TWI743614B - Substrate processing device and substrate processing method - Google Patents

Substrate processing device and substrate processing method Download PDF

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TWI743614B
TWI743614B TW108144463A TW108144463A TWI743614B TW I743614 B TWI743614 B TW I743614B TW 108144463 A TW108144463 A TW 108144463A TW 108144463 A TW108144463 A TW 108144463A TW I743614 B TWI743614 B TW I743614B
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substrate
platform
correction
held
nozzle
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TW202032623A (en
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上野幸一
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日商斯庫林集團股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

本發明提供一種基板處理裝置及基板處理方法。本發明的課題在於確實地防止矯正構件與檢測部發生干涉，所述矯正構件對載置於平台的基板進行矯正，所述檢測部一邊在沿著平台的上表面的第一方向上移動一邊對已矯正的基板的上表面的表面狀態進行檢測。包括退避部，所述退避部在將藉由矯正構件而受到矯正後的基板保持於平台後且開始檢測部的移動前，使矯正構件退避至較保持於平台的基板的上表面的高度位置低的位置。The invention provides a substrate processing device and a substrate processing method. The subject of the present invention is to reliably prevent interference between a correction member and a detection unit that corrects a substrate placed on a platform, and the detection unit moves in a first direction along the upper surface of the platform while facing The surface condition of the upper surface of the corrected substrate is detected. It includes a retreat portion that retracts the correcting member to a position lower than the height of the upper surface of the substrate held on the platform after holding the substrate corrected by the correcting member on the platform and before starting the movement of the detection portion s position.

Description

基板處理裝置及基板處理方法Substrate processing device and substrate processing method

本發明是涉及一種在利用矯正構件對液晶顯示裝置或有機電致發光（Electroluminescence，EL）顯示裝置等的平板顯示器（Flat Panel Display，FPD）用玻璃基板、半導體晶片（wafer）、光罩（photomask）用玻璃基板、彩色濾光片（color filter）用基板、記錄磁片用基板、太陽電池用基板、電子紙用基板等精密電子裝置用基板、半導體封裝用基板（以下簡稱為“基板”）進行矯正後，保持基板並實施規定的處理的基板處理技術。The present invention relates to a glass substrate, semiconductor wafer (wafer), photomask (photomask) for flat panel displays (Flat Panel Display, FPD) such as liquid crystal display devices or organic electroluminescence (Electroluminescence, EL) display devices using a correction member. ) Substrates for precision electronic devices such as glass substrates, color filter substrates, recording magnetic sheet substrates, solar cell substrates, electronic paper substrates, etc., and semiconductor packaging substrates (hereinafter referred to as "substrates") After the correction, the substrate processing technology that holds the substrate and performs the prescribed processing.

以前，作為基板處理裝置的一例，已知有對基板進行塗布液的塗布等處理的塗布裝置（例如，參照專利文獻1）。所述塗布裝置包括：基板保持裝置，吸附並保持載置於平台的上表面的基板的下表面；以及狹縫噴嘴，在與由基板保持裝置保持的基板的上表面近接的狀態下，相對於所述基板沿水準方向相對移動，由此將塗布液塗布於基板的上表面。Conventionally, as an example of a substrate processing apparatus, a coating apparatus that performs processing such as coating of a coating liquid on a substrate is known (for example, refer to Patent Document 1). The coating device includes: a substrate holding device that sucks and holds the lower surface of the substrate placed on the upper surface of the platform; and a slit nozzle that faces the upper surface of the substrate held by the substrate holding device in close proximity The substrate is relatively moved in a horizontal direction, thereby applying the coating liquid on the upper surface of the substrate.

在所述基板保持裝置中，為了抑制在基板的周邊部附近產生的翹曲的影響，在平台的周圍配置有按壓構件（相當於本發明的“矯正構件”的一例）。而且，在基板的翹曲大的情況下，按壓構件對基板的上表面的周邊部自上方進行按壓來矯正基板的翹曲。因此，可將基板的整個區域吸附保持於平台上，從而可良好地進行塗布處理等基板處理。 [現有技術文獻] [專利文獻]In the substrate holding device, in order to suppress the influence of warpage generated near the peripheral portion of the substrate, a pressing member (corresponding to an example of the “correcting member” of the present invention) is arranged around the platform. Furthermore, when the warpage of the substrate is large, the pressing member presses the peripheral portion of the upper surface of the substrate from above to correct the warpage of the substrate. Therefore, the entire area of the substrate can be adsorbed and held on the platform, so that substrate processing such as coating processing can be performed well. [Prior Art Literature] [Patent Literature]

[專利文獻1] 日本專利特開2017-112197號公報 [專利文獻2] 日本專利特開2006-167610號公報 [專利文獻3] 日本專利特開2005-85773號公報 [發明所欲解決之課題][Patent Document 1] Japanese Patent Laid-Open No. 2017-112197 [Patent Document 2] Japanese Patent Laid-Open No. 2006-167610 [Patent Document 3] Japanese Patent Laid-Open No. 2005-85773 [The problem to be solved by the invention]

然而，在塗布裝置中，在成為狹縫噴嘴的下端部的噴出口與基板近接的狀態下，狹縫噴嘴相對於基板移動。因此，若異物附著於基板的上表面或因基板與保持基板的保持面之間的異物而在基板存在隆起部，則存在如下擔憂：這些異物或隆起部與狹縫噴嘴接觸而產生狹縫噴嘴的損傷、基板的損傷或者塗布不良等。因此，提出有如下技術：在異物等與狹縫噴嘴接觸前，一邊使檢測部沿著基板的上表面移動，一邊對基板的上表面的表面狀態進行檢測，基於所述檢測結果而在異物等與狹縫噴嘴接觸前停止狹縫噴嘴的相對移動（參照專利文獻2、專利文獻3）。因此，提出了將所述技術應用於所述專利文獻1中所記載的基板處理裝置。However, in the coating apparatus, the slit nozzle moves with respect to the substrate in a state where the ejection port, which is the lower end of the slit nozzle, is in close proximity to the substrate. Therefore, if foreign matter adheres to the upper surface of the substrate or there is a raised portion on the substrate due to the foreign matter between the substrate and the holding surface holding the substrate, there is a concern that the foreign matter or the raised portion contacts the slit nozzle and the slit nozzle is generated. Damage to the substrate, damage to the substrate, or poor coating, etc. Therefore, a technique has been proposed to detect the surface condition of the upper surface of the substrate while moving the detection unit along the upper surface of the substrate before the foreign object or the like comes into contact with the slit nozzle. The relative movement of the slit nozzle is stopped before contact with the slit nozzle (refer to Patent Document 2 and Patent Document 3). Therefore, it has been proposed to apply the technique to the substrate processing apparatus described in Patent Document 1.

然而，若將專利文獻2或專利文獻3中所記載的檢測技術應用於具備矯正基板的翹曲的按壓構件的基板處理裝置，則存在用以進行異物檢測的擋板構件（參照專利文獻2）或檢測感測器（參照專利文獻3）與按壓構件發生干涉的情況，所述情況成為給塗布處理等基板處理帶來阻礙的主要原因之一。However, if the detection technique described in Patent Document 2 or Patent Document 3 is applied to a substrate processing apparatus equipped with a pressing member that corrects the warpage of the substrate, there is a baffle member for detecting foreign matter (see Patent Document 2) Or, the detection sensor (see Patent Document 3) interferes with the pressing member, which becomes one of the main factors that hinder substrate processing such as coating processing.

本發明是鑒於所述課題而完成的，其目的在於提供一種可確實地防止矯正構件與檢測部發生干涉的基板處理裝置及基板處理方法，所述矯正構件對載置於平台的基板進行矯正，所述檢測部一邊在沿著平台的上表面的第一方向上移動一邊對已矯正的基板的上表面的表面狀態進行檢測。The present invention has been completed in view of the above-mentioned problems, and its object is to provide a substrate processing apparatus and a substrate processing method that can reliably prevent interference between a correction member and a detection unit, the correction member correcting a substrate placed on a platform, The detection unit detects the surface condition of the upper surface of the corrected substrate while moving in the first direction along the upper surface of the platform.

[解決課題之手段][Means to solve the problem]

本發明的一實施方式為一種基板處理裝置，包括：平台，在上表面設置供基板載置的載置區域，對載置於載置區域的基板進行保持；移動體，在沿著平台的上表面的第一方向上移動；檢測部，一邊與移動體朝向第一方向的移動同時沿第一方向移動，一邊對保持於平台的基板的上表面的表面狀態進行檢測；矯正構件，在利用平台保持基板前，位於載置於載置區域的基板的上表面周邊部的上方位置並將上表面周邊部按壓至平台側來進行矯正；以及退避部，在將藉由矯正構件而受到矯正後的基板保持於平台後且開始檢測部的移動前，使矯正構件退避至較保持於平台的基板的上表面的高度位置低的位置。One embodiment of the present invention is a substrate processing apparatus including: a platform, a mounting area for substrate mounting is provided on the upper surface, and a substrate placed in the mounting area is held; a moving body is located along the platform The surface moves in the first direction; the detection part moves in the first direction simultaneously with the movement of the moving body in the first direction, while detecting the surface condition of the upper surface of the substrate held on the platform; the correction member is using the platform Before holding the substrate, it is positioned above the peripheral portion of the upper surface of the substrate placed in the mounting area and presses the peripheral portion of the upper surface to the platform side for correction; and the retreat portion is corrected by the correction member. After the substrate is held on the platform and before the movement of the detection unit is started, the correction member is retracted to a position lower than the height position of the upper surface of the substrate held on the platform.

另外，本發明的另一實施方式為一種基板處理方法，包括：使矯正構件移動至基板的上表面周邊部的上方位置，所述基板載置於載置區域，所述載置區域設置於平台的上表面，並將上表面周邊部按壓至平台側來進行矯正的步驟；利用平台來保持藉由矯正構件而受到矯正後的基板的步驟；使矯正構件自保持於平台的基板的上方退避至較基板的上表面的高度位置低的位置的步驟；以及在矯正構件位於較高度位置低的位置的期間，使移動體沿平台的第一方向移動，並且使檢測部沿第一方向移動，同時對保持於平台的基板的上表面的表面狀態進行檢測的步驟。In addition, another embodiment of the present invention is a substrate processing method, including: moving a correction member to a position above a peripheral portion of the upper surface of a substrate, the substrate is placed on a placement area, and the placement area is provided on a platform The step of correcting the upper surface of the upper surface and pressing the peripheral portion of the upper surface to the side of the platform to perform the step of correcting; the step of using the platform to hold the substrate corrected by the correcting member; the step of retreating the correcting member from above the substrate held on the platform The step of moving the moving body in the first direction of the platform and the detecting part in the first direction while the correcting member is in the higher position and lower position, and moving the detecting part in the first direction while A step of detecting the surface condition of the upper surface of the substrate held on the platform.

