WO2005027614A1

WO2005027614A1 - Electronic circuit component mounter

Info

Publication number: WO2005027614A1
Application number: PCT/JP2004/012353
Authority: WO
Inventors: Mamoru Tsuda; Yukio Ueno; Takehiro Ido
Original assignee: Fuji Machine Mfg. Co., Ltd.
Priority date: 2003-09-10
Filing date: 2004-08-27
Publication date: 2005-03-24
Also published as: CN1849861A; JP4484823B2; CN1849861B; JPWO2005027614A1

Abstract

An electronic circuit component mounter in which pressing force of a suction nozzle against an electronic circuit component is detected accurately. A load detectors (180) and a feeder are selectively fixed to a feeder supporting base. The load detector (180) is provided with a load cell (190) and detects a load by lowering the suction nozzle (114) and pressing it against the load cell (190). When preset detection executing conditions are satisfied during non-mounting work, the suction nozzle (114) is moved periodically to the load detector (180) and the load is detected. The detected load is stored in a RAM of a microcomputer (220) and transmitted to a PC (240) where a decision is made whether the nozzle is acceptable or not. If the nozzle is defective, or for example, the load is abnormally large, the fact is displayed on a monitor (244) to warn a worker and urge the replacement of the defective nozzle, maintenance, etc. This avoids the production of defective circuit boards that can be caused by the defective nozzle.

Description

Specification

Electronic circuit component mounting machine

Technical field

The present invention relates to an electronic circuit component mounting machine that receives an electronic circuit component from a component supply device by a suction nozzle and mounts the electronic circuit component on a circuit board. In particular, the present invention relates to detection of a load applied to the electronic circuit component by a suction nozzle. It is about.

Background art

[0002] In an electronic circuit component mounting machine, for example, as described in Patent Document 1, a mounting head holding a suction nozzle is moved to an arbitrary position in a horizontal plane by a head moving device, and the head is moved. There is a device that is moved up and down by a lifting device, receives an electronic circuit component from a component supply device by a suction nozzle, and mounts the electronic circuit component on a circuit board. The electronic circuit component is a component that is mounted on a circuit board such as a printed wiring board to form an electronic circuit. The mounting head holds the suction nozzle by the nozzle holder so as to be relatively movable in the axial direction. When receiving the electronic circuit component from the component supply device, the mounting head is moved after the suction nozzle contacts the electronic circuit component. The descent is absorbed by the relative movement of the suction nozzle with respect to the nozzle holder. Also, when the electronic circuit component is mounted on the circuit board, the lowering of the mounting head after the electronic circuit component comes into contact with the circuit board is similarly absorbed. Generally, a spring member is provided between the nozzle holder and the suction nozzle, and the suction nozzle is normally urged in a direction protruding from the nozzle holder. The nozzle holder elastically deforms the spring member while the suction nozzle is elastically deformed. , The mounting head is allowed to descend excessively, and the shock when the suction nozzle contacts the electronic circuit component and the shock when the electronic circuit component contacts the circuit board are reduced, and The pressing force of the suction nozzle against the electronic circuit component is set to an appropriate magnitude.

[0003] When the electronic circuit component is suctioned and attached by the suction nozzle in this way, the relative movement between the suction nozzle and the nozzle holder causes the weight of the suction nozzle, the urging force of the spring member, and the nozzle of the electronic circuit component to move. A force based on the sliding resistance between the holder and the suction nozzle is applied. If this force is not appropriate, electronic circuit components and suction nozzles may be damaged, Insufficient or excessive pressing force of the product on the circuit board prevents proper mounting. Therefore, in the electronic circuit component mounting machine described in Patent Document 1, a load detecting device is provided on the mounting head, and the suction nozzle detects a load applied to the electronic circuit component when receiving the electronic circuit component. The lowering and lowering of the mounting head is controlled so that the load becomes appropriate. The same is true when the suction nozzle mounts electronic circuit components on a circuit board.

Patent Document 1: JP-A-5-191097

Disclosure of the invention

[0004] However, the electronic circuit component mounting machine described in Patent Document 1 has a problem that the pressing force of the suction nozzle against the electronic circuit component cannot be accurately detected. As described above, the pressing force of the suction nozzle against the electronic circuit component is, as described above, a force S, which is equal to the sum of the weight of the suction nozzle, the urging force of the spring member, and the sliding resistance between the suction nozzle and the nozzle holder. By detecting the urging force (elastic force) of a spring member disposed between the suction nozzle and the holder, the pressing force of the suction nozzle against the electronic circuit component is detected. Is acquired. Therefore, only the force obtained by subtracting at least the sliding resistance between the suction nozzle and the nozzle holder (and, in some cases, the weight of the suction nozzle) can be detected from the pressing force of the suction nozzle against the electronic circuit components. If the above-mentioned sliding resistance can be regarded as constant, this problem is not so important. However, in practice, the sliding resistance is ignored due to the invasion of foreign matter between the sliding surfaces and the scratching of the sliding surfaces. The amount may not be obtained. In this case, the pressing force of the suction nozzle against the electronic circuit component becomes excessive, which may cause damage to the suction nozzle / the electronic circuit component or decrease the mounting position accuracy. Therefore, an object of the present invention is to make it possible to accurately detect the pressing force of the suction nozzle against the electronic circuit component in the electronic circuit component mounting machine.

[0005] The above object is achieved by providing an electronic circuit component mounting machine with (0) a component supply device for supplying electronic circuit components, (ii) a circuit board holding device for holding a circuit board, and (iii) an electronic circuit component by negative pressure. A mounting head for receiving an electronic circuit component from the component supply device and mounting the suction nozzle on the circuit board held by the substrate holding device; (Iv) the mounting head, the substrate holding device, and the A mounting relative motion imparting device for imparting a relative motion necessary for mounting the electronic circuit component to the component supply device; and (V) a detecting unit provided separately from the mounting head, wherein the suction nozzle detects the suction noise. (Vi) a load detector that applies a relative motion required for detecting the load to the mounting head and the load detector and presses the suction nozzle against the detector. And (vii) a load detection result utilization device that uses a load detection result obtained by the load detection device.

If the suction nozzle detects the load applied to the detection unit, the suction nozzle can accurately detect the load applied to the electronic circuit component when receiving and mounting the electronic circuit component, and by using this load detection result In addition, reception and mounting of electronic circuit components can be appropriately performed.

Also, since the load detecting device is provided separately from the mounting head, the mounting head can be made lighter than when the mounting head is provided, and the mounting relative motion imparting device imparts motion to the mounting head. In this case, the acceleration and deceleration of the exercise can be increased, and the wearing efficiency can be improved. Further, it is not necessary to secure a space for mounting the mounting head on the load detecting device, and the load detecting device can be shared by a plurality of mounting heads, so that the load can be detected easily and inexpensively. it can.

Furthermore, if the load detecting device is provided on the mounting head, when the mounting relative motion imparting device applies a motion to the mounting head, the load detecting device and the signal extraction circuit therefrom when the motion starts and stops. While an impact may occur, which may lead to a failure, according to the present invention, the impact does not act or may be small, and the occurrence of a failure is satisfactorily avoided. When the load detecting device is kept stationary, no impact is exerted. For example, when the load detecting device is moved together with the component supply feeder, the impact is smaller than when the load detecting device is moved together with the mounting head. Since the load detection device is provided separately from the mounting head, the load is not detected each time electronic circuit components are received or mounted due to suction noise, but is detected at a different time from those mounting operations. It is desirable that Since the sliding resistance between the suction nozzle and the nozzle holder hardly changes suddenly, it is not necessary to detect the load during mounting work and control the movement of the mounting head. The electronic circuit components can be mounted without any trouble by using the load detected at another time.

[0007] In the following, the inventions that are recognized as being claimable in the present application (hereinafter, may be referred to as "claimable inventions." The claimable inventions are at least the inventions described in the claims. The present invention includes the "invention" or "the invention of the present application, but may also include a subordinate invention of the present invention, a superordinate concept of the present invention, or an invention of another concept.) Will be described. As in the case of the claims, each aspect is divided into sections, each section is numbered, and if necessary, the form is cited in a form in which the numbers of other sections are cited. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combination of the constituent elements constituting the claimable invention to those described in the following items. In other words, the claimable invention should be interpreted in consideration of the description attached to each item, the description of the examples, and the like, and other components are added to the embodiments of each item as long as the interpretation is followed. The embodiments and the embodiments in which the constituent elements are deleted from the embodiments of the respective sections can also be one embodiment of the claimable invention.

[0008] In the following items, items (1) to (19) correspond to claims 1 to

Equivalent to 19.

(1) A component supply device for supplying electronic circuit components,

A circuit board holding device for holding a circuit board,

A suction holder for holding the electronic circuit component by sucking and holding the electronic circuit component by the negative pressure so as to be relatively movable in the axial direction; receiving the electronic circuit component from the component supply device; and mounting the electronic component on the circuit board held by the board holding device. A mounting head to be mounted,

A mounting relative motion imparting device for imparting a relative motion required for mounting an electronic circuit component to the mounting head, the substrate holding device, and the component supply device;

A load detecting device that is provided separately from the mounting head with a detecting unit and detects a load applied by the suction nozzle to the detecting unit;

A relative motion imparting device for applying a relative motion required for detecting the load to the mounting head and the load detecting device, and pressing the suction nozzle against the detecting portion; a load detection result by the load detecting device; And a load detection result utilization device using Electronic circuit component mounting machine.

[0010] (2) The load detection relative motion imparting device is controlled to contact the suction nozzle with the detection unit, and the load detection device detects a load applied by the suction nozzle to the detection unit at the time of the contact. The electronic circuit component mounting machine according to item (1), including a control unit.

The load detection control unit is configured to include, for example, a load detection relative motion imparting device control unit that controls the load detection relative motion imparting device, and a load detection device control unit that controls the load detection device. These control units may be configured by different control devices or may be configured by the same control device.

