JPS62119444A - Pattern inspector - Google Patents
Pattern inspectorInfo
- Publication number
- JPS62119444A JPS62119444A JP26032085A JP26032085A JPS62119444A JP S62119444 A JPS62119444 A JP S62119444A JP 26032085 A JP26032085 A JP 26032085A JP 26032085 A JP26032085 A JP 26032085A JP S62119444 A JPS62119444 A JP S62119444A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- circuit board
- printed circuit
- filter
- wavelength band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
Abstract
Description
【発明の詳細な説明】
〔発明の概要〕
本発明は基板のパターン検査装置に関するもので、プリ
ント基板の両面（表裏）にパターン形成したものを検査
する場合の検査装置において、プリント銅箔の中のピン
ホールおよび両面のバターンの検出が行える検査装置を
得るためにブラックライン照明方式と、透過照明方式を
併用した照明方式によって得られた検出々力の相対出力
を得るにあり、特にブランクライン照明方式で得られた
パターン検知信号をストローブ信号として、透過照明方
式で得られたパターン検知信号を検知するようにしたも
のである。Detailed Description of the Invention [Summary of the Invention] The present invention relates to a circuit board pattern inspection device, and is used to inspect a pattern formed on both sides (front and back) of a printed circuit board. In order to obtain an inspection device that can detect pinholes and patterns on both sides, the objective is to obtain the relative output of the detection power obtained by an illumination method that combines a black line illumination method and a transmitted illumination method. The pattern detection signal obtained by the transmitted illumination method is detected by using the pattern detection signal obtained by the transmitted illumination method as a strobe signal.
本発明はプリント基板の検査装置に係り、特に表裏にパ
ターン形成されたプリント基板中の微少欠陥を検知する
ための検査装置に関する。The present invention relates to a printed circuit board inspection device, and more particularly to an inspection device for detecting minute defects in a printed circuit board whose front and back surfaces are patterned.
従来から、プリント基板の両面にパターンを形成したも
のが多く利用されている。このようなプリント基板を被
検物体として該プリント基板の裏面側から照明を行って
、その透過したパターンをプリント基板の上方に配した
ラインセンサ等からなる一次元撮像素子で検出する透過
照明方式が知られている。Conventionally, many printed circuit boards with patterns formed on both sides have been used. A transmitted illumination method uses such a printed circuit board as an object to be inspected, and illuminates the printed circuit board from the back side, and detects the transmitted pattern with a one-dimensional image sensor, such as a line sensor, placed above the printed circuit board. Are known.
さらにプリント基板の上方から斜めにブランクラインマ
スクを通して照明を行って基板の上方に配したラインセ
ンサ等からなる一次元撮像素子でパターン反射光と共に
ブラックラインを検出してパターン外形等を検知する検
査装置も知られている。Furthermore, an inspection device that illuminates the printed circuit board diagonally through a blank line mask and detects the black line along with the pattern reflected light using a one-dimensional imaging device consisting of a line sensor placed above the board to detect the pattern outline, etc. is also known.
