JP2020136480A - Substrate processing device and substrate processing method - Google Patents

Substrate processing device and substrate processing method Download PDF

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JP2020136480A
JP2020136480A JP2019027647A JP2019027647A JP2020136480A JP 2020136480 A JP2020136480 A JP 2020136480A JP 2019027647 A JP2019027647 A JP 2019027647A JP 2019027647 A JP2019027647 A JP 2019027647A JP 2020136480 A JP2020136480 A JP 2020136480A
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substrate
stage
moving
straightening
substrate processing
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JP6869279B2 (en
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上野　幸一
Koichi Ueno
幸一 上野
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to TW108144463A priority patent/TWI743614B/en
Priority to KR1020200004777A priority patent/KR102323711B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Abstract

To surely prevent interference between a correction member that corrects a substrate placed on a stage and a detection unit that detects the surface condition of the upper surface of the corrected substrate while moving in a first direction along the upper surface of the stage.SOLUTION: A substrate processing device includes a retracting unit that retracts a correction member to a position lower than the height position of the upper surface of a substrate held on a stage after the substrate that has been corrected by the correction member is held on the stage, and before the movement of the detection unit starts.SELECTED DRAWING: Figure 5B

Description

この発明は、液晶表示装置や有機ＥＬ表示装置等のＦＰＤ用ガラス基板、半導体ウェハ、フォトマスク用ガラス基板、カラーフィルター用基板、記録ディスク用基板、太陽電池用基板、電子ペーパー用基板等の精密電子装置用基板、半導体パッケージ用基板（以下、単に「基板」と称する）を矯正部材で矯正した後で基板を保持して所定の処理を施す基板処理技術に関するものである。 The present invention relates to precision such as glass substrates for FPDs such as liquid crystal display devices and organic EL display devices, semiconductor wafers, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, and substrates for electronic paper. The present invention relates to a substrate processing technique for performing a predetermined process by holding a substrate after correcting a substrate for an electronic device and a substrate for a semiconductor package (hereinafter, simply referred to as a “substrate”) with a straightening member.

従来、基板処理装置の一例として、塗布液の塗布等の処理を基板に行う塗布装置が知られている（例えば特許文献１参照）。この塗布装置は、ステージの上面に載置された基板の下面を吸着して保持する基板保持装置と、基板保持装置により保持された基板の上面と近接した状態で当該基板に対して水平方向に相対的に移動することにより基板の上面に塗布液を塗布するスリットノズルとを備えている。 Conventionally, as an example of a substrate processing apparatus, a coating apparatus that performs processing such as coating of a coating liquid on a substrate is known (see, for example, Patent Document 1). This coating device is a substrate holding device that attracts and holds the lower surface of the substrate mounted on the upper surface of the stage, and a substrate holding device that is held by the substrate holding device in a state close to the upper surface of the substrate and horizontally to the substrate. It is equipped with a slit nozzle that applies a coating liquid to the upper surface of the substrate by moving relative to each other.

この基板保持装置では、基板の周辺部付近に生じる反りの影響を抑えるべくステージの周囲に押圧部材（本発明の「矯正部材」の一例に相当）が配置されている。そして、基板の反りが大きい場合には、押圧部材が基板の上面の周辺部を上方から押圧して基板の反りを矯正する。したがって、基板全域をステージ上に吸着保持することができ、塗布処理などの基板処理を良好に行うことが可能となっている。 In this substrate holding device, a pressing member (corresponding to an example of the "correcting member" of the present invention) is arranged around the stage in order to suppress the influence of warpage generated in the vicinity of the peripheral portion of the substrate. When the warp of the substrate is large, the pressing member presses the peripheral portion of the upper surface of the substrate from above to correct the warp of the substrate. Therefore, the entire surface of the substrate can be adsorbed and held on the stage, and the substrate treatment such as the coating treatment can be performed satisfactorily.

特開２０１７−１１２１９７号公報Japanese Unexamined Patent Publication No. 2017-12197 特開２００６−１６７６１０号公報Japanese Unexamined Patent Publication No. 2006-167610 特開２００５−８５７７３号公報Japanese Unexamined Patent Publication No. 2005-85773

ところで、塗布装置では、スリットノズルの下端部となる吐出口と基板とが近接された状態で、スリットノズルが基板に対して相対的に移動される。このため、基板の上面に異物が付着していたり、基板とそれを保持する保持面との間の異物により基板に隆起部があると、これらの異物や隆起部がスリットノズルと接触し、スリットノズルの損傷、基板の損傷、あるいは、塗布不良などが生じるおそれがある。そこで、異物等がスリットノズルと接触する前に検出部を基板の上面に沿って移動させながら基板の上面について表面状態を検出し、その検出結果に基づいて異物等がスリットノズルと接触する前にスリットノズルの相対移動を停止する技術が提案されている（特許文献２、３参照）。そこで、当該技術を上記特許文献１に記載の基板処理装置に適用することが提案されている。 By the way, in the coating device, the slit nozzle is moved relative to the substrate in a state where the discharge port, which is the lower end portion of the slit nozzle, and the substrate are close to each other. For this reason, if foreign matter adheres to the upper surface of the substrate or if there is a raised portion on the substrate due to foreign matter between the substrate and the holding surface that holds the foreign matter, these foreign matter or the raised portion come into contact with the slit nozzle and the slit. Damage to the nozzle, damage to the substrate, or poor coating may occur. Therefore, before the foreign matter or the like comes into contact with the slit nozzle, the surface state of the upper surface of the substrate is detected while moving the detection unit along the upper surface of the substrate, and based on the detection result, before the foreign matter or the like comes into contact with the slit nozzle. A technique for stopping the relative movement of the slit nozzle has been proposed (see Patent Documents 2 and 3). Therefore, it has been proposed to apply the technique to the substrate processing apparatus described in Patent Document 1.

しかしながら、特許文献２や特許文献３に記載された検出技術を基板の反りを矯正する押圧部材を備えた基板処理装置に適用すると、異物検出のためのバンパー部材（特許文献２参照）や検出センサ（特許文献３参照）が押圧部材と干渉することがあり、これが塗布処理などの基板処理に支障を来す要因の一つとなる。 However, when the detection techniques described in Patent Documents 2 and 3 are applied to a substrate processing apparatus provided with a pressing member for correcting the warp of the substrate, a bumper member (see Patent Document 2) and a detection sensor for detecting foreign matter are applied. (Refer to Patent Document 3) may interfere with the pressing member, which is one of the factors that hinder the substrate processing such as the coating process.

この発明は上記課題に鑑みなされたものであり、ステージに載置された基板を矯正する矯正部材と、ステージの上面に沿った第一方向に移動しながら矯正された基板の上面の表面状態を検出する検出部とが干渉するのを確実に防止することができる基板処理装置および基板処理方法を提供することを目的とする。 The present invention has been made in view of the above problems, and a straightening member for straightening a substrate placed on a stage and a surface state of the upper surface of the straightened substrate while moving in the first direction along the upper surface of the stage. It is an object of the present invention to provide a substrate processing apparatus and a substrate processing method capable of surely preventing interference with a detection unit to be detected.

本発明の一態様は、基板処理装置であって、基板が載置される載置領域が上面に設けられ、載置領域に載置された基板を保持するステージと、ステージの上面に沿った第一方向に移動する移動体と、第一方向への移動体の移動とともに第一方向に移動しながらステージに保持された基板の上面の表面状態を検出する検出部と、ステージによる基板の保持前に、載置領域に載置された基板の上面周辺部の上方位置に位置して上面周辺部をステージ側に押し付けて矯正する矯正部材と、矯正部材による矯正を受けた基板がステージに保持された後で、かつ検出部の移動が開始される前に、ステージに保持された基板の上面の高さ位置よりも低い位置に矯正部材を退避させる退避部と、を備えることを特徴としている。 One aspect of the present invention is a substrate processing apparatus, in which a mounting area on which a substrate is mounted is provided on the upper surface, a stage for holding the substrate mounted on the mounting area, and a stage along the upper surface of the stage. A moving body that moves in the first direction, a detection unit that detects the surface state of the upper surface of the substrate held on the stage while moving in the first direction as the moving body moves in the first direction, and holding of the board by the stage. Previously, a straightening member located above the upper surface peripheral portion of the substrate placed in the mounting area and pressing the upper surface peripheral portion against the stage side to correct the substrate, and a substrate corrected by the straightening member are held on the stage. The feature is that the correction member is retracted to a position lower than the height position of the upper surface of the substrate held on the stage after the detection unit is moved and before the movement of the detection unit is started. ..

また、本発明の他の態様は、基板処理方法であって、ステージの上面に設けられた載置領域に載置された基板の上面周辺部の上方位置に矯正部材を移動させ、上面周辺部をステージ側に押し付けて矯正する工程と、矯正部材による矯正を受けた基板をステージで保持する工程と、ステージに保持された基板の上方から基板の上面の高さ位置よりも低い位置に矯正部材を退避させる工程と、矯正部材が高さ位置よりも低い位置に位置している間に、移動体をステージの第一方向に移動させるとともに検出部を第一方向に移動させながらステージに保持された基板の上面の表面状態を検出する工程と、を備えることを特徴としている。 Further, another aspect of the present invention is a substrate processing method, in which the straightening member is moved to a position above the upper surface peripheral portion of the substrate mounted on the mounting region provided on the upper surface of the stage, and the upper surface peripheral portion is moved. The process of pressing the substrate against the stage to correct it, the process of holding the substrate straightened by the straightening member on the stage, and the straightening member from above the substrate held on the stage to a position lower than the height position of the upper surface of the substrate. While the step of retracting and the correction member is located at a position lower than the height position, the moving body is moved in the first direction of the stage and the detection unit is held in the stage while moving in the first direction. It is characterized by including a step of detecting the surface state of the upper surface of the substrate.

このように構成された発明では、検出部が第一方向に移動しながらステージに保持された基板の上面の表面状態を検出する。また、矯正部材がステージの載置領域に載置された基板の上面周辺部の上方位置に位置して基板の矯正を行う。このように基板の上方に検出部および矯正部材が位置する期間が全部または部分的に重なると、両者が干渉してしまう。そこで、本発明では、矯正処理を行った矯正部材がステージに保持された基板の上方から基板の上面の高さ位置よりも低い位置に退避し、その退避状態で移動体の移動とともに検出部を第一方向に移動させながらステージに保持された基板の上面の表面状態を検出する。なお、「移動体の移動とともに検出部を第一方向に移動させ」とは、検出部を移動体と一体的あるいは移動体から独立して移動させることを意味している。 In the invention configured as described above, the surface state of the upper surface of the substrate held on the stage is detected while the detection unit moves in the first direction. In addition, the straightening member is located above the upper surface peripheral portion of the substrate mounted in the mounting area of the stage to straighten the substrate. If the period in which the detection unit and the straightening member are located above the substrate completely or partially overlaps in this way, the two interfere with each other. Therefore, in the present invention, the straightening member that has been straightened is retracted from above the substrate held on the stage to a position lower than the height position of the upper surface of the substrate, and in the retracted state, the detection unit is moved along with the movement of the moving body. The surface state of the upper surface of the substrate held on the stage is detected while moving in the first direction. In addition, "moving the detection unit in the first direction with the movement of the moving body" means moving the detection unit integrally with the moving body or independently of the moving body.

