JP2017162935A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a component placed temporarily on a temporary placement surface from deviating, when it is imaged by imaging means.SOLUTION: The controller 80 of a component mounting device 11 controls a component, supplied by means of a reel unit 56, to be placed temporarily in the temporary placement area 74 of a temporary placement surface 71, after it is sucked by the nozzle 40 of a mounting head 24, and before being mounted on a board 12. Furthermore, the controller 80 images the component, placed temporarily in the temporary placement area 74 while supplying a negative pressure to a hole 73 provided in the temporary placement area 74 of the temporary placement surface 71, by means of a mark camera 34. Since a component is held on the temporary placement surface 71 by negative pressure, deviation of the temporarily placed component can be prevented.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a component mounting apparatus.

  Conventionally, in a component mounting apparatus that mounts components on a board, after sucking the components arranged on a tape or tray with a nozzle, the nozzle is moved onto the board and the nozzle is released from the suction at a predetermined position on the board. The one that mounts the component is known. In such a component mounting apparatus, there is also known a device in which suction of a component is released on the temporary placement surface and the component is placed on the temporary placement surface before the nozzle moves to the substrate after the component is attracted (patent) Reference 1). After the component shape is recognized by the imaging device, the component placed on the temporary placement surface is again attracted to the nozzle and moved onto the substrate.

JP-A-1-209578

  However, in the component mounting apparatus described in Patent Document 1, since no consideration has been given to holding the component against the temporary placement surface, when the temporarily placed component is imaged by the imaging unit, the temporary placement surface is used. Various problems arise due to deviations in the temporarily placed parts. For example, when imaging a temporarily placed part while moving the imaging means, the part may be displaced on the temporary placement surface due to vibration caused by movement of the imaging means, and the recognition accuracy of the shape and position of the part is reduced. Problems arise. For example, when the imaging field of view of the imaging unit is smaller than the imaging target, the imaging target may be divided into a plurality of areas for imaging, but in such a case as well, while capturing different areas If the component is displaced, there is a problem that the recognition accuracy of the shape and position of the component is lowered. Further, for example, when the nozzle is positioned and sucked with respect to the component based on the shape and position of the component recognized by the imaging means, the component is not captured until the component is re-sucked. If it is displaced on the temporary placement surface, there arises a problem that the positioning accuracy of the nozzle with respect to the component is lowered.

  The present invention has been made in order to solve at least one of the problems caused when the temporarily placed component is displaced when the temporarily placed component is imaged by the imaging unit. In the apparatus, the main purpose is to prevent the components temporarily placed on the temporary placement surface from shifting when the parts temporarily placed on the temporary placement surface are imaged by the imaging means.

The component mounting apparatus of the present invention is
Parts supply means for supplying parts;
Component adsorbing means capable of adsorbing the component;
Moving means for moving the component suction means;
Board holding means for holding a board on which the component is mounted;
Having a hole at a predetermined position, and a temporary placement surface for temporarily placing the component at the predetermined position;
Pressure adjusting means capable of supplying at least negative pressure to the hole;
Upper surface imaging means capable of imaging the upper surface of the component temporarily placed on the temporary placement surface;
Control for controlling the component suction unit and the moving unit so that the component is temporarily placed at the predetermined position after the component suction unit sucks the component supplied by the component supply unit and before the component is mounted on the substrate. Means,
With
The control means controls to temporarily place the part at the predetermined position, and images the part temporarily placed at the predetermined position with negative pressure supplied to the hole by the upper surface imaging means. .

  The component mounting apparatus controls the component supplied by the component supply unit so that the component is temporarily placed at a predetermined position on the temporary placement surface before being mounted on the substrate after the component suction unit sucks the component. The component mounting apparatus controls to temporarily place the component at a predetermined position, and images the component temporarily placed at the predetermined position in a state where negative pressure is supplied to the hole by the upper surface imaging unit. Since the component is held at a predetermined position on the temporary placement surface by the negative pressure supplied to the hole on the temporary placement surface in this way, the component temporarily placed on the temporary placement surface is displaced when the component is imaged by the imaging unit. Can be prevented.

  The component mounting apparatus of the present invention includes pressure detection means for detecting the pressure in the hole, and the control device determines whether or not the component is temporarily placed at the predetermined position based on the pressure detected by the pressure detection means. The first determination may be performed. In this way, in order to determine whether or not a part has actually been temporarily placed based on the pressure state of the hole on the temporary placement surface, it is easily determined using negative pressure for holding the component on the temporary placement surface. Can do.

  In the component mounting apparatus of the present invention, when the result of the first determination is affirmative, the control unit causes the upper surface imaging unit to image the upper surface of the temporarily placed component and then the component suction unit On the other hand, if the result of the first determination is negative, a non-normal process different from the normal process may be performed. In this way, it is possible to reliably image the upper surface of the component while the component is actually temporarily placed.

  In the component mounting apparatus of the present invention, the component mounting apparatus includes a side imaging unit capable of imaging the component sucked by the component sucking unit from the side, and the control unit is configured to perform the negative determination when the result of the first determination is negative. It is also possible to cause the image pickup means to pick up the component suction means and determine whether or not the component suction means is picking up the component based on the picked-up image. In this way, when the component is not temporarily placed on the temporary placement surface, it can be recognized whether or not the component is still sucked by the component suction means, and the subsequent measures can be appropriately taken.

