CN105592683B

CN105592683B - Electronic component conveying suction nozzle and electronic component mounting device with same

Info

Publication number: CN105592683B
Application number: CN201510765356.9A
Authority: CN
Inventors: 加贺谷宏之
Original assignee: Juki Corp
Current assignee: Juki Corp
Priority date: 2014-11-11
Filing date: 2015-11-11
Publication date: 2019-12-06
Anticipated expiration: 2035-11-11
Also published as: JP6351486B2; CN105592683A; JP2016092375A

Abstract

provided are an electronic component transfer nozzle capable of holding and transferring an electronic component having a shape which is difficult to hold by suction or hold by clamping, and an electronic component mounting apparatus having the same. The conveying suction nozzle is provided with: a base part connected with a mounting head of the electronic component mounting device; a guide shaft coupled to a side surface of the base portion; a slide part connected with the guide shaft and movable relative to the base part; an arm portion fixed to the slide portion and provided with a distal end portion that is in contact with the connector-type electronic component at a portion farthest from the slide portion; and a telescopic adjustment mechanism which is arranged between the base part and the sliding part, moves the sliding part relative to the base part, changes the distance from the base part to the front end part, inserts the front end part into a groove formed on the surface of the connector type electronic component facing to the center side, and applies force to the surface of the electronic component facing to the center side by the arm part, thereby holding the connector type electronic component.

Description

Electronic component conveying suction nozzle and electronic component mounting device with same

Technical Field

the present invention relates to an electronic component transfer nozzle that transfers an electronic component, and an electronic component mounting apparatus that includes the electronic component transfer nozzle and mounts the electronic component on a substrate.

Background

The electronic component mounting apparatus mounts the electronic component on the substrate by repeating an operation of holding the electronic component by a suction nozzle provided in the mounting head and mounting the electronic component on a mounting point of the substrate. In recent years, there has been proposed an electronic component mounting device which can mount an insertion type electronic component having a lead and mounted on a substrate by inserting the lead into a hole of the substrate, in addition to a mounting type electronic component mounted on the substrate (see patent document 1).

Patent document 1 describes a suction-type nozzle having a mechanism for sucking and holding an electronic component, and a grip-type nozzle having a mechanism for holding an electronic component. As a mechanism of the nozzle, patent documents 2 and 3 also describe a grip-type nozzle which is a mechanism for holding and holding an electronic component by clamping.

Patent document 1: japanese patent laid-open publication No. 2013-179190

Patent document 2: japanese laid-open patent publication No. 2006-108199

Patent document 3: japanese patent laid-open publication No. 2006-140274

The insertion type electronic component has a lead, and is mounted by inserting the lead into a hole of a substrate. As described above, some electronic components having leads have shapes that are difficult to hold by suction or gripping. For example, there are a DIMM connector into which a Memory module, specifically a DIMM (dual Inline Memory module) is inserted, and a connector for a flat cable into which a flat cable is inserted. In the connector-type electronic component having the insertion portion, the insertion portion into which various components are inserted is formed, and since the member of the plate-shaped portion is inserted and has a shape extending in one direction, there is an electronic component in which it is difficult to hold the electronic component by suction or gripping. Therefore, in a real situation, the operator manually performs the insertion.

Disclosure of Invention

The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic component transfer nozzle capable of holding and transferring an electronic component having a shape in which holding by suction or holding by clamping is difficult, and an electronic component mounting apparatus including the electronic component transfer nozzle.

An electronic component transfer nozzle according to the present invention is an electronic component transfer nozzle that is mounted on an electronic component mounting apparatus and holds a connector-type electronic component having a lead and an insertion portion into which a plate-like component is inserted, the electronic component transfer nozzle comprising: a base part coupled to a mounting head of the electronic component mounting device; a guide shaft coupled to a side surface of the base portion; a slide part coupled to the guide shaft and movable relative to the base part; an arm portion fixed to the slide portion and provided with a distal end portion that is in contact with the connector-type electronic component at a portion farthest from the slide portion; and a telescopic adjustment mechanism which is arranged between the base part and the sliding part, moves the sliding part relative to the base part, changes the distance from the base part to the front end part, inserts the front end part into a groove formed on the surface of the connector type electronic component facing to the center side, and biases the arm part to the surface of the connector type electronic component facing to the center side, thereby holding the connector type electronic component.

Here, it is preferable that the telescopic adjustment mechanism includes a spring portion that biases the base portion and the slide portion in a direction away from each other, and an air pressure adjustment portion that biases the base portion and the slide portion in a direction toward each other by adjusting air pressure, adjusts air pressure supplied from the air pressure adjustment portion, and switches between a contracted state and an extended state of the arm portion.

Preferably, the air pressure adjusting portion biases the base portion and the sliding portion in a direction of approaching each other by supplying air.

Preferably, the air pressure adjusting portion draws air to bias the base portion and the sliding portion in a direction of approaching each other.

Preferably, the telescopic adjustment mechanism includes a spring portion that biases the base portion and the slide portion in a direction in which the spring portion approaches the slide portion, and an air pressure adjustment portion that biases the base portion and the slide portion in a direction in which the spring portion separates from each other by adjusting air pressure, and the air pressure supplied from the air pressure adjustment portion is adjusted to switch between a contracted state and an extended state of the arm portion.

Preferably, the tip end portion of the arm portion is provided below a vertically lower end portion of the base portion.

Preferably, the arm portion is detachable from the slide portion.

Preferably, the slide portion and the arm portion are disposed on 2 opposing surfaces of the base portion.

The invention is characterized by comprising the electronic component conveying nozzle; a substrate conveying unit that conveys a substrate; an electronic component supply device that supplies a connector-type electronic component having a lead and an insertion portion into which a plate-shaped component is inserted; a mounting head having a nozzle driving section for driving the electronic component transfer nozzle, holding the connector type electronic component by the electronic component transfer nozzle, transferring the electronic component from the electronic component supply device to the substrate, and mounting the connector type electronic component on the substrate; a mounting head moving mechanism that moves the mounting head; and a control device provided with a mounting head control unit for controlling the operation of the mounting head.

ADVANTAGEOUS EFFECTS OF INVENTION

the present invention has an effect that the connector type electronic component can be inserted into the substrate by the electronic component mounting apparatus.

Drawings

Fig. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus.

Fig. 2 is a schematic diagram showing a schematic configuration of an example of the component supply unit.

Fig. 3 is a schematic diagram showing another example of the component supply unit.

fig. 4 is a perspective view showing an example of a connector-type electronic component.

Fig. 5 is a front view of the connector-type electronic component shown in fig. 4.

Fig. 6 is an enlarged oblique view showing a locking portion of the connector-type electronic component shown in fig. 4.

fig. 7 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus.

Fig. 8 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus.

Fig. 9 is a perspective view showing a schematic configuration of the suction nozzle for a connector.

Fig. 10 is a plan view showing a schematic configuration of the suction nozzle for a connector.

Fig. 11 is an enlarged cross-sectional view showing a schematic configuration of the connector nozzle.

Fig. 12 is a flowchart showing an example of the operation of the electronic component mounting apparatus.

Fig. 13 is a flowchart showing an example of the operation of the electronic component mounting apparatus.

Fig. 14 is a flowchart showing an example of the operation of the electronic component mounting apparatus.

Fig. 15 is a flowchart showing an example of the operation of the electronic component mounting apparatus.

Fig. 16 is an explanatory view for explaining an operation of the electronic component mounting apparatus.