以上のように本発明によれば、矯正部材がステージに保持された基板の上方から基板の上面の高さ位置よりも低い位置に退避した状態で検出部が移動して基板の上面の表面状態を検出するため、矯正部材と検出部との干渉を確実に防止することができる。 As described above, according to the present invention, the detection unit moves in a state where the straightening member is retracted from above the substrate held on the stage to a position lower than the height position of the upper surface of the substrate, and the surface state of the upper surface of the substrate is changed. Is detected, interference between the straightening member and the detection unit can be reliably prevented.

本発明に係る基板処理装置の第１実施形態としての塗布装置を示す斜視図である。It is a perspective view which shows the coating apparatus as 1st Embodiment of the substrate processing apparatus which concerns on this invention. 図１に示す塗布装置の部分平面図である。It is a partial plan view of the coating apparatus shown in FIG. 図１に示す塗布装置の電気的構成を示すブロック図である。It is a block diagram which shows the electrical structure of the coating apparatus shown in FIG. 第１実施形態における矯正機構の矯正ブロックと当該矯正ブロックを移動させるための移動部を示す斜視図である。It is a perspective view which shows the correction block of the correction mechanism in 1st Embodiment and the moving part for moving the correction block. 第１実施形態における移動部による矯正ブロックの移動を模式的に示す側面図である。It is a side view which shows typically the movement of the correction block by the moving part in 1st Embodiment. 第１実施形態における移動部による矯正ブロックの移動を模式的に示す側面図である。It is a side view which shows typically the movement of the correction block by the moving part in 1st Embodiment. 本発明に係る基板処理装置の第２実施形態の電気的構成を示すブロック図である。It is a block diagram which shows the electrical structure of the 2nd Embodiment of the substrate processing apparatus which concerns on this invention. 第２実施形態における矯正機構の矯正ブロックと当該矯正ブロックを移動させるための移動部を示す斜視図である。It is a perspective view which shows the correction block of the correction mechanism in 2nd Embodiment, and the moving part for moving the correction block. 第２実施形態における移動部による矯正ブロックの移動を模式的に示す側面図である。It is a side view which shows typically the movement of the correction block by the moving part in 2nd Embodiment. 第２実施形態における移動部による矯正ブロックの移動を模式的に示す側面図である。It is a side view which shows typically the movement of the correction block by the moving part in 2nd Embodiment. 矯正ブロックに連結されて矯正ブロックと基板との間にエア層を強制的に形成するエア層形成部の構成を示す図である。It is a figure which shows the structure of the air layer forming part which is connected to a straightening block and forcibly forms an air layer between a straightening block and a substrate. 第２実施形態における基板固定の一例を示すフローチャートである。It is a flowchart which shows an example of substrate fixing in 2nd Embodiment. 図１０のフローチャートにより実行される動作を模式的に示す動作説明図である。It is operation explanatory drawing which shows typically the operation executed by the flowchart of FIG. 本発明に係る基板処理装置の第２実施形態が装備するエア層形成部の他の構成を示す図である。It is a figure which shows the other structure of the air layer forming part equipped with the 2nd Embodiment of the substrate processing apparatus which concerns on this invention.

図１は本発明に係る基板処理装置の第１実施形態としての塗布装置を示す斜視図である。また、図２は図１に示す塗布装置の部分平面図である。さらに、図３は図１に示す塗布装置の電気的構成を示すブロック図である。なお、図１、図２および以降の各図にはそれらの方向関係を明確にするためＺ方向を鉛直方向とし、ＸＹ平面を水平面とするＸＹＺ直交座標系を適宜付している。また、理解容易の目的で、必要に応じて各部の寸法や数を誇張または簡略化して描いている。 FIG. 1 is a perspective view showing a coating apparatus as a first embodiment of the substrate processing apparatus according to the present invention. Further, FIG. 2 is a partial plan view of the coating device shown in FIG. Further, FIG. 3 is a block diagram showing an electrical configuration of the coating apparatus shown in FIG. In addition, in order to clarify the directional relationship between FIGS. 1, 2 and the following, an XYZ Cartesian coordinate system in which the Z direction is the vertical direction and the XY plane is the horizontal plane is appropriately attached. In addition, for the purpose of easy understanding, the dimensions and numbers of each part are exaggerated or simplified as necessary.

塗布装置１００は、ＣＰＵ(Central Processing Unit)やＲＡＭ(Random Access Memory)で構成されたコンピュータであるコントローラ１０を備え、コントローラ１０により装置各部を制御することでロボット等から受け取った基板Ｓの上面Ｓａ（図５Ｂ参照）に処理液の一例として塗布液を供給して塗布する。この塗布装置１００の処理対象となる基板Ｓの種類は多様ある。特に塗布装置１００は、後述するように基板Ｓの反りを矯正する機構を具備するため、例えば銅等の金属の層を含む多層構造を有する基板Ｓを処理するのに好適である。つまり、かかる多層基板Ｓは各層の熱膨張率の違いに起因して反りやすいのに対し、塗布装置１００はその反りを矯正した後で当該基板Ｓを保持し、塗布液を塗布可能となっている。また、処理対象となる基板Ｓの形状も多様であるが、ここでは平面視において四角形状を有する基板Ｓに対して塗布処理を実行する構成について説明する。 The coating device 100 includes a controller 10 which is a computer composed of a CPU (Central Processing Unit) and a RAM (Random Access Memory), and the upper surface Sa of the substrate S received from a robot or the like by controlling each part of the device by the controller 10. (See FIG. 5B) is supplied with a coating liquid as an example of the treatment liquid and coated. There are various types of substrates S to be processed by the coating device 100. In particular, since the coating device 100 includes a mechanism for correcting the warp of the substrate S as described later, it is suitable for processing the substrate S having a multilayer structure including a metal layer such as copper, for example. That is, while the multilayer substrate S tends to warp due to the difference in the coefficient of thermal expansion of each layer, the coating device 100 holds the substrate S after correcting the warp and can apply the coating liquid. There is. Further, although the shape of the substrate S to be processed is various, here, a configuration in which the coating process is executed on the substrate S having a rectangular shape in a plan view will be described.

塗布装置１００は図１に示すように略直方体の形状を有する花崗岩等の石材で構成されたステージ１を有している。ステージ１の上面１１のうち（＋Ｘ）側には、略水平な平坦面に加工されて基板Ｓを載置する載置領域１１ａを備えている。この載置領域１１ａには図示しない多数の通気孔が分散して形成されている。これらの通気孔は、エア供給部１１２およびエア吸引部１１３と接続されている。このため、装置全体を制御するコントローラ１０が、エア供給部１１２により通気孔にエアを供給することで通気孔から載置領域１１ａ上の基板Ｓにエアをブローしたり、エア吸引部１１３により通気孔からエアを吸引することで基板Ｓを載置領域１１ａに吸着して保持することが可能となっている。 As shown in FIG. 1, the coating device 100 has a stage 1 made of a stone material such as granite having a substantially rectangular parallelepiped shape. The (+ X) side of the upper surface 11 of the stage 1 is provided with a mounting area 11a on which the substrate S is mounted, which is processed into a substantially horizontal flat surface. A large number of ventilation holes (not shown) are dispersedly formed in the mounting region 11a. These ventilation holes are connected to the air supply unit 112 and the air suction unit 113. Therefore, the controller 10 that controls the entire device blows air from the ventilation holes to the substrate S on the mounting region 11a by supplying air to the ventilation holes by the air supply unit 112, or passes the air through the air suction unit 113. By sucking air from the pores, the substrate S can be attracted to and held in the mounting region 11a.

塗布装置１００は、ロボット（図示省略）から受け取った基板Ｓを載置領域１１ａに載置するための複数のリフトピン１２を備える。つまり、ステージ１には、載置領域１１ａに開口する複数のピン収納孔１１４がＺ方向に平行に延設されており、各ピン収納孔１１４にリフトピン１２が収容されている。各リフトピン１２はＺ方向に平行に延設されたピン形状を有し、コントローラ１０がリフトピンアクチュエータＡ１１２によりリフトピン１２を昇降させることで、リフトピン１２がピン収納孔１１４に対して進退する。そして、ロボットが載置領域１１ａの上方に基板Ｓを搬送してくると、リフトピンアクチュエータＡ１１２の駆動により上昇した複数のリフトピン１２がピン収納孔１１４から載置領域１１ａの上方へ突出してそれぞれの上端で基板Ｓを受け取る。続いて、リフトピンアクチュエータＡ１１２の駆動により複数のリフトピン１２が降下してピン収納孔１１４内に収まることで、複数のリフトピン１２の上端から載置領域１１ａに基板Ｓが載置される。 The coating device 100 includes a plurality of lift pins 12 for mounting the substrate S received from the robot (not shown) on the mounting region 11a. That is, in the stage 1, a plurality of pin storage holes 114 that open in the mounting area 11a extend in parallel in the Z direction, and the lift pins 12 are housed in each pin storage hole 114. Each lift pin 12 has a pin shape extending parallel to the Z direction, and when the controller 10 raises and lowers the lift pin 12 by the lift pin actuator A112, the lift pin 12 moves back and forth with respect to the pin storage hole 114. Then, when the robot conveys the substrate S above the mounting area 11a, the plurality of lift pins 12 raised by the drive of the lift pin actuator A112 project from the pin storage hole 114 upward of the mounting area 11a, and the upper ends of the respective lift pins 12 are projected. Receives the board S at. Subsequently, the plurality of lift pins 12 are lowered by the drive of the lift pin actuator A112 and are accommodated in the pin storage holes 114, so that the substrate S is mounted on the mounting region 11a from the upper ends of the plurality of lift pins 12.

本実施形態では、特許文献１に記載の装置と同様に、基板Ｓの保持に先立って載置領域１１ａに載置された状態で、水平方向における基板Ｓの位置を調整するために位置調整機構２が設けられるとともに、基板Ｓの反りを矯正するために矯正機構３が設けられている。なお、これらの構成については後で説明する。 In the present embodiment, similarly to the apparatus described in Patent Document 1, a position adjusting mechanism for adjusting the position of the substrate S in the horizontal direction in a state of being mounted on the mounting region 11a prior to holding the substrate S. 2 is provided, and a correction mechanism 3 is provided to correct the warp of the substrate S. These configurations will be described later.

