CN103249293B - Electronic component mounting apparatus, electronic component mounting system and electronic component mounting method - Google Patents

Electronic component mounting apparatus, electronic component mounting system and electronic component mounting method Download PDF

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Publication number
CN103249293B
CN103249293B CN201310049299.5A CN201310049299A CN103249293B CN 103249293 B CN103249293 B CN 103249293B CN 201310049299 A CN201310049299 A CN 201310049299A CN 103249293 B CN103249293 B CN 103249293B
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China
Prior art keywords
electronic
unit
lead
electronic unit
suction nozzle
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CN201310049299.5A
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CN103249293A (en
Inventor
伊藤直也
齐藤乐
伊藤公宏
藤本和弥
儿玉裕介
木村光
伊势谷和宏
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Juki Corp
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Juki Corp
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Priority claimed from JP2012042362A external-priority patent/JP5925523B2/en
Application filed by Juki Corp filed Critical Juki Corp
Priority to CN201710062915.9A priority Critical patent/CN106879245A/en
Publication of CN103249293A publication Critical patent/CN103249293A/en
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Publication of CN103249293B publication Critical patent/CN103249293B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The present invention provides a kind of electronic component mounting apparatus, electronic component mounting system and electronic component mounting method, can efficiently and accurately install lead-type electronic-part.It has：Electronic part feeder will be supplied with electronic component body and with the lead-type electronic-part of the lead of main body connection to holding position；Holder main body, has absorption suction nozzle or grasping suction nozzle, the suction nozzle driving portion and boarded head supporter of the main body for the electronic unit for keeping supplying from electronic part feeder, which carries out driving and rotation driving, and supply air pressure up and down；Control unit controls their action；And state detecting section, the state of its lead-type electronic-part to being kept by suction nozzle is detected, control unit is in the state of the lead-type electronic-part kept based on detected by state detecting section, suction nozzle, in the case of judging that its lead state meets condition, which is inserted into substrate.

Description

Electronic component mounting apparatus, electronic component mounting system and electronic unit installation Method
Technical field
The present invention relates to a kind of electronic component mounting apparatus, electronic component mounting system and electronic component mounting method, It keeps electronic unit using suction nozzle and moves the electronic unit, is installed on substrate.
Background technology
The electronic component mounting apparatus of electronic unit is carried on substrate, possesses the boarded head with suction nozzle, utilizes the suction Mouth keeps electronic unit and is carried on substrate.Electronic component mounting apparatus is by making the suction nozzle edge of boarded head and the surface of substrate Orthogonal direction movement so as to be adsorbed to the component being located in electronic part feeder, then, makes boarded head edge and base The direction that the surface of plate is parallel is relatively moved, after the loading position of adsorbed component is reached, by the suction for making boarded head Mouth along the direction orthogonal with the surface of substrate move and close to substrate, so as to which the electronic unit adsorbed be carried on substrate.
Herein, as the electronic unit installed to substrate, in addition to being equipped on the mounting type electronic unit on substrate, Also there is the lead-type electronic-part with main body and with the lead of main body connection.In the present invention, lead-type electronic-part It is the component by the way that lead to be inserted into install into the hole formed on substrate.It, will not be to inserting in addition, in the present invention Enter hole（Substrate aperture）It is middle insertion and be equipped on the electronic unit on substrate, such as SOP, QFP etc., as mounting type electronic unit. As the electronic component mounting apparatus for installing lead-type electronic-part on substrate, exist recorded in such as patent document 1 and 2 Device.A kind of electronic components mounting machine is described in patent document 1, and with component assembling machine, which uses In installing following two kinds of electronic units, i.e. the mounting type electronic unit that is adsorbed by absorption boarded head and pressed from both sides by clamping boarded head It holds and carries out stickfast after substrate insertion（clinch）Lead-type electronic-part.A kind of electronics is described in patent document 2 Apparatus for mounting component is integrally formed the boarded head installed to mounting type electronic unit and to lead-type electronic-part The insertion boarded head installed.
Patent document 1：Japanese Unexamined Patent Publication 5-335782 publications
Patent document 2：Japanese Unexamined Patent Publication 9-83121 publications
By using the device recorded in patent document 1 and 2, lead-type electronic-part can be carried to substrate.At this In, the device recorded in patent document 1 and 2 is that Special mounting device is carried in mixing, is provided integrally with and is respectively for insertion into axis Dedicated clamping boarded head to lead-type electronic-part and the dedicated suction for mounting type electronic unit to be carried to substrate Attached boarded head can install both mounting type electronic unit and lead-type electronic-part to substrate.Herein, patent document Special mounting device is carried in mixing recorded in 1 and 2, can not utilize above-mentioned absorption boarded head by lead-type electronic-part to insertion Hole（Substrate aperture）Middle insertion, in addition, above-mentioned clamping boarded head can not be utilized to carry mounting type electronic unit to substrate.That is, it Be boarded head for the variety of components of mounting type electronic unit and lead-type electronic-part without the device of interchangeability. Therefore, the species of electronic unit that is corresponding with the species of the boarded head on erecting device and can carrying is limited, And due to a variety of boarded heads, so as very expensive device.
The content of the invention
The present invention is exactly to propose in view of the foregoing, can efficiently and accurately it is intended that providing one kind Electronic component mounting apparatus, electronic component mounting system and the electronic component mounting method of lead-type electronic-part are installed.Separately Outside, the present invention is exactly to propose in view of the foregoing, it is intended that providing a kind of electronic component mounting apparatus, the ministry of electronics industry Part installation system and electronic component mounting method can efficiently and accurately install lead-type electronic-part, also, also Other electronic units can efficiently and be accurately installed.
The present invention provides a kind of electronic component mounting apparatus, electronic component mounting system and electronic component mounting method, Wherein, which makes removable by the suction nozzle comprising absorption suction nozzle and grasping suction nozzle of air pressure driving It unloads, mounting type electronic unit can be kept and is carried on substrate, a feature of the electronic component mounting apparatus exists In being kept using the suction nozzle of the electronic component mounting apparatus to the main body of lead-type electronic-part, according to electronic unit State judges in the state of the main body is kept can be by unconfined lead to the situation for the insertion that inserts in the hole, and can will be upper Lead is stated to be inserted into substrate, another feature is that, it can not only utilize the base of a boarded head progress mounting type electronic unit Plate carry, can also by lead-type electronic-part to insertion hole（Substrate aperture）Middle insertion, so as to interchangeability, the electricity as a result, Subassembly erecting device, electronic component mounting system and electronic component mounting method can efficiently and accurately be installed a variety of Electronic unit, versatility are very high.
In order to solve the above problems, purpose is realized, the present invention provides a kind of electronic component mounting apparatus, using in level The boarded head moved on face will be transferred and installed to the loading position of substrate positioned at the electronic unit of holding position, special Sign is have：Electronic part feeder, by drawing for the lead linked with electronic component body and with the main body Line style electronic unit is supplied to the holding position；Holder main body is supported with suction nozzle, suction nozzle driving portion and boarded head Body, the suction nozzle are driven by air pressure, with the electronic unit master to the electronic unit supplied from the electronic part feeder Body is kept, which installs the suction nozzle and carry out driving and rotation driving, and supply air pressure up and down Power, the boarded head supporter are supported the suction nozzle and the suction nozzle driving portion；Control unit, to the boarded head master The action of body and the electronic part feeder is controlled；And state detecting section, to what is kept by the suction nozzle The state of lead-type electronic-part is detected, and the control unit is based on suction detected by the state detecting section, described The state for the lead-type electronic-part that mouth is kept, in the case of judging that the lead state of the electronic unit meets condition, by this Electronic unit is inserted into substrate, and the suction nozzle is absorption suction nozzle or grasping suction nozzle.
It is electric to the wire type supplied using suction nozzle at holding position in the electronic component mounting apparatus of said structure The electronic component body of subassembly is kept, and in a state that lead-type electronic-part is kept by the suction nozzle, judges wire type Whether the state of electronic unit meets condition, by the lead-type electronic-part for the condition that meets to insertion hole（Substrate aperture）Middle insertion, Therefore, there are following effects, i.e. even if without using Special mounting device, widely available chip attachment machine can be utilized, efficiently And lead-type electronic-part is accurately installed.In addition, electronic component mounting apparatus in the state of main body and lead extremely Few one is detected, the state as electronic unit.
Additionally, it is preferred that the control unit judge the electronic unit lead state be unsatisfactory for condition in the case of, by this Electronic unit is conveyed to recovering mechanism.In the case where the state for judging the electronic unit lead is unsatisfactory for condition, by should Electronic unit is conveyed to recovering mechanism, can exclude the component of recycling.
Additionally, it is preferred that also there is the lead processing department being processed to the shape of the lead of the electronic unit, the control Portion processed is in the case where being determined as that the state of lead of the electronic unit is unsatisfactory for condition, using the lead processing department to the electricity Subassembly is processed.Due to also having the lead processing department being processed to the shape of the lead of the electronic unit, sentencing Be set to the lead of the electronic unit state be unsatisfactory for condition in the case of, can utilize the lead processing department to the ministry of electronics industry Part is processed, it is possible to the component effectively after application exclusion.
Additionally, it is preferred that the interval of lead of the control unit based on the electronic unit, diameter wire and substrate are inserted Enter the interval in hole, judge whether the state of the lead of the electronic unit meets condition.Since the control unit is based on The interval in the insertion hole at the interval of the lead of the electronic unit, diameter wire and substrate, to the lead of the electronic unit State whether meet condition and judged, it is possible to judging in advance can be by the lead of the electronic unit kept to insertion Situation about being inserted into hole.
Additionally, it is preferred that the state detecting section is detected the front end of the lead.Before to above-mentioned lead End is detected, and can accurately judge in advance can be by the lead of the electronic unit kept to the insertion that inserts in the hole Situation.
Additionally, it is preferred that the state detecting section is laser sensor, configure on the lower section of the boarded head supporter, edge Horizontal irradiation laser measures the shape of the electronic unit of measure object.Using said structure, by only making to maintain electricity The suction nozzle of subassembly rises and is moved to the detection height of laser sensor, it is possible to carry out accurate detection immediately, therefore, no Will boarded head moved into check device, moved up when being kept using other suction nozzles to electronic unit or to substrate It can be carried out detecting in dynamic, so the effect to shorten with beat.
Additionally, it is preferred that also having the framework being supported to each several part, the state detecting section is camera, is supported on In the framework, three-dimensional measurement is carried out to the shape of the electronic unit of measure object.It, can be to electronic unit using said structure It is detected compared with the position of suction nozzle, and computing is carried out to position correction, and can also identify the shape of electronic unit, because This, the effect for having operating efficiency high.
Additionally, it is preferred that the state detecting section by make measure object electronic unit rotate while measure, So as to which the shape of the lead to the electronic unit is detected.By using above-mentioned state detecting section, make measure object Electronic unit rotation while measure, whereby it can be detected that the shape of the above-mentioned lead of the electronic unit, not only may be used To detect the front position of lead, the inclination and bending of lead can also detect that, can more accurately carry out could be to inserting Enter to be inserted into the judgement of lead in hole.
Additionally, it is preferred that the state detecting section by make measure object electronic unit rotate while measure, So as to which the outermost shape of the lead to the electronic unit is detected, based on the outermost shape, to the lead Interval is detected.By using above-mentioned state detecting section, measured while the electronic unit of measure object is rotated, So as to detect the outermost shape of the above-mentioned lead of the electronic unit, by based on the outermost shape above-mentioned lead Every being detected, so as to the algorithm identical with the shape identification of electronic component body, be examined to multiple lead intervals It surveys, therefore, there is the effect that can make computing high speed.
Additionally, it is preferred that the state detecting section by make measure object electronic unit rotate while measure, So as to which the center to the lead of the electronic unit measures, to the lead compared with the suction nozzle position into Row detection.By using above-mentioned state detecting section, measured while the electronic unit of measure object is rotated, so as to survey The center of the above-mentioned lead of the electronic unit is measured, by being detected to above-mentioned lead compared with the position of suction nozzle, from And the position offset between suction nozzle and above-mentioned center can be detected, to insert in the hole insertion lead when into line position Put correction.
Additionally, it is preferred that the state detecting section is by surveying the electronic unit of measure object from set direction Amount, so as to which the radical of the lead to the electronic unit is detected.By using above-mentioned state detecting section from set direction The electronic unit of measure object is measured, so as to which the radical of the lead to the electronic unit is detected, therefore, having can The effect judged with the classification to the electronic unit kept on suction nozzle.
Additionally, it is preferred that the state detecting section is detected the direction of the electronic unit, as the electronic unit State.The direction of above-mentioned electronic unit is detected by using above-mentioned state detecting section, as above-mentioned electronic unit State, so as to being detected to such as lead compared with the link position in electronic component body portion, to the direction of electronic unit into Therefore row detection, can make the polarity of electronic unit conformably to the insertion that inserts in the hole.
Additionally, it is preferred that the state detecting section is detected the shape of the main body of the electronic unit, as institute State the state of electronic unit.The shape of the aforementioned body of above-mentioned electronic unit is examined by using above-mentioned state detecting section It surveys, as the state of above-mentioned electronic unit, so as to so that the polarity of electronic unit is conformably inserted into inserting in the hole.
Additionally, it is preferred that also have to supply to the supply position of the electronic part feeder the electronic unit into The component test section of row detection, the control unit are detecting that the suction nozzle does not keep the electricity using the state detecting section In the case of subassembly, it is detected using the component test section to whetheing there is the electronic unit at the supply position, In the case where being determined as no electronic unit, institute is supplied to the holding position using the electronic part feeder State electronic unit.Since electronic component mounting apparatus also has to supply to the supply position of the electronic part feeder The component test section that the electronic unit is detected, the control unit are detecting the suction nozzle using the state detecting section In the case of not keeping the electronic unit, using the component test section to whetheing there is the electronics at the supply position Component is detected, in the case where being determined as no electronic unit, using the electronic part feeder to described Holding position supplies the electronic unit, so with the effect that suction nozzle can be utilized to keep electronic unit again.
It keeps band cut-out lead additionally, it is preferred that the electronic part feeder is included from electronic unit and supplies and radially draw The radial direction feeder of line style electronic unit.Herein, 2 stage cut-outs of existing lead-type electronic-part erecting device point are drawn Line.That is, using special boarded head, lead cutting portion is acted, carries out keeping the pre-cutting with separation lead from electronic unit, After substrate insertion, lead is cut off with specific length in the back side of substrate（Formal cut-out）And it bends.Particularly, in pre-cut When disconnected, the front end side of the lead taken since lead member holding will be fixed on（It is fixed to keep band side）Cut-out, so in order to incite somebody to action Longer lead is inserted into inserting in the hole with guiding pin and lead holding part, makes structure extremely complex.Said structure Electronic component mounting apparatus be not to break lead in boarded head lateral incision as prior art, but supply and fill in electronic unit It puts side to be initially switched off in advance, and is installed in this state using boarded head on substrate.In addition, electronic component mounting apparatus is to supply On the boarded head kept to the electronic unit of holding position, the suction nozzle for the construction for implementing absorption or grasping is set.As a result, Electronic component mounting apparatus has following excellent effects, i.e. can make the structure of boarded head and existing lead-type electronic-part Carrying header structure in erecting device, can be using being carried on substrate, as chip attachment machine compared to simpler The boarded head that electronic component mounting apparatus is installed, handles lead-type electronic-part.
Additionally, it is preferred that above-mentioned electronic part feeder includes radial direction feeder, the radial direction feeder is from electronic unit Keep band by lead it is shorter be cut to specific length, radial direction lead-type electronic-part is supplied.Herein, it is so-called shorter Ground is cut to specific length, refers to when being inserted into lead to substrate, it is not necessary to which welding can be passed through by cutting off lead and need not bending And it is fixed on the length on substrate.Specific length is the length identical with substrate thickness or is protruded to substrate back side Lead will not generate failure welding and length corresponding with substrate thickness.Specific length is, for example, the insertion hole substantially phase with substrate Same length.More specifically, it is to grow more than or equal to 0mm and be less than or equal to compared with the length in the insertion hole of substrate The length of 3mm.
The electronic component mounting apparatus of said structure by cutting off lead shorter, can using suction nozzle to being located at portion When the main body of electronic unit on the holding position of part feedway is kept, the stability at lead interval is improved.It is as a result, Make using guiding pin not as good as existing insertion machine, can also increase can be to the component for the insertion lead that inserts in the hole, can be with Very efficiently and it is accurately proceed installation.
In addition, if compared with being pre-charged with or the solder coated in inserting in the hole, the longer lead of insertion, then sometimes Solder almost all is squeezed out to lead front end side, and in reflow soldering, the solder of fusing can not rise to substrate, i.e., solder without Method reaches substrate so that failure welding.In contrast, in the electronic component mounting apparatus of said structure, by by lead compared with Above-mentioned specific length is cut to shortly, if so as to because of the part for squeeze out from insertion hole to the lead for the insertion that inserts in the hole Solder becomes the state of fusing, then can rise to the back side of aforesaid substrate, be welded with the electrode of substrate back.In addition, In insertion hole（Substrate aperture）Inside there is also electrode in the case of, electrode that solder can be made to rise to inside lead and substrate Between gap in and welded.In this way, with the effect that can be mechanically and electrically welded.
Additionally, it is preferred that the electronic part feeder is the radial lead type to the insertion that inserts in the hole to the substrate The lead-type electronic-part feedway that electronic unit is supplied, also with mounting type electronic part feeder, to logical It crosses the mounting type electronic unit for carrying and installing on the substrate on the substrate to be supplied, the control unit utilizes institute It states suction nozzle to keep the main part of the radial lead type electronic unit and mounting type electronic unit, and is moved to substrate It send, by the radial lead type electronic unit to the insertion that inserts in the hole, the mounting type electronic unit is taken on substrate It carries.
The electronic component mounting apparatus of said structure is supplied by corresponding with the species of electronic unit to install electronic unit To device, so as to using 1 table apparatus by both lead-type electronic-part and mounting type electronic unit to substrate Any position is inserted into and is carried with random order.Thus, it is possible to providing a kind of can expand the species of accessible electronic unit Open up to obtain non-constant width, electronic component mounting apparatus that practicability is excellent.In addition, electronic component mounting apparatus can be well known to Suction nozzle apparatus for automatic change, using compared with boarded head by suction nozzle replacing as suction nozzle corresponding with the main part of electronic unit.
In order to solve the above problems, purpose is realized, the present invention provides a kind of electronic component mounting apparatus, using in level The boarded head moved on face will be transferred and installed to the loading position of substrate positioned at the electronic unit of holding position, special Sign is have：Electronic part feeder, by drawing for the lead linked with electronic component body and with the main body Line style electronic unit is supplied to the holding position；Holder main body is supported with suction nozzle, suction nozzle driving portion and boarded head Body, the suction nozzle are driven by air pressure, with the electronic unit master to the electronic unit supplied from the electronic part feeder Body is kept, which installs the suction nozzle and carry out driving and rotation driving, and supply air pressure up and down Power, the boarded head supporter are supported the suction nozzle and the suction nozzle driving portion；Control unit, to the boarded head master The action of body and the electronic part feeder is controlled；And substrate state test section, to the table of the substrate The state in face is detected, the control unit taking to the electronic unit of the substrate using the substrate state test section The state for carrying position is detected, in the case where the state for judging the loading position meets condition, by the electronic unit to It is installed on substrate, the suction nozzle is absorption suction nozzle or grasping suction nozzle.
It is preferred that the control unit makes the boarded head in the case where the state for judging the loading position is unsatisfactory for condition The installation action of main body stops.
Additionally, it is preferred that also have：Display unit shows picture；And operation portion, it is inputted and operated by user, it is described Control unit shows error picture in the case where the state for judging the loading position is unsatisfactory for condition.
Additionally, it is preferred that the control unit selects to continue in the state of the error picture is shown, using the operation portion In the case of the installation action, continue the installation action of the holder main body.
Additionally, it is preferred that the control unit has selected inspection in the state of the error picture is shown, using the operation portion In the case of the state for surveying the loading position, the state of the loading position is examined using the substrate state test section It surveys.
Additionally, it is preferred that the height that the height that the substrate state test section is the position opposite to the substrate is detected Spend sensor.
Additionally, it is preferred that the control unit in the case where the height of the loading position is more than threshold value, is determined as described take The state for carrying position is unsatisfactory for condition, in the case where the height of the loading position is less than or equal to threshold value, is determined as described The state of loading position meets condition.
Additionally, it is preferred that the control unit utilizes height of the substrate state test section to multiple positions of the loading position Degree is detected.
Additionally, it is preferred that the electronic part feeder is the radial lead type to the insertion that inserts in the hole to the substrate The lead-type electronic-part feedway that electronic unit is supplied, also with mounting type electronic part feeder, to logical It crosses the mounting type electronic unit for carrying and installing on the substrate on the substrate to be supplied, the control unit utilizes institute It states suction nozzle to keep the main part of the radial lead type electronic unit and mounting type electronic unit, and is moved up to substrate It send, by the radial lead type electronic unit to the insertion that inserts in the hole, the mounting type electronic unit is taken on substrate It carries.
In order to solve the above problems, purpose is realized, the present invention provides a kind of electronic component mounting system, which is characterized in that Have：Patterning device to the filling solder that inserts in the hole of the substrate, also, prints on the surface of the substrate The pattern of solder；And the electronic component mounting apparatus of above-mentioned record, after solder is filled by the patterning device It inserts in the hole, is inserted into radial lead type electronic unit, on the surface of pattern for having printed the solder, the mounting type is installed Electronic unit.
In the electronic component mounting system of said structure, insert in the hole filling or painting surfacing to aforesaid substrate are configured Material and on component mounting position solder-coating applying device, then, by lead-type electronic-part to it is above-mentioned insert in the hole it is slotting Enter, above-mentioned mounting type electronic unit is carried on the above-mentioned solder on substrate.The lead of insertion is being inserted via solder as a result, Enter in hole and be fixed temporarily, therefore, even if applying some vibrations, insertion part will not be extracted.In addition, it is installed in electronic unit In system, even if component is not bent in substrate back side, can also shorten lead.As a result, by the supporting pin of supporting substrate In the case of any position for being configured at substrate back, mounting type electronic unit can be carried on substrate, by wire type electricity The lead of subassembly is inserted into inserting in the hole.
Additionally, it is preferred that also there is reflow treatment device, to installing the radial direction using the electronic component mounting apparatus Substrate after lead-type electronic-part and the mounting type electronic unit flows back, by the radial lead type electronic unit And the mounting type electronic unit welds on the substrate.
In order to solve the above problems, purpose is realized, the present invention provides a kind of electronic component mounting system, which is characterized in that Have：The electronic component mounting apparatus of above-mentioned record, the insertion radial lead type that inserts in the hole after the filling solder of substrate Electronic unit on the surface of pattern for having printed the solder, installs mounting type electronic unit；And reflow treatment device, It using the electronic component mounting apparatus to installing the radial lead type electronic unit and the mounting type electronic unit Substrate afterwards flows back, and the radial lead type electronic unit and the mounting type electronic unit are welded on the substrate It connects.
In the electronic component mounting system of said structure, to the above-mentioned insertion hole for filling or being coated with above-mentioned solder In, above-mentioned lead-type electronic-part is inserted into, mounting type electronic unit is carried on the above-mentioned solder on substrate, then using same Process carries out reflow soldering.Thus, it is possible to simplify the welding sequence on hookup wire.In the prior art, it is if wire type is electric Subassembly is inserted into substrate, then is welded at the moment, if boarded parts carried on substrate, is carried out at the moment Welding, therefore, electronic component mounting line is longer and becomes complicated.In contrast, in the electronic component mounting system of said structure In, reflow soldering can be carried out together after lead-type electronic-part and mounting type electronic unit are installed on substrate, it can be with It is further simplified the welding sequence on hookup wire.
In order to solve the above problems, purpose is realized, the present invention provides a kind of electronic component mounting method, in the method, To have main body and lead-type electronic-part with the lead of main body connection, using being detachably provided with by air While the holder main body of pressure-actuated suction nozzle is kept, the holder main body is transferred, it is enterprising to substrate Row installation, which is characterized in that there is following step：Component supplying step in this step, the ministry of electronics industry is supplied to holding position Part；Step is kept, in this step, using the suction nozzle to supplying to the main part of the electronic unit of the holding position It is kept；Detecting step, in this step, the state of the electronic unit to being kept by the suction nozzle are detected；Sentence Step is determined, in this step, based on lead-type electronic-part being detected in the detecting step, being kept by the suction nozzle State judges the state of the lead of the electronic unit；And inserting step, in this step, in the determination step In the case that the state of the middle lead for judging the electronic unit meets condition, which is inserted to the loading position of substrate Enter, the suction nozzle is absorption suction nozzle or grasping suction nozzle.
Additionally, it is preferred that also having recycling step, in this step, drawing for the electronic unit is judged in the determination step In the case that the state of line is unsatisfactory for condition, which is conveyed to recovering mechanism.
Additionally, it is preferred that also having procedure of processing, in this step, it is determined as the electronic unit in the determination step In the case that the state of lead is unsatisfactory for condition, which is processed.Due to procedure of processing, in the step In, in the case of being determined as that the state of the lead of the electronic unit is unsatisfactory for condition in the determination step, to the ministry of electronics industry Part is processed, it is possible to effectively apply the component of exclusion.
Additionally, it is preferred that in the detecting step, using the laser measurement of laser sensor, to the ministry of electronics industry of measure object The shape of part measures.
Additionally, it is preferred that in the detecting step, by being surveyed while the electronic unit of measure object is rotated Amount, so as to be measured to the shape of the electronic unit.
Additionally, it is preferred that in the component supplying step, it is long using lead is cut to regulation from electronic unit holding band It spends to the radial direction feeder that radial direction lead-type electronic-part is supplied, the electronic unit is supplied to the holding position.
Additionally, it is preferred that in the component supplying step, using from electronic unit keep band by lead it is shorter be cut to Specific length and to the radial direction feeder that radial direction lead-type electronic-part is supplied, supply the electronics to the holding position Component.
Additionally, it is preferred that also having pattern forming step, in this step, solder is filled to inserting in the hole for the substrate, Also, the pattern of printing solder on the surface of the substrate, in the inserting step, by the lead of the electronic unit to The insertion that inserts in the hole.
It is preferred that also have reflow processing step, in this step, to install the substrate after the lead-type electronic-part into Row reflux, the lead-type electronic-part is welded on the substrate.
It is preferred that also there is following step：Mounting type electronic unit supplying step, in this step, by mounting type electronic unit It is supplied to the holding position；And mounting type electronic unit installation steps, in this step, by utilizing the suction nozzle pair The mounting type electronic unit supplied to the holding position is transferred while holding, and is taken to described in the substrate It carries position to carry, so as to which the mounting type electronic unit be installed on the substrate.
In order to solve the above problems, purpose is realized, the present invention provides a kind of electronic component mounting method, in the method, To have main body and lead-type electronic-part with the lead of main body connection, using being detachably provided with by air While the holder main body of pressure-actuated suction nozzle is kept, the holder main body is transferred, and on substrate Installation, which is characterized in that there is following step：Component supplying step in this step, electronic unit is supplied to holding position； Keep step, in this step, using the suction nozzle to supply to the holding position the electronic unit main part into Row is kept；Loading position detecting step, in this step, to the state of the loading position of the electronic unit of the substrate into Row detection；Determination step, in this step, the state to the loading position detected in the loading position detecting step Whether meet condition to be judged；And installation steps, in this step, the loading position is judged in the determination step State meet condition in the case of, which is installed on the loading position of substrate, the suction nozzle for absorption suction nozzle Or grasping suction nozzle.
Herein, preferably the height of the substrate is detected in the loading position detecting step.
Additionally, it is preferred that it is determined as in the determination step in the case where the height of the loading position is more than threshold value The state of the loading position is unsatisfactory for condition, in the case where the height of the loading position is less than or equal to threshold value, judges State for the loading position meets condition.
Additionally, it is preferred that in the loading position detecting step, the height at multiple positions of the loading position is carried out Detection.
The effect of invention
In the present invention, at holding position using suction nozzle to the wire type ministry of electronics industry that is supplied by electronic part feeder The electronic component body of part is kept, and in a state that lead-type electronic-part is kept by the suction nozzle, judges wire type electronics Whether the state of component meets condition, by the lead-type electronic-part for the condition that meets to insertion hole（Substrate aperture）Middle insertion, therefore, With following effects, i.e. even if without using Special mounting device, widely available chip attachment machine can be utilized, it is efficiently and high Lead-type electronic-part is installed to precision.
Description of the drawings
Fig. 1 is the schematic diagram for the schematic configuration for representing electronic component mounting apparatus.
Fig. 2 is the oblique view of the schematic configuration for the framework for representing electronic component mounting apparatus.
Fig. 3 A are the front views of framework shown in Fig. 2.
Fig. 3 B are the top views of framework shown in Fig. 2.
Fig. 3 C are the right side views of framework shown in Fig. 2.
Fig. 3 D are the left side views of framework shown in Fig. 2.
Fig. 3 E are the rearviews of framework shown in Fig. 2.
Fig. 4 is the definition graph of the schematic configuration for the cover for representing framework.
Fig. 5 is the definition graph of the schematic configuration for the lockable mechanism for representing framework.
Fig. 6 is the schematic diagram for the schematic configuration for representing electronic component mounting apparatus.
Fig. 7 is the schematic diagram for the schematic configuration for representing front side receptacle.
Fig. 8 is the schematic diagram for the schematic configuration for representing rear side receptacle.
Fig. 9 is the schematic diagram of the schematic configuration of the other examples for the component feed unit for representing rear side.
Figure 10 is the schematic diagram of the schematic configuration for the boarded head for representing electronic component mounting apparatus.
Figure 11 is the schematic diagram of the schematic configuration for the boarded head for representing electronic component mounting apparatus.
Figure 12 is to represent that electronic unit keeps the schematic diagram of the schematic configuration of an example of band.
Figure 13 is to represent that electronic unit keeps the schematic diagram of the schematic configuration of the other examples of band.
Figure 14 is the oblique view of the schematic configuration of the electronic part feeder for the component feed unit for representing rear side.
Figure 15 is the oblique view of the electronic part feeder shown in Figure 14 from the direction different from Figure 14.
Figure 16 is the definition graph of the schematic configuration for the electronic part feeder for representing component feed unit.
Figure 17 is the definition graph of the schematic configuration for the clamping unit for representing electronic part feeder.
Figure 18 is the definition graph of the schematic configuration for the feeder unit for representing electronic part feeder.
Figure 19 is the definition graph of the schematic configuration in the front support portion for representing feeder unit.
Figure 20 is the definition graph for representing schematic configuration of the holding of feeder unit with feeding claw unit.
Figure 21 is for illustrating the definition graph of the action of feeder unit.
Figure 22 is the definition graph of the schematic configuration for the cutting unit for representing electronic part feeder.
Figure 23 is the definition graph of the schematic configuration for the cutting unit for representing electronic part feeder.
Figure 24 is the definition graph of the schematic configuration for the cutting unit for representing electronic part feeder.
Figure 25 is the oblique view of the schematic configuration for the other examples for representing cutting unit.
Figure 26 is the oblique view for representing the schematic configuration from the cutting unit shown in Figure 25 from other directions.
Figure 27 is the oblique view for representing the relation between the cutting unit shown in Figure 25 and framework.
Figure 28 is the oblique view of the schematic configuration for the other examples for representing cutting unit.
Figure 29 is the definition graph for the action of the cutting unit shown in definition graph 25.
Figure 30 is the definition graph for the action of the cutting unit shown in definition graph 25.
Figure 31 A are the definition graphs of the schematic configuration for the holding mechanism for representing cutting unit.
Figure 31 B are the definition graphs of the schematic configuration of the other examples for the holding mechanism for representing cutting unit.
Figure 32 is the definition graph of the schematic configuration of the other examples for the feeder unit for representing electronic part feeder.
Figure 33 is the oblique view for representing the schematic configuration from the feeder unit shown in Figure 32 from other directions.
Figure 34 is the front view for the schematic configuration for representing the feeder unit shown in Figure 32.
Figure 35 is the top view for the schematic configuration for representing the feeder unit shown in Figure 32.
Figure 36 is the front view of the schematic configuration for other states for representing the feeder unit shown in Figure 32.
Figure 37 is the top view of the schematic configuration for other states for representing the feeder unit shown in Figure 32.
Figure 38 is the definition graph for the schematic configuration for representing the feeder unit shown in Figure 32.
Figure 39 is the definition graph of the schematic configuration for other states for representing the feeder unit shown in Figure 32.
Figure 40 is the definition graph of the schematic configuration for the linkage mechanism for representing the feeder unit shown in Figure 32.
Figure 41 is the definition graph of the schematic configuration for the other examples for representing framework.
Figure 42 is the definition graph for the action of the feeder unit shown in definition graph 32.
Figure 43 is the definition graph for the action of the feeder unit shown in definition graph 32.
Figure 44 is the definition graph of the schematic configuration for the other examples for representing assembly supply device.
Figure 45 is the definition graph for representing the part amplification of Figure 44.
Figure 46 is the definition graph of the schematic configuration for the other examples for representing assembly supply device.
Figure 47 is the definition graph for representing the part amplification of Figure 46.
Figure 48 is the definition graph of the schematic configuration for the other examples for representing assembly supply device.
Figure 49 is the definition graph for representing the part amplification of Figure 48.
Figure 50 is to represent a bowl oblique view for the schematic configuration of formula feeder assembly.
Figure 51 is the oblique view for the schematic configuration for representing the bowl formula feeder assembly shown in Figure 50.
Figure 52 is the side view for the other examples for representing component feed unit.
Figure 53 is the top view for the other examples for representing component feed unit.
Figure 54 is the side view for representing to accommodate the state after bowl is dismantled from the component feed unit shown in Figure 52.
Figure 55 is collecting bowl and the vibration section for the electronic part feeder for representing the component feed unit shown in Figure 53 The definition graph of relation between support portion.
Figure 56 is the definition graph for the schematic configuration for representing the collecting bowl shown in Figure 55.
Figure 57 A are the outline knots of the supporting mechanism for the electronic part feeder for representing the component feed unit shown in Figure 53 The oblique view of structure.
Figure 57 B are the front views for the schematic configuration for representing the supporting mechanism shown in Figure 57 A.
Figure 58 A are the oblique views for other states for representing the supporting mechanism shown in Figure 57 A.
Figure 58 B are the front views for the schematic configuration for representing the supporting mechanism shown in Figure 58 A.
Figure 59 is the top view of the schematic configuration for the driving device for representing the component feed unit shown in Figure 53.
Figure 60 is the oblique view for the schematic configuration for representing the driving device shown in Figure 59.
Figure 61 is the enlarged plan view for representing the schematic configuration amplification of the driving device shown in Figure 59.
