JPH10231025A - Tray transfer device for parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tray transfer device for parts capable of dissolving/ reducing errors in height and position resulting from warping of part trays when stacked. SOLUTION: A tray transfer device for parts has a pushup plate 6 formed with a base 6a and a plate 6b elastically supported on the base 6a, an elevating means 7 to elevate/lower the pushup plate 6, a guide mechanism 8 to guide part trays 9a, 9b, 9c to be supplied in stack onto and removed from the elastically supported plate 6b of the pushup plate 6 elevated by the elevating means 7, thrusting mechanisms 10a, 10b to thrust and remedy the upper faces of the part trays 9a, 9b, 9c supplied in layer onto the pushup plate 6 and detecting means 11a, 11b to detect the upper faces of the part trays 9a, 9b, 9c remedied from warping and deformation with thrusting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component tray transfer device, and more particularly, to a device for automatically transferring a component tray to a predetermined height and position when stacking component trays in multiple stages. The present invention relates to a component tray transfer device that can be secured.

[0002]

2. Description of the Related Art For example, in a manufacturing process such as lead molding of a semiconductor device, a method is adopted in which a semiconductor device conveyed through an automatic conveyance system is subjected to predetermined processing and then sequentially stored in a component tray. That is, an empty component tray in which component trays are stacked in multiple stages and a component tray transfer device are set at a position close to a predetermined automatic conveyance system, and the empty component tray is set in the transfer device. Transfer to the storage position. Then, the semiconductor device that has been subjected to the predetermined processing is stored in the component tray by the automatic transfer system, and a predetermined number of semiconductor devices are stored. After that, an empty component tray is newly stacked on the component tray storing the semiconductor device by the transfer device, and the processed semiconductor device is
The operation of storing the newly stacked empty component trays is repeated.

FIG. 5 is an exploded perspective view showing a main part of a conventional component tray transfer apparatus. In FIG. 5, reference numeral 1 denotes a lifting plate, 2 denotes a lifting means (for example, an elevator) for raising and lowering the lifting plate 1, and 3 denotes a component tray 4a, 4b, 4c on the lifting plate 1 which is raised and lowered by the lifting means 2. The guide mechanism guides multi-stage supply / removal of. 5a and 5b are detecting means (for example, optical sensors) for detecting the upper surface position of the component trays 4a, 4b, 4c,.
It is. The supply and removal of the component trays 4a, 4b, 4c,... Are performed separately by a transfer device (not shown).

Here, detecting means 5a for detecting the position of the upper surface,
5b, when the component trays 4a, 4b, 4c,...
When the position of the upper surface of the uppermost component tray 4a is detected, the lifting drive of the lifting / lowering means 2 is stopped. That is, the upper surface position of the uppermost component tray 4a raised by the lifting / lowering means 2 is set to a certain height / position with respect to the height / position where the next process is performed, and the automatic / continuous transfer is performed. The loading can be performed reliably and accurately.

[0005]

However, in the case of the component tray transfer device configured as described above, the following inconveniences are often recognized. That is, the component trays 4a, 4b, 4c
Are generally warped or the like and the accuracy of flatness is likely to be reduced on a plate made of resin having a thickness of about 7 mm. Therefore, when stacked in multiple stages, for example, as shown schematically in FIG. ,
The position of the upper surface of the uppermost component tray 4a may not be accurately detected. The height or position error, depending on the degree, varies the housing position of the semiconductor device and causes bending of the lead of the semiconductor device (for example, a semiconductor package). As a result, productivity and yield are reduced. This leads to a reduction in the operating rate of the semiconductor device manufacturing line.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a component tray transfer device which can eliminate or reduce height and position errors caused by warpage of component trays when stacked in multiple stages. For the purpose of providing.

[0007]

According to the first aspect of the present invention, there is provided a push-up plate comprising a base and a plate resiliently supported on the base, lifting means for raising and lowering the push-up plate, A guide mechanism for guiding the multi-stage supply / removal of the component tray onto the resiliently supported upper part of the lifting plate, and pressing the upper surface of the component tray supplied / stacked on the lifting plate. A component tray transfer device comprising: a pressing mechanism for correcting the component; and a detecting means for detecting a position of the upper surface of the component tray that has been warped and deformed by the pressing.

According to a second aspect of the present invention, in the component tray transfer apparatus according to the first aspect, the resilient support of the push-up plate is set to be displaced by a pressing load smaller than the driving force of the lifting / lowering means. It is characterized by the following.

According to a third aspect of the present invention, in the component tray transfer device according to the first or second aspect, the pressing mechanism is stacked on the push-up plate and is larger than the load of the component tray, and the driving force of the lifting / lowering means. It is characterized in that it is set to operate downward with a smaller force.

