JP2008124293A - Imaging device with image processing function, and inspection system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To largely shorten time required for data communication processing between a camera side and a control computer side of a production facility such as an electronic component mounting machine to meet a need of high-speed processing. <P>SOLUTION: A CPU of an imaging device 11 picks up an image of a reference jig by a camera 15 from a horizontal direction before the electronic component mounting machine works, detects a measuring reference position (a height position of the lowermost point) of the reference jig, and stores the data in a RAM or the like. It picks up an image of an object to be imaged (suction nozzle 13 or a sucked component 20) by the camera 15 from the horizontal direction while the mounting machine works, detects a measuring object position (the height position of the lowermost point) of the object, calculates differential data between the measuring object position and the measuring reference position, and sends it to the control computer of the mounting machine. The control computer of the mounting machine examines whether the sucked component 20 is sucked well or whether the component 20 is present based on the received differential data, and detects the thickness of the component 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an imaging apparatus with an image processing function and an inspection system having a function of outputting data after image processing.

  For example, in an electronic component mounting machine, an electronic component sucked by a suction nozzle of the electronic component mounting machine (hereinafter referred to as “suction component”) is imaged from below by a camera, and image data output from the camera is electronic component Some of them are transferred to a control computer of a mounting machine, and image processing is performed by the control computer to check whether the suction state of the suction component is good.

Further, as described in Patent Document 1 (Japanese Patent Laid-Open No. 2002-232193), the lower end portion of the suction nozzle is imaged with a camera from the horizontal direction to detect the lower end position of the suction nozzle, and the lower end of the suction nozzle is detected. There is one in which the quality of the suction nozzle is inspected based on whether or not the position is within a predetermined value set in advance.
JP 2002-232193 A (first page)

  In the inspection system using the camera described above, image data output from the camera is transferred to a control computer of the electronic component mounting machine, and image processing is performed by the control computer to determine whether the suction state of the suction component and the suction nozzle are good. Although the inspection is performed, the image data output from the camera has a large data capacity, and therefore it takes a considerable time to transfer the image data to the control computer of the electronic component mounting machine. For this reason, the transfer time (communication processing time) of the image data has been a factor that hinders the speeding up of the electronic component mounting machine.

  The present invention has been made in consideration of such circumstances. Therefore, the object of the present invention is to perform data communication processing between the camera side (imaging device side) and the control computer side of a production apparatus such as an electronic component mounting machine. It is an object of the present invention to provide an imaging apparatus with an image processing function and an inspection system that can significantly reduce the time required for the above processing and can satisfy the demand for high-speed processing.

  In order to achieve the above object, an invention according to claim 1 is an imaging apparatus with an image processing function that is used by being attached to a production apparatus such as an electronic component mounting machine, the camera for imaging an object to be imaged, and a reference image Storage means for storing the data of the measurement reference position, and the image pickup object image data output from the camera while controlling the imaging operation of the camera, and the measurement target position of the image pickup object and the reference image Image processing means for outputting difference data from the measurement reference position.

  In this configuration, the data to be transmitted from the imaging apparatus with an image processing function to the control computer of the production apparatus is not large-capacity image data but a small number of difference data processed by the image processing means. The time required for data communication processing with the control computer side of the apparatus can be greatly reduced, and the demand for high-speed processing can be satisfied. In addition, it is not necessary to mount an expensive high-speed communication function on the imaging apparatus side or the control computer side of the production apparatus, and there is an advantage that the communication function can be reduced in cost.

  In this case, the measurement target position of the object to be imaged is preferably the height position of the lowest point of the object to be imaged. For example, when the object to be imaged is a suction nozzle, the height position of the lowest point of the suction nozzle is the measurement target position.

  Further, as in claim 3, the camera is preferably installed so that the scanning direction is the longitudinal direction of the object to be imaged. For example, when the object to be imaged is a suction nozzle, the longitudinal direction of the object to be imaged is the vertical direction, so the camera may be installed so that the scanning direction is the vertical direction. In this way, for a vertically long object to be picked up, such as a suction nozzle, only a part of the area where the object to be picked exists is scanned without scanning the entire image pickup area of the camera. Thus, image data necessary for measurement of the object to be imaged can be obtained, and the image processing time on the imaging device side can be shortened.