Figure 62 is the side view for the schematic configuration for representing the driving device shown in Figure 59.
Figure 63 is the side cutaway view for the schematic configuration for representing the driving device shown in Figure 59.
Figure 64 is the definition graph for the action of the driving device shown in definition graph 59.
Figure 65 is the oblique view for representing the part amplification of electronic part feeder.
Figure 66 is the oblique view for representing the part amplification of electronic part feeder.
Figure 67 A are the oblique views for representing the part amplification of electronic part feeder.
Figure 67 B are the oblique views for the part that the electronic part feeder shown in Figure 67 A is represented from other directions.
Figure 68 is for illustrating the definition graph of the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.
Figure 69 is for illustrating the definition graph of the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.
Figure 70 is for illustrating the definition graph of the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.
Figure 71 is for illustrating the definition graph of the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.
Figure 72 is for illustrating the definition graph of the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.
Figure 73 is the schematic diagram of an example of the testing result for representing identification maneuver.
Figure 74 is the schematic diagram of an example of the testing result for representing identification maneuver.
Figure 75 is for illustrating the definition graph of the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.
Figure 76 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 77 is the definition graph for an example for representing operation screen.
Figure 78 is the definition graph for the part for representing operation screen.
Figure 79 A are the definition graphs for an example for representing component feed angle degree.
Figure 79 B are the definition graphs for an example for representing component feed angle degree.
Figure 80 is the definition graph for an example for representing operation screen.
Figure 81 is the definition graph for an example for representing operation screen.
Figure 82 is the definition graph for the part for representing operation screen.
Figure 83 A are the definition graphs for locate example for representing electronic unit.
Figure 83 B are the definition graphs for locate example for representing electronic unit.
Figure 83 C are the definition graphs for locate example for representing electronic unit.
Figure 83 D are the definition graphs for locate example for representing electronic unit.
Figure 84 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 85 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 86 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 87 A are the definition graphs for an example for representing electronic unit.
Figure 87 B are the definition graphs of an example of the measurement result for representing lead.
Figure 88 A are the definition graphs for an example for representing electronic unit.
Figure 88 B are the definition graphs of an example of the measurement result for representing lead.
Figure 89 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 90 is the definition graph for representing lead and the relation being inserted between hole.
Figure 91 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 92 is for illustrating the definition graph of the action of electronic component mounting apparatus.
Figure 93 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 94 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 95 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 96 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 97 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 98 A are for illustrating the definition graph of the action of electronic component mounting apparatus.
Figure 98 B are for illustrating the definition graph of the action of electronic component mounting apparatus.
Figure 99 is the definition graph for an example for representing suction nozzle.
Figure 100 is the definition graph of the holding action for the suction nozzle of definition graph 99.
Figure 101 A are the definition graphs for an example for representing suction nozzle.
Figure 101 B are the definition graphs for an example for representing suction nozzle.
Figure 101 C are the definition graphs for an example for representing suction nozzle.
Figure 101 D are the definition graphs for an example for representing suction nozzle.
Figure 102 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 103 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 104 is for illustrating the definition graph of the action of electronic component mounting apparatus.
Figure 105 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 106 is for illustrating the flow chart of the action of electronic component mounting apparatus.
Figure 107 is for illustrating the flow chart of the action of electronic component mounting apparatus.
Figure 108 is the definition graph for an example for representing electronic unit.
Figure 109 is the definition graph for an example for representing electronic unit.
Figure 110 is the definition graph for an example for representing operation screen.
Figure 111 is for illustrating the definition graph of the action of electronic component mounting apparatus.
Figure 112 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 113 is the definition graph for an example for representing error picture.
Figure 114 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Figure 115 is the schematic diagram for the schematic configuration for representing electronic component mounting system.
Figure 116 is the flow chart of an example of the action for representing electronic component mounting system.
The explanation of symbol
1 installation system, 2 patterning devices, 4 reflow treatment devices, 6,7 conveying devices, 8 substrates, 10 electronic units peace Assembling device, 11 frameworks, 11a main bodys, 11b, 11f, 11r cover, 11c openings, 11d cover support portions, 11e lockable mechanisms, 12 substrates are defeated Send portion, 14,14f, 14r component feed unit, 15 boarded heads, 16XY moving mechanisms, 17VCS units, 18, which replace suction nozzles, keeps machines Structure, 19 component storage portions, 20 control devices, 22X axis driving portions, 24Y axis driving portions, 30 holder main bodies, the support of 31 boarded heads Body, 32 suction nozzles, 34 suction nozzle driving portions, 38 laser identification devices, 40 operation portions, 42 display units, 44 front side receptacles, 46 rear sides are received Container, 48,49 connectors, 60 control units, 62 boarded head control units, 64 component supply control parts, 70 electronic units holding band, 72 Keep band main body, 80 electronic units, 82 main bodys（Electronic component body）, 84 leads, 90 bowls of formula feeder assemblys, 100, The electronic part feeder of 100a, 200,402,404,406,102 supporting tables, 110 frameworks, 112 clamping units, 114 feeders Unit, 116,116a cutting units, 118 air pressure adjustment sections, 120 guiding grooves, 302 lists, 304 carrying order lists, 400 Accommodate bowl feeder unit, 408 driving devices, 410 fixed parts, 420,420a, 420b, 420c accommodate bowl, 422,422a, 422b, 422c guide rail, 424,424a, 424b, 424c supporting mechanism, 426,426a, 426b, 426c linking part, 580a, 580b, 580c initiating terminal sidepiece part detection sensors, 582a, 582b, 582c holding position sidepiece part detection sensor, 590 air supplying parts
Specific embodiment
In the following, referring to the drawings, the present invention is described in detail.In addition, the present invention is not used to carry out an invention by following Mode（Hereinafter referred to as embodiment）It limits.In addition, in inscape in following embodiments, art technology is included Element in the so-called equivalency ranges such as element, substantially the same element that personnel can be readily apparent that.In addition, in following implementations Inscape disclosed in mode can be appropriately combined.
In the following, based on attached drawing, to electronic component mounting apparatus according to the present invention, electronic component mounting system and electricity The embodiment of subassembly installation method is described in detail.In addition, the present invention and from present embodiment limit.Fig. 1 is table Show the schematic diagram of the schematic configuration of electronic component mounting apparatus.
Electronic component mounting apparatus 10 shown in FIG. 1 is the device that electronic unit is carried on substrate 8.Electronic unit is installed Device 10 has：Framework 11, substrate delivery section 12, component feed unit 14f, 14r, boarded head 15, XY moving mechanisms 16, VCS Unit 17 replaces suction nozzle holding mechanism 18, component storage portion 19, control device 20, operation portion 40 and display unit 42.In addition, XY moving mechanisms 16 have X-axis driving portion 22 and Y-axis driving portion 24.Herein, the electronic unit installation dress of present embodiment 10 are put as shown in Figure 1, being respectively provided with component feed unit 14f, 14r in front side and rear side centered on substrate delivery section 12. In electronic component mounting apparatus 10, component feed unit 14f configurations are in the front side of electronic component mounting apparatus 10, component supply Unit 14r configures the rear side in electronic component mounting apparatus 10.In addition, 2 component feed units are not being distinguished particularly below In the case of 14f, 14r, component feed unit 14 is referred to as.
Fig. 2 is the oblique view of the schematic configuration for the framework for representing electronic component mounting apparatus.Fig. 3 A are frameworks shown in Fig. 2 Front view.Fig. 3 B are the top views of framework shown in Fig. 2.Fig. 3 C are the right side views of framework shown in Fig. 2.Fig. 3 D are Fig. 2 The left side view of shown framework.Fig. 3 E are the rearviews of framework shown in Fig. 2.Fig. 4 is the schematic configuration for the cover for representing framework Definition graph.Fig. 5 is the definition graph of the schematic configuration for the lockable mechanism for representing framework.In addition, in Fig. 3 A to Fig. 3 E, omission portion The diagram of part feed unit 14f, 14r, show to be more readily understood framework 11.
Framework 11 has main body 11a and cover 11bf, 11br as shown in Fig. 3 A to Fig. 3 E.Main body 11a is to accommodate to form electronics The babinet of each several part of apparatus for mounting component 10.Main body 11a configures cover 11bf, operation portion 40, display unit 42, front side receipts in front side Container 44 and connector 48 form cover 11br, rear side receptacle 46 and connector 49 in rear side.Main body 11a is 2 sides On be respectively formed 2 opening 11c, they are for moving into and discharge substrate 8 into device.The operation portion 40 of present embodiment has There are keyboard 40a and mouse 40b.The display unit 42 of present embodiment has touch panel 42a and picture monitor 42b.In addition, it touches Touching panel 42a also becomes a part for operation portion 40.Front side receptacle 44 and rear side receptacle 46 are to supply list to component respectively The component that first 14f, 14r are supported.The detailed configuration of front side receptacle 44 and rear side receptacle 46 is described below.Connector 48 are connected with the wiring of each several part of aftermentioned component feed unit 14f.In addition, connector 49 and aftermentioned component feed unit The wiring connection of each several part of 14r.Herein, as wiring, there is the wiring for transferring electric signal and the pipeline for supplying air.
In the following, cover 11bf, 11br are illustrated.In addition, cover 11bf, 11br only allocation position front side and rear side this Point is different, and structure is identical.In the following, in the case where not distinguishing particularly, referred to as cover 11b and illustrate.Cover 11bf be The coaming plate set in a part for the front side of main body 11a, configures on the upside of vertical.Cover 11br is the rear side in main body 11a A part on the coaming plate that sets, configure on the upside of vertical.Cover front or the back side of the 11b with covering main body 11a The shape of a part and a part for upper surface, section become L-shaped.11b is covered as shown in figure 4, can be opened compared with main body 11a It closes.By the way that cover 11b is made to become opening state, operation can be carried out to configuring each several part inside main body 11a.Cover the upper of 11b The front end on surface links with main body 11a, is rotated by fulcrum of linking portion.In addition, cover 11b is supported by cover support portion 11d.Cover branch Support part 11d is flexible bar-like member, and a side end links with main body 11a, end side and cover 11b connections.Cover support portion Opening and closings of the 11d with covering 11b is performed in accordance with flexible.In addition, lockable mechanism 11e is provided on cover support portion 11d, by cover branch The flexible locking of support part 11d.Lockable mechanism 11e makes cover support portion 11d become the shape that can not be stretched by becoming lockup state State by becoming released state, makes cover support portion 11d become the state that can be stretched.If lockable mechanism 11e becomes locking shape State then covers 11b and is fixed on current location.Thus, it is possible to the cover 11b for inhibiting opening state is closed due to dead weight.
Fig. 1 is returned to, continues to illustrate electronic component mounting apparatus 10.As long as substrate 8 is used to carry electronic unit Component, structure is not specially limited.The substrate 8 of present embodiment is plate-shaped member, and surface is provided with Wiring pattern. The surface of Wiring pattern on substrate 8 is arranged at, attachment flow back as utilization by the Wiring pattern of plate-shaped member and the ministry of electronics industry The solder of the joint element of part engagement.In addition, it on the substrate 8, is also formed to be inserted into the through hole of electronic unit（It is inserted into hole, base Plate hole）.
Substrate delivery section 12 is by the conveying mechanism that X-direction conveys along figure of substrate 8.Substrate delivery section 12 has：Along X The guide rail of direction of principal axis extension；And conveying mechanism, substrate 8 is supported, substrate 8 is made to be moved along guide rail.Substrate delivery section 12 so that the carrying object surface of substrate 8 direction opposite with boarded head 15, makes substrate 8 be moved along guide rail using conveying mechanism, So as to which substrate 8 be conveyed along X-direction.Substrate delivery section 12 by by the equipment that is supplied to electronic component mounting apparatus 10 supply Lai Substrate 8, the assigned position being delivered on guide rail.Boarded head 15 is at above-mentioned assigned position, by electronic unit to the table of substrate 8 It carries in face.Substrate delivery section 12 on the substrate 8 for be delivered to above-mentioned assigned position carry electronic unit after, by substrate 8 into It is conveyed at the device of the next process of row.In addition, the conveying mechanism as substrate delivery section 12, can use various structures.Example Such as, can use the conveying mechanism of the integrated conveyer belt mode of conveying mechanism, in the conveying mechanism of this mode, by edge The guide rail of the conveying direction configuration of substrate 8 and the endless belt rotated along above-mentioned guide rail are combined, and substrate 8 is being mounted in above-mentioned annular It is conveyed in the state of taking.
Fig. 6 is the schematic diagram for the schematic configuration for representing electronic component mounting apparatus.Fig. 7 is the outline for representing front side receptacle The schematic diagram of structure.Fig. 8 is the schematic diagram for the schematic configuration for representing rear side receptacle.Such as Fig. 6 institutes of electronic component mounting apparatus 10 Show, in front side arrangement components feed unit 14f, in rear side arrangement components feed unit 14r.The component feed unit 14f of front side Electronic part feeder is respectively provided with the component feed unit 14r of rear side, they keep multiple electricity carried on substrate 8 Subassembly, as shown in fig. 6, can be supplied to boarded head 15, i.e. can be to be kept by boarded head 15（Absorption or grasping） State to holding position supply electronic unit.Component feed unit 14f, 14r of present embodiment supply with main body and With the lead-type electronic-part of the lead of main body connection.
The component feed unit 14f of front side has 2 bowl formula feeder assemblys 90.Bowl formula feeder assembly 90 has Multiple assembly supply devices as bowl formula feeder, from each assembly supply device to holding position（Absorption position grasps position It puts）Supply electronic unit.It is supplied by each assembly supply device to the electronic unit of holding position, by boarded head 15 to substrate 8 Installation.For bowl formula feeder assembly 90, described below.
2 bowl formula feeder assemblys 90 of component feed unit 14f are arranged on the receptacle 44 of front side.As shown in fig. 7, Front side receptacle 44 has support plate 44a.Support plate 44a is fixed on the assigned position inside main body 11a by bolt etc..Support Plate 44a is supported 2 bowl formula feeder assemblys 90.The end of 12 side of substrate delivery section of support plate 44a is configured with fixed Position axis 44b.Locating shaft 44b support bowl formula feeders assembly 90, positions bowl formula feeder assembly 90.In addition, Support plate 44a on the end of the opposite side of 12 side of substrate delivery section, being formed with 2 recess portion 44c.Recess portion 44c also makes respectively The part insertion of bowl formula feeder assembly 90, positions bowl formula feeder assembly 90.
The component feed unit 14r of rear side has multiple electronic part feeders（Hereinafter referred to as " component supply dress It puts "）100.Electronic part feeder 100 is radial direction feeder, to holding position（Absorption position, grasping position）For electron Component.It is supplied to the electronic unit of holding position by each assembly supply device 100, is installed by boarded head 15 to substrate 8.
Assembly supply device 100 is using keeping taking pasting the lead of multiple radial lead type electronic units and forming Electronic unit keeps band, and radial lead type electronic unit is supplied to boarded head 15.Assembly supply device 100 is to maintain band supply Device keeps electronic unit to keep band, band is kept to convey the electronic unit kept, the radial lead type that will be kept Electronic unit is moved to the holding area that can be kept using the suction nozzle of boarded head 15 to electronic unit（Absorption position is grabbed Hold position, holding position）.Assembly supply device 100 is drawn by will be moved to the radial lead type electronic unit of holding area Line cuts off and separates, so as to may remain in rule so as to be become by radial lead type electronic unit of the holding with anchor leg The state at place is put in positioning, the radial lead type electronic unit can be kept using the suction nozzle of boarded head 15（It adsorbs, grab It holds）.It is described for assembly supply device 100 below.In addition, multiple assembly supply devices 100 can be supplied respectively to different product The electronic unit of kind, can also supply a variety of electronic units.
Multiple electronic part feeders 100 are arranged on rear side receptacle 46.Rear side receptacle 46 is to multiple electronics The mechanism that assembly supply device 100 is supported, as shown in figure 8, having：1st fixed plate 46a and the 2nd fixed plate 46b, locking Axis 46c, driving cylinder 46d and location tags 46e.1st fixed plate 46a is the plate-shaped member extended in ZX planes, along X side To the hole for being formed with in-line shape.Hole is the hole that can make the protrusion insertion formed on electronic part feeder 100.1st is solid Fixed board 46a is by the protrusion inserting hole that makes to be formed on electronic part feeder 100, so as to electronic part feeder 100 are positioned.2nd fixed plate 46b is disposed on face on the downside of vertical, supports electronic part feeder 100 Plate-shaped member on face.2nd fixed plate 46b forms concave-convex on the end face of the one side away from substrate delivery section 12.2nd fixed plate 46b is inserted by the protrusion for making to be formed on electronic part feeder 100 in bumps, so as to electronic part feeder 100 are positioned.Locking shaft 46c configuration compared with the 2nd fixed plate 46b further from the one side of substrate delivery section 12.Locking shaft 46c props up electronic part feeder 100 by being clamped by the clamping unit 112 of electronic part feeder 100 Support, positioning.Driving cylinder 46d is can to pass through the electricity to being arranged on correspondence position to the piston of protrusion on the upside of vertical The assigned position of subassembly feedway 100 is pressed, so as to convey electricity to the holding position of electronic part feeder 100 Subassembly.Location tags 46e is the guiding mark that can observe to identify the receptacle position in rear side receptacle 46 by eyes Know.Operating personnel set electronic part feeder 100 by being confirmed to location tags 46e to defined position, from And electronic part feeder 100 can be set on desired position.
Fig. 9 is the schematic diagram of the schematic configuration of the other examples for the component feed unit for representing rear side.Component feed unit 14 can also have following electronic part feeders on the basis of multiple following electronic part feeders 100 are installed 100a, wherein, which installs by by multiple radial lead type electronic units（Radial component）It is fixed It is keeping keeping band with the electronic unit formed in main body（Radial component keeps band）, in holding position（2nd holding position） The lead with the lead-type electronic-part kept is kept to cut off the electronic unit, and the absorption having on boarded head can be utilized Suction nozzle or grasping suction nozzle, keep the lead-type electronic-part for being located at the holding position, the electronic part feeder 100a installations keep the electronic unit holding band with to be formed in main body by the way that multiple mounting type electronic units are fixed on（Chip Component keeps band）, in holding position（1st holding position）By the electronic unit keep the mounting type electronic unit that is kept of band from Band main body is kept to be removed, using the absorption suction nozzle or grasping suction nozzle having on boarded head, to being located at the holding position Mounting type electronic unit is kept.In component feed unit 14, other electronic part feeders 100a can also be used as And rod-type feeder or pellet type feeder are set on rear side receptacle 46.Multiple assembly supply devices 100 shown in Fig. 9, 100a is maintained at supporting table（Receptacle）On 102.Supporting table 102 has the structure identical with above-mentioned rear side receptacle 46.Separately Outside, supporting table 102 can also carry other devices in addition to assembly supply device 100,100a（For example, measuring device or photograph Camera etc.）.
In component feed unit 14, the multiple assembly supply devices 100, the 100a that are held in supporting table 102, by carrying out The species of the electronic unit of carrying, the mechanism for keeping electronic unit or the different a variety of assembly supply devices 100 of feed mechanism, 100a is formed.In addition, component feed unit 14 can also have assembly supply device 100, the 100a of multiple identical types.Separately Outside, preferred components feed unit 14 has the structure that can be dismantled compared with apparatus main body.
Electronic part feeder 100a use keep take bonding carry out substrate carrying chip-type electronic component and The electronic unit of composition keeps band, and electronic unit is supplied to boarded head 15.In addition, electronic unit keeps band keeping taking being formed Multiple storage rooms, the stored electrons component in the storage room.Electronic part feeder 100a is following holding band feeders, It keeps band to keep electronic unit, the electronic unit kept holding band is conveyed, being moved to storage room can To utilize the holding area of the suction electronic unit of boarded head 15.In addition, by the way that storage room is made to be moved to holding area, it can To become the state that the electronic unit being housed in the storage room exposes in assigned position, the suction nozzle of boarded head 15 can be utilized to inhale It is attached, grasp the electronic unit.Electronic part feeder 100a is not limited to keep band feeder, and supply chip may be employed The various chip part feeders of type electronic unit.As chip part feeder, such as rod-type feeder can be used, kept Band feeder, in bulk（bulk）Feeder.
Boarded head 15 is using suction nozzle to the electronic unit that is kept on component feed unit 14f（Bowl formula feeder unit institute The lead-type electronic-part of holding）Or the electronic unit kept on component feed unit 14r（Electronic part feeder The 100 radial lead type electronic units kept（Lead-type electronic-part, insert type electronic unit））It is kept（Absorption or Person grasps）, the electronic unit kept is installed on the substrate 8 for being moved to assigned position using substrate delivery section 12. In addition, boarded head 15 will be supplied in the case where component feed unit 14r has electronic part feeder 100a in electronic unit To the chip-type electronic component kept on device 100a（Mounting type electronic unit）It is carried on substrate 8（Installation）.In addition, for The structure of boarded head 15 is described below.In addition, chip-type electronic component（Mounting type electronic unit）It is not have to be inserted in base The insertion hole formed on plate（Through hole）Lead without lead electronic unit.As mounting type electronic unit, illustrate as described above SOP, QFP etc..When chip-type electronic component is installed on substrate, without lead is inserted in the hole.
XY moving mechanisms 16 be make boarded head 15 along the X-direction in Fig. 1, Fig. 2 and Y direction, i.e. with substrate 8 The moving mechanism moved on the parallel face in surface has X-axis driving portion 22 and Y-axis driving portion 24.X-axis driving portion 22 and boarded head 15 connections, make boarded head 15 be moved along X-direction.Y-axis driving portion 24 links via X-axis driving portion 22 and boarded head 15, passes through X-axis driving portion 22 is made to be moved along Y direction, so that boarded head 15 is moved along Y direction.XY moving mechanisms 16 are by making carrying First 15 move along XY direction of principal axis, so as to so that boarded head 15 to the position opposite with substrate 8 or with component feed unit 14f, 14r opposite position movement.In addition, XY moving mechanisms 16 are by moving boarded head 15, so as to boarded head 15 and base Relative position between plate 8 is adjusted.Thus, it is possible to make the electronic unit that boarded head 15 is kept appointing to 8 surface of substrate The movement of meaning position can carry electronic unit to any position on 8 surface of substrate.That is, XY moving mechanisms 16 are to make boarded head 15 in horizontal plane（X/Y plane）Upper movement, by the electronics in the electronic part feeder of component feed unit 14f, 14r Component is to the assigned position of substrate 8（Loading position, installation site）The supply unit of conveying.In addition, as X-axis driving portion 22, The various mechanisms that boarded head 15 can be made to be moved to prescribed direction.As Y-axis driving portion 24, can use drive X-axis The various mechanisms that portion 22 is moved to prescribed direction.As the mechanism that object is made to be moved to prescribed direction, such as line can be used Property motor, rack pinion, the conveying mechanism using ball-screw, conveying mechanism using conveyer belt etc..
VCS units 17 replace suction nozzle holding mechanism 18 and component storage portion 19, configure in the xy plane with boarded head The position that 15 movable area overlaps, and position in z-direction compared with boarded head 15 closer to the position on the downside of vertical Put place.In the present embodiment, VCS units 17, replacement suction nozzle holding mechanism 18 and component storage portion 19, in substrate delivery section It is adjacent between 12 and component feed unit 14r.
VCS units（Unit status test section, state detecting section）17 be pattern recognition device, has the suction to boarded head 15 The camera shot and the lighting unit being illuminated to shooting area near mouth.VCS units 17 are to by boarded head 15 The shape of the electronic unit of suction and the hold mode of the electronic unit kept by suction nozzle are identified.More specifically It says, if boarded head 15 is made to be moved to the position opposite with VCS units 17, VCS units 17 are on the downside of vertical to carrying First 15 suction nozzle is shot, by being parsed to the image taken, so as to the shape to the electronic unit by suction The hold mode of shape and the electronic unit kept by suction nozzle is identified.VCS units 17 are by the information of acquirement to control device 20 It sends.
Replace the mechanism that suction nozzle holding mechanism 18 is to maintain a variety of suction nozzles.Suction nozzle holding mechanism 18 is replaced so that carrying can be made The state of first 15 dismounting and change suction nozzle, keeps a variety of suction nozzles.Herein, the replacement suction nozzle holding mechanism 18 of present embodiment is kept Have：Suction nozzle is adsorbed, electronic unit is kept by being attracted；And grasping suction nozzle, by being grasped to keep electricity Subassembly.Boarded head 15 is supplied by changing the suction nozzle installed using suction nozzle holding mechanism 18 is replaced to the suction nozzle installed It is driven to air pressure, so as in the proper condition（Attract or grasp）The electronic unit to be kept is protected It holds.
Component storage portion 19 is that storage is kept using suction nozzle by boarded head 15 and is fitted without electronics on the substrate 8 The babinet of component.That is, in electronic component mounting apparatus 10, become and the electronic unit being fitted without on the substrate 8 gives up The discard bin abandoned.Electronic component mounting apparatus 10 has what is do not installed to substrate 8 in the electronic unit kept from boarded head 15 In the case of electronic unit, boarded head 15 is made to be moved to the position opposite with component storage portion 19, passes through the electronics that will be kept Component discharges, so as to which electronic unit is put into component storage portion 19.
Control device 20 controls each several part of electronic component mounting apparatus 10.Control device 20 is various control units Aggregate.Operation portion 40 is the input equipment that operating personnel inputs operation, has keyboard 40a, mouse 40b and touch panel 42a.Operation portion 40 sends the various inputs detected to control device 20.Display unit 42 is to show various letters to operating personnel The picture of breath has touch panel 42a and picture monitor 42b.Display unit 42 is based on the image letter inputted from control device 20 Number, show various images on touch panel 42a and picture monitor 42b.
In addition, the electronic component mounting apparatus 10 of present embodiment is provided with 1 boarded head, but can also be supplied with component Unit 14f, 14r are corresponding respectively and set 2 boarded heads.In the case, 2 X-axis driving portions are set, by making 2 carryings Head moves respectively along XY directions, so as to so that 2 boarded heads are independently mobile.Electronic component mounting apparatus 10 is by having 2 Boarded head, so as to alternately carry electronic unit to 1 substrate 8.It is as noted above, replace by using 2 boarded heads Ground carries electronic unit, so as to during a boarded head carries electronic unit to substrate 8, make another boarded head The electronic unit being located in assembly supply device is kept.Thus, it is possible to further shorten electronics is not carried to substrate 8 The time of component can efficiently carry electronic unit.It is also preferable to electronic component mounting apparatus 10 parallelly configures 2 Substrate delivery section 12.If electronic component mounting apparatus 10 makes 2 substrates alternately to the ministry of electronics industry using 2 substrate delivery sections 12 Part loading position moves, and is alternately carried out component mounting using above-mentioned 2 boarded heads 15, then can more efficiently be taken to substrate Carry electronic unit.
In the following, using Figure 10 and Figure 11, the structure of boarded head 15 is illustrated.Figure 10 is to represent electronic unit installation dress The schematic diagram of the schematic configuration for the boarded head put.Figure 11 is showing for the schematic configuration for the boarded head for representing electronic component mounting apparatus It is intended to.In addition, in Fig. 10, while the various control units controlled electronic component mounting apparatus 10 and component supply are shown 1 assembly supply device 100 of unit 14r.Boarded head 15 as shown in Figures 10 and 11, has holder main body 30, shooting dress It puts（Substrate state test section）36th, height sensor（Substrate state test section）37 and laser identification device（Unit status is examined Survey portion, state detecting section）38.
Electronic component mounting apparatus 10 is as shown in Figure 10, has control unit 60, boarded head control unit 62 and component supply Control unit 64.Control unit 60, boarded head control unit 62 and component supply control part 64 are a parts for above-mentioned control device 20. In addition, electronic component mounting apparatus 10 is connected with power supply, control unit 60, boarded head control unit 62, component supply control part are used 64 and various circuits, it will be supplied from the electric power that power supply supplies to each several part.For control unit 60, boarded head control unit 62 and Component supply control part 64 is described below.
Electronic part feeder 100 makes lead be maintained at electronic unit holding band（Radial component keeps band）On electronics The main body of component 80 is exposed upward.In addition, as electronic unit 80, aluminium electrolutic capacitor is exemplified.In addition, as the ministry of electronics industry Part 80 in addition to aluminium electrolutic capacitor, can also use with leaded various electronic units.Electronic part feeder 100 by keeping band to pull out electronic unit and moving it, so that the electronic unit for keeping keeping in band in electronic unit 80 to holding area（Binding domain, grip areas）It is mobile.In the present embodiment, the Y direction of assembly supply device 100 Near front end, become the guarantor for being held in electronic unit the electronic unit 80 in band being kept to be kept by the suction nozzle of boarded head 15 Hold region.For the structure of electronic part feeder 100, described below.In addition, with electronic part feeder 100a's Situation in the same manner, it is specified that position become by boarded head 15 suction nozzle to be held in electronic unit keep band in electronic unit 80 into The holding area that row is kept.
Holder main body 30, which has, drives boarded head supporter 31, multiple suction nozzles 32 and the suction nozzle that each several part is supported Dynamic portion 34.In the holder main body 30 of present embodiment, 6 suction nozzles 32 are configured to a row as shown in figure 11.6 suction nozzles 32 It is arranged along the direction parallel with X-axis.In addition, the suction nozzle 32 shown in Figure 11 is each equipped with adsorbing and keeps the suction nozzle of electronic unit.
Boarded head supporter 31 is the support member linked with X-axis driving portion 22, to suction nozzle 32 and suction nozzle driving portion 34 It is supported.In addition, boarded head supporter 31 is also supported laser identification device 38.
Suction nozzle 32 is absorption, the adsorbing mechanism for keeping electronic unit 80.Suction nozzle 32 front end have opening 33, by from this Opening 33 attracts air, so as in front end absorption, keep electronic unit 80.In addition, suction nozzle 32 has axis 32a, axis 32a and shape Into have opening 33 and adsorb electronic unit 80 front end connection.Axis 32a is the bar-like member being supported to front end, along Z Direction of principal axis extension configuration.Axis 32a is configured with the air hose for connecting opening 33 with the attracting mechanism of suction nozzle driving portion 34 in inside （Piping）.
Suction nozzle driving portion 34 makes suction nozzle 32 be moved along Z-direction, is carried out using 33 pairs of electronic units 80 of opening of suction nozzle 32 Absorption.Herein, Z axis is the axis orthogonal with X/Y plane.In addition, Z axis becomes the direction orthogonal with the surface of substrate.In addition, it inhales Mouth driving portion 34 makes suction nozzle 32 be rotated along θ directions when electronic unit is installed etc..So-called θ directions, be with centered on Z axis The parallel direction of round circumferencial direction, wherein, Z axis is to make the parallel axis in direction that suction nozzle 32 moves with Z axis driving portion.In addition, θ Direction becomes the rotation direction of suction nozzle 32.
In suction nozzle driving portion 34, as the mechanism that suction nozzle 32 is made to be moved along Z-direction, for example there is with Z-direction For the mechanism of the linear motor of driving direction.Suction nozzle driving portion 34 makes the axis 32a of suction nozzle 32 along Z by using linear motor Direction of principal axis moves, so that the opening 33 of the front end of suction nozzle 32 is moved along Z-direction.In addition, in suction nozzle driving portion 34, make To make the mechanism that suction nozzle 32 is rotated along θ directions, for example there is by being formed by motor and with the transmission element of axis 32a into joining line Mechanism.Suction nozzle driving portion 34 will be transferred from the driving force of motor output using element is driven to axis 32a, make axis 32a along θ side To rotation, also rotated so as to the front end of suction nozzle 32 along θ directions.
In suction nozzle driving portion 34, the mechanism adsorbed as 33 pairs of electronic units 80 of opening using suction nozzle 32 is inhaled Draw mechanism, for example there is the mechanisms with components described below：Air hose links with the opening 33 of suction nozzle 32；Pump, with the air Pipe connects；And solenoid valve, the opening and closing of the pipeline of air hose is switched over.Suction nozzle driving portion 34 is using pump to air hose Whether air is attracted, by being switched over to the opening and closing of solenoid valve, so as to from opening 33 air being attracted to switch over.It inhales Mouth driving portion 34 attracts air by opening solenoid valve, from opening 33, so that 33 absorption of opening（It keeps）Electronic unit 80 leads to Closing solenoid valve is crossed, opening 33 is made not attract air, so as to which the electronic unit 80 adsorbed in opening 33 be discharged, i.e. become Opening 33 is not utilized to adsorb the state of electronic unit 80（Without the state of holding）.
In addition, the boarded head 15 of present embodiment, when the main body to electronic unit is kept, body upper surface is nothing Method utilizes suction nozzle（Adsorb suction nozzle）In the case of the shape of 33 absorption, aftermentioned grasping suction nozzle is used.Grasp suction nozzle by with suction Attached suction nozzle carries out attraction release to air in the same manner, so that movable plate is opened and closed compared with fixinig plate, it is possible thereby to be grabbed from top Hold, discharge the main body of electronic unit.In addition, boarded head 15 moves suction nozzle 32 by using suction nozzle driving portion 34 and performs replacement Action, so as to replace the suction nozzle driven by suction nozzle driving portion 34.
Filming apparatus 36 is fixed on the boarded head supporter 31 of holder main body 30, pair area opposite with boarded head 15 Domain is shot such as substrate 8 or being equipped with the substrate 8 of electronic unit 80.There is filming apparatus 36 camera and illumination to fill It puts, while being illuminated using lighting device to the visual field, image is obtained using camera.Thus, it is possible to it shoots and carries The various images of the image of the opposite position of head main body 30, such as substrate 8 or component feed unit 14.For example, filming apparatus 36 The BOC that reference mark is formed as on 8 surface of substrate is marked（Hereinafter referred to as BOC）Or through hole（It is inserted into hole）Image It is shot.Herein, in the case where using the reference mark in addition to BOC is marked, the image of the reference mark is carried out Shooting.
Height sensor 37 is fixed on the boarded head supporter 31 of holder main body 30, to boarded head 15 and opposite area The distance between domain, such as substrate 8 or substrate 8 for being equipped with electronic unit 80 measure.It can be with as height sensor 37 Using laser sensor, which has：Light-emitting component irradiates laser；And photo detector, to opposite The laser for reflecting and returning at position carries out light, the laser sensor according to the time after being sent from laser until light, It pair is measured with the distance between opposite part.In addition, height sensor 37 by using measure when self-position with And substrate position, it pair is handled with the distance between opposite part, so as to opposite part, the specifically ministry of electronics industry The height of part is detected.In addition it is also possible to by control unit 60 based on the progress of the measurement result of the distance between electronic unit The processing of the height of detection electronics.
