CN1448043A - Three-D inspection of leaded Ics - Google Patents
Three-D inspection of leaded Ics Download PDFInfo
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- CN1448043A CN1448043A CN01814393A CN01814393A CN1448043A CN 1448043 A CN1448043 A CN 1448043A CN 01814393 A CN01814393 A CN 01814393A CN 01814393 A CN01814393 A CN 01814393A CN 1448043 A CN1448043 A CN 1448043A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention refers to an optical inspection system for an inspection of an object in form of a leaded IC component, wherein the object is positioned in an overlapping relationship with an aperture of a datum and illuminated by a lateral diffuse light source, thereby projecting contour images of the object and of a reference contour of the reference edge through the aperture in several projection directions. An optical side prism and a center prism is provided to receive the projection light under two different incident angles thus defining two different projection paths so that a three dimensional image can be captured by analyzing the light of these two projection paths coming from one object point. The side prism and the center prism are designed and arranged such that the projection paths of the first and second projections have the same optical length between the lead-including contour of the object and an imaging plane of the system.
Description
Technical field
The present invention relates to the device that a kind of three-dimensional that is used to the integrated circuit (IC) with lead-in wire detects.
Background technology
At the electronic component that has a plurality of pins or lead-in wire, in the manufacturing as integrated circuit, there is the people to propose to use the detection system of optical system, these detection systems provide the three-dimensional to electronic component to detect.
In order to obtain that the three-dimensional of IC element is detected, there is the people also to propose, at least two light paths are provided, along these light paths the different images of detected integrated circuit is transferred to imageing sensor.
For example, United States Patent (USP) 5,909 discloses a kind of method that integrated circuit detects that is used in 285, and this method comprises a camera, and the accurate pattern mask that is deposited is imaged on the detected transparent graticule.Use diffused light that detected integrated circuit is shone.By using the minute surface or the prism of top, the end view of integrated circuit is reflected on the camera.But this method is used the frontlighting irradiation, also needs integrated circuit fully accurately to be positioned on the transparent graticule.
From United States Patent (USP) 5,910,844 can learn a kind of vision detection system, and eight width of cloth optical imagerys are recorded in the odd number picture frame simultaneously in this system, and these images are exported from two optical cameras.According to United States Patent (USP) 5,910, this detection system of 844 needs complicated optical reflection unit, and this device uses a plurality of optical orientation parts.But according to United States Patent (USP) 5,910,844, when detecting the object of different size, the optical orientation parts have to selectively adjust.
In addition, can learn a kind of optical detection system from U.S. Patent application 09/205,852, this system is used for determining the positional information of object with respect to object of reference.Benchmark as system's object of reference is placed near the detected object.In addition, be provided for the diffused light source of irradiation object.This light source is set so that the point on the point on the object and the benchmark along at least two light paths and their image in identical plane, shape is at an angle each other for these light paths.In addition, provide imaging subsystems, obtain along the image of two light paths.In order to provide point on the object, the image that obtains is correlated with and analyzes by imaging subsystems with respect to the positional information of the point on the benchmark.According to U.S. Patent application 09/205,852, by using Dove prism to form a light path and using level crossing to form another light path, be possible thereby form two light paths, these two light paths are propagated on the imaging subsystems by relaying.In addition, using single Dove prism also is possible so that two light paths to be provided.By this method, light path forms along the inner surface of Dove prism, and another light path forms along the outer surface of Dove prism.
But according to U.S. Patent application 09/205,852, the light path difference of these two light paths damaged down to picture quality, so the precision of detection system is also damaged.In addition, as two faces of the object of double-face intergrate circuit by using two as United States Patent (USP) 09/205, the 852 disclosed optical textures of two light paths that provide separately detect, in this case, owing to there is the white space of bulk at the middle part of image that detection system produces, optical subsystem needs large-area transducer to obtain the image from two light paths.
Summary of the invention
The present invention provides a kind of detection system for the integrated circuit (IC) of band lead-in wire.Can in confined spaces, test the lead-in wire of expanded letter IC encapsulation according to system of the present invention.In other words, the objective of the invention is to carry out in a kind of very compact mode the three-dimensional measurement of IC lead-in wire.
