JP6828223B2 - Mounting device - Google Patents

Description

The present invention relates to a mounting device.

Conventionally, a mounting device for mounting a light emitting component having a light emitting body such as an LED on a substrate has been known. Further, there is known a mounting device that accurately positions the light emitting center of the light emitting body on the substrate even when the position accuracy of the light emitting body in the light emitting component is poor. For example, the bonding apparatus described in Patent Document 1 first captures an image in a state where the light emitting component emits light, and calculates the relative coordinates of the light emitting center and the external reference point of the light emitting component based on the image. Next, this device takes an image while holding the light emitting component by the holding means, and recognizes the external reference point of the light emitting component based on the captured image. Then, this device calculates the position of the light emitting center based on the recognized external reference point and the calculated relative coordinates, and corrects the bonding position when the amount of misalignment between that position and the bonding position is large. The light emitting component is bonded on the substrate.

Japanese Unexamined Patent Publication No. 2000-150970

As described above, in Patent Document 1, in order to accurately position the light emitting center on the substrate, light is emitted in each of the state where the light emitting component is not held by the holding means and the state where the light emitting component is held by the holding means. Imaging of parts was required and was not always efficient.

The present invention has been made in view of such a problem, and an object of the present invention is to efficiently position and mount the position of a light emitting body of a light emitting component on a substrate.

The present invention has taken the following measures to achieve the above-mentioned main object.

The method for mounting the first light emitting component of the present invention is as follows.
It is a mounting method of a light emitting component that mounts a light emitting component having a light emitting body on a substrate.
An imaging step of acquiring an image of a light emitting component by imaging a region including at least a part of the light emitting body in the light emitting component by an imaging means.
A light emitting body position detection step of detecting the position of the light emitting body based on the light emitting component image, and
Based on the position of the light emitting body detected in the light emitting body position detection step, the component holding means is aligned with the light emitting component so that the component holding means and the light emitting body have a predetermined positional relationship, and the component. A component holding step of holding the light emitting component by the holding means, and
A mounting step of positioning the component holding means for holding the light emitting component with respect to the substrate and mounting the light emitting component on the substrate based on the predetermined positional relationship.
Is included.

In the first method of mounting a light emitting component of the present invention, when mounting a light emitting component having a light emitting body on a substrate, an image of a region including at least a part of the light emitting body is taken to acquire an image of the light emitting component. .. Next, the position of the light emitting body is detected based on the light emitting component image. Then, based on the detected position of the light emitting body, the component holding means is aligned with the light emitting component so that the component holding means and the light emitting body have a predetermined positional relationship, and the light emitting component is held. Further, based on a predetermined positional relationship, the component holding means for holding the light emitting component is positioned with respect to the substrate, and the light emitting component is mounted on the substrate. In this way, based on the position of the light emitting body, the component holding means and the light emitting body are aligned so as to have a predetermined positional relationship to hold the light emitting component, and the component holding means is mounted on the substrate in consideration of the positional relationship. Since the light emitting body is positioned and mounted on the substrate, the light emitting body can be accurately positioned on the substrate even if the position of the light emitting body in the light emitting component deviates from the design value. Further, since it is not necessary to take an image of the light emitting component while the light emitting component is held by the holding means, the light emitting component can be efficiently positioned and mounted on the substrate. It suffices if the light emitting component can be mounted so that the specific part of the light emitting body is eventually arranged at the predetermined coordinates on the substrate, and the predetermined coordinates on the substrate can be stored in advance or the predetermined coordinates on the substrate can be derived. It is not essential to do it.

The method for mounting the second light emitting component of the present invention is as follows.
It is a method of mounting a light emitting component that mounts a light emitting component having a light emitting body on a substrate.
An imaging step of acquiring an image of a light emitting component by imaging a region including at least a part of the light emitting body in the light emitting component by an imaging means.
A light emitting body position detection step of detecting the position of the light emitting body based on the light emitting component image, and
A component holding step of positioning the component holding means at a predetermined holding position and holding the light emitting component by the component holding means.
Based on the position of the light emitting body detected in the light emitting body position detection step and the predetermined holding position, the positional relationship between the holding means and the light emitting body in the light emitting component held by the holding means is calculated. Process and
Based on the positional relationship, a mounting step of positioning the component holding means for holding the light emitting component at a mounting position on the substrate and mounting the light emitting component on the substrate.
Is included.

In the second method of mounting a light emitting component of the present invention, when mounting a light emitting component having a light emitting body on a substrate, an image of a region including at least a part of the light emitting body is taken to acquire an image of the light emitting component. .. Next, the position of the light emitting body is detected based on the light emitting component image. Then, the component holding means is positioned at a predetermined holding position, and the light emitting component is held by the component holding means. At the same time, based on the detected position of the light emitting body and the above-mentioned holding position, the positional relationship between the holding means and the light emitting body in the light emitting component held by the holding means is calculated. Then, based on the positional relationship, the component holding means that holds the light emitting component is positioned at the mounting position on the substrate, and the light emitting component is mounted on the substrate. In this way, the positional relationship between the holding means and the light emitting body is calculated based on the detected position and holding position of the light emitting body, the component holding means is positioned based on the positional relationship, and the light emitting component is mounted on the substrate. Therefore, even if the position of the light emitting body in the light emitting component deviates from the design value, the light emitting body can be accurately positioned on the substrate. Further, since it is not necessary to take an image of the light emitting component while the light emitting component is held by the holding means, the light emitting component can be efficiently positioned and mounted on the substrate.

In the first or second light emitting component mounting method of the present invention, further, at least from the time when the light emitting component is imaged in the imaging step until the light emitting component is held by the holding means in the component holding step. May include a mounting and holding step of holding the light emitting component on a mounting table. In this way, since the light emitting component is held on the mounting table from the time when the light emitting component is imaged until the light emitting component is held by the holding means, the light emitting body can be positioned more accurately on the substrate. ..

The first mounting device of the present invention is
A mounting device for mounting a light emitting component having a light emitting body on a substrate.
A component holding means capable of holding the light emitting component and
A moving means for moving the component holding means and
An imaging means for acquiring an image of a light emitting component by imaging a region including at least a part of the light emitting body among the light emitting components.
A light emitting body position detecting means for detecting the coordinate position of a specific portion of the light emitting body based on the light emitting component image, and
A holding mounting control means that controls the operation of the component holding means and the moving means to control the holding and mounting of the light emitting component on a substrate.
With
In the holding mounting control means, when the component holding means holds the light emitting component, the component holding means and the light emitting body are predetermined based on the position of the light emitting body detected by the light emitting body position detecting means. When the component holding means is aligned with the light emitting component so as to have a positional relationship and the light emitting component held by the component holding means is mounted on the substrate, the component holding means is based on the predetermined positional relationship. Is positioned with respect to the substrate.

In the first mounting device of the present invention, when mounting a light emitting component having a light emitting body on a substrate, an image of a region including at least a part of the light emitting body is taken from the light emitting component to acquire an image of the light emitting component. Next, the position of the light emitting body is detected based on the light emitting component image. Then, when the component holding means holds the light emitting component, the component holding means is positioned on the light emitting component so that the component holding means and the light emitting body have a predetermined positional relationship based on the detected position of the light emitting body. Further, when the light emitting component held by the component holding means is mounted on the substrate, the component holding means holding the light emitting component is positioned with respect to the substrate based on a predetermined positional relationship. In this way, based on the position of the light emitting body, the component holding means and the light emitting body are aligned so as to have a predetermined positional relationship to hold the light emitting component, and the component holding means is mounted on the substrate in consideration of the positional relationship. Since the light emitting body is positioned and mounted on the substrate, the light emitting body can be accurately positioned on the substrate even if the position of the light emitting body in the light emitting component deviates from the design value. Further, since it is not necessary to take an image of the light emitting component while the light emitting component is held by the holding means, the light emitting component can be efficiently positioned and mounted on the substrate.