Based on the control by the load detection control unit, the mounting head and the load detection device are relatively moved to detect the load.

(3) The load detection control unit may be configured to perform the load detection relative movement imparting device and the load detection relative motion control unit when the electronic circuit component mounting machine is not performing the work of mounting the electronic circuit component on the circuit board. The electronic circuit component mounting machine according to the above mode (1) or (2), including a non-mounting work load detection control unit for causing the load detection device to detect the load.

The non-mounting work load detection control unit starts the mounting work of one lot of circuit boards, starts the operation after the machine stops for more than the set time, every set operation time, every set number of components, and the set number of boards. When a predetermined condition such as each mounting is satisfied, the load detection device can be made to perform load detection.

According to the electronic circuit component mounting machine of this mode, the load is periodically detected. Therefore, for example, it is easy to maintain the electronic circuit component mounting machine in a state in which the electronic circuit component can be properly received and mounted, and the load is detected each time the electronic circuit component is received and mounted. Compared to the case, the time required for component mounting work is shorter, the load is detected accurately while avoiding the efficiency of the mounting work, and the receiving and mounting of electronic circuit components is appropriate by using the detection result. Can be done. Furthermore, the effect of reducing the number of maintenance steps can be obtained. If the load is not detected, frequent maintenance is necessary to avoid the occurrence of abnormalities, and the number of maintenance increases.If the load applied by the suction nozzle is detected periodically, Based on the detection results, it is possible to predict the occurrence of load abnormalities and reduce the number of maintenance operations. It can be eliminated.

(4) The electronic circuit component mounting machine according to any one of (1) to (3), further including a load detection result recording unit that records a load detection result by the detection unit.

The load detection result recording unit shall include a detected load recording unit that records the detected load itself, and a post-processing information record that records the result of statistically processing the detected load and the result of pass / fail judgment. Part.

If the load detection result is recorded, the result can be easily used. For example, the load detection result can be used at a different time from the time of detection. It is not necessary to use this function every time a load is detected.For example, the load is detected multiple times for one suction nozzle, all the detection results are recorded, and the average value is calculated. If it is installed or the mounting head holds multiple suction nozzles, the load can be detected for each of the multiple suction nozzles at once, and the detection results can be used to improve the efficiency of detection and use. Can do well. Even when the load detection result is used at the time of detection, if the detection result is recorded in the recording unit, it can be further used later.

In addition, it is easy to provide a load detection result utilization device separately from the component supply device, the circuit board holding device, the mounting head, the mounting relative motion imparting device, the load detecting device, and the load detecting relative motion imparting device. This is because if the load detection result is recorded, the device that uses the load detection result only needs to acquire the load detection result from the load detection result recording unit and has little relation to other components of the electronic circuit component mounting machine. .

(5) The electronic circuit component mounting machine according to (4), wherein the load detection result recording unit is provided in the load detection device.

According to the electronic circuit component mounting machine described in this section, for example, load detection and recording are performed by the load detection device, and recording is easily performed in response to the detection.

[0013] (6) The load detection result recording unit records a change in load over time in one contact of the suction nozzle with the load detection device, and a detected load. The electronic circuit component mounting machine according to the above mode (4) or (5), further comprising a detection load recording timing restriction section that restricts at least one of recording start timing and recording end timing of the detection load on the recording section. According to the electronic circuit component mounting machine described in this section, the recording amount can be reduced as compared with the case where the entire detected load is recorded, and the detected load recording section can be made inexpensive with a small capacity. Alternatively, the number of suction nozzles on which the load detection result is recorded can be increased, or the number of times of detection per suction nozzle can be increased.

(7) The detection load recording timing restriction unit sets the recording start timing to a timing before the contact start timing of the suction nozzle to the detection unit, and sets the recording end timing to the contact start timing. (6) The electronic circuit component mounting machine according to the above mode (6), wherein the timing is set later and before the end of the relative movement for detecting the load between the mounting head and the detector. According to the electronic circuit component mounting machine described in this section, the load at least when the suction nozzle starts to contact the detection unit is recorded. Since the load detected at the time when the load is most likely to be the largest is recorded, an excessive load can be reliably recorded.

(8) The load detection result utilization device is a detection result analysis unit for analyzing a load detection result by the load detection device, and at least (a) a maximum value and a minimum value of the detected load, Determining a preset load, such as the load at the end of relative movement with the load detector, (b) examining the tendency of the load to change during relative movement between the mounting head and the load detector, and (c) The electronic circuit component mounting machine according to any one of the above modes (1) to (7), which performs at least one of obtaining a state and a characteristic of a suction nozzle represented by them. According to the electronic circuit component mounting machine described in this section, for example, if suction nozzles can be used, if the suction nozzles cannot be used, it is possible to investigate what is the cause.

(9) The electronic circuit component according to any one of (1) to (8), wherein the load detection result utilization device includes a nozzle abnormality warning unit that warns of an abnormality of the suction nozzle based on the load detection result. Mounting machine.

If an alarm is detected on the suction nozzle, for example, the operator may replace the suction nozzle with a normal suction nozzle or perform maintenance if the error warning nozzle is actually held by the mounting head. By performing the above process, it is possible to prevent the abnormal suction nozzle from being used abnormally for mounting and producing a defective circuit board. An instruction to replace the suction nozzle or maintenance may be issued together with the abnormality warning or as a type of abnormality warning. In this case, the load detection result utilization device is used for the nozzle replacement It will include a sense instruction unit.

(10) The electronic device according to any one of (1) to (9), wherein the load detection result utilization device includes a nozzle quality determination unit that determines the quality of the suction nozzle based on the load detection result. Circuit component mounting machine.

For example, by comparing the detected load with a set value, it is determined whether the suction nozzle is a non-defective nozzle or a defective nozzle. If the detected load is abnormally large, the load applied to the electronic circuit components by the suction nozzle becomes excessive, which may damage the electronic circuit components and the circuit board, and the suction nozzle is considered to be a defective nozzle. Conversely, even if the detected load is abnormally small, for example, the suction force applied to the electronic circuit component by the suction nozzle may be insufficient, and the electronic circuit component may not be properly received or mounted. It is considered a bad noise. In any case, if the quality of the suction nozzle is determined, it can be determined whether the suction nozzle is a defective nozzle, and the production of a defective substrate due to the use of the defective nozzle can be avoided.

(11) The electronic circuit according to any one of (1) to (10), wherein the load detection result utilization device includes a nozzle use prohibition unit that prohibits use of the suction nozzle based on the load detection result. Component mounting machine.

The use of suction nozzles is prohibited, for example, for suction nozzles currently held by the mounting head. Even if the suction nozzles are still held by the mounting head, they are used for mounting electronic circuit parts. Will not be. Alternatively, the use of suction nozzles not held by the mounting head when the load detection result is used is prohibited, and thereafter, the suction head is held by the mounting head so as not to be used for mounting work.

The nozzle use prohibition can be performed by various methods such as storing the use prohibition data in association with data that can individually specify the suction nozzles, such as a nozzle ID, and displaying the data as a use prohibition nozzle on a display device. Done in an embodiment.

(12) A display device, wherein the load detection result utilization device includes a load detection result display unit for displaying the load detection result by the load detection device on the display device (1) or (11). An electronic circuit component mounting machine as described in Crab.

The load detection result display section statistically processes raw load, raw load, which is the detected load itself. After that, the processing load, suction nozzle abnormal warning, suction nozzle good / bad judgment result, use prohibition of suction nozzle, etc. can be displayed on the display device.

If the load detection result is displayed, it becomes easy to respond to the detection result that makes it easy for the worker to sway.

(13) The load detection result utilization device is provided separately from the control device that controls the mounting relative motion imparting device, and is provided in an external device capable of receiving the load detection result from the load detection device (1). Receiving the load detection result from the electronic circuit component mounting machine load detecting device described in any of paragraphs (12) to (12) can be performed in various modes, for example, by wire communication using a communication cable. It may be performed by radio communication or by wireless communication.

The load detection result utilization device may be provided in the control device that controls the mounting relative motion imparting device, and may be provided in the control device that controls the load detection device if provided. If the load detection result utilization device is provided in an external device as in the electronic circuit component mounting machine described in this section, for example, the load detection result utilization device is mounted in parallel with the electronic circuit component mounting operation in the electronic circuit component mounting machine. Or by sharing it with a plurality of electronic circuit component mounting machines to reduce the cost required to use the load detection results.

(14) The electronic circuit component mounting machine according to any one of (1) to (13), wherein the mounting relative motion imparting device also functions as the load detecting relative motion imparting device.

According to the electronic circuit component mounting machine described in this section, it is possible to easily and inexpensively configure the electronic circuit component mounting machine for detecting the load of the suction noise.

(15) The electronic circuit component mounting machine according to any one of (1) to (14), wherein the detection section of the load detection device includes a load cell.

(16) In the detecting unit, one of two surfaces opposite to each other is a nozzle contact surface that is larger than the suction surface of the suction nozzle, and the other surface is a contact unit that contacts the input unit of the load cell in a spot shape. The electronic circuit component mounting machine according to the above mode (15), further comprising: a transmission body that is capable of swinging around a contact portion thereof.

The shape of the suction surface is not limited to a circle, but various shapes such as ellipse, rectangle, square, etc. can be adopted. Noh. The nozzle contact surface is larger than the suction surface regardless of the shape and size of the suction surface. According to the electronic circuit component mounting machine described in this section, even if the input portion of the load cell is small and the suction surface is large, the load can be detected and detected by the load cell, and a plurality of types having different suction surface sizes can be obtained. Can be used as a common load detecting device. In addition, the transmitting body is swingably contacted with the input portion of the load cell. For example, even if the suction surface is worn and the surface is slightly inclined with respect to the axis of the suction nozzle, the transmitting body can swing. It can move and apply force to the input part of the load cell at almost the same position as the center of the suction surface.

