JP2003332792A - Electronic circuit component mounting head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit component mounting head satisfying at least one requirement of coincidence between an actual contact load of the electronic circuit component to a member being mounted and a target contact load or grasp of the actual contact load by a worker. <P>SOLUTION: From the detection signal of a load sensor provided between a nozzle holder and a suction chucking nozzle, the actual contact load is operated every time when the electronic circuit component is mounted on a circuit board. If the absolute value of a difference between the actual contact load and the target contact load is smaller than a first set value, the actual contact load is appropriate and it is displayed, along with a stage to which it belongs, on a display screen (S1, S2). If the difference of contact load is larger than the first set value but, smaller than a second set value, the occurrence of deviation of the contact load is informed by sounding an alarm buzzer (S3, S4) and operation of the mounting system is stopped (S5) if the second set value is exceeded. The worker can know the actual contact load on the display screen and the target contact load can be determined by altering the target position of the nozzle holder. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit component mounting head, and more particularly to processing of a reaction force received by a nozzle holder that holds a suction nozzle.

[0002]

2. Description of the Related Art Electronic circuit components are components that are mounted on a mounting target material such as a printed wiring board to form an electronic circuit.
At the time of mounting, it is desirable to contact the target material with an appropriate contact load. Therefore, the electronic circuit component mounting head is held so as to be movable in the axial direction by (a) the mounting head body and (b) the mounting head body, as disclosed in, for example, Japanese Patent Application Laid-Open No. 8-2799697. The nozzle holder that holds the suction nozzle, (c) the holder position detecting device that detects the relative position of the nozzle holder with respect to the mounting head body, and (d) the nozzle based on the detection result of the holder position detecting device. A holder elevating device for lowering the holder with respect to the mounting head body to a preset target position and raising the holder from the target position. The target position of the nozzle holder is set to a position where the electronic circuit component is mounted on the mounting target material with an appropriate contact load, and the nozzle holder is lowered to the target position.

[0003]

SUMMARY OF THE INVENTION However, in the electronic circuit component mounting head described in the above publication, when the electronic circuit component is mounted on the mounting target material with an appropriate load set in advance. Not necessarily. For example, when mounting an electronic circuit component on a printed wiring board, a vertical position error of a mounting surface on which the electronic circuit component of the printed wiring board is mounted, a lowering position error of the nozzle holder, deterioration,
The lower position of the nozzle holder when the electronic circuit component is brought into contact with the printed wiring board is different from the planned lower position due to the thickness error of the electronic circuit component, or the target position of the nozzle holder is different from the set position. However, since the actual contact load may be different from the target value, there is a conventional demand to mount the electronic circuit component on the printed wiring board with an appropriate contact load. . There is also a demand for the operator to know the actual contact load of the electronic circuit component on the printed wiring board when the electronic circuit component is mounted on the printed wiring board. These requirements also occur when the suction nozzle picks up an electronic circuit component.

The present invention has been made in view of the above circumstances, and the above-mentioned 2
It is an object of the present invention to solve at least one of the two requirements, and the present invention provides an electronic circuit component mounting head having the following aspects. Similar to the claims, each mode is divided into paragraphs, each paragraph is numbered, and the numbers of other paragraphs are referred to as necessary. This is merely for facilitating the understanding of the present invention, and the technical features and combinations thereof described in the present specification should not be construed as being limited to those described in the following respective sections. .
Further, when a plurality of items are described in one section, it is not always necessary to adopt the plurality of items together. It is also possible to select and use only some of the items.

In the following items, item (1) corresponds to item 1, item (2) is item 2 and item (5) is item 3
(6) corresponds to claim 4, and (7) corresponds to claim 5.

(1) The mounting head main body, a nozzle holder that is held by the mounting head main body so as to be movable in the axial direction parallel to the axis of the mounting head main body, and holds the suction nozzle, and the nozzle holder described above. A holder position detection device that detects the relative position in the axial direction with respect to the mounting head body, and the nozzle holder is preset in the axial direction with respect to the mounting head body based on the detection result of the holder position detection device. A holder advancing / retracting device for advancing to a target position that is set and retracting from the target position, a reaction force detecting device for detecting a reaction force received by the nozzle holder when the nozzle holder advances by the holder advancing / retreating device, and a reaction force thereof. An electronic circuit component mounting head including a display device that displays reaction force related information related to a reaction force detected by a detection device. There are various modes of display by the display device, for example,
Characters such as letters and numbers may be used, or graphics may be used. The reaction force related information may be any information related to the reaction force. For example, the reaction force itself, the quality of the reaction force, the stage to which the reaction force belongs, and the actual forward end position of the nozzle holder are used as the reaction force related information. . The reaction force is opposite in direction to the contact load of the electronic circuit component to the mounting target material or the contact load of the suction nozzle to the electronic circuit component, but the magnitude is the same, and if the reaction force is obtained, the contact load is obtained. Is obtained. The nozzle holder is
It may be directly held by the mounting head main body or indirectly by a holder holding member or the like. In the former case, the nozzle holder is held by the mounting head body so as to be movable in the axial direction. Furthermore, if the nozzle holder can be rotated about its own axis, it is also held rotatably about its axis by the mounting head body and rotated by the rotating device. When the nozzle holder is indirectly held by the mounting head body via the holder holding member or the like, for example, the holder holding member is held by the mounting head body so as to be relatively movable in the advancing / retreating direction of the nozzle holder and in the axial direction. The nozzle holder may be held by the holder holding member such that it cannot move relative to it, or the holder holding member may be held by the mounting head main body such that it cannot move relative to it, and the nozzle holder may hold the nozzle holder relatively movable in the axial direction. When the nozzle holder is moved not only in the axial direction but also about its own axis, if the holder holding member is advanced and retracted, the nozzle holder is rotated with respect to the holder holding member, If the holder is moved back and forth, it is desirable that the nozzle holder is rotated by rotating the holder holding member with respect to the mounting head body. The nozzle holder is
For example, (A) the suction nozzle is held so as to be relatively movable in the advancing / retreating direction of the nozzle holder, and is biased in the forward direction by the biasing means, or (B) the suction nozzle is moved in the advancing / retreating direction of the nozzle holder. At the same time, it is supposed to be held immovably. The suction nozzle includes a main body that is held by the nozzle holder and a suction portion that sucks electronic circuit components.In the case of (A), the main body is held by the nozzle holder so that it can move relative to the nozzle holder in the forward and backward directions. At the same time, it is biased in the forward direction by the biasing means. The suction unit may be held by the main body unit so that the suction unit cannot move relative to the nozzle holder in the forward / backward direction, and the suction unit can be held in the main unit unit so that the suction unit can move in the forward / backward direction relative to the nozzle holder. You may be encouraged. In the case of (B), the main body is held by the nozzle holder so that the nozzle holder cannot move in the forward and backward directions. It is desirable that the suction portion is held by the main body portion so as to be relatively movable in the forward / backward direction of the nozzle holder, and is biased in the forward direction by the biasing means.
It is not indispensable, and may be held in the main body so as not to move relative to it. For example, if the electronic circuit component is to be mounted on the mounting target material, in the case of (A), for example, the electronic circuit component is brought into contact with the mounting target material before the nozzle holder reaches the target position, and then the biasing means. Allows the nozzle holder to move to the target position, so that the electronic circuit component is securely mounted on the mounting target material, and is mounted on the mounting target material with a load according to the biasing force of the biasing means. can do. In this case, for example, by changing the urging force of the urging means, it is possible to change the contact load of the electronic circuit component on the mounting target material. The biasing force of the biasing means is, for example,
It can be changed according to the setting of the target position of the nozzle holder. When mounting the electronic circuit component on the mounting target material, in the case of (B), when the suction part is held so that it can move relative to the main body part in the advancing and retracting direction of the nozzle holder, it is the same as in the case of (A). is there. When the suction part is held relatively immovable in the main body part, there is no elastic deformability on the suction nozzle side, so when the nozzle holder is advanced to the target position by utilizing the elastic deformability of the mounting target material. , So that a suitable contact load can be obtained. It is possible to change the contact load within the range allowed by the elastic deformability of the mounting target material,
For example, the contact load can be changed by changing the target position of the nozzle holder. In either case, when the nozzle holder is advanced to the target position and the electronic circuit component is mounted on the mounting target material, the reaction force applied to the nozzle holder from the mounting target material through the electronic circuit component is detected as the reaction force. The reaction force-related information detected by the device is displayed on the display device. If the reaction force-related information is displayed on the display device, it is convenient for the operator, for example, to know the magnitude of the actual contact load when the electronic circuit component is mounted on the mounting target material. Further, based on the display, for example, the reaction force is increased or decreased by changing the target position of the nozzle holder, or the electronic circuit component mounting head is changed according to the magnitude of the actual contact load, its quality, the amount of excess or deficiency, etc. By performing appropriate processing such as maintenance and inspection, the electronic circuit component can be actually attached to the attachment target material with an appropriate contact load. The same applies when the suction nozzle sucks an electronic circuit component.

(2) The electronic circuit component mounting head according to item (1), wherein the display device includes a reaction force display section that displays the reaction force itself as the reaction force related information.

(3) The display device includes a reaction force good / bad display section for displaying whether or not the reaction force detected by the reaction force detection device is within a preset reaction force range. The electronic circuit component mounting head according to the item 2).

(4) The display device includes a stage display section for displaying which of a plurality of preset stages the reaction force detected by the reaction force detection device belongs to.
The electronic circuit component mounting head according to item (2) or (3).
According to this section, for example, depending on the stage to which the reaction force belongs, it is possible for the operator to easily understand whether or not the reaction force is proper, and also the extent to which the reaction force is proper or incorrect.