在以所述方式構成的發明中，檢測部一邊沿第一方向移動一邊對保持於平台的基板的上表面的表面狀態進行檢測。另外，矯正構件位於載置於平台的載置區域的基板的上表面周邊部的上方位置並進行基板的矯正。如此，若檢測部及矯正構件位於基板的上方的期間全部或部分重疊，則兩者會發生干涉。因此，在本發明中，進行矯正處理的矯正構件自保持於平台的基板的上方退避至較基板的上表面的高度位置低的位置，在所述退避狀態下，一邊與移動體的移動同時使檢測部沿第一方向移動，一邊對保持於平台的基板的上表面的表面狀態進行檢測。再者，所謂“與移動體的移動同時使檢測部沿第一方向移動”是指使檢測部與移動體一體地或獨立於移動體地移動。 [發明的效果]In the invention configured as described above, the detection unit detects the surface state of the upper surface of the substrate held on the platform while moving in the first direction. In addition, the correction member is positioned above the peripheral portion of the upper surface of the substrate placed on the mounting area of the platform and performs correction of the substrate. In this way, if the detection part and the correcting member are located above the substrate, if all or part of the period overlaps, they will interfere with each other. Therefore, in the present invention, the correcting member for correcting treatment is retracted from above the substrate held on the platform to a position lower than the height position of the upper surface of the substrate, and in the retracted state, while simultaneously moving the movable body The detection unit moves in the first direction while detecting the surface state of the upper surface of the substrate held on the platform. In addition, the term "moving the detection unit in the first direction simultaneously with the movement of the moving body" refers to moving the detection unit integrally with the moving body or independently of the moving body. [Effects of the invention]

如上所述，根據本發明，在矯正構件自保持於平台的基板的上方退避至較基板的上表面的高度位置低的位置的狀態下，檢測部移動來對基板的上表面的表面狀態進行檢測，因此可確實地防止矯正構件與檢測部的干涉。As described above, according to the present invention, in a state where the correction member is retracted from above the substrate held on the platform to a position lower than the height of the upper surface of the substrate, the detection unit moves to detect the surface condition of the upper surface of the substrate Therefore, the interference between the correction member and the detection part can be reliably prevented.

圖1是表示作為本發明的基板處理裝置的第一實施方式的塗布裝置的立體圖。另外，圖2是圖1所示的塗布裝置的部分平面圖。進而，圖3是表示圖1所示的塗布裝置的電氣構成的框圖。再者，在圖1、圖2及以後的各圖中，為了明確它們的方向關係而適當標注有將Z方向設為鉛垂方向、將XY平面設為水平面的XYZ正交坐標系。另外，為了易於理解，視需要而誇大或簡略描繪各部的尺寸或數量。Fig. 1 is a perspective view showing a coating apparatus as a first embodiment of the substrate processing apparatus of the present invention. In addition, FIG. 2 is a partial plan view of the coating device shown in FIG. 1. Furthermore, FIG. 3 is a block diagram showing the electrical configuration of the coating device shown in FIG. 1. In addition, in each of FIGS. 1, 2 and the following figures, in order to clarify the directional relationship, an XYZ orthogonal coordinate system in which the Z direction is a vertical direction and the XY plane is a horizontal plane is appropriately indicated. In addition, for ease of understanding, the size or number of each part is exaggerated or simplified as necessary.

塗布裝置100包括由中央處理器（Central Processing Unit，CPU）或隨機存取記憶體（Random Access Memory，RAM）構成的電腦即控制器（controller）10，且藉由利用控制器10控制裝置各部而對自機器人等接收的基板S的上表面Sa（參照圖5B）供給作為處理液的一例的塗布液來進行塗布。作為所述塗布裝置100的處理物件的基板S的種類有多種。尤其，如後所述，塗布裝置100包括矯正基板S的翹曲的機構，因此例如適於處理具有多層結構的基板S，所述多層結構包含銅等金屬的層。即，所述多層基板S容易因各層的熱膨脹率的不同而翹曲，相對於此，塗布裝置100可在矯正所述翹曲後保持所述基板S並將塗布液塗布。另外，作為處理對象的基板S的形狀也有多種，此處，對相對於俯視時具有四邊形狀的基板S執行塗布處理的構成進行說明。The coating device 100 includes a computer (controller) 10 composed of a central processing unit (CPU) or a random access memory (Random Access Memory, RAM), and the controller 10 is used to control various parts of the device. The upper surface Sa (see FIG. 5B) of the substrate S received from a robot or the like is supplied with a coating liquid as an example of a processing liquid and applied. There are many kinds of substrates S as the processing objects of the coating device 100. In particular, as described later, the coating apparatus 100 includes a mechanism for correcting the warpage of the substrate S, and is therefore suitable for processing a substrate S having a multilayer structure including a layer of a metal such as copper, for example. That is, the multilayer substrate S tends to warp due to the difference in the thermal expansion coefficient of each layer. In contrast, the coating device 100 can hold the substrate S and apply the coating liquid after correcting the warpage. In addition, there are also various shapes of the substrate S to be processed. Here, a configuration in which the coating process is performed with respect to the substrate S having a quadrangular shape in a plan view will be described.

如圖1所示，塗布裝置100包括具有大致立方體的形狀且由花崗岩等石材構成的平台1。在平台1的上表面11中的（+X）側具備加工成大致水準的平坦面來載置基板S的載置區域11a。在所述載置區域11a中分散地形成有未圖示的多個通氣孔。這些通氣孔與空氣供給部112及空氣抽吸部113連接。因此，控制裝置整體的控制器10可藉由利用空氣供給部112對通氣孔供給空氣而將空氣自通氣孔吹至載置區域11a上的基板S，或者可藉由利用空氣抽吸部113自通氣孔抽吸空氣而將基板S吸附保持於載置區域11a。As shown in FIG. 1, the coating device 100 includes a platform 1 that has a substantially cubic shape and is made of stone such as granite. On the (+X) side of the upper surface 11 of the platform 1, a mounting area 11 a in which the substrate S is mounted is provided with a flat surface processed to be substantially horizontal. A plurality of vent holes (not shown) are dispersedly formed in the mounting area 11a. These vent holes are connected to the air supply part 112 and the air suction part 113. Therefore, the controller 10 of the entire control device can blow air from the vent hole to the substrate S on the mounting area 11a by supplying air to the vent hole by the air supply part 112, or it can blow air from the vent hole to the substrate S on the mounting area 11a, or can use the air suction part 113 to blow air from the vent hole. The air vent sucks air to suck and hold the substrate S in the mounting area 11a.

塗布裝置100包括用以將自機器人（省略圖示）接收的基板S載置於載置區域11a的多個頂銷（lift pin）12。即，在平台1上，向載置區域11a開口的多個銷收納孔114沿Z方向平行地延伸設置，各銷收納孔114中收容有頂銷12。各頂銷12具有沿Z方向平行地延伸設置的銷形狀，控制器10利用頂銷致動器A112而使頂銷12升降，由此頂銷12相對於銷收納孔114進退。而且，若機器人將基板S搬送至載置區域11a的上方，則藉由頂銷致動器A112的驅動而上升的多個頂銷12自銷收納孔114向載置區域11a的上方突出，並在各自的上端接收基板S。繼而，藉由頂銷致動器A112的驅動，多個頂銷12下降並收入銷收納孔114內，由此使基板S自多個頂銷12的上端載置於載置區域11a。The coating apparatus 100 includes a plurality of lift pins 12 for placing the substrate S received from a robot (not shown) on the placing area 11 a. That is, on the platform 1, a plurality of pin receiving holes 114 that open to the mounting area 11 a are extended in parallel in the Z direction, and the top pins 12 are accommodated in each of the pin receiving holes 114. Each ejector pin 12 has a pin shape extending in parallel in the Z direction. The controller 10 uses the ejector pin actuator A112 to move the ejector pin 12 up and down, so that the ejector pin 12 advances and retreats with respect to the pin housing hole 114. Then, when the robot transports the substrate S above the placement area 11a, the plurality of ejector pins 12 raised by the drive of the ejector pin actuator A112 protrude above the placement area 11a from the pin accommodating hole 114, and The substrate S is received at each upper end. Then, by the driving of the ejector pin actuator A112, the plurality of ejector pins 12 are lowered and received in the pin accommodating hole 114, thereby placing the substrate S on the placement area 11a from the upper end of the plurality of ejector pins 12.

在本實施方式中，與專利文獻1中所記載的裝置同樣地，設置有位置調整機構2，以在保持基板S前，在載置於載置區域11a的狀態下，對水準方向上的基板S的位置進行調整，並且設置有矯正機構3，以矯正基板S的翹曲。再者，關於這些構成，將在後文進行說明。In the present embodiment, similar to the device described in Patent Document 1, a position adjustment mechanism 2 is provided to align the substrate in the horizontal direction with the substrate S placed on the mounting area 11a before holding the substrate S. The position of S is adjusted, and a correction mechanism 3 is provided to correct the warpage of the substrate S. In addition, these constitutions will be described later.

受到藉由位置調整機構2的位置調整及藉由矯正機構3的翹曲矯正的基板S在由平台1保持後，受到藉由狹縫噴嘴4的塗布處理。如圖1所示，所述狹縫噴嘴4具有沿Y方向延伸的狹縫狀的開口部即噴出口，且藉由移動機構5而沿X方向移動。移動機構5具有橋樑結構的噴嘴支撐體51與使噴嘴支撐體51沿X方向移動的噴嘴移動部52作為主要構成。噴嘴支撐體51以可自噴出口朝向保持於平台1的基板S的上表面Sa噴出塗布液的姿勢支撐狹縫噴嘴4。噴嘴支撐體51具有將Y方向設為長邊方向並支撐狹縫噴嘴4的樑構件51a及分別支撐樑構件51a的Y方向端部的一對柱構件51b。更詳細而言，如圖1所示，噴嘴支撐體51具有沿著Y方向架設於平台1的左右兩端部且跨越平台1的上表面11的架橋結構。而且，噴嘴移動部52使噴嘴支撐體51與被噴嘴支撐體51固定保持的狹縫噴嘴4相對於保持於平台1上的基板S沿著X方向相對移動。所述X方向為沿著平台1的上表面11的第一方向。如此，噴嘴支撐體51以使噴出口沿著與第一方向X大致正交的水準方向Y的方式固定保持狹縫噴嘴4，使狹縫噴嘴4一體地沿第一方向X移動，相當於本發明的“保持部”的一例，並且作為本發明的“移動體”發揮功能。The substrate S subjected to the position adjustment by the position adjustment mechanism 2 and the warpage correction by the correction mechanism 3 is held by the stage 1 and then subjected to the coating process by the slit nozzle 4. As shown in FIG. 1, the slit nozzle 4 has a slit-shaped opening extending in the Y direction, that is, an ejection port, and is moved in the X direction by a moving mechanism 5. The moving mechanism 5 has a nozzle support body 51 having a bridge structure and a nozzle moving part 52 that moves the nozzle support body 51 in the X direction as main components. The nozzle support 51 supports the slit nozzle 4 in a posture capable of ejecting the coating liquid from the ejection port toward the upper surface Sa of the substrate S held on the stage 1. The nozzle support body 51 has a beam member 51a that sets the Y direction as the longitudinal direction and supports the slit nozzle 4, and a pair of column members 51b that respectively support the Y-direction ends of the beam member 51a. In more detail, as shown in FIG. 1, the nozzle support body 51 has a bridge structure that is erected on the left and right ends of the platform 1 along the Y direction and straddles the upper surface 11 of the platform 1. In addition, the nozzle moving part 52 relatively moves the nozzle support 51 and the slit nozzle 4 fixedly held by the nozzle support 51 in the X direction with respect to the substrate S held on the stage 1. The X direction is the first direction along the upper surface 11 of the platform 1. In this way, the nozzle support 51 fixes and holds the slit nozzle 4 so that the ejection port is along the horizontal direction Y substantially orthogonal to the first direction X, and moves the slit nozzle 4 integrally in the first direction X, which is equivalent to this An example of the "holding part" of the invention also functions as the "moving body" of the invention.

