JP2015115528A - Substrate processing device and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device that is capable of obtaining high positioning accuracy and reduces cost, and a substrate processing method.SOLUTION: The substrate processing device comprises: a holding base 4 including a mounting surface on which a substrate 1 is mounted; a first pressing member 6b; a second pressing member 6a; a first reference member 5a; a second reference member 5c; pressing member moving parts 8a and 8b; and a first reference member moving part 7a. The first pressing member 6b and the first reference member 5a are disposed so as to hold the substrate 1 mounted on the holding base 4 therebetween in a first direction along a mounting surface. The second pressing member 6a and the second reference member 5c are disposed so as to hold the substrate 1 mounted on the holding base 4 therebetween in a second direction crossing the first direction and along the mounting surface. The pressing member moving parts 8a and 8b are configured to move the first pressing member 6b and the second pressing member 6a closer to the first reference member 5a and the second reference member 5c, respectively. The first reference member moving part 7a is configured to move the first reference member 5a.

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly to a substrate processing apparatus and a substrate processing method capable of positioning the substrate on a mounting surface on which the substrate is mounted.

  Conventionally, a substrate processing apparatus for processing or inspecting a substrate such as a flat panel display (FPD) such as a liquid crystal display or an electroluminescence (EL) display is known. In such a substrate processing apparatus, a substrate, which is a processing target material, is mounted on a mounting surface of a holding table, and predetermined processing is performed after positioning (alignment) of the substrate (for example, Japanese Patent Laid-Open No. 2003-2003). No. 29017 and JP2013-125595A).

JP 2003-29017 A JP2013-125895A

  In the substrate processing apparatus as described above, in order to accurately position the substrate fixed on the mounting surface by vacuum suction or the like, the holding table on which the substrate is fixed based on the positional information of the alignment mark formed on the substrate surface A method of moving itself using a moving member such as an XYθ stage is used.

  On the other hand, substrates such as FPDs are becoming larger, and a holding table for holding such a large substrate is also enlarged. When the holding table itself is moved as described above, the XYθ stage is also increased in size, and the motor used for the XYθ stage must be increased in size and torque. Since the motor generates a large amount of heat, the thermal expansion of the XYθ stage and the holding table due to the heat generation can be a factor that degrades the positioning accuracy. Furthermore, the positioning accuracy itself may deteriorate due to the increase in size of the XYθ stage. Further, since the space occupied by the XYθ stage also increases, the substrate processing apparatus becomes larger and the manufacturing cost also increases.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can obtain high positioning accuracy and are low in cost.

  A substrate processing apparatus according to the present invention includes a holding table having a mounting surface on which a substrate is mounted, a first pressing member, a second pressing member, a first reference member, a second reference member, a pressing member moving unit, and a first reference. A member moving part is provided. The first pressing member and the first reference member are disposed so as to sandwich the substrate mounted on the holding base from the first direction along the mounting surface. The second pressing member and the second reference member are disposed so as to sandwich the substrate mounted on the holding base from the second direction along the mounting surface while intersecting the first direction. The pressing member moving unit moves the first pressing member and the second pressing member to the first reference member side and the second reference member side, respectively. The first reference member moving unit moves the first reference member.

  A substrate processing method according to the present invention includes a step of preparing a substrate, a step of mounting the substrate on a mounting surface of a holding table, and a step of positioning the substrate. In the step of positioning the substrate, the substrate mounted on the mounting surface is sandwiched between the first pressing member and the first reference member from the first direction along the mounting surface, and intersects with the first direction and mounted. The substrate is positioned by being sandwiched between the second pressing member and the second reference member from the second direction along the surface. The step of positioning the substrate includes a step of moving the first pressing member and the second pressing member to the first reference member side and the second reference member side, and a step of moving the first reference member, respectively.

  According to the present invention, a substrate processing apparatus and a substrate processing method having high positioning accuracy can be realized at low cost.

