JP4494933B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus.

Conventionally, as a device for mounting electronic components on a board, a plurality of electronic components supplied by a component supply unit are sucked and held by a suction nozzle provided in a mounting head, transferred to a board, mounted, and mounted. A component mounting apparatus is known.
In such an electronic component mounting apparatus, after the suction nozzle sucks and holds the electronic component from the component supply unit, and the electronic component is mounted on the substrate, the mounting head including the suction nozzle holding the electronic component is mounted on the substrate. There is known an electronic component mounting apparatus that detects the presence or absence of an electronic component held at the tip of the suction nozzle and detects the posture of the electronic component at each timing after moving (For example, refer to Patent Document 1).
Then, based on the detection results at the respective timings, the electronic component mounting apparatus restarts sucking and holding the electronic component if the electronic component is not held by the suction nozzle, and changes the posture of the electronic component held by the suction nozzle. When there is a deviation, the electronic component is mounted on the substrate by correcting the deviation of the electronic component with respect to the substrate by rotating the suction nozzle around the nozzle axis.
JP 2000-59099 A

However, in the case of the above-mentioned patent document 1, the state of the electronic component at each timing after the suction nozzle sucks and holds the electronic component and after the mounting head including the suction nozzle holding the electronic component moves relative to the substrate. The data related to the electronic component obtained by detecting this is independent, and is used for the correction operation of the electronic component at each timing. However, the data regarding the electronic component at each timing is not related.
In other words, the electronic component data acquired at each timing between the time when the suction nozzle sucks and holds the electronic component and the time when the mounting head equipped with the suction nozzle that holds the electronic component moves with respect to the substrate is correlated. No change in the state of the electronic component held by the suction nozzle was detected during the process (the process in which the mounting head equipped with the suction nozzle moves after the suction nozzle sucks and holds the electronic component). .

  An object of the present invention is to improve the quality of a substrate on which an electronic component is mounted based on a change in the state of the electronic component held by a suction nozzle.

In order to solve the above-described problems, the invention according to claim 1 is an electronic component mounting apparatus that holds an electronic component at a tip portion of a suction nozzle provided downward from a mounting head and mounts the electronic component on a substrate. After the suction nozzle holds the electronic component, the mounting head including the suction nozzle that holds the electronic component moves with respect to the substrate, and immediately after the suction nozzle holds the electronic component. And a timing immediately before the mounting head equipped with the suction nozzle holding the electronic component mounts the electronic component on the substrate is held at the tip of the suction nozzle. Comparing component detection means for detecting the attitude of the electronic component and the attitude of the electronic component at a plurality of timings detected by the component detection means. As well as, the component comparison data acquiring means for acquiring parts comparison data is the difference, and storing means for storing the component comparison data the component comparison data acquisition means has acquired, the component comparison data acquisition means has acquired the When the component comparison data is determined to be greater than or equal to a predetermined reference value, and the determination unit determines that the component comparison data is greater than or equal to a reference value, Storage control means for storing accompanying data related to the electronic component corresponding to the component comparison data .

  According to the first aspect of the present invention, the component detection means is provided at a plurality of timings while the mounting head including the suction nozzle holding the electronic component moves relative to the substrate after the suction nozzle holds the electronic component. While detecting the posture of the electronic component held at the tip of the suction nozzle, the component comparison data acquisition means compares the posture of the electronic component at a plurality of detected timings, and relates to the difference in the posture of the electronic component. Get component comparison data. Then, the component comparison data acquired by the component comparison data acquisition unit can be stored in the storage unit.

That is, the component comparison data regarding the difference in posture of the electronic component held by the suction nozzle at a plurality of timings after the suction nozzle holds the electronic component and the mounting head including the suction nozzle moves with respect to the substrate. Is stored in the storage means, and the electronic component mounted on the substrate can be recorded as a history relating to a change in posture held by the suction nozzle.
As a result, it is possible to know the history of how the electronic component is mounted on the board, so that it can be used as a quality proof of the board on which the electronic component is mounted. It can be used to improve the quality.
Therefore, in the electronic component mounting apparatus, the quality of the board on which the electronic component is mounted can be improved based on the change in the state of the electronic component held by the suction nozzle.

In addition, since the determination unit can automatically determine whether or not the component comparison data acquired by the component comparison data acquisition unit is equal to or greater than a predetermined reference value, Data management and data organization when recording the history of changes in the posture of the component held by the suction nozzle are facilitated.
Further, when the determination unit determines that the component comparison data is greater than or equal to the reference value, the storage control unit can store accompanying data related to the electronic component corresponding to the component comparison data in the storage unit.
In other words, it is determined that the component comparison data is greater than or equal to the reference value, and the amount of deviation of the electronic component held by the suction nozzle is large, and trouble may occur when mounting the electronic component on the board. In the case where the electronic component mounting apparatus is stopped, the accompanying data regarding the electronic component corresponding to the component comparison data determined to be greater than the reference value can be stored in the storage unit. Then, it is possible to store so as to accumulate accompanying data associated with the electronic component related to the electronic component that may cause a trouble when mounting the electronic component on the board. Then, by analyzing the accumulated accompanying data, it is possible to investigate the cause of trouble that is likely to occur when the electronic component is mounted on the substrate.
Therefore, the electronic component mounting apparatus can store and manage incidental data related to the electronic component as a quality record, and by analyzing the incidental data, it is possible to take measures against the cause of the electronic component mounting trouble. Mounting defects on the substrate can be reduced.
Therefore, it can be said that the electronic component mounting apparatus is an electronic component mounting apparatus that can reduce defective mounting of electronic components on a substrate.