  The component mounting apparatus according to the present invention further comprises pressure detection means for detecting the pressure in the hole, and the control means controls the component to be re-sucked by the component suction means, and then supplies a negative pressure to the hole. Based on the pressure detected by the pressure detection means in the above state, a second determination may be made as to whether or not the component is actually re-sucked by the component suction means. In this way, it is possible to continue the series of processes after recognizing whether or not the part is actually re-sucked from the temporary placement surface.

  In the component mounting apparatus of the present invention, the control unit controls the component adsorption unit to re-adsorb the component after the upper surface imaging unit images the upper surface of the temporarily placed component, and at least The pressure adjusting means may be controlled such that the pressure in the hole remains negative until the component suction means contacts the component. By doing so, the component is prevented from being displaced until the component suction means comes into contact with the component after the upper surface of the component is imaged, so that the positioning accuracy of the component suction means with respect to the component can be improved.

  In the component mounting apparatus of the present invention, the control unit may control the pressure adjusting unit so that the pressure of the hole becomes an atmospheric pressure or a positive pressure when the component is re-sucked by the component suction unit. . In this way, the component suction means can re-suck the components smoothly. In particular, when the hole pressure is positive, the effect is enhanced.

FIG. 3 is an explanatory diagram of the mounting system 10. FIG. 3 is an explanatory diagram of the mounting head 24. FIG. Explanatory drawing of the component 660 with a light emission part. The top view of the temporary placement surface 71. FIG. The flowchart of a component mounting program. The flowchart of a suction process routine. The flowchart of a temporary placement process routine. The flowchart of a re-adsorption / mounting process routine. FIG. 6 is an explanatory diagram illustrating a state in which a light emitting part-equipped component 660 on the tape 60 is imaged. Explanatory drawing which shows a mode that the components 660 with a light emission part on the temporary placement surface 71 are imaged.

  Embodiments of the present invention will be described below with reference to the drawings. 1 is an explanatory view of the mounting system 10, FIG. 2 is an explanatory view of the mounting head 24, FIG. 3 is an explanatory view of the reel 57, FIG. 4 is an explanatory view of a component 660 with a light emitting part, and FIG. FIG. The mounting system 10 according to the present embodiment includes a component mounting apparatus 11 that mounts components on a substrate 12 and a management computer 90 that manages and sets information related to the mounting processing. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG. In addition, the mounting process includes a process of placing, arranging, mounting, inserting, joining, or adhering components on a substrate.

  As shown in FIG. 1, the component mounting apparatus 11 is provided in the transporting unit 18 that transports the substrate 12, the sampling unit 21 that performs the mounting process of sampling components and placing them on the substrate 12, and the sampling unit 21. The mark camera 34, a reel unit 56 that holds a number of reels 57, a temporary placement table 70 that temporarily places components, and a control device 80 that controls the entire apparatus such as the sampling unit 21 and the mark camera 34 are provided.

  The transport unit 18 includes support plates 20 and 20 that are provided at intervals in the front and rear direction in FIG. 1 and extend in the left-right direction, and conveyor belts 22 and 22 that are provided on the surfaces of the support plates 20 and 20 that face each other. ing. The conveyor belts 22 and 22 are stretched over the drive wheels and the driven wheels provided on the left and right sides of the support plates 20 and 20 so as to be endless. The substrate 12 is carried on the upper surfaces of the pair of conveyor belts 22 and 22 and is conveyed from left to right. The substrate 12 is supported from the back side thereof by a large number of standing support pins 23. Therefore, the transport unit 18 also serves to hold the substrate 12.

  The sampling unit 21 includes a mounting head 24, an X-axis slider 26, a Y-axis slider 30, and the like. The mounting head 24 is attached to the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed inside the component mounting apparatus 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The mounting head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Each slider 26 and 30 is driven by a drive motor (not shown).

  As shown in FIG. 2, the mounting head 24 includes a nozzle 40 that picks up and collects components, and a nozzle holder 42 that can be attached and detached with one or more nozzles 40. In the present embodiment, the nozzle holder 42 includes a total of four nozzle holders to which the nozzles 40 can be attached every 90 °. The nozzle holder 42 is held by the mounting head 24 in a rotatable state. The nozzle 40 uses pressure to adsorb components at the nozzle tip or release components adsorbed at the nozzle tip. The nozzle 40 is moved up and down in a Z-axis direction (vertical direction) orthogonal to the X-axis and Y-axis directions by a holder lifting device using a Z-axis motor 45 as a drive source. The holder lifting / lowering device lifts and lowers only one nozzle 40 stopped at the operating position (see FIG. 2) in the Z-axis direction. Therefore, the nozzle 40 stopped at a position other than the operating position is fixed at the upper position. The nozzle 40 in the operating position moves to the upper position after attracting the parts supplied from the reel unit 56 in the lowered state, and then rotates 90 ° clockwise in FIG. 2 to face the side camera 44. Stop at the shooting position (see FIG. 2). The side camera 44 is attached to the mounting head 24 so as to be able to image a component adsorbed by the nozzle 40 at the imaging position, and outputs the captured image to the control device 80.