It is a schematic diagram which shows the substrate processing apparatus according to this embodiment. It is a plane schematic diagram for demonstrating the substrate processing method in the substrate processing apparatus shown in FIG. It is a plane schematic diagram for demonstrating the substrate processing method in the substrate processing apparatus shown in FIG. It is a plane schematic diagram for demonstrating the substrate processing method in the substrate processing apparatus shown in FIG. It is a top view which shows the chuck | zipper stage of the substrate processing apparatus shown in FIG. It is a schematic diagram for demonstrating the modification of the substrate processing apparatus shown in FIG. It is a plane schematic diagram for demonstrating the substrate processing method in the other modification of the substrate processing apparatus shown in FIG. It is a plane schematic diagram for demonstrating the substrate processing method in the other modification of the substrate processing apparatus shown in FIG. It is a plane schematic diagram for demonstrating the substrate processing method in the other modification of the substrate processing apparatus shown in FIG. It is a plane schematic diagram for demonstrating the substrate processing method in the substrate processing apparatus as a comparative example. It is a plane schematic diagram for demonstrating the substrate processing method in the substrate processing apparatus as a comparative example. It is a plane schematic diagram for demonstrating the substrate processing method in the substrate processing apparatus as a comparative example. It is a plane schematic diagram for demonstrating the substrate processing method in the substrate processing apparatus as a comparative example. It is a plane schematic diagram for demonstrating the substrate processing method in the substrate processing apparatus as a comparative example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

  With reference to FIG. 1, the substrate processing apparatus according to the present embodiment includes a chuck stage 4 as a holding table for mounting a substrate 1 as a processing target material on a mounting surface (upper surface), and an upper portion of the chuck stage 4. Reference members 5a to 5c for positioning the substrate 1 and a pressing member for pressing the end of the substrate 1 and pressing the substrate 1 against the reference members 5a to 5c. 6a and 6b, CCD cameras 10a and 10b for detecting alignment marks 3a and 3b formed on the surface of the substrate 1, these CCD cameras 10a and 10b, reference members 5a to 5c, and pressing members 6a and 6b. And a control unit 20 for controlling the position of the main unit. Note that the substrate processing apparatus is also provided with a processing unit (not shown) for inspecting and processing the substrate 1.

  The planar shape of the chuck stage 4 is rectangular. Electric cylinders 7a to 7c for moving a plurality of reference members 5a to 5c are installed on two adjacent sides among the four sides constituting the outer periphery of the chuck stage 4. Specifically, electric cylinders 7a and 7b for moving two reference members 5a and 5b are installed on the long side of the front side of the chuck stage 4 shown in FIG. An electric cylinder 7c for moving the reference member 5c is installed on one short side adjacent to the long side. The reference members 5a to 5c are connected to the tip ends of the drive shafts of the electric cylinders 7a to 7c, respectively. Further, the reference members 5 a to 5 c are arranged at positions overlapping the upper surface of the chuck stage 4.

  An air cylinder 8b for moving the pressing member 6b is connected to the other long side facing the reference members 5a and 5b. An air cylinder 8a for moving the pressing member 6a is connected to the other short side facing the reference member 5c. The pressing members 6a and 6b are connected to the tip ends of the drive shafts of the air cylinders 8a and 8b, respectively. Further, the pressing members 6 a and 6 b are arranged at positions overlapping the upper surface of the chuck stage 4. It is preferable that the speed at which the air cylinders 8a and 8b move the pressing members 6a and 6b and the pressure to press the end of the substrate 1 are adjusted in advance so that the substrate 1 is not damaged or deformed.

