JP2011014811A - Device for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an electronic component from being missed or carried back.SOLUTION: The device for mounting an electronic component includes: a pressure detection means 125 to detect internal pressure of a suction nozzle 105; a means 30 for acquiring and controlling the time required for suction, wherein the means 30 performs a suction operation of a suction nozzle by a negative pressure supply means 122 in a component supply part 102 to each electronic component in non-execution of mounting operation control, and measures and records the time required for suction until the detected pressure is set at target suction pressure by the pressure detection means. An operation control means continues suction of each electronic component by the negative pressure supply means according to the time required for suction, acquired by the means 30, in mounting the electronic component, and thereafter lifts the suction nozzle.

Description

  The present invention relates to an electronic component mounting apparatus that performs mounting by sucking an electronic component with a nozzle.

The conventional electronic component mounting apparatus is equipped with a suction nozzle and a head that can move freely in the XY plane. The electronic component is received from the electronic component feeder by suction, and the head moves to the component mounting location on the board. The electronic component is mounted by supplying positive pressure into the suction nozzle at the mounting position to release the electronic component.
However, depending on the individual electronic components such as the size and weight of the electronic components, the surface material, etc., there may be a case where external air pressure leaks at the time of adsorption and sufficient holding power cannot be obtained. For this reason, in the conventional electronic component mounting apparatus, an air leak parameter indicating the degree of leak is set in advance for each electronic component, and control is performed to reduce the moving speed of the head in accordance with the air leak parameter. The positional deviation with respect to is prevented (for example, refer to Patent Document 1).

  Also, depending on the individual electronic components such as the size, weight, and surface material of the electronic components, the adhesion is too high and the electronic components do not separate when released from the nozzle tip. There is a so-called take-away problem of moving to the target position. For this reason, in other conventional electronic component mounting apparatuses, when an electronic component that tends to be taken home is lowered when the nozzle is lowered by the suction nozzle, the amount of the lowering is reduced, and the suction nozzle for the electronic component at the time of suction is reduced. Control to reduce the pressing force is performed to prevent take-out (for example, see Patent Document 2).

JP 2007-242818 A JP 2007-250795 A

However, since the conventional technique of Patent Document 1 employs a method of reducing the moving speed of the head by using a leak parameter, it is not possible to prevent failure when picking up and picking up the electronic component from the electronic component supply unit. It was.
In addition, in each of the above-described conventional technologies, leakage and takeout prevention measures are taken based on leak parameters and parameters indicating the likelihood of takeout. However, the leak parameters and the likelihood of takeout are likely to occur for individual electronic components. It is difficult to predict in advance the parameter indicating the above, and it is actually mounted and dealt with after the above troubles occur.
In addition, the leak parameter and the parameter indicating ease of take-out have to be set for each electronic component by the user himself paying attention to each phenomenon, which is complicated.

An object of the present invention is to prevent an electronic component from being missed by a suction nozzle.
Another object of the present invention is to suppress a reduction in suction force or take-out of the suction nozzle before the electronic component is mounted and to eliminate the need for an operator to set the characteristics of the electronic component. To do.

  According to the first aspect of the present invention, there is provided a substrate holding unit that holds a substrate on which electronic components are mounted, a component supply unit that supplies a plurality of electronic components to be mounted, and a lift that sucks the electronic components mounted on the substrate. A head including a possible suction nozzle, a negative pressure supply unit that applies a negative pressure to the suction nozzle, a positive pressure supply unit that applies a positive pressure to the suction nozzle, and from the component supply unit to the substrate holding unit In an electronic component mounting apparatus, comprising: a head moving mechanism that arbitrarily moves and positions the head over a region including: and an operation control unit that performs mounting operation control on the substrate based on mounting data. Pressure detecting means for detecting, and when the mounting operation control is not performed, the negative pressure supplying means at the component receiving position of the component supplying unit for each electronic component A suction required time acquisition control means for performing the suction operation of the landing nozzle and measuring and recording the suction required time until the detected pressure reaches the target suction pressure by the pressure detection means. In mounting the component, the suction nozzle is raised after continuing the suction of each electronic component by the negative pressure supply means according to the required suction time acquired by the required suction time acquisition control means.

  The invention described in claim 2 has the same configuration as that of the invention described in claim 1, and the suction required time acquisition control means measures the suction required time and then sucks and releases electronic components by the positive pressure supply means. The suction nozzle is raised after performing the operation.

  The invention described in claim 3 has the same configuration as that of the invention described in claim 1 or 2, and for each electronic component to be mounted by the mounting data when the mounting operation control is not executed. In the component supply unit, the negative pressure supply means performs an adsorption operation for setting the inside of the adsorption nozzle as a target adsorption pressure, and the positive pressure supply means allows the inside of the adsorption nozzle to be changed from the target adsorption pressure to the target release pressure. A required release time acquisition control means for measuring and storing the required release time, wherein the operation control means is configured to provide the positive pressure according to the required release time acquired by the required release time acquisition control means when the electronic component is mounted. The suction nozzle is raised after continuing the suction release of each electronic component by the supply means.

  The invention according to claim 4 has the same configuration as that of the invention according to claim 3, and the required release time acquisition control means is configured to measure the required suction time by the required suction time acquisition control means. The release time is measured by executing an operation control to set the target release pressure by the positive pressure supply means from the state in which the inside is the target adsorption pressure.

  The invention according to claim 5 has the same configuration as that of the invention according to claim 3 or 4, and the release required time acquisition control means is configured such that the positive pressure from a state in which the inside of the suction nozzle is set to a target suction pressure. The positive pressure supply by the supply means is performed in the predicted release time, and when the inside of the suction nozzle does not reach the target release pressure, the predicted release time is repeatedly changed every predetermined unit time, The time required for release to obtain a target release pressure is obtained.

  The invention according to claim 6 has the same configuration as the invention according to any one of claims 3 to 5, and detects whether or not an electronic component is sucked by the suction nozzle. And suctioning the electronic component with the inside of the suction nozzle as a target suction pressure, and supplying the positive pressure based on the required release time acquired by the required release time acquisition control means with the suction nozzle raised. And a required release time confirmation control means for determining whether or not the electronic component has been released by the component suction detection means after a predetermined waiting time from the supply stop of the positive pressure. Until the electronic component is released, the standby time is changed every predetermined unit time and is repeated to obtain an appropriate standby time. At the time of mounting the product, the suction release of each electronic component is performed by the positive pressure supply means according to the required release time, and then the suction nozzle is turned on after the standby time acquired by the required release time confirmation control means has elapsed. It is characterized by raising.