(17) The electronic circuit component mounting machine according to any one of (1) and (16), wherein the load detection device is detachably attached to the electronic circuit component mounting machine.

If the load detecting device is detachably mounted, for example, the load detecting device can be shared between a plurality of the same type of electronic circuit component mounting machines or different types of electronic circuit component mounting machines. If the load detector is attached to the electronic circuit component mounting machine at the time of load detection, it can be removed at the time of non-detection and can be used to detect the load at another electronic circuit component mounting machine. It is not essential to provide a load detection device for each component mounting machine, and the cost required for load detection can be reduced.

In addition, the load detection device only needs to be detachably mounted on the electronic circuit component mounting machine, and the mounting configuration can be simplified as compared with the case where the load detection device is fixedly mounted on the electronic circuit component mounting machine. It is also possible to reduce costs.

Furthermore, after removing the load detecting device, the mounting space can be used for mounting other components of the electronic circuit component mounting machine, or the mounting space of another component can be used for mounting the load detecting device. It is not essential to provide a dedicated space for providing the load detecting device, and the load detecting device can be provided while effectively utilizing the space of the electronic circuit component mounting machine. .

When the load detecting device is detachably attached to the electronic circuit component mounting machine as described above, it is particularly effective that the load detecting result storage section is provided in the load detecting device as described above. In this case, the load detection device has a detection unit and a load detection result storage unit. This is because the electronic circuit component mounting machine can share not only the detection unit but also the load detection result storage unit.

Further, it is effective to combine the aspect in which the load detection result utilization device is provided in an external device with this item. For example, if the load detection device is fixed to the electronic circuit component mounting machine so as to be non-detachable, it becomes a dedicated load detection device, and the control device that controls the mounting relative motion imparting device uses the load detection result utilization device. Although it is easy to provide and use a load detection device, if it is provided detachably, the load detection device may be shared by multiple electronic circuit component mounting machines. This is because, by providing the external device so that it can be shared by a plurality of electronic circuit component mounting machines, it is possible to enjoy the effect of reducing both the load detection cost and the load detection result utilization cost. Further, when the load detection result utilization device is provided in an external device, the degree of freedom in installing the external device increases. It is a force that can remove the load detection device from the electronic circuit component mounting machine and connect it to an external device that is not restricted by the configuration of the electronic circuit component mounting machine to supply the load detection result.

(18) The electronic circuit component mounting machine according to the above mode (17), wherein the load detection device is removably mounted on a component supply device so that the load detection device is removably mounted.

The mounting head is moved relative to the component supply device by the mounting relative motion imparting device to receive the electronic circuit component from the component supply device. Therefore, if the load detection device is mounted on the component supply device, the load detection device will be located within the relative movement area between the mounting head and the component supply device, and by using the mounting relative motion imparting device, It is easy to give the mounting head and the load detector a relative motion required for detecting the load.

Also, for example, when a load is detected at a different time from the mounting operation, the load detector is removed from the component supply device except when the load is detected, and the load detector is not attached. As in the case described above, the electronic circuit components can be supplied, and the load can be detected without causing a decrease in the supply efficiency or the like due to the attachment of the load detecting device.

Furthermore, a load detection device is installed using the existing equipment of the electronic circuit component mounting machine. And it is easy to suppress the load detection cost.

(19) The component supply device includes a plurality of component supply feeders and a feeder support member, and the load detection device is selectively detachable from at least one of the plurality of component supply feeders to the feeder support member. The electronic circuit component mounting machine according to (18).

The plurality of component supply feeders are each detachably attached to the feeder support member, but the load detection device is selectively attached to and detached from at least one of the component supply feeders. The load detecting device can be mounted instead of a plurality of component supply feeders, or can be mounted instead of one of the component supply feeders. Further, it may be selectively detachable with only a specific one of the plurality of component supply feeders, or may be selectively detachable with any of the plurality of component supply feeders.

In any case, the load detection device can be attached to the feeder support member by using the attachment device of the component supply feeder. The load detecting device can be attached to the existing mounting portion of the feeder support member and the mounting device for mounting the component supply feeder to the mounting portion.The load detecting device can be attached to the electronic circuit component mounting machine. Installation of a dedicated mounting device for mounting can be omitted, and the mounting can be easily and inexpensively performed. If a load is detected at a different time from the mounting operation, and if the load detector is removed from the feeder support member during the mounting operation, secure space for attaching the load detector to the feeder support member. Is no longer essential. If the load detector is attached to the electronic circuit component mounting machine at the time of load detection, providing a dedicated mounting section on the mounting machine body is wasteful in terms of space and cost. In addition, a load detection device can be provided. Further, if the component supply device is an electronic circuit component mounting machine including a component supply feeder and a feeder support member, the load detection device can be shared, and the sharing range is widened and sharing is easy.

Brief Description of Drawings

FIG. 1 is a plan view showing an electronic circuit component mounting machine according to an embodiment of the present invention.

FIG. 2 is a front view (partial cross section) showing a component mounting device of the electronic circuit component mounting machine.

FIG. 3 is a side view (partial cross section) showing a mounting head of the component mounting apparatus and a periphery thereof. The

FIG. 4 is a side sectional view showing a nozzle holder and a suction nozzle of a mounting head of the component mounting apparatus.

FIG. 5 is a side view (partially cut away) showing a load detection device that detects a load applied by the suction nozzle.

FIG. 6 is a side view (partial cross section) showing a load cell and a transmission plate of the load detection device.

FIG. 7 is a block diagram schematically showing a microcomputer provided with the load detection device.

FIG. 8 is a block diagram schematically showing a control device for controlling the electronic circuit component mounting machine.

FIG. 9 is a graph showing the relationship between the load of suction sticks detected by the load detection device and the descending distance, and the load detection and recording timing.

FIG. 10 is a graph for explaining setting of set values for judging pass / fail of a suction nozzle based on a load detected by the load detecting device.

Explanation of symbols

[0021] 10: Mounting machine body 14: Printed wiring board holding device 16: Component mounting device 18: Component supply device 24: Control device 30: Printed wiring board 38: Feeder support base 40: Tape feeder 46: Electronic circuit component 50: Mounting head 52: XY robot 54: Head elevating device 114: Suction nozzle 132: Nozzle holder 180: Load detector 190: Strain gauge type load cell 192: Input device 200: Transmission plate 208: Nozzle contact surface 220: Microcomputer 240: Personal computer

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an electronic circuit component mounting machine according to an embodiment of the present invention. In this electronic circuit component mounting machine, the mounting head is moved to an arbitrary position in a plane parallel to the surface of the printed wiring board, receives the electronic circuit component from the component supply device, and mounts the electronic circuit component on the printed wiring board. For example, as already known in Japanese Patent No. 2824378, etc. It is explained briefly.

As shown in FIG. 1 and FIG. 2, the electronic circuit component mounting machine includes a bed 10 constituting a mounting machine main body, a wiring board transport device 12 provided on the bed 10, and a printed wiring board holding device 14. A component mounting device 16, a component supply device 18, a wiring board imaging system 22, and a control device 24 (see FIG. 8) for controlling these devices are provided.

In this embodiment, the printed wiring board 30 as a circuit board is transported in a horizontal posture by the wiring board transport device 12, and is stopped at a predetermined mounting work position by a stop device (not shown). At the same time, the mounting surface is held by the printed wiring board holding device 14 in a horizontal posture. The transport direction of the printed wiring board 30 is defined as the X-axis direction, and the direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction. The printed wiring board holding device 14 includes a printed wiring board support device and a clamp device (not shown), and is provided in a fixed position.

As shown in FIGS. 1 and 2, the component supply device 18 is provided on one side of the wiring board transport device 12 at a fixed position and stationary. The component supply device 18 is known in Japanese Patent No. 2824378, Japanese Patent Application Laid-Open No. H10-112598, and will be described briefly.

[0026] The component supply device 18 includes a feeder support 38 as a feeder support member, and a plurality of tape feeders (hereinafter referred to as feeder support) as component supply feeders, which are a type of component supply tool mounted on the feeder support 38. Abbreviated). Each of the plurality of feeders 40 is provided with a mounting portion (not shown), is positioned in the width direction and the front-back direction, and is prevented from floating. It is detachably attached to an attachment portion (for example, including a slot). The feeder mounting portion is provided with a mounting device for fixing the feeder 40 to the feeder support base 38 in cooperation with the mounting portion provided on the feeder 40. These feeder mounting portions and the like are configured in the same manner as, for example, the feeder mounting portion and the like described in JP-A-9-29550.

In the present embodiment, the feeder 40 supplies an electronic circuit component 46 (see FIG. 2; hereinafter, abbreviated as the component 46) to a taping electronic circuit component by holding it on a carrier tape (not shown). It has been. The taping electronic circuit components are sent by the feeding device, and the components 46 are sequentially positioned in the component supply unit. In this embodiment, a plurality of feeders 4 Numeral 0 is attached to the feeder support base 38 in a state where the component supply units are located on a straight line parallel to the X-axis direction.

As shown in FIGS. 1 and 2, the component mounting device 16 mainly includes a mounting head 50 and an arbitrary mounting head 50 in an arbitrary horizontal plane which is a plane parallel to the mounting surface of the printed wiring board 30. An XY robot 52 as a mounting head moving device for moving to a position, a head elevating device 54 for raising and lowering the mounting head 50, and a head rotating device 56 for rotating the mounting head 50 about an axis are provided.

