CN105592683B - Electronic component conveying suction nozzle and electronic component mounting device with same - Google Patents

Abstract

Provided are an electronic component transport suction nozzle capable of holding and transporting an electronic component having a shape that is difficult to hold by suction or hold by clamping, and an electronic component mounting apparatus having the same. The transport nozzle has: a base connected to a mounting head of an electronic component mounting device; a guide shaft connected to a side surface of the base; a slide part connected to the guide shaft and movable relative to the base; The arm part is fixed to the sliding part, and at the part farthest from the sliding part, a front end part in contact with the connector type electronic component is provided; the telescopic adjustment mechanism is arranged between the base part and the sliding part, so that The sliding part moves relative to the base part, changes the distance from the base part to the front end part, inserts the front end part into the groove formed on the surface facing the center side of the connector type electronic component, and inserts the arm part toward the electronic part The surface facing the center side of the connector is forced to hold the connector type electronic component.

Description

Electronic component conveying suction nozzle and electronic component mounting device having the same

technical field

The present invention relates to an electronic component transport suction nozzle for transporting electronic components, and an electronic component mounting apparatus having the electronic component transport suction nozzle and mounting electronic components on a substrate.

Background technique

The electronic component mounting apparatus repeatedly holds the electronic component by the suction nozzle provided on the mounting head and mounts the electronic component on the mounting point of the substrate, thereby mounting the electronic component on the substrate. In recent years, there have been proposed electronic component mounting apparatuses capable of mounting, in addition to mounted electronic components mounted on a substrate, plug-in electronic components having leads that are inserted into holes in the substrate. inserted and mounted on a substrate (refer to Patent Document 1).

In addition, Patent Document 1 describes a suction nozzle of such a mechanism that sucks and holds an electronic component, and a grip type nozzle of such a mechanism that grips and holds an electronic component. In addition, as the mechanism of the suction nozzle, Patent Document 2 and Patent Document 3 also describe a grip type suction nozzle of such a mechanism that clamps and holds electronic components.

Patent Document 1: Japanese Patent Laid-Open No. 2013-179190

Patent Document 2: Japanese Unexamined Patent Publication No. 2006-108199

Patent Document 3: Japanese Unexamined Patent Publication No. 2006-140274

The plug-in electronic component has leads, and is mounted by inserting the leads into holes in a substrate. As described above, among electronic components having leads, there are electronic components having a shape that is relatively difficult to maintain by suction or gripping. For example, there are DIMM connectors into which memory modules, specifically, DIMMs (Dual Inline Memory Modules) are inserted, and connectors for flat cables into which flat cables are inserted. These above-mentioned connector-type electronic parts having an insertion part are formed with an insertion part for inserting various parts, and since it is a structure in which a member of a plate-shaped part is inserted, it is a shape extending in one direction, so there is a possibility of It is an electronic component that maintains a shape that is difficult to maintain. Therefore, in reality, a worker inserts it manually.

Contents of the invention

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component transport suction nozzle and an electronic component transport suction nozzle capable of holding and transporting an electronic component having a shape that is difficult to hold by suction or by clamping. An electronic component mounting device having the same.

The electronic component conveying suction nozzle of the present invention is mounted on an electronic component mounting device to hold a connector-type electronic component having a lead wire and an insertion portion for inserting a plate-shaped component, and the electronic component conveying suction nozzle The nozzle is characterized in that it has: a base part connected to the mounting head of the electronic component mounting device; a guide shaft connected to the side surface of the base part; a sliding part connected to the guide shaft opposite to The base part is movable; the arm part is fixed to the sliding part, and a front end part in contact with the connector type electronic component is provided at a part farthest from the sliding part; and a telescopic an adjustment mechanism arranged between the base portion and the slide portion, and moves the slide portion relative to the base portion to change a distance from the base portion to the front end portion inserting the front end into a groove formed on the surface of the connector-type electronic component facing toward the center, and applying force to the surface of the connector-type electronic component facing toward the center by the arm portion , thereby holding the connector-type electronic component.

Here, it is preferable that the telescopic adjustment mechanism has a spring part and an air pressure adjustment part, wherein the spring part biases the base part and the sliding part in a direction in which the sliding part is separated, and the air pressure adjustment part adjusts the air pressure. , thereby applying force in a direction in which the base portion and the sliding portion approach, the air pressure supplied from the air pressure adjustment portion is adjusted, and the contracted state and the extended state of the arm portion are switched.

In addition, it is preferable that the air pressure adjustment unit applies a force in a direction in which the base unit and the sliding unit approach each other by supplying air.

In addition, it is preferable that the air pressure adjusting part applies force in a direction in which the base part and the sliding part approach by sucking air.

In addition, it is preferable that the telescopic adjustment mechanism has a spring part and an air pressure adjustment part, wherein the spring part biases the base part and the sliding part in a direction close to each other, and the air pressure adjustment part adjusts the air pressure, Thereby, a force is applied in a direction in which the base part and the sliding part are separated, the air pressure supplied from the air pressure adjustment part is adjusted, and the contracted state and extended state of the arm part are switched.

In addition, it is preferable that the front end portion of the arm portion is provided on the lower side in the vertical direction than the end portion on the lower side in the vertical direction of the base portion.

Moreover, it is preferable that the said arm part is attachable and detachable with respect to the said slide part.

In addition, it is preferable that the sliding portion and the arm portion are respectively disposed on two opposing surfaces of the base portion.

The present invention is characterized in that it has the electronic component transport suction nozzle described in any one of the above; a substrate transport unit that transports the substrate; an electronic component supply device that supplies connector-type electronic components having lead wires and an insertion portion for inserting a plate-shaped component; a mounting head having a nozzle drive unit for driving the electronic component conveying nozzle, and holding the connector-type electronic component by the electronic component conveying nozzle, conveying from the electronic component supply device to the substrate to mount the connector-type electronic component on the substrate; a mounting head moving mechanism that moves the mounting head; and a control device that includes a control device for A mounting head control unit that controls the operation of the mounting head.

The effect of the invention

The present invention has an effect that a connector-type electronic component can be inserted into a board by an electronic component mounting device.

Description of drawings

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting device.

FIG. 2 is a schematic diagram showing a schematic configuration of an example of a component supply unit.

Fig. 3 is a schematic diagram showing a schematic configuration of another example of a component supply unit.

Fig. 4 is a perspective view showing an example of a connector-type electronic component.

FIG. 5 is a front view of the connector-type electronic component shown in FIG. 4 .

FIG. 6 is an enlarged perspective view showing a lock portion of the connector-type electronic component shown in FIG. 4 .

7 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus.

8 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus.

Fig. 9 is a perspective view showing a schematic structure of a suction nozzle for a connector.

Fig. 10 is a plan view showing a schematic configuration of a suction nozzle for a connector.

Fig. 11 is an enlarged cross-sectional view showing a schematic configuration of a suction nozzle for a connector.

FIG. 12 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 13 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 14 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 15 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 16 is an explanatory diagram for explaining the operation of the electronic component mounting device.

Explanation of labels

8 Substrate, 10 Electronic component mounting device, 11 Frame body, 12 Substrate transport unit, 14, 14f, 14r Component supply unit, 15 Mounting head, 16XY moving mechanism, 17VCS unit, 18 Replacement nozzle holding mechanism, 19 Component storage unit, 20 Control device, 22, 22f, 22r X-axis drive unit, 24Y-axis drive unit, 30 Mounting head body, 31 Mounting head support body, 32 Suction nozzle, 33 Suction nozzle support unit, 34 Suction nozzle drive unit, 34a Z-axis motor , 38 laser recognition device, 40 operation unit, 42 display unit, 60 control unit, 61 storage unit, 62 mounted head control unit, 64 parts supply control unit, 66 image processing unit, 80 electronic components, 80a connector type electronic components, 90, 90a electronic component supply device, 96 support table, 98 tray, 110 base part, 112 lock part, 122 insertion part, 124 lead wire, 130 fixed part, 132 movable part, 134 slot, 150 suction nozzle for connector, 152 base part, 154 slide part, 156 guide shaft, 160 arm part (claw), 162 telescopic adjustment mechanism, 164 connection part, 166D cutting part, 170 spring part, 172 air pressure adjustment part, 180 air pressure supply part , 182 air flow path, 184 cylinder part, 186 piston part, 190 fastening part, 202 front end

Detailed ways

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within a so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.