(5) At least one of an alarm buzzer and an alarm lamp, which is activated when the reaction force detected by the reaction force detecting device and the predetermined target reaction force are different from each other by at least a first set state. Including the alarm device (1) or
The electronic circuit component mounting head according to any one of (4). The first setting state includes, for example, a setting value and a setting ratio. According to the electronic circuit component mounting head of this section, when the reaction force and the target reaction force are different from each other by the first setting state or more, the operator quickly knows the occurrence of the situation by the alarm of the alarm device. be able to. The operation timing of the alarm device or the state of the electronic circuit component mounting head at the time of operation differs depending on, for example, the setting of the first setting state, and the operator grasps how the first setting state is set. If so, the meaning of the alarm can be understood and the processing can be performed accordingly. The alarm buzzer can be configured, for example, so that the sounding mode is different in a plurality of types and the operator is informed of the content of the situation occurring in the electronic circuit component mounting head accordingly. In the case of an alarm lamp, the operator can be informed of the content of the situation occurring in the electronic circuit component mounting head, for example, by selectively using lighting and blinking, or by properly using the color of the lamp. (6) An automatic stop unit is included that stops the operation of the component mounting head when the reaction force detected by the reaction force detection device and the predetermined target reaction force differ by a second set state or more. An electronic circuit component mounting head according to any one of (1) to (5). The second set state includes, for example, a set value and a set ratio. In the electronic circuit component mounting head having both the characteristics of (5) and (6), the first setting state and the second setting state are set to different states, for example, after an alarm by an alarm device. The operation of the component mounting head is stopped. If the detected reaction force and the target reaction force differ by more than the second setting state, for example, there is a difference in size that causes some trouble if the electronic circuit components continue to be mounted. By automatically stopping the operation of the head, electronic circuit components and suction nozzles are damaged, or the amount of advancement of the nozzle holder is insufficient to cause suction and mounting errors, and a defective printed circuit board is manufactured. Occurrence of such a situation is automatically avoided.

(7) A reaction force storage device that stores the detection value of the reaction force detection device when the electronic circuit component is mounted on the circuit board by the mounting head in association with the circuit board and the mounting position ( The electronic circuit component mounting head according to any one of items 1) to 6). The circuit board includes, for example, a printed wiring board on which no electronic circuit components are mounted yet, a printed wiring board on which electronic circuit components are mounted on a part of the printed wiring, and electronic circuit components mounted on one of both sides. There are printed circuit boards that have already been joined by soldering, small circuit boards on which a small number of electronic circuit components are mounted, and the like. According to this section, for example, after mounting the electronic circuit component on the circuit substrate, at which mounting position on which circuit substrate, how much reaction force acts on the nozzle holder You can see if was attached. Thereby, for example, when performing traceability at a later date,
That is, when tracing the mounting state of electronic circuit components on a circuit board, it is possible to easily obtain the actual reaction force etc. when mounting the electronic circuit component at a certain mounting position of a certain circuit board, and to accurately meet the data requirements. Can handle.

(8) The electronic circuit component mounting head according to the item (7), further including a maintenance necessity determining unit that determines maintenance necessity of the mounting head based on the memory of the reaction force storage device. (9) The electronic circuit component mounting head according to item (8), wherein the maintenance necessity determination unit includes a reaction force statistical processing unit that statistically processes data in the reaction force storage device. The statistical processing is performed in various modes such as obtaining an average value of a plurality of reaction forces detected by the reaction force detection device and obtaining a standard deviation. If statistical processing is performed, for example, the tendency of reaction force can be obtained,
The reaction force generation status is accurately acquired. (10) A target position changing unit that changes the target position of the nozzle holder with respect to the mounting head body to a position where the reaction force to the nozzle holder should be a target value, based on at least the processing result of the statistical processing unit. Including (1) or
The electronic circuit component mounting head according to any one of (9). The change of the target position is performed based on only the processing result of the statistical processing unit, or in addition to the processing result of the statistical processing unit,
For example, if the load sensor constitutes a reaction force detecting device, the load sensor may be operated based on the displacement of the zero point position of the load sensor. The target position changing unit is configured, for example, such that the target position is changed based on an instruction from an operator, for example, an instruction of changing the target position and an instruction of the amount of change, or at least based on the processing result of the statistical processing unit. It may be configured to change automatically.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an electronic circuit component mounting system including an electronic circuit component mounting head according to an embodiment of the present invention. The basic configuration of this mounting system is the same as the electronic circuit component mounting system described in Japanese Patent No. 2824378, and will be briefly described.

In FIG. 1, reference numeral 10 is a bed of the electronic circuit component mounting system. On the bed 10, a wiring board conveyor 14 that conveys a printed wiring board 12, which is a type of circuit board as a mounting target material, in the X-axis direction (the horizontal direction in FIG. 1), a printed wiring board holding device 16, and a mounting device. 18
Also, component supply devices 20, 22 and the like are provided.

In the present embodiment, the printed wiring board 12
Is conveyed in a horizontal posture by the wiring board conveyor 14,
It is stopped at a predetermined stop position by a stop device (not shown), and the surface thereof is held in a horizontal posture by a printed wiring board holding device 16 provided at a portion corresponding to the stop position of the bed 10. The reference mark 24 and the board ID are provided on the front surface or the upper surface of the printed wiring board 12 on which the electronic circuit components are mounted.
A wiring board ID mark 26 as an indicator is provided. The wiring board ID mark 26 is a two-dimensional bar code in the present embodiment, which defines the type of the printed wiring board 12, data which specifies the printed wiring board 12,
For example, data such as numbers is stored.

The component supply devices 20 and 22 are provided at fixed positions on both sides of the wiring board conveyor 14 so as to be separated from each other in the Y-axis direction orthogonal to the X-axis direction in the horizontal plane. The component supply device 20 is a feeder type component supply device that supplies electronic circuit components by a feeder 28, and the component supply device 22 is a tray type component supply device that supplies electronic circuit components by a tray 29. Tray 29 is
The tray accommodating boxes accommodate the tray accommodating boxes, the tray accommodating boxes are vertically stacked, one of the tray accommodating boxes is positioned at a component supply position, and the tray 29 accommodated in the positioned tray accommodating box supplies electronic circuit components. To do.

The mounting device 18 will be described. Mounting device 18
Is a component of at least one of an X-axis direction and a Y-axis direction in which a nozzle holder 30 forming an electronic circuit component mounting head (hereinafter, simply referred to as a mounting head) is orthogonal to each other by an XY robot 32 as a holder moving device. The suction nozzle 34 held by the nozzle holder 30 is moved in the direction having the arrow, conveys the electronic circuit component 36, and mounts it on the mounting surface of the printed wiring board 12.

Therefore, as shown in FIG. 1, the XY robot 32 includes the X-axis slide 40 and the X-axis slide moving device 4
A Y-axis slide 44 and a Y-axis slide moving device 46 are provided. The X-axis slide moving device 42 includes an X-axis slide moving motor 48, a ball screw 50 and a nut (not shown), and moves the X-axis slide 40 in the X-axis direction. Y-axis slide 44 and Y-axis slide moving device 46
Are provided on the X-axis slide 40. The Y-axis slide moving device 46 includes a Y-axis slide moving motor 56, a ball screw 58, and a nut 60 (see FIG. 2).
The shaft slide 44 is moved in the Y-axis direction. The nozzle holder 30 is provided on the Y-axis slide 44 and can be moved to an arbitrary position within a horizontal plane parallel to the surface of the printed wiring board 12.

The nozzle holder 30 is provided on the Y-axis slide 44 so as to be able to move up and down and to rotate about a vertical axis. To be made. In the present embodiment, the nozzle holder 30, the suction nozzle 34, the holder elevating device 70, and the holder rotating device 72 are configured similarly to the nozzle holder and the like described in Japanese Patent Laid-Open No. 8-2799697, and will be briefly described. .

As shown in FIGS. 2 and 3, the holder lifting device 70 includes a lifting member 74 as a nozzle holding member and a lifting member driving device 76. Lifting member driving device 76
Is a Z-axis motor 78 which is a kind of electric motor as a drive source.
(Refer to FIG. 7), including the ball screw 80 and the nut 82, the ball screw 80 is rotated by the Z-axis motor 78, whereby the elevating member 74 is guided by the guide device 88 including the guide rail 84 and the guide block 86. The nozzle holder 30 lifted and lowered and held by the lift member 74 is lifted and lowered with respect to the Y-axis slide 44.

The nozzle holder 30, as shown in FIG.
In the present embodiment, it is composed of a plurality of members and includes a rotating body 90 and a support shaft 92. The nozzle holder 30 is held by the elevating member 74 in the rotating body 90 so as to be rotatable about its vertical axis and not relatively movable in the axial direction parallel to its own axis. It is held by the Y-axis slide 44 so as to be movable in the axial direction and rotatable about its own axis. The holder rotating device 72 includes a θ-axis motor 100 (see FIG. 7) as an electric motor as a drive source, a driven gear 102 and a drive gear (not shown), and the nozzle holder 30 as its own axis. Rotate around a vertical axis of rotation.

The support shaft 92 is fixed to the rotating body 90 such that neither axial relative movement nor relative rotation is possible. In the support shaft 92, as shown in FIG. 3, the passage 1 penetrating along the axis is formed.
10 and the like are formed, and through the radial passage 112, the rotary joint 114, the hose 116, and the electromagnetic directional control valve 118 (see FIG. 7) formed in the rotating body 90, a negative pressure source and a positive pressure source (not shown). And selectively communicated to the atmosphere. The rotary joint 114 includes an annular passage 120 and a radial passage 12.
2, annular passages 124, 126 and radial passage 13
0, including 0, regardless of the rotational position of the rotating body 90
Keep negative pressure supplied to 10. Supply and shutoff of negative pressure, positive pressure, and atmospheric pressure to the passage 110 are performed by switching the electromagnetic directional control valve 118.