  Further, as described in claim 4, it is preferable to use an image captured by capturing the reference jig with a camera as the reference image. In this way, by replacing the reference jig according to the type of the object to be imaged, the data of the measurement reference position can be stored in the storage unit using the reference image that matches the actual object to be imaged.

  Further, as in claim 5, the imaging apparatus with an image processing function of the present invention is attached to an electronic component mounting machine, and an electronic component (hereinafter referred to as "suction component") sucked by a suction nozzle of the electronic component mounting machine is covered. The picked-up object is picked up by a camera from the horizontal direction, and difference data output from the image pickup device with an image processing function is taken into a control computer of the electronic component mounting machine, and the control computer uses the difference data based on the difference data. Then, it may be possible to inspect whether the suction part is in the suction state or not, or to detect the thickness of the suction part. In this way, the time required for data communication processing between the imaging device side and the control computer side of the electronic component mounting machine can be greatly shortened, and the speed of the electronic component mounting machine must be met. Can do.

  Further, as in claim 6, the suction nozzle of the electronic component mounting machine is an object to be imaged, the suction nozzle is imaged by the camera from the horizontal direction, and the difference data output from the imaging device is used as the electronic component mounting machine. The control computer may check the quality of the suction nozzle based on the difference data. In this case, the same effect as that of the fifth aspect can be obtained.

  In this case, as in claim 7, the image processing means of the image pickup device moves the reference jig in the horizontal direction in a state where the reference jig is adsorbed to the adsorption holder that adsorbs and holds the adsorption nozzle instead of the adsorption nozzle. The image captured by the camera and captured by the camera may be stored in the storage means as a reference image. By doing this, it is possible to capture the reference image by capturing the reference jig under the same conditions as when imaging the electronic component sucked by the suction nozzle, and store the reference image that matches the actual suction nozzle in the storage means. Can be made.

  Further, as in claim 8, the height position of the lowest point of the reference jig is stored in the storage means as the measurement reference position, and the image processing means of the imaging device is configured to store the lowest point of the suction nozzle imaged by the camera. The difference in height between the height position and the measurement reference position of the reference jig is output as difference data, and the control computer of the electronic component mounting machine places the reference jig on the board mounting surface while the reference jig is sucked into the suction holder. It is also possible to detect the amount of descent until contact is made as a reference stroke, and correct the reference stroke with the difference data to determine the suction nozzle stroke during the mounting operation. In this way, the suction nozzle stroke at the time of the mounting operation can be calculated using the difference data output from the imaging apparatus, and the confirmation operation of the suction nozzle stroke before the start of the mounting operation is facilitated.

Hereinafter, an embodiment embodying the best mode for carrying out the present invention will be described.
In this embodiment, an example in which the imaging device 11 with an image processing function is attached to an electronic component mounting machine will be described. However, the imaging device 11 with an image processing function according to the present invention is a variety of production apparatuses other than the electronic component mounting machine. It can be used by attaching to

  As shown in FIG. 1, the electronic component mounting machine includes a revolver type (rotary type) mounting head 12, and a plurality of suction nozzles 13 are arranged at predetermined intervals in the circumferential direction on the lower surface side of the mounting head 12. ing. Each suction nozzle 13 is suctioned and held downward by a suction holder 14 provided on the mounting head 12 so as to be movable up and down, and a reference jig 41 (see FIGS. 3 and 4) described later is attached to each suction holder 14. It can be replaced with 13 and held by suction. Although not shown, the mounting head 12 is supported by a Y slide that moves in the Y direction of the XY slide mechanism, and the Y slide is mounted on the X slide that moves in the X direction.

  On the other hand, the imaging device 11 with an image processing function is attached to a mounting head 12 that is detachably supported by a Y slide, and moves integrally with the mounting head 12. The imaging device 11 with an image processing function includes a camera 15 such as a CCD camera, a display 16 such as a liquid crystal display (LCD), and an illumination light source 17 such as an LED that illuminates an object to be imaged (the suction nozzle 13 and the suction component 20). A main control board 18 for controlling these operations and a prism 19 for aligning the optical axis of the camera 15 with the object to be imaged are provided. In this embodiment, the illumination light source 17 is a UV illumination LED that irradiates UV light, and fluorescent light is generated by the UV light from the illumination light source 17 below the center of the mounting head 12 to capture an object to be imaged (adsorption). A cylindrical fluorescent reflector 21 for illuminating the nozzle 13 and the suction component 20) from the back side is provided.