  In the first aspect of the present invention, for each electronic component to be mounted, the time required for suction until the target suction pressure is reached by suction is acquired, and during the mounting operation control, suction is continued according to the acquired time required for suction. The electronic components are lifted and moved in the state where the target suction pressure has been reached, and it is possible to prevent operation failure, drop of electronic components during movement, displacement of the nozzle tip, etc. It is possible to improve the performance and mounting position accuracy.

In addition, when mounting operation control is not performed, the time required for suction until the target suction pressure is reached due to suction is acquired. Therefore, the electronic component is likely to leak only after an error occurs during mounting operation. Unlike the case of recognizing the leak and taking countermeasures against leaks, even if the operator does not recognize the leak characteristics of each electronic component, the mounting operation is automatically performed according to the leak characteristics, and the occurrence of errors is further improved. It becomes possible to reduce.
In addition, it is not necessary for the operator to perform setting input work regarding the leakage characteristics of individual electronic components, and the complexity of the setting work can be eliminated.

  In claim 1, for example, when “target suction pressure” is individually set for each electronic component in the mounting data or the like, the time required for suction until the target suction pressure for each electronic component is reached is measured. If a common “target adsorption pressure” is set regardless of the electronic component, the time required for adsorption until the same target adsorption pressure is reached is measured for each electronic component.

  In the invention according to claim 2, the time required for suction in the suction required time acquisition control is measured at the component receiving position of the component supply unit, and after the electronic component is sucked and released by the positive pressure supply means after the measurement. Since the suction nozzle is raised, the electronic components are not taken out from the component supply unit. As a result, it is possible to avoid wasting the electronic components for measuring the time required for suction, which improves the economy. Can be achieved.

  In the invention according to claim 3, for each electronic component to be mounted, the time required for release until the inside of the suction nozzle reaches the target release pressure by supplying positive pressure from the suction state is acquired, and is acquired at the time of mounting operation control. Since the suction is released according to the required release time, it is possible to prevent the electronic component from being taken home and to improve the operation reliability.

Also, when mounting operation control is not executed, the time required for release until the target release pressure is reached by the positive pressure supply means is acquired, so electronic components that are likely to be brought home only when an error occurs during mounting operation Unlike the case of recognizing that it is a countermeasure, even if the worker does not recognize that each electronic component is a characteristic that is likely to be taken out, the mounting operation that automatically avoids take-out is performed, The occurrence of errors can be further reduced.
In addition, it is not necessary for the operator to perform setting input work as to whether or not each electronic component is likely to be taken home, and the complexity of the setting work can be eliminated.

  Furthermore, since the suction nozzle is raised after the measurement of the required release time in the required release time acquisition control is performed at the component receiving position of the component supply unit, even when the required release time is measured, the electronic component is As a result, it is possible to avoid wasting electronic parts for measuring the time required for release, and it is possible to improve the economy.

The “target release pressure” is a pressure for separating the sucked electronic component from the suction nozzle, and is preferably a pressure within a range from the atmospheric pressure to the positive pressure limit value. The positive pressure limit value refers to a pressure that prevents the electronic component or the electronic component mounted around the electronic component from being displaced by blowing when the electronic component is detached.
Further, in claim 3, for example, when “target release pressure” is individually set for each electronic component in the mounting data, the time required for release until the target release pressure for each electronic component is reached is measured. When a common “target release pressure” is set regardless of the electronic component, the time required for release until the same target release pressure is reached is measured for each electronic component.

  According to the fourth aspect of the present invention, the operation of setting the target release pressure by the positive pressure supply of the positive pressure supply means by the required release time acquisition control means from the state in which the inside of the suction nozzle is set to the target suction pressure by the required suction time acquisition control means. Since control is executed and the required release time is measured, the measurement of the required adsorption time by the required adsorption time acquisition control means and the measurement of the required release time by the required release time acquisition control means are performed in a series of controls. The negative pressure supply operation until the inside of the suction nozzle reaches the target suction pressure by the suction required time acquisition control means and the negative pressure supply operation until the inside of the suction nozzle reaches the target suction pressure by the release required time acquisition control means. Compared with the case where it is performed separately, the time required for obtaining the time required for adsorption and the time required for release can be greatly reduced.

In the invention according to claim 5, the release required time acquisition control means retries by changing the positive pressure supply by the positive pressure supply means from the state where the inside of the suction nozzle is set to the target suction pressure, every predetermined unit time. , To obtain the required release time to be the target release pressure. The required release time can be measured by monitoring the detection pressure of the pressure detection means and measuring the time from the start of positive pressure supply start until the target release pressure is reached. When performing the operation by the operation control, a time lag is likely to occur, and even if the control is performed according to the measurement time, the internal pressure of the suction nozzle may not be as measured. Therefore, if the method of repeating the retry to determine whether the suction nozzle reaches the target suction pressure by actually setting the required release time, the time required for operation control from the supply of positive pressure to the stop is required. Therefore, since the influence of the time lag is included from the beginning, it is possible to obtain an accurate release time.
As a result, it is possible to more accurately measure the time required for release, more effectively prevent the electronic component from being taken home, and prevent misalignment of other electronic components during the mounting operation.

  In the invention according to claim 6, the waiting time after release is acquired by the release required time confirmation control means, and the operation control means waits for the elapse of the waiting time from the state where the suction nozzle is set to the target release pressure by suction release, and then the suction is performed. Since the nozzle is raised, it is possible to more reliably prevent the electronic component from being taken home.

It is a top view which shows the whole electronic component mounting apparatus which concerns on this Embodiment. It is a block diagram which shows the control system of an electronic component mounting apparatus. It is a front view of the head of an electronic component mounting apparatus. It is a flowchart of adsorption | suction required time acquisition control. It is a diagram which shows the state of the pressure change in the suction nozzle from the start of switching of the solenoid valve for switching. It is a flowchart of release required time acquisition control. Pressure change in the suction nozzle when switching control is performed so that the solenoid valve for switching is supplied with positive pressure for a predetermined waiting time when the internal pressure of the suction nozzle is at the target suction pressure in three stages It is a diagram which shows the state of. It is a flowchart of release required time confirmation control. It is a flowchart of electronic component mounting control.