The second mounting device of the present invention is
A mounting device for mounting a light emitting component having a light emitting body on a substrate.
A component holding means capable of holding the light emitting component and
A moving means for moving the component holding means and
An imaging means for acquiring an image of a light emitting component by imaging a region including at least a part of the light emitting body in the light emitting component.
A light emitting body position detecting means for detecting the position of the light emitting body based on the light emitting component image, and
A holding mounting control means that controls the operation of the component holding means and the moving means to control the holding and mounting of the light emitting component on a substrate.
With
When the component holding means holds the light emitting component, the holding mounting control means aligns the component holding means at a predetermined holding position, and the light emitting component held by the component holding means is placed on the substrate. At the time of mounting, the light emitting component is mounted based on the positional relationship between the holding means and the light emitting body in the light emitting component held by the holding means, which is calculated from the position of the light emitting body and the predetermined holding position. The light emitting component is mounted on the board by positioning the held component holding means at a mounting position on the board.

In the second mounting device of the present invention, when mounting a light emitting component having a light emitting body on a substrate, an image of a region including at least a part of the light emitting body is taken from the light emitting component to acquire an image of the light emitting component. Next, the position of the light emitting body is detected based on the light emitting component image. Then, when the component holding means holds the light emitting component, the component holding means is positioned at a predetermined holding position. Then, when mounting the light emitting component held by the component holding means on the substrate, the light emitting component is mounted based on the position of the light emitting body and the positional relationship between the holding means and the light emitting body calculated from the predetermined holding position. The light emitting component is mounted on the board by positioning the held component holding means at the mounting position on the board. In this way, since the component holding means is positioned and the light emitting component is mounted on the substrate based on the positional relationship between the holding means and the light emitting body calculated from the detected position of the light emitting body and the holding position, the light emitting component is contained. Even if the position of the light emitting body deviates from the design value, the light emitting body can be accurately positioned on the substrate. Further, since it is not necessary to take an image of the light emitting component while the light emitting component is held by the holding means, the light emitting component can be efficiently positioned and mounted on the substrate.

In the first or second mounting apparatus of the present invention, a mounting table on which the light emitting component is placed when the light emitting component is imaged by the imaging means, and a mounting table provided on the above-described stand, at least by the imaging means. From the time when the light emitting component is imaged until the light emitting component is held by the holding means, a mounting holding means for holding the light emitting component on the above-mentioned stand may be provided. In this way, since the light emitting component is held on the mounting table from the time when the light emitting component is imaged until the light emitting component is held by the holding means, the light emitting body can be positioned more accurately on the substrate. ..

Schematic diagram of the mounting system 10. A flowchart showing an example of an implementation processing routine. The explanatory view of the mounting information 67 stored in HDD 64. Explanatory drawing which shows various coordinates when mounting a light emitting component 75 on a substrate 70. A flowchart showing an example of an implementation processing routine of a modified example. Explanatory drawing which shows various coordinates when mounting a light emitting component 75 on a substrate 70. The schematic explanatory view of the mounting system 10 of the modification. It is explanatory drawing at the time of taking an image of a light emitting component 75 on a mounting table 90.

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory view of the mounting system 10. The mounting system 10 of this embodiment includes a mounting device 11 that mounts a component including a light emitting component 75, which will be described later, on a substrate 70, and a mounting management computer 80 that manages and sets information related to the mounting process. In the present embodiment, the left-right direction (X-axis), the front-back direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG. Further, the mounting process includes a process of placing, arranging, mounting, inserting, joining, and adhering components on a substrate.

As shown in FIG. 1, the mounting device 11 includes a transport unit 18 for transporting a substrate, a sampling unit 21 for performing a mounting process for collecting parts and arranging them on the substrate 70, and a substrate 70 arranged on the sampling unit 21. A mark camera 34 that captures a reference mark, a reel unit 56 that sends out parts from a reel 57, a parts camera 54 that images parts, and a control device 60 that controls the entire device such as a sampling unit 21 and a mark camera 34 are provided. There is.

The transport unit 18 includes support plates 20 and 20 provided at intervals in the front and rear directions of FIG. 1 and extending in the left-right direction, and conveyor belts 22 and 22 provided on opposite surfaces of both support plates 20 and 20. ing. The conveyor belts 22 and 22 are bridged to the drive wheels and the driven wheels provided on the left and right sides of the support plates 20 and 20 so as to be endless. The substrate 70 is placed on the upper surfaces of the pair of conveyor belts 22, 22 and conveyed from left to right. The substrate 70 is supported from the back surface side by a large number of supporting pins 23 erected.

The sampling unit 21 includes a mounting head 24, an X-axis slider 26, a Y-axis slider 30, and the like. The mounting head 24 is mounted on the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed inside the mounting device 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is slidably attached to the guide rails 28, 28 in the left-right direction. The mounting head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. The sliders 26 and 30 are driven by drive motors (not shown).

The mounting head 24 includes a nozzle 40 for sucking and collecting parts, and a nozzle holder 42 to which one or more nozzles 40 are mounted and removable. In the present embodiment, the nozzle holder 42 includes 12 nozzle holders, and 12 nozzles 40 can be mounted. The nozzle holder 42 is held by the mounting head 24 in a rotatable state. The nozzle 40 uses pressure to attract parts to the tip of the nozzle and release the parts attracted to the tip of the nozzle. The nozzle 40 is moved up and down in the Z-axis direction (vertical direction) orthogonal to the X-axis and Y-axis directions by a holder raising and lowering device using the Z-axis motor 45 as a drive source. The mounting head 24 attracts and holds the component by the nozzle 40, but is not particularly limited as long as the component can be held. For example, the mounting head 24 may include a mechanical chuck that holds and holds the components.

The mark camera 34 is a device that images the substrate 70 from above, and is arranged on the lower surface of the X-axis slider 26. The mark camera 34 is a camera that reads a reference mark attached to the substrate 70, which has an imaging region below and indicates a reference position of the substrate 70, a reference position for arranging components, and the like. The mark camera 34 moves in the XY directions as the mounting head 24 moves.

The reel unit 56 includes a plurality of reels 57 around which tapes containing parts are wound, and is detachably attached to the front side of the mounting device 11. This tape is unwound from the reel 57 and sent out by the feeder unit 58 to the collection position where the tape is collected by the mounting head 24. A plurality of feeder portions 58 are arranged according to the number of reels 57 that can be attached to and detached from the mounting device 11.

The parts camera 54 is arranged in front of the support plate 20 on the front side of the transport unit 18. The imaging range of the parts camera 54 is above the parts camera 54. When the nozzle 40 sucking the parts passes above the parts camera 54, the parts camera 54 captures the state of the parts sucked by the nozzle 40 and outputs the image to the control device 60.

As shown in FIG. 1, the control device 60 is configured as a microprocessor centered on a CPU 61, and has a ROM 62 for storing a processing program, a RAM 63 used as a work area, and an HDD 64 as a storage means for storing various data. An input / output interface 65 for exchanging electric signals with an external device is provided, and these are connected via a bus 66. The control device 60 is connected to the transport unit 18, the collection unit 21, the mark camera 34, the parts camera 54, the reel unit 56, and the like so as to be capable of bidirectional communication, and inputs an image signal from the mark camera 34 and the parts camera 54. To do. The sliders 26 and 30 are equipped with position sensors (not shown), and the control device 60 controls the drive motors of the sliders 26 and 30 while inputting the position information from the position sensors.