Hereinafter, embodiments of the electronic component mounting apparatus according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment. The electronic component mounting device of the present invention is an electronic component mounting device for mounting a so-called plug-in type electronic component and a mount-on electronic component, the plug-in type electronic component having a lead wire (insertion portion), by inserting the lead wire into a substrate hole ( Insertion hole, hole) to mount on the substrate, and the mounted electronic component is mounted on the substrate without being inserted into the insertion hole (substrate hole). Here, the plug-in electronic component is mounted by inserting leads into holes formed in the substrate. In addition, electronic components mounted on a substrate without being inserted into insertion holes (substrate holes), such as SOPs and QFPs, are referred to as mounted electronic components. In addition, the electronic component mounting apparatus may have a function of mounting only plug-in type electronic components (lead type electronic components).

Next, the electronic component mounting apparatus 10 of the present embodiment will be described. The electronic component mounting apparatus 10 is a device capable of mounting both mount-type electronic components mounted by mounting on a substrate and plug-in electronic components (lead-type electronic components) mounted by inserting leads into insertion holes of the substrate. Both the mount-type electronic component and the plug-in electronic component may be mounted by one electronic component mounting apparatus 10 , or only one of the electronic components may be mounted by one electronic component mounting apparatus 10 . That is, the electronic component mounting apparatus 10 is capable of mounting both mount-type electronic components and plug-in type electronic components, and can be used for various purposes according to substrates to be manufactured and other designs of the electronic component mounting apparatus.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting device. An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8 . The electronic component mounting apparatus 10 has a housing 11, a substrate conveyance unit 12, component supply units 14f, 14r, mounting heads 15f, 15r, an XY moving mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, a component storage unit 19, The control device 20 , the operation unit 40 and the display unit 42 . In addition, the XY moving mechanism 16 has X-axis driving units 22 f and 22 r and a Y-axis driving unit 24 . Here, as shown in FIG. 1 , the electronic component mounting apparatus 10 according to the present embodiment includes component supply units 14f and 14r, mounting heads 15f and 15r, and an X-axis drive unit on the front and rear sides centering on the substrate conveyance unit 12. 22f, 22r. In the electronic component mounting apparatus 10, the component supply unit 14f, the mounting head 15f, and the X-axis drive unit 22f are disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14r, the mounting head 15r, and the X-axis drive portion 22r are disposed on the electronic component mounting apparatus 10. The rear side of the component mounting device 10 . In addition, below, when the two component supply units 14f, 14r, the mounting heads 15f, 15r, and the two X-axis drive units 22f, 22r are not particularly distinguished, they are collectively referred to as the component supply unit 14, the mounting head 15, and the X-axis drive unit. Section 22.

The structure of the substrate 8 is not particularly limited as long as it is a member for mounting electronic components. The substrate 8 of this embodiment is a plate-shaped member, and a wiring pattern is provided on the surface. On the surface of the wiring pattern provided on the substrate 8 , solder is attached as a joining member for joining the wiring pattern of the plate-like member and the electronic component by reflow. In addition, on the substrate 8, through holes (insertion holes, substrate holes) for inserting electronic components are also formed.

The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate conveyance unit 12 includes: a guide rail extending in the X-axis direction; and a conveyance mechanism that supports the substrate 8 and moves the substrate 8 along the guide rail. The substrate transport unit 12 transports the substrate 8 along the X-axis direction by moving the substrate 8 along guide rails with a transport mechanism such that the mounting target surface of the substrate 8 faces the mounting head 15 . The board|substrate conveyance part 12 conveys the board|substrate 8 supplied from the equipment which supplies to the electronic component mounting apparatus 10, to the predetermined position on a guide rail. The mounting head 15 mounts the electronic component on the surface of the substrate 8 at the predetermined position described above. The substrate conveyance part 12 conveys the board|substrate 8 to the apparatus which performs a next process after mounting electronic components on the board|substrate 8 conveyed to the said predetermined position. In addition, various configurations can be used as the transport mechanism of the substrate transport unit 12 . For example, a guide rail arranged along the conveyance direction of the substrate 8 is combined with an endless belt rotating along the guide rail, and the substrate 8 is conveyed in a state where the substrate 8 is mounted on the endless belt. This is a conveyor-type conveyor mechanism that integrates the conveyor mechanism.

In the electronic component mounting apparatus 10, a component supply unit 14f is arranged on the front side, and a component supply unit 14r is arranged on the rear side. The component supply unit 14 f on the front side and the component supply unit 14 r on the rear side each hold a plurality of electronic components mounted on the substrate 8 and can supply them to the mounting head 15 . That is, there is provided an electronic component supply device that supplies to the holding position in a state that can be held (adsorbed or gripped) by the mounting head 15 .

FIG. 2 is a schematic diagram showing a schematic configuration of an example of a component supply unit. The component supply unit 14f on the front side is constituted by a plurality of electronic component supply devices (hereinafter simply referred to as "component supply devices") 90 and 90a held in a support table (receptacle) 96 as shown in FIG. 2 . These electronic component supply devices 90 and 90a have different mechanisms for holding and supplying electronic components depending on the type of electronic components to be mounted. In addition, the component supply unit 14 may have a plurality of electronic component supply apparatuses 90 and 90a of the same type. In addition, it is preferable that the component supply unit 14 has a detachable structure with respect to the apparatus main body. In addition, other devices (for example, a measuring device, a camera, etc.) other than the component supply devices 90 and 90a can be mounted on the support stand 96 .

The component supply device 90 supplies radial lead type electronic components to the mounting head 15 using an electronic component holding tape formed by affixing leads of a plurality of radial lead type electronic components to the holding tape. The component supply device 90 is a holding tape feeder that holds the electronic component holding tape, conveys the held electronic component holding tape, and moves the held radial lead type electronic component to the suction nozzle where the mounting head 15 can be used. A holding area (suction position, grip position, holding position) for holding electronic components. In addition, the component supply device 90 cuts and separates the lead wires of the radial lead type electronic components moved to the holding area, so that the radial lead type electronic components whose leads are fixed by the holding tape can be held at a predetermined position. , the radial lead type electronic component can be held (adsorbed, gripped) by the suction nozzle of the mounting head 15 .

In addition, the plurality of component supply devices 90 may supply different types of electronic components, respectively, or may supply multiple types of electronic components. In addition, the component supply device 90 is not limited to a holding tape feeder that sticks and supplies a plurality of radial lead type electronic components on a holding tape, and a bowl feeder, an axial feeder, a rod feeder, a tray feeder, etc. may also be used. type feeder, etc., to supply various lead type electronic components.

The electronic component supply device 90 a supplies electronic components to the mounting head 15 using an electronic component holding tape configured by pasting chip-type electronic components to be mounted on a substrate on a holding tape. In addition, the electronic component holding tape forms a plurality of storage chambers on the holding tape, and electronic components are stored in the storage chambers. The electronic component supply device 90 a is a holding tape feeder that holds the electronic component holding tape, conveys the held electronic component holding tape, and moves the storage chamber to the point where the electronic component can be sucked by the suction nozzle of the mounting head 15 . the holding area. Furthermore, by moving the storage chamber to the holding area, the electronic component housed in the storage chamber can be exposed at a predetermined position, and the electronic component can be sucked and gripped by the suction nozzle of the mounting head 15 . The electronic component supply device 90a is not limited to a holding tape feeder, and various chip component feeders that supply chip-type electronic components can be employed. As the chip component feeder, for example, a stick feeder and a bulk feeder can be used.

Next, the rear component supply unit 14r and connector-type electronic components, which are an example of electronic components supplied from the rear component supply unit 14r, will be described with reference to FIGS. 3 to 6 . Fig. 3 is a schematic diagram showing a schematic configuration of another example of a component supply unit. Fig. 4 is a perspective view showing an example of a connector-type electronic component. FIG. 5 is a front view of the connector-type electronic component shown in FIG. 4 . FIG. 6 is an enlarged perspective view showing a lock portion of the connector-type electronic component shown in FIG. 4 .