Laser identification device 38 has light source 38a and photo detector 38b.Laser identification device 38 is built on bracket 50. Bracket 50 is as shown in Figure 10, downside, substrate 8 and the connection of 100 side of assembly supply device with boarded head supporter 31.Laser is known Other device 38 is by irradiating laser to the electronic unit 80 adsorbed by the suction nozzle 32 of holder main body 30, so as to electronic unit The device that 80 state is detected.Herein, the state as electronic unit 80, refer to electronic unit 80 shape and Using suction nozzle 32 whether with correct posture absorption electronic unit 80 etc..Light source 38a is the light-emitting component for exporting laser.Light member Position in the Z-direction of part 38b is configured on the identical position of the position opposite with light source 38a, i.e. height.Swash for utilizing Light identification device 38 describes the identifying processing of shape below.
In the following, the control function of the apparatus structure of electronic component mounting apparatus 10 is illustrated.Electronic unit installation dress It puts 10 as shown in Figure 10, there is control unit 60, boarded head control unit 62 and component supply control part as control device 20 64.The component that various control units have operation processing function and store function by CPU, ROM and RAM etc. respectively is formed.In addition, In present embodiment, multiple control units are set for convenience of description, but 1 control unit can also be set.In addition, by electronics In the case that the control function of apparatus for mounting component 10 is realized by 1 control unit, it can be realized by 1 arithmetic unit, it can also It is realized by multiple arithmetic units.
Control unit 60 is connected with each several part of electronic component mounting apparatus 10, based on the operation signal inputted, in electronics The information detected in each several part of apparatus for mounting component 10 performs stored program, the action of each several part is controlled. Drive actions of the control unit 60 for example to the conveying of substrate 8 action, the boarded head 15 realized using XY moving mechanisms 16, using swashing SHAPE DETECTION action that light identification device 38 is realized etc. is controlled.It is controlled in addition, control unit 60 is as noted above to boarded head Portion 62 sends various instructions, and the control action of boarded head control unit 62 is controlled.Control unit 60 is also to boarded head control unit 62 and the control action of component supply control part 64 controlled.
Boarded head control unit 62 and suction nozzle driving portion 34, various sensors and the control configured on boarded head supporter 31 Portion 60 processed connects, and suction nozzle driving portion 34 is controlled, and the action of suction nozzle 32 is controlled.Boarded head control unit 62 is based on The operation instruction supplied from control unit 60 and various sensors（Such as range sensor）Testing result, to suction nozzle 32 to electricity The absorption of subassembly（It keeps）/ release movement, the rotational action of each suction nozzle 32, the shift action of Z-direction are controlled.
Component supply control part 64 controls the supply action of component feed unit 14f, 14r electronic unit 80 carried out System.Set parts supply control part 64 can be distinguished on assembly supply device 100, bowl formula feeder unit 400, it can also profit All assembly supply devices 100, bowl formula feeder unit 400 are controlled with 1 component supply control part 64.For example, The electronic unit that component supply control part 64 carries out assembly supply device 100 keeps the pull-out of band to act（Shift action）、 The cutoff action of lead and the holding of radial direction lead-type electronic-part action is controlled.In addition, component supply control part The component supply action that 64 pairs of bowl formula feeder units 400 are carried out controls.In addition, component supply control part 64 is in component In the case that feed unit 14f has assembly supply device 100a, the electronic unit carried out to assembly supply device 100a is protected Hold the pull-out action of band（Shift action）It is controlled.Instruction of the component supply control part 64 based on control unit 60 performs various dynamic Make.Component supply control part 64 is controlled by the way that the pull-out of band or electronic unit holding band is kept to act to electronic unit, So as to keep band or electronic unit that the movement of band is kept to control electronic unit.
In the following, using Figure 12 to Figure 24, assembly supply device 100 is illustrated.Assembly supply device 100 such as above-mentioned institute Show, be the radial direction feeder for supplying radial lead type electronic unit to holding position.First, using Figure 12 and Figure 13, to electricity Subassembly keeps band to illustrate.Figure 12 is to represent that electronic unit keeps the schematic diagram of the schematic configuration of an example of band.Figure 13 be to represent that electronic unit keeps the schematic diagram of other schematic configuration examples of band.
Electronic unit shown in Figure 12 keeps band（Radial component keeps band）70 have：Keep band main body 72；It is and multiple Electronic unit（Radial lead type electronic unit, radial lead component）80, it is maintained in holding band main body 72.Keep band main body 72 by the way that by the 1st holding band 74 and compared with the 1st holding band 74, the 2nd holding band 76 of narrower width is bonded to be formed.In addition, it protects Hold with main body 72 hole 78 being formed with along extending direction using fixed intervals as inlet ports.That is, band main body 72 is kept along extension side Multiple holes 78 are formed with to in-line shape.
Electronic unit 80 has：Electronic component body（Hereinafter referred to as " main body "）82；And 2 leads 84, along master The radial direction configuration of body 82.The lead 84 of electronic unit 80 is clamped between the 1st holding band 74 and the 2nd holding band 76 and consolidates It is fixed.Electronic unit 80 is by the way that lead 84 to be clamped between the 1st holding holding band 76 of band 74 and the 2nd to fix as a result, so as to solid It is scheduled on and keeps at the assigned position with main body 72.In addition, for multiple electronic units 80, hole 78 is configured between 2 leads 84, So as to be separately fixed at the formation with main body 72 is kept to have on the position in hole 78.That is, electronic unit 80 with it is identical with hole 78 into It is configured to the interval of spacing P at the position identical with the position on the extending direction for keeping band.In addition, electronic unit 80 It is with the lead being clamped between the 1st holding holding band 76 of band 74 and the 2nd of the holding with main body 72, lead to want its shape And shape, the species of main body are not specially limited.
In the following, the electronic unit shown in Figure 13 keeps band 70a to have：Keep band main body 72；And multiple electronic units（Footpath To lead-type electronic-part）80, it is maintained in holding band main body 72.In addition, electronic unit keeps band 70a only electronic units 80 Relative position relation between hole 78 is different, and other structures keep band 70 identical with electronic unit.Electronic unit keeps band 70a 2 leads 84 of electronic unit 80 are configured and are being kept between the hole 78 with main body 72 and hole 78.That is, electronic unit 80 configures For interval is identical with the feeding spacing P in hole 78, and its position on the extending direction for keeping band has been disposed offset from configuration space Half position.That is, electronic unit 80, which is configured, is offseting by compared with hole 78 on the position of half amount of separation.
Electronic unit keeps band as shown in Figure 12 and Figure 13, there is the hole 78 on the extending direction for keeping band and electronic unit The different species of relative position relation between 80.
In the following, Figure 14 is the strabismus of the schematic configuration of the electronic part feeder for the component feed unit for representing rear side Figure.Figure 15 is the oblique view of the electronic part feeder shown in Figure 14 from the direction different from Figure 14.Figure 16 is to represent The definition graph of the schematic configuration of the electronic part feeder of component feed unit.As shown in Figure 14 to Figure 16, electronic unit supplies To device（Assembly supply device）100 have：Framework 110 keeps other each several parts, and electronic unit holding is brought into Row guiding；Clamping unit 112 links with rear side receptacle 46；Feeder unit 114 keeps band to carry out electronic unit Conveying；Cutting unit 116 will remain in the lead cut-out for the electronic unit that electronic unit is kept in band；And air pressure Adjustment section 118, the air pressure of the driving portion of driving portion and cutting unit 116 to feeder unit 114 is adjusted, right The driving of each several part is controlled.
Framework 110 is longitudinally elongated hollow box body, and interior retaining clip holds unit 112, feeder unit 114, cut-out list Member 116 and air pressure adjustment section 118.Framework 110 is provided with guiding groove 120, guide portion 122, discharge unit 126, grasping part 128 and lug boss 129.Guiding groove 120 has the shape along its length of the elongate surface on the upside of the vertical of framework 110 Into 2 straight lines a side end connection shape.That is, guiding groove 120 is formed as from a side end of framework 110 to opposite side End extends about, and turns back near end side, and extends to the U-shaped of a side end.Guiding groove 120 is to electronics Component keeps the slot that band guides, from a side end of U-shaped（The end of supply side）It supplies electronic unit and keeps band.Draw Guide groove 120 makes supplied electronic unit that band be kept to be moved along U-shaped, from a side end of U-shaped（The end of discharge side Portion）Discharge.In addition, guiding groove 120 with keep with main body 72 be located at framework 110 inside and electronic unit to framework 110 The state that outside is exposed keeps band to guide electronic unit.
The end of the supply side of guide portion 122 and guiding groove 120 links, and will maintain the electronics in the state of electronic unit Component keeps band to be guided to guiding groove 120.Discharge unit 126 and the end of the discharge side of guiding groove 120 link, will be in framework 110 Interior movement and by electronic unit to boarded head 15 supply after part from electronic unit keep band in discharge.Grasping part 128 be The part grasped when electronic part feeder 100 conveys etc. by operating personnel.Lug boss 129 is to above-mentioned rear side receptacle The protrusion being inserted into the hole of 46 the 1st fixed plate 46a.
In the following, on the basis of Figure 14 to Figure 16, clamping unit is illustrated using Figure 17.Herein, Figure 17 is table Show the definition graph of the schematic configuration of the clamping unit of electronic part feeder.Clamping unit 112 is connected with rear side receptacle 46 The mechanism of knot.Clamping unit 112 has linking part 132, driving section 134, elastic portion 136 and bar 138.
Linking part 132 is the part contacted when linking with rear side receptacle 46 with rear side receptacle 46, outside framework 110 Expose.In addition, linking part 132 is configured on the face for having the opposite side in the face of guiding groove 120 in the formation with framework 110.Linking part 132 On the end on the downside of vertical, bite 133 is provided with.Bite 133 and the locking shaft 46c of rear side receptacle 46 connect Knot.Driving section 134 and the bite 133, elastic portion 136, bar 138 of linking part 132 link, and will be applied from bar 138, elastic portion 136 The power added is transferred to linking part 132.One side end of elastic portion 136 is fixed in framework 110, and end side is fixed on transmission In portion 134.Elastic portion 136 is the components such as spring, driving section 134 is applied by it to the side stretching being fixed in framework 110 Power.Driving section 134 becomes the state that the part linked with elastic portion 136 is stretched to prescribed direction as a result,.The one of bar 138 Side end is exposed to the external of framework 110, and end side links with driving section 134.The fixing axle 139 of bar 138 is fixed on frame On body 110.As a result, if operating personnel operate the side end that bar 138 exposes to the outside of framework 110, with fixation Axis 139 is axis, moves the end for linking side with driving section 134.It as a result, moves driving section 134, is acted on to linking part 132 Defined power acts bite 133.Clamping unit 112 is said structure, by operation of the operating personnel to bar 138, thus In the state for linking locking shaft 46c of the bite 133 with rear side receptacle 46 and being fixed on rear side receptacle 46 and sting It is switched between the state that conjunction portion 133 does not link with locking shaft 46c and is released.
In the following, on the basis of Figure 14 to Figure 16, using Figure 18 to Figure 21, feeder unit is illustrated.Herein, Figure 18 is the definition graph of the schematic configuration for the feeder unit for representing electronic part feeder.Figure 19 is to represent feeder unit Front support portion schematic configuration definition graph.Figure 20 is outline knot of the holding with feeding claw unit for representing feeder unit The definition graph of structure.Figure 21 is for illustrating the definition graph of the action of feeder unit.Feeder unit 114 is that electronic unit is protected It holds band to be conveyed, i.e. the mechanism for making the electronic unit being guided along guiding groove 120 that band be kept to move.Feeder unit 114 has There are support portion 142, driving portion 144, front support portion 146 and keep band feeding claw unit 148.In addition, in present embodiment In, front support portion 146 and holding become with feeding claw unit 148 to keeping between feeding claw unit 148 and framework 110 The position adjusting mechanism that relative position is adjusted.
Support portion 142 is integrally fixed at the component in framework 110, and driving portion 144 is supported.Driving portion 144 has solid Determine portion 144a and movable part 144b.Driving portion 144 is to expose the slave fixed part 144a of movable part 144b using air pressure The flexible cylinder in part.Driving portion 144 makes the front end of movable part 144b on the extending direction of the line part of guiding groove 120, It is at least correspondingly moved back and forth with feeding spacing in defined distance range.That is, driving portion 144 makes the front end of movable part 144b At least with the feeding spacing with keeping band（The spacing P in hole 78）Corresponding distance moves back and forth.Front support portion 146 is fixed on The front end of the movable part 144b of driving portion 144.The reciprocating movement of front support portion 146 and movable part 144b integrally back and forth moves It is dynamic.In addition, as shown in figure 19, front support portion 146 is the face on the upside of vertical, with band feeding claw unit 148 is kept to connect At the part of knot, there are this 4 screw holes of screw hole 149a, 149b, 149c, 149d.This 4 screw hole 149a, 149b, 149c, 149d are formed in holding with 4 different positions of the position in direction of feed.Herein, the screw in front support portion 146 The distance between hole 149a and screw hole 149b are the distance of the half of the spacing P in hole 78 of the above-mentioned holding with main body 72.That is, spiral shell Nail hole 149a and screw hole 149b are formed on the position of half amount of separation for the configuration space for offseting by hole 78.In addition, preceding It holds on support portion 146, the distance between screw hole 149c and screw hole 149d are the spacing P in hole 78 of the above-mentioned holding with main body 72 Half distance.That is, screw hole 149c and screw hole 149d is formed in the half amount of separation for the configuration space for offseting by hole 78 Position on.
Band feeding claw unit 148 is kept to be fixed in front support portion 146.Keep band feeding claw unit 148 that there is installation Platform 150, feeding claw 152, pin 154 and spring 156.Erecting bed 150 is that feeding claw 152, pin 154, spring 156 are supported Pedestal.It is the plate shape after the bending of L-shaped, vertical side that erecting bed 150, which has and keeps with the orthogonal section of direction of feed, A part to the upper side is exposed from framework 110.It is provided with what can be grasped by operating personnel in the part of the exposing of erecting bed 150 Grasping part 158.Operating personnel as needed grasp grasping part 158 and are operated, so as to so as to keep band feeding claw list Member 148 is moved to holding band direction of feed.Erecting bed 150 is the component being connected with front support portion 146, utilizes 2 fixed spiral shells Nail 159 is fixed in front support portion 146.Herein, on erecting bed 150, between the hole for making 2 insertions of fixing screws 159 Every the interval phase between interval and screw hole 149b and screw hole 149d between screw hole 149a and screw hole 149c Together.That is, front support portion 146 is being kept on the different position in direction of feed, have it is multigroup with to keeping band feeding claw list The fixing screws that the erecting bed 150 of member 148 is inserted into（Screw）The combination of the identical screw hole of 159 configuration spacing.Accordingly, for Erecting bed 150, by being switched over to the screw hole for being inserted into fixing screws 159, so as to so that erecting bed 150 and front support The half of relative offset amount of separation between portion 146.
Feeding claw 152 is the component with the protrusion 152a in a side end of bar-like member protrusion.Feeding claw 152 configures Band is being kept with electronic unit（Hereinafter referred to as " holding band "）On the opposite position in hole of 70 holding with main body 72, protrusion The shape of 152a is to keep the direction of feed downstream side with direction of feed（The front side of direction of feed）Face 152b become with into To the face that direction is orthogonal, the direction of feed upstream side with direction of feed is being kept（The rear side of direction of feed）Face 152c become phase For the face inclined face orthogonal with direction of feed, make the narrowed width of direction of feed with close to holding band 70.Feeding claw 152 in the case of the position Chu You hole 78 opposite with protrusion 152a, as shown in figure 20, becomes protrusion 152a and is inserted into hole 78 State.Pin 154 is to the side end for not forming protrusion 152a of feeding claw 152, can be revolved along the direction parallel with paper The mode turned is supported.One side end of spring 156 is fixed on the projecting surface 150a of erecting bed 150, and end side is solid It is scheduled in feeding claw 152.Spring 156, will be into the case where the protrusion 152a of feeding claw 152 is opposite with the part outside hole 78 It is pressed to pawl 152 to holding band side.
In the following, using Figure 21, the holding band feed motion of feeder unit 114 is illustrated.In addition, shown in Figure 21 Example（Step S1~S4）In, it will keep with the hole formed in main body 72, the downstream side with direction of feed kept to be located at Kong Xianxiang frameworks 110 supply, and are first set to 78,78a, 78b, 78c successively from the order of the discharge of framework 110.In step S1 In, the protrusion 152a of feeding claw 152, which is inserted into, to be kept in the hole 78a with main body 72.Feeder unit 114 is as shown in step S1 In a state that protrusion 152a is inserted into the 78a of hole, driving portion 144 is driven, holding band feeding claw unit 148 is made to be brought into along holding Give direction movement amount corresponding with keeping 1 pitch of holes with main body 72.
If feeder unit 114 in the state of step S1, will keep band feeding claw unit 148 along holding band feeding side To conveying, then using the face orthogonal with direction of feed of protrusion 152a, hole 78a is pushed to holding band direction of feed, such as step Shown in S2, keep band feeding claw unit 148 and band main body 72 is kept to be moved along holding band direction of feed.Feeder unit 114 By making holding band main body 72 along band direction of feed is kept to move, so that the electronic unit of band is kept to be moved to holding position.
If holding is made to move end with direction of feed along holding with feeding claw unit 148（Step S2）, then feeder Unit 114 makes electronic unit of the holding with the front end kept in main body 72 be in holding position and standby.At this point, positioned at holding position It puts（Holding area）Electronic unit it is as shown in the above, electronic component body is clamped, and is cut off lead using cutter.So Afterwards, after processing as defined in being performed in electronic component mounting apparatus side, driving instruction is sent.For example, in the absorption using boarded head After suction or utilization grasp the electronic unit for the above-mentioned holding position that suction nozzle grasping keeps band to be kept, to electronic unit Feedway sends clamping and releases order, and electronic part feeder is made to discharge the clamping to electronic unit.Then, by making Suction nozzle rise and make the electronic unit kept on suction nozzle raise after, to feeder unit 114 send driving instruction.It is driven sending After dynamic instruction, feeder unit 114 is driven driving portion 144, makes holding band feeding claw unit 148 along with keeping band feeding Amount corresponding with keeping 1 pitch of holes with main body 72 is moved in the opposite direction in side.If feeder unit 114 is in step S2 In the state of, it will keep with feeding claw unit 148 to keeping conveying with the opposite one side of direction of feed, then protrusion 152a inclines Oblique face is contacted with hole 78a, and protrusion 152a is moved along inclination towards the direction extracted from the 78a of hole.Feeder unit as a result, 114 as shown in step S3, and protrusion 152a is made to depart from from the 78a of hole（Step S3）, band is kept not move, keeps band feeding claw unit 148 to keeping moving with the opposite one side of direction of feed.
Then, in feeder unit 114 since the state shown in step S2, make holding band feeding claw unit 148 along with It keeps after moving amount corresponding with keeping 1 pitch of holes with main body 72 with the opposite direction of direction of feed, such as step S4 institutes Show, become the state in the hole 78b for the upstream side that 152a insertions in protrusion are located at 1 amount of separation compared with the 78a of hole.At this point, due to Feeding claw 152 is pressed by spring 156 to the direction of hole 78b, so protrusion 152a is reliably made to be inserted into hole 78b.Then, drive Dynamic portion 144 will be kept with the next electronic unit kept in main body 72 immediately along band direction of feed is kept to be driven to guarantor Hold position conveying.
Feeder unit 114 is as noted above, by using driving portion 144 make holding band feeding claw unit 148 with guarantor It holds 1 with main body 72 corresponding amount of pitch of holes to move back and forth along direction of feed, so as to so as to keep band suitable along direction of feed Secondary 1 amount of separation of movement.
In the following, on the basis of Figure 14 to Figure 16, using Figure 22 to Figure 24, cutting unit is illustrated.Figure 22 is table Show the definition graph of the schematic configuration of the cutting unit of electronic part feeder.Figure 23 is to represent cutting for electronic part feeder The definition graph of the schematic configuration of disconnected unit.Figure 24 is the explanation of the schematic configuration for the cutting unit for representing electronic part feeder Figure.Electronic unit is kept the lead with the electronic unit kept to cut off by cutting unit 116.In addition, cutting unit 116 clamps Keep lead be cut off after electronic unit, until electronic unit is by suction（It keeps）Until.Cutting unit 116 has Support portion 162, driving portion 164, driving section 166, cutting portion 168 and cover 169.
Support portion 162 is integrally fixed at the component in framework 110, and driving portion 164 and driving section 166 are supported.In addition, Support portion 162 is supported cutting portion 168 via driving section 166.Driving portion 164 has fixed part 164a and movable part 164b.Driving portion 164 is the cylinder that the part for exposing the slave fixed part 164a of movable part 164b using air pressure is stretched.It drives Dynamic portion 164 makes the front end of movable part 164b on the extending direction of the line part of guiding groove 120, past in defined distance range It is multiple mobile.Driving section 166 is the transmission for transferring the power generated by the reciprocating movement of movable part 164b to cutting portion 168 Mechanism.Movable part 164b to the reciprocating movement with direction of feed is kept, is transformed to keeping band direction of feed by driving section 166 The movement in orthogonal direction makes cutting portion 168 along with keeping moving with the orthogonal direction of direction of feed.Driving section 166 make across The front end 166a configured by region of band and front end 166b is kept, to each other close direction or away from each other Direction, the direction movement i.e. shown in arrow 170.The driving section 166 of present embodiment, on the movable part 164b edges of driving portion 164 In the case of stretching out direction movement, make front end 166a and front end 166b close direction movement to each other.Driving section 166 exists In the case that the movable part 164b of driving portion 164 is moved to shrinkage direction, make front end 166a and front end 166b remote to each other From direction movement.
Cutting portion 168 is configured in holding area, and the main body of the electronic unit to being configured in holding area is kept, so Afterwards, the lead of electronic unit in main body and is kept cutting off between band main body, then, maintains to keep electronic unit State.Cutting portion 168 has the 1st blade 168a and the 2nd blade 168b.Cutting portion 168, which configures, makes the 1st blade 168a and In 2 blade 168b relative positions.In addition, band configuration is kept to be kept between the 1st blade 168a and the 2nd blade 168b The lead for taking kept electronic unit passes through by the position of the 1st blade 168a and the 2nd blade 168b clampings.1st blade 168a is as shown in figure 24, links with the front end 166a of driving section 166, if front end 166a is moved to the 2nd blade 168b sides, Then moved together with front end 166a to the 2nd blade 168b sides.2nd blade 168b is as shown in figure 24, the front end with driving section 166 Portion 166b links, if front end 166b is moved to the 1st blade 168a sides, to the 1st blade 168a together with front end 166b It moves side.In addition, the 1st blade 168a links via spring and front end 166a, pressed from front end 166a to the 2nd blade 168b sides Pressure.
Cover 169 is integrally fixed at the component in framework 110.169 configuration of cover is around the 1st blade 168a, the 1st blade 168a The face contacted with the 2nd blade 168b becomes opening.In addition, cover 169 is connected via spring with front end 166a, by front end 166a It is pressed to one side separate the 2nd blade 168b.Front end 166a is in situation about not pressed to the 2nd blade 168b sides as a result, Under, it can be to the power in direction of the 1st blade 168a applications away from the 2nd blade 168b.
Cutting unit 116 has said structure, and the 1st blade of the drawer at movable side of cutting portion 168 is made by using driving portion 164 168a and the 2nd blade 168b of affixed side are approached, and the main body of electronic unit is supported from side, and further by making to cut The 1st blade 168a of drawer at movable side and the 2nd blade 168b of affixed side in disconnected portion 168 are approached and contacted, so as to configure Lead cut-out between 1st blade 168a of drawer at movable side and the 2nd blade 168b of affixed side.In addition, cutting unit 116 will draw Line cut-out after, by maintain the 1st blade 168a and the 2nd blade 168b contact state, so as to from side to from keep band The main body of the electronic unit of main body cut-out is supported.I.e., it is possible to lead is cut off and is clamped from the holding band separated electricity of main body Subassembly.In addition, cutting unit 116 can also make the mechanism of cut-out electronic unit lead and to the electronic unit after cut-out（Electricity The main body of subassembly）It is clamped（Support）Mechanism formed with individual mechanism.
Herein, the off-position of the lead cut off to cutting unit 116 illustrates.It is inserted into existing substrate In the erecting device of the special boarded head of lead-type electronic-part, in the holding with anchor leg with close lead front end side It is cut off, it will be in very long lead insertion substrate.The reason is that existing erecting device is carrying rostral with lead Cutting portion and lead grasping part, will be cut off below after being grasped using lead grasping part to the root of lead（Pre-cut It is disconnected）, so the lead after cut-out is elongated.In addition, which is because, existing erecting device to the insertion that inserts in the hole due to drawing During line, it is inserted by the guiding of guiding pin, so even if lead is longer, will not interferes and be inserted into substrate.In addition, its reason exists In existing erecting device cuts off lead in substrate back to utilize（Formal cut-out）For required length and the lead of bending Bending device performs subsequent processing, and, it is necessary to which lead is protected when for keeping cutting off the pre-cutting of lead in from above-mentioned component Stay longer length.
In contrast, cutting unit 116 is so that the shearing length of the lead of radial lead type electronic unit becomes following rule Measured length, i.e. the lead that the specific length becomes the length identical with substrate thickness or protruded to substrate back side will not Failure welding is generated, and length is corresponding with substrate thickness.Specific length is, for example, the length roughly the same with the insertion hole of substrate. More specifically, it is to be grown compared with the length in the insertion hole of substrate more than or equal to 0mm and be less than or equal to the length of 3mm. It is as noted above, it is not necessary to pre-cutting be carried out to component using boarded head as shown in the prior art, but be configured to supply using component To device it is shorter from the beginning be cut to specific length, so as to obtain following effects.
Electronic component mounting apparatus 10 by by cutting unit 116 by lead it is shorter cut off, can utilize suction nozzle pair When the main body of electronic unit on the holding position of assembly supply device 100 is kept, the stabilization at lead interval is improved Property, the component that lead can be inserted in the hole can be increased, very efficiently and installation can be accurately proceed.
In addition, in existing erecting device, if compared with being pre-charged with or the solder coated in inserting in the hole, insert Enter longer lead, then solder almost all is squeezed out to lead front end side sometimes, and in reflow soldering, the solder of fusing can not It rises in the relatively areolar between insertion hole and lead so that failure welding.In contrast, in electronic component mounting apparatus 10 In, since lead is cut off shorter by cutting unit 116, so the solder of fusing can be risen in above-mentioned gap, can carry out It is full of the optimal welding of solder with having no gap.And at this point, by being also mounted in mounting type electronic unit coated on substrate On the solder of upper surface, so as to also generate following effects, i.e. wire type can be carried out at the same time by a reflow soldering process The carrying of electronic unit and mounting type electronic unit.In other words, if compared with being pre-charged with or coated in inserting in the hole Solder is inserted into long lead, then solder almost all is squeezed out to lead front end side, the weldering melted sometimes in reflow soldering Material can not be risen at substrate, i.e. solder can not reach substrate, failure welding.In contrast, in the electronic unit of said structure In erecting device, by by lead it is shorter be cut to above-mentioned specific length, if so as to because to the lead for the insertion that inserts in the hole So that a part of solder squeezed out from insertion hole becomes the state of fusing, then the back side of aforesaid substrate can be risen to, with substrate The electrode at the back side is welded.In addition, in insertion hole（Substrate aperture）Inside there is also electrode in the case of, can make on solder It is welded in gap between the electrode risen to inside lead and substrate.In this way, it can mechanically and electrically be welded.
In addition, by the way that defined length is set to the length identical with substrate thickness, even if so as to install footpath on substrate To lead-type electronic-part, lead can also be inhibited from substrate（The back side of substrate）The situation of protrusion.In addition, by that will provide length Degree is set to that the lead protruded to substrate back side is made to become the length that will not cause failure welding, even if so as to which lead be cut off It is shorter, can also lead be fixed on by reflow treatment by inserting in the hole for substrate well.
Air pressure adjustment section 118 is to the cylinder of the driving portion 144 as feeder unit 114 and as cutting unit The air pressure of the cylinder of 116 driving portion 164 is adjusted, and the driving of each several part is controlled.Specifically, air pressure Power adjustment section 118 controls the flexible of the movable part 144b of driving portion 144, i.e. position, the position progress to feeding claw 152 Control.In addition, air pressure adjustment section 118 controls the flexible of the movable part 164b of driving portion 164, i.e. position, to cutting The position of the 1st blade 168a and the 2nd blade 168b in disconnected portion 168 are controlled.In addition, air pressure adjustment section 118 is based on portion The control of part supply control part 64 controls the air pressure of each several part.
Assembly supply device 100 has said structure.Assembly supply device 100 is by being configured to, along holding band feeding side To multiple positions that the erecting bed 150 with feeding claw unit 148 will be kept to be mounted in front support portion 146 are set, can cut The position for keeping being configured compared with front support portion 146 with feeding claw unit 148 is changed, without replacing component A variety of electronic units that reply keeps the relative position between the hole with main body and electronic unit different keep band.That is, component supplies To device 100 by keeping the opposite position between hole of the holding with main body of band and electronic unit based on the electronic unit being packed into It puts, to the position for keeping installing on the 150 forward end support portion 146 of erecting bed with feeding claw unit 148 is switched over, so as to In the case where arbitrary electronic unit keeps band, electronic unit can moved to holding position.
Specifically, feeder unit 114 will keep 150 forward end of erecting bed with feeding claw unit 148 by change The position that support portion 146 is installed most extends so as to become to the movable part 144b of driving portion 144 in the scope moved back and forth The position of the protrusion 152a of feeding claw 152 in the position of state changes.Thus, it is possible to it is in feeder unit 114 The movable part 144b for making driving portion 144 is the position of the state most extended in the scope moved back and forth（It feeds end position, keep Position）When, make the position being located in hole of the holding with main body become various positions.As a result, feeder unit 114 even for Electronic unit keeps band compared with the different electronic unit of the allocation position of hole site, can also become reciprocal in movable part 144b During the state most extended in mobile scope, electronic unit is configured in holding position.
Additionally, it is preferred that in assembly supply device 100, by the reciprocating movement of the movable part 144b of feeder unit 114 Distance is set to than keeping distance and 2 times short than spacing between the hole with main body.Assembly supply device 100 can will be into as a result, The hole of next spacing is reliably inserted to the protrusion 152a of pawl 152, can will be protected by the once reciprocating movement of feeding claw 152 Hold the amount with 1 spacing of conveying.In addition, for assembly supply device 100, preferably in the object conveyor i.e. spacing in the hole of holding band In the case of there are multiple species, the distance of the reciprocating movement of the movable part 144b of feeder unit 114 is set to pitch of holes most Long hole is shorter compared with 2 times of the shortest holding of pitch of holes with spacing compared to longer.Assembly supply device 100 is being protected as a result, In the case of the spacing of band is held as any kind, the protrusion 152a of feeding claw 152 can be reliably inserted next spacing Hole, band can will be kept to convey the amount of 1 spacing by the once reciprocating movement of feeding claw.That is, assembly supply device 100 The distance of reciprocating movement need not be changed or carry out the replacement of component, it is possible to for the holding band of a variety of spacing, convey 1 respectively The amount of spacing.
Herein, the feeder unit 114 of the above embodiment, can be in 2 position selections compared with front support portion 146 and install and keep the position with feeding claw unit 148, but it's not limited to that for quantity.Feeder unit 114 is by increasing phase For front support portion 146, installation keeps the selectable position of the position with feeding claw unit 148, can tackle more Electronic unit keep band.In addition, feeder unit 114 may be set to be, can linearly adjust compared with front support Portion 146 and install keep the position with feeding claw unit 148.Such as may be set to be, by by front support portion 146 or It keeps with the screw hole in any one in feeding claw unit 148, being set to the long hole shape along keeping extending with direction of feed, from And front support portion 146 and holding can be made to be set with the holding between feeding claw unit 148 with the relative position in direction of feed It is set to various positions.In this case, it is preferable to front support portion 146 and holding are brought into the holding between feeding claw unit 148 To the relative position on direction, can be adjusted in the range of 1 pitch of holes amount of band is kept.Feeder unit as a result, 114 can arbitrarily adjust relative position, can also carry out the micro-adjustment of relative position.
In addition, the feeder unit 114 of the above embodiment is configured to, by front support portion 146 and band feeding claw is kept Unit 148 is used as position adjusting mechanism, by changing front end support portion 146 and keeping with opposite between feeding claw unit 148 Position, so as to change the state after keeping with conveying, i.e. movable part 144b moves back and forth the shape most extended in scope The position of the protrusion 152a of feeding claw 152 during state（Framework 110 can be adjusted and kept with opposite between feeding claw unit 148 Position）, but it's not limited to that.Feeder unit can will adjust framework and keep with opposite between feeding claw unit The various mechanisms of position, use as position adjusting mechanism.For example, assembly supply device can also be configured to, by that can adjust Holding between whole framework and feeder unit keeps band conveying to terminate with the relative position in direction of feed so as to change State afterwards, i.e. the position of movable part 144b protrusion 152a of feeding claw 152 in the state most extended in moving back and forth scope It puts.That is, installation position adjustment mechanism on the linking part that feeder unit can also be between feeder unit and framework.
In the following, the various modifications example of the electronic part feeder as radial direction feeder is illustrated.Figure 25 is table Show the oblique view of the schematic configuration of the other examples of cutting unit.Figure 26 is the cut-out represented from shown in Figure 25 from other directions The oblique view of the schematic configuration of unit.Figure 27 is the oblique view for representing the relation between the cutting unit shown in Figure 25 and framework. Figure 28 is the oblique view of the schematic configuration for the other examples for representing cutting unit.Figure 29 is for the cut-out list shown in definition graph 25 The definition graph of the action of member.Figure 30 is the definition graph for the action of the cutting unit shown in definition graph 25.In addition, Figure 25 extremely schemes The basic structure of cutting unit 116a shown in 30 is identical with cutting unit 116.In the following, the feature of cutting unit 116a is clicked through Row explanation.
Electronic unit is kept the lead with the electronic unit kept to cut off by cutting unit 116a.In addition, cutting unit 116a clampings keep the electronic unit after cut-out lead, until electronic unit is by suction nozzle 32（Adsorb suction nozzle or grasping suction nozzle） Absorption or grasping（It keeps）.Cutting unit 116a have support portion 162, driving portion 164, driving section 172, cutting portion 174 with And cover.
Driving section 172 is the biography for transferring the power generated by the reciprocating movement of movable part 164b to cutting portion 174 Motivation structure.Movable part 164b to the reciprocating movement with direction of feed is kept, is transformed to keeping band feeding side by driving section 172 Movement to orthogonal direction makes cutting portion 174 along with keeping moving with the orthogonal direction of direction of feed.Driving section 172 by every It the fixing piece 175 configured by region for keeping band and movable member 176 is formed.Driving section 172 make cutting portion 174 with can The 1st unit 174a that moving part 176 links, approached to the 2nd unit 174b linked with cutting portion 174 with fixing piece 175 or Separate direction movement.That is, the driving section 172 of present embodiment is as shown in figure 29, driving portion 164 movable part 164b to drawing In the case of the direction movement stretched, movable member 176 is made to be moved to close to the direction of fixing piece 175.Driving section 172 is in driving portion In the case that 164 movable part 164b is moved to the direction of contraction, movable member 176 is made to be moved to the direction away from fixing piece 175. As noted above, cutting unit 116a is configured to, and only makes a movement in 2 units of cutting portion 174.
