JP2011082506A - Device for inspecting or mounting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce cost and burdens required for inspecting an elctronic component. <P>SOLUTION: The component inspection device 110 includes a holding part 7 for holding a component P, and an imaging part 9 for imaging the component, and inspects displacement of the component from the center of the holding part by an imaging image shot by the imaging part. In the component inspection device, the imaging part includes: a pixel data determination means 13 to capture a plurality of images having different distances to the component, and determining focused pixel data in pixels at the same location out of the plurality of shot imaging images; a distance data determination means 13 to determine the distances between the imaging parts and the component when the respective determined pixel data have been shot, on a pixel data basis; a storage means 13d to store a permissible value of the distance from a virtual line or virtual plane of a predetermined part of the component obtained from the distance data; and a determination means 13 to determine whether the distance from the virtual line or virtual plane of the predetermined part of the component exceeds the permissible value stored in the storage means. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component inspection apparatus and a component mounting apparatus.

An electronic component mounting apparatus for mounting an electronic component on a substrate is known.
The electronic component mounting apparatus sucks an electronic component with a suction nozzle, moves the suction nozzle to a predetermined mounting position, and attaches the electronic component to the substrate.
Here, the electronic component mounting apparatus picks up an image of the electronic component with a component recognition camera before mounting the electronic component on the substrate, and detects the positional deviation amount of the electronic component with respect to the suction nozzle. After that, the electronic component is moved to an electrode inspection device for inspecting whether or not the state of the electrode is normal, and the defect inspection such as the floating of the electrode of the electronic component is performed by the electrode inspection device. Mounted on the board. That is, the detection of the amount of displacement of the electronic component and the inspection of the electrodes are performed by dedicated devices.
In addition, there is an electrode inspection device arranged in the vicinity of the component recognition camera, and the electrode inspection device irradiates parallel light toward the electrode of the electronic component above the component recognition camera obliquely from below to inspect the electrode. . With this configuration, if the electronic component is moved above the component recognition camera, the electronic component can be misaligned and the electrode can be inspected at the same position, improving the inspection efficiency. (For example, refer to Patent Document 1).

Japanese Patent No. 3378077

However, in the electronic component mounting apparatus as described above, it is necessary to provide an electrode inspection device separately from the component recognition camera for the electrode inspection before mounting the electronic component on the board. There is a problem that the cost of the electrode inspection apparatus is high, such as irradiating a parallel light beam.
Also, since different devices are used for recognizing the positional deviation of the electronic component by the suction nozzle and for inspecting the electrode of the electronic component, different data is acquired. As a result, when inspecting the electrode, the position of the feature point of the electronic component (for example, the tip position of the lead) at the time of recognizing the misalignment and the position of the feature point of the electronic component at the time of the electrode inspection are detected. The detection has to be performed separately, and there is a problem that it takes time to inspect the electronic parts.

  The present invention has been made to solve the above-described problems, and reduces the cost required for inspecting a component (for example, an electronic component) mounted on an object to be mounted such as a substrate, and also inspecting the electronic component. It is an object of the present invention to provide a component inspection apparatus and a component mounting apparatus that can reduce the labor required for work.

In order to solve the above-mentioned problem, the invention described in claim 1
A holding unit that holds a component and an imaging unit that captures an image of the component held by the holding unit, and inspects the positional deviation of the component from the center of the holding unit based on a captured image captured by the imaging unit. In parts inspection equipment,
The imaging unit captures a plurality of images having different distances from the imaging unit to the component,
Pixel data determining means for determining focused pixel data in pixels at the same position from among a plurality of captured images captured by the imaging unit;
Distance data determining means for determining, for each pixel data, a distance between the imaging unit and the component when each pixel data determined by the pixel data determining means is imaged;
Storage means for storing an allowable value of a distance from a virtual straight line or a virtual plane of a predetermined part of the component obtained from the distance data in order to determine whether or not the component satisfies a predetermined criterion;
Determination means for determining whether a distance from a virtual straight line or a virtual plane of the predetermined part of the component obtained from the distance data exceeds an allowable value stored in the storage means;
It is characterized by providing.

The invention according to claim 2 is the component inspection apparatus according to claim 1,
A moving unit that moves at least one of the holding unit and the imaging unit so as to be in contact with or separated from the other; and
Imaging control means for causing the imaging unit to image the component together with the holding unit each time the holding unit and the imaging unit move by a predetermined distance by the moving unit;
It is characterized by providing.

The invention according to claim 3 is the component inspection apparatus according to claim 2,
Fixing the imaging unit;
The moving unit moves the holding unit in a direction along an optical axis direction of an optical system of the imaging unit.

The invention according to claim 4 is the component mounting apparatus,
The component inspection apparatus according to any one of claims 1 to 3,
A transport unit that moves the holding unit to transport the component to a mounting position;
When it is determined by the determination means that at least one of the distances from the virtual straight line or the virtual plane of the predetermined part of the part obtained from the distance data exceeds the allowable value stored in the storage means, A transport control means for causing the transport unit to eject the component without transporting it to a mounting position;
It is characterized by providing.

The invention according to claim 5 is the component mounting apparatus according to claim 4,
A center in which the center position deviation amount of the image corresponding to the distance from the imaging unit to the component is calculated in advance for image data obtained by the imaging unit capturing a plurality of images having different distances from the imaging unit to the component. It is characterized by comprising a misregistration correction means for correcting image data by a misregistration correction table.

