WO2017068645A1

WO2017068645A1 - Component mounting method and component mounting machine

Info

Publication number: WO2017068645A1
Application number: PCT/JP2015/079558
Authority: WO
Inventors: 茂人大山
Original assignee: 富士機械製造株式会社
Priority date: 2015-10-20
Filing date: 2015-10-20
Publication date: 2017-04-27
Also published as: JP6777644B2; JPWO2017068645A1

Abstract

The present invention is a component mounting method for mounting a component onto a substrate (S), by using a component mounting machine (10) provided with (A) a component mounting apparatus (28) that includes a component holding device (70) for holding/detaching a component and that mounts the component onto the substrate (S) by lowering the component holding device (70), and (B) a substrate support device (50) that includes a support part (54) having a plurality of suction ports (52) in the upper surface thereof and that supports the substrate (S) by using the suction ports (52) such that a support surface which is the upper surface of the support part sucks the lower surface of the substrate (S), the method being characterized by comprising: measuring the height of the support surface prior to a component mounting operation of mounting components onto a plurality of the substrates (S); and lowering the component holding device (70) on the basis of the measured height of the support surface, during the component mounting operation on the plurality of substrates (S).

Description

Component mounting method and component mounting machine

The present invention relates to a component mounting method and a component mounting machine for mounting a component on a substrate.

Patent Documents 1 and 2 listed below describe a component mounting machine that lowers a component holding device capable of holding and detaching a component on a substrate held by a substrate support device and mounts the component. Note that the substrate support device has a support portion having a plurality of suction ports provided on the upper surface, as shown in Patent Documents 3 and 4 below, as well as a configuration supporting from the lower surface. There is a so-called vacuum backup type substrate support device that is configured to support the substrate by using the lower surface of the substrate to be adsorbed on the upper surface of the support portion.

JP 2002-185193 A International Publication No. WO2015 / 107354A1 Pamphlet JP 2003-142896 A Japanese Patent Laid-Open No. 7-15191

The component mounting machine equipped with the vacuum back-up type board support device as described above can flatten and hold the board firmly by adsorbing the board even if the board is warped. is there. However, there is still a lot of room for improvement even in such a component mounting machine, and it is possible to improve the practicality of such a component mounting machine by making improvements. This invention is made | formed in view of such a situation, and makes it a subject to provide the component mounting method which improves the practicality of the component mounting machine provided with the vacuum backup type board | substrate support apparatus. It is another object of the present invention to provide a highly practical component mounting machine.

In order to solve the above-described problems, a component mounting method of the present invention includes (A) a component mounting device that includes a component holding device that holds and detaches a component, and lowers the component holding device to mount the component on the board. (B) A substrate support that supports a substrate by having a support portion provided with a plurality of suction ports on the upper surface and adsorbing the lower surface of the substrate to the support surface that is the upper surface of the support portion using the suction ports. In a component mounting machine equipped with a device, a component mounting method for mounting a component on a board, and measuring the height of a support surface before performing a component mounting operation, which is a task of mounting components on a plurality of boards The component holding device is lowered based on the measured height of the support surface during the component mounting operation on the plurality of substrates.

Further, the component mounting machine of the present invention has (A) a component holding device that holds and detaches a component, and lowers the component holding device to mount the component on the board, and (B) on the upper surface. A substrate support device having a support portion provided with a plurality of suction ports, and supporting the substrate by adsorbing the lower surface of the substrate to the support surface which is the upper surface of the support portion using the suction ports; and (C) A control device that controls the component mounting machine, and the control device measures the height of the support surface before performing a component mounting operation, which is a task of mounting components on a plurality of substrates, The component holding device is lowered based on the measured height of the support surface when the component is mounted on the substrate.

According to the component mounting method and the component mounting machine of the present invention, for example, since the substrate support device sucks and holds the substrate, the height on the substrate can be estimated from the height of the support surface of the substrate support device. Thus, it is possible to perform the component mounting operation without increasing the height of the board for each board. On the other hand, if the height of the substrate is measured for each substrate, it is possible to detect a suction failure based on the difference between the height of the substrate and the height of the support surface. By having such an advantage, the practicality of the component mounting machine of the present invention is greatly improved. Moreover, the component mounting method of the present invention that can be used for such a component mounting machine contributes to improvement of the practicality of the component mounting machine.

It is a perspective view of the component mounting machine which is an Example of this invention. It is a side view of the component mounting machine which is an Example of this invention. It is a perspective view which expands and shows the board | substrate conveyance apparatus and board | substrate support apparatus which are shown in FIG. It is a side view which expands and shows a board | substrate support apparatus. It is a top view which shows the position of the several measurement point provided on the support surface.