  The mark camera 34 is a device that images the substrate 12 and the like from above, and is disposed on the lower surface of the X-axis slider 26. The mark camera 34 has an imaging region below, images a reference mark attached to the substrate 12, and outputs the image to the control device 80. The reference mark is used for grasping the position of the substrate 12 or grasping the position of the component on the substrate 12. The mark camera 34 also images the upper surface of the component 66 accommodated in the tape 60 and the component 66 temporarily placed on the temporary placement table 70, and outputs the image to the control device 80. The mark camera 34 moves in the XY direction as the mounting head 24 moves.

  The reel unit 56 holds a reel 57 and a feeder 58. A plurality of reels 57 are detachably attached to the front side of the component mounting apparatus 11. As shown in FIG. 3, the reel 57 is wound with a tape 60 in which a component 66 is accommodated in a concave accommodating portion 62. The upper surface of the tape 60 is covered with a film 64 so that the component 66 does not fall from the accommodating portion 62. The film 64 is peeled off from the tape 60 before it reaches a predetermined sampling position where the component 66 is picked up by the nozzle 40. The tape 60 has a large number of sprocket holes 67 along the longitudinal direction. A feeder 58 is provided for each reel 57. The feeder 58 includes a sprocket (not shown) that can be driven to rotate. When the sprocket rotates while the sprocket teeth mesh with the sprocket holes 67 of the tape 60, the tape 60 is fed out in the direction of being unwound from the reel 57. The parts 66 accommodated in the accommodating part 62 of the tape 60 are sequentially sent out to a predetermined sampling position by the feeder 58. The tape 60 is cut by a cutter (not shown) every predetermined length at a cutting position behind the sampling position.

  As shown in FIG. 4, a tape 60 containing a light emitting part-equipped component 660 is wound around at least one of the plurality of reels 57. The light emitting part-equipped component 660 has a rectangular LED 660a which is a light emitting part at a predetermined position on the upper surface. The predetermined suction position 660b sucked by the nozzle 40 on the upper surface of the light emitting part-equipped component 660 is set with reference to the center position 660c of the LED 660a. In the present embodiment, the predetermined suction position 660b is set as a position shifted from the center position 660c of the LED 660a by X1 in the X direction and Y1 in the Y direction. The light emitting part-equipped component 660 is mounted on the substrate 12 such that the LED 660a is disposed at a predetermined position on the substrate 12.

  The temporary placement table 70 temporarily absorbs the light emitting part-equipped component 660 supplied by the reel unit 56 with the nozzle 40 of the mounting head 24 and then mounts it on the substrate 12 held by the transport unit 18. This is a table for temporarily placing the light emitting part-equipped component 660. The temporary placement table 70 is provided between the transport unit 18 that holds the substrate 12 and the reel unit 56 that holds the reel 57. In addition, the upper surface of the temporary placement table 70 is a temporary placement surface 71 which is finished flat with high accuracy. As shown in FIG. 5, the temporary placement surface 71 has temporary placement table marks 72 at four corners. The temporary placement table mark 72 is used to recognize the position of the temporary placement surface 71. Further, the temporary placement surface 71 is provided with four temporary placement areas 74 for placing the component 66, and a hole 73 is provided at the center of each temporary placement area 74. The hole 73 is connected in parallel to the vacuum pump 77 and the air compressor 78 through a switching valve 76 that is an electromagnetic valve. Therefore, by adjusting the switching valve 76, a negative pressure or a positive pressure can be supplied to the hole 73. A pressure sensor 75 that detects the pressure in the hole 73 is provided between the hole 73 and the switching valve 76.

  As shown in FIG. 1, the control device 80 is configured as a microprocessor centered on a CPU 81, and includes a ROM 82 that stores a processing program, a RAM 83 that is used as a work area, an HDD 84 that stores various data, an external device and an electrical device. An input / output interface 85 for exchanging signals is provided, and these are connected via a bus 86. The control device 80 is connected to the transport unit 18, the sampling unit 21, the mark camera 34, the side camera 44, the reel unit 56 and the like so as to be capable of bidirectional communication, and image signals from the mark camera 34 and the side camera 44. Enter. Further, the control device 80 outputs a control signal to the switching valve 76. Each slider 26, 30 is equipped with a position sensor (not shown), and the control device 80 controls the drive motor of each slider 26, 30 while inputting position information from these position sensors.

  The management computer 90 is a PC that manages information related to component mounting processing, and includes an input device 97 such as a mouse and a keyboard, a display 98, and the like. Production job data is stored in an HDD (not shown) of the management computer 90. Production job data includes information such as how many parts are mounted in which order on which board, how many boards on which such parts are mounted, and so on. .