  As shown in FIG. 2, the main control board 18 includes a CPU 22 (image processing means), a ROM 23, a RAM 24 (storage means), a control network IC 25, an LED driver 26 that drives an illumination light source 17 (UV illumination LED), A binarization circuit 27 for binarizing image data output from the camera 15, an LCD driver 28 for driving the display 16 (LCD), and the like are mounted.

  The display 16 (LCD) is connected to the main control board 18 via a relay board 29 and a cable 30 such as a flexible flat cable (FFC). The relay board 29 is provided with push button switches 31 and 32 for operation. By operating the push button switches 31 and 32, the display mode of the display 16 is switched. In addition, the display mode of the display 16 can be switched by a display mode switching signal transmitted from a control computer (not shown) of the electronic component mounting machine. The camera 15 and the illumination light source 17 (UV illumination LED) are also connected to the main control board 18 via cables 33 and 34 such as a flexible flat cable (FFC).

  The main control board 18 is connected to a control computer (not shown) of the electronic component mounting machine via a harness 35, and transmits and receives signals between the main control board 18 and the control computer of the electronic component mounting machine. DC power is supplied to the imaging device 11 from a control computer of the electronic component mounting machine.

Next, the operation of the imaging apparatus 11 with an image processing function having the above configuration will be described.
The CPU 22 of the image pickup device 11 with an image processing function receives information such as threshold data, various parameters, and operation commands (image pickup triggers) transmitted from the control computer of the electronic component mounting machine. When the operation command (imaging trigger) is received, the imaging operation of the camera 15 is started, and image processing of the imaged object (suction nozzle 13 or suction component 20) output from the camera 15 is captured and image processing is performed. The difference data as the processing result is transmitted to the control computer of the electronic component mounting machine.

At this time, the CPU 22 of the imaging device 11 performs image processing as follows.
Prior to the operation of the electronic component mounting machine, a suction jig 14 that sucks and holds the suction nozzle 13 is sucked with a reference jig 41 [see FIG. 3A and FIG. 4A] instead of the suction nozzle 13 Then, the image obtained by capturing the reference jig 41 with the camera 15 from the horizontal direction is taken as a reference image, and the measurement reference position data of the reference image is stored in the RAM 24.

  When a plurality of suction nozzles 13 are sucked by the mounting head 12 as in the present embodiment, the reference jig 41 is sucked by each suction holder 14 that holds each suction holder 14 and picked up by the camera 15. Thus, the measurement reference position data of the same number of reference images as the number of suction nozzles 13 is stored in the RAM 24. The height position (Z coordinate data) of the lowest point of the reference jig 41 shown in the reference image is the measurement reference position [see FIGS. 3 (a) and 4 (a)].

  Note that the measurement reference position data of the reference image may be stored in a rewritable non-volatile memory such as an EEPROM in order to store and hold the reference image measurement reference position data even when the imaging apparatus 11 is powered off. . Alternatively, the memory for storing the measurement reference position data of the reference image may be switched between the RAM 24 and the nonvolatile memory by a command from the control computer of the electronic component mounting machine. In addition, measurement reference position data of a standard reference image created by the manufacturer that manufactures the imaging device 11 may be stored in a nonvolatile memory such as the ROM 23.

  When inspecting the quality of the suction nozzle 13 during operation of the electronic component mounting machine, the CPU 22 of the imaging device 11 sucks the suction nozzle 13 into the suction holder 14 of the mounting head 12 (no suction component). 13 is imaged by the camera 15 from the horizontal direction, and an image captured by the suction nozzle 13 [see FIG. 3B] is captured. Then, the height position (Z coordinate data) of the lowest point of the suction nozzle 13 represented in this captured image is the measurement target position. The height difference (Z coordinate data) between the measurement target position (the height position of the lowest point of the suction nozzle 13) and the measurement reference position of the reference image (the height position of the lowest point of the reference jig 41) is calculated. This is calculated and transmitted as difference data to the control computer of the electronic component mounting machine.

  The control computer of the electronic component mounting machine inspects the quality of the suction nozzle 13 based on the received difference data. For example, the quality of the suction nozzle 13 may be inspected based on whether or not the difference data is within an allowable error range set in consideration of manufacturing tolerances in advance.