（発明が解決しようとする問題点〕
上記したブラックライン照明方式によると、プリント基
板の銅箔部の外形は検知出来るが、第５図に示すように
プリント基板１上にパターニングされたパターンの銅箔
部２上に斜めから照射されたブランクラインパターン３
は銅箔部２上では暗部４を形成するがプリント基板１の
領域では、基板そのものが光拡散性が大きいために周囲
の明部６から多くの光５が拡散漏入して明るくなってブ
ラックラインパターン３の基板上では明部７を形成する
。このように、このパターン検査では周囲の明部６から
拡散漏入してくる光に基づいているので、第６図に示す
ようにプリント基板１上に形成した銅箔部２中にピンホ
ールのような欠陥８があると、このピンホールには周囲
から光が拡散漏入しないため、このような欠陥を検出す
ることが出来ない問題があった。このような問題を解決
するために従来公知の透過照明方法を用いてプリント基
板の裏面から照明した透過パターンを撮像装置で検出し
ようとすると微少なピンホールの如き欠陥の検出は出来
るが、プリント基板の両面にパターニングされたパター
ンを同時に検出するために一方（例えば表面）だけを検
出することが出来ない欠点があった。(Problems to be Solved by the Invention) According to the black line illumination method described above, the outline of the copper foil portion of the printed circuit board can be detected, but as shown in FIG. Blank line pattern 3 irradiated diagonally onto foil part 2
forms a dark area 4 on the copper foil part 2, but in the area of the printed circuit board 1, since the board itself has a large light diffusing property, a lot of light 5 diffuses and leaks from the surrounding bright area 6, becoming bright and black. A bright portion 7 is formed on the substrate of the line pattern 3. In this way, since this pattern inspection is based on the light diffused and leaked from the surrounding bright area 6, pinholes are detected in the copper foil part 2 formed on the printed circuit board 1, as shown in FIG. When such a defect 8 exists, there is a problem in that such a defect cannot be detected because light does not diffuse and leak from the surroundings into this pinhole. In order to solve this problem, when trying to detect a transmission pattern illuminated from the back side of a printed circuit board using a conventionally known transmission illumination method using an imaging device, defects such as minute pinholes can be detected, but defects such as small pinholes can be detected. Since patterns formed on both sides of the sensor can be detected simultaneously, there is a drawback that only one side (for example, the front surface) cannot be detected.
本発明は上記欠点に鑑みなされたものであり。 The present invention has been made in view of the above drawbacks.
その口約とするところはプリント基板の両面にバターニ
ングされた配線パターンの一方のみを検出すると共にパ
ターン中のピンホールの如き微少欠陥も同時に検出でき
る検査装置を得るにあり、その手段は、基板の両面にパ
ターン形成された被検物体と、上記被検物体の上方から
第１の波、区帯域の光をブランクラインマスクを介して
照射する第１の照明手段と、上記第１の照明手段で照射
された上記被検物体の反射パターンを検出する第１の撮
像手段と、上記被検物体の下方から上記第１の波長帯域
とは異なる第２の波長帯域の光を照射する第２の照明手
段と、上記第２の照明手段で照射された上記被検物体の
透過パターンを検出する第２の撮像手段とを具備し、上
記第１及び第２の撮像手段からの検出々力の相対出力を
得るようにしてなることを特徴とするパターン検査装置
によって達成される。The key to this goal is to obtain an inspection device that can detect only one side of the wiring pattern patterned on both sides of a printed circuit board and also detect minute defects such as pinholes in the pattern at the same time. a test object having patterns formed on both sides of the test object, a first illumination means for irradiating a first wave and a band of light from above the test object through a blank line mask, and the first illumination means. a first imaging means for detecting a reflection pattern of the object to be inspected irradiated with the object; and a second imaging means for irradiating the object from below with light in a second wavelength band different from the first wavelength band. an illumination means, and a second imaging means for detecting a transmission pattern of the object to be inspected illuminated by the second illumination means; This is achieved by a pattern inspection device characterized in that it obtains an output.
本発明のパターン検査装置はブラックライン照明方式と
透過照明方式を用いて試験物体を照明し。The pattern inspection device of the present invention illuminates a test object using a black line illumination method and a transmitted illumination method.
それぞれの照明光による被検物体の反射光と透過光パタ
ーンを２つの一次元撮像素子によって検出し、これら信
号のアンドをとって被検物体の両面にバターニングされ
た銅箔の配線パターンの内の一方のみを取り出すように
したものである。Two one-dimensional imaging devices detect the reflected light and transmitted light patterns of the test object due to each illumination light, and these signals are ANDed to detect the inside of the copper foil wiring pattern patterned on both sides of the test object. Only one of the two can be taken out.
以下９本発明の一実施例を第１図乃至第４図について詳
記する。An embodiment of the present invention will be described in detail below with reference to FIGS. 1 to 4.