(Embodiment of the Invention)
An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an explanatory diagram showing a schematic configuration of an electronic component mounting apparatus 100 according to the present embodiment, and FIG. 2 is a control block diagram. Hereinafter, as illustrated, two directions orthogonal to each other on the horizontal plane are defined as an X-axis direction and a Y-axis direction, respectively. In addition, a vertical direction perpendicular to these is referred to as a Z-axis direction.
The electronic component mounting apparatus 100 mounts various electronic components on a board. As shown in FIG. 1, a plurality of electronic component feeders 101 for supplying electronic components to be mounted are arranged in the X-axis direction. A plurality of first component supply units 102 that are arranged and held; a second component supply unit 104 that arranges a tray 103 on which various electronic components are placed; a substrate transfer unit 108 that transfers a substrate in the X-axis direction; A substrate holding unit for performing an electronic component mounting operation on a substrate K provided in the middle of the substrate transfer path by the substrate transfer means 108 and a plurality (six in this example) of suction nozzles 105 are held up and down so as to be electronic. X as a head moving mechanism that drives and conveys the head 106 that holds the component T and the head 106 to an arbitrary position in a work area including the two component supply units 102 and 104 and the substrate holding unit. Y gantry 107, base frame 114 for mounting and supporting each of the above components, and pneumatic circuit 120 for supplying negative pressure (atmospheric state below atmospheric pressure) and positive pressure (atmospheric state above atmospheric pressure) to each suction nozzle 105 And an operation control means 10 for controlling the operation of each of the above components.

  The operation control means 10 of the electronic component mounting apparatus 100 has mounting data in which various setting contents relating to the mounting of the electronic component are recorded, and the electronic component to be mounted from the mounting data and the electronic component feeder 101 of the electronic component. The component receiving position based on the installation position and data indicating the mounting position on the board are read out, and the XY gantry 107 is controlled to move the head 106 to the electronic component receiving position and mounting position. 106, the suction nozzle 105 is moved up and down and the suction-release operation is performed. Further, while moving, the position of the electronic component and the angle around the nozzle at the time of suction are detected using a component recognition device 113 described later. Operation control such as position correction and angle adjustment is executed.

(Substrate transport means and substrate holder)
The substrate transport unit 108 includes a transport belt (not shown), and transports the substrate K along the X-axis direction by the transport belt.
Further, as described above, in the middle of the substrate transfer path by the substrate transfer means 108, the substrate holding portion (the substrate K in FIG. 1) for fixing and holding the substrate K at the work position when the electronic component is mounted on the substrate K. Is shown). The substrate transport unit 108 transports and stops the substrate K to the substrate holding unit, and holds the substrate K by a holding mechanism (not shown). That is, a stable electronic component mounting operation is performed while the substrate K is held by the holding mechanism.

(First and second parts supply section)
The first component supply unit 102 is an area along the X-axis direction that is provided at one end of the base frame 114 in the Y-axis direction and that can mount a plurality of electronic component feeders 101 side by side. A plurality of electronic component feeders 101 are arranged and mounted on the upper surface of the flat portion of the first component supply unit 102 along the X-axis direction. Each electronic component feeder 101 is provided with a latch mechanism, and can be attached to and detached from the first delivery supply unit by operating the latch mechanism.

The electronic component feeder 101 described above holds a tape reel (not shown) wound with a tape in which countless number of electronic components are sealed at a uniform interval on the rear end side, and in the vicinity of the front end portion as described above. The electronic component delivery unit 101a to the head 106 is provided.
During the mounting operation of the electronic component, the head 106 receives the electronic component by positioning the suction nozzle 105 in the transfer portion 101a of the electronic component feeder 101 to be mounted.

The second component supply unit 104 is provided on the base frame 114 at the end on the opposite side of the first component supply unit 102 in the Y-axis direction with the substrate transport unit 108 interposed therebetween.
The tray disposed in the second component supply unit 104 includes a plurality of recesses, and electronic components are arranged in a row in each recess.
During the mounting operation of the electronic component, the head 106 positions the suction nozzle 105 in the recess in which the electronic component to be mounted is stored, and the electronic component is transferred.

(XY gantry)
The XY gantry 107 includes an X-axis guide rail 107a that guides the movement of the head 106 in the X-axis direction, and two Y-axis guide rails 107b that guide the head 106 in the Y-axis direction together with the X-axis guide rail 107a. , An X-axis motor 109 that is a drive source that moves the head 106 along the X-axis direction, and a Y-axis motor 110 that is a drive source that moves the head 106 in the Y-axis direction via the X-axis guide rail 107a. ing. By driving the motors 109 and 110, the head 106 can be transported to almost the entire region between the two Y-axis guide rails 107b.
Each of the motors 109 and 110 is positioned so that the suction nozzle 105 is positioned via the head 106 by controlling the rotation amount of each of the motors 109 and 110 to be a desired rotation amount. Is going.
Further, the first and second component supply units 102 and 104 and the substrate holding unit described above are all disposed within the transportable area of the head 106 by the XY gantry 107 due to the necessity of the electronic component mounting work. .
A disposal box 116 for discarding defective electronic components is provided in the transportable area.

(head)
FIG. 3 is a front view of the head 106 as viewed from the line of sight along the Y-axis direction. The head 106 includes six suction nozzles 105 that hold the electronic component T by air suction at the tip thereof, and six Z-axis motors 111 that move the suction nozzles 105 up and down along the Z-axis direction (FIG. 2). And only six rotary motors 112 for adjusting the angle of the electronic components held by rotating the respective suction nozzles 105 around the Z-axis direction, and imaging the marks on the substrate K to determine the substrate position. A mark recognition camera 115 for recognition and a component recognition device 113 for detecting the position of the electronic component sucked by each suction nozzle 105 relative to the nozzle tip and the angle around the Z axis are provided. In FIG. 2, the motors 111 and 112 are illustrated for only one suction nozzle 105, but actually, each motor 111 and 112 is provided for each suction nozzle 105 mounted on the head 106. .