  Next, the operation of the mounting system 10 of the present embodiment configured as described above will be described. The CPU 81 of the control device 80 mounts a plurality of components supplied by the reel unit 56 on the substrate 12 using the nozzles 40 according to the production job data. In the component mounting apparatus 11, XYZ coordinates are set in advance. The component mounting apparatus 11 recognizes the positions of the X-axis slider 26, the Y-axis slider 30, and the Z-axis motor 45 using the XYZ coordinates. Further, the CPU 81 causes the mark camera 34 to image the board mark of the board 12 and the temporary placement table mark 72 of the temporary placement surface 71 before starting the mounting of components, and the board mark and temporary placement table are based on these images. The coordinates of the mark 72 are specified, and the position where the substrate 12 is actually held and the position where the temporary placement surface 71 is disposed are recognized accurately.

  Hereinafter, a procedure for mounting the component 660 with the light emitting unit on the substrate 12 using the four nozzles 40 of the mounting head 24 will be described in detail with reference to the flowchart of the component mounting program of FIG. This program is stored in the HDD 84 of the component mounting apparatus 11.

  When the component mounting program is started, the CPU 81 of the control device 80 executes a suction processing routine (step S100), a temporary placement processing routine (step S200), and a re-suction / mounting processing routine (step S300) in this order. Hereinafter, each routine will be described with reference to the flowcharts of FIGS.

  When the suction processing routine is started, the CPU 81 first sets the value 1 to the variable N of the counter in the RAM 83 (step S110). Subsequently, the CPU 81 rotates the mounting head 24 to place the Nth nozzle 40 at the operating position (step S115). Subsequently, as shown in FIG. 10, the CPU 81 causes the mark camera 34 to capture an image of the upper surface of the light emitting part-equipped component 660 at the sampling position (step S120). That is, the CPU 81 controls the X-axis slider 26 and the Y-axis slider 30 so that the mark camera 34 is located above the component 660 with the light emitting unit, and then includes the LED 660a of the component 660 with the light emitting unit at the position. The upper surface is imaged and the image data is taken into the RAM 83. Subsequently, the CPU 81 calculates the suction position 660b of the light emitting part-equipped component 660 (step S125). Here, the CPU 81 calculates the outer contour of the light emitting part-equipped component 660 and the center position 660c of the LED 660a from the captured image data, and calculates the suction position 660b therefrom. However, since the bottom surface of the accommodating portion 62 of the tape 60 is not flat, the light emitting part-equipped component 660 accommodated in the accommodating portion 62 is likely to rattle. For this reason, the calculated suction position 660b often does not actually coincide with a predetermined specific position.

  Subsequently, the CPU 81 attracts the light emitting part-equipped component 660 on the tape 60 to the Nth nozzle 40 (step S130). That is, the CPU 81 controls the X-axis slider 26 and the Y-axis slider 30 so that the N-th nozzle 40 comes directly above the suction position 660b of the component 660 with the light emitting unit, and then the tip of the N-th nozzle 40 The Z-axis motor 45 is controlled so as to come into contact with the suction position 660b. At the same time, the CPU 81 supplies a negative pressure to the Nth nozzle 40 and causes the nozzle 40 to attract the component 660 with the light emitting unit. Thereafter, the CPU 81 controls the Z-axis motor 45 so that the Nth nozzle 40 rises to the upper position. Subsequently, the CPU 81 causes the side camera 44 to image the vicinity of the tip of the Nth nozzle 40 (step S135). That is, the CPU 81 controls the mounting head 24 so that the N-th nozzle 40 is disposed at the photographing position, and then causes the side camera 44 to image the vicinity of the tip of the N-th nozzle 40 at that position, and obtains the image data. The data is loaded into the RAM 83. Subsequently, the CPU 81 determines whether or not the light emitting part-equipped component 660 is attracted to the tip of the Nth nozzle 40 (step S140).

  If the component 660 with the light emitting unit is not attracted to the tip of the Nth nozzle 40, the CPU 81 executes error processing including display of the error code E1 (step S155), and ends the component mounting operation. . In the error processing in step S155, the CPU 81 displays the error code E1 on a display (not shown) of the component mounting apparatus 11, sounds an alarm sound, and turns on the alarm lamp. The error code E1 indicates that the suction of the component on the tape 60 has failed. Therefore, the worker who has seen the error code E1 can easily know what work is required to cancel the error. On the other hand, if the light emitting part-equipped component 660 is attracted to the tip of the Nth nozzle 40 in step S140, the CPU 81 determines whether or not the variable N is the maximum value (here, value 4) (step S145). If the variable N is not the maximum value, the value of the variable N is incremented by 1 (step S150), and the process returns to step 115 again. On the other hand, if the variable N is the maximum value in step S145, the components 660 with the light emitting parts are attracted to all the nozzles 40, and the process proceeds to the temporary placement processing routine (step S200).