The management computer 80 is a PC that manages information related to the mounting process, and includes an input device 87 such as a mouse and a keyboard, a display 88, and the like. In the HDD (not shown) of the management computer 80, the production job data including the mounting information 67 described later is stored in the HDD (not shown). In addition to the mounting information 67, the production job data also includes information on how many boards 70 on which the components are mounted and information such as the position of a reference mark on the board 70.

Next, the operation of the mounting system 10 of the present embodiment configured in this way, particularly the mounting process in which the mounting device 11 mounts various components on the substrate 70 will be described. FIG. 2 is a flowchart showing an example of a mounting processing routine executed by the CPU 61 of the control device 60. This routine is stored in the HDD 64 of the mounting device 11 and executed by the start instruction by the operator. When this routine is executed, the CPU 61 of the control device 60 acquires the production job data including the mounting information 67 from the management computer 80 and stores it in the HDD 64 (step S100). The CPU 61 may receive the production job data from the management computer 80 in advance and store it in the HDD 64.

FIG. 3 is an explanatory diagram of mounting information 67 stored in the HDD 64. As shown in the figure, the mounting information 67 includes information associating the mounting order, component type, mounting coordinates, holding coordinates, and the like of the components to be mounted on the board 70. The mounting coordinates are coordinates (XY coordinates) representing positions on the substrate 70 on which the components are arranged. The holding coordinates are coordinates (XY coordinates) representing the positions where the parts are attracted and held. In the present embodiment, the holding coordinates are predetermined as the coordinates of the center of the component (center in the XY direction).

Here, the component specified to be mounted in the mounting information 67 includes a light emitting component 75. In this embodiment, the component A shown in FIG. 3 is a light emitting component 75. FIG. 4 is an explanatory diagram showing various coordinates when the light emitting component 75 is mounted on the substrate 70. As shown in the lower part of FIG. 4, the light emitting component 75 includes a support substrate 76 and a light emitting body 77 such as an LED mounted on the support substrate 76. As shown in the lower part of FIG. 4, the center position of the light emitting component 75, that is, the center position (component center coordinates) of the support substrate 76 is the coordinates (C1, D1). Further, in the light emitting component 75, the design position of the light emitting body 77 in the light emitting component 75 is predetermined. As shown in the lower part of FIG. 4, when the light emitting body 77 is attached to the design position (when the light emitting body 77 is at the position of the broken line), the center position (light emitting body design center coordinates) of the light emitting body 77 is the coordinates (the light emitting body design center coordinates). A1 and B1). The holding coordinates (C1, D1) are located at positions deviated from the illuminant design center coordinates (A1, B1) by the coordinates r to the left and the coordinates s forward. That is, the holding coordinates (C1, D1) = coordinates (A1-r, B1-s). In other words, the relative position of the holding coordinates with respect to the illuminant design center coordinates is the coordinates (−r, −s). Then, as shown in FIG. 3, the mounting information 67 includes coordinates (C1, D1) as holding coordinates corresponding to the component A (light emitting component 75). Further, the mounting information 67 includes coordinates (A1, B1) as the illuminant design center coordinates corresponding to the component A (light emitting component 75). As described above, the mounting information 67 includes the positional relationship between the light emitting body design center coordinates which are the centers of the light emitting body 77 and the holding coordinates where the mounting head 24 holds the light emitting component 75. The holding coordinates and the light emitting body design center coordinates are values determined for each type of the light emitting component 75. Therefore, as shown in FIG. 3, the holding coordinates and the illuminant design center coordinates corresponding to the component A have the same values in the mounting order 1 and the mounting order 2, respectively. Further, in the mounting information 67, the value of the light emitting body design center coordinates is not associated with the parts (parts B to G, etc.) other than the light emitting component 75.

In the present embodiment, the mounting coordinates are the coordinates with the reference mark of the substrate 70 as the origin. Further, the holding coordinates and the illuminant design center coordinates are coordinates whose origin is the reference position stored in advance in the HDD 64 corresponding to each of the plurality of feeder units 58. Further, the holding coordinates and the illuminant design center coordinates are the parts (collected by the feeder unit 58) that are unwound from the reel 57 and then collected by the mounting head 24 among the plurality of parts stored in the tape of the reel 57. It is defined as the coordinates of the parts sent to.

When the production job data including the mounting information 67 is stored, the CPU 61 conveys the board 70 (step S110). In this process, the CPU 61 conveys the substrate 70 by the conveyor belt 22 of the conveying unit 18, and fixes the substrate 70 at a predetermined mounting position for performing the process of mounting the components. Next, the CPU 61 performs a process of detecting the position of the reference mark on the substrate 70 (step S120). In this process, the CPU 61 moves the mark camera 34 to the position of the board mark based on the production job data by the sliders 26 and 30 respectively. Next, the CPU 61 causes the mark camera 34 to image the substrate mark. Then, the CPU 61 detects the position (XY coordinates) of the reference mark based on the captured image and stores it in the RAM 63. The CPU 61 grasps the coordinates (for example, mounting coordinates) on the substrate 70 in the subsequent processing with the detected coordinates of the reference mark as the origin.

Subsequently, the CPU 61 determines one unarranged component as a suction target according to the mounting order of the mounting information 67 (step S140). Then, the CPU 61 determines whether or not the adsorption target is the light emitting component 75 (step S150). The CPU 61 makes this determination based on, for example, the type of component to be attracted in the mounting information 67. The CPU 61 may make this determination depending on whether or not the illuminant design center coordinates are associated with the component to be attracted in the mounting information 67.

When the object to be attracted is the light emitting component 75 in step S150, the CPU 61 causes the mark camera 34 to image the light emitting body 77 of the light emitting component 75 to acquire the light emitting component image (step S160). In this process, the CPU 61 first acquires the illuminant design center coordinates of the adsorption target defined in the mounting information 67 from the HDD 64. Then, the CPU 61 moves the mark camera 34 so that the center of the imaging range 35 (see the lower part of FIG. 4) of the mark camera 34 is located at the illuminant design center coordinates corresponding to the feeder unit 58 that sends out the adsorption target. Then, the CPU 61 acquires a light emitting component image by the mark camera 34. As shown in FIG. 4, the field of view of the mark camera 34, that is, the imaging range 35 is predetermined so that the entire light emitting body 77 can be imaged. Further, the imaging range 35 is empirically determined in advance so that the entire light emitting body 77 can be imaged even if the position of the light emitting body 77 in the light emitting component 75 deviates from the design value. In the present embodiment, the imaging range 35 can capture the entire light emitting body 77 and the outer peripheral portion of the light emitting component 75 (for example, the front, rear, left, or right end or corner of the support substrate 76) as one image. It was not as large as that.

Subsequently, the CPU 61 detects the actual position of the light emitting body 77 based on the acquired light emitting component image. That is, the coordinates of the center of the illuminant 77 (the coordinates of the illuminant detection center) are detected (step S170). In this process, the CPU 61 first compares the light emitting component image with the comparative image obtained by capturing the light emitting component 75 with the light emitting body 77 as the center in advance. Then, the CPU 61 detects the region of the light emitting body 77 in the light emitting component image based on the comparison result, and detects the light emitting body detection center coordinates based on the center position of the detected region. As a result, for example, when the position of the light emitting body 77 in the light emitting component 75 is as designed, the CPU 61 detects the same coordinates as the light emitting body design center coordinates (A1, B1) as the light emitting body detection coordinates. On the other hand, when the position of the light emitting body 77 in the light emitting component 75 deviates from the design value by the coordinates a to the left and the coordinates b forward, as shown in the lower part of FIG. 4, the CPU 61 has the coordinates (A2, B2). = Coordinates (A1-a, B1-b) are detected as illuminant detection coordinates. The comparison image may be included in the production job data or may be stored in the HDD 64 in advance. Further, not only when the comparison image is used, it is sufficient that the CPU 61 has reference information for detecting the illuminant detection center coordinates based on the light emitting component image. For example, the production job data may include a threshold value for discriminating the color difference between the pixels of the light emitting body 77 and the pixels of the support substrate 76 in the light emitting component image as reference information.

