JP2007250851A - Apparatus, system, and method for substrate treatment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently inspect an object which is likely to interfere with a slit nozzle. <P>SOLUTION: A substrate treatment apparatus 1 which discharges a resist liquid from the slit nozzle 41 is provided with a detection sensor 45 and an imaging portion 6. An object which is likely to interfere with the slit nozzle 41 is detected by the detection sensor 45, and the position in the X-axis direction of the object is identified as a detected position from the position in the X-axis direction of the detection sensor 45 when the object was detected by the detection sensor 45. Based on the identified detected position, the imaging portion 6 is moved in the X-axis direction. Furthermore, while moving a camera 63 in the Y-axis direction, a detection region including the object is photographed by the camera 63 to acquire image data for inspection. By displaying the acquired image data for inspection, the detected object is inspected. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technique for efficiently inspecting an object that may interfere with a long nozzle.

  2. Description of the Related Art A slit coater (substrate processing apparatus) that applies a processing liquid such as a resist solution with a long slit nozzle is known as an apparatus used in a substrate manufacturing process. The slit coater moves the slit nozzle close to the substrate in the coating operation. Therefore, for example, when an object such as a foreign object exists on the substrate, the object and the slit nozzle interfere with each other, and a failure such as a coating failure or a breakage of the slit nozzle occurs.

  Therefore, in the slit coater, a technique for detecting an object that may interfere with the slit nozzle has been proposed. For example, Patent Document 1 discloses a slit coater using such a technique.

JP 2005-085773 A

  However, although the technique described in Patent Document 1 can detect an object that may interfere with the slit nozzle, there is a problem that the position of the detected object cannot be specified.

  When some kind of object is detected, it may be possible to inspect the detected object. However, in the technique described in Patent Document 1, the position of the object must be detected again, and almost the same process as the process of detecting the object must be repeated. That is, the technique described in Patent Document 1 has a problem that efficient inspection processing cannot be executed.

  The present invention has been made in view of the above problems, and an object thereof is to efficiently inspect an object that may interfere with a long nozzle.

  In order to solve the above problems, the invention of claim 1 is a substrate processing apparatus for processing a substrate, wherein a long nozzle that discharges a processing liquid from a discharge portion facing the substrate toward the substrate, and the long length A nozzle moving unit that relatively moves the long nozzle and the substrate in a scanning direction when the nozzle discharges a processing liquid; and a detection region, and the nozzle moving unit moves the long nozzle when the nozzle moving unit moves the long nozzle. Detecting means for detecting an object that may interfere with the scale nozzle as an interference object; and imaging means for acquiring image data for inspection by imaging so as to include a detection region when the detecting means detects the object; It is characterized by providing.

  Further, the invention of claim 2 is the substrate processing apparatus according to the invention of claim 1, wherein the imaging range and the detection region are such that the imaging range of the imaging unit includes the detection region of the detection unit. The positional relationship is fixed.

  The invention of claim 3 is the substrate processing apparatus according to the invention of claim 1, further comprising position specifying means for specifying a detection position in the scanning direction of the interference detected by the detection means, The image pickup means picks up an image at the detection position specified by the position specifying means.

  According to a fourth aspect of the present invention, there is provided the substrate processing apparatus according to any one of the first to third aspects, wherein the imaging means moves a camera for imaging a predetermined range and the camera in the width direction. And moving the camera in the width direction by the camera moving unit, and sequentially imaging the entire imaging region.

  The invention of claim 5 is the substrate processing apparatus according to any one of claims 1 to 3, wherein the imaging means includes a plurality of cameras each imaging a predetermined range, The area imaged by the camera includes the entire imaging area.

  A sixth aspect of the present invention is the substrate processing apparatus according to any one of the first to fifth aspects, wherein the nozzle moving means integrally connects the imaging means and the long nozzle in the scanning direction. It is made to move to.

  A seventh aspect of the present invention is the substrate processing apparatus according to any one of the first to fifth aspects of the present invention, wherein the movement of moving the imaging means in the scanning direction is independent of the long nozzle. The apparatus further comprises means.

  The invention according to claim 8 is the substrate processing apparatus according to any one of claims 1 to 7, further comprising display means for displaying an image based on image data for inspection imaged by the imaging means. It is further provided with the feature.

  The invention according to claim 9 is the substrate processing apparatus according to any one of claims 1 to 8, wherein the inspection is performed on the object based on the image data for inspection imaged by the imaging means. The apparatus further comprises means.

  A tenth aspect of the present invention is the substrate processing apparatus according to any one of the first to ninth aspects, wherein the imaging region includes a surface of the substrate when an interference is detected by the detection means. It is set as follows.

  An eleventh aspect of the present invention is the substrate processing apparatus according to any one of the first to tenth aspects of the present invention, further comprising a stage for holding the substrate, wherein the imaging region includes a surface of the stage. It is characterized by being set.

  The invention of claim 12 is a substrate processing system for processing a substrate, comprising: a coating apparatus that applies a processing liquid to the substrate; and an inspection apparatus that is connected to the coating apparatus via a network; The apparatus includes a long nozzle that discharges a processing liquid from a discharge unit facing the substrate toward the substrate, and relatively moves the long nozzle and the substrate in a scanning direction when the long nozzle discharges the processing liquid. Nozzle moving means, detecting means for detecting an object that may interfere with the long nozzle when the nozzle moving means moves the long nozzle, and an interference detected by the detecting means A position specifying means for specifying a detection position in the scanning direction, and a transmission means for transmitting the detection position specified by the position specifying means to the inspection apparatus. A receiving means for receiving the detection position transmitted by the transmitting means, and an image for inspection at the detection position received by the receiving means by imaging the surface of the substrate when an interference is detected by the detecting means. An image pickup means for acquiring image data is provided.

  The invention according to claim 13 is a substrate processing method for processing a substrate, wherein the long nozzle and the substrate are relatively moved in the scanning direction while discharging the processing liquid from the discharge portion of the long nozzle toward the substrate. A detecting step for detecting an object that may interfere with the long nozzle in the applying step as an interference from the detection region, and a detection region when the interference is detected in the detection step. And an imaging step of acquiring image data for inspection by imaging as described above.

  The invention of claim 14 is the substrate processing method according to the invention of claim 13, wherein the imaging step includes a substrate imaging step of imaging the surface of the substrate, and a stage imaging step of imaging the stage holding the substrate. It is characterized by providing.

  According to the invention described in claims 1 to 11 and 13 and 14, an image is acquired so as to include a detection region when the detection means detects an object, and the image data for inspection is acquired to interfere with the long nozzle. When a possible object is detected, image data for inspection can be obtained.

  In the invention according to claim 2, the detecting means detects the interference object because the positional relationship between the imaging range and the detection area is fixed so that the imaging range of the imaging means includes the detection area of the detection means. Sometimes it is not necessary to move the imaging means.

  In the invention according to claim 4, the entire imaging range can be captured by one small camera by sequentially capturing the entire imaging range while moving in the width direction by the camera moving unit.

  According to the fifth aspect of the present invention, since the region captured by the plurality of cameras includes the entire imaging range, the entire imaging range can be imaged at a time, so the imaging time is shortened.

  According to the sixth aspect of the present invention, the nozzle moving means can be used as the nozzle moving means by integrally moving the imaging means and the long nozzle in the scanning direction, so that the cost of the apparatus can be suppressed.

  According to the eighth aspect of the present invention, the detection region can be visually confirmed by the operator by further including display means for displaying an image based on the image data for inspection imaged by the imaging means.

  According to the ninth aspect of the present invention, an inspection unit that inspects an object based on the image data for inspection imaged by the imaging unit is further provided, so that an automatic inspection can be performed without an inspection by the operator.

  In the invention described in claim 10, the imaging range can be set so as to include the surface of the substrate when the interference is detected by the detecting means, whereby the substrate can be inspected.