System according to the present invention comprises benchmark, has in this benchmark by the determined perforate of reference edge, and described benchmark provides a plane of reference that is substantially perpendicular to the optical axis of system at least, and wherein, the perforate that detected object is positioned as with benchmark is an overlapping relation.This system also comprises: horizontal diffused light source, be used for laterally shining and diffuse light on the object by perforate, thus by perforate at several projecting directions, the object that is positioned is comprised that the profile of lead-in wire and the contour images of reference edge carry out projection; Optics side prism is used to receive first projected light from the contour images of first projecting direction.Described side prism has: the plane of incidence, exit facet and interior reflective surface, the collaborative plane of incidence of this interior reflective surface and exit facet work are used for internal reflection first projected light, make it pass through the exit facet of side prism, be oriented to image planes in exit direction, system comprises the optics centre prism, be placed to receive second projected light from the contour images of second projecting direction, described centre prism has in the precalculated position: the incident plane of refraction and with the outgoing plane of refraction of incident plane of refraction collaborative work so that second projected light is refracted to imaging surface by the incident plane of refraction with by the outgoing plane of refraction.Side prism and centre prism are designed and place, so that the projection path of first and second projections has identical light path between the contours of objects of being with lead-in wire and imaging surface.
Comprise the profile of lead-in wire and the identical light path of two projection path between the imaging surface in order to provide at object by what side prism and centre prism were determined separately, must change the profile of side prism, to arrive the light path of imaging plane corresponding to the profile of centre prism and light source from object outline and by centre prism, vice versa.In other words, the size of side prism and centre prism and placement must be coordinated mutually, i.e. pairing.Based on by different optical medium the time, the principle that the light path of light is different, so light path is the function of geometrical length and optical medium.So, provide two kinds of different optical mediums by being respectively the side prism with centre prism, and the 3rd medium air, change the size of each prism by considering the ad hoc structure in the 3rd medium air, then can obtain to meet the coupling of identical light path.
According to a preferred embodiment of the invention, for measuring or detect as two or more of IC element two-sided or more multiaspect, can dispose two or more identical optics side prisms.This means, system with single side prism and centre prism becomes mirror image with respect to axis, so the symmetrical of a plurality of sides prism system for winding is placed, they are also placed with respect to public centre prism symmetry, the also middle axial symmetry placement of system for winding of centre prism conversely.As a result, the projection of the profile of each face of IC is by each side prism and centre prism, for each face of object is determined two projections.Therefore, there is each face of a plurality of IC element can be simultaneously detected.
In addition, in a preferred embodiment, obtain the required image area of projected image in order to reduce, this projected image is provided by one or two optics side prism and centre prism, an inclined to one side rectangle prism is provided, and this inclined to one side rectangle prism will influence first and second projections mobilely is parallel to it and near the optical axis of system.Therefore reduced the image area that is used to detect, this has caused the raising of active graphical resolution, so improved measurement accuracy.
Best, the image that detection system produced is obtained by the video camera scioptics, and the processor by computer carries out digitlization and processing then, to determine the three-dimensional coordinate of object with respect to benchmark.
Description of drawings
For the present invention is described, will preferred embodiment be described in conjunction with following accompanying drawing here, wherein:
Fig. 1 shows the schematic diagram of detection system according to a preferred embodiment of the invention;
Fig. 2 shows the path of two illumination beams of side prism and centre prism respectively;
Embodiment
According to a preferred embodiment of the present invention, be used to detect the IC element form with band lead-in wire object detection system as shown in Figure 1, this detection system comprises: benchmark 1, wherein have by reference edge 12 determined perforates 2, and benchmark 1 provides the plane of reference vertical with systematic optical axis A; Object carriage 30 is used for anchored object 10, and making the perforate 2 of itself and benchmark 1 is overlapping relation, so be positioned on the plane that is focused on by system; Diffused light source 3 is used for by perforate 2 emission diffused lights, and the profile that therefore object 10 is comprised the profile of lead-in wire and reference edge 12 is by perforate 2 projection on several projecting directions.This system also comprises two optics side prisms 5, is used to receive the projection of profile and lead-in wire; Centre prism 6 and image detection system 9, this detection system comprise lens and the camera of imageing sensor are arranged.
As shown in Figure 1, illumination 3 preferably laterally is placed on the top of benchmark 1, but also can be set at the benchmark top.Best, the light of illumination 3 emission single wavelengths or narrow bandwidth wavelength, with the minimizing chromatic dispersion, otherwise the propagation distance owing to length may cause chromatic dispersion in optical prism.For example, the illumination 3 of this narrow bandwidth can realize by the filter (not shown).