Next, the CPU 61 derives the actual holding coordinates, which are the positions where the light emitting component 75 should actually be adsorbed, based on the detected light emitting body detection center coordinates, the holding coordinates included in the mounting information 67, and the light emitting body design center coordinates. (Step S180). In this process, the CPU 61 first derives the amount of deviation (difference between the two coordinates) from the illuminant design center coordinates to the illuminant detection center coordinates in the XY directions. Next, the CPU 61 derives the coordinates deviated from the holding coordinates by the amount of deviation as the actual holding coordinates. For example, when the position of the light emitting body 77 in the light emitting component 75 is as designed, the light emitting body design center coordinates and the light emitting body detection center coordinates are the same, and the deviation amount is (0,0). Therefore, the CPU 61 derives the same coordinates as the holding coordinates included in the mounting information 67 as the actual holding coordinates. On the other hand, when the position of the light emitting body 77 in the light emitting component 75 deviates from the design value as shown in the lower part of FIG. 4, the light emitting body detection center coordinates (A2, B2) are changed from the light emitting body design center coordinates (A1, B1). The amount of deviation to) is (-a, -b). Therefore, the CPU 61 actually holds the coordinates (C2, D2) = coordinates (C1-a, D1-b) deviated by the amount of deviation (-a, -b) from the holding coordinates (C1, D1) included in the mounting information 67. Derived as coordinates. As can be seen from FIG. 4, the actual holding coordinates (C2, D2) are the coordinates (A2-r, B2) deviated from the illuminant detection center coordinates (A2, B2) to the left by the coordinates r and the forward coordinates s. −S). As a result, as can be seen from FIG. 4, the positional relationship between the illuminant detection center coordinates (A2, B2) and the actual holding coordinates (C2, D2) when the position of the illuminant 77 deviates from the design value is light emission. The positional relationship between the light emitter design center coordinates (A1, B1) and the holding coordinates (C1, D1) is the same when the position of the body 77 is as designed. That is, the positional relationship between the illuminant detection center coordinates (A2, B2) and the actual holding coordinates (C2, D2) is from the illuminant design center coordinates (A1, B1) to the illuminant detection center coordinates (A2, B2). It does not depend on the amount of deviation (-a, -b). In this way, the CPU 61 derives the actual holding coordinates so that the positional relationship between the illuminant detection center coordinates and the actual holding coordinates is always the same regardless of the amount of deviation of the position of the illuminant 77 from the design value. There is. Then, the CPU 61 aligns the nozzle 40 so that the nozzle 40 and the light emitting body 77 have a predetermined positional relationship, and causes the nozzle 40 to hold the light emitting component 75. That is, the CPU 61 moves the mounting head 24 so that the center position of the nozzle 40 is located at the actual holding coordinates, and attracts and holds the light emitting component 75 at the actual holding coordinates (step S190). As described above, when the mounting head 24 holds the light emitting component 75, the CPU 61 holds the light emitting component 75 not with the holding coordinates specified in the mounting information 67 but with the actual holding coordinates derived based on the illuminant detection center coordinates. On the other hand, when the suction target is not the light emitting component 75 in step S150, the CPU 61 moves the mounting head 24 so that the center of the nozzle 40 is located at the holding coordinates specified in the mounting information 67 to move the suction target component. It is attracted and held at the holding coordinates (step S200).

When the suction target is sucked in step S190 or step S200, the CPU 61 determines whether or not the number of parts sucked by the mounting head 24 is less than the number of nozzles 40 (12) of the nozzle holder 42 (step S210). .. In step S210, when the number of sucked parts is less than the number of nozzles 40 of the nozzle holder 42, the CPU 61 performs the processes after step S140. That is, the CPU 61 sequentially sets the suction target, and if the suction target is the light emitting component 75, the component is sucked by the nozzle 40 at the actual holding coordinates, and if the suction target is a component other than the light emitting component 75, the component is nozzleed. It is adsorbed at the holding coordinates by 40. Then, in step S210, when the number of sucked parts is not less than the number of nozzles 40 of the nozzle holder 42, that is, when all the 12 nozzles 40 of the nozzle holder 42 suck and hold the parts, the CPU 61 determines. The holding state of the parts held by the nozzle 40 is acquired (step S220). In this process, the CPU 61 moves the mounting head 24 to the upper part of the parts camera 54 and acquires an image captured by the parts camera 54. The CPU 61 analyzes this image to determine whether or not there is an abnormality related to a component abnormality, a posture such as tilt of the component, or a deviation of the holding position. Further, the CPU 61 discards the defective part. In the present embodiment, the CPU 61 omits the determination of the presence or absence of abnormality in the light emitting component 75. Further, when all the parts held in the nozzle 40 of the nozzle holder 42 are the light emitting parts 75, the CPU 61 does not perform imaging by the parts camera 54 and omits the process itself in step S220. However, the CPU 61 may not omit these, or may omit a specific type of light emitting component among the light emitting components 75.

Next, the CPU 61 arranges (mounts) the components held by the mounting head 24 at the mounting coordinates on the board 70 (step S230). In this process, the CPU 61 moves the mounting head 24 so that the center position of the nozzle 40 holding the component is located at the mounting coordinates, and the Z-axis motor 45 lowers the component to arrange the component at the mounting coordinate. To do. That is, the CPU 61 moves the components and arranges them on the substrate 70 so that the portion holding the components is arranged at the mounting coordinates. The CPU 61 sequentially arranges a plurality of parts held by the mounting head 24 at mounting coordinates according to the mounting order of the mounting information 67.

Here, a case where the light emitting component 75 is arranged at the mounting coordinates will be described with reference to FIG. As described above, even if the position of the light emitting body 77 in the light emitting component 75 deviates from the design value, the positional relationship between the actual holding coordinates of the light emitting component 75 and the light emitting body detection center coordinates is the same. Therefore, as shown in FIG. 4, when the portion where the CPU 61 holds the light emitting component 75 (the portion corresponding to the actual holding coordinates (C2, D2) at the time of adsorption) is arranged at the mounting coordinates (G, H), the light emitting body 77 The center of is located at predetermined coordinates (E, F) = coordinates (G + r, H + s). As described above, in the present embodiment, the CPU 61 holds the light emitting component 75 at the actual holding coordinates and arranges the light emitting component 75 at the mounting coordinates, so that the center of the light emitting body 77 is determined regardless of the positional deviation from the design value of the light emitting body 77. It is designed to be placed in coordinates. The predetermined coordinates are desired positions on the substrate 70 on which the center of the light emitting body 77 is desired to be arranged. That is, the mounting coordinates included in the mounting information 67 are calculated back from the predetermined coordinates as coordinates such that the positional relationship between the predetermined coordinates and the mounting coordinates is the same as the positional relationship between the illuminant design center coordinates and the holding coordinates. It is predetermined. The position of the support substrate 76 among the light emitting components 75 changes according to the position deviation from the design value of the light emitting body 77 in the light emitting component 75. In the upper part of FIG. 4, the position of the support substrate 76 on the substrate 70 after mounting when the position of the light emitting body 77 is as designed is shown by a broken line. Further, the position of the support substrate 76 on the substrate 70 after mounting when the illuminant detection center coordinates of the illuminant 77 are the coordinates (A2, B2) is shown by a solid line. As described above, in step S230, the CPU 61 positions the nozzle 44 with respect to the substrate 70 based on the positional relationship between the actual holding coordinates and the illuminant detection center coordinates, and arranges the light emitting component 75 on the substrate 70. It is.