第１図は本発明のパターン検査装置の検知光学系の模式
図、第２図は第１図に用いるフィルタの波区−光透過率
の特性を示す分光特性図、第３図は本発明の検査装置の
系統図、第４図は本発明の検査装置の検知信号の処理波
形図である。FIG. 1 is a schematic diagram of the detection optical system of the pattern inspection apparatus of the present invention, FIG. 2 is a spectral characteristic diagram showing the wave zone-light transmittance characteristics of the filter used in FIG. 1, and FIG. FIG. 4, a system diagram of the inspection apparatus, is a processing waveform diagram of a detection signal of the inspection apparatus of the present invention.
第１図で被検物体であるプリント基板１はその表裏面に
配線パターンの銅箔部２が形成され、第１の光源９から
の射出光は第２図に示す分光特性を有する第１のフィル
タＦ１を通過する。この波長帯域特性は第２図にも示さ
れているようにプリント基板１の有する基材の分光特性
が有する波長帯域内の特定の波長帯域のみを通過させる
ように選択される。The printed circuit board 1, which is the object to be tested in FIG. Passes through filter F1. As shown in FIG. 2, this wavelength band characteristic is selected so as to pass only a specific wavelength band within the wavelength band of the spectral characteristic of the base material of the printed circuit board 1.
このような波長帯域特性を持った第１のフィルタＦ１を
通過した光は透明のガラス板等で構成され、その中央に
ブラックライン１０を形成したブラックラインマスク１
１を照明する。このブラックラインマスク１１のブラッ
クライン１０のパターンをマスク結像レンズ１２を介し
てプリント基板１の表面の配線パターンである銅箔部に
結像させる。このようにすると第５図に説明したと同様
に投影されたブラックラインパターン３に沿ってプリン
ト基板１の銅箔部２は暗部４をプリント基板１部分は明
部７を形成する。この反射光をレンズ１３→ビームスプ
リンタ１４−第１のフィルタＦ１と同様の波長帯域特性
を有する第２のフィルタＦ＋’を通じてラインセンサの
如き第１の一次元撮像素子１５の結像面上にブランクラ
インパターン３を結像させれば配線パターン検知を行う
ことができる。このブラックライン照明では配線パター
ンのピンホール（第６図参照）の如き欠陥は検知不能で
ある。The light passing through the first filter F1 having such wavelength band characteristics is passed through a black line mask 1 made of a transparent glass plate or the like, with a black line 10 formed in the center thereof.
Illuminate 1. The pattern of the black line 10 of this black line mask 11 is imaged on a copper foil portion, which is a wiring pattern on the surface of the printed circuit board 1, via a mask imaging lens 12. In this way, the copper foil section 2 of the printed circuit board 1 forms a dark section 4 and the printed circuit board 1 section forms a bright section 7 along the projected black line pattern 3 in the same manner as explained in FIG. This reflected light is passed through the lens 13 -> the beam splinter 14 - the second filter F+' having the same wavelength band characteristics as the first filter F1, and then blanked onto the imaging plane of the first one-dimensional image sensor 15 such as a line sensor. If the line pattern 3 is imaged, the wiring pattern can be detected. With this black line illumination, defects such as pinholes (see FIG. 6) in the wiring pattern cannot be detected.
次にプリント基板１の裏面から第２の光源１７で第３の
フィルタＦ２を通じて照明を行う。第３のフィルタＦ２
の波長帯域特性は第２図に示されるようにプリント基板
１の有する基材の分光特性が有する波長帯域内の特定の
波長帯域のみを通過させると共に第１のフィルタの帯域
特性とは異なる波長に選択される。第３のフィルタＦ２
を通過した照明光は配線パターンの銅箔部２で遮られる
ため暗くなるが、プリント基板１の部分は光を透過する
ので明るくなる。このような透過パターンをレンズ１３
を通過させ、ビームスプリンタ１４で反射させ第３のフ
ィルタＦ２と同じ分光特性を有する第４のフィルタＦ２
’を通過させて、第２のラインセンサの如き一次元撮像
素子工６の結像面に投影させてプリント基板の配線パタ
ーンを検出する。この場合は第６図に示したようなピン
ホールも裏側からの照明で明るくなるので検出できるが
プリント基板１の裏面の配線パターンも同時に検知され
てしまうことになる。 。Next, illumination is performed from the back surface of the printed circuit board 1 using the second light source 17 through the third filter F2. Third filter F2
As shown in FIG. 2, the wavelength band characteristics of the printed circuit board 1 pass only a specific wavelength band within the wavelength band of the spectral characteristics of the base material, and also pass a wavelength different from the band characteristics of the first filter. selected. Third filter F2
The illumination light passing through is blocked by the copper foil portion 2 of the wiring pattern and becomes dark, but the portion of the printed circuit board 1 transmits the light and becomes bright. Lens 13 has such a transmission pattern.