如此沿X方向一體地移動的狹縫噴嘴4及噴嘴支撐體51中，相對於狹縫噴嘴4，與專利文獻2中所記載的裝置同樣地安裝包含擋板構件61與振動感測器（省略圖示）的第一檢測部6，進而，相對於噴嘴支撐體51，與專利文獻3中所記載的裝置同樣地安裝包含多個檢測感測器71、72的第二檢測部7。如上所述，這些第一檢測部6及第二檢測部7對基板S的上表面Sa的表面狀態進行檢測而預先防止在狹縫噴嘴4的移動中，基板S的異物等與狹縫噴嘴4及下端部接觸而產生狹縫噴嘴4的損傷、基板S的損傷或者塗布不良等。In the slit nozzle 4 and the nozzle support 51 that move integrally in the X direction in this way, the slit nozzle 4 is equipped with a baffle member 61 and a vibration sensor (omitted The first detection unit 6 shown in the figure is further attached to the nozzle support 51 with a second detection unit 7 including a plurality of detection sensors 71 and 72 in the same manner as the device described in Patent Document 3. As described above, the first detection unit 6 and the second detection unit 7 detect the surface condition of the upper surface Sa of the substrate S and prevent in advance the movement of the slit nozzle 4 from foreign matter and the like of the substrate S and the slit nozzle 4 Contact with the lower end portion causes damage to the slit nozzle 4, damage to the substrate S, or poor coating.

噴嘴移動部52在±Y側分別包括：導軌53，沿X方向引導狹縫噴嘴4、擋板構件61及檢測感測器71、72的移動；作為驅動源的線性馬達54；以及位置感測器55，用以檢測狹縫噴嘴4的噴出口的位置。The nozzle moving part 52 respectively includes a guide rail 53 on the ±Y side to guide the movement of the slit nozzle 4, the baffle member 61, and the detection sensors 71 and 72 in the X direction; a linear motor 54 as a driving source; and a position sensor The device 55 is used to detect the position of the ejection port of the slit nozzle 4.

兩個導軌53分別在平台1的Y方向的兩端部沿著X方向延伸設置為包含自噴嘴待機位置（圖1所示的位置）至塗布結束位置（載置區域11a的+X側端部位置）為止的區間。因此，利用噴嘴移動部52沿著所述兩個導軌53引導兩個柱構件51b的下端部，由此狹縫噴嘴4在噴嘴待機位置與和保持於平台1上的基板S相向的位置之間移動。The two guide rails 53 respectively extend along the X direction at both ends of the platform 1 in the Y direction to include from the nozzle standby position (the position shown in FIG. 1) to the coating end position (the +X side end of the placement area 11a) Position). Therefore, the lower ends of the two column members 51b are guided by the nozzle moving portion 52 along the two guide rails 53, so that the slit nozzle 4 is between the nozzle standby position and the position facing the substrate S held on the platform 1. move.

在本實施方式中，各線性馬達54構成為具有定子54a與動子54b的交流電（Alternating Current，AC）無鐵心線性馬達（coreless linear motor）。定子54a沿著X方向設置於平台1的Y方向的兩側面。另一方面，動子54b固定設置於柱構件51b的外側。線性馬達54藉由在這些定子54a與動子54b之間產生的磁力而作為噴嘴移動部52的驅動源發揮功能。In this embodiment, each linear motor 54 is configured as an alternating current (AC) coreless linear motor having a stator 54 a and a mover 54 b. The stator 54a is provided on both sides of the platform 1 in the Y direction along the X direction. On the other hand, the mover 54b is fixedly provided on the outside of the column member 51b. The linear motor 54 functions as a drive source of the nozzle moving part 52 by the magnetic force generated between the stator 54a and the mover 54b.

另外，各位置感測器55具有所謂的線性編碼器的構成，且分別具有刻度部55a與檢測部55b。刻度部55a沿著X方向設置於固定設置於平台1的線性馬達54的定子54a的下部。另一方面，檢測部55b固定設置於在柱構件51b上固定設置的線性馬達54的動子54b的更外側，並與刻度部55a相向配置。在刻度部55a以一定間隔設置有格子標度，每當相對於刻度部55a相對移動的檢測部55b讀取標度，自檢測部55b輸出脈衝信號。檢測部55b的輸出信號被輸入至控制器10。如後所述，基於刻度部55a與檢測部55b的相對位置關係，檢測Y方向上的狹縫噴嘴4的噴出口的位置。In addition, each position sensor 55 has a structure of a so-called linear encoder, and each has a scale portion 55a and a detection portion 55b. The scale part 55a is provided in the lower part of the stator 54a of the linear motor 54 fixedly provided in the platform 1 along the X direction. On the other hand, the detection part 55b is fixedly provided in the outer side of the mover 54b of the linear motor 54 fixedly provided in the column member 51b, and is arrange|positioned facing the scale part 55a. The scale portion 55a is provided with grid scales at regular intervals, and whenever the detection portion 55b that moves relative to the scale portion 55a reads the scale, a pulse signal is output from the detection portion 55b. The output signal of the detection unit 55b is input to the controller 10. As described later, the position of the discharge port of the slit nozzle 4 in the Y direction is detected based on the relative positional relationship between the scale portion 55a and the detection portion 55b.

其次，一面參照圖1至圖4、圖5A及圖5B，一面對位置調整機構2及矯正機構3的構成進行說明。圖4是表示第一實施方式中的矯正機構的矯正塊與用以使所述矯正塊移動的移動部的立體圖。另外，圖5A及圖5B是示意性表示第一實施方式中的矯正塊利用移動部而進行的移動的側視圖。本實施方式在相對於平台1設置有可收容位置調整機構2及矯正機構3的凹坑（pit）13的方面與當狹縫噴嘴4與噴嘴支撐體51一體地沿X方向往返移動時位置調整機構2及矯正機構3可退避至凹坑13的方面和專利文獻1中所記載的裝置大不相同，另一方面，位置調整機構2及矯正機構3的基本構成相同。Next, while referring to FIGS. 1 to 4, FIGS. 5A and 5B, the configuration of the position adjustment mechanism 2 and the correction mechanism 3 will be described. 4 is a perspective view showing a correction block of the correction mechanism in the first embodiment and a moving part for moving the correction block. 5A and 5B are side views schematically showing the movement of the correction block in the first embodiment by the moving part. In this embodiment, a pit 13 capable of accommodating the position adjusting mechanism 2 and the correcting mechanism 3 is provided with respect to the platform 1 and the position is adjusted when the slit nozzle 4 and the nozzle support 51 are moved back and forth in the X direction integrally. The mechanism 2 and the correcting mechanism 3 are quite different from the device described in Patent Document 1 in that they can be retracted to the recess 13. On the other hand, the basic configuration of the position adjusting mechanism 2 and the correcting mechanism 3 is the same.

如圖1及圖2所示，凹坑13是在載置區域11a與平台1的側端面11b之間自平台1的上表面11向下方下挖而成的凹部狀的空間，且以自四周包圍載置區域11a的方式設置有合計四個。如以下所說明般，所述凹坑13與對應於具有矩形形狀的基板S的各邊而設置位置調整單元20及矯正單元30相對應。As shown in Figures 1 and 2, the pit 13 is a recess-shaped space dug from the upper surface 11 of the platform 1 downward between the placement area 11a and the side end surface 11b of the platform 1, and is formed from the surrounding A total of four are provided so as to surround the placement area 11a. As described below, the pit 13 corresponds to the position adjustment unit 20 and the correction unit 30 provided corresponding to each side of the substrate S having a rectangular shape.

其次，對具有位置調整單元20的位置調整機構2及具有矯正單元30的矯正機構3的構成以及動作進行說明。位置調整機構2是對載置於載置區域11a的基板S在載置區域11a上的位置進行調整的機構。所述位置調整機構2具有在載置區域11a的各邊各配置有兩個的合計8個位置調整單元20，各位置調整單元20具有沿Z方向平行地延伸設置的銷形狀的定位銷（alignment pin）21。即，在凹坑13的側面中的與載置區域11a鄰接的側面各設置有兩個垂直切入於所述側面且沿水準方向延伸設置的切口部115，各切口部115內配置有定位銷21。定位銷21的上端自切口部115突出至載置區域11a的上方，位置調整單元20藉由利用位置調整致動器A21將定位銷21沿著切口部115向水準方向驅動，可使定位銷21的較載置區域11a靠上方的部分抵接於基板S的周緣。再者，作為位置調整單元20，例如可使用專利文獻1中所記載的單元。另外，在本實施方式中，如以下所說明般，對應於載置區域11a的各邊而設置的一對位置調整單元20可與矯正機構3中對應於載置區域11a的各邊而設置的矯正塊31一體地移動。Next, the configuration and operation of the position adjustment mechanism 2 having the position adjustment unit 20 and the correction mechanism 3 having the correction unit 30 will be described. The position adjustment mechanism 2 is a mechanism that adjusts the position of the substrate S placed on the placement area 11a on the placement area 11a. The position adjustment mechanism 2 has a total of eight position adjustment units 20 arranged two on each side of the placement area 11a, and each position adjustment unit 20 has a pin-shaped positioning pin (alignment) extending in parallel in the Z direction. pin) 21. That is, each of the side surfaces of the recess 13 adjacent to the placement area 11a is provided with two notches 115 vertically cut into the side surfaces and extending in the horizontal direction, and positioning pins 21 are arranged in each notch 115. . The upper end of the positioning pin 21 protrudes from the notch 115 to above the placement area 11a, and the position adjustment unit 20 drives the positioning pin 21 in the horizontal direction along the notch 115 by using the position adjustment actuator A21 to enable the positioning pin 21 The upper part of the mounting area 11a abuts against the peripheral edge of the substrate S. In addition, as the position adjustment unit 20, for example, a unit described in Patent Document 1 can be used. In addition, in this embodiment, as described below, a pair of position adjustment units 20 provided corresponding to each side of the placement area 11a may be combined with those provided in the correction mechanism 3 corresponding to each side of the placement area 11a. The correction block 31 moves integrally.

矯正機構3是與載置於載置區域11a的基板S的上表面周邊部接觸而將基板S按壓至載置區域11a來矯正基板S的翹曲者，且具有在載置區域11a的各邊各配置有一個的合計4個矯正單元30。各矯正單元30具有矯正塊31，所述矯正塊31沿著載置區域11a的對應邊延伸設置，且如後所述，位於載置於載置區域11a的基板S的上表面周邊部的上方並將上表面周邊部直接按壓至平台1的上表面11來矯正基板S的翹曲。The correction mechanism 3 is a device that contacts the peripheral portion of the upper surface of the substrate S placed in the placement area 11a and presses the substrate S to the placement area 11a to correct the warpage of the substrate S, and has the sides of the placement area 11a. A total of four correction units 30 are arranged one each. Each correction unit 30 has a correction block 31 that extends along the corresponding side of the placement area 11a and is located above the peripheral portion of the upper surface of the substrate S placed in the placement area 11a, as described later. The peripheral portion of the upper surface is directly pressed to the upper surface 11 of the platform 1 to correct the warpage of the substrate S.