When all the components held by the mounting head 24 are arranged on the board 70 in step S230, the CPU 61 determines whether or not there are unarranged parts on the current board 70 based on the mounting information 67 (step S240). ), When there are unarranged parts, the processes after step S130 are executed. That is, the CPU 61 changes the nozzle 40 as necessary, holds the nozzle 40 at the actual holding coordinates if the suction target is the light emitting component 75, and holds the nozzle 40 at the holding coordinates if the suction target is other than the light emitting component 75. Place the parts at the mounting coordinates. On the other hand, when there are no unarranged components on the current board 70, the CPU 61 discharges the current board 70 for which mounting has been completed (step S250), and determines whether or not production has been completed based on the number of boards for which mounting has been completed. (Step S260). When the production is not completed, the CPU 61 repeatedly executes the processes after step S110. On the other hand, when the production is completed, the CPU 61 ends this routine.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The nozzle 40 of the present embodiment corresponds to the component holding means of the present invention, the X-axis slider 26 and the Y-axis slider 30 correspond to the moving means, the mark camera 34 corresponds to the imaging means, and the control device 60 corresponds to the light emitter position. Corresponds to the detection means and the holding mounting control means.

According to the mounting system 10 described above, when the CPU 61 mounts the light emitting component 75 having the light emitting body 77 on the substrate 70, the CPU 61 captures an image of a region including at least a part of the light emitting body 77 among the light emitting components 75 and emits light. Get the part image. Next, the CPU 61 detects the coordinates (light emitter detection center coordinates) of the specific portion (center) of the light emitting body 77 as the position of the issuing body 77 based on the light emitting component image. Then, when the nozzle 40 holds the light emitting component 75, the CPU 61 has a predetermined positional relationship between the issuer detection center coordinates and the actual holding coordinates based on the detected position of the light emitting body 77. The nozzle 40 is positioned on the light emitting component 75 so that the center position of the nozzle 40 is located at the actual holding coordinates so that the nozzle 40 and the light emitting body 77 have a predetermined positional relationship. Further, when the light emitting component 75 held by the nozzle 40 is mounted on the substrate 70, the center of the light emitting body 77 is at a desired position on the substrate 70 based on the positional relationship between the issuer detection center coordinates and the actual holding coordinates. The center of the nozzle 40 holding the light emitting component 75 is positioned at the mounting coordinates on the substrate 70 so as to be. In this way, the CPU 61 holds the light emitting component 75 by aligning the nozzle 40 and the light emitting body 77 so as to have a predetermined positional relationship based on the position of the light emitting body 77, and considers the positional relationship of the nozzle. 40 is positioned with respect to the substrate 70 and mounted. Therefore, even if the position of the light emitting body 77 in the light emitting component 75 deviates from the design value, the light emitting body 77 can be accurately positioned on the substrate 70. Further, since it is not necessary to take an image of the light emitting component 75 while the light emitting component 75 is held by the nozzle 40, the light emitting component 75 can be efficiently positioned and mounted on the substrate 70. After mounting the light emitting component 75 on the substrate 70, a lens component or the like may be placed on the light emitting body 77. At this time, if the positional relationship between the lens component and the light emitting body 77 is deviated, the desired brightness may not be obtained. Further, the position of the lens component on the substrate 70 may not be changed according to the position of the light emitting body 77, such as when a part of the lens component is inserted into the hole formed in the substrate 70 and fixed. Even in such a case, in the mounting device 11, the CPU 61 accurately positions the center of the light emitting body 77 at a predetermined coordinate regardless of the positional deviation of the light emitting body 77 in the light emitting component 75, so that the desired brightness can be easily obtained. Further, in the description using FIG. 4, the case where the position of the light emitting body 77 in the light emitting component 75 deviates from the design value is illustrated, but the position of the entire light emitting component 75 collected by the mounting head 24 is deviated. Even in this case, the light emitting body 77 can be accurately positioned on the substrate 70 by performing the above-described processing by the CPU 61. That is, in the above-described embodiment, since the CPU 61 implements the mounting based on the coordinates of the light emitting body detection center instead of the coordinates of the light emitting component 75, the position shift of the light emitting body 77 due to the misalignment of the entire light emitting component 75 and the light emission The light emitting body 77 can be accurately positioned on the substrate 70 without particularly distinguishing which of the misalignment of the light emitting body 77 in the component 75 has occurred. Similarly, when both the position shift of the entire light emitting component 75 and the position shift of the light emitting body 77 in the light emitting component 75 occur, the CPU 61 can accurately position the light emitting body 77 on the substrate 70. Examples of the case where the position of the entire light emitting component 75 is displaced include the case where the position of the light emitting component 75 in the tape is displaced, the case where the tape feed by the feeder portion 58 is displaced, and the like.

Further, the HDD 64 has the same positional relationship between the light emitter design center coordinates and the holding coordinates of the light emitting body 75 and the positional relationship between the light emitting body design center coordinates and the holding coordinates with respect to the predetermined coordinates on the substrate 70. The mounting information 67 including the mounting coordinates on a certain board 70 is stored. Then, the CPU 61 derives the actual holding coordinates having the same positional relationship with respect to the illuminant detection center coordinates based on the illuminant detection center coordinates and the stored positional relationship, and holds the light emitting component 75 with the actual holding coordinates. Place the held part in the mounting coordinates. In this way, the CPU 61 determines the actual holding coordinates with reference to the illuminant detection center coordinates. Therefore, even if the position of the light emitting body 77 in the light emitting component 75 deviates from the design value, the positional relationship between the center of the light emitting body 77 and the held portion in the light emitting component 75 is always constant. As a result, the CPU 61 can accurately position the center of the light emitting body 75 at a predetermined coordinate on the substrate 70 by simply positioning the portion of the light emitting component 75 held by the mounting head 24 at the mounting coordinates stored in advance. it can.

Further, the positional relationship stored in the HDD 64 is the positional relationship between the illuminant design center coordinates and the holding coordinates. Therefore, when the position of the light emitting body 77 in the light emitting component 75 is as designed, the center position of the light emitting component 75 becomes the actual holding coordinates. Further, when the position of the light emitting body 77 deviates from the design value, the position deviated from the center position of the light emitting component 75 by that amount becomes the actual holding coordinates. That is, the actual holding coordinates are the positions corresponding to the positional deviations of the light emitting body 77 with reference to the center position of the light emitting component 75. Therefore, as compared with the case where the actual holding coordinates are determined with the vicinity of the end of the light emitting component 75 as a reference (holding coordinates), a state occurs in which the actual holding coordinates deviate from the light emitting component 75 and the light emitting component 75 cannot be held. It becomes difficult.

Furthermore, since the mark camera 34 also serves as an imaging means for imaging the light emitting component 75, the number of components of the mounting device 11 can be reduced. Further, the mark camera 34 has a narrow field of view, and may not be able to capture the outer peripheral portion of the light emitting body 77 and the light emitting component 75 as one image. That is, it may not be possible to capture an image in which both the illuminant detection center coordinates and the information on the outer shape of the luminescent component 75 can be acquired. In such a case, it is particularly significant to apply the present invention which does not require information on the outer shape of the light emitting component 75 based on the light emitting component image. In addition, information on the outer shape may be used together.