  Although the reference members 5a to 5c and the pressing members 6a and 6b may be made of any material, for example, metal or resin can be used. The reference members 5a to 5c and the electric cylinders 7a to 7c preferably have sufficient rigidity or holding force so as not to be displaced or deformed when the substrate 1 is pressed. The reference members 5 a to 5 c and the pressing members 6 a and 6 b have a cylindrical shape as shown in FIG. 1, and are arranged so that the cylindrical side walls are in contact with the end surface of the substrate 1. Here, as the shapes of the reference members 5a to 5c and the pressing members 6a and 6b, other arbitrary shapes (for example, a polyhedral shape such as a rectangular parallelepiped, a spherical shape, etc.) may be adopted.

  Two CCD cameras 10 a and 10 b are arranged at positions facing the upper surface of the chuck stage 4. The CCD cameras 10a and 10b are arranged to detect alignment marks 3a and 3b formed on the surface of the substrate 1 that is a processing target material. Lenses 9a and 9b are attached to the CCD cameras 10a and 10b, respectively. These electric cylinders 7a to 7c, air cylinders 8a and 8b, and CCD cameras 10a and 10b are connected to the control unit 20, respectively. Then, the substrate 1 that is the material to be processed is positioned by pressing the ends of the chuck stage 4 on the upper surface of the chuck stage 4 by the reference members 5a to 5c and the pressing members 6a and 6b. Then, a predetermined process (inspection or processing) is performed on the positioned substrate 1 by a processing unit (not shown).

  Next, a positioning method (alignment method) of the substrate 1, which is a substrate processing method in the substrate processing apparatus shown in FIG. 1, will be described with reference to FIGS.

  First, a substrate 1 that is a processing target material is prepared. A pattern 2 and alignment marks 3 a and 3 b are formed on the surface of the substrate 1. As an example of the pattern 2, a lattice pattern is formed. Then, as shown in FIG. 2, the substrate 1 is placed on the upper surface of the chuck stage 4 with the reference members 5 a to 5 c and the pressing members 6 a and 6 b sufficiently retracted from the center of the upper surface of the substrate 1. (Step (S10)). At this time, it is preferable that a space is formed between the end portion (end surface) of the substrate 1 and the reference members 5a to 5c and the pressing members 6a and 6b.

  Next, as shown in FIG. 3, the air cylinders 8a and 8b are operated to press the pressing members 6a and 6b against the end face of the substrate 1 (step (S20)). And the edge part which opposes the reference members 5a-5c of the board | substrate 1 and the said reference members 5a-5c are contacted by pushing and moving the board | substrate 1 by this press member 6a, 6b. At this time, the positions of the reference members 5a to 5c are adjusted in advance so that the substrate 1 comes to a predetermined position when the end of the substrate 1 contacts the reference members 5a to 5c as shown in FIG. Is preferred. Moreover, it is preferable to adjust beforehand the pressure and speed which the air cylinders 8a and 8b press the board | substrate 1 via the press members 6a and 6b so that the board | substrate 1 may not be damaged. The adjustment can be performed, for example, by adjusting the air supply pressure to the air cylinders 8a and 8b.

  Next, the alignment marks 3a and 3b formed on the surface of the substrate 1 are detected by the CCD cameras 10a and 10b (see FIG. 1) (step (S30)). The alignment marks 3a and 3b have predetermined relative positions with respect to the pattern formed on the surface of the substrate 1. Therefore, the position of the pattern 2 formed on the surface of the substrate 1 can be specified based on the positions of the alignment marks 3a and 3b. The measurement position data of the alignment marks 3a and 3b is output from the CCD cameras 10a and 10b to the control unit 20.

  Then, the position specified by the measurement position data of the alignment marks 3a and 3b is a preset position (that is, the position where the pattern 2 formed on the surface of the substrate 1 is to be disposed when undergoing processing). In some cases, the control unit 20 determines whether or not the alignment marks 3a and 3b are at the reference positions (steps (S40)). Specifically, the control unit compares the measurement position data with the reference position data of the alignment marks 3a and 3b determined in advance.

