KR101846949B1 - Intergrated Inspection Apparatus Using Multi Optical System - Google Patents

Abstract

The present invention relates to a composite inspection apparatus using multiple optical systems, which comprises a first measurement light input unit for measuring a three-dimensional shape of an object by using a first optical measurement system and irradiating the sample with measurement light of a first wavelength band, A first optical filter for selectively transmitting only the measurement light of the first wavelength band, a first measurement system for acquiring the first wavelength band reflected light image passed through the first optical filter, A second measurement light input unit for measuring a three-dimensional shape of an object using a second optical measurement system, the second measurement light input unit irradiating the sample with the measurement light of the second wavelength band, and a second measurement light input unit selectively transmitting only the measurement light of the second wavelength band A second optical filter and a second measurement system for acquiring a second wavelength band reflected light image passed through the second optical filter.
According to the present invention, it is possible to simultaneously drive various kinds of optical inspection apparatuses at the same time, thereby remarkably improving the inspection speed, and providing an inspection apparatus which is simple in construction and excellent in manufacturing cost, Is expected to be more active.

Description

TECHNICAL FIELD [0001] The present invention relates to a composite inspection apparatus using multiple optical systems,

The present invention relates to an optical inspection apparatus, and more particularly, to an optical inspection apparatus capable of reducing measurement time while using two or more measurement methods using multiple optical systems, .

Various kinds of components are mounted on the electronic circuit board, and optical 3D measurement method is mainly used for 3D inspection of the appearance.

As the optical 3D measurement method, the moire method, the white light scanning interference method, and the confocal method are used, and each measurement method has advantages and disadvantages.

For example, in the case of the Moire method, it is easy to measure the height and surface of a large-sized part relatively. However, it is difficult to make the mirror surface inspection due to the occurrence of the 2-pi ambiguity and the photoelectricization, There are difficult disadvantages.

In the case of the white light scanning interferometer, there is a merit that super-precise surface measurement is possible and the mirror surface inspection is possible. However, it is sensitive to vibration and has the same 2 pie ambiguity as the Moire method.

Also, in the case of the confocal method, it is easy to measure the height and the thickness of the transparent body, and it is possible to measure the height of the wire loop. On the other hand, it is difficult to measure the inclined plane depending on the limited measuring range and the specific angle.

 Therefore, the most effective measurement methods should be applied according to the optical characteristics (anti-accidents, color, surface roughness, slope, etc.) of the surface of parts, and electronic circuits in which various components are mounted are satisfactory results with one- Is often difficult to obtain.

Korean Patent No. 0870922 discloses a technique for displaying a three-dimensional shape of an object to be inspected in which mirror reflection is generated using a moire interferometer and a white light scanning interferometer as a coaxial light interferometer.

FIG. 1 is a perspective view showing a configuration of a three-dimensional shape measuring system using a multiple interferometer according to Korean Patent No. 0870922, and FIG. 2 is a diagram showing a sectional configuration in a direction perpendicular to the front face of FIG.

1, a three-dimensional shape measuring system using a multiple interferometer according to Korean Patent No. 0870922 includes an imaging unit 10 for imaging a reflection image reflected by the object 1 to be inspected, an imaging unit 10 The coaxial illumination unit 20 is installed on one side of the imaging unit 10 and emits white light to the object 1 so as to generate a reflected image. The coaxial illumination unit 20 is installed on one side and the other side of the imaging unit 10, A grating pattern projecting unit 40 for projecting the grating pattern illumination and a grating pattern projection unit 40 for separating and filtering the white light emitted from the coaxial illumination unit 20 on the other side of the imaging unit 10, And a reference surface generating unit (30) for making the reflected light incident on the reference mirror and re-examining the reflected light to the imaging unit.

2, the reference plane generating section 30 is constituted by a block filter 31, a block filter transfer mechanism 31a, a reference mirror 32 and a mirror transfer mechanism 32a.

A three-dimensional shape measuring method according to Korean Patent No. 0870922 will be described with reference to FIGS. 1 and 2. FIG.