According to a second aspect of the invention, in the electronic component mounting apparatus according to claim 1, the determining means, when the component comparison data is equal to or greater than the reference value, the electronic component held by the suction nozzle, abnormal And a notification means for notifying that there is.

According to the second aspect of the present invention, the suction nozzle is operated by the notifying unit when the determination unit determines that the component comparison data is equal to or higher than the reference value, while performing the same operation as the first aspect of the invention. It is possible to notify that there is an abnormality in the electronic component held in the box.

  In other words, the deviation amount of the electronic component held by the suction nozzle is large so that it is determined that the component comparison data is equal to or higher than the reference value, and there is a possibility that trouble may occur when the electronic component is mounted on the board. In some cases, the electronic component mounting apparatus can notify a user or the like that there is an abnormality in the electronic component held by the suction nozzle, so that the state of the electronic component held by the suction nozzle can be confirmed, It is possible to urge the user or the like to perform a predetermined treatment on the electronic component mounting apparatus, such as stopping the component mounting apparatus.

According to a third aspect of the present invention, in the electronic component mounting apparatus according to the first or second aspect , when the determination unit determines that the component comparison data is greater than or equal to a reference value, the electronic component held by the suction nozzle is A stop control means for stopping the operation to be mounted on the substrate is provided.

According to the invention described in claim 3, the same effect as that of the invention described in claim 1 or 2 is achieved, and when the determination means determines that the component comparison data is greater than or equal to the reference value, the stop control means The operation of mounting the electronic component held by the suction nozzle on the substrate can be stopped.

That is, after the suction nozzle holds the electronic component, the mounting head including the suction nozzle that holds the electronic component moves relative to the substrate so that the component comparison data is determined to be equal to or greater than the reference value. In the process, if the amount of displacement of the electronic component held by the suction nozzle is large and trouble may occur when mounting the electronic component on the substrate, the electronic component in the electronic component mounting apparatus is placed on the substrate. The mounted operation can be stopped.
Therefore, it is possible to reduce mounting defects of electronic components on the substrate.

According to a fourth aspect of the present invention, in the electronic component mounting apparatus according to any one of the first to third aspects, the component comparison data and / or accompanying data stored in the storage means are stored outside the electronic component mounting apparatus. It comprises data sending means for sending to an external storage device.

According to the invention of claim 4, the same effect as the invention of any one of claims 1 to 3 is achieved, and in the electronic component mounting apparatus, the data sending means stores the data in the storage means. The component comparison data and / or accompanying data can be sent to an external storage device outside the electronic component mounting apparatus.

  That is, component comparison data and accompanying data stored in the storage means can be sent to a large-capacity external storage device outside the electronic component mounting apparatus, and the data can be processed, managed, and recorded in the external storage device. As a result, the data can be processed quickly or a larger amount of data can be recorded.

According to the first aspect of the invention, after the suction nozzle holds the electronic component, the electronic component held by the suction nozzle at a plurality of timings while the mounting head including the suction nozzle moves relative to the substrate. By storing the component comparison data regarding the difference in posture in the storage unit, the electronic component mounted on the substrate can be recorded as a history regarding the change in posture held by the suction nozzle. As a result, it is possible to know the history of how the electronic component is mounted on the board, so that it can be used as a quality proof of the board on which the electronic component is mounted. It can be used to improve the quality.
Therefore, in the electronic component mounting apparatus, the quality of the board on which the electronic component is mounted can be improved based on the change in the state of the electronic component held by the suction nozzle.

In addition, since the determination unit can automatically determine whether or not the component comparison data acquired by the component comparison data acquisition unit is equal to or greater than a predetermined reference value, Data management and data organization when recording the history of changes in the posture of the component held by the suction nozzle are facilitated.
Further, when the determination unit determines that the component comparison data is greater than or equal to the reference value, the storage control unit can store accompanying data related to the electronic component corresponding to the component comparison data in the storage unit. In other words, it is determined that the component comparison data is greater than or equal to the reference value, and the amount of deviation of the electronic component held by the suction nozzle is large, and trouble may occur when mounting the electronic component on the board. In the case where the electronic component mounting apparatus is stopped, the accompanying data regarding the electronic component corresponding to the component comparison data determined to be greater than the reference value can be stored in the storage unit. Then, it is possible to store so as to accumulate accompanying data associated with the electronic component related to the electronic component that may cause a trouble when mounting the electronic component on the board. Then, by analyzing the accumulated accompanying data, it is possible to investigate the cause of trouble that is likely to occur when the electronic component is mounted on the substrate.
Therefore, the electronic component mounting apparatus can store and manage incidental data related to the electronic component as a quality record, and by analyzing the incidental data, it is possible to take measures against the cause of the electronic component mounting trouble. Mounting defects on the substrate can be reduced. Therefore, it can be said that the electronic component mounting apparatus is an electronic component mounting apparatus that can reduce defective mounting of electronic components on a substrate.