Description of the reference numerals

8 substrate, 10 electronic component mounting device, 11 frame, 12 substrate transport section, 14f, 14r component supply unit, 15 mounting head, 16XY moving mechanism, 17VCS unit, 18 replacement nozzle holding mechanism, 19 component storage section, 20 control device, 22f, 22r X axis drive section, 24Y axis drive section, 30 mounting head main body, 31 mounting head support body, 32 nozzle, 33 nozzle support section, 34 nozzle drive section, 34a Z axis motor, 38 laser recognition device, 40 operation section, 42 display section, 60 control section, 61 storage section, 62 mounting head control section, 64 component supply control section, 66 image processing section, 80 electronic component, 80a connector type electronic component, 90a electronic component supply device, 96 support table, 98 tray, base section, 112 lock section, 122 insertion section, 124 lead wire, 130 fixing section, 132 movable part, 134 groove, 150 suction nozzle for connector, 152 base part, 154 sliding part, 156 guide shaft, 160 arm part (gripping claw), 162 telescopic adjustment mechanism, 164 coupling part, 166D cutting part, 170 spring part, 172 air pressure adjustment part, 180 air pressure supply part, 182 air flow path, 184 air cylinder part, 186 piston part, 190 fastening part, 202 tip part

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings. The present invention is not limited to the following embodiments for carrying out the invention (hereinafter, referred to as embodiments). The constituent elements in the following embodiments include elements that can be easily conceived by those skilled in the art, and elements that are within a so-called equivalent range such as substantially the same elements. Further, the constituent elements disclosed in the following embodiments may be appropriately combined.

An embodiment of an electronic component mounting apparatus according to the present invention will be described in detail below with reference to the accompanying drawings. The present invention is not limited to the embodiments. An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus for mounting a so-called insertion-type electronic component having a lead (insertion portion) and mounted on a substrate by inserting the lead into a substrate hole (insertion hole, hole) of the substrate, and a mounting-type electronic component mounted on the substrate without inserting the mounting-type electronic component into the insertion hole (substrate hole). Here, the insertion-type electronic component is mounted by inserting a lead into a hole formed in a substrate. An electronic component mounted on a substrate without being inserted into an insertion hole (substrate hole), for example, an SOP, a QFP, or the like, is used as a mounted electronic component. The electronic component mounting apparatus may have a function of mounting only an insertion type electronic component (lead type electronic component).

Next, the electronic component mounting apparatus 10 of the present embodiment will be explained. The electronic component mounting apparatus 10 is an apparatus capable of mounting both a mounting type electronic component mounted by mounting on a substrate and an insertion type electronic component (lead type electronic component) mounted by inserting a lead into an insertion hole of the substrate. Both the mount-type electronic component and the insertion-type electronic component may be mounted by 1 electronic component mounting device 10, or only one of the electronic components may be mounted by 1 electronic component mounting device 10. That is, the electronic component mounting apparatus 10 can mount both the mount-type electronic component and the insertion-type electronic component, and can be used for various applications depending on the design of the substrate to be manufactured and other electronic component mounting apparatuses.

Fig. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. The electronic component mounting apparatus 10 shown in fig. 1 is an apparatus for mounting an electronic component on a substrate 8. The electronic component mounting apparatus 10 includes: the apparatus includes a housing 11, a substrate transport unit 12, component supply units 14f and 14r, mounting heads 15f and 15r, an XY moving mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, a component storage unit 19, a control device 20, an operation unit 40, and a display unit 42. The XY-moving mechanism 16 includes X-axis driving units 22f and 22r and a Y-axis driving unit 24. Here, as shown in fig. 1, the electronic component mounting apparatus 10 of the present embodiment includes component supply units 14f and 14r, mounting heads 15f and 15r, and X-axis drive units 22f and 22r on the front side and the rear side with respect to the substrate transport unit 12 as the center. In the electronic component mounting apparatus 10, the component supply unit 14f, the mounting head 15f, and the X-axis drive section 22f are disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14r, the mounting head 15r, and the X-axis drive section 22r are disposed on the rear side of the electronic component mounting apparatus 10. Hereinafter, the component supply units 14f and 14r, the mounting heads 15f and 15r, and the 2X-axis drive units 22f and 22r will be collectively referred to as the component supply units 14, the mounting heads 15, and the X-axis drive units 22 without particularly distinguishing them from each other.

The structure of the substrate 8 is not particularly limited as long as it is a member for mounting electronic components. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface thereof. Solder as a bonding member for bonding the wiring pattern of the plate-like member and the electronic component by reflow is attached to the surface of the wiring pattern provided on the substrate 8. In addition, through holes (insertion holes, substrate holes) for inserting electronic components are also formed in the substrate 8.

The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the figure. The substrate conveying unit 12 includes: a guide rail extending in the X-axis direction; and a conveying mechanism for supporting the substrate 8 and moving the substrate 8 along the guide rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the guide rail by the transport mechanism in a direction in which the surface to be mounted of the substrate 8 faces the mounting head 15. The substrate transfer unit 12 transfers the substrate 8 supplied from the device for supplying the electronic component mounting apparatus 10 to a predetermined position on the guide rail. The mounting head 15 mounts the electronic component on the surface of the substrate 8 at the predetermined position. The substrate transfer unit 12 carries the electronic components on the substrate 8 transferred to the predetermined position, and then transfers the substrate 8 to a device for performing the next step. Various configurations can be used as the conveyance mechanism of the substrate conveyance unit 12. For example, a guide rail arranged along the conveyance direction of the substrate 8 and an endless belt rotating along the guide rail are combined, and the substrate 8 is conveyed while being mounted on the endless belt. This is a conveyor belt type conveying mechanism in which the conveying mechanism is integrated.

The electronic component mounting apparatus 10 is provided with a component supply unit 14f on the front side and a component supply unit 14r on the rear side. The front component supply unit 14f and the rear component supply unit 14r can hold a plurality of electronic components mounted on the substrate 8 and supply the electronic components to the mounting head 15. That is, there is an electronic component supply device that supplies the electronic component to the holding position in a state where the electronic component can be held (sucked or held) by the mounting head 15.

Fig. 2 is a schematic diagram showing a schematic configuration of an example of the component supply unit. As shown in fig. 2, the front component supply unit 14f is constituted by a plurality of electronic component supply devices (hereinafter, simply referred to as "component supply devices") 90 and 90a held in a support table (housing) 96. These electronic component supply devices 90 and 90a have different mechanisms for holding electronic components to be mounted and different supply mechanisms depending on the type of the electronic components. The component supply unit 14 may include a plurality of electronic component supply devices 90 and 90a of the same type. Further, the component supply unit 14 is preferably configured to be detachable from the apparatus main body. The support table 96 can be equipped with other devices (for example, a measuring device, a camera, and the like) than the component supply devices 90 and 90 a.

The component supplying device 90 supplies the radial lead type electronic components to the mounting head 15 by using an electronic component holding tape configured by attaching a plurality of leads of the radial lead type electronic components to a holding tape. The component supplying device 90 is a holding tape feeder that holds an electronic component holding tape, conveys the held electronic component holding tape, and moves the held radial lead-type electronic component to a holding area (suction position, holding position) where the electronic component can be held by the suction nozzle of the mounting head 15. In addition, the component supplying device 90 can hold the radial lead type electronic component, in which the leads are fixed by the holding tape, at a predetermined position by cutting and separating the leads of the radial lead type electronic component moved to the holding area, and can hold (suck and hold) the radial lead type electronic component by the suction nozzle of the mounting head 15.

the plurality of component supply devices 90 may supply different types of electronic components, or may supply a plurality of types of electronic components. The component feeding device 90 is not limited to a holding tape feeder that sticks and feeds a plurality of radial lead type electronic components to a holding tape, and may feed a plurality of types of lead type electronic components using a bowl type feeder, an axial direction feeder, a lever type feeder, a tray type feeder, or the like.

the electronic component supply device 90a supplies the electronic component to the mounting head 15 by using an electronic component holding tape configured by attaching a chip-type electronic component to be mounted on a substrate to a holding tape. Further, the electronic component holding tape forms a plurality of storage chambers in which the electronic components are stored on the holding tape. The electronic component supplying device 90a is a holding tape feeder that holds an electronic component holding tape, conveys the held electronic component holding tape, and moves a storage chamber to a holding area where the electronic component can be sucked by a suction nozzle of the mounting head 15. Further, by moving the storage chamber to the holding area, the electronic component stored in the storage chamber can be exposed at a predetermined position, and the electronic component can be sucked and held by the suction nozzle of the mounting head 15. The electronic component feeding device 90a is not limited to the holding tape feeder, and various chip component feeders that feed chip-type electronic components can be used. As the chip component feeder, for example, a bar feeder or a bulk feeder can be used.