A fourth filter F2 having the same spectral characteristics as the third filter F2 is reflected by the beam splinter 14.
', and is projected onto the imaging plane of a one-dimensional image sensor 6, such as a second line sensor, to detect the wiring pattern of the printed circuit board. In this case, pinholes such as those shown in FIG. 6 can be detected because they become brighter due to illumination from the back side, but the wiring pattern on the back side of the printed circuit board 1 will also be detected at the same time. .
このような光学検知系で得られた第１の一次元撮像素子
１５と第２の一次元撮像素子１６で得られた検知出力を
それぞれ第１および第２の二値化回路１８ａ、１８ｂに
加えて二値化する。第４図（ａｌに示すようにプリント
基板１の表面１ａと裏面１ｂに銅箔部２が形成され、銅
箔部２にピンホール８がある場合の第１および第２の二
値化回路１８ａ、１８ｂの二値化出力波形（ｂ）、 ［
Ｃ）は第４図（ｂｌ、 （（りに示す如き波形となる。The detection outputs obtained by the first one-dimensional image sensor 15 and the second one-dimensional image sensor 16 obtained by such an optical detection system are added to the first and second binarization circuits 18a and 18b, respectively. and binarize it. First and second binarization circuits 18a when the copper foil portion 2 is formed on the front surface 1a and the back surface 1b of the printed circuit board 1 and the copper foil portion 2 has a pinhole 8 as shown in FIG. , 18b binarized output waveform (b), [
C) has a waveform as shown in Fig. 4 (bl, ((ri).
すなわちブラックライン照明で得られた二値化検出々力
には第４図（ｂｌのようにピンホールの検知信号２０も
プリント基板１ａの裏面１ｂの銅箔２も検出されない。In other words, neither the pinhole detection signal 20 nor the copper foil 2 on the back surface 1b of the printed circuit board 1a is detected in the binarized detection power obtained by black line illumination, as shown in FIG.
しかし、透過照明で得られた二値化検出々力は第４図（
Ｃ）の如くプリント基板１の裏面１ｂの銅箔信号２１と
ピンホールの検知信号２０が検知されている。However, the binarization detection power obtained with transmitted illumination is as shown in Figure 4 (
As shown in C), a copper foil signal 21 and a pinhole detection signal 20 on the back surface 1b of the printed circuit board 1 are detected.
これら両検知出力（ｂｌ、 （Ｃ１をアンドゲート回路
１９に加えると第４図（ｄ）の波形で示す如き波形が得
られる。すなわち、プリント基板の上方からブラックラ
イン照明で得たパターン検知信号をストローブ信号とし
て、ｉ３過照明で得られたパターン検知信号を検知する
。いわゆるパターンの暗い部分だけアンドが取られ、明
るい部分は第４図（ｄ）に示すようにそのまま出力され
るためにプリント基板の裏面のパターンは取り出さずに
ピンホールを取り出すことができる。裏面のパターン検
出はブラックライン照明を裏面から行い透過照明を表か
ら行えば裏側の配線パターンおよびその欠陥が検出でき
ることは明らかである。When these two detection outputs (bl, (C1) are applied to the AND gate circuit 19, a waveform as shown in FIG. 4(d) is obtained. That is, the pattern detection signal obtained by black line illumination from above the printed circuit board The pattern detection signal obtained by i3 over-illumination is detected as a strobe signal.Only the dark portions of the pattern are ANDed, and the bright portions are output as they are as shown in Figure 4(d). It is possible to extract pinholes without taking out the pattern on the back side.It is clear that the wiring pattern on the back side and its defects can be detected by performing black line illumination from the back side and transmitting illumination from the front side to detect the pattern on the back side.