A projecting portion of the support shaft 92 from the rotating body 90 is a spline shaft portion 138, which holds the suction nozzle 34 through an adapter 140. Adapter 140
A ball spline 144 is provided inside, and is spline-fitted with the spline shaft portion 138. Adapter 14
No. 0 is fitted in the spline shaft portion 138 so as to be relatively movable in the axial direction and not relatively rotatable. Note that the ball spline 144 is conceptually shown in FIG. 3, and in reality, the adapter 140 is divided into a plurality of members for holding the balls of the ball spline.

As shown in FIG. 3, a first compression coil spring 150 (hereinafter referred to as the first spring 1) is provided at a portion of the spline shaft portion 138 between the adapter 140 and the rotating body 90.
The second compression coil spring 154 (hereinafter, referred to as the second spring 154) is fitted to the lower end of the spline shaft portion 138 between the spring receiver 152 and the adapter 140. It is fitted. The second spring 154 is housed outside a rubber bellows 156, one end of which is hermetically locked to a load sensor described below and the other end of which is hermetically locked to the spring receiver 152.

The biasing force of the first spring 150 and the weights of the adapter 140 and the suction nozzle 34 are applied to the second spring 154 and the bellows 156. A cylindrical stopper 158 is provided on the outer peripheral portion of the spring bearing 152 of the support shaft 92 in parallel with the axis of the support shaft 92 and in a direction projecting upward. Therefore, when the adapter 140 contacts the stopper 158, the downward movement limit of the suction nozzle 34 due to the urging of the first spring 150 is defined. With the adapter 140 in contact with the stopper 158, the elastic force of the first spring 150 and the adapter 140
The first biasing force, which is the sum of the suction nozzle 34 and its own weight, is slightly larger than the second biasing force, which is the sum of the elastic forces of the second spring 154 and the bellows 156. The adapter 140 is pressed against the stopper 158 by the pressing force corresponding to the difference in power. This pressing force is applied to the suction nozzle 3 when the electronic circuit component 36 is suctioned.
4 is smaller than both the proper contact load of the electronic circuit component 36 and the proper contact load of the electronic circuit component 36 on the printed wiring board 12 at the time of mounting. By thus defining the movement limit of the suction nozzle 34 in the urging direction of the first spring 150, it is possible to favorably suppress the vibration of the suction nozzle 34 during movement or the like. Further, in this state, the first spring 150, the second spring 154 and the bellows 1
These load characteristics are determined so that 56 does not adhere to each other.

The suction nozzle 34 has a bottomed cylindrical suction tube holder 160 and a suction tube 162, and an engaging device including a leaf spring 166 prevents relative rotation with respect to the adapter 140 and relative movement in the axial direction. And, it is detachably held. The adsorption pipe 162 constitutes an adsorption portion, and the adsorption pipe holder 1
In the suction nozzle 34, the main body portion and the suction portion are integrally provided so that they cannot move relative to each other. The suction nozzle 34 is attached to the nozzle holder 30 via the adapter 140, It is held in the direction of forward and backward movement of 30, so as to be relatively movable in the axial direction and not relatively rotatable around the axis. In FIG. 3, reference numerals 170 and 172 are back plates that absorb light.

By attaching the suction nozzle 34 to the adapter 140, the suction tube holder 160 and the adapter 1 are attached.
A negative pressure chamber 176 is formed between the suction pipe 162 and the suction pipe 162, and the suction pipe 162 sucks the electronic component 36 by the negative pressure supplied from the passage 110 of the support shaft 92. A sealing device 180 is provided in the negative pressure chamber 176, and the suction pipe holder 160 and the adapter 1 are provided.
The airtightness between the bellows 40 and the bellows 15 is maintained.
6, the airtightness between the adapter 140 and the spline shaft portion 138 is maintained. In particular, the bellows 156 functions to prevent dust and the like from being sucked into the ball spline 144 together with the air without hindering the light movement of the adapter 140 with respect to the spline shaft portion 138.

The first and second springs 150 and 154
Each load of is detected by the load sensors 190 and 192. In the present embodiment, the load sensor 190 is the same as that shown in FIG.
As shown in FIG.
The load sensor 192 is provided between the second spring 154 and the bellows 156 and the adapter 140. These load sensors 190, 192
The configuration is substantially the same, and the load sensor 190 will be mainly described.

As shown in FIGS. 4 and 5, the load sensor 190 includes a plurality of strain gauges 194, in this embodiment, three strain gauges 194. These strain gauges 194
Are attached to the lower surface of a disc-shaped elastic plate 196 at equal angular intervals, and the elastic plates 196 are disc-shaped load plates 19 respectively.
It is sandwiched by 8 and the load plate 200 from both sides.

Each of the load plate 198 and the load plate 200 has a plurality of protrusions 20, three in this embodiment.
2, 204 are provided at equal angular intervals. Load plate 20
0 is adhered to the elastic plate 196 in the protrusion 204, just to the portion where the strain gauge 194 is attached, and the load plate 1
Reference numeral 98 denotes the elastic plate 196 at the protrusion 202 and the load plate 20.
It is adhered at a position which is 60 degrees out of phase with the protrusion 204 of 0.

Fitting holes 208, 210 and 212 are concentrically provided in the load plate 198, the elastic plate 196 and the load plate 200, respectively, and are fitted to the support shaft 92. The fitting hole 208 of the load plate 198 is accurately provided, and the center position of the load sensor 190 with respect to the support shaft 92 is accurate. Elastic plate 196, fitting holes 210, 2 of load plate 200
Each 12 is sized to fit into the support shaft 92 with a slight gap. 4 and 5, reference numeral 214 is a cover, which is provided on the load plate 198 and covers the elastic plate 196, the load plates 198, 200, and the like.

The load sensor 192, as shown in FIG.
The load sensor 190 has substantially the same configuration as that of the load sensor 190. Components having the same function are designated by the same reference numerals to indicate the corresponding relationship, and the description thereof will be omitted. One end of the bellows 156 is hermetically locked to the load plate 200, and the load sensor 192 is covered with a seal member 216. The seal member 216 is made of a soft and airtight material, for example, a soft synthetic resin, and maintains airtightness between the spline shaft portion 138 and the adapter 140.

Although not shown, a signal line for transmitting the detection signal of the load sensor 190 is provided through the inside of the rotating body 90, and the lifting member 74 is provided by a slip ring (not shown).
A signal is sent to the side. A signal line for transmitting a detection signal of the load sensor 192 is provided inside the adapter 140, and then, like the load sensor 190, provided inside the rotating body 90, and a signal is sent by a slip ring. Three strain gauges 194 for each of the load sensors 190 and 192
Respectively constitute a bridge circuit (not shown), the strain of the strain gauge 194 is converted into an electric signal by the bridge circuit, and is supplied to a control device described later via a signal processing circuit (not shown). .

The Y-axis slide 44 also has reference marks 24 provided on the printed wiring board 12, as shown in FIG.
A reference mark image pickup system 220 for picking up images is provided. Further, the X-axis slide 40 is located at positions corresponding to the two ball screws 50 that move the X-axis slide 40, respectively, and at positions between the component supply devices 20 and 22 and the wiring board conveyor 14, respectively. The component imaging system 230 is provided immovably.

This electronic component mounting system is controlled by the controller 250 shown in FIG. The control device 250 mainly includes a computer 252, and the computer 252 includes a PU (processing unit) 254,
The ROM 256, the RAM 258, and the input / output port 260 are connected by the bus line 262.

The input / output port 260 has an encoder 2
72, detectors such as load sensors 190 and 192, reference mark camera 266 of the reference mark imaging system 220.
Various computers such as an image processing computer 270 for analyzing data of an image captured by the component camera 268 of the component imaging system 222, an input device 276, etc. are connected. The input device 276 is configured to include, for example, a keyboard and a mouse which is a kind of pointing device.

The input / output port 260 is connected to the drive circuit 28.
Various actuators such as the X-axis slide movement motor 48 are connected via 0. In the present embodiment, various motors that are drive sources such as the X-axis slide movement motor 48 are
It is an electric motor, which is a type of rotary motor, and is a servo motor capable of controlling the rotation angle with high accuracy.
A step motor may be used instead of the servo motor.
Each rotation angle of the motor 48 and the like is detected by a rotation angle or an encoder that is a rotation amount detection device, and the motor 48 and the like are controlled based on the detection result. In Figure 7,
An encoder 272 provided for the Z-axis motor 78 is representatively shown. The encoder 272 is an absolute encoder in this embodiment. The elevating member 7 is detected based on the detection value of the encoder 272.
4. Consequently, the relative position in the axial direction of the nozzle holder 30 with respect to the Y-axis slide 44 is obtained, and the lowered position is obtained.
In this embodiment, the portion that processes the detection signals of the encoder 272 and the encoder 272 of the computer 252 to detect the position of the nozzle holder 30 constitutes a holder position detection device.

An alarm buzzer 290 is connected to the input / output port 260 via a drive circuit 280, and a display screen 296 is connected to the input / output port 260 via a control circuit 294. The alarm buzzer 290 is the alarm buzzer 29 of the computer 252.
An alarm device is configured with a part for controlling the ringing of 0.

As schematically shown in FIG. 8, the RAM 258 is provided with a contact load memory, a target position memory, a program memory, etc. together with a working memory, and stores various programs and data. The program memory stores various programs and data such as a main routine (not shown), a routine such as a contact load quality determination routine shown in FIG. 9 and the like, a program for mounting the electronic circuit component 36 on the printed wiring board 12, and the like. Remembered.
These programs and data may be read from an external storage device, or may be supplied from a host computer that controls a plurality of pairs of circuit board working systems including the electronic circuit component mounting system.

In the target position memory, the component supply device 20,
Lifting member 74 when receiving electronic circuit component 36 from 22
And a target position when the nozzle holder 30 is lowered and advanced in the axial direction with respect to the Y-axis slide 44, and the elevating member 74 and the nozzle holder 30 are lowered when the components are mounted and when the nozzle holder 30 is advanced in the axial direction. The target position is preset and stored. This target position may be set based on the design value of the mounting head. As described in Japanese Patent Laid-Open No. 8-279697, the target position may be set to the lower position of the elevating member 74 (nozzle holder 30). The relationship with the contact load of the electronic circuit component 36 may be acquired in advance and set based on that.