The component supply unit 14 r on the rear side is a tray feeder that holds a plurality of trays and selects a tray arranged at a position for supplying electronic components according to electronic components to be mounted. The component supply unit 14r on the rear side has a plurality of trays 98 shown in FIG. 3 . The tray 98 mounts a plurality of connector-type electronic components 80a. In FIG. 3 , the connector-type electronic component 80 a is placed, but the electronic components placed on the rear side component supply unit 14 r may be different for each tray. The component supply unit 14r on the rear side can supply different types of electronic components by switching the trays arranged at the positions for supplying electronic components by changing the electronic components to be placed on each tray.

Next, the connector-type electronic component 80a will be described. The connector type electronic component 80a shown in FIGS. 4 to 6 is a DIMM connector into which a DIMM (Dual Inline Memory Module) is inserted. The connector-type electronic component 80a has a base portion 110 whose one direction is the longitudinal direction, and lock portions 112 provided at both ends of the base portion 110 in the longitudinal direction. An insertion portion 122 is formed in the base portion 110 to which a lead wire 124 is connected. The insertion portion 122 is for insertion of an electronic component (memory module) inserted into the connector-type electronic component 80a. The insertion portion 122 is a groove extending in the longitudinal direction of the base portion 110 , and a circuit in contact with the electronic component is formed inside the groove. The lead wire 124 is arranged on the surface opposite to the surface on which the insertion portion 122 is formed. In FIGS. 4 to 6 , it is shown that the lead wires 124 are located only on a part of the bottom surface of the base portion 110 , but the lead wires 124 are arranged on the entire surface. The locking part 112 has a fixed part 130 and a movable part 132 . The fixing part 130 is fixed relative to the base part 110 . The movable part 132 is movable with respect to the fixed part 130, and the groove|channel 134 is formed in the surface of the center side of the base part 110 (the center side of the connector type electronic component 80a). When an electronic component to be inserted is inserted, the movable part 132 moves together with the inserted electronic component. Specifically, the movable portion 132 moves in a direction to fasten the inserted electronic component. In addition, the groove 134 is a mechanism for guiding an inserted electronic component, and forms a part of the insertion portion 122 . That is, the connector-type electronic component 80a supports the inserted electronic component by inserting a part of the side surface and the bottom surface of the inserted electronic component into the groove.

Connector-type electronic component 80 a is mounted on substrate 8 by inserting lead wire 124 into a hole formed in substrate 8 . That is, it is inserted into the substrate 8 with the insertion portion 122 facing upward in the vertical direction. In addition, when the connector-type electronic component 80 a is inserted along the insertion portion 122 , the movable portion 132 is moved, and the movable portion 132 moved to a predetermined fixed position is supported so as not to move relative to the fixed portion 130 . The mechanism for inserting the connector-type electronic component 80a will be described later.

The connector-type electronic component 80a is not limited to a DIMM connector. The connector-type electronic component 80a should just have the lead wire inserted into the board|substrate 8, and the insertion part into which other components are inserted. Furthermore, the insertion portion 122 includes a groove 134 formed at a surface on the center side of the lock portion 112 . A connector for a flat cable into which a flat cable is inserted is also exemplified as the connector-type electronic component 80a.

In addition, in this embodiment, although the component supply means 14r on the rear side is provided as the apparatus which supplies electronic components using a tray, it is not limited to this. In the electronic component mounting apparatus 10, a device for supplying electronic components using the tray 98 may be provided in the component supply unit 14f on the front side. In addition, although the case where the component supply part 14 of this embodiment supplies the connector type electronic component 80a using a tray was demonstrated, you may supply using the method other than a tray. In addition, in the component supply unit 14 , a mechanism for supplying electronic components by a tray and a mechanism for supplying electronic components by a holding tape feeder as shown in FIG. 2 may be arranged in parallel. For example, both a mechanism for supplying electronic components using a tray and a mechanism for supplying electronic components using a holding tape feeder may be arranged as the component supply unit 14r on the rear side.

The mounting head 15 is a mechanism for holding (adsorbing or gripping) the electronic components held in the component supply unit 14f or the electronic components held in the component supply unit 14r with suction nozzles, and transfers the held electronic components to the utilization unit. The board conveyance part 12 moves to the board|substrate 8 of a predetermined position, and mounts. In addition, when the component supply unit 14r has the electronic component supply device 90a, the mounting head 15 mounts (mounts) a chip-type electronic component (mounted electronic component) held by the electronic component supply device 90a on the substrate 8. mechanism. In addition, the structure of the mounting head 15 will be described later. Also, a chip-type electronic component (mount-mount type electronic component) is a leadless electronic component that does not have leads inserted into insertion holes (through holes) formed on the substrate 8 . As the mount-type electronic component, SOP, QFP, etc. are illustrated as mentioned above. When the chip-type electronic component is mounted on the substrate, it is not necessary to insert the leads into the insertion holes.

The XY moving mechanism (also referred to as a head moving mechanism) 16 is a moving mechanism that moves the heads 15f, 15r in the X-axis direction and the Y-axis direction in FIG. 1 , that is, on a surface parallel to the surface of the substrate 8 . The XY moving mechanism 16 has X-axis drive units 22 f and 22 r and a Y-axis drive unit 24 . The X-axis driving unit 22f is connected to the mounting head 15f, and moves the mounting head 15f in the X-axis direction. The X-axis driving unit 22r is connected to the mounting head 15r, and moves the mounting head 15r in the X-axis direction. The Y-axis driving unit 24 is connected to the mounting head 15 via the X-axis driving unit 22 , and moves the mounting head 15 f in the Y-axis direction by moving the X-axis driving unit 22 f in the Y-axis direction. The Y-axis drive unit 24 moves the mounting head 15r in the Y-axis direction by moving the X-axis drive unit 22r in the Y-axis direction. The XY moving mechanism 16 can move the mounting head 15 f to a position facing the substrate 8 or a position facing the component supply unit 14 f by moving the mounting head 15 in the XY axis direction.

The XY moving mechanism 16 can move the mounting head 15r to a position facing the substrate 8 or to a position facing the component supply unit 14r by moving the mounting head 15r in the XY axis direction.

In addition, the XY moving mechanism 16 adjusts the relative position between the mounting head 15 and the substrate 8 by moving the mounting head 15 . Thereby, the electronic component held by the mounting head 15 can be moved to an arbitrary position on the surface of the substrate 8 , and the electronic component can be mounted on an arbitrary position on the surface of the substrate 8 . That is, the XY moving mechanism 16 moves the mounting heads 15f, 15r on the horizontal plane (XY plane), and places the electronic components in the electronic component supply devices 90, 90a located in the component supply units 14f, 14r to a predetermined position (mounting position) on the substrate 8. location, installation location) conveying unit.

In addition, various mechanisms for moving the mounting head 15 in a predetermined direction can be used as the X-axis drive unit 22 . Various mechanisms for moving the X-axis drive unit 22 in a predetermined direction can be used as the Y-axis drive unit 24 . As a mechanism for moving an object in a predetermined direction, for example, a linear motor, a rack and pinion, a conveyance mechanism using a ball screw, a conveyance mechanism using a conveyor belt, or the like can be used.

The VCS unit 17, the replacement nozzle holding mechanism 18, and the parts storage unit 19 are arranged at positions overlapping with the movable area of the mounting head 15 in the XY plane, and are closer to the mounting head 15 in the Z direction than the mounting head 15. The position on the lower side in the vertical direction. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are arranged adjacently between the substrate transport unit 12 and the component supply unit 14r.