Cutting portion 174 is configured in holding area, by the lead of the electronic unit configured in holding area in main body and It cuts off and keeps between holding band main body.Cutting portion 174 keeps both the main body of electronic unit 80 and lead, then Lead is cut off, the state kept to main body and lead is continued to after lead is cut off.Cutting portion 174 has the 1st Unit 174a and the 2nd unit 174b.There is 1st unit 174a 1178a, the 1st main body maintaining part 179a and the 1st lead to keep Portion 180a.1st sword 178a and the 2nd sword 178b becomes cutting mechanism 178, the 1st main body maintaining part 179a and the 2nd main body maintaining part 179b, which becomes main body holding mechanism the 179, the 1st lead maintaining part 180a and the 2nd lead maintaining part 180b, becomes lead holding mechanism 180.Cutting portion 174 is as shown in figure 30, and sequentially disposal subject holding mechanism 179, lead keep machine since vertical upside Structure 180 and cutting mechanism 178.
The each several part of 1st unit 174a and each several part of the 2nd unit 174b are configured in relative position.In addition, Band configuration is kept between the 1st unit 174a and the 2nd unit 174b, is cut off keeping the lead with the electronic unit kept Pass through at mechanism 178 and the position that lead holding mechanism 180 clamps, the main body of electronic unit is clamped by main body holding mechanism 179.
1st unit 174a of cutting portion 174 is supported on movable member 176, together with movable member 176 to Unit the 2nd 174b is approached, separate direction（Arrow direction in Figure 30）It is mobile.If the 1st unit 174a of cutting portion 174 to Unit the 2nd Direction movement close 174b then keeps the main body of electronic unit 80 as main body holding mechanism 179, lead keeps machine The state that structure 180 keeps the lead of electronic unit 80.Then, in cutting portion 174, if the 1st unit 174a is into one It walks and is moved to direction close the 2nd unit 174b, then the 1st sword 178a and the 2nd sword 178b of cutting mechanism 178 intersect, will Lead is cut off.In addition, in fig. 30, it appears that as the 1st sword 178a and the 2nd sword 178b are overlapped, but due to the 1st sword 178a and the The position of paper left and right directions of the 2 sword 178b on paper front-rear direction is different（It is tilted compared with conveying direction）, therefore it is actual On be not in contact with.
Cutting unit 116a makes holding electronic unit 80 using 1 driving portion 164 as driving source by driving section 172 Clamping device（Main body holding mechanism 179, lead holding mechanism 180）It is acted in linkage with the cutting mechanism 178 of cut-out lead 84. Cutting unit 116a can perform the holding to electronic unit 80 and the cut-out of lead by simple structure as a result,.At this On point, cutting unit 116 is also identical.
In addition, cutting unit 116a keeps the main body 82 of electronic unit 80 by using main body holding mechanism 179, So as to after lead 84 is cut off, suitably be kept to electronic unit 80.Thus, it is possible to it suitably keeps lead Electronic unit 80 after 84 cut-outs, easily can keep electronic unit 80 using suction nozzle 32.At this point, cut-out Unit 116 is also identical.
In addition, cutting unit 116a is by before lead 84 is cut off, carrying out electronic unit 80 using clamping device It keeps, particularly, the main body 82 of electronic unit 80 is kept, so as to which electronic unit 80 is being held in settling position In the state of upper, lead 84 is cut off.Thus, it is possible to it is appropriately cut off lead 84.In addition, by cutting unit 116a by lead Electronic unit 80 is kept using clamping device before 84 cut-outs, so as to inhibit the electronic unit after cut-out lead 84 The situation for coming off or dropping from holding position.
Cutting unit 116a by the basis of being kept to main body 82, being kept to lead 84, so as to The position of lead 84 is limited in cut-out, can more suitably be cut off lead 84.In addition, by using lead holding mechanism The lead 84 of 180 pairs of main body sides is kept, the deformation of the lead 84 for the main body side that so as to reduce cut-out when generates.
Cutting unit 116a is by regarding the one side of driving section 172 as fixing piece 175, so as to simplify the machine of device Structure.Furthermore it is possible to make to become stable position by the holding position of the cutting unit 116a electronic units kept, it can simplify and take The operation of carrier head 15.It is preferred that cutting unit 116a has both main body holding mechanism 179 and lead holding mechanism 180, but Can only have wherein any one.
Herein, cutting unit 116a is as shown in figure 27, to being formed on framework 110a using vertical as length Bolt 182,185 is inserted into the slot hole 181,184 in direction and is fixed.Cutting unit 116a can be to vertical as a result, Position be adjusted.Thus, it is possible to pair opposite with the electronic unit that is kept of holding band moved by feeder unit The position of vertical is adjusted.Therefore, cutting unit 116a can be compared with the position for keeping band, to cutting off the lead of lead The position in vertical direction, i.e. off-position corresponding with radial lead type electronic unit is adjusted.Cutting unit 116a as a result, The length of lead after cut-out can be adjusted.In addition, in the present embodiment, pair with radial lead type electronic unit pair The mechanism that the off-position answered is adjusted uses adjustment direction for the slot hole of length direction and for stationary phase for slot hole The combination of the bolt of position, but it's not limited to that for position adjusting mechanism.In electronic part feeder, as long as it can adjust The mechanism of the position of the Z-direction of whole cutting unit 116a, more specifically, can adjust cutting mechanism compared with holding area The electronic unit in domain keeps the mechanism of the position of the Z-direction of band.
In addition, cutting unit 116a has the bar 188 exposed to the outside of framework 110a.Bar 188 is straight with driving section 172 Line motion parts link.Cutting unit 116a is by making bar 188 be moved to arrow direction as a result, so as to utilize cutting portion 174 perform the cutoff action of electronic unit.That is, by the way that bar 188 is made to be moved to arrow direction, so as to perform with utilizing driving Portion 164 makes driving section 172 move along a straight line the identical action of action of direction movement.For example performing cutting unit as a result, In the case of the position adjustment of 116a, even if unfavorable drive driving portion 164 with the control device 20 of electronic component mounting apparatus 10 It is dynamic, the lead of electronic unit can also be cut off.In addition, even if the shape of air pressure or electric power is not being supplied to driving portion 164 Under state, the lead of electronic unit can also be cut off.
In addition, electronic part feeder 100 can also set the behaviour for driving driving portion 164 on framework 110a Make portion.As a result, in electronic part feeder 100, even if not operated using control device 20, it can also perform by cutting The cutoff action for the electronic unit lead that disconnected unit 116a is carried out.In addition, it is driven in this case it is desirable to be supplied to driving portion 164 Power（Air pressure or electric power）.
Figure 31 A are the definition graphs of the schematic configuration for the holding mechanism for representing cutting unit.Figure 31 B represent cutting unit The definition graph of the schematic configuration of the other examples of holding mechanism.The 2nd main body maintaining part 179b such as Figure 31 A institutes of cutting unit 116a Show, be the block in the hole 190 for being inserted into the bolt being fixed on the fixing piece 175 of driving section 172 with 2.It is protected in the 2nd main body It holds in portion 179b, the face parallel with the line for connecting 2 holes 190, is made of 4 different faces of the distance at a distance of hole 190.1st The distance between face 191a and hole 190 are arrow 192a.The distance between 2nd face 191b and hole 190 are arrow 192b.3rd face The distance between 191c and hole 190 are arrow 192c.The distance between 4th face 191d and hole 190 are arrow 192d.Arrow 192a, arrow 192b, arrow 192c and arrow 192d length are different.For cutting unit 116a, by the 2nd main body maintaining part When 179b is fixed on fixing piece 175, by the direction for changing the 2nd main body maintaining part 179b（Reversion, left and right reversion up and down）, from And the face opposite with the 1st main body maintaining part 179a can be switched to the 1st face 191a, the 2nd face 191b, the 3rd face 191c or 4 face 191d.Herein, since the position of the bolt of mounting hole 190 is fixed, so passing through switching and the 1st main body maintaining part Face opposite 179a, thus it is possible to vary the face opposite with the 1st main body maintaining part 179a of the 2nd main body maintaining part 179b and the 1st main body The distance between maintaining part 179a.
The 2nd main body maintaining part 179b and the 1st main body when cutting unit 116a can be by the cutoff action of lead as a result, are protected It holds the distance between portion 179a and is changed to 4 kinds, it can be according to the kind of the electronic unit supplied by electronic part feeder 100 Class is appropriate to adjust the distance between the 2nd main body maintaining part 179b and the 1st main body maintaining part 179a.
The 2nd main body maintaining part 195 shown in Figure 31 B is octagonal prism shape, and the 1st main body maintaining part 179a is 1 Flat face.2nd main body maintaining part 195 forms the hole 196 for being inserted into bolt.Hole 196 is by the conveying side with keeping band Slot hole of the direction moved to orthogonal direction, i.e. cutting unit as length direction.2nd main body maintaining part 195 passes through device to hole Relative position between 196 and bolt is adjusted, so as to the 2nd main body maintaining part in the direction of action to cutting portion 195 are adjusted compared with the position of bolt.It is as noted above, cutting unit by using the 2nd main body maintaining part 195, so as to It can be opposite with the 1st main body maintaining part 179a to the 2nd main body maintaining part 195 between the distance of the length direction in hole 196 The distance between face and the 1st main body maintaining part 179a are adjusted.Cutting unit can tackle more electronic units as a result, The width of main body.For example, cutting unit can grasp 20 kinds of lead-type electronic-parts while lead is cut off so that can be with The species of the lead-type electronic-part supplied in the state of cutting off after lead to holding position is 20 kinds.
Figure 32 is the definition graph of the schematic configuration of the other examples for the feeder unit for representing electronic part feeder.Figure 33 be the oblique view for representing the schematic configuration from the feeder unit shown in Figure 32 from other directions.Figure 34 is to represent Figure 32 institutes The front view of the schematic configuration of the feeder unit shown.Figure 35 is to represent that the schematic configuration of feeder unit shown in Figure 32 is bowed View.Figure 36 is the front view of the schematic configuration for other states for representing the feeder unit shown in Figure 32.Figure 37 is to represent figure The top view of the schematic configuration of other states of the feeder unit shown in 32.In addition, the feeder list shown in Figure 32 to Figure 37 Member 200 moves back and forth the shape most extended in scope except that can change the i.e. movable part 144b of state after keeping with conveying During state, outside the structure of the position of the protrusion 152a of feeding claw 152, substantially there is the structure identical with feeder unit 114.
Feeder unit 200 has support portion 202, driving portion 204, the 1st front support portion 206, holding band feeding claw list First 208, the 2nd front support portion 209, Return-ing direction keep band feeding claw unit 210 and linkage mechanism 211.Driving portion 204 has There is the structure identical with driving portion 144.In addition, the 1st front support portion 206 of present embodiment and holding band feeding claw unit 208 do not have the function of keeping the adjustment of the position with direction of feed.In addition, band feeding claw unit 208 is kept not have grasping part. 1st front support portion 206 and other structures of the holding with feeding claw unit 208 and front support portion 146 and holding band feeding claw Unit 148 is identical.
Support portion 202 is to driving portion 204, the 1st front support portion 206, keeps band feeding claw unit 208, Return-ing direction The mechanism being directly or indirectly supported with feeding claw unit 210 and linkage mechanism 211 is kept, is fixed in framework 110. Support portion 202 has the screw 232 of lug boss 230,2 of support member 222,2 and 2 screws 236.
The opposite plate-shaped member in support member 222 is with the area of the elongated box shape of framework 110 is most wide face, with drive Dynamic portion 204, the 1st front support portion 206 keep a face with feeding claw unit 208 opposite.Support member 222 and driving portion 204 fixed part connection, is supported fixed part.In addition, support member 222 is fixed on framework 110 via lug boss 230 On.
Lug boss 230 is configured in support member 222 with keeping the face with the opposite side in 208 grade of feeding claw unit opposite face On.Lug boss 230 is to keeping protruding with the separate direction of 208 grade of feeding claw unit.Lug boss 230 is in support member 222 It keeps in band direction of feed, to configure 2 on the separated position of predetermined distance.
2 screws 232 side end with lug boss 230 respectively（The end of side is contacted with support member 222）It screws togather.Separately Outside, screw 232 is inserted into respectively in the slot hole 222a formed in support member 222.The slot hole 222a formed in support member 222 It is along the hole for keeping extending with direction of feed.In addition, slot hole 222a has screw 232 is allow to be protected along holding band direction of feed Hold the shape moved in the range of the amount of a pitch of holes of band.
End side of 2 screws 236 respectively with lug boss 230 screws togather.In addition, screw 236 is inserted into framework respectively In the slot hole 212 formed on 110.The slot hole 212 formed in framework 110 is along the hole for keeping extending with direction of feed.It is in addition, long Hole 212 have allow screw 236 along keep with direction of feed be equivalent to keep band a pitch of holes in the range of move Shape.
In addition, in feeder unit 200, the screw 232 screwed togather with lug boss 230 is inserted into the slot hole of support member 222 In 222a.The lug boss 230 of feeder unit 200, screw 232, the slot hole 222a that is formed in support member 222 are combined into Position adjusting mechanism.It is by tightening screw 232 that lug boss 230 and support member 222 is tight compared with feeder unit 200 Gu so as to which feeder unit 200 and framework 110 are being kept being fixed with the relative position in direction of feed.In addition, Compared with feeder unit 200, by becoming the state after screw 232 is unclamped, so as to so that slot hole 222a and screw 232 Relative movement.Thus, it is possible to make the support member 222 for being formed with slot hole 222a, compared with the lug boss for inserting screw 232 230 relatively move on band direction of feed is kept.For feeder unit 200, by the way that support member 222 and lug boss can be made 230 relative movements can be such that feeder unit 200 is moved compared with framework 110 along holding band direction of feed so as to be formed State.Accordingly, for feeder unit 200, by unclamping screw 232, feeder unit 200 and framework 110 can be adjusted It is keeping with the relative position in direction of feed, by tightening screw 232, feeder unit 200 and framework 110 can protected It holds and is fixed with the relative position in direction of feed.
In addition, for feeder unit 200, the screw 236 screwed togather with lug boss 230 is inserted into the slot hole 212 of framework 110 In.The lug boss 230 of feeder unit 200, screw 236, the slot hole 212 that is formed in framework 110 are combined into position adjustment Mechanism.For feeder unit 200, lug boss 230 and framework 110 are fastened by tightening screw 236, it can be by feeder Unit 200 and framework 110 are keeping being fixed with the relative position in direction of feed.In addition, for feeder unit 200, It by forming the state after screw 236 is unclamped, can relatively move slot hole 212 and screw 236.Thus, it is possible to make to be formed There is the framework 110 of slot hole 212, relatively moved compared with the lug boss 230 for inserting screw 236 on band direction of feed is kept. For feeder unit 200, by that can relatively move framework 110 and lug boss 230, can be formed can make feeder list The state that member 200 is moved compared with framework 110 along holding with direction of feed.Accordingly, for feeder unit 200, pass through release Screw 236 can keep being adjusted with the relative position in direction of feed, pass through to feeder unit 200 and framework 110 Screw 236 is tightened, feeder unit 200 and framework 110 can kept being fixed with the relative position in direction of feed.
Since the formation of feeder unit 200 can make 200 entirety of feeder unit and framework 110 along holding band direction of feed The structure of relative movement, so part replacement etc. need not be carried out, it is possible to simply to the holding of feeding claw with direction of feed Position is adjusted.In addition, for feeder unit 200, by only unclamping screw 232 from the outside of framework 110, so that it may so that Feeder unit 200 is moved compared with framework 110.Thus, it is possible to it more simply carries out in the holding band direction of feed of feeding claw Position adjustment.Herein, making feeder unit 200 and framework 110, along keeping, band direction of feed is opposite to move operating personnel When dynamic, by grasping support member 222, make support member 222 compared with framework 110 along band direction of feed is kept to move, so as to It can make a relative move.In addition, operating personnel can also grasp lug boss 230 and make a relative move.In addition, operating personnel Make feeder unit 200 and framework 110 that it is loose to pass through grasping along when band direction of feed being kept to relatively move in release screw 236 Screw 236 after opening, makes screw 236 be moved compared with slot hole 212, so as to make 110 edge of feeder unit 200 and framework Band direction of feed is kept to relatively move.In this case, it is preferable to screw 236 is made to form the shape for being easy to grasping.
In addition, for feeder unit 200, carried out using the mechanism that screw 232 and slot hole 222a are combined and formed In the case that relative position moves, preferably become and utilize screw 236 by 230 fixed state of framework 110 and lug boss.In addition, For feeder unit 200, the situation that the mechanism that screw 236 and slot hole 212 are composed is made to relative position movement is being utilized Under, preferably become and utilize screw 232 by 230 fixed state of support member 222 and lug boss.
In addition, in feeder unit 200, set as position adjusting mechanism by screw 232 and slot hole 222a combinations The mechanism formed and the two mechanisms of mechanism for being composed screw 236 and slot hole 212 can utilize them to supply It is keeping being adjusted with the relative position in direction of feed between device unit 200 and framework 110, but it's not limited to that. In feeder unit 200, as position adjusting mechanism, it can also only set and lug boss 230 and support member 222 are fixed Part at the screw 232 that sets and the mechanisms that are composed of slot hole 222a.In addition, in feeder unit 200, as position Adjustment mechanism, can also only set 110 fixed part of lug boss 230 and framework, i.e. screw 236 and slot hole 212 are combined and Into mechanism.
In addition, for feeder unit 200, by using driving portion 204 the 1st front support portion 206 is made to be brought into along holding It is moved back and forth to direction, so that keeping with feeding claw unit 208 in the position shown in Figure 34 and Figure 35 and Figure 36 and Figure 37 institutes It is moved back and forth between the position shown.As a result, by moving back and forth holding band feeding claw unit 208, so as to feeder Unit 114 in the same manner, will be kept with the amount for conveying 1 spacing every time with direction of feed along holding.
Herein, the feeder unit 200 of present embodiment is as noted above, also with the 2nd front support portion 209, returns It goes back to direction and keeps band feeding claw unit 210 and linkage mechanism 211.In the following, using Figure 32 to Figure 37 and Figure 38 to Figure 43, it is right 2nd front support portion 209, Return-ing direction keep band feeding claw unit 210, linkage mechanism 211 to illustrate.Figure 38 is to represent figure The definition graph of the schematic configuration of feeder unit shown in 32.Figure 39 is other states for representing the feeder unit shown in Figure 32 Schematic configuration definition graph.Figure 40 is the explanation of the schematic configuration for the linkage mechanism for representing the feeder unit shown in Figure 32 Figure.Figure 41 is the definition graph of the schematic configuration for the other examples for representing framework.Figure 42 is the feeder shown in for definition graph 32 The definition graph of the action of unit.Figure 43 is the definition graph for the action of the feeder unit shown in definition graph 32.In Figure 41, Framework 280 is shown in order to illustrate feeder unit 200.
As shown in Figure 38 and Figure 39, the 2nd front support portion 209 is most wide with the area of the elongated box shape of framework 110 The opposite plate-shaped member in face, with driving portion 204, the 1st front support portion 206, keep another face with feeding claw unit 208 Relatively.That is, the 2nd front support portion 209 and support member 222 are configured across driving portion 204, the 1st front support portion 206 and guarantor It holds on the position with feeding claw unit 208.2nd front support portion 209 is fixed on support via linking part 226, linkage mechanism 211 On component 222.2nd front support portion 209 is the machine being supported to the holding of aftermentioned Return-ing direction with feeding claw unit 210 Structure is linked using linking part 226 and linkage mechanism 211.A part on the upside of the vertical in the 2nd front support portion 209 is from frame Body 110 exposes.That is, the part on the upside of the vertical in the 2nd front support portion 209, from the formation guiding groove 120 of framework 110 Expose towards the external of framework 110.In the part on the upside of the vertical in the 2nd front support portion 209, grasping part is set 228.In addition, 222 and the 2nd front support portion 209 of support member is with can be along keeping with the state that direction of feed moves to before the 1st End support portion 206 is supported.
Linking part 226 is made of bolt and nut etc., and the 2nd front support portion 209 is fixed on linkage mechanism 211. Grasping part 228 is as noted above, is arranged at the part on the upside of the vertical in the 2nd front support portion 209.Grasping part 228 It is the part that can be grasped by operating personnel.Grasping part 228 is formed as being easy to make operating personnel by 209 edge of the 2nd front support portion With the shape for keeping moving with the parallel direction of direction of feed.Operating personnel are by making the 2nd front support portion 209 along with keeping band The parallel direction movement of direction of feed, so as to so as to which band feeding claw unit 208 and Return-ing direction is kept to keep band feeding claw list Member 210, along with keeping moving with the parallel direction of direction of feed.
It is with keeping 208 essentially identical configuration of band feeding claw unit that Return-ing direction, which keeps band feeding claw unit 210,.It returns Direction keeps the direction with feeding claw unit 210 orthogonal with the surface of support portion 202, is disposed substantially away from holding band feeding claw unit 208 position and with keeping on the opposite position of feeding claw unit 208.Return-ing direction keeps band feeding claw unit 210 to fix In the 2nd front support portion 209, along linear movement direction together with the 2nd front support portion 209（The movable part of driving portion 204 moves Dynamic direction）It is mobile.In addition, Return-ing direction holding makes the direction of the feeding claw on linear movement direction with feeding claw unit 210 It is opposite with keeping band feeding claw unit 208.In addition, Return-ing direction keep with feeding claw unit 210 make the protrusion of feeding claw to The opposite one side protrusion in 202 side of support portion.
Linkage mechanism 211 is that the power in the 1st front support portion 206 will be transferred to from driving portion 204 to the 2nd front support portion 209 mechanisms transferred.Linkage mechanism 211 is as shown in figure 40, has the 1st sliding equipment 242,244 and the 2nd skate machine of driving section Structure 246.1st sliding equipment 242 has fixed part 242a and movable part 242b.Fixed part 242a is fixed on support portion 202.It can Dynamic portion 242b is with can be along linear movement direction（The direction of the movable part movement of driving portion 204）Mobile state is supported on fixed part On 242a.Movable part 242b is fixed in the 1st front support portion 206, along linear movement side together with the 1st front support portion 206 To movement.
Driving section 244 is the driver for transferring the power transferred from the 1st sliding equipment 242 to the 2nd sliding equipment 246 Structure.Driving section 244 has the gear being fixed on via pin on support portion.
2nd sliding equipment 246 has fixed part 246a and movable part 246b.Fixed part 246a is fixed on support portion 202. Movable part 246b with can along linear movement direction（The direction of the movable part movement of driving portion 204）Mobile state is supported on fixation On portion 246a.Movable part 246b is fixed in the 2nd front support portion 209, along linear movement together with the 2nd front support portion 209 It moves in direction.
Linkage mechanism 211 has said structure, and as driving section 244, gear is embedded in the movable of the 1st sliding equipment 242 In the gear grooved formed on portion 242b and the gear grooved formed on the movable part 246b of the 2nd sliding equipment 246.That is, link Mechanism 211 is linked 244 and the 1st sliding equipment 242 of driving section using rack and pinion mechanism, will be driven using rack and pinion mechanism 244 and the 2nd sliding equipment 246 of portion links.In addition, as shown in figure 40, for linkage mechanism 211, driving section 244 and the 1st is slided The position that motivation structure 242 links and the position for linking 244 and the 2nd sliding equipment 246 of driving section, become opposite with gear Position.As a result, in feeder unit 200, if gear rotates, the 1st sliding equipment 242 and 246 edge of the 2nd sliding equipment Move linearly direction opposite direction movement to each other.
Herein, the framework 280 of fixed supply device unit 200 is illustrated.As shown in figure 41, framework 280 formed with The identical guiding groove 282 of above-mentioned framework 110.The shape of guiding groove 282 is, will be along elongated on the upside of the vertical of framework 280 One side end of 2 line parts 283,285 that the length direction on surface is formed links at reflex part 284.That is, guiding groove 282 Be formed as following U-shaped, i.e. line part 283 is extended about from a side end of framework 280 to end side, another It turns back at reflex part 284 near side end, line part 285 extends to a side end.Guiding groove 282 is that electronic unit is kept The slot that band guides, from a side end of U-shaped（The end of supply side）It supplies electronic unit and keeps band.Guiding groove 282 Make supplied electronic unit that band be kept to be moved along U-shaped, from a side end of U-shaped（The end of discharge side）Discharge. In addition, guiding groove 282 is to keeping being located at the inside of framework 280 with main body and electronic unit is exposed to state outside framework 280 Electronic unit keep band guide.The reflex part 284 of framework 280 is keeping the peripheral side configuration guiding of the conveyor zones of band Portion 286a is configured with guide portion 286b in the inner circumferential side for the conveyor zones for keeping band.Guide portion 286a, 286b is respectively formed as edge The periphery for the conveyor zones turned back and the curved curve form of inner circumferential.Framework 280 at reflex part 284 by setting guide portion 286a, 286b and can utilize reflex part 284 holding band be made to be moved along appropriate direction.
In the following, using Figure 42 and Figure 43, the feed motion of band is kept to say the electronic unit of feeder unit 200 It is bright.It is as shown in figure 42, fixed in the 1st front support portion 206 to keep band feeding claw unit 208 for feeder unit 200, Return-ing direction is fixed in the 2nd front support portion 209 and keeps band feeding claw unit 210.
Keep band feeding claw unit 208 that there is feeding claw 152.Feeding claw 152 and 148 phase of above-mentioned holding band feeding claw unit It is the component with the protrusion 152a in a side end of bar-like member protrusion with ground.Feeding claw 152 configure with electronic unit On the position for keeping hole of the holding with main body of band 70 opposite, the shape of protrusion 152a is to keep the feeding in direction of feed Direction downstream side（The front side of direction of feed）Face 152b become the face orthogonal with direction of feed, keep in direction of feed into Give direction upstream side（The rear side of direction of feed）Face 152c become compared with the face inclined face orthogonal with direction of feed, with It approaches and keeps band, the narrowed width in direction of feed.Feeding claw 152 is in the situation in the position Shang You hole 78 opposite with protrusion 152a Under, become the state that protrusion 152a inserts in the hole as shown in figure 42.Herein, keep band feeding claw unit 208 configure with position On the position for keeping band 70 opposite in the line part 283 of guiding groove 282, protrusion 152a is configured in 284 side of reflex part.It keeps With feeding claw unit 208 band 70 will be kept to the holding area of absorption electronic unit in the line part 283 of guiding groove 282 PP is conveyed.
Return-ing direction keeps band feeding claw unit 210 to have feeding claw 252.Feeding claw 252 and above-mentioned holding band feeding claw Unit 208 is the component with the protrusion 252a in a side end of bar-like member protrusion in the same manner.Feeding claw 252 configures With on the opposite position in hole of the holding with main body for keeping band 70, the shape of protrusion 252a be keep in direction of feed into Give direction downstream side（The front side of direction of feed）Face 252b become the face orthogonal with direction of feed, keep in direction of feed Direction of feed upstream side（The rear side of direction of feed）Face 252c become compared with the face inclined face orthogonal with direction of feed, with It to approach and keeps band, the narrowed width in direction of feed.Feeding claw 252 is in the feelings in the position Shang You hole 78 opposite with protrusion 252a Under condition, become the state that protrusion 252a inserts in the hole as shown in figure 42.Herein, Return-ing direction keeps band feeding claw unit 210 Configuration is kept in the line part 285 of guiding groove 282 on the opposite position of band 70, protrusion 252a configure with reflex part The opposite one side in 284 sides.That is, Return-ing direction keeps the feeding claw 252 with feeding claw unit 210 to be configured to, in linear movement side The direction opposite with keeping the feeding claw 152 with feeding claw unit 208 upwards.Return-ing direction keeps band feeding claw unit 210 will The holding band 70 after holding area PP by adsorbing electronic unit is conveyed to the discharge unit of the line part 285 of guiding groove 282.
In the following, using Figure 43, the holding band feed motion of feeder unit 200 is illustrated.In step s 6, feed The protrusion 152a of pawl 152 is inserted into hole 78 of the holding with main body for keeping band 70, and the protrusion of feeding claw 252 is to keeping band main body Hole in be inserted into.Herein, the protrusion of feeding claw 152 is inserted into holding band direction of feed compared with holding area PP positioned at upper Swim side（Before holding area PP）Holding band 70 hole in.The protrusion of feeding claw 252 is inserted into holding band direction of feed On compared with holding area PP be located at downstream side（After holding area PP）And the holding band to turn back at reflex part 284 Kong Zhong.Feeder unit 200 as shown in step s beta, makes the protrusion of feeding claw 152 insert in the hole, is making the protrusion of feeding claw 252 In the state of inserting in the hole, driving portion 204 is driven, band feeding claw unit 208, Return-ing direction is kept to keep band feeding claw unit 210 move amount corresponding with keeping 1 pitch of holes with main body along holding with direction of feed.
If feeder unit 200 in the state of step S6, will keep band feeding claw unit 208, Return-ing direction to keep Band feeding claw unit 210 along band direction of feed is kept to convey, then using feeding claw 152 protrusion the face orthogonal with direction of feed And the face orthogonal with direction of feed of the protrusion of feeding claw 252, by hole to band direction of feed is kept to push, such as step S7 institutes Show, make holding band feeding claw unit 208 and band is kept to be moved to holding band direction of feed.Herein, band feeding claw list is kept Member 208 and Return-ing direction keep band feeding claw unit 210, are moved in the opposite directions to each other using linkage mechanism 211.It is such as above-mentioned Shown, Return-ing direction keeps band feeding claw unit 210, by being moved along with holding with the opposite direction of feeding claw unit 208, from And can be by the holding band in the hole with insertion feeding claw 152,252, edge keeps band direction of feed, that is, guiding groove 282, Xiang Congyin Portion is led to convey towards the direction of discharge unit.
If it keeps keeping with feeding claw unit 210 along holding with direction of feed with feeding claw unit 208, Return-ing direction Movement terminates（Step S7）, then feeder unit 200 electronic unit for the front end that holding kept with main body is made to be in holding position It puts and standby.At this point, positioned at holding position（Holding area）The electronic unit of PP, electronic component body are clamped and by cutting portions Lead is cut off.Then, defined processing is carried out in electronic component mounting apparatus side, such as will keep being located at guarantor with what is kept The electronic unit of position is held after boarded head supply, driving instruction is sent, drives driving portion 204, makes holding band feeding claw list Member 208, Return-ing direction are kept with feeding claw unit 210 along with keeping with the opposite direction of direction of feed, mobile with keeping band main The corresponding amount of 1 pitch of holes of body 72.If feeder unit 200 in the state of step S7, will keep band feeding claw unit 208th, Return-ing direction is kept with feeding claw unit 210 to keeping conveying with the opposite one side of direction of feed, then feeding claw 152, The inclined surface of 252 protrusion is contacted with hole, and the protrusion of feeding claw 152,252 is made to be moved along the direction for being tilted towards extracting from hole It is dynamic.Feeder unit 200 makes the protrusion of feeding claw 152,252 depart from from hole as shown in step S8 as a result,（Step S8）, protect It holds band not move, band feeding claw unit 208, Return-ing direction is kept to keep band feeding claw unit 210 to keeping band direction of feed Opposite side movement.
Then, in feeder unit 200 since the state shown in step S7, make holding band feeding claw unit 208, return Direction is kept with feeding claw unit 210 along with keeping with the opposite direction of direction of feed, mobile with keeping 1 hole with main body 72 After the corresponding amount of spacing, as shown in step S9, the protrusion for becoming feeding claw 152,252 is inserted into compared with the hole being inserted into step S7 State in the hole of 1 amount of separation of upstream side.Then, driving portion 204 will be protected immediately to band direction of feed is kept to drive It holds and is conveyed with the next electronic unit kept in main body 72 to holding position.
Feeder unit 200 is as noted above, keeps holding band feeding claw unit 208 by using driving portion 204 The corresponding amount of 1 pitch of holes with main body 72 is moved back and forth along direction of feed, so as to so that keep band along direction of feed sequentially The amount of mobile 1 spacing.
In addition, feeder unit 200 utilizes linkage mechanism by the way that Return-ing direction is set to keep band feeding claw unit 210 211, make Return-ing direction that band feeding claw unit 210 be kept to be driven with band feeding claw unit 208 is kept to link, so as to It will be conveyed by the holding band after holding area PP along direction of feed.It is as noted above, since holding area PP can will be passed through Holding band afterwards is conveyed along direction of feed, it is possible to move holding band in this both sides of the upstream and downstream of holding area PP. Thus, it is possible to inhibit the phenomenon that keep with the position offset for bending or keeping band in holding area PP.In addition, present embodiment Feeder unit 200, by using linkage mechanism 211 holding band feeding claw unit 208 and Return-ing direction is made to keep band feeding Pawl unit 210 moves in linkage, so as to move 2 feeding claws using 1 driving mechanism.In addition, by moving in linkage It is dynamic, the distance between 2 feeding claws can be maintained to fix, can suitably convey holding band.
Herein, preferably electronic part feeder 100 is keeping band direction of feed as shown in the respective embodiments described above On, the downstream side of the allocation position of feeding claw 152 and the upstream side configuration guarantor compared with reflex part in feeder unit 200 Hold region（Holding position）PP.That is, preferably in electronic part feeder 100, electronic unit 80 will be kept using suction nozzle 32 Holding area PP, configure and electronic unit kept to the folding of feeding claw 152 that band 70 conveyed to holding area and guiding groove 282 Between the portion of returning between clamped position.Thus, it is possible to inhibit by the electronic unit of holding area PP keep band 70 bend or The situation of deformation, can make electronic unit at holding area PP keep band 70 position and electronic unit 80 position it is steady It is fixed.
Figure 44 is the definition graph of the schematic configuration for the other examples for representing assembly supply device.Figure 45 is by the part of Figure 44 The definition graph amplified and represented.Electronic part feeder 310 has the plate-shaped member 312 with feeder unit connection, in frame Opening 314 is formed on body.Plate-shaped member 312 moves together with the fixed part of feeder unit along conveying direction.Opening 314 is in plate At the position overlapped with the end of plate-shaped member 312 in the movable range of shape component 312, formed along the more of vertical extension A side 314a, 314b, 314c, 314d.Herein, side 314a, 314b, 314c, 314d is formed in and the hole of various holding bands Interval and electronic unit are compared on the corresponding position of configuration in hole.Interval and electronics of the user for the hole for keeping band Component compared with the configuration in hole combination, make plate-shaped member 312 while position and with while 314a, 314b, 314c, 314d item The consistent side alignment of part, so as to be conveyed electronic unit to holding area from feeder unit.In addition, in present embodiment In, identically with the above embodiment, the interval and electronic unit for keeping the hole of band are combined as 4 kinds compared with the configuration in hole Situation, but as long as with combining shape that is corresponding and changing opening 314.