In the present embodiment, the printed wiring board 1
Prior to the start of mounting the electronic circuit component 36 on the second electronic component, the relationship between the lowered position of the elevating member 74 (nozzle holder 30) and the contact load of the electronic circuit component 36 is examined, and the acquired relationship and the target contact load, etc. Based on the above, the target position of the nozzle holder 30 and the suction nozzle 3 when the suction nozzle 34 takes out the electronic circuit component 36 from the component supply device 20, 22.
A target position of the nozzle holder 30 when the electronic circuit component 36 mounts the electronic circuit component 36 on the printed wiring board 12 is determined. The target contact load is determined by the suction nozzle 34 being the electronic circuit component 3
6 is a target contact load when the electronic circuit component 36 is brought into contact with the printed circuit board 12 and a proper contact load when the electronic circuit component 36 is brought into contact with the printed wiring board 12.

In the present embodiment, the relationship between the lowered position of the nozzle holder 30 and the contact load of the electronic circuit component 36 is as follows.
Obtained in the same manner as the electronic circuit component mounting head described in Japanese Patent Application Laid-Open No. 8-2799697, hold the electronic circuit component 36 in the suction nozzle 34, and contact the load cell (not shown) provided at the contact load detection position. Detected by. The nozzle holder 30 is further lowered from the state where the electronic circuit component 36 is in contact with the load cell, and the position of the lifting member 74 (nozzle holder 30) is calculated based on the output signal from the encoder 272 (falling distance from the origin position). Then, the calculation of the contact load based on the output signal from the load cell is repeatedly performed, and the relationship between the lowered position of the nozzle holder 30 and the contact load is acquired and stored. When the nozzle holder 30 descends after the electronic circuit component 36 comes into contact with the load cell, the suction nozzle 34 and the rotating body 90 move the first spring 1
The elastic force of the first spring 150 increases while the elastic force of the first spring 150 increases while the elastic force of the second spring 154 and the bellows 156 decreases, and the absolute values of increase and decrease of these elastic forces are allowed. In addition, the force obtained by adding the difference between the first urging force and the second urging force in the state where the adapter 140 is in contact with the stopper 158 becomes the difference in magnitude between the first urging force and the second urging force. A contact load equal to the size difference is detected by the load cell. The increase and decrease of the elastic force is proportional to the relative movement distance of the suction nozzle 34 with respect to the rotating body 90, that is, the descending distance of the nozzle holder 30,
The contact load increases linearly with the descending distance.

As described above, the relationship between the contact load and the position of the nozzle holder 30 (contact load and the rotary member 9 of the suction nozzle 34).
It can also be considered as a relationship with the relative movement amount with respect to 0), that is, if the spring characteristics of the first spring 150, the second spring 154 and the bellows 156 are known, the suction nozzle 34 is brought into contact with the electronic circuit component 36 with an appropriate contact load. It is possible to determine the target lowering position of the nozzle holder 30 and the lowering target position of the nozzle holder 30 that allows the electronic circuit component 36 to contact the printed wiring board 12 with an appropriate contact load. In this embodiment, for each of all types of suction nozzles 34 scheduled to be used,
The relationship between the lowered position of the nozzle holder 30 and the contact load is acquired and stored in advance. Multiple types of suction nozzle 34
The relationship between the lowered position of the nozzle holder 30 and the contact load is acquired by using a load cell for one of the above, and the relation between the lowered position of the nozzle holder 30 and the contact load is acquired for the other suction nozzles 34. .

The target position of the nozzle holder 30 when picking up electronic circuit components is, for example, the relationship between the contact load of each suction nozzle 34 and the lowered position of the nozzle holder 30, and the electronic circuit positioned at the load cell and the component supply portion of the feeder 28. Based on the vertical distance from the upper surface of the component 36 and the target contact load,
It is determined for each type of suction nozzle 34 and stored in the target position memory in association with the type of suction nozzle 34. In the present embodiment, the target contact load of the suction nozzle 34 at the time of receiving the components is set to the same size even if the type of the suction nozzle 34 and the type of the electronic circuit component 36 are different. The target contact load may be different depending on the type of electronic circuit component 36.

In the present embodiment, the height (vertical position) of the upper surface of the electronic circuit component 36 located in the component supply portion of the feeder 28 of the feeder type component supply device 20 is the same in each of the plurality of feeders 28. Has been In the tray-type component supply device 22, the heights of the upper surfaces of the plurality of electronic circuit components 36 held on the same tray 29 are set to be the same, and one of the plurality of tray accommodating boxes vertically stacked. In the present embodiment, the component supply position at which the electronic circuit component 36 is supplied is the height of the upper surface of the electronic circuit component 36 supplied by the tray 29 of the tray accommodation box positioned at the component supply position. The height is set to the same height as the upper surface of the electronic circuit component 36 positioned in the component supply unit. Feeder 2
The component supply position of the tray 29 may be set at a position where the upper surface of the electronic circuit component 36 is located at a height different from the height of the upper surface of the electronic circuit component 36 positioned in the component supply unit 8.

In the present electronic circuit component mounting system, the printed wiring board 12 is arranged by the printed wiring board holding device 16 so that the mounting surface has the same height even if the type of the printed wiring board 12 is different and the thickness is different. The nozzle holder 30 is held and the target position of the nozzle holder 30 is set to a position corresponding to the type of the electronic circuit component 36. The type of the suction nozzle 34 may be changed depending on the type of the electronic circuit component 36 to be mounted. Even if the type of the suction nozzle 34 is changed, the length of the suction pipe 162 is the same, and the nozzle holder 30 is It is assumed that the tip end surface of the suction pipe 162 or the vertical position of the suction surface in the state of being located at the rising end position is the same regardless of the type of the suction nozzle 34. In addition, the electronic circuit component 36
It is assumed that the type of the suction nozzle 34 that sucks the electronic circuit component 36 is determined to be one type according to the type. Furthermore, a target contact load is set for each type of electronic circuit component 36.

The relationship between the lowered position of the lifting member 74 and the contact load for each type of the suction nozzle 34, the vertical distance between the mounting surface of the printed wiring board 12 and the load cell, and the type of the electronic circuit component 36. A target position for lowering the nozzle holder 30 or the elevating member 74 is determined for each type of electronic circuit component 36 based on (shape, size, etc.) and the target contact load, and the target position is associated with the type of electronic circuit component 36. It is stored in memory.

When the electronic circuit component 36 is mounted on the printed wiring board 12 in the electronic circuit component mounting system, the printed wiring board 12 is carried in by the wiring board conveyor 14.
It is stopped at a preset stop position by the stop device and is held by the wiring board holding device 16. In that state, the reference mark imaging system 220 is moved by the XY robot 32, and the reference mark camera 266 images the reference mark 24 and the wiring board ID mark 26 provided on the printed wiring board 12. The image data of the reference mark 24 is image-processed to acquire the position of the printed wiring board 12, and each position error (horizontal position error) of the plurality of mounting positions is detected. Further, the image data of the wiring board ID mark 26 is image-processed to obtain the number or the like given to the printed wiring board 12 to which the electronic circuit component 36 is actually mounted.

Then, the suction nozzle 34 is connected to the component supply device 2
The electronic circuit component 36 is moved to 0, 22 and is moved to the printed wiring board 12 for mounting. If the printed wiring board 12 receives the electronic circuit component 36 from the component supply device 20, for example, the nozzle holder 30
Is moved by the XY robot 32 to the component supply unit of the feeder 28 to receive the electronic circuit component 36. When receiving, the elevating member 74 is lowered, and the nozzle holder 30
Is lowered.

At this time, the elevating member 74 is initially lowered at a high speed, but the suction nozzle 34 is moved to the electronic circuit component 36.
After approaching, the speed is smoothly reduced, and it is possible to prevent the contact load from increasing due to the inertia of the suction nozzle 34 when the electronic circuit component 36 contacts. The suction pipe 162 of the suction nozzle 34 contacts the electronic circuit component 36 before the nozzle holder 30 reaches the target position, and then the nozzle holder 3 further.
0 is lowered to the target position. The Z-axis motor 78 is controlled on the basis of the detection signal of the encoder 272, and the nozzle holder 30 causes the suction nozzle 3 to move against the Y-axis slide 44.
The target position is set in advance according to the four types, and the target position is lowered while the speed is controlled.

The lowering of the nozzle holder 30 after the suction nozzle 34 comes into contact with the electronic circuit component 36 is allowed by the suction nozzle 34 and the rotating body 90 compressing the first spring 150 and moving relatively. Until the suction nozzle 34 contacts the electronic circuit component 36, the stopper 158 is in contact with the adapter 140 in the mounting head, and there is a load that the stopper 158 receives, but the load is small and the suction nozzle 34 Also, the adapter 140 is in a state where its own weight is extremely small. Moreover, the suction nozzle 34
Is spline-fitted to the support shaft 92 at the ball spline 144 via the adapter 140, and the frictional resistance is extremely small. The suction nozzle 34 is attached to the electronic circuit component 36, and the elastic force of the first spring 150 and the adapter 14 are applied.
A contact load having a magnitude equal to the difference in biasing force obtained by subtracting the second biasing force, which is the elastic force of the second spring 154 and the bellows 156, from the first biasing force, which is 0 and the own weight of the suction nozzle 34, The electronic circuit component 3 has a contact load smaller than the total weight of the suction nozzle 34 and the adapter 140.
6 to securely adsorb the electronic circuit component 36 by negative pressure.