When the current measurement mode is the lateral moire interferometer measurement mode, the block filter 31 is turned on, that is, the block filter 31 is positioned in front of the reference mirror 32 to adjust the focus of the camera 11 of the moire interferometer It is possible to measure the three-dimensional shape according to the diffuse reflection of the inspection object 1 by filtering or absorbing the coaxial illumination incident on the reference mirror 32. On the contrary, when the current measurement mode is the coaxial interferometer measurement mode, the block filter 31 is turned off to adjust the focus of the camera 11 of the coaxial interferometer or to reflect the reflection image on the reference mirror 32 and the reflection image Dimensional shape according to the mirror-surface reflection of the object 1 to be inspected.

According to the patent, the shape of the object on which the diffuse reflection occurs is measured by using the moire measurement method, and the object on which the specular reflection is generated is measured by using a white light interferometer. By using the appropriate interferometer according to the optical characteristic of the object surface, And the like.

However, in the above-mentioned patent, since the inspection must be performed while changing the measurement mode for the two types of optical inspection, there is a disadvantage that the inspection speed is remarkably delayed as compared with the single optical inspection system.

Korean Patent No. 10-0870922 entitled " Three Dimensional Shape Measurement System Using Multiple Interferometers "

SUMMARY OF THE INVENTION It is an object of the present invention to provide a configuration of a test apparatus which can shorten a measurement time while using two or more measurement methods using multiple optical systems .

According to an aspect of the present invention, there is provided a measurement apparatus comprising: a first measurement light input section for irradiating a measurement light of a first wavelength band onto a sample; a first optical filter selectively transmitting only measurement light of the first wavelength band; A first measurement system for acquiring an image of a first wavelength band reflected light that has passed through a first optical filter and an optical system different from the first measurement system, A second optical filter for selectively transmitting only the measurement light in the second wavelength band; a second optical filter for selectively transmitting the measurement light in the second wavelength band and a second optical filter for acquiring the second wavelength band reflected light image through the second optical filter; A measurement system and an image of a first wavelength band provided from the first measurement system are measured using a first optical measurement method algorithm to measure a three- , The image of the second wavelength band provided from the second measurement system is measured by using the algorithm of the second optical measurement method different from the algorithm of the first optical measurement method to obtain a three- A measurement terminal simultaneously acquiring a three-dimensional shape by different measurement algorithms from the first measurement system and the second measurement system and selectively using a three-dimensional shape by any one optical measurement algorithm according to the optical characteristics of the sample The complex inspection apparatus using the multiple optical system is provided.

Here, a third measurement light input unit for measuring the three-dimensional shape of the object using the third optical measurement system different from the first and second optical measurement systems, the third measurement light input unit irradiating the sample with the measurement light of the third wavelength band, A third optical filter for selectively transmitting only the measurement light in the third wavelength band and a third measurement system for acquiring the third wavelength band reflected light image passed through the third optical filter.

According to another aspect of the present invention, there is provided an apparatus for measuring a first measurement light, comprising: a first measurement light input unit for irradiating a first measurement light of a first wavelength band to a sample; And an image acquiring unit for acquiring an image of the first wavelength band and an image of the second wavelength band after acquiring the reflected light from the second measurement light input unit and the sample, Is provided.

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And a third measurement light input unit for irradiating the sample with the third measurement light of the third wavelength band, wherein the image acquisition unit acquires an image reflected from the sample, and then acquires the image of the first wavelength band, And the measuring terminal separately analyzes the three-dimensional shape of the sample from the images of the first to third wavelength bands using the algorithms of the first to third optical measuring methods .

According to the present invention as described above, it is possible to simultaneously drive various types of optical inspection apparatuses, thereby remarkably improving the inspection speed and providing an inspection apparatus which is simple in construction and excellent in manufacturing cost, The test equipment market is expected to be more active.

