KR100722452B1 - Apparatus and method for bonding printed circuit on fpd panel - Google Patents

Abstract

Disclosed are a driving circuit board bonding apparatus and a method thereof. A driving circuit board bonding apparatus of the present invention includes: at least one head for holding and attaching a driving circuit board to a driving circuit board attaching surface of the substrate; A drive mechanism to which at least one head is coupled and to move at least one head; An alignment position sensing unit for acquiring alignment position information of at least one of an eye mark alignment position formed on the driving circuit board attachment surface and information on the driving circuit board alignment position held by the head; And a control unit which controls the movement of the head so that the driving circuit board alignment position gripped on the head may be aligned corresponding to the eyemark alignment position based on the information obtained from the alignment position detecting unit. It is done. According to the present invention, it is possible to significantly reduce the tact time required for attaching the driving circuit board to the substrate, so that a larger number of driving circuit boards can be attached in a unit time than in the past, thereby improving production efficiency. Can be.

Driving Circuit Board, TCP, Bonding Device, Rotating Mechanism, Linear Driving Mechanism, Vision Camera, Eye Mark, PDP, Board

Description

Circuit board bonding device for driving and method thereof {Apparatus and Method for Bonding Printed Circuit on FPD Panel}

1 is a perspective view of a substrate.

2 is a schematic plan view of a TCP bonding apparatus according to a conventional embodiment.

3 is a schematic perspective view of a TCP bonding apparatus according to an embodiment of the present invention.

4 is a plan view of FIG. 3.

5 is a perspective view for explaining the structure of the head of the TCP bonding apparatus shown in FIG.

FIG. 6 is a control block diagram of the TCP bonding apparatus shown in FIG. 3.

7 is a flowchart illustrating a TCP bonding method according to an embodiment of the present invention.

8 is a schematic plan view of a TCP bonding apparatus according to another embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

   1: TCP bonding device 7: TCP

   10: substrate 11: TCP attachment surface

   13 substrate alignment mark 15 eye mark

   30: rotating mechanism 50: head

   61: Vision camera for TCP alignment 63: Vision camera for substrate alignment

   65: vision camera for eye mark alignment 70: substrate stage

   80: controller 30a: first linear drive mechanism

   30b: second linear drive mechanism

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a driving circuit board bonding apparatus and a method thereof, and more particularly, to a driving circuit board bonding apparatus and method for attaching a driving circuit board to a flat panel display element such as a PDP substrate. .

In general, flat panel displays (FPDs), such as plasma displays (PDPs), liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), are increasingly thin and thin. The trend is going. Accordingly, various driving circuit boards are directly attached to a flat panel display element (hereinafter referred to as a "substrate") and manufactured into a single article.

The driving circuit board includes a printed circuit board (PCB), a flexible printed circuit (FPC), a tape carrier package (TCP), a common block flexible printed circuit (CBF), and the like. As these driving circuit boards are in direct contact with the board, there is no need for complicated wiring, so assembly and maintenance are easy, and there is no need to secure a separate wiring space. have. In addition, the driving circuit board is widely used without being limited by the use and specifications of the board because the compatibility of various wiring is maintained.

Among these, TCP is a surface mount type package of a semiconductor in which a large scale integrated chip is mounted on a tape-shaped insulating film forming a lead wiring and connected to the lead. TCP is widely used in PDP boards and the like because a plurality of integrated circuit devices are mounted on a single board in a high-density manner to shorten wiring lengths between the devices.

In order to attach the TCP to a substrate, an insulating adhesive layer of an anisotropic conductive film (ACF), that is, a film that provides insulation and adhesiveness, is first attached. This process is preceded by a film bonding apparatus in a separate process. After that, the film-bonded substrate is transferred to the TCP bonding apparatus to attach the TCP. The TCP bonding apparatus has been disclosed as follows.

First, as shown in FIG. 1, the substrate 10, which is the workpiece, is generally attached to one long side and both short sides by a circuit board. The substrate 10 according to one embodiment of the present invention and one conventional embodiment to be described later is a substrate for a PDP of about 50 inches, and about 22 TCPs 7 are attached to the long side.

2 is a schematic plan view of a TCP bonding apparatus according to a conventional embodiment. Conventional TCP bonding apparatus 101, the rotation mechanism 130 that rotates based on the shaft center 131, and four heads 150 coupled to the lower surface of the rotation mechanism 130 to rotate along the rotation mechanism 130 And a vision camera 160 which is gripped and transferred to the eye mark 15 and the head 150 formed on the substrate 10, and photographs the alignment position of the TCP 7 in order.

Four heads 150 are coupled to the outer circumferential surface of the lower surface of the rotary mechanism 130 at intervals of 90 degrees. Each of the four heads 150 rotates along the rotating mechanism 30 to control the TCP loading station (# 1), the TCP centering station (# 2), the TCP attachment station (# 3), and the retrieval / standby station (# 4). Rough For convenience of description, the four heads 150 will be referred to as first to fourth heads 151, 152, 153, and 154.

The attaching process of each head 150 will be described with reference to the first head 151. First, the first head 151 sucks and loads one TCP 7 in the TCP loading station # 1. . When the loading of the TCP 7 is completed by the first head 151, the first head 151 rotates 90 degrees clockwise to move to the TCP centering station # 2, and loads the TCP at this position. Proceed to the simple centering of (7). At this time, the fourth head 154 proceeds to load another TCP 7 from the TCP loading station # 1.