According to the second aspect of the present invention, when the determination unit determines that the component comparison data is greater than or equal to the reference value, the notification unit notifies the electronic component held by the suction nozzle that there is an abnormality. Can do. In other words, the deviation amount of the electronic component held by the suction nozzle is large so that it is determined that the component comparison data is equal to or higher than the reference value, and there is a possibility that trouble may occur when the electronic component is mounted on the board. In some cases, the electronic component mounting apparatus can notify a user or the like that there is an abnormality in the electronic component held by the suction nozzle, so that the state of the electronic component held by the suction nozzle can be confirmed, It is possible to urge the user or the like to perform a predetermined treatment on the electronic component mounting apparatus, such as stopping the component mounting apparatus.

According to the third aspect of the present invention, when the determination unit determines that the component comparison data is greater than or equal to the reference value, the stop control unit stops the operation of mounting the electronic component held by the suction nozzle on the substrate. Can be made. That is, after the suction nozzle holds the electronic component, the mounting head including the suction nozzle that holds the electronic component moves relative to the substrate so that the component comparison data is determined to be equal to or greater than the reference value. In the process, if the amount of displacement of the electronic component held by the suction nozzle is large and trouble may occur when mounting the electronic component on the substrate, the electronic component in the electronic component mounting apparatus is placed on the substrate. The mounted operation can be stopped.
Therefore, it is possible to reduce mounting defects of electronic components on the substrate.

According to the fourth aspect of the present invention, in the electronic component mounting apparatus, the component comparison data and / or accompanying data stored in the storage unit is transmitted by the data transmission unit to the external storage device outside the electronic component mounting apparatus. be able to. That is, component comparison data and accompanying data stored in the storage means can be sent to a large-capacity external storage device outside the electronic component mounting apparatus, and the data can be processed, managed, and recorded in the external storage device. As a result, the data can be processed quickly or a larger amount of data can be recorded.

Hereinafter, embodiments of the present invention will be described in detail.
The electronic component mounting apparatus according to the present invention is an apparatus for mounting and mounting an electronic component supplied by a component supply unit (electronic component feeder) at a predetermined position on a substrate.
Here, in the electronic component mounting apparatus, the direction in which the substrate P is conveyed from the previous process to the subsequent process is defined as the X-axis direction, and one direction orthogonal thereto is defined as the Y-axis direction. The direction orthogonal to is defined as the Z-axis direction.

FIG. 1 is a perspective view of the electronic component mounting apparatus 1, and FIG. 2 is a block diagram showing a main part configuration of the electronic component mounting apparatus 1.
As shown in FIGS. 1 and 2, the electronic component mounting apparatus 1 transports a base 2 on which each component member is placed on the upper surface and a substrate P from the previous process to the subsequent process along the X-axis direction. Substrate transport means 3, component supply unit 4 for supplying electronic component D, mounting head 6 for mounting electronic component D supplied by component supply unit 4 on substrate P, and mounting head 6 for each of the X and Y axes The head moving means 7 that moves in the direction, the input unit 11 that inputs various data and operation instructions, the display unit 12 that displays various data and the operation status of the apparatus, and the data generated by the predetermined processing are stored. Storage means 13, and a control unit 10 for controlling the operation of each of the above units.

The substrate transport means 3 includes a transport belt (not shown) in the substrate transport path extending in the X-axis direction, and transports the substrate P along the substrate transport path from the pre-process side to the post-process side.
Moreover, since the board | substrate conveyance means 3 mounts the electronic component D on the board | substrate P with the mounting head 6, it stops conveyance of the board | substrate P in a predetermined component mounting position, and also supports the board | substrate P.
The substrate transport path is provided with a substrate detection sensor 3a for detecting the substrate P transported by the substrate transport means 3, and the detection signal detected by the substrate detection sensor 3a is the control unit 10 (CPU 10a). ) Is output.

  The component supply unit 4 includes a plurality of electronic component feeders that convey electronic components arranged in a feeder bank on the upper surface of the base 2, and is provided on the side of the substrate conveying means 3.

  The mounting head 6 is provided on a beam member 72 to be described later, and a predetermined number (in this embodiment, one) of suction nozzles 6a protruding downward (in the Z-axis direction) and a nozzle movement for moving the suction nozzle 6a. Means 6b and a laser recognition unit 5 as part detection means for detecting the posture of the electronic part D held by the suction nozzle 6a.