The invention according to claim 6 is the component mounting apparatus according to claim 4 or 5,
A center in which the center position deviation amount of the image corresponding to the distance from the imaging unit to the component is calculated in advance for image data obtained by the imaging unit capturing a plurality of images having different distances from the imaging unit to the component. The image processing apparatus includes a magnification correction unit that corrects image data using a displacement correction table or a magnification correction table in which an amount of change in image size corresponding to a distance from the imaging unit to the component is calculated in advance.

The invention according to claim 7 is the component mounting apparatus according to any one of claims 4 to 6,
Imaging is performed at a plurality of positions during movement until the holding unit that holds the part reaches the imaging unit, and the pixel data determination unit focuses on the pixels at the same position based on image data obtained by the imaging. And an optimum environment determining unit that performs preprocessing for setting an optimum position in a range in which a plurality of images with different distances from the imaging unit to the component are obtained to obtain pixel data.

According to the first aspect of the present invention, the imaging unit captures a plurality of images having different distances from the imaging unit to the component. Then, the pixel data determination unit determines focused pixel data for the pixel at the same position from among a plurality of captured images captured by the imaging unit.
The distance data determining unit determines the distance between the imaging unit and the component for each pixel data when each pixel data determined by the pixel data determining unit is imaged.
Then, the determination unit determines whether or not the distance from the virtual straight line or the virtual plane of the predetermined part of the part obtained from the distance data exceeds the allowable value stored in the storage unit.
As a result, only the pixel data with focus at each pixel position (position coordinate) is extracted using only the imaging unit that inspects the positional deviation of the component from the center of the holding unit, and the focus is achieved at all pixel positions. An omnifocal image can be created, and by determining the distance data of each pixel data of the omnifocal image, it is possible to detect which part of the component has a defect.
That is, when the imaging unit captures a plurality of images and processes the images, the positional deviation of the component from the center of the holding unit and the inspection of the component itself can be performed.
Therefore, it is not necessary to provide both a device for recognizing the positional deviation of the component and a device for inspecting the component itself as in the conventional case, and thus the cost for inspecting the component mounted on the mounting target can be reduced. Can do. In addition, since the position of the feature point of the part at the time of inspection of the positional deviation of one part and at the time of inspection of the part itself can be detected from the same image, the work of taking consistency of each data becomes unnecessary, It is possible to reduce the time and labor required for parts inspection.

According to the second aspect of the invention, the imaging control means causes the imaging unit to image the component together with the holding unit every time the holding unit and the imaging unit move by a predetermined distance by the moving unit.
Thereby, a captured image can be acquired for every predetermined distance interval, and it becomes easy to grasp the relationship between the pixel data of the captured image and the distance to the imaging unit.

According to the third aspect of the present invention, the imaging unit is fixed, and the holding unit is moved by the moving unit in the optical axis direction of the optical system of the imaging unit, so that the imaging unit and the components held by the holding unit are The distance can be changed.
Thereby, the imaging unit can capture a plurality of images having different distances. In addition, since an optical system is provided, an image with less blur can be captured by fixing an imaging unit that requires positioning accuracy.

According to the invention of claim 4, it is determined that at least one of the distances from the virtual straight line or the virtual plane of the predetermined part of the part obtained from the distance data exceeds the allowable value stored in the storage unit. If it is determined, the conveyance control means causes the conveyance unit to discharge the component without conveying it to the mounting position.
As a result, if at least one of the distances from the virtual straight line or virtual plane of the predetermined part of the part obtained from the distance data exceeds the allowable value, the part is considered to be not normal. It is possible to prevent a defective part from being mounted on a predetermined mounting object by discharging the battery without discharging.

  According to the fifth aspect of the present invention, the correction is performed by the center position shift correction table for correcting the shift amount of the center position of the image of the image data. Even if there is a discrepancy between the movement trajectory of the center position of the component when imaging by changing the distance up to, it is possible to eliminate the effect of image misalignment caused by it, It becomes possible to perform component inspection with higher accuracy.

  According to the invention described in claim 6, even when a non-telecentric lens is used in the optical system of the imaging unit, it is possible to eliminate the influence of fluctuations in the size of the image at each position caused by it, It becomes possible to perform component inspection with higher accuracy.

  According to the seventh aspect of the present invention, it is possible to obtain an optimum position of a range in which a plurality of images with different distances from the imaging unit to the component are captured during component movement. Thereby, an optimal imaging range that does not depend on the set value can be automatically set.

The perspective view of a component mounting apparatus provided with a component inspection apparatus. The block diagram which shows the structure regarding a control part. The flowchart which shows the flow of component inspection. The figure explaining the imaging method of components. The figure which shows the image produced with the imaging distance data of each pixel. The flowchart which shows the flow of the optimal environment determination process. FIG. 7A is a diagram for explaining an imaging method for a component for an optimum environment. FIG. 7A shows the relationship between the position change seen from the front direction of the component at the time of imaging and the processing to be executed, and FIG. The state which looked at the position change of the components at the time of the imaging of (A) from the plane direction is shown. The figure explaining the imaging range before the update by the optimal environment determination process (setting range) and after the update (optimum range). FIGS. 9A to 9C are diagrams illustrating changes in the position of the captured image at each position in the Z direction when the optical axis of the imaging unit and the axis of the suction nozzle do not match. It is a figure which shows the surface which faces a component recognition camera of a correction target. FIGS. 11A to 11C are diagrams illustrating changes in the size of a captured image at each position in the Z direction when a non-telecentric lens is used.

