozzle 24 after the suction nozzle 24 abuts on the characteristic component 60, the suction position shift can be further suppressed.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the control device 40 applies a negative pressure to the suction nozzle 24 at a timing later than the general-purpose suction operation or the pre-mounting suction operation, and at a slower acceleration than the general-purpose suction operation. However, either one of the processes may be omitted. In this mounting apparatus, it is possible to further suppress the adsorption position shift by delaying either one of the negative pressure application timing and the movement acceleration.

In the above-described embodiment, the negative pressure is applied to the suction nozzle 24 after the suction nozzle 24 comes into contact with the characteristic component 60. For example, the negative pressure is applied to the suction nozzle 24 at a later timing than the general-purpose suction operation. It is good also as what gives to. Since the tip of the suction nozzle 24 when the suction nozzle 24 comes close to the characteristic component 60 has a smaller negative pressure than the general-purpose suction operation, the suction position shift can be further suppressed.

In the embodiment described above, the control device 40 sucks and moves the feature component 60 by the suppression suction operation different from the general-purpose suction operation of the normal component P, and the feature component by the suppression suction operation different from the suction operation before placing the feature component 60. 60 is moved by suction, but either one may be satisfied. For example, when the feature component 60 is attracted and moved by a suppression suction operation different from the general-purpose suction operation of the normal component P, the pre-mounting suction operation and the suppression suction operation may be set to the same condition. In addition, when the feature component 60 is moved by suction with a suppression suction operation different from the pre-mounting suction operation, the general-purpose suction operation and the suppression suction operation may be set to the same condition.

In the above-described embodiment, the mounting table 18 is provided, and the position of the feature unit 61 is recognized on the mounting table 18. However, the present invention is not particularly limited thereto, and the mounting of the characteristic component 60 on the mounting table 18 is omitted. May be. For example, if the posture of the characteristic component 60 is stable in the accommodating portion of the tape 34 of the feeder 32, the control device 40 recognizes the characteristic portion 61 on the feeder 32 without being mounted on the mounting table 18. Implementation processing may be performed. In this mounting apparatus, the position recognition processing of the characteristic portion 61 is performed on the feeder 32, and the suppression suction operation under a slower condition than the general-purpose suction operation may be performed on the feeder 32 when the feature component 60 is suctioned. The mounting apparatus 11 may not include the mounting table 18.

In the above-described embodiment, the characteristic component 60 is mounted on the planar mounting table 18. However, as illustrated in FIG. 6, the mounting device 11 includes the suction unit 19 that sucks the mounted component. It is good also as what is provided with the mounted mounting base 18B. FIG. 6 is an explanatory diagram of a suction operation in the mounting apparatus 11B including the mounting table 18B in which the suction part 19 is formed. In the mounting table 18 </ b> B, a slit-like suction portion 19 that is sufficiently narrower than the characteristic component 60 is formed on the mounting surface on which the characteristic component 60 is mounted. The suction part 19 is connected to the pressure applying unit 27 and is supplied with negative pressure and positive pressure. In this mounting apparatus 11B, the control device 40 may control the mounting head 22 so as to suck the characteristic component 60 from the component supply unit 14 by the suppression suction operation. On the other hand, when the control device 40 picks up the feature component 60 after the upper surface of the feature component 60 is imaged by the mark camera 25 on the placement table 18B and recognizes the feature portion 61, the control device 40 is different from the restraining suction operation. The mounting head 22 may be controlled so that the characteristic component 60 is mounted by a suction operation. For example, the post-mounting suction operation may be the same as or different from the general-purpose suction operation and / or the pre-mounting suction operation. The suppression suction operation may have a slower negative pressure supply timing to the suction nozzle 24 than the post-mounting suction operation, or may have a slower movement acceleration after the suction. In this mounting apparatus 11B, the suction position 19 of the mounting table 18B can suppress the displacement of the suction position of the characteristic component 60 on the mounting table 18B. For this reason, when the suction part 19 can sufficiently fix the characteristic component 60, the suppression suction operation can be omitted on the mounting table 18 </ b> B. Further, on the feeder 32, by performing the suppression suction operation, it is possible to suppress the suction position shift of the characteristic component 60 in the component supply unit 14. In addition, in the mounting apparatus 11B, you may perform suppression adsorption | suction operation | movement in any on the feeder 32 and the mounting base 18B.

In the above-described embodiment, the upper surface side of the feature component 60 is imaged, and the position correction is performed using the result of recognizing the position of the feature component 60 (feature portion 61). The processed image may be used for other processing. In the above-described embodiment, the characteristic part 61 is described as the characteristic part 60 that is a light emitter. However, the characteristic part 61 is not particularly limited as long as it is a part that needs to image the characteristic part 61 from the upper surface side. It may be a part.