The VCS unit 17 is an image recognition device, and includes a camera for imaging the vicinity of the suction nozzle of the mounting head 15 and an illumination unit for illuminating the imaging area. The VCS unit 17 recognizes the shape of the electronic component picked up by the suction nozzle of the mounting head 15 and the holding state of the electronic component held by the suction nozzle. More specifically, when the mounting head 15 is moved to a position facing the VCS unit 17, the VCS unit 17 photographs the suction nozzles of the mounting head 15 from the lower side in the vertical direction, and analyzes the captured image, thereby The shape of the electronic component picked up by the suction nozzle and the holding state of the electronic component held by the suction nozzle are recognized. The VCS unit 17 is arranged on the substrate 8 side rather than the suction nozzle, and by imaging the electronic component held by the suction nozzle from the substrate 8 side, it is possible to image the surface of the electronic component facing the substrate 8 . The VCS unit 17 transmits the obtained information to the control device 20 .

The replacement nozzle holding mechanism 18 is a mechanism for holding various types of nozzles. The replacement nozzle holding mechanism 18 holds various types of nozzles in a detachable and replaceable state for the mounting head 15 . Here, the replacement nozzle holding mechanism 18 of this embodiment holds a suction nozzle which holds an electronic component by suction, and a gripping nozzle which holds an electronic component by gripping. The mounting head 15 can hold the electronic component to be held under an appropriate condition (suction or grip) by changing the nozzle to be mounted by changing the nozzle holding mechanism 18, and supplying air pressure to the mounted nozzle to drive it. .

The component storage unit 19 is a box for storing electronic components held by the mounting head 15 using suction nozzles and not mounted on the substrate 8 . That is, in the electronic component mounting apparatus 10, it becomes a waste box which discards the electronic component which is not mounted on the board|substrate 8. As shown in FIG. The electronic component mounting apparatus 10 moves the mounting head 15 to a position facing the component storage part 19 when there is an electronic component not to be mounted on the substrate 8 among the electronic components held by the mounting head 15, and the held electronic components release, and the electronic component is put into the component storage part 19 .

The control device 20 controls each part of the electronic component mounting device 10 . The control device 20 is an aggregate of various control units. The operation unit 40 is an input device for an operator to input an operation. As the operation unit 40 , a keyboard, a mouse, a touch panel, and the like are exemplified. The operation unit 40 transmits various detected inputs to the control device 20 . The display unit 42 is a screen for displaying various information to an operator. As the display unit 42, there are a touch panel, a video monitor, and the like. The display unit 42 displays various images based on the image signal input from the control device 20 .

In addition, in the electronic component mounting apparatus 10 of this embodiment, it is preferable to arrange two board|substrate conveyance parts 12 in parallel. If the electronic component mounting apparatus 10 moves the two substrates 8 alternately to the mounting positions of the electronic components using the two substrate conveying units 12, and alternately performs component mounting using the above-mentioned two mounting heads 15, it is possible to efficiently mount the components on the substrates 8. electronic components.

Next, the configuration of the mounting head 15 will be described using FIGS. 7 and 8 . FIG. 7 is a schematic diagram showing a schematic configuration of the mounting head 15 of the electronic component mounting apparatus. FIG. 8 is a schematic diagram showing a schematic configuration of the mounting head 15 of the electronic component mounting apparatus. In addition, in FIG. 7, various control parts of the control apparatus 20 which controls the electronic component mounting apparatus 10, and one component supply apparatus 90 of the component supply unit 14r are shown together.

As shown in FIGS. 7 and 8 , the mounting head 15 has a mounting head main body 30 , an imaging device 36 , a height sensor 37 , and a laser recognition device 38 . As shown in FIG. 7 , the electronic component mounting apparatus 10 includes a control unit 60 , a mounting head control unit 62 , a component supply control unit 64 , and an image control unit 66 . The control unit 60 , the head control unit 62 , the component supply control unit 64 , and the image processing unit 66 are part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source, and uses the control unit 60 , mounting head control unit 62 , component supply control unit 64 , image processing unit 66 and various circuits to supply power supplied from the power source to each part. The control unit 60, the head control unit 62, the component supply control unit 64, and the image processing unit 66 will be described later.

The electronic component supply device 90 exposes upward the main body of the electronic component 80 whose leads are held on the electronic component holding tape (radial component holding tape). In addition, an aluminum electrolytic capacitor is illustrated as the electronic component 80 . In addition, as the electronic component 80, various electronic components with leads other than an aluminum electrolytic capacitor can be used. The electronic component supply apparatus 90 moves the electronic component 80 held on the electronic component holding tape by pulling out the electronic component holding tape to the holding area (adsorption area, gripping area). In this embodiment, the vicinity of the front end in the Y-axis direction of the component supply device 90 serves as a holding area where the electronic components 80 held on the electronic component holding tape are held by the suction nozzles of the mounting head 15 . The configuration of the electronic component supply device 90 will be described later. In addition, similarly to the case of the electronic component supply apparatus 90 a , the predetermined position is a holding area where the electronic component 80 held on the electronic component holding tape is held by the suction nozzle of the mounting head 15 .

The mounting head main body 30 has a mounting head support body 31 supporting each part, a plurality of suction nozzles 32 , and a suction nozzle drive unit 34 . In the mounting head main body 30 of this embodiment, six suction nozzles 32 are arranged in a row as shown in FIG. 8 . Six suction nozzles 32 are arranged in a direction parallel to the X axis. In addition, each of the suction nozzles 32 shown in FIG. 8 is provided with a suction nozzle that suctions and holds the electronic component 80 .

The mounting head support body 31 is a support member connected to the X-axis drive unit 22 and supports the suction nozzle 32 and the suction nozzle drive unit 34 . In addition, the mounting head support body 31 also supports the laser recognition device 38 .

The suction nozzle 32 is a suction mechanism for suctioning and holding the electronic component 80 . The suction nozzle 32 has an opening 32a at the front end. The opening 32 a is connected to the nozzle drive unit 34 via the cavity inside and the cavity of the nozzle support unit 33 . The suction nozzle 32 sucks and holds the electronic component 80 at the front end by sucking air from the opening 32a. The nozzle 32 is detachably attached to the nozzle support portion 33 , and when not attached to the nozzle support portion 33 , is stored (stored) in the replacement nozzle holding mechanism 18 . Moreover, as for the suction nozzle 32, the shape and size of the opening 32a differ from each other. In addition, in this embodiment, a suction type suction nozzle having the opening 32a for suctioning the electronic component 80 is shown, but it is also possible to use a grip type suction nozzle that uses an arm that operates by air pressure to hold The electronic component 80 is sandwiched to hold the electronic component 80 .

The nozzle holder 33 is a mechanism for holding the nozzle 32 at the end (tip end) on the lower side in the vertical direction, and has, for example: a shaft that moves relative to the mounting head support 31 by the nozzle driver 34; and a socket, It is connected to the suction nozzle 32 . The shaft is a rod-shaped member and is arranged to extend in the Z-axis direction. The shaft supports the socket arranged at the end portion on the lower side in the vertical direction. The shaft is supported by the mounting head support body 31 in a state where the portion connected to the socket can move in the Z-axis direction and rotate in the θ direction. Here, the Z axis is an axis perpendicular to the XY plane, and the Z axis is a direction perpendicular to the surface of the substrate 8 . The θ direction is a direction parallel to the circumferential direction of a circle centered on the Z-axis, where the Z-axis is an axis parallel to the direction in which the nozzle drive unit 34 moves the nozzle 32 . The θ direction becomes the rotation direction of the suction nozzle 32 . The shaft moves and rotates the part connected to the socket in the Z-axis direction and the θ direction by the nozzle drive unit 34 .

The nozzle driver 34 moves the nozzle holder 33 in the Z-axis direction, thereby moving the nozzle 32 in the Z-axis direction, and sucks the electronic component 80 through the opening 32 a of the nozzle 32 . In addition, the suction nozzle drive unit 34 rotates the suction nozzle 32 in the θ direction by rotating the suction nozzle holding portion 33 in the θ direction when the electronic component 80 is mounted or the like.