Embodiments of a component inspection apparatus and a component mounting apparatus according to the present invention will be described. Since the component inspection apparatus is a part of the component mounting apparatus, it will be described together with the component mounting apparatus.
<Configuration of component mounting device>
As shown in FIG. 1, the component mounting apparatus 100 is an apparatus that mounts an electronic component (component) supplied from a component supply device on a substrate (mounting object).
The component mounting apparatus 100 includes a base 1 that serves as a base. A substrate transport path 2 that transports the substrate B is provided on the upper surface of the base 1 so as to extend in the X direction slightly behind the center of the upper surface. A component supply unit 3 for mounting the electronic component P on the board B is provided in front of the base unit 1. The component supply unit 3 stores an electronic component P mounted on the board B.

An X transport section 5 (transport section) that extends in the X direction and guides the head section 4 so as to be reciprocally movable in the X direction and an Y transport direction that extends in the Y direction. A Y transport unit 6 (transport unit) that reciprocally guides in a direction is provided.
The X transport unit 5 is provided in the Y transport unit 6 so as to be movable along the Y direction on the Y transport unit 6. The X transport unit 5 is provided with a head unit 4 so as to be movable along the X direction. In other words, the X conveyance unit 5 and the Y conveyance unit 6 can move the head unit 4 in the XY direction to move the electronic component P to the mounting position of the substrate B.

The head portion 4 holds the electronic component P by suction and picks up the suction nozzle 7 (holding portion) that conveys the electronic component P to the mounting position of the substrate B, and images the substrate B from above the substrate B to recognize the presence of the substrate B. A substrate recognition camera 8 is provided. Here, since the suction nozzle 7 is provided in the head unit 4, the electronic component P can be moved to the mounting position of the substrate B by driving the transport units 5 and 6.
The suction nozzle 7 is connected to a moving unit 14 (see FIG. 2) that moves the suction nozzle 7 along the Z direction in FIG. The moving unit 14 is a mechanism using a motor that can control the amount of movement, such as a stepping motor, a ball screw, or the like.
A component recognition camera 9 (imaging unit) adjacent to the component supply unit 3 is provided on the upper surface of the base unit 1.
The component recognition camera 9 is a camera that images the electronic component P sucked and held by the suction nozzle 7 together with the suction nozzle 7 from below. The component recognition camera 9 is fixed on the upper surface of the base unit 1 in such a posture as to be able to capture an image directly above. That is, the optical axis of the optical system of the component recognition camera 9 coincides with the Z axis.
Therefore, based on the relationship between the direction in which the suction nozzle 7 can move and the arrangement of the component recognition camera 9, the suction nozzle 7 moves up and down in the direction along the optical axis direction of the optical system of the component recognition camera 9 by the moving unit 14. can do. Thereby, the electronic component P held by the suction nozzle 7 can be moved toward and away from the component recognition camera 9, and the component recognition camera 9 changes the distance to the electronic component P and images the electronic component P. be able to.
The base part 1 is provided with a cover 11 that covers each part provided on the base part 1, and an operation panel 12 for operating the electronic component mounting apparatus 100 is provided on a part of the cover 11. It has been. The operation panel 12 can input an instruction from the user and can display information notified to the user.

A control unit 13 that controls driving of each driving unit of the electronic component mounting apparatus 100 is provided in the base unit 1.
The control unit 13 performs arithmetic processing on the captured image captured by the component recognition camera 9 and inspects the positional deviation of the electronic component P from the center of the suction nozzle 7. That is, the control unit 13 inspects whether or not the electronic component P is held in the suction nozzle 7 in a correct state. This is because the suction nozzle 7 transports the electronic component P immediately above the mounting position of the substrate B. Therefore, if the electronic component P is not held at the correct position of the suction nozzle 7, the electronic component P is placed at the mounting position of the substrate B. This is because it cannot be implemented.
The control unit 13 checks whether or not the electronic component P is normal by calculating the position of the feature point of the electronic component P, for example, the position of the electrode. This is because the electronic component P cannot be mounted at the mounting position of the substrate B if the electrodes of the electronic component P are missing or bent. And when the state of the electronic component P is defective, the position where the electrode or the like is detected in the captured image is greatly different. Therefore, the captured image used when inspecting the positional deviation of the electronic component P with respect to the suction nozzle 7. The electronic component P can be inspected using the same captured image.

  As shown in FIG. 2, the control unit 13 includes a CPU 13a that performs each arithmetic processing, a RAM 13b that is a work space for the CPU 13a, a ROM 13c that stores arithmetic programs and the like by the CPU 13a, and an EEPROM 13d that stores rewritable data and the like. And.

  In the EEPROM 13d, in order to determine whether or not the electronic component P satisfies a predetermined standard for mounting on the substrate B, distance data between the component recognition camera 9 and the predetermined part of the electronic component P when each pixel data is imaged. The allowable value of the distance from the virtual straight line or virtual plane of the predetermined part (for example, electrode) of the electronic component P obtained from the above is stored. Therefore, the EEPROM 13d functions as a storage unit.

The ROM 13c is executed by the CPU 13a so as to realize a function of causing the component recognition camera 9 to image the electronic component P together with the suction nozzle 7 every time the suction nozzle 7 is moved in the Z direction by the moving unit 14. A control program is stored. The component recognition camera 9 can capture a plurality of images with different distances to the electronic component P by executing the imaging control program by the CPU 13a.
Therefore, when the CPU 13a executes the imaging control program, the control unit 13 functions as an imaging control unit.