Subsequently, when the centering of the TCP 7 of the first head 151 is completed, the first head 151 rotates clockwise again to move to the TCP attachment station # 3 and moves the TCP 7 to the TCP attachment of the substrate. To the face (11).

At this time, the alignment of the substrate 10 must be preceded before the first head 151 attaches the TCP 7 to the TCP attaching surface 11 of the substrate 10. In order to align the substrate 10, the first stage in which the substrate stage 170 on which the substrate 10 is supported is moved to the position of the vision camera 160, on the substrate 10 according to the movement of the substrate 10. After confirming the alignment mark 13, the second stage in which the substrate stage 170 retreats, and the substrate stage 170 is aligned in accordance with the information of the alignment mark 13, so that the substrate 10 is attached to the station with TCP. Through the third step of moving to 3), the substrate 10 may be aligned at the correct position of the substrate stage 170.

After the alignment of the substrate 10 is completed, the eye mark 15 provided on the TCP attachment surface 11 is again checked by the vision camera 160, and then the substrate stage 170 is moved again so that the eye mark 15 is removed. You should align. That is, the TCP 7 can be attached after the alignment of the substrate 10 and the eye mark 15 formed on the TCP attachment surface 11 of the substrate 10 are completed.

When the alignment of the eyemark 15 is completed, the first head 151 may move in the vertical direction to press-attach the TCP 7 on the substrate 10. When the attaching process is completed, the first head 151 is rotated 90 degrees clockwise to move to the recovery / standby station (# 4). In the case where TCP 7 defect occurs during the attaching process, the first head 151 recovers the defective TCP 7 at the recovery / waiting station # 4, and when the TCP 7 defect does not occur. Waits for the recovery / waiting station # 4 to move to the TCP loading station # 1 after a certain time has elapsed.

In this case, the other heads perform the same work at a predetermined time interval with the first head. When the first head 151 performs the predetermined process at the recovery / waiting station # 4, the second head 152 performs the TCP (7) attaching process at the TCP attaching station # 3, and the third The head 153 simply centers the TCP 7 in the TCP centering station # 2, and the fourth head 154 proceeds to suck and load the TCP 7 in the TCP loading station # 1. .

However, in the TCP bonding apparatus 101 according to the related art, the head 150 moves only in the Z-axis direction and the above-described three-step operation is performed to align the position of the entire substrate 10. Many operations are required to attach one TCP 7 because the alignment of the TCP 7 can be completed by performing the alignment of the eyemark 15 existing on the substrate 10 each time. This is required, thereby causing a problem in that the tact time becomes long and the productivity decreases.

In addition, since a simple centering is performed instead of aligning the TCP (7) in the TCP centering station (# 2), one vision camera 160 in the TCP attachment station (# 3) is an eyemark (15) of the substrate 10. Since the attachment process of TCP (7) can be performed only after the alignment position of) and the alignment position confirmation process of TCP (7), the tact time becomes longer due to this confirmation process, thereby reducing productivity. have.

In addition, since one head 150 is coupled to each of the four divided zones of the rotating mechanism 130, a large number of TCPs cannot be attached during a unit time.

Accordingly, it is an object of the present invention to significantly reduce the tact time required for attaching a driving circuit board to a substrate, so that a larger number of driving circuit boards can be attached in a unit time than in the prior art, thus producing efficiency. It is to provide a driving circuit board bonding apparatus that can improve the.

According to the present invention, the object is at least one head for holding the driving circuit board to attach to the driving circuit board attachment surface of the substrate; A drive mechanism coupled to the at least one head to move the at least one head; An alignment position sensing unit for obtaining at least one alignment position information among eye mark alignment positions formed on the driving circuit board attachment surface and information on the driving circuit board alignment positions held by the head; ; And a control unit controlling movement of the head so that the driving circuit board alignment position held by the head may be aligned corresponding to the eyemark alignment position based on the information obtained from the alignment position detecting unit. It is achieved by a driving circuit board bonding apparatus comprising a.

Here, it is preferable that the driving circuit board is TCP (Tape Carriage Package), and the driving circuit board attaching surface is a TCP attaching surface.

The drive mechanism is a linear drive mechanism for reciprocating linear movement of the head, the head is provided with a plurality, the plurality of heads, the linear drive mechanism is circulated between the TCP loading station and TCP attachment station, the control unit Preferably, when the head holding the TCP moves to the TCP attachment station, the relative movement of the head is controlled so that the held TCP can be aligned in correspondence with the TCP attachment surface.

The plurality of heads are coupled to the linear drive mechanism in two pairs, and the control unit controls the linear drive mechanism such that each pair of heads alternately move between the TCP loading station and the TCP attachment station. desirable.

The drive mechanism is a rotating mechanism rotatable with respect to the axis, the head is provided with a plurality of coupled to each other spaced apart from each other, the plurality of heads, the TCP loading station, the TCP all along the circumferential direction on the rotating mechanism The control unit is configured to cycle through an in station, a TCP attaching station, and a recovery / waiting station, and the control unit is configured such that when the head holding the TCP moves from the TCP alignment position to the TCP attaching position, the TCP held by the TCP attaching surface. It is preferable to control the relative movement of the head to be aligned in correspondence with the.

The plurality of heads are coupled to the rotary mechanism at equal angle intervals along the circumferential surface of the rotary mechanism, and each pair of the heads is the TCP loading station, TCP alignment station, TCP attachment station and It is desirable to cycle through the withdrawal / standby station simultaneously.