As shown in FIG. 1, the XY robot 52 includes an X-axis slide 60 as a moving member, an X-axis slide moving device 62, a Y-axis slide 64 as a moving member, and a Y-axis slide moving device 66. . The X-axis slide moving device 62 includes an X-axis slide drive motor 68, a ball screw 70, and a nut 71 (see FIG. 2), and moves the X-axis slide 60 in the X-axis direction. The moving device 72 is configured. The Y-axis slide 64 and the Y-axis slide moving device 66 are provided on the X-axis slide 60. The Y-axis slide movement device 66 includes a Y-axis slide drive motor 76, a ball screw 78, and a nut 80, and moves the Y-axis slide 64 in the Y-axis direction to form a Y-axis movement device 82 together with the Y-axis slide 64. I'll do it.

The mounting head 50, the head elevating device 54, and the head rotating device 56 are provided on a Y-axis slide 64, as shown in FIG. The head elevating device 54 includes a nut 90, a ball screw 92 screwed to the nut 90, and a head elevating motor 94 as a driving source. The nut 90 is driven by the head elevating motor 94 via a gear train 96. The ball screw 92 is raised and lowered by being rotated. The head rotation device 56 includes a spline shaft 102 and a head rotation motor 104 (see FIG. 7) which are provided integrally below the spline member 100 and the ball screw 92 and are fitted to the spline member 100. The spline shaft 102 is rotated by rotating the member 100 by the head rotation motor 104 via the gear train 106.

As shown in FIG. 4, a suction nozzle 114 is detachably held at the lower end of the spline shaft 102 by a chuck adapter 110 and a chuck 112. The suction nozzle 114 includes a nozzle body 116 as a main body and a suction tube 118 forming a suction unit, and suctions and holds the component 46 by negative pressure. The cross-sectional shape of the adsorption tube 118 is circular in this embodiment. The leading end surface forms the suction surface 120.

The chuck adapter 110 has a generally cylindrical shape, and is detachably fixed to the lower end of the spline shaft 102. The chuck 112 also has a generally cylindrical shape, and is detachably fixed to the outside of the chuck adapter 110. The nozzle body 116 of the suction nozzle 114 has a cylindrical shape, is fitted into the chuck adapter 110 so as to be relatively movable in the axial direction, and is held by the chuck 112 so as to be relatively non-rotatable and relatively movable in the axial direction. I have. The suction nozzles 114 are urged by a compression coil spring 124 as an elastic member, which is a kind of an urging device, disposed between the chuck adapter 110 and the chuck adapter 110 in a direction in which the chuck adapter 110 is pulled out. A pair of inclined surfaces 128 provided on a pair of ears 126 of the nozzle body 116 and located on the same plane with each other engage with a pair of pins 130 provided on the chuck 112, thereby attracting. The nozzle 114 is held by the chuck 112 so as to be relatively movable in the axial direction and not to rotate relatively.

In the present embodiment, the chuck adapter 110 and the chuck 112 constitute a nozzle holder 132, and constitute a mounting head 50 together with the lower end of the spline shaft 102. The suction nozzles 114 can compress the springs 124 and relatively move in the axial direction with respect to the nozzle holder 132, and the relative movement is guided by the fitting of the nozzle body 116 to the chuck adapter 110. You. The outer peripheral surface of the nozzle body 116 constitutes the guided surface 134, and the inner peripheral surface of the chuck adapter 110 constitutes the guide surface 136. The mounting head 50 is raised and lowered by raising and lowering the ball screw 92 of the head lifting and lowering device 54, and is rotated by rotating the spline shaft 102 of the head rotating device 56. Thus, the suction nozzle 114 is moved up and down and rotated.

[0034] The wiring board imaging system 22 is provided on the Y-axis slide 64 as shown in FIG. The wiring board imaging system 22 includes a wiring board imaging device 140 (see FIG. 8) and a lighting device (not shown), is moved by an XY robot 52, and is provided on a mounting surface of the printed wiring board 30, for example. Image fiducial mark 142 (see Fig. 1). Based on this imaging result, the position error in each horizontal plane of a plurality of component mounting points set on the mounting surface of the printed wiring board 30 is obtained.

As shown in FIG. 2, a component imaging system 150 is provided on the X-axis slide 60. Yes. The component imaging system 150 includes a component imaging device 152, a light guide device 154, and a lighting device 156, captures an image of the component 46 held by the suction nozzle 114, and selectively acquires a front image and a projection image of the component 46. It is configured as follows. Based on this imaging result, the holding position error (including the position error and the rotational position error in the X-axis and Y-axis directions of the suctioned position of the component 46) by the suction nozzle 114 is acquired by the suction nozzle 114.

[0036] As shown in Fig. 1, a load detecting device is provided on the feeder support 38 of the component supply device 18.

180 can be attached detachably. The load detecting device 180 is provided separately from the mounting head 50. In the present embodiment, the device main body 182 of the load detecting device 180 is configured similarly to the feeder main body of the feeder 40, and has a generally elongated plate shape. As shown in FIG. A mounting portion 184 for mounting to the feeder mounting portion is provided. The mounting portion 184 is configured similarly to the mounting portion provided on the feeder body. The load detection device 180 can be mounted on any of the feeder mounting portions provided on the feeder support 38, and can be selectively attached to and detached from the feeder support 38 with the feeder 40. It is attached to the feeder support 38 by using the attachment device provided in the, so that it is detachably attached to the bed 10. In this embodiment, the mounting position of the load detecting device 180 is set at one end in the X-axis direction of the feeder support base 38, and is mounted on the feeder support base 38 when detecting a load applied by a suction nozzle 114 described later. The configuration of the mounting portion 184 is already well known, for example, as described in Japanese Patent No. 3397900, and description thereof is omitted.

[0037] A strain gauge type load cell (hereinafter abbreviated as load cell) 190 is provided at the front of the apparatus main body 182, and constitutes a detection unit. As shown in FIG. 6, the input part 192 constituting the input part of the load cell 190 has a partially spherical outer peripheral surface at its tip end and is formed to protrude upward. And a load is applied. The input element 192 is provided integrally with a sensing column (not shown) as a sensing member housed in the casing 194. The sensing column is made of an elastic body, and a plurality of strain gauges are attached.When a load is applied to the input 192, the sensing column is compressed, and the strain of the strain gauge is converted into an electric signal by a bridge circuit. It is converted and output. [0038] A transmission plate 200 as a transmission body is brought into contact with the input element 192. In the present embodiment, the transmission plate 200 has a generally disk shape, and is provided with a projection 202 having a partially spherical outer peripheral surface at the center thereof, and as shown in FIG. A recess 204 provided at the projecting end of the portion 202 is fitted to the input terminal 192 of the load cell 190. The bottom surface of the concave portion 204 is in contact with the input element 192, the force projection 202 is separated from the casing 194, and the transmission plate 200 is swingably contacted with the input element 192. Movement of the transmission plate 200 in a direction parallel to the plate surface is restricted by the engagement of the recess 204 with the input element 192.

[0039] The diameter of the transmission plate 200 is larger than the outer diameter of the suction surface 120 of all types of suction nozzles 114 whose load is detected by the load cell 190, and the upper surface of the transmission plate 200 is Make up. Reference numeral 210 denotes a regulating member, which is provided with a regulating portion 212 extending above the transmission plate 200, and is provided in plurality to regulate the swing limit of the transmission plate 200.

[0040] At the rear of the device main body 182 of the load detecting device 180, as shown in Fig. 5, a microcom- puter 220 is provided. As shown in FIG. 7, the microcomputer 220 includes a CPU 22, a ROM 224, a RAM 226 and a bus connecting them. The load cell 190 is connected to the input / output interface 230 connected to the bus, and an electric signal corresponding to the magnitude of the load applied to the load sensor 190 is input. The microcomputer 220 takes in the electric signal and converts it into a load. In this embodiment, the part of the microcomputer 220 that performs this conversion constitutes a load detecting device 180 together with the load cell 190. The microcomputer 220 also constitutes a control device for controlling the load detection device 180.

A personal computer (hereinafter abbreviated as “PC”) 240 as an external device is connected to the input / output interface 230 via a communication cable 242 (see FIG. 5). The communication cable 242 forms a communication line which is a kind of communication means. For example, the communication cable 242 is a kind of a standard interface for data transmission, and is provided by an RS-232C cable as a standard interface for serial data transmission. It is connected to PC240 via USB-RS232C converter 243 (see Fig. 5). In the connected state, the microcomputer 2 Data transmission is performed by communication between the PC 20 and the PC 240, and the PC 240 can receive the load detection result. The PC 240 is provided separately from the control device 24. As shown in FIG. 5, the PC 240 includes a monitor 244 as a display device and a keyboard 246 as an input device, and controls the monitor 244 via a control circuit (not shown). The PC 240 is an external computer provided outside the main part of the electronic circuit component mounting machine such as the component mounting device 16. The load detection device 180 is connected to an external computer, and the PC 240 performs a noise determination based on the load detection result and displays the load detection result on a monitor 244 serving as an external display device.

As shown in FIG. 8, the control device 24 for controlling the electronic circuit component mounting machine includes a CPU 260, a ROM 252, a RAM 254, and a computer 260 having a bus connecting them (hereinafter referred to as a mounting control computer 260). ). An input / output interface 262 is connected to the bus, and an image for processing image data obtained by each imaging of the wiring board imaging device 140 of the wiring board imaging system 22 and the component imaging device 152 of the component imaging system 150. Various sensors such as a processing computer 268, 270, a wiring board imaging device 140, a component imaging device 152, an encoder 272, and an input device 274 are connected. When the load detecting device 180 is mounted on the feeder support base 38, the microcomputer 220 is connected to the mounting control computer 260. The input device 274 is composed of, for example, a keyboard. The microcomputer 220 and the mounting control computer 260 are connected by a signal line.