Each of the suction nozzles 105 is supported by the head 106 so as to be movable up and down and rotatable in a state along the Z-axis direction, so that the electronic components can be received or mounted by raising and lowering and the angle of the electronic components can be adjusted by rotation. Yes.
Further, the component recognition device 113 irradiates the electronic component at the tip of the suction nozzle 105 with laser light along the Y-axis direction from a plurality of light sources provided side by side along the X-axis direction, and the reflected light The position and angle of the electronic component at the tip of the nozzle can be recognized depending on the range in which the reflected light is obtained in the X-axis direction.
Further, the component recognition device 113 can detect whether or not an electronic component is attracted to the tip of the suction nozzle 105 based on the presence or absence of the reflected light, and also functions as a “component suction detection unit”. It has become.

(Pneumatic circuit)
The air pressure circuit 120 includes a positive pressure source 121 that generates positive air pressure, a negative pressure generator 122 that generates a negative pressure from an air flow generated by the positive pressure source, and a positive pressure generated from the positive pressure source 121. Then, the pressure reducing device 123 composed of an electropneumatic regulator for adjusting a predetermined pressure, the negative pressure generated from the negative pressure generating device 122, and the positive pressure output from the pressure reducing device 123 are switched and supplied to each suction nozzle 105. An electromagnetic valve 124 and pressure detecting means 125 for detecting the internal pressure of each suction nozzle 105 are provided.
The positive pressure source 121 and the pressure reducing device 123 described above function as a positive pressure supply unit that applies a positive pressure to the suction nozzle 105, and the negative pressure generation unit 122 that applies a negative pressure to the suction nozzle 105. Function as.
The switching solenoid valve 124 can be switched to three positions, ie, a negative pressure supply state, a positive pressure supply state, and a circuit closed state, and the switching operation is controlled by the operation control means 10. With this configuration, the pneumatic circuit 120 is controlled to be switched so that the switching solenoid valve 124 connects the negative pressure generator 122 and the suction nozzle 105 when the suction nozzle 105 performs suction of the electronic component. Is supplied so that the suction can be performed. Further, when releasing the electronic component from the suction state by the suction nozzle 105, the switching electromagnetic valve 124 is controlled to connect the decompression device 123 and the suction nozzle 105, and positive pressure is supplied. The electronic component is released.
Although not shown, the pneumatic circuit 120 is actually prepared for each of the plurality of suction nozzles 105 in practice.

(Operation control means)
As shown in FIG. 2, the operation control means 10 mainly includes an X-axis motor 109, a Y-axis motor 110 of the XY gantry 107, a Z-axis motor 111 that raises and lowers the suction nozzle 105 in the head 106, and a suction nozzle 105. A CPU 30 that executes various processes and controls in accordance with a predetermined control program for a rotation motor 112 that performs rotation of the motor, a solenoid valve 124 for switching the pneumatic circuit 120, a pressure detection means 125, a component recognition device 113, and a mark recognition camera 115 The system ROM 12 storing programs for executing various processes and controls, the RAM 13 serving as a work area for various processes by storing various data, and the CPU 30 and various devices are connected to each other. / F (interface) 14, a list of electronic components to be mounted on the board, and the mounting position of each electronic component And a non-volatile storage device 17 for storing mounting data necessary for mounting operation control such as a receiving position of electronic components and other setting information, and an operation panel 15 for inputting various settings and data required for operations. And a display monitor 18 for presenting various setting contents and necessary information. Each of the motors 109 to 112 described above is a servo motor including an encoder, and is connected to the I / F 14 via a servo driver (not shown).

The CPU 30 reads mounting data from the storage device 17 at the time of mounting the electronic components, and from the mounting data, lists various electronic components to be mounted on the board, reception positions and mounting positions of the electronic components. Get information.
The CPU 30 controls the X-axis and Y-axis motors 109 and 110 to move the head 106 to the electronic component receiving position, and controls the Z-axis motor to lower the suction nozzle 105 to suck the electronic components. Then, the suction nozzle 105 is raised and the head 106 is further transferred to the mounting position. Then, during the transfer to the mounting position, the CPU 30 detects the position of the sucked electronic component with respect to the nozzle and the angle around the nozzle using the component posture recognition means, and controls the rotation motor 112 to correct the angle. Execute. Further, when positioning the head 106 at the mounting position, correction is performed in consideration of the position of the electronic component relative to the nozzle.
Further, the suction nozzle 105 is lowered by the Z-axis motor to complete the mounting of the electronic component.
The CPU 30 repeatedly executes the above operation for all electronic components mounted on the board.

  Further, the CPU 30 obtains important setting information related to the suction operation during mounting of the electronic component according to various programs stored in the system ROM 12, so that the required suction time acquisition control, the required release time acquisition control, and the required release time confirmation Control is in progress. These controls will be described in detail below.

(Adsorption required time acquisition control)
The suction time acquisition control is a process executed by the CPU 30 in accordance with a program in the system ROM 12, and for example, mounting operation control such as immediately after the main power of the apparatus is turned on or new mounting data is acquired. At the time of non-execution, the suction nozzle 105 is positioned in the delivery part 101a of the electronic component feeder 101 (or the concave portion of the tray 103) for each electronic component to be mounted by the mounting data, and the suction nozzle 105 is moved on the spot. The pressure is lowered to the suction height, negative pressure is supplied by the switching electromagnetic valve 124, and the CPU 30 monitors the pressure detection means 125 in a state where the electronic parts are sucked, and measures the time required for suction until the suction reaches the target suction pressure. Perform the process. Further, this process is performed for all the electronic components of the component supply units 102 and 104 to be mounted in the mounting data, and the suction required time for each electronic component is stored in the storage device 17.
The above-mentioned target suction pressure for suction is a pressure that can raise the suction nozzle 105 that has sucked the electronic component, and can be set numerically by the operation panel 15. This example illustrates the case where the target suction pressure is a specified value common to electronic components. For example, each electronic component is individually set in consideration of the stability during suction due to its weight and shape. You may do it.