After the suction of the electronic circuit component 36 and before the movement to the mounting position of the printed wiring board 12, the suction nozzle 3
An image of the electronic circuit component 36 held by the image pickup device 4 is captured by the component image capturing system 222, and a position error (horizontal position error) in the X-axis and Y-axis directions orthogonal to each other in the horizontal plane of the electronic circuit component 36 based on the image capturing result. And the position error around the axis (rotational position error) is calculated. The horizontal position error is corrected by correcting the stop position of the suction nozzle 34 in the X-axis direction and the Y-axis direction, and the rotational position error is corrected by rotating the nozzle holder 30 by the holder rotating device 72. Electronic circuit component 36
In addition to the correction of the horizontal position error of (1), the horizontal position error of the mounting position of the printed wiring board 12 and the center position deviation of the electronic circuit component 36 caused by the rotation of the suction nozzle 34 are corrected.

The suction nozzle 34 is moved to the mounting position of the printed wiring board 12 and then lowered to mount the electronic circuit component 36 on the printed wiring board 12. Also at this time, the elevating member 74 is decelerated before the electronic circuit component 36 comes into contact with the printed wiring board 12, and an increase in the contact load due to the inertial force of the suction nozzle 34 is avoided. The elevating member 74 or the nozzle holder 30 is lowered to a predetermined target position, and the electronic circuit component 36 is brought into contact with the printed wiring board 12 with an appropriate contact load. Even when the electronic circuit component 36 is mounted on the printed wiring board 12, the Z-axis motor 78 is controlled based on the detection signal of the encoder 272, and the nozzle holder 30 is set at the target position set according to the type of the electronic circuit component 36. It is lowered while controlling the speed to.

Even when the electronic circuit component 36 is mounted on the printed wiring board 12, the second spring 154 and the bellows 156 are provided.
The electronic circuit component 36 is urged by the
Until it contacts the suction nozzle 34 and the adapter 1.
The own weight of 40 is extremely small, and the electronic circuit component 3
6 is attached to the printed wiring board 12 with a contact load smaller than the sum of the respective weights of the suction nozzle 34 and the adapter 140. The electronic circuit component 36 contacts the printed wiring board 12 before the nozzle holder 30 descends to the target position, and the subsequent lowering of the nozzle holder 30 is allowed by the compression of the first spring 150. The difference is equal to the biasing force obtained by subtracting the second biasing force from the first biasing force, and the printed wiring board 12 can be contacted with a small contact load. After mounting the electronic circuit component 36 on the printed wiring board 12, the nozzle holder 30 is raised and retracted from the target position. After the supply of the negative pressure is cut off and the positive pressure is supplied to the suction nozzle 34, the suction nozzle 34 is communicated with the atmosphere to release the electronic circuit component 36, and is separated from the electronic circuit component 36.

As described above, when the electronic circuit component 36 is mounted on the printed wiring board 12, the first and second springs 15 are attached.
The loads 0 and 154 are detected by the load sensors 190 and 192, and the actual contact load of the electronic circuit component 36 on the printed wiring board 12 (hereinafter referred to as the actual contact load) is detected. After the nozzle holder 30 is lowered and the electronic circuit component 36 is brought into contact with the printed wiring board 12, when the nozzle holder 30 is further lowered, the first spring 150 is compressed and the elastic plate 1 in the load sensor 190 is compressed.
96 is pushed by the load plate 198 and the strain of the strain gauge 194 increases. On the other hand, the second spring 154 and the bellows 1
56 expands as the nozzle holder 30 descends after the electronic circuit component 36 contacts the printed wiring board 12, the force applied to the elastic plate 196 in the load sensor 192 decreases, and the strain of the strain gauge 194 decreases.

The contact load of the electronic circuit component 36 on the printed wiring board 12 is calculated in the computer 252 based on the output signals of the load sensors 190 and 192. The weights of the suction nozzle 34 and the adapter 140 are known by design, and the first biasing force is obtained based on these and the elastic force of the first spring 150 obtained based on the detection signal of the load sensor 190. , Load sensor 192
The second urging force is obtained by the elastic force of the second spring 154 and the bellows 156 obtained based on the detection signal of 1., and the actual contact load is obtained by subtracting the second urging force from the first urging force. Here, the weight of the electronic circuit component 36 is ignored, but the actual contact load may be obtained based on the weight of the electronic circuit component 36. Load sensor 1
The actual contact load may be calculated based on the detection signals of 90 and 192 and input to the computer 252.

The calculation of the contact load may be repeated every minute time from when the nozzle holder 30 starts to descend until it reaches the target position, and the electronic circuit component 36 contacts the printed wiring board 12. After that, it may be repeated every minute time, or when the nozzle holder 30 reaches the target position. The contact of the electronic circuit component 36 with the printed wiring board 12 can be seen, for example, from the lowered position of the nozzle holder 30.

The reaction force that the nozzle holder 30 receives from the printed wiring board 12 when the electronic circuit component 36 is mounted on the printed wiring board 12, and the printed wiring board 12 of the electronic circuit component 36.
Although the direction is opposite to the contact load on the nozzle holder 30, the size is the same.
The reaction force received by the nozzle holder 30 when the nozzle is lowered is detected. In the present embodiment, the load sensors 190, 19
2 and load sensors 190, 19 of the computer 252
The part for calculating the actual contact load based on each detection signal of 2 constitutes a contact load detecting device which is a reaction force detecting device.

The contact load obtained when the nozzle holder 30 reaches the target position is the actual contact load. In the computer 252, the acquired actual contact load is used as data for specifying the printed wiring board 12, for example, a number. In addition to associating with each other, it is stored in the contact load memory of the RAM 252 in association with the mounting position of the electronic circuit component 36. Data for identifying the printed wiring board 12 is the wiring board ID mark 2
6, the mounting position is obtained from the mounting program.

Each time one electronic circuit component 36 is mounted on the printed wiring board 12, a contact load quality determination routine and a maintenance necessity determination routine shown in the flowcharts of FIGS. 9 and 10 are executed.

The contact load quality determination routine will be described. The nozzle holder 30 should be lowered to a preset target position, and the electronic circuit component 36 should be brought into contact with the printed wiring board 12 with an appropriate target load, but contact should be made with a load deviating from the target contact load. Sometimes it is. For example, the thickness error of the electronic circuit component 36, the printed wiring board 12
Error in spring height, springs 150 and 154
The contact load of the electronic circuit component 36 may deviate from the target contact load due to variations in eigenvalues, deterioration, deterioration of the suction nozzle 34, and the like. Therefore, the contact load quality determination routine is performed, and the quality of the actual contact load is determined.

Step 1 of the contact load quality judgment routine
In (hereinafter, abbreviated as S1. The same applies to other steps), it is determined whether or not the absolute value of the difference between the actual contact load and the target contact load is equal to or greater than the first set value. The first set value is a kind of first set state. If the absolute value of this difference is smaller than the first set value, the electronic circuit component 36 may be mounted on the printed wiring board 12 with an appropriate load, the determination result of S1 is NO, and S2 is executed, It is displayed on the display screen 296 that the contact load has an appropriate size and is good. It is displayed that the actual contact load or reaction force is within the preset contact load range or reaction force range.

Further, the display device 296 displays which of a plurality of preset levels the actual contact load belongs to. In the present embodiment, since the target contact load at the time of mounting the component is made different according to the type of the electronic circuit component 36, not the actual contact load itself, but a value obtained by subtracting the target contact load from the actual contact load (contact load Which of the preset stages the difference belongs to is displayed. In the present embodiment, the stage representing the degree of the contact load difference is set to a plurality of stages, for example, 10 stages, and the fourth to sixth stages are the stages where the actual contact load is within the proper range, and the first stage. Or, the third stage is a stage where the actual contact load exceeds the proper range and is insufficient, and the seventh stage to the tenth stage is a stage where the actual contact load exceeds the proper range and is excessive. In the 1st stage to the 3rd stage, the smaller the number of stages, the larger the contact load difference, and the larger the deviation of the actual contact load from the target contact load. In the 7th to 10th stages, the larger the number of stages, the larger the contact load. The difference is large, and the actual contact load deviates greatly from the target contact load.

The fourth stage to the sixth stage are, for example, stages obtained by equally dividing the range obtained by adding positive and negative signs to the first set value into three, and the first stage to the sixth stage. The three steps are obtained, for example, by equally dividing a range between a value obtained by adding a negative sign to the first set value and a value obtained by adding a negative sign to a second set value described later into three. Staged. In the seventh to tenth steps, for example, the range between the value in which the first set value is given a positive sign and the value in which the second set value is given a positive sign is equally divided into four. It is a stage obtained by.

At S2, it is determined and displayed which of the fourth stage to the sixth stage the contact load difference belongs to. As a result, the operator can know that the actual contact load is within the set load range and also the degree of goodness. In S2, the acquired actual contact load is also displayed on the display screen 296. The actual contact load is displayed on the display screen 296 together with, for example, the type and number of the printed wiring board 12, the type of the electronic circuit component 36, and the mounting position.
Only the actual contact load may be displayed.

On the other hand, if the absolute value of the contact load difference is greater than or equal to the first set value, the determination result of S1 is YES and S
3 is executed, and it is determined whether or not the absolute value of the contact load difference is equal to or larger than the second set value. The second set value is larger than the first set value. For example, a situation where the absolute value of the contact load difference exceeds the second set value should not normally occur, and if it exceeds even once, the mounting work is The size is set so that it is necessary to stop immediately and determine the cause of the situation and eliminate the cause of the abnormality.

When the absolute value of the contact load difference is equal to or larger than the first set value but smaller than the second set value, the determination result of S3 is NO, S4 is executed, and the alarm buzzer 290 is sounded. , It is reported that the actual contact load is not large but is out of the proper range. Alarm buzzer 290
The audible alarm informs the operator that there is an electronic circuit component 36 mounted on the printed wiring board 12 with a contact load outside the proper range. In S4, the display screen 296 also shows that the contact load is not proper (good), the actual contact load, the stage to which the actual contact load belongs, the type and number of the printed wiring board 12, the type of the electronic circuit component 36, the mounting position, etc. Is displayed. The difference between the actual contact load and the target contact load may be displayed with positive and negative signs.