In the above-described embodiment, the present invention has been described as the mounting apparatus 11. However, for example, a mounting method may be used, or a program that a computer executes the above-described processing may be used.

The present invention can be used for an apparatus for performing a mounting process in which components are arranged on a substrate.

10 mounting system, 11, 11B mounting device, 12 substrate transport unit, 13 mounting unit, 14 component supply unit, 15 parts camera, 18, 18B mounting table, 19 suction unit, 20 head moving unit, 22 mounting head, 23 Z axis Motor, 24 suction nozzle, 25 mark camera, 26 imaging area, 27 pressure application unit, 27a piping, 28 vacuum pump, 29 solenoid valve, 30 intake port, 31 mounting part, 32 feeder, 33 reel, 34 tape, 35 tray unit , 36 sampling position, 40 control device, 41 CPU, 42 ROM, 43 HDD, 44 RAM, 45 I / O interface, 46 bus, 50 management computer, 52 input device, 54 display, 60 feature parts, 61 feature part, 62 Contact surface, P usually parts, S substrate.

Claims

A mounting head that has one or more suction nozzles for picking up the components and mounts the picked-up components on a substrate;
The mounting head is controlled so that the first component is mounted by the general-purpose suction operation, and the predetermined restraint suction different from the general-purpose suction operation is performed when the feature component having the predetermined feature portion formed on the upper surface is mounted. A control unit for controlling the mounting head so as to perform mounting processing by operation;
Mounting device.
The control unit is configured to apply a negative pressure to the suction nozzle at a timing slower than the general-purpose suction operation, and after the suction of the characteristic component at a slower acceleration than the general-purpose suction operation. The mounting apparatus according to claim 1, wherein the mounting head is controlled so as to perform any one or more of the restraining suction operations for moving.
The mounting apparatus according to claim 1 or 2,
An imaging unit capable of imaging the upper surface of the component;
A mounting table for mounting the component;
The control unit places the characteristic component on the mounting table by the pre-mounting suction operation, and after the upper surface of the characteristic component is imaged by the imaging unit on the mounting table and recognizes the characteristic unit, A mounting apparatus that controls the mounting head so as to mount the characteristic component by the restraining suction operation different from the pre-placement suction operation.
A mounting head that has one or more suction nozzles for picking up the components and mounts the picked-up components on a substrate;
An imaging unit capable of imaging the upper surface of the component;
A mounting table for mounting the components;
A feature part having a predetermined feature portion formed on the upper surface is placed on the mounting table by the pre-mounting suction operation, and the upper surface of the feature part is imaged by the imaging unit on the mounting table to recognize the feature portion. Later, a control unit that controls the mounting head so as to mount the characteristic component with a predetermined restraining suction operation different from the pre-placement suction operation described above,
Mounting device.
The control unit is configured to apply the suppression suction operation that applies a negative pressure to the suction nozzle at a timing slower than the pre-placement suction operation described above, and the characteristic component at a slower acceleration than the pre-placement suction operation. The mounting apparatus according to claim 3, wherein the mounting head is controlled so as to perform any one or more of the restraining suction operations for performing movement after suction.
The mounting apparatus according to any one of claims 1 to 5,
An imaging unit capable of imaging the upper surface of the component;
The control unit applies the negative pressure to the suction nozzle after the suction nozzle comes into contact with the feature part after the upper surface of the feature part is imaged by the imaging unit and the feature part is recognized. A mounting apparatus that controls the mounting head by a suction operation.
The mounting apparatus according to claim 1 or 2,
An imaging unit capable of imaging the upper surface of the component;
A supply unit for supplying parts;
A mounting table including a suction unit that mounts the component and sucks the mounted component;
The control unit controls the mounting head to suck the characteristic component from the supply unit by the suppression suction operation, while imaging the upper surface of the characteristic component on the mounting table by the imaging unit. A mounting apparatus that controls the mounting head so as to mount the feature component by a post-mounting suction operation different from the general-purpose suction operation or the suppression suction operation when the feature component is suctioned after being recognized.
A mounting head that has one or more suction nozzles for picking up the components and mounts the picked-up components on a substrate;
An imaging unit capable of imaging the upper surface of the component;
When mounting a feature part having a predetermined feature portion formed on the upper surface, after the upper surface of the feature component is imaged by the imaging unit and the feature portion is recognized, the suction nozzle touches the feature component. A control unit that controls the mounting head in a suppression suction operation that applies a negative pressure to the suction nozzle after contact;
Mounting device.
A mounting method having one or more suction nozzles for sucking a component and mounting the sucked component on a substrate,
The mounting head is controlled so that the first component is mounted by the general-purpose suction operation, and the predetermined restraint suction different from the general-purpose suction operation is performed when the feature component having the predetermined feature portion formed on the upper surface is mounted. Controlling the mounting head to perform mounting processing in motion;
Implementation method including