1 is a perspective view illustrating the configuration of a three-dimensional shape measuring system using a multiple interferometer according to Korean Patent No. 0870922.
Fig. 2 is a view showing a cross-sectional configuration in the direction perpendicular to the front face of Fig. 1. Fig.
FIG. 3 is a view showing a configuration of a composite inspection apparatus using a multiple optical system according to a first embodiment of the present invention.
4 is a view showing a configuration of a composite inspection apparatus using a multiple optical system according to a second embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the drawings. It is to be noted that like elements in the drawings are represented by the same reference numerals as possible. Further, detailed description of known functions and configurations that may unnecessarily obscure the gist of the invention will be omitted.

In order to compressively explain only the main features of the present invention, only the essential components of the entire inspection apparatus are shown in a simplified manner, and the detailed optical system configuration and detailed description thereof are also omitted.

FIG. 3 is a view showing a configuration of a composite inspection apparatus using a multiple optical system according to a first embodiment of the present invention.

3, the hybrid inspection apparatus using the multiple optical system according to the first embodiment of the present invention includes a first measurement system 100 and a second measurement system 200, 100, 200) is used to measure the three-dimensional shape of the sample (300).

Here, the first measurement system 100 and the second measurement system 200 may be any one of a moire system, a white light scanning interference system, and a confocal system, and each measurement system 100, A measurement system is used.

The first measurement system 100 and the second measurement system 200 use measurement lights of different wavelength bands so that they can be simultaneously driven.

The first measurement system 100 includes a first measurement light input unit 110, a first optical filter 120, and a first image acquisition unit 130.

The first measurement light input unit 110 may be a light source that emits measurement light of a first wavelength band. In this case, the first optical filter 120 may be an optical filter having a characteristic of selectively transmitting only light of a first wavelength band Can be used.

The first image acquiring unit 130 acquires an image of the reflected light of the first wavelength band that has been reflected by the sample 300 and passed through the first optical filter 120.

In this embodiment, the first wavelength band may be, for example, a red wavelength band.

Similarly, the second measurement system 200 includes a second measurement light input unit 210, a second optical filter 220, and a second image acquisition unit 230.

The second measurement light input unit 210 may be a light source for irradiating the measurement light of the second wavelength band and the second optical filter 220 may be an optical filter having a property of selectively transmitting only light of the second wavelength band .

The second image acquiring unit 230 acquires an image of the reflected light of the second wavelength band that has been reflected by the sample 300 and passed through the second optical filter 220.

In this embodiment, the second wavelength band may be, for example, a blue wavelength band.

That is, in the first embodiment of the present invention, two measurement systems having different optical systems simultaneously measure measurement lights of different wavelength bands in a sample, and each measurement system transmits only the reflected light of the wavelength band itself, It is possible to perform simultaneous measurement independently for each measurement system.

The image acquisition units 110 and 210 transmit the acquired image to the subsequent PC, and the PC analyzes the received image to measure the three-dimensional shape of the sample. For example, if the first measurement system is a white light interferometer system and the second measurement system is a moire interferometer system, the PC measures the shape of the sample using a white light interferometer type algorithm for the red image, The shape of the sample can be measured using an algorithm of the method.

In the first embodiment, only the configuration of the measurement light input unit, the optical filter, and the image acquisition unit is briefly described in each measurement system. However, the measurement system includes an additional optical system configuration depending on the measurement system of the measurement system, The configuration of the optical system is omitted. For example, if the first measurement system 100 is a moire interferometer and the second measurement system 200 is a white light scanning interferometer, a light separator, a reference mirror, a sample Z axis drive device, and the like will be required. The configuration of the imaging lens and the like in each image acquiring unit is also omitted.

In addition, although only two measurement systems are shown in the first embodiment, when a moire interference system, a white light interference system and a confocal system are simultaneously operated, a third measurement system using measurement light of a third wavelength band is additionally provided Where the light in the third wavelength band may be the green wavelength band.

4 is a view showing a configuration of a composite inspection apparatus using a multiple optical system according to a second embodiment of the present invention.

4, the hybrid inspection apparatus using the multiple optical system according to the second embodiment of the present invention includes two measurement light input units 400 and 500 and one image acquisition unit 600, And has a simpler configuration than the example.