The alignment position detecting unit may include: a TCP alignment vision camera for acquiring information on the TCP alignment position held by the head; And an eyemark alignment vision camera for acquiring information on the eyemark alignment position, the information on the TCP alignment position obtained by the TCP alignment vision camera and the eyemark alignment vision camera. The information on the eye mark alignment position obtained by the PDP is transmitted to the controller, and the controller controls the movement of the head based on the transmitted information.

The TCP alignment vision camera may be installed at a position corresponding to the TCP alignment station so as to obtain information on the TCP alignment position from the TCP alignment station.

Two pairs of the eyemark alignment vision cameras are installed in an upper region of the substrate corresponding to the TCP attachment station, and a pair of the eyemark alignment vision cameras provide information on odd-numbered eyemarks among the eyemarks. Are sequentially obtained by two, and the other pair of the eyemark alignment vision cameras may sequentially obtain information about even-numbered eyemarks of the eyemarks.

The alignment position detecting unit may further include a substrate alignment vision camera for capturing the alignment mark formed on the substrate to obtain the substrate alignment position information, and the control unit may be configured by the substrate alignment vision camera. Preferably, the movement of the head is controlled based on the obtained substrate alignment position information, the TCP alignment position information, and the eyemark alignment position information.

The substrate alignment position information by the substrate alignment vision camera is preferably obtained before the substrate is transferred to the TCP attachment station and transmitted to the controller.

The substrate stage may further include a substrate stage that supports the substrate and reciprocates along a predetermined path, wherein the substrate stage supports the substrate so as to be movable in the plate surface direction of the substrate on the path.

The substrate is preferably a substrate for a plasma display panel (PDP).

Further, the above object is, according to the present invention, is obtained on the driving circuit board attachment surface of the substrate to obtain information about the eye mark alignment position for setting the reference for the attachment position of the driving circuit board, eye mark alla Obtaining location information; Obtaining information on the alignment position of the driving circuit board on the head holding the driving circuit board to be attached to the driving circuit board attaching surface; And information obtained in the eyemark alignment position information obtaining step and the driving circuit board alignment position information obtaining step so that the driving circuit board alignment position may be aligned with respect to the eyemark alignment position. Is also achieved by a drive circuit board bonding method comprising a head movement control step of controlling relative movement of the head.

Here, it is preferable that the driving circuit board is TCP (Tape Carriage Package), and the driving circuit board attaching surface is a TCP attaching surface.

A plurality of heads are provided and coupled to a linear driving mechanism for reciprocating linear movement of the head. The reciprocating linear movement is performed. The plurality of heads circulate the TCP loading station and the TCP attachment station by the linear driving mechanism. The control step is preferably performed when the head holding the TCP moves to the TCP attachment station.

The head is provided in plurality, coupled to the rotary mechanism rotatable with respect to the shaft center to rotate along the rotary mechanism, the plurality of heads, TCP loading station, TCP in the circumferential direction on the rotary mechanism It is preferable to rotate the alignment station, the TCP attachment station and the recovery / waiting station, wherein the head movement control step is performed when the head holding the TCP moves from the TCP alignment station to the TCP attachment station. .

The acquiring of the TCP alignment position information is preferably performed when the head holding the TCP of the attachment target is located in the TCP alignment station.

Before the head movement control step, the method may further include obtaining substrate alignment position information for acquiring information on alignment positions of the entire substrate.

The head movement control step may be performed based on information obtained in the eyemark alignment position information obtaining step, the TCP alignment position information obtaining step, and the substrate alignment position information obtaining step.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

A driving circuit board bonding apparatus and a method thereof according to the present invention may include a driving circuit board such as a printed circuit board (PCB), a flexible printed circuit (FPC), a tape carrier package (TCP), and a common block flexible printed circuit (CBF). It can be used to attach to a flat panel display (FPD) such as a plasma display panel (PDP), a liquid crystal display (LCD), or an organic light emitting diode (OLED). For convenience of explanation, hereinafter, only the case of attaching the TCP will be described.

3 is a perspective view of a TCP bonding apparatus according to an embodiment of the present invention, Figure 4 is a plan view of Figure 3, Figure 5 is a perspective view for explaining the structure of the head of the TCP bonding device shown in Figure 3, 6 is a control block diagram of the TCP bonding apparatus shown in FIG. 3, and FIG. 7 is a flowchart of the TCP bonding method according to an embodiment of the present invention. 3 to 5, the number of the TCP attaching surfaces 11 on the substrate will be described in order to explain the TCP attaching surfaces 11 more clearly.

As shown in these drawings, the TCP bonding apparatus 1 according to an embodiment of the present invention is coupled to the rotary mechanism 30 and the lower surface of the rotary mechanism 30 which are rotatable based on the shaft core 31. Four pairs of heads 50 which rotate along the rotating mechanism 30 and attach the TCP 7 to the TCP attachment surface 11 of the substrate 10, and information about the alignment position of the TCP 7 and the substrate. Obtained by the alignment position detecting unit 60 and the alignment position detecting unit 60 for obtaining information on the alignment position of the eye mark 15 formed on the TCP attachment surface 11 of (10). And a controller 80 for controlling the relative movement of the head 50 with respect to the rotating mechanism 30 based on the obtained information.