According to the present invention, in a component tray transfer apparatus in which component trays are stacked in multiple stages, the component trays that are stacked in multiple stages can be easily pressed and pressed without damaging the component trays. The main point is that the height and position of the uppermost surface are accurately set by flattening the surface by the correction action by the absorption of the surface.

That is, while the component trays to be stacked are pressed to correct them to flattening, the above-mentioned pressing and local displacements caused by the pressing are absorbed by the resilience at the lowermost stage. The occurrence of errors such as predetermined positions and heights can be reduced or eliminated by eliminating the influence of warpage of the component tray and the like.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1, FIG. 2 (a), (b), FIG.
An embodiment will be described with reference to FIGS. 4 (a) and 4 (b).

FIG. 1 is a perspective view showing a first configuration example of a component tray transfer device. In FIG. 1, reference numeral 6 denotes a push-up plate composed of a base 6a and a plate 6b resiliently supported on the base 6a. Reference numeral 7 denotes an elevating means for raising and lowering the push-up plate 6, for example, an elevator mechanism. Here, the resilient support of the plate 6b with respect to the base 6a adopts, for example, a configuration in which a compression spring is interposed between the upper surface of the base 6a and the lower surface of the plate 6b, so that the plate can be freely displaced in the vertical direction. ing.

A guide 8 guides the multi-stage supply and removal of component trays 9a, 9b, 9c,... Onto a resiliently supported plate 6b of a push-up plate 6 which is raised and lowered by the elevator mechanism 7. Mechanism. Here, the supply and stacking of the component trays 9a, 9b, 9c... May be performed at a position adjacent to the push-up plate 6, or the component trays 9a, 9b,
It may be performed at a remote location such as the storage location of 9c ...

Further, 10a and 10b are the push-up plates 6
A pressing mechanism that presses and corrects the uppermost surface of the component trays 9a, 9b, 9c... Supplied and stacked above, and 11a and 11b are component trays that are warped and deformed by the pressing of the pressing mechanisms 10a and 10b. Detecting means for detecting the uppermost position of 9a, 9b, 9c..., For example, a pair of optical sensors arranged to face each other. Here, the pressing mechanisms 10a and 10b press the uppermost surfaces of the component trays 9a, 9b, 9c... While moving up and down along the side surfaces of the stacked component trays 9a, 9b, 9c. It can be configured.

Next, the operation of the component tray transfer device having the above configuration will be described.

The push-up plate 6 to which necessary electronic components, for example, component trays 9a, 9b, 9c,. The lifting of the lifting plate 6 stops when the uppermost surface of the stacked component trays 9a, 9b, 9c,... Is detected by the detecting means 11a, 11b. FIG.
(a) schematically shows this state. When the uppermost component tray 9a is warped, the uppermost surface is detected by detecting the position of the upper end of the warpage. That is, the uppermost surface of the stacked component trays 9a, 9b, 9c ...
Positioning is performed without a predetermined position being determined.

In order to prevent the occurrence of a positioning error of the uppermost surface, the stacked component trays 9a, 9b, 9c
The pressing mechanisms 10a, 10b move down along the side surfaces of the... To press the uppermost surfaces of the component trays 9a, 9b, 9c,. By pressing the uppermost surface, deformation such as warpage is corrected, and the position of the uppermost surface is detected and located. This part tray 9a, 9
Of the pressing forces applied to correct deformations such as warpage of b, 9c, etc., the excess pressing force is generated by a compression spring that resiliently supports the plate 6b with respect to the base 6a forming the lifting plate 6. Absorbed by 6c.

FIG. 2 (b) schematically shows this state, in which the component trays 9a, 9b, 9c,.
Can always maintain a predetermined height and position in a state where deformation such as warpage has been corrected and there is no risk of occurrence of breakage or the like.

FIG. 3 is a perspective view showing a second configuration example of the component tray transfer device. In FIG. 3, reference numeral 6 denotes a push-up plate composed of a base 6a and a plate 6b resiliently supported on the base 6a. Reference numeral 7 denotes an elevating means for raising and lowering the push-up plate 6, for example, an elevator mechanism. Here, the resilient support of the plate 6b with respect to the base 6a employs, for example, a configuration in which a compression spring 6c is interposed between the upper surface of the base 6a and the lower surface of the plate 6b so that the plate can be freely displaced in the vertical direction. Made up of On the other hand, the elevator mechanism 7 is configured to be able to stop driving by a timer.