The ROM 13c includes a pixel data determination program that, when executed by the CPU 13a, realizes a function of determining focused pixel data at a pixel at the same position from a plurality of captured images captured by the component recognition camera 9. It is remembered.
Therefore, when the CPU 13a executes the pixel data determination program, the control unit 13 functions as a pixel data determination unit.

The ROM 13c is executed by the CPU 13a to realize a function of determining the distance between the component recognition camera 9 and the electronic component P for each pixel data when each pixel data determined by the execution of the pixel data determination program is imaged. A distance data determination program is stored.
Therefore, when the CPU 13a executes the distance data determination program, the control unit 13 functions as a distance data determination unit.

The ROM 13c realizes a function of determining whether a distance from a virtual straight line or a virtual plane of a predetermined part (for example, an electrode) of the electronic component P obtained from the distance data exceeds an allowable value stored in the EEPROM 13d. A judgment program is stored.
Therefore, when the CPU 13a executes the determination program, the control unit 13 functions as a determination unit.

In the ROM 13c, it is determined that at least one of the distances from a virtual straight line or a virtual plane of a predetermined part (for example, an electrode) of the electronic component P obtained from the distance data exceeds the allowable value stored in the EEPROM 13d. A transfer control program that realizes a function of driving the X transfer unit 5 and the Y transfer unit 6 to discharge the electronic component P without transferring it to the mounting position of the substrate B when it is determined by execution is stored. .
Therefore, when the CPU 13a executes the conveyance control program, the control unit 13 functions as a conveyance control unit.

The ROM 13c picks up the electronic component P by the suction nozzle 7 and then picks up a plurality of times while moving the suction nozzle 7 in the X, Y, and Z directions to the position immediately above the component recognition camera 9 to obtain an optimal image. An optimum environment determination program for realizing a function for determining a range and an optimum illumination pattern is stored.
Therefore, when the CPU 13a executes the optimum environment determination program, the control unit 13 functions as an optimum environment determination unit that determines an imaging distance range and an optimal illumination value that are optimal for imaging.

The control unit 13 is electrically connected to the X transport unit 5, the Y transport unit 6, the board recognition camera 8, the component recognition camera 9, the lighting unit 10, and the operation panel 12. Control related to the driving of
The component mounting apparatus 100 includes each of the above-described components. Among these components, the component inspection apparatus 110 includes the suction nozzle 7, the component recognition camera 9, the illumination unit 10, the moving unit 14, and the control unit 13. Yes.

<Electronic component misalignment inspection and defect inspection processing>
The component mounting apparatus 100 will be described with respect to an inspection of the positional deviation of the electronic component P with respect to the suction nozzle 7 and a defect inspection of the electronic component P (exemplification of electrode floating inspection).
As shown in FIG. 3, first, the user sets the electronic component P for inspecting the electrode, sets the imaging distance (height) range captured by the component recognition camera 9, sets the imaging interval, and the like. This is performed from the operation panel 12 (step S1).
Here, the imaging distance range setting refers to an imaging distance range in which a plurality of images are captured, and the range is such that the electronic component P is in the Z direction centering on the position where the component recognition camera 9 is focused on the electrode. The same distance is taken along the direction of approaching the component recognition camera 9 and the direction of separation.
Specifically, as shown in FIG. 4, +0.5 mm (upper limit value) and −0.5 mm (lower limit value) are set along the Z direction from the focal position of the component recognition camera 9. Therefore, the component recognition camera 9 can capture an image within a range of 1 mm in the Z direction.
The imaging interval is an interval of a distance at which the component recognition camera 9 performs imaging within the 1 mm imaging range set in this way.
Specifically, the distance interval is set to 0.05 mm. Thereby, the component recognition camera 9 can capture 21 images within the set imaging range.

When each setting is completed and the user inputs an instruction to start mounting from the operation panel 12, the control unit 13 controls driving of each unit and starts mounting the electronic component P on the board B (step S2).
When the mounting of the electronic component P is started, the control unit 13 drives the X transport unit 5 and the Y transport unit 6 to move the suction nozzle 7 to the component supply unit 3. Then, the control unit 13 drives the moving unit 14 to lower the suction nozzle 7 to suck and hold the electronic component P (step S3).
Next, the control unit 13 drives the X transport unit 5 and the Y transport unit 6 to move the suction nozzle 7 directly above the component recognition camera 9 (step S4).
At this time, the control unit 13 executes the above-described process as the optimum environment determination means (referred to as the optimum environment determination process) in the process of moving the suction nozzle 7 to the component recognition camera 9. Details of such processing will be described later.

  Next, the control unit 13 drives the moving unit 14 to move the suction nozzle 7 holding the electronic component P up and down along the Z direction so that the component recognition camera 9 is focused on the electrode of the electronic component P. The electronic component P is moved to the position. After the focus is set on the electrode, the control unit 13 drives the moving unit 14 to electronically reach the highest position in the imaging range set in step S1 (upper limit value of imaging distance (position +0.5 mm from the focal position)). The part P is raised. After rising, the control unit 13 causes the component recognition camera 9 to image the electronic component P.