For example, object can be positioned at the near zone of perforate 2 and overlapping with perforate 2 by object carriage 30, and object carriage 30 preferably has a vacuum tip to hold object 10 from the top.Object 10 is aimed at the optical axis A of system, and the position of its relative pedestal can be changed by the object carriage and adjust to arrange object to reach a kind of effect, and the object-point of symmetry is arranged in and is parallel to the plane that perforate is the plane of reference of benchmark.Illumination 3 provides the backlighting of diffusion.So by the detected object with lead-in wire is placed described diffused ray, the packaging body 82 of the lead-in wire of object 10 or pin 81 and object 10 is by illumination 3 backlight illuminations.
As mentioned above, benchmark 1 provides the plane of reference for system.Best, this benchmark and the plane of reference are substantially perpendicular to the optical axis of system at least.Perforate 2 forms on benchmark 1, determines that by four reference edges 12 or two pairs of parallel reference edges 12 wherein, the spacing of two relative reference edges is known.The gap ratio of two relative reference edges 12 of benchmark 1 wants the external dimensions of IC element of detected maximum big slightly.For the stable plane of reference is provided, benchmark 1 is made by the material that mechanically intensity is big and stable, as carbide or invar.The upper surface of benchmark 1 is arrived quite high evenness by grinding and buffing.It is sharp-pointed and straight that the reference edge 12 of benchmark 1 is made, and accurately finish.The hole wall that constitutes the benchmark 1 of reference edge 12 can be by blacking, to avoid or to reduce reflection from relative illumination.
After leaving the face of benchmark, be radiated on separately the side prism 5 from each light source and projected light with the incidence angle that is positioned at the special angle scope.This as shown in Figure 1, illustrated preferred embodiment comprises two optics side prisms, to be used to detect two sides of IC element, these sides comprise the lead-in wire of IC.Two optics side prisms 5 are all placed with respect to the optical axis A symmetry of system.Each optics side prism has six sides and one four limit cross section, this four limits cross section comprises the plane of incidence 61, exit facet 62 and interior reflective surface 52, these interior reflective surface 52 collaborative plane of incidence and exit facet work, be used for the internal reflection of projection of the profile of object and perforate, with the exit direction that is oriented to image planes 110 exit facet, make that first projection path between described profile and the imaging surface is determined by each side.
The plane of incidence and exit facet generation refraction at the side prism are possible, and this depends on the angle that projected light shines respective face.When the reflecting surface of side prism makes the reverberation that enters with a certain predetermined angular range by the plane of incidence be adjusted to the axis that is parallel to system with respect to the inclination of imaging surface, exit facet is perpendicular to axis.As a result, leaving the projection of side prism separately is adjusted to and is parallel to described axis A, the i.e. optical axis of system.
System also comprises optics centre prism 6, this centre prism has incident plane of refraction 63 and outgoing plane of refraction 64, wherein the projected light of the incident of object outline and perforate all is refracted at incident plane of refraction 63 and outgoing plane of refraction 64, to form second projection path at described profile and 110 of imaging surfaces.Centre prism 6 has the cross section of hexagon, under the situation of using two side prisms, 8 sides is arranged, and under the situation of using four side prisms, centre prism 6 has 10 sides.Centre prism 6 has one, places centre prism around this axial symmetry, and wherein, when central prism was placed in the system, the axle of this centre prism overlapped with the axis A of system.
When the outgoing plane of refraction 64 of central prism tilts with respect to axis at a certain angle so that the light that comes out from the outgoing plane of refraction is refracted when parallel with optical axis A, the incident plane of refraction is parallel with imaging surface, promptly perpendicular to the axis of system, and therefore perpendicular to the normal of centre prism.
According to preferred embodiment, when using two relative side prisms, two inclined to one side rectangle prisms 8 are placed under optics side prism and the centre prism, promptly be positioned at (i) side prism exit facet 62 separately and the outgoing plane of refraction 64 of centre prism, (ii) between the imaging surface 110, the rectangle prism is conditioned the optical axis A that points to this detection system partially.In addition, each inclined to one side rectangle prism 8 is placed with respect to the symmetrical of system.This placement of rectangle prism can allow to move into to the optics axis A of system the projected light of each inclined to one side rectangle prism partially, obtains the required image area of image of projection with minimizing.