Figure 46 is the definition graph of the schematic configuration for the other examples for representing assembly supply device.Figure 47 is by the part of Figure 46 The definition graph amplified and represented.Electronic part feeder 320 shown in Figure 46 and Figure 47 is configured with holding band row in discharge unit Go out guide portion 322.Keep the angle formed with discharge guide portion 322 with the semicircular cylinder on the face opposite with discharge unit and vertical Direction for 60 degree is configured.In addition, it keeps configuring plate on the face opposite with guide portion 122 with discharge guide portion 322 Component.Electronic part feeder 320 keeps band discharge guide portion 322 by configuring, so as to so as to be discharged from discharge unit 126 Holding band change direction along semicircle canister portion, to suitably guiding on the downside of vertical.Thus, it is possible to passing through guiding groove And the electronic unit discharged from discharge unit keeps the discharge angle of band to be limited.Band discharge guide portion 322 is kept by will be with The opposite face of discharge unit is set to cylinder, and electronic unit is kept, with the load applied, can suitably to make electricity so as to reduce Subassembly keeps band to change direction.In addition, keep band discharge guide portion 322 by by the angle of inclination of cylindrical portion be set to compared with 60 degree of vertical keeps electronic unit, with the load applied, suitably to keep electronic unit so as to reduce Band changes direction.In addition, it keeps with discharge guide portion 322 by using Figure 46,47 structure, so as to the swimmingly side of change To, it can be to desired position discharge electronic unit holding band, but it is not limited to the structure.
Figure 48 is the definition graph of the schematic configuration for the other examples for representing assembly supply device.Figure 49 is by the part of Figure 48 The definition graph amplified and represented.Electronic part feeder 320 shown in Figure 48 and Figure 49, portion is provided in guide portion 122 Part placing box 324.Component placing box 324 sets lock section 326, and lock section 326 links with guide portion 122, is supported on guide portion 122 On.Component placing box 324 keeps band to accommodate the electronic unit supplied to electronic part feeder 320.In addition, electronics Component keeps band that can also keep being placed in component placing box 324 together with the chest of band with accommodating the electronic unit.The ministry of electronics industry Part feedway 320 can shorten position and guide portion that stored electrons component keeps band by set parts placing box 324 The distance between 122.Keep the position of band right during being conveyed to guide portion 122 thus, it is possible to reduce from stored electrons component Electronic unit is kept with the load applied.Thus, it is possible to electronic unit guarantor is suitably conveyed using electronic part feeder 320 Hold band.It is additionally possible to suppress electronic unit keeps the situation that band is broken due to dead weight or elongates hole.
In the following, component feed unit 14f is illustrated.Herein, there are component feed unit 14f 2 bowl formulas to supply Device assembly 90.2 bowl formula feeder assemblys 90 configure side by side, are substantially identical structure.In the following, to 1 bowl formula Feeder assembly 90 illustrates.
Figure 50 is to represent a bowl oblique view for the schematic configuration of formula feeder assembly.Figure 51 is the bowl formula represented shown in Figure 50 The oblique view of the schematic configuration of feeder assembly.Bowl formula feeder assembly 90 has 2 bowl formulas as shown in Figure 50 and Figure 51 Feeder unit 400 and supporting mechanism 401.In the present embodiment, bowl formula feeder unit 400 and the combination of bowl formula feeder Body 90 controls action by control unit.Bowl formula feeder unit 400 and bowl formula feeder assembly 90 can be by electronics Possessed by apparatus for mounting component 10 control device 20 as control unit use or bowl formula feeder unit 400 and Bowl formula feeder assembly 90 has control unit.
Supporting mechanism 401 is the mechanism being supported to 2 bowl formula feeder units 400.Supporting mechanism 401 has support Plate 491, support stick 492 and linking part 493.Support plate 491 is plate-shaped member, sets and fixes 2 bowl formula feeder units 400.The front end of the supply part side of support plate 491 links with the locating shaft 44b of front side receptacle 44 and recess portion 44c.Support Stick 492 links via the one side of linking part 493 and the separate front side receptacle 44 of support plate 491.The vertical of support stick 492 The end of downside is supported on the setting face for setting electronic component mounting apparatus 10（Ground）On.Supporting mechanism 401 utilizes front side to receive Container 44 and support stick 492 are supported the support plate 491 for being provided with 2 bowl formula feeder units 400.Supporting mechanism 401 By being propped up in front side receptacle 44 and at this 2 positions of support stick 492 away from front side receptacle 44 support plate 491 Support, bends so as to inhibit support plate 491.Thus, it is possible to inhibit bowl vibration of formula feeder unit 400 as support plate 491 vibration and absorbed situation, can suitably be driven bowl formula feeder unit 400.
1 bowl formula feeder unit 400 possessed by bowl formula feeder assembly 90 is configured to, aftermentioned to accommodate bowl and its He lines up 2 row by the collecting bowl of bowl formula feeder unit 400 along vertical, and compared with holding position（The front end of guide rail 422, Absorption position）Along front and rear offset.That is, bowl formula feeder assembly 90 in the Y direction, 2 bowl formula feeder units 400 it is aftermentioned Bowl configuration is accommodated on front and back position.Also, in X-direction（The conveying in the direction, substrate orthogonal with aftermentioned guide rail extending direction Direction）On, the bowl formula feeder unit 400 that bowl and the 2nd row are accommodated possessed by the bowl formula feeder unit 400 of the 1st row is had At least a portion that some accommodates the configuring area between bowl overlaps.That is, bowl formula feeder assembly 90 in the X direction, 2 bowls The position of the aftermentioned collecting bowl of formula feeder unit 400 overlaps ground configuration.In addition, bowl formula feeder assembly 90 is in the Y direction, The aftermentioned collecting bowl of 2 bowl formula feeder units 400 is configured on front and back position.Bowl formula feeder assembly 90 can be with as a result, Efficiently configure bowl formula feeder unit 400.Specifically, the narrowed width of X-direction can be made, can be installed in electronic unit The component of device 10, which can be supplied to, configures more assembly supply devices in region.
In the present embodiment, bowl is accommodated possessed by the bowl formula feeder unit 400 of the 1st row and the bowl formula of the 2nd row supplies To device unit 400（It is disposed substantially away from compared with the bowl formula feeder unit 400 of the 1st row at the position of holding position）It is possessed Bowl is accommodated, in the direction orthogonal with the extending direction of guide rail（The conveying direction of X-direction, substrate）On, it configures less than collecting bowl Outer diameter 2 times of region in.In this way, can reliably make the narrowed width of X-direction, it can be in electronic component mounting apparatus 10 Component can be supplied to more assembly supply devices are configured in region.
In the following, using Figure 52 to Figure 67 B, the bowl formula of the bowl formula feeder assembly 90 of component feed unit 14f is supplied Device unit 400 illustrates.Bowl formula feeder is used as the ministry of electronics industry by the bowl formula feeder unit 400 shown in Figure 52 to Figure 67 B Part feedway.First, using Figure 52 to Figure 54, the overall structure of bowl formula feeder unit 400 is illustrated.Figure 52 is table Show the side view of the other examples of component feed unit.Figure 53 is the top view for the other examples for representing component feed unit.Figure 54 be the side view for representing the state from the component feed unit shown in Figure 52 after dismounting collecting bowl.
Bowl formula feeder unit 400 has electronic part feeder（Bowl formula feeder）402nd, 404,406, driving device 408 and fixed part 410.That is, bowl formula feeder unit 400 be have 3 electronic part feeders 402,404,406 and can With in the mechanism of 3 position supply parts.In addition, 1 driving device 408 of bowl formula feeder unit 400 becomes electronic unit The driving portion of feedway 402,404,406.In addition, in bowl formula feeder unit 400, fixed part 410 supplies electronic unit It is supported to device 402,404,406 and driving device 408.Fixed part 410 has the frame shape extended along vertical Support portion 442 and support portion 444, in top and bottom to electronic part feeder 402,404,406 and driving device 408 are supported.In addition, until support portion 442 and support portion 444 extend to the rotation axis of aftermentioned driving device 408, driving The shape that dynamic device 408 can be rotated using the object part of electronic part feeder 402,404,406 as rotating shaft center Under state, driving device 408 is supported.
Electronic part feeder 402, which has, accommodates bowl 420a, guide rail 422a, supporting mechanism 424a and linking part 436a.Electronic part feeder 404, which has, accommodates bowl 420b, guide rail 422b, supporting mechanism 424b and linking part 436b.Electricity Subassembly feedway 406, which has, accommodates bowl 420c, guide rail 422c, supporting mechanism 424c and linking part 436c.Electronic unit It is stacked and matches somebody with somebody on the position of position overlapping of the feedway 402,404,406 in the horizontal direction for accommodating bowl 420a, 420b, 420c It puts, sequentially to accommodate being arranged in order for bowl 420a, 420b, 420c above vertical.In addition, electronic part feeder 402nd, configuration is at grade side by side by supporting mechanism 424a, 424b, 424c in 404,406.I.e., a plurality of guide rail 422a, The respective holding position configuration of 422b, 422c are at grade.
The only allocation position of electronic part feeder 402,404,406 is different and because of the different relation of the allocation position And the shape of guide rail 422a, 422b, 422c are different, are substantially identical structure.In the following, for electronic part feeder 402, 404th, 406 common ground for accommodating bowl 420a, 420b, 420c, is illustrated with accommodating bowl 420.In the same manner, for guide rail The common ground of 422a, 422b, 422c are illustrated with guide rail 422.For the common ground of supporting mechanism 424a, 424b, 424c, It is illustrated with supporting mechanism 424.For the common ground of linking part 436a, 436b, 436c, illustrated with linking part 436.
It is the container for being put into multiple electronic units to accommodate bowl 420.Guide rail 422 becomes the electricity that will be put into and accommodate in bowl 420 The guide member that subassembly is guided to absorption position.Supporting mechanism 424 is the ministry of electronics industry to being guided by guide rail 422 in absorption position The mechanism that part is supported.Linking part 436 links with accommodating the portion that shakes that applies of bowl 420 and driving device 408, from driving device 408 transfer vibration to bowl 420 is accommodated.In addition, in the present embodiment, in electronic part feeder 402,404,406, even Knot 436 and driving device 408 become vibration section.In the following, each several part is described in detail.
Using Figure 55 and Figure 56, illustrated to accommodating bowl 420.Figure 55 is the component feed unit represented shown in Figure 53 The definition graph for accommodating the relation between bowl and the support portion of vibration section of electronic part feeder.Figure 56 is represented shown in Figure 55 Collecting bowl schematic configuration definition graph.It is as noted above to accommodate bowl 420, is the container for being put into multiple electronic units.It receives Hold the main body 450 as container of bowl 420, be bottom surface for circular, outer rim to the extension of the direction of plane perpendicular, upper surface open Box shape.Bowl 420 is accommodated on the bottom surface of main body 450, there is the lug boss 451 to extension on the downside of vertical, to convex It rises in portion 451 inserted with the secure component 452 for being fastened with linking part 436.Secure component 452 is screw（Mounting screw）, Can with can compared with lug boss 451 rotate state and with not from lug boss 451 depart from construction be supported.Linking part 436 are provided with the fastener hole fastened by secure component 452（Screw hole）454.Bowl 420 is accommodated by making secure component 452 It is fastened in fastener hole 454, so as to be fixed on linking part 436.
It is as noted above, it accommodates bowl 420 and linking part is fixed on dismountable state by using using secure component 452 Construction on 436, so as to from electronic part feeder 402,404,406 and bowl formula feeder unit 400, easily It is dismantled to accommodating bowl 420 on ground.Bowl 420 is accommodated thus, it is possible to easily replace.
Also, a side end of guide rail 422 links with accommodating bowl 420, and end side links with supporting mechanism 424.It leads Rail 422 is formed with the guiding groove guided to electronic unit, makes to move along guiding groove from the electronic unit that collecting bowl 420 takes out of It is dynamic, and guide to the part linked with supporting mechanism 424.In addition, as described later, the part that guide rail 422 links with accommodating bowl 420 It is fixed on the vibration section of driving device 408, is vibrated with accommodating together with bowl 420.In addition, guide rail 422 links with supporting mechanism 424 A side end, can be slided along the extending direction of guide rail 422（It can slide in one direction）State be supported.
2 bowl formula feeder units 400 shown in Figure 50, Figure 51 are respectively provided with the multiple collectings configured towards vertical Bowl 420a, 420b, 420c.By the respective holding position with multiple guide rail 422a, 422b, 422c（Absorption position）Nearest one A bowl formula feeder unit 400 as the 1st row is supplied one in contrast away from holding position as the bowl formula of the 2nd row To device unit 400.At this point, multiple guide rail 422a, 422b, 422c possessed by the bowl formula feeder unit 400 of the 2nd row, the 1st The side of multiple guide rail 422a, 422b, 422c, match somebody with somebody side by side along vertical possessed by the bowl formula feeder unit 400 of row It puts.Also, as shown in figure 53, their the front end edge direction exhibition orthogonal with the extending direction of multiple guide rail 422a, 422b, 422c It opens, and the respective holding position of multiple guide rail 422a, 422b, 422c, i.e. supporting mechanism 424a, 424b, 424c are matched somebody with somebody side by side It puts at grade.
In the following, using Figure 57 A to Figure 58 B, supporting mechanism 424 is illustrated.Figure 57 A are the components represented shown in Figure 53 The oblique view of the schematic configuration of the supporting mechanism of the electronic part feeder of feed unit.Figure 57 B are represented shown in Figure 57 A The front view of the schematic configuration of supporting mechanism.Figure 58 A are the oblique views for other states for representing the supporting mechanism shown in Figure 57 A. Figure 58 B are the front views for the schematic configuration for representing the supporting mechanism shown in Figure 58 A.Figure 57 A and Figure 57 B are supporting mechanisms 424 The state that position adjustment is closed with bracket 470, Figure 58 A and Figure 58 B are that the position adjustment bracket 470 of supporting mechanism 424 is opened State.In addition, in Figure 57 B and Figure 58 B, in order to show the relative position of each component, virtually shown in the upside of bracket 470 Guiding groove 464.
Supporting mechanism 424 has pedestal 460, rail supporting portion 462, guiding groove 464 and absorption position adjustment unit 468.Pedestal 460 is integrally fixed at the component on bowl fixed part of formula feeder unit 400.Rail supporting portion 462 is with rotatable State be supported on wheel portion on pedestal 460, from vertical on the downside of guide rail 422 is supported.Rail supporting portion 462 with Rotation is performed in accordance with parallel to the movement on the direction of the extending direction of guide rail 422.Guide rail 422 is with can be compared with branch as a result, Support mechanism 424 is supported in the state that the direction parallel with extending direction is moved.Guiding groove 464 is formed in the guide rail of pedestal 460 The end of 422 extending direction.Guiding groove 464 and the slot of guide rail 422 link, and receive the electronic unit guided by guide rail 422. That is, guiding groove 464 receives the electronic unit by guide rail 422.
Absorption position adjustment unit 468 is the machine being adjusted to the absorption position of the electronic unit in supporting mechanism 424 Structure has position adjustment bracket 470, rotation axis 472, fixed part 474 and screw 476.Position adjustment bracket 470 is to match somebody with somebody It puts by the component on the position of the occlusion of guiding groove 464, protrusion 480 is formed in the end of 422 side of guide rail.Position adjustment bracket 470 is inaccessible by guiding groove 464 by using protrusion 480, so as to be supported to the electronic unit by guiding groove 464, so that It will not be moved to the downstream side of the electronic unit moving direction compared with protrusion 480.Position adjustment bracket 470 can as a result, Electronic unit is maintained on the assigned position of guiding groove 464.Rotation axis 472 is the extending direction stretching along guiding groove 464 Axis, be fixed on rotatable state on fixed part 474.Rotation axis 472 is supported position adjustment bracket 470, makes Position adjustment is become with bracket 470 can be along the state that the extending direction of guiding groove 464 moves and can be with along guiding groove 464 The axis that stretches out of extending direction centered on the state that rotates.Fixed part 474 is fixed on pedestal 460.
Screw 476 be by position adjustment bracket 470 on fixed part 474 fixed component, screw 476 is in position tune It is whole to be inserted into in the slot hole 482 formed on bracket 470.Slot hole 482 is the extending direction using guiding groove 464 as length direction Hole.In absorption position adjustment unit 468, position adjustment bracket 470 is fixed on fixed part 474 by using screw 476 On, so as to which position adjustment bracket 470 be fixed, becoming position adjustment bracket 470 can be compared with fixed part 474 The state that is moved along the extending direction of guiding groove 464 and it can be turned centered on the axis that the extending direction along guiding groove 464 stretches out Dynamic state.
Absorption position adjustment unit 468 has said structure, will by using screw 476 as shown in Figure 57 A and Figure 57 B Position adjustment bracket 470 is fixed on fixed part 474, so as in the assigned position of supporting mechanism 424 to electronic unit It is supported.In addition, absorption position adjustment unit 468 as shown in Figure 58 A and Figure 58 B, is used by the way that screw 476 is adjusted from position It is unloaded on bracket 470, so as to open the end 490 in the electronic unit moving direction downstream side of guiding groove 464.As a result, may be used To be fed to the electronic unit of guide rail 422 and guiding groove 464, from the front end of guiding groove 464（Under electronic unit moving direction Swim the end of side）Discharge.It is as noted above, by forming the mechanism that can discharge electronic unit from the front end of guiding groove 464, In the case where replacement collecting bowl 420 changes supplied electronic unit, it can simply vent and remain in guide rail 422 and draw Electronic unit in guide groove 464.
Electronic part feeder 402,404,406 is by making position adjustment bracket 470 become following constructions, i.e. into For that can be fixed compared with fixed part 474 along the state that the extending direction of guiding groove 464 moves, and using screw 476, so as to Easily the position adjustment on the extending direction of guiding groove 464 can be adjusted with the position of bracket 470.Thus, it is possible to It is corresponding with the species of electronic unit, the position for supporting electronic unit is changed.I.e., it is possible to the adsorption potential with electronic unit Put position that is corresponding and adjusting protrusion 480.Even if as a result, in the case where the electronic unit supplied is variety classes, Electronic unit can be supported in appropriate absorption position.
In addition, electronic part feeder 402,404,406 and makes support by the way that collecting bowl 420 is made to become said structure Mechanism 424 becomes said structure, and bowl 420 is accommodated so as to be easily changed, and can easily discharge the remaining electronics when replacing Component.Thus, it is possible to easily change the species of the electronic unit supplied by electronic part feeder 402,404,406.
In the following, using Figure 52 to Figure 54 and Figure 59 to Figure 64, driving device 408 is illustrated.Figure 59 is to represent figure The top view of the schematic configuration of the driving device of the electronic part feeder of component feed unit shown in 53.Figure 60 is to represent The oblique view of the schematic configuration of driving device shown in Figure 59.Figure 61 is to amplify the schematic configuration of the driving device shown in Figure 59 And the enlarged plan view represented.Figure 62 is the side view for the schematic configuration for representing the driving device shown in Figure 59.Figure 63 is to represent The side cutaway view of the schematic configuration of driving device shown in Figure 59.Figure 64 is for the dynamic of the driving device shown in definition graph 59 The definition graph of work.
Driving device 408 has motor 430, axis 432, line slideway 433, installation block as shown in Figure 59 to Figure 62 Portion 434, rail supporting portion 502, cardinal extremity guide rail（Arm）504th, fixed part 506 and rotation section 508.
Motor 430 is the driving source of driving device 408 as shown in Figure 59 to Figure 63, with motor body 550, partially Mandrel 552, bearing 554 and line slideway 556.Motor 430 by by motor body 550 make axis 550a rotate, so as to Rotate eccentric shaft 552.Motor 430 transfers rotary force via eccentric shaft 552 and bearing 554, rotates line slideway 556.
Axis 432 is as shown in Figure 59 to Figure 63, using the bearing 562,564 being fixed on fixed part, with rotatable state It is supported.In addition, bearing 562,564 is propped up using the washer 566 linked with axis 432 with the state not moved to vertical Support.
One side end of line slideway 433 is nearby supported on rotatable state on the outer end of line slideway 556, separately One side end is nearby fixed in installation stopper portions 434.In addition, line slideway 433 is propped up with the state that can be rotated around axis 432 Support.Herein, in line slideway 433 and line slideway 556, line slideway 433 become rail unit, line slideway 556 into For sliding unit.Line slideway 433 is linked with the transportable state of coupling position with line slideway 556 as a result,.That is, straight line The change in location that guide rail 433 links with line slideway 556.Using this structure, by rotating line slideway 556, so as to straight Line guide rail 433 is rotated centered on axis 432.
Installation stopper portions 434 are supported with the state that can be rotated around axis 432, are linked with line slideway 433.Stopper portions are installed 434 and line slideway 433 linked using connecting member 570.Installation stopper portions 434 are along the extending direction with line slideway 433 The elongated plate-shaped member that orthogonal horizontal direction is stretched out, end links with rail supporting portion 502.In addition, installation stopper portions 434 The upper surface of the plate-shaped member linked with line slideway 433 links with linking part 436.In addition, installation stopper portions 434 with each company The position that knot 436 links configures the component identical with the elongated plate-shaped member that line slideway 433 links, upper surface and company Knot 436 links.Install stopper portions 434 also as shown in Figure 52 to Figure 53, set along vertical extend stick portion, the stick portion and The end connection of elongated plate-shaped member.Stopper portions 434 and the elongated plate-shaped member linked with linking part 436 are installed as a result, It is integrally rotated for rotation axis with axis 432.
Rail supporting portion 502 and the end of installation stopper portions 434 link.Cardinal extremity guide rail（Arm）504 side end with Rail supporting portion 502 links, and end side links with guide rail 422.Cardinal extremity guide rail 504 utilizes rail supporting portion 502, will install The rotational motion of stopper portions 434 is transformed to move along a straight line and be transferred.In addition, electronics of the cardinal extremity guide rail 504 with accommodating bowl 420 The supply unit connection of component, guides next electronic unit direction guiding rail 422 is supplied from collecting bowl 420.Fixed part 506 is fixed on drive On the part do not moved i.e. pedestal of dynamic device 408 etc..Rotation section 508 is supported on rotatable state on fixed part 506.Turn And with the fixing end 520 being supported on using rotatable state on fixed part 506 and as cardinal extremity guide rail 504 lead in dynamic portion 508 The movable end 522 of the linking part of rail 422.For rotation section 508, between movable end 522 and cardinal extremity guide rail 504 and guide rail 422 Linking part links, and the moving area of the linking part between cardinal extremity guide rail 504 and guide rail 422 is limited.
Driving device 408 has said structure, and as shown in Figure 64, motor 430 is driving source, is passed to line slideway 433 It passs driving force and rotates.In addition, installation stopper portions 434 are fixed with the state that can be rotated around axis 432, by making line slideway 433 rotations, so as to be rotated centered on the rotation axis of axis 432.The rotation direction guiding rail support portion 502 of installation stopper portions 434 transfers. The driving force for the rotation direction for installing stopper portions 434 is transformed to the driving force of rectilinear direction by rail supporting portion 502, leads cardinal extremity Rail（Arm）504 move back and forth along the direction parallel with the extending direction of guide rail.At this point, it is arranged on cardinal extremity guide rail 504 and guide rail Rotation section 508 on linking part between 422 centered on fixing end 520, makes the company between cardinal extremity guide rail 504 and guide rail 422 Knot, that is, movable end 522 rotates.408 formation as noted above of driving device, by making installation stopper portions 434 and cardinal extremity guide rail 504 vibrations, so that being mounted on the collecting bowl 420 installed in stopper portions 434 via linking part 436 and connecting with cardinal extremity guide rail 504 The guide rail 422 of knot vibrates.Bowl formula feeder unit 400 vibrates collecting bowl 420 by using driving device 408, so that putting Enter to accommodate the electronic unit in bowl 420 to move in collecting bowl 420, direction guiding rail 422 supplies.In addition, bowl formula feeder unit 400 Vibrate guide rail 422 by using driving device 408, so as to will in the guide rail 422 guiding electronic unit to supporting mechanism 424 Supply.
Bowl formula feeder unit 400 is by the collecting bowl as noted above by assembly supply device 402,404,406 along lead Vertical direction is stacked, and so as to effectively utilize the region of horizontal direction, can be saved space and be configured multiple components supply dresses It puts.Bowl formula feeder unit 400 can supply multiple electronic units to absorption position as a result,.In addition, bowl formula feeder unit 400 are stacked by the collecting bowl as noted above by assembly supply device 402,404,406 along vertical, so as to prop up Support mechanism 424 is closely configured with horizontal direction.Thus, it is possible to close to the absorption position of electronic unit, component suction can be reduced The displacement distance of boarded head when attached.In addition, bowl formula feeder unit 400 is by regarding 1 driving device 408 as 3 components The driving portion of feedway 402,404,406 uses, and so as to reduce driving source, can make simplified.It is in addition, logical It crosses and the rotation axis of assembly supply device 402,404,406 is supported using fixed part 410, so as to so that each several part is stablized Ground vibrates.In addition, in the bowl formula feeder unit 400 of the above embodiment, assembly supply device is set to 3, but not This is defined in, the quantity of assembly supply device does not limit.
In addition, in the present embodiment, as the driving portion of bowl formula feeder unit 400, having used makes collecting bowl 420 shake Dynamic driving mechanism, but it's not limited to that.Form the electronic part feeder of bowl formula feeder unit 400（Bowl formula supply Device）As long as electronic unit 80 can be supplied and direction guiding rail 422 by the way that collecting bowl 420 is made to tremble.For example, as driving portion, The driving portion that can also swing collecting bowl 420.
Figure 65 is by the part amplification of electronic part feeder and the oblique view of expression.Bowl formula feeder unit 400 Assembly supply device 402,404,406, as shown in Figure 65, have the end of 420 side of collecting bowl in guide rail 422 is whether there is Initiating terminal sidepiece part detection sensor 580a, 580b, 580c that electronic unit is detected.Initiating terminal sidepiece part detection sensor 580a, 580b, 580c are detected the end of 420 side of collecting bowl in guide rail 422 with the presence or absence of electronic unit.As rise Beginning sidepiece part detection sensor 580a, 580b, 580c can use laser sensor.Bowl formula feeder unit 400 passes through profit Whether the end of 420 side of collecting bowl in guide rail 422 is deposited with initiating terminal sidepiece part detection sensor 580a, 580b, 580c It is detected in electronic unit, is examined so as to whether be rested on to electronic unit on guide rail 422 in state is filled It surveys.For example, detect the state of electronic unit in certain time in initiating terminal sidepiece part detection sensor 580a, 580b, 580c In the case of inside persistently detecting, bowl formula feeder unit 400 due to electronic unit stops at assigned position and as can not The state that the front of direction guiding rail 422 is advanced, it is possible to be judged to filling state.
Figure 66 is by the part amplification of electronic part feeder and the oblique view of expression.Bowl formula feeder unit 400 Assembly supply device 402,404,406 it is as shown in Figure 66, have in the front end of guide rail 422（Absorption position, holding position） Whether there is holding position sidepiece part detection sensor 582a, 582b, 582c that electronic unit is detected.Holding position sidepiece part inspection Sensor 582a, 582b, 582c are surveyed to whether there is electronic unit at front end side, that is, holding position of corresponding guide rail 422 It is detected.Holding position sidepiece part detection sensor 582a is that have the optical profile type of illumination region 584a and acceptance part 586a sensing Device.Both illumination region 584a and acceptance part 586a are configured on the position across holding position.Holding position sidepiece part detection Sensor 582a is detected in the case where the measure light exported from illumination region 584a is by acceptance part 586a light in mensuration region （It is holding position in the present embodiment）There is no electronic unit.Holding position sidepiece part detection sensor 582a is from illumination region In the case that the measure light of 584a outputs is not by acceptance part 586a light, detect in mensuration region（In the present embodiment For holding position）There are electronic units.In the same manner, holding position sidepiece part detection sensor 582b is also with illumination region 584b With the optical sensor of acceptance part 586b, holding position sidepiece part detection sensor 582c be also with illumination region 584c and by The optical sensor of light portion 586c.Holding position sidepiece part detection sensor 582a, 582b, 582c utilize identical structure pair Electronic unit is whether there is to be detected.400 utilization holding position sidepiece part detection sensor 582a, 582b of bowl formula feeder unit, 582c is detected to whetheing there is electronic unit in holding position, and bowl formula feeder unit 400 is driven based on testing result. Bowl formula feeder unit 400 is for example being determined as holding position using holding position sidepiece part detection sensor 582a, 582b, 582c In the case of putting no electronic unit, driving device 408 is driven, conveys electronic unit.
In addition, electronic component mounting apparatus 10 can also be performed in the suction nozzle 32 using boarded head 15 to bowl formula feeder In the case of the action that the electronic unit of the holding position of unit 400 is kept, passed using the detection of holding position sidepiece part In the case that sensor 582a, 582b, 582c are detected at holding position there are the situation of electronic unit, perform to holding position Electronic unit kept holding action, using holding position sidepiece part detection sensor 582a, 582b, 582c detect Go out at holding position not having standby in the case of the situation of electronic unit.Electronic component mounting apparatus 10 can more may be used as a result, Electronic unit is kept by ground, can inhibit the phenomenon that perform holding action in the case of not having electronic unit at holding position. Electronic component mounting apparatus can more efficiently perform the holding action of electronic unit as a result,.
Figure 67 A are by the part amplification of electronic part feeder and the oblique view of expression.Figure 67 B are from other directions Represent the oblique view of a part for the electronic part feeder shown in Figure 67 A.In addition, in Figure 67 A, Figure 67 B, a bowl formula is shown The assembly supply device 402 of feeder unit 400, but assembly supply device 404,406 also has identical structure.Component supplies Device 402 has air supplying part 590, and the base that will be accommodated bowl 420 and guide rail 422 and connect is located in the electronic unit for accommodating bowl 420 When holding the end of 422 side of guide rail of guide rail 504, to vertical upside（The direction of arrow 591）Spray air.Air supplying part 590 By spraying the air in 591 direction of arrow to the end of 422 side of guide rail of cardinal extremity guide rail 504, so that the electricity positioned at the position Subassembly, which returns, accommodates bowl 420.
Cardinal extremity guide rail 504 is configured with guide portion 592 on the linking part between accommodating bowl 420.Guide portion 592 will from The electronic unit that bowl 420 is not suitable direction into the electronic unit that cardinal extremity guide rail 504 conveys is accommodated to guide to bowl 420 is accommodated. That is, guide portion 592 causes the electronic unit conveyed in the electronic unit conveyed to cardinal extremity guide rail 504 with inappropriate direction, Cardinal extremity guide rail 504 will not be entered.Specifically, guide portion 592 is contacted in the lead of the electronic unit of unsuitable direction Plate-shaped member is configured at position, the electronic unit that lead is in contact is guided to bowl 420 is accommodated.
In addition, cardinal extremity guide rail 504 is sprayed in air supplying part 590 is provided with the portion of dropping on the upside of the vertical in the region of air 594.The portion 594 that drops is configured in the outside of cardinal extremity guide rail 504（Away from the one side for accommodating bowl 420）, it is provided with towards vertical The rake for accommodating bowl 420 is moved closer on the upside of direction.Portion 594 drop using rake, will sky be sprayed by air supplying part 590 Gas and by the electronic unit lifted on the upside of vertical, to accommodating the guiding of 420 side of bowl.Thus, it is possible to inhibit electronic unit to The outside for accommodating bowl 420 flies out.
As shown in Figure 67 A and Figure 67 B, assembly supply device 402 makes to move towards guide rail 422 by setting air supplying part 590 Electronic unit return accommodate bowl 420, so as to which by electronic unit, suitably direction guiding rail 422 guides.For example, component supply dress It puts 402 regularly to blow by using air supplying part 590, so as to regularly return the electronic unit positioned at object's position Bowl 420 is held in recycling.Thus, it is possible to it will obliquely be conveyed compared with guide rail 422 and do not move into the electricity of guide rail 422 in subject area Subassembly excludes.In addition, assembly supply device 402 can also utilize air supplying part 590, the court that will could not be excluded by guide portion 592 It is excluded to inappropriate electronic unit.In addition, in the present embodiment, as on the cardinal extremity guide rail 504 for making 422 initiating terminal of guide rail Electronic unit return accommodate bowl 420 mechanism, be provided with air supplying part 590, but it's not limited to that.For example, it is also possible to substitute Air supplying part 590 and using mechanical mechanism.
In the following, the action of each several part of electronic component mounting apparatus is illustrated.In addition, the electronic unit of the description below Each several part action, can be by being controlled to perform to the action of each several part by control device 20.
Using Figure 68 to Figure 74, the shape recognition action of the electronic unit of electronic component mounting apparatus is illustrated.Figure 68 be for illustrating the definition graph of the shape recognition of the electronic unit of electronic component mounting apparatus action.Figure 69 is for illustrating electricity The definition graph of the shape recognition action of the electronic unit of subassembly erecting device.Figure 70 is for illustrating electronic component mounting apparatus Electronic unit shape recognition action definition graph.Figure 71 is for illustrating the shape of the electronic unit of electronic component mounting apparatus The definition graph of shape identification maneuver.Figure 72 is for illustrating saying for the shape recognition of the electronic unit of electronic component mounting apparatus action Bright figure.Figure 73 is the schematic diagram of an example of the testing result for representing identification maneuver.Figure 74 is the detection for representing identification maneuver As a result the schematic diagram of a example.
Electronic component mounting apparatus 10 is as noted above, and the shape of electronic unit is surveyed using laser identification device 38 Amount.Laser identification device 38 is as shown in Figure 66, and the state of electronic unit 80 is configured between light source 38a and photo detector 38b Under, laser is exported from light source 38a, the laser reached using photo detector 38b detections, so as to configuring in light source 38a and light The shape of component between element 38b is detected.In addition, laser identification device 38 is in the electronic unit to being adsorbed by suction nozzle 32 After the shape in 80 direction is detected, using suction nozzle driving portion 34 suction nozzle 32 is made to move or rotate, make electronic unit 80 Mobile or rotation, carries out SHAPE DETECTION again.It is as noted above, laser identification device 38 by rotating electronic unit 80, from It is and as shown in Figure 66 so as to the direction of the irradiation laser of electronic unit 80 and photo detector 38b compared with electronic unit 80 Angle change.
Electronic component mounting apparatus 10 is as shown in Figure 74, as step S11, the height with the Z-direction of electronic unit 80 It is corresponding, be configured between light source 38a and photo detector 38b in the state of electronic unit 80, by laser identification device 38 from Light source 38a irradiates laser to certain area.Then, in electronic component mounting apparatus 10, as step S12, the ministry of electronics industry is started The rotation of part 80（The rotation in θ directions）.