On the other hand, if the absolute value of the contact load difference is not less than the second set value, the determination result of S3 is YES and S
5 is executed and the operation of the electronic circuit component mounting system is stopped. Also, as in S4, the display screen 2
At 96, the actual contact load and the like are displayed. The worker performs processing so that the electronic circuit component 36 is mounted on the printed wiring board 12 with an appropriate contact load based on the stoppage of the operation of the electronic circuit component mounting system. This processing is performed, for example, in the same manner as the maintenance of the electronic circuit component mounting system described below, and the operation of the system is restarted after the processing.

The maintenance necessity determination routine shown in FIG. 10 will be described. In S11 of this routine, statistical processing is performed. The statistical processing is performed based on the actual contact load stored in the contact load memory. In the present embodiment, the target contact load at the time of component mounting differs depending on the type of electronic circuit component 36, and for example, statistical processing is performed for each type of electronic circuit component 36. At this time, a statistical process is performed for each type of electronic circuit component 36 when the number of mounted components exceeds the set number.

Of a large number of actual contact loads for each type of electronic circuit component 36, the actual contact load obtained by excluding a set number of values on the side where the target contact load is maximum and on the side where the target contact load is minimum is set. , Their average value is calculated and compared with the target contact load. If there is an electronic circuit component 36 in which the difference between the average value of the actual contact load and the target contact load is out of the setting range, and the difference is out of the setting range and the number of types of electronic circuit components 36 is the set number or more, maintenance is required. It is supposed to be. The number of settings may be one or more.

Then, in S12, it is determined whether or not maintenance is required. If maintenance is not required, the determination result in S12 is NO and the routine is finished. Note that the number of data statistically processed in S11 is determined. For example, when the number of mounted electronic circuit components 36 of each of the plurality of types exceeds the set number, old data is erased and new data is stored. Is
Statistical processing is performed.

On the other hand, if maintenance is required, the determination result in S12 is YES and S13 is executed. The maintenance is displayed on the display screen 296 to notify the operator. The alarm buzzer 290 may be sounded together with the display on the display screen 296. At this time, the alarm buzzer 290 is rung in a manner different from S4 of the contact load quality determination routine and capable of notifying that maintenance is required. Alternatively, a voice alarm, which is a type of a notification device, may be provided to notify by voice that maintenance is required. At this time, the notification device functions as an alarm device.

In the contact load quality judgment routine,
The first set value for determining whether the absolute value of the difference between the actual contact load and the target contact load is within the appropriate range is:
In the present embodiment, it is set to a relatively small value, and the proper range or target range of the load obtained thereby is determined in the statistical processing of S11 of the maintenance necessity determination routine in order to determine whether maintenance is necessary. It is narrower than the setting range of. Therefore, normally, S1
The alarm buzzer 290 is sounded before it is determined that the maintenance is required in 2, and the operator is informed that the contact load is out of the appropriate range, and the maintenance may be performed soon. It will be announced in advance. The first set value is set to a value that provides a wider setting range than the setting range for determining whether maintenance is required, and the more the alarm buzzer 290 is sounded, the more the actual contact load with respect to the target contact load is set. The maintenance may be performed before the detachment becomes large.

When a message indicating that maintenance is required is displayed and notified, the worker performs maintenance.
As a cause of the electronic circuit component 36 being mounted with a contact load outside the proper range, for example, as described above,
Besides the deterioration of the first and second springs 150 and 154, the load sensors 190 and 192 may be abnormal.

Therefore, first, the load sensors 190, 19
Check whether 2 is abnormal. For example, a load cell, which is a kind of load detection device, is provided on the upper surface of the constituent member of the printed wiring board holding device 16, and the elevating member 74 is lowered to a predetermined position on the load cell. At this time, the suction nozzle 34 may or may not hold the electronic circuit component 36. The descending position of the elevating member 74 is set to a position where relative movement in the axial direction occurs between the suction nozzle 34 and the nozzle holder 30, and the nozzle holder 30 is further lowered from the state where the suction nozzle 34 is in contact with the load cell. The contact load detected by the load cell when the nozzle holder 30 reaches the set descending position is compared with the contact load obtained based on the detection signals of the load sensors 190 and 192. There is no abnormality in the load cell, and the load should be detected accurately. If the two values match, it is determined that the load sensors 190 and 192 are normal.

If the two values do not match and the difference exceeds the set range, it can be seen that the load sensors 190, 192 are abnormal. In this case, for example, calibration is performed, and the load sensors 190,
When the actual contact load is calculated based on each detection value of 192, the deviation of the output values of the load sensors 190, 192 is corrected. The calibration may be automatically performed based on, for example, the difference between the contact load detected by the load cell and the contact load obtained based on the detection signals of the load sensors 190 and 192. It may be performed based on what the person inputs using the input device 276. If the contact load obtained based on the detection signals of the load sensors 190 and 192 and the contact load detected by the load cell do not match even if the calibration is performed again and the inspection is performed again, for example, It is considered that the load sensors 190 and 192 have deteriorated, and the load sensors 190 and 192 are replaced, for example.

If the load sensors 190 and 192 are not abnormal, the cause of the deviation of the actual contact load from the target contact load is
Thought to be elsewhere. The result of the statistical processing is displayed on the display device 2.
96, the operator seeks the cause based on the result of the statistical processing. For example, if the contact load deviates only for a specific electronic circuit component 36 among a plurality of types of electronic circuit components 36, it is considered that the thickness error of the electronic circuit component 36 is the cause. In this case, based on the difference between the average value of the actual contact load and the target contact load, the difference is eliminated, and the target position set for the electronic circuit component 36 may be changed so that the target contact load is obtained. . For example, the operator obtains the difference between the average value of the actual contact load and the target contact load, obtains and inputs the increase / decrease amount of the contact load, and gives an instruction to change the target position of the nozzle holder 30. Alternatively, the operator may obtain and input the change amount and direction of the target position based on the difference between the average value of the actual contact load and the target contact load.

Further, for example, if the deviation exceeds the setting range of the difference between the average value of the actual contact load and the target contact load, the suction nozzle 34 for mounting the electronic circuit component 36 is common among the plurality of types of electronic circuit components 36. If it occurs in the electronic circuit component 36, it is considered that the suction nozzle 34 has a cause. Therefore, the suction nozzle 34 is checked, and if the tip surface of the suction pipe 162 is worn or the like and further use is not appropriate, the suction nozzle 34 is replaced with a new suction nozzle 34. If the suction nozzle 34 can still be used, the target position of the nozzle holder 30 is changed for the electronic circuit component 36 mounted by the suction nozzle 34. The suction nozzles 34 are made with high dimensional accuracy, and if the types are the same, the nozzle holder 3 acquired for the suction nozzles 34 of that type.
It is possible to use the relationship between the lowered position of 0 and the contact load.

If a deviation exceeding the setting range of the difference between the average value of the actual contact load and the target contact load occurs regardless of the type of electronic circuit component 36 and the type of suction nozzle 34, it is common to them. It is thought that there is a cause. For example, deterioration due to the first and second springs 150 and 152, a vertical movement control error of the vertical movement member 74, a vertical positioning error of the printed wiring board 12, and the like are considered. On this occasion,
For example, the operator causes the computer 12 to obtain the relationship between the average value of the actual contact loads of all types of electronic circuit components 36 that have been statistically processed and the target contact load. For example, a regression line, which is a straight line that defines the relationship between the two, is obtained by the least-squares method or the like and displayed on the display screen 296. Then, based on the result, the operator obtains the amount of increase / decrease of the contact load necessary to obtain the target contact load for each type of the electronic circuit component 36, inputs it by the input device 276, and Instruct to change the target position. Alternatively, the operator may obtain and input the change amount and direction of the target position based on the increase / decrease amount of the contact load.

If the instruction to change the target position of the nozzle holder 30 is issued, S21 of the target position changing routine shown in FIG. 11 is executed.
The determination result of is YES and S22 is executed, and the target position is changed to a position where the actual contact load should be the target contact load. The computer 252 has data for setting the relationship between the target position of the nozzle holder 30 and the contact load for each type of the suction nozzle 34, and based on the data and the increase / decrease amount of the contact load, the computer 252 The target position of the nozzle holder 30 is changed for each type. At this time, the target position set in the initial or previous time may be left as it is, and a new target position may be set, and the actual target position actually used during mounting may be set. The actual target position may be set by setting.

Whether the target position is changed for a specific electronic circuit component 36 or all the electronic circuit components 36, the lowered position of the nozzle holder 30 according to the type of the suction nozzle 34 is determined in S22. The target position is changed based on the relationship between the contact load and the contact load, the increase / decrease amount of the contact load, and the current target position.

The operator may obtain and input the change amount and direction of the target position of the nozzle holder 30 based on the increase / decrease amount of the contact load, and the computer 252 may change the target position accordingly.

By changing the target position of the nozzle holder 30 as described above, the abnormality of the contact load caused by the deterioration of the first and second springs 150 and 154, the vertical positioning error of the printed wiring board 12, and the like is eliminated. .

Even if the maintenance is performed in this way, if the absolute value of the difference between the actual contact load and the target contact load becomes large, becomes equal to or larger than the first set value, and further becomes equal to or larger than the second set value. , The electronic circuit component mounting system is deactivated. Then, the worker finds and corrects the cause of the abnormality in the contact load as in the maintenance.