  When the temporary placement processing routine is started, the CPU 81 first controls the X-axis slider 26 and the Y-axis slider 30 so that the mounting head 24 is disposed above the temporary placement surface 71 (step S205). Subsequently, the CPU 81 sets a value 1 to the variable N of the counter of the RAM 83 (step S210). Subsequently, the CPU 81 rotates the mounting head 24 to place the Nth nozzle 40 at the operating position (step S215). Subsequently, the CPU 81 performs a temporary placement operation of the light emitting part-equipped component 660 (step S220). That is, the CPU 81 causes the X-axis slider 26 and the Y-axis slider 30 to place the light emitting part-equipped component 660 adsorbed by the Nth nozzle 40 at a position above the Nth temporary placement area 74 of the temporary placement surface 71. To control. In the present embodiment, the four temporary placement areas 74 are counted as first and second from the left. Thereafter, the CPU 81 lowers the Nth nozzle 40 so as to place the light emitting part-equipped component 660 in the Nth temporary placement area 74, and supplies positive pressure to the Nth nozzle 40. At the same time, the CPU 81 controls the switching valve 76 so that negative pressure is supplied to the hole 73 of the Nth temporary placement area 74. Thereafter, the CPU 81 controls the Z-axis motor 45 so that the Nth nozzle 40 rises to the upper position. Subsequently, the CPU 81 determines whether or not the pressure in the hole 73 of the Nth temporary placement area 74 is less than a threshold value (step S225). Here, when the hole 73 to which negative pressure is supplied is covered by the component 660 with the light emitting portion, the threshold value is less than the threshold value, and the hole 73 is the component with the light emitting portion. When not covered with 660, the negative pressure of the hole is set to be equal to or higher than the threshold value. For this reason, if the determination in step S225 is affirmative, the light emitting part-equipped component 660 has been temporarily placed in the temporary placement area 74 so as to cover the hole 73, and normal processing continues. On the other hand, if the negative determination is made in step S225, the light emitting part-equipped component 660 has not been temporarily placed in the temporary placement area 74, and a non-normal process different from the normal process is performed.

  If the pressure in the hole 73 of the Nth temporary placement area 74 is not less than the threshold value in step S225, the CPU 81 causes the side camera 44 to image the vicinity of the tip of the Nth nozzle 40 (step S240). ). That is, the CPU 81 controls the mounting head 24 so that the N-th nozzle 40 is disposed at the photographing position, and then causes the side camera 44 to image the vicinity of the tip of the N-th nozzle 40 at that position, and obtains the image data. The data is loaded into the RAM 83. Subsequently, the CPU 81 determines whether or not the light emitting part-equipped component 660 is attracted to the tip of the Nth nozzle 40 (step S245).

  If the light emitting part-equipped component 660 is attracted to the tip of the Nth nozzle 40, the CPU 81 executes error processing including display of the error code E2 (step S250), and ends the component mounting operation. In the error process of step S250, the CPU 81 displays an error code E2 on a display (not shown) of the component mounting apparatus 11, sounds a warning sound, and turns on a warning lamp. The error code E2 indicates that the temporary placement of the component in the temporary placement area 74 has failed, and the nozzle 40 remains sucking the component. Therefore, the operator who has seen the error code E2 can easily know that the component that has failed in temporary placement is adsorbed by the nozzle 40. On the other hand, if the component 660 with the light emitting unit is not attracted to the tip of the Nth nozzle 40 in step S245, the CPU 81 executes error processing including display of the error code E3 (step S255), and component mounting operation Exit. In the error processing in step S255, the CPU 81 displays an error code E3 on a display (not shown) of the component mounting apparatus 11, sounds a warning sound, and turns on a warning lamp. The error code E3 indicates that the temporary placement of the component in the temporary placement area 74 has failed and the nozzle 40 has not picked up the component. Therefore, the operator who has seen the error code E3 can predict that the part has fallen between the reel unit 56 and the temporary placement table 70 or around the temporary placement table 70.

  On the other hand, if the pressure in the hole 73 of the Nth temporary placement area 74 is less than the threshold value in step S225, the CPU 81 determines whether or not the variable N is the maximum value (step S230). If the variable N is not the maximum value, the CPU 81 increments the variable N by 1 (step S235) and returns to step S215. On the other hand, if the variable N is the maximum value in step S230, the light emitting part-equipped components 660 are temporarily placed in all the temporary placement areas 74, so the CPU 81 performs the re-suction / mounting process routine (step S300). Proceed to

  When the re-adsorption / mounting process routine is started, the CPU 81 first sets the value 1 to the variable N of the counter of the RAM 83 (step S310). Subsequently, the CPU 81 places the Nth nozzle 40 at the operating position (step S315). Subsequently, as shown in FIG. 11, the CPU 81 causes the mark camera 34 to image the upper surface of the light emitting part-equipped component 660 temporarily placed in the Nth temporary placement area 74 (step S320). That is, the CPU 81 controls the X-axis slider 26 and the Y-axis slider 30 so that the mark camera 34 comes above the light emitting part-equipped component 660 temporarily placed in the Nth temporary placement area 74, and then marks the mark camera 34 at that position. The camera 34 is caused to take an image of the upper surface including the LED 660 a of the light emitting part-equipped component 660 and the image data is taken into the RAM 83. At this time, since the imaging by the mark camera 34 is performed in a state where the light emitting part-equipped component 660 is held in the temporary placement area 74 by the negative pressure supplied to the hole 73, the imaging can be performed with high accuracy. Subsequently, the CPU 81 calculates a suction position of the light emitting part-equipped component 660 (step S325). Here, the CPU 81 calculates the outer contour of the light emitting part-equipped component 660 and the center position 660c of the LED 660a from the captured image data, and calculates the suction position 660b therefrom. This process is the same as step S125, but the temporary placement surface 71 has good flatness, and thus the component 660 with the light emitting part is held horizontally. Therefore, the calculated suction position 660b coincides with a predetermined specific position with high accuracy.