FIG. 4 is a flowchart of the suction required time acquisition control. The adsorption required time acquisition control will be described according to this.
First, the CPU 30 positions the X-axis motor 109 and the Y-axis motor so that any of the suction nozzles 105 of the head 106 is positioned in the delivery unit 101a (or the recess of the tray 103) of the electronic component feeder 101 of the target electronic component. 110 is controlled (step S1).
Next, the suction nozzle 105 is lowered to the suction height of the electronic component by driving the Z-axis motor 111 (step S2), and negative pressure is supplied into the suction nozzle 105 by switching the switching electromagnetic valve 124 (step S3). As a result, the electronic components in the delivery unit 101 a (or the concave portion of the tray 103) of the electronic component feeder 101 are sucked by the suction nozzle 105.

Simultaneously with the supply of the negative pressure, the CPU 30 monitors the output of the pressure detection means 125, measures the time until the target adsorption pressure is reached, and acquires the required adsorption time (step S4).
FIG. 5 is a diagram showing a state of pressure change in the suction nozzle 105 from the start of switching of the switching electromagnetic valve 124. A curve A is a normal electronic component with little leakage, and a curve B shows an electronic component with much leakage. In this diagram, the upper part of the vertical axis indicates a decrease in atmospheric pressure, and the lower part of the vertical axis indicates an increase in atmospheric pressure.
As shown in the drawing, when the negative pressure supply is started in a state where the tip of the suction nozzle 105 is in contact with the upper surface of each electronic component, the switching timing of the switching electromagnetic valve 124 is slightly increased in any electronic component. In the case of an electronic component in which the pressure in the nozzle decreases after a delay occurs and there is a leak, as shown by curve B, the gradient of the pressure decrease becomes gradual and the time until the target adsorption pressure is reached (adsorption) It can be seen that it takes a long time.

After reaching the target adsorption pressure, the switching solenoid valve 124 stops the negative pressure supply (step S5), and further switches to the positive pressure supply (step S6). When the positive pressure is supplied for a preset time, the switching electromagnetic valve 124 is closed to stop the positive pressure supply (step S7). As a result, the inside of the suction nozzle 105 is returned to atmospheric pressure, and the electronic component is released from the suction state. In this state, the Z-axis motor 111 is controlled so that the suction nozzle 105 is raised to the standby height (step S8), and the suction time acquisition control for one electronic component is completed. Note that the suction required time acquisition control is repeatedly executed until completion for all electronic components prepared in the electronic component mounting apparatus 100.
By executing the above control, the CPU 30 functions as “adsorption required time acquisition control means”.

(Release time acquisition control)
Next, release time acquisition control will be described. The required release time acquisition control is a process executed by the CPU 30 in accordance with a program in the system ROM 12. For example, the mounting operation control such as immediately after the main power of the apparatus is turned on or immediately after new mounting data is acquired. At the time of non-execution, the suction nozzle 105 is positioned in the delivery part 101a of the electronic part feeder 101 (or the concave part of the tray 103) for each electronic part to be mounted by the mounting data, and the electronic part is sucked on the spot. The nozzle 30 serves as a target suction pressure for suction within the nozzle 105, and from this state, the CPU 30 performs a process of measuring the time required for release until it returns to the target release pressure after the supply of positive pressure is started. Further, this process is performed for all the electronic components of the component supply units 102 and 104 to be mounted in the mounting data, and the required release time for each electronic component is stored in the storage device 17.

FIG. 6 is a flowchart of the required release time acquisition control. The release required time acquisition control will be described according to this.
First, the CPU 30 positions the X-axis motor 109 and the Y-axis motor so that any of the suction nozzles 105 of the head 106 is positioned in the delivery unit 101a (or the recess of the tray 103) of the electronic component feeder 101 of the target electronic component. 110 is controlled (step S31).
Next, the suction nozzle 105 is lowered to the suction height of the electronic component by driving the Z-axis motor 111 (step S32), and negative pressure is supplied into the suction nozzle 105 by switching the switching electromagnetic valve 124 (step S33). As a result, the electronic components in the delivery unit 101 a (or the concave portion of the tray 103) of the electronic component feeder 101 are sucked by the suction nozzle 105.

  Simultaneously with the negative pressure supply, the CPU 30 monitors the output of the pressure detecting means 125 (step S34), and when the suction nozzle 105 reaches the target suction pressure, the switching solenoid valve 124 supplies the negative pressure. Stop (step S35). If the required suction time has already been acquired, the negative pressure supply may be stopped in step S35 after waiting for the required suction time, instead of monitoring the pressure detection means 125 in step S34.

Then, the CPU 30 measures the time until the inside of the suction nozzle 105 reaches the target release pressure (required release time) by supplying positive pressure.
In this measurement, it is possible to measure the elapsed time from the start of positive pressure supply until the pressure detection means 125 indicates the target release pressure. If the solenoid valve 124 is switched, it may not be in time depending on the response.
Therefore, in this release time acquisition control, the switching solenoid valve 124 is controlled so that positive pressure is supplied from the state in which the suction nozzle 105 is at the target suction pressure at a predetermined time n [ms]. Then, from the detected pressure in the suction nozzle 105 obtained as a result, it is determined whether the initial positive pressure supply time n is too long or too short, and a predetermined unit for the positive pressure supply time n is determined according to the determination. Repeat the retry by adding or subtracting time to release the optimal positive pressure supply time for boosting the suction nozzle 105 within the range from the atmospheric pressure to the positive pressure limit value (this range is the “target release pressure”) It is to be acquired as the required time. Note that the initial value of the positive pressure supply time n can be arbitrarily set by the operation panel 15. Also, the positive pressure limit value can be arbitrarily set by the operation panel 15, but it is set within a range where the atmospheric pressure is not less than the atmospheric pressure and the electronic component to be mounted and the electronic component mounted therearound are not displaced by air blow. There is a need to.