Next, a connector-type electronic component, which is an example of the rear-side component supply unit 14r and the electronic component supplied from the rear-side component supply unit 14r, will be described with reference to fig. 3 to 6. Fig. 3 is a schematic diagram showing another example of the component supply unit. Fig. 4 is a perspective view showing an example of a connector-type electronic component. Fig. 5 is a front view of the connector-type electronic component shown in fig. 4. Fig. 6 is an enlarged oblique view showing a locking portion of the connector-type electronic component shown in fig. 4.

The component supply unit 14r on the rear side is a tray type feeder that holds a plurality of trays, and selects a tray arranged at a position where an electronic component is supplied, in accordance with the electronic component to be mounted. The rear component supply unit 14r has a plurality of trays 98 shown in fig. 3. The tray 98 mounts a plurality of connector-type electronic components 80 a. In fig. 3, the connector-type electronic components 80a are mounted, but the electronic components mounted on the rear-side component supply unit 14r may be different for each tray. The rear component supply unit 14r can supply different types of electronic components by changing the electronic components to be placed on each tray, and switching the trays arranged at the positions where the electronic components are supplied.

Next, the connector-type electronic component 80a will be explained. The connector-type electronic component 80a shown in fig. 4 to 6 is a DIMM connector into which a DIMM (dual Inline Memory module) is inserted. The connector-type electronic component 80a includes a base portion 110 having one direction in the longitudinal direction, and locking portions 112 provided at both ends of the base portion 110 in the longitudinal direction. The base portion 110 has an insertion portion 122 to which a lead wire 124 is connected. The insertion portion 122 is for insertion into an electronic component (memory module) inserted in the connector-type electronic component 80 a. The insertion portion 122 is a groove extending in the longitudinal direction of the base portion 110, and a circuit in contact with the electronic component is formed inside the groove. The lead 124 is disposed on the surface opposite to the surface on which the insertion portion 122 is formed. In fig. 4 to 6, the lead 124 is shown only in a part of the bottom surface of the base portion 110, but the lead 124 is arranged over the entire surface. The lock portion 112 has a fixed portion 130 and a movable portion 132. The fixing portion 130 is fixed to the base portion 110. The movable portion 132 is movable relative to the fixed portion 130, and a groove 134 is formed in a surface of the base portion 110 on the center side (the center side of the connector-type electronic component 80 a). If an electronic component to be inserted is inserted, the movable portion 132 moves together with the inserted electronic component. Specifically, the movable portion 132 moves in a direction in which the inserted electronic component is fastened. The groove 134 is a mechanism for guiding the inserted electronic component, and is a part of the insertion portion 122. That is, the connector type electronic component 80a supports the electronic component on the side of insertion by inserting a part of the side surface and the bottom surface of the electronic component on the side of insertion into the groove.

The connector-type electronic component 80a is mounted on the substrate 8 by inserting the leads 124 into holes formed in the substrate 8. That is, the substrate 8 is inserted with the insertion portion 122 facing upward in the vertical direction. In addition, when connector-type electronic component 80a is inserted along insertion portion 122, movable portion 132 moves, and movable portion 132 that has moved to the predetermined fixed position is supported so as not to move with respect to fixed portion 130. The mechanism for inserting the connector-type electronic component 80a will be described later.

The connector type electronic component 80a is not limited to the DIMM connector. The connector-type electronic component 80a may have only a lead inserted into the substrate 8 and an insertion portion into which another component is inserted. Further, the insertion portion 122 includes a groove 134 formed at a face of the center side of the lock portion 112. As the connector-type electronic component 80a, a connector for a flat cable into which a flat cable is inserted is also exemplified.

In the present embodiment, the rear component supply unit 14r is provided as a device for supplying electronic components using a tray, but is not limited thereto. The electronic component mounting apparatus 10 may be provided with a device for supplying electronic components by the tray 98 in the component supply unit 14f on the front side. In addition, although the case where the component supply unit 14 of the present embodiment supplies the connector-type electronic components 80a by using the tray has been described, the supply may be performed by a method other than the tray. The component supply unit 14 may be arranged with a mechanism for supplying the electronic components by the tray and a mechanism for supplying the electronic components by the holding tape feeder as shown in fig. 2. For example, as the rear-side component supply unit 14r, both a mechanism for supplying electronic components by a tray and a mechanism for supplying electronic components by a holding tape feeder may be arranged.

The mounting head 15 is a mechanism for holding (sucking or holding) the electronic component held by the component supply unit 14f or the electronic component held by the component supply unit 14r by a suction nozzle, and mounting the held electronic component on the substrate 8 moved to a predetermined position by the substrate transfer unit 12. When the component supply unit 14r includes the electronic component supply device 90a, the mounting head 15 is a mechanism for mounting (mounting) the chip-type electronic component (mounted electronic component) held in the electronic component supply device 90a on the substrate 8. The structure of the mounting head 15 will be described later. Further, the chip-type electronic component (mounted-type electronic component) is a leadless electronic component having no lead inserted into an insertion hole (through hole) formed in the substrate 8. As the mounted electronic component, the SOP, QFP, and the like are exemplified as described above. When the chip-type electronic component is mounted on the substrate, it is not necessary to insert the lead into the insertion hole.

the XY moving mechanism (also referred to as a mounting head moving mechanism) 16 is a moving mechanism that moves the mounting heads 15f and 15r in the X-axis direction and the Y-axis direction in fig. 1, that is, on a plane parallel to the surface of the substrate 8. The XY-moving mechanism 16 has X-axis driving units 22f and 22r and a Y-axis driving unit 24. The X-axis driving unit 22f is coupled to the mounting head 15f and moves the mounting head 15f in the X-axis direction. The X-axis driving unit 22r is coupled to the mounting head 15r and moves the mounting head 15r in the X-axis direction. The Y-axis driving unit 24 is coupled to the mounting head 15 via the X-axis driving unit 22, and moves the mounting head 15f in the Y-axis direction by moving the X-axis driving unit 22f in the Y-axis direction. The Y-axis driving unit 24 moves the mounting head 15r in the Y-axis direction by moving the X-axis driving unit 22r in the Y-axis direction. The XY moving mechanism 16 can move the mounting head 15f to a position facing the substrate 8 or a position facing the component supply unit 14f by moving the mounting head 15 in the XY axis direction.

The XY moving mechanism 16 can move the mounting head 15r to a position facing the substrate 8 or a position facing the component supply unit 14r by moving the mounting head 15r in the XY axis direction.

further, the XY-moving mechanism 16 moves the mounting head 15 to adjust the relative position between the mounting head 15 and the substrate 8. This enables the electronic component held by the mounting head 15 to be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted on an arbitrary position on the surface of the substrate 8. That is, the XY-moving mechanism 16 is a conveying unit that moves the mounting heads 15f and 15r on a horizontal plane (XY plane) and conveys the electronic components in the electronic component supply devices 90 and 90a located in the component supply units 14f and 14r to predetermined positions (mounting position and mounting position) of the substrate 8.

As the X-axis driving unit 22, various mechanisms for moving the mounting head 15 in a predetermined direction can be used. As the Y-axis driving unit 24, various mechanisms for moving the X-axis driving unit 22 in a predetermined direction can be used. Examples of the mechanism for moving the object in the predetermined direction include a linear motor, a rack and pinion, a conveying mechanism using a ball screw, and a conveying mechanism using a conveyor belt.

The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed at positions overlapping the movable region of the mounting head 15 in the XY plane and at positions lower than the mounting head 15 in the vertical direction in the Z direction. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transport unit 12 and the component supply unit 14 r.