The nozzle driving unit 34 includes a Z-axis motor 34 a as a mechanism for moving the nozzle 32 in the Z-axis direction. In addition, the suction nozzle driving part 34 has: a transmission belt connected to the rotating part of the Z-axis motor 34a; a screw extending in the Z-axis direction and rotating by the transmission belt; a screw screwed into the screw and fixed to the suction nozzle support. Section 33. The nozzle drive part 34 rotates the screw connected via the belt by the Z-axis motor 34a, and moves the screw screwed into the screw in the Z-axis direction. In the nozzle driving part 34 , a screw screwed into a screw is fixed to the nozzle supporting part 33 . The nozzle driving part 34 uses the Z-axis motor 34a to rotate the screw, and moves the nozzle 32 along the Z-axis direction together with the nozzle support part 33 fixed with the screw, so that the axis of the opening 32a at the front end of the nozzle 32 is along the Z axis. Axis direction movement. Also, in the nozzle drive unit 34 , as a mechanism for rotating the nozzle 32 in the θ direction, for example, there is a mechanism composed of a motor and a transmission element coupled to the shaft of the nozzle holding unit 33 . The nozzle driving unit 34 transmits the driving force output from the motor to the shaft of the nozzle holding unit 33 through the transmission element, and rotates the shaft in the θ direction, so that the tip of the suction nozzle 32 also rotates in the θ direction.

The suction nozzle drive unit 34 has, for example, a mechanism having the following components as a mechanism for sucking the electronic component 80 through the opening 32 a of the suction nozzle 32 : an air tube connected to the opening 32 a of the suction nozzle 32 ; a pump whose It is connected with the air pipe; and a solenoid valve switches the opening and closing of the pipeline of the air pipe. The nozzle drive unit 34 sucks air from the air pipe with a pump, and switches whether or not to suck air from the opening 32a by switching the solenoid valve on and off. The suction nozzle driver 34 sucks air from the opening 32a by opening the solenoid valve, so that the opening 32a sucks (holds) the electronic component 80, and closes the solenoid valve so that the opening 32a does not suck air, thereby sucking the electronic component 80 on the opening 32a. 80 is released, that is, the electronic component 80 is not held by the opening 32a (state not held).

In addition, when the mounting head 15 of the present embodiment holds the main body of the electronic component 80 , when the upper surface of the main body is in a shape that cannot be sucked by the suction nozzle (suction nozzle) 32 , the gripping nozzle described later is used. . The gripping nozzle sucks and releases air similarly to the suction nozzle, thereby opening and closing the movable piece with respect to the fixed piece, whereby the main body of the electronic component 80 can be gripped and released from above. In addition, the mounting head 15 can replace the nozzles 32 driven by the nozzle driving unit 34 by performing the replacement operation by moving the nozzles 32 by the nozzle driving unit 34 .

The imaging device 36 shown in FIG. 8 is fixed on the head support body 31 of the head body 30 , and takes an image of a region facing the head 15 , such as the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and a lighting device, and obtains an image using the camera while illuminating the field of view with the lighting device. Thereby, images of positions facing the mounting head main body 30 , for example, various images of the substrate 8 or the component supply unit 14 can be captured. For example, the imaging device 36 captures an image of a BOC mark (hereinafter abbreviated as BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8 . Here, when a fiducial mark other than the BOC mark is used, an image of the fiducial mark is captured. One imaging device 36 is provided for one mounting head 15 . Moreover, in the imaging device 36, the camera is arrange|positioned parallel to the Z-axis direction, and an image is taken from the direction parallel to the Z-axis direction.

The height sensor 37 is fixed to the head support body 31 of the head body 30 , and measures the distance between the area facing the head 15 , for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. As the height sensor 37, a laser sensor can be used. This laser sensor has: a light emitting element that emits laser light; Measure the distance to the opposite part. In addition, height sensor 37 detects the height of the opposing portion, specifically electronic component 80 , by processing the distance to the opposing portion using its own position and the position of substrate 8 at the time of measurement. In addition, the process of detecting the height of the electronic component 80 based on the measurement result of the distance with respect to an electronic component may be performed by the control part 60.

The laser recognition device 38 has a light source 38a and a light receiving element 38b. The laser recognition device 38 is built into the bracket 50 . As shown in FIG. 7 , the bracket 50 is connected to the lower side of the head support body 31 , the substrate 8 and the component supply device 90 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating laser light on the electronic component 80 sucked by the suction nozzle 32 of the head main body 30 . Here, the state of the electronic component 80 refers to the shape of the electronic component 80 , whether or not the electronic component 80 is sucked by the suction nozzle 32 in a correct posture, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b is arranged at a position in the Z-axis direction, that is, a position having the same height as the light source 38a and a position facing the light source 38a.

Next, the control function of the device configuration of the electronic component mounting device 10 will be described. As shown in FIG. 7 , the electronic component mounting apparatus 10 includes a control unit 60 , a storage unit 61 , a head control unit 62 , a component supply control unit 64 , and an image processing unit 66 as the control device 20 . Each of the various control units is composed of members having arithmetic processing functions and storage functions, such as a CPU, ROM, and RAM. In addition, in this embodiment, a plurality of control units are provided for convenience of explanation, but one control unit may be provided. In addition, when realizing the control function of the electronic component mounting apparatus 10 by one control part, it may realize it by one computing device, and may realize it by several computing devices.

The control unit 60 is connected to each part of the electronic component mounting apparatus 10, and executes a stored program based on an input operation signal and information detected in each part of the electronic component mounting apparatus 10 to control the operation of each part. The control unit 60 controls, for example, the conveying operation of the substrate 8 , the driving operation of the mounting head 15 by the XY moving mechanism 16 , the shape detection operation by the laser recognition device 38 , and the like. In addition, the control unit 60 sends various instructions to the mounting head control unit 62 as described above, and also controls the control operation of the mounting head control unit 62 . The control unit 60 also controls the control operation of the component supply control unit 64 .

The storage unit 61 is connected to the control unit 60 and has a storage function such as ROM and RAM. In addition, the storage unit 61 may be provided integrally with the control unit 60 or separately. The storage unit 61 stores data acquired by the control unit 60 from each unit and data calculated and calculated by the control unit 60 . The storage unit 61 stores data of design drawings, shapes of various electronic components, adsorption conditions, correction conditions of adsorption processing, production programs, etc., wherein the data of design drawings include through-hole coordinate design values, reference mark coordinate design values, electronic component Carry coordinate design values. In addition, the storage unit 61 stores a generation condition, which is a condition for detecting the shape of a lead of an insert-type electronic component having leads, such as a radial lead-type electronic component, in association with the type of the insert-type electronic component. Furthermore, the storage unit 61 also stores a program for controlling the operation (parameter acquisition process) when determining the generation condition. In addition, the storage unit 61 can also delete unnecessary data under the control of the control unit 60 .

The mounting head control unit 62 is connected to the nozzle drive unit 34 , various sensors arranged on the head support 31 , and the control unit 60 to control the nozzle drive unit 34 and the operation of the suction nozzle 32 . The mounting head control section 62 controls the suction (holding)/release operation of the suction nozzles 32 for the electronic component 80 and the rotation of the suction nozzles 32 based on the operation instructions supplied from the control section 60 and the detection results of various sensors (for example, distance sensors). Action, movement action in the Z-axis direction. In addition, the mounting head control unit 62 also controls the replacement operation of the suction nozzles.

The component supply control part 64 controls the supply operation|movement of the electronic components 80 and 80a by the component supply means 14f and 14r. The component supply control part 64 may be provided in each of the component supply apparatuses 90 and 90a, or all the component supply apparatuses 90 and 90a may be controlled by one component supply control part 64. For example, the component supply control unit 64 controls the pulling operation (moving operation) of the electronic component holding tape, the cutting operation of the lead wire, and the holding operation of the radial lead type electronic component by the component supply device 90 . Also, when the component supply unit 14 has the component supply device 90a, the component supply control unit 64 controls the pulling operation (moving operation) of the electronic component holding tape by the component supply device 90a, and the like. The component supply control unit 64 executes various operations based on instructions from the control unit 60 . The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the pulling operation of the electronic component holding tape or the electronic component holding tape.