Here, the TCP (7) is installed around the rotary mechanism 30, the head 50 is gripped and transported. And the alignment position detection part 60 is formed in the TCP alignment vision camera 61 which acquires the information about the alignment position of TCP 7, and the TCP attachment surface 11 of the board | substrate 10. FIG. Two pairs of eyemark alignment vision cameras 65 are provided for acquiring information on the alignment positions of the eyemarks 15.

In addition, in some cases, the alignment position detecting unit 60 includes a vision camera 63 for substrate alignment which acquires information on the alignment position of the entire substrate 10 as in the present embodiment. Accuracy can be improved, which will be described later.

First, the rotating mechanism 30 rotates regularly based on the shaft core 31 so that the four pairs of heads 50 coupled to the lower surface of the rotating mechanism 30 can perform the attaching operation.

The head 50 is a component that directly loads and aligns the TCP 7 and attaches the TCP 7 to the TCP attaching surface 11 of the substrate 10 and waits for reworking. In this embodiment, a total of four pairs are equally coupled to the lower surface of the rotating mechanism 30, but the scope of the present invention is not limited thereto. Hereinafter, for convenience of description, four pairs of heads 50 will be referred to as first heads or fourth heads 51, 52, 53, and 54, respectively, and all heads 50 will be sequentially attached. Since the process is substantially the same, the process of attaching the first head 51 will be mainly described, and the process of attaching the other heads 52, 53, and 54 will be schematically described or omitted.

The rotation of the rotary mechanism 30 causes the first head 51 to operate the TCP loading station # 1, the TCP alignment station # 2, the TCP attachment station # 3 and the recovery / waiting station # 4. Cycle in turn. Each station # 1 to # 4 represents a predetermined position corresponding to the four pairs of heads 50 in the lower region of the rotary mechanism 30, and the head 50 is rotated by the rotation of the rotary mechanism 30. Each station # 1 to # 4 may move sequentially.

Hereinafter, the processes proceeding in each of the stations # 1 to # 4 will be described in detail, but the TCP bonding apparatus 1 will be described more effectively by explaining the components related to each process together.

First, in the TCP loading station # 1, the first head 51 is supplied with the TCP 7. The first head 51 is positioned above the TCP supply surface so that the TCP 7 can be detached from the TCP supply surface (not shown) where the plurality of TCP 7 is aligned, and the TCP 7 is sucked through the suction force. do. At this time, since the first head 51 has a structure capable of adjusting positions in the X, Y, Z and θ axes, the first head 51 can be easily detached from the TCP supply surface.

After adsorbing the TCP 7 by the first head 51, the first head 51 is rotated 90 degrees to the TCP alignment station # 2 for the next operation. However, the alignment of the TCP 7 is not completed in the TCP alignment station # 2, but the vision camera 61 for TCP alignment is installed in the TCP alignment station # 2, so that the first head 51 ) And the alignment position information of the TCP (7), such as the degree that the TCP (7) is transferred to the eye mark 15 of the substrate 10 is transferred to the controller 80 to be described later.

In other words, the TCP alignment station # 2 is a position for obtaining information on the alignment position of the TCP 7 by the TCP alignment vision camera 65. As will be described later in detail, the actual alignment of the TCP 7 is based on this information, the information obtained by the eyemark alignment vision camera 65, and the information obtained by the substrate alignment vision camera 63. The first head 51 adsorbing the TCP 7 is made during the rotational movement from the TCP alignment station # 2 to the TCP attachment station # 3. This will be described later in more detail.

In the TCP attachment station # 3, the aligned TCP 7 is moved to the TCP attachment surface 11 on which the eyemark 15 of the board | substrate 10 is formed, while the 1st head 51 rotates. It is the location to attach. As shown in the figure, a predetermined path through which the substrate stage 70 can be moved is provided in the lower region of the TCP attaching station # 3 to transfer the substrate 10, which is a workpiece, to the work area.

The substrate alignment mark 13 and the eye mark 15 are formed on the substrate 10 mounted on the substrate stage 70 and transferred to the lower region of the TCP attachment station # 3. The substrate alignment mark 13 is a mark displayed to accurately align the entire substrate 10 to the substrate stage 70. The substrate alignment mark 13 is displayed at both ends of the long side of the substrate 10, so that the substrate alignment mark 13 is aligned at the alignment position of the entire substrate 10. It serves to provide information. On the other hand, the eye mark 15 is formed on the TCP attachment surface 11 of the board | substrate 10 as mentioned above, and serves to display the alignment position of each TCP adhesion surface 11. As shown in FIG.

In the TCP bonding apparatus 1 according to the present embodiment, separate vision cameras 63 and 65 are provided for photographing the substrate alignment mark 13 and the eye mark 15 and obtaining the information.

First, photographing whether the substrate 10 is loaded at the correct alignment position of the substrate stage 70 in the upper region of the substrate stage 70 from which the substrate 10 is loaded from the outside, and transmitting the information to the controller 80. A substrate alignment vision camera 63 is provided. The controller 80 may control the degree of distortion through the alignment position information transmitted by the substrate alignment vision camera 63.

Since the substrate stage 70 is movable in the plane direction (X-axis, Y-axis, and θ-axis directions), the position of the substrate 10 may be aligned according to a command received from the controller 80. However, the substrate stage 70 cannot adjust the position in the plate surface direction, that is, the planar direction of the substrate, and may reciprocate only in a predetermined direction (X-axis direction) along the rail 71. The reason for this is that in this embodiment, since the head 50 that absorbs and transports the TCP 7 can be positioned in all directions (X, Y, Z axis and θ axis direction), the substrate ( This is because TCP (7) can be attached accordingly even if 10) is transferred out of alignment.

