KR101351250B1 - Align stage apparatus for substrate inspection equipment - Google Patents

Align stage apparatus for substrate inspection equipment Download PDF

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Publication number
KR101351250B1
KR101351250B1 KR1020130014092A KR20130014092A KR101351250B1 KR 101351250 B1 KR101351250 B1 KR 101351250B1 KR 1020130014092 A KR1020130014092 A KR 1020130014092A KR 20130014092 A KR20130014092 A KR 20130014092A KR 101351250 B1 KR101351250 B1 KR 101351250B1
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KR
South Korea
Prior art keywords
substrate
inspection equipment
turntable
clamp arm
alignment stage
Prior art date
Application number
KR1020130014092A
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Korean (ko)
Inventor
김성민
김민수
임미희
Original Assignee
세광테크 주식회사
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Priority to KR1020130014092A priority Critical patent/KR101351250B1/en
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Publication of KR101351250B1 publication Critical patent/KR101351250B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to an alignment stage apparatus which moves and supplies a substrate to the position of inspection equipment having a camera for fitting the alignment of the substrate, in order to effectively recognize alignment marks of the substrate by the inspection equipment by compensating for the shape of the substrate into a flat state prior to inspection, and in order to efficiently improve the frequency of errors due to materials. The alignment stage apparatus comprises: a turntable which is formed to be able to rotate by a fixed angle in order to position the substrate in a straight line of the camera; multiple jig members which are fixated and installed in the upper part of the turntable and where the substrate is accumulated and positioned; and an auxiliary clamp unit which is located at one side of the turntable and is in contact with the substrate accumulated on the jig members in order to compensate for the substrate into a flat state.

Description

Align Stage Apparatus for Substrate Inspection Equipment

The present invention relates to an alignment stage device for a substrate inspection equipment, and more particularly, to correct the shape of the substrate to a flat state before inspection so that the alignment mark of the substrate by the inspection equipment can be recognized very effectively and the frequency of error caused by the material The alignment stage apparatus for board | substrate inspection equipment which can be improved efficiently is related.

Recently, the display industry for visually displaying various electrical signal information is rapidly developing as the information age enters. Among them, portable electronic products such as mobile phones, notebook computers, PDAs, navigation devices, etc. are mounted with various types of liquid crystal display devices to realize low voltage driving, low power consumption, and full color.

Common liquid crystal displays include liquid crystal displays (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescent displays (VFDs), all of which are flexible glass (hereinafter referred to as substrates). It is constructed based on. Furthermore, in manufacturing liquid crystal displays, chip on glass (COG), film on glass (FOG), chip on flex (COF), touch film on glass (TFOG), outer lead bonding (OLB), and fpcb on flex (FOF) The mounting equipment which manufacture process, such as this is used.

Here, the process by the mounting equipment includes a cleaning process for washing the substrate, a bonding process for mounting the semiconductor chip on the cleaned substrate, and many other processes are involved.

In addition, various manufacturing processes of the mounting equipment are performed in unique manufacturing equipment for each process, and the substrate to be processed is transferred to each manufacturing equipment. Properly place the inspection equipment to check the alignment of the board.

In this case, the inspection apparatus inspects the alignment of the substrate through an image of the substrate supplied from the outside, and includes a camera for capturing an image of the substrate. In addition, in order to completely acquire the image of the substrate from the camera of the inspection equipment, the substrate is placed in a fixed position by supplying the substrate on a fixed position and driving the substrate in a constant axial direction to precisely align the position of the substrate. Align it.

As a related art disclosed in relation to the above-described alignment stage device, Korean Patent Application Publication No. 17281 (2012.2.28.) Includes a base frame; An alignment table disposed on the upper surface of the base frame to be rotatable in an unspecified direction and having guide rails mounted on at least three sides thereof; A driving device fixed to the base frame and arranged on at least three side surfaces of the alignment table to drive the alignment table in the X-axis direction, the Y-axis direction, and the θ-axis direction, wherein the driving device is connected to the guide rail. The roller is arranged to be movable, the driving rod to which the roller is connected, and the driving unit for linearly reciprocating the driving rod to align the substrate and align for three-axis driving to minimize the overall size of the equipment. Stage devices are known.