As is clear from the above description, in this embodiment, the lifting / lowering member 74, the lifting / lowering member driving device 76, and the portion of the controller 250 that controls the lifting / lowering member driving device 76 constitute the holder lifting / lowering device 70. There is. Further, the part of the controller 250 that executes S2, S4 and S5 constitutes a reaction force display section, a reaction force quality display section and a stage display section,
The display screen 296 and the part that controls the display screen 296 of the control device 250 constitute the display device. The display device is mainly a device for performing various displays required in the electronic circuit component mounting system, and also serves as a display device of the electronic circuit component mounting head in the present embodiment. The display device is provided stationary and fixed in position, whereas the main part of the electronic circuit component mounting head such as the nozzle holder 30 is provided on the Y-axis slide 44. In the present embodiment, Part of the mounting head body is Y
The mounting head main body is also formed by being integrally provided with the shaft slide 44 and also provided with the control device 250 and the display device of the electronic circuit component mounting system. It can be considered that the Y-axis slide 44 constitutes a part of the mounting head main body. Further, the part of the controller 250 that executes S5 constitutes an automatic stop part, the part that executes S11 forms a reaction force statistical processing part that forms a maintenance necessity determination part, and the part that executes S13 requires maintenance. The notification unit is configured, and the part that executes S22 is the target position changing unit.

The load of the spring that biases the electronic circuit component may be detected on the axis of the spring. Further, it is not indispensable to apply the elastic forces of the two springs to the suction nozzle in opposite directions to reduce or increase the elastic force of the spring and the dead weight of the suction nozzle. It is also possible to just urge it away from the nozzle holder. Those embodiments will be described based on FIG.

Also in the present embodiment, X in the above embodiment is used.
An elevating member 350 is vertically movable on a Y-axis slide (not shown) of an XY robot configured in the same manner as the Y robot 32, and is moved up and down by an elevating member driving device 352. The elevating / lowering member drive device 352 includes a Z-axis motor 354 as a drive source configured by a pulse motor, a ball screw 356, and a nut 358.
The elevating member 350 is moved up and down by rotating 56 by the Z-axis motor 3554.

Inside the elevating member 350, the nozzle holder 36
6 is held so as to be relatively immovable and relatively rotatable in the axial direction. The lifting member 350 and the nozzle holder 36
All of 6 are actually composed by assembling a plurality of members. An adapter 370 is fitted in the nozzle holder 366 so as to be relatively movable in the axial direction and not relatively rotatable, and detachably holds the suction nozzle 382. Nozzle holder 3
66 is rotated about the vertical axis by a holder rotating device 376 having a θ-axis motor 374 as a drive source, and the adapter 370 and the suction nozzle 382 are rotated. The suction nozzle 382 includes a suction tube holder 384 and a suction tube 386.
Have and.

The suction nozzle 382 is connected to a negative pressure source, a positive pressure source, and atmosphere (not shown) by an axial passage 390, a radial passage 392, a rotary joint 394, a hose 396, etc. provided in the adapter 370. By selectively switching the electromagnetic directional control valve (not shown), the negative pressure source, the positive pressure source and the atmosphere can be selectively communicated. Rotary joint 394
Includes an annular passage 398, 400, 402, 404 and a radial passage 406, 408, 410, which allows the suction nozzle 382 and the negative pressure source to be connected even when the nozzle holder 366, the adapter 370 and the suction nozzle 382 are rotated. It is designed to maintain communication.

Between the adapter 370 and the nozzle holder 366, a compression coil spring (hereinafter abbreviated as spring) 420, which is a kind of biasing means, is arranged, and the suction nozzle 382 mounts the adapter 370. It is urged downward by the spring 420 via. Between the spring 420 and the nozzle holder 380,
A load member 422 and a load cell 424, which is a type of load sensor, are provided in series, and the load applied to the suction nozzle 382 by the spring 420 is detected. Adsorption nozzle 38 by biasing spring 420
The movement limit of 2 is defined by the large diameter portion 426 of the adapter 370 contacting the shoulder surface 428 of the nozzle holder 366.

Although not shown, the electronic circuit component mounting system of the present invention is also controlled by a control unit mainly composed of a computer, like the electronic circuit component mounting system of the above-described embodiment. The detection signal of the load cell 424 is supplied to the computer.

At the time of sucking the electronic circuit component, the nozzle holder 366 is moved to the component supply device and is lowered, and the suction nozzle 382 is negatively pressured to cause the electronic circuit component 4 to move.
Adsorb 30. After suction, the suction nozzle 382 is moved to the printed wiring board 432 by the XY robot and the electronic circuit component 430 is mounted on the printed wiring board 432.

At this time, the elevating member 350, the nozzle holder 366, the adapter 370 and the suction nozzle 382 are provided until the electronic circuit component 430 contacts the printed wiring board 432.
Are lowered integrally. In the same manner as in the above-described embodiment, the descending speed control of the nozzle holder 366 is performed both when picking up a component and when mounting a component. In the lifting member 350 or the nozzle holder 366, the electronic circuit component 430 is the printed wiring board 4
After being brought into contact with 32, it is further lowered by a small distance.
Since the nozzle holder 366 is lowered to the target position, the elevating member 350 and the nozzle holder 366 are lowered with respect to the adapter 370. This lowering is allowed by the compression of the spring 420, and the contact load of the electronic circuit component 430 on the printed wiring board 432 increases. The compression of the spring 420 increases the strain of the load cell 424, the load applied by the spring 420 to the electronic circuit component 430 is converted into an electric signal, and the electric signal is output, and the elastic force of the spring 420 and the respective weights of the adapter 370 and the suction nozzle 382 increase. Based on this, the contact load of the electronic circuit component 430 on the printed wiring board 432 is acquired. Although description is omitted, also in the present embodiment, similarly to the above-described embodiment, the quality of contact load, the necessity of maintenance, and the like are determined, and the acquired contact load and the like are displayed on the display screen. Be seen. In the present embodiment, the portion that calculates the contact load based on the detection signals of the load cell 424 and the load cell 424 of the control device constitutes the reaction force detection device.

The present invention is disclosed in, for example, Japanese Patent Laid-Open No. 2001-473.
As disclosed in Japanese Patent Publication No. 85-85, it is also applicable to an electronic circuit component mounting head in which the contact load of the electronic circuit component is changed by controlling the pressure in the pressure chamber of the cylinder. This electronic circuit component mounting head will be briefly described with reference to FIGS. 13 and 14.

The nozzle holder 500 of the electronic circuit component mounting head of this embodiment is moved to an arbitrary position on a horizontal XY coordinate plane by an XY robot (not shown) and is moved up and down by a holder lifting device (not shown). To be made. The nozzle holder 500 includes a holder body 501 and a cylinder 502. Piston 5 slidably fitted in cylinder housing 510 of cylinder 502
12 is provided with a piston rod 514 projecting,
The suction nozzle 516 is fixedly held, and the electronic circuit component 5 is driven by the negative pressure supplied by the negative pressure supply device 518.
Adsorb 20.

Piston 512 and piston rod 51
4 is supported by a cylinder housing 510 via a gas bearing. A pressurized gas controlled to a constant pressure is supplied from the bearing gas supply device 522 to the fitting gaps between the piston 512 and the piston rod 514 and the cylinder housing 510, so that the piston 512 and the piston rod 514 move to the cylinder housing. It is supported by 510 in a non-contact manner so as to be slidable in the axial direction.

The pressure chamber 5 is provided in the cylinder housing 510.
30, 532 are provided, and the pressure control device 534 shown in FIG. 14 is connected. Pressure control device 534
Is a pressure regulator 538 for reducing the pressure of the pressurized gas that is the pressurized gas from the pressurized gas source 536 to a set constant pressure, and a pressure control valve 540 connected to the pressure chambers 530 and 532. 542 and a controller 544 are provided. The control device 544 is mainly composed of a computer, and the respective pressures of the pressure chambers 530 and 532 are detected by the pressure sensors 546 and 548 and supplied to the computer. A display screen 549 and an input device 551 are also connected to the control device 544. In FIG. 14, reference numeral 550 is a pressure regulator, and the pressurized gas source 5
The pressure at 36 is controlled and supplied between the piston 512 and piston rod 514 and the cylinder housing 510.

In this embodiment, the pressure control valve 54
A proportional electromagnetic pressure reducing valve with a relief valve is used as 0, 542, and the control device 544 controls the contact loads of the plurality of types of electronic circuit components 520 held by the suction nozzle 516 and mounted on the printed wiring board, The pressures of the pressure chambers 530 and 532 are controlled so as to be equal to the target contact load set for each of the electronic circuit components 520 and stored in the storage device. The contact load F of the electronic circuit component 520 is
It is represented by F = (P1−P2) × S + W. However, P1
Is the pressure in the pressure chamber 530, P2 is the pressure in the pressure chamber 532, S
Is the cross-sectional area of the piston 512, and W is the weight of the piston 512, the suction nozzle 516, and the electronic circuit component 520. The weight of the electronic circuit component 520 may be ignored. Then, the respective pressures of the pressure chambers 530 and 532 for obtaining the target contact load are determined from the target contact load, and the pressure control valves 540 and 542 are set so that the detection values of the pressure sensors 546 and 548 become equal to the determined pressure. The supply current to is controlled.

When the electronic circuit component 520 is mounted on the printed wiring board, the nozzle holder 500 is moved to the component supply device, and after the suction nozzle 516 sucks the electronic circuit component 520, it is moved to the printed wiring board and mounted. To do.
At this time, the nozzle holder 500 is moved down to a preset target position while its speed is controlled by the lifting device.
The nozzle holder 500 is further lowered after the electronic circuit component 520 contacts the printed wiring board. At the start of lowering of the nozzle holder 500, the piston 512 has a large head portion 552 with a shoulder surface 554 of the cylinder housing 510.
Contacting the printed wiring board of the electronic circuit component 520, the piston 512 and the piston rod 5 are in contact with each other.
As 14 moves relative to the cylinder housing 510, the head 552 moves away from the shoulder surface 554. Then, although the volumes of the pressure chambers 530 and 532 change, the pressure control valve 5
Due to the action of 40 and 542, the respective pressures of the pressure chambers 530 and 532 are maintained at the heights for mounting the electronic circuit component 520 on the printed wiring board with the preset target contact load. Therefore, it is not necessary to precisely adjust the lowered position of the nozzle holder 500. Specifically, the lowered position of the nozzle holder 500 may be set to any position as long as the head 552 is separated from the shoulder surface 554 and does not come into contact with the upper end surface of the cylinder bore. is there.