  If the position of the alignment marks 3a and 3b is deviated from a predetermined reference position as a result of the determination, the reference member 5a is driven by driving the electric cylinders 7a to 7c so that the deviation is eliminated. The position of ˜5c is changed (step (S50)). At this time, the pressing members 6a and 6b maintain a state in which a predetermined force is pressed against the end of the substrate 1 by the air cylinders 8a and 8b. Thus, when the reference members 5a to 5c are moved, the position of the substrate 1 is changed according to the movement of the reference members 5a to 5c by the pressing force of the pressing members 6a and 6b. As a result, as shown in FIG. 4, the substrate 1 is moved so that the positions of the alignment marks 3a and 3b overlap with a predetermined reference position.

  And after the position of alignment mark 3a, 3b is corrected by moving the board | substrate 1 in this way, the process (S30) and process (S40) mentioned above are implemented again. That is, the positions of the alignment marks 3 a and 3 b are measured by the CCD cameras 10 a and 10 b, and the obtained measurement position data is output to the control unit 20. The control unit 20 determines whether or not the position specified by the measurement position data of the alignment marks 3a and 3b is a preset reference position. In this step (S40), when it is determined that the positions of the alignment marks 3a and 3b are the reference positions, the substrate 1 is fixed to the surface of the chuck stage 4 (step (S60)).

  Although any method can be used as the method for fixing the substrate 1 in the step (S60), for example, a vacuum adsorption method or an electrostatic adsorption method can be used. On the other hand, when the positions of the alignment marks 3a and 3b detected by the CCD cameras 10a and 10b are deviated from the predetermined positions as described above, the fixing of the substrate 1 to the chuck stage 4 is released and again. The above-described step (S50) is performed. Such a process is repeated until it is determined in the step (S40) that the positions of the alignment marks 3a and 3b are the reference positions, and the step (S60) is performed.

  In this way, the structure of the substrate processing apparatus can be simplified and the cost of the substrate processing apparatus can be reduced as compared with the case where a process described later, such as moving the chuck stage 4 itself using an XYθ stage or the like, is used. Hereinafter, a substrate positioning method in the substrate processing apparatus including the above-described XYθ stage will be specifically described.

  10 to 14 are schematic views for explaining a substrate positioning method in a substrate processing apparatus as a comparative example. The substrate processing apparatus shown in FIGS. 10 to 14 basically has the same structure as the substrate processing apparatus shown in FIG. 1, but the reference members 5 a to 5 c are located at predetermined positions on the upper surface of the chuck stage 4. It is in a fixed state. Further, the chuck stage 4 can be moved by an XYθ stage (not shown).

  First, as shown in FIG. 10, the substrate 1 is mounted on the upper surface of the chuck stage 4 so as not to contact the reference members 5 a to 5 c and the pressing members 6 a and 6 b.

  Next, as shown in FIG. 11, the pressing members 6 a and 6 b are pressed against the end portion of the substrate 1 by driving the air cylinders 8 a and 8 b. As a result, the board | substrate 1 is moved and the edge part which opposes the reference members 5a-5c in the board | substrate 1 will be in the state which contacted the said reference members 5a-5c. At this time, the substrate 1 is positioned at a predetermined position on the upper surface of the chuck stage 4 defined by the reference members 5a to 5c. In addition, if the pattern 2 formed on the surface of the substrate 1 is formed in a correct position designed in advance with respect to the outer periphery of the substrate 1, the position of the reference members 5a to 5c is set appropriately, thereby 2 and the alignment marks 3a and 3b should be in a state where they are arranged at the correct positions to be arranged at the time of processing (see FIG. 11).

  However, there is a case where the pattern 2 is formed at a position shifted from a predetermined position on the surface of the substrate 1 (see, for example, the pattern 2 of the substrate 1 shown in FIG. 12). A substrate positioning method in such a case will be described.