The image processing unit 66 controls the imaging operation in the VCS unit 17 and processes the acquired image. The image processing unit 66 transmits information obtained by performing image processing and image information to the control unit 60 . When acquiring the image of the plug-in electronic component, the image processing unit 66 synthesizes images captured at a plurality of positions with different distances from the plug-in electronic component. That is, the image processing unit 66 acquires an image of the surface of the plug-in electronic component on which the leads are formed by the all-focus recognition process, and acquires information on the shape of the leads. In addition, the image processing unit 66 performs various image processing on the image acquired by the VCS unit 17 . The image processing includes edge enhancement processing using primary (differential) filtering, smoothing processing using secondary (differential) filtering, binarization processing, and the like. The processing performed by the control device 60 will be described later.

Here, in the above-mentioned embodiment, the case where the suction nozzle is used as the nozzle attached to the mounting head 15 has been described, but the present invention is not limited thereto. As a suction nozzle attached to the mounting head 15, a gripping nozzle for gripping an electronic component can also be used. The electronic component mounting apparatus 10 can appropriately hold the electronic component 80 by selecting the type of suction nozzle for holding the electronic component 80 according to the type of the electronic component 80 to be held. Specifically, it is possible to use one electronic component by selecting whether to use a suction nozzle or a grip nozzle according to the electronic component 80 to be held, and switching which nozzle to use among each type of nozzle. The mounting device mounts more kinds of electronic components 80 .

Next, the suction nozzle (connector suction nozzle, electronic component conveying suction nozzle) used for insertion of the connector type electronic component 80a is demonstrated using FIG.9 thru|or FIG.11. The connector suction nozzle 150 is a suction nozzle for inserting the connector-type electronic component 80a. The connector suction nozzle 150 is attached to the nozzle support portion 33 of the mounting head 15 similarly to the suction nozzle 32 . In addition, the connector nozzle 150 is held by the replacement nozzle holding mechanism 18 when it is not attached to the mounting head 15 .

The connector suction nozzle 150 has a base portion 152 , a slide portion 154 , a guide shaft 156 , an arm portion 160 , and a telescopic adjustment mechanism 162 .

The base portion 152 is a base of the connector nozzle 150 , and is fixed to the nozzle support portion 33 when attached to the nozzle support portion 33 . The base portion 152 has a connecting portion 164 and a D-cut portion 166 . The connecting portion 164 is formed at an end portion on the upper side in the vertical direction in a state where the base portion 152 is supported by the nozzle support portion 33 . The connection part 164 is connected to the nozzle support part 33 . The D-cut portion 166 is a circular plate in which a part of the nozzle 150 for a connector protruding in a direction perpendicular to the Z-axis is missing in a state supported by the nozzle support portion 33 . The D-cut portion 166 is fixed to the base portion 152 . The suction nozzle 150 for a connector can detect the position of the missing part (notch part) of the D cut part 166, and can specify the attitude|position of the suction nozzle 150 for a connector.

The sliding parts 154 are respectively disposed on two opposing side surfaces of the base part 152 . That is, the suction nozzle 150 for a connector has two sliding parts 154, one sliding part 154 faces one of the two opposing side surfaces of the base part 152, and one sliding part 154 faces two opposing sides of the base part 152. The other of the two sides faces each other. The slide portion 154 is supported by the guide shaft 156 in a movable state relative to the base portion 152 .

The two guide shafts 156 are respectively arranged corresponding to the two sliding parts 154 . The guide shaft 156 is connected to the side surface of the base portion 152 in a movable state, and is fixed to the slide portion 154 . The guide shaft 156 sets a predetermined direction in which the slide portion 154 moves relative to the base portion 152 . The guide shaft 156 supports the sliding portion 154 in a state where the sliding portion 154 is movable relative to the base portion 152 in a direction perpendicular to the side surface of the base portion 152 .

The two arm parts 160 are respectively fixed to the two sliding parts 154 . The arm portion 160 is detachably fixed by fastening portions 190 such as bolts and screws. The arm portion 160 is a wrist-shaped member extending in a direction perpendicular to the side surface of the base portion 152 . The part of the arm part 160 farthest from the sliding part 154 is a front end part 202 . The front end portion 202 is in contact with the groove 134 of the connector-type electronic component 80a.

The front end portion 202 of the arm portion 160 is provided on the lower side in the vertical direction than the end portion on the lower side in the vertical direction of the base portion 152 . Specifically, in the state attached to the nozzle support portion 33, the end portion of the front end portion 202 of the arm portion 160 on the lower side in the vertical direction is compared with the end portion of the base portion 152 on the lower side in the vertical direction. It is arranged on the lower side in the vertical direction at a distance h. By disposing the arm portion 160 below the base portion 152 in the vertical direction, it is possible to prevent the base portion 152 from coming into contact with other devices or electronic components during the mounting operation of the electronic component. Thereby, connector-type electronic components can be mounted with high density.

The telescopic adjustment mechanism 162 is disposed between the base portion 152 and the sliding portion 154 , and moves the sliding portion 154 relative to the base portion 152 to change the distance from the base portion 152 to the tip portion 202 of the arm portion 160 . The telescopic adjustment mechanism 162 has a spring portion 170 and an air pressure adjustment portion 172 . The spring portion 170 is arranged on the surface where the base portion 152 and the sliding portion 154 face each other, and has one end fixed to the base portion 152 and the other end fixed to the sliding portion 154 . The spring portion 170 applies a force of an arrow 210 to the sliding portion 154 , that is, a force in a direction in which the base portion 152 and the sliding portion 154 are separated.

The air pressure adjusting part 172 applies a force opposite to the elastic force of the spring part 170 to the sliding part 154 by supplying air pressure, that is, the force of the arrow 220, that is, the direction in which the base part 152 and the sliding part 154 approach each other. force. The air pressure adjustment unit 172 has an air pressure supply unit 180 , an air flow path 182 , a cylinder unit 184 , and a piston unit 186 . The air pressure supply unit 180 is connected to the mounting head 15 and supplies air to the connector suction nozzle 150 via the nozzle support unit 33 . The air pressure supply unit 180 is also used during the mounting operation of electronic components with other types of suction nozzles.

The air flow path 182 is formed inside the base portion 152 and is connected to the air flow path of the nozzle support portion 33 . The air flow path 182 is such that the air supplied from the air flow path of the nozzle support portion 33 is supplied from the sliding portion 154 side of the piston portion 186 of the air cylinder portion 184 . The cylinder portion 184 is a cylindrical space formed inside the base portion 152 . The piston portion 186 is arranged inside the cylinder portion 184 and connected to the guide shaft 156 .

The air pressure regulator 172 is supplied with air pressure from the air pressure supply unit 180 to apply the force of the arrow 220 , that is, the force in the direction of bringing the base unit 152 and the slider unit 154 closer together, to the piston unit 186 of the cylinder unit 184 .

The suction nozzle 150 for a connector has the structure mentioned above. The suction nozzle 150 for a connector adjusts the balance between the force applied by the air pressure adjustment part 172 and the direction in which the base part 152 and the slide part 154 approach, and the force applied from the spring part 170, thereby The positions of the sliding part 154 and the arm part 160 are adjusted. That is, by making the force of the arrow 220 applied by the air pressure adjusting part 172 greater than the force of the arrow 210 applied by the spring part 170 , the base part 152 and the slide part 154 can be moved in the approaching direction. In addition, by making the force of arrow 220 applied by the air pressure adjusting part 172 smaller than the force of arrow 210 applied by the spring part 170 , the base part 152 and the slide part 154 are moved in the direction of separation. As described above, by moving the slider 154 , the distance between the front ends 202 of the arm 160 fixed to the slider 154 can be adjusted. The suction nozzle 150 for a connector uses the guide shaft 156, specifically, the piston part 186, to limit the moving range of the distance between the base part 152 and the sliding part 154 within a predetermined range. That is, the movable range of the sliding part 154 connected via the guide shaft 156 can be restricted by having a structure that restricts the movable range of the piston part 186 in the air cylinder 184 .

Next, the operation of each part of the electronic component mounting apparatus will be described. In addition, the operation|movement of each part of an electronic component demonstrated below can be executed by controlling the operation|movement of each part by the control apparatus 20.

FIG. 12 is a flowchart showing an example of the operation of the electronic component mounting device. The outline of the overall processing operation of the electronic component mounting apparatus 10 will be described using FIG. 12 . In addition, the process shown in FIG. 12 is executed by controlling each part by the control device 20 . The electronic component mounting apparatus 10 reads the production program as step S52. The production program is created by a dedicated production program creation device, or is created by the control device 20 based on various input data.

