JP2008130771A - Component recognition method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component recognition method that allows three-dimensional position-detection of a component held by a suction nozzle of a component mounting device without prolonging a cycle time. <P>SOLUTION: The component recognition method is a method for recognizing a three-dimensional position of a component 121 in a component mounting device provided with recognition cameras 106a, 106b for imaging the component 121 held by a mounting head. The recognition camera 106a in a first position with respect to the component 121 images the component at a first angle with respect to the component 121. The recognition camera 106b in a second position with respect to the component 121 images the component at a second angle with respect to the component 121. The three-dimensional position of the imaged component 121 is recognized from the two imaging results. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component recognition method, and more particularly to a method for recognizing a three-dimensional position of a component held by a mounting head of a component mounting apparatus.

  Conventionally, there is a component mounting apparatus as an apparatus for mounting an electronic component (hereinafter simply referred to as “component”) on a substrate. In a component mounting apparatus, a mounting head takes out a component from a component supply device such as a tape feeder and transfers and mounts the component on a substrate. In response to a request for improving the mounting accuracy of components for such a component mounting apparatus, the component mounting apparatus is provided with a recognition means for recognizing the holding state of the component transferred by the mounting head, and the component mounting based on the recognition result by the recognition means Position correction at the time has been performed.

FIG. 16 is an external view of a conventional component mounting apparatus (see, for example, Patent Document 1).
The component mounting apparatus 501 includes a conveyance path 502 that conveys and positions the substrate 502a, a tray 503 in which the component 503a is stored, a tray supply unit 504 that automatically supplies the tray 503 to a predetermined position, and components on the tray 503. The mounting head 505 that moves while holding the 503a by suction, the X-axis moving means 506 that moves the mounting head 505 in the X-axis direction, and the Y-axis movement that moves the mounting head 505 in the Y-axis direction Means 507a and 507b and a recognition means 508 for recognizing the holding state of the component 503a held by the mounting head 505 are provided.

  The recognition unit 508 includes a height sensor 508a that acquires height data of the entire bottom surface of the component 503a and a luminance sensor 508b such as a CCD camera that acquires luminance image data of the entire bottom surface of the component 503a. The recognition unit 508 recognizes the holding state of the component 503a based on the detection results of the height sensor 508a and the luminance sensor 508b.

  In the component mounting apparatus 501, the two-dimensional position detection of the component 503a by the luminance sensor 508b and the three-dimensional position detection of the component 503a by the height sensor 508a are used separately to recognize the three-dimensional position of the component 503a. Done. Therefore, it is possible to detect defects that are not detected by two-dimensional position recognition, such as component standing suction, component reverse suction, and lead floating. As a result, it is possible to prevent mounting defects due to standing suction, dropout of parts other than the mounting position, jumping of parts other than the mounting position, mounting defects due to reverse suction of parts, soldering defects due to lead floating, etc., and improving mounting quality Can be realized.

  Incidentally, in the component mounting apparatus 501, the height sensor 508a is composed of expensive components such as a polygon mirror and a semiconductor laser, and has a complicated structure, so that the recognition means 508 becomes expensive and increases in size. When the recognizing unit 508 is enlarged, the recognizing unit 508 cannot be arranged due to positional restrictions on the recognizing unit 508. Further, it is necessary to search the component 503a at a low speed in view of the recognition capability of the laser type sensor, and the productivity of the component mounting apparatus 501 is reduced. As a prior art proposed to solve these problems, there is a component recognition device described in Patent Document 2, for example.

  FIG. 17A is a front view showing the configuration of the component recognition device, and FIG. 17B is a side view showing the configuration of the component recognition device.

  This component recognition apparatus observes the side surface and the bottom surface of the component 603a held by the suction nozzle 602 at a time from the same direction, and a plurality of reflecting means 601a, 601b, 601c, and 601d positioned so as to surround the component 603a. And a lens 605, a camera 604 that images the side and bottom surfaces of the component 603a, and a plurality of illumination means 606 that illuminate the component 603a.