The laser recognition unit 5 includes a light emitting unit 5a that outputs laser light, which is predetermined light, and a light receiving unit 5b that receives the laser light output from the light emitting unit 5a.
The light receiving unit 5b is configured by, for example, a CCD line sensor, and is disposed at a position facing the light emitting unit 5a with the suction nozzle 6a interposed therebetween so as to receive the laser beam output from the light emitting unit 5a. It has become.
The laser recognizing unit 5 irradiates the electronic component D arranged in the optical path of the laser beam from the light emitting unit 5a to the light receiving unit 5b with the light emitting unit 5a irradiating the laser beam, and the laser light reaching the light receiving unit 5b The posture of the electronic component D held by the suction nozzle 6a is detected by the light receiving unit 5b detecting the shadow of the laser beam blocked by the electronic component D.
Note that processing and operation when the laser recognition unit 5 detects the attitude of the electronic component D held by the suction nozzle 6a are well-known techniques and will not be described in detail here.

The suction nozzle 6a is connected to, for example, an air suction means (not shown), and by passing vacuum air through a through hole (not shown) formed in the suction nozzle 6a, an electronic component is attached to the tip portion which is the lower end of the suction nozzle 6a. D can be adsorbed and held. Further, the air suction means is provided with a solenoid valve (not shown), the vacuum air can be switched by the solenoid valve, and the air suction means can be switched between the air suction state and the air release state. . That is, when the air suction state is set, the vacuum component is allowed to pass through the through hole so that the electronic component D can be sucked, and when the air release state is set, the inside of the through hole of the suction nozzle 6a is set to the atmospheric pressure state. Release adsorption.
The suction nozzle 6a is detachably provided so that it can be exchanged according to the size, shape, and type of the electronic component D to be sucked and held.

The nozzle moving means 6b includes a Z-axis moving means (not shown) that moves the suction nozzle 6a in the Z-axis direction, and a θ-axis rotation means (not shown) that rotates the suction nozzle 6a around the nozzle axis. The nozzle axis has substantially the same axial direction as the Z axis.
The Z-axis moving means (not shown) is provided on the mounting head 6 and moves the suction nozzle 6a in the Z-axis direction. The suction nozzle 6a passes through the Z-axis moving means in the Z-axis direction. The mounting head 6 is provided so as to be freely movable. As the Z-axis moving means, for example, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.
The θ-axis rotating means (not shown) is a rotation driving means that is provided on the mounting head 6 and rotates the suction nozzle 6a around the nozzle axis. The suction nozzle 6a is a nozzle that passes through the θ-axis rotating means. The mounting head 6 is provided so as to be rotatable about an axis. The θ-axis rotating means includes, for example, an angle adjustment motor and an encoder that detects the amount of rotation angle of the angle adjustment motor.

Then, the suction nozzle 6a that sucks and holds the electronic component D is moved by the Z-axis moving means (not shown) of the nozzle moving means 6b, and the electronic component D held by the suction nozzle 6a is emitted by the laser recognition unit 5. The electronic component D is disposed in the optical path of the laser beam from the unit 5a toward the light receiving unit 5b, and the θ-axis rotating unit (not shown) of the nozzle moving unit 6b rotates the suction nozzle 6a around the nozzle axis. It is designed to rotate inside.
The laser recognition unit 5 detects the shadow of the electronic component D rotated in the optical path of the laser light and the laser light reaching the light receiving unit 5b, and outputs the detection data to the control unit 10 (CPU 10a). The processing and operation for the laser recognition unit 5 to detect the attitude of the electronic component D held by the suction nozzle 6a are well-known techniques and will not be described in detail here.

  The head moving unit 7 includes an X-axis moving unit 7a that moves the mounting head 6 in the X-axis direction (left-right direction), and a Y-axis moving unit 7b that moves the mounting head 6 in the Y-axis direction (front-back direction). Has been.

  The X-axis moving unit 7a is supported by guide members 71 and 71 provided on the substrate transfer path of the substrate transfer unit 3 so as to straddle the direction (Y-axis direction) perpendicular to the transfer direction of the substrate P. A rail-like support member provided on the beam member 72 extending in the direction and a driving means (not shown) for moving the mounting head 6 supported by the support member in the X-axis direction are provided. As this driving means, for example, a linear motor, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.

The Y-axis moving unit 7b includes a rail-like support member provided on the upper surfaces of the guide members 71 and 71 and a drive unit (not shown) that moves the beam member 72 supported by the support member in the Y-axis direction. ing. As this driving means, for example, a linear motor, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.
The beam member 72 is provided such that the upper surface of the guide members 71 and 71 can be moved in the Y-axis direction by the Y-axis moving means 7 b, and the mounting head 6 can be moved in the Y-axis direction via the beam member 72.

  The input unit 11 includes, for example, a keyboard and a mouse, and can input various data and operation instructions.

The display unit 12 is configured by, for example, an LCD, and can display various data and the operation status of the apparatus.
In particular, the display unit 12 is a notification unit that displays a message or the like for notifying that there is an abnormality in the electronic component D held by the suction nozzle 6a based on the determination of the control unit 10 as a determination unit described later. Function.