However, the conventional alignment stage device has a problem that it is difficult to expect high productivity because workability is low because only one substrate may be supplied on the table to be placed on the table to inspect the substrate from the previous process.

In the case of the conventional alignment stage device, the substrate is arranged to be in contact with the side of the substrate. However, the substrate having a thin thickness and a flexible characteristic is not always constant. Decreased, which increases the error occurrence rate for detecting a defect of the substrate from the inspection equipment has had to supply a new substrate again.

For example, as shown in FIG. 1, the storage environment of the board | substrate G supplied on the jig | tool 2 of the alignment stage apparatus, or winding up in the up-down direction to the board | substrate G in the middle of supplying the board | substrate G is provided. When the curvature occurs and the substrate G is bent or bent, deformation of the substrate G on the jig 2 may accurately read the alignment mark of the camera. There was a problem that there is a problem that there is a possibility that a loss occurs in the tact time of the equipment as a delay occurs in the supply of the substrate due to the error occurring during the operation, the delay of the supply of the substrate due to the error occurred during the operation.

The present invention is to solve the above problems, by forming a means for correcting the shape of the substrate by pressing the substrate flatly before the alignment inspection to improve the accuracy of the alignment inspection and at the same time significantly increase the error occurrence rate by the inspection It is an object of the present invention to provide an alignment stage device for substrate inspection equipment that can reduce the input cycle of the substrate toward each process and efficiently minimize the adverse effect on the tact time.

And another object of the present invention is to increase the work efficiency by configuring a means for modifying the position of the jig having a plurality of jig so that the alignment inspection process proceeds with respect to the substrate that is preferentially supplied while the substrate is supplied from the previous process It is an object of the present invention to provide an alignment stage device for substrate inspection equipment capable of improving productivity.

The alignment stage apparatus for substrate inspection equipment proposed by the present invention is an alignment stage apparatus for moving and supplying a substrate to a position of an inspection apparatus having a camera to align the substrate, wherein the substrate is placed on a vertical line of the camera. A turntable rotatably configured at a predetermined angle to be positioned; A plurality of jig members fixedly installed on an upper portion of the turntable and mounted with a substrate; And an auxiliary clamp unit positioned on one side of the turntable and contacting the substrate mounted on the jig member to correct the substrate in a flat state.

The turntable includes a table in which the jig member is fixedly installed and rotatably formed, and a driving motor connected to the lower portion of the table and applying power to the table.

The auxiliary clamp unit includes a clamp arm which contacts to press the substrate located on the jig member, lifting means provided with the clamp arm to move up and down in the Z-axis direction, and the lifting means and the clamp arm are X-axis. Conveying means is provided so as to reciprocate toward the direction.

The clamp arm is constructed using a series of engineering plastic materials in a transparent form.

The lifting means moves the clamp arm up and down to contact the substrate, but is formed to apply a suitable pressure to the applied substrate in the pressure range of 0.15 ~ 0.75MPa.

According to the alignment stage apparatus for the substrate inspection equipment according to the present invention, since the auxiliary clamp unit is installed to correct the deformation caused by the substrate storage environment or the supply process, the alignment check by the inspection equipment can be performed very accurately. In addition, by reducing the frequency of inspection errors on the deformed board, the number of discarded materials can be reduced, thereby reducing the cycle time of new material input, minimizing tact time loss, maximizing productivity, and reducing waste of unnecessary materials. Get the effect.

In addition, the alignment stage device for the substrate inspection equipment according to the present invention constitutes a turntable having a plurality of jig members so that the substrate supply and the alignment process can be performed at the same time, thereby enabling continuous operation while improving work efficiency. There is an effect that can improve the productivity more.

1 is an exemplary view conceptually showing a substrate located in an alignment stage device according to the related art.
2 is a front view showing an embodiment according to the present invention;
3 is a plan view showing an embodiment according to the present invention.
Figure 4 is a perspective view of the auxiliary clamp unit in one embodiment according to the present invention.
Figure 5 is a partially enlarged view showing a state of use of one embodiment according to the present invention.