The input / output interface 262 is also connected via a drive circuit 276 to various actuators and the like constituting a drive source of the wiring board transport device 12 and the like. In these devices 12, etc., the motor constituting the drive source is a type of actuator, and in this embodiment, it is an electric rotary motor which is a type of electric motor, and a servo capable of controlling the rotation angle with high accuracy. A driven member, such as the mounting head 50, which is often composed of a motor, is moved to an arbitrary position based on the driving of the motor. A step motor may be used instead of the servo motor. The rotation angles of these motors are detected by an encoder serving as a rotation angle detection device, and the motors are controlled based on the detection results. FIG. 8 shows one of these encoders, which detects the rotation angle of the head elevating motor 94. Coda 272 is representatively shown. An encoder is a kind of an operation amount detection device or an operation position detection device that detects an operation amount or an operation position of a member driven by a power drive source such as a motor. The ROM 254 and the RAM 256 store various programs and data, such as a basic operation program of the electronic circuit component mounting machine, a component mounting work program corresponding to the printed wiring board 30 to be worked, and the like. .

Next, the operation will be described. The mounting operation of mounting the component 46 on the printed wiring board 30 is described in the above-mentioned Patent No. 2824378 or the like, so that the overall description is simplified, and the details and parts related to the present invention which can be claimed are detailed. Will be described.

During the mounting operation, the mounting head 50 is moved to the component supply device 18 by the XY robot 52, and receives the component 46 from one of the plurality of feeders 40. At this time, the mounting head 50 is lowered by the head lifting / lowering device 54, but is further lowered a further small distance after the suction pipe 118 of the suction nozzle 114 comes into contact with the component 46 on the suction surface 120, so that the suction nozzle 114 is securely moved. The part 46 is sucked. The excessive lowering of the mounting head 50 is allowed by the compression of the spring 124, and is lowered with respect to the force of the nozzle holder 132 and the mounting nozzle 114, and the shock when the suction nozzle 114 collides with the component 46 is reduced. In addition, the pressing force of the suction nozzle 114 against the component 46 is set to an appropriate magnitude.

For this reason, a force is applied to the component 46 based on the weight of the suction nozzle 114, the urging force of the spring 124, and the sliding resistance between the nozzle holder 132 and the suction nozzle 114. The weight of part 46 is so small that it is ignored. The descending distance of the mounting head 50 after the suction nozzle 114 comes into contact with the component 46 is set according to the magnitude of the pressing force that presses the component 46 when the suction nozzle 114 suctions the component 46. Further, the descending speed and the acceleration / deceleration are set to such a value that the mounting head 50 smoothly starts descending and stops. Then, a negative pressure is supplied to the suction nozzle 114 with the lowering of the mounting head 50, and the suction nozzle 114 comes into contact with the component 46 and sucks and holds the component 46 by the negative pressure. 46 is removed from feeder 40.

The mounting head 50, which has received the component 46 with the feeder 40, is moved to the printed wiring board 30 by the XY robot 52 and mounted at a predetermined component mounting point. At this time, the reference mark 142 The position error of the component mounting point obtained based on the imaging and the holding position error of the component 46 by the suction nozzle 114 obtained based on the imaging of the component 46 by the component imaging device 152 are corrected, and the component 46 is printed. Attached to 30.

When the component 46 is mounted, the mounting head 50 is lowered by a predetermined distance by the head elevating device 54, and is lowered by a small distance even after the component 46 is brought into contact with the mounting surface of the printed wiring board 30. Then, the component 46 is pressed against the printed wiring board 30 by the suction nozzle 114. The extra downward movement of the mounting head 50 is allowed by the compression of the spring 124, and the component 46 includes the own weight of the suction nozzle 114, the urging force of the spring 124, and the sliding resistance between the suction nozzle 114 and the nozzle holder 132. Power is applied. In this embodiment, in order to simplify the description, the spring 124 is the same even if the type of the suction nozzle 114 is different, and the urging force of the spring 124 attached to the component 46 is set at the time of suction and mounting. It is assumed that the same is true for different types of parts 46. The lowering distance of the mounting head 50 after the suction nozzle 114 comes into contact with the component 46 or the component 46 comes into contact with the printed wiring board 30, and the relative movement distance between the suction nozzle 114 and the nozzle 132 is constant. It is. In addition, it is assumed that the descending speed and the acceleration / deceleration are the same at the time of attachment and at the time of suction.

As described above, the suction nozzle 114 presses the component 46 both when the suction nozzle 114 receives the component 46 from the feeder 40 and when the component 46 is mounted on the printed wiring board 30. Abnormalities may occur. For example, if foreign matter enters between the guided surface 134 of the nozzle body 116 and the guide surface 136 of the chuck adapter 110, or if at least one surface is squeezed, the suction nozzle 114 and the nozzle holder 132 During this time, the sliding resistance increases, the pressing force becomes excessive, and the suction nozzle 114, the component 46, and the printed wiring board 30 may be damaged. Even when twisting occurs, the sliding resistance increases. The pressing force may be abnormally small. For example, when the spring constant urging the suction nozzle 114 is so low that the spring constant decreases, the urging force decreases and the pressing force becomes insufficient.

[0050] Therefore, in the present electronic circuit component mounting machine, the load applied by the suction nozzle 114 is periodically detected during the non-mounting operation in which the component 46 is not mounted on the printed wiring board 30. If there is an abnormality, a warning is issued. In this embodiment, the load detection is performed. The outgoing execution condition is selected by the operator. For example, at the start of the mounting work on one lot of printed wiring boards 30, at the start of the operation after the mounting machine has been stopped for more than the set time, at the set operating time, at each time the fixed number of components are mounted, and at the set number of printed wiring boards 30 The operator selects one of the detection execution conditions for each mounting of the component 46, and the mounting operation is not performed during the detection. Regardless of which condition is selected, the load detecting device 180 is attached to the feeder support 38 at the time of load detection.

Hereinafter, detection of the load applied by the suction nozzle 114 will be described.

The load is detected by the load detecting device 180. For this purpose, the load detecting device 180 is mounted on the feeder support base 38, and the microcomputer 220 is connected to the mounting control computer 260 and the PC 240. At the time of non-mounting work and at the selected load detection time, the mounting head 50 is moved by the XY robot 52 to the load detecting device 180 mounted on the feeder support 38. Then, with the suction nozzle 114 positioned right above the load cell 190, the mounting head 50 is lowered by the head lifting / lowering device 54, and the suction nozzle 114 is brought into contact with the nozzle contact surface 208 of the transmission plate 200. Thereafter, the mounting head 50 is lowered, and a load based on the weight of the suction nozzle 114, the urging force of the spring 124, and the sliding resistance is applied to the input element 192 of the load cell 190, similarly to the component 46.

In the present embodiment, in order to simplify the description, it is assumed that the vertical position of the suction surface 120 with respect to the nozzle holder 132 is uniform even if the type of the suction nozzle 114 is different. And Therefore, the vertical distance (A) between the suction surface 120 and the nose contact surface 208 when the mounting head 50 is at the rising end position is the same even if the type of the suction nozzle 114 is different. . Further, the descending distance (B) of the mounting head 50 after the suction surface 120 comes into contact with the nozzle contact surface 208 is the same regardless of the type of the suction nozzle 114. In the present embodiment, the descending distance B is set to be the same as the relative movement distance between the suction nozzle 114 and the nozzle holder 132 when the component 46 is suctioned and mounted, and the spring 124 applies to the load cell 190 by the relative movement. The size of the component 46 is the same as when the component 46 is picked up and mounted. Further, the descending speed and acceleration / deceleration of the mounting head 50 are the same size as when the suction nozzle 114 sucks and mounts the component 46. And the same regardless of the type of suction nozzle 114. Therefore, the impact applied to the load cell 190 when the suction nozzle 114 contacts the nozzle contact surface 208 is the same as when the component 46 is suctioned and mounted, and the state of the suction nozzle 114 during suction and mounting (the suction nozzle 114). 114 indicates the magnitude and change of the load applied to the component 46). In this electronic circuit component mounting machine, the descending speed, calorie, deceleration of the mounting head 50 when receiving and mounting the component 46, and the pressing force by which the suction nozzle 114 presses the component 46, and the like, are determined by the received values. In addition, settings are made so that mounting is performed normally, and various components of the electronic circuit component mounting machine are manufactured and managed based on the settings.

The mounting head 50 is lowered from the state in which the mounting head 50 is located at the rising end position by a distance shorter than the lowering distance A (C), and the suction surface 120 is set in advance from the nose contact surface 208 of the transmission plate 200. When the vehicle reaches the position above the distance, a signal indicating the arrival is output from the mounting control computer 260 to the microcomputer 220. The descending distances A, B, and C are converted into the number of pulses of the encoder 272 that detects the rotation angle of the head elevating motor 94, and whether the mounting head 50 has moved down each distance A, B, or C by counting the number of pulses. You know whether or not. The counting of the number of pulses is performed by the mounting control computer 260.

[0055] When the mounting head 50 reaches the position where the mounting head 50 has moved down by the distance C from the rising end position, a signal indicating that fact is output to the microcomputer 220, and the microcomputer 220 outputs the signal based on the input of the signal. Then, conversion of the electric signal input from the load sensor 190 into a load, that is, detection of the load and storage of the detected load in the RAM 226, starts recording. The output signal of the load cell 190 is converted into a digital signal in a force input interface 230 which is an analog signal, taken into the microcomputer 220, converted into a load, and stored in the RAM 226. In the present embodiment, the load applied to the load cell 190 and the load cell 190, and the detected load itself is recorded in the RAM 226. Therefore, as shown in the graph of FIG. The point when C falls is the load detection start point, which is the recording start time, and is set to a time before the suction nozzle 114 comes into contact with the load cell 190. The RAM 226 can store a plurality of detection results.