在載置區域11a的各邊各設置有一個矯正塊31，各矯正塊31的構成是相通的。矯正塊31具有框架33、以及安裝於框架33的下表面的相向平板34。相向平板34在沿著載置區域11a的對應邊而向水準方向延伸的框架33的下表面，避開切口部32而設置。而且，若藉由移動部35而使矯正塊31移動至基板S的上表面周邊部的上方，則安裝於相向平板34的下部的接觸構件341以對所述上表面周邊部自上方進行覆蓋的方式相向配置。而且，若藉由移動部35而使矯正塊31下降，則接觸構件341與基板S的上表面周邊部接觸，進而按壓至平台1的上表面11。One correction block 31 is provided on each side of the placement area 11a, and the configuration of each correction block 31 is the same. The correction block 31 has a frame 33 and an opposed flat plate 34 attached to the lower surface of the frame 33. The facing flat plate 34 is provided on the lower surface of the frame 33 extending in the horizontal direction along the corresponding side of the mounting area 11 a, avoiding the cutout portion 32. Furthermore, if the correction block 31 is moved above the peripheral portion of the upper surface of the substrate S by the moving portion 35, the contact member 341 is installed at the lower part of the opposed plate 34 to cover the peripheral portion of the upper surface from above. The way is configured oppositely. Then, when the correction block 31 is lowered by the moving portion 35, the contact member 341 comes into contact with the peripheral portion of the upper surface of the substrate S, and is further pressed to the upper surface 11 of the platform 1.

如圖4、圖5A及圖5B所示，移動部35具有作為驅動源的兩個垂直致動器351、352以及一個水準致動器353。垂直致動器351、352分別具有根據來自控制器10的驅動指令而進行升降移動的桿351r、352r。這些中，桿351r經由加工成剖面形狀為大致L字狀的托架361而安裝於矯正塊31的框架33。另外，另一個桿352r經由加工成剖面形狀為大致L字狀的托架362而安裝於垂直致動器351的筒體部351s。進而，垂直致動器352的筒體部352s被移動板371支撐。As shown in FIGS. 4, 5A, and 5B, the moving part 35 has two vertical actuators 351 and 352 and one leveling actuator 353 as driving sources. The vertical actuators 351 and 352 respectively have rods 351r and 352r that move up and down in accordance with a drive command from the controller 10. Among these, the rod 351r is attached to the frame 33 of the correction block 31 via a bracket 361 processed into a substantially L-shaped cross-sectional shape. In addition, the other rod 352r is attached to the cylindrical portion 351s of the vertical actuator 351 via a bracket 362 processed into a substantially L-shaped cross-sectional shape. Furthermore, the cylindrical portion 352 s of the vertical actuator 352 is supported by the moving plate 371.

移動板37可相對於平台1而沿水準方向進退。更詳細而言，在所述實施方式中，基座構件373固定於平台1，進而在所述基座構件373上，軌道372對移動板371以移動板371可沿水準方向進退的方式進行支撐。而且，相對於移動板371而連接有水準致動器353，從而可沿水準方向驅動移動板371。The moving plate 37 can advance and retreat in the horizontal direction with respect to the platform 1. In more detail, in the embodiment, the base member 373 is fixed to the platform 1, and then on the base member 373, the rail 372 supports the moving plate 371 in such a way that the moving plate 371 can advance and retreat in the horizontal direction. . Furthermore, a leveling actuator 353 is connected to the moving plate 371, so that the moving plate 371 can be driven in the horizontal direction.

移動部35以如上方式構成，因此當在根據來自控制器10的指令而垂直致動器351、352使桿351r、352r前進至最上方位置後，水準致動器353使移動板371移動至平台1側時，如圖5A所示，矯正塊31移動至平台1的上方，矯正塊31的底面、即相向平板34中的與基板S相向的下表面被定位於自平台1上的基板S充分離開的高度位置H1。另外，雖省略了同圖中的圖示，但隨著矯正塊31的移動，位置調整單元20也移動至平台1側。然後，保持使垂直致動器352的桿352r伸長的狀態，根據來自控制器10的指令，垂直致動器351的桿351r後退至筒體部351s，伴隨於此，接觸構件341向平台1上的基板S接近，並被定位於與後退量對應的高度位置H2、H3。由此，將基板S的上表面周邊部按壓至平台1的上表面11來矯正翹曲。再者，關於所述矯正動作，與專利文獻1中所記載的裝置相同，因此此處省略說明。The moving part 35 is configured as described above. Therefore, after the vertical actuators 351 and 352 advance the rods 351r and 352r to the uppermost position in accordance with the instruction from the controller 10, the leveling actuator 353 moves the moving plate 371 to the platform. 1 side, as shown in FIG. 5A, the correction block 31 moves above the platform 1, and the bottom surface of the correction block 31, that is, the lower surface of the facing plate 34 that faces the substrate S, is sufficiently positioned from the substrate S on the platform 1. Leave the height position H1. In addition, although the illustration in the same figure is omitted, as the correction block 31 moves, the position adjustment unit 20 also moves to the platform 1 side. Then, keeping the state of extending the rod 352r of the vertical actuator 352, according to the instruction from the controller 10, the rod 351r of the vertical actuator 351 is retracted to the cylindrical portion 351s, and with this, the contact member 341 is moved onto the platform 1. The substrate S of φ is approaching and is positioned at the height positions H2 and H3 corresponding to the amount of retreat. As a result, the peripheral portion of the upper surface of the substrate S is pressed to the upper surface 11 of the stage 1 to correct the warpage. In addition, the correction operation is the same as the device described in Patent Document 1, so the description is omitted here.

如此，藉由使矯正塊31移動至載置於平台1的載置區域11a的基板S的上表面周邊部的上方、更詳細而言高度位置H3而將所述上表面周邊部按壓至平台1側來進行矯正，但其後，將藉由矯正塊31而受到矯正的基板S吸附保持於平台1。In this way, by moving the correction block 31 to the upper surface peripheral portion of the substrate S placed on the mounting area 11a of the platform 1, in more detail, the height position H3, the upper surface peripheral portion is pressed to the platform 1 After that, the substrate S corrected by the correction block 31 is sucked and held on the platform 1.

在基板S的保持完成後，以如下方式執行矯正塊31的退避處理。在根據來自控制器10的指令而水準致動器353使移動板371移動至相對於平台1側的相反側後，垂直致動器351、352使桿351r、352r後退至筒體部351s、352s。由此，如圖5B所示，矯正塊31被定位於退避位置。另外，雖省略了圖5B中的圖示，但與矯正塊31一體地移動的位置調整單元20也被定位於退避位置。所述退避位置是指矯正塊31在水準方向上自平台1離開的位置，且是在垂直方向上低於保持於平台1的已矯正的基板S的上表面Sa的高度位置H4（圖5B中的點劃線）的位置。因此，藉由矯正塊31及位置調整單元20定位於退避位置，可防止矯正塊31與擋板構件61碰撞或將投光於檢測感測器71、72之間的感測器光73遮光。因此，在矯正塊31的退避後，在狹縫噴嘴4的移動前方側即如圖1所示的（+X）方向側，可一邊高精度地檢測在狹縫噴嘴4的移動中與狹縫噴嘴4發生干涉的基板S上的物件物（異物或隆起部等），一邊執行塗布處理。After the holding of the substrate S is completed, the retreat processing of the correction block 31 is performed in the following manner. After the horizontal actuator 353 moves the moving plate 371 to the side opposite to the platform 1 side in accordance with an instruction from the controller 10, the vertical actuators 351 and 352 retract the rods 351r and 352r to the cylinder portions 351s and 352s. . Thus, as shown in FIG. 5B, the correction block 31 is positioned at the retracted position. In addition, although the illustration in FIG. 5B is omitted, the position adjustment unit 20 that moves integrally with the correction block 31 is also positioned at the retracted position. The retreat position refers to the position where the correction block 31 is separated from the platform 1 in the horizontal direction, and is lower than the height position H4 of the upper surface Sa of the corrected substrate S held on the platform 1 in the vertical direction (FIG. 5B Dotted line). Therefore, by positioning the correcting block 31 and the position adjusting unit 20 at the retracted position, the correcting block 31 and the baffle member 61 can be prevented from colliding or blocking the sensor light 73 projected between the detecting sensors 71 and 72 from light. Therefore, after the correction block 31 is retracted, the movement front side of the slit nozzle 4, that is, the side in the (+X) direction as shown in FIG. Objects (foreign objects, bumps, etc.) on the substrate S where the nozzle 4 interferes are applied while being applied.

如上所述，根據本實施方式，使矯正塊31移動至載置於平台1的載置區域11a的基板S的上表面周邊部的上方位置（高度位置H3）並利用接觸構件341進行基板S的矯正。然後，在利用平台1保持基板S後，使矯正塊31退避至低於高度位置H4的位置。因此，可確實地防止矯正塊31與第一檢測部6及第二檢測部7發生干涉，所述第一檢測部6及第二檢測部7一邊沿（+X）方向移動一邊對已矯正的基板S的上表面Sa的表面狀態（在與狹縫噴嘴4發生干涉的基板S上是否存在異物等）進行檢測。其結果，可良好地進行塗布處理。As described above, according to the present embodiment, the correction block 31 is moved to a position (height position H3) above the peripheral portion of the upper surface of the substrate S placed on the placement area 11a of the platform 1, and the contact member 341 is used to perform the substrate S Correction. Then, after the substrate S is held by the platform 1, the correction block 31 is retracted to a position lower than the height position H4. Therefore, it is possible to reliably prevent the correction block 31 from interfering with the first detection unit 6 and the second detection unit 7, which move in the (+X) direction while performing the correction. The surface state of the upper surface Sa of the substrate S (the presence or absence of foreign matter or the like on the substrate S that interferes with the slit nozzle 4) is detected. As a result, the coating treatment can be performed satisfactorily.

然而，在所述第一實施方式中，使矯正塊31的接觸構件341直接接觸於基板S的上表面周邊部而將所述上表面周邊部按壓至平台1的上表面11來進行矯正。因此，存在會對基板S中的與接觸構件341物理接觸的部位導入損傷的情況。另外，因所述接觸而產生灰塵或顆粒等。因此，如以下所說明般提出有如下塗布裝置100：在基板S的上表面Sa與矯正塊31的下表面之間形成氣體層，藉由氣體層而將所述上表面周邊部按壓至下方來矯正基板S的翹曲。也可將本發明應用於所述塗布裝置100，以下，一面參照圖6、圖7、圖8A、圖8B、圖9～圖11，一面對本發明的第二實施方式進行詳細敘述。However, in the first embodiment, the contact member 341 of the correction block 31 is directly contacted with the upper surface peripheral portion of the substrate S, and the upper surface peripheral portion is pressed to the upper surface 11 of the platform 1 to perform correction. Therefore, damage may be introduced to the part of the substrate S that is in physical contact with the contact member 341. In addition, dust, particles, etc. are generated due to the contact. Therefore, as described below, a coating device 100 is proposed in which a gas layer is formed between the upper surface Sa of the substrate S and the lower surface of the correction block 31, and the upper surface peripheral portion is pressed downward by the gas layer. The warpage of the substrate S is corrected. The present invention can also be applied to the coating device 100. Hereinafter, the second embodiment of the present invention will be described in detail with reference to FIGS. 6, 7, 8A, 8B, and 9 to 11.