It is needless to say that the present invention is not limited to the above-described embodiment, and can be implemented in various aspects as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the CPU 61 derives the actual holding coordinates based on the illuminant detection center coordinates, holds the light emitting component 75 in the actual holding coordinates, and arranges the held portion in the mounting coordinates. Not limited. The mounting device 11 may be mounted so that the center of the light emitting component 75 is arranged at a predetermined coordinate on the substrate 70 based on the light emitting body detection center coordinates detected from the light emitting body image. For example, the CPU 61 positions the nozzle 40 at a predetermined holding position when the nozzle 40 holds the light emitting component 75, and mounts the light emitting component 75 held by the nozzle 40 on the substrate 70. The nozzle 40 holding the light emitting component 75 is mounted on the substrate 70 based on the positional relationship between the nozzle 40 and the light emitting body 77 in the light emitting component 75 held by the nozzle 40, which is calculated from the position of 77 and the predetermined holding position. The light emitting component 75 may be mounted on the substrate 70 by positioning the light emitting component 75. That is, the CPU 61 controls the mounting head 24 so as to hold the light emitting component 75 at the holding coordinates without deriving the actual holding coordinates regardless of the illuminant detection center coordinates, and derives the mounting coordinates based on the illuminant detection center coordinates. To do. FIG. 5 is a flowchart showing an example of the implementation processing routine of the modified example. This routine is the same as the implementation processing routine of FIG. 2 except that steps S175a to S190a are performed instead of steps S180 to S190 described above. When performing the mounting processing routine of this modification, in the mounting information 67 stored in the HDD 64 in step S100, it is desired to arrange the above-mentioned predetermined coordinates (the center of the light emitting body 77) with respect to the light emitting component 75 instead of the mounting coordinates. It is assumed that the desired coordinates on the substrate 70) are associated with each other. In the mounting processing routine of this modification, the CPU 61 detects the illuminant detection center coordinates based on the light emitting component image in step S170, and then associates the illuminant detection center coordinates with the light emitting component 75 to be attracted by the mounting information 67. The positional relationship with the holding coordinates is derived (step S175a). The positional relationship derived by the CPU 61 will be described with reference to FIG. For example, when the position of the light emitting body 77 in the light emitting component 75 is as designed, the CPU 61 uses the light emitting body detection center coordinates (= light emitting body design center coordinates) (A1, B1) as a reference (origin). The relative coordinates (-r, -s) of the retained coordinates (C1, D1) are derived as the positional relationship between the illuminant detection center coordinates and the retained coordinates. On the other hand, when the position of the light emitting body 77 in the light emitting component 75 is the coordinates (A2, B2) deviated from the design value as shown in the lower part of FIG. 6, the CPU 61 determines the light emitting body detection center coordinates (A2, B2). ) As the origin, the relative coordinates (-c, -d) = relative coordinates (-r + a, -s + b) of the holding coordinates (C1, D1) are derived as the positional relationship between the illuminant detection center coordinates and the holding coordinates. In this way, the positional relationship according to the coordinates of the illuminant detection center is derived. Subsequently, the CPU 61 derives the mounting coordinates based on the derived positional relationship and the predetermined coordinates stored in the mounting information 67 (step S180a). The CPU 61 derives the mounting coordinates so that the position of the mounting coordinates based on the predetermined coordinates is the same as the position of the holding coordinates based on the illuminant detection center coordinates. For example, when the position of the light emitting body 77 in the light emitting component 75 in FIG. 6 is as designed, the CPU 61 is in the relative coordinate (−r, −s) position with reference to the predetermined coordinates (E, F). Coordinates (G, H) = coordinates (Er, F-s) in are derived as mounting coordinates. On the other hand, when the illuminant detection center coordinates are the coordinates (A2, B2) in FIG. 6, the CPU 61 is at the relative coordinates (−c, −d) with respect to the predetermined coordinates (E, F). Coordinates (I, J) = coordinates (Ec, Fd) are derived as mounting coordinates. Then, the CPU 61 moves the mounting head 24 to attract and hold the light emitting component 75 at the holding coordinates (step S190a), and performs the processes after step S210. Further, after step S220, the CPU 61 arranges (mounts) the components held by the mounting head 24 at the mounting coordinates on the board 70 (step S230). As described above, in the mounting device 11 of the modified example, the CPU 61 holds the light emission with the holding coordinates so that the light emitting body detection center coordinates can be arranged at the predetermined coordinates based on the positional relationship between the light emitting body detection center coordinates and the holding coordinates. The mounting coordinates are derived as the coordinates of the movement destination of the part 75. As a result, even if the position of the light emitting body 77 in the light emitting component 75 deviates from the design value, the center of the light emitting body 77 can be accurately positioned at the predetermined coordinates (E, F) on the substrate 70. In the mounting device 11 of this modification, the light emitting body design center coordinates included in the mounting information 67 are merely coordinates indicating an imaging position when the light emitting component 75 is imaged in step S160. Therefore, even when the illuminant detection center coordinates are detected from the light emitting component image, other coordinates may be included in the mounting information 67 instead of the illuminant design center coordinates. Further, in the mounting device 11 of the above-described modification, it is assumed that the mounting information 67 includes predetermined coordinates, but the present invention is not limited to this. For example, instead of the predetermined coordinates, the mounting coordinates and the positional relationship (the positional relationship between the light emitting body design center coordinates and the holding coordinates) when the position of the light emitting body 77 in the light emitting component 75 is as designed is the mounting information 67. It may be included in. In this case, the CPU 61 derives the deviation amount between the positional relationship derived in step S175a and the positional relationship included in the mounting information 67, and the mounting coordinates included in the mounting information 67 are shifted by the derived deviation amount. The corrected mounting coordinates as may be derived in step S180a. Then, the light emitting component 75 held by the CPU 61 on the mounting head 24 in step S230 may be arranged (mounted) at the corrected mounting coordinates on the substrate 70. Even in this way, the center of the light emitting body 77 can be accurately positioned at the predetermined coordinates (E, F) on the substrate 70.

In the above-described embodiment, the mounting information 67 includes the illuminant design center coordinates and the holding coordinates as the positional relationship between the illuminant design center coordinates and the holding coordinates of the illuminant 75, but the positions of both are included. The information is not limited to this as long as it represents the relationship. For example, the mounting information 67 may include relative coordinates representing the positions of the other coordinates when one coordinate of the light emitter design center coordinate and the holding coordinate is used as a reference, as information representing the positional relationship. Even in this way, the CPU 61 can derive the actual holding coordinates based on the illuminant detection center coordinates and the positional relationship included in the mounting information 67.

In the above-described embodiment, the CPU 61 detects the illuminant detection center coordinates, which are the coordinates of the center of the illuminant 77, based on the image of the luminescent component. However, the CPU 61 is not limited to this, and the CPU 61 is a specific portion of the illuminant 77. All you have to do is detect the coordinates. For example, the CPU 61 may detect the coordinates of any of the front, rear, left, and right ends and corners of the light emitter 77. Alternatively, the CPU 61 may detect coordinates such as a predetermined mark arranged on the light emitting body 77. Further, the light emitting component image is an image including the entire light emitting body 77, but the image is not limited to this. The imaging range 35 may be defined so that the region required for detecting the coordinates of the specific portion of the light emitting body 77 is included in the light emitting component image. Further, the CPU 61 may detect the coordinates of a plurality of specific parts of the light emitting body 77, such as detecting the coordinates of the center and the coordinates of the corners of the light emitting body 77.