[0056] The mounting head 50 is further lowered from the position where the distance C is lowered, and the suction surface 120 is transmitted. The nozzle 200 is brought into contact with (collides with) the nozzle contact surface 208 of the plate 200. The mounting head 50 is further lowered from this state. A force that allows the mounting head 50 to move down while compressing the spring 124 against the suction nozzles 114 is allowed. When the suction nozzle 114 collides with the transmission plate 200, the load detected by the load detector 180 increases rapidly. The sudden increase in the detection value of the load detection device 180 indicates that the suction nozzle 114 has come into contact with the transmission plate 200, and a signal indicating the fact is output from the microcomputer 220 to the mounting control computer 260. The mounting control computer 260 controls the descending distance of the mounting head 50 after the suction nozzle 114 comes into contact with the nozzle contact surface 208 based on the input of this signal, and lowers it by the distance B. The transmission plate 200 is swingably contacted with the input element 192, so that the suction nozzle 114 can satisfactorily push the load cell 190 through the transmission plate 200 even if the suction surface 120 is worn. Initially, the force applied by the suction nozzle 114 to the transmission plate 200 fluctuates in a vibrating manner, but eventually the suction nozzle 114 is stably pressed against the transmission plate 200. A force based on the biasing force of the spring 124 and the sliding resistance is applied and detected.

The mounting control computer 260 monitors the force of the mounting head 50 moving down the distance D from the state where the mounting head 50 has moved down to the distance C, that is, the position where the recording of the load is started. Output to 220. Based on the input of the signal, the microcomputer 220 ends the detection and recording of the load. After that, the load sensor 190 no longer outputs the signal, and the conversion of the load to the load and the recording of the detected load to the RAM 226 are not performed.The detection ends when the mounting head 50 further decreases the distance D from the position where the distance C has decreased. This is a point, which is the recording end time, and is set after the contact start time. Detection and recording are performed during the distance D. In this embodiment, the position of the distance D is determined by the fact that the mounting head 50 moves down the distance B after the suction nozzle 114 contacts the nozzle contact surface 208. The recording is set before the position, and the recording ends before the descent of the mounting head 50 ends. Therefore, the maximum load (impact) is detected and the force to be recorded is recorded. In the steady state (when the mounting head 50 has moved down by the distance B and the relative movement of the suction nozzle 114 and the nozzle holder 132 has been completed and the load has stabilized). It is not recorded until the load of. If the sliding resistance increases, the contact load when the suction nozzle 114 contacts the transmission plate 200 The contact load in the steady state is expected to be the same as or less than the normal condition, and if the maximum load is recorded, abnormally large contact The load can be detected.

When the mounting head 50 is further lowered after the suction nozzle 114 comes into contact with the nozzle contact surface 208, the load applied by the suction nozzle 114 to the load cell 190 increases rapidly as shown in the graph of FIG. , Decreases and fluctuates in an oscillating manner, but eventually becomes almost constant. After the suction nozzles 114 come into contact with the nozzle contact surface 208 and before the relative movement of the suction nozzles 114 and the nozzle holder 132 starts, the load overcoming the sliding resistance sharply increases, but decreases after the relative movement starts. When the mounting head 50 is moved down by the distance B and the spring 124 is compressed by a predetermined amount due to the relative movement between the suction nozzle 114 and the nozzle holder 132, and reaches a steady state, the load is reduced by the weight of the suction nozzle 114 and the spring 124. The size is determined by the biasing force. The distance D is set to a size at which the suction nozzle 114 and the nozzle holder 132 start relative movement, the load suddenly increases, and the maximum load is detected and recorded. In the present embodiment, the distances A and B are unique values set by design, but the distances C and D are arbitrarily set, for example, set by an operator using the input device 274. .

As described above, the load detection start point and the recording start timing are set to timings before the suction nozzle 114 starts contacting the load sensor 190 and the suction nozzle 114 contacts the nozzle contact surface 208 before the suction nozzle 114 comes into contact with the nozzle contact surface 208. Thus, the load is detected and recorded, so that the maximum value of the load can be reliably detected and recorded. Due to manufacturing errors, assembly errors, wear of the suction surface 120, etc., the descent distance of the mounting head 50 when the suction nozzle 114 comes into contact with the nozzle contact surface 208 is not necessarily the set distance A. The contact may occur when the vehicle descends a short distance from A, or when the vehicle descends a long distance. However, the distance C is set in consideration of this, and if the microphone-mouth computer 220 starts detecting and recording the load when the mounting head 50 is moved a shorter distance C than the distance A and falls, the contact of the suction nozzle 114 is confirmed. Even if there is a deviation in the descending distance of the mounting head 50 when contacting the surface 208, when the suction nozzle 114 contacts the nozzle contact surface 208, the load is detected and recorded, and the maximum load is It will be detected and recorded.

The detected load recorded in the RAM 226 of the microcomputer 220 is transmitted to the PC 240 by communication. The PC 240 determines the quality of the suction nozzle 114 based on the load detection result. This determination is made by comparing the maximum load among the loads detected by the load detection device 180 and recorded by the microcomputer 220 with a set value (threshold, value). Even if the suction nozzle 114 is normal, when the suction nozzle 114 collides with the transmission plate 200, the load detected by the load detection device 180 increases rapidly, but when abnormal, the maximum load becomes abnormally large or small. By paying attention to this, the quality of the noise is judged by comparing with the set value.

As shown in FIG. 10, the above set values are set for both cases where the load becomes abnormally large and cases where the load becomes abnormally small. In the former case, the set value FPT is, for example, from the maximum load FPA assumed when the load becomes abnormally large, to the maximum load of multiple load detections performed using a plurality of normal suction nozzles 114 from the maximum load FPA. Is set by multiplying the difference Δ FF (positive value) obtained by subtracting the average value FPNm of the nozzle by a preset ratio, and adding the resulting value to the average maximum load FPNm when the nozzle is normal. . This ratio is set to any value between 0 and 1. In the latter case, the set value FP is calculated in advance as the difference A FF (negative value) obtained by subtracting the average value FPN m from the maximum load FPA 'assumed when the load becomes abnormally small. It is set by multiplying the set ratio and adding the resulting value to the average maximum load FPNm. This ratio is set to any value between 0 and 1, and may be the same or different from the ratio when setting the FPT. Note that the load applied by the suction nozzle 114 to the load cell 190 is the sum of the weight of the suction nozzle 114, the urging force of the spring 124, and the force based on the sliding resistance. It is assumed that the weights of different types are the same. The set values FPT and FPT ^r are set in advance and stored in the memory of the PC 240.

If the maximum detected load FPA, which is the maximum load among the detected and stored loads, is equal to or less than the set value FPT and equal to or more than the set value FP, the suction nozzle 114 is normal, and the monitor 244 indicates that. Will be displayed. If the maximum detected load FPA is larger than the set value FPT or smaller than the set value FPT, the pressing force is abnormal, the suction nozzle 114 is determined to be defective, and the monitor 244 indicates that the suction nozzle 114 is abnormal. Displayed and warned. This abnormal warning The operator can replace the suction nozzle 114 or perform maintenance based on the condition, and the abnormal suction nozzle 114 may be used to mount the component 46, which may damage the component 46 and the printed wiring board 30. Avoided, the production of defective printed circuit boards is prevented. Further, it is possible to prevent the mounting machine from being stopped due to a nozzle abnormality. If the suction nozzle 114 is defective, suction load information such as the maximum load and whether the maximum load is abnormally large or small, or detection and determination results may be displayed.

In the present electronic circuit component mounting machine, the distance D for determining the load detection end point and the detected load recording time can be set arbitrarily, and the distance D is set so that the mounting head 50 reaches the descending end position and descends. Is set, the load applied by the suction nozzle 114 to the load cell 190 in the steady state is also recorded. This is because the load becomes stable when the mounting head 50 finishes descending, and the load at the end of descending may be regarded as a load in a steady state. In the present embodiment, the contact of the suction nozzle 114 with the load cell 190 is notified from the microcomputer 220 to the mounting control computer 260, and the distance D is set when the mounting head 50 reaches the descending end position. If the distance is set, when the mounting head 50 moves down the distance B from the contact, a signal indicating that the mounting head 50 has reached the lower end position is output from the mounting control computer 260 to the microcomputer 220, and based on the signal, The detection and recording of the load are terminated. Since the mounting head 50 can be moved down by exactly the distance B from the contact of the suction nozzle 114 with the load sensor 190, even if the suction surface 120 is worn, for example, the set load can be accurately obtained in a steady state. Can be The load may be detected for a further set time from the end of the descent of the mounting head 50, and the load in the steady state may be reliably acquired.

By detecting and recording the load in the steady state, the pressing state in the steady state can also be confirmed. For example, it is possible to compare the load in the steady state with a set value (a set value for determining the quality of the suction nozzle 114 in the steady state) and determine whether a normal pressing force can be obtained in the steady state. It is possible to judge the quality of the suction nozzle 114 based on the judgment result or the judgment result of the maximum detected load, and when the suction nozzle 114 is defective, it is possible to estimate the cause. is there. For example, if the sliding resistance increases, the contact in the steady state may occur due to the insufficient descent distance of the mounting head 50. The tactile load may be insufficient, and the increase in sliding resistance can be confirmed in addition to the abnormally large maximum load. Alternatively, if the maximum detected load is abnormal but the detected load in the steady state is normal, for example, it is possible to confirm the occurrence of an abnormal state such as an increase in pressing force due to an increase in sliding resistance, In the steady state, it can be estimated that there is an abnormal cause different from the case where the contact load is insufficient. Alternatively, if the maximum detection load is normal but the pressing force in the steady state is abnormal, for example, the lowering control of the mounting head 50 by the head elevating device 54 is abnormal, and the lowering distance is insufficient or excessive. It can be assumed that the cause of the abnormality is removed and the component 46 can be received and mounted normally.

After the end of the load detection, the load detection device 180 may be left attached to the feeder support 38, or may be removed from the feeder support 38 and, for example, the suction nozzle 114 of another electronic circuit component mounting machine. It can also be used for load detection. The detected load of the plurality of suction nozzles 114 can be recorded in the RAM 226 of the microcomputer 220. The load is attached to an electronic circuit component mounting machine that holds the plurality of suction nozzles 114 and mounts the component 46. Can be detected. When the load detecting device 180 is detached from the feeder support base 38 other than when detecting the load, the feeder 40 may be attached to the load detecting device mounting portion of the feeder support base 38 and the component 46 may be supplied.