<Configuration of component mounting machine>
1 and 2 show a component mounting machine 10 that is an embodiment of the present invention. FIG. 1 is a perspective view of the component mounting machine 10, and FIG. 2 is a side view of the component mounting machine 10. In addition, the operation | work which mounts components in a board | substrate arrange | positions the several component mounting machine 10 in order to mount a several kind of component in a board | substrate. In FIG. 1, two of the plurality of component mounting machines 10 are shown, and one of them shows the one with the exterior panel removed. The component mounting machine 10 includes a base 20, a beam 22 fixedly provided on the base 20, a board conveyor device 24 that is a board transfer device disposed on the base, and a base on the front side of the component mounting machine 10. A plurality of component feeders 26 that are replaceably attached to 20, and a component mounting device that holds components supplied from any of the plurality of component feeders 26 and separates the components for mounting on the substrate S The apparatus includes a mounting head 28, a head moving device 30 that is disposed on the beam 22 and moves the component mounting head 28, and a control device 32 that controls itself. In the following description, the direction in which the substrate is conveyed by the substrate conveyor device 24 is the left-right direction (X direction), and the direction perpendicular to the left-right direction on the horizontal plane is the front-rear direction (Y direction). The direction perpendicular to the front-rear direction is referred to as the up-down direction (Z direction).

FIG. 3 shows a perspective view of the substrate conveyor device 24. FIGS. 3A and 3B are perspective views from the viewpoints opposite to each other. The substrate conveyor device 24 has a pair of conveyors 40, and the substrate S placed on the pair of conveyor belts 42 by rotating each conveyor belt 42 of the pair of conveyors 40 by a transport motor 44. Is configured to be conveyed in the left-right direction. Although a detailed description is omitted, one of the pair of conveyors 40 is moved in the front-rear direction by an electromagnetic motor 46 so that it can accommodate substrates S of various widths.

Further, a substrate support device 50 for fixing and supporting the substrate S is provided between the pair of conveyors 42 of the substrate conveyor device 24. The substrate support device 50 is a vacuum backup type support device. The back-up plate 54 as a support portion provided with a plurality of suction ports 52 on the upper surface, a negative pressure source (not shown), and the back-up plate 54 are moved up and down. And a support lifting device 56 to be moved. In the state where the substrate S is placed on the upper surface of the backup plate 54, the substrate supporting device 50 is supplied with negative pressure from the negative pressure source to the suction port 52 of the backup plate 54, and adsorbs and supports the substrate S. Further, the support unit lifting device 56 is a state in which the substrate S is sucked and supported on the backup plate 54, and more specifically, the backup plate 54 is moved to a height at which component mounting work is performed. It raises until it contacts the collar part 58 provided above each of 40. Incidentally, the thickness t of the substrate S is registered in the control device 32, and the amount of increase L of the backup plate 54 from the thickness t of the substrate S until the substrate S comes into contact with the flange portion 58 is calculated, and the increase Based on the amount L, the support lifting device 56 is controlled by the control device 32.

The head moving device 30 is a so-called XY type moving device, and includes a head mounting body 60 to which the component mounting head 28 is detachably mounted, an X direction moving mechanism for moving the head mounting body 60 in the X direction, and the beam 22. The supported X direction moving mechanism includes a Y direction moving mechanism for moving the component mounting head 28 over the component feeder 26 and the substrate S. As shown in FIG. 2, a camera 62 for imaging the surface of the substrate S and a laser sensor 64 as a height sensor for measuring the height are fixed to the lower part of the head attachment body 60. ing.

The component mounting head 28 is a so-called index type mounting head. That is, each of the component mounting heads 28 has eight suction nozzles 70 that function as component holding devices and suck and hold the components at the lower end by supplying negative pressure, and these are held by the revolver 72. ing. The revolver 72 rotates intermittently, and one suction nozzle 70 located at a specific position can be moved up and down by the nozzle lifting device, that is, can be moved in the vertical direction. When the suction nozzle 70 located at a specific position is lowered, negative pressure is supplied to hold the component, and when the negative pressure supply is cut off, the suction holding component is removed. Let Incidentally, each of the eight suction nozzles 70 can be rotated around its own axis by the nozzle rotation mechanism, that is, around the axis, and the component mounting head 28 is rotated by each suction nozzle 70. It is possible to change and adjust the rotational position of the held component.