  In the invention described in claim 11, the stage can be inspected by setting the imaging range so as to include the surface of the stage.

  In the invention described in claim 12, the coating apparatus transmits a position specifying means for specifying the detection position in the scanning direction of the interference detected by the detecting means, and transmits the detection position specified by the position specifying means to the inspection apparatus. The inspection apparatus includes a receiving unit that receives the detection position transmitted by the transmitting unit, and a surface of the substrate when an interference is detected by the detecting unit at the detection position received by the receiving unit. By providing imaging means for acquiring image data for inspection by imaging, the function of detecting the position of the object in the inspection apparatus is unnecessary.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.

<1. First Embodiment>
FIG. 1 is a front view showing a substrate processing apparatus 1 according to the present invention. FIG. 2 is a partial plan view of the substrate processing apparatus 1. Further, FIG. 3 is an enlarged view of a peripheral portion of the detection sensor 45 in the substrate processing apparatus 1.

  In FIG. 1, for the sake of illustration and explanation, the Z-axis direction is defined as the vertical direction and the XY plane is defined as the horizontal plane, but these are defined for convenience in order to grasp the positional relationship. The directions described below are not limited. The same applies to the following figures.

  The substrate processing apparatus 1 uses a rectangular glass substrate for manufacturing a screen panel of a liquid crystal display device as a substrate 90 to be processed. In the process of selectively etching an electrode layer or the like formed on the surface of the substrate 90, the substrate 90 is processed. It is comprised as a coating device which apply | coats a resist liquid to the surface of this. Therefore, in this embodiment, the slit nozzle 41, which is a long nozzle, discharges the resist solution to the substrate 90. In addition, the substrate processing apparatus 1 can be modified and used not only as a glass substrate for a liquid crystal display device but also as a device for applying a processing liquid (chemical solution) to various substrates for a flat panel display.

  For example, when the slit nozzle 41 discharges the resist solution, the slit nozzle 41 comes close to the substrate 90 in the substrate processing apparatus 1. At this time, if foreign matter exists on the substrate 90, the slit nozzle 41 and the foreign matter may interfere with each other, and the slit nozzle 41 and the substrate 90 may be damaged.

  Therefore, the substrate processing apparatus 1 detects an object that may interfere with the slit nozzle 41 when the slit nozzle 41 is moved (hereinafter referred to as an “interfering object”), and detects the relationship between the slit nozzle 41 and the interference object. It is necessary to avoid collisions in advance.

  In addition, since the interference object is an object that may interfere with the slit nozzle 41, it does not necessarily interfere with the slit nozzle 41. Further, the interference object is not limited to foreign substances such as particles, and the substrate 90 itself may be an interference object.

  The substrate processing apparatus 1 includes a stage 3 that functions as a holding table for placing and holding the substrate to be processed 90 and also functions as a base for each attached mechanism. The stage 3 is made of an integral stone having a rectangular parallelepiped shape, and its upper surface (holding surface 30) and side surfaces are processed into flat surfaces.

  The upper surface of the stage 3 is a horizontal plane and serves as a holding surface 30 for the substrate 90. A large number of vacuum suction ports (not shown) are distributed and formed on the holding surface 30. The vacuum suction port holds the substrate 90 in a predetermined horizontal position by sucking the substrate 90 while processing the substrate 90 in the substrate processing apparatus 1.

  Above the stage 3, a bridging structure 4 is provided that extends substantially horizontally from both sides of the stage 3. The bridging structure 4 is mainly composed of a nozzle support portion 40 using carbon fiber resin as an aggregate, lifting mechanisms 43 and 44 that support both ends thereof, and a nozzle moving mechanism 5.

  A slit nozzle 41 and a gap sensor 42 are attached to the nozzle support portion 40.

  The slit nozzle 41 extending in the horizontal Y-axis direction is connected to a discharge mechanism (not shown) including a pipe for supplying a chemical solution (resist solution) to the slit nozzle 41 and a resist pump. The slit nozzle 41 is supplied with a resist solution by a resist pump and scans the surface of the substrate 90, thereby discharging the resist solution to a predetermined region on the surface of the substrate 90 (hereinafter referred to as “resist application region”). To do.

  The gap sensor 42 is attached to the nozzle support portion 40 of the bridging structure 4 at a position facing the surface of the substrate 90, and is located between a certain direction (−Z direction) and an entity (for example, the substrate 90 and the resist film). The distance (gap) is detected and the detection result is transmitted to the control unit 71.

  Thereby, the control unit 71 can detect the distance between the surface of the substrate 90 and the slit nozzle 41 based on the detection result of the gap sensor 42. The substrate processing apparatus 1 in the present embodiment includes one gap sensor 42. However, the number of gap sensors 42 is not limited to this, and a configuration including a large number of gap sensors 42 may be employed. Good.

  The elevating mechanisms 43 and 44 are divided on both sides of the slit nozzle 41 and are connected to the slit nozzle 41 by the nozzle support portion 40. The elevating mechanisms 43 and 44 are used for moving the slit nozzle 41 in translation and adjusting the posture of the slit nozzle 41 in the YZ plane. In FIG. 1, part of the casings (mainly the front panel) of the lifting mechanisms 43 and 44 are omitted so that the inside can be observed.

  At both ends of the bridging structure 4, nozzle moving mechanisms 5 arranged separately along the edge sides on both sides of the stage 3 are fixed. As shown in FIG. 3, the nozzle moving mechanism 5 mainly includes a pair of AC coreless linear motors (hereinafter simply referred to as “linear motors”) 50 and a pair of linear encoders 51.

  Each linear motor 50 includes a stator and a mover (not shown), and a driving force for moving the bridging structure 4 (slit nozzle 41) in the X-axis direction by electromagnetic interaction between the stator and the mover. Is a motor that generates Further, the moving amount and moving direction of the linear motor 50 can be controlled by a control signal from the control unit 71.

  Thus, the linear motor 50 (nozzle moving mechanism 5) moves the bridging structure 4 in the (−X) direction according to the control signal from the control unit 71 when the slit nozzle 41 discharges the resist solution. Thus, the slit nozzle 41 and the substrate 90 have a function of relatively moving in the scanning direction.

  The linear encoder 51 includes a scale unit and a detector (not shown), detects the relative positional relationship between the scale unit and the detector, and transmits the relative positional relationship to the control unit 71. Each detector is fixed at a predetermined position on both ends of the bridging structure 4. Further, the scale portions are respectively fixed on both sides of the stage 3. Note that the scale section has a position in the X-axis direction with respect to a predetermined reference point (hereinafter referred to as “origin”) of the substrate processing apparatus 1.

  Thereby, the linear encoder 51 can detect the position of the bridging structure 4 with respect to the origin in the X-axis direction and transmit it to the control unit 71. In the substrate processing apparatus 1 according to the present embodiment, the end position of the stage 3 is set as the origin, but the position of the origin is not limited to this. For example, the position that is the end of the substrate 90 held on the stage 3 may be the origin.

  Although details will be described later, a detection sensor 45 is attached to the bridging structure 4 as shown in FIGS. Therefore, the detection of the position of the bridging structure 4 on the X axis by the linear encoder 51 corresponds to the detection of the position of the detection sensor 45 on the X axis. Further, since the substrate processing apparatus 1 in the present embodiment applies the resist solution by moving the slit nozzle 41 in the (−X) direction, the scanning direction (application direction) of the slit nozzle 41 is the (−X) direction. It is. Therefore, detecting the position of the detection sensor 45 on the X axis by the linear encoder 51 is equivalent to specifying the position of the detection sensor 45 in the scanning direction.

  An imaging unit 6 is further attached to the bridging structure 4.