The present invention provides an alignment stage apparatus for moving and supplying a substrate to a position of an inspection apparatus having a camera to align the substrate, the turntable being configured to be rotated at a predetermined angle so that the substrate is positioned on a vertical line of the camera. and; A plurality of jig members fixedly installed on an upper portion of the turntable and mounted with a substrate; An alignment stage device for substrate inspection equipment, comprising: an auxiliary clamp unit disposed on one side of the turntable and contacting the substrate loaded on the jig member to correct the substrate in a flat state.

In addition, the turntable includes a table in which the jig member is fixedly installed and rotatably formed, and an alignment stage device for substrate inspection equipment including a driving motor connected to a lower portion of the table and applying power to the table. It is characterized by.

In addition, the auxiliary clamp unit is a clamp arm for contacting to press the substrate located on the jig member, the lifting means provided with the clamp arm to move up and down in the Z-axis direction, the lifting means and the clamp arm is X An aligning stage apparatus for substrate inspection equipment including a conveying means provided reciprocally toward an axial direction is characterized by a technical configuration.

In addition, the clamp arm is characterized in that the alignment stage device for substrate inspection equipment is configured using a series of engineering plastic (engineering plastic) material of the transparent form.

In addition, the elevating means is characterized in that the alignment stage device for substrate inspection equipment is formed to move the clamp arm up and down to contact the substrate, but to apply a suitable pressure to the applied substrate in the pressure range of 0.15 ~ 0.75MPa .

Next, the preferred embodiment of the alignment stage apparatus for board | substrate inspection equipment which concerns on this invention is described in detail with reference to drawings.

First, as shown in FIGS. 2 and 3, one embodiment of the alignment stage device for substrate inspection equipment according to the present invention includes a turntable 10, a jig member 20, and an auxiliary clamp in the alignment stage device. It comprises a unit 30.

In general, the alignment stage device is configured to move and supply the substrate G to the position of the inspection equipment (not shown in the drawing) having the camera 5 to align the substrate G.

As shown in FIG. 2, the turntable 10 is installed on the work frame 17 so as to be positioned at a constant height from the ground. That is, the working frame 17 performs a function as a support for supporting the technical configuration of the turntable 10.

The turntable 10 is located so as to photograph the substrate (G) from the camera (5) of the inspection equipment. In other words, the turntable 10 is formed such that the substrate G can be positioned on a lower vertical line from the camera 5 installed to face downward.

The turntable 10 provides the substrate G to a testable position so that the substrate G supplied from the previous process can be aligned from the inspection equipment, but is rotatable at a predetermined angle to move the substrate G. It is composed.

The turntable 10 includes a table 11 rotatably installed on the work frame 17 and a drive motor 13 for rotating the table 11.

The table 11 has a disc shape having a predetermined thickness, and the jig member 20 is fixedly installed on an upper portion thereof.

The drive motor 13 is connected to the lower part of the table 11 and is configured to apply a predetermined power to the table 11 in that its operation is linked according to the on / off operation state of the facility. .

The drive motor 13 rotates the table 11 by a predetermined angle. That is, the table 11 is rotated from the drive motor 13 by a set angle between the jig member 20 provided on the table 11.

For example, in the case where the jig member 20 is installed and installed in total, one on each of the 90 ° angles on the table 11, the jig member 20 is positioned at each position of the inspection equipment camera 5. The drive motor 13 is configured to rotate the table 11 by 90 ° so that the rotation of the table 11 can be stopped.

It is also possible to configure the rotation support means 18 on the turntable 10 so as to be spaced apart from one side of the work frame 17 so as to support the lower part of the table 11.

The roller member 19 is preferably configured at the upper end of the rotation support means 18 to support the table 11 and to facilitate smooth rotation of the table 11 by the drive motor 13.

The jig member 20 loads the substrate G supplied from the outside to assist the alignment operation from the camera 5 of the inspection equipment.

The jig member 20 is fixedly installed on the table 11 of the turntable 10 and is formed to form a flat plane.

As shown in FIG. 3, the jig member 20 is provided on the turntable 10 in a plurality, and is disposed at a distance from each other in a predetermined pattern.