In the above-described embodiment, in step S180, the CPU 61 derives the coordinates deviated from the holding coordinates by the amount of deviation from the illuminant design center coordinates to the illuminant detection center coordinates in the XY directions as the actual holding coordinates. That is, the CPU 61 derives the actual holding coordinates in consideration of the deviation of the light emitting body 77 in the XY direction. At this time, the CPU 61 may derive the actual holding coordinates in consideration of the inclination (deviation in the rotation direction) of the light emitting body 77 on the XY plane. For example, the mounting device 11 has a positional relationship between the coordinates of a plurality of specific parts of the light emitting body 77 and the holding coordinates, and a positional relationship between the coordinates of the plurality of specific parts and the holding coordinates with respect to the plurality of predetermined coordinates on the substrate 70. The mounting information 67 including the mounting coordinates on the board 70 having the same positional relationship as the above may be stored in the HDD 64. Then, the CPU 61 has the same positional relationship as the stored positional relationship with respect to the detected coordinates of the plurality of specific parts based on the coordinates of the plurality of specific parts detected from the light emitting component image and the stored positional relationship. The mounting head 24, the X-axis slider 26, and the Y-axis slider 30 may be controlled so as to derive the actual holding coordinates in the above and arrange the portion of the light emitting component 75 held and held in the actual holding coordinates in the mounting coordinates. .. Specifically, for example, in steps S100, S170, and S180 of the above-described embodiment, the CPU 61 may perform the following processing. In step S100, the CPU 61 determines the coordinates of a plurality of specific parts of the light emitting body 77 (for example, the coordinates of the center of the light emitting body 77 and the left front corner of the light emitting body 77 when the position of the light emitting body 77 is as designed. The production job data including the mounting information 67 including the coordinates of the part), the holding coordinates, and the mounting coordinates is acquired and stored in the HDD 64. Further, in step S170, the CPU 61 detects the coordinates of a plurality of specific parts (for example, the center and the front left corner) of the light emitting body 77 based on the image of the light emitting component. Further, the CPU 61 compares the position of the light emitting body 77 with the design value based on the detected coordinates of the plurality of specific parts and the coordinates of the plurality of specific parts stored in the HDD 64. The amount of deviation (rotation angle) in the rotation direction of is derived. For example, the CPU 61 derives the angle formed by the line segment connecting the coordinates of the plurality of specific parts stored in the HDD 64 and the line segment connecting the coordinates of the detected plurality of specific parts as the amount of deviation in the rotation direction. .. Next, in step S180, the CPU 61 derives the actual holding coordinates having the same positional relationship as the positional relationship stored in the HDD 64 with respect to the detected coordinates of the plurality of specific parts. That is, the actual holding coordinates are set so that the positional relationship between the coordinates of the plurality of specific parts and the holding coordinates stored in the HDD 64 is the same as the positional relationship between the detected coordinates of the plurality of specific parts and the actual holding coordinates. Is derived. Then, the CPU 61 attracts and holds the light emitting component 75 at the actual holding coordinates in step S190, and arranges (mounts) the light emitting component 75 at the mounting coordinates on the substrate 70 in step S230. At this time, the CPU 61 rotates the light emitting component 75 by the amount of the deviation in the rotation direction so as to correct the amount of deviation in the rotation direction derived in step S170, and then arranges (mounts) the light emitting component 75 at the mounting coordinates on the substrate 70. .. By doing so, even if the light emitting body 77 is shifted not only in the XY direction but also in the rotation direction, the CPU 91 attaches the light emitting body 77 to the substrate including the inclination (positioning angle) of the light emitting body 77. It can be accurately positioned on the 70. In the mounting processing routine of the modified example shown in FIG. 5, by using the coordinates of a plurality of specific parts of the light emitting body 77, the light emitting body 75 is similarly mounted on the substrate in consideration of the deviation in the rotation direction of the light emitting body 77. It can be accurately positioned on the 70. Specifically, the CPU 61 detects the coordinates of a plurality of specific parts of the light emitting body 77 (for example, the coordinates of the center and the front left corner) based on the light emitting component image in step S170, and then the detected coordinates and mounting information. In step S175a, the positional relationship with the holding coordinates associated with the light emitting component 75 to be attracted in 67 is derived. Then, in step S180a, the CPU 61 has a plurality of predetermined coordinates stored in advance as the derived positional relationship and the mounting information 67 (for example, desired coordinates on the substrate 70 on which the center of the light emitter 77 and the front left corner are to be arranged. ) And derive the mounting coordinates. That is, the CPU 61 derives the mounting coordinates so that the positions of the mounting coordinates based on the plurality of predetermined coordinates are the same as the positions of the holding coordinates based on the detected coordinates of the plurality of specific parts. Further, the CPU 61 uses the angle formed by the line segment connecting the plurality of predetermined coordinates stored in the HDD 64 and the line segment connecting the coordinates of the detected plurality of specific parts as the amount of deviation in the rotation direction of the light emitting body 77. Derived. Then, the CPU 61 attracts and holds the light emitting component 75 at the holding coordinates in step S190a, and arranges (mounts) the light emitting component 75 at the mounting coordinates on the substrate 70 in step S230. At this time, the CPU 61 rotates the light emitting component 75 by the amount of the deviation in the rotation direction so as to correct the amount of deviation in the rotation direction derived in step S180a, and then arranges (mounts) the light emitting component 75 at the mounting coordinates on the substrate 70. ..

In the above-described embodiment, the imaging range 35 is not wide enough to capture the entire light emitting body 77 and the outer peripheral portion of the light emitting component 75 as one image, but is not limited to this. Further, in the mounting device 11, the mark camera 34 also serves as an image pickup means for imaging the light emitting component 75, but the present invention is not limited to this, and an image pickup means different from the mark camera 34 may capture the image of the light emitting component.

In the above-described embodiment, the holding coordinates included in the mounting information 67 are the coordinates of the center of the light emitting component 75, but the coordinates are not limited to this and may be the coordinates of any part of the light emitting component 75. However, it is preferable to set the coordinates of the center of the light emitting component 75 as the holding coordinates because the actual holding coordinates are less likely to deviate from the light emitting component 75 and the light emitting component 75 cannot be held.

In the above-described embodiment, the mounting coordinates are the coordinates with the reference mark of the substrate 70 as the origin, and the holding coordinates and the illuminant design center coordinates are stored in the HDD 64 in advance corresponding to each of the plurality of feeder units 58. The coordinates are set with the reference position as the origin, but the coordinates are not limited to this, and other origins may be used.

The order of each step in the implementation processing routine in the above-described embodiment is an example, and may be changed as appropriate.

In the above-described embodiment, the position of the light emitting body 77 of the light emitting component 75 is detected while being stored in the tape of the reel 57 set in the feeder unit 58, but the light emitting component 70 is mounted on a dedicated mounting table. The position of the light emitting body 77 of the light emitting component 75 may be detected in this state. An example of this modification will be described.

As shown in FIG. 7, the mounting table 90 is provided between the transport unit 18 and the feeder unit 58. The mounting table 90 is a table for temporarily mounting the light emitting component 75 when detecting the position of the light emitting body 77 of the light emitting component 75. Further, the upper surface of the mounting table 90 is a mounting surface 91 finished flat with high accuracy. As shown in FIG. 8, the mounting surface 91 has mounting table marks 92 at the four corners. The mounting table mark 92 is used to recognize the position of the mounting surface 91. Further, the mounting surface 91 is provided with four mounting areas 94 for mounting the light emitting component 75, and a hole 93 is provided in the center of each mounting area 94. The hole 93 is connected in parallel to the vacuum pump and the air compressor via a switching valve which is a solenoid valve, and by adjusting the switching valve, a negative pressure or a positive pressure can be supplied to the hole 93. be able to. These holes 93, the switching valve, and the vacuum pump constitute a mounting holding means for holding the light emitting component 75 on the mounting table 90. A pressure sensor for detecting the pressure in the hole 93 is provided between the hole 93 and the switching valve.