位置調整機構２による位置調整および矯正機構３による反り矯正を受けた基板Ｓはステージ１で保持された後で、スリットノズル４による塗布処理を受ける。このスリットノズル４は、図１に示すように、Ｙ方向に延びるスリット状の開口部である吐出口を有しており、移動機構５によりＸ方向に移動される。移動機構５は、主たる構成として、ブリッジ構造のノズル支持体５１と、ノズル支持体５１をＸ方向に移動させるノズル移動部５２とを有している。ノズル支持体５１は、ステージ１に保持された基板Ｓの上面Ｓａに向けて吐出口から塗布液を吐出可能な姿勢でスリットノズル４を支持する。ノズル支持体５１は、Ｙ方向を長手方向としスリットノズル４を支持する梁部材５１ａと、梁部材５１ａのＹ方向端部をそれぞれ支持する１対の柱部材５１ｂとを有している。より詳しくは、ノズル支持体５１は、図１に示すように、ステージ１の左右両端部をＹ方向に沿って掛け渡し、ステージ１の上面１１を跨ぐ架橋構造を有している。そして、ノズル支持体５１とそれに固定保持されたスリットノズル４とを、ノズル移動部５２がステージ１上に保持される基板Ｓに対してＸ方向に沿って相対移動させる。このＸ方向はステージ１の上面１１に沿った第一方向である。このようにノズル支持体５１が吐出口を第一方向Ｘと略直交する水平方向Ｙに沿うようにスリットノズル４を固定保持し、スリットノズル４を一体的に第一方向Ｘに移動させており、本発明の「保持部」の一例に相当するとともに、本発明の「移動体」として機能する。 The substrate S that has undergone position adjustment by the position adjustment mechanism 2 and warp correction by the correction mechanism 3 is held by the stage 1 and then subjected to a coating process by the slit nozzle 4. As shown in FIG. 1, the slit nozzle 4 has a discharge port which is a slit-shaped opening extending in the Y direction, and is moved in the X direction by the moving mechanism 5. The moving mechanism 5 has, as a main configuration, a nozzle support 51 having a bridge structure and a nozzle moving portion 52 for moving the nozzle support 51 in the X direction. The nozzle support 51 supports the slit nozzle 4 in a posture in which the coating liquid can be discharged from the discharge port toward the upper surface Sa of the substrate S held by the stage 1. The nozzle support 51 has a beam member 51a that supports the slit nozzle 4 with the Y direction as the longitudinal direction, and a pair of pillar members 51b that support the Y-direction ends of the beam member 51a. More specifically, as shown in FIG. 1, the nozzle support 51 has a cross-linking structure in which the left and right ends of the stage 1 are hung along the Y direction and straddle the upper surface 11 of the stage 1. Then, the nozzle support 51 and the slit nozzle 4 fixedly held by the nozzle support 51 are moved relative to the substrate S held on the stage 1 by the nozzle moving portion 52 along the X direction. This X direction is the first direction along the upper surface 11 of the stage 1. In this way, the nozzle support 51 fixedly holds the slit nozzle 4 so that the discharge port is along the horizontal direction Y substantially orthogonal to the first direction X, and integrally moves the slit nozzle 4 in the first direction X. , Corresponds to an example of the "holding unit" of the present invention, and functions as the "moving body" of the present invention.

このようにＸ方向に一体的に移動するスリットノズル４およびノズル支持体５１のうち、スリットノズル４に対して特許文献２に記載の装置と同様にバンパー部材６１と振動センサ（図示省略）とからなる第１検出部６が取り付けられ、さらにノズル支持体５１に対して特許文献３に記載の装置と同様に複数の検出センサ７１、７２からなる第２検出部７が取り付けられている。これら第１検出部６および第２検出部７は、上記したように、基板Ｓの上面Ｓａの表面状態を検出してスリットノズル４の移動中に基板Ｓの異物等がスリットノズル４と下端部と接触してスリットノズル４の損傷、基板Ｓの損傷、あるいは、塗布不良などが発生するのを未然に防ぐ。 Of the slit nozzle 4 and the nozzle support 51 that move integrally in the X direction in this way, from the bumper member 61 and the vibration sensor (not shown) for the slit nozzle 4 as in the device described in Patent Document 2. A first detection unit 6 is attached to the nozzle support 51, and a second detection unit 7 including a plurality of detection sensors 71 and 72 is attached to the nozzle support 51 as in the device described in Patent Document 3. As described above, the first detection unit 6 and the second detection unit 7 detect the surface state of the upper surface Sa of the substrate S, and while the slit nozzle 4 is moving, foreign matter or the like on the substrate S is removed from the slit nozzle 4 and the lower end portion. It prevents damage to the slit nozzle 4, damage to the substrate S, coating failure, and the like in contact with the slit nozzle 4.

ノズル移動部５２は、±Ｙ側のそれぞれにおいて、スリットノズル４、バンパー部材６１および検出センサ７１、７２の移動をＸ方向に案内するガイドレール５３と、駆動源であるリニアモータ５４と、スリットノズル４の吐出口の位置を検出するための位置センサ５５とを備えている。 The nozzle moving portion 52 includes a guide rail 53 that guides the movement of the slit nozzle 4, the bumper member 61, and the detection sensors 71, 72 in the X direction, a linear motor 54 that is a drive source, and a slit nozzle on each of the ± Y sides. It is provided with a position sensor 55 for detecting the position of the discharge port of 4.

２つのガイドレール５３はそれぞれ、ステージ１のＹ方向の両端部にＸ方向に沿ってノズル待機位置（図１に示す位置）から塗布終了位置（載置領域１１ａの＋Ｘ側端部位置）までの区間を含むように延設されている。このため、ノズル移動部５２によって２つの柱部材５１ｂの下端部が上記２つのガイドレール５３に沿って案内されることで、スリットノズル４はノズル待機位置とステージ１上に保持される基板Ｓに対向する位置との間を移動する。 Each of the two guide rails 53 extends from the nozzle standby position (position shown in FIG. 1) to the coating end position (+ X side end position of the mounting area 11a) along the X direction at both ends of the stage 1 in the Y direction. It is extended to include the section. Therefore, the lower end portions of the two pillar members 51b are guided along the two guide rails 53 by the nozzle moving portion 52, so that the slit nozzle 4 is placed on the nozzle standby position and the substrate S held on the stage 1. Move between opposite positions.

本実施形態では、各リニアモータ５４は、固定子５４ａと移動子５４ｂとを有するＡＣコアレスリニアモータとして構成される。固定子５４ａは、ステージ１のＸ方向の両側面にＹ方向に沿って設けられている。一方、移動子５４ｂは、柱部材５１ｂの外側に対して固設されている。リニアモータ５４は、これら固定子５４ａと移動子５４ｂとの間に生じる磁力によってノズル移動部５２の駆動源として機能する。 In the present embodiment, each linear motor 54 is configured as an AC coreless linear motor having a stator 54a and a mover 54b. The stator 54a is provided on both side surfaces of the stage 1 in the X direction along the Y direction. On the other hand, the mover 54b is fixed to the outside of the column member 51b. The linear motor 54 functions as a drive source for the nozzle moving portion 52 by the magnetic force generated between the stator 54a and the mover 54b.

また、各位置センサ５５はいわゆるリニアエンコーダの構成を有しており、それぞれスケール部５５ａと検出部５５ｂとを有している。スケール部５５ａはステージ１に固設されたリニアモータ５４の固定子５４ａの下部にＹ方向に沿って設けられている。一方、検出部５５ｂは、柱部材５１ｂに固設されたリニアモータ５４の移動子５４ｂのさらに外側に固設され、スケール部５５ａに対向配置される。スケール部５５ａには一定間隔で格子目盛が設けられており、スケール部５５ａに対し相対移動する検出部５５ｂが目盛を読み取る度に、検出部５５ｂからパルス信号が出力される。検出部５５ｂの出力信号はコントローラ１０に入力される。後述するように、スケール部５５ａと検出部５５ｂとの相対的な位置関係に基づいて、Ｙ方向におけるスリットノズル４の吐出口の位置が検出される。 Further, each position sensor 55 has a so-called linear encoder configuration, and has a scale unit 55a and a detection unit 55b, respectively. The scale portion 55a is provided in the lower portion of the stator 54a of the linear motor 54 fixed to the stage 1 along the Y direction. On the other hand, the detection unit 55b is fixed to the outside of the mover 54b of the linear motor 54 fixed to the pillar member 51b, and is arranged to face the scale part 55a. The scale unit 55a is provided with grid scales at regular intervals, and each time the detection unit 55b that moves relative to the scale unit 55a reads the scale, a pulse signal is output from the detection unit 55b. The output signal of the detection unit 55b is input to the controller 10. As will be described later, the position of the discharge port of the slit nozzle 4 in the Y direction is detected based on the relative positional relationship between the scale unit 55a and the detection unit 55b.

次に、位置調整機構２および矯正機構３の構成について図１ないし図４、図５Ａおよび図５Ｂを参照しつつ説明する。図４は第１実施形態における矯正機構の矯正ブロックと当該矯正ブロックを移動させるための移動部を示す斜視図である。また、図５Ａおよび図５Ｂは第１実施形態における移動部による矯正ブロックの移動を模式的に示す側面図である。本実施形態は、ステージ１に対して位置調整機構２および矯正機構３を収容可能なピット１３が設けられている点と、スリットノズル４がノズル支持体５１と一体的にＸ方向に往復移動する際に位置調整機構２および矯正機構３がピット１３に退避可能となっている点とで特許文献１に記載の装置と大きく相違する一方、位置調整機構２および矯正機構３の基本的な構成は同一である。 Next, the configurations of the position adjusting mechanism 2 and the correction mechanism 3 will be described with reference to FIGS. 1 to 4, 5A and 5B. FIG. 4 is a perspective view showing a correction block of the correction mechanism according to the first embodiment and a moving portion for moving the correction block. Further, FIGS. 5A and 5B are side views schematically showing the movement of the correction block by the moving portion in the first embodiment. In this embodiment, the stage 1 is provided with a pit 13 capable of accommodating the position adjusting mechanism 2 and the correction mechanism 3, and the slit nozzle 4 reciprocates in the X direction integrally with the nozzle support 51. The position adjustment mechanism 2 and the correction mechanism 3 are significantly different from the apparatus described in Patent Document 1 in that the position adjustment mechanism 2 and the correction mechanism 3 can be retracted to the pit 13, while the basic configuration of the position adjustment mechanism 2 and the correction mechanism 3 is It is the same.

ピット１３は、図１および図２に示すように、載置領域１１ａとステージ１の側端面１１ｂとの間でステージ１の上面１１から下方に掘り下げられた凹部状の空間であり、載置領域１１ａを四方から取り囲むように合計４つ設けられている。これは、次に説明するように矩形形状を有する基板Ｓの各辺に対応して位置調整手段２０および矯正手段３０を設けたことに対応するものである。 As shown in FIGS. 1 and 2, the pit 13 is a recessed space dug downward from the upper surface 11 of the stage 1 between the mounting area 11a and the side end surface 11b of the stage 1, and is a mounting area. A total of four are provided so as to surround 11a from all sides. This corresponds to the provision of the position adjusting means 20 and the correcting means 30 corresponding to each side of the substrate S having a rectangular shape as described below.