Each inclined to one side rectangle prism 8 comprises perpendicular to the plane of incidence of optical axis and exit facet and two interior reflective surface, is used for reflective projection light, and this projected light is passed through described prism in its path.The size that the plane of incidence is had can receive the light of projection path 91 and projection path 92, promptly leaves the light of side prism 5 and centre prism 6 respectively.Projected light separately at first is vertically projected to the plane of incidence, projects first reflecting surface with miter angle again, is reflected with an angle of 90 degrees.Projection light then projects to second reflecting surface with miter angle again, so described light is parallel to axis A after last reflection.Because being parallel to systematic optical axis, projected light enters separately inclined to one side rectangle prism, thereby each reflecting surface tilts with miter angle with respect to described axle A, therefore contrast the projected light of incident and the inclined to one side rectangle prism of outgoing, projection direction of light is not separately changed by rectangle prism partially, but only be move the optics axis of more close system.Therefore, reduced the image area of two-sided detection, and caused the raising of effective image resolution ratio, so improved certainty of measurement.
Best, provide to be attached to video camera 7, and the lens (not shown) of the optical axis of alignment system placement.Place sensor board on imaging surface, this sensor board belongs to video camera 7, is acquired so comprise the single image of projection of the profile of the lead end 81 of profile, object 10 of the reference edge 12 of benchmark 1 and packaging body 82.This image is that an adnation of this object becomes, this is by carrying out projection with the reference edge 12 of benchmark 1, the lead end 81 of object 10 and the profile of packaging body 82 along two projection path 91 and 92, these two projection path 91 and 92 have two different directions, correspond respectively to two different view angle theta 1 and θ 2, so include three-dimensional information.The image that video camera 7 is obtained uses digital image processing method, as edge detection method, carries out digitlization and analysis.That is to say that this system extracts, as the relative position of the feature of the packaging appearance of object 10 and lead end, and by the image that obtains be correlated with and the mechanical parameter of analytical calculation, as lead spacing and joint dimension.
With reference to figure 2, show two projecting light paths of left surface prism and centre prism respectively, wherein, the configuration of the prism of one side is only disclosed, because preferably dispose, so the second side surface opposite prism (not shown) that the respective projection light path just passes through as shown in Figure 1 generates with respect to symmetrical.
Two projection path as shown in Figure 2 are all from 1 P of object, and this point determined detected contours of objects point, and wherein, this point can observe along two projection path 91 and 92 that optics side prism 5 and centre prism 6 are provided.So this object-point P should be arranged in can be by the plane that system focused on.These two different projection path 91 and 92 provide an object-point at two different view angle theta 1 and two of θ 2 different views.
Two different view angle theta 1 and θ 2 provide by the predetermined angular between the plane of the incident plane of refraction 63 of the plane of the reflecting surface 52 of side prism 5 and centre prism 6.
Though only be used for mobile projector light being parallel to optics axis A in the reflection of the reflecting surface 52 of side prism 5, the projected light of second projection path by centre prism is moved twice at incident plane of refraction and outgoing plane of refraction makes it be parallel to optical axis A to regulate this light.
Will be with projected light to the optics axis, promptly the normal of centre prism moves, and centre prism must have than the high refraction coefficient of outside other media.According to a preferred embodiment of the invention, other media are air, and its refraction coefficient is approximately 1.
As shown in Figure 2, between face 100 and imaging surface 110, the projected light of the projected light of first projection path 91 and second projection path 92 is conditioned to be parallel to the optical axis A of system.
According to the present invention, optical path difference between two projected light light is compensated at exit facet 100, this exit facet is set up and is parallel to benchmark 1, and align with the bottom surface of optics side prism 5, but the permission of the maximum between view angle theta 1 and the θ 2 angular difference is held, and has kept enough blank between lead end 81 and the reference edge 12 in image.
δ=[a/n1]+[(b+c)/n2]-[(d+f)/n1]-e/n3 is a wherein, b, c, d, e and f are the partial-lengths of projection path 91 and 92, and n1 is the refraction coefficient of the medium beyond the optical prism, n2 is the refraction coefficient of the material of optical prism 5, and n3 is the refraction coefficient of the material of centre prism 6.Here, light path can be expressed as: Lo=Lg*n, and wherein Lo is a light path, and Lg is a geometrical length, and n is the refraction coefficient of the material that passes through of geometrical length.