  First, as shown in FIG. 12, the substrate 1 is placed on the upper surface of the chuck stage 4 in the same manner as the process shown in FIG. Thereafter, the same process as that shown in FIG. 11 is performed to place the substrate 1 at a predetermined position on the upper surface of the chuck stage 4 as shown in FIG. However, since the pattern 2 is formed on the surface of the substrate 1 so as to deviate from a predetermined position, the position of the pattern 2 shown in FIG. 13 is different from the region shown in FIG. It is in a state.

  For this reason, in the substrate processing apparatus as the comparative example, after the substrate 1 is sucked and fixed to the chuck stage 4 by an arbitrary method such as vacuum suction in the state shown in FIG. 13, the alignment marks 3a and 3b are Detect position. If it is detected that the positions of the alignment marks 3a and 3b are deviated from a predetermined reference position (the positions of the alignment marks 3a and 3b shown in FIG. 11), the positions of the alignment marks 3a and 3b are detected. The chuck stage 4 on which the substrate 1 is mounted is moved in the horizontal plane (in the XY plane) using the XYθ stage so that the deviation is eliminated. As a result, as shown in FIG. 14, the position of the pattern 2 can be corrected to the correct position at the time of processing.

  In such a substrate processing apparatus as a comparative example, an XYθ stage for moving the chuck stage 4 itself is required to position the pattern 2 at an accurate position. However, in the substrate processing apparatus according to the present invention, as described with reference to FIGS. 2 to 4, the reference members 5a to 5c are configured to be movable without using the XYθ stage as described in the comparative example. The pattern 2 of the substrate 1 can be positioned at an accurate position.

  Note that, as shown in FIG. 5, the surface of the chuck stage 4 in the substrate processing apparatus according to the present embodiment described above has air or an inert gas (for example, nitrogen gas or the like) in order to move the substrate 1 more smoothly. A plurality of ejection ports 21 through which gas such as argon gas is ejected are formed. A pipe (not shown) is connected to the jet port 21, and the gas supply device is connected to the pipe via an on-off valve. From this jet port, the substrate 1 can be floated from the surface of the chuck stage 4 by jetting, for example, compressed air in the step (S50). As a result, the substrate 1 can be moved smoothly in the step (S50).

  As shown in FIG. 6, an elastic member 23 may be disposed between the pressing member 6a and the drive shaft 22 of the air cylinder 8a. In this way, even when the substrate 1 is pressed by the pressing member 6 a at the stroke end of the air cylinder 8 a, when the pressing member 6 a is brought into contact with the end of the substrate 1, An excessive force applied can be absorbed by the deformation of the elastic member 23. For this reason, possibility that the board | substrate 1 will be damaged by the said excessive force can be reduced. The elastic member 23 may be disposed between the pressing member 6b and the drive shaft of the air cylinder 8b. As the elastic member 23, for example, rubber or a spring can be used.

  Further, depending on the configuration of the substrate processing apparatus, it may be considered that only a part of the reference members 5a to 5c may be movable. For example, when it is necessary only to rotate the substrate 1, only a part of the plurality of reference members 5a to 5c (in the example shown in FIGS. 7 to 9), as shown in FIGS. Only the reference member 5a) may be movable by an electric cylinder. Specifically, in the substrate processing apparatus shown in FIGS. 7 to 9, the reference members 5b and 5c are fixed on the upper surface of the chuck stage 4, while only the reference member 5a is movable by the electric cylinder 7a. Yes. In this case, the substrate 1 (more specifically, the pattern 2) formed on the surface of the substrate 1 can be positioned as follows. This will be described below.

  First, as shown in FIG. 7, the board | substrate 1 is arrange | positioned in the position which does not contact the reference members 5a-5c and the press members 6a and 6b. This step is basically the same as the step (S10) shown in FIG.

  Thereafter, the pressing members 6 a and 6 b are brought into contact with the end portion of the substrate 1 by driving the air cylinders 8 a and 8 b. As a result, the substrate 1 is moved by the pressing members 6a and 6b, and the end portions of the substrate 1 are brought into contact with the reference members 5a to 5c as shown in FIG. This step is basically the same as the step (S20) shown in FIG.