Since the conventional head 150 (see FIG. 2) can only adjust the position in the vertical direction, the position of the substrate 10 must be adjusted separately, but the head 50 of the present embodiment has a relative relative to the rotation mechanism 30. Since the position can be adjusted to correspond to the TCP attachment surface 11 formed on the substrate 10 through the movement, not only the complexity of the work can be reduced but also the time required for attachment can be shortened.

On the other hand, two pairs of eyemark alignment vision cameras 65 are provided in an area adjacent to the rail 71 and the TCP attachment station # 3 serving as the paths of the substrate stage 70. However, before describing the eyemark alignment vision camera 65, the alignment position information of the eyemark 15 is acquired by the eyemark alignment vision camera 65 by first explaining the structure of the head 50. The principle will be explained easily.

As shown in FIG. 5, the head 50 has a predetermined volume so that the head 50 may be arranged to attach the TCP 7 to the continuous TCP attaching surface 11 existing on the substrate 10. Interference may occur. Therefore, the pair of first heads 51 can attach the TCP 7 to the first and third TCP attachment surfaces 11a and 11c of the TCP attachment surfaces 11, and then rotate by 90 degrees to allow TCP to attach. The pair of fourth heads 52 reaching the attachment station # 3 has a structure capable of attaching the TCP 7 to the second and fourth TCP attachment surfaces 11b and 11d. Similarly, the pair of third heads 53 reaching the TCP attachment station # 3 has a structure capable of attaching the TCP 7 to the fifth and seventh TCP attachment surfaces 11e and 11g. In other words, each head 50 has a structure in which TCP 7 can be attached to both TCP attachment surfaces 11 with one TCP attachment surface 11 interposed therebetween.

Due to the structure of the head 50, a pair of eyemark alignment vision cameras 65a are formed of the eyemark 15 and the third TCP attachment surface 11c displayed on the first TCP attachment surface 11a. When photographing the position information of the eye mark 15 and sending it to the control unit 80, the control unit 80 moves while the first head 51 moves from the TCP alignment station # 2 to the TCP attachment station # 3. The control unit 80 controls the movement of the first head 51 to align the first head 51, so that the TCP 7 is connected to the first and second portions of the substrate 10 at the TCP attachment station # 3. 3 It can be attached to TCP attachment surface 11a, 11c.

Substantially the same, the other pair of eyemark alignment vision cameras 65b captures the eyemarks 15 of the second and fourth TCP attachment surfaces 11b and 11d, and controls the positional information thereof. Controller 80 moves the fourth head 52 to align the fourth head 54 while the fourth head 52 moves from the TCP align station # 2 to the TCP attach station # 3. By controlling the movement of 54, the TCP 7 can be attached to the second and fourth TCP attachment surfaces 11b and 11d of the substrate 10 at the TCP attachment station # 3.

When the attachment of the TCP 7 is completed, the first head 51 is rotated 90 degrees clockwise again to move to the recovery / waiting station # 4. The recovery / waiting station # 4 waits to recover the bad TCP 7 or move to the TCP loading station # 1 to load another TCP 7.

As described above, each head 50 sequentially cycles four stations (# 1 to # 4) and proceeds with the attaching operation of TCP (7). Hereinafter, the TCP attaching station (# 2) is used in the TCP alignment station (# 2). The control unit 80 for controlling the movement of the head 50 for alignment while moving to 3) will be described.

As shown in FIG. 6, the controller 80 of the present exemplary embodiment moves the head 50 relative to the rotating mechanism 30 based on the alignment position information acquired by the alignment position detecting unit 60. To control. In this embodiment, the alignment position detecting unit 60 includes a substrate alignment vision camera 63, an eyemark alignment vision camera 65, and a TCP alignment vision camera 61. Therefore, the control part 80 has alignment position information of the whole board | substrate 10 image | photographed by the board | substrate alignment vision camera 63, and the TCP attachment surface 11 image | photographed by the eyemark alignment vision camera 65. As shown in FIG. The alignment position information of the eye mark 15 displayed in the figure) and the alignment position information of the TCP 7 photographed by the TCP alignment vision camera 61 are transmitted. The control unit 80 comprehensively analyzes this information and completes the alignment in advance before the head 50 arrives at the TCP attachment station # 3, and reaches the TCP attachment station # 3 after the TCP attachment surface 11 is reached. The relative movement of the head 50 is controlled so that the TCP 7 can be accurately attached to it.

Therefore, as soon as each head 50 arrives at the TCP attachment station # 3, the TCP 7 can be attached to the TCP attachment surface 11, so that the attachment operation can be performed quickly and accurately, and accordingly, Tact time can be significantly reduced.

The bonding method of the TCP bonding apparatus 1 having such a configuration will be described below.

First, four pairs of heads circulate four stations # 1 to # 4 clockwise by the rotational force of the rotating mechanism 30. First, as described above, the pair of first heads 51 respectively adsorb the TCP 7 at the TCP loading station # 1. Thereafter, the pair of first heads 51 are rotated by 90 degrees to the TCP alignment station # 2, and the first head is moved by the TCP alignment vision camera 61 installed in the TCP alignment station # 2. The position of the TCP 7 adsorbed to 51 is photographed. When the photographing is completed, the first head 51 again rotates 90 degrees clockwise to move the TCP 7 to the TCP attachment station # 3.