  In addition, when determining the stroke (lifting amount) of the suction nozzle 13 of the electronic component mounting machine using this difference data, the control computer of the electronic component mounting machine performs the suction of the mounting head 12 before the operation of the electronic component mounting machine. In a state where the reference jig 41 is attracted to the holder 14, the reference jig 41 is lowered until the height relative to the substrate mounting surface comes into contact with a predetermined touch sensor (not shown). A descending amount until the jig 41 is brought into contact with the board mounting surface is detected as a reference stroke. Then, the detected reference stroke is corrected with the difference data to determine the stroke of the suction nozzle 13 during the mounting operation. For example, when the measurement target position (the height position of the lowest point of the suction nozzle 13) is located below the measurement reference position of the reference image (the height position of the lowest point of the reference jig 41), the reference stroke The value obtained by subtracting the difference data by the difference data is determined as the stroke of the suction nozzle 13 during the mounting operation. In this way, the stroke of the suction nozzle 13 at the time of the mounting operation can be calculated using the difference data output from the imaging device 11, and the check operation of the suction nozzle 13 before starting the mounting operation is easy. It becomes.

  On the other hand, when the electronic component mounting machine is in operation, when the suction state of the suction component 20 is checked, the presence / absence of the suction component 20 is detected, or the thickness of the suction component 20 is detected, the CPU 22 of the imaging device 11 detects the suction nozzle 13. In the state where the electronic component 20 is sucked onto the suction nozzle 13, the suction nozzle 13 and the suction component 20 are imaged by the camera 15 from the horizontal direction, and the picked-up images of the suction nozzle 13 and the suction component 20 [see FIGS. 4B and 4C] Capture. The height position (Z coordinate data) of the lowest point of the suction component 20 shown in the captured image is the measurement target position. Then, the height difference between the measurement target position (the height position of the lowest point of the suction component 20) and the measurement reference position of the reference image (the height position of the lowest point of the reference jig 41) is calculated, As difference data (Z coordinate data) to the control computer of the electronic component mounting machine.

  Based on the received difference data, the control computer of the electronic component mounting machine inspects the suction state of the suction component 20 and the presence / absence of the suction component 20, or detects the thickness of the suction component 20. For example, the quality of the suction state of the suction component 20 may be determined based on whether or not the difference data is within an allowable error range set in consideration of manufacturing tolerances in advance. At this time, if the difference data is larger than the standard value (median value) by the maximum permissible error, it may be determined that the diagonal suction [see FIG. 4 (c)].

  The presence / absence of the suction component may be determined based on whether or not the received difference data is substantially the same as the difference data of only the suction nozzle 13 having no suction component [see FIG. 3B].

  Alternatively, the difference between the difference data with the suction component [see FIG. 4B] and the difference data without the suction component [see FIG. 3B] is calculated, and this difference is detected as the thickness of the suction component 20. You may make it do.

  In the present embodiment, the image size of the camera 15 is, for example, 640 × 480 (VGA), the object to be imaged (the suction nozzle 13) is long in the vertical direction, and the measurement target position is the height of the lowest point. In consideration of the position, the camera 15 is rotated 90 ° counterclockwise so that the scanning direction is the longitudinal direction (vertical direction) of the object to be imaged. Further, the camera 15 is equipped with a partial function (a function for outputting only image data of an arbitrary part of the imaging area), and as shown in FIG. Only a portion where 20 is present is set as a scanning range by a partial function, and scanning is performed from below to above, and image data is sequentially output to the binarization circuit 27 of the main control board 18. The binarization circuit 27 binarizes the input image data with a predetermined threshold value by pipeline processing, and stores the binarized data in the RAM 24. Thus, by limiting the scanning range with the partial function, the image processing time can be shortened. Each difference data is calculated using the data after binarization processing stored in the RAM 24. Since the camera 15 is rotated by 90 ° and mounted, the image data readout direction and the scanning direction of the lowest point of the suction nozzle 13 (suction component 20) (from the bottom to the top) are matched. If the search process for the lowest point of the suction nozzle 13 (suction component 20) is also performed simultaneously with the binarization process, the image processing time can be further shortened.

  In this embodiment, the CPU 22 of the imaging device 11 realizes a resolution measurement function for measuring the resolution of the camera 15 as follows. In place of the suction nozzle 13 instead of the suction nozzle 13, a resolution measurement jig 42 (see FIG. 6) having a predetermined dimension X [mm] × Z [mm] is sucked to the suction holder 14 of the electronic component mounting machine. 42 is captured and captured by the camera 15 from the horizontal direction. Then, the number of pixels Nx having a width in the X coordinate direction and the number of pixels Nz having a width in the Z coordinate direction of the resolution measuring jig 42 represented in the captured image are counted, and the resolutions in the X coordinate direction and the Z coordinate direction are respectively determined. Calculated by the following formula.