  Next, the control unit 13 drives the moving unit 14 to lower and stop the imaging interval (distance 0.05 mm) set in step S <b> 1, and causes the component recognition camera 9 to image the electronic component 9 after the stop. Thereafter, the control unit 13 drives the moving unit 14 to lower the electronic component P by 0.05 mm to the lowest position of the imaging range (lower limit of imaging distance (position of −0.5 mm from the focal position)). However, the electronic component P is imaged by the component recognition camera 9. As described above, when an imaging range of 1 mm in the Z direction is imaged every 0.05 mm, a total of 21 captured images with different imaging distances can be acquired. After capturing all the captured images, the control unit 13 stores the image data in the EEPROM 13d (step S5).

Next, the control unit 13 compares 21 pixels at the same position from 21 images stored in the EEPROM 13d, extracts pixel data that is most focused on each pixel, and focuses on all the pixels. An omnifocal image is created (steps S6 and S7).
Here, as a method for extracting only focused pixel data, for example, a known 7 × 7 difference filter is applied to all captured images, and the pixel data is obtained at the same pixel position in all the images. This is realized by selecting the pixel data and the position of the position where the filter result shows the highest value.

Next, after creating the omnifocal image and the position image of the imaging distance (step S8: YES), the control unit 13 detects the electrode position of the electronic component P using the created omnifocal image (step S8). S9). This can be easily performed by using the fact that the pixel data of the electrode and the background where nothing exists are greatly different from each other by comparison with the surrounding pixel data.
Next, the control unit 13 calculates the center position of the electronic component P from the detected electrode position, and calculates the positional deviation in the X-axis direction and the Y-axis direction with respect to the suction nozzle 7 (step S10). Thereby, it is possible to know in which direction and how much the electronic component P is sucked with respect to the suction nozzle 7.

Next, the control unit 13 creates a position image of the imaging distance (height from the component recognition camera 9) when the extracted pixel data is imaged (step S11).
Here, the position image of the imaging distance is data created by associating the imaging distance (height) when the pixel data adopted for each pixel is acquired with each pixel position, as shown in FIG. . Here, in any captured image, if there is no focused pixel data, the electronic component P is not present and the data is “0”. In addition, when inspecting an electrode, for example, in the case of a lead component, there is a parameter for specifying a position to measure the distance from the tip of the lead, and an imaging distance (height position) with reference to this position data Will be detected.
Next, after calculating the imaging distance of each electrode of the electronic component P, the control unit 13 uses, for example, a method as disclosed in Japanese Patent Application Laid-Open No. 2003-130619, the distance from the virtual straight line of each lead terminal of each side, Alternatively, the distance from the virtual plane of each lead terminal is calculated (step S12).
Next, the control unit 13 determines whether or not the distance calculated in step S12 is within an allowable value (step S13). That is, based on the calculated distance from the least-squares line or the least-squares plane, the amount of floating of the lead serving as an electrode is detected, and the detected amount of floating of the lead is the tolerance of the amount of floating of the lead stored in the EEPROM 13d. It is determined whether or not the value is exceeded (step S13).

  In step S13, when the control unit 13 determines that the distance from the virtual straight line or the distance from the virtual plane is not within the allowable value (step S13: YES), that is, the lead floating amount detected by the control unit 13 Is determined to exceed the allowable value (step S13: YES), the control unit 13 drives the X conveyance unit 5 and the Y conveyance unit 6 to place the electronic component P held by the suction nozzle 7 on the substrate. It is discarded in a predetermined external location without being mounted on B (step S14).

On the other hand, when the control unit 13 determines that the distance from the virtual straight line or the distance from the virtual plane is within the allowable value (step S13: NO), that is, the lead floating amount detected by the control unit 13 is allowable. When it is determined that the value has not been exceeded (step S13: NO), the control unit 13 causes the electronic component P held by the suction nozzle 7 to be mounted on the substrate B (step S15).
Next, the control unit 13 determines whether or not the mounting process of the electronic component P on the board B has been completed (step S16), and if the control unit 13 determines that the process has been completed (step S16: YES) The control unit 13 returns to the process of step S2 if it is determined that the process is terminated and it is determined that the process has not been terminated (step S16: NO).

<Optimum environment determination process>
In the component mounting apparatus 100, a preparation process for determining an optimum environment for the inspection of the positional deviation of the electronic component P with respect to the suction nozzle 7 and the defect inspection of the electronic component P will be described based on the flowchart of FIG.
The preparatory process for determining the optimum environment is the movement from the suction of the electronic component P by the suction nozzle 7 to the position immediately above the component recognition camera 9 in the above-described processing of the positional deviation inspection and the defect inspection of the electronic component P (FIG. 3: step). It is carried out until S4).

  After the electronic component P is sucked by the holding unit in step S3, the control unit 13 drives the X transport unit 5 and the Y transport unit 6 so that part or all of the suction nozzle 7 or the electronic component P of the component recognition camera 9 is driven. The suction nozzle 7 is moved to a position that falls within the imaging range (taken as an imaging start position for the optimum environment) (FIG. 6, step S201).

At the imaging start position for the optimum environment, the control unit 13 turns on the illumination unit 10 and changes the intensity of illumination. Then, the control unit 13 causes the component recognition camera 9 to image the electronic component P.
Next, the control unit 13 drives the X transport unit 5 and the Y transport unit 6 to move them by a predetermined distance. Further, the suction nozzle 7 is moved in the Z direction by a predetermined distance by the moving unit 14. Thereafter, the control unit 13 changes to the illumination intensity stored in advance in the EEPROM 13d, and repeats imaging for the set number of times while moving (step S202).
Specifically, as shown by p1, p2, and p3 in FIG. 7, the illumination intensity is changed at a position after the position of the suction nozzle 7 has moved by a predetermined distance in each of the X direction, the Y direction, and the Z direction, and imaging is performed. I do. Three candidate values that are recognized to be appropriate to some extent are provided in the EEPROM 13d for the illumination intensities at the respective positions p1 to p3.