  Then, the process similar to process (S30)-process (S50) mentioned above is implemented. That is, the positions of the alignment marks 3a and 3b on the surface of the substrate 1 are detected using the CCD cameras 10a and 10b (see FIG. 1). When the positions of the alignment marks 3a and 3b are deviated from a predetermined reference position, the substrate 1 is moved so as to eliminate the deviation. At this time, the position of the reference member 5a is changed by driving the electric cylinder 7a. As a result, the substrate 1 rotates on the upper surface of the chuck stage 4 in a plane along the upper surface. In this way, the pattern 2 of the substrate 1 is positioned at a predetermined position during processing as shown in FIG. Even in this case, the pattern 2 of the substrate 1 can be positioned.

  In the substrate processing apparatus described above, the three reference members 5a to 5c are arranged. If the number of the reference members is two (for example, two reference members 5a and 5c), It can be any number. Further, all of the plurality of reference members may be movable, but only a part may be connected to an electric cylinder or the like to be movable, while the other part may be fixed to the chuck stage.

  In the substrate processing measures described above, the electric cylinders 7a to 7c are used to move the reference members 5a to 5c. However, other moving members (for example, air cylinders, hydraulic cylinders, etc.) ) Can be used. Furthermore, although the air cylinders 8a and 8b are used to move the pressing members 6a and 6b, other moving members (for example, linear motion units of an arbitrary system such as an electric cylinder or a hydraulic cylinder) can be used.

  Here, although there is a part which overlaps with embodiment mentioned above, the characteristic structure of this invention is enumerated.

  (1) A substrate processing apparatus according to the present invention includes a holding table (chuck stage 4) having a mounting surface (upper surface) on which a substrate 1 is mounted, a first pressing member (pressing member 6b), and a second pressing member ( A pressing member 6a), a first reference member (reference member 5a), a second reference member (reference member 5c), a pressing member moving unit (air cylinders 8a and 8b), and a first reference member moving unit (electric cylinder 7a). . The first pressing member (6b) and the first reference member (5a) sandwich the substrate 1 mounted on the holding base (chuck stage 4) from a first direction (vertical direction in FIG. 2) along the mounting surface. Are arranged as follows. The second pressing member (6a) and the second reference member (5c) are arranged so that the substrate 1 mounted on the holding table (chuck stage 4) intersects the first direction and extends in the second direction along the mounting surface ( They are arranged so as to be sandwiched from the left and right direction in FIG. The pressing member moving portions (air cylinders 8a and 8b) move the first pressing member (6b) and the second pressing member (6a) to the first reference member (5a) side and the second reference member (5c) side, respectively. Let The first reference member moving unit (electric cylinder 7a) moves the first reference member (5a).

  In this way, since the first reference member (5a) can be moved, the substrate 1 can be moved to the first pressing member (6b), the first reference member (5a), and the like without using an XYθ stage. The position of the substrate 1 when positioned by being sandwiched between the second pressing member (6a) and the second reference member (5c) can be set with high accuracy and a large degree of freedom. That is, a substrate processing apparatus having high positioning accuracy can be realized at low cost without using an XYθ stage or the like.

  Here, as shown in FIGS. 10 to 14, when the reference members 5 a to 5 c are fixed on the mounting surface (upper surface) of the chuck stage 4, the position on the mounting surface depends on the position of the reference members 5 a to 5 c. The final position of the substrate 1 is determined. On the other hand, by making the first reference member (5a) movable with respect to the chuck stage 4 as described above, the outer periphery of the substrate 1 in contact with the first reference member (5a) and the outer periphery of the mounting surface are used. An operation of changing the angle (rotating the substrate 1 in the direction along the mounting surface as shown in FIGS. 4 and 9) is possible.