X coordinate direction resolution = X / Nx
Resolution in the Z coordinate direction = Z / Nz
The resolution data is stored in a rewritable nonvolatile memory such as an EEPROM, and the stored data is retained even when the imaging apparatus 11 is powered off.

  In the present embodiment, the CPU 22 of the imaging apparatus 11 realizes a shape comparison function for inspecting the presence or absence of foreign matters such as dust attached to the suction nozzle 13 or the deformation of the suction nozzle 13 as follows. Prior to the operation of the electronic component mounting machine, the suction nozzle 14 of the mounting head 12 sucks the reference nozzle 43 [see FIG. 7A] that has the same shape as the suction nozzle 13 that is normally used and has no foreign matter attached thereto. In this state, an image obtained by capturing the reference nozzle 43 with the camera 15 from the horizontal direction is taken as a reference nozzle image, and this reference nozzle image is binarized, and then the X coordinate direction for each Z coordinate of the reference nozzle image is set. The number of pixels is counted and stored in the RAM 24 (or rewritable nonvolatile memory) as shape reference data [see FIG. 7B].

  Then, during operation of the electronic component mounting machine, the CPU 22 of the imaging device 11 moves the suction nozzle 13 from the horizontal direction with the camera 15 in a state where the suction nozzle 13 is sucked to the suction holder 14 of the mounting head 12 (no suction component). After capturing and capturing the captured image of the suction nozzle 13 [see FIG. 8A], the captured image of the suction nozzle 13 is binarized, and then the X coordinate direction for each Z coordinate of the captured image of the suction nozzle 13 Are counted and stored in the RAM 24 as shape measurement data [see FIG. 8B]. Then, the shape measurement data of the suction nozzle 13 and the shape reference data are compared for each Z coordinate, and the difference in the number of pixels (or the absolute value thereof) is calculated for each Z coordinate. (Or the absolute value thereof) is greater than or equal to a predetermined threshold value, the presence or absence of foreign matter adhering to the suction nozzle 13 or the presence or absence of deformation of the suction nozzle 13 is inspected. At this time, the presence or absence of foreign matter or the presence or absence of deformation of the suction nozzle 13 is inspected based on whether or not the number of Z coordinates at which the difference between the numbers of pixels (or the absolute value thereof) is equal to or greater than a threshold is greater than or equal to a predetermined number. You may do it.

  By the way, it is conceivable to adopt an area comparison method in which the area of the reference nozzle image and the area of the picked-up image of the suction nozzle 13 are compared to check for the presence of foreign matter or the deformation of the suction nozzle 13. Since the ratio of the area change due to the adhesion of foreign matter and the deformation of the suction nozzle 13 is very small with respect to the area of 13 images, it is difficult to detect the adhesion of small foreign matter and the small deformation of the suction nozzle 13 by the area comparison method. is there.

  On the other hand, in the shape comparison method in which the number of pixels in the X coordinate direction is compared for each Z coordinate as in the present embodiment, the number of pixels in the X coordinate direction can be reduced even if a small foreign object is attached or the suction nozzle 13 is slightly deformed. Since there is a Z coordinate where the difference becomes large, it is possible to easily detect the attachment of small foreign matter and the small deformation of the suction nozzle 13, and accurately inspect the presence or absence of foreign matter attachment and the deformation of the suction nozzle 13. it can.

  In order to perform the image processing described above, the CPU 22 of the imaging device 11 executes the programs shown in FIGS. 9 and 10 stored in the ROM 23. Hereinafter, the processing contents of each program of FIGS. 9 and 10 will be described.

When the resolution measurement program of FIG. 9 is started, first, in step 101, the resolution measurement jig 42 having a predetermined dimension X [mm] × Z [mm] is imaged by the camera 15 as described above, and the X coordinate direction thereof is captured. The number of pixels Nx and the number of pixels Nz in the Z coordinate direction are counted, and the resolutions in the X coordinate direction and the Z coordinate direction are calculated by the following equations, respectively.
X coordinate direction resolution = X / Nx
Resolution in the Z coordinate direction = Z / Nz

  Thereafter, the process proceeds to step 102, where it is determined whether or not the resolution in the X coordinate direction and the Z coordinate direction is within the normal range. If the resolution is not within the normal range, the process returns to step 101, and again the X coordinate direction and the Z coordinate direction. The process of calculating the resolution in the coordinate direction and determining whether the resolution is within the normal range is repeated.