次に、位置調整手段２０を有する位置調整機構２および矯正手段３０を有する矯正機構３の構成および動作について説明する。位置調整機構２は、載置領域１１ａに載置された基板Ｓの載置領域１１ａ上での位置を調整する機構である。この位置調整機構２は、載置領域１１ａの各辺に２個ずつ配置された合計８個の位置調整手段２０を有し、各位置調整手段２０は、Ｚ方向に平行に延設されたピン形状のアライメントピン２１を有する。つまり、ピット１３の側面のうち載置領域１１ａと隣接する側面には、当該側面に垂直に切り欠けられて水平方向に延設された切り欠き部１１５が２個ずつ設けられており、各切り欠き部１１５内にアライメントピン２１が配置されている。アライメントピン２１の上端は切り欠き部１１５から載置領域１１ａの上方に突出しており、位置調整手段２０は、アライメントピン２１を位置調整アクチュエータＡ２１により切り欠き部１１５に沿って水平方向へ駆動することで、アライメントピン２１の載置領域１１ａより上方部分を基板Ｓの周縁に当接させることができる。なお、位置調整手段２０としては、例えば特許文献１に記載のものを使用することができる。また、本実施形態では、載置領域１１ａの各辺に対応して設けられた一対の位置調整手段２０は次に説明するように矯正機構３において載置領域１１ａの各辺に対応して設けられる矯正ブロック３１と一体的に移動可能となっている。 Next, the configuration and operation of the position adjusting mechanism 2 having the position adjusting means 20 and the correction mechanism 3 having the correcting means 30 will be described. The position adjusting mechanism 2 is a mechanism for adjusting the position of the substrate S mounted on the mounting region 11a on the mounting region 11a. The position adjusting mechanism 2 has a total of eight position adjusting means 20 arranged on each side of the mounting area 11a, and each position adjusting means 20 is a pin extended in parallel in the Z direction. It has an alignment pin 21 in shape. That is, on the side surface of the side surface of the pit 13 adjacent to the mounting area 11a, two notch portions 115 that are notched perpendicularly to the side surface and extend in the horizontal direction are provided, and each cutout is provided. The alignment pin 21 is arranged in the notch 115. The upper end of the alignment pin 21 projects above the mounting area 11a from the notch 115, and the position adjusting means 20 drives the alignment pin 21 horizontally along the notch 115 by the position adjusting actuator A21. Therefore, the portion above the mounting region 11a of the alignment pin 21 can be brought into contact with the peripheral edge of the substrate S. As the position adjusting means 20, for example, the one described in Patent Document 1 can be used. Further, in the present embodiment, the pair of position adjusting means 20 provided corresponding to each side of the mounting area 11a are provided corresponding to each side of the mounting area 11a in the correction mechanism 3 as described below. It is movable integrally with the correction block 31 to be formed.

矯正機構３は、載置領域１１ａに載置された基板Ｓの上面周辺部に接触して基板Ｓを載置領域１１ａに押圧して基板Ｓの反りを矯正するものであり、載置領域１１ａの各辺に１個ずつ配置された合計４個の矯正手段３０を有する。各矯正手段３０は、載置領域１１ａの対応する辺に沿って延設され、後述するように載置領域１１ａに載置された基板Ｓの上面周辺部の上方に位置して上面周辺部を直接ステージ１の上面１１に押し付けて基板Ｓの反りを矯正する矯正ブロック３１を有する。 The straightening mechanism 3 is for correcting the warp of the substrate S by contacting the peripheral portion of the upper surface of the substrate S mounted on the mounting region 11a and pressing the substrate S against the mounting region 11a. It has a total of four correction means 30 arranged one on each side of the above. Each straightening means 30 is extended along the corresponding side of the mounting area 11a, and is located above the upper surface peripheral portion of the substrate S mounted on the mounting region 11a as described later to provide the upper surface peripheral portion. It has a straightening block 31 that is directly pressed against the upper surface 11 of the stage 1 to correct the warp of the substrate S.

矯正ブロック３１は載置領域１１ａの各辺に１個ずつ設けられており、各矯正ブロック３１の構成は共通している。矯正ブロック３１は、フレーム３３と、フレーム３３の下面に取り付けられた対向平板３４とを有する。対向平板３４は、載置領域１１ａの対応する辺に沿って水平方向へ延びるフレーム３３の下面に、切り欠き部３２を外して設けられている。そして、移動部３５によって矯正ブロック３１が基板Ｓの上面周辺部の上方に移動されると、対向平板３４の下部に取り付けられた接触部材３４１が当該上面周辺部を上方から覆うように対向配置される。そして、移動部３５によって矯正ブロック３１が降下されると、接触部材３４１が基板Ｓの上面周辺部に接触し、さらにステージ１の上面１１に押し付ける。 One straightening block 31 is provided on each side of the mounting area 11a, and the configuration of each straightening block 31 is common. The straightening block 31 has a frame 33 and an opposing flat plate 34 attached to the lower surface of the frame 33. The facing flat plate 34 is provided on the lower surface of the frame 33 extending in the horizontal direction along the corresponding side of the mounting region 11a with the notch 32 removed. Then, when the straightening block 31 is moved above the upper surface peripheral portion of the substrate S by the moving portion 35, the contact member 341 attached to the lower portion of the facing flat plate 34 is arranged so as to cover the upper surface peripheral portion from above. To. Then, when the straightening block 31 is lowered by the moving portion 35, the contact member 341 comes into contact with the peripheral portion of the upper surface of the substrate S and further presses against the upper surface 11 of the stage 1.

移動部３５は、図４、図５Ａおよび図５Ｂに示すように、駆動源として２つの垂直アクチュエータ３５１、３５２と、１つの水平アクチュエータ３５３とを有している。垂直アクチュエータ３５１、３５２は、それぞれコントローラ１０からの駆動指令に応じて昇降移動するロッド３５１ｒ、３５２ｒを有している。これらのうちロッド３５１ｒは、断面形状が略Ｌ字状に仕上げられたブラケット３６１を介して矯正ブロック３１のフレーム３３に取り付けられている。また、もう一方のロッド３５２ｒは、断面形状が略Ｌ字状に仕上げられたブラケット３６２を介して垂直アクチュエータ３５１のシリンダ部３５１ｓに取り付けられている。さらに、垂直アクチュエータ３５２のシリンダ部３５２ｓは移動プレート３７１に支持されている。 As shown in FIGS. 4, 5A and 5B, the moving unit 35 has two vertical actuators 351 and 352 and one horizontal actuator 353 as drive sources. The vertical actuators 351 and 352 have rods 351r and 352r that move up and down in response to a drive command from the controller 10, respectively. Of these, the rod 351r is attached to the frame 33 of the straightening block 31 via a bracket 361 whose cross-sectional shape is finished to be substantially L-shaped. Further, the other rod 352r is attached to the cylinder portion 351s of the vertical actuator 351 via a bracket 362 whose cross-sectional shape is finished to be substantially L-shaped. Further, the cylinder portion 352s of the vertical actuator 352 is supported by the moving plate 371.

移動プレート３７１はステージ１に対して水平方向に進退可能となっている。より詳しくは、この実施形態では、ベース部材３７３がステージ１に固定され、さらに当該ベース部材３７３上にレール３７２が移動プレート３７１を水平方向に進退可能に支持している。そして、移動プレート３７１に対して水平アクチュエータ３５３が接続されており、移動プレート３７１を水平方向に駆動可能となっている。 The moving plate 371 can advance and retreat horizontally with respect to the stage 1. More specifically, in this embodiment, the base member 373 is fixed to the stage 1, and the rail 372 further supports the moving plate 371 in the horizontal direction so as to be able to move forward and backward on the base member 373. A horizontal actuator 353 is connected to the moving plate 371 so that the moving plate 371 can be driven in the horizontal direction.

このように移動部３５は構成されているため、コントローラ１０からの指令に応じて垂直アクチュエータ３５１、３５２がロッド３５１ｒ、３５２ｒを最上位置に前進させた後で水平アクチュエータ３５３が移動プレート３７１をステージ１側に移動させると、図５Ａに示すように矯正ブロック３１はステージ１の上方に移動し、その底面、つまり対向平板３４のうち基板Ｓと対向する下面はステージ１上の基板Ｓから十分に離れた高さ位置Ｈ１に位置決めされる。また、同図への図示を省略しているが、矯正ブロック３１の移動に伴って位置調整手段２０もステージ１側に移動する。そして、垂直アクチュエータ３５２のロッド３５２ｒを伸長させた状態のままコントローラ１０からの指令に応じて垂直アクチュエータ３５１のロッド３５１ｒがシリンダ部３５１ｓに後退するにしたがって接触部材３４１がステージ１上の基板Ｓに接近し、後退量に応じた高さ位置Ｈ２、Ｈ３に位置決めされる。これによって、基板Ｓの上面周辺部をステージ１の上面１１に押し付けて反りを矯正する。なお、当該矯正動作については、特許文献１に記載の装置と同一であるため、ここでは説明を省略する。 Since the moving portion 35 is configured in this way, the horizontal actuator 353 advances the moving plate 371 to the stage 1 after the vertical actuators 351 and 352 advance the rods 351r and 352r to the uppermost positions in response to a command from the controller 10. When moved to the side, the straightening block 31 moves above the stage 1 as shown in FIG. 5A, and the bottom surface thereof, that is, the lower surface of the facing flat plate 34 facing the substrate S is sufficiently separated from the substrate S on the stage 1. It is positioned at the vertical height position H1. Further, although not shown in the figure, the position adjusting means 20 also moves to the stage 1 side as the straightening block 31 moves. Then, the contact member 341 approaches the substrate S on the stage 1 as the rod 351r of the vertical actuator 351 retracts to the cylinder portion 351s in response to a command from the controller 10 while the rod 352r of the vertical actuator 352 is extended. Then, it is positioned at the height positions H2 and H3 according to the amount of retreat. As a result, the peripheral portion of the upper surface of the substrate S is pressed against the upper surface 11 of the stage 1 to correct the warp. Since the correction operation is the same as the device described in Patent Document 1, description thereof will be omitted here.

このようにステージ１の載置領域１１ａに載置された基板Ｓの上面周辺部の上方、より詳細には高さ位置Ｈ３に矯正ブロック３１を移動させることで当該上面周辺部をステージ１側に押し付けて矯正されるが、この後で矯正ブロック３１による矯正を受けた基板Ｓがステージ１に吸着保持される。 By moving the straightening block 31 above the upper surface peripheral portion of the substrate S mounted on the mounting region 11a of the stage 1 and more specifically to the height position H3 in this way, the upper surface peripheral portion is moved to the stage 1 side. It is pressed and straightened, but after that, the substrate S straightened by the straightening block 31 is adsorbed and held on the stage 1.