At this time, when the first head 51 moves from the TCP alignment station # 2 to the TCP attachment station # 3, the alignment of the TCP 7 is completed by the controller 80. The alignment of the TCP 7 is the movement of the head 50 through the control unit 80 in order to accurately attach the TCP 7 to the TCP attachment surface 11 of the substrate 10 on which the eyemark 15 is formed. To control.

To this end, in order to precisely correspond to the positions of the TCP attachment surface 11 formed on the substrate 10 and the substrate 10 and the TCP 7 carried by the head 50, these positions are used for substrate alignment. Information is obtained from the vision camera 63, the eyemark alignment vision camera 65, and the TCP alignment vision camera 61, and the control unit 80 controls the movement of the head 50 based on the information. Thus, the TCP 7 can be attached to the TCP attachment surface 11.

Referring to this process in more detail, first, the vision alignment camera 63 for substrate alignment is installed in the upper region of the substrate stage 70 on which the substrate 10 is loaded from the outside. As shown in FIG. 7, the vision camera 63 for substrate alignment sequentially photographs two alignment marks 13 formed at corners of the substrate 10 to align the entire position of the substrate 10. Obtain information (S11). The obtained alignment position information of the substrate 10 may be transmitted to the controller 80 to calculate the degree of twist of the substrate 10 with respect to the substrate stage 70.

Subsequently, an eyemark alignment vision camera 65 is installed along the rail 71 to photograph the eyemark 15 of the substrate 10 provided on the TCP attachment surface 11 of the substrate 10. Obtain the alignment position information for (S13). The acquired alignment position information of the eye mark 15 is transmitted to the controller 80 so that the controller 80 can recognize the alignment position of the eye mark 15.

Finally, the vision camera 61 for TCP alignment is installed in the TCP attachment station # 3, and acquires the alignment position information of the TCP 7 conveyed by the head 50 (S15). The obtained alignment position information of the TCP is transmitted to the controller 80.

The control unit 80 performs a TCP alignment station based on the respective alignment position information obtained by the substrate alignment vision camera 63, the eyemark alignment vision camera 65, and the TCP alignment vision camera 61. The relative movement of the head 50 with respect to the rotating mechanism 30 is controlled while the head 50 moves from the # 2 to the TCP attachment station # 3 (S17).

Through such a step, the aligned head 50 can directly attach the TCP 7 to the TCP attachment surface 11 so that the TCP 7 can be attached to the correct position by descending in the vertical direction (S19). ). When the attachment of the TCP 7 is complete, the head 50 rises to this position and rotates 90 degrees clockwise to wait for loading another TCP 7.

For example, the fourth head 54 performs the attachment process at the TCP attachment station # 3 while the first head 51 is waiting at the recovery / waiting station # 4. At the same time, the third head 53 provides position information by the TCP alignment vision camera 61 at the TCP alignment station # 2, and the second head 52 is provided at the TCP loading station # 1. The substrate 10 is sucked and loaded.

As described above, the TCP bonding apparatus 1 of the present embodiment obtains the alignment position information of the entire substrate 10, the eyemark 15, and the TCP 7, and comprehensively analyzes the relative position information of the head 50. By providing the control unit 80 for controlling the movement, it is possible to quickly perform an accurate and efficient attachment work as compared with the conventional TCP bonding apparatus 101.

In addition, since the time for the alignment is not required separately, but is aligned while the head 50 moves, the attachment work of the TCP 7 can be quickly performed, thereby reducing the tact time. In addition, the productivity can be significantly improved.

In addition, the head 50 is coupled to the lower surface of the rotary mechanism 30 by a total of four pairs at equal angle intervals, so that not only can the same attachment work be performed at half the number of revolutions, but also the number of revolutions per hour is more efficient than the conventional method. Can be further improved.

8 is a schematic plan view of a TCP bonding apparatus according to another embodiment of the present invention. Hereinafter, the descriptions of the embodiments of the present invention will apply mutatis mutandis to the parts substantially the same as the embodiments of the present invention, and only the parts different from the embodiments of the present invention will be described.

The TCP bonding apparatus 1a according to another embodiment of the present invention is coupled to the two linear driving mechanisms 30a and 30b moving along each linear path and the lower surfaces of the linear driving mechanisms 30a and 30b. Two pairs of heads 51a, 52a, 51b, 52b for reciprocating linear movement along the drive mechanisms 30a, 30b and attaching the TCP 7 to the TCP attachment surface 11 of the substrate 10, and TCP (7). Alignment position detection unit 60 for detecting information about the alignment position of the) and the alignment position of the eye mark 15 formed on the TCP attachment surface 11 of the substrate 10, and Control unit (not shown) for controlling the relative movement of the corresponding head (51a, 52a, 51b, 52b) with respect to each of the linear drive mechanism (30a, 30b) based on the information obtained by the in-position detecting unit 60 It is provided.

In the TCP bonding apparatus 1a according to another embodiment of the present invention, in one embodiment of the present invention, four pairs of heads 51, 52, 53, 54, and FIG. 4 rotate by the rotating mechanism 30. Unlike the predetermined attaching operation, the TCP 7 is attached to the TCP attaching surface 11 of the substrate 10 by linear reciprocating movement. However, hereinafter, for convenience of description, two linear driving mechanisms are referred to as first and second linear driving mechanisms, and two pairs of heads coupled to the first and second linear driving mechanisms are referred to as first and second heads, respectively. Let's do it.