  (2) The substrate processing apparatus may further include a second reference member moving unit (electric cylinder 7c) for moving the second reference member (5c). In this case, since the second reference member (5c) is also movable with respect to the holding table (chuck stage 4), the degree of freedom in determining the position after positioning of the substrate 1 can be further increased.

  (3) The substrate processing apparatus may further include a third reference member (reference member 5b) facing the first pressing member (6b). In this case, since the substrate 1 can be positioned in a state where the end portion of the substrate 1 is in contact with both the first reference member (5a) and the third reference member (5b), the positioning accuracy of the substrate 1 can be further improved. it can. Further, by moving the first reference member (5a) while pressing the first pressing member (6b) against the substrate 1, the substrate 1 is rotated with the contact portion between the third reference member (5b) and the substrate 1 as a fulcrum. , And the like can be easily performed.

  (4) The substrate processing apparatus may further include a third reference member moving part (electric cylinder 7b) for moving the third reference member (5b) as shown in FIG. In this case, the degree of freedom in selecting the position after positioning the substrate 1 can be further increased.

  (5) In the said substrate processing apparatus, as shown in FIGS. 7-9, the position of the 3rd reference member (5b) may be fixed with respect to the holding stand (chuck stage 4). In this case, the positioning accuracy of the substrate 1 can be increased without excessively complicating the configuration of the substrate processing apparatus.

  (6) The substrate processing apparatus may further include a detection unit (CCD cameras 10a and 10b) and a control unit 20. The detection units (CCD cameras 10a and 10b) detect the positions of the alignment marks 3a and 3b formed on the surface of the substrate 1. Based on the measurement position data of the alignment marks 3a and 3b output from the detection units (10a and 10b) and the reference position data of the alignment marks 3a and 3b determined in advance, the control unit 20 generates a first reference member ( The moving amount of 5a) is determined. In this case, the substrate 1 can be positioned more accurately based on the measurement position data of the alignment marks 3a and 3b.

  (7) In the substrate processing apparatus, the pressing member moving unit (air cylinders 8a and 8b) can adjust the moving speed and the pressing force of the first pressing member (6b) and the second pressing member (6a). Also good. In this case, the first pressing member (6b) and the second pressing member (6a) are prevented from being damaged due to the first pressing member (6b) and the second pressing member (6a) being in contact with the end portion of the substrate 1. The moving speed of the two pressing members (6a) and the pressing force against the substrate 1 can be adjusted.

  (8) As shown in FIG. 6, the substrate processing apparatus includes at least one of a first pressing member (6b) and a second pressing member (6a) and a pressing member moving portion (air cylinders 8b, 8a). You may further provide the elastic member 23 arrange | positioned between. In this case, the first pressing member (6b) and the second pressing member (6a) are prevented from being damaged due to the first pressing member (6b) and the second pressing member (6a) being in contact with the end portion of the substrate 1. The elastic member 23 can absorb an impact or the like when the two pressing member (6a) contacts the substrate 1.

  (9) As shown in FIG. 5, the substrate processing apparatus includes an auxiliary member (upper part of the chuck stage 4) for holding the substrate 1 in a state where the substrate 1 is lifted from the mounting surface of the holding table (chuck stage 4). And the like, a jet port 21 formed on the surface, a pipe connected to the jet port 21, a gas supply device, and the like. In this case, when the substrate 1 is moved on the mounting surface, it is possible to prevent the surface of the substrate 1 from being damaged due to contact between the surface of the substrate 1 and the mounting surface.

  (10) The substrate processing method according to the present invention (substrate 1 positioning method) includes a step of preparing the substrate 1 and a step of mounting the substrate 1 on the mounting surface of the holding table (chuck stage 4) (S10). And a step of positioning the substrate 1 (step (S20) to step (S60)). In the step of positioning the substrate 1, the substrate 1 mounted on the mounting surface is moved from the first direction along the mounting surface by the first pressing member (pressing member 6b) and the first reference member (reference member 5a). The substrate 1 is positioned by being sandwiched by the second pressing member (pressing member 6a) and the second reference member (reference member 5c) from the second direction along the mounting surface while intersecting with the first direction. . The step of positioning the substrate is a step of moving the first pressing member (6b) and the second pressing member (6a) toward the first reference member (5a) and the second reference member (5c), respectively (S20). And a step (S50) of moving the first reference member (5a).