  FIG. 4 is a diagram illustrating a positional relationship between the detection sensor 45 and the imaging unit 6. A thick line 41b shown in FIG. 4 indicates the position of the discharge tip 41a of the slit nozzle 41. Also, the coordinate O indicates the coordinate on the X axis of the end position of the stage 3 (in the present embodiment, the coordinate O is the origin). Further, the coordinate L0 indicates the coordinate on the X axis of the coating start side end portion of the substrate 90, and the coordinate L indicates the coordinate on the X axis of the ejection tip portion 41a (coordinate acquired from the linear encoder 51). Further, the distance d1 indicates the relative distance between the discharge tip 41a and the detection sensor 45, and the distance d2 indicates the relative distance between the discharge tip 41a and the imaging unit 6.

  The detection sensor 45 includes a light projecting unit 46 and a light receiving unit 47, and is disposed at positions facing each other in the Y-axis direction. In the present embodiment, the light projecting unit 46 is fixed to the lifting mechanism 43 side (−Y side), and the light receiving unit 47 is fixed to the lifting mechanism 44 side (+ Y side).

  The light projecting unit 46 irradiates laser light in the (+ Y) direction (that is, in the light receiving unit 47 direction). The light receiving unit 47 receives the laser light emitted from the light projecting unit 46, measures the amount of the received light, and outputs it to the control unit 71.

  That is, the detection sensor 45 has a function as a transmissive laser sensor for detecting an interference in the Y-axis direction. A region irradiated with laser light at a certain moment is a detection region of the detection sensor 45 at that moment.

  Strictly speaking, the control unit 71 detects an interference object based on the output from the light receiving unit 47, but here, the detection principle of the interference object by the detection sensor 45 and the control unit 71 is omitted. Further, in the present embodiment, only one detection sensor 45 is shown, but the number of detection sensors 45 is not limited to one. That is, a plurality of detection sensors 45 may cooperate to detect an interference.

  As described above, the substrate processing apparatus 1 moves the slit nozzle 41 in the (−X) direction when discharging the resist solution from the slit nozzle 41. That is, in the present embodiment, the scanning direction (application direction) of the slit nozzle 41 is the (−X) direction. As apparent from FIGS. 2 and 4, the detection sensor 45 is arranged in the (−X) direction with respect to the slit nozzle 41.

  With such an arrangement structure, the detection sensor 45 moves in the same direction at the same speed as the slit nozzle 41 moves in the (−X) direction. Therefore, scanning (detection) by the detection sensor 45 is performed so as to precede scanning (application) of the slit nozzle 41.

  The relative distance d1 between the detection sensor 45 and the slit nozzle 41 is determined according to the speed at which the slit nozzle 41 moves and the calculation speed of the control unit 71. That is, when the control unit 71 controls the nozzle moving mechanism 5 according to the detection result of the detection sensor 45, the distance between the interference object and the slit nozzle 41 can be sufficiently avoided.

  When the nozzle moving mechanism 5 moves the bridging structure 4 while the light projecting unit 46 is irradiating the laser light, the laser light also moves in the X-axis direction. Here, when the distance that the detection sensor 45 moves in the state where the laser beam is irradiated is “detection movement distance X1”, and the distance between the light projecting unit 46 and the light receiving unit 47 is “detection width Y1”, the detection sensor 45. Scans a region having an area of X1 × Y1 (hereinafter referred to as “detection target region”).

  That is, the detection sensor 45 in the present embodiment instantaneously detects an interference from the detection area, and the detection area moves in the X-axis direction, thereby completing the detection in the detection target area. . In other words, the region where the detection sensor 45 detects the interference is a detection region, but the region where the substrate processing apparatus 1 detects the interference is a detection target region.

  Since the slit nozzle 41 has a structure for discharging a resist solution toward a substrate 90 from a slit (not shown) provided in the discharge tip portion 41a, the discharge tip portion 41a is closest to the substrate 90 of the slit nozzle 41. Formed in position. That is, in the slit nozzle 41, it can be said that the discharge tip portion 41a is most likely to collide with an interferent.

  Further, in the processing in the substrate processing apparatus 1, when the slit nozzle 41 is brought close to the substrate 90 in order to apply the resist solution to the substrate 90, it can be said that the slit nozzle 41 is most likely to collide with an interference substance. .

  For this reason, any object is present in a locus region (hereinafter simply referred to as “trajectory region”) drawn by the discharge tip portion 41a when the slit nozzle 41 is moved in the scanning direction with the slit nozzle 41 being close to the substrate 90. Is present, the slit nozzle 41 collides with the object. Accordingly, when viewed in the Y-axis direction, the detection target area needs to include at least the locus area.

  In the substrate processing apparatus 1, since the slit nozzle 41 does not move in the Y-axis direction, the size of the detection target region in the Y-axis direction (detection width Y1) is at least the size of the ejection tip portion 41a in the Y-axis direction. Longer is better.

  Here, as shown in FIGS. 1 and 2, the light projecting unit 46 and the light receiving unit 47 are arranged separately on both sides of the holding surface 30, so that the detection width Y <b> 1 of the detection sensor 45 is the Y-axis direction of the holding surface 30. Longer than the size of. Therefore, the detection target region is set to be longer than the size of the substrate 90 in the Y-axis direction and cover the substrate 90 held on the holding surface 30.

  On the other hand, the Y-axis direction size of the discharge tip 41 a of the slit nozzle 41 is slightly shorter than the Y-axis direction size of the substrate 90.

  Therefore, by arranging the light projecting unit 46 and the light receiving unit 47 separately on both sides of the holding surface 30, the detection width Y1 is set to the size in the Y-axis direction of the discharge tip 41a of the slit nozzle 41 (thick line 41b shown in FIG. 4). (Length in the Y-axis direction)) or more. That is, with respect to the Y-axis direction, the detection target area is set to include the trajectory area.

  Further, since the detection sensor 45 must detect an object that may interfere with the slit nozzle 41, the detection target area needs to be set at a position closer to the substrate 90 than at least the trajectory area. That is, the detection target region is set with reference to the position of the discharge tip portion 41a when approaching the substrate 90 in order to discharge the resist solution. The position of the detection target region in the Z-axis direction can be arbitrarily set by adjusting the position of the detection sensor 45 in the Z-axis direction.

  As shown in FIG. 2, the imaging unit 6 includes a rotation motor 60, a ball screw 61, a ball nut 62, and a camera 63. Since the imaging unit 6 is fixed to the casings of the lifting mechanisms 43 and 44 and constitutes the bridging structure 4, it moves together with the slit nozzle 41 in the X-axis direction by the nozzle moving mechanism 5. In addition, although illustration is abbreviate | omitted in FIG. 2, the imaging part 6 is provided with the cover member which covers these structures.

  The rotation motor 60 is fixed to the casing of the elevating mechanism 43 and generates a rotational driving force centered on the Y-axis direction in accordance with a control signal from the control unit 71 to rotate the ball screw 61. The ball screw 61 is disposed along the Y-axis direction and is screwed into the ball nut 62. The ball nut 62 is provided with a through hole into which the ball screw 61 is screwed.

  With such a structure, when the imaging unit 6 rotates the rotary motor 60 in accordance with a control signal from the control unit 71, the ball nut 62 moves along the ball screw 61.

  The camera 63 is fixed to the ball nut 62 via a bracket (not shown). Therefore, the camera 63 moves along the Y-axis direction as the rotation motor 60 rotates. The control unit 71 can detect the position of the camera 63 in the Y-axis direction based on the rotation amount of the rotary motor 60.

  The camera 63 has a function as a general digital camera, and images a predetermined range (hereinafter referred to as “imaging range 64”) in accordance with a control signal from the control unit 71. That is, the camera 63 can capture the subject included in the imaging range 64 from the (+ Z) direction by one imaging.