圖6是表示本發明的基板處理裝置的第二實施方式的電氣構成的框圖。另外，圖7是表示第二實施方式中的矯正機構的矯正塊與用以使所述矯正塊移動的移動部的立體圖。另外，圖8A及圖8B是示意性表示第二實施方式中的矯正塊利用移動部而進行的移動的側視圖。在本實施方式中，相對於相向平台34設置有多個貫通孔342（圖7）來代替接觸構件341。另外，追加地設置空氣層形成部38，藉由對矯正塊31供給空氣而在矯正塊31的相向平板34與基板S之間強制形成空氣層（氣體層）。然後，藉由空氣層而針對基板S的上方周邊部矯正基板S的翹曲。再者，這些以外的構成及動作基本與第一實施方式相同。因此，以下，以不同點為中心進行說明，對同一構成標注同一符號並省略說明。Fig. 6 is a block diagram showing the electrical configuration of a second embodiment of the substrate processing apparatus of the present invention. 7 is a perspective view showing the correction block of the correction mechanism in the second embodiment and a moving part for moving the correction block. 8A and 8B are side views schematically showing the movement of the correction block in the second embodiment by the moving part. In the present embodiment, a plurality of through holes 342 (FIG. 7) are provided with respect to the opposing stage 34 instead of the contact member 341. In addition, an air layer forming portion 38 is additionally provided, and by supplying air to the correction block 31, an air layer (gas layer) is forcibly formed between the opposed flat plate 34 of the correction block 31 and the substrate S. Then, the warpage of the substrate S is corrected with respect to the upper peripheral portion of the substrate S by the air layer. In addition, the structure and operation other than these are basically the same as those of the first embodiment. Therefore, the following description will focus on the differences, and the same components will be denoted by the same reference numerals, and the description will be omitted.

圖9是表示與矯正塊連結，並在矯正塊與基板之間強制形成空氣層的空氣層形成部的構成的圖。為了在矯正塊31與基板S之間強制形成空氣層39，對於矯正塊31連接有空氣層形成部38。如圖9所示，所述空氣層形成部38具有壓縮機等壓縮部381、溫度調節部382、過濾器383、針閥384、流量計385、壓力計386以及氣動閥（air operation valve）387。在空氣層形成部38中，利用溫度調節部382將由壓縮部381壓縮的空氣調整成規定的溫度，生成空氣層形成用的壓縮空氣。在使所述壓縮空氣流通的配管中設置有過濾器383、針閥384、流量計385、壓力計386以及氣動閥387。而且，若依照來自控制器10的指令打開氣動閥387，則藉由過濾器383而經淨化的壓縮空氣在利用針閥384進行了壓力調節後，藉由流量計385、壓力計386、氣動閥387而被壓送至矯正塊31。由此，貫通相向平板34而設置的貫通孔342（參照圖7中的局部放大圖）作為噴出孔發揮功能，壓縮空氣自所述貫通孔342向下方噴出，從而在基板S的上表面周邊部與矯正塊31之間形成空氣層39（圖9中，標注點而示意性地示出的區域）。而且，藉由在形成有空氣層39的狀態下使矯正塊31下降至高度位置H1、H2、H3，可利用空氣層39將基板S的上表面周邊部按壓至平台1來矯正翹曲。Fig. 9 is a diagram showing the configuration of an air layer forming part connected to a correction block and forcibly forming an air layer between the correction block and the substrate. In order to forcibly form an air layer 39 between the correction block 31 and the substrate S, an air layer forming portion 38 is connected to the correction block 31. As shown in FIG. 9, the air layer forming part 38 has a compressor or other compression part 381, a temperature adjustment part 382, a filter 383, a needle valve 384, a flow meter 385, a pressure gauge 386, and an air operation valve 387 . In the air layer forming part 38, the temperature adjustment part 382 adjusts the air compressed by the compression part 381 to a predetermined temperature, and produces|generates the compressed air for air layer formation. A filter 383, a needle valve 384, a flow meter 385, a pressure gauge 386, and a pneumatic valve 387 are provided in the piping through which the compressed air circulates. Furthermore, if the pneumatic valve 387 is opened in accordance with the instruction from the controller 10, the compressed air purified by the filter 383 is pressure-regulated by the needle valve 384, and then the flow meter 385, the pressure gauge 386, and the pneumatic valve 387 and sent to the correction block 31 under pressure. Thereby, the through hole 342 (refer to the partial enlarged view in FIG. 7) provided through the opposed flat plate 34 functions as an ejection hole. An air layer 39 is formed between the correction block 31 and the correction block 31 (in FIG. 9, the area is schematically shown with dots). Furthermore, by lowering the correction block 31 to the height positions H1, H2, H3 with the air layer 39 formed, the air layer 39 can press the upper surface peripheral portion of the substrate S to the platform 1 to correct warpage.

圖10是表示第二實施方式中的基板固定的一例的流程圖。圖11是示意性表示根據圖10的流程圖而執行動作的動作說明圖。再者，在圖11中，關於空氣的流動，以點線箭頭表示，關於基板S、定位銷21及矯正塊31的活動，以實線箭頭表示，關於空氣層39，標注點來表示。另外，在圖11中，符號H1～符號H3表示矯正塊31的高度位置，且以鉛垂方向Z上的相向平板34的下表面（相向面）的高度表示。另外，符號H4與第一實施方式同樣地表示在垂直方向上保持於平台1的已矯正的基板S的上表面Sa的高度位置H4。Fig. 10 is a flowchart showing an example of substrate fixing in the second embodiment. Fig. 11 is an operation explanatory diagram schematically showing an operation performed in accordance with the flowchart of Fig. 10. In addition, in FIG. 11, the flow of air is indicated by dotted arrows, the movement of the substrate S, the positioning pins 21 and the correction block 31 is indicated by solid arrows, and the air layer 39 is indicated by marking dots. In addition, in FIG. 11, symbols H1 to H3 indicate the height position of the correction block 31, and are indicated by the height of the lower surface (opposing surface) of the facing flat plate 34 in the vertical direction Z. In addition, the symbol H4 indicates the height position H4 of the upper surface Sa of the corrected substrate S held on the stage 1 in the vertical direction, similarly to the first embodiment.

分別設置於載置區域11a的四邊的矯正塊31退避至退避位置（圖8B所示的位置），並且位置調整單元20也位於退避位置，同時各定位銷21位於隔開位置。所述退避位置與第一實施方式同樣地是指在水準方向上自平台1離開的位置，且是在垂直方向上低於保持於平台1的已矯正的基板S的上表面Sa的高度位置H4（圖8B中的點劃線）的位置。The correction blocks 31 respectively provided on the four sides of the placement area 11a are retracted to the retracted position (the position shown in FIG. 8B), and the position adjustment unit 20 is also located at the retracted position, and each positioning pin 21 is located at the spaced position. The retreat position refers to a position separated from the platform 1 in the horizontal direction in the same manner as in the first embodiment, and is a height position H4 lower than the upper surface Sa of the corrected substrate S held on the platform 1 in the vertical direction. (Dotted line in Figure 8B).

如此，在可搬入下一基板S的搬入準備狀態下，機器人將基板S搬送至載置區域11a的上方。與此對應，各頂銷12自銷收納孔114上升而各頂銷12的上端抵接於基板S（步驟S101），各頂銷12自機器人接收基板S（步驟S102）。然後，當各頂銷12下降而各頂銷12的上端被收入銷收納孔114內時，將基板S自各頂銷12的上端載置於載置區域11a（步驟S103）。再者，如圖11的（a）欄所示，此處示出的例子中，基板S的周邊部翹曲為弓形，基板S的周緣離開了載置區域11a。In this way, in the loading preparation state where the next substrate S can be loaded, the robot transfers the substrate S to the upper side of the mounting area 11a. Corresponding to this, each ejector pin 12 rises from the pin accommodating hole 114, the upper end of each ejector pin 12 abuts on the substrate S (step S101), and each ejector pin 12 receives the substrate S from the robot (step S102). Then, when each ejector pin 12 descends and the upper end of each ejector pin 12 is received in the pin housing hole 114, the substrate S is placed on the placement area 11a from the upper end of each ejector pin 12 (step S103). Furthermore, as shown in the column (a) of FIG. 11, in the example shown here, the peripheral portion of the substrate S is warped in an arc shape, and the peripheral edge of the substrate S is away from the mounting area 11 a.

在步驟S104中，在藉由移動部35，垂直致動器351、352使桿351r、352r前進至最上方位置後，水準致動器353使移動板371移動至平台1的上方，由此，矯正塊31被定位於高度位置H1。所述高度位置H1可考慮基板S的周邊部的翹曲量來設定，藉由設定成比最大翹曲量稍高的位置，可確實地防止矯正塊31與基板S發生干涉，從而在基板S的周邊部與矯正塊31的下表面之間確實地形成空間。然後，空氣層形成部38將空氣壓送至矯正塊31，並自矯正塊31的貫通孔342噴出壓縮空氣（步驟S105）。由此，如圖11的（a）欄所示，在基板S的上表面周邊部與矯正塊31之間形成空氣層39。空氣層39的此種形成一直持續到接下來說明的矯正動作及定位動作（基板S的位置調整）完成為止。In step S104, after the vertical actuators 351 and 352 advance the rods 351r and 352r to the uppermost position by the moving part 35, the horizontal actuator 353 moves the moving plate 371 to the upper side of the platform 1, thereby, The correction block 31 is positioned at the height position H1. The height position H1 can be set in consideration of the amount of warpage of the peripheral portion of the substrate S. By setting it to a position slightly higher than the maximum amount of warpage, interference between the correction block 31 and the substrate S can be reliably prevented, so that the substrate S A space is surely formed between the peripheral portion of φ and the lower surface of the correction block 31. Then, the air layer forming unit 38 pressure-feeds the air to the correction block 31, and blows compressed air from the through hole 342 of the correction block 31 (step S105). Thereby, as shown in the column (a) of FIG. 11, an air layer 39 is formed between the peripheral portion of the upper surface of the substrate S and the correction block 31. Such formation of the air layer 39 continues until the correction operation and positioning operation (position adjustment of the substrate S) described below are completed.