基板Ｓの保持完了後に、次のようにして矯正ブロック３１の退避処理が実行される。コントローラ１０からの指令に応じて水平アクチュエータ３５３が移動プレート３７１を反ステージ１側に移動させた後で垂直アクチュエータ３５１、３５２がロッド３５１ｒ、３５２ｒをシリンダ部３５１ｓ、３５２ｓに後退させる。これによって、図５Ｂに示すように矯正ブロック３１は退避位置に位置決めされる。また、図５Ｂへの図示を省略しているが、矯正ブロック３１と一体的に移動させられる位置調整手段２０も退避位置に位置決めされる。この退避位置は、矯正ブロック３１が水平方向においてステージ１から離れた位置で、かつ垂直方向においてステージ１に保持される矯正済の基板Ｓの上面Ｓａの高さ位置Ｈ４（図５Ｂ中の一点鎖線）よりも低い位置を意味している。このため、矯正ブロック３１および位置調整手段２０の退避位置への位置決めによって、矯正ブロック３１がバンパー部材６１と衝突したり、検出センサ７１、７２の間を投光されるセンサ光７３を遮光するのを防止することができる。したがって、矯正ブロック３１の退避後において、スリットノズル４の移動前方側、つまり図１に示すように（＋Ｘ）方向側でスリットノズル４の移動中にスリットノズル４と干渉する基板Ｓ上の対象物（異物や隆起部など）を高精度に検出しながら塗布処理を実行することができる。 After the holding of the substrate S is completed, the evacuation process of the straightening block 31 is executed as follows. In response to a command from the controller 10, the horizontal actuator 353 moves the moving plate 371 to the anti-stage 1 side, and then the vertical actuators 351 and 352 retract the rods 351r and 352r to the cylinder portions 351s and 352s. As a result, the straightening block 31 is positioned at the retracted position as shown in FIG. 5B. Further, although not shown in FIG. 5B, the position adjusting means 20 that is integrally moved with the straightening block 31 is also positioned at the retracted position. This retracted position is the height position H4 of the upper surface Sa of the corrected substrate S held at the position where the straightening block 31 is separated from the stage 1 in the horizontal direction and in the vertical direction (one-dot chain line in FIG. 5B). ) Means a lower position. Therefore, by positioning the straightening block 31 and the position adjusting means 20 to the retracted position, the straightening block 31 collides with the bumper member 61, and the sensor light 73 projected between the detection sensors 71 and 72 is shielded from light. Can be prevented. Therefore, after the straightening block 31 is retracted, an object on the substrate S that interferes with the slit nozzle 4 while the slit nozzle 4 is moving on the front side of the movement of the slit nozzle 4, that is, on the (+ X) direction side as shown in FIG. The coating process can be executed while detecting (foreign matter, ridges, etc.) with high accuracy.

以上のように、本実施形態によれば、ステージ１の載置領域１１ａに載置された基板Ｓの上面周辺部の上方位置（高さ位置Ｈ３）に矯正ブロック３１を移動させて接触部材３４１により基板Ｓの矯正を行う。そして、基板Ｓをステージ１で保持した後で、矯正ブロック３１を高さ位置Ｈ４よりも低い位置に退避させている。このため、矯正ブロック３１が（＋Ｘ）方向に移動しながら矯正された基板Ｓの上面Ｓａの表面状態（スリットノズル４と干渉する基板Ｓ上に異物などが存在するか否か）を検出する第１検出部６および第２検出部７と干渉するのを確実に防止することができる。その結果、塗布処理を良好に行うことができる。 As described above, according to the present embodiment, the straightening block 31 is moved to the upper position (height position H3) of the upper surface peripheral portion of the substrate S mounted on the mounting region 11a of the stage 1 to move the contact member 341. The substrate S is straightened by. Then, after the substrate S is held by the stage 1, the straightening block 31 is retracted to a position lower than the height position H4. Therefore, while the straightening block 31 moves in the (+ X) direction, the surface state of the upper surface Sa of the straightened substrate S (whether or not foreign matter or the like exists on the substrate S that interferes with the slit nozzle 4) is detected. It is possible to reliably prevent interference with the 1 detection unit 6 and the 2nd detection unit 7. As a result, the coating process can be performed satisfactorily.

ところで、上記第１実施形態では、矯正ブロック３１の接触部材３４１を基板Ｓの上面周辺部に直接的に接触させて当該上面周辺部をステージ１の上面１１に押し付けて矯正している。このため、基板Ｓのうち接触部材３４１と物理的に接触する部位にダメージが導入されてしまうことがある。また、上記接触により塵やパーティクルなどが発生することなる。そこで、次に説明するように、基板Ｓの上面Ｓａと矯正ブロック３１の下面との間に気体層を形成し、気体層により上面周辺部を下方に押し付けて基板Ｓの反りを矯正する塗布装置１００が提案されている。この塗布装置１００に対しても本発明を適用することが可能である、以下、図６、図７、図８Ａ、図８Ｂ、図９〜図１１を参照しつつ本発明の第２実施形態について詳述する。 By the way, in the first embodiment, the contact member 341 of the straightening block 31 is brought into direct contact with the peripheral portion of the upper surface of the substrate S, and the peripheral portion of the upper surface is pressed against the upper surface 11 of the stage 1 for straightening. Therefore, damage may be introduced to a portion of the substrate S that is in physical contact with the contact member 341. In addition, dust and particles will be generated by the above contact. Therefore, as will be described next, a coating device that forms a gas layer between the upper surface Sa of the substrate S and the lower surface of the straightening block 31 and presses the peripheral portion of the upper surface downward by the gas layer to correct the warp of the substrate S. 100 has been proposed. The present invention can be applied to the coating device 100 as well. Hereinafter, with reference to FIGS. 6, 7, 8A, 8B, 9 to 11, the second embodiment of the present invention. It will be described in detail.

図６は本発明に係る基板処理装置の第２実施形態の電気的構成を示すブロック図である。また、図７は第２実施形態における矯正機構の矯正ブロックと当該矯正ブロックを移動させるための移動部を示す斜視図である。また、図８Ａおよび図８Ｂは第２実施形態における移動部による矯正ブロックの移動を模式的に示す側面図である。本実施形態では、対向平板３４に対して接触部材３４１の代わりに複数の貫通孔３４２（図７）が設けられている。また、エア層形成部３８が追加的に設けられ、矯正ブロック３１にエアを供給することで矯正ブロック３１の対向平板３４と基板Ｓとの間にエア層（気体層）を強制的に形成する。そして、エア層により基板Ｓの上方周辺部を基板Ｓの反りを強制する。なお、それら以外の構成および動作は基本的に第１実施形態と同一である。したがって、以下においては相違点を中心に説明し、同一構成については同一符号を付して説明を省略する。 FIG. 6 is a block diagram showing an electrical configuration of a second embodiment of the substrate processing apparatus according to the present invention. Further, FIG. 7 is a perspective view showing a straightening block of the straightening mechanism and a moving portion for moving the straightening block in the second embodiment. 8A and 8B are side views schematically showing the movement of the straightening block by the moving portion in the second embodiment. In the present embodiment, a plurality of through holes 342 (FIG. 7) are provided in place of the contact member 341 for the facing flat plate 34. Further, an air layer forming portion 38 is additionally provided, and by supplying air to the straightening block 31, an air layer (gas layer) is forcibly formed between the opposing flat plate 34 of the straightening block 31 and the substrate S. .. Then, the air layer forces the upper peripheral portion of the substrate S to warp. The configurations and operations other than these are basically the same as those in the first embodiment. Therefore, in the following description, the differences will be mainly described, and the same components will be designated by the same reference numerals and the description thereof will be omitted.

図９は矯正ブロックに連結されて矯正ブロックと基板との間にエア層を強制的に形成するエア層形成部の構成を示す図である。矯正ブロック３１と基板Ｓとの間にエア層３９を強制的に形成するために、矯正ブロック３１に対してエア層形成部３８が接続されている。このエア層形成部３８は、図９に示すように、コンプレッサなどの圧縮部３８１、温調部３８２、フィルタ３８３、ニードル弁３８４、流量計３８５、圧力計３８６およびエアオペレーションバルブ３８７を有している。エア層形成部３８では、圧縮部３８１により圧縮されたエアを温調部３８２で所定の温度に調整してエア層形成用の圧縮エアを生成する。この圧縮エアを流通させる配管には、フィルタ３８３、ニードル弁３８４、流量計３８５、圧力計３８６およびエアオペレーションバルブ３８７が設けられている。そして、コントローラ１０からの指令にしたがってエアオペレーションバルブ３８７が開成されると、フィルタ３８３を通って清浄化された圧縮エアがニードル弁３８４により圧力調節された後で流量計３８５、圧力計３８６、エアオペレーションバルブ３８７を通過して矯正ブロック３１に圧送される。これによって、対向平板３４に貫通して設けられた貫通孔３４２（図７中の部分拡大図を参照）が噴出孔として機能し、当該貫通孔３４２から圧縮エアが下方に噴出し、基板Ｓの上面周辺部と矯正ブロック３１との間にエア層３９（図９においてドットを付して模式的に示した領域）が形成される。そして、エア層３９を形成したまま矯正ブロック３１を高さ位置Ｈ１、Ｈ２、Ｈ３への下降させることでエア層３９によって基板Ｓの上面周辺部をステージ１に押し付けて反りを矯正可能となっている。 FIG. 9 is a diagram showing a configuration of an air layer forming portion that is connected to the straightening block and forcibly forms an air layer between the straightening block and the substrate. An air layer forming portion 38 is connected to the straightening block 31 in order to forcibly form the air layer 39 between the straightening block 31 and the substrate S. As shown in FIG. 9, the air layer forming portion 38 includes a compression portion 381 such as a compressor, a temperature control portion 382, a filter 383, a needle valve 384, a flow meter 385, a pressure gauge 386, and an air operation valve 387. There is. In the air layer forming section 38, the air compressed by the compressing section 381 is adjusted to a predetermined temperature by the temperature control section 382 to generate compressed air for forming the air layer. A filter 383, a needle valve 384, a flow meter 385, a pressure gauge 386, and an air operation valve 387 are provided in the pipe for circulating the compressed air. Then, when the air operation valve 387 is opened according to the command from the controller 10, the compressed air cleaned through the filter 383 is pressure-adjusted by the needle valve 384, and then the flow meter 385, the pressure gauge 386, and the air. It passes through the operation valve 387 and is pumped to the straightening block 31. As a result, the through hole 342 (see the partially enlarged view in FIG. 7) provided through the facing flat plate 34 functions as an ejection hole, and the compressed air is ejected downward from the through hole 342 to form the substrate S. An air layer 39 (a region schematically shown with dots in FIG. 9) is formed between the peripheral portion of the upper surface and the straightening block 31. Then, by lowering the straightening block 31 to the height positions H1, H2, and H3 while forming the air layer 39, the air layer 39 presses the peripheral portion of the upper surface of the substrate S against the stage 1 to correct the warp. There is.