本発明は叙上の如く構成し、かつ動作させたので被検物
体のプリント基板に表裏２面に配線パターンが形成され
ていても、それぞれのピンホールの如き欠陥が検出でき
る特徴を有する。Since the present invention is configured and operated as described above, it has the feature that even if wiring patterns are formed on the front and back sides of the printed circuit board of the object to be inspected, defects such as pinholes can be detected on each side.
第１図は本発明の検査装置の検知の系模式図。
第２図は第１図に用いるフィルタの分光特性図。
第３図は本発明の検査装置の系統図。
第４図（ａ）〜（ｄ）は本発明の検知装置の検知信号の
処理波形図。
第５図はブランクライン領域を説明するための拡大斜視
図。
第６図は従来のプリント基板の配線パターンのピンホー
ル欠陥を説明するための斜視図である。
１・・・プリント基板。
２・・・銅箔部。
３・・・ブラックラインパターン。
４・・・暗部。
５・・・光。
６．７・・・明部。
８・・・ピンホール欠陥。
９・・・第１の光源。
１０・・・ブランクライン。
１１・・・ブラックラインマスク。
１２・・・マスク結像用レンズ。
１３・・・レンズ。
１４・・・ビームスプリフタ。
１５・・・第１の一次元撮像素子。
１６・・・第２の一次元撮像素子。
１７・・・第２の光源。
Ｆ＋、Ｆ＋’ ・・・第１および第２のフィルタ。
Ｆ２．Ｆ２’・・・第３および第４のフィルタ。
１８ａ、１３ｂ・・・二値化回路。
１９・・・アンド回路。
２０・・・ピンホールの検知信号。
２１・・・裏面の銅箔の信号。
ｑ 票
Ｕ−
掘四智井FIG. 1 is a schematic diagram of the detection system of the inspection device of the present invention. FIG. 2 is a spectral characteristic diagram of the filter used in FIG. 1. FIG. 3 is a system diagram of the inspection device of the present invention. FIGS. 4(a) to 4(d) are processing waveform diagrams of detection signals of the detection device of the present invention. FIG. 5 is an enlarged perspective view for explaining the blank line area. FIG. 6 is a perspective view for explaining pinhole defects in the wiring pattern of a conventional printed circuit board. 1...Printed circuit board. 2...Copper foil part. 3...Black line pattern. 4... Dark part. 5...Light. 6.7... Akabe. 8... Pinhole defect. 9...First light source. 10...Blank line. 11...Black line mask. 12...Mask imaging lens. 13...Lens. 14...Beam splitter. 15...First one-dimensional image sensor. 16...Second one-dimensional image sensor. 17...Second light source. F+, F+'...first and second filters. F2. F2'...Third and fourth filters. 18a, 13b... Binarization circuit. 19...AND circuit. 20... Pinhole detection signal. 21... Signal on the copper foil on the back side. q Vote U- Hori Shichii
Claims (5)
記被検物体の上方から第１の波長帯域の光をブラックラ
インマスクを介して照射する第１の照明手段と、上記第
１の照明手段で照射された上記被検物体の反射パターン
を検出する第１の撮像手段と、上記被検物体の下方から
上記第１の波長帯域とは異なる第２の波長帯域の光を照
射する第２の照明手段と、上記第２の照明手段で照射さ
れた上記被検物体の透過パターンを検出する第２の撮像
手段とを具備し、上記第１及び第２の撮像手段からの検
出々力の相対出力を得るようにしてなることを特徴とす
るパターン検査装置。(1) A test object having patterns formed on both sides of a substrate; a first illumination means for irradiating light in a first wavelength band from above the test object through a black line mask; a first imaging means for detecting a reflection pattern of the object to be inspected illuminated by the illumination means; and a first imaging means for irradiating light in a second wavelength band different from the first wavelength band from below the object to be inspected. and a second imaging means for detecting a transmission pattern of the object to be inspected illuminated by the second illumination means, the detection power from the first and second imaging means being A pattern inspection device characterized in that it obtains a relative output of.