In this component recognition apparatus, the two-dimensional position detection and the three-dimensional position detection of the component 603a are performed by one imaging with the camera 604. Therefore, the three-dimensional position recognition of the component 603a can be realized by a component recognition device having a simple structure with a low cost by simply providing a plurality of reflecting means without using a polygon mirror or a semiconductor laser.
Japanese Patent Laid-Open No. 11-251791 JP 2006-140391 A

  However, in the component recognition apparatus described in Patent Document 2, it is necessary to move the component 603a held by the suction nozzle 602 to a region surrounded by the reflecting means 601a, 601b, 601c, and 601d. Accordingly, the movement of the component 603a held by the suction nozzle 602 is limited, and the tact time is increased.

  In addition, there are various parts to be mounted from a semiconductor chip to a semiconductor IC. For example, the component mounting apparatus is a small part having a length of 0.6 mm and a width of 0.3 mm. It is necessary to handle all parts. However, since the interval between the plurality of reflecting means 601a, 601b, 601c, and 601d in the component recognition device described in Patent Document 2 can be changed using a ball screw attached to the reflecting means, the size of the component changes greatly. Takes a long time to adjust the interval, resulting in a long tact time.

  Therefore, in view of such a problem, the present invention provides a component recognition method capable of recognizing the three-dimensional position of a component held by a suction nozzle of a component mounting apparatus without increasing the tact time. Objective.

  In order to achieve the above object, a component recognition method of the present invention is a method for recognizing a three-dimensional position of a component in a component mounting apparatus including a mounting head and an imaging unit that images the component held by the mounting head. Then, the imaging means at the first position with respect to the component images the part at a first angle with respect to the component, and further, with respect to the component by the imaging means at the second position with respect to the component. An imaging step of imaging the component at a second angle, and a component position recognition step of recognizing a three-dimensional position of the component that has been imaged from the two imaging results.

  As a result, since the three-dimensional position of the component is recognized from the two imaging results by stereo matching or the like, it is not necessary to provide the apparatus with a special structure for recognizing the three-dimensional position of the component. Accordingly, it is not necessary to recognize a part in a special area surrounded by the reflection means as in the conventional part recognition apparatus, and the three-dimensional position of the part held by the suction nozzle without increasing the tact time is recognized. It can be performed.

  In addition, a general camera such as an area camera or a line camera can be used as an imaging means instead of a polygon mirror or a semiconductor laser. Therefore, the three-dimensional position of the component can be recognized without complicating the structure of the device.

  The component recognition method may further include a position between the recognized three-dimensional position of the component and the three-dimensional position of the component when the recognized component is held in the nozzle in a desired state. A component position deviation calculating step for calculating a deviation and a component position deviation determining step for determining whether or not the calculated position deviation is smaller than a predetermined threshold value may be included. The component recognition method may further include an inclination recognition step of recognizing the inclination of the component from the two imaging results, and the component recognition method further includes the recognized component inclination, An inclination deviation calculating step for calculating an inclination deviation from the inclination of the part when the part is held by the nozzle in a desired state, and determining whether or not the calculated inclination deviation is smaller than a predetermined threshold. An inclination deviation determination step.

  As a result, the positional deviation amount and the inclination deviation amount of the component are calculated from the three-dimensional position of the component, so that it is possible to detect problems such as standing suction of the component and reverse suction of the component.

  In the component position recognition step, after the imaging of the component is completed by the imaging unit at the first position, the imaging unit at the first position is moved to the second position to perform imaging of the component. Also good. In the component position recognition step, after the imaging of the component is finished by the recognition unit at the first position, the component is moved to the second position with respect to the component by moving the component. May be taken.

  As a result, the image pickup means can be constituted by a single camera, so that the structure of the apparatus can be further simplified.