Because the medium beyond the prism 5 is air preferably, so n1 equals 1, so formula 1 can be write:
δ=a+[(b+c)/n2]-(d+f)-[e/n3] by selecting to have suitable refraction coefficient n2 and the material of n3 respectively, the optical path difference δ between first projection path 91 (a+b+c) and second projection path (d+e+f) just can be compensated.
Using the outer another kind of medium of deacration also is possible as other media, as another kind of gas, and liquid, or glass.
As mentioned above, an aspect that influences the light path of two projection path 91 and 92 is to select the optical material that is fit to optics side prism 5 and centre prism 6, this projection path 91 and 92 respectively with view angle theta 1 and θ 2 from same object point such as the lead end 81 of reference edge 12 or object.
Another aspect that reduces two optical path differences between projection path is to adopt suitable view angle theta 1 and θ 2, and the suitable optics side prism 5 and/or the size of centre prism 6.
According to a preferred embodiment of the invention, another aspect that influences the equivalent optical path of two projection path 91 and 92 is the size of the perforate 2 of benchmark 1, and optics side prism 5 and/or centre prism 6 are with respect to the setting of the perforate 2 of benchmark 1 and benchmark 1.
Though with reference to preferred embodiment the present invention is described in detail, should be understood that: do not deviating from determined spirit and scope of the invention in the claim of being added, can carry out various variations, substitute and change.
Claims (5)
1. an optical detection system is used to detect the object with integrated circuit component form of being with lead-in wire, and described system has optical axis and comprises:
Benchmark (1), have in this benchmark by the determined perforate of reference edge (12) (2), described benchmark provides a plane of reference that is substantially perpendicular to the optical axis (A) of system at least, wherein, object to be detected (10) is positioned in the precalculated position, with the perforate (2) of benchmark (1) be overlapping relation;
Horizontal diffused light source (3) is used for laterally shining and diffuses light on the object and by perforate (2), thus by perforate (2) at several projecting directions, the object (10) that is positioned is comprised that the profile of lead-in wire and the contour images of reference edge (12) carry out projection;
Optics side prism (5), be used to receive first projected light from the contour images of first projecting direction, described side prism has: the plane of incidence (51), exit facet (62) and interior reflective surface (52), the collaborative plane of incidence of this interior reflective surface and exit facet work are used for internal reflection first projected light, make it pass through the exit facet of side prism, be oriented to image planes in exit direction;
Optics centre prism (6), be placed to receive second projected light from the contour images of second projecting direction, described centre prism (6) has in the precalculated position: incident plane of refraction (63) and with the outgoing plane of refraction (64) of incident plane of refraction collaborative work so that second projected light is refracted to imaging surface (110) by the incident plane of refraction with by the outgoing plane of refraction;
Wherein, side prism (5) and centre prism (6) are designed and place, so that the projection path of first and second projections has identical light path between the profile of being with the object (10) that goes between and imaging surface (110).
2. system as claimed in claim 1 also comprises: the image detection system that is provided with on imaging surface is used to survey the image of two projections of described profile.
3. system as claimed in claim 2, wherein, described image detection system comprises lens and the camera (7) of imageing sensor is arranged.
4. as the system of one of claim 1 to 3, wherein, described first projecting direction and described second projecting direction correspond respectively to first visual angle (Θ 1) and second visual angle (Θ 2), and these two visual angles are different mutually.