When the electronic circuit component 520 is mounted on the printed wiring board as described above, the actual contact load of the electronic circuit component 520 is determined based on the respective pressures of the pressure chambers 530 and 532 detected by the pressure sensors 546 and 548. As in the above-described respective embodiments, the contact load quality determination routine or the like is calculated, and the actual contact load or the like is displayed on the display screen 549. Then, when the worker is notified that the maintenance is necessary, the operator searches for and corrects the cause of the actual contact load deviating from the target contact load.

In this electronic circuit component mounting head, the cause of the actual contact load deviating from the target contact load beyond the set range is, for example, an error in the command value of the amount of current supplied to the pressure control valves 540 and 542, pressure control. Deterioration, abnormality, etc. of the valves 540 and 542 are considered. Then, when the operator finds the cause, for example, based on the display of the display screen 549,
Input device 5 for deviation of actual contact load from target contact load
Input to computer using 51. In the computer based on the input, for example, the pressure control valve 54
The increase / decrease value of the supply current to 0 is calculated, and the pressure of the pressure chamber 530 is changed so that the target contact load is obtained. The increase / decrease value of the supply current of the pressure control valve 540 may be obtained and input by the operator. In this embodiment, the pressure sensors 546 and 546 are used.
548 and pressure sensors 546, 54 of controller 544
The portion that calculates the actual contact load based on the detection signal of 8 constitutes a reaction force detection device.

The contact load of the suction nozzle on the electronic circuit component at the time of receiving the component may be different depending on the type of the electronic circuit component. The types of electronic circuit components may be different or the same.

Further, the contact load of the suction nozzle to the electronic circuit parts is detected at the time of receiving the parts, and whether the quality is good or not and the necessity of maintenance is judged, and if necessary, the target position of the nozzle holder is changed. The contact load may be corrected. Similar to the case of mounting the component, based on the detection of the contact load, the display of the actual contact load, the judgment result of the quality, the stage to which the contact load belongs, etc. may be displayed.

Further, the contact load or the like may be displayed on the display screen only when it is out of the proper range.

Further, the processing for matching the actual contact load with the target contact load, such as changing the target position of the nozzle holder based on the statistical processing, may be automatically performed. As a result of statistical processing, if there is an electronic circuit component whose actual contact load is out of the appropriate range, self-diagnosis is performed to find the cause of the deviation, and the target position is automatically changed according to the deviation. To do.

Furthermore, when displaying the stage to which the contact load belongs, the number of stages may be, for example, three or five.

Further, in the electronic circuit component mounting head of the electronic circuit component mounting system 10, the first spring 15
The limit of movement of the suction nozzle 34 due to the bias of 0 is the stopper 1
However, the stopper 158 may be omitted. In this case, when the nozzle holder 30 is in the raised position, the suction nozzle 34 is in a position where the first urging force and the second urging force are in balance, and the electronic circuit component 36 is mounted on the printed wiring board 12. At that time, the contact load increases from zero.

In the electronic circuit component layer mounting head of the electronic circuit component mounting system 10, the second spring 15 is used.
4 may be omitted. In this case, a stopper is provided that defines the movement limit of the suction nozzle 34 due to the urging of the first spring 150.

Furthermore, in each of the above embodiments, the alarm device is a device including an alarm buzzer, but it may be a device including both an alarm buzzer and an alarm lamp, or may be a device including only an alarm lamp.

The data for setting the relationship between the target position of the nozzle holder and the contact load may be set based on the design data of the electronic circuit component mounting head.

Further, in each of the above embodiments, the reaction force display, the reaction force pass / fail display, the step display, the alarm by the alarm device,
Although the automatic stop of the component mounting head, the maintenance necessity determination, and the target position change based on the statistical processing are performed, at least one of them may be performed.

Furthermore, the present invention includes a rotating body and a rotating body rotating device for rotating the rotating body, and the rotation of the rotating body causes the suction nozzles held by the plurality of nozzle holders held by the rotating body to be sequentially held. , Moved to multiple stop positions to receive electronic circuit components at the component receiving position,
It can also be applied to an electronic circuit component mounting head of an electronic circuit component mounting system for mounting an electronic circuit component on a circuit board at a component mounting position. In this mounting head, the holder advancing / retreating device is provided at the component receiving position and the component mounting position, and the reaction force received by the nozzle holder when the nozzle holder advances by the holder advancing / retreating device is detected by the reaction force detection device, and the reaction force related information is displayed. To be displayed on the device. The present invention also relates to a plurality of rotating members which are rotatable independently of each other around a common pivot axis, and the rotating members.
A plurality of rotating members, each of which includes a rotating motion imparting device that makes one revolution around the swivel axis, includes one or more stops during the revolution, and imparts rotating motions having a constant time difference from each other. The present invention can also be applied to an electronic circuit component mounting head of an electronic circuit component mounting system that causes an adsorption nozzle held by a nozzle holder provided in each of the above to receive and mount an electronic circuit component. The rotating body and the rotating body rotating device, or the rotating member and the rotating motion imparting device may be further moved by a moving device in a plane parallel to the mounting surface of the circuit board.

Although some embodiments of the present invention have been described in detail above, these are merely examples, and the present invention is described in the above-mentioned [Problems to be solved by the invention, means for solving problems and effects]. Various modifications and improvements can be made based on the knowledge of those skilled in the art, starting from the described embodiment.

[Brief description of drawings]

FIG. 1 is a plan view schematically showing an electronic circuit component mounting system including an electronic circuit component mounting head according to an embodiment of the present invention.

FIG. 2 is a front view showing a portion of the electronic circuit component mounting head provided on a Y-axis slide.

FIG. 3 is a front view (partial cross section) showing a portion of the electronic circuit component mounting head provided on a Y-axis slide.

FIG. 4 is a front view (partial cross section) showing a load sensor that detects a load of a first spring that biases a suction nozzle in the electronic circuit component mounting head.

FIG. 5 is a plan view showing the load sensor without a load plate and an elastic plate.

FIG. 6 is a front view (partial cross section) showing a load sensor that detects a load of a second spring that biases the suction nozzle.

FIG. 7 is a block diagram showing a part deeply related to the present invention in the control device for controlling the electronic circuit component mounting system.

FIG. 8 is a RA of a computer which is the main body of the control device.
It is a block diagram which shows the structure of M schematically.

FIG. 9 is a flowchart showing a contact load quality determination routine stored in the RAM of the computer.

FIG. 10 is a flowchart showing a maintenance necessity determination routine stored in the RAM of the computer.

FIG. 11 is a flowchart showing a target position changing routine stored in a RAM of the computer.

FIG. 12 is a front view (partial cross section) showing a main part of an electronic circuit component mounting head according to another embodiment of the present invention.

FIG. 13 is a front sectional view showing a main part of an electronic circuit component mounting head according to still another embodiment of the present invention.

14 is a circuit diagram showing a part of a pressure control device and a bearing gas supply device of the electronic circuit component mounting head shown in FIG.

[Explanation of symbols]

30: Nozzle holder 34: Suction nozzle 36: Electronic circuit component 44: Y-axis slide 70: Holder lifting device 190, 192: Load sensor 250: Control device 272: Encoder 290: Alarm buzzer 296: Display screen 366: Nozzle holder 3
82: Adsorption nozzle 424: Load cell 430:
Electronic circuit component 432: Printed wiring board 500:
Nozzle holder 534: Pressure control device 540, 54
2: Pressure control valve 544: Control device 546, 54
8: Pressure sensor 549: Display screen

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Noriaki Iwaki             Fuji Machinery, 19 Chasuyama, Yamamachi, Chiryu City, Aichi Prefecture             Manufacturing Co., Ltd. (72) Inventor Yuji Katsumi             Fuji Machinery, 19 Chasuyama, Yamamachi, Chiryu City, Aichi Prefecture             Manufacturing Co., Ltd. F-term (reference) 5E313 AA02 AA03 AA11 CC03 EE02                       EE03 EE05 EE24 EE33 EE34                       EE37 EE38

Claims (5)

[Claims] 1. A mounting head body and a direction parallel to the axis of the mounting head body by the mounting head body.
It is held so that it can move in the axial direction.
A nozzle holder to hold, and the shaft of the nozzle holder with respect to the mounting head body
The holder position detecting device for detecting the relative position in the direction, and the holder position detecting device based on the detection result of the holder position detecting device.
Set the slide holder in the axial direction with respect to the mounting head body.
, Advance it to the preset target position, and
A holder advancing / retreating device for retreating from the standard position, and when the nozzle holder is advancing by the holder advancing / retreating device.
Reaction force detection device for detecting the reaction force received by the nozzle holder
And the reaction force related to the reaction force detected by the reaction force detection device.
And a display device for displaying related information.
Electronic circuit component mounting head. 2. The electronic circuit component mounting head according to claim 1, wherein the display device includes a reaction force display section that displays the reaction force itself as the reaction force related information. 3. An alarm buzzer and / or an alarm lamp, which is activated when the reaction force detected by the reaction force detection device and a predetermined target reaction force differ by at least a first set state. The electronic circuit component mounting head according to claim 1, further comprising an alarm device. 4. An automatic stop unit for stopping the operation of the component mounting head when the reaction force detected by the reaction force detection device and a predetermined target reaction force differ by at least a second set state. The electronic circuit component mounting head according to any one of claims 1 to 3, wherein: 5. A reaction force storage device for storing the detection value of the reaction force detection device when the electronic circuit component is mounted on the circuit board by the mounting head, in association with the circuit board and the mounting position. The electronic circuit component mounting head according to any one of claims 1 to 4, which is characterized in that.