The VCS unit 17 is an image recognition device, and includes a camera for capturing an image of the vicinity of the suction nozzle of the mounting head 15 and an illumination unit for illuminating an imaging area. The VCS unit 17 recognizes the shape of the electronic component sucked by the suction nozzle of the mounting head 15 and the holding state of the electronic component held by the suction nozzle. More specifically, if the mounting head 15 is moved to a position facing the VCS unit 17, the VCS unit 17 images the suction nozzle of the mounting head 15 from the lower side in the vertical direction, and analyzes the captured image to recognize the shape of the electronic component sucked by the suction nozzle and the holding state of the electronic component held by the suction nozzle. The VCS unit 17 is disposed on the substrate 8 side of the nozzle, and can image the surface of the electronic component facing the substrate 8 by imaging the electronic component held by the nozzle from the substrate 8 side. The VCS unit 17 transmits the acquired information to the control device 20.

The replacement nozzle holding mechanism 18 is a mechanism for holding a plurality of types of nozzles. The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles in a state where the mounting head 15 can be detachably replaced. Here, the nozzle replacement holding mechanism 18 of the present embodiment holds: a suction nozzle for holding the electronic component by suction; and a grip nozzle that holds the electronic component by gripping. The mounting head 15 is driven by changing the suction nozzle mounted by the replacement nozzle holding mechanism 18 and supplying air pressure to the mounted suction nozzle, and thereby can hold the electronic component to be held under appropriate conditions (suction or gripping).

The component storage unit 19 is a box that stores electronic components that are not mounted on the substrate 8 and held by the mounting head 15 by suction nozzles. That is, the electronic component mounting apparatus 10 is a disposal box for disposing of electronic components that are not mounted on the substrate 8. In the electronic component mounting apparatus 10, when there is an electronic component that is not mounted on the substrate 8 among the electronic components held by the mounting head 15, the mounting head 15 is moved to a position facing the component storage section 19, and the held electronic component is released, whereby the electronic component is put in the component storage section 19.

The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. The operation unit 40 is an input device for an operator to input an operation. The operation unit 40 is exemplified by a keyboard, a mouse, a touch panel, and the like. The operation unit 40 transmits the detected various inputs to the control device 20. The display unit 42 is a screen for displaying various information to the operator. The display unit 42 includes a touch panel, an image monitor, and the like. The display unit 42 displays various images based on the image signal input from the control device 20.

in the electronic component mounting apparatus 10 of the present embodiment, it is preferable that 2 substrate transfer units 12 are arranged in parallel. If the electronic component mounting apparatus 10 alternately moves the 2 substrates 8 to the electronic component mounting positions by the 2 substrate transfer units 12 and alternately carries out component mounting by the 2 mounting heads 15, it is possible to efficiently mount electronic components on the substrates 8.

Next, the structure of the mounting head 15 will be described with reference to fig. 7 and 8. Fig. 7 is a schematic diagram showing a schematic configuration of the mounting head 15 of the electronic component mounting apparatus. Fig. 8 is a schematic diagram showing a schematic configuration of the mounting head 15 of the electronic component mounting apparatus. Fig. 7 also shows various control units of the control device 20 that controls the electronic component mounting device 10, and 1 component supply device 90 of the component supply unit 14 r.

As shown in fig. 7 and 8, the mounting head 15 includes: a mounting head body 30, a camera 36, a height sensor 37, and a laser recognition device 38. As shown in fig. 7, the electronic component mounting apparatus 10 includes a control unit 60, a mounting head control unit 62, a component supply control unit 64, and an image control unit 66. The control unit 60, the mounting head control unit 62, the component supply control unit 64, and the image processing unit 66 are part of the control device 20. The electronic component mounting apparatus 10 is connected to a power supply, and supplies power supplied from the power supply to each unit using the control unit 60, the mounting head control unit 62, the component supply control unit 64, the image processing unit 66, and various circuits. The control unit 60, the mounting head control unit 62, the component supply control unit 64, and the image processing unit 66 are described later

The electronic component supply device 90 exposes the main body of the electronic component 80 with the leads held on the electronic component holding tape (radial component holding tape) upward. Further, an aluminum electrolytic capacitor is exemplified as the electronic component 80. In addition, as the electronic component 80, various electronic components with leads other than the aluminum electrolytic capacitor can be used. The electronic component supplying device 90 moves the electronic component 80 held by the electronic component holding tape to the holding area (suction area, grip area) by pulling out the electronic component holding tape and moving it. In the present embodiment, the vicinity of the front end of the component supplying device 90 in the Y-axis direction is a holding area for holding the electronic component 80 held on the electronic component holding tape by the suction nozzle of the mounting head 15. The configuration of the electronic component supply device 90 will be described later. In addition, as in the case of the electronic component supply device 90a, the predetermined position is a holding area in which the electronic component 80 held on the electronic component holding tape is held by the suction nozzle of the mounting head 15.

the mounting head main body 30 includes a mounting head support 31 for supporting each part, a plurality of suction nozzles 32, and a suction nozzle driving unit 34. In the mounting head main body 30 of the present embodiment, 6 suction nozzles 32 are arranged in a row as shown in fig. 8. The 6 suction nozzles 32 are arranged in a direction parallel to the X-axis. In addition, the suction nozzles 32 shown in fig. 8 are each provided with a suction nozzle that sucks and holds the electronic component 80.

the mounting head support 31 is a support member connected to the X-axis drive unit 22, and supports the suction nozzle 32 and the suction nozzle drive unit 34. The mounting head support 31 also supports the laser recognition device 38.

The suction nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The suction nozzle 32 has an opening 32a at the front end. The opening 32a is connected to the nozzle driving portion 34 via a hollow inside and a hollow of the nozzle supporting portion 33. The suction nozzle 32 sucks air from the opening 32a, thereby sucking and holding the electronic component 80 at the tip. The suction nozzles 32 are detachable from the nozzle support portion 33, and are stored (stocked) in the replacement nozzle holding mechanism 18 when not attached to the nozzle support portion 33. The nozzles 32 have openings 32a of different shapes and sizes. In the present embodiment, although the suction type nozzle having the opening 32a for sucking the electronic component 80 is shown, a grip type nozzle for holding the electronic component 80 by sandwiching the electronic component 80 with an arm portion operated by air pressure may be used.

The nozzle holding portion 33 is a mechanism for holding the nozzle 32 by a vertically lower end portion (tip), and includes, for example: a shaft that moves relative to the mounting head support 31 by the nozzle drive unit 34; and a socket connected to the suction nozzle 32. The shaft is a rod-like member and is disposed to extend in the Z-axis direction. The shaft supports a socket disposed at an end portion on a lower side in the vertical direction. The shaft is supported by the mounting head support 31 in a state in which the portion coupled to the socket can be moved in the Z-axis direction and rotated in the θ direction. Here, the Z axis is an axis orthogonal to the XY plane, and the Z axis is a direction orthogonal to the surface of the substrate 8. The θ direction is a direction parallel to the circumferential direction of a circle centered on the Z axis parallel to the direction in which the nozzle 32 is moved by the nozzle driving unit 34. The θ direction becomes the rotation direction of the suction nozzle 32. The shaft moves and rotates the portion connected to the socket in the Z-axis direction and the θ direction by the nozzle driving unit 34.

The nozzle driving unit 34 moves the nozzle 32 in the Z-axis direction by moving the nozzle holding unit 33 in the Z-axis direction, and sucks the electronic component 80 through the opening 32a of the nozzle 32. The nozzle driving unit 34 rotates the nozzle 32 in the θ direction by rotating the nozzle holding unit 33 in the θ direction at the time of mounting the electronic component 80 or the like.