在形成有空氣層39的狀態下，藉由移動部35，垂直致動器351的桿351r後退而使矯正塊31下降至高度位置H2（步驟S106）。此時，處於翹曲狀態的基板周邊部在與矯正塊31保持非接觸狀態的狀態下，被空氣層39朝向平台1按壓。由此，翹曲在一定程度上得到矯正，翹曲量成為規定值（小於定位銷21的高度的值）以下（暫時矯正處理）。即，進行所謂的基板S的暫時按壓，將基板S的周邊部的高度抑制為低於高度位置H2，且低於定位銷21的上端。In the state where the air layer 39 is formed, by the moving part 35, the rod 351r of the vertical actuator 351 retreats, and the correction block 31 is lowered to the height position H2 (step S106). At this time, the peripheral portion of the substrate in the warped state is pressed toward the platform 1 by the air layer 39 while maintaining a non-contact state with the correction block 31. Thereby, the warpage is corrected to a certain extent, and the amount of warpage becomes equal to or less than a predetermined value (a value smaller than the height of the positioning pin 21) (temporary correction processing). That is, so-called temporary pressing of the substrate S is performed, and the height of the peripheral portion of the substrate S is suppressed to be lower than the height position H2 and lower than the upper end of the positioning pin 21.

當基板S的暫時矯正處理完成時，如圖11的（b）欄所示，空氣供給部112開始自平台1的通氣孔對載置區域11a上的基板S的下表面吹氣（步驟S107）。由此，基板S的下表面略微離開載置區域11a，而實現基板S的下表面與載置區域11a之間的摩擦力的降低。然後，在接下來的步驟S108中，如圖11的（c）欄所示，使各定位銷21向基板S側移動，由此調整載置區域11a上的基板S的位置（位置調整處理）。然後，當位置調整處理完成時，空氣供給部112停止吹氣（步驟S109）。When the temporary correction processing of the substrate S is completed, as shown in the column (b) of FIG. 11, the air supply unit 112 starts to blow air from the vent hole of the platform 1 to the lower surface of the substrate S on the mounting area 11a (step S107) . Thereby, the lower surface of the substrate S is slightly separated from the placement area 11a, and the frictional force between the lower surface of the substrate S and the placement area 11a is reduced. Then, in the next step S108, as shown in the column (c) of FIG. 11, each positioning pin 21 is moved to the substrate S side, thereby adjusting the position of the substrate S on the mounting area 11a (position adjustment processing) . Then, when the position adjustment process is completed, the air supply unit 112 stops blowing (step S109).

在接下來的步驟S110中，在形成有空氣層39的狀態下，藉由移動部35，垂直致動器351的桿351r進一步後退而使矯正塊31下降至高度位置H3。由此，如圖11的（d）欄所示，基板周邊部在與矯正塊31保持非接觸狀態的狀態下，被空氣層39按壓至平台1，以遵循載置區域11a的形狀的方式矯正基板S的形狀（最終矯正處理）。In the next step S110, in the state where the air layer 39 is formed, the rod 351r of the vertical actuator 351 is further retracted by the moving part 35, and the correction block 31 is lowered to the height position H3. As a result, as shown in the column (d) of FIG. 11, the peripheral portion of the substrate is pressed to the platform 1 by the air layer 39 while maintaining a non-contact state with the correction block 31, and is corrected in a manner that follows the shape of the placement area 11a. The shape of the substrate S (final correction treatment).

當矯正塊31的向高度位置H3的下降完成時，如圖11的（e）欄所示，空氣抽吸部113自通氣孔抽吸空氣，由此將基板S吸附於載置區域11a（步驟S111）。由此，基板S被固定於載置區域11a。接著，空氣層形成部38停止向矯正塊31的空氣壓送，並且，移動部35使矯正塊31及位置調整單元20一體地移動至退避位置（參照圖11的（f）欄）。由此，將矯正塊31及位置調整單元20定位於在水準方向上自平台1離開的位置，且是在垂直方向上低於保持於平台1的已矯正的基板S的上表面Sa的高度位置H4（圖8B、圖11的（f）欄中的點劃線）的位置。其結果，可防止矯正塊31與擋板構件61碰撞或將投光於檢測感測器71、72之間的感測器光73遮光。因此，在矯正塊31的退避後，在狹縫噴嘴4的移動前方側即如圖1所示的（+X）方向側，可一邊高精度地檢測在狹縫噴嘴4的移動中與狹縫噴嘴4發生干涉的基板S上的物件物（異物或隆起部等），一邊執行塗布處理。When the lowering of the correction block 31 to the height position H3 is completed, as shown in the column (e) of FIG. S111). Thereby, the substrate S is fixed to the mounting area 11a. Next, the air layer forming part 38 stops the air pressure supply to the correction block 31, and the moving part 35 integrally moves the correction block 31 and the position adjustment unit 20 to the retracted position (refer to the column (f) of FIG. 11). As a result, the correction block 31 and the position adjustment unit 20 are positioned at a position away from the platform 1 in the horizontal direction, and at a height position lower than the upper surface Sa of the corrected substrate S held on the platform 1 in the vertical direction. The position of H4 (the dot-dash line in the column (f) of FIG. 8B and FIG. 11). As a result, it is possible to prevent the correction block 31 from colliding with the baffle member 61 or blocking the sensor light 73 projected between the detection sensors 71 and 72. Therefore, after the correction block 31 is retracted, the movement front side of the slit nozzle 4, that is, the side in the (+X) direction as shown in FIG. Objects (foreign objects, bumps, etc.) on the substrate S where the nozzle 4 interferes are applied while being applied.

如上所述，在第二實施方式中，使矯正塊31移動至載置於平台1的載置區域11a的基板S的上表面周邊部的上方、更詳細而言高度位置H3，由此利用空氣層39將基板S按壓至載置區域11a而進行基板S的矯正。然後，在利用平台1保持基板S後，使矯正塊31退避至低於高度位置H4的位置。因此，可確實地防止矯正塊31與第一檢測部6及第二檢測部7發生干涉，所述第一檢測部6及第二檢測部7一邊沿（+X）方向移動一邊對已矯正的基板S的上表面Sa的表面狀態（在與狹縫噴嘴4發生干涉的基板S上是否存在異物等）進行檢測。其結果，可良好地進行塗布處理。As described above, in the second embodiment, the correction block 31 is moved above the peripheral portion of the upper surface of the substrate S placed on the placement area 11a of the platform 1, more specifically at the height position H3, thereby utilizing air The layer 39 presses the substrate S to the mounting area 11a to correct the substrate S. Then, after the substrate S is held by the platform 1, the correction block 31 is retracted to a position lower than the height position H4. Therefore, it is possible to reliably prevent the correcting block 31 from interfering with the first detection unit 6 and the second detection unit 7, which move in the (+X) direction while moving the corrected The surface state of the upper surface Sa of the substrate S (the presence or absence of foreign matter or the like on the substrate S that interferes with the slit nozzle 4) is detected. As a result, the coating treatment can be performed satisfactorily.

另外，關於矯正塊31，利用空氣層39將平台1的載置區域11a上的基板S按壓至載置區域11a，由此以非接觸方式矯正了基板S的翹曲，然後將基板S吸附保持於平台1。因此，在矯正翹曲時與基板S的上表面接觸的是空氣層39，與直接接觸接觸構件341來進行矯正的第一實施方式相比，可防止對基板S導入損傷，並且在消除發塵問題的同時良好地保持基板S的整個區域。In addition, regarding the correction block 31, the substrate S on the mounting area 11a of the platform 1 is pressed to the mounting area 11a by the air layer 39, thereby correcting the warpage of the substrate S in a non-contact manner, and then the substrate S is sucked and held On platform 1. Therefore, when the warpage is corrected, the air layer 39 is in contact with the upper surface of the substrate S. Compared with the first embodiment that directly contacts the contact member 341 for correction, it is possible to prevent damage to the substrate S and to eliminate dust generation. At the same time, the entire area of the substrate S is well maintained.

另外，在對基板S的下表面吹氣而使基板S的下表面與載置區域11a之間的摩擦力降低的狀態下，利用定位銷21進行基板S的位置調整，因此可順暢地進行位置調整處理中的基板S的位置調整。另外，如圖11的（c）欄所示，所述位置調整處理是在使矯正塊31下降至高度位置H2後執行。因此，即使在載置於載置區域11a的基板S的翹曲相對較大的情況下，也是在基板S的翹曲得到一定程度的矯正的狀態下執行位置調整處理。其結果，可抑制基板S的翹曲對平台1上的基板S的位置調整的影響。In addition, in a state where the friction between the lower surface of the substrate S and the placement area 11a is reduced by blowing air on the lower surface of the substrate S, the positioning pins 21 are used to adjust the position of the substrate S, so that the position can be performed smoothly. The position of the substrate S in the adjustment process is adjusted. In addition, as shown in the column (c) of FIG. 11, the position adjustment process is executed after the correction block 31 is lowered to the height position H2. Therefore, even in a case where the warpage of the substrate S placed on the mounting region 11a is relatively large, the position adjustment processing is performed in a state where the warpage of the substrate S is corrected to a certain extent. As a result, the influence of the warpage of the substrate S on the position adjustment of the substrate S on the stage 1 can be suppressed.

另外，如圖11的（d）欄及（e）欄所示，在使經由空氣層39按壓基板S的周邊部的矯正塊31下降至高度位置H3，由此使基板S的周邊部與載置區域11a密接後，執行基板S朝向載置區域11a的吸附。因此，可確實地執行基板S對於載置區域11a的吸附保持。In addition, as shown in the columns (d) and (e) of FIG. 11, the correction block 31 pressing the peripheral portion of the substrate S via the air layer 39 is lowered to the height position H3, thereby making the peripheral portion of the substrate S and the carrier After the placement area 11a is in close contact, suction of the substrate S toward the placement area 11a is performed. Therefore, the suction and holding of the substrate S with respect to the mounting region 11a can be performed reliably.

再者，在第二實施方式中，設置於相向平板34的多個貫通孔342全部作為用以噴出壓縮空氣的噴出孔發揮功能，但例如圖12所示，也可使貫通孔342的一部分作為抽吸孔343發揮功能。即，空氣層形成部38可構成為不僅具有壓縮空氣的供給系統（=壓縮部381+溫度調節部382+過濾器383+針閥384+流量計385+壓力計386+氣動閥387），還具有自空氣層39抽吸空氣以使空氣層39的壓力及擴展穩定化的抽吸系統388。在所述抽吸系統388中，在與抽吸孔343連接的抽吸配管中包括作為抽吸單元的鼓風機388a、壓力計388b以及調壓閥388c，在經由抽吸配管而連接的抽吸孔343內的壓力高於利用鼓風機388a而獲得的抽吸壓力的情況下，將空氣自調壓閥388c經由抽吸孔343及抽吸配管釋放至外部，由此可進行用以將空氣層39的壓力保持為一定的微調整。Furthermore, in the second embodiment, all of the through holes 342 provided in the opposed flat plate 34 function as ejection holes for ejecting compressed air, but for example, as shown in FIG. 12, a part of the through holes 342 may be used as The suction hole 343 functions. That is, the air layer forming part 38 can be configured not only to have a compressed air supply system (=compression part 381 + temperature adjustment part 382 + filter 383 + needle valve 384 + flow meter 385 + pressure gauge 386 + pneumatic valve 387), but also A suction system 388 that sucks air from the air layer 39 to stabilize the pressure and expansion of the air layer 39 is provided. In the suction system 388, the suction pipe connected to the suction hole 343 includes a blower 388a as a suction unit, a pressure gauge 388b, and a pressure regulating valve 388c. When the pressure in the 343 is higher than the suction pressure obtained by the blower 388a, the air is released from the pressure regulating valve 388c to the outside through the suction hole 343 and the suction pipe, thereby allowing the air layer 39 to be released. The pressure is kept at a certain fine adjustment.