FIG. 7 shows a case where the switching control is performed so that the switching solenoid valve 124 is supplied with positive pressure for a predetermined waiting time n when the internal pressure of the suction nozzle 105 is at a target suction pressure in three stages. It is a diagram which shows the state of the pressure change in the suction nozzle 105. FIG.
Curve C shows the pressure change when a positive pressure is applied from the target adsorption pressure, which is the most negative pressure. In this case, even if positive pressure is supplied during the positive pressure supply time n, the atmospheric pressure is not reached, and the electron The part is not released from the suction nozzle 105.
Curve D shows a change in pressure when a positive pressure is applied from a target adsorption pressure that is somewhat more positive than C. In this case, if positive pressure is supplied during positive pressure supply time n, atmospheric pressure In addition, the positive pressure limit value is not exceeded and good adsorption / release is performed.
Curve E shows a change in pressure when a positive pressure is applied from a target adsorption pressure that is a positive pressure further than D. In this case, if positive pressure is supplied during positive pressure supply time n, atmospheric pressure is reduced. The limit value of the positive pressure is also exceeded and the electronic component is released, but since it may cause spraying to the surroundings, the electronic component and its nearby electronic components may be skipped. .
Thus, the optimum positive pressure supply time n is determined according to the target adsorption pressure, and in the required release time acquisition control, the positive pressure supply time n is sequentially changed to search for the optimum value.

  Specifically, the supply of positive pressure is started (step S36), and after the elapse of the positive pressure supply time n (step S37), the supply of the positive pressure is stopped by controlling the switching electromagnetic valve 124 (step S37). Step S38). Then, it is determined whether or not the detected pressure in the suction nozzle 105 by the pressure detecting means 125 at that time is negative (step S39). The value added by 1 [ms] is set as a new waiting time (step S40), and the process returns to step S33. Then, the negative pressure is supplied again until the target suction pressure is reached, and then the positive pressure is supplied for a new positive pressure supply time n [ms] to determine whether the internal pressure of the suction nozzle 105 is a negative pressure (step) S33 to S39). This loop of steps S33 to S40 is repeated until the internal pressure of the suction nozzle 105 becomes equal to or higher than atmospheric pressure.

If it is detected in step S39 that the pressure inside the suction nozzle 105 is not negative, it is determined whether the internal pressure is less than the positive pressure limit value described above (step S41).
As a result, if it is equal to or greater than the positive pressure limit value, it is assumed that the positive pressure supply time is too long, and a value obtained by subtracting 1 [ms] from n is set as a new positive pressure supply time (step S42). To return. Then, the negative pressure is supplied again until the target suction pressure is reached, and then the positive pressure is supplied for a new positive pressure supply time n [ms]. Whether the internal pressure of the suction nozzle 105 is negative or positive It is determined whether or not the threshold value is exceeded (steps S33 to S41). The loop of steps S33 to S42 is repeated until the suction nozzle 105 becomes less than the positive pressure limit value.
By repeating the retry, a positive pressure supply time in which the inside of the suction nozzle 105 is at least atmospheric pressure and less than the positive pressure limit value can be obtained by supplying positive pressure, and this is acquired as a required release time.
Thereby, the inside of the suction nozzle 105 is set to the target release pressure, and the electronic component is released from the suction state. In this state, the Z-axis motor 111 is controlled so that the suction nozzle 105 is raised to the standby height (step S43), and the required release time acquisition control for one electronic component is completed. The release required time acquisition control is repeatedly executed until completion for all the electronic components prepared in the electronic component mounting apparatus 100.
By executing the above control, the CPU 30 functions as “required release time acquisition control means”.

(Release time confirmation control)
Next, release time confirmation control will be described. The required release time confirmation control is a process executed by the CPU 30 in accordance with the program in the system ROM 12, and is performed after the execution of the required release time acquisition control described above when the mounting operation control is not executed.
In this release time confirmation control, each electronic component to be mounted based on the mounting data is sucked by the delivery unit 101a of the electronic component feeder 101 (or the concave portion of the tray 103) and the suction nozzle 105 is raised to move the head. The device waits above the disposal box 116 and supplies positive pressure with the required release time determined by the release time acquisition control. After a predetermined waiting time, the component recognition device 113 causes an electronic component to be attached to the tip of the suction nozzle 105. It is determined whether or not exists. If it is detected that the electronic component is still adsorbed to the tip of the adsorption nozzle 105, the standby time is added every predetermined unit time, and the adsorption / release time is again obtained at the target adsorption pressure. Adsorption release and detection of electronic components are performed, and the standby time is extended every unit time until the presence of the electronic components is no longer confirmed, and the retry is repeated.
Thereby, it is possible to acquire a waiting time until the electronic component is separated from the suction nozzle 105 after the positive pressure supply for suction release is stopped.
This process is performed for all the electronic components of the component supply units 102 and 104 to be mounted in the mounting data, and the standby time for each electronic component is stored in the storage device 17.
In this release time confirmation control, one electronic component is consumed, so it is not necessarily set to be executed along with the execution of the release time acquisition control. Even if the electronic component mounting operation is performed based on the required release time, the electronic component may be arbitrarily executed only when the electronic component is still taken home.

FIG. 8 is a flowchart of release required time confirmation control. The release required time confirmation control will be described according to this.
First, the CPU 30 positions the X-axis motor 109 and the Y-axis motor so that any of the suction nozzles 105 of the head 106 is positioned in the delivery unit 101a (or the recess of the tray 103) of the electronic component feeder 101 of the target electronic component. 110 is controlled (step S61).
Next, the suction nozzle 105 is lowered to the suction height of the electronic component by driving the Z-axis motor 111 (step S62), and negative pressure is supplied into the suction nozzle 105 by switching the switching electromagnetic valve 124 (step S63). As a result, the electronic components in the delivery unit 101 a (or the concave portion of the tray 103) of the electronic component feeder 101 are sucked by the suction nozzle 105.

Simultaneously with the supply of the negative pressure, the CPU 30 monitors the output of the pressure detection means 125 (step S64), raises the suction nozzle 105 by driving the Z-axis motor 11 (step S65), and the X and Y-axis motor 109. , 110 is moved to the disposal box 116 (step S66), and the suction nozzle 105 is lowered to the disposal height again by driving the Z-axis motor 111 (step S67).
Then, during these operation controls, when the inside of the suction nozzle 105 reaches the target suction pressure, the supply of negative pressure is stopped (step S68). If the required adsorption time has already been acquired, in step S64, the measurement of the required adsorption time is started instead of monitoring the pressure detecting means 125, and in step S68, the time required for the adsorption is waited for. The supply of negative pressure may be stopped.