図１０は第２実施形態における基板固定の一例を示すフローチャートである。図１１は図１０のフローチャートにより実行される動作を模式的に示す動作説明図である。なお、図１１では、エアの流れについては点線矢印で示し、基板Ｓ、アライメントピン２１および矯正ブロック３１の動きについては実線矢印で示し、エア層３９についてはドットを付して示している。また、図１１では、符号Ｈ１〜Ｈ３は矯正ブロック３１の高さ位置を示しており、鉛直方向Ｚにおける対向平板３４の下面（対向面）の高さで示されている。また、符号Ｈ４は第１実施形態と同様に、垂直方向においてステージ１に保持される矯正済の基板Ｓの上面Ｓａの高さ位置Ｈ４を示している。 FIG. 10 is a flowchart showing an example of fixing the substrate in the second embodiment. FIG. 11 is an operation explanatory diagram schematically showing the operation executed by the flowchart of FIG. In FIG. 11, the flow of air is indicated by a dotted arrow, the movement of the substrate S, the alignment pin 21, and the straightening block 31 is indicated by a solid arrow, and the air layer 39 is indicated by dots. Further, in FIG. 11, reference numerals H1 to H3 indicate the height position of the straightening block 31, and are indicated by the height of the lower surface (opposing surface) of the opposing flat plate 34 in the vertical direction Z. Further, reference numeral H4 indicates the height position H4 of the upper surface Sa of the corrected substrate S held by the stage 1 in the vertical direction as in the first embodiment.

載置領域１１ａの４辺それぞれに設けられた矯正ブロック３１が退避位置（図８Ｂに示す位置）へ退避するとともに位置調整手段２０も退避位置に位置しながら各アライメントピン２１が離間位置に位置している。この退避位置は、第１実施形態と同様に、水平方向においてステージ１から離れた位置で、かつ垂直方向においてステージ１に保持される矯正済の基板Ｓの上面Ｓａの高さ位置Ｈ４（図８Ｂ中の一点鎖線）よりも低い位置を意味している。 The straightening blocks 31 provided on each of the four sides of the mounting area 11a retract to the retracted position (position shown in FIG. 8B), and the position adjusting means 20 is also located at the retracted position, while the alignment pins 21 are located at separate positions. ing. This retracted position is the height position H4 of the upper surface Sa of the corrected substrate S held on the stage 1 in the vertical direction and at a position away from the stage 1 in the horizontal direction as in the first embodiment (FIG. 8B). It means a position lower than the one-dot chain line in the middle.

このように次の基板Ｓの搬入可能な搬入準備状態でロボットが基板Ｓを載置領域１１ａの上方へ搬送してくる。これに対応して各リフトピン１２がピン収納孔１１４から上昇して各リフトピン１２の上端が基板Ｓに当接し（ステップＳ１０１）、各リフトピン１２がロボットより基板Ｓを受け取る（ステップＳ１０２）。そして、各リフトピン１２が降下して各リフトピン１２の上端がピン収納孔１１４内に収まると、各リフトピン１２の上端から載置領域１１ａに基板Ｓが載置される（ステップＳ１０３）。なお、図１１の（ａ）欄に示すように、ここで示す例では、基板Ｓの周辺部が弓なりに反っており、基板Ｓの周縁が載置領域１１ａから離れている。 In this way, the robot conveys the substrate S above the mounting area 11a in a carry-in ready state in which the next substrate S can be carried. Correspondingly, each lift pin 12 rises from the pin storage hole 114, the upper end of each lift pin 12 comes into contact with the substrate S (step S101), and each lift pin 12 receives the substrate S from the robot (step S102). Then, when the lift pins 12 are lowered and the upper ends of the lift pins 12 are contained in the pin storage holes 114, the substrate S is placed on the mounting area 11a from the upper ends of the lift pins 12 (step S103). As shown in the column (a) of FIG. 11, in the example shown here, the peripheral portion of the substrate S is curved in a bow shape, and the peripheral edge of the substrate S is separated from the mounting region 11a.

ステップＳ１０４では、移動部３５により垂直アクチュエータ３５１、３５２がロッド３５１ｒ、３５２ｒを最上位置に前進させた後で水平アクチュエータ３５３が移動プレート３７１をステージ１の上方に移動させ、これによって矯正ブロック３１が高さ位置Ｈ１に位置決めされる。この高さ位置Ｈ１は基板Ｓの周辺部の反り量を考慮して設定することができ、最大反り量よりも若干高い位置に設定することで矯正ブロック３１が基板Ｓと干渉するのを確実に防止することができ、基板Ｓの周辺部と矯正ブロック３１の下面との間に空間が確実に形成される。そして、エア層形成部３８がエアを矯正ブロック３１に圧送して矯正ブロック３１の貫通孔３４２から圧縮エアを噴出させる（ステップＳ１０５）。これによって、図１１の（ａ）欄に示すように基板Ｓの上面周辺部と矯正ブロック３１との間にエア層３９が形成される。こうしたエア層３９の形成は次に説明する矯正動作およびアライメント動作（基板Ｓの位置調整）が完了するまで継続される。 In step S104, the vertical actuators 351 and 352 move the rods 351r and 352r to the uppermost position by the moving portion 35, and then the horizontal actuator 353 moves the moving plate 371 above the stage 1, whereby the straightening block 31 is raised. It is positioned at the vertical position H1. This height position H1 can be set in consideration of the amount of warpage of the peripheral portion of the substrate S, and by setting the height position H1 at a position slightly higher than the maximum amount of warpage, the straightening block 31 is surely interfered with the substrate S. This can be prevented, and a space is surely formed between the peripheral portion of the substrate S and the lower surface of the straightening block 31. Then, the air layer forming portion 38 pumps air to the straightening block 31 to eject compressed air from the through hole 342 of the straightening block 31 (step S105). As a result, as shown in the column (a) of FIG. 11, the air layer 39 is formed between the peripheral portion of the upper surface of the substrate S and the straightening block 31. The formation of the air layer 39 is continued until the correction operation and the alignment operation (position adjustment of the substrate S) described below are completed.

エア層３９を形成したまま移動部３５により垂直アクチュエータ３５１のロッド３５１ｒが後退して矯正ブロック３１を高さ位置Ｈ２まで下降させる（ステップＳ１０６）。このとき、反った状態の基板周辺部は、矯正ブロック３１と非接触状態のまま、エア層３９によりステージ１に向けて押し付けられる。これにより反りがある程度矯正され、反り量が所定値（アライメントピン２１の高さよりも小さい値）以下になる（仮矯正処理）。つまり、いわゆる基板Ｓの仮押圧が行われ、基板Ｓの周辺部の高さは高さ位置Ｈ２よりも低く抑えられ、アライメントピン２１の上端より低くなっている。 The rod 351r of the vertical actuator 351 is retracted by the moving portion 35 while the air layer 39 is formed, and the straightening block 31 is lowered to the height position H2 (step S106). At this time, the warped substrate peripheral portion is pressed toward the stage 1 by the air layer 39 while remaining in non-contact with the straightening block 31. As a result, the warp is corrected to some extent, and the amount of warp becomes equal to or less than a predetermined value (a value smaller than the height of the alignment pin 21) (provisional correction process). That is, so-called temporary pressing of the substrate S is performed, and the height of the peripheral portion of the substrate S is suppressed to be lower than the height position H2, and is lower than the upper end of the alignment pin 21.

基板Ｓの仮矯正処理が完了すると、図１１の（ｂ）欄に示すように、エア供給部１１２がステージ１の通気孔から載置領域１１ａ上の基板Ｓの下面にエアブローを開始する（ステップＳ１０７）。これによって、基板Ｓの下面が載置領域１１ａから僅かに離れて、基板Ｓの下面と載置領域１１ａとの間の摩擦力の低下が図られる。そして、次のステップＳ１０８では、図１１の（ｃ）欄に示すように、各アライメントピン２１が基板Ｓ側へ移動することで載置領域１１ａ上での基板Ｓの位置が調整される（位置調整処理）。そして、位置調整処理が完了すると、エア供給部１１２はエアブローを停止する（ステップＳ１０９）。 When the temporary correction process of the substrate S is completed, as shown in the column (b) of FIG. 11, the air supply unit 112 starts air blowing from the ventilation holes of the stage 1 to the lower surface of the substrate S on the mounting region 11a (step). S107). As a result, the lower surface of the substrate S is slightly separated from the mounting region 11a, and the frictional force between the lower surface of the substrate S and the mounting region 11a is reduced. Then, in the next step S108, as shown in the column (c) of FIG. 11, the position of the substrate S on the mounting region 11a is adjusted by moving each alignment pin 21 to the substrate S side (position). Adjustment process). Then, when the position adjustment process is completed, the air supply unit 112 stops the air blow (step S109).

次のステップＳ１１０では、エア層３９を形成したまま移動部３５により垂直アクチュエータ３５１のロッド３５１ｒがさらに後退して矯正ブロック３１を高さ位置Ｈ３まで下降させる。これによって、図１１の（ｄ）欄に示すように、基板周辺部は矯正ブロック３１と非接触状態のままエア層３９によってステージ１に押し付けられ、基板Ｓの形状が載置領域１１ａの形状に沿うように矯正される（最終矯正処理）。 In the next step S110, the rod 351r of the vertical actuator 351 is further retracted by the moving portion 35 while the air layer 39 is formed, and the straightening block 31 is lowered to the height position H3. As a result, as shown in column (d) of FIG. 11, the peripheral portion of the substrate is pressed against the stage 1 by the air layer 39 in a non-contact state with the straightening block 31, and the shape of the substrate S becomes the shape of the mounting region 11a. It is corrected along (final correction process).

矯正ブロック３１の高さ位置Ｈ３への降下が完了すると、図１１の（ｅ）欄に示すように、エア吸引部１１３が通気孔からエアを吸引することで、基板Ｓを載置領域１１ａに吸着する（ステップＳ１１１）。これによって、基板Ｓが載置領域１１ａに固定される。それに続いて、エア層形成部３８は矯正ブロック３１へのエア圧送を停止するとともに移動部３５は矯正ブロック３１および位置調整手段２０を一体的に退避位置に移動させる（図１１の（ｆ）欄参照）。これによって、矯正ブロック３１および位置調整手段２０が水平方向においてステージ１から離れた位置で、かつ垂直方向においてステージ１に保持される矯正済の基板Ｓの上面Ｓａの高さ位置Ｈ４（図８Ｂ、図１１の（ｆ）欄中の一点鎖線）よりも低い位置を位置決めされる。その結果、矯正ブロック３１がバンパー部材６１と衝突したり、検出センサ７１、７２の間を投光されるセンサ光７３を遮光するのを防止することができる。したがって、矯正ブロック３１の退避後において、スリットノズル４の移動前方側、つまり図１に示すように（＋Ｘ）方向側でスリットノズル４の移動中にスリットノズル４と干渉する基板Ｓ上の対象物（異物や隆起部など）を高精度に検出しながら塗布処理を実行することができる。 When the descent of the straightening block 31 to the height position H3 is completed, as shown in the column (e) of FIG. 11, the air suction unit 113 sucks air from the ventilation holes, so that the substrate S is placed in the mounting area 11a. Adsorb (step S111). As a result, the substrate S is fixed to the mounting region 11a. Subsequently, the air layer forming portion 38 stops the air pressure feeding to the straightening block 31, and the moving portion 35 integrally moves the straightening block 31 and the position adjusting means 20 to the retracted position (column (f) in FIG. 11). reference). As a result, the straightening block 31 and the position adjusting means 20 are held at a position away from the stage 1 in the horizontal direction and on the stage 1 in the vertical direction, and the height position H4 of the upper surface Sa of the straightened substrate S (FIG. 8B, FIG. The position is positioned lower than the one-dot chain line in column (f) of FIG. As a result, it is possible to prevent the straightening block 31 from colliding with the bumper member 61 and blocking the sensor light 73 projected between the detection sensors 71 and 72. Therefore, after the straightening block 31 is retracted, an object on the substrate S that interferes with the slit nozzle 4 while the slit nozzle 4 is moving on the front side of the movement of the slit nozzle 4, that is, on the (+ X) direction side as shown in FIG. The coating process can be executed while detecting (foreign matter, ridges, etc.) with high accuracy.