Then, after the rotary speed that electronic component mounting apparatus 10 is rotated in electronic unit 80 reaches certain speed, as Step S13 starts with the shape measure that laser identification device 38 carries out the regulation direction of electronic unit 80.At this point, laser is known Other device 38 is configured between light source 38a and photo detector 38b in the state of electronic unit 80, from light source 38a to certain area Laser is irradiated in domain, and carries out light to laser using photo detector 38b.Herein, do not had by the laser that electronic unit 80 intercepts Reach photo detector 38b or strength reduction.Laser identification device 38 can be according to swashing by photo detector 38b light as a result, The distribution of light is detected the shape of the electronic unit 80 in the section of the angle measured.In the present embodiment, laser Identification device 38 is detected the end of the laser by photo detector 38b light, to the electronic unit 80 in the direction most Outer shape is detected.In electronic component mounting apparatus 10, as step S14, while electronic unit 80 is rotated, The SHAPE DETECTION of electronic unit 80 is repeated using the method for step S13, so as to the shape to rotate a circle to electronic unit 80 Shape is detected.Thus, it is possible to the shape in whole directions of electronic unit 80 is detected.Laser identification device 38 is such as above-mentioned Shown, the shape in the direction to rotating a circle is detected, and as shown in Figure 71, the testing result of all directions shape is superimposed, from And the 3D shape of electronic unit 80 can be detected exactly（The shape of outermost part）.
Herein, as noted above, the electronic component mounting apparatus 10 of present embodiment will be used as radial lead type electronics The electronic unit 80 of component carries on substrate 8.Electronic component mounting apparatus 10 is in the shape to the electronic unit 80 shown in Figure 72 In the case that shape is detected, the shape detected as the height of the Z-direction measured is different is different.That is, electronics The laser identification device 38 of apparatus for mounting component 10 performs in the case of performing detection at online A as shown in Figure 72, at online B Shape detected in the case of detecting is performed in the case of detection is performed in the case of detection, at online C, at online D is Different shape.
It, as shown in Figure 73, can for example, if laser identification device 38 carries out shape measure at the line A shown in Figure 72 To detect the shape of the main body 82 of electronic unit 80.In addition, if laser identification device 38 carries out at the line B shown in Figure 72 Shape measure then as shown in Figure 74, can detect the shape of the lead 84 of electronic unit 80.Further, since laser identification dress The shape for putting the outermost part of the measurement height of 38 pairs of electronic units is detected, so the shape as electronic unit, inspection Measure the outermost part with electronic unit（Outermost lead 84）Relevant shape.In addition, if laser identification device 38 Shape measure is carried out at the line C shown in Figure 72, then the shape of the lower surface position of main body 82 can be detected, if in Figure 72 Shape measure is carried out at shown line D, then can detect the shape of the lower surface position of lead 84.Electronic component mounting apparatus 10 by adjusting the height of the Z-direction of the suction nozzle 32 of electronic unit 80 is adsorbed with, so as to so that laser identification device 38 is right The position that the shape of electronic unit 80 measures becomes various positions.
Figure 75 is for illustrating the definition graph of the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.Separately Outside, in electronic component mounting apparatus 10, as the electronic unit of radial lead type electronic unit, sometimes using shown in Figure 75 Electronic unit 80a.Electronic unit 80a forms notch 89 in a part of main body 82a.Electronic unit 80a's forms notch 89 part becomes the shape different from other electronic units.In addition, electronic unit 80a can be according to the position for being formed with notch 89 It puts and judges direction.
Herein, the control unit 60 of the electronic component mounting apparatus 10 of present embodiment, presets by operating personnel Carry the position for the electronic unit that electronic unit, the i.e. suction nozzle of object is adsorbed（Position in the Z-direction of electronic unit） In the case of, it is detected using the electronic unit shape of position of the laser identification device 38 to being set by operating personnel.As above Shown in stating, electronic component mounting apparatus 10 is by based on the position set by operating personnel, surveying the shape of electronic unit Amount, so as to using the character shape part of electronic unit as measurement position, can more precisely perform electronic unit The detection of the direction of category identification and electronic unit.
In addition, carry out the shape recognition of electronic unit using laser identification device 38 for electronic component mounting apparatus 10 Situation is illustrated, but it's not limited to that.In electronic component mounting apparatus 10, as state detecting section, it can also make The camera of three-dimensional measurement is carried out with the electronic unit shape to being supported in framework 11（The VCS units 17 of present embodiment）. In addition it is also possible to use the camera for carrying out three-dimensional measurement well known in addition to VCS to electronic unit shape.By using The camera of three-dimensional measurement is carried out to electronic unit shape, interval to the lead front end of the electronic unit of measure object is drawn Curved shape, article body shape of line etc. measure, so as to perform identical processing.
Figure 76 is the flow chart of an example of the action for representing electronic component mounting apparatus.Using Figure 76, to the ministry of electronics industry The outline of the disposed of in its entirety action of part erecting device 10 illustrates.In addition, the processing shown in Figure 76 is by by control device 20 control the action of each several parts and perform.In electronic component mounting apparatus 10, as step S52, production routine is read in.It is raw Stages of labor sequence is to be generated by dedicated production routine generating means or given birth to based on the various data inputted by control device 20 Into.
After electronic component mounting apparatus 10 reads in production routine in step S52, as step S54, to the state of device It is detected.Specifically, the structure to component feed unit 14f, 14r, the species of the electronic unit having been filled with, be ready for Species of suction nozzle etc. is detected.Electronic component mounting apparatus 10 is detected and prepares to the state of device in step S54 After, as step S56, substrate is moved into.Electronic component mounting apparatus 10 moves into substrate in step S56, to installation electricity After the position placement substrate of subassembly, as step S58, electronic unit is installed to substrate.Electronic component mounting apparatus 10 exists In step S58 after the installation of electronic unit, substrate is taken out of as step S60.Electronic component mounting apparatus 10 is in step After substrate is taken out of in S60, as step S62, whether production is terminated to judge.Electronic component mounting apparatus 10 is in step It is determined as that production is not in S62（It is no）In the case of, S56 is entered step, performs the processing of step S56 to step S60. That is, perform based on processing of the production routine to substrate installation electronic unit.Electronic component mounting apparatus 10 judges in step S62 Terminate for production（It is）In the case of, terminate present treatment.
Electronic component mounting apparatus 10 passes through as described above, production routine is being read and after carrying out various settings, to substrate Electronic unit is installed, so as to produce the substrate for being equipped with electronic unit.In addition, in electronic component mounting apparatus 10, As electronic unit, the lead-type electronic-part for the lead being connected with main body and with the main body is installed to substrate, specifically It says, passes through the hole for forming lead on substrate（It is inserted into hole）Middle insertion, so as to which the electronic unit is installed to substrate.
Figure 77 is the definition graph for an example for representing operation screen.Figure 78 is the explanation for the part for representing operation screen Figure.Figure 79 A are the definition graphs for an example for representing component feed angle degree.Figure 79 B are an examples for representing component feed angle degree The definition graph of son.Figure 80 is the definition graph for an example for representing operation screen.Figure 81 is an example for representing operation screen Definition graph.Figure 82 is the definition graph for the part for representing operation screen.Figure 83 A to Figure 83 D are to represent electronic unit respectively The definition graph of the example to locate.
In the following, using Figure 77 to Figure 83 D, the various information to the electronic unit that will be installed to electronic component mounting apparatus 10 One example of the processing logged in illustrates.Letter of the electronic component mounting apparatus 10 based on the electronic unit after login Breath, is determined the various values of the installation process based on production routine, based on the value after determining, performs the peace of electronic unit Dress.In addition, the various information of electronic unit can be logged in as a part for production routine, multiple production journeys are can also be used as The information for the electronic unit monomer that sequence shares and log in.
Electronic component mounting apparatus 10 is in display unit 42（Touch panel 42a or picture monitor 42b）Upper display Figure 77 Shown operation screen 602.Operation screen 602 shows various cuits.Operating personnel pass through by operation screen Various operations are carried out in the state of 602 displays, so as to input the information of electronic unit.In addition, in Figure 77, show by The picture that the information of electronic unit is inputted as parts data, but electronic component mounting apparatus 10 can also input substrate number According to, carry data, adsorpting data, image data.
Operation screen 602 shown in Figure 77 shows to input the cuit 604 of the component categories of electronic unit and use In the cuit 606 of input package shape.In addition, operation screen 602 includes：Input includes horizontal stroke, length, the height of electronic unit The project of appearance and size including degree, wire length；Selection uses laser in centering mode（Laser identification device 38）Still Use image（VCS units 17）Project；Input package size（The size of electronic component body）Project etc..Also, it is grasping Make also to show in picture 602：For showing the label of the detail items of encapsulation shape, centering, additional information, extension, inspection etc.. In addition, in the operation screen 602 of present embodiment, as the detail items of encapsulation shape, supplied comprising expression to holding position The component of the angle for the electronic unit given provides the cuit 608 of angle, keeps the cuit with species and represents electricity The cuit of the pitch information of the configuration spacing of subassembly.
Herein, cuit 604 is for inputting the project of the species of logged in electronic unit, if options Mesh then as shown in Figure 78, shows the list 610 of options in drop-down menu.In list 610, except various electronic units Species outside, also show insertion part and the options of other component.Operating personnel are by making cursor 612 be directed at desired choosing Item is selected, is determined operation, so as to input information into the cuit 604 of component categories.
In cuit 608, the component of the angle as the electronic unit for representing to supply to the holding position inputted There is provided angle, can select 0 °, 90 °, 180 °, 270 ° or other.It is electronics in subject electronic component for example, as shown in Figure 79 A In the case of component 614, the state after electronic unit 614 is rotated by 90 ° every time is respectively 0 °, 90 °, 180 °, 270 ° of posture.Behaviour Make personnel based on holding position from electronic unit 614 to electronic part feeder supply when posture become which kind of posture, and To 608 input angle of cuit.In addition, the reference position of the angle of electronic unit 614 can be set by operating personnel.
In addition, in electronic component mounting apparatus 10, as shown in Figure 79 B, electronic unit 616 is with compared with holding band sometimes The state of 618 inclination predetermined angulars is kept.Herein, electronic unit 616 is thin film capacitor.Operating personnel are in such as ministry of electronics industry In the case that posture shown in part 616 does not meet 0 °, 90 °, 180 °, any one of 270 °, the input electronic unit in " other " 616 angle.Herein, it is preferred as suction nozzle 32 in boarded head 15 in the case where being kept to electronic unit 616 Implement the grasping suction nozzle kept using being clamped to electronic unit 616.Electronic component mounting apparatus 10 is using grasping suction In the case that mouth keeps electronic unit 616, provided by the component based on input in " other " to cuit 608 Angle is adjusted the angle of suction nozzle, so as to so that the contact surface of grasping suction nozzle becomes the inclination pair with electronic unit 616 The angle answered, it is possible to reduce keep the generation of mistake.
In electronic component mounting apparatus 10, if in display unit 42（Touch panel 42a or picture monitor 42b）On In the state of showing the operation screen 602 shown in Figure 77, the label of additional information is selected by operation portion 40, then in operation screen Operation screen 620 shown in 602 local display Figure 80.In operation screen 620, the cuit for carrying intrusion is included 622 and absorption intrusion cuit 624.In addition, operation screen 620 also shows following selection projects：Whether test run is carried out Whether row is discharged using sensor confirmation component, whether carries out the correction of component absorption position, whether performing automatic teaching, being No execution unit is skipped.In addition, going back the project that display unit is discarded, it is used to input in the case where component is discarded（Judge It can not be in the case of the state of installing component to be in）Electronic unit processing method.
The project for the size for being pressed into electronic unit from upper surface of base plate when cuit 622 is for being set in carrying. " 0 " is the value that the distance between electronic unit and substrate is made to become 0 in design load.In electronic component mounting apparatus 10, if Numerical value becomes larger to forward direction, then electronic unit is made to be moved to compared with substrate to the state of press-in on the downside of vertical.Pass through setting Intrusion can inhibit due to the influence of the flatness of substrate etc., and be carried in a state that component does not reach substrate, There is a situation where carrying offset or when carrying, component slides on solder.In addition, in order to by electronic unit more reliably to base Plate is installed, and initial value preferably is set to positive value, such as is set to 0.5mm.
Intrusion when cuit 624 keeps for component.That is, for being set in the holding position of electronic part feeder Put the project of the suction nozzle and the distance between electronic unit in the case that place keeps electronic unit by suction nozzle." 0 " is in design load Make the value that the distance between maintaining part of electronic unit and suction nozzle is 0.In electronic component mounting apparatus 10, if numerical value is to just To becoming larger, then suction nozzle is made to be moved to compared with electronic unit to the state of press-in on the downside of vertical.By setting intrusion, from And it can inhibit due to part dimension（Highly）The influence of fluctuation etc. so that suction nozzle can not reach electronic unit, can not be to component It is adsorbed situation about either grasping or phenomena such as electronic unit of chip form is holded up occurs.In addition, in order to more reliably Electronic unit is kept using suction nozzle, initial value is preferably set to positive value, such as is set to 0.2mm.
In addition, the cuit of 620 display unit layer of operation screen.The cuit of component layer is in same carrying layer Each component the project that is set of relative importance value.By setting the project, in situation about being produced with optimization order Under, the relative importance value of the carrying order of the electronic unit can be set.
In addition, the cuit of the display clamping suction nozzle data of operation screen 620.Herein, so-called clamping suction nozzle is grasping And keep the grasping suction nozzle of electronic unit.Pressing position is the position pressed in grasping electronic unit.Horizontal direction Gap is the project in the gap between the press surface and component of the affixed side arm that grasping suction nozzle is inputted with negative.Suction nozzle during absorption The project in suction nozzle direction during absorption when direction is for inputting with 0 degree of supply part.It is for inputting to adsorb height fine adjusting function value Grasping height during grasping（Absorption height）Deviant project.
In electronic component mounting apparatus 10, if in display unit 42（Touch panel 42a or picture monitor 42b）On In the state of showing the operation screen 602 shown in Figure 77, the label of extension is made choice by operation portion 40, then in operation picture Operation screen 630 shown in the local display Figure 81 in face 602.In operation screen 630, show to being held by laser identification device 38 The project that the various conditions of the state detection process of capable electronic unit are set.It is included in operation screen 630；Setting is inhaled The cuit 634 of the cuit of mouth translational speed, the cuit of laser elevation 632 and component shape.Herein, θ Speed（During measurement）The project of the θ axle accelerations of suction nozzle when being input laser identification, θ speed（Outside measurement）It is that input is swashing Light centering after rotation, such as obtain carry angle rotation in the case of suction nozzle θ axle accelerations project.
Cuit 632 is the project of distance of the input from suction nozzle front end during measurement to coplanar laser illumination.Cuit 634 be the project of the shape for the electronic unit for inputting measure object, as shown in Figure 82, the profit from the list 636 of display options It is specified with cursor 638, so as to the information of input block shape.Pass through the shape of input block, tool in cuit 634 The body shape of electronic unit is said body, may thereby determine that and the shape of electronic unit is being carried out using laser identification device 38 In the case of identification, the characteristic point of the electronic unit is determine whether.For example, no unfilled corner is being had input into cuit 634 In the case of, 4 vertex are detected.In the case of the electronic unit 640,641 shown in Figure 83 A, respectively to 1 to 4 this 4 The position on a vertex is detected.Thus, it is possible to position offset, angle offset are detected.In addition, to cuit In the case of having had input unfilled corner in 634,5 to 8 vertex are detected.In the situation of the electronic unit 642 shown in Figure 83 B Under, the position on 1 to 6 this 6 vertex is detected.In the case of the electronic unit 643 shown in Figure 83 B, to 1 to 8 this 8 The position on vertex is detected.Thus, it is possible to position offset, angle offset are detected.It is inputted into cuit 634 In the case of PLCC, 8 vertex are detected.In the case of the electronic unit 644 shown in Figure 83 C, to 1 to 8 this 8 The position on vertex is detected.In addition, in the case of PLCC, 4 points can be used from 8 vertex detected, are aligned Put offset, angle offset is detected.In addition, in the case where having input flexibility into cuit 634, to making XY directions 8 points that component width becomes near minimum are detected.It is right in the case of the electronic unit 646,647 shown in Figure 83 D The position of 1 to 8 this 8 points is detected.In the case of the electronic unit 643 shown in Figure 83 D, to 1 to 8 this 8 vertex Position is detected.Thus, it is possible to position offset, angle offset are detected.
Electronic component mounting apparatus 10 can show operation screen 602,620,630 etc. with as noted above, obtain With the associated various information of electronic unit.Electronic component mounting apparatus 10 passes through based on acquired associated each with electronic unit Kind information carries out the installation process of electronic unit, so as to suitably carry electronic unit to substrate.In addition, the ministry of electronics industry Part erecting device 10 is by the suitable no lead of setting without lead electronic unit（Mounting type electronic unit）And with oriented substrate The lead-type electronic-part of the lead of insertion（Insert type electronic unit）Various cuits, so as to perform and each electricity The corresponding processing of subassembly.For example, in electronic component mounting apparatus 10, as component categories, it can input and be expressed as inserting Enter the insertion part of type electronic unit.Electronic component mounting apparatus 10, can be to being by being detected to component categories as a result, Mounting type electronic unit or insert type electronic unit are detected, i.e. to when mounted whether by lead to the hole of substrate（It inserts Enter hole）Middle insertion（Insertion or carrying）It is detected.
Using Figure 84 and Figure 85, the identification maneuver of the shape of electronic unit is illustrated.Figure 84 and Figure 85 is table respectively Show the flow chart of an example of the action of electronic component mounting apparatus.Processing shown in Figure 84 and Figure 85 is by by control unit 60 control the action of each several parts and perform.
Processing shown in Figure 84 is the processing set to the position for measuring electronic unit shape.Herein, control unit 60 can carry out the processing shown in Figure 84 when being measured every time to the shape of electronic unit, can also be carried in opposite substrate When the carrying action of electronic unit is set, performed for whole electronic units, in actual electro part carrying processing, It can also be based on the prior result performed and determine（Measure the setting result of position）Carry out shape measure.
As step S112, whether control unit 60 is to having measurement position to be set for judging.Herein, so-called measurement position Setting, refers to the electronic unit for object, by the information of the position measured to shape of operating personnel's setting, above-mentioned behaviour Make the input value of the laser elevation in picture.Control unit 60 is determined as there is setting in step S112（It is）In the case of, as Step S114, the setting measurement position based on setting, i.e. the measurement position set by operating personnel is set as the electronic unit Measurement position, terminate present treatment.In addition, control unit 60 is determined as no setting in step S112（It is no）In the case of, as Reference position is set as measuring position, terminates present treatment by step S116.Herein, so-called reference position, refers to according to electronics The classification of component, i.e. capacitor or IC chip etc. and set reference measurement site.
Electronic component mounting apparatus 10 as noted above can set measurement position by operating personnel, can incite somebody to action The position that operating personnel arbitrarily set is as measurement position.In addition, electronic component mounting apparatus 10 can be to 1 electronic unit It is multiple to measure position setting.For example, in the case of radial lead type electronic unit, it can be to main body and this 2 positions of lead Shape measure.In addition, electronic component mounting apparatus 10, in the case where setting measurement position, being obtained based on setting should The information of shape at the measurement position of electronic unit.In addition, the information as shape, can use and utilize laser identification dress Put 38 measure after as a result, can also use by operating personnel input the electronic unit shape data.
In the following, the processing shown in Figure 85 is the processing before electronic unit installation, it is the survey of electronic unit shape specifically Amount processing and the determination processing based on measurement result.In addition, control unit 60 is directed to the whole electronic unit execution figures to be kept 85 processing.As step S120, control unit 60 obtains the data of the electronic unit of keeping object.Herein, so-called holding pair As（Adsorb object, grasping object）Electronic unit data, refer to carry the electronic unit on substrate needed for Various information.The data of the electronic unit of keeping object are to maintain the position of the assembly supply device 100 of the electronic unit, electronics The shape data of component, the absorption height of electronic unit（Keep height）, by laser identification device 38 electronic unit is surveyed Information of measurement position of amount etc..
After obtaining data in the step s 120, as step S122,60 true measurement position of control unit.That is, control unit 60 Based on the data obtained in step S120, the Z axis side of the definite position being detected to the shape of electronic unit, i.e. electronic unit Upward position.In addition, control unit 60 can also carry out the place of step S120 and step S122 before the absorption of electronic unit Reason.
In step S122 true measurement position and using suction electronic unit in the case of, as step S124, control unit 60 are adjusted the Z axis position of electronic unit.That is, control unit 60 by the way that suction nozzle is made to be moved along Z-direction, So that the measurement position of the electronic unit determined in step S122 is moved to the measured zone of laser identification device 38.Control unit After 60 are adjusted the Z axis position of electronic unit in step S124, as step S126, the shape of electronic unit is carried out Measurement.That is, control unit 60 is detected the shape at the measurement position of electronic unit using laser identification device 38.
After control unit 60 is detected the shape at the measurement position of electronic unit in step S126, as step Whether S128 terminates to judge to measurement.That is, the shape measure that measures position at of the control unit 60 to being determined in step S122 Whether terminate to be judged.Control unit 60 is determined as that measurement is not in step S128（It is no）In the case of, it enters step S124 carries out the processing of step S124 and step S126 again, and the shape for measuring the measurement position being not over is measured. Control unit 60 is by the position adjustment and shape measure as noted above that electronic unit is repeated, so as to set measurement The shape of position is detected.
Control unit 60 is determined as that measurement terminates in step S128（It is）In the case of, as step S130, measurement is tied Fruit and reference data are compared.Herein, reference data is the absorption object obtained in step S120（Keeping object）Electricity The data of subassembly shape.Control unit 60 is by the way that measurement result and reference data are compared, so as to the electronics adsorbed Whether component is the shape consistent with reference data, and whether the direction of electronic unit is consistent with the direction of reference data etc. is sentenced It is fixed.
After being compared in step s 130, as step S132, whether control unit 60 suitably judges component.Tool It says, whether control unit 60 is in step S132 to having adsorbed electronic unit with installable state and judging body.Control unit 60 are determined as that component is inappropriate in step S132（It is no）In the case of, as step S134, the ministry of electronics industry that suction nozzle is adsorbed Part is discarded, and terminates present treatment.Control unit 60 makes boarded head and suction nozzle be moved to the position opposite with component storage portion 19, passes through The electronic unit that the suction nozzle is kept is put into component storage portion 19, so as to which electronic unit be discarded.In addition, control unit 60 is again It performs same kind of electronic unit to the same loading position of substrate（Installation site）The processing of installation.
Control unit 60 is determined as that component is appropriate in step S132（It is）In the case of, as step S136, to component Direction（Direction on the direction of rotation of suction nozzle）Whether suitably judged.That is, to the electronic unit that is adsorbed whether with benchmark Direction identical judged.In addition, as step S136, the control unit 60 of present embodiment whether electronic unit is inverted into Row judges.Control unit 60 is determined as that direction is inappropriate in step S136, i.e., electronic unit is the state after reversion（It is no）Feelings Under condition, after inverting electronic unit in step S138, S140 is entered step.
In the case that control unit 60 is judged to being in step S136 or in the case of performing the processing of step S138, As step S140, based on holding position, to the loading position of electronic unit（Installation site）It is finely adjusted.For example, based on electricity The testing result of the shape of subassembly, the position that electronic unit to suction are detected, based on holding position compared with The offset of reference position, suction nozzle and the relative position of substrate during to installation are adjusted.Control unit 60 is performing step S140 Processing after, terminate present treatment.In addition, control unit 60 carry out Figure 85 step S140 processing after, to the electronics judged Result of the component based on step S140 and electronic unit is carried on substrate.
Electronic component mounting apparatus 10 by it is as noted above using laser identification device 38 to the shape of electronic unit into Row detection, based on as a result, various processing are carried out, so as to more suitably carry electronic unit on substrate.
Electronic component mounting apparatus 10 discards electronic unit in the step S134 of the flow chart shown in Figure 85, but also may be used With unsuitable in the lead format for being determined as electronic unit, the processing being modified to lead format is performed.That is, Electronic unit can not be discarded in step S134, but the lead of electronic unit is corrected（Processing）For pluggable shape Shape, and to loading position（Installation site）Installation.In electronic component mounting apparatus 10, electronic part feeder can be utilized The mechanism for being used to clamp electronic unit of 100 cutting unit, is modified the lead of electronic unit, can also utilize in addition The correction mechanism of setting is modified the lead of electronic unit.It is as noted above, it is processed as the shape to lead Unit is processed, the mechanism clamped to the main body or lead of electronic unit, the correction mechanism in addition set etc. can be used Various units.
Figure 86 is the flow chart of an example of the action for representing electronic component mounting apparatus.In the following, using Figure 86, to electricity The state of the lead of subassembly（Shape）Identification maneuver illustrate.In addition, the processing shown in Figure 86 is partly with using State the identical processing of the electronic unit identifying processing of laser identification device 38.In electronic component mounting apparatus 10, as step S150 is adjusted Z axis position, and the shape of lead is made to be moved to measurement position.Electronic component mounting apparatus 10 is in step After electronic unit is made to be moved to and locate in S150, as step S152, electronic unit is made to rotate and perform measurement.In addition, The processing of step S152 is identical with the processing of above-mentioned Figure 70.After electronic component mounting apparatus 10 performs measurement in step S152, As step S154, the outermost shape of lead is detected based on measurement result.That is, measurement position at pair with outside The relevant shape of lead is detected.
After electronic component mounting apparatus 10 is detected the outermost shape of lead in step S154, as step S156 is made the direction of electronic unit rotate to the direction set, is measured with set direction, i.e. with fixed 1 Towards measuring, as step S158, the radical of lead is detected based on measurement result, terminates present treatment.
Herein, Figure 87 A are the definition graphs for an example for representing electronic unit.Figure 87 B are the measurement knots for representing lead The definition graph of an example for fruit.Figure 88 A are the definition graphs for an example for representing electronic unit.Figure 88 B represent lead The definition graph of one example of measurement result.In electronic component mounting apparatus 10, such as carrying out the ministry of electronics industry shown in Figure 87 A In the case of the lead format measurement of part 670, in step S156, surveyed with the direction to paper front-rear direction irradiation laser Amount.If the picture shown in Figure 87 B is detected as measurement result into the shape measure of line lead with the direction shown in Figure 87 A Waveform 673 shown in face 672.Waveform 673 exports reduction at the position there are lead.Electronic unit 670 has 5 leads. Therefore, waveform 673 goes out to export reduced trough in 5 location detections.
In the following, in electronic component mounting apparatus 10, surveyed in the lead format for carrying out the electronic unit 671 shown in Figure 88 A In the case of amount, measured in step S156 with the direction to paper front-rear direction irradiation laser.If with shown in Figure 88 A Direction into the shape measure of line lead, detect the waveform 675 shown in the picture 674 shown in Figure 88 B as measurement result.Ripple Shape 675 there are lead position export reduce.Electronic unit 671 has 3 leads.Therefore, waveform 675 is at 3 positions It detects to export reduced trough.
It is as noted above, in electronic component mounting apparatus 10, by electronic unit with defined towards fixed, progress shape Measurement, by being parsed to its result, so as in addition to the outermost shape of electronic unit, also detect to provide Towards the radical of the lead detected（The radical of pin）.Electronic component mounting apparatus 10 by carrying out the processing of Figure 86, so as to In addition to the outer shape of electronic unit, to be also detected to the radical of lead.
Using Figure 89 and Figure 90, illustrate to measure the electronic unit after shape whether be appropriate judgement an example.That is, One example of the processing to being performed in step S130, S132 of Figure 85 illustrates.Figure 89 is to represent electronic unit installation dress The flow chart of one example of the action put.Figure 90 is the definition graph for representing lead and the relation being inserted between hole.Electronic unit Erecting device 10 is used as step S160, obtains the outermost shape of the lead of electronic unit.In addition, the outermost shape of lead can It is detected with the processing using above-mentioned Figure 86.After electronic component mounting apparatus 10 obtains shape in step S160, as step Rapid S162, to whether consistent with electronic unit to be mounted judging.Namely based on the characteristic point of the outermost shape of lead, Whether the electronic unit just kept to suction nozzle is that the electronic unit of mounting object judges.In addition it is also possible to performing step During the judgement of S162, shape, shape of main body in addition to the outermost shape of lead etc. is compared.
Electronic component mounting apparatus 10 is determined as consistent with electronic unit in step S162（It is）In the case of, into step Rapid S166, be determined as it is inconsistent（It is no）In the case of, enter step S169.Electronic component mounting apparatus 10 is in step S162 It is determined as in the case of being, as step S166, judges whether the interval of outermost shape is included in permissible range. Specifically, electronic component mounting apparatus 10 by the outermost shape of the lead detected and insertion lead substrate be inserted into hole into Row compares, and whether the interval of the outermost shape of lead is judged in the permissible range at the interval in insertion hole.
In the following, insertion is electric respectively in 4 insertion holes 682 of the apex to the quadrangle being configured at shown in Figure 90 for explanation Permissible range in the case of the lead 684 of subassembly 680.In addition, in Figure 90, paper vertical direction becomes Y-direction, paper Left and right directions becomes X-direction.Herein, being inserted into the diameter in hole 682 becomes dP, and the diameter of lead 684 becomes dL.In addition, it will set The lead 684 of evaluation farthest away from the distance of X-direction that is connected of position be dA, by the lead 684 of design load most The distance for the Y-direction that separate position is connected is dB.
It in the case of the example shown in Figure 90, in design load, is respectively configured as, makes the center in insertion hole 682 and draws The center of line 684 overlaps.In the case, the upper limit value of permissible range become by be inserted into hole 682 farthest away from position be connected Tie the distance formed.That is, the upper limit value of X-direction for insertion hole 682 X-direction on farthest away from point distance, i.e. dC.Y side To upper limit value for insertion hole 682 Y-direction on farthest away from point distance, i.e. dD.In addition, the lower limiting value of permissible range into For by be inserted into hole 682 closest position inscribe in the case of, lead 684 farthest away from position be connected and Into distance.The lower limiting value of X-direction be lead 684a X-direction on farthest away from point distance, i.e. dE.The lower limit of Y-direction Be worth in the Y-direction for lead 684b farthest away from point distance, i.e. dF.In addition, the permissible range shown in Figure 90（Upper limit value, Lower limiting value）It is an example, permissible range can be various settings.For example, it is also possible to will allow for range set and be, as long as draw The interval that at least a portion of line is contacted with insertion hole.By expanding permissible range, it is possible to reduce discarded electronic unit, By reducing permissible range, the generation of setup error can be inhibited.
Electronic component mounting apparatus 10 is determined as that the interval of outermost shape is included in permissible range in step S166 （It is）In the case of, as step S168, it is appropriate to judge electronic unit, terminates present treatment.Electronic component mounting apparatus 10 exists It is determined as that the interval of outermost shape is not included in permissible range in step S166（It is no）In the case of, sentence in step S162 Be set to it is no in the case of, as step S169, judge that electronic unit to be inappropriate, terminates present treatment.
Electronic component mounting apparatus 10 is detected the shape of lead, is based on the result judgement electronic unit detected It is no appropriate, specifically, to whether can judge to the insertion that inserts in the hole, so as to by electronic unit more reliably to Substrate is installed.I.e., it is possible to by the lead of electronic unit more reliably to the insertion of insertion hole.Particularly, in such as radial direction feeder institute Show, be configured in the case that lead cut-out is supplied to holding position using electronic part feeder, since lead is easy Deformation, so easily generating the situation that kept electronic unit can not be installed.Since electronic component mounting apparatus 10 can be right The state of lead is judged, it is possible to inhibit to carry out the feelings of installation action to substrate using the electronic unit that can not be installed Condition, the electronic unit that can inhibit the phenomenon that be not inserted into are stayed on substrate.It can also inhibit to make other electronic units as a result, Into the situation of baneful influence.In addition, in the case where performing the processing of Figure 89, it is detected in the lead format to electronic unit Figure 86 processing in, the step S156, processing of S158 can not also perform.
Figure 91 is the flow chart of an example of the action for representing electronic component mounting apparatus.It, can also be in Figure 89 After whether the outermost shape based on electronic unit suitably judges electronic unit, further carry out based on lead radical Judge.In electronic component mounting apparatus 10, as step S160, the outermost shape of the lead of electronic unit is obtained.Electronics After apparatus for mounting component 10 obtains shape in step S160, as step S162, to whether with electronic unit one to be mounted Cause is judged.
Electronic component mounting apparatus 10 is determined as consistent with electronic unit in step S162（It is）In the case of, into step Rapid S163, be determined as it is inconsistent（It is no）In the case of, enter step S169.Electronic component mounting apparatus 10 is in step S162 It is determined as in the case of being, as step S163, the lead radical of obtaining parts.In addition, lead radical can also be with outermost Shape obtains together.In addition, outermost shape, lead radical can also in advance be measured before present treatment.
In the case that electronic component mounting apparatus 10 obtains lead radical in step S163, as step S164, to being It is no consistent with electronic unit to be mounted to be judged.That is, to lead radical whether the lead root with electronic unit to be mounted Number is identical to be judged.Electronic component mounting apparatus 10 is determined as consistent with electronic unit in step S164（It is）Situation Under, enter step S166, be determined as it is inconsistent（It is no）In the case of, enter step S169.
In the case that electronic component mounting apparatus 10 is judged to being in step S164, as step S166, to outermost Whether the interval of shape, which is included in permissible range, is judged.Electronic component mounting apparatus 10 is determined as most in step S166 The interval of outer shape is included in permissible range（It is）In the case of, as step S168, it is appropriate, knot to judge electronic unit Beam present treatment.Electronic component mounting apparatus 10 is determined as that the interval of outermost shape is not comprised in step S166 and allows model In enclosing（It is no）In the case of, be determined as in step S162, S164 it is no in the case of, as step S169, judge electronic unit To be inappropriate, end present treatment.
Electronic component mounting apparatus 10 is detected and is compared by the radical of the lead to electronic unit, can be with The difference only different electronic unit of lead radical.It is detected and to the shape of lead in the outermost shape to lead as a result, In the case of being judged, the different electronic unit of lead radical can also be identified.
Electronic component mounting apparatus 10 is used by the device being detected as the shape of the lead to electronic unit Laser identification device 38, so as to be detected with simply handling to lead format.In addition, in the above-described embodiment, In order to be handled, be judged in a short time, outermost shape is detected as the shape of lead（Outermost lead Interval）, but lead interval that can also be to the diameter of other shapes, such as lead and in addition to outermost is detected.Separately Outside, electronic component mounting apparatus 10 can be by using laser identification device 38, and uses the installation in mounting type electronic unit The middle structure used, is appropriately performed insert type electronic unit（Lead-type electronic-part）Installation.In addition, pacify in electronic unit In assembling device 10, as the device that the lead format to electronic unit is detected, other devices can also be used, such as with The VCS units 17 of camera.In addition, in the case where using VCS units 17, due to from the downside of electronic unit to electronic unit Shape measure, so compared to use electronic unit can be measured from side, can be to the position of Z-direction The situation for the laser identification device 38 that the electronic unit of the position identical with light source 38a, photo detector 38b measures is put, is had May handle becomes numerous and diverse, and precision reduces.