  The component recognition method may further include an electrode position recognition step for recognizing a three-dimensional position of an electrode formed on the imaged component from the two imaging results, and a three-dimensional position of the recognized electrode. An electrode displacement calculation step for calculating a displacement from the three-dimensional position of the electrode when the recognized component is held by the nozzle in a desired state, and the calculated displacement of the electrode Electrode position deviation determination step for determining whether or not is smaller than a predetermined threshold value.

  As a result, the amount of misalignment of the electrode is calculated in addition to the amount of misalignment and the amount of tilt misalignment of the component, so that it is possible to detect a defect in the electrode such as a floating lead.

  The present invention also includes a mounting head that holds a component and mounts the held component on a substrate, an imaging unit that images the component held by the mounting head, and the first position relative to the component. An imaging result of the component at a first angle relative to the component by the imaging means; and an imaging result of the component at a second angle relative to the component by the imaging means at a second position relative to the component; And a position recognizing unit for recognizing a three-dimensional position of the component on which the imaging has been performed. Here, the imaging means may be composed of a plurality of cameras arranged so that the component enters a viewing angle.

  Thereby, it is possible to realize a component mounting apparatus capable of recognizing the three-dimensional position of the component held by the suction nozzle without increasing the tact time. Further, it can be realized by a component mounting apparatus having an inexpensive and simple structure capable of recognizing the three-dimensional position of the component.

  The imaging means may be composed of a movable camera arranged so that the component enters a viewing angle.

  As a result, the image pickup means can be constituted by a single camera, which can be realized by a component mounting apparatus having a simpler structure at a lower cost.

  The present invention also provides a component mounting method in a component mounting apparatus including a mounting head for mounting a component on a substrate and an imaging unit for capturing an image of the component held by the mounting head. The part is imaged at a first angle with respect to the part by the imaging means at one position, and the part at a second angle with respect to the part by the imaging means at a second position relative to the part. The component mounting method may include an imaging step of imaging, and a component position recognition step of recognizing a three-dimensional position of the component that has been imaged from the two imaging results.

  As a result, the three-dimensional position of the component held by the suction nozzle can be recognized without increasing the tact time. In addition, the three-dimensional position of the component can be recognized without complicating the structure of the apparatus.

  Here, the component mounting method further includes a three-dimensional position of the recognized component and a three-dimensional position of the component when the recognized component is held in the nozzle in a desired state. A component misalignment calculating step for calculating misalignment, a component misalignment determining step for determining whether the calculated misalignment is smaller than a predetermined threshold, and determining that the misalignment is larger than a predetermined threshold In this case, a correction step of correcting the mounting condition of the component by the mounting head and a mounting step of mounting the component that has been recognized under the corrected mounting condition may be included. The component mounting method may further include a tilt recognition step for recognizing the tilt of the component from the two imaging results, the tilt of the recognized component, and the component held in the nozzle in a desired state. An inclination deviation calculating step for calculating an inclination deviation with respect to the inclination of the component, an inclination deviation determining step for determining whether the calculated inclination deviation is smaller than a predetermined threshold value, and the inclination deviation is a predetermined value. When it is determined that the value is larger than the threshold value, a correction step of correcting a component mounting condition by the mounting head and a mounting step of mounting the component that has been recognized under the corrected mounting condition may be included.

  As a result, the positional deviation amount and the inclination deviation amount of the component are calculated from the three-dimensional position of the component, so that it is possible to detect problems such as standing suction of the component and reverse suction of the component. Further, since the mounting condition is corrected based on the positional deviation amount and the inclination deviation amount, the mounting accuracy of the components can be improved.

  The present invention also relates to a method for recognizing a three-dimensional position of a nozzle in a component mounting apparatus comprising a mounting head having a nozzle for holding a component and an imaging means for imaging the nozzle. The nozzle is imaged at a first angle with respect to the component by the imaging means at a position, and the nozzle is imaged at a second angle with respect to the component by the imaging means at a second position relative to the nozzle. And a nozzle position recognizing step for recognizing a three-dimensional position of the nozzle on which the imaging has been performed from the two imaging results.