The nozzle drive unit 34 includes a Z-axis motor 34a as a mechanism for moving the nozzle 32 in the Z-axis direction. In addition, the nozzle driving part 34 includes: a transmission belt coupled to a rotating portion of the Z-axis motor 34 a; a screw rod extending in the Z-axis direction and rotated by a transmission belt; and a screw screwed into the screw rod and fixed to the nozzle support portion 33. The nozzle drive unit 34 rotates a screw connected via a belt by a Z-axis motor 34a, and moves the screw screwed into the screw in the Z-axis direction. In the nozzle driving portion 34, a screw screwed into the screw is fixed to the nozzle supporting portion 33. The nozzle driving unit 34 rotates the screw by the Z-axis motor 34a, and moves the nozzle 32 in the Z-axis direction together with the nozzle support 33 to which the screw is fixed, thereby moving the axis of the opening 32a at the tip of the nozzle 32 in the Z-axis direction. In the nozzle driving unit 34, as a mechanism for rotating the nozzle 32 in the θ direction, for example, there is a mechanism including a motor and a transmission element connected to a shaft of the nozzle holding unit 33. The nozzle driving unit 34 transmits a driving force output from the motor to the shaft of the nozzle holding unit 33 by means of the transmission element, and rotates the shaft in the θ direction, so that the tip of the nozzle 32 also rotates in the θ direction.

The nozzle driving unit 34 is a suction mechanism that is a mechanism for sucking the electronic component 80 through the opening 32a of the nozzle 32, and includes, for example, the following components: an air tube connected to the opening 32a of the suction nozzle 32; a pump connected with the air pipe; and an electromagnetic valve for switching the opening and closing of the air pipe line. The nozzle driving unit 34 sucks air from the air pipe by a pump, and switches the opening and closing of the electromagnetic valve to switch whether or not air is sucked from the opening 32 a. The nozzle driving unit 34 opens the electromagnetic valve to suck air from the opening 32a, thereby causing the opening 32a to suck (hold) the electronic component 80, and closes the electromagnetic valve to cause the opening 32a not to suck air, thereby releasing the electronic component 80 sucked in the opening 32a, that is, bringing the electronic component 80 into a state of not being sucked in the opening 32a (a state of not being held).

In the mounting head 15 of the present embodiment, when holding the main body of the electronic component 80, a gripping nozzle (suction nozzle) described later is used when the upper surface of the main body has a shape that cannot be sucked by the suction nozzle 32. The holding suction nozzle can hold and release the main body of the electronic component 80 from above by opening and closing the movable piece with respect to the fixed piece by sucking and releasing air in the same manner as the suction nozzle. In addition, the mounting head 15 can replace the suction nozzle 32 driven by the suction nozzle driving unit 34 by performing a replacement operation by moving the suction nozzle 32 by the suction nozzle driving unit 34.

the imaging device 36 shown in fig. 8 is fixed to the mounting head support 31 of the mounting head body 30, and images an area facing the mounting head 15, for example, the substrate 8 on which the electronic component 80 is mounted, or the like. The imaging device 36 includes a camera and an illumination device, and obtains an image by the camera while illuminating a field of view by the illumination device. This makes it possible to capture images of the position facing the mounting head body 30, for example, various images of the substrate 8 and the component supply unit 14. For example, the imaging device 36 images BOC marks (hereinafter, simply referred to as BOCs) or through holes (insertion holes) formed on the surface of the substrate 8 as reference marks. Here, in the case of using a reference mark other than the BOC mark, an image of the reference mark is captured. The imaging device 36 is provided in 1 number with respect to 1 mounting head 15. In the imaging device 36, the camera is disposed parallel to the Z-axis direction, and performs imaging from a direction parallel to the Z-axis direction.

The height sensor 37 is fixed to the mounting head support 31 of the mounting head main body 30, and measures a distance between a region facing the mounting head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. As the height sensor 37, a laser sensor can be used, which includes: a light-emitting element which irradiates laser light; and a light receiving element for receiving the laser light reflected and returned at the opposite position, wherein the laser sensor measures the distance to the opposite part according to the time from the emission of the laser light to the reception of the laser light. The height sensor 37 detects the height of the facing portion, specifically, the electronic component 80, by processing the distance to the facing portion using the position of the height sensor and the position of the substrate 8 at the time of measurement. The control unit 60 may detect the height of the electronic component 80 based on the measurement result of the distance from the electronic component.

The laser beam recognition device 38 includes a light source 38a and a light receiving element 38 b. The laser identification device 38 is built into the carriage 50. As shown in fig. 7, the bracket 50 is connected to the lower side of the mounting head support 31, the substrate 8, and the component supply device 90. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating the electronic component 80 sucked by the suction nozzle 32 of the mounting head body 30 with laser light. Here, the state of the electronic component 80 refers to the shape of the electronic component 80, whether or not the electronic component 80 is sucked by the suction nozzle 32 in a correct posture, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b is disposed at a position in the Z-axis direction, i.e., at the same height as the light source 38a, and at a position facing the light source 38 a.

Next, a control function of the device configuration of the electronic component mounting device 10 will be described. As shown in fig. 7, the electronic component mounting apparatus 10 includes a control unit 60, a storage unit 61, a mounting head control unit 62, a component supply control unit 64, and an image processing unit 66 as the control device 20. Each of the various control units is composed of a CPU, a ROM, a RAM, and other components having an arithmetic processing function and a storage function. In the present embodiment, a plurality of control units are provided for convenience of explanation, but 1 control unit may be provided. When the control function of the electronic component mounting apparatus 10 is realized by 1 control unit, it may be realized by 1 arithmetic device or by a plurality of arithmetic devices.

The control unit 60 is connected to each unit of the electronic component mounting apparatus 10, and executes a stored program based on an input operation signal and information detected in each unit of the electronic component mounting apparatus 10, thereby controlling the operation of each unit. The control unit 60 controls, for example, a conveyance operation of the substrate 8, a driving operation of the mounting head 15 by the XY-moving mechanism 16, a shape detection operation by the laser recognition device 38, and the like. As described above, the control unit 60 sends various instructions to the mounting head control unit 62, and also controls the control operation of the mounting head control unit 62. The control unit 60 also controls the control operation of the component supply control unit 64.

The storage unit 61 is connected to the control unit 60, and has storage functions such as ROM and RAM. The storage unit 61 may be provided integrally with the control unit 60 or may be provided separately. The storage unit 61 stores data acquired from each unit by the control unit 60 and data calculated and calculated by the control unit 60. The storage unit 61 stores design drawing data including a through hole coordinate design value, a reference mark coordinate design value, and an electronic component mounting coordinate design value, shapes of various electronic components, suction conditions, correction conditions for suction processing, a production program, and the like. The storage unit 61 stores conditions, i.e., production conditions, for detecting the shape of the lead of the insertion-type electronic component having the lead, such as the radial lead-type electronic component, in association with the type of the insertion-type electronic component. The storage unit 61 also stores a program for controlling the operation (parameter acquisition process) when the generation condition is determined. The storage unit 61 may delete unnecessary data under the control of the control unit 60.

The mounting head control unit 62 is connected to the suction nozzle driving unit 34, various sensors arranged on the mounting head support 31, and the control unit 60, and controls the suction nozzle driving unit 34 and the operation of the suction nozzle 32. The mounting head control unit 62 controls the suction (holding)/release operation of the electronic component 80 by the suction nozzles 32, the rotation operation of each suction nozzle 32, and the movement operation in the Z-axis direction, based on the operation instruction supplied from the control unit 60 and the detection results of various sensors (for example, distance sensors). In addition, the mounting head control unit 62 also controls the nozzle replacement operation.

The component supply control unit 64 controls the supply operation of the electronic components 80 and 80a by the component supply units 14f and 14 r. The component supply controllers 64 may be provided in the component supply devices 90 and 90a, respectively, or all of the component supply devices 90 and 90a may be controlled by 1 component supply controller 64. For example, the component supply control unit 64 controls the operation of pulling out the electronic component holding tape (moving operation), the operation of cutting the lead, and the operation of holding the radial lead type electronic component by the component supply device 90. When the component supply unit 14 includes the component supply device 90a, the component supply control unit 64 controls the operation (moving operation) of pulling out the electronic component holding tape by the component supply device 90 a. The component supply control unit 64 executes various operations based on instructions from the control unit 60. The component supply controller 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape.