  Then, the supply of positive pressure is started above the disposal box 116 (step S69), and after the required release time obtained by the release required time acquisition control has elapsed (step S70), the supply of positive pressure is stopped. (Step S71).

Next, after the supply of positive pressure is stopped, the initial waiting time m has elapsed (step S72), negative pressure is supplied (step S73), and the recognition height of the component recognition device 113 mounted on the head 105 is increased. The suction nozzle 105 is raised (step S74).
Then, as a result of detection by the component recognition device 113, when it is detected that the electronic component is still adsorbed on the tip of the adsorption nozzle 105 even though positive pressure is supplied (step S75), Assuming that the waiting time is insufficient, a value obtained by adding 1 [ms] to m is set as a new waiting time (step S76), and the process returns to step S67. Then, the negative pressure is supplied again until the target adsorption pressure is reached, then the negative pressure supply is stopped, and the positive pressure is supplied for the required release time. The presence of a part is determined (steps S67 to S75). This loop of steps S67 to S76 is repeated until the presence of the electronic component is no longer confirmed.

If it is detected in step S75 that no electronic component is present at the tip of the suction nozzle 105 and it has been dropped, the standby time m finally obtained is stored in the storage device 17 and the process is terminated. .
The release time confirmation control is repeatedly executed until all electronic components prepared in the electronic component mounting apparatus 100 are completed.
By executing the above control, the CPU 30 functions as a “required release time confirmation control means”.

(Electronic component mounting operation control)
Next, electronic component mounting operation control performed by the CPU 30 in accordance with a program stored in the system ROM 12 will be described with reference to the flowchart of FIG.
First, the CPU 30 positions the X-axis motor 109 and the Y-axis motor so that any of the suction nozzles 105 of the head 106 is positioned in the delivery unit 101a (or the recess of the tray 103) of the electronic component feeder 101 of the target electronic component. 110 is controlled (step S101).
Next, the suction nozzle 105 is lowered to the suction height of the electronic component by driving the Z-axis motor 111 (step S102), and negative pressure is supplied into the suction nozzle 105 by switching the switching electromagnetic valve 124 (step S103). As a result, the electronic components in the delivery unit 101 a (or the concave portion of the tray 103) of the electronic component feeder 101 are sucked by the suction nozzle 105.
Simultaneously with the negative pressure supply, the CPU 30 measures the time required for adsorption (step S104), and when the required adsorption time obtained by the required adsorption time acquisition control has elapsed, the negative pressure is supplied by the switching electromagnetic valve 124. Is stopped (step S105).

Next, the suction nozzle 105 is raised to the conveyance height by driving the Z-axis motor 111 (step S106), and the X-axis motor 109 and the Y-axis motor are positioned so that the suction nozzle 105 of the head 106 is positioned at the mounting position of the substrate K. 110 is controlled (step S107).
Then, the suction nozzle 105 is lowered to the mounting height by driving the Z-axis motor 111 (step S108).
Then, supply of positive pressure is started (step S109), and after waiting for the required release time obtained by the required release time acquisition control (step S110), supply of positive pressure is stopped (step S111).
Furthermore, after the positive pressure supply is stopped, the waiting time obtained by the release time confirmation control is waited (step S112), and then the suction nozzle 105 is raised to the conveying height by driving the Z-axis motor 111 (step S106). ), The mounting operation control for one electronic component is terminated.
Note that the processing from S101 to S113 is repeatedly executed for all electronic components to be mounted.

(Effect of embodiment)
In the electronic component mounting apparatus 100, the required suction time at which the inside of the suction nozzle 105 becomes the target suction pressure is acquired for each electronic component by the required suction time acquisition control, and the suction is continued according to the acquired required suction time during the mounting operation control. Therefore, the suction nozzle 105 is lifted and moved in a state where the appropriate target suction pressure has been reached, and it is possible to suppress the occurrence of loss during suction, the falling of electronic parts during movement, the positional deviation with respect to the nozzle tip, and the like. Therefore, it is possible to improve the operation reliability and the mounting position accuracy.

In addition, since the required suction time acquisition control is performed separately from the mounting operation, for example, by performing the required suction time acquisition control before performing the mounting operation, it is not until the error occurs during the mounting operation that the electronic component is Unlike when leak countermeasures are implemented by recognizing that electronic components are prone to leaks, even if the operator does not recognize the leak characteristics for each electronic component, it automatically responds to the leak characteristics. The mounting operation is performed, and the occurrence of errors can be further reduced.
Further, since the required suction time for each electronic component is automatically stored in the storage device 17 by the execution of the required suction time acquisition control, the operator needs to perform setting input work on the leak characteristics of the individual electronic components. Therefore, the complexity of the setting work can be eliminated.

  In addition, the measurement of the time required for suction in the suction time acquisition control is performed in the transfer part 101a of the electronic component feeder 101 or the recess of the tray 103. Further, after the measurement, positive pressure is supplied to release the electronic parts. Since the suction nozzle 105 is raised after the operation, the electronic component is not picked up. Therefore, at least the suction time acquisition control does not cause the electronic component to be discarded, thereby preventing the waste of the electronic component and improving the economical efficiency. It is possible to improve.

  Further, by executing the required release time acquisition control, the required release time for setting the inside of the suction nozzle 105 within the range between the atmospheric pressure and the positive pressure limit value (target release pressure) for each electronic component to be mounted is set. Since it is possible to acquire the electronic component, it is possible to release the electronic component more reliably by releasing the suction according to the acquired required release time during mounting operation control. Can be improved.

In addition, since the required release time acquisition control is executed when the mounting operation control is not executed, for example, by executing the required release time acquisition control in advance of the mounting operation in advance, an electronic component is not generated until an error occurs during the mounting operation. Unlike when taking measures to recognize that an electronic component is likely to be taken home, even if the operator does not recognize that each electronic component has a characteristic that is likely to be taken home, it is automatically taken away. The mounting operation for avoiding the error is performed, and the occurrence of errors can be further reduced.
Further, since the time required for release is automatically stored in the storage device 17 at the time of acquisition control, it is not necessary for the operator to perform setting input work as to whether or not each electronic component is likely to be taken home. It is possible to eliminate the complexity of the setting work.