  Accordingly, since the three-dimensional position of the suction nozzle is recognized from the two imaging results by stereo matching or the like, it is not necessary to provide the apparatus with a special structure for recognizing the three-dimensional position of the suction nozzle. Therefore, it is possible to recognize the three-dimensional position of the suction nozzle without increasing the tact time. As a result, based on the three-dimensional shape of the nozzle, it is possible to detect nozzle abnormalities such as nozzle chipping, nozzle clogging, and nozzle setting mistakes where a desired nozzle is not set.

  The present invention can be realized not only as such a component recognition method, component mounting method, component mounting apparatus, and nozzle recognition method, but also by using this method to capture an image of the components held by the mounting head and the mounting head. And a storage medium storing the program for the component mounting apparatus.

  According to the present invention, the three-dimensional position recognition of the component held by the suction nozzle of the component mounting apparatus can be performed without increasing the tact time. In addition, it is possible to detect defects that are not detected by the recognition of the two-dimensional position of the component, such as the standing suction of the component, the reverse suction of the component, and the lead floating. Further, it can be realized by a component mounting apparatus having an inexpensive and simple structure capable of recognizing the three-dimensional position of the component. In addition, it is possible to accurately calculate the positional deviation amount and the inclination deviation amount of the component.

  Hereinafter, a component recognition method according to an embodiment of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a top view showing the configuration of the component mounting apparatus according to the present embodiment.

  This component mounting apparatus is provided in a base 100, a central portion of the base 100, a plurality of transport paths 101 for transporting and positioning a substrate 104, and a plurality of tape feeders 102 to supply a plurality of types of components. The component supply unit 103 to be mounted, the mounting head 105 to take out the component from the component supply unit 103 and transfer and mount it on the substrate 104, the imaging means 106 to image the component held by the mounting head 105, and the mounting head 105 in the X direction. An X-axis table 107 to be moved and a Y-axis table 108 on which the X-axis table 107 is installed and move the X-axis table 107 in the Y direction are provided.

  The mounting head 105 has a suction nozzle (hereinafter, also simply referred to as “nozzle”) that can suck and hold components from the component cassette and mount them on the substrate 104.

  As shown in FIG. 2, the imaging unit 106 is arranged so that the component 121 falls within the viewing angle, and the two-dimensional or one-dimensional recognition cameras 106 a and 106 b that capture the component 121 sucked and held by the nozzle 120 from below. And illuminations 122a and 122b for irradiating the component 121 with light. The recognition cameras 106a and 106b are arranged at different positions, and the imaging surfaces are at different angles with respect to the component bottom surface. Note that when the viewing angles of the recognition cameras 106 a and 106 b are narrow, the recognition cameras 106 a and 106 b are arranged so that the imaging surface faces the imaging position of the component 121. When the recognition cameras 106a and 106b are one-dimensional cameras, the mounting head 105 moves above the recognition cameras 106a and 106b during imaging.

FIG. 3 is a functional block diagram showing the configuration of the component mounting apparatus.
The component mounting apparatus includes a mechanism unit 140, a mounting control unit 141, a display unit 142, an input unit 143, a storage unit 144, a deviation amount calculation unit 145, a correction amount calculation unit 146, a deviation amount determination unit 147, and a communication I / F unit. 148 and a memory unit 149.

  The mechanism unit 140 is a set of mechanism components including the conveyance path 101, the component supply unit 103, the mounting head 105, the recognition cameras 106a and 106b, the X-axis table 107, the Y-axis table 108, and a motor and a motor controller that drive these. It is.

  The mounting control unit 141 loads and executes NC data (mounting data) from the storage unit 144 to the memory unit 149 according to an instruction from the operator, and controls the mechanism unit 140 according to the execution result.