  Subsequently, the CPU 81 causes the N-th nozzle 40 to re-suck the light emitting part-equipped component 660 temporarily placed in the N-th temporary placement area 74 (step S330). That is, the CPU 81 controls the X-axis slider 26 and the Y-axis slider 30 so that the N-th nozzle 40 comes directly above the suction position 660b of the light emitting part-equipped component 660 temporarily placed in the N-th temporary placement area 74. After that, the Z-axis motor 45 is controlled so that the tip of the Nth nozzle 40 contacts the suction position 660b. At the same time, the CPU 81 supplies negative pressure to the Nth nozzle 40 to cause the nozzle 40 to suck the component 660 with the light emitting unit. At that time, the CPU 81 controls the switching valve 76 so that positive pressure is supplied to the hole 73 of the Nth temporary placement area 74 at the timing when the tip of the Nth nozzle 40 contacts the component 660 with the light emitting unit. At this time, the switching valve 76 is controlled so that the pressure in the hole 73 remains negative until at least the tip of the Nth nozzle 40 contacts the light emitting part-equipped component 660. This prevents the light-emitting component 660 from being displaced until the Nth nozzle 40 contacts the light-emitting component 660 after the top surface of the light-emitting component 660 is imaged. The positioning accuracy of the nozzle 40 with respect to can be improved. The light emitting part-equipped component 660 is easily separated from the temporary placement area 74. Thereafter, the CPU 81 controls the Z-axis motor 45 so that the Nth nozzle 40 rises to the upper position. Subsequently, the CPU 81 controls the switching valve 76 so that the negative pressure is supplied again to the hole 73 of the Nth temporary storage area 74 (step S335), and whether or not the pressure of the hole 73 is equal to or higher than a threshold value. Determination is made (step S340). Here, the threshold value may be set similarly to the threshold value in step S225 described above.

  If the pressure in the hole 73 in the Nth temporary placement area 74 is not equal to or higher than the threshold value in step S340, the CPU 81 executes error processing including display of the error code E4 (step S365), and component mounting. End the operation. In the error process of step S365, the CPU 81 displays the error code E4 on a display (not shown) of the component mounting apparatus 11, sounds an alarm sound, and turns on the alarm lamp. The error code E4 indicates that the re-suction of the component from the temporary placement area 74 has failed and the component remains in the temporary placement area 74. Therefore, the operator who has seen the error code E4 can easily know that the part that has failed to be re-sucked remains on the temporary placement surface 71.

  On the other hand, if the pressure in the hole 73 of the Nth temporary placement area 74 is equal to or greater than the threshold value in step S340, the CPU 81 causes the side camera 44 to image the vicinity of the tip of the Nth nozzle 40 (step S345). . That is, the CPU 81 controls the mounting head 24 so that the N-th nozzle 40 is disposed at the photographing position, and then causes the side camera 44 to image the vicinity of the tip of the N-th nozzle 40 at that position, and obtains the image data. The data is loaded into the RAM 83. Subsequently, the CPU 81 determines whether or not the light emitting part-equipped component 660 is attracted to the tip of the Nth nozzle 40 (step S350).

  If the component 660 with the light emitting unit is not attracted to the tip of the Nth nozzle 40, the CPU 81 executes error processing including display of the error code E5 (step S370) and ends the component mounting operation. . In the error processing in step S370, the CPU 81 displays an error code E5 on a display (not shown) of the component mounting apparatus 11, sounds a warning sound, and turns on the warning lamp. The error code E5 indicates that the component has been removed from the nozzle 40 in the middle of the nozzle 40 once re-sucking the component from the temporary placement area 74. Therefore, the operator who has seen the error code E5 can easily know that there are parts remaining around the temporary placement surface 71.

  On the other hand, if the light emitting part-equipped component 660 is attracted to the tip of the Nth nozzle 40 in step S350, the CPU 81 determines whether or not the variable N is the maximum value (here, value 4) (step S355). If the variable N is not the maximum value, the value of the variable N is incremented by 1 (step S360), and the process returns to step 315 again. On the other hand, if the variable N is the maximum value in step S350, the components 660 with the light emitting unit are re-adsorbed to all the nozzles 40, so the mounting processing routine (step S375) is executed, and this component is executed. The mounting operation ends. In the mounting processing routine, the CPU 81 moves the mounting head 24 onto the substrate 12 and the X-axis slider 26 and the Y-axis slider 30 so that the LED 660a of each light emitting part-equipped component 660 is disposed at the position specified by the production job data. And the Z-axis motor 45 and the pressure of the nozzle 40 are controlled.