In the following, using Figure 92 and Figure 93, to determining the carrying order of electronic unit（Erection sequence）Definite action carry out Explanation.The order of electronic unit comprising insertion in carrying order.Figure 92 is for illustrating the action of electronic component mounting apparatus Definition graph.
The electronic component mounting apparatus 10 of present embodiment, has the list shown in Figure 92 as the data of production routine 302.List 302 is the carrying point with substrate（Include the point being inserted into substrate）The corresponding information for carrying layer and insertion part refer to Fixed information.Herein, so-called carrying layer refers to the information for determining the priority used during the carrying order of electronic unit, with 1 Numerical value to 7 is set.Herein, for carrying layer, numerical value is smaller to be more judged to carrying front, and numerical value is more big more sentences It is set to carrying back.In addition, it is the value for being considered various information by operating personnel and being set to carry layer.So-called insertion part refers to It is fixed, be represent to carry the electronic unit that is carried on point whether be insertion part project.In addition, in Figure 92, with "Yes" table Show the carrying point for being appointed as insertion part.Herein, so-called insertion part, which will be primarily referred to as radial lead type electronic unit etc., to draw The electronic unit that line is inserted into the hole being formed on substrate.In addition, it is also the letter set by operating personnel that insertion part, which is specified, Breath.Therefore, it is determined as the carrying point of insertion part by operating personnel for the species independent of electronic unit, can will inserts Enter component and specify to be set to "Yes".
Electronic component mounting apparatus 10 uses the information of list 302, generation carrying order list 304.Herein, carrying In order list 304, the carrying on the upside of list puts first to carry a carrying point for electronic unit, and the carrying point on the downside of list becomes The carrying point of electronic unit is carried afterwards.That is, in carrying order list 304, carry the order of electronic unit sequentially from Top beginning order represents.Herein, the interior layer of carrying order list 304 is to be specified based on carrying layer and insertion part by controlling The information of the definite layer in portion 60 processed.Control unit 60 is since the smaller carrying point of numerical value of interior layer sequentially to carrying electronic unit Carrying point be determined.
Figure 93 is the flow chart of an example of the action for representing electronic component mounting apparatus.Processing shown in Figure 93 is base An example of the processing of carrying order list 304 is generated in list 302.Processing shown in Figure 93 is by being controlled by control unit 60 The action of each several part processed and perform.As step S200, control unit 60 reads production routine.Control unit 60 is from external device It reads production routine or reads production routine from the storage part of electronic component mounting apparatus 10.Control unit 60 is in step s 200 After reading production routine, as step S202, the information for carrying point n is obtained.Specifically, the carrying layer of carrying point n is obtained The information that information and insertion part are specified.
After control unit 60 obtains the information for carrying point n in step S202, as step S204, to whether carrying point n= Whether the information that insertion part, the i.e. insertion part of carrying point n are specified is that "Yes" is judged.Control unit 60 is in step S204 It is determined as not being to carry point n=insertion parts（It is no）In the case of, as step S206, it is set to interior layer=carrying layer.That is, control In the case that the information that portion 60 processed is specified in the insertion part for carrying point n is not for "Yes", the numerical value for carrying layer is set to interior layer Numerical value.Control unit 60 enters step S210 after the processing of step S206 is carried out.Control unit 60 is determined as in step S204 Carry point n=insertion parts（It is）In the case of, as step S208, it is set to interior layer=carrying layer+7.That is, control unit 60 In the case where the information specified of insertion part for carrying point n is "Yes", the numerical value that is obtained after the numerical value for carrying layer is added with 7 It is set to the numerical value of interior layer.Control unit 60 enters step S210 after the processing of step S208 is carried out.
Control unit 60 is after the processing of step S206 or step S208 is carried out, and as step S210, is to carrying data It is no to terminate, i.e., whether calculate interior layer and judged for all carrying.Control unit 60 is determined as not having in step S210 There is end（It is no）In the case of, as step S212, it will carry after point n is set to n+1 and enter step S202.That is, by interior layer The carrying point of object is detected as next carrying point, carries out above-mentioned processing.
Control unit 60 is judged to terminating in step S210（It is）, i.e. to all carry point interior layers carried out setting In the case of, as step S214, carrying order is determined.That is, control unit 60 is based on set interior layer and various items Part is determined to the order for carrying point carrying electronic unit.Control unit 60 is after carrying order is determined, generation carrying order List terminates present treatment.
It is as noted above, electronic component mounting apparatus 10 by set can by operating personnel to whether be insertion part into The project of row setting, to being set as that the interior layer of carrying point of insertion part carries out certain add operation, so as to so as to insert It is carried on substrate with entering component back.In addition, whether operating personnel are only by being that insertion part judges, so that it may So that the carrying back of the electronic unit of object.As a result, when carrying the setting of layer, without the concern for for carrying layer Layer and set the carrying layer of electronic unit.Determine the operation for carrying layer to burden caused by operating personnel thus, it is possible to reduce.
Using Figure 94, the action of the assembly supply device of electronic component mounting apparatus is illustrated.Figure 94 is to represent electricity The flow chart of one example of the action of subassembly erecting device.Processing shown in Figure 94 is by by component supply control part 64 Based on the processing of control unit 60, the action of each several part of assembly supply device is controlled and is performed.In addition, shown in Figure 94 Processing do not have in holding area configure electronic unit in the state of start.As step S260, component supply control Portion 64 makes the amount of holding band 1 spacing of movement.That is, component supply control part 64 is by making the feeding claw of feeder unit carry out 1 Secondary reciprocating movement is moved along direction of feed, so that keeping the amount with mobile 1 spacing.Make as a result, in holding band main body The electronic unit of holding is moved to holding area.
Component supply control part 64 makes electronic unit after holding area movement in step S260, as step S262, It will be moved to the lead cut-out of the electronic unit in holding area.That is, component supply control part 64 utilizes cutting unit, by lead Be located at article body and keep with the partial cut between main body.Component supply control part 64 cuts lead in step S262 It has no progeny, as step S264, maintains clamp position.That is, component supply control part 64 after using cutting unit, lead is cut off, Maintain the state by the tooth clamp leads after cutting off.
After component supply control part 64 maintains clamp position in step S264, as step S266, to suction nozzle 32 whether It keeps（Absorption or grasping）Electronic unit is judged.Component supply control part 64 is determined as not having on suction nozzle in step S266 Keep electronic unit（It is no）In the case of, enter step S264.Component supply control part 64 keeps electronics on suction nozzle is determined as Before component, the clamp position of electronic unit is maintained.
Component supply control part 64 is judged to keeping electronic unit on suction nozzle in step S266（It is）In the case of, as Step S268 discharges electronic unit, that is, releases clamp position.Cut off lead as a result, and from keeping with separated electronic unit, profit With suction nozzle to defined loading position（Installation site）It is mobile, and carried on substrate.
After component supply control part 64 discharges electronic unit in step S268, as step S270, protected to whether there is Band feeding request is held to be judged.Herein, it is so-called to keep with feeding request being to instigate to keep the amount with mobile 1 spacing, make The request that next electronic unit is moved to holding area.Component supply control part 64 is determined as there is request in step S270 （It is）In the case of, S260 is entered step, performs above-mentioned processing again.
Component supply control part 64 is determined as no request in step S270（It is no）In the case of, it is right as step S272 Whether processing terminates to be judged.Component supply control part 64 is determined as that processing is not in step S272（It is no）Situation Under, enter step S270.In addition, component supply control part 64 is determined as that processing terminates in step S272（It is）In the case of, Terminate present treatment.
Component supply control part 64 makes electronic unit be moved to holding area as noted above, and lead is cut off and pressed from both sides It holds, after making suction electronic unit, is clamped by releasing, so as to so that suction nozzle adsorbs radial lead with moveable state Type electronic unit.
Figure 95 is the flow chart of an example of the action for representing electronic component mounting apparatus.In addition, the place shown in Figure 95 Reason action is to the action until electronic unit completion is carried on substrate from moving into after substrate.In addition, the processing shown in Figure 95 Action is by being controlled to perform to the action of each several part by control unit 60.
As step S302, control unit 60 moves into substrate.Specifically, control unit 60 will be carried using substrate delivery section 12 The object substrate of electronic unit is conveyed to assigned position.After control unit 60 moves into substrate in step s 302, as step S304, Carry out holding movement.Herein, it is so-called to keep movement（Absorption movement）, it is that holder main body 30 is instigated to be moved to suction nozzle 32 and position The processing action of the opposite position of electronic unit 80 in the holding area of component feed unit 14.
After control unit 60 carries out absorption movement in step s 304, as step S306, decline suction nozzle 32.That is, control Portion 60, which makes suction nozzle 32 be moved to downwards, to keep（Absorption, grasping）The position of electronic unit 80.Control unit 60 is in step After declining suction nozzle 32 in S306, as step S308, component is kept using suction nozzle 32, as step S310, makes suction Mouth 32 rises.After control unit 60 makes suction nozzle rise to assigned position in step S310, specifically, move electronic unit 80 To the measurement position of laser identification device 38, as step S312, the shape of the electronic unit to being adsorbed by suction nozzle 32 carries out Detection.After control unit 60 is detected the shape of electronic unit in step S312, as step S314, suction nozzle is made to increase. In addition, the component shape as noted above to step S312 of control unit 60 is detected, it is determined as that kept electronic unit is In the case of can not carrying, electronic unit is discarded, adsorbs electronic unit again.Control unit 60 rises to predetermined bits making suction nozzle It postpones, as step S316, carries out carrying movement, i.e. into enforcement from the electronic unit that suction nozzle 32 adsorbs to the carrying with substrate 8 Position（Installation site）The processing action of opposite position movement, as step S318, declines suction nozzle 32, as step S320 carries out component mounting（Component is installed）, i.e. discharged from suction nozzle 32 the processing action of electronic unit 80, as step Rapid S322 rises suction nozzle 32.That is, control unit 60 performs the processing action of step S312 to step S320, performs above-mentioned installation Processing.
In the case that control unit 60 makes suction nozzle rising in step S322, as step S324, the carrying to whole components Whether the installation process of the electronic unit whether completed, carried on i.e. pre- orientation substrate 8 has been completed to be judged.Control unit 60 It is determined as that the carrying of whole components has not been completed in step S324（It is no）, i.e. be scheduled for carry electronic unit it is also residual In the case of staying, S304 is entered step, the processing for carrying next electronic unit on substrate 8 is performed and acts.Such as above-mentioned institute Show, above-mentioned processing action is repeated in control unit 60, until completing to carry whole components on substrate.Control unit 60 is in step It is determined as that the carrying of whole components has been completed in rapid S324（It is）In the case of, terminate present treatment.
In the following, using Figure 96, illustrate suction nozzle the electronic unit kept in assembly supply device 100 is adsorbed before and The action of assembly supply device 100 and boarded head 15 afterwards.Figure 96 is one of the action for representing electronic component mounting apparatus The flow chart of example.Processing shown in Figure 96 is by being controlled to perform to the action of each several part by control unit 60.
As step S340, control unit 60 carries out the XY absorption movements of boarded head 15, and starts to make assembly supply device 100 pairs of electronic units clamp.That is, as step S340, control unit 60 makes boarded head 15 be moved along XY directions, makes suction nozzle 32 It is moved to holding area.In addition, control unit 60 configures electronic unit into the holding area of assembly supply device 100, it then, will Lead is cut off, and becomes clamp position.
Control unit 60 carries out the processing of step S340, and as step S342, in the holding position of boarded head 15, movement terminates In the case of, i.e. make the suction nozzle 32 of boarded head 15 after holding area movement, as step S344, to clamping the stand-by period It is compared with the elapsed time, as step S346, to whether have passed through the stand-by period, i.e. whether the elapsed time is greater than or equal to The clamping stand-by period is judged.
Control unit 60 is judged to not passing through the stand-by period in step S346（It is no）, i.e. the elapsed time be less than clamping wait In the case of time, S344 is entered step.The processing of step S344, S346 is repeated in control unit 60, until when passing through wait Between until.
Control unit 60 is judged to have passed through the stand-by period in step S346（It is）In the case of, as step S348, into The absorption of row Z axis declines.That is, control unit 60 suction nozzle is made to be moved on the downside of the Z-direction can be to the electronics that is located in holding area The position that component is adsorbed.After control unit 60 carries out Z axis absorption decline in step S348, component is carried out in step S350 Absorption, i.e. adsorbed using suction nozzle to electronic unit, as step S352, clamping is released into stand-by period and existing Z axis The stand-by period is compared during decline.Herein, so-called clamping releases the stand-by period, and referring to will be just by assembly supply device 100 The clamp position of the electronic unit of clamping releases required processing time.The stand-by period is boarded head when existing Z axis declines The suction nozzle time standby at the position of absorption electronic unit.In addition, the stand-by period is preset when existing Z axis declines Value, is the time needed for the adsorption treatment of electronic unit.
After control unit 60 is compared in step S352, as step S354, to whether clamp release the stand-by period compared with Greatly, whether it is that the clamping of stand-by period ＜ releases the stand-by period and judged when existing Z axis declines.Control unit 60 is in step It is larger to be determined as that clamping releases the stand-by period in S354（It is）, when i.e. existing Z axis declines the clamping of stand-by period ＜ release and wait It is standby with clamping releasing stand-by period progress as step S356 in the case of time, enter step S360.In addition, control unit 60 are determined as that the clamping releasing stand-by period is little in step S354（It is no）, when i.e. existing Z axis declines when Shi Jian≤clamping In the case of releasing the stand-by period, as step S358, stand-by period progress is standby when being declined with existing Z axis, enters step S360。
Control unit 60, as step S360, carries out the Z axis absorption of boarded head after the processing of step S356, S358 is carried out Rise and the supply of assembly supply device acts, terminate present treatment.
Electronic component mounting apparatus 10 is acted by performing the processing shown in Figure 95 and Figure 96, so as to be taken on substrate Carry electronic unit.
In the following, using Figure 97 to Figure 98 B, illustrate by suction nozzle to being located at the holding position of electronic part feeder 100 Electronic unit kept in the case of processing an example.Figure 97 is the one of the action for representing electronic component mounting apparatus The flow chart of a example.Figure 98 A are for illustrating the definition graph of the action of electronic component mounting apparatus.Figure 98 B are for illustrating The definition graph of the action of electronic component mounting apparatus.Processing shown in Figure 97 can pass through the control by electronic component mounting apparatus 10 Device 20 processed controls each several part and is performed.
In electronic component mounting apparatus 10, as step S402, the holding that electronic unit is performed by suction nozzle acts.That is, Electronic component mounting apparatus 10 is performed to be kept by suction nozzle（Absorption, grasping）Positioned at the electricity of the holding area of electronic part feeder The action of subassembly.After electronic component mounting apparatus 10 performs holding action in step S402, as step S404, to electronics The hold mode of component is detected.Specifically, using laser identification device 38 or VCS units 17, whether suction nozzle is kept Electronic unit is detected.
After electronic component mounting apparatus 10 is in step s 404 detected hold mode, as step S406, to inhaling Whether mouth keeps electronic unit to be judged.Electronic component mounting apparatus 10 is judged to keeping electronic unit in step S406 （It is）In the case of, terminate present treatment.Electronic component mounting apparatus 10 is judged to not keeping electronic unit in step S406 （It is no）In the case of, as step S408, the state of the holding position of electronic part feeder is detected.It is for example, electric Subassembly erecting device 10 is detected the height of holding position by height sensor 37, to whether there is on holding position Electronic unit is detected.In addition it is also possible to it is shot by filming apparatus 36 and is detected to whetheing there is electronic unit.
After electronic component mounting apparatus 10 is detected the state of holding position in step S408, in step S410 To judging on holding position with the presence or absence of electronic unit.Electronic component mounting apparatus 10 is judged to depositing in step S410 In electronic unit（It is）In the case of, S416 is entered step, is being determined as no electronic unit（It is no）In the case of, it enters step S412.Herein, height of the electronic component mounting apparatus 10 based on the holding position obtained using height sensor 37, to whetheing there is Electronic unit is detected.For example, as shown in Figure 98 A, in holding area there are electronic unit 80 in the case of, holding area Height become higher, as shown in Figure 98 B, in the case of not having electronic unit 80 in holding area, the height of holding area is lower （As the position for keeping band）.Electronic component mounting apparatus 10 is sentenced in the case where the height of holding area is higher than threshold value as a result, It is set to there are electronic unit, in the case of lower than threshold value, is determined as no electronic unit.
Electronic component mounting apparatus 10 be determined as in step S410 it is no in the case of, it is dynamic to feeding as step S412 Make whether number is judged more than or equal to threshold number.Herein, so-called feed motion, refers to electronic part feeder 100 it is corresponding with the configuration space of electronic unit and to keeping the action that is conveyed of band.The feed motion number of step S412 It is the number that feed motion is carried out in the state of it can not adsorb electronic unit.Electronic component mounting apparatus 10 is in step S412 It is determined as that feed motion number is greater than or equal to threshold number（It is）In the case of, S416 is entered step, is being determined as that feeding is dynamic Make number not greater than or equal to threshold number（It is no）In the case of, enter step S414.
Electronic component mounting apparatus 10 be determined as in step S412 it is no in the case of, as step S414, perform holding Band feed motion, enters step S402.Electronic component mounting apparatus 10 is determined as yes in step S410 or step S412 In the case of, as step S416 error process, terminate present treatment.Herein, electronic component mounting apparatus 10 is in step It is determined as in S410 in the case of being, as error handle, notifies this case that the excess electron component of holding position.The ministry of electronics industry In the case that part erecting device 10 is judged to being in step S412, as error handle, even if notice is supplied in electronic unit The feed motion of certain number has been carried out in device 100 can not also confirm component this case.
It is as noted above, in the case that electronic component mounting apparatus 10 does not have excess electron component on holding position, lead to It crosses and holding band is conveyed, perform the holding action of electronic unit again, even if not configured so as to take to exist in holding The part of electronic unit need not also stop device, can continue the installation of electronic unit.In addition, electronic unit is installed Even if device 10 cut off in electronic part feeder 100 electronic unit after lead not by suction nozzle keep and from holding position It,, can be more efficient by continuing installation action when there is no excess electron component on holding position in the case of putting movement Ground is installed by electronic unit.
Figure 99 is the definition graph for an example for representing suction nozzle.Figure 100 is the holding action for the suction nozzle of definition graph 99 Definition graph.Figure 99 and Figure 100 is to represent grasping suction nozzle（Clamp suction nozzle）An example figure.Shown in Figure 99 and Figure 100 Suction nozzle 690 has fixed arm 692 and moveable arm 694.In suction nozzle 690, the fulcrum 695 of moveable arm 694 is with rotatable state It is fixed in the main body of suction nozzle 690, moveable arm 694 can be axis with fulcrum 695, make the part opposite with fixed arm 692 from connecing It is moved to separate direction in the direction of nearly fixed arm 692.In moveable arm 694, across fulcrum 695, compared with suction nozzle 690 Main part and with fixed arm 692 close to or away from part opposite side, link driving portion 696.Driving portion 696 utilizes drive The driving source of dynamic suction nozzle（Air pressure）And it moves.Moveable arm 694 by the movement of driving portion 696 so that with fixed arm 692 It is moved from the direction close to fixed arm 692 to separate direction opposite part.
Suction nozzle 690 between fixed arm 692 and moveable arm 694 there are electronic unit 80 in the state of, by making fixed arm The distance between 692 and moveable arm 694 shortening, so as to grasp electronic unit 80 as shown in Figure 100.
Grasping suction nozzle is not limited to suction nozzle 690, can be variously-shaped.Figure 101 A to Figure 101 D are to represent suction nozzle respectively An example definition graph.The suction nozzle shown in suction nozzle 690b, Figure 101 C shown in suction nozzle 690a, Figure 101 B shown in Figure 101 A Suction nozzle 690d shown in 690c and Figure 101 D is interval between fixed arm and moveable arm and the different suction of movable range respectively Mouth.Therefore, for suction nozzle 690a to suction nozzle 690d, the shape for the electronic unit that can be grasped is different.
Electronic component mounting apparatus 10 correspondingly selects to keep the ministry of electronics industry by the species with the electronic unit to be kept The species of the suction nozzle of part, so as to suitably keep electronic unit.Specifically, by corresponding with the electronic unit to be kept Ground selection is to use absorption suction nozzle or using grasping suction nozzle, and to which suction nozzle is used to cut in the suction nozzle of various species It changes, so as to install a greater variety of electronic units using 1 electronic component mounting apparatus.
In the following, using Figure 102, an example of the processing during installing electronic unit to electronic component mounting apparatus into Row explanation.Figure 102 is the flow chart of an example of the action for representing electronic component mounting apparatus.In electronic component mounting apparatus In 10, as step S450, the electronic unit of each suction nozzle holding by boarded head is determined.That is, to next by suction nozzle The species of the electronic unit of holding is determined.
After electronic component mounting apparatus 10 determines electronic unit in step S450, as step S452, to whether there is The replacement of suction nozzle is judged.If electronic component mounting apparatus 10 is determined as no suction nozzle replacing in step S452（It is no）, Then enter step S456.If electronic component mounting apparatus 10 is determined to have the replacement of suction nozzle in step S452（It is）, then As step S454, the replacement of suction nozzle is performed.Specifically, electronic component mounting apparatus 10 makes boarded head 15 be protected to suction nozzle is replaced It holds mechanism 18 to move, the suction nozzle that boarded head is kept is made to be moved to suction nozzle holding mechanism 18 is replaced, will remain in and replace suction nozzle guarantor It holds in mechanism 18 and is installed in suction nozzle to be used next time on boarded head.Electronic component mounting apparatus 10 utilizes and replaces suction nozzle Holding mechanism 18 for grasping suction nozzle or changes the kind of absorption suction nozzle by the suction nozzle on boarded head, from absorption suction nozzle replacing Class or the species for changing grasping suction nozzle.Electronic component mounting apparatus 10 is after the processing of step S454 is carried out or in step Be determined as in S452 it is no in the case of, as step S456, perform the holding action of electronic unit, i.e. carry using being mounted on Suction nozzle on first 15 performs the holding action of the electronic unit determined in step S450, terminates present treatment.
Electronic component mounting apparatus 10 is as shown in Figure 102, by the species with electronic unit correspondingly and to boarded head institute The suction nozzle of installation is replaced, so as to be kept using more appropriate suction nozzle to electronic unit.It further, since can be right Suction nozzle is replaced, it is possible to using 1 electronic component mounting apparatus 10 to lead-type electronic-part, mounting type electronic unit The two is suitably kept.Furthermore it is possible to a greater variety of electronic units are kept.Electronic component mounting apparatus 10 Due to being that the main part of both lead-type electronic-part, mounting type electronic unit, the part of i.e. no lead are carried out It keeps, it is possible to two kinds of electronic units be kept using general suction nozzle.Even if it is not provided with protecting lead as a result, The Special sucker held can also keep lead-type electronic-part.Further, since said effect can be obtained, so excellent Choosing keeps the main body of lead-type electronic-part, but can also set the suction nozzle kept to lead.
In the following, using Figure 103 and Figure 104, to being handled from execution preparation（The setting of production routine, the preparation of each several part, portion Adjustment of part feedway etc.）One example of the processing until production is started illustrates.Figure 103 is to represent the ministry of electronics industry The flow chart of one example of the action of part erecting device.Figure 104 is for illustrating saying for the action of electronic component mounting apparatus Bright figure.In addition, the processing of Figure 103 can be performed as temporarily the processing until starting again at is stopped from production.
In electronic component mounting apparatus 10, as step S460, preparation processing is performed, as step S462, utilizes electricity The cutting unit of subassembly feedway 100 cuts off the lead of electronic unit, clamps electronic unit.In addition, step S462 It handles as the part processing of the preparation processing of step S460 and performs.In addition, electronic component mounting apparatus 10 is by the ministry of electronics industry After part clamping, do not kept using boarded head.
Electronic component mounting apparatus 10 is after the processing of step S462 is performed, as step S464, output information.Specifically It says, the picture 698 shown in Figure 104 is shown as message.In picture 698, display " maintains clamp position" this message with And "Yes" button 699a, "No" button 699b.
Electronic component mounting apparatus 10 shows message in step S464, to some progress in button 699a, 699b After selecting and determining, as step S466, to whether clamp position being maintained to judge.If electronic component mounting apparatus 10 exists It is judged to not maintaining clamp position in step S466（It is no）, that is, button 699b has been selected, then as step S467, has released clamping shape State discharges electronic unit, terminates present treatment.In the case, operating personnel recycle electronic unit from holding area.This Outside, in the present embodiment, to whether clamp position being maintained to inquire, but may be reversed to whether releasing clamp position It is inquired.In the case, the corresponding function of "Yes" and "No" is opposite.
If electronic component mounting apparatus 10 is judged to maintaining clamp position in step S466（It is）, that is, selected button 699a then as step S468, maintains clamp position, as step S469, after production starts, uses the ministry of electronics industry of clamping Part terminates present treatment.
Electronic component mounting apparatus 10 is waiting mesh as shown in Figure 103 in order to which the off-position to electronic unit is adjusted And when being prepared processing, by the electronic unit by lead has been cut off after production starts, supplied as the electronic unit 1st electronic unit of device uses, and can mitigate the burden of operating personnel.Specifically, recycling electronic unit can be saved Time, furthermore it is possible to reduce the time for being inserted into the electronic unit after recycling to substrate with hand.
In the following, using Figure 105, to an example of the processing that electronic component mounting apparatus 10 is performed when electronic unit is installed Son illustrates.Figure 105 is the flow chart of an example of the action for representing electronic component mounting apparatus.
Electronic component mounting apparatus 10 is used as step S470, the position for installing electronic unit is determined, as step S472 is detected the height of installation site.In addition, the height of the substrate for installation site, it can be by height sensor 37 are detected.Electronic component mounting apparatus 10 in step S472 to being highly detected after, as step S474, to height Whether threshold value is less than or equal to（A reference value）（It boarded head and whether longer than threshold value (a reference value) the distance between locates）Into Row judges.That is, electronic component mounting apparatus 10 to whether do not carried whatever on the position of the installation electronic unit of substrate into Row judges.
Electronic component mounting apparatus 10 is determined as height without being less than or equal to threshold value in step S474（It is no）, i.e. height In the case of higher than threshold value, it is judged to being equipped with some components in installation site, error handle, knot is carried out as step S476 Beam present treatment.Electronic component mounting apparatus 10 is determined as that height is less than or equal to threshold value in step S474（It is）In the case of, It is determined as in installation site without carrying any part, as step S478, performs the installation process of electronic unit, terminate this Processing.
Electronic component mounting apparatus 10 as shown in Figure 105, is detected to carrying the substrate height of position of electronic unit, In the case where substrate height is higher, by error process, so as to inhibit on the loading position of substrate, there are it In the case of the barriers such as his component, the situation for the action installed to electronic unit is performed.Thus, it is possible to inhibiting to make base While plate or electronic unit damage, electronic unit is installed.In addition, in Figure 105, in order to which processing can be made to become simple, and The height of substrate is detected using height sensor 37, but filming apparatus 36 can also be utilized to the installation site on substrate State be detected.
Herein, Figure 106 and Figure 107 is namely for illustrating the definition graph of the action of electronic component mounting apparatus.Electronics Apparatus for mounting component 10 utilizes height sensor as shown in Figure 106（Substrate state test section）The installation ministry of electronics industry of 37 pairs of substrates 8 The position of part（Loading position）Height be detected.Between component present on 37 pairs of height sensor and opposite position Distance is measured, so as to be detected to the height on 8 surface of substrate.Height sensor 37 has light-projecting portion 37a and acceptance part 37b.Light-projecting portion 37a has light-emitting component etc., and output measures light, such as infrared laser.Acceptance part 37b has photo detector, The photo detector carries out light to the measure light after projecting from light-projecting portion 37a and being reflected by 8 grade of substrate.Acceptance part 37b is to light Timing and light quantity be detected.
Herein, the substrate 8 shown in Figure 106 forms through hole in the loading position for carrying lead-type electronic-part 752（Insertion Hole）750.Lead-type electronic-part 752 has main body 754 and the lead 756 linked with main body 754.Lead-type electronic-part 752 By being kept from the suction nozzle 32 of boarded head 15 and being inserted into lead 756 into through hole 750, so as to be installed on substrate 8（It carries）. For the substrate 8 shown in Figure 106,2 lead-type electronic-parts 752 are installed on substrate 8.In addition, substrate 8 is being equipped with 2 Between the position of a lead-type electronic-part 752, the through hole 750 for being not inserted into lead 756 is set.Substrate 8 is equipped with 2 and draws Between the position of line style electronic unit 752, become the loading position of electronic unit.
Electronic component mounting apparatus 10 is being loading position as shown in Figure 106, between 2 lead-type electronic-parts 752 In the case of, before electronic unit is carried to loading position, by the use of height sensor 37 to drawing as 2 of the loading position Height between line style electronic unit 752 is detected.As shown in Figure 106, the wire type ministry of electronics industry around loading position In the case that part 752 has been equipped on appropriate location, height sensor 37 examines the height of the substrate 8 of the loading position It surveys.
In contrast, electronic component mounting apparatus 10 is as shown in Figure 107,1 electronic unit around loading position The main body 754a of 752a compared with substrate 8 it is inclined in the case of, become and a part for loading position hidden by main body 754a The state of gear.In the case, height sensor 37 is to having blocked the height of the main body 754a of the electronic unit 752a of loading position Degree is detected.
Electronic component mounting apparatus 10, can be with by being detected before electro part carrying to the height of loading position Detect and judge state that other electronic units as shown in Figure 106 do not overlap with loading position or as shown in Figure 107 its The state that his electronic unit is overlapped with loading position.
Figure 108 and Figure 109 is the definition graph for an example for representing electronic unit respectively.Electronic component mounting apparatus 10 is logical It crosses and the height of loading position is detected before electro part carrying, even if so as to by the electronic unit shown in Figure 108 It, can also be most preferably by each electronic unit to base in the case that electronic unit 760a shown in 760 or Figure 109 is carried on substrate It is installed on plate.Herein, the electronic unit 760 shown in Figure 108 has main body 762 and the lead 764 being connected with main body 762.Electricity Face of the subassembly 760 on the upside of the vertical of main body 762, i.e. the court opposite with height sensor 37 is upwardly formed stage portion. Electronic unit 760a shown in Figure 109 has main body 762a and the lead 764a being connected with main body 762a.In electronic unit 760a In, main body 762a is smaller than the width of lead 764a.Therefore, in electronic unit 760a, main body 762a is compared with loading position The ratio of area becomes smaller.
For electronic component mounting apparatus 10, even if being appropriately mounted at base in electronic unit 760 or electronic unit 760a In the case of on plate 8, also due to the position offset in error range, and make the height change of the position of loading position.Example Such as, for electronic unit 760, due to there are stage portion, so even if being examined to the height of the main body 762 of electronic unit 760 It surveys, detected height is different and different also with the measurement position of main body 762.Therefore, install and fill for electronic unit 10 are put, even if being detected after the carrying of electronic unit 760 to the height of the electronic unit 760, it is also difficult to the electronic unit Whether 760, which be equipped on appropriate location, is judged, it is difficult to whether from loading position deviate and block other electronic units and take Position is carried to be judged.In addition, for electronic unit 760a, since main body 762a is smaller, so being difficult to the height to main body 762a Degree is detected.Therefore, for electronic component mounting apparatus 10, even if to the electronic unit after electronic unit 760a carryings The height of 760a is detected, it is also difficult to be judged whether electronic unit 760a is equipped on appropriate location, it is difficult to being The no loading position for blocking other electronic units from loading position offset is judged.In contrast, installed in electronic unit In device 10, by being detected in electro part carrying to the height of the loading position of the electronic unit, so as to not Species, the shape of electronic unit dependent on surrounding and detect whether to exist and block the electronic unit of loading position.It is electric as a result, Subassembly erecting device 10 more appropriate and reliably can install electronic unit on substrate 8.In addition, electronic component mounting apparatus 10 in the case where that can not install the state of electronic unit, can suitably detect this case.
Herein, preferably height sensor 37 is from the position opposite with loading position, specifically from loading position just Top（The identical position in position on X/Y plane）Irradiation measures light and measures height.That is, preferably height sensor 37 from suction The substantial parallel position of the direction that mouth 32 moves up and down i.e. Z-direction measures the height of loading position.Electronics as a result, Apparatus for mounting component 10 can detect the whether there are obstacles in electro part carrying exactly.
In addition, in order to which judgement can be performed with simple and less processing, and be preferably based on and detected by height sensor 37 The height of the substrate 8 gone out, whether to that can carry and judge, but it's not limited to that.Electronic component mounting apparatus 10 also may be used Using the substrate state test section that filming apparatus 36 is used to be detected as the state to loading position.Electronic component mounting apparatus 10 obtain the image of the loading position of substrate 8 by using filming apparatus 36, and carry out image analysis, so as to carrying position It puts whether to be blocked by other electronic units and be judged.
In addition, in the above-described embodiment, it is illustrated for the situation of installation lead-type electronic-part, but to base It, can also in the same manner, to loading position before mounting type electro part carrying in the case of plate installation mounting type electronic unit State be detected, based on testing result, judgement is that the mounting type electronic unit is installed or notified on loading position Mistake.In addition, electronic component mounting apparatus 10 can also always carry out the state of loading position before electro part carrying Detection, but the state of loading position can also be carried out before electro part carrying only in the case where meeting rated condition Detection.In the case that electronic component mounting apparatus 10 is preferably equipped with lead-type electronic-part around loading position, at this The state of loading position is detected before electro part carrying.Electronic component mounting apparatus 10 can be made whether as a result, The lead-type electronic-part easily deviated after carrying from loading position has blocked the carrying position of next electronic unit to be carried It puts.
In the following, using Figure 110 to Figure 113, act in more detail example of electronic component mounting apparatus is said It is bright.Figure 110 is the definition graph for an example for representing operation screen.Figure 111 is for illustrating the dynamic of electronic component mounting apparatus The definition graph of work.Figure 112 is the flow chart of an example of the action for representing electronic component mounting apparatus.Figure 113 is to represent wrong The definition graph of an example of picture by mistake.