Next, the control unit 13 calculates the optimum illumination intensity from the plurality of images captured in step S202, and stores the optimum illumination intensity in the EEPROM 13d as the optimum illumination intensity for rough positioning (step S203).
For example, the illumination intensity calculation for determining the optimum illumination intensity obtains the brightness value of the feature point (for example, the lead position) of the electronic component P in each of the images obtained by the multiple times of imaging, and the brightness value of the feature point And the upper limit brightness value set in advance, and the illumination intensity at the time of capturing an image where the brightness value of the feature point does not exceed the upper limit brightness value is set to the optimum illumination intensity, or obtained by multiple imaging. In each of the images, there is a method of obtaining a contrast value in the vicinity of the feature point of the electronic component P and setting the illumination intensity at the time of capturing an image with the clearest contrast as the optimum illumination intensity.
In addition, when adopting a method for determining the illumination intensity depending on whether the luminance value of the feature point exceeds the upper limit luminance value, if there are multiple illumination intensity levels that do not exceed the upper limit luminance value, the lowest illumination intensity among them To be determined.

Next, the control unit 13 turns on the illumination unit 10 and changes the illumination intensity to the optimum illumination intensity for the rough positioning (the illumination intensity obtained in step S203). Then, the control unit 13 causes the component recognition camera 9 to image the electronic component P. The control unit 13 drives the X transport unit 5 and the Y transport unit 6 to move them by a predetermined distance. Further, the suction nozzle 7 is moved in the Z direction by a predetermined distance by the moving unit 14. (Step S204).
Specifically, as shown by even-numbered positions (p4, p6, p8...) Of p4 or more in FIG. 7, the position of the suction nozzle 7 is a position moved by a predetermined distance in the X direction, Y direction, and Z direction, respectively. Take an image.

Next, the control unit 13 turns on the illumination unit 10 and changes the illumination pattern. As the illumination pattern, the value of the illumination pattern table prepared in advance is used. Then, the control unit 13 causes the component recognition camera 9 to image the electronic component P. The control unit 13 drives the X transport unit 5 and the Y transport unit 6 to move them by a predetermined distance. Further, the suction nozzle 7 is moved in the Z direction by a predetermined distance by the moving unit 14 (step S205).
Specifically, as shown in odd-numbered positions (p5, p7, p9...) Of p5 or more in FIG. 7, the position of the suction nozzle 7 is a position moved by a predetermined distance in the X direction, Y direction, and Z direction, respectively. Take an image.

  Thereafter, the control unit 13 repeats Steps S204 and S205 until it moves to the set number of times or the imaging end position for the optimum environment (for example, the position immediately above the component recognition camera 9) (Step S206). A plurality of illumination patterns are prepared in step S205, and each time step S205 is performed, the illumination pattern is changed to an unused illumination pattern.

  In step S201, step S202, step S204, and step S205 described above, after all the captured images are captured, the image data is stored in the EEPROM 13d.

Next, the control unit 13 determines the optimum imaging range from the image for coarse positioning, which is captured in step S204 and stored in the EEPROM 13d, and the imaging range in the Z-axis direction set from the outside stored in the EEPROM 13d. Are updated in the optimum imaging range (step S207).
Specifically, as shown in FIG. 8, the imaging range in the Z-axis direction, which has been widely set in advance for performing the processing after step S6 in FIG. 3, is updated to the optimum imaging range by performing the same processing. To do.

  For example, the optimum imaging range is obtained by executing the pixel data determination program and the distance data determination program stored in the ROM 13c on the local region centered on the feature point of the electronic component P, and centering on the obtained distance. A method of setting a range having a predetermined width as an optimal imaging range, or obtaining a contrast value near the feature point of the electronic component P, and images having a low contrast value before and after a position where an image having a high contrast value is captured A method for obtaining an optimum imaging range between the two imaged positions is obtained.

  That is, in the case of the pixel data determination program and the distance data determination program, the feature points of the electronic component P are calculated from the image data at the even-numbered positions (p4, p6, p8. 7 is used to obtain focused pixel data, and the imaging distance when the focused pixel data is imaged is calculated. A range having a predetermined width in the vertical direction with the imaging distance as the center is set as a new imaging range.

  Further, in the case of using the contrast value near the feature point, the upper and lower position ranges are obtained from the position where the contrast value is maximized until the contrast value becomes somewhat lower than the maximum value, and this is referred to as a new imaging range. To do.

In addition, the control unit 13 determines an optimal illumination pattern from a plurality of images for the illumination pattern captured in step S205 and stored in the EEPROM 13d, and determines the illumination pattern stored in the EEPROM 13d as the optimal illumination pattern. (Step S208).
Specifically, the optimum illumination pattern is obtained by obtaining a contrast value near the feature point of the electronic component P, and the illumination pattern at the time of capturing an image in which the contrast value is closest to a preset reference contrast value is the optimum illumination pattern. There are ways to make it.

  The process of step S5 in FIG. 3 is performed reflecting the illumination pattern obtained by the above preprocessing and the optimum imaging range.