  Although details will be described later, when imaging is started, the camera 63 sequentially performs imaging a plurality of times while moving in the Y-axis direction along the ball screw 61. Thereby, the imaging unit 6 captures the image data (hereinafter referred to as “inspection image data”) obtained by imaging the range in which the imaging range 64 is arranged in the Y-axis direction (hereinafter referred to as “inspection image range 65”). Is transmitted to the control unit 71. That is, the inspection image range 65 is an imaging range of the imaging unit 6 and is a range in which the imaging unit 6 captures an image without moving in the X-axis direction.

  The size of the inspection image range 65 in the Y-axis direction can be arbitrarily set depending on the position of the camera 63 in the Y-axis direction when taking an image. In the substrate processing apparatus 1, since the interference is detected from the detection target region, it is preferable that the inspection image data used for inspecting the detected interference is also captured so as to include the detection target region.

  In the present embodiment, the size of the inspection image range 65 in the Y-axis direction is set to a size equal to the detection width Y1, as shown in FIG. By setting in this way, the position of the inspection image range 65 in the Y-axis direction coincides with the detection target region. However, the inspection image data may include at least an area that the operator desires to inspect (hereinafter referred to as “inspection area 66”).

  In the substrate processing apparatus 1, the operator can arbitrarily set the size of the inspection region 66 in the Y-axis direction. Here, an example in which the size is set slightly larger than the holding surface 30 will be described. In the substrate processing apparatus 1, the interference is detected in order to avoid interference with the slit nozzle 41. Therefore, the size in the width direction (Y-axis direction) orthogonal to the scanning direction of the inspection region 66 needs to be larger than the size of the slit nozzle 41 in the Y-axis direction.

  Returning to FIG. 1, the controller 7 includes a liquid crystal panel display 70 on the front surface and a control unit 71 inside. Although not shown, the controller 7 also includes an operation unit used for inputting an operator's instruction. The controller 7 is connected to each component of the substrate processing apparatus 1 by a cable or the like (not shown).

  The display 70 has a function of displaying various data on the screen in accordance with a control signal from the control unit 71. For example, the display 70 displays a warning message indicating that an interfering object has been detected and inspection image data.

  The control unit 71 processes various data according to a program. The control unit 71 controls each component such as the stage 3, the elevating mechanisms 43 and 44, the nozzle moving mechanism 5, and the imaging unit 6 in accordance with inputs from the gap sensor 42, the detection sensor 45, the linear encoder 51, and the like.

  FIG. 5 is a diagram illustrating functional blocks of the control unit 71. The functional blocks as shown in FIG. 5 can be realized, for example, when an arithmetic device such as a CPU operates according to a program.

  The determination unit 72 determines whether there is an interference object based on the amount of received light output from the detection sensor 45 (light receiving unit 47). For example, the determination unit 72 can determine the presence or absence of an interference by comparing a preset threshold value with the amount of received light. If the determination unit 72 determines that there is an interfering object, the determination unit 72 notifies the position specifying unit 73 and the linear motor control unit 74 to that effect.

  When the position specifying unit 73 receives information indicating that an interfering object exists from the determining unit 72, the position specifying unit 73 determines the position (detected position) where the interfering object is detected based on the coordinates L output from the linear encoder 51. Identify. Further, position data (not shown) is created and stored based on the specified detection position, and is transmitted to the linear motor control unit 74.

  The linear motor control unit 74 controls the linear motor 50 based on the coordinates L output from the linear encoder 51. That is, the linear motor control unit 74 is a functional block that controls the movement of the bridging structure in the X-axis direction.

  Further, when the linear motor control unit 74 receives information indicating that an interference exists from the determination unit 72, the linear motor control unit 74 immediately stops the linear motor 50. Furthermore, when position data is received from the position specifying unit 73, the position of the imaging unit 6 in the X-axis direction is controlled by controlling the linear motor 50 and moving the bridging structure 4 based on the position data. Control.

  The imaging control unit 75 controls the rotation motor 60 and also controls imaging by the camera 63. The imaging control unit 75 controls the position of the camera 63 in the Y-axis direction by transmitting a control signal indicating the rotation direction and the rotation amount to the rotary motor 60. Further, by transmitting a shutter signal to the camera 63, the camera 63 is caused to take an image. The inspection image data captured by the camera 63 is transmitted to the image processing unit 76 and the display 70.

  The image processing unit 76 detects an interference from the inspection image data by performing image processing such as a pattern matching method and a design rule check method on the inspection image data. The image processing unit 76 displays the image processing result (detection result) on the display 70. The detection result may be the detected interference itself, or may be characteristics such as the size and shape of the interference. Further, the determination result of the determination unit 72 may be reflected in this detection result.

  The above is the description of the configuration of the substrate processing apparatus 1 in the present embodiment.

  Next, the operation of the substrate processing apparatus 1 will be described.

  6 and 7 are flowcharts showing the processing operation when a resist solution is applied to the substrate 90 by the substrate processing apparatus 1. In addition, unless otherwise indicated, the operation control of each part shown below is performed by the control part 71.

  In the substrate processing apparatus 1, the substrate 90 is transferred to a predetermined position by an operator or a transfer mechanism (not shown) (step S11). Note that an instruction for the substrate processing apparatus 1 to start processing may be input by the operator operating the operation unit at the time when the transfer of the substrate 90 is completed.

  Although not shown in FIGS. 6 and 7, the substrate processing apparatus 1 performs a preparatory operation before starting the coating operation.

  In the preparatory operation, first, the stage 3 moves the gap sensor 42 to the measurement start position for measuring the gap with the substrate 90 while adsorbing and holding the substrate 90 at a predetermined position on the holding surface 30. This operation is performed by the elevating mechanisms 43 and 44 adjusting the height position of the slit nozzle 41 to the measurement height and the linear motor 50 adjusting the bridging structure 4 in the X-axis direction.

  When the movement of the gap sensor 42 to the measurement start position is completed, the linear motor 50 moves the bridging structure 4 in the (+ X) direction. Accordingly, the gap sensor 42 measures the gap between the surface of the substrate 90 and the slit nozzle 41 in the resist coating region on the surface of the substrate 90 while maintaining a predetermined measurement height. It should be noted that the distance in the Z-axis direction between the slit nozzle 41 and the holding surface 30 at the measurement altitude is such that the slit nozzle 41 does not come into contact with an interfering object while the measurement by the gap sensor 42 is being performed. Sufficiently secured.

  The measurement result of the gap sensor 42 is transmitted to the control unit 71. Then, the control unit 71 stores the transmitted measurement result of the gap sensor 42 in association with the horizontal position (position in the X-axis direction) detected by the linear encoder 51.

  When the control unit 71 determines that the thickness of the substrate 90 is not within the specified range by the measurement by the gap sensor 42, the substrate processing apparatus 1 displays an alarm message on the display 70 or the like and places the slit nozzle 41 in the standby position. While moving, the board | substrate 90 in which abnormality was detected is discharged | emitted.

  When scanning (measurement) by the gap sensor 42 is completed, the linear motor 50 moves the bridging structure 4 in the X-axis direction and moves the detection sensor 45 to the end position of the substrate 90. Note that the end position is a position where the optical axis of the detection sensor 45 is substantially along the (+ X) side of the substrate 90. That is, the linear motor control unit 74 controls the linear motor 50 so that L = L0−d1 for the coordinate L obtained from the linear encoder 51.

  When the detection sensor 45 moves to the end position, the linear motor control unit 74 stops the bridging structure 4 by stopping the linear motor 50.

  Next, on the basis of the measurement result from the gap sensor 42, the controller 71 determines that the posture of the slit nozzle 41 in the YZ plane is an appropriate posture (the interval between the slit nozzle 41 and the application region is appropriate for applying the resist. The position of the nozzle support portion 40 that becomes a small interval (50 to 200 μm in the present embodiment) (hereinafter referred to as “appropriate posture”) is calculated, and each lifting mechanism 43 is calculated based on the calculation result. , 44 are controlled to adjust the slit nozzle 41 to an appropriate posture.