First, using Figure 110 and Figure 111, illustrate to be detected the height of above-mentioned loading position and be made whether can be with Carry the setting method of the treatment conditions of the processing of the judgement of electronic unit.In electronic component mounting apparatus 10, if started For setting the pattern of the testing conditions of loading position height, then in display unit 42（Touch panel 42a or picture monitor 42b）Operation screen 770 shown in upper display Figure 110.Operation screen 770 shows various cuits.Operating personnel pass through aobvious Show and carry out various operations in the state of operation screen 770, so as to input processing condition.
Operation screen 770 shown in Figure 110 is shown：Whether cuit 772 is used to input to the height of loading position Can degree be detected and carry the judgement of electronic unit；Cuit 774, the quantity of input checking position（It checks Number）Information；And cuit 776, the decision content of input height（A reference value, the threshold value of judgement）.In addition, operation picture The also display area 777 of face 770, the region 777 include cuit 778, and the cuit 778 is for the input phase for each inspection The reference position of position（It is the center of loading position in the present embodiment）X-direction, respective compensation rate in Y-direction.Separately Outside, the also display area 779 of operation screen 770, the region 779 display represent to be based on inputting to each cuit 774,776,778 Input results and definite electronic component body and the image for checking the relation between position.
Herein, cuit 772 is that input performs the project for checking or not performing inspection.Cuit 774 is input The project of the quantity for the position being detected in electro part carrying to the height of loading position.In the present embodiment, by In having input 4, so the setting being detected as the height to 4 points.Cuit 776 is the height as determinating reference Degree, i.e. the corresponding height in reference position with the benchmark as notification error.In the present embodiment, due to for 0.500, So in the case of higher 0.5mm than altitude datum, it is determined as that loading position is blocked by some things, and notification error.
8 cuits 778 in region 777 are divided to be shown for 2 row, 4 row.4 rows are corresponding with checking position respectively, each row 2 cuits 778 it is corresponding with respective X-direction compensation rate, Y-direction compensation rate.To cuit 778 input numerical value into For compared with the compensation rate of reference position.Electronic component mounting apparatus 10 according to compared with the compensation rate of reference position by determining Position is checked, and as shown in Figure 111, by by the center 784 of electronic unit 780, the i.e. loading position of electronic unit 780 Center determines the position to be compensated as reference position as shown in arrow 788, may thereby determine that 4 check position 786a, 786b、786c、786d.Phase between the main body 782 of electronic unit 780 and inspection position 786a, 786b, 786c, 786d as a result, To relation as shown in Figure 111.In region 779, the main body 782 of the so definite electronic unit 780 of display and inspection position Relativeness between 786a, 786b, 786c, 786d.Furthermore it is preferred that make the number of the cuit shown in region 777 778 Amount, increases and decreases with the numerical value inputted into cuit 774.
In the following, using Figure 112, to what is performed based on input to the condition in Figure 110 by electronic component mounting apparatus 10 Processing illustrates.In addition, the processing shown in Figure 112 can be by controlling the action of each control unit by control device 20 And it performs.In electronic component mounting apparatus 10, as step S480, the holding action of electronic unit is performed.That is, carrying is utilized First 15 suction nozzle 32 keeps electronic unit existing at the supply position of electronic unit feed unit 14f, 14r（Absorption Or grasping）.In addition, the electronic unit to be kept, the suction nozzle kept are determined by production routine.
After electronic component mounting apparatus 10 keeps electronic unit in step S480, as step S482 start to Locate movement.Herein, it is so-called to locate, it is the carrying for being directed to the substrate 8 for carrying kept electronic unit 1 checked in position of position setting.Electronic component mounting apparatus 10 is by moving boarded head 15, so as to start until high Movement until degree the locating of sensor 37.
After electronic component mounting apparatus 10 starts movement in step S482, start highly sensing as step S484 Device.In addition, in the case of the state after height sensor 37 starts, without the processing of step S484.Electronic unit is installed After device 10 starts height sensor in step S484, as step S486, stop locating, as step S488, The height at the place of locating is measured.That is, the height to locate can be measured by height sensor 37 At position, stop boarded head 15, using height sensor 37 to checking position（The set point of loading position）Height carry out Measurement.
After electronic component mounting apparatus 10 measures in step S488, as step S490, determine whether to measure knot Beam, i.e., whether to all checking that position is measured.Electronic component mounting apparatus 10, which is judged to measuring in step S490, not to be had There is end（It is no）, i.e. also exist without measurement inspection position in the case of, enter step S482, to not yet measure inspection Position measures.
Electronic component mounting apparatus 10 is judged to measuring in step S490 and terminate（It is）In the case of, as step S492 determines whether that there are mistakes, i.e. whether detects to be more than decision content（Threshold value）Height.Electronic component mounting apparatus 10 It is determined as inerrancy in step S492（It is no）, i.e. do not detect the height more than decision content（Highly it is less than or equal to threshold Value）In the case of, enter step S499.
Electronic component mounting apparatus 10 is determined as wrong in step S492（It is）, i.e. it detects more than decision content Highly（Highly it is more than threshold value）In the case of, as step S493, action is temporarily ceased, as step S494, show mistake Picture.That is, in electronic component mounting apparatus 10, the electronic unit installation action of boarded head 15 is temporarily ceased, shows Figure 113 Shown error picture 790.In error picture 790, display represent detected at loading position more than benchmark height this The information of one situation.In addition, in the region of error picture 790 792, the electricity carried to the loading position for generating mistake is shown The information of subassembly.By showing the information of electronic unit in region 792, so as to be notified to operating personnel to substrate 8 The installation action of which position installation electronic unit generate mistake.In addition, show input area in error picture 790 794, which includes to input the button 796 of the operation next performed in the state of mistake is generated, press Button 798.Button 796 shows " starting to produce ", and the action of installation action is started again at corresponding to mistake is ignored.In addition, button 798 displays " carry out component height inspection " again, corresponding to the action for the height for measuring loading position again.In addition, the ministry of electronics industry Part erecting device 10 is additionally provided with stopping in the state of error picture 790 is shown the button of production.
After electronic component mounting apparatus 10 shows error picture in step S494, as step S496, determine whether again It is secondary to be checked, i.e. whether to have selected button 798.Electronic component mounting apparatus 10 is judged to carrying out again in step S496 It checks（It is）, i.e., in the case of having selected button 798, enter step S482, perform above-mentioned processing again.Electronic unit is installed Device 10 is determined as in step S496 without checking again for（It is no）, i.e. in the case of without select button 798, as step Rapid S497 determines whether to start to produce, i.e. whether selected button 796.Electronic component mounting apparatus 10 is sentenced in step S497 It is set to and does not start to produce（It is no）, i.e. in the case of without select button 796, as step S496, stopping action, i.e. stop The production action of electronic component mounting apparatus 10, terminates present treatment.
Electronic component mounting apparatus 10 is judged to starting to produce in step S497（It is）That is, the feelings of button 796 have been selected Under condition, alternatively, be determined as in step S492 it is no in the case of, as step S499, perform installation action, i.e. performing will be by The action that the electronic unit that suction nozzle 32 is kept is installed to loading position terminates present treatment.
Electronic component mounting apparatus 10 by it is as noted above carry out electronic unit installation action before to carry position Can the height that put be detected, and judge install electronic unit, can suitably install electronic unit on substrate.By This, can inhibit the phenomenon that unreasonably to press electronic unit on substrate 8, can inhibit to apply to electronic unit, substrate 8 negative The situation of load.In addition, electronic component mounting apparatus 10 shows error picture as shown in Figure 112 and Figure 113, by being based in mistake The operation that picture inputs when showing performs various processing, so as to successfully be produced.For example, operating personnel passes through temporary When stop in the position of the electronic unit around loading position is adjusted, so as to continue production action.
In the following, using Figure 114, the example that processing during to the carrying of electronic unit acts illustrates.Figure 114 is Represent the flow chart of an example of the action of electronic component mounting apparatus.Electronic component mounting apparatus 10 utilizes carrying each When the suction nozzle of head carries out the action of absorption electronic unit, the processing of Figure 114 is performed.In addition, the processing of Figure 114 is substantially being made Processing in the case of installing both lead-type electronic-part and mounting type electronic unit to substrate for electronic unit.In electricity In subassembly erecting device 10, as step S910, the electronic unit of holding is determined, as step S912, to keeping Whether the component of object is that lead-type electronic-part is judged.
Electronic component mounting apparatus 10 is determined as lead-type electronic-part in step S912（It is）In the case of, as step Rapid S914 keeps the lead-type electronic-part of electronic part feeder using suction nozzle.That is, electronic component mounting apparatus 10 using suction nozzles to the holding position of electronic part feeder 100,402,404,406 etc.（2nd holding position）Supply Lead-type electronic-part is kept.Electronic component mounting apparatus 10 is in step S914 using suction nozzle to lead-type electronic-part After being kept, as step S916, by the lead of lead-type electronic-part to the insertion that inserts in the hole, and installed to substrate.
Electronic component mounting apparatus 10 is determined as it not being lead-type electronic-part in step S912（It is no）In the case of, make For step S917, the mounting type electronic unit of electronic part feeder is kept using suction nozzle.That is, electronic unit is installed Device 10 is using suction nozzle to the holding position of electronic part feeder 100a etc.（1st holding position）The mounting type electricity of supply Subassembly is kept.Electronic component mounting apparatus 10 keeps mounting type electronic unit using suction nozzle in step S917 Afterwards, as step S918, mounting type electronic unit is installed to substrate.That is, electronic component mounting apparatus 10 is not by mounting type electricity Subassembly to insert in the hole insertion and to substrate install.
Electronic component mounting apparatus 10 is performing the processing of step S916 or step S918, electronic unit is being pacified After dress, as step S919, whether the installation of all electronic units is terminated to judge.Electronic component mounting apparatus 10 is in step It is determined as that installation is not in rapid S919（It is no）In the case of, enter step S910, to the electronic unit of next installation into Row determines, above-mentioned processing is performed to the electronic unit after determining.If electronic component mounting apparatus 10 is sentenced in step S919 It is set to installation to terminate（It is）, then present treatment is terminated.
Electronic component mounting apparatus 10 as shown in Figure 114, can utilize 1 boarded head by mounting type electronic unit and lead Type electronic unit is installed to substrate.In addition, electronic component mounting apparatus 10 can utilize same suction nozzle, to the mounting type ministry of electronics industry Both part and lead-type electronic-part are carried.Herein, electronic component mounting apparatus 10 passes through to the wire type ministry of electronics industry The main body of part is kept（Absorption or grasping）, it is defeated so as to be carried out with mounting type electronic unit using same suction nozzle It send, install.In addition, electronic component mounting apparatus 10 passes through to being that mounting type electronic unit or lead-type electronic-part are sentenced It is fixed, respectively to lead is switched over to inserting in the hole to be inserted into or be not inserted into, even if so as to utilize identical boarded head Or in the case that identical suction nozzle is installed, can also with the condition that each electronic unit is adapted to substrate install.As a result, Suction nozzle need not be replaced can install mounting type electronic unit and lead-type electronic-part.It further, since can Carrying is mixed not distinguished to mounting type electronic unit and lead-type electronic-part, it is possible to make the limit of carrying order System becomes less, can further improve installation effectiveness.
Herein, electronic component mounting apparatus 10 is by being used as lead-type electronic-part, and use as noted above is by electronics The radial lead type electronic unit that assembly supply device 100 supplies, so as to more suitably obtain said effect.Electronic unit Erecting device 10 draws the radial direction after lead to be cut to specific length in electronic part feeder 100 by using suction nozzle Line style electronic unit is kept, and more specifically, suction nozzle holding, conveying is carried out to main body, and lead is inserted into inserting in the hole, So as to be installed to substrate.It is as noted above, electronic component mounting apparatus 10 since the main body to electronic unit is kept, so Wire length can be shortened.In addition, electronic component mounting apparatus 10 is conveyed due to being configured to using holding band main body, and Lead is cut off before being kept, it is possible to by the lead of radial lead type electronic unit in order to conveyed and by In the state of keeping after being removed with the part kept, installed to substrate.Thus, it is possible to shorten drawing for radial lead type electronic unit Line and to substrate install, can make electronic unit stablize in the state of to substrate install.Specifically, since footpath can be shortened Installed to the lead of lead-type electronic-part to substrate, it is possible to reduce when substrate install lead contact with being inserted into hole and The vibration applied to substrate.Even if as a result, with identical process to radial direction lead-type electronic-part and mounting type electronic unit into Row installation can also reduce the influence caused by mutual installation, even if in identical process, i.e. utilize identical carrying Head or identical suction nozzle are continuously installed, and suitably two kinds of electronic units can also be installed.
Herein, the electronic component mounting apparatus 10 of the above embodiment is configured to, as component feed unit 14f, tool There is the bowl formula feeder device 90 using bowl formula feeder, as component feed unit 14r, the ministry of electronics industry with radial direction feeder Part feedway 100, but it's not limited to that.Electronic component mounting apparatus 10 can make component feed unit become various groups It closes.For example, it is also possible to the electronic part feeder of bowl formula feeder is set on two front side, rear side component feed units, The electronic part feeder of radial direction feeder can also be set on two front side, rear side component feed units.In addition, as above Shown in stating, as component feed unit, it can also include and keep the electronics with supply mounting type electronic unit using electronic unit Assembly supply device（Chip part feeder）100a.Alternatively, it is also possible to by a component feed unit in front side, rear side Electronic part feeder is all set to electronic part feeder（Chip part feeder）100a.That is, can also set For the component feed unit supply lead-type electronic-part in front side, rear side（The electronic unit being inserted into substrate）, it is another A supply is without lead electronic unit（The electronic unit carried to substrate）.In addition, in electronic component mounting apparatus, as electronics Apparatus for mounting component can also use so-called pellet type feeder.In addition, in electronic component mounting apparatus, as the ministry of electronics industry Part feedway, can also use axial feeder, which will keep taking the axialmode electronic unit of holding Lead it is as noted above be cut to expose shortlyer below the substrate and be bent to "U" font in the state of, to holding position It is supplied.In the case, electronic component mounting apparatus is in the axialmode using suction nozzle to the holding position of axial feeder After electronic component body is kept, whether lead interval is well differentiated, will be determined as the good axialmode ministry of electronics industry Part to insertion hole（Substrate aperture）Middle insertion.What electronic component mounting apparatus 10 was either supplied by which electronic part feeder Electronic unit can either grasp to carry or be inserted into substrate by adsorbing electronic unit.In addition, it is supplying In the electronic part feeder of lead-type electronic-part, the direction that is configured at main body on the upside of the vertical of lead, i.e. draw Line is configured at the direction on the downside of the vertical of main body, by lead-type electronic-part to the holding position using suction nozzle implementation holding Supply.Herein, electronic component mounting apparatus 10 preferably as shown in the embodiment, will be supplied with the component of bowl formula feeder Unit, other kinds of electronic part feeder, such as above-mentioned radial direction feeder, above-mentioned axial feeder, mounting type electronics Component keeps the components feed units such as band feeder, rod-type feeder, pellet type feeder, configures via substrate delivery section 12 And opposite position, i.e. front side and rear side.Thus, it is possible to inhibit bowl vibration of formula feeder supplies list to other kinds of component The situation that member impacts, it is possible to make the electronics supplied for other kinds of electronic part feeder in holding position The suction nozzle holding effect of component is stablized.
In addition, in the present embodiment, using component feed unit as component feed unit 14f, 14r the two and carry out Explanation, but quantity do not limit.Alternatively, it is also possible to which 2 component feed units 14f, 14r are considered as 1 component feed unit, Component feed unit 14f, 14r are respectively seen as the 1st component supply unit, the 2nd component supply unit.It is configured to for example, can be considered as, 1 component feed unit has bowl formula feeder as shown in the above embodiment（Component feed unit 14f, the supply of the 1st component Portion）With radial direction feeder（Component feed unit 14r, the 2nd component supply unit）.In the case, the 1st component supply unit and the 2nd Component supply unit is configured across substrate allocation position and on opposite position.It is supplied alternatively, it is also possible to be considered as in 1 component There is the 1st component supply unit, the 2nd component supply unit on unit 14f.For example, it is as noted above, it can be considered as and be configured to, 1 portion Part feed unit 14f has radial direction feeder（1st component supply unit）With chip part feeder（2nd component supply unit）.Such as Shown in above-mentioned, electronic component mounting apparatus 10 can be independent of combination, and uses with a variety of electronic part feeders Structure.
Herein, the electronic unit supplied as radial direction feeder, that is, electronic part feeder 100, existing can profit With holding with the various radial lead type electronic units for keeping lead.Electronic part feeder 100 can supply such as aluminium electricity Electrolysis condenser, inductor, ceramic capacitor, thin film capacitor etc..In addition, as bowl formula feeder, that is, electronic part feeder 402nd, 404,406 electronic unit supplied, there are the various lead-type electronic-parts of package parts.Electronic part feeder 402nd, 404,406 such as solid-state relay, DIP types electronic unit, SIP types electronic unit, connector, transformer can be supplied Deng.
In addition, for the boarded head 15 of present embodiment, in order to 1 boarded head can be utilized to install a greater variety of electricity Subassembly and in the case of multiple suction nozzles, said suction nozzle apparatus for automatic change can be used（It is logical in the present embodiment The boarded head replacement action crossed the combination for replacing suction nozzle holding mechanism and holder main body and realized）, will be each in installation produces Suction nozzle replacing is various suction nozzles, grasping suction nozzle.Electronic component mounting apparatus 10 according to mounting type electronic unit and wire type Whether whether the corresponding size of electronic unit, weight, article body upper surface have adsorbable plane and can be with grasping parts The component conditions such as part main body for each component, specify the grasping part with the appropriate suction nozzle or suitable shape for adsorbing aperture The grasping suction nozzle of part, and be stored in production routine.Electronic component mounting apparatus 10 is based on the ministry of electronics industry stored in production routine Correspondence between part and suction nozzle switches over the suction nozzle installed on boarded head or in boarded head to keeping the electricity The suction nozzle of subassembly is determined.
As a result, electronic component mounting apparatus 10 for example in substrate installation by by the electronic unit that suction nozzle is kept from carrying In the case that type electronic unit is changed to lead-type electronic-part, generate using identical with keeping the suction nozzle of mounting type electronic unit Suction nozzle situation about being kept to lead-type electronic-part and lead-type electronic-part is protected using different suction nozzles Situation about holding.Electronic component mounting apparatus 10 is in the case of said suction nozzle difference, in preparatory process or in production, carries Electronic unit when changing, using said suction nozzle apparatus for automatic change, automatically replace suction nozzle.That is, persistently carry out following Action：When the electronic unit installed in production to substrate is such as mounting type electronic unit, selection is mutually fitted with the electronic unit The suction nozzle answered（Adsorb suction nozzle or grasping suction nozzle）, suction nozzle is made to be moved to positioned at the electronic unit supply dress for supplying the electronic unit Mounting type electronic unit on the holding position put keeps electronic unit and is moved to the assigned position of substrate, made Electronic unit carries out carrying out carrying action while decrease speed control.Electronic component mounting apparatus 10 is in the electricity of specified quantity The installation of subassembly terminates, identical to suction nozzle to go back when next electronic unit that should be installed is changed to lead-type electronic-part It is different to be differentiated.Electronic component mounting apparatus 10 is in the case where being determined as that suction nozzle is identical, since suction nozzle need not be replaced, So using identical suction nozzle as the suction nozzle of the lead-type electronic-part.In addition, electronic component mounting apparatus 10 is being determined as In the case of there is the suction nozzle that can be used in the case of suction nozzle difference, in other suction nozzles installed on boarded head, this is inhaled Suction nozzle of the mouth as the lead-type electronic-part, in the case of not having utilizable suction nozzle in other suction nozzles, by upper Suction nozzle apparatus for automatic change is stated, is automatically changed to the lead-type electronic-part suction nozzle.Electronic component mounting apparatus 10 is at this After calibration gets the suction nozzle of lead-type electronic-part ready, boarded head is moved, the suction nozzle is made to be supplied to lead-type electronic-part and is filled The holding position movement put.Electronic component mounting apparatus 10 utilizes the electronic part feeder for supplying lead-type electronic-part, It will be with by built-in disconnecting device（Cutting unit）From electronic unit band（Electronic unit keeps band）It is cut in advance shorter The lead-type electronic-part of the lead of specific length, is arranged on holding position.Electronic component mounting apparatus 10 is by using upper It states suction nozzle lead-type electronic-part is adsorbed or grasped, so as to be kept, by using detection unit（Laser identification dress Put 38）Lead interval is differentiated, and position offset is differentiated, so as to which opposite substrate is mobile and to insertion hole（Base Plate hole）The electronic unit of insertion is screened, to insert in the hole insertion when position offset correction is carried out to lead, and carry out The switching control for making decrease speed during insertion corresponding with the shearing length of lead and gradually slowing down, is carried out at the same time installation.
In addition, boarded head 15, in the case of with multiple suction nozzles, as long as at least having, there are one can be to wire type electronics Component（Insert type electronic unit）Various structures may be employed in the suction nozzle kept, carried, the structure of suction nozzle.For example, Boarded head 15 can also make the suction nozzle of a part be the suction nozzle kept to lead-type electronic-part, and it is pair to make remaining suction nozzle The suction nozzle that mounting type electronic unit is kept.In the case, electronic component mounting apparatus is electric to mounting type using suction nozzle In the case that subassembly is kept, the installation for carried out to the mounting type electronic unit substrate carrying controls, to lead In the case that type electronic unit is kept, into be about to the lead-type electronic-part to insertion hole（Substrate aperture）The installation of middle insertion Control.In addition, whole suction nozzles can also be set to the suction nozzle kept to lead-type electronic-part by boarded head 15.In addition, Electronic component mounting apparatus 10 is based on production routine, and the absorption suction nozzle of the electronic unit of object is carried to absorption（Or it is grabbed The grasping suction nozzle held）It is true to the suction nozzle for installing the electronic unit is kept to carry out according to the species of electronic unit when being determined It is fixed.Electronic component mounting apparatus 10 is as noted above, prepares the multiple suction nozzles that can be installed on a boarded head, passes through basis Instruction based on production routine in production acts suction nozzle apparatus for automatic change, and the suction nozzle on boarded head is removable The electronic unit for being changed to unloading and producing next time（The electronic unit of installation）Corresponding suction nozzle, so as to be kept on substrate Lead-type electronic-part is inserted into, and by carrying out substrate carrying to mounting type electronic unit, so as to carry out substrate successively Installation.
In the following, using Figure 115 and Figure 116, to using the electronic component mounting system of above-mentioned electronic component mounting apparatus（Peace Dress system）An example illustrate.Figure 115 is the schematic diagram for the schematic configuration for representing electronic component mounting system.Figure 115 Shown electronic component mounting system（Hereinafter also referred to " installation system "）1 have patterning device 2, reflow treatment device 4, Conveying device 6,7 and electronic component mounting apparatus 10.In installation system 1, with patterning device 2, conveying device 6, electricity Subassembly erecting device 10, conveying device 7, the order of reflow treatment device 4, configure each several part, with conveying substrate.
Patterning device 2 is to form solder pattern on the surface of substrate, to the dress of the filling solder that inserts in the hole of substrate It puts.Reflux 4 makes the solder of substrate melt temporarily by the way that substrate is heated to set point of temperature, so as to by with solder contact Substrate and electronic unit bonding.That is, reflux 4 utilizes the solder of pattern, by the pattern of the solder formed on the surface of substrate Lead, is inserted into the lead-type electronic-part to insert in the hole by the mounting type electronic unit and substrate bonding of upper installation and lead is inserted Enter hole, be bonded using the solder for the filling that inserts in the hole.
Conveying device 6,7 is the device of conveying substrate.Conveying device 6 will be handled and removed in patterning device 2 The substrate gone out is moved into electronic component mounting apparatus 10.Conveying device 7 will be handled and taken out of in electronic component mounting apparatus 10 Substrate, moved into reflow treatment device 4.
Electronic component mounting apparatus 10 is as noted above, and electronic unit is installed to substrate.Herein, electronic unit installation dress 10 are put as electronic unit, lead-type electronic-part can be installed.In addition, electronic component mounting apparatus 10 is used as electronic unit, Both lead-type electronic-part and mounting type electronic unit can also be installed.Installation system 1 is said structure.
Figure 116 is the flow chart of an example of the action for representing electronic component mounting system.In installation system 1, make For step S960, the printing solder on substrate.That is, in installation system 1, as step S960, existed using patterning device The surface of substrate forms the pattern of solder, to the filling solder that inserts in the hole.In installation system 1, to substrate in step S960 After upper printing solder, substrate to electronic component mounting apparatus 10 is moved into using conveying device 6, as step S962, utilizes electricity Subassembly erecting device 10 installs lead-type electronic-part and mounting type electronic unit to substrate.In installation system 1, in step In rapid S962 after substrate installs electronic unit, the substrate for being equipped with electronic unit is filled to reflow treatment using conveying device 7 It puts 4 to move into, as step S964, performs reflow treatment, terminate present treatment.
It is as noted above in installation system 1, by using electronic component mounting apparatus 10 to lead-type electronic-part with And mounting type electronic unit is installed, so as to utilize 1 reflow treatment, by lead-type electronic-part and mounting type electricity Both subassemblies are fixed on substrate.As a result, in installation system 1, the structure of manufacturing line can be simplified.
In addition, lead-type electronic-part and mounting type electronic unit are carried out by using electronic component mounting apparatus 10 Installation so as to as noted above, can be installed in the state of the lead of radial lead type electronic unit is shortened.As a result, It is right even if being installed in identical process to lead-type electronic-part and mounting type electronic unit in installation system 1 Lead-type electronic-part and mounting type electronic unit perform reflux simultaneously, can also electronic unit suitably be bonded in substrate On.Thus, it is possible to improve the production efficiency of substrate.
In addition, in electronic component mounting system 1, by being pre-charged with or solder-coating to inserting in the hole, so as to pass through The lead after insertion is temporarily fixed at by solder and is inserted in the hole, therefore, can without using it is currently performed, for fixed component And the component for bending component in substrate back side bends process, therefore lead can be shortened, thus, it is possible in existing substrate In the Special mounting device of insertion, the wire kink device of substrate back side setting is omitted in.It furthermore it is possible to will be in existing electricity Subassembly erecting device（Chip attachment machine）Middle supporting pin utilizing, supporting substrate, configures in arbitrary position, utilizes carrying Head the carrying of carry out substrate and to insert in the hole insertion.
In addition, for alloing what installation system 1 shown in Figure 115, Figure 116 obtained said effect there is preferred structure It's not limited to that for the installation system of electronic component mounting apparatus.Such as installation system can also be configured to, and have more electronics Apparatus for mounting component 10.In addition, in installation system, it can also be electric as wire type is only installed using electronic component mounting apparatus 10 The erecting device of subassembly uses.In addition, electronic component mounting apparatus 10 can suitably install lead-type electronic-part Device, but the device for being also used as temporarily only installing mounting type electronic unit uses.

Claims (14)

1. a kind of electronic component mounting apparatus, will be positioned at the electronics of holding position using the boarded head moved in the horizontal plane Component is transferred and installed to the loading position of substrate,
It is characterized in that, have：
Electronic part feeder, by the wire type electronics with electronic component body and with the lead of main body connection Component is supplied to the holding position；
Holder main body, with suction nozzle, suction nozzle driving portion and boarded head supporter, which is driven by air pressure, with The electronic component body of electronic unit to being supplied from the electronic part feeder is kept, suction nozzle driving portion installation The suction nozzle simultaneously carries out driving and rotation driving, and supply air pressure up and down, and the boarded head supporter is to the suction nozzle And the suction nozzle driving portion is supported；
Control unit controls the action of the holder main body and the electronic part feeder；And
State detecting section is configured at the shape between light source and photo detector in the lead-type electronic-part kept by the suction nozzle Under state, the state of the lead-type electronic-part is detected,
The control unit is in the lead-type electronic-part kept based on suction nozzle detected by the state detecting section, described In the case of judging that the lead state of the electronic unit meets condition, which is inserted into substrate for state,
The suction nozzle is absorption suction nozzle or grasps suction nozzle,
The state detecting section is adjusted by the height of the Z-direction of the lead-type electronic-part to being kept by the suction nozzle It is whole, the lead of the lead-type electronic-part is made to make measure object between the light source and the photo detector It is measured while electronic unit is rotated with certain speed, so as to the direction to rotate a circle to the lead-type electronic-part Shape is detected, and the testing result of all directions shape is superimposed, the shape of the lead of the electronic unit is detected.
2. a kind of electronic component mounting apparatus, will be positioned at the electronics of holding position using the boarded head moved in the horizontal plane Component is transferred and installed to the loading position of substrate,
It is characterized in that, have：
Electronic part feeder, by the wire type electronics with electronic component body and with the lead of main body connection Component is supplied to the holding position；
Holder main body, with suction nozzle, suction nozzle driving portion and boarded head supporter, which is driven by air pressure, with The electronic component body of electronic unit to being supplied from the electronic part feeder is kept, suction nozzle driving portion installation The suction nozzle simultaneously carries out driving and rotation driving, and supply air pressure up and down, and the boarded head supporter is to the suction nozzle And the suction nozzle driving portion is supported；
Control unit controls the action of the holder main body and the electronic part feeder；And
State detecting section is configured at the shape between light source and photo detector in the lead-type electronic-part kept by the suction nozzle Under state, the state of the lead-type electronic-part is detected,
The control unit is in the lead-type electronic-part kept based on suction nozzle detected by the state detecting section, described In the case of judging that the lead state of the electronic unit meets condition, which is inserted into substrate for state,
The suction nozzle is absorption suction nozzle or grasps suction nozzle,
The state detecting section is adjusted by the height of the Z-direction of the lead-type electronic-part to being kept by the suction nozzle It is whole, the lead of the lead-type electronic-part is made to make measure object between the light source and the photo detector It is measured while electronic unit is rotated with certain speed, so as to the direction to rotate a circle to the lead-type electronic-part Shape is detected, and the testing result of all directions shape is superimposed, to the outermost shape of the lead of the electronic unit into Row detection, based on the outermost shape, is detected the interval of the lead.
3. a kind of electronic component mounting apparatus, will be positioned at the electronics of holding position using the boarded head moved in the horizontal plane Component is transferred and installed to the loading position of substrate,
It is characterized in that, have：
Electronic part feeder, by the wire type electronics with electronic component body and with the lead of main body connection Component is supplied to the holding position；
Holder main body, with suction nozzle, suction nozzle driving portion and boarded head supporter, which is driven by air pressure, with The electronic component body of electronic unit to being supplied from the electronic part feeder is kept, suction nozzle driving portion installation The suction nozzle simultaneously carries out driving and rotation driving, and supply air pressure up and down, and the boarded head supporter is to the suction nozzle And the suction nozzle driving portion is supported；
Control unit controls the action of the holder main body and the electronic part feeder；And
State detecting section is configured at the shape between light source and photo detector in the lead-type electronic-part kept by the suction nozzle Under state, the state of the lead-type electronic-part is detected,
The control unit is in the lead-type electronic-part kept based on suction nozzle detected by the state detecting section, described In the case of judging that the lead state of the electronic unit meets condition, which is inserted into substrate for state,
The suction nozzle is absorption suction nozzle or grasps suction nozzle,
The state detecting section is adjusted by the height of the Z-direction of the lead-type electronic-part to being kept by the suction nozzle It is whole, the lead of the lead-type electronic-part is made to make measure object between the light source and the photo detector It is measured while electronic unit is rotated with certain speed, so as to the direction to rotate a circle to the lead-type electronic-part Shape is detected, and the testing result of all directions shape is superimposed, and the center of the lead of the electronic unit is carried out Measurement, the lead is detected compared with the position of the suction nozzle.
4. electronic component mounting apparatus according to claim 1, which is characterized in that
The control unit is in the case where the lead state for judging the electronic unit is unsatisfactory for condition, by the electronic unit to recycling Mechanism conveys.
5. electronic component mounting apparatus according to any one of claim 1 to 3, which is characterized in that
Also there is the framework being supported to each several part,
The state detecting section is camera, is supported in the framework, and the shape of the electronic unit of measure object is carried out Three-dimensional measurement.
6. electronic component mounting apparatus according to any one of claim 1 to 3, which is characterized in that
The state detecting section is by measuring the electronic unit of measure object from set direction, so as to the electronics The radical of the lead of component is detected.
7. electronic component mounting apparatus according to any one of claim 1 to 3, which is characterized in that
The state detecting section is detected the direction of the electronic unit, the state as the electronic unit.
8. electronic component mounting apparatus according to any one of claim 1 to 3, which is characterized in that
The state detecting section is detected the shape of the main body of the electronic unit, the shape as the electronic unit State.
9. electronic component mounting apparatus according to any one of claim 1 to 3, which is characterized in that
The electronic part feeder includes from electronic unit and keeps band cut-out lead and supply radial lead type electronic unit Radial direction feeder.
10. electronic component mounting apparatus according to claim 9, which is characterized in that
The radial direction feeder from electronic unit keep band by lead it is shorter be cut to specific length, to radial lead type electronics Component is supplied.
11. electronic component mounting apparatus according to any one of claim 1 to 3, which is characterized in that
The electronic part feeder is the radial lead type electronic unit progress to the insertion that inserts in the hole to the substrate The lead-type electronic-part feedway of supply,
Also there is mounting type electronic part feeder, to what is installed by being carried on the substrate on the substrate Mounting type electronic unit is supplied,
The control unit is using the suction nozzle to the main part of the radial lead type electronic unit and mounting type electronic unit It is kept, and to base plate transfer, by the radial lead type electronic unit to the insertion that inserts in the hole, by the mounting type Electronic unit carries on substrate.
12. a kind of electronic component mounting system, which is characterized in that have：
Patterning device to the filling solder that inserts in the hole of the substrate, also, prints weldering on the surface of the substrate The pattern of material；And
Electronic component mounting apparatus described in claim 11, the insertion after solder is filled by the patterning device Kong Zhong is inserted into radial lead type electronic unit, on the surface of pattern for having printed the solder, installs the mounting type electronics Component.
13. electronic component mounting system according to claim 12, which is characterized in that
Also there is reflow treatment device, to installing the radial lead type electronic unit using the electronic component mounting apparatus And the substrate after the mounting type electronic unit flows back, by the radial lead type electronic unit and the mounting type Electronic unit welds on the substrate.
14. a kind of electronic component mounting system, which is characterized in that have：
Electronic component mounting apparatus described in claim 11 inserts in the hole insertion radially after the filling solder of substrate Lead-type electronic-part on the surface of pattern for having printed the solder, installs mounting type electronic unit；And
Reflow treatment device, to installing the radial lead type electronic unit and institute using the electronic component mounting apparatus It states the substrate after mounting type electronic unit to flow back, by the radial lead type electronic unit and the mounting type ministry of electronics industry Part welds on the substrate.
CN201310049299.5A 2012-02-08 2013-02-07 Electronic component mounting apparatus, electronic component mounting system and electronic component mounting method Active CN103249293B (en)

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