As described above, in the component mounting machine 10 of the present embodiment, the device for lifting and lowering the holding device (holding device lifting device) is provided in the component mounting head 28, but is provided in the component mounting head 28. Instead of the holding device lifting / lowering device, or in addition to the holding device lifting / lowering device provided to the component mounting head 28, the head moving device 30 may be provided. Specifically, it is also possible to employ a structure that moves the head mounting body 60 to which the component mounting head 28 is mounted in the vertical direction as the holding device lifting device.

Each of the plurality of component feeders 26 is set with a reel on which a component holding tape (a plurality of components are held on the tape, also called “component taping”) is wound. Each of the feeders 26 supplies parts one by one sequentially at a predetermined part supply site by intermittently feeding out the part holding tape. The replenishment of the parts may be performed by splicing the part taping while exchanging the reels (splicing), or may be performed by exchanging the reels together with the part feeder 26. Note that the component mounting machine 10 can also be attached with a so-called tray-type component supply device instead of the plurality of component feeders 26.

<Working with a component mounting machine>
(I) Measurement of Support Surface Height In the component mounting machine 10 of the present embodiment, the height of the support surface which is the upper surface of the backup plate 54 is measured before the component mounting operation is repeatedly performed on the plurality of substrates S. Is done. Below, it demonstrates from the process of measuring the height of the support surface of the backplate 54. FIG. This process is executed when the component mounting machine 10 is started, when the type of the board on which the component mounting operation is performed is changed, or when so-called setup change is performed. In this step, first, the backup plate 54 is raised by the support unit lifting device 56 and is positioned at a height position for mounting components on the substrate S when it is assumed that the substrate S is supported. Then, the laser sensor 64 is moved by the head moving device 30, and the nine measurement points AI (see FIG. 4) set on the support surface of the backup plate 54 are measured. As will be described in detail later, the measured heights of the nine measurement points AI on the support surface are used for controlling the descending amount of the suction nozzle 70.

(II) Support surface inclination determination As described above, after the heights of the nine measurement points AI are measured, the heights of two of the nine measurement points are compared. When the difference is larger than the set value, the support surface may be greatly inclined, so that the component mounting operation is not started and a warning is issued. Specifically, first, the heights of two adjacent objects are obtained from nine measurement points AI, respectively, and from the set value determined based on the distance between the two measurement points and the inclination from the horizontal plane. If there is a large part, the component mounting operation is not started and a warning is issued. Also, when the difference between the highest and lowest of the nine measurement points AI is larger than the set value, the component mounting operation is not started and a warning is issued.

(III) Component Mounting Operation Next, the component mounting operation by the component mounting machine 10 will be described. First, the substrate S to be used for the operation is carried in from the upstream side by the substrate conveyor device 24 to a predetermined position. Be transported. The substrate S transported to a predetermined position is sucked and held by the vacuum backup type substrate support device 50 and raised to a predetermined height. Subsequently, the component moving head 30 positions the component mounting head 28 above the plurality of component feeders 26, and the components are sequentially held in each of the eight suction nozzles 70. Next, the component moving head 28 is moved above the substrate S by the head moving device 30 and sequentially mounted at the set positions determined by the mounting program.

As described above, since the substrate S is sucked and held on the support surface of the backup plate 54 by the substrate support device 50, the height at the component mounting position on the substrate S even if some warping occurs. Increases by the thickness t of the substrate S stored in the control device 32 to the previously measured height on the support surface. Therefore, in the component mounting machine 10, the height of the component mounting position on the substrate S is obtained based on the height of the support surface of the backup plate 54. Specifically, for example, the height of the mounting position a shown in FIG. 4 is a support corresponding to the mounting position a interpolated from the heights of three measurement points A, B, and D around the mounting position a. This is obtained by adding the thickness t of the substrate S to the height above the surface. The lowering amount of the suction nozzle 70 is determined from the height of the mounting position a on the substrate S.

The component mounting head 28 is reciprocated between the component feeder 26 and the board S for the number of times determined by the mounting program, and the holding and mounting of the component by the component mounting head 28 is repeated as described above to obtain one component. The component mounting operation by the mounting machine 10 is completed. The substrate S for which the component mounting operation has been completed is sent by the substrate conveyor device 24 to the next substrate mounting machine such as the component mounting machine 10. In one component mounting machine 10, the above-described component work is repeatedly performed on a plurality of substrates S. That is, the component mounting machine 10 of this embodiment uses the height of the support surface to control the lowering amount of the suction nozzle 70 during the component mounting operation on the substrate S. It is not necessary to measure the height of the substrate S for each substrate. Therefore, according to the component mounting machine 10, it is possible to shorten the cycle time.