<Effect>
As described above, according to the component inspection apparatus 110 and the component mounting apparatus 100, the component recognition camera 9 captures a plurality of images having different distances from the component recognition camera 9 to the electronic component P. And the control part 13 determines the focused pixel data in the pixel of the same position from the some captured images imaged with the components recognition camera 9 by execution of a pixel data determination program, and produces an all-focus image To do.
And the control part 13 determines the distance of the component recognition camera 9 and the electronic component P when each determined pixel data is imaged for every pixel data by execution of the distance data determination program.
And the control part 13 determines whether the distance from the virtual straight line or virtual plane of the lead | read | reed of the electronic component P calculated | required from distance data exceeds the tolerance | permissible value memorize | stored in EEPROM13d by execution of a determination program.
As a result, only the focused pixel data at each pixel position (positional coordinate) is extracted by using only the component recognition camera 9 that inspects the positional deviation of the electronic component P from the center of the suction nozzle 7, and all the pixels are extracted. It is possible to create an omnifocal image that is in focus at the position, and by determining the distance data of each pixel data of the omnifocal image, it is possible to detect which part of the component is defective.
That is, the component recognition camera 9 captures a plurality of images and processes the images, so that the positional deviation of the electronic component P from the center of the suction nozzle 7 and the inspection of the electronic component P itself can be performed. become.
Therefore, it is not necessary to provide both a device for recognizing the positional deviation of the electronic component P and a device for inspecting the electronic component P as in the prior art, so that it is necessary to inspect the electronic component P mounted on the board B. Cost can be reduced. Further, since the position of the feature point (lead position, etc.) of the electronic component P can be detected from the same image at the time of inspection of the positional deviation of one electronic component P and at the time of inspection of the electronic component P itself, each data This eliminates the need for the work of ensuring the consistency of the electronic parts P, and can reduce the labor required for the work of inspecting the electronic component P.

The control unit 13 causes the component recognition camera 9 to image the electronic component P together with the suction nozzle 7 every time the suction nozzle 7 and the component recognition camera 9 move by a predetermined distance by the moving unit 14.
Thereby, a captured image can be acquired for every predetermined distance interval, and it becomes easy to grasp the relationship between the pixel data of the captured image and the distance to the component recognition camera 9.

In addition, the component recognition camera 9 is fixed, and the suction nozzle 7 is moved by the moving unit 14 in the optical axis direction of the optical system of the component recognition camera 9, so that the electronic component held by the component recognition camera 9 and the suction nozzle 7. The distance from P can be changed.
Thereby, the component recognition camera 9 can capture a plurality of images having different distances. Further, by fixing the component recognition camera 9 that requires positioning accuracy because of the optical system, it is possible to capture an image with less blur.

Moreover, by execution of the determination program by the control unit 13, at least one of the distances from the virtual straight line or the virtual plane of the predetermined part (electrode) of the electronic component P obtained from the distance data exceeds the allowable value stored in the EEPROM 13d. If it is determined, the control unit 13 causes the X conveyance unit 5 and the Y conveyance unit 6 to discharge the electronic component P without conveying it to the mounting position of the substrate B by executing a conveyance control program. .
Thereby, it is considered that the electronic component P is not normal when at least one of the distances from the virtual straight line or the virtual plane of the predetermined part (electrode) of the electronic component P obtained from the distance data exceeds the allowable value. Therefore, it is possible to prevent the defective electronic component P from being mounted on the substrate B by discharging the electronic component P without mounting it.

In addition, even if the predetermined part is normal without the virtual straight line or the distance from the virtual plane exceeding the allowable value, the virtual plane is set in advance with an allowable value for the virtual plane itself separately from the allowable value, When this is exceeded, it can be judged that it is not normal to mount the part and discharged.
That is, by setting an allowable value for the inclination of the virtual straight line or the virtual plane and determining whether it is appropriate, it is possible to more strictly eliminate the mounting of defective electronic components.

<Other 1>
If the optical axis of the imaging unit 9 shown in FIG. 4 does not coincide with the axis of the suction nozzle 7 at the time of imaging in step S5 described above, the suction nozzle 7 is moved Z with respect to the component recognition camera 9 by the moving unit 14. When the electronic component P is imaged together with the suction nozzle 7 by the component recognition camera 9 every time a predetermined distance is moved in the direction, as shown in FIGS. 9 (A) to 9 (C), the center of the object to be imaged is shifted. Arise.
In order to correct this deviation, as shown in FIG. 10, a correction target 100 in which the positions of a plurality of reference points (center positions of a plurality of circle marks) are known is mounted on the suction nozzle 7 in advance. The center of gravity of the mark is calculated from an image for each movement of a predetermined distance in the direction, the amount of positional deviation of the center of gravity of each mark at a plurality of positions in the Z direction is obtained, and a positional deviation correction table in which these are stored in the EEPROM 13d is created.
When each image is acquired based on the data of the misregistration correction table amount, correction is performed based on the imaging position in the Z direction, and the data of the omnifocal image is calculated.
Such a correction may be performed when storing the image data that has been picked up in step S5 described above, or when using the already stored image data in the processing after step S6. By performing such correction processing, the control unit 13 functions as a positional deviation correction unit.