  Since the detection sensor 45 of the substrate processing apparatus 1 is disposed on the (−X) side of the slit nozzle 41, the slit nozzle 41 is not opposed to the substrate 90 when the detection sensor 45 is in the end position. Has moved. Therefore, even if the slit nozzle 41 is moved in the (−Z) direction and adjusted to an appropriate posture in a state where the detection sensor 45 is in the end position, there is almost no risk that the slit nozzle 41 comes into contact with an interference object.

  When the posture adjustment of the slit nozzle 41 is completed, the substrate processing apparatus 1 starts a coating operation (step S12).

  In the coating operation, first, the detection sensor 45 starts the irradiation of the laser light and the detection unit 72 starts detecting the interference, and the linear motor control unit 74 drives the linear motor 50 to (−−) of the bridge structure 4. X) Start moving in the direction.

  When step S12 is executed, the substrate processing apparatus 1 monitors whether the interference unit is detected by the determination unit 72 (step S13), and whether or not the slit nozzle 41 has been moved to the coating end position by the linear motor control unit 74. Is monitored (step S14). The application end position is a position where the slit nozzle 41 substantially follows the (−X) side of the resist application region.

  When the slit nozzle 41 moves to the application start position during the execution of steps S13 and S14, the discharge of the resist solution from the slit nozzle 41 is started. The application start position is a position where the slit nozzle 41 substantially follows the (+ X) side of the resist application region.

  Therefore, if it is not determined that there is an interfering object, the slit nozzle 41 eventually moves to the application end position, and it is determined Yes in step S14. At that time, the substrate processing apparatus 1 ends the coating operation normally, and the operator or the transport mechanism carries out the substrate 90.

  When it is determined that the determination unit 72 has detected an interference (when determined Yes in step S13), the determination unit 72 transmits the fact to the linear motor control unit 74. Thereby, the linear motor control part 74 stops the linear motor 50 immediately, and stops the movement to the (-X) direction of the slit nozzle 41 (step S15).

  In parallel with the process of step S15, the slit nozzle 41 stops the discharge of the resist solution. That is, the coating operation is stopped by step S15. Further, the elevating mechanisms 43 and 44 raise the slit nozzle 41 so as to be sufficiently separated from the substrate 90.

  Thereby, even if the slit nozzle 41 is moved in the X-axis direction thereafter, the slit nozzle 41 and the interference do not collide. Therefore, when the substrate processing apparatus 1 detects the interference, the collision between the slit nozzle 41 and the interference is avoided.

  Next, the determination unit 72 transmits information indicating that the interference has been detected to the position specifying unit 73, and the position specifying unit 73 specifies the detection position of the interference (step S16).

  Since the interference object is detected at the position of the detection sensor 45, the position specifying unit 73 adds the distance d1 to the coordinate L from the linear encoder 51 at this time, and sets the coordinate DP of the detection position of the interference object to L + d1. Identify. Further, position data indicating the coordinate DP is generated and stored, and transmitted to the linear motor control unit 74.

  When the position data is transmitted, the linear motor control unit 74 controls the linear motor 50 to move the imaging unit 6 to the detection position (step S17). Specifically, the linear motor 50 is controlled so that the coordinate L obtained from the linear encoder 51 becomes DP-d2.

  In the present embodiment, since the imaging unit 6 is provided in the (−X) direction of the detection sensor 45, when the step S17 is executed, the bridging structure 4 moves in the (+ X) direction by a distance of d2−d1. Will be. As a result of this operation, the imaging unit 6 moves to the detection position, so that the inspection image range 65 and the inspection region 66 are regions including the detection position.

  When the coordinate L obtained from the linear encoder 51 becomes DP-d2, the linear motor control unit 74 stops the linear motor 50 and transmits a control signal indicating that the imaging unit 6 has moved to the detection position to the imaging control unit 75. To do.

  Thus, the imaging control unit 75 drives the rotary motor 60 to move the camera 63 in the (+ Y) direction, and sequentially transmits the shutter signal to the camera 63, thereby causing the camera 63 to sequentially image the imaging range 64. As described above, the imaging unit 6 according to the present embodiment images the inspection image range 65 which is an area wider than the imaging range 64 by causing the camera 63 to perform imaging a plurality of times.

  Therefore, since the substrate processing apparatus 1 can capture the inspection image area with one relatively small camera 63, the apparatus cost can be suppressed. In the present embodiment, the size of the inspection image range 65 in the X-axis direction is about 10 mm, but it may be set so that the region in the coordinate DP is surely included in the inspection image range 65 (or inspection region 66). preferable.

  At this time, since the substrate 90 is still held on the holding surface 30, imaging the inspection image range 65 in this state mainly corresponds to imaging the substrate 90 (step S18).

  When inspection image data obtained by imaging the inspection image range 65 is obtained, the image processing unit 76 performs the above-described image processing on the inspection image data to detect an interference object (step S21). Thereby, the position of the interference object in the Y-axis direction may be specified.

  Further, the control unit 71 displays the enlarged inspection image data and the detection result in the image processing on the display 70 (step S22).

  Thereby, the operator can visually inspect the interference by checking the screen of the display 70. In addition, since the detection result by the image processing is displayed, the interference object can be inspected more accurately.

  As described above, since the substrate processing apparatus 1 specifies the detection position when detecting the interference object, it is not necessary to search for the interference object again when performing the inspection of the interference object. Can be inspected.

  Further, the substrate processing apparatus 1 has a function of not only detecting an interference object but also inspecting the interference object. Therefore, it is not necessary to provide a separate inspection device.

  Next, the linear motor control unit 74 controls the linear motor 50 to move the bridging structure 4 to the retracted position (step S23), and unloads the substrate 90 (step S24). The retracted position is a position where the bridging structure 4 and the substrate 90 do not interfere when the substrate 90 is carried in and out.

  When the substrate 90 is unloaded, the controller 71 determines whether or not the stage 3 needs to be inspected (step S25). For example, if no interference object is detected in step S22, a part of the substrate 90 may be raised by the foreign matter adhering to the stage 3, and this raised part may cause the interference object. In such a case, the inspection of the stage 3 is executed automatically or according to an operator's instruction. This determination can be made based on an instruction from an operator who has confirmed the screen of the display 70, for example. However, it may be set in advance in the initial setting.

  When the inspection of stage 3 is not necessary (No in step S25), the process ends without executing the processes of steps S26 to S28.

  On the other hand, when the inspection of the stage 3 is necessary (Yes in step S25), the linear motor control unit 74 controls the linear motor 50 based on the position data, and moves the imaging unit 6 to the detection position again (step S26).

  Then, the imaging control unit 75 images the inspection image range 65 while moving the camera 63 in the (+ Y) direction. At this time, since the substrate 90 has already been unloaded in step S24, capturing the inspection image range 65 in this state corresponds to capturing the holding surface 30 of the stage 3 (step S27).

  When the imaging is completed, the control unit 71 displays the inspection image data acquired in step S27 on the display 70 (step S28). At this time, the image processing unit 76 may perform image processing on the inspection image data and display the inspection result on the display 70.

  Thereby, the substrate processing apparatus 1 can perform not only the interference on the surface of the substrate 90 but also the foreign matter inspection of the stage 3 (holding surface 30). Therefore, the operator can determine whether or not the stage 3 needs to be cleaned, for example.

  In the present embodiment, it has been described that the imaging unit 6 is disposed in front of the slit nozzle 41 in the scanning direction. On the other hand, in the present embodiment, the slit nozzle 41 is raised when an interference is detected. Therefore, after the interference object is detected, the slit nozzle 41 is prevented from colliding with the detected interference object, and therefore the imaging unit 6 may be arranged behind the slit nozzle 41 in the scanning direction.