  When an error occurs, the operator removes the cause of the failure and restarts the component mounting program. As a result, the CPU 81 resumes the suspended component mounting program.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The reel unit 56 of this embodiment corresponds to the component supply means of the present invention, the mounting head 24 corresponds to the component suction means, the X-axis slider 26, the Y-axis slider 30, and the Z-axis motor 45 correspond to the moving means, The support plate 20 and the support pin 23 correspond to the substrate holding means, the switching valve 76, the vacuum pump 77, and the air compressor 78 correspond to the pressure adjusting means, the pressure sensor 75 corresponds to the pressure detecting means, and the control device 80 performs control. Corresponds to means. Further, the side camera 44 corresponds to a side imaging unit, and the mark camera 34 corresponds to a top surface imaging unit.

  According to the component mounting apparatus 11 of the present embodiment described in detail above, the component 660 with the light emitting unit is controlled to be temporarily placed in the temporary placement area 74 of the temporary placement surface 71, and the negative pressure is supplied to the hole 73. Then, the mark camera 34 captures an image of the component 660 with the light emitting unit temporarily placed in the temporary placement area 74. In this way, the component 660 with the light emitting portion is held in the temporary placement area 74 of the temporary placement surface 71 by the negative pressure supplied to the hole 73 provided in the temporary placement area 74, and thus the mark camera 34 images the component 660 with the light emitting portion. In doing so, it is possible to prevent the light emitting part-equipped component 660 temporarily placed on the temporary placement surface 71 from being displaced.

  In addition, in order to determine whether or not the light emitting part-equipped component 660 is actually temporarily placed based on the pressure state of the hole 73, it is easily determined using the negative pressure for holding the component on the temporary placement surface. Can do. Further, the determination can be made more quickly than in the case where the temporary placement surface 71 is imaged and the captured image is analyzed to check the presence or absence of the component 660 with the light emitting unit.

  In addition, when the reel unit 56 supplies the light emitting part-equipped component 660, the light emitting part-equipped component 660 is supplied using the tape 60. However, since the tape 60 is not flat, the light emitting component-equipped component 660 is Easy to beat. Therefore, when the nozzle 40 of the mounting head 24 sucks the light emitting part-equipped component 660 supplied by the reel unit 56, it is difficult to suck a predetermined specific suction position 660b with high accuracy. However, in the present embodiment, since the temporary placement surface 71 is a flat surface, when the nozzle 40 of the mounting head 24 re-sucks the component 660 with the light emitting unit placed on the temporary placement surface 71, a specific surface is provided. The suction position 660b can be sucked with high accuracy.

  Furthermore, the CPU 81 executes a re-adsorption / mounting process routine including imaging of the upper surface of the light-emitting component 660 when the component 660 with the light-emitting portion is actually temporarily placed in the temporary placement area 74 of the temporary placement surface 71. Perform normal processing. On the other hand, if the component 660 with the light emitting unit is not actually temporarily placed, the non-normal processing after step S240 is performed. Therefore, the upper surface of the light emitting part-equipped component 660 can be reliably imaged in a state where the light emitting unit-equipped component 660 is actually temporarily placed.

  Further, in practice, when the component 660 with the light emitting part is not temporarily placed on the temporary placement surface 71, whether or not the part 660 with the light emitting part remains adsorbed to the nozzle 40 is determined by the error codes E2 and E3. Therefore, the operator can easily find the light emitting part-equipped component 660 that has not been temporarily placed.

  Further, the CPU 81 controls the switching valve 76 so that the pressure in the hole 73 becomes positive when the component 660 with the light emitting unit is re-adsorbed to the nozzle 40 of the mounting head 24. Therefore, the nozzle 40 can re-suck the light emitting part-equipped component 660 smoothly.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the temporary placement processing routine (FIG. 8) of the above-described embodiment, if the CPU 81 makes a negative determination in step S225, instead of executing steps S240 to S255, the CPU 81 simply performs error processing indicating that temporary placement has failed. May be executed. In this way, since error processing is performed without performing image analysis, it is possible to quickly notify the operator that temporary placement has failed, and throughput is further improved. In addition, when an affirmative determination is made in step S245, the error processing is not performed immediately, but the component 660 with the light emitting part sucked by the nozzle 40 may be temporarily placed in the temporary placement area 74 again. In this way, the chance of error stop can be reduced.

  Further, in the re-adsorption / mounting process routine (FIG. 9) of the above-described embodiment, the CPU 81 does not immediately execute the error process when making a negative determination in step S340, but performs the processes of steps S320 to S340 again. You may do it. In this way, the chance of error stop can be reduced.

  In the above-described embodiment, the mounting head 24 includes the four nozzles 40. However, the number of nozzles 40 is not particularly limited. For example, the mounting head 24 may include one nozzle 40, or may include eight or twelve nozzles 40. For example, when the mounting head 24 including the eight nozzles 40 is used and the temporary placement surface 71 provided with the four temporary placement areas 74 as in the above-described embodiment is used, Only four of them may be used.

  In the embodiment described above, the vacuum pump 77 and the air compressor 78 are provided for each of the four holes 73 of the temporary placement surface 71, but the vacuum pump 77 and the air compressor 78 may be integrated into one.