As is clear from the above description, in the present embodiment, the XY robot 52 and the head lifting / lowering device 54 constitute a mounting relative motion imparting device, and also serve as a load detecting relative motion imparting device. Also, the control unit 24 controls the XY robot 52 and the like to move the mounting head 50 when the detection execution condition is satisfied, and press the suction nozzle 114 against the load cell 190. The part of the microcomputer 220 that allows the microcomputer 220 to convert the input signal from the load cell 190 into the load constitutes the non-mounting work load detection device control unit, and these are the non-mounting work load detection control. Part. Further, the RAM 226 of the microcomputer 220 constitutes a detected load recording unit, and the load detected by the load detecting device 180 of the microcomputer 220 is limited based on a signal input from the mounting control computer 260. The part that records the load detected in the RAM 226 constitutes the detected load recording time limiter. These constitute a load detection result recording unit. The microcomputer 220 is provided in the device main body 182, and the load detection result recording unit is provided in the load detection device 180. In this embodiment, the detection and recording of the load are started and ended based on the signal input from the mounting control computer 260, and they are performed at the same time. It can be considered that the load detection device control unit also functions as the detection load recording timing restriction unit. The lowering distance of the mounting head 50 of the mounting control computer 260 is acquired by counting the number of pulses of the encoder 272, and the part that detects the lowering of the distance C and the distance D of the mounting head 50 is a detection start time acquisition unit and a recording start time. An acquisition unit, a detection end time acquisition unit, and a recording end time acquisition unit are configured. It can also be considered that a portion that receives a signal indicating a decrease in the set distance of the mounting head 50 from the mounting control computer 260 of the microcomputer 220 constitutes a detection start time acquisition unit and the like. Further, a portion for determining the quality of the suction nozzle 114 based on the detected load transmitted from the microcomputer 220 of the PC 240 constitutes a nozzle quality determination unit and a detection result analysis unit. The portion where the abnormal nozzle is displayed on the monitor 244 constitutes a nozzle abnormality warning section and a load detection result display section. The nozzle pass / fail determination section includes a maximum detected load dependent pass / fail determination section, a steady state load dependent pass / fail determination section, and a maximum detected load / steady state load dependent pass / fail determination section. Further, when the load detection device 180 is attached to the feeder support base 38 and can detect the load, it can be considered that it constitutes a part of the self-diagnosis function of the electronic circuit component mounting machine.

Note that load detection may be performed a plurality of times for one suction nozzle 114, and determination of defective noise may be performed based on a plurality of load detection results. For example, an average value of the maximum detected loads in a plurality of load detections is determined, and the average contact load of the suction nozzle 114 is determined.

[0068] In the electronic circuit component mounting machine of the above embodiment, one suction nozzle is used for mounting the electronic circuit component, but a plurality of suction nozzles may be used. For example, a plurality of mounting heads 50 are provided on the Y-axis slide 64 along the Y-axis direction. At least one of the plurality of suction nozzles receives an electronic circuit component from the feeder 40 and mounts the electronic circuit component on the printed wiring board 30. The load applied to the load cell 190 is detected for each of the plurality of suction nozzles, and if there is a defective nozzle, a warning is issued and appropriate processing such as replacement is performed. Bad nozzle The use of the head may be prohibited but not replaced, and the mounting operation may be started with the mounting head 50 holding the defective tip. In this case, for example, the PC 240 and the mounting control computer 260 can communicate with each other, and the result of the determination as to whether or not the nozzle is good and the nozzle use prohibition information are supplied to the mounting control computer 260. It will not be used. A plurality of suction nozzles 114 are held, and if possible, the use-prohibited nozzles are skipped and are not used for mounting, and another good nozzle performs mounting of components in place of the use-prohibited nozzles. In this case, the portion of the PC 240 that prohibits the use of the defective tip forms a nozzle use prohibition portion.

Also, the present invention provides a method for picking up and mounting an electronic circuit component by moving a mounting head to an arbitrary position in a plane parallel to a mounting surface of a circuit board by a mounting head moving device of an XY robot type. Not only the electronic component mounting machine that performs the above, but also other forms of the electronic component mounting machine, for example, a plurality of mounting heads are turned around a common turning axis, and a component receiving device that is one of a plurality of stop positions is provided. The present invention can be applied to an electronic circuit component mounting machine that stops at a position and a component mounting position and receives a component supply device force of a component and mounts the component on a circuit board. This type of electronic circuit component mounting machine comprises: (a) a mounting machine body; and (b) at least one rotating body rotatably held on the mounting machine body around a substantially vertical axis of rotation; c) A mounting head held by each of the plurality of head holding portions provided on the at least one rotating body, each including a head main body and a nozzle holding body having at least one nozzle holding portion. And (d) rotating a rotating body to rotate a plurality of mounting heads around the rotation axis, and a component receiving position for receiving an electronic circuit component from a component supply device by a suction nozzle, and receiving the component. Rotator for moving the electronic circuit component to a component mounting position for mounting the electronic circuit component on the circuit board. For example, as described in JP-A-6-342998, one rotating body holds all of the plurality of mounting heads, and the rotating bodies rotate the mounting heads around a vertical rotation axis. As described in JP-A-9-1237997, a plurality of rotating bodies each hold one mounting head and can freely rotate around a vertical rotation axis, as described in JP-A-9-1237997. By doing so, the held mounting heads may be individually turned. [0070] In this electronic circuit component mounting machine, the load detection device is detachably attached to, for example, a feeder support base that constitutes a component supply device. The feeder support is moved by the feeder support moving device, and the component supply units of the plurality of feeders mounted on the feeder support are sequentially moved to the component supply positions to supply the components. At the time of load detection, the detector of the load detector is moved to the component supply position by the movement of the feeder support, and the suction nozzle of the mounting head moved to the component receiving position is brought into contact with the detector and pressed. Then, the load is detected, recorded, and used for determining the quality of the nozzle. The load detection is performed, for example, at the time of non-mounting work, and the mounting head is lowered by a set distance at the time of load detection, as in the above-described embodiment. In, the mounting head elevating device uses, for example, a rotating body rotating device and a drive source, includes a motion transmitting device including a cam and a cam follower, and raises and lowers the mounting head. In this case, the descending distance of the mounting head corresponds to the rotation angle of the cam constituting the motion transmission device, and is converted into, for example, the number of pallets of an encoder that detects the rotation angle of the cam. Used for control such as termination. The load detection device should be attached to the feeder support when detecting the load, and should be removed from the feeder support when the detection is completed and mounting work is started. This avoids an increase in the weight of the feeder support during component supply. For example, the impact acting on the feeder due to acceleration and deceleration when the feeder support starts and stops moving increases supply accuracy. Is avoided. Alternatively, it is not necessary to reduce the acceleration and deceleration at the start and stop of the movement of the feeder support table in order to avoid an increase in impact, so that a reduction in supply efficiency can be avoided. Furthermore, it is possible to prevent the impact at the time of starting and stopping the movement of the feeder support base from acting on the load detecting device and causing a failure or the like.

[0071] If a plurality of heads hold and remove a plurality of suction nozzles, the suction nozzles are sequentially positioned at operation positions for receiving and mounting components, and are pressed against a detection unit of a load detection device. Then, the load is detected and recorded, and for example, pass / fail is determined. If there is a defective nozzle, for example, a warning is issued or the use of a defective nozzle is prohibited. In this case, the electronic circuit component mounting machine mounts the electronic circuit component on the circuit board by a plurality of suction nozzles. The use-prohibited nozzles are held by the mounting head but are not used and are skipped. If the suction nozzle held by another mounting head can be replaced, the electronic components can be replaced. Is easy to attach. Alternatively, since the mounting head holds multiple suction nozzles, if the mounting head that holds the use-prohibited nozzle has a suction nozzle that can mount electronic circuit components in place of the use-prohibited nozzle, the An electronic circuit component may be mounted on the suction nozzle. Nozzle use prohibition information is supplied to the mounting control computer so that nozzle skipping, use of alternative nozzles, and nozzle use prohibition are performed. For example, a PC and a mounting control computer may be connected to supply nozzle use prohibition information, or an operator may input information into the mounting control computer.

If there is a defective nozzle, replacement of the defective nozzle may be displayed on the display device, and the operator may be prepared to replace the nozzle. If the defective nozzle is replaced prior to the start of the mounting operation, the stop of the mounting machine due to the nozzle abnormality is avoided. If the mounting operation is started without replacing the defective nozzle with a non-defective one, the replacement nozzle will be prepared in advance according to the replacement indication before the stoppage of the mounting machine due to the abnormality of the nozzle. Before stopping the mounting machine due to an abnormality in the sliding surface between the nozzle holder and the suction nozzle, the replacement or maintenance of the suction nozzle can be prompted, and the nozzle can be replaced quickly. Even if the mounting work without replacing the defective nozzle is started, for example, if the electronic circuit component mounting machine holds a plurality of suction nozzles, it is possible to reliably stop the mounting work due to nozzle abnormalities by nozzle skipping etc. Can be avoided. The same applies to an electronic circuit component mounting machine in which at least one mounting head is moved by an XY robot type mounting head moving device.