The storage means 13 has a recording medium capable of storing new data or the like generated by a predetermined process. The recording medium is composed of, for example, a magnetic recording medium, an optical recording medium, a semiconductor memory, and the like, and is provided to the storage unit 13 in a fixed or detachable manner.
And the memory | storage means 13 can memorize | store the accompanying data regarding the electronic component D corresponding to the component comparison data judged to be more than a reference value based on judgment of the control part 10 as a judgment means mentioned later. It has become.

As shown in FIG. 2, the control unit 10 includes a CPU 10a, a ROM 10b, and a RAM 10c.
The CPU 10a performs centralized control of the operation of each unit according to various control programs for the electronic component mounting apparatus stored in the ROM 10b in accordance with the start signal, operation signal, setting data value, and the like input from the input unit 11 and the like. The processing result is stored in the work area in the RAM 10c. Then, the CPU 10a controls driving of each part constituting the electronic component mounting apparatus 1.

In the ROM 10b, a control program, control data, reference data, and the like of the electronic component mounting apparatus 1 are written and stored.
In particular, the ROM 10b functions as a reference value storage unit and stores a reference value for comparison with component comparison data acquired by processing of the control unit 10 as a component comparison data acquisition unit described later.

  The RAM 10c is provided with various work memories and counters, and is used as a work area during the electronic component mounting operation. Further, the RAM 10c stores a processing result by the CPU 10a.

Then, the control unit 10 executes a predetermined control program and controls the operation of each unit of the apparatus, whereby the suction nozzle 6a provided in the mounting head 6 holds the posture and angle of the electronic component D held from the component supply unit 4. Is adjusted to function as a component mounting control means for mounting and mounting at a predetermined position of the substrate P supported at a predetermined component mounting position of the substrate transport path.
The control unit 10 performs control to recognize the position of the substrate P and stop at a predetermined component mounting position based on the detection signal detected by the substrate detection sensor 3a.
The control unit 10 also determines the posture of the electronic component D held by the suction nozzle 6a based on the shadow of the electronic component D detected by the laser recognition unit 5 (light receiving unit 5b) and the laser light reaching the light receiving unit 5b. Control to recognize the angle.
Further, the control unit 10 adjusts the posture of the electronic component D to be mounted on the substrate P according to the posture and angle of the electronic component D held by the recognized suction nozzle 6a, and moves the nozzle moving means 6b and the head. Control for operating the means 7 is performed.

In particular, the control unit 10 includes a plurality of timings during which the mounting head 6 including the suction nozzle 6a holding the electronic component D moves relative to the substrate P after the suction nozzle 6a holds the electronic component D. It functions as a part of component detection means for operating the laser recognition unit 5 so as to detect the posture of the electronic component D held at the tip of the suction nozzle 6a.
For example, the control unit 10 serving as the component detection unit includes a timing immediately after the suction nozzle 6a holds the electronic component D from the component supply unit 4, and a mounting head 6 including the suction nozzle 6a holding the electronic component D on the substrate P. At the timing immediately before the electronic component D is moved and mounted on the substrate P, the posture of the electronic component D held at the tip of the suction nozzle 6a is detected by the laser recognition unit 5, and the electronic component related to the posture is detected. Control to acquire the coordinates and angle of D is performed.

Further, the control unit 10 compares the postures of the electronic components D at a plurality of timings detected by the control unit 10 as the component detection unit, and acquires component comparison data for acquiring component comparison data regarding the differences in the postures of the electronic components D. Functions as a means.
For example, the control unit 10 serving as the component comparison data acquisition unit is configured in the X axis direction, the Y axis direction, and the θ direction with respect to the posture of the electronic component D at the timing immediately after the suction nozzle 6a holds the electronic component D from the component supply unit 4. Numerical values of coordinates and angles (X1, Y1, θ1) and numerical values of coordinates and angles (X2, Y2) in the X-axis direction, Y-axis direction, and θ-direction relating to the posture of the electronic component D just before being mounted on the substrate P , Θ2) and component comparison data (ΔX, ΔY, Δθ) which are the differences
) = (X2-X1, Y2-Y1, θ2-θ1) is obtained.

Here, the coordinates and angle values (X1, Y1, θ1) of the electronic component D at the timing immediately after the suction nozzle 6a holds the electronic component D from the component supply unit 4, and the timing immediately before being mounted on the substrate P are displayed. The component comparison data (ΔX, ΔY, Δθ), which is the difference between the coordinates of the electronic component D and the numerical values of the angles (X2, Y2, θ2), is a mounting head that includes the suction nozzle 6a that holds the electronic component D from the component supply unit 4. In the process of moving 6 with respect to the substrate P, the posture of the electronic component D held by the suction nozzle 6a is changed, and the amount of shift of the position of the electronic component D is indicated.
Since the mounting head 6 including the suction nozzle 6a moves quickly in order to shorten the mounting tact time for mounting the electronic component D on the substrate P, the mounting head 6 is moving at the moment when the mounting head 6 is stopped. At the moment when the mounting head 6 stops, a large inertia force may be generated. Due to the action of the inertial force, the posture of the electronic component D held by the suction nozzle 6a may change, and the position of the electronic component D may shift.