  If it is determined in step 102 that the resolution is within the normal range, the process proceeds to step 103, the resolution data is written in a rewritable nonvolatile memory such as an EEPROM, and the program is terminated.

  On the other hand, when the difference measurement program of FIG. 10 is started, first, at step 201, it is determined whether or not the reference image capturing instruction transmitted from the control computer of the electronic component mounting machine is received, and the reference image capturing instruction is issued. Wait for reception. Thereafter, when the reference image capturing instruction is received, the process proceeds to step 202, where the reference image capturing number counter i is set to the initial value “1”.

  Thereafter, the process proceeds to step 203, and after the image of the reference jig 41 (hereinafter referred to as “i-th reference jig 41”) attracted to the i-th nozzle position of the mounting head 12 is captured by the camera 15, the process proceeds to step 204. The height position (measurement reference position) of the lowest point of the i-th reference jig 41 is stored in the RAM 24 or a rewritable nonvolatile memory, and in the next step 205, the lowest position of the i-th reference jig 41 is stored. Data of the height position (measurement reference position) of the point is transmitted to the control computer of the electronic component mounting machine.

  Thereafter, the process proceeds to step 206, where the reference image imaging number counter i is incremented by 1. In the next step 207, the count value of the reference image imaging number counter i (the number of reference image imaging) is the nozzle suction of the mounting head 12. It is determined whether or not the number n has been exceeded, and if the count value of the reference image capturing number counter i is equal to or less than the number n of nozzle suctions, the processing of steps 203 to 206 described above is repeated to be sucked to the next nozzle position. The height position of the lowest point of the reference jig 41 is stored and transmitted.

  When the storage and transmission of the lowest height position is completed for the reference jigs 41 at all nozzle positions, “Yes” is determined in step 207 and the process proceeds to step 208 to control the electronic component mounting machine control computer. It is determined whether or not the difference measurement instruction transmitted from is received and waits until the difference measurement instruction is received. After that, when a difference measurement instruction is received, the process proceeds to step 209, where the object to be imaged (suction nozzle 13 or suction component 20) is imaged by the camera 15, and the height position of the lowest point of the object to be imaged (measurement target) Position).

  Then, in the next step 210, the height position (measurement reference position) of the lowest point of the reference jig 41 at the same nozzle position as the imaged object and the height position (measurement object) of the imaged object. After calculating the difference data (level difference) with respect to the position), the process proceeds to step 211, where the difference data is transmitted to the control computer of the electronic component mounting machine.

  According to the present embodiment described above, the CPU 22 of the imaging device 11 images the reference jig 41 with the camera 15 from the horizontal direction before the operation of the electronic component mounting machine, and the measurement reference position ( The height position of the lowest point is detected and the data is stored in the RAM 24 or the like, and the object to be imaged (the suction nozzle 13 or the suction component 20) is picked up by the camera 15 from the horizontal direction while the electronic component mounting machine is in operation. Then, the measurement target position (the height position of the lowest point) of the imaged object is detected, difference data between the measurement target position and the measurement reference position is calculated and transmitted to the control computer of the electronic component mounting machine. Since the control computer of this electronic component mounting machine checks the quality of the suction component 20 on the basis of the received difference data, the presence or absence of the suction component 20, or detects the thickness of the suction component 20. With image processing function Data to be transmitted from the imaging device 11 to the control computer of the electronic component mounting machine, rather than a large amount of image data, a small number of differential data subjected to image processing by the imaging device 11 side. For this reason, the time required for data communication processing between the imaging apparatus 11 side and the control computer side of the electronic component mounting machine can be greatly shortened, and the demand for high-speed processing can be satisfied. In addition, it is not necessary to mount an expensive high-speed communication function on the imaging device 11 side or the control computer side of the electronic component mounting machine, and there is an advantage that the communication function can be reduced in cost.