(IV) Substrate Adsorption Determination For example, if the warp of the substrate S becomes too large, a portion that cannot be adsorbed by the substrate support device 50 may occur. In such a case, if the lowering amount of the suction nozzle 70 is controlled based on the height of the support surface, there is a possibility that the components cannot be properly mounted. Therefore, in the component mounting machine 10, it is possible to determine for each substrate S whether or not the substrate support device 50 is reliably sucked and held. Whether or not to make the determination can be switched by an operation by an operator or the like.

More specifically, first, the laser sensor 64 measures the substrate S that has been attracted and held by the substrate support device 50 and raised to a position where the component mounting operation is performed. Specifically, the height of the position on the substrate S corresponding to the plurality of suction ports 52 provided in the backup plate 54, or the height on the substrate S due to components being mounted at that position, etc. When the measurement cannot be performed, the height of the position close to the position corresponding to the suction port 52 is measured by the laser sensor 64. Next, the height of the support surface at the position corresponding to the suction port 52 is obtained from three of the nine measurement points measured previously. Then, at the position corresponding to each suction port 52, the difference between the obtained height of the support surface and the measured height on the substrate S is obtained, and the difference is set to a value larger than the thickness t of the substrate S. If it is greater than the set height difference, it is determined that there is a possibility that the substrate S cannot be adsorbed by the substrate support device 50. In that case, the component mounting operation is stopped and a warning is issued.

The component mounting machine 10 can detect the deficiency of the adsorption of the substrate by the substrate supporting device 50 with high accuracy by performing the above determination. Therefore, according to the component mounting machine 10, it is possible to manufacture a highly accurate product without causing defective mounting of components due to insufficient suction.

<Modification>
In the component mounting machine 10 of the above-described embodiment, the plate-like backup plate 54 is adopted as the support portion of the board support device 50. However, instead of the backup plate 54, a suction port is provided at the upper end. It is also possible to employ a plurality of support pins that support the substrate at its upper end. In the case where the component mounting machine is provided with a substrate support device including such a plurality of support pins, the height of the upper end of each of the plurality of support pins is set before the component mounting operation. , And the amount of lowering of the component holding device can be controlled based on the height of the upper end of each of the support pins.

10: component mounting machine 20: base 22: beam 24: substrate conveyor device 26: component feeder 28: component mounting head [component mounting device] 30: head moving device 32: control device 50: substrate support device 52: suction port 54: suction port 54: Backup plate [support part] 56: Support part lifting device 64: Laser sensor [height sensor]

Claims

(A) A component mounting device that has a component holding device that holds and detaches a component, and lowers the component holding device to mount the component on the board, and (B) a support portion provided with a plurality of suction ports on the upper surface. A component mounting machine including a substrate support device for supporting a substrate by adsorbing a lower surface of the substrate to a support surface that is an upper surface of the support portion using the suction port. A component mounting method for
The height of the support surface is measured before performing a component mounting operation, which is a task of mounting components on a plurality of substrates, and the measured support surface is measured during component mounting operations on the plurality of substrates. A component mounting method, wherein the component holding device is lowered based on a height.
The component mounting method is
Based on the measured height of the support surface and the thickness of each of the plurality of substrates known in advance, the height of the upper surface of each of the plurality of substrates is estimated, and the descending amount of the component holding device is determined. The component mounting method according to claim 1 to be controlled.
The component mounting method is
As the height of the support surface, the height of a plurality of measurement points set on the support surface is measured, and the difference between the heights of two of the plurality of measurement points is set from the set value. The component mounting method according to claim 1, wherein when it is larger, the component mounting operation for the plurality of substrates is not started.
The component mounting method is
For each of the plurality of substrates supported by the substrate support device, the height of the upper surface of each of the substrates is measured, and the difference between the measured height of the upper surface of the substrate and the height of the support surface The component mounting method according to any one of claims 1 to 3, wherein the component mounting operation is stopped when the difference is larger than a set height difference set to a value larger than the thickness of the board.
A component mounting machine for mounting components on a board,
A component mounting device that has a component holding device for holding and releasing the component, and lowering the component holding device to mount the component on the board;
A substrate support device that has a support portion provided with a plurality of suction ports on an upper surface, and supports the substrate by adsorbing a lower surface of the substrate to a support surface that is an upper surface of the support portion using the suction ports;
A control device for controlling the component mounting machine;
The control device is
The height of the support surface is measured before performing a component mounting operation, which is a task of mounting components on a plurality of substrates, and the measured support surface is measured during component mounting operations on the plurality of substrates. A component mounting machine configured to lower the component holding device based on a height.