The image processing unit 66 controls the image capturing operation in the VCS unit 17 and processes the acquired image. The image processing unit 66 transmits information obtained by performing image processing and image information to the control unit 60. When acquiring an image of the insertion-type electronic component, the image processing unit 66 combines images captured at a plurality of positions having different distances from the insertion-type electronic component. That is, the image processing unit 66 obtains an image of the surface of the insertion-type electronic component on which the lead is formed by the all-focus recognition processing, and obtains information on the shape of the lead. The image processing unit 66 performs various image processing on the image acquired by the VCS unit 17. The image processing includes edge enhancement processing using 1-time (differential) filtering, smoothing processing using 2-time (differential) filtering, binarization processing, and the like. The processing performed by the control device 60 will be described later.

Here, in the above-described embodiment, the case where the suction nozzle is used as the nozzle attached to the mounting head 15 has been described, but the present invention is not limited to this. As the suction nozzle attached to the mounting head 15, a grip nozzle for gripping the electronic component can be used. The electronic component mounting apparatus 10 can appropriately hold the electronic component 80 by selecting the type of the holding nozzle for holding the electronic component 80 according to the type of the electronic component 80 to be held. Specifically, depending on the electronic component 80 to be held, it is possible to select whether to use the suction nozzle or the grip nozzle, and switch which nozzle is to be used among the respective kinds of nozzles, thereby enabling a wider variety of electronic components 80 to be mounted using 1 electronic component mounting apparatus.

Next, a nozzle (a connector nozzle, an electronic component transfer nozzle) used for inserting the connector-type electronic component 80a will be described with reference to fig. 9 to 11. The connector suction nozzle 150 is a suction nozzle for insertion of the connector-type electronic component 80 a. The connector nozzle 150 is attached to the nozzle support 33 of the mounting head 15, similarly to the nozzle 32. The connector nozzle 150 is held by the replacement nozzle holding mechanism 18 without being attached to the mounting head 15.

The connector nozzle 150 includes a base portion 152, a slide portion 154, a guide shaft 156, an arm portion 160, and a telescopic adjustment mechanism 162.

The base portion 152 is a base body of the connector nozzle 150, and is fixed to the nozzle support portion 33 when attached to the nozzle support portion 33. The base portion 152 has a coupling portion 164 and a D-cut portion 166. The coupling portion 164 is formed at an end portion that is vertically above the nozzle support portion 33 in a state where the base portion 152 is supported by the nozzle support portion. The coupling portion 164 is coupled to the nozzle support portion 33. The D-cut portion 166 is a disk from which a portion of the connector suction nozzle 150 protruding in the direction orthogonal to the Z axis is missing in a state of being supported by the nozzle support portion 33. The D-cut portion 166 is fixed to the base portion 152. The connector nozzle 150 can determine the posture of the connector nozzle 150 by detecting the position of the missing portion (notch) of the D-cut portion 166.

The slide portions 154 are disposed on 2 opposite side surfaces of the base portion 152, respectively. That is, the connector suction nozzle 150 has 2 sliding portions 154, and 1 sliding portion 154 faces one of 2 opposing side surfaces of the base portion 152, and 1 sliding portion 154 faces the other of the 2 opposing side surfaces of the base portion 152. The slide portion 154 is supported by a guide shaft 156 so as to be movable relative to the base portion 152.

The 2 guide shafts 156 are disposed corresponding to the 2 sliding portions 154, respectively. The guide shaft 156 is movably coupled to a side surface of the base portion 152 and fixed to the sliding portion 154. The guide shaft 156 has a predetermined direction as a direction in which the slide portion 154 moves relative to the base portion 152. The guide shaft 156 supports the sliding portion 154 in a state where the sliding portion 154 is movable relative to the base portion 152 in a direction orthogonal to the side surface of the base portion 152.

The 2 arm portions 160 are fixed to the 2 sliding portions 154, respectively. The arm portion 160 is fixed in a detachable state by a fastening portion 190 such as a bolt or a screw. The arm portion 160 is a wrist-shaped member extending in a direction orthogonal to the side surface of the base portion 152. The portion of the arm portion 160 farthest from the sliding portion 154 becomes the tip portion 202. The front end portion 202 is in contact with the groove 134 of the connector type electronic component 80 a.

the tip portion 202 of the arm portion 160 is provided vertically below the vertically lower end portion of the base portion 152. Specifically, in a state of being mounted on the nozzle support portion 33, the lower end portion in the vertical direction of the tip end portion 202 of the arm portion 160 is disposed at a lower side in the vertical direction by a distance h than the lower end portion in the vertical direction of the base portion 152. By providing the arm portion 160 below the base portion 152 in the vertical direction, the base portion 152 can be prevented from coming into contact with other devices and electronic components during the mounting operation of the electronic components. Thus, the connector-type electronic components can be mounted with high density.

The expansion/contraction adjustment mechanism 162 is disposed between the base portion 152 and the slide portion 154, and moves the slide portion 154 relative to the base portion 152 to change the distance from the base portion 152 to the distal end portion 202 of the arm portion 160. The telescopic adjustment mechanism 162 has a spring portion 170 and an air pressure adjustment portion 172. The spring portion 170 is disposed on a surface where the base portion 152 and the sliding portion 154 face each other, and has one end fixed to the base portion 152 and the other end fixed to the sliding portion 154. The spring portion 170 applies a force of an arrow 210, i.e., a force in a direction of separating the base portion 152 and the slide portion 154, to the slide portion 154.

The air pressure adjusting portion 172 applies a force opposite to the elastic force of the spring portion 170, that is, a force of the arrow 220, that is, a force in a direction in which the base portion 152 and the sliding portion 154 approach each other, to the sliding portion 154 by supplying air pressure. The air pressure adjusting portion 172 includes an air pressure supply portion 180, an air flow path 182, a cylinder portion 184, and a piston portion 186. The air pressure supply unit 180 is connected to the mounting head 15 and supplies air to the connector nozzle 150 through the nozzle support 33. The air pressure supply unit 180 is also used in mounting operations of electronic components in other types of suction nozzles.

The air flow path 182 is formed inside the base portion 152 and connected to the air flow path of the nozzle support portion 33. The air flow path 182 supplies air supplied from the air flow path of the nozzle support portion 33 from the side of the sliding portion 154 with respect to the piston portion 186 of the cylinder portion 184. The cylinder portion 184 is a cylindrical space formed inside the base portion 152. The piston portion 186 is disposed inside the cylinder portion 184 and connected to the guide shaft 156.

The air pressure adjusting portion 172 supplies air pressure from the air pressure supply portion 180, and applies a force of an arrow 220, that is, a force in a direction in which the base portion 152 and the sliding portion 154 approach each other, to the piston portion 186 of the cylinder portion 184.

The connector suction nozzle 150 has the above-described structure. The connector nozzle 150 adjusts the force in the direction in which the base portion 152 and the sliding portion 154 approach each other, which is applied by the air pressure adjusting portion 172, and adjusts the balance between the force applied from the spring portion 170, thereby adjusting the positions of the sliding portion 154 and the arm portion 160. That is, the force of the arrow 220 applied by the air pressure adjusting portion 172 is made larger than the force of the arrow 210 applied by the spring portion 170, whereby the base portion 152 and the sliding portion 154 can be moved in the direction of approaching each other. Further, the force of the arrow 220 applied by the air pressure adjusting portion 172 is made smaller than the force of the arrow 210 applied by the spring portion 170, so that the base portion 152 and the slide portion 154 are moved in the direction of being separated from each other. As described above, by moving the sliding portion 154, the distance between the distal end portions 202 of the arm portions 160 fixed to the sliding portion 154 can be adjusted. The connector nozzle 150 restricts the moving range of the distance between the base portion 152 and the slide portion 154 to a predetermined range by the guide shaft 156, specifically, the piston portion 186. That is, the movable range of the sliding portion 154 connected via the guide shaft 156 can be limited by the structure that limits the movable range of the piston portion 186 in the cylinder 184.

Next, the operation of each part of the electronic component mounting apparatus will be described. The operations of the respective parts of the electronic component described below can be executed by controlling the operations of the respective parts based on the control device 20.