<2. Second Embodiment>
In the first embodiment, the imaging unit 6 is configured integrally with the bridging structure 4 and the nozzle moving mechanism 5 moves the imaging unit 6 and the slit nozzle 41 integrally in the scanning direction. A mechanism for moving the imaging unit 6 in the scanning direction independently of the slit nozzle 41 may be provided.

  FIG. 8 is a diagram showing a substrate processing apparatus 1a according to the second embodiment configured based on such a principle. In addition, among each structure of the substrate processing apparatus 1a, the same sign is attached | subjected to the structure which has the same function as the substrate processing apparatus 1, and description is abbreviate | omitted suitably. The same applies to the following embodiments.

  The substrate processing apparatus 1 a includes a second bridge structure 4 a including an imaging unit 6, and is different from the substrate processing apparatus 1 in that the bridge unit 4 does not include the imaging unit 6. The second bridging structure 4 a includes a pair of linear motors 52, a pair of linear encoders 53, and an imaging unit 6, and a ball screw 61 (and a cover member (not shown)) of the imaging unit 6 is spanned from both sides of the stage 3. .

  The pair of linear motors 52 has the same structure as the linear motor 50 of the nozzle moving mechanism 5 and is controlled by the linear motor control unit 74 of the control unit 71. The pair of linear encoders 53 has the same structure as that of the linear encoder 51, and outputs coordinates in the X-axis direction of the second bridging structure 4 a (imaging unit 6) to the linear motor control unit 74.

  Therefore, the linear motor control unit 74 in the present embodiment moves the imaging unit 6 to an arbitrary position (for example, a detection position) in the X-axis direction by controlling the linear motor 52 in accordance with the input from the linear encoder 53. Can be made.

  The operation of the substrate processing apparatus 1a having such a structure will be described. Also in the substrate processing apparatus 1a, the processing until the detection position of the interference substance is specified (FIG. 6: processing up to step S16) is the same as that of the substrate processing apparatus 1, and the description thereof is omitted. However, when the coating operation is stopped and the slit nozzle 41 is raised, the linear motor control unit 74 of the substrate processing apparatus 1a controls the linear motor 50 to move the bridging structure 4 in the (+ X) direction.

  When the position data is transmitted from the position specifying unit 73, the linear motor control unit 74 in the present embodiment controls the linear motor 52 to move the second bridging structure 4a, thereby bringing the imaging unit 6 to the detection position. Move. Specifically, the linear motor 52 is controlled so that the coordinate L obtained from the linear encoder 53 is L + d1.

  By this operation, the second bridging structure 4a moves and the imaging unit 6 moves to the detection position, so that the inspection image range 65 and the inspection region 66 are regions including the detection position.

  When the coordinate L obtained from the linear encoder 53 becomes L + d1, the linear motor control unit 74 stops the linear motor 52 and transmits a control signal indicating that the imaging unit 6 has moved to the detection position to the imaging control unit 75.

  Thereafter, the process of determining whether or not the stage 3 inspection is necessary (FIG. 7: the process up to step S25) is performed in the same manner as the substrate processing apparatus 1. However, the linear motor control unit 74 moves the second bridging structure 4a to the retracted position when moving the bridging structure 4 to the retracted position in order to carry out the substrate 90.

  In this embodiment, when the inspection of the stage 3 is necessary, the linear motor control unit 74 controls the linear motor 52 based on the position data, and detects the imaging unit 6 again by moving the second bridging structure 4a. Move to position.

  The subsequent processing is the same as that of the substrate processing apparatus 1 in the first embodiment.

  As described above, even if the structure includes a moving mechanism that moves the imaging unit 6 in the scanning direction independently of the slit nozzle 41 as in the substrate processing apparatus 1a according to the second embodiment, The same effects as those of the substrate processing apparatus 1 in the first embodiment can be obtained.

<3. Third Embodiment>
In the said embodiment, in order to image the test | inspection image range 65 wider than the imaging range 64 of the camera 63, it demonstrated that the imaging part 6 imaged sequentially, moving the camera 63 to a Y-axis direction. That is, in the above-described embodiment, the inspection image range 65 is imaged in a plurality of times. However, the configuration for capturing the inspection image range 65 is not limited to this.

  FIG. 9 is a diagram showing a substrate processing apparatus 1b according to the third embodiment configured based on such a principle.

  The substrate processing apparatus 1b is different from the substrate processing apparatus 1 in that an imaging unit 6a is provided. The imaging unit 6 a includes ten cameras 63, a camera support unit 67, and ten fixing members 68. The imaging unit 6a does not include a configuration corresponding to the rotation motor 60, the ball screw 61, and the ball nut 62 of the imaging unit 6 in the first embodiment.

  The camera support member 67 is a rod-shaped member, and both ends thereof are fixed to the casings of the elevating mechanisms 43 and 44, and are arranged along the Y-axis direction.

  Each fixing member 68 is attached to the camera 63 via a bracket, and is further fixed to the camera support portion 67. That is, the fixing member 68 functions as a member for fixing the plurality of cameras 63 to the camera support portion 67.

  Since the camera 63 in the first and second embodiments is attached to the ball nut 62, it can move in the Y-axis direction as the ball screw 61 rotates. However, although the camera 63 in the present embodiment can move in the X-axis direction as the bridging structure 4 moves, the position in the Y-axis direction is fixed by the fixing member 68, so that the Y-axis. Never move in the direction.

  However, since the imaging range 64 of each camera 63 is arranged as shown in FIG. 9, it is possible to capture the inspection image range 65 by, for example, synthesizing the image data from the ten cameras 63. is there.

  The coating operation by the substrate processing apparatus 1b will be described in comparison with the substrate processing apparatus 1. In the substrate processing apparatus 1b, only the imaging operation by the imaging unit 6a is different from the operation of the substrate processing apparatus 1. Specifically, in the processing corresponding to steps S18 and S27 of the substrate processing apparatus 1, the inspection image range 65 is imaged by capturing images by 10 cameras 63 at a time, instead of imaging while moving the camera 63. To do.

  As described above, even when the structure includes a plurality of cameras 63 like the substrate processing apparatus 1b in the third embodiment, the same effect as the substrate processing apparatus 1 can be obtained.

  Further, since a mechanism for moving the camera 63 (a structure such as the rotary motor 60 and the ball screw 61) is unnecessary, particles can be suppressed.

  In addition, since a plurality of cameras 63 can capture images simultaneously, the imaging time in the inspection is shortened.

  Of course, a structure including a plurality of cameras 63 such as the imaging unit 6a can be applied to the substrate processing apparatus 1a according to the second embodiment.

  Further, the number of cameras 63 is not limited to ten. The appropriate number of cameras 63 can be determined based on the ratio of the imaging range 64 and the inspection image range 65, for example.

<4. Fourth Embodiment>
In the above-described embodiment, the example in which the detection of the interference object and the inspection of the interference object are performed by one apparatus has been described.

  FIG. 10 is a diagram showing a configuration of a substrate processing system 100 according to the fourth embodiment configured based on such a principle.

  The substrate processing system 100 has a configuration in which the substrate processing apparatus 1c and the inspection apparatus 10 are connected via a network NW in a state where data communication is possible. The network NW may be a LAN, a public line network, the Internet, or the like.

  In the substrate processing apparatus 1c according to the fourth embodiment, the controller 7a includes a communication unit 77 instead of a configuration corresponding to the imaging unit 6 of the substrate processing apparatus 1.

  The communication unit 77 has a function of connecting the substrate processing apparatus 1c to the network NW. In particular, the communication unit 77 transmits the position data generated by the position specifying unit 73 to the inspection apparatus 10.