Further, the control unit 10 compares the component comparison data acquired by the control unit 10 as the component comparison data acquisition unit with a predetermined reference value stored in the ROM 10b, and the component comparison data is equal to or greater than the reference value. It functions as a determination means for determining whether or not there is.
Here, in the process in which the mounting head 6 including the suction nozzle 6a holding the electronic component D from the component supply unit 4 moves with respect to the substrate P, the attitude and position of the electronic component D held by the suction nozzle 6a change. Is small, troubles related to the mounting of the electronic component D on the board P are unlikely to occur. However, when the posture and position of the electronic component D are largely changed, there is a trouble related to the mounting of the electronic component D on the board P. May occur.
Therefore, a comparison is made between a predetermined reference value and the component comparison data, and the degree of possibility that a trouble related to the mounting of the electronic component D on the substrate P will occur is determined. For example, it is determined that trouble is likely to occur if the component comparison data is greater than or equal to a reference value, and it is determined that trouble is less likely to occur if the component comparison data is less than or equal to the reference value.

  In addition, when the control unit 10 as the determination unit determines that the component comparison data is greater than or equal to the reference value, the control unit 10 stops the operation of mounting the electronic component D held by the suction nozzle 6a on the substrate P. Thus, it functions as a stop control means for temporarily stopping each part of the apparatus.

  Further, when the control unit 10 as the determination unit determines that the component comparison data is greater than or equal to the reference value, the control unit 10 notifies the electronic component D held by the suction nozzle 6a that there is an abnormality. It functions as a part of notification means for displaying a message or the like on the display unit 12.

In addition, when the control unit 10 serving as a determination unit determines that the component comparison data is greater than or equal to the reference value, the control unit 10 associates the electronic component D corresponding to the component comparison data determined to be greater than or equal to the reference value. It functions as a storage control means for storing data in the storage means 13.
Here, the accompanying data related to the electronic component D includes, for example, component comparison data (ΔX, ΔY, Δθ) acquired by the control unit 10 as the component comparison data acquisition unit and the component comparison data as shown in FIG. The component data specifying the electronic component D, such as the component name, the product number, or the ID number related to the electronic component D determined to be equal to or greater than the reference value, is the minimum necessary data.
Further, as more detailed accompanying data, for example, as shown in FIG. 4, the component comparison data (ΔX, ΔY, Δθ) acquired by the control unit 10 as the component comparison data acquisition means, and the component comparison data is greater than or equal to a reference value. The component data (product number) for identifying the electronic component D determined to be, the product name and ID number of the component, the mounting machine name of the electronic component mounting apparatus that mounted the electronic component D, and the mounting of the electronic component D It is also possible to store a specific number for identifying the mounting head or suction nozzle that has performed, the component lot of the electronic component D, the mounting date and time when the electronic component D was mounted, and the like. Further, temperature (air temperature), humidity, weather, and the like may be recorded together.

Next, the operation of the electronic component mounting apparatus 1 will be described based on the flowchart shown in FIG.
First, the electronic component mounting apparatus 1 is activated when a predetermined key of the input unit 11 is pressed, and various electronic components D are mounted on a predetermined board P in a predetermined arrangement based on a predetermined control program. The operation is started (step S101).

Then, the mounting head 6 moves to the component supply unit 4, and the suction nozzle 6a sucks and holds the electronic component D (step S102).
Next, the laser recognition unit 5 detects the attitude of the electronic component D held at the tip of the suction nozzle 6a, and the control unit 10 uses numerical data (for example, numerical values) of coordinates (positions) and angles related to the attitude of the electronic component D. Data (X1, Y1, θ1)) is acquired (step S103).

Then, the mounting head 6 moves to the substrate P supported at a predetermined component mounting position on the substrate conveyance path (step S104).
Next, the laser recognition unit 5 detects the attitude of the electronic component D held at the tip of the suction nozzle 6a, and the control unit 10 uses numerical data (for example, numerical values) of coordinates (positions) and angles related to the attitude of the electronic component D. Data (X2, Y2, θ2)) is acquired (step S105).

  Then, the control unit 10 includes numerical data (for example, numerical data (X1, Y1, θ1)) regarding the posture of the electronic component D at the timing immediately after the suction nozzle 6a holds the electronic component D from the component supply unit 4, and the substrate. The numerical data (for example, numerical data (X2, Y2, θ2)) regarding the posture of the electronic component D at the timing immediately before being mounted on P is compared, and the component comparison data (ΔX, ΔY, Δθ) as the difference is compared. Is acquired (step S106).

Next, the control unit 10 determines whether or not the acquired component comparison data is greater than or equal to a reference value (step S107).
When the control unit 10 determines that the component comparison data is greater than or equal to the reference value (step S107; Yes), the process proceeds to step S108.
On the other hand, when the control unit 10 determines that the component comparison data is not equal to or greater than the reference value (step S107; No), the process proceeds to step S110.