  In the above-described embodiment, the air compressor 78 is connected to the four holes 73 of the temporary placement surface 71, but the air compressor 78 may be provided and communicated with the atmosphere. In this case, instead of supplying positive pressure to the hole 73, atmospheric pressure is supplied.

  In the embodiment described above, the light emitting part-equipped component 660 having the LED 660a attached to the upper surface is illustrated, and the predetermined suction position 660b is obtained from the center position 660c of the LED 660a. However, instead of the LED 660a, another one is used as a mark. You may attach to an upper surface. For example, in the case of a component having a polarity such as a diode or a capacitor, a mark indicating the polarity direction (for example, “+”) is provided on the upper surface of the component, and a predetermined suction position is obtained from the position of this mark. Good. Further, the position of a specific location such as the LED 660a or the mark may not be obtained, but the external shape of the component or the shape of a predetermined location may be obtained.

  In the embodiment described above, the reel unit 56 is exemplified as the component supply device, but a tray unit may be used instead of the reel unit 56.

  In the above-described embodiment, the specific suction position 660b determined in advance is re-sucked when the component 660 with the light emitting unit temporarily placed in the temporary placement area 74 is re-sucked, but not the specific suction position 660b. A predetermined design value (coordinate position) may be attracted again. Even in this case, the component 660 with the light emitting unit can be mounted so that the LED 660 a is disposed at a predetermined position on the substrate 12.

  The present invention is applicable to a component mounting apparatus for mounting electronic components on a substrate.

DESCRIPTION OF SYMBOLS 10 mounting system, 11 component mounting apparatus, 12 board | substrate, 18 conveyance part, 20 support plate, 21 sampling part, 22 conveyor belt, 23 support pin, 24 mounting head, 26 X axis slider, 28 guide rail, 30 Y axis slider, 32 guide rails, 34 mark cameras, 40 nozzles, 42 nozzle holders, 44 side cameras, 45 Z-axis motors, 56 reel units, 57 reels, 58 feeders, 60 tapes, 62 housings, 64 films, 66 parts, 67 Sprocket hole, 70 Temporary placement table, 71 Temporary placement surface, 72 Temporary placement table mark, 73 Pressure hole, 74 Temporary placement area, 75 Pressure sensor, 76 Switching valve, 77 Vacuum pump, 78 Air compressor, 80 Controller, 81 CPU , 82 ROM, 83 RAM, 84 HDD, 85 Force interface, 86 bus, 90 management computer, 97 input device, 98 display, 660 component with light emitting part, 660a LED, 660b suction position, 660c center position.

Claims (7)

Parts supply means for supplying parts;
Component adsorbing means capable of adsorbing the component;
Moving means for moving the component suction means;
Board holding means for holding a board on which the component is mounted;
Having a hole at a predetermined position, and a temporary placement surface for temporarily placing the component at the predetermined position;
Pressure adjusting means capable of supplying at least negative pressure to the hole;
Upper surface imaging means capable of imaging the upper surface of the component temporarily placed on the temporary placement surface;
Control for controlling the component suction unit and the moving unit so that the component is temporarily placed at the predetermined position after the component suction unit sucks the component supplied by the component supply unit and before the component is mounted on the substrate. Means,
With
The control means controls to temporarily place the component at the predetermined position, and the upper surface imaging means images the component temporarily placed at the predetermined position in a state where negative pressure is supplied to the hole.
Component mounting equipment. The component mounting apparatus according to claim 1,
Pressure detecting means for detecting the pressure of the hole,
The control device performs a first determination as to whether or not the component has been temporarily placed at the predetermined position based on the pressure detected by the pressure detection unit.
Component mounting equipment. If the result of the first determination is affirmative, the control means performs normal processing for re-sucking the component by the component suction means after the top surface imaging means images the top surface of the temporarily placed component. On the other hand, if the result of the first determination is negative, an abnormal process different from the normal process is performed.
The component mounting apparatus according to claim 2. The component mounting apparatus according to claim 2 or 3,
Side imaging means capable of imaging the part adsorbed by the parts adsorption means from the side,
When the result of the first determination is negative, the control means causes the side image pickup means to pick up the component suction means, and the component suction means picks up the component based on the picked up image. Determine whether or not
Component mounting equipment. The component mounting apparatus according to any one of claims 1 to 4,
Pressure detecting means for detecting the pressure of the hole,
The control unit controls the component to be re-adsorbed to the component adsorption unit, and then the component is actually detected based on the pressure detected by the pressure detection unit in a state where negative pressure is supplied to the hole. A second determination is made as to whether or not the component suction means has been re-sucked.
Component mounting equipment. The controller controls the upper surface of the temporarily placed part to be picked up by the upper face image pickup means, and then controls the part suction means to re-suck the part, and at least the part suction means to the part. The component mounting apparatus according to any one of claims 1 to 5, wherein the pressure adjusting means is controlled so that the pressure in the hole maintains a negative pressure state until contact is made. The control means controls the pressure adjusting means so that the pressure of the hole becomes an atmospheric pressure or a positive pressure when the parts are re-sucked by the parts suction means.
The component mounting apparatus of any one of Claim 3, 5 or 6.

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