  The position specifying unit 73 in the present embodiment transmits the generated position data to the communication unit 77 rather than to the linear motor control unit 74. The position specifying unit 73 sets the origin at the end of the substrate 90 and specifies the detection position when creating position data. That is, the coordinate DP of the detection position is specified as L−L0 + d1.

  FIG. 11 is a diagram illustrating the inspection apparatus 10. The inspection apparatus 10 includes a stage 11 on which a substrate 90 is placed, a pair of linear motors 12, a pair of linear encoders 13, a display 14, a communication unit 15, a control unit 16, and an imaging unit 6b.

  The pair of linear motors 12 has the same function as that of the linear motor 50, and has a function of moving the imaging unit 6 b in the X-axis direction according to a control signal from the control unit 16. The pair of linear encoders 13 have the same function as the linear encoder 51, and transmit the coordinates on the X axis of the imaging unit 6 b to the control unit 16. The linear encoder 13 of the inspection apparatus 10 transmits coordinates with the end position on the (+ X) side of the substrate 90 as the origin.

  The imaging unit 6 b included in the inspection apparatus 10 has the same configuration as the imaging unit 6 of the substrate processing apparatus 1. The imaging unit 6 b is controlled in the same manner as the imaging unit 6 by an imaging control unit (not shown) of the control unit 16.

  That is, it can be said that the inspection apparatus 10 according to the fourth embodiment has a structure corresponding to the second bridging structure 4a of the substrate processing apparatus 1a.

  The display 14 is disposed on the upper surface of the stage 11 and has the same function as the display 70. That is, in accordance with a control signal from the control unit 16, the inspection result and inspection image data in the substrate processing system 100 (inspection apparatus 10) are displayed. An operator can perform a visual inspection, for example, on the screen of the display 14.

  The communication unit 15 has a function for connecting the inspection apparatus 10 to the network NW. In particular, the communication unit 15 receives position data transmitted from the substrate processing apparatus 1 c via the network NW and transmits the position data to the control unit 16.

  In the substrate processing system 100, the interference is detected by the substrate processing apparatus 1 c that performs the coating operation, but the interference is inspected by the inspection apparatus 10. The operation of the substrate processing system 100 will be described below.

  First, as in the first embodiment, the substrate processing apparatus 1c performs a coating operation. At this time, if the determination unit 72 determines that an interference is detected, the elevating mechanisms 43 and 44 raise the slit nozzle 41. In parallel with this operation, the position specifying unit 73 specifies the detection position and creates position data, and the communication unit 77 transmits the position data to the inspection apparatus 10.

  When the position data is created, the linear motor control unit 74 moves the bridging structure 4 to the retracted position, and an operator or a transport mechanism (not shown) transports the substrate 90 from the substrate processing apparatus 1c toward the inspection apparatus 10.

  When the substrate 90 is carried into the inspection apparatus 10, the control unit 16 of the inspection apparatus 10 controls the linear motor 12 based on the position data received from the substrate processing apparatus 1 c and the input from the linear encoder 13, and the imaging unit. 6b is moved to the detection position.

  Further, the control unit 16 controls the rotation motor 60 of the image pickup unit 6b to move the camera 63 in the Y-axis direction and pick up the inspection image range 65 as in the first embodiment. The inspection image data acquired in this way is displayed on the display 14.

  As described above, in the substrate processing system 100, information (position data) related to the position of the interfered object detected from the substrate processing apparatus 1c is obtained. It can be carried out. That is, the inspection time is shortened compared to the conventional case.

  On the other hand, since the substrate processing apparatus 1c does not perform the inspection process, the stop time of the coating process is shortened, and the manufacturing efficiency of the substrate 90 is improved. Moreover, since the substrate processing apparatus 1c does not require a configuration corresponding to the imaging unit 6, a conventional substrate processing apparatus can be used relatively easily.

  In the substrate processing system 100, the stage 3 of the substrate processing apparatus 1c cannot be inspected. However, according to the inspection result in the inspection apparatus 10, a process for the stage 3 (for example, a cleaning process for the holding surface 30) is determined. Good.

  Further, the configuration shown in the first and second embodiments may be employed in the substrate processing apparatus 1c in order to execute the inspection of the stage 3.

<5. Fifth embodiment>
In the above-described embodiment, an example has been described in which, when an interference is detected by the detection sensor 45, the detection position is specified, and the imaging unit is moved in the X-axis direction toward the specified detection position. However, in order to capture an image so as to include a detection region when the detection sensor 45 detects an interference object, the imaging unit does not necessarily have to be moved in the X-axis direction.

  FIG. 12 is a partial plan view of a substrate processing apparatus 1d according to the fifth embodiment configured based on such a principle.

  In the substrate processing apparatus 1d, the imaging unit 6c is disposed above the optical axis of the detection sensor 45. That is, the imaging range of the imaging unit 6c and the detection region of the detection sensor 45 so that the region (detection region) through which the optical axis of the laser light passes is always included in the imaging range of the imaging unit 6c (detection image range 65). The positional relationship of is fixed.

  With such a positional relationship, when the detection sensor 45 detects an interference, the imaging unit 6c is already at the detection position. Therefore, the substrate processing apparatus 1d not only obtains the same effect as the above embodiment, but also eliminates the processing corresponding to steps S16 and S17 shown in FIG. it can.

  In this configuration, since the imaging range 64 is irradiated with laser light, the substrate processing apparatus 1d irradiates the detection sensor 45 with laser light when imaging with the imaging unit 6c. You may stop.

<6. Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

  For example, the imaging units 6, 6 a, 6 b, and 6 c are all arranged to image the (−Z) axis direction, but the imaging direction may be slightly inclined with respect to the Z axis. That is, you may make it image the front or back with respect to the scanning direction.

  Moreover, in the said embodiment, the detection sensor 45 detected the interference object with the laser beam. However, the detection sensor 45 is not limited to one using laser light.

  FIG. 13 is a diagram showing a detection sensor 45a of the substrate processing apparatus 1e configured based on such a principle.

  The substrate processing apparatus 1e includes a detection sensor 45a including a nozzle guard 48 and a vibration detection sensor 49 instead of the detection sensor 45 that uses laser light.

  The nozzle guard 48 is a plate-like member whose longitudinal direction is the Y-axis direction, and is fixed in front of the slit nozzle 41 in the (−X) direction. The size of the nozzle guard 48 in the Y-axis direction is at least larger than the size of the discharge tip portion 41a of the slit nozzle 41 in the Y-axis direction. Further, the surface of the nozzle guard facing the substrate 90 (holding surface 30) is set so that the height position thereof is lower than the discharge tip portion 41a.

  The vibration detection sensor 49 is fixed to the slit nozzle 41, detects vibration in the slit nozzle 41, and transmits it to the control unit 71 (determination unit 72). That is, in the substrate processing apparatus 1e, when an interference exists and the interference collides with the nozzle guard 48, the vibration detection sensor 49 detects the vibration and transmits it to the determination unit 72.

  As described above, even when an interference is detected by providing the nozzle guard 48 and the vibration detection sensor 49 as in the substrate processing apparatus 1e shown in FIG. 13, the same effects as those of the first embodiment are obtained. be able to.

  That is, any method for detecting an interference object may be used. In addition, the structure provided with both the detection sensors 45 and 45a may be sufficient.

  In the above-described embodiment, the example in which the coating process and the inspection process are performed while the substrate 90 is stationary has been described. However, these processes may be performed while moving the substrate 90.

  FIG. 14 is a diagram showing a substrate processing apparatus 1f configured based on such a principle. The substrate processing apparatus 1f includes a moving mechanism 2, a bridging structure 4b, and a second bridging structure 4c. Although not shown, a nut portion into which the ball screw 21 is screwed is provided on the back surface of the stage 3.