1 is a diagram schematically illustrating a configuration of a mounting head portion of an imaging device with an image processing function and an electronic component mounting machine in an embodiment of the present invention. FIG. It is a block diagram which shows the electrical constitution of the imaging device with an image processing function. (A) is a figure which shows the image of the reference | standard jig | tool imaged with the camera, (b) is a figure which shows the image of the suction nozzle imaged with the camera. (A) is a figure which shows the image of the reference | standard jig | tool imaged with the camera, (b) is a figure which shows the image at the time of normal adsorption | suction of the adsorption nozzle imaged with the camera, (c) is the adsorption | suction imaged with the camera It is a figure which shows the image at the time of the diagonal adsorption | suction of a nozzle. (A) is a figure which shows the full screen imaging data of a suction nozzle, (b) is a figure explaining the partial function which limits the scanning range of the imaging area of a camera, (c) is a figure explaining an operation direction. (D) is the image figure after a binarization process. It is a figure which shows the image of the resolution measuring jig imaged with the camera. (A) is a figure which shows the image of the reference | standard nozzle after a binarization process, (b) is a figure explaining shape reference | standard data. (A) is a figure which shows the image of the suction nozzle after a binarization process, (b) is a figure explaining shape measurement data. It is a flowchart which shows the flow of a process of a resolution measurement program. It is a flowchart which shows the flow of a process of a difference measurement program.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Imaging device with image processing function, 12 ... Mounting head, 13 ... Suction nozzle, 14 ... Suction holder, 15 ... Camera, 16 ... Display, 17 ... Illumination light source, 18 ... Main control board, 19 ... Prism, 20 ... Adsorption parts, 21 ... fluorescent reflector, 22 ... CPU (image processing means), 23 ... ROM, 24 ... RAM 24 (storage means), 25 ... control network IC, 41 ... reference jig, 42 ... resolution measuring jig, 43 ... Reference nozzle

Claims (8)

An imaging device with an image processing function used by being attached to a production device,
A camera for imaging an object to be imaged;
Storage means for storing data of the measurement reference position of the reference image;
Image processing for controlling the imaging operation of the camera and capturing image data of the imaged object output from the camera and outputting difference data between the measurement target position of the imaged object and the measurement reference position of the reference image And an image processing function-equipped imaging device.   The imaging apparatus with an image processing function according to claim 1, wherein the measurement target position of the imaging object is a height position of a lowest point of the imaging object.   The imaging apparatus with an image processing function according to claim 1, wherein the camera is installed such that a scanning direction is a longitudinal direction of the object to be imaged.   The imaging apparatus with an image processing function according to claim 1, wherein the reference image is an image captured by capturing a reference jig with the camera.   An imaging apparatus with an image processing function according to any one of claims 1 to 4 is attached to an electronic component mounting machine, and an electronic component sucked by a suction nozzle of the electronic component mounting machine (hereinafter referred to as "suction component") The picked-up image is picked up by the camera from the horizontal direction, and the difference data output from the image pickup device with an image processing function is taken into a control computer of the electronic component mounting machine, and the control computer uses the difference data. The inspection system is characterized by inspecting whether the suction state of the suction component is good or not, whether the suction component is present, or detecting the thickness of the suction component.   An imaging apparatus with an image processing function according to any one of claims 1 to 4 is attached to an electronic component mounting machine, the suction nozzle of the electronic component mounting machine is set as the imaging target, and the suction nozzle is moved from the horizontal direction by the camera. An inspection system that takes an image and takes in the difference data output from the imaging device into a control computer of the electronic component mounting machine, and inspects the quality of the suction nozzle by the control computer based on the difference data . The inspection system according to claim 5 or 6,
The image processing means of the imaging apparatus picks up the reference jig from the horizontal direction with the camera in a state where the reference jig is adsorbed to the adsorption holder that adsorbs and holds the adsorption nozzle instead of the adsorption nozzle. An inspection system using an acquired image as the reference image. The inspection system according to claim 7,
The storage means stores the height position of the lowest point of the reference jig as the measurement reference position, and the image processing means of the imaging device is the height of the lowest point of the suction nozzle imaged by the camera. The difference in height between the position and the measurement reference position of the reference jig is output as difference data,
The control computer of the electronic component mounting machine detects a lowering amount until the reference jig is brought into contact with the board mounting surface in a state where the reference jig is sucked into the suction holder, and this reference stroke is detected. An inspection system for correcting the difference data to determine a stroke of the suction nozzle during mounting work.

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