In the embodiment of FIG. 4, the first measurement light input unit 400 is a white light interferometer. In the optical system configuration of the white light interferometer, only the optical isolator 410 is shown.

In the second embodiment, the first and second measurement light input units 400 and 500 irradiate measurement light of different wavelength bands to the sample. For example, the measurement light emitted from the first measurement light input unit 400 And the measurement light emitted from the second measurement light input unit 500 may be a blue wavelength band.

The image obtaining unit 600 includes a color image sensor and an image forming lens. That is, the image acquisition unit 600 acquires images reflected by the sample 700 irradiated by the two measurement light input units 400 and 500, and separates the images by wavelength bands. When each measurement light is in the red and blue wavelength bands, the acquired image is separated into a red image and a blue image, transmitted to the rear PC, and the PC analyzes the received image to measure the three-dimensional shape of the sample.

For example, in the embodiment of FIG. 4, the PC measures the shape of the sample using a white light interferometer type algorithm for the red image, and measures the shape of the sample using the Moire interferometer type algorithm for the blue image .

As in the first embodiment, only the method of using measurement light of two different wavelength bands is shown in the second embodiment. However, in the case of simultaneously operating the moire interference system, the white light interference system, and the confocal system, A third measurement light input unit for irradiating the measurement light of the wavelength band may be additionally provided. In this case, the light of the third wavelength band may be a green wavelength band.

Although the present invention has been described in connection with the preferred embodiments, it is possible to make various modifications and variations without departing from the spirit and scope of the invention. It is, therefore, to be understood that the appended claims will include all such modifications and changes as fall within the true spirit of the invention.

100: first measurement system 110, 400: first measurement light input part
120: first optical filter 130: first image acquiring unit
200: second measurement system 210, 500: second measurement light input part
220: second optical filter 230: second image acquiring unit
300, 700: sample 600: image acquiring unit

Claims (5)

A first optical filter for selectively transmitting only the measurement light in the first wavelength band, a first optical filter for passing the first wavelength band reflected light through the first optical filter, A first measurement system for acquiring an image,
A second measurement light input unit having an optical system different from that of the first measurement system, the measurement light input unit irradiating the sample with the measurement light of the second wavelength band simultaneously with the first measurement light input unit; A second measurement system for acquiring a second wavelength band reflected light image that has passed through the second optical filter,
The image of the first wavelength band provided from the first measurement system is measured by using the algorithm of the first optical measurement method and the image of the second wavelength band provided from the second measurement system is measured By measuring the three-dimensional shape of the sample using the algorithm of the second optical measurement method different from the algorithm of the first optical measurement method, it is possible to measure the three-dimensional shape of the sample by using different measurement algorithms from the first measurement system and the second measurement system And a measuring terminal which simultaneously obtains a three-dimensional shape and selectively uses a three-dimensional shape by any one of the optical measuring algorithms according to the optical characteristics of the sample.
The method according to claim 1,
A third measurement light input unit for measuring a three-dimensional shape of an object by using a third optical measurement system different from the first and second optical measurement systems, the third measurement light input unit irradiating the sample with measurement light of a third wavelength band; A third optical filter for selectively transmitting only the measurement light in the third wavelength band, and a third measurement system for acquiring the third wavelength band reflected light image passed through the third optical filter. Inspection device.
The method according to claim 1,
A first measurement light input unit for irradiating the sample with the first measurement light of the first wavelength band;
A second measurement light input unit for irradiating the sample with the second measurement light of the second wavelength band; And
And an image acquiring unit for acquiring an image reflected from the sample and separating the image of the first wavelength band and the image of the second wavelength band and outputting the separated image.
delete The method of claim 3,
A third measurement light input unit for irradiating the sample with the third measurement light of the third wavelength band,
Wherein the image acquiring unit separates and outputs an image of the first wavelength band, an image of the second wavelength band, and an image of the third wavelength band after acquiring the reflected image from the sample,
Wherein the measuring terminal analyzes the three-dimensional shape of the sample from the images of the first to third wavelength bands using algorithms of the first to third optical measuring systems.

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