WO2002017357A3 - Three dimensional inspection of leaded ics - Google Patents
Three dimensional inspection of leaded ics Download PDFInfo
- Publication number
- WO2002017357A3 WO2002017357A3 PCT/SG2001/000167 SG0100167W WO0217357A3 WO 2002017357 A3 WO2002017357 A3 WO 2002017357A3 SG 0100167 W SG0100167 W SG 0100167W WO 0217357 A3 WO0217357 A3 WO 0217357A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- projection
- prism
- contour
- aperture
- leaded
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001282842A AU2001282842A1 (en) | 2000-08-22 | 2001-08-22 | Three dimensional inspection of leaded ics |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200004224-2 | 2000-08-22 | ||
SG200004224 | 2000-08-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002017357A2 WO2002017357A2 (en) | 2002-02-28 |
WO2002017357A3 true WO2002017357A3 (en) | 2002-11-28 |
Family
ID=20430635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SG2001/000167 WO2002017357A2 (en) | 2000-08-22 | 2001-08-22 | Three dimensional inspection of leaded ics |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN1448043A (en) |
AU (1) | AU2001282842A1 (en) |
WO (1) | WO2002017357A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001336919A (en) * | 2000-03-31 | 2001-12-07 | Agilent Technol Inc | Inspection system of integrated circuit with lead |
DE602004021240D1 (en) * | 2003-03-07 | 2009-07-09 | Ismeca Semiconductor Holding | OPTICAL EQUIPMENT AND INSPECTION MODULE |
JP5622068B2 (en) * | 2005-11-15 | 2014-11-12 | 株式会社ニコン | Surface position detection apparatus, exposure apparatus, and device manufacturing method |
US7768633B2 (en) * | 2007-04-05 | 2010-08-03 | Asti Holdings Limited | Multiple surface inspection system and method |
US7869021B2 (en) * | 2007-04-05 | 2011-01-11 | Asti Holdings Limited | Multiple surface inspection system and method |
CN102116745A (en) * | 2009-12-30 | 2011-07-06 | 上海允科自动化有限公司 | IC element detection system |
CN106879245A (en) * | 2012-02-08 | 2017-06-20 | Juki株式会社 | Electronic component mounting apparatus, electronic component mounting system and electronic component mounting method |
CN104206050B (en) * | 2012-04-12 | 2017-04-26 | 富士机械制造株式会社 | Component mounting machine |
CN104509235B (en) * | 2012-08-01 | 2017-04-26 | 富士机械制造株式会社 | Component mounting apparatus |
US11029146B2 (en) * | 2018-10-18 | 2021-06-08 | Cyberoptics Corporation | Three-dimensional sensor with counterposed channels |
CN114167622A (en) * | 2021-12-14 | 2022-03-11 | 樊宸 | Optical system for acquiring three-dimensional information of surface of shot object |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997030572A1 (en) * | 1996-02-12 | 1997-08-21 | Icos Vision Systems N.V. | Process for forming on an opto-electronic transducer a shadow image of at least a part of an electronic component |
JPH1093846A (en) * | 1996-09-12 | 1998-04-10 | Copal Co Ltd | Image pickup device |
US5909285A (en) * | 1997-05-05 | 1999-06-01 | Beaty; Elwin M. | Three dimensional inspection system |
US5910844A (en) * | 1997-07-15 | 1999-06-08 | Vistech Corporation | Dynamic three dimensional vision inspection system |
US6088108A (en) * | 1998-08-27 | 2000-07-11 | Hewlett-Packard Company | Leaded components inspection system |
-
2001
- 2001-08-22 AU AU2001282842A patent/AU2001282842A1/en not_active Abandoned
- 2001-08-22 CN CN01814393A patent/CN1448043A/en active Pending
- 2001-08-22 WO PCT/SG2001/000167 patent/WO2002017357A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997030572A1 (en) * | 1996-02-12 | 1997-08-21 | Icos Vision Systems N.V. | Process for forming on an opto-electronic transducer a shadow image of at least a part of an electronic component |
JPH1093846A (en) * | 1996-09-12 | 1998-04-10 | Copal Co Ltd | Image pickup device |
US5909285A (en) * | 1997-05-05 | 1999-06-01 | Beaty; Elwin M. | Three dimensional inspection system |
US5910844A (en) * | 1997-07-15 | 1999-06-08 | Vistech Corporation | Dynamic three dimensional vision inspection system |
US6088108A (en) * | 1998-08-27 | 2000-07-11 | Hewlett-Packard Company | Leaded components inspection system |
Also Published As
Publication number | Publication date |
---|---|
CN1448043A (en) | 2003-10-08 |
WO2002017357A2 (en) | 2002-02-28 |
AU2001282842A1 (en) | 2002-03-04 |
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