  In the release required time acquisition control, since the release required time is changed little by little and the retry is repeated to acquire the required release time at which the suction nozzle pressure is appropriate, the influence of the time lag due to the switching solenoid valve 124 is included. The release required time can be acquired in this state, and the same result can be reproduced even when the operation control is implemented. For this reason, it is possible to measure the time required for release more accurately to prevent the electronic component from being taken home more effectively, and to prevent misalignment of other electronic components during the mounting operation.

  In addition, the waiting time is acquired by the release time confirmation control, and at the time of mounting operation, the suction nozzle 105 is kept waiting without being raised during the waiting time after performing suction release by supplying positive pressure. It is possible to prevent the take-out of the user more reliably.

(Other)
The operation control means 10 separately performs the required suction time acquisition control and the required release time acquisition control, but these acquire both the required suction time and the required release time by a series of operation controls. Anyway.
In other words, when obtaining the required release time, it is essential to supply a negative pressure into the suction nozzle 105 to obtain a target suction pressure, and then start supplying a positive pressure to obtain an appropriate pressure. When the suction nozzle 105 is set to the target suction pressure, the negative pressure supply time is measured to obtain the required suction time, and then the positive pressure is supplied at a predetermined time to release the target inside the suction nozzle. You may perform the process which determines whether it is in the range of a pressure.

More specifically, timing is started from the start of the negative pressure supply in step S33 in FIG. 6, the nozzle pressure is monitored in step S34, and the negative pressure supply is stopped in step S35 as the target adsorption pressure. The time required for adsorption can be acquired by measuring the time until. Subsequent steps S36 and thereafter acquire the required release time by performing the control as described above. In addition, when retry is performed by determining YES in steps S39 and S41, the processes in steps S33 to S35 in the second and subsequent rounds are not timed and negative pressure is supplied by monitoring the pressure detection means 125. It is desirable to control to stop.
As described above, by performing the suction required time acquisition control and the release required time acquisition control within one process, the suction required time acquisition control of FIG. 4 performed independently can be made unnecessary. It is possible to greatly reduce the time required for obtaining the release time.

10 operation control means 30 CPU (adsorption required time acquisition control means, release required time acquisition control means, release required time confirmation control means)
DESCRIPTION OF SYMBOLS 100 Electronic component mounting apparatus 101 Electronic component feeder 102,104 Component supply part 103 Tray 105 Adsorption nozzle 106 Head 107 XY gantry (head moving mechanism)
113 Component recognition device (component adsorption detection means)
120 Pneumatic circuit 121 Positive pressure source (positive pressure supply means)
122 Negative pressure generator (negative pressure supply means)
123 Pressure reducing device (positive pressure supply means)
124 Solenoid valve for switching 125 Pressure detection means K Substrate

Claims (6)

A board holding unit for holding a board on which electronic components are mounted;
A component supply unit for supplying a plurality of electronic components to be mounted;
A head having a suction nozzle capable of moving up and down to suck an electronic component mounted on the substrate;
Negative pressure supply means for applying a negative pressure to the suction nozzle;
A positive pressure supply means for applying a positive pressure to the suction nozzle;
A head moving mechanism for arbitrarily moving and positioning the head over a region including the component supply unit to the substrate holding unit;
In an electronic component mounting apparatus comprising operation control means for performing mounting operation control on the board based on mounting data,
Pressure detecting means for detecting the internal pressure of the suction nozzle;
When the mounting operation control is not executed, the suction operation of the suction nozzle is performed by the negative pressure supply unit at the component receiving position of the component supply unit for each electronic component, and the detected pressure is detected by the pressure detection unit. The adsorption required time acquisition control means for measuring and recording the adsorption required time until becomes the target adsorption pressure,
The operation control means, when mounting the electronic component, raises the suction nozzle after continuing the suction of each electronic component by the negative pressure supply means according to the required suction time acquired by the required suction time acquisition control means. An electronic component mounting apparatus characterized by that.   2. The electronic component according to claim 1, wherein the suction required time acquisition control unit raises the suction nozzle after the suction time of the electronic component is released by the positive pressure supply unit after measuring the suction required time. Mounting device. At the time of non-execution of the mounting operation control, a target suction pressure is set in the suction nozzle by the negative pressure supply means at the component receiving position of the component supply unit for each electronic component to be mounted by the mounting data. And a required release time acquisition control means for measuring and storing the required release time until the inside of the suction nozzle reaches the target release pressure from the target suction pressure by the positive pressure supply means,
The operation control means continues the suction release of each electronic component by the positive pressure supply means according to the required release time acquired by the required release time acquisition control means when mounting the electronic component, and then lifts the suction nozzle The electronic component mounting apparatus according to claim 1, wherein:   The required release time acquisition control means operates to set the target release pressure by the positive pressure supply means from the state in which the inside of the suction nozzle is set to the target suction pressure for the measurement of the required suction time by the required suction time acquisition control means. The electronic component mounting apparatus according to claim 3, wherein the time required for release is measured by executing control.   The required release time acquisition control means performs a positive pressure supply by the positive pressure supply means from a state in which the inside of the suction nozzle is set to a target suction pressure in a predicted release time, and the inside of the suction nozzle is a target release pressure. 5. If not, the predicted release time is repeatedly changed every predetermined unit time, and the release time for obtaining the target release pressure is obtained. The electronic component mounting apparatus described. Component adsorption detection means for detecting whether or not an electronic component is adsorbed to the adsorption nozzle;
While adsorbing an electronic component with the inside of the suction nozzle as a target suction pressure and supplying the positive pressure based on the required release time acquired by the required release time acquisition control means in a state where the suction nozzle is raised, A required release time confirmation control unit that determines whether or not the electronic component has been released by the component suction detection unit after a predetermined waiting time has elapsed since the stop of the supply of positive pressure,
The release required time confirmation control means obtains an appropriate standby time by changing the standby time every predetermined unit time until the electronic component is released, and repeating it.
The operation control means performs the suction release of each electronic component by the positive pressure supply means according to the required release time when the electronic component is mounted, and then the standby time acquired by the required release time confirmation control means elapses. The electronic component mounting apparatus according to claim 3, wherein the suction nozzle is raised after that.

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