The auxiliary clamp unit 30 is in contact with the substrate (G) loaded on the jig member 20 to perform a function to correct to a flat state.

As shown in FIGS. 2 and 3, the auxiliary clamp unit 30 is positioned at an upper side with a predetermined distance on one side of the turntable 10.

As shown in FIG. 4, the auxiliary clamp unit 30 is configured to be movable in the front-rear direction and the vertical direction so as to contact the substrate G. The clamp arm 31, the lifting means 33, and the conveying means ( 35).

The clamp arm 31 extends toward the direction in which the turntable 10 is positioned to be in contact with the substrate G on the jig member 20.

The clamp arm 31 has a bar shape and is formed to contact the upper surface of the substrate G while contacting only a predetermined portion of the substrate G. That is, the clamp arm 31 has a predetermined contact range applicable to the substrate G or the jig member 20.

For example, the contact coverage of the clamp arm 31 applicable to the substrate G is generally adjustable in the X-axis direction but corresponds to the width corresponding to the width of the clamp arm 31 in the Y-axis direction. When the width of the clamp arm 31 is 5 mm, the contact coverage of the substrate G is 5 mm.

The clamp arm 31 is constructed using a series of engineering plastic materials in a transparent form.

As the material of the clamp arm 31, it is preferable to use polyetherethereketone (PEEK) in an engineering plastic material.

Generally, polyether ether ketone material is a material used in a field requiring high performance. As a crystalline resin that can be melt-molded, it has the highest heat resistance (continuous use temperature is 250 ° C), flame retardancy, hot water resistance (200 to 260 ° C), Impact resistance, fatigue resistance, chemical resistance and the like have excellent properties. In addition, polyether ether ketone is heat-resistant resin and can be manufactured by applying a wide range of processing methods such as injection molding, extrusion molding, extrusion coating, rotational molding, melt spinning.

In addition, the clamp arm 31 is configured to be separated from the lifting means 33 and replaceable. That is, the clamp arm 31 is configured to be easily replaced and applied to enable active correspondence according to various types of substrates G. FIG.

The lifting means 33 is provided to move the clamp arm 31 up and down. That is, the clamp arm 31 forms a structure connected to the lifting means 33, and the clamp arm 31 is provided to move up and down in the Z-axis direction by the movement of the lifting means 33.

The lifting means 33 is moved up and down so that the clamp arm 31 is in contact with the upper surface of the substrate (G), but within a range that does not damage the substrate (G) by the contact of the clamp arm (31). In the pressure forming according to the lifting means 33 is formed.

The pressing force applied to the elevating means 33 at the same time as the clamp arm 31 is applied is set to apply an appropriate pressure to the applied substrate in the pressure range of 0.15 to 0.75 MPa.

The transfer means 35 is provided to move the lifting means 33 and the clamp arm 31 back and forth. That is, the elevating means 33 connected to the clamp arm 31 forms a structure connected to the conveying means 35, and the elevating means having the clamp arm 31 by the movement of the conveying means 35. 33 is configured to reciprocate in the X-axis direction.

The elevating means 33 and the conveying means 35 form a cylinder and are operably configured by air having a predetermined pressure supplied from the outside.

Also in the transfer means 35, it is possible to drive by the same pressure as the lifting means 33, it is also possible to apply a stronger pressure to increase the overall work speed by the transfer means (35).

Next, look at the operation relationship of the alignment stage device for substrate inspection equipment according to a preferred embodiment of the present invention.

First, when the substrate G is supplied to the jig member 20, which is transferred by the loader and mounted on the turntable 10, the turntable 10 rotates the table 11 by applying power to the drive motor 13. The position of the jig member 20 is continuously moved to the position on the vertical line that can be taken from the camera 5 of the inspection equipment.

At this time, the auxiliary clamp unit 30 will be described with reference to Figure 5, before moving the substrate (G) to align the substrate (G) to align the movement, the transfer means 35 is first The clamp arm 31 is positioned above the substrate G by moving in the X-axis direction, and the lifting means 33 moves in the Z-axis direction while lowering, so that the clamp arm 31 moves on the upper surface of the substrate G. Touch to press.