5. as the system of one of claim 1 to 4, also comprise inclined to one side rectangle prism (8), this inclined to one side rectangle prism is placed between the exit facet and imaging surface of side prism and centre prism, and the projection that is used for entering this inclined to one side rectangle prism moves to parallel and is close to the optical axis of system.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200004224 | 2000-08-22 | ||
| SG2000042242 | 2000-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1448043A true CN1448043A (en) | 2003-10-08 |
Family
ID=20430635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN01814393A Pending CN1448043A (en) | 2000-08-22 | 2001-08-22 | Three-D inspection of leaded Ics |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN1448043A (en) |
| AU (1) | AU2001282842A1 (en) |
| WO (1) | WO2002017357A2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101603926A (en) * | 2008-05-09 | 2009-12-16 | 半导体技术设备私人有限公司 | Multi-surface detection system and method |
| CN102116745A (en) * | 2009-12-30 | 2011-07-06 | 上海允科自动化有限公司 | IC element detection system |
| CN101305259B (en) * | 2005-11-15 | 2012-07-04 | 株式会社尼康 | Plane position detection device, exposure device and method for manufacturing elements |
| CN102788554A (en) * | 2007-04-05 | 2012-11-21 | 联达科技控股有限公司 | Multi-surface detection system and method |
| CN103249293A (en) * | 2012-02-08 | 2013-08-14 | Juki株式会社 | Electronic component installation apparatus, electronic component instalation system and electronic component instalation method |
| CN112888913A (en) * | 2018-10-18 | 2021-06-01 | 赛博光学公司 | Three-dimensional sensor with aligned channels |
| CN114167622A (en) * | 2021-12-14 | 2022-03-11 | 樊宸 | Optical system for acquiring three-dimensional information of surface of shot object |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001336919A (en) * | 2000-03-31 | 2001-12-07 | Agilent Technol Inc | Inspection system of integrated circuit with lead |
| DE602004021240D1 (en) * | 2003-03-07 | 2009-07-09 | Ismeca Semiconductor Holding | OPTICAL EQUIPMENT AND INSPECTION MODULE |
| EP2838333B1 (en) * | 2012-04-12 | 2019-08-21 | FUJI Corporation | Component mounting machine |
| JP6138127B2 (en) * | 2012-08-01 | 2017-05-31 | 富士機械製造株式会社 | Component mounter |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU4660496A (en) * | 1996-02-12 | 1997-09-02 | Icos Vision Systems N.V. | Process for forming on an opto-electronic transducer a shadow image of at least a part of an electronic component |
| JPH1093846A (en) * | 1996-09-12 | 1998-04-10 | Copal Co Ltd | Image pickup device |
| US5909285A (en) * | 1997-05-05 | 1999-06-01 | Beaty; Elwin M. | Three dimensional inspection system |
| US5910844A (en) * | 1997-07-15 | 1999-06-08 | Vistech Corporation | Dynamic three dimensional vision inspection system |
| SG72860A1 (en) * | 1998-08-27 | 2001-03-20 | Agilent Technologies Inc | Leaded components inspection system |
-
2001
- 2001-08-22 AU AU2001282842A patent/AU2001282842A1/en not_active Abandoned
- 2001-08-22 CN CN01814393A patent/CN1448043A/en active Pending
- 2001-08-22 WO PCT/SG2001/000167 patent/WO2002017357A2/en active Application Filing
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101305259B (en) * | 2005-11-15 | 2012-07-04 | 株式会社尼康 | Plane position detection device, exposure device and method for manufacturing elements |
| CN102788554A (en) * | 2007-04-05 | 2012-11-21 | 联达科技控股有限公司 | Multi-surface detection system and method |
| CN102788554B (en) * | 2007-04-05 | 2017-04-12 | 联达科技控股有限公司 | Multi-surface detection system and method |
| CN101603926A (en) * | 2008-05-09 | 2009-12-16 | 半导体技术设备私人有限公司 | Multi-surface detection system and method |
| CN102116745A (en) * | 2009-12-30 | 2011-07-06 | 上海允科自动化有限公司 | IC element detection system |
| CN103249293A (en) * | 2012-02-08 | 2013-08-14 | Juki株式会社 | Electronic component installation apparatus, electronic component instalation system and electronic component instalation method |
| CN103249293B (en) * | 2012-02-08 | 2018-05-29 | Juki株式会社 | Electronic component mounting apparatus, electronic component mounting system and electronic component mounting method |
| CN112888913A (en) * | 2018-10-18 | 2021-06-01 | 赛博光学公司 | Three-dimensional sensor with aligned channels |
| CN112888913B (en) * | 2018-10-18 | 2023-05-02 | 赛博光学公司 | Three-dimensional sensor with column-to-column channels |
| CN114167622A (en) * | 2021-12-14 | 2022-03-11 | 樊宸 | Optical system for acquiring three-dimensional information of surface of shot object |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002017357A2 (en) | 2002-02-28 |
| AU2001282842A1 (en) | 2002-03-04 |
| WO2002017357A3 (en) | 2002-11-28 |
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