おける特定の波長のみを透過させるフィルタとよりなる
ことを特徴とする特許請求の範囲第１項記載のパターン
検査装置。(2) The pattern inspection apparatus according to claim 1, wherein the first illumination means comprises a light source and a filter that transmits only a specific wavelength according to the light transmission characteristics of the substrate.
第１の照明手段の波長帯域とは異なる波長内の特定の波
長のみを透過させるフィルタとよりなることを特徴とす
る特許請求の範囲第１項記載のパターン検査装置。(3) A patent claim characterized in that the second illumination means is comprised of a filter that transmits only a specific wavelength within a wavelength band different from the wavelength band of the first illumination means due to the light transmission characteristics of the light source and the substrate. The pattern inspection device according to item 1.
りなることを特徴とする特許請求の範囲第１項記載のパ
ターン検査装置。(4) The pattern inspection apparatus according to claim 1, wherein the first and second imaging means are comprised of one-dimensional imaging elements.
に得るために上記第１及び第２のアンド論理をとるよう
にしてなることを特徴とする特許請求の範囲第１項記載
のパターン検査装置。(5) Claim 1, characterized in that the first and second AND logics are used to relatively obtain the detection powers of the first and second imaging means. The pattern inspection device described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26032085A JPS62119444A (en) | 1985-11-20 | 1985-11-20 | Pattern inspector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26032085A JPS62119444A (en) | 1985-11-20 | 1985-11-20 | Pattern inspector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62119444A true JPS62119444A (en) | 1987-05-30 |
Family
ID=17346375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26032085A Pending JPS62119444A (en) | 1985-11-20 | 1985-11-20 | Pattern inspector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62119444A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02147844A (en) * | 1988-11-28 | 1990-06-06 | Satake Eng Co Ltd | Device for discriminating quality of grain of rice |
| JPH0429041A (en) * | 1990-05-25 | 1992-01-31 | Matsushita Electric Ind Co Ltd | Wiring pattern inspection device |
| JPH04233440A (en) * | 1990-12-14 | 1992-08-21 | Internatl Business Mach Corp <Ibm> | Optical inspecting apparatus |
| JP2001221747A (en) * | 2000-02-03 | 2001-08-17 | Suntory Ltd | Imaging method of liquid filling container and device |
| JP2002267613A (en) * | 2001-03-14 | 2002-09-18 | Hitachi Eng Co Ltd | Device and system for detecting foreign matter in liquid filled in transparent container or the like |
| CN102983089A (en) * | 2011-09-06 | 2013-03-20 | 株式会社岛津制作所 | Solar battery unit inspection device |
-
1985
- 1985-11-20 JP JP26032085A patent/JPS62119444A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02147844A (en) * | 1988-11-28 | 1990-06-06 | Satake Eng Co Ltd | Device for discriminating quality of grain of rice |
| JPH0429041A (en) * | 1990-05-25 | 1992-01-31 | Matsushita Electric Ind Co Ltd | Wiring pattern inspection device |
| JPH04233440A (en) * | 1990-12-14 | 1992-08-21 | Internatl Business Mach Corp <Ibm> | Optical inspecting apparatus |
| JP2001221747A (en) * | 2000-02-03 | 2001-08-17 | Suntory Ltd | Imaging method of liquid filling container and device |
| JP2002267613A (en) * | 2001-03-14 | 2002-09-18 | Hitachi Eng Co Ltd | Device and system for detecting foreign matter in liquid filled in transparent container or the like |
| CN102983089A (en) * | 2011-09-06 | 2013-03-20 | 株式会社岛津制作所 | Solar battery unit inspection device |
| JP2013053973A (en) * | 2011-09-06 | 2013-03-21 | Shimadzu Corp | Solar battery cell test equipment |
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