以上のように、第２実施形態では、ステージ１の載置領域１１ａに載置された基板Ｓの上面周辺部の上方、より詳細には高さ位置Ｈ３に矯正ブロック３１を移動させることで基板Ｓをエア層３９によって載置領域１１ａに押圧して基板Ｓの矯正を行う。そして、基板Ｓをステージ１で保持した後で、矯正ブロック３１を高さ位置Ｈ４よりも低い位置に退避させている。このため、矯正ブロック３１が（＋Ｘ）方向に移動しながら矯正された基板Ｓの上面Ｓａの表面状態（スリットノズル４と干渉する基板Ｓ上に異物などが存在するか否か）を検出する第１検出部６および第２検出部７と干渉するのを確実に防止することができる。その結果、塗布処理を良好に行うことができる。 As described above, in the second embodiment, the straightening block 31 is moved above the peripheral portion of the upper surface of the substrate S mounted on the mounting region 11a of the stage 1, more specifically, to the height position H3. The substrate S is straightened by pressing S against the mounting region 11a by the air layer 39. Then, after the substrate S is held by the stage 1, the straightening block 31 is retracted to a position lower than the height position H4. Therefore, while the straightening block 31 moves in the (+ X) direction, the surface state of the upper surface Sa of the straightened substrate S (whether or not foreign matter or the like exists on the substrate S that interferes with the slit nozzle 4) is detected. It is possible to reliably prevent interference with the 1 detection unit 6 and the 2nd detection unit 7. As a result, the coating process can be performed satisfactorily.

また、矯正ブロック３１は、ステージ１の載置領域１１ａ上の基板Ｓをエア層３９によって載置領域１１ａに押圧することで基板Ｓの反りを非接触にて矯正した上で基板Ｓをステージ１に吸着保持している。したがって、反りの矯正時に基板Ｓの上面に接触するのはエア層３９となり、接触部材３４１を直接接触させて矯正する第１実施形態に比べて基板Ｓにダメージが導入されるのを防止するとともに発塵の問題を解消しながら基板Ｓの全域を良好に保持することができる。 Further, the straightening block 31 corrects the warp of the substrate S in a non-contact manner by pressing the substrate S on the mounting region 11a of the stage 1 against the mounting region 11a by the air layer 39, and then sets the substrate S on the stage 1. It is adsorbed and held in. Therefore, it is the air layer 39 that comes into contact with the upper surface of the substrate S during the straightening of the warp, which prevents damage from being introduced into the substrate S as compared with the first embodiment in which the contact member 341 is directly contacted and straightened. The entire area of the substrate S can be held well while solving the problem of dust generation.

また、基板Ｓの下面をエアブローして基板Ｓの下面と載置領域１１ａとの間の摩擦力を低下させた状態でアライメントピン２１による基板Ｓの位置調整を行っているため、位置調整処理における基板Ｓの位置調整をスムーズに行うことができる。また、この位置調整処理を図１１の（ｃ）欄に示すように矯正ブロック３１を高さ位置Ｈ２まで下降させた後で実行している。したがって、載置領域１１ａに載置された基板Ｓの反りが比較的大きい場合であっても、基板Ｓの反りがある程度矯正された状態で位置調整処理が実行される。その結果、ステージ１上での基板Ｓの位置調整に対する基板Ｓの反りの影響を抑制することが可能となっている。 Further, since the position of the substrate S is adjusted by the alignment pin 21 in a state where the lower surface of the substrate S is air blown to reduce the frictional force between the lower surface of the substrate S and the mounting region 11a, the position adjustment process is performed. The position of the substrate S can be adjusted smoothly. Further, this position adjustment process is executed after the straightening block 31 is lowered to the height position H2 as shown in the column (c) of FIG. Therefore, even when the warp of the substrate S mounted on the mounting region 11a is relatively large, the position adjustment process is executed with the warp of the substrate S corrected to some extent. As a result, it is possible to suppress the influence of the warp of the substrate S on the position adjustment of the substrate S on the stage 1.

また、図１１の（ｄ）欄および（ｅ）欄に示すように、エア層３９を介して基板Ｓの周辺部を押圧する矯正ブロック３１を高さ位置Ｈ３まで下降させることで基板Ｓの周辺部を載置領域１１ａに密着させた後で基板Ｓの載置領域１１ａへの吸着を実行している。このため、載置領域１１ａへの基板Ｓの吸着保持を確実に実行することが可能となっている。 Further, as shown in columns (d) and (e) of FIG. 11, the straightening block 31 that presses the peripheral portion of the substrate S via the air layer 39 is lowered to the height position H3 to lower the periphery of the substrate S. After the portion is brought into close contact with the mounting region 11a, the substrate S is attracted to the mounting region 11a. Therefore, it is possible to reliably and hold the substrate S on the mounting region 11a.

なお、第２実施形態では、対向平板３４に設けられた複数の貫通孔３４２の全てが圧縮エアを噴出させるための噴出孔として機能するが、例えば図１２に示すように貫通孔３４２の一部を吸引孔３４２として機能させてもよい。すなわち、エア層形成部３８が、圧縮エアの供給系（＝圧縮部３８１＋温調部３８２＋フィルタ３８３＋ニードル弁３８４＋流量計３８５＋圧力計３８６＋エアオペレーションバルブ３８７）以外にエア層３９からエアを吸引してエア層３９の圧力および広がりを安定化させる吸引系３８８を有するように構成してもよい。この吸引系３８８では、吸引孔３４２に接続された吸引配管に、吸引手段としてのブロワ３８８ａと、圧力計３８８ｂと、リリーフ弁３８８ｃとを備え、ブロワ３８８ａによって得られる吸引圧力よりも吸引配管を介して接続される吸引孔３４２内の圧力が高い場合に、リリーフ弁３８８ｃから吸引孔３４２および吸引配管を介してエアを外部に放出することで、エア層３９の圧力を一定に保つための微調整を行うことができる。 In the second embodiment, all of the plurality of through holes 342 provided in the facing flat plate 34 function as ejection holes for ejecting compressed air, but as shown in FIG. 12, for example, a part of the through holes 342. May function as a suction hole 342. That is, the air layer forming unit 38 sucks air from the air layer 39 in addition to the compressed air supply system (= compression unit 381 + temperature control unit 382 + filter 383 + needle valve 384 + flow meter 385 + pressure gauge 386 + air operation valve 387). It may be configured to have a suction system 388 that stabilizes the pressure and spread of the air layer 39. In this suction system 388, the suction pipe connected to the suction hole 342 is provided with a blower 388a as a suction means, a pressure gauge 388b, and a relief valve 388c, and the suction pressure obtained by the blower 388a is passed through the suction pipe. Fine adjustment for keeping the pressure of the air layer 39 constant by discharging air from the relief valve 388c to the outside through the suction hole 342 and the suction pipe when the pressure in the suction hole 342 connected is high. It can be performed.

また、上記第２実施形態では、矯正ブロック３１の高さ位置にかかわらず、ニードル弁３８４により圧力調節された圧縮エアを一律に圧送しているが、矯正ブロック３１の高さ位置に応じて圧縮エアの圧力や吐出流量を調整するように構成してもよい。例えば高さ位置Ｈ１から高さ位置Ｈ２に矯正ブロック３１を下降させる間、つまり仮矯正処理を行う間においては圧縮エアの流量を上記実施形態と同様に設定する一方、高さ位置Ｈ２から高さ位置Ｈ３に矯正ブロック３１を下降させる間、つまり最終矯正処理を行う間においては圧縮エアの流量を抑えてもよい。こうすることでエア消費量を抑制してランニングコストの低減を図ることができる。 Further, in the second embodiment, the compressed air whose pressure is adjusted by the needle valve 384 is uniformly pumped regardless of the height position of the straightening block 31, but it is compressed according to the height position of the straightening block 31. It may be configured to adjust the air pressure and the discharge flow rate. For example, while lowering the straightening block 31 from the height position H1 to the height position H2, that is, during the provisional straightening process, the flow rate of the compressed air is set in the same manner as in the above embodiment, while the height from the height position H2. The flow rate of the compressed air may be suppressed while the straightening block 31 is lowered to the position H3, that is, during the final straightening process. By doing so, it is possible to suppress the air consumption and reduce the running cost.

また、上記第２実施形態では、圧縮エアを用いてエア層３９を形成しているが、その他の気体、例えば窒素ガスや不活性ガスなどを用いてもよい。 Further, in the second embodiment, the air layer 39 is formed by using compressed air, but other gases such as nitrogen gas and inert gas may be used.

上記したように、第１実施形態および第２実施形態では、（＋Ｘ）方向およびＹ方向がそれぞれ本発明の「第一方向」および「第一方向と略直交する水平方向」に相当している。また、第１検出部および第２検出部が本発明の「検出部」の一例に相当している。また、矯正ブロック３１が本発明の「矯正部材」の一例に相当している。移動部３５が本発明の「退避部」の一例に相当している。ピット１３が本発明の「凹部」の一例に相当している。スリットノズル４が本発明の「ノズル」の一例に相当している。 As described above, in the first embodiment and the second embodiment, the (+ X) direction and the Y direction correspond to the "first direction" and the "horizontal direction substantially orthogonal to the first direction" of the present invention, respectively. .. Further, the first detection unit and the second detection unit correspond to an example of the "detection unit" of the present invention. Further, the straightening block 31 corresponds to an example of the "correcting member" of the present invention. The moving unit 35 corresponds to an example of the “evacuation unit” of the present invention. The pit 13 corresponds to an example of the "recess" of the present invention. The slit nozzle 4 corresponds to an example of the "nozzle" of the present invention.

なお、本発明は上記した実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて上述したもの以外に種々の変更を行うことが可能である。例えば上記実施形態では、異物検出するために２種類の検出部６、７を設けているが、いずれか一方のみを設けるように構成してもよい。 The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above embodiment, two types of detection units 6 and 7 are provided for detecting foreign matter, but only one of them may be provided.