In step S108, the control unit 10 temporarily stops the operation of the electronic component mounting apparatus 1 so as to stop the mounting of the electronic component D, and the display unit 12 has an abnormality in the electronic component D held by the suction nozzle 6a. A message or part comparison data (Δ
X, ΔY, Δθ) and the like are displayed, and accompanying data relating to the electronic component D corresponding to the component comparison data determined to be equal to or greater than the reference value is stored in the storage means 13 (step S108).

  Then, after the user performs a predetermined measure such as checking the state of the electronic component D, the electronic component mounting apparatus 1 is restarted when a predetermined key of the input unit 11 is pressed (step S109). ).

Next, the control unit 10 determines whether or not all the electronic components D have been mounted on the substrate P (step S110).
When the control unit 10 determines that all the electronic components D have been mounted (step S110; Yes), the operation of the electronic component mounting apparatus 1 is stopped (step S111), and the electronic component mounting is ended.
On the other hand, when the control unit 10 determines that all the electronic components D have not been mounted (step S110; No), the process returns to step S102.

As described above, according to the electronic component mounting apparatus 1 according to the present invention, numerical data relating to the posture of the electronic component D at the timing immediately after the suction nozzle 6a holds the electronic component D from the component supply unit 4 and the substrate P are mounted. Based on component comparison data (ΔX, ΔY, Δθ) that is obtained by comparing the numerical data related to the posture of the electronic component D at the timing immediately before the comparison, and a predetermined reference value. In the process in which the mounting head 6 including the suction nozzle 6a holding the electronic component D from the supply unit 4 moves relative to the substrate P, the posture of the electronic component D held by the suction nozzle 6a changes, and the position of the electronic component D changes. When it is determined that the amount of deviation is large, the operation of the electronic component mounting apparatus 1 can be temporarily stopped so as to stop the mounting of the electronic component D. It is possible to reduce the problems related to installation of the P.
Therefore, it can be said that the electronic component mounting apparatus 1 is an electronic component mounting apparatus that can reduce mounting defects of the electronic component D on the substrate P based on a change in the state of the electronic component D held by the suction nozzle 6a.

Then, the deviation amount of the electronic component D held by the suction nozzle 6a is large so that it is determined that the component comparison data is equal to or higher than the reference value, and trouble occurs when the electronic component D is mounted on the substrate P. Therefore, when the electronic component mounting apparatus 1 is temporarily stopped, the electronic component mounting apparatus 1 informs the display unit 12 that there is an abnormality in the electronic component D held by the suction nozzle 6a. A message for notification, component comparison data (ΔX, ΔY, Δθ) and the like can be displayed. Then, the user confirms the state of the electronic component D based on the notification or message displayed on the display unit 12, for example, to continue mounting the electronic component D on the substrate P as it is, It is possible to prompt the user to perform a predetermined treatment such as terminating the operation, discarding the sucked electronic component D, re-sucking the electronic component D, and remounting the electronic component D.

Further, the electronic component mounting apparatus 1 determines that the component comparison data is equal to or greater than the reference value, and the displacement amount of the electronic component D held by the suction nozzle 6a is large, and the electronic component D is mounted on the substrate P. When the electronic component mounting apparatus 1 is temporarily stopped, associated data relating to the electronic component D corresponding to the component comparison data determined to be equal to or higher than the reference value is stored. 13 can be stored.
That is, in the electronic component mounting apparatus 1, regarding the electronic component D that may cause a trouble when the electronic component D is mounted on the board P, the accompanying data accompanying the electronic component D is accumulated and accumulated. In addition, by storing the accumulated and accumulated accompanying data, it is possible to investigate the cause of trouble that is likely to occur when the electronic component D is mounted on the substrate P.

In addition to storing and managing the accompanying data stored in a cumulative manner as a quality record, and investigating the regularity and trends of the accompanying data, for example, the difference between day shift and night shift in two shift production, Based on the difference in each, it is possible to clarify conditions such as time, season, temperature and humidity that are likely to cause trouble.
Also, if the type of electronic component D that is likely to cause trouble is found, the management when mounting the electronic component D can be tightened, and if the mounting head 6 and the suction nozzle 6a that are likely to cause trouble are found. It is possible to use the data when making these improvements.
Further, if the combination of the electronic component D and the suction nozzle 6a that are likely to cause troubles is found, it is possible to cope with the change of the suction nozzle 6a that holds the electronic component D.

As described above, the electronic component mounting apparatus 1 can store and manage the accompanying data regarding the electronic component D as a quality record based on the state change of the electronic component D held by the suction nozzle 6a, and analyze the quality record. As a result, it becomes possible to take measures against the cause of the trouble of mounting the electronic component, so that mounting defects of the electronic component D on the substrate P can be reduced.
Therefore, it can be said that the electronic component mounting apparatus 1 is an electronic component mounting apparatus that can reduce mounting defects of the electronic component D on the substrate P.