Fig. 12 is a flowchart showing an example of the operation of the electronic component mounting apparatus. The overall processing operation of the electronic component mounting apparatus 10 will be described with reference to fig. 12. The processing shown in fig. 12 is executed by the control device 20 controlling each unit. The electronic component mounting apparatus 10 reads the production program as step S52. The production program is generated by a dedicated production program generation device, or is generated by the control device 20 based on various input data.

The electronic component mounting device 10 detects the state of the device as step S54 after reading the production program by step S52. Specifically, the configuration of the component supply units 14f and 14r, the type of electronic component to be loaded, the type of nozzle 32 to be prepared, and the like are detected. The electronic component mounting apparatus 10 detects the state of the apparatus in step S54, and after the preparation is completed, the electronic component mounting apparatus is loaded on the substrate 8 in step S56. The electronic component mounting apparatus 10 carries the substrate 8 in step S56, and after the substrate 8 is disposed at a position where the electronic component is to be mounted, mounts the electronic component on the substrate 8 as step S58. After the electronic component mounting apparatus 10 completes the mounting of the electronic component in step S58, the substrate 8 is sent out as step S60. After the electronic component mounting apparatus 10 has sent out the substrate 8 in step S60, the end of production is determined as step S62. If it is determined in step S62 that the production is not completed (No), the electronic component mounting apparatus 10 proceeds to step S56, and executes the processing from step S56 to step S62. That is, based on the production program, the process of mounting the electronic components on the substrate 8 is performed. When it is determined in step S62 that the production is completed (Yes), the electronic component mounting apparatus 10 ends the present process.

In the above-described manner, the electronic component mounting apparatus 10 reads the production program, performs various settings, and then mounts the electronic components on the substrate, thereby manufacturing the substrate on which the electronic components are mounted. The electronic component mounting apparatus 10 is configured to mount a lead-type electronic component having a main body and leads connected to the main body as an electronic component on a substrate, and specifically, to mount the electronic component on the substrate by inserting the leads into holes (insertion holes) formed in the substrate.

Fig. 13 is a flowchart showing an example of the operation of the electronic component mounting apparatus. The processing operation shown in fig. 13 is an operation after the substrate is loaded, until the mounting of the electronic component on the substrate is completed. The processing operation shown in fig. 13 is executed by the control unit 60 controlling the operation of each unit.

The control unit 60 sends the substrate 8 as step S102. Specifically, the control unit 60 transports the substrate to be mounted with the electronic component to a predetermined position by the substrate transport unit 12. After the substrate is loaded in step S102, the control unit 60 performs holding and moving as step S104. The holding movement (suction movement) is a processing operation of moving the mounting head main body 30 until the suction nozzle 32 moves to a position facing the electronic component located in the holding area of the component supply unit 14.

After the holding movement in step S104, the control unit 60 lowers the suction nozzle 32 in step S106. That is, the control unit 60 moves the suction nozzle 32 downward to a position where the electronic component can be held (sucked and held). After the nozzle 32 is lowered in step S106, the control unit 60 holds the electronic component by the nozzle 32 in step S108, and raises the nozzle 32 in step S110. The control unit 60 raises the nozzle to a predetermined position in step S110, and then performs the inspection movement in step S112. Specifically, the electronic component 8 is moved to a position where the shape of the electronic component is detected. Specifically, to a position opposite to the VCS unit 17. Depending on the type of the electronic component, the position of the suction nozzle 32 may be moved to move the electronic component to the measurement position of the laser recognition device 38. When the electronic component is moved to the position where the electronic component is inspected, the control unit 60 detects the shape of the electronic component sucked by the suction nozzle 32 as step S114. The processing of step S114 will be described later. Further, when the shape of the electronic component is detected in step S114 and it is determined that the held electronic component cannot be mounted, the control unit 60 discards the electronic component and again sucks the electronic component.

After the shape of the electronic component is detected in step S114, the control unit 60 performs mounting movement, that is, a processing operation of moving the electronic component sucked by the nozzle 32 to a position facing a mounting position (mounting position) of the substrate 8 in step S116, lowers the nozzle 32 in step S118, performs component mounting (component mounting) in step S120, that is, a processing operation of releasing the electronic component from the nozzle 32, and raises the nozzle 32 in step S122. That is, the control unit 60 executes the above-described mounting process in the processing operation from step S112 to step S120.

When the suction nozzle 32 is raised in step S122, the control unit 60 determines in step S124 whether or not the mounting of all the components is completed, that is, whether or not the mounting process of the predetermined electronic component to be mounted on the substrate 8 is completed. When it is determined in step S124 that the mounting of all the components is not completed (No), that is, that a predetermined electronic component to be mounted remains, the control unit 60 proceeds to step S104 to execute a processing operation of mounting the next electronic component on the substrate 8. As described above, the control unit 60 repeats the above processing operations until all the components are mounted on the substrate 8. When the control unit 60 determines in step S124 that the mounting of all the components is completed (Yes), it ends the present process.

Next, a description will be given of processing operations to be executed when a connector-type electronic component is mounted on a substrate as an electronic component, specifically, when a connector nozzle 150 is provided as a nozzle and a connector-type electronic component is set as an insertion target component, with reference to fig. 14 to 16. Fig. 14 to 15 are flowcharts each showing an example of an operation of the electronic component mounting apparatus. Fig. 16 is an explanatory view for explaining an operation of the electronic component mounting apparatus. The processing operations shown in fig. 14 to 15 are executed by the control unit 60 controlling the operations of the respective units.

the control unit 60 determines whether or not the connector-type electronic component 80a is mounted (step S202). That is, the control unit 60 determines whether or not the electronic component to be mounted on the lower surface includes the connector-type electronic component. When determining that the connector-type electronic component is not mounted (No at step S202), the control unit 60 determines whether or not the nozzle needs to be replaced (step S204). When it is determined that the nozzle needs to be replaced (Yes at step S204), the control unit 60 replaces the nozzle mounted on the nozzle support 33 of the mounting head 15 by the replacement nozzle holding mechanism 18 (step S206). When it is determined that the nozzle replacement is not necessary (No at step S204), or when the nozzle mounted on the nozzle support portion 33 is replaced by the nozzle-replacement holding mechanism 18, the control portion 60 mounts the electronic component (step S208). Here, steps S204 to S208 are the same operations as those performed when electronic components other than the connector-type electronic component are mounted.

When it is determined that the connector-type electronic component 80a is to be mounted (Yes at step S202), the control unit 60 determines whether or not the mounting of the connector nozzle 150 is completed (step S212). That is, it is determined whether or not the connector nozzle 150 is mounted on the nozzle support 33 of the mounting head 15. When determining that the connector nozzle 150 is not mounted (No at step S212), the control unit 60 replaces the nozzle mounted on the nozzle support 33 of the mounting head 15 with the connector nozzle 150 held by the replacement nozzle holding mechanism 18 (step S214). When it is determined that the nozzle replacement is completed (Yes at step S212), or when the nozzle mounted on the nozzle support portion 33 is replaced, the control portion 60 mounts the connector-type electronic component 80a using the connector nozzle 150 (step S216).

Next, an operation of mounting the connector-type electronic component 80a by the connector suction nozzle 150 will be described with reference to fig. 15. The controller 60 supplies air to contract the arm 160 (step S220). Specifically, by supplying air from the air pressure supply unit 180, the piston 186 is biased toward the center of the base 152, and the slide 154 and the arm 160 are moved toward the base 152. The electronic component mounting apparatus 10 reduces the distance between the leading end portions 202 of the arm portions 160 as compared with the interval between the grooves 134 of the connector-type electronic component 80a by contracting the arm portions 160.

After retracting the arm 160, the controller 60 moves the connector nozzle 150 to the holding position of the electronic component supply device (component supply unit 14r) (step S222). That is, the controller 60 moves the connector nozzle 150 mounted on the mounting head 15 to a position on the component supply unit 14r where the connector-type electronic component 80a is placed. Here, as shown in fig. 16, the controller 60 moves the connector nozzle 150 mounted on the mounting head 15 to a position where a line connecting the distal end portions 202 and a line connecting the grooves 134 overlap each other. The controller 60 further moves the connector nozzle 150 downward in the vertical direction so that the tip 202 and the groove 134 face each other.