また、上記実施形態では、２種類の検出部６、７をスリットノズル４およびノズル支持体５１と一体的にＸ方向に移動するように構成されているが、一体的に移動させることは必須要件ではなく、例えば第２検出部７をスリットノズル４およびノズル支持体５１から独立してＸ方向に移動して塗布処理前に異物検出を行うように構成してもよい。 Further, in the above embodiment, the two types of detection units 6 and 7 are configured to move integrally with the slit nozzle 4 and the nozzle support 51 in the X direction, but it is an essential requirement to move them integrally. Instead, for example, the second detection unit 7 may be configured to move in the X direction independently of the slit nozzle 4 and the nozzle support 51 to detect foreign matter before the coating process.

また、上記実施形態では、ステージ１の上面１１にピット１３を設け、当該ピット１３の内部空間が矯正ブロック３１を退避させる退避空間として用いられているが、例えば特許文献１に記載の装置においては基台の上にステージが固定されている塗布装置では、次のように構成して退避空間を確保してもよい。例えばステージの厚みが上記実施形態におけるピット１３の深さと同程度である場合には、本発明の退避部として機能する移動部３５をステージに隣接させながら基台上に設け、矯正ブロックをステージの側端面と隣接するように移動させることで矯正ブロックを高さ位置Ｈ４よりも低い位置に位置決めしてもよい。また、ステージがピット１３の深さよりも薄い場合には、基台の上面のうちステージに隣接する領域にピットを設け、当該ピットに矯正ブロックを移動させることで矯正ブロックを高さ位置Ｈ４よりも低い位置に位置決めしてもよい。 Further, in the above embodiment, the pit 13 is provided on the upper surface 11 of the stage 1, and the internal space of the pit 13 is used as an evacuation space for retracting the correction block 31, but in the apparatus described in Patent Document 1, for example. In the coating device in which the stage is fixed on the base, the evacuation space may be secured by the following configuration. For example, when the thickness of the stage is about the same as the depth of the pit 13 in the above embodiment, the moving portion 35 functioning as the retracting portion of the present invention is provided on the base while being adjacent to the stage, and the straightening block is provided on the stage. The straightening block may be positioned lower than the height position H4 by moving it so as to be adjacent to the side end surface. When the stage is thinner than the depth of the pit 13, a pit is provided in the area of the upper surface of the base adjacent to the stage, and the straightening block is moved to the pit to move the straightening block from the height position H4. It may be positioned at a lower position.

また、上記実施形態では、塗布処理前に矯正ブロック３１を高さ位置Ｈ４よりも低い位置に退避させているが、さらに低い位置、例えばステージ１の上面１１よりも低い位置に矯正ブロック３１を退避させるように構成してもよい。これによって、例えば第２検出部７を構成する検出センサ７１、７２をステージ１の上面１１の直上位置に配設することができ、装置の設計自由度を高めることができる。 Further, in the above embodiment, the straightening block 31 is retracted to a position lower than the height position H4 before the coating process, but the straightening block 31 is retracted to a lower position, for example, a position lower than the upper surface 11 of the stage 1. It may be configured to cause. As a result, for example, the detection sensors 71 and 72 constituting the second detection unit 7 can be arranged at a position directly above the upper surface 11 of the stage 1, and the degree of freedom in designing the device can be increased.

さらに、上記実施形態では、本発明を塗布装置１００に適用しているが、本発明の適用範囲はこれに限定されるものではなく、基板を矯正ブロックで矯正した後で基板を保持して基板の上面に対して所定の処理を施す基板処理装置も本発明の適用対象に含まれる。例えばスリットノズルの代わりに印刷ヘッドや露光ヘッドなどを（＋Ｘ）方向に移動させながらステージ１に保持された基板Ｓの上面Ｓａに対して印刷処理や露光処理を施す基板処理装置に対して本発明を適用することができる。 Further, in the above embodiment, the present invention is applied to the coating device 100, but the scope of application of the present invention is not limited to this, and the substrate is held and held after the substrate is straightened with a straightening block. A substrate processing apparatus that performs a predetermined treatment on the upper surface of the above is also included in the application object of the present invention. For example, the present invention relates to a substrate processing apparatus that performs printing processing or exposure processing on the upper surface Sa of the substrate S held on the stage 1 while moving the print head, the exposure head, or the like in the (+ X) direction instead of the slit nozzle. Can be applied.

この発明は、基板を矯正部材で矯正した後で基板を保持して所定の処理を施す基板処理技術全般に好適に適用することができる。 The present invention can be suitably applied to a general substrate processing technique in which a substrate is straightened with a straightening member and then the substrate is held and a predetermined treatment is performed.

１…ステージ
３…矯正機構
４…スリットノズル
６…第１検出部
６１…バンパー部材
７…第２検出部
７１，７２…検出センサ
１１…（ステージの）上面
１１ａ…載置領域
１１ｂ…側端面
１３…ピット（凹部）
３１…矯正ブロック
３５…移動部（退避部）
３８…エア層形成部
３９…エア層
５１…ノズル支持体（移動体）
１００…塗布装置
３４１…接触部材
Ｈ１，Ｈ２，Ｈ３，Ｈ４…高さ位置
Ｓ…基板
Ｓａ…（基板の）上面
Ｘ…第一方向
Ｙ…水平方向
1 ... Stage 3 ... Correction mechanism 4 ... Slit nozzle 6 ... First detection unit 61 ... Bumper member 7 ... Second detection unit 71, 72 ... Detection sensor 11 ... Top surface (of stage) 11a ... Mounting area 11b ... Side end surface 13 … Pit (recess)
31 ... Straightening block 35 ... Moving part (evacuation part)
38 ... Air layer forming portion 39 ... Air layer 51 ... Nozzle support (moving body)
100 ... Coating device 341 ... Contact members H1, H2, H3, H4 ... Height position S ... Substrate Sa ... Top surface (of substrate) X ... First direction Y ... Horizontal direction

Claims (6)

基板が載置される載置領域が上面に設けられ、前記載置領域に載置された前記基板を保持するステージと、
前記ステージの前記上面に沿った第一方向に移動する移動体と、
前記第一方向への前記移動体の移動とともに前記第一方向に移動しながら前記ステージに保持された前記基板の上面の表面状態を検出する検出部と、
前記ステージによる前記基板の保持前に、前記載置領域に載置された前記基板の上面周辺部の上方位置に位置して前記上面周辺部を前記ステージ側に押し付けて矯正する矯正部材と、
前記矯正部材による矯正を受けた前記基板が前記ステージに保持された後で、かつ前記検出部の移動が開始される前に、前記ステージに保持された前記基板の上面の高さ位置よりも低い位置に前記矯正部材を退避させる退避部と、
を備えることを特徴とする基板処理装置。 A mounting area on which the substrate is mounted is provided on the upper surface, and a stage for holding the substrate mounted on the previously described mounting area
A moving body that moves in the first direction along the upper surface of the stage,
A detection unit that detects the surface state of the upper surface of the substrate held on the stage while moving in the first direction along with the movement of the moving body in the first direction.
Before the stage holds the substrate, a straightening member that is located above the upper surface peripheral portion of the substrate placed in the above-mentioned placement region and presses the upper surface peripheral portion against the stage side to correct the substrate.
It is lower than the height position of the upper surface of the substrate held by the stage after the substrate straightened by the straightening member is held by the stage and before the movement of the detection unit is started. A retracting part that retracts the straightening member to the position,
A substrate processing apparatus comprising. 請求項１に記載の基板処理装置であって、
前記ステージでは、前記載置領域と前記ステージの側端面との間で前記ステージの上面から下方に掘り下げられた凹部が設けられ、
前記退避部は前記矯正部材を前記凹部に移動させることで前記矯正部材を前記高さ位置よりも低い位置に位置決めする基板処理装置。 The substrate processing apparatus according to claim 1.
In the stage, a recess is provided between the previously described placement area and the side end surface of the stage, which is dug downward from the upper surface of the stage.
The retracting portion is a substrate processing device that positions the straightening member at a position lower than the height position by moving the straightening member to the recess. 請求項１に記載の基板処理装置であって、
前記退避部は前記矯正部材を前記ステージの側端面と隣接するように移動させることで前記矯正部材を前記高さ位置よりも低い位置に位置決めする基板処理装置。 The substrate processing apparatus according to claim 1.
The retracting portion is a substrate processing device that positions the straightening member at a position lower than the height position by moving the straightening member so as to be adjacent to the side end surface of the stage. 請求項１ないし３のいずれか一項に記載の基板処理装置であって、
前記退避部は前記矯正部材を前記ステージの上面よりも低い位置に前記矯正部材を退避させる基板処理装置。 The substrate processing apparatus according to any one of claims 1 to 3.
The retracting portion is a substrate processing device that retracts the straightening member to a position lower than the upper surface of the stage. 請求項１ないし４のいずれか一項に記載の基板処理装置であって、
前記ステージに保持された前記基板に向けて処理液を吐出するスリット状の吐出口を有するノズルをさらに備え、
前記移動体は、前記載置領域を跨ぐ架橋構造を有し、前記吐出口が前記第一方向と略直交する水平方向に沿うように前記ノズルを固定保持する保持部を有し、前記吐出口から前記処理液を吐出する前記ノズルを前記保持部で保持して前記第一方向に移動可能となっており、
前記検出部は、前記ノズルの移動前方側で前記ノズルの移動中に前記ノズルと干渉する前記基板上の対象物を検出する基板処理装置。 The substrate processing apparatus according to any one of claims 1 to 4.
Further provided with a nozzle having a slit-shaped discharge port for discharging the processing liquid toward the substrate held on the stage.
The moving body has a cross-linked structure straddling the above-mentioned pre-described region, has a holding portion for fixing and holding the nozzle so that the discharge port is along a horizontal direction substantially orthogonal to the first direction, and the discharge port. The nozzle for discharging the treatment liquid from the body is held by the holding portion and can be moved in the first direction.
The detection unit is a substrate processing device that detects an object on the substrate that interferes with the nozzle while the nozzle is moving on the front side of the movement of the nozzle. ステージの上面に設けられた載置領域に載置された基板の上面周辺部の上方位置に矯正部材を移動させ、前記上面周辺部を前記ステージ側に押し付けて矯正する工程と、
前記矯正部材による矯正を受けた前記基板を前記ステージで保持する工程と、
前記ステージに保持された前記基板の上方から前記基板の上面の高さ位置よりも低い位置に前記矯正部材を退避させる工程と、
前記矯正部材が前記高さ位置よりも低い位置に位置している間に、移動体を前記ステージの前記上面に沿った第一方向に移動させるとともに検出部を前記第一方向に移動させながら前記ステージに保持された前記基板の上面の表面状態を検出する工程と、
を備えることを特徴とする基板処理方法。 A step of moving the straightening member to a position above the upper surface peripheral portion of the substrate mounted on the mounting area provided on the upper surface of the stage and pressing the upper surface peripheral portion against the stage side for straightening.
A step of holding the substrate straightened by the straightening member on the stage, and
A step of retracting the straightening member from above the substrate held on the stage to a position lower than the height position of the upper surface of the substrate.
While the straightening member is located at a position lower than the height position, the moving body is moved in the first direction along the upper surface of the stage and the detection unit is moved in the first direction. A step of detecting the surface state of the upper surface of the substrate held on the stage and
A substrate processing method comprising.
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