In this modification, in the above-described embodiment, the step of capturing the light emitting body 77 of the light emitting component 75 with the mark camera 34 and acquiring the light emitting component image is performed on the mounting table 90, but the other parts are different. The implementation processing routine is almost the same. First, the CPU 61 moves the mounting head 24 and holds the light emitting component 75 on the hooder portion 58 by the nozzle 40. When the light emitting component 75 is held, the CPU 61 moves the mounting head 24 above the mounting surface 91. Subsequently, the CPU 61 executes the mounting operation of the light emitting component 75. That is, the CPU 61 lowers the nozzle 40 so that the light emitting component 75 is placed in the mounting area 94, and supplies positive pressure to the nozzle 40. At the same time, the CPU 61 controls the switching valve so that a negative pressure is supplied to the hole 93 of the mounting area 94. As a result, the light emitting component 75 is held on the mounting table while the image is taken by the mark camera 34. After that, the CPU 61 controls the Z-axis motor 45 so that the nozzle 40 rises to the upper position. Subsequently, as shown in FIG. 8, the CPU 61 causes the mark camera 34 to image the upper surface of the light emitting component 75 mounted in the mounting area 94. After that, the processes of steps S170 to S190 or steps S170 to S190a in the above-described embodiment are performed, but after detecting the position of the light emitting body 77, the CPU 61 attaches the light emitting component 75 mounted in the mounting area 94 to the nozzle 40. Re-adsorb. That is, the CPU 61 controls the X-axis slider 26 and the Y-axis slider 30 so that the nozzle 40 is directly above the light emitting component 75 mounted in the mounting area 94, and then the tip of the nozzle 40 is placed on the light emitting component 75. The Z-axis motor 45 is controlled so as to come into contact with each other. At the same time, the CPU 61 supplies a negative pressure to the nozzle 40 to attract the light emitting component 75 to the nozzle 40. At that time, the CPU 61 controls the switching valve so that a positive pressure is supplied to the hole 93 of the mounting area 94. As a result, the light emitting component 75 can be easily separated from the mounting area 94. Further, the CPU 61 supplies a negative pressure to the hole 93 and puts the light emitting component 75 on the mounting table 90 at least from the time when the light emitting component 75 is imaged by the mark camera 34 until the light emitting component 75 is held by the nozzle 40. Since it is held, the position shift of the light emitting component between them is prevented, and the light emitting body can be positioned more accurately on the substrate.

The present invention can be used in the technical field of mounting a light emitting component on a substrate.

10 Mounting system, 11 Mounting device, 18 Conveying part, 21 Sampling part, 20 Support plate, 22 Conveyor belt, 23 Support pin, 24 Mounting head, 26 X-axis slider, 28 Guide rail, 30 Y-axis slider, 32 Guide rail, 34 mark camera, 35 imaging range, 40 nozzles, 42 nozzle holder, 45 Z-axis motor, 54 parts camera, 56 reel unit, 57 reels, 58 feeder section, 60 control device, 61 CPU, 62 ROM, 63 RAM, 64 HDD, 65 I / O interface, 66 bus, 67 mounting information, 70 board, 75 light emitting component, 76 support board, 77 light emitter, 80 management computer, 87 input device, 88 display, 90 mounting table, 91 mounting surface, 92 Mounting stand mark, 93 holes, 94 mounting area.

Claims (6)

It is a mounting method of a light emitting component that mounts a light emitting component having a light emitting body on a substrate.
An imaging step of acquiring an image of a light emitting component by imaging a region including at least a part of the light emitting body in the light emitting component by an imaging means.
A light emitting body position detection step of detecting the position of the light emitting body based on the light emitting component image, and
Based on the position of the light emitting body detected in the light emitting body position detection step, the component holding means is attached to the light emitting component so that the component holding means and the light emitting body have a predetermined positional relationship specified in the mounting information. A component holding step of aligning and holding the light emitting component by the component holding means,
A mounting step of mounting the basis of the mounting information the information of a predetermined positional relationship specified by the light emitting component and the substrate the component holding means holding the light-emitting component is positioned with respect to the substrate,
How to mount light emitting parts including. The light emitting component having a light-emitting element a real Sokata method of the light emitting parts mounted on the substrate,
An imaging step of acquiring an image of a light emitting component by imaging a region including at least a part of the light emitting body in the light emitting component by an imaging means.
A light emitting body position detection step of detecting the position of the light emitting body based on the light emitting component image, and
A component holding step of positioning the component holding means at a predetermined holding position specified in the mounting information and holding the light emitting component by the component holding means.
The holding means and the holding means in the light emitting component held by the holding means based on the information of the position of the light emitting body detected in the light emitting body position detecting step and the predetermined holding position specified in the mounting information. The process of calculating the positional relationship with the illuminant and
Based on the positional relationship, a mounting step of positioning the component holding means for holding the light emitting component at a mounting position on the substrate and mounting the light emitting component on the substrate.
How to mount light emitting parts including. Further, at least from the time when the light emitting component is imaged in the imaging step until the light emitting component is held by the holding means in the component holding step, a mounting holding step of holding the light emitting component on the mounting table is performed. The method for mounting a light emitting component according to claim 1 or 2, which includes. A mounting device for mounting a light emitting component having a light emitting body on a substrate, a component holding means capable of holding the light emitting component, and a component holding means.
A moving means for moving the component holding means and
An imaging means for acquiring an image of a light emitting component by imaging a region including at least a part of the light emitting body in the light emitting component.
A light emitting body position detecting means for detecting the position of the light emitting body based on the light emitting component image, and
A holding mounting control means that controls the operation of the component holding means and the moving means to control the holding and mounting of the light emitting component on a substrate.
With
In the holding / mounting control means, when the component holding means holds the light emitting component, the component holding means and the light emitting body provide mounting information based on the position of the light emitting body detected by the light emitting body position detecting means. When the component holding means is positioned on the light emitting component so as to have the predetermined positional relationship specified in the above, and the light emitting component held by the component holding means is mounted on the substrate, it is specified in the mounting information. A mounting device that positions the component holding means with respect to the substrate based on the information on the predetermined positional relationship. A mounting device for mounting a light emitting component having a light emitting body on a substrate.
A component holding means capable of holding the light emitting component and
A moving means for moving the component holding means and
An imaging means for acquiring an image of a light emitting component by imaging a region including at least a part of the light emitting body in the light emitting component.
A light emitting body position detecting means for detecting the position of the light emitting body based on the light emitting component image, and
A holding mounting control means that controls the operation of the component holding means and the moving means to control the holding and mounting of the light emitting component on a substrate.
With
When the component holding means holds the light emitting component, the holding / mounting control means positions the component holding means at a predetermined holding position specified in the mounting information, and the light emitting light held by the component holding means. When the component is mounted on the substrate, the holding means in the light emitting component held by the holding means, which is calculated from the position of the light emitting body and the information of the predetermined holding position specified in the mounting information. A mounting device for mounting the light emitting component on the substrate by positioning the component holding means for holding the light emitting component at a mounting position on the substrate based on the positional relationship between the light emitting body and the light emitting body. Further, a mounting table on which the light emitting component is placed when the light emitting component is imaged by the imaging means, and
A mounting holding means provided on the above-mentioned pedestal for holding the luminescent component on the above-mentioned pedestal at least from the time when the light emitting component is imaged by the imaging means until the light emitting component is held by the holding means. When,
4. The mounting device according to claim 4 or 5.

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