Here, each of the linear drive mechanisms 30a and 30b starts each TCP loading station # 1a and # 1b which loads the TCP 7 as shown, and sets the alignment position of the TCP 7 as shown. It reaches the TCP attachment station # 3a which attaches TCP7 on the board | substrate 10 through the TCP alignment stations # 2a and # 2b which are acquired. At this time, when the first heads 51a and 52a of the first linear driving mechanism 30a attach the TCP 7 at the TCP attachment station # 3, the second head 51b of the second linear driving mechanism 30b, 52b) causes TCP 7 to load in TCP loading station # 1b.

The method of controlling / positioning the heads 51a, 52a, 51b, and 52b by the controller 80 by acquiring / integrating information in the TCP bonding apparatus 1a according to another embodiment of the present invention is an embodiment of the present invention. It is substantially similar to the example. However, in the present embodiment, since the linear drive mechanisms 30a and 30b do not reciprocate linearly in one path, each of the predetermined positions of each path, that is, adjacent to the TCP alignment stations # 2a and # 2b, respectively. TCP alignment vision cameras 61a and 61b can be provided.

Each of the TCP alignment vision cameras 61a and 61b loads the TCP 7 from the TCP loading stations # 1a and # 1b and is located in the center area of the path to the TCP attachment station # 3 so as to place the head 51a. , 52a, 51b, 52b and the position of the head (51a, 52a, 51b, 52b) to obtain the information about the degree of skew between the TCP (7) adsorbed and transported and sends the information to the control unit (not shown) Play a role. Each of the heads 51a, 52a, 51b, and 52b can be individually positioned in the X, Y, Z, and θ axis directions according to a position control command of a controller (not shown). The TCP 7 gripped by 51b and 52b can be correctly attached to the TCP attachment surface 11.

As described in detail in an embodiment of the present invention, the controller (not shown) includes alignment position information of the TCP 7, alignment position information of the eye mark 15 on the substrate 10, and the entire substrate 10. By controlling the positions of the heads 51a, 52a, 51b, 52b and the stage 70 based on the information on the alignment position, it is possible to attach the TCP (7) to the correct position of the substrate 10.

Hereinafter, the TCP attaching method of the TCP bonding apparatus 1a according to another embodiment of the present invention having such a configuration will be described schematically.

First, the first heads 51a and 52a of the first linear drive mechanism 30a among the linear drive mechanisms 30a and 30b each having a pair of heads 51a, 52a, 51b and 52b on the lower surface thereof are themselves. Are supplied with two TCP (7) at the TCP loading station (# 1a). Then, it moves to the TCP attachment station (# 3) direction along a straight path. At this time, the TCP alignment station # 2a is located in the center area on the path, and the alignment position information of the TCP 7, which is adsorbed and carried by the first heads 51a and 52a, is transferred to the vision camera 61a for TCP alignment. Obtained by

The control unit 80 based on the alignment position information of the TCP 7, the alignment position information of the eye mark 15 acquired by the eyemark alignment vision camera 65, and the alignment position information of the entire substrate 10. ) Indicates the position of the first heads 51a and 52a while the first heads 51a and 52a of the first linear drive mechanism 30a move from the TCP alignment station # 2a to the TCP attachment station # 3. Accurately control the to complete the final alignment. Two aligned TCPs 7 are attached to the first and third TCP attachment surfaces 11a and 11c formed on the substrate 10.

The second heads 51b and 52b of the second linear drive mechanism 30b having a predetermined other linear path substantially simultaneously with the attaching process of the first linear drive mechanism 30a are mounted at their TCP loading station # 1b. Load two TCP (7). The second heads 51b and 52b of the second linear driving mechanism 30b also have the same alignment and attachment process as the first heads 51a and 52a of the first linear driving mechanism 30a. Since 51a and 52a attach TCP7 to the 1st and 3rd TCP attachment surfaces 11a and 11c of the board | substrate 10, the 2nd head 51b and 52b are the 2nd and 4th TCP adhesion surfaces 11b. , 11d) must be attached to TCP (7). This is because the TCP 7 cannot be attached to the immediately adjacent TCP attaching surface 11 due to the volume occupied by each of the heads 51a, 52a, 51b, and 52b as described above in one embodiment.

As such, the TCP bonding device 1a according to another embodiment of the present invention is substantially similar in some respects to the embodiment of the present invention which rotates and attaches the TCP 7, but the heads 51a, 52a, 51b. , 52b) has a big difference in that it moves along a straight line path. When the heads 51a, 52a, 51b, and 52b move in a straight line, the work speed may be faster than to rotate depending on the situation.

In the above-described embodiments, the number of heads coupled to one area of the rotary mechanism and the linear drive mechanism has been described above, but it may be more or less than two according to each structure.

In addition, in the above-described exemplary embodiment, two vision cameras for TCP alignment are described above, but only one may be provided with an appropriate structure.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

As described above, according to the present invention, the tact time required for attaching the driving circuit board to the substrate can be significantly reduced, so that a larger number of driving circuit boards can be attached during the unit time. It can improve the production efficiency.