Subsequently, the auxiliary clamp unit 30 having the substrate G flattened up raises the clamp arm 31 through the lifting means 33, and then the clamp arm 31 through the transfer means 35. Move back to the standby position again.

On the other hand, the inspection equipment aligns and checks the substrate G located on the jig member 20 through the camera 5, and checks the substrate G according to whether there is a defect according to the reading result of the inspection equipment. Recovery or transfer to the next process.

That is, according to the alignment stage apparatus for substrate inspection equipment according to the present invention configured as described above, since the auxiliary clamp unit is provided to correct the deformation caused by the influence of the storage environment or the supply process of the substrate, the alignment by the inspection equipment Verification can be done very accurately, greatly reducing inspection error frequency of deformed boards, reducing the number of discarded materials and thus reducing the cycle time of new material input, minimizing tact time loss, maximizing productivity, and unnecessary materials. It is possible to reduce waste.

In addition, the present invention constitutes a turntable having a plurality of jig members so that the supply and alignment process of the substrate can be performed at the same time, it is possible to continuously work to improve the productivity while improving the work efficiency.

In the above, a preferred embodiment of an alignment stage device for a substrate inspection apparatus according to the present invention has been described. However, the present invention is not limited thereto, and the present invention is not limited thereto. It is possible and this also belongs to the scope of the present invention.

5: camera 10: turntable
11: Table 13: Drive motor
17: working frame 18: rotation support means
19: roller member 20: jig member
30: auxiliary clamp unit 31: clamp arm
33: lifting means 35: transfer means
G: substrate

Claims (5)

In the alignment stage apparatus for moving and supplying the substrate to the position of the inspection equipment having a camera to align the substrate,
A turntable rotatably configured at a predetermined angle so that the substrate is positioned on a vertical line of the camera;
A plurality of jig members fixedly installed on an upper portion of the turntable and mounted with a substrate;
And an auxiliary clamp unit positioned on one side of the turntable and contacting the substrate mounted on the jig member to correct the substrate in a flat state.
The method according to claim 1,
The turntable includes a table on which the jig member is fixedly installed and rotatably formed, and a driving motor connected to a lower portion of the table and configured to apply power to the table. Device.
The method according to claim 1,
The auxiliary clamp unit may include a clamp arm which contacts the substrate positioned on the jig member, and the lifting means provided with the clamp arm to move up and down in the Z-axis direction, and the lifting means and the clamp arm are X. Alignment stage device for substrate inspection equipment comprising a conveying means provided reciprocally movable in the axial direction.
The method according to claim 3,
The clamp arm is an alignment stage device for a substrate inspection equipment, characterized in that using a transparent type of engineering plastic material series.
The method according to claim 3,
The elevating means is an alignment stage device for a substrate inspection equipment, characterized in that to move the clamp arm up and down to contact the substrate, but to apply a suitable pressure to the applied substrate in the pressure range of 0.15 ~ 0.75MPa.
KR1020130014092A 2013-02-07 2013-02-07 Align stage apparatus for substrate inspection equipment KR101351250B1 (en)

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101597352B1 (en) 2015-04-09 2016-02-25 서울과학기술대학교 산학협력단 Stage 4 axis parallel alignment device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091568A (en) 2006-09-29 2008-04-17 Fujifilm Corp Device and method for mounting substrate
KR101077910B1 (en) 2011-08-22 2011-10-31 우리마이크론(주) Test device for panel
KR20120105670A (en) * 2011-03-16 2012-09-26 주식회사 로보스타 Edge grip type pre-aligner having buffer stage

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091568A (en) 2006-09-29 2008-04-17 Fujifilm Corp Device and method for mounting substrate
KR20120105670A (en) * 2011-03-16 2012-09-26 주식회사 로보스타 Edge grip type pre-aligner having buffer stage
KR101077910B1 (en) 2011-08-22 2011-10-31 우리마이크론(주) Test device for panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101597352B1 (en) 2015-04-09 2016-02-25 서울과학기술대학교 산학협력단 Stage 4 axis parallel alignment device

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