After the electronic component mounting apparatus 10 reads the production program in step S52, it detects the state of the apparatus as step S54. Specifically, the configurations of the component supply units 14f and 14r, the types of electronic components to be filled, the types of suction nozzles 32 to be prepared, and the like are detected. The electronic component mounting apparatus 10 detects the state of the apparatus in step S54, and after preparation is completed, carries in the board|substrate 8 in step S56. The electronic component mounting apparatus 10 carries the board|substrate 8 in step S56, arrange|positions the board|substrate 8 in the position where an electronic component is to be mounted, and mounts an electronic part on the board|substrate 8 as a step S58. The electronic component mounting apparatus 10 sends out the board|substrate 8 as step S60 after completing mounting of an electronic component by step S58. After the electronic component mounting apparatus 10 sends out the board|substrate 8 in step S60, it determines with production completion as step S62. When the electronic component mounting apparatus 10 determines in step S62 that production is not completed (No), it proceeds to step S56 and executes the processing from step S56 to step S62. That is, based on the production program, the process of mounting electronic components on the substrate 8 is performed. The electronic component mounting apparatus 10 ends this process when it determines with production end (Yes) in step S62.

The electronic component mounting apparatus 10 reads the production program and performs various settings as described above, and then mounts the electronic component on the board, thereby manufacturing the board on which the electronic component is mounted. In addition, the electronic component mounting apparatus 10 mounts, as an electronic component, a lead-type electronic component having a main body and leads connected to the main body on a substrate. By inserting the electronic component, the electronic component can be mounted on the substrate.

FIG. 13 is a flowchart showing an example of the operation of the electronic component mounting device. In addition, the processing operation shown in FIG. 13 is an operation until completion of mounting of electronic components on the substrate after the substrate is carried in. In addition, the processing operation shown in FIG. 13 is executed by controlling the operation of each unit by the control unit 60 .

The control part 60 carries in the board|substrate 8 as step S102. Specifically, the control unit 60 uses the substrate transport unit 12 to transport the substrate to be mounted with electronic components to a predetermined position. After the control unit 60 carries in the substrate in step S102, the holding movement is performed in step S104. Here, holding movement (suction movement) refers to a processing operation of moving the head body 30 until the suction nozzle 32 moves to a position facing the electronic component in the holding area of the component supply unit 14 .

After the control unit 60 performs the holding movement in step S104, the suction nozzle 32 is lowered in step S106. That is, the control unit 60 moves the suction nozzle 32 downward until it moves to a position where the electronic component can be held (adsorbed, gripped). After the control unit 60 lowers the suction nozzle 32 in step S106, the electronic component is held by the suction nozzle 32 in step S108, and the suction nozzle 32 is raised in step S110. After the control unit 60 raises the suction nozzle to a predetermined position in step S110, the inspection movement is performed in step S112. Specifically, the electronic component 8 is moved to a position where the shape of the electronic component is detected. Specifically, it moves to a position facing the VCS unit 17 . Depending on the type of the electronic component, the position of the suction nozzle 32 may be moved to move the electronic component to the measurement position of the laser recognition device 38 . The control part 60 detects the shape of the electronic component picked up by the suction nozzle 32 as step S114, when moving to the position where the inspection of an electronic component is performed. The processing of step S114 will be described later. Also, when the control unit 60 detects the shape of the electronic component in step S114 as described above and determines that the held electronic component cannot be mounted, the electronic component is discarded and the electronic component is adsorbed again.

After the control unit 60 detects the shape of the electronic component in step S114, it performs mounting movement as step S116, that is, moves the electronic component sucked by the suction nozzle 32 to a position facing the mounting position (mounting position) of the substrate 8. In the position processing operation, the suction nozzle 32 is lowered as step S118, and the component mounting (component mounting) is performed as step S120, that is, the processing operation for releasing the electronic component from the suction nozzle 32 is to raise the suction nozzle 32 as step S122. That is, the control unit 60 executes the above-mentioned installation process in the processing operation from step S112 to step S120.

When the control unit 60 raises the suction nozzle 32 in step S122 , it determines in step S124 whether the mounting of all components is completed, that is, whether the mounting process of electronic components scheduled to be mounted on the board 8 is completed. When it is determined in step S124 that the mounting of all components is not completed (No), that is, when there are remaining electronic components to be mounted, the control unit 60 proceeds to step S104 and performs a process of mounting the next electronic component on the substrate 8. action. As described above, the control unit 60 repeats the above-described processing operations until the mounting of all components on the substrate 8 is completed. When it is determined in step S124 that the mounting of all components has been completed (Yes), the control unit 60 ends this process.

Next, using Fig. 14 to Fig. 16, the case where a connector-type electronic component is mounted on a substrate as an electronic component, specifically, a connector-use suction nozzle 150 as a suction nozzle and a component to be inserted are provided. The processing operation to be executed when a connector-type electronic component is specified will be described. 14 to 15 are flowcharts each showing an example of the operation of the electronic component mounting device. FIG. 16 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. In addition, the processing operations shown in FIGS. 14 to 15 are executed by controlling the operation of each unit by the control unit 60 .

The control part 60 determines whether the connector type electronic component 80a is mounted (step S202). That is, the control unit 60 determines whether or not the electronic components to be mounted next include connector-type electronic components. When it is judged that the connector type electronic component is not to be mounted (No in step S202), the control part 60 judges whether it is necessary to replace a suction nozzle (step S204). When the control unit 60 determines that nozzle replacement is necessary (Yes in step S204), the nozzle replacement holding mechanism 18 replaces the nozzles attached to the nozzle support portion 33 of the mounting head 15 (step S206). When the control unit 60 determines that it is not necessary to replace the nozzles (step S204: No), or when the nozzles mounted on the nozzle support unit 33 have been replaced by the replacement nozzle holding mechanism 18, the The electronic components are mounted (step S208). Here, the steps from step S204 to step S208 are the same operations as those performed when mounting electronic components other than connector-type electronic components.

When the control part 60 judges to mount the connector type electronic component 80a (step S202: Yes), it judges whether the attachment of the suction nozzle 150 for connectors is complete (step S212). That is, it is determined whether or not the connector suction nozzle 150 is attached to the nozzle support portion 33 of the mounting head 15 . When the control unit 60 determines that the connector nozzle 150 is not mounted (No in step S212), the nozzle mounted on the nozzle support portion 33 of the mounting head 15 is replaced with the one installed in the replacement nozzle holding mechanism 18. The held connector suction nozzle 150 (step S214). When the control unit 60 determines that the replacement of the nozzle is completed (Yes in step S212), or when the nozzle mounted on the nozzle support unit 33 has been replaced, it uses the connector suction nozzle 150 to connect the connector-type The electronic component 80a is mounted (step S216).

Next, the operation|movement of mounting the connector type electronic component 80a with the suction nozzle 150 for connectors is demonstrated using FIG. 15. FIG. The control unit 60 supplies air to shrink the arm unit 160 (step S220). Specifically, by supplying air from the air pressure supply part 180 , the piston part 186 is urged toward the center side of the base part 152 , and the slide part 154 and the arm part 160 are moved toward the base part 152 . In the electronic component mounting apparatus 10, the distance between the front ends 202 of the arm portions 160 is reduced compared to the distance between the grooves 134 of the connector-type electronic component 80a by contracting the arm portions 160 .

After contracting the arm part 160, the control part 60 moves the suction nozzle 150 for connectors to the holding position of the electronic component supply apparatus (component supply unit 14r) (step S222). That is, the control part 60 moves the suction nozzle 150 for connectors attached to the mounting head 15 to the position where the connector-type electronic component 80a of the component supply unit 14r is mounted. Here, as shown in FIG. 16 , the control unit 60 moves the connector suction nozzle 150 attached to the mounting head 15 to a position where the wire connecting the front end portion 202 and the wire connecting the grooves 134 overlap. . The control unit 60 moves the connector suction nozzle 150 further downward in the vertical direction so that the tip portion 202 and the groove 134 face each other.