A guide 8 guides the multi-stage supply and removal of component trays 9a, 9b, 9c,... Onto a resiliently supported plate 7b of a push-up plate 6 which is raised and lowered by the elevator mechanism 7. Mechanism. The multi-stage supply and stacking of the component trays 9a, 9b, 9c... On the push-up plate 6 is performed by a separate transfer device.

Further, reference numeral 10 denotes a pressing mechanism for pressing and correcting the uppermost surface of the component trays 9a, 9b, 9c... Supplied and stacked on the lifting plate 6, and 11a and 11b denote the pressing mechanism 12
Component tray 9 that has been warped and deformed by pressing
a, 9b, 9c,..., for example, a pair of optical sensors arranged to face each other. Here, the pressing plate 10 is a stack of component trays 9a,
9b, 9c ... installed on the top side, component trays 9a, 9b, 9c ...
And the uppermost surface can be pressed.

Next, the operation of the second component tray transfer device having the above configuration will be described.

The push-up plate 6 which supplies and stacks required electronic components, for example, component trays 9a, 9b, 9c... When the uppermost surfaces of the stacked component trays 9a, 9b, 9c,... Are detected by the detecting means 11a, 11b, a timer is activated, and the lifting of the push-up plate 6 is stopped after a lapse of a set time.

FIG. 4 (a) schematically shows this state. When the uppermost component tray 9a is warped, the position is detected at the upper end of the warp. Works and stops after a predetermined time has elapsed. That is,
The uppermost component tray 9a keeps rising by the timer of the elevator mechanism 7 and contacts the pressing plate 10 to press the uppermost surfaces of the component trays 9a, 9b, 9c.

By pressing the uppermost surface, deformation such as warpage is corrected, and the position of the uppermost surface is detected and located.
Of the pressing forces applied to correct deformations such as warpage of the component trays 9a, 9b, 9c, etc., the extra pressing force repels the plate 6b against the base 6a forming the lifting plate 6. It is absorbed by the compression spring 6c, which is locally supported. FIG. 4 (b) schematically shows this state, in which the stacked component trays 9a, 9b, 9c... It is possible to always maintain a predetermined height and position without fear of occurrence.

The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the invention. For example, the elastic support in the push-up plate may be an elastic body such as rubber instead of the compression spring.

[0028]

According to the first to third aspects of the present invention, the upper surfaces of the component trays to be stacked are pressed to correct the flatness, while the pressing and the local displacement caused by the pressing are reduced to the lowermost side. By absorbing by the elasticity of the
It is possible to reduce or eliminate the occurrence of errors such as predetermined positions and heights by eliminating the influence of warpage of the component tray. Therefore, it is possible to always automatically take out and supply parts with high accuracy, so that it is possible to easily improve productivity, yield, and operation rate.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main configuration of a first component tray transfer device.

FIGS. 2A and 2B are explanatory views schematically showing the operation of a first component tray transfer device.

FIG. 3 is a perspective view showing a configuration of a main part of a second component tray transfer device.

FIGS. 4A and 4B are explanatory views schematically showing the operation of a second component tray transfer device.

FIG. 5 is a perspective view showing a main part configuration of a conventional component tray transfer device.

FIG. 6 is an explanatory view schematically showing the operation of a conventional component tray transfer device.

[Explanation of symbols]

 1, 6 push-up plate 2, 7 elevating means (elevator mechanism) 3, 8 guide mechanism 4a, 4b, 4c, 9a, 9b, 9c ... component trays 5a, 5b, 11a, 11b ... Upper surface position detecting means 6a Base 6b Resiliently supported plate 6c Compression spring 10 Pressing plates 10a, 10b Pressing mechanism

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Fukuoka Dai 25-1 Ekimae Honcho, Kawasaki-ku, Kawasaki-shi, Kanagawa Prefecture Toshiba Microelectronics Corporation

Claims (3)

[Claims] 1. A lifting plate comprising a base and a plate resiliently supported on the base, lifting means for raising and lowering the lifting plate, and resiliently supporting the lifting plate to be raised and lowered A guide mechanism for guiding the multi-stage supply / removal of the component tray onto the pressed plate, a pressing mechanism for supplying / stacking on the push-up plate and pressing / correcting the upper surface of the component tray, and warping by the pressing. Detecting means for detecting the upper surface position of the component tray whose deformation has been corrected. 2. The component tray transfer device according to claim 1, wherein the resilient support of the lifting plate is set to be displaced by a pressing load smaller than the driving force of the lifting / lowering means. 3. The pressing mechanism according to claim 1, wherein the pressing mechanism is stacked on the push-up plate and is operated so as to operate downward with a force larger than the load of the component tray and smaller than the driving force of the lifting / lowering means. The component tray transfer device according to claim 1 or 2.