另外，在所述第二實施方式中，無論矯正塊31的高度位置如何，均同樣地壓送利用針閥384進行了壓力調節的壓縮空氣，但也可構成為根據矯正塊31的高度位置來調整壓縮空氣的壓力或噴出流量。例如，在使矯正塊31自高度位置H1下降至高度位置H2的期間、即進行暫時矯正處理的期間，與所述實施方式同樣地設定壓縮空氣的流量，另一方面，在使矯正塊31自高度位置H2下降至高度位置H3的期間、即進行最終矯正處理的期間，可限制壓縮空氣的流量。由此，可抑制空氣消耗量來實現運行成本的減低。In addition, in the second embodiment, regardless of the height position of the correction block 31, the compressed air pressure-adjusted by the needle valve 384 is pressure-fed in the same manner. However, it may be configured to be adjusted according to the height position of the correction block 31. Adjust the pressure of compressed air or the discharge flow rate. For example, during the period when the correction block 31 is lowered from the height position H1 to the height position H2, that is, during the temporary correction process, the flow rate of the compressed air is set in the same manner as in the above-mentioned embodiment. During the period during which the height position H2 drops to the height position H3, that is, the period during which the final correction process is performed, the flow rate of the compressed air can be restricted. As a result, air consumption can be suppressed, and running costs can be reduced.

另外，在所述第二實施方式中，使用壓縮空氣形成了空氣層39，但也可使用其他氣體、例如氮氣或惰性氣體等。In addition, in the second embodiment, compressed air is used to form the air layer 39, but other gases such as nitrogen or inert gas may also be used.

如上所述，在第一實施方式及第二實施方式中，（+X）方向及Y方向分別相當於本發明的“第一方向”及“與第一方向大致正交的水準方向”。另外，第一檢測部及第二檢測部相當於本發明的“檢測部”的一例。另外，矯正塊31相當於本發明的“矯正構件”的一例。移動部35相當於本發明的“退避部”的一例。凹坑13相當於本發明的“凹部”的一例。狹縫噴嘴4相當於本發明的“噴嘴”的一例。As described above, in the first embodiment and the second embodiment, the (+X) direction and the Y direction correspond to the “first direction” and the “horizontal direction substantially orthogonal to the first direction” in the present invention, respectively. In addition, the first detection unit and the second detection unit correspond to an example of the "detection unit" of the present invention. In addition, the correction block 31 corresponds to an example of the "correction member" of the present invention. The moving part 35 corresponds to an example of the "retracting part" of the present invention. The dimple 13 corresponds to an example of the "recess" in the present invention. The slit nozzle 4 corresponds to an example of the "nozzle" in the present invention.

再者，本發明並不限定於所述實施方式，只要不脫離本發明的主旨，則除了所述實施方式以外，也能夠進行各種變更。例如，在所述實施方式中，為了進行異物檢測，設置有兩種檢測部6、7，但也可構成為僅設置任一者。In addition, the present invention is not limited to the above-mentioned embodiment, and various changes can be made in addition to the above-mentioned embodiment as long as it does not deviate from the gist of the present invention. For example, in the above-described embodiment, two types of detection units 6 and 7 are provided in order to perform foreign object detection, but it may be configured to provide only one of them.

另外，在所述實施方式中，構成為使兩種檢測部6、7與狹縫噴嘴4及噴嘴支撐體51一體地沿X方向移動，但一體地移動並非必需條件，例如，也可構成為使第二檢測部7獨立於狹縫噴嘴4及噴嘴支撐體51地沿X方向移動而在塗布處理前進行異物檢測。In addition, in the above-mentioned embodiment, the two detection units 6, 7 are configured to move in the X direction integrally with the slit nozzle 4 and the nozzle support 51. However, the integral movement is not an essential condition. For example, it may be configured as The second detection unit 7 is moved in the X direction independently of the slit nozzle 4 and the nozzle support 51 to perform foreign matter detection before the coating process.

另外，在所述實施方式中，在平台1的上表面11設置凹坑13，並將所述凹坑13的內部空間用作使矯正塊31退避的退避空間，但例如在專利文獻1中所記載的裝置中，在平台固定於基台上的塗布裝置中，可以如下方式構成來確保退避空間。例如，在平台的厚度與所述實施方式中的凹坑13的深度為同等程度的情況下，可使作為本發明的退避部發揮功能的移動部35與平台鄰接地設置於基台上，使矯正塊以與平台的側端面鄰接的方式移動，由此可將矯正塊定位於低於高度位置H4的位置。另外，在平台薄於凹坑13的深度的情況下，在基台的上表面中的與平台鄰接的區域設置凹坑，並使矯正塊移動至所述凹坑，由此可將矯正塊定位於低於高度位置H4的位置。In addition, in the above embodiment, the pit 13 is provided on the upper surface 11 of the platform 1, and the inner space of the pit 13 is used as an evacuation space for evacuation of the correction block 31. However, for example, it is described in Patent Document 1. Among the described devices, in the coating device in which the platform is fixed to the base, the following configuration can be used to ensure an evacuation space. For example, in the case where the thickness of the platform is equivalent to the depth of the recess 13 in the above-mentioned embodiment, the moving part 35 functioning as the retreat part of the present invention can be provided adjacent to the platform on the base, so that The correction block moves in a manner adjacent to the side end surface of the platform, so that the correction block can be positioned at a position lower than the height position H4. In addition, in the case where the platform is thinner than the depth of the pit 13, a pit is provided in an area adjacent to the platform in the upper surface of the base, and the correction block is moved to the pit, whereby the correction block can be positioned At a position lower than the height position H4.

另外，在所述實施方式中，在塗布處理前，使矯正塊31退避至低於高度位置H4的位置，但也可構成為使矯正塊31退避至更低的位置、例如低於平台1的上表面11的位置。由此，例如可將構成第二檢測部7的檢測感測器71、72配設於平台1的上表面11的正上方位置，且可提高裝置的設計自由度。In addition, in the above embodiment, before the coating process, the correction block 31 is retracted to a position lower than the height position H4, but it may be configured to retract the correction block 31 to a lower position, for example, lower than the platform 1. The location of the upper surface 11. Thereby, for example, the detection sensors 71 and 72 constituting the second detection unit 7 can be arranged at a position directly above the upper surface 11 of the platform 1, and the design freedom of the device can be increased.

進而，在所述實施方式中，將本發明應用於塗布裝置100，但本發明的應用範圍並不限定於此，在利用矯正塊矯正基板後保持基板並對基板的上表面實施既定的處理的基板處理裝置也包含於本發明的應用物件中。例如，可將本發明應用於如下基板處理裝置：代替狹縫噴嘴而使印刷頭或曝光頭等沿（+X）方向移動，同時對保持於平台1的基板S的上表面Sa實施印刷處理或曝光處理。 [產業上的可利用性]Furthermore, in the above-mentioned embodiment, the present invention is applied to the coating device 100, but the scope of application of the present invention is not limited to this. After the substrate is corrected by the correction block, the substrate is held and the upper surface of the substrate is subjected to a predetermined treatment. The substrate processing apparatus is also included in the application of the present invention. For example, the present invention can be applied to a substrate processing apparatus that moves a print head or exposure head in the (+X) direction instead of a slit nozzle, while performing printing processing or printing on the upper surface Sa of the substrate S held on the platform 1 Exposure processing. [Industrial availability]

本發明可適宜地應用於在利用矯正構件矯正基板後保持基板並實施既定的處理的全體基板處理技術。The present invention can be suitably applied to an overall substrate processing technique that holds the substrate and performs a predetermined process after correcting the substrate with the correcting member.

1:平台 2:位置調整機構 3:矯正機構 4:狹縫噴嘴 5:移動機構 6:第一檢測部 7:第二檢測部 10:控制器 11:（平台的）上表面 11a:載置區域 11b:側端面 12:頂銷 13:凹坑（凹部） 20:位置調整單元 21:定位銷 30:矯正單元 31:矯正塊 32、115:切口部 33:框架 34:相向平板 35:移動部（退避部） 38:空氣層形成部 39:空氣層 51:噴嘴支撐體（移動體） 51a:樑構件 51b:柱構件 52:噴嘴移動部 53:導軌 54:線性馬達 54a:定子 54b:動子 55:位置感測器 55a:刻度部 55b:檢測部 61:擋板構件 71、72:檢測感測器 73:感測器光 100:塗布裝置 112:空氣供給部 113:空氣抽吸部 114:銷收納孔 341:接觸構件 342:貫通孔/抽吸孔 351、352:垂直致動器 351r、352r:桿 351s、352s:筒體部 353:水準致動器 361、362:托架 371:移動板 372:軌道 373:基座構件 381:壓縮部 382:溫度調節部 383:過濾器 384:針閥 385:流量計 386:壓力計 387:氣動閥 388:抽吸系統 388a:鼓風機 388b:壓力計 388c:調壓閥 A21:位置調整致動器 A112:頂銷致動器 H1、H2、H3、H4:高度位置 S:基板 Sa:（基板的）上表面 S101、S102、S103、S104、S105、S106、S107、S108、S109、S110、S111、S112:步驟 X:第一方向 Y:水準方向 Z:鉛垂方向 1: platform 2: Position adjustment mechanism 3: Correction institution 4: slit nozzle 5: Mobile agency 6: The first detection department 7: The second detection department 10: Controller 11: The upper surface (of the platform) 11a: Placement area 11b: side end face 12: Top pin 13: pit (concave) 20: Position adjustment unit 21: positioning pin 30: Correction unit 31: Correction block 32, 115: Notch 33: Frame 34: Opposite plate 35: Moving Department (Evacuation Department) 38: Air layer forming part 39: air layer 51: Nozzle support body (moving body) 51a: beam member 51b: Column member 52: Nozzle moving part 53: Rail 54: Linear motor 54a: stator 54b: mover 55: position sensor 55a: Scale part 55b: Inspection Department 61: baffle member 71, 72: detection sensor 73: Sensor light 100: Coating device 112: Air Supply Department 113: Air suction part 114: Pin receiving hole 341: contact member 342: Through hole/suction hole 351, 352: Vertical actuator 351r, 352r: pole 351s, 352s: barrel part 353: Level Actuator 361, 362: Bracket 371: mobile board 372: Orbit 373: base member 381: Compression Department 382: Temperature Control Department 383: filter 384: Needle Valve 385: Flowmeter 386: Pressure Gauge 387: Pneumatic valve 388: Suction System 388a: Blower 388b: Pressure gauge 388c: pressure regulating valve A21: Position adjustment actuator A112: Top pin actuator H1, H2, H3, H4: height position S: substrate Sa: (of the substrate) upper surface S101, S102, S103, S104, S105, S106, S107, S108, S109, S110, S111, S112: steps X: first direction Y: horizontal direction Z: vertical direction