After the control unit 60 moves the connector suction nozzle 150 to the holding position of the electronic component supply device, the supply of air is stopped, and the arm portion 160 is extended to hold the connector type electronic component 80a by the connector suction nozzle 150 (step S224). That is, the supply of air is stopped, and the force of the spring part 170 is used to extend the arm part 160 to the direction in which the distance between the front end parts 202 is extended, so that the groove 134 and the front end part 202 are contacted, and the front end part 202 is further moved toward the groove 134. By applying force in the pressing direction, the connector-type electronic component 80 a is held by the suction nozzle 150 for a connector.

After the electronic component is held by the suction nozzle, the control unit 60 moves the electronic component to the mounting position on the substrate to mount the electronic component on the substrate (step S226 ). That is, the leads 124 of the connector-type electronic component 80a are inserted into the holes of the substrate. At this time, the control unit 60 preferably moves the suction nozzle 150 for a connector by a predetermined distance to the side in the vertical direction from the mounting position of the connector-type electronic component 80a. Accordingly, the connector-type electronic component 80a is pressed against the board, and the connector-type electronic component 80a can be more reliably mounted on the board.

After mounting the electronic component on the board, the control unit 60 supplies air to contract the arm unit 160 to detach the electronic component from the suction nozzle (step S228 ). That is, the distance between the tip portions 202 is shortened compared with the distance between the grooves 134 , and the tip portion 202 and the groove 134 are separated.

The electronic component mounting apparatus 10 performs the above process, inserts the front end portion 202 into the groove 134 formed on the surface facing the center side of the connector type electronic component 80a, and inserts the arm portion 160 toward the center side of the connector type electronic component 80a. The connector-type electronic component 80a can be held by exerting force on the surface thereof. Thereby, the electronic component mounting apparatus 10 can mount the connector-type electronic component 80a on the board|substrate 8 using the suction nozzle 150 for connectors. As described above, the connector-type electronic component 80a can be mounted on the board 8 using the connector suction nozzle 150, and the connector-type electronic component 80a can also be mounted by the electronic component mounting apparatus 10 for mounting various electronic components. Install. Accordingly, the number of electronic components that can be mounted by the electronic component mounting apparatus 10 can be increased only by exchanging the suction nozzle.

In addition, the telescopic adjustment mechanism 162 of the electronic component mounting apparatus 10 can appropriately move the arm portion 160 by combining the spring portion 170 and the air pressure adjustment portion 172 as shown in this embodiment. The force is applied in a direction in which the base portion 152 and the sliding portion 154 are separated, and the air pressure adjustment unit 172 is applied in a direction in which the base portion 152 and the sliding portion 154 approach by adjusting the air pressure.

In addition, the air pressure regulator 172 of the present embodiment urges the base portion 152 and the sliding portion 154 in a direction in which the base portion 152 and the sliding portion 154 approach by supplying air, that is, by supplying a positive pressure. Press to apply a force in a direction in which the base portion 152 and the sliding portion 154 approach. In the case of sucking air, an opening for supplying air from the air pressure supply unit 180 to the cylinder unit is provided on the surface of the piston unit 186 on the side away from the sliding unit 154 .

In addition, the telescopic adjustment mechanism 162 of the electronic component mounting apparatus 10 can also appropriately move the arm portion 160 by combining the spring portion 170 and the air pressure adjustment portion 172, wherein the spring portion 170 slides toward the base portion 152 and The base portion 154 applies a force in a direction in which the base portion 154 approaches, and the air pressure adjustment portion 172 applies a force in a direction in which the base portion 152 and the sliding portion 154 separate by adjusting the air pressure. In addition, in this case, the air pressure regulator 172 may supply air, that is, supply positive pressure, thereby biasing the base portion 152 and the sliding portion 154 in the direction of separation, or may suck air, that is, by By supplying negative pressure, a force is applied in a direction in which the base portion 152 and the sliding portion 154 are separated.

In addition, the telescopic adjustment mechanism 162 may move the arm part 160 by a combination other than spring and air pressure.

Moreover, the suction nozzle 150 for connectors is provided with the fastening part 190, and the arm part 160 is made detachable with respect to the slide part 154, and the arm part 160 can be replaced. Thereby, the arm part 160 can be replaced according to the connector type electronic component 80a to be mounted, and units, such as one base part 152 and the slide part 154, can be used effectively.

In addition, in the above-described embodiment, by providing the sliding portion 154 on both sides of the base portion 152 and making it a mechanism that moves on both sides, the amount of movement can be increased. In addition, the structure of the suction nozzle 150 for connectors is not limited to this. Alternatively, the sliding portion 154 may be provided on one side of the base portion 152 and the fixed arm portion 160 may be provided on the other side.

Claims (9)

1. an electronic component transfer nozzle which is mounted on an electronic component mounting apparatus and holds a connector-type electronic component, the connector-type electronic component comprising: a first base part; locking parts provided at both ends of the first base part; a lead wire; and an insertion portion into which the plate-like member is inserted,

The electronic component transfer nozzle is characterized by comprising:

A second base part coupled to a mounting head of the electronic component mounting device;

A guide shaft coupled to a side surface of the second base part;

A slide part coupled to the guide shaft and movable relative to the second base part;

An arm portion fixed to the slide portion and provided with a distal end portion that is in contact with the connector-type electronic component at a portion farthest from the slide portion; and

A telescopic adjustment mechanism disposed between the second base portion and the sliding portion, for moving the sliding portion relative to the second base portion and changing a distance from the second base portion to the distal end portion,

The tip portion is inserted into a groove formed on a surface of the locking portion of the connector type electronic component facing the center side, and the arm portion is biased toward the surface of the locking portion of the connector type electronic component facing the center side, thereby holding the connector type electronic component.

2. The electronic component transfer nozzle according to claim 1,

the telescopic adjustment mechanism includes a spring portion that biases the second base portion in a direction in which the second base portion and the slide portion are separated from each other, and an air pressure adjustment portion that biases the second base portion in a direction in which the second base portion and the slide portion approach each other by adjusting air pressure,

the air pressure supplied from the air pressure adjusting unit is adjusted, and the arm unit is switched between a contracted state and an extended state.

3. The electronic component transfer nozzle according to claim 2,

The air pressure adjusting portion supplies air to bias the second base portion and the sliding portion in a direction in which the second base portion and the sliding portion approach each other.

4. The electronic component transfer nozzle according to claim 2,

The air pressure adjusting portion draws air to bias the second base portion and the sliding portion in a direction in which the second base portion and the sliding portion approach each other.

5. The electronic component transfer nozzle according to claim 1,

The telescopic adjustment mechanism includes a spring portion that biases the second base portion and the slide portion in a direction in which the spring portion approaches the slide portion, and an air pressure adjustment portion that biases the second base portion and the slide portion in a direction in which the air pressure adjustment portion separates the spring portion from the slide portion,

The air pressure supplied from the air pressure adjusting unit is adjusted, and the arm unit is switched between a contracted state and an extended state.

6. The electronic component transfer nozzle according to any one of claims 1 to 5,

The tip end portion of the arm portion is provided below the end portion of the second base portion on the lower side in the vertical direction.

7. The electronic component transfer nozzle according to any one of claims 1 to 5,

the arm portion is detachable from the slide portion.

8. The electronic component transfer nozzle according to any one of claims 1 to 5,

The slide portion and the arm portion are disposed on 2 opposing surfaces of the second base portion.

9. An electronic component mounting apparatus, comprising:

The electronic component transfer nozzle of any one of claims 1 to 8;

A substrate conveying unit that conveys a substrate;

An electronic component supply device that supplies a connector-type electronic component having a lead and an insertion portion into which a plate-shaped component is inserted;

a mounting head having a nozzle driving section for driving the electronic component transfer nozzle, holding the connector type electronic component by the electronic component transfer nozzle, transferring the electronic component from the electronic component supply device to the substrate, and mounting the connector type electronic component on the substrate;

A mounting head moving mechanism that moves the mounting head; and

And a control device provided with a mounting head control unit for controlling the operation of the mounting head.