  In the above embodiment, the timing for detecting the posture of the electronic component D held at the tip of the suction nozzle 6a is set immediately after the suction nozzle 6a holds the electronic component D from the component supply unit 4, and the substrate. However, the present invention is not limited to this, and the posture of the electronic component D is detected at three or more times to obtain numerical data. Also good.

The component comparison data includes a difference ((ΔX, ΔY, Δθ) = (X2−) between a plurality of numerical data.
X1, Y2-Y1, θ2-θ1)). However, the present invention is not limited to this, and the component comparison data is data based on ratios / proportions, for example, (ΔX, ΔY, Δθ) = (
X2 / X1, Y2 / Y1, θ2 / θ1).

  Moreover, in the said embodiment, the laser recognition unit 5 provided in the mounting head 6 is used as an example of a component detection means. Instead, a posture of the electronic component D held by the suction nozzle 6a is detected by installing a component recognition camera on the mounting head 6 or providing a plurality of component recognition cameras on the electronic component mounting apparatus 1. It may be.

  Moreover, in the said embodiment, when it was judged that component comparison data is more than a reference value, the operation | movement which mounts the electronic component D on the board | substrate P was stopped. Instead of this, the production operation may be continued while notifying such as displaying a warning that there is an abnormality. Further, in the production operation at this time, it is easily conceivable to reduce the suction or mounting speed of the electronic component D.

  In the above embodiment, one reference value is set. However, it is easily conceivable to set a plurality of reference values. In this case, a first reference value and a second reference value larger than the first reference value are set. When the component comparison data exceeds the first reference value, the production operation is continued while warning. When the component comparison data exceeds the second reference value, the production is stopped, that is, the electronic component D is placed on the substrate P. It can be easily considered to stop the mounting operation.

  In the above embodiment, the component comparison data and the accompanying data are stored in the storage unit 13 of the electronic component mounting apparatus 1. Instead, the data is transferred to a personal computer or server as an external storage device (not shown) outside the electronic component mounting apparatus 1 via a wired or wireless communication means such as a cable or a mobile terminal as data transmission means (not shown). Can be easily transmitted. The transmitted various data can be processed at high speed by an external storage device, which is a dedicated processing device, or can be stored together as a large amount of data.

  In addition, it is needless to say that other specific detailed structures can be appropriately changed.

It is a perspective view which shows the electronic component mounting apparatus which concerns on this invention. It is a block diagram which shows the principal part structure of the electronic component mounting apparatus which concerns on this invention. It is explanatory drawing which shows an example of the accompanying data memorize | stored in a memory | storage means. It is explanatory drawing which shows an example of the accompanying data memorize | stored in a memory | storage means. It is a flowchart which shows operation | movement of an electronic component mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Board | substrate conveyance means 4 Component supply part 5 Laser recognition unit (component detection means)
5a Light emitting unit 5b Light receiving unit 6 Mounted head 6a Adsorption nozzle 6b Nozzle moving unit 7 Head moving unit 10 Control unit (component detection unit, component comparison data acquisition unit, determination unit, stop control unit, notification unit, storage control unit)
10a CPU
10b ROM
10c RAM
11 Input unit 12 Display unit (notification means)
13 Storage means D Electronic component P Substrate

Claims (4)

An electronic component mounting apparatus that holds an electronic component at the tip of a suction nozzle provided downward from a mounting head and is mounted on a substrate,
After the suction nozzle holds the electronic component, the mounting head including the suction nozzle that holds the electronic component moves relative to the substrate, and the suction nozzle holds the electronic component. The tip of the suction nozzle is held at a plurality of timings including a timing immediately after and a timing immediately before the mounting head including the suction nozzle holding the electronic component is mounted on the substrate. Component detection means for detecting the posture of the electronic component;
Comparing the posture of the electronic component at a plurality of timings detected by the component detection means, and component comparison data acquisition means for acquiring component comparison data that is the difference between the postures,
Storage means for storing the component comparison data acquired by the component comparison data acquisition means;
Determining means for determining whether or not the component comparison data acquired by the component comparison data acquiring means is equal to or greater than a predetermined reference value;
When the determination means determines that the component comparison data is greater than or equal to a reference value, storage control means for storing accompanying data related to the electronic component corresponding to the component comparison data in the storage means;
An electronic component mounting apparatus comprising: When the determination unit determines that the component comparison data is greater than or equal to a reference value, the determination unit includes a notification unit that notifies the electronic component held by the suction nozzle that there is an abnormality. Item 2. The electronic component mounting apparatus according to Item 1 . When the determination unit determines that the component comparison data is greater than or equal to a reference value, the determination unit includes a stop control unit that stops an operation of mounting the electronic component held by the suction nozzle on the substrate. The electronic component mounting apparatus according to claim 1 or 2 . Wherein stored in the storage means, the component comparison data and / or the additional data, any claim 1-3, characterized in that it comprises a data sending means for sending to the electronic component mounting apparatus outside the external storage device An electronic component mounting apparatus according to claim 1.

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