Claims (20)

At least one head for holding a driving circuit board and attaching the driving circuit board to the driving circuit board attachment surface of the board; A driving mechanism coupled to the at least one head and moving the at least one head; An alignment position sensing unit for obtaining at least one alignment position information among eye mark alignment positions formed on the driving circuit board attachment surface and information on the driving circuit board alignment positions held by the head; ; And A control unit for controlling the movement of the head so that the driving circuit board alignment position held in the head may be aligned corresponding to the eyemark alignment position based on the information obtained from the alignment position detecting unit; Drive circuit board bonding apparatus comprising a. The method of claim 1, The driving circuit board is a tape carrier package (TCP), and the driving circuit board bonding surface is a TCP mounting surface, characterized in that the TCP mounting surface. The method of claim 2, The at least one head is a plurality of heads, the drive mechanism is a linear drive mechanism for linearly moving the plurality of heads, The plurality of heads are circulated between the TCP loading station and the TCP attachment station by the linear drive mechanism, The control unit controls relative movement of the head so that the gripped TCP can be aligned in correspondence with the TCP attachment surface when the head holding the TCP moves to the TCP attachment station. Circuit board bonding device for driving. The method of claim 3, The plurality of heads are coupled to two pairs of the linear drive mechanism, And the controller controls the linear drive mechanism such that each pair of heads alternately moves between the TCP loading station and the TCP attachment station. The method of claim 2, The at least one head is a plurality of heads, the drive mechanism is a rotating mechanism rotatable based on the axis, The plurality of heads are coupled to the rotary mechanism to be spaced apart from each other but circulates the TCP loading station, TCP alignment station, TCP attachment station and recovery / standby station along the circumferential direction on the rotation mechanism, The control unit controls relative movement of the head so that the gripped TCP can be aligned corresponding to the TCP attachment surface when the head holding the TCP moves from the TCP alignment position to the TCP attachment position. Driving circuit board bonding apparatus, characterized in that. The method of claim 5, The plurality of heads are coupled to the rotary mechanism at equal angle intervals along the circumferential surface of the rotary mechanism, and each pair of the heads is the TCP loading station, TCP alignment station, TCP attachment station and A driving circuit board bonding apparatus for circulating a recovery / waiting station at the same time in sequence. The method according to claim 3 or 5, The alignment position detection unit, A TCP alignment vision camera for acquiring information on the TCP alignment position held by the head; And Further comprising a vision camera for eyemark alignment to obtain information on the eyemark alignment position, The information on the TCP alignment position obtained by the TCP alignment vision camera and the information on the eyemark alignment position obtained by the eyemark alignment vision camera are respectively transmitted to a control unit, and the control unit transmits the information. And controlling the movement of the head based on the received information. The method of claim 7, wherein And the TCP alignment vision camera is installed at a position corresponding to the TCP alignment station so as to obtain information on the TCP alignment position from the TCP alignment station. The method of claim 7, wherein The eyemark alignment vision camera is installed in two pairs in the upper region of the substrate corresponding to the TCP attachment station, The pair of vision cameras for the eyemark align sequentially acquires information about odd-numbered eyemarks of the eyemarks, two by one, And another pair of the eyemark alignment vision cameras sequentially obtains information about an even-numbered eyemark among the eyemarks, respectively. The method of claim 7, wherein The alignment position detection unit, It further includes a vision camera for substrate alignment to obtain the substrate alignment position information by photographing the alignment mark formed on the substrate, The control unit controls movement of the head based on the substrate alignment position information obtained by the substrate alignment vision camera, the TCP alignment position information, and the eyemark alignment position information. A circuit board bonding device for driving. The method of claim 10, And the substrate alignment position information of the substrate alignment vision camera is obtained before the substrate is transferred to the TCP attachment station and transmitted to the control unit. The method of claim 1, And a substrate stage for supporting the substrate and reciprocating along a predetermined path, wherein the substrate stage supports the substrate so as to be movable in the plate surface direction of the substrate on the path. Bonding device. The method of claim 12, The substrate is a driving circuit board bonding apparatus, characterized in that the substrate for the plasma display panel (PDP). An eyemark alignment position information acquiring step, which is formed on the driver circuit board attachment surface of the substrate and acquires information on an eyemark alignment position which sets a reference for the attachment position of the driver circuit board; Obtaining information on the alignment position of the driving circuit board on the head holding the driving circuit board to be attached to the driving circuit board attaching surface; And In order to align the driving circuit board alignment position with respect to the eyemark alignment position, the eyemark alignment position information acquiring step and the driving circuit board alignment position information acquiring step are acquired. And a head movement control step of controlling the relative movement of the head. The method of claim 14, And said driving circuit board is a tape carrier package (TCP), and said driving circuit board attaching surface is a TCP attaching surface. The method of claim 15, The head is provided with a plurality of coupled to the linear drive mechanism for reciprocating linear movement of the head reciprocating linear movement, The plurality of heads circulate the TCP loading station and the TCP attachment station by the linear drive mechanism, And the head movement control step is performed when the head holding the TCP moves to the TCP attachment station. The method of claim 15, The head is provided with a plurality, coupled to the rotating mechanism rotatable with respect to the axis of the center is rotated along the rotating mechanism, The plurality of heads circulate along the circumferential direction on the rotating mechanism a TCP loading station, a TCP align station, a TCP attach station and a retrieval / standby station, And the head movement control step is performed when the head holding the TCP moves from the TCP alignment station to the TCP attachment station. The method according to claim 16 or 17, And obtaining the TCP alignment position information, when the head holding the TCP of the attachment target is located at the TCP alignment station. The method of claim 14, And acquiring substrate alignment position information for acquiring information on the alignment positions of the entire substrate before the head movement control step. The method of claim 19, The head movement control step is performed based on the information obtained in the eyemark alignment position information acquisition step, the TCP alignment position information acquisition step and the substrate alignment position information acquisition step. Circuit board bonding method.

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