The start and end of load detection and recording are not limited to being performed based on a signal input from the mounting control computer to the microcomputer, and the start and end timing of detection and recording on the load detection device side are determined. It may be acquired. For example, a head detection device that detects the mounting head is provided together with the load detection device. The head detection device is configured by, for example, a transmission type photoelectric sensor which is a kind of a photoelectric sensor.For example, the suction surface of the suction nozzle reaches a position above a nozzle contact surface of the transmission plate by a predetermined distance. Sometimes worn Provided to detect the head. Alternatively, the suction nozzle may be detected by a nozzle detection device. The detection signal is input to the microcomputer, and the load detection device starts detecting the load based on the detection signal, and records the detected load. In the microcomputer, the time from the detection of the mounting head is measured by a timer, and when the set time has elapsed, the detection and recording of the load are terminated. The set time can be set arbitrarily, for example, set to the length at which the maximum load is detected and recorded. With this configuration, the load detection time can be set and the recording time can be restricted without performing communication between the computer that controls the load detection device and the mounting control computer. In this case, based on the detection signals from the head detection device and the head detection device of the microcomputer, the force to determine whether the mounting head has lowered to the position where load detection and recording start is detected. And a recording start time acquisition unit, and a detection end time acquisition unit determines whether or not it is time to end load detection and recording based on the time measured by the timer and the timer of the microcomputer. This constitutes the recording end time acquisition unit. The start and end of load detection and recording based on the timing obtained by the microcomputer constitute the load detector control unit and the detected load recording timing limit unit.

Further, when the suction nozzle comes into contact with the nozzle contact surface of the transmission plate of the load cell and the load suddenly increases, a signal indicating the sudden increase is input from the microcomputer of the load detection device to the mounting control computer. The descending distance of the mounting head at the time is obtained by the number of encoders, and this descending distance may be used for the mounting operation. If the height of the nozzle contact surface of the load cell is the same as the height of the upper surface of the component held by the component supply device and the height of the mounting surface of the printed wiring board, the mounting head was acquired at the time of receiving and mounting the component. Lower the distance by adding the relative movement distance between the suction nozzle and the nozzle holder to the descent distance.If the descent distance is different, correct the descent distance set for receiving and mounting components based on the obtained descent distance. To lower the mounting head. Thus, for example, even if the suction surface is worn or the like, the suction nozzle and the nozzle holder are relatively moved by a predetermined distance, and a predetermined pressing force is applied to the component.

[0075] It is not possible to input the nozzle contact based on the sudden increase in the load to the mounting control computer. It may be omitted if it is not missing.

Further, communication is performed between the PC and the electronic circuit component mounting machine irrespective of the number of suction nozzles that can be mounted on the electronic circuit component mounting machine, and information is exchanged. The machine may be warned.

[0077] Further, a computer that constitutes the control device may be configured such that the control device that controls the mounting relative motion imparting device of the electronic circuit component mounting machine determines the acceptability of suction noise based on the load detection result. Also, the RAM can be used as the detection load recording unit. Alternatively, the control device for controlling the load detection device may determine whether the suction nozzle is good or not.

Further, in the above embodiment, in order to simplify the description, the vertical position of the suction surface with respect to the nozzle holder is constant even if the type of suction nozzle is different, and the mass of the suction nozzle is the same. The urging device for urging the nozzles is the same, and the urging force for urging the electronic circuit components by the urging device is constant, but they are actually different in many cases. Control is performed. For example, when the load applied by the suction nozzle is detected, the distance from the rising end position of the mounting head to the position at which the suction surface comes into contact with the contact surface of the load cell, the descending distance of the mounting head after the contact is detected. Based on the applied load, a set value or the like for detecting whether the suction nozzle is good or bad is set according to the type of the suction nozzle, and load detection, good / bad judgment, and the like are performed.

The detection execution conditions for determining the load detection time of the suction sticking are set in advance in the electronic circuit component mounting machine, or may be set in advance.

Further, in the microcomputer provided with the load cell, the load is constantly detected and recorded based on the output signal of the load cell, and the contact of the suction nozzle with the load cell is detected due to the sudden increase in the load. The load until the recording end condition is satisfied, for example, until the set time elapses, or until the load becomes constant may be left as a record and used for determining whether or not it is good. Alternatively, the load may be constantly detected, and for example, the recording may be started by acquiring the recording start timing due to a sudden increase in the load, and may be terminated by acquiring the recording end timing after the lapse of a set time. The load detection time may be different from the recording time. In addition, it is essential that the calorie and deceleration of the lowering of the mounting head when detecting the load applied by the suction nozzle and the relative movement distance between the suction nozzle and the nozzle holder are the same at the time of mounting and at the time of suction. Then it may be different. At the time of load detection, the mounting head is lowered at the set acceleration and deceleration, the suction nozzle and the nozzle holder are moved relative to each other by the set distance, and the load applied by the suction nozzle to the load cell is detected. What is necessary is just to acquire the set value of the nozzle pass / fail judgment using the suction nozzle.

[0082] The present invention that can be claimed can also be applied to an electronic circuit component mounting machine in which a plurality of modularized electronic circuit component mounting units are arranged in series. Although a modularized electronic circuit component mounting unit has not been disclosed yet, as described in Japanese Patent Application No. 2003-115216 filed by the present applicant, a component supply device and a circuit board holding device are respectively provided. A device, a mounting head, and a mounting relative motion imparting device are provided. Each of them mounts electronic circuit components on a circuit board, and arranges an arbitrary number of electronic circuit component mounting units in an arbitrary order. An electronic circuit component mounting machine having a desired configuration can be obtained. It can be considered that one electronic component mounting unit constitutes an electronic component mounting machine. The load detection is performed in each of the plurality of electronic circuit component mounting units.

[0083] As described above, the forces that have described in detail some embodiments of the present invention that can be claimed are merely examples, and the present invention that can be claimed includes the embodiments described in the section of [Embodiments of the Invention]. It can be implemented in a mode in which various modifications are made based on the knowledge of those skilled in the art.

Claims

The scope of the claims

[1] a component supply device for supplying electronic circuit components,

A circuit board holding device for holding a circuit board,

A relative motion imparting device for applying a relative motion required for detecting the load to the mounting head and the load detecting device, and pressing the suction nozzle against the detecting portion; a load detection result by the load detecting device; And a load detection result utilization device utilizing the electronic circuit component mounting machine.

[2] A load detection control that controls the load detection relative motion imparting device to bring the suction nozzle into contact with the detection unit, and the load detection device detects a load applied by the suction nozzle to the detection unit at the time of the contact. The electronic circuit component mounting machine according to claim 1, including a part.

[3] The load detection control unit may be configured to perform the load detection relative motion imparting device and the load detection device when the electronic circuit component mounting machine is not performing the mounting operation of the electronic circuit component on the circuit board. 3. The electronic circuit component mounting machine according to claim 1, further comprising a non-mounting operation load detection control unit that causes the load to be detected.

4. The electronic circuit component mounting machine according to claim 1, further comprising a load detection result recording unit that records a load detection result by the detection unit.

[5] The electronic circuit component mounting machine according to claim 4, wherein the load detection result recording unit is provided in the load detection device.

[6] The load detection result recording unit records a change in load over time in a single contact of the suction nozzle with the load detection device, and a detected load recording unit. Control at least one of the recording start time and the recording end time The electronic circuit component mounting machine according to claim 4 or 5, further comprising a detection load recording timing restriction unit that limits the load.

[7] The detection load recording timing restriction unit sets the recording start timing to a timing before the start of contact of the suction nozzle with the detection unit, and sets the recording end timing after the contact start timing. 7. The electronic circuit component mounting machine according to claim 6, wherein the electronic head is set at a time before the end of the relative movement for detecting the load between the mounting head and the detection unit.

[8] The load detection result utilization device is a detection result analysis unit that analyzes a load detection result by the load detection device, and at least (a) a maximum value and a minimum value of the detected load, the mounting head, Obtaining a preset load, such as the load at the end of the relative motion with the load detector, and (b) examining the change tendency of the load during the relative motion between the mounting head and the load detector, and (c) The electronic circuit component mounting machine according to any one of claims 1 to 7, which performs at least one of acquiring a state and a characteristic of an adsorption noise represented by them.

[9] The electronic device according to any one of claims 1 to 8, wherein the load detection result utilization device includes a nozzle abnormality warning unit that warns of an abnormality of the suction nozzle based on the load detection result. Circuit component mounting machine.

10. The electronic circuit according to claim 1, wherein the load detection result utilization device includes a nozzle quality determination unit that determines quality of the suction nozzle based on the load detection result. Component mounting machine.

[11] The electronic circuit according to any one of claims 1 to 10, wherein the load detection result utilization device includes a nozzle use prohibition unit that prohibits use of the suction nozzle based on the load detection result. Component mounting machine.

[12] Any one of claims 1 to 11, further comprising a display device, wherein the load detection result utilization device includes a load detection result display section for displaying the load detection result by the load detection device on the display device. An electronic circuit component mounting machine as described in Crab.

[13] The load detection result utilization device is provided separately from a control device that controls the mounting relative motion imparting device, and is provided to an external device that can receive the load detection result from the load detection device. 13. The electronic circuit component mounting machine according to claim 1, wherein the mounting device is provided.

14. The electronic circuit component mounting machine according to claim 1, wherein the mounting relative motion imparting device also functions as the load detecting relative motion imparting device.

15. The electronic circuit component mounting machine according to claim 1, wherein the detection unit of the load detection device includes a load cell.

[16] In the detection unit, one of two surfaces opposite to each other is a nose contact surface that is larger than the suction surface of the suction nozzle, and the other surface is in contact with the input unit of the load cell in a spot-like manner. 16. The electronic circuit component mounting machine according to claim 15, further comprising: a transmission body that includes a transmission unit that is capable of swinging about a contact portion thereof.

17. The electronic circuit component mounting machine according to claim 1, wherein the load detection device is detachably attached to the electronic circuit component mounting machine.

18. The electronic circuit component mounting machine according to claim 17, wherein the load detection device is removably attached to a component supply device so as to be detachably attached.

[19] The component supply device may include a plurality of component supply feeders and a feeder support member, and the load detection device may be selectively attachable to and detachable from at least one of the plurality of component supply feeders. Electronic circuit component mounting machine according to paragraph 18.