When the component recognition camera 9 uses a telecentric lens, even when the suction nozzle 7 moves in the Z direction, the size of the image does not change as the electronic component P and the suction nozzle 7 move. The component recognition camera 9 of the above-described component inspection apparatus does not perform the correction process for the variation in the image size based on the premise.
However, for example, when the component recognition camera 9 uses a non-telecentric lens, each time the suction nozzle 7 or the component recognition camera 9 moves by a predetermined distance in the Z direction by the moving unit 14 as shown in FIG. When the camera 9 causes the electronic component P to be imaged together with the suction nozzle 7, the size of the image changes, and therefore, collation is performed at different positions when calculating the omnifocal point.
Therefore, when a non-telecentric lens is used, the same correction target 100 as described above is mounted on the suction nozzle 7 and images are taken at a plurality of positions in the Z direction, and the distance between the mark centers is calculated in advance for each movement distance. Then, the magnification change at each position in the Z direction is stored in the EEPROM 13d as a magnification correction table. Then, when each image is acquired based on the value of the magnification correction table, correction is performed based on the imaging position in the Z direction, and data of the omnifocal image is calculated.
Such a correction may be performed when storing the image data that has been picked up in step S5 described above, or when using the already stored image data in the processing after step S6. By performing such correction processing, the control unit 13 functions as a magnification correction unit.

<Other 2>
The present invention is not limited to the above embodiment. For example, in imaging with a component recognition camera, the electronic part P was imaged by changing the imaging distance in a range of ± 0.5 mm from the focal position in increments of 0.05 mm, but the interval between the imaging range and the height is free Can be changed.
In addition, the virtual plane for detecting the imaging distance (height) from the component recognition camera to the electronic component is obtained as a virtual plane shown in ED-7401-4 of JEITA (Electronic Information Technology Industries Association) standard. It may be calculated.
Further, the displacement of the holding position of the electronic component may be detected using a captured image focused on a specific part (electrode or the like) or may be detected using an omnifocal image.
Further, for the shift of the holding position of the electronic component, an image created by distance data (height data) of the imaging distance when creating the omnifocal image may be used. At this time, as a method for recognizing the positional deviation, it may be stored in the EEPROM as a template based on distance data, and an image based on the created distance data may be compared with the template to perform positioning.
In addition, in parts where the electrodes are uneven, such as ball parts, the ball part is recognized using image data generated from the distance data, and there is no uneven part with a mark for direction determination etc. For example, an omnifocal image or an image of a focal position may be used, and image data to be handled may be selected according to a portion to be processed even in the same component.

5 X transport section (transport section)
6 Y transport section (transport section)
7 Suction nozzle (holding part)
9 Component recognition camera (imaging part)
10 Lighting box (lighting part)
13 Control unit (pixel data determination means, distance data determination means, determination means, imaging control means, transport control means)
13d EEPROM (storage means)
14 Moving part 100 Component mounting device 110 Component inspection device B Substrate P Electronic component (component)

Claims (7)

A holding unit that holds a component and an imaging unit that captures an image of the component held by the holding unit, and inspects the positional deviation of the component from the center of the holding unit based on a captured image captured by the imaging unit. In parts inspection equipment,
The imaging unit captures a plurality of images having different distances from the imaging unit to the component,
Pixel data determining means for determining focused pixel data in pixels at the same position from among a plurality of captured images captured by the imaging unit;
Distance data determining means for determining, for each pixel data, a distance between the imaging unit and the component when each pixel data determined by the pixel data determining means is imaged;
Storage means for storing an allowable value of a distance from a virtual straight line or a virtual plane of a predetermined part of the component obtained from the distance data in order to determine whether or not the component satisfies a predetermined criterion;
Determination means for determining whether a distance from a virtual straight line or a virtual plane of the predetermined part of the component obtained from the distance data exceeds an allowable value stored in the storage means;
A component inspection device comprising: A moving unit that moves at least one of the holding unit and the imaging unit so as to be in contact with or separated from the other; and
Imaging control means for causing the imaging unit to image the component together with the holding unit each time the holding unit and the imaging unit move by a predetermined distance by the moving unit;
The component inspection apparatus according to claim 1, further comprising: Fixing the imaging unit;
The component inspection apparatus according to claim 2, wherein the moving unit moves the holding unit in a direction along an optical axis direction of an optical system of the imaging unit. The component inspection apparatus according to any one of claims 1 to 3,
A transport unit that moves the holding unit to transport the component to a mounting position;
When it is determined by the determination means that at least one of the distances from the virtual straight line or the virtual plane of the predetermined part of the part obtained from the distance data exceeds the allowable value stored in the storage means, A transport control means for causing the transport unit to eject the component without transporting it to a mounting position;
A component mounting apparatus comprising:   A center in which the center position deviation amount of the image corresponding to the distance from the imaging unit to the component is calculated in advance for image data obtained by the imaging unit capturing a plurality of images having different distances from the imaging unit to the component. The component mounting apparatus according to claim 4, further comprising a positional deviation correction unit that corrects image data using a positional deviation correction table.   A center in which the center position deviation amount of the image corresponding to the distance from the imaging unit to the component is calculated in advance for image data obtained by the imaging unit capturing a plurality of images having different distances from the imaging unit to the component. 6. The magnification correction unit according to claim 4 or 5, further comprising a magnification correction unit that corrects the image data using a displacement correction table or a magnification correction table in which a change amount of an image size corresponding to a distance from the imaging unit to the component is calculated in advance. Component mounting equipment.   Imaging is performed at a plurality of positions during movement until the holding unit that holds the part reaches the imaging unit, and the pixel data determination unit focuses on the pixels at the same position based on image data obtained by the imaging. 7. An optimum environment determining unit that performs preprocessing for setting an optimum position in a range in which a plurality of images with different distances from the imaging unit to the component are obtained in order to obtain pixel data. The component mounting apparatus according to any one of the above.

Images