  In this way, since the first reference member (5a) can be moved, the substrate 1 can be moved to the first pressing member (6b), the first reference member (5a), and the like without using an XYθ stage. The position of the substrate 1 when positioned by being sandwiched between the second pressing member (6a) and the second reference member (5c) can be set with high accuracy and a large degree of freedom.

  (11) In the substrate processing method, the step of positioning the substrate 1 (step (S20) to step (S60)) may include a step of moving the second reference member (5c). In this case, the degree of freedom in determining the position after positioning of the substrate 1 can be further increased.

  (12) In the substrate processing method, in the step of positioning the substrate (step (S20) to step (S60)), the third reference member (reference member 5b) facing the first pressing member (6b) is You may contact the board | substrate 1 from the same direction as 1 reference | standard member (5a). In this case, since the substrate 1 can be positioned in a state where the end portion of the substrate 1 is in contact with both the first reference member (5a) and the third reference member (5b), the positioning accuracy of the substrate 1 can be further improved. it can. Further, by moving the first reference member (5a) while pressing the first pressing member (6b) against the substrate 1, the third reference member (5b) and the substrate 1 are moved as shown in FIGS. It is possible to easily perform an operation such as rotating the substrate 1 with the contact portion as a fulcrum. That is, a substrate processing method capable of realizing low cost and high positioning accuracy can be realized without using an XYθ stage or the like.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention is particularly advantageously applied to a substrate processing apparatus and a substrate processing method capable of positioning a substrate.

  1 substrate, 2 patterns, 3a, 3b alignment mark, 4 chuck stage, 5a-5c reference member, 6a, 6b pressing member, 7a-7c electric cylinder, 8a, 8b air cylinder, 9a, 9b lens, 10a, 10b CCD camera , 20 control unit, 21 spout, 22 drive shaft, 23 elastic member.

Claims (6)

A holding base having a mounting surface for mounting a substrate;
A first pressing member and a first reference member arranged so as to sandwich the substrate mounted on the holding base from a first direction along the mounting surface;
A second pressing member and a second reference member arranged so as to sandwich the substrate mounted on the holding base from a second direction along the mounting surface while intersecting the first direction;
A pressing member moving part for moving the first pressing member and the second pressing member to the first reference member side and the second reference member side, respectively;
A substrate processing apparatus comprising: a first reference member moving unit for moving the first reference member. A detection unit for detecting a position of an alignment mark formed on the surface of the substrate;
A control unit that determines a moving amount of the first reference member based on the measurement position data of the alignment mark output from the detection unit and the reference position data of the alignment mark that is determined in advance. Item 2. The substrate processing apparatus according to Item 1.   The substrate processing apparatus according to claim 1, further comprising an auxiliary member for holding the substrate in a state where the substrate is floated from the mounting surface of the holding table. Preparing a substrate;
Mounting the substrate on the mounting surface of the holding table;
The substrate mounted on the mounting surface is sandwiched between a first pressing member and a first reference member from a first direction along the mounting surface, intersects the first direction, and extends along the mounting surface. A step of positioning the substrate by being sandwiched between the second pressing member and the second reference member from the second direction,
The step of positioning the substrate includes:
Moving the first pressing member and the second pressing member to the first reference member side and the second reference member side, respectively;
And a step of moving the first reference member.   The substrate processing method according to claim 4, wherein the step of positioning the substrate includes a step of moving the second reference member.   The substrate processing according to claim 4, wherein in the step of positioning the substrate, a third reference member facing the first pressing member contacts the substrate from the same direction as the first reference member. Method.

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