  Both the crosslinked structure 4b and the second crosslinked structure 4c are fixed in the substrate processing apparatus 1f and do not move like the crosslinked structure 4 and the second crosslinked structure 4a in the above embodiment. That is, since the positions of the bridging structure 4b and the second bridging structure 4c are not changed by the operation of the substrate processing apparatus 1f, the control unit 71 stores these positions (mainly coordinates on the X axis) in advance. Saved.

  The moving mechanism 2 includes a rotary motor 20 and a ball screw 21.

  The rotary motor 20 is a general servo motor provided with a rotary encoder, and can be controlled by the control unit 71 in the rotation direction and the rotation amount. That is, the control unit 71 can specify the position of the stage 3 (substrate 90) by the signal from the rotary encoder. And if the position of the board | substrate 90 can be specified in the substrate processing apparatus 1f, the position of an interference object can be specified.

  In the application operation, when the rotary motor 20 rotates the ball screw 21, the stage 3 moves in the X-axis direction with the horizontal posture. Since the substrate 90 is held on the stage 3, the moving mechanism 2 moves the stage 3 in the X-axis direction to relatively move the bridging structure 4 b (second bridging structure 4 c) and the substrate 90. That is, the slit nozzle 41 can scan the substrate 90 in the (−X) direction by moving the stage 3 in the (+ X) direction.

  Therefore, even in the substrate processing apparatus 1f, it is possible to perform the coating operation as in the above embodiment.

  Also in the substrate processing apparatus 1f, the detection position can be specified by the rotary encoder of the rotary motor 20 when the detection sensor 45 detects an interference. Therefore, based on the identified detection position, the detected interference can be moved below the second bridging structure 4c by moving the stage 3 in the (−X) direction. If the inspection image range 65 is imaged by the imaging unit 6 in this state, inspection image data similar to that in the above embodiment is obtained. Therefore, if this inspection image data is displayed on the display 70, the operator can inspect the interference. Note that the positional relationship between the crosslinked structure 4b and the second crosslinked structure 4c is not limited to that shown in FIG. 14, and for example, the second crosslinked structure 4c may be provided on the downstream side of the crosslinked structure 4b. Moreover, the structure which has multiple cameras 63 like 2nd Embodiment may be sufficient.

FIG. 1 is a front view showing a substrate processing apparatus according to the present invention. It is a partial top view of a substrate processing apparatus. It is an enlarged view of the peripheral part of the detection sensor in a substrate processing apparatus. It is a figure which shows the positional relationship of a detection sensor and an imaging part. It is a figure which shows the functional block of a control part. It is a flowchart which shows the processing operation in case a resist liquid is apply | coated to a board | substrate with a substrate processing apparatus. It is a flowchart which shows the processing operation in case a resist liquid is apply | coated to a board | substrate with a substrate processing apparatus. It is a figure which shows the substrate processing apparatus in 2nd Embodiment. It is a figure which shows the substrate processing apparatus in 3rd Embodiment. It is a figure which shows the substrate processing system in 4th Embodiment. It is a figure which shows an inspection apparatus. It is a figure which shows the substrate processing apparatus in 5th Embodiment. It is a figure which shows the detection sensor of the substrate processing apparatus in a modification. It is a figure which shows the substrate processing apparatus in a modification.

Explanation of symbols

1, 1a, 1b, 1c, 1d, 1e, 1f Substrate processing device 10 Inspection device 100 Substrate processing system 3, 11 Stage 14, 70 Display 15, 77 Communication unit 2 Moving mechanism 4, 4b Cross-linking structure 4a, 4c Second cross-linking Structure 41 Slit nozzle 41a Discharge tip 43, 44 Elevating mechanism 45, 45a Detection sensor 5 Nozzle moving mechanism 50 Linear motor 51 Linear encoder 6, 6a, 6b, 6c Imaging unit 63 Camera 71 Control unit 72 Judgment unit 73 Position specifying unit 74 Linear motor control unit 75 Imaging control unit 76 Image processing unit

Claims (14)

A substrate processing apparatus for processing a substrate,
A long nozzle that discharges the processing liquid from the discharge section facing the substrate toward the substrate;
Nozzle moving means for relatively moving the long nozzle and the substrate in the scanning direction when the long nozzle discharges the processing liquid;
A detection unit that has a detection region, and detects an object that may interfere with the long nozzle as the interference when the nozzle moving unit moves the long nozzle;
An imaging unit that captures an image so as to include a detection region when the detection unit detects an object, and acquires image data for inspection;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein a positional relationship between the imaging range and the detection region is fixed so that an imaging range of the imaging unit includes a detection region of the detection unit. The substrate processing apparatus according to claim 1,
Further comprising position specifying means for specifying a detection position in the scanning direction of the interference detected by the detecting means;
The substrate processing apparatus, wherein the image pickup means picks up an image at a detection position specified by the position specifying means. A substrate processing apparatus according to any one of claims 1 to 3,
The imaging means includes
A camera for imaging a predetermined range;
Camera moving means for moving the camera in the width direction;
With
The substrate processing apparatus, wherein the camera sequentially images the entire imaging region while moving in the width direction by the camera moving means. A substrate processing apparatus according to any one of claims 1 to 3,
The imaging means includes a plurality of cameras each imaging a predetermined range,
An area captured by the plurality of cameras includes the entire imaging area. A substrate processing apparatus according to any one of claims 1 to 5,
The substrate processing apparatus, wherein the nozzle moving unit moves the image pickup unit and the long nozzle integrally in the scanning direction. A substrate processing apparatus according to any one of claims 1 to 5,
A substrate processing apparatus, further comprising a moving unit that moves the image pickup unit in the scanning direction independently of the long nozzle. A substrate processing apparatus according to any one of claims 1 to 7,
A substrate processing apparatus, further comprising display means for displaying an image based on inspection image data imaged by the imaging means. A substrate processing apparatus according to any one of claims 1 to 8,
The substrate processing apparatus further comprising inspection means for inspecting the object based on inspection image data imaged by the imaging means. A substrate processing apparatus according to any one of claims 1 to 9,
The substrate processing apparatus, wherein the imaging region is set so as to include a surface of a substrate when an interference is detected by the detection unit. A substrate processing apparatus according to any one of claims 1 to 10,
A stage for holding the substrate;
The substrate processing apparatus, wherein the imaging region is set so as to include a surface of the stage. A substrate processing system for processing a substrate,
A coating apparatus for applying a treatment liquid to a substrate;
An inspection apparatus connected to the coating apparatus via a network;
With
The coating device includes:
A long nozzle that discharges the processing liquid from the discharge section facing the substrate toward the substrate;
Nozzle moving means for relatively moving the long nozzle and the substrate in the scanning direction when the long nozzle discharges the processing liquid;
Detecting means for detecting an object that may interfere with the long nozzle as the interference when the nozzle moving means moves the long nozzle;
Position specifying means for specifying the detection position in the scanning direction of the interference detected by the detecting means;
Transmitting means for transmitting the detection position specified by the position specifying means to the inspection device;
With
The inspection device includes:
Receiving means for receiving the detection position transmitted by the transmitting means;
An imaging means for obtaining image data for inspection by imaging the surface of the substrate when an interference is detected by the detection means at the detection position received by the reception means;
A substrate processing system comprising: A substrate processing method for processing a substrate, comprising:
An application step of relatively moving the long nozzle and the substrate in the scanning direction while discharging the processing liquid from the discharge portion of the long nozzle toward the substrate;
A detection step of detecting an object that may interfere with the long nozzle in the coating step as an interference from a detection region;
An imaging step of obtaining an image data for inspection by imaging so as to include a detection region when an interference is detected in the detection step;
A substrate processing method comprising: The substrate processing method according to claim 13, comprising:
The imaging step includes
A substrate imaging step of imaging the surface of the substrate;
A stage imaging process for imaging the stage holding the substrate;
A substrate processing method comprising:

Images