After moving the connector nozzle 150 to the holding position of the electronic component supply device, the control unit 60 stops the supply of air, and extends the arm 160 to hold the connector-type electronic component 80a by the connector nozzle 150 (step S224). That is, the supply of air is stopped, the arm 160 is extended in the direction in which the distance between the distal end portions 202 is widened by the force of the spring portion 170, the groove 134 is brought into contact with the distal end portion 202, and the distal end portion 202 is biased in the direction in which the groove 134 is pressed, whereby the connector-type electronic component 80a is held by the connector suction nozzle 150.

After holding the electronic component by the suction nozzle, the control unit 60 moves the mounting position of the electronic component on the substrate to mount the electronic component on the substrate (step S226). That is, the leads 124 of the connector-type electronic component 80a are inserted into the holes of the substrate. At this time, the controller 60 preferably moves the connector suction nozzle 150 by a predetermined distance in the vertical direction with respect to the mounting position of the connector-type electronic component 80 a. This presses the connector-type electronic component 80a against the substrate, and the connector-type electronic component 80a can be more reliably mounted on the substrate.

after mounting the electronic component on the board, the controller 60 supplies air to contract the arm 160 and detach the electronic component from the nozzle (step S228). That is, the distance between the distal end portions 202 is shorter than the distance between the grooves 134, and the distal end portions 202 and the grooves 134 are separated from each other.

The electronic component mounting apparatus 10 performs the above-described process, and inserts the tip portion 202 into the groove 134 formed on the surface of the connector type electronic component 80a facing the center side, and biases the arm portion 160 toward the surface of the connector type electronic component 80a facing the center side, thereby holding the connector type electronic component 80 a. Thereby, the electronic component mounting device 10 can mount the connector-type electronic component 80a on the substrate 8 using the connector suction nozzle 150. As described above, the connector-type electronic component 80a can be mounted on the board 8 using the connector suction nozzle 150, and the connector-type electronic component 80a can also be mounted using the electronic component mounting apparatus 10 that mounts various electronic components. Thus, the number of electronic components that can be mounted by the electronic component mounting device 10 can be increased only by replacing the suction nozzle.

further, as shown in the present embodiment, the expansion/contraction adjusting mechanism 162 of the electronic component mounting apparatus 10 can appropriately move the arm portion 160 by combining the spring portion 170 and the air pressure adjusting portion 172, wherein the spring portion 170 biases the base portion 152 and the slide portion 154 in the direction of separating from each other, and the air pressure adjusting portion 172 biases the base portion 152 and the slide portion 154 in the direction of approaching to each other by adjusting the air pressure.

The air pressure adjusting portion 172 of the present embodiment biases the base portion 152 and the sliding portion 154 in the direction of approaching by supplying air, that is, by supplying positive pressure, but may bias the base portion 152 and the sliding portion 154 in the direction of approaching by sucking air, that is, by supplying negative pressure. When air is sucked, an opening for supplying air from the air pressure supply portion 180 to the cylinder portion is provided on the surface of the piston portion 186 on the side away from the slide portion 154.

The expansion/contraction adjusting mechanism 162 of the electronic component mounting apparatus 10 can also move the arm portion 160 appropriately by combining the spring portion 170 and the air pressure adjusting portion 172, wherein the spring portion 170 biases the base portion 152 and the slide portion 154 in the direction of approaching each other, and the air pressure adjusting portion 172 biases the base portion 152 and the slide portion 154 in the direction of separating from each other by adjusting the air pressure. In this case, the air pressure adjusting portion 172 may be biased in the direction in which the base portion 152 and the sliding portion 154 are separated by supplying air, that is, by supplying positive pressure, or may be biased in the direction in which the base portion 152 and the sliding portion 154 are separated by sucking air, that is, by supplying negative pressure.

The arm 160 may be moved by a combination of a spring and air pressure in the telescopic adjustment mechanism 162.

Further, the connector suction nozzle 150 is provided with the fastening portion 190 so that the arm portion 160 is detachable from the slide portion 154, and the arm portion 160 can be replaced. This allows the arm portion 160 to be replaced according to the connector-type electronic component 80a to be mounted, and 1 unit such as the base portion 152 and the slide portion 154 can be effectively used.

In the above embodiment, the movement amount can be increased by providing the sliding portions 154 on both sides of the base portion 152 and providing a mechanism for moving the base portion on both sides. The structure of the connector nozzle 150 is not limited to this. The base portion 152 may be provided with a slide portion 154 on one side and a fixed arm portion 160 on the other side.

Claims

1. an electronic component transfer nozzle which is mounted on an electronic component mounting apparatus and holds a connector-type electronic component, the connector-type electronic component comprising: a first base part; locking parts provided at both ends of the first base part; a lead wire; and an insertion portion into which the plate-like member is inserted,

The electronic component transfer nozzle is characterized by comprising:

A second base part coupled to a mounting head of the electronic component mounting device;

A guide shaft coupled to a side surface of the second base part;

A slide part coupled to the guide shaft and movable relative to the second base part;

An arm portion fixed to the slide portion and provided with a distal end portion that is in contact with the connector-type electronic component at a portion farthest from the slide portion; and

A telescopic adjustment mechanism disposed between the second base portion and the sliding portion, for moving the sliding portion relative to the second base portion and changing a distance from the second base portion to the distal end portion,

The tip portion is inserted into a groove formed on a surface of the locking portion of the connector type electronic component facing the center side, and the arm portion is biased toward the surface of the locking portion of the connector type electronic component facing the center side, thereby holding the connector type electronic component.

2. The electronic component transfer nozzle according to claim 1,

the telescopic adjustment mechanism includes a spring portion that biases the second base portion in a direction in which the second base portion and the slide portion are separated from each other, and an air pressure adjustment portion that biases the second base portion in a direction in which the second base portion and the slide portion approach each other by adjusting air pressure,

the air pressure supplied from the air pressure adjusting unit is adjusted, and the arm unit is switched between a contracted state and an extended state.

3. The electronic component transfer nozzle according to claim 2,

The air pressure adjusting portion supplies air to bias the second base portion and the sliding portion in a direction in which the second base portion and the sliding portion approach each other.

4. The electronic component transfer nozzle according to claim 2,

The air pressure adjusting portion draws air to bias the second base portion and the sliding portion in a direction in which the second base portion and the sliding portion approach each other.

5. The electronic component transfer nozzle according to claim 1,

The telescopic adjustment mechanism includes a spring portion that biases the second base portion and the slide portion in a direction in which the spring portion approaches the slide portion, and an air pressure adjustment portion that biases the second base portion and the slide portion in a direction in which the air pressure adjustment portion separates the spring portion from the slide portion,

6. The electronic component transfer nozzle according to any one of claims 1 to 5,

The tip end portion of the arm portion is provided below the end portion of the second base portion on the lower side in the vertical direction.

7. The electronic component transfer nozzle according to any one of claims 1 to 5,

the arm portion is detachable from the slide portion.

8. The electronic component transfer nozzle according to any one of claims 1 to 5,

The slide portion and the arm portion are disposed on 2 opposing surfaces of the second base portion.

9. An electronic component mounting apparatus, comprising:

The electronic component transfer nozzle of any one of claims 1 to 8;

A substrate conveying unit that conveys a substrate;

An electronic component supply device that supplies a connector-type electronic component having a lead and an insertion portion into which a plate-shaped component is inserted;

a mounting head having a nozzle driving section for driving the electronic component transfer nozzle, holding the connector type electronic component by the electronic component transfer nozzle, transferring the electronic component from the electronic component supply device to the substrate, and mounting the connector type electronic component on the substrate;

A mounting head moving mechanism that moves the mounting head; and

And a control device provided with a mounting head control unit for controlling the operation of the mounting head.