圖1是表示作為本發明的基板處理裝置的第一實施方式的塗布裝置的立體圖。 圖2是圖1所示的塗布裝置的部分平面圖。 圖3是表示圖1所示的塗布裝置的電氣構成的框圖。 圖4是表示第一實施方式中的矯正機構的矯正塊與用以使所述矯正塊移動的移動部的立體圖。 圖5A是示意性表示第一實施方式中的矯正塊利用移動部而進行的移動的側視圖。 圖5B是示意性表示第一實施方式中的矯正塊利用移動部而進行的移動的側視圖。 圖6是表示本發明的基板處理裝置的第二實施方式的電氣構成的框圖。 圖7是表示第二實施方式中的矯正機構的矯正塊與用以使所述矯正塊移動的移動部的立體圖。 圖8A是示意性表示第二實施方式中的矯正塊利用移動部而進行的移動的側視圖。 圖8B是示意性表示第二實施方式中的矯正塊利用移動部而進行的移動的側視圖。 圖9是表示與矯正塊連結，並在矯正塊與基板之間強制形成空氣層的空氣層形成部的構成的圖。 圖10是表示第二實施方式中的基板固定的一例的流程圖。 圖11是示意性地表示根據圖10的流程圖而執行動作的動作說明圖。 圖12是表示本發明的基板處理裝置的第二實施方式所配備的空氣層形成部的另一構成的圖。Fig. 1 is a perspective view showing a coating apparatus as a first embodiment of the substrate processing apparatus of the present invention. Fig. 2 is a partial plan view of the coating device shown in Fig. 1. Fig. 3 is a block diagram showing the electrical configuration of the coating device shown in Fig. 1. 4 is a perspective view showing a correction block of the correction mechanism in the first embodiment and a moving part for moving the correction block. Fig. 5A is a side view schematically showing the movement of the correction block in the first embodiment by the moving part. Fig. 5B is a side view schematically showing the movement of the correction block in the first embodiment by the moving part. Fig. 6 is a block diagram showing the electrical configuration of a second embodiment of the substrate processing apparatus of the present invention. Fig. 7 is a perspective view showing a correction block of a correction mechanism in a second embodiment and a moving part for moving the correction block. Fig. 8A is a side view schematically showing the movement of the correction block in the second embodiment by the moving part. Fig. 8B is a side view schematically showing the movement of the correction block in the second embodiment by the moving part. Fig. 9 is a diagram showing the configuration of an air layer forming part connected to a correction block and forcibly forming an air layer between the correction block and the substrate. Fig. 10 is a flowchart showing an example of substrate fixing in the second embodiment. Fig. 11 is an operation explanatory diagram schematically showing an operation performed in accordance with the flowchart of Fig. 10. Fig. 12 is a diagram showing another configuration of the air layer forming section provided in the second embodiment of the substrate processing apparatus of the present invention.

1:平台 1: platform

11:(平台的)上表面 11: (of the platform) upper surface

11a:載置區域 11a: Placement area

13:凹坑(凹部) 13: pit (concave)

30:矯正單元 30: Correction unit

31:矯正塊 31: Correction block

33:框架 33: Frame

34:相向平板 34: Opposite plate

35:移動部(退避部) 35: Moving part (evacuation part)

341:接觸構件 341: contact member

351:垂直致動器 351: Vertical actuator

351r、352r:桿 351r, 352r: pole

351s、352s:筒體部 351s, 352s: barrel part

361、362:托架 361, 362: Bracket

371:移動板 371: mobile board

H4:高度位置 H4: height position

S:基板 S: substrate

Sa:(基板的)上表面 Sa: (of the substrate) upper surface

Claims (6)

一種基板處理裝置，包括：平台，在上表面設置供基板載置的載置區域，對載置於所述載置區域的所述基板進行保持；移動體，在沿著所述平台的所述上表面的第一方向上移動；檢測部，一邊與所述移動體朝向所述第一方向的移動同時沿所述第一方向移動，一邊對保持於所述平台的所述基板的上表面的表面狀態進行檢測；矯正構件，在利用所述平台保持所述基板前，位於載置於所述載置區域的所述基板的上表面周邊部的上方位置並將所述上表面周邊部按壓至所述平台側來進行矯正；以及退避部，在將藉由所述矯正構件而受到矯正後的所述基板保持於所述平台後且開始所述檢測部的移動前，使所述矯正構件退避至較保持於所述平台的所述基板的上表面的高度位置低的位置；且所述檢測部具有一對檢測感測器，沿著所述基板的上表面藉由投光於所述一對檢測感測器之間的感測器光，檢測所述表面狀態，所述一對檢測感測器以沿著與所述第一方向正交並在所述平台的所述上表面的第二方向上將所述基板及所述矯正構件夾入的方式設置。 A substrate processing device includes: a platform, a loading area for substrate placement is provided on the upper surface, and the substrate placed in the loading area is held; a moving body is positioned along the platform The upper surface moves in the first direction; the detection part moves in the first direction simultaneously with the movement of the moving body in the first direction, while facing the upper surface of the substrate held on the platform The surface condition is detected; the correction member is positioned above the peripheral portion of the upper surface of the substrate placed in the placement area before holding the substrate by the platform and presses the peripheral portion of the upper surface to Correcting on the platform side; and a retreating portion that retreats the correcting member after holding the substrate corrected by the correcting member on the platform and before starting the movement of the detecting portion To a position lower than the height position of the upper surface of the substrate held on the platform; and the detection portion has a pair of detection sensors, along the upper surface of the substrate by projecting light on the one The sensor light between the detection sensors is used to detect the surface state. The base plate and the correcting member are sandwiched in two directions. 如申請專利範圍第1項所述的基板處理裝置，其中在所述平台中，在所述載置區域與所述平台的側端面之間設 置自所述平台的上表面向下方下挖而成的凹部，所述退避部藉由使所述矯正構件移動至所述凹部而將所述矯正構件定位於較所述高度位置低的位置。 The substrate processing apparatus according to the first item of the scope of patent application, wherein in the platform, there is provided between the mounting area and the side end surface of the platform A recessed portion dug downward from the upper surface of the platform, and the retreating portion positions the correcting member at a position lower than the height position by moving the correcting member to the recessed portion. 如申請專利範圍第1項所述的基板處理裝置，其中所述退避部藉由使所述矯正構件以與所述平台的側端面鄰接的方式移動而將所述矯正構件定位於較所述高度位置低的位置。 The substrate processing apparatus according to claim 1, wherein the retreat portion positions the correcting member at a higher height by moving the correcting member to abut the side end surface of the platform. The location is low. 如申請專利範圍第1項至第3項中任一項所述的基板處理裝置，其中所述退避部使所述矯正構件退避至低於所述平台的上表面的位置。 The substrate processing apparatus according to any one of items 1 to 3 in the scope of patent application, wherein the retreat portion retreats the correction member to a position lower than the upper surface of the platform. 一種基板處理裝置，包括：平台，在上表面設置供基板載置的載置區域，對載置於所述載置區域的所述基板進行保持；移動體，在沿著所述平台的所述上表面的第一方向上移動；檢測部，一邊與所述移動體朝向所述第一方向的移動同時沿所述第一方向移動，一邊對保持於所述平台的所述基板的上表面的表面狀態進行檢測；矯正構件，在利用所述平台保持所述基板前，位於載置於所述載置區域的所述基板的上表面周邊部的上方位置並將所述上表面周邊部按壓至所述平台側來進行矯正；退避部，在將藉由所述矯正構件而受到矯正後的所述基板保持於所述平台後且開始所述檢測部的移動前，使所述矯正構件退 避至較保持於所述平台的所述基板的上表面的高度位置低的位置；以及噴嘴，具有朝向保持於所述平台的所述基板噴出處理液的狹縫狀的噴出口；且所述移動體具有跨越所述載置區域的架橋結構，且具有保持部，所述保持部以使所述噴出口沿著與所述第一方向大致正交的水準方向的方式對所述噴嘴進行固定保持，能夠利用所述保持部對自所述噴出口噴出所述處理液的所述噴嘴進行保持並沿所述第一方向移動，所述檢測部在所述噴嘴的移動前方側對在所述噴嘴的移動中與所述噴嘴發生干涉的所述基板上的物件物進行檢測。 A substrate processing device includes: a platform, a loading area for substrate placement is provided on the upper surface, and the substrate placed in the loading area is held; a moving body is positioned along the platform The upper surface moves in the first direction; the detection part moves in the first direction simultaneously with the movement of the moving body in the first direction, while facing the upper surface of the substrate held on the platform The surface condition is detected; the correction member is positioned above the peripheral portion of the upper surface of the substrate placed in the placement area before holding the substrate by the platform and presses the peripheral portion of the upper surface to Correction is performed on the platform side; the retreat part, after holding the substrate corrected by the correction member on the platform and before starting the movement of the detection part, retreat the correction member Avoiding to a position lower than the height position of the upper surface of the substrate held on the platform; and a nozzle having a slit-shaped ejection port for ejecting the processing liquid toward the substrate held on the platform; and The moving body has a bridging structure spanning the placement area, and has a holding portion that fixes the nozzle so that the ejection port is along a horizontal direction substantially orthogonal to the first direction Holding, the nozzle that ejects the processing liquid from the ejection port can be held by the holding portion and can be moved in the first direction, and the detection portion can be opposed to the nozzle on the front side of the movement of the nozzle. Objects on the substrate that interfere with the nozzle during the movement of the nozzle are detected. 一種基板處理方法，包括：使矯正構件移動至基板的上表面周邊部的上方位置，所述基板載置於載置區域，所述載置區域設置於平台的上表面，並將所述上表面周邊部按壓至所述平台側來進行矯正的步驟；利用所述平台來保持藉由所述矯正構件而受到矯正後的所述基板的步驟；使所述矯正構件自保持於所述平台的所述基板的上方退避至較所述基板的上表面的高度位置低的位置的步驟；以及在所述矯正構件位於較所述高度位置低的位置的期間，使移動體在沿著所述平台的所述上表面的第一方向上移動，並且使檢測部沿所述第一方向移動，同時對保持於所述平台的所述基板的 上表面的表面狀態進行檢測的步驟；且所述檢測部沿著所述基板的上表面將感測器光投光於一對檢測感測器之間，所述一對檢測感測器以沿著與所述第一方向正交並在所述平台的所述上表面的第二方向上將所述基板及所述矯正構件夾入的方式設置。 A substrate processing method includes: moving a correction member to a position above a peripheral portion of an upper surface of a substrate, the substrate is placed on a placement area, the placement area is provided on the upper surface of a platform, and the upper surface The step of pressing the peripheral portion to the side of the platform to perform correction; the step of using the platform to hold the base plate corrected by the correction member; the step of making the correction member self-retaining on all of the platform The step of retracting the upper part of the substrate to a position lower than the height position of the upper surface of the substrate; The upper surface is moved in the first direction, and the detection part is moved in the first direction, and at the same time, the substrate held on the platform is The step of detecting the surface state of the upper surface; and the detection section projects the sensor light between a pair of detection sensors along the upper surface of the substrate, and the pair of detection sensors are arranged along the It is arranged in such a way that it is orthogonal to the first direction and sandwiches the base plate and the correcting member in the second direction of the upper surface of the platform.
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