  The display unit 142 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like, and the input unit 143 is a keyboard, a mouse, or the like. These are used for dialogue between the component mounting apparatus and the operator.

  The storage unit 144 is a hard disk, a memory, or the like, and holds mounting data 144a, a component library 144b, and the like.

  The mounting data 144a is information regarding mounting conditions of the component 121, and is a collection of information indicating mounting points of all the components 121 to be mounted. The component library 144b is a library in which unique information about all component types that can be handled by the component mounting apparatus is collected.

  The deviation amount calculation unit 145 recognizes the three-dimensional position of the component 121 based on the two image data obtained by the imaging of the recognition cameras 106 a and 106 b at different positions with respect to the component 121, and determines the reference position of the component 121. Displacement amount, that is, component position displacement amount is calculated. Also, a deviation amount from the reference inclination of the component 121, that is, an inclination deviation amount is calculated. The deviation amount calculation unit 145 is an example of the position recognition unit of the present invention.

  The reference position of the component 121 is a three-dimensional position of the component 121 when the component 121 is held by the nozzle 120 in a desired state, specifically, a point (center point) where a rectangular diagonal line on the bottom surface of the component intersects. The three-dimensional position is included in the component library 144b. The reference inclination of the component 121 is the inclination of the component 121 when the component 121 is held by the nozzle 120 in a desired state, specifically, the inclination of the bottom surface of the component, and is included in the component library 144b.

  At this time, when the component 121 in the holding state shown in FIG. 4A is imaged by the recognition cameras 106a and 106b, the center point of the two-dimensional image (rectangular GHIJ) of the component bottom surface when there is no positional deviation and inclination deviation A two-dimensional image (rectangular ABCD) of the component bottom surface from the Z direction shown in FIG. 4B and a component bottom surface from the Y direction shown in FIG. A two-dimensional image (straight line BC) and a two-dimensional image (straight line AB) of the component bottom surface from the X direction shown in FIG. 4D are obtained.

  In this case, as the component position deviation amount, the deviation amount between the reference position E in FIGS. 4B and 4C and the actual center point position (recognition position) F of the component bottom surface is calculated. Is obtained. That is, it is obtained by calculating the shift amount ΔX1 in the X direction and the shift amount ΔY1 in the Y direction in FIG. 4B and the shift amount ΔZ1 in the Z direction in FIG.

  In addition, the inclination deviation amount includes the inclination of the component bottom face (reference inclination) when there is no inclination deviation in FIGS. 4B, 4C, and 4D, and the actual inclination of the component bottom face (recognition inclination). ) To calculate the amount of deviation. That is, it is obtained by calculating the inclination α in FIG. 4B, the inclination θ in FIG. 4C, and the inclination γ in FIG.

  The deviation amount determination unit 147 determines whether or not the component position deviation amount and the inclination deviation amount calculated by the deviation amount calculation unit 145 are smaller than a predetermined threshold value. The amount is transmitted to the correction amount calculation unit 146. On the other hand, when it is larger than the predetermined threshold, the imaged component 121 is discarded.

  The correction amount calculation unit 146 calculates the correction amount of the mounting condition such as the mounting point based on the component position deviation amount and the inclination deviation amount transmitted from the deviation amount determination unit 147, and the mounting data 144a loaded in the memory unit 149. Correct.

  The communication I / F unit 148 is a LAN (Local Area Network) adapter or the like, and is used for communication between the component mounting apparatus and another component mounting apparatus.

  The memory unit 149 is a RAM (Random Access Memory) that provides a work area for the mounting control unit 141, the deviation amount calculation unit 145, the correction amount calculation unit 146, the deviation amount determination unit 147, and the like.

  Next, the mounting operation of the component mounting apparatus having the above configuration will be described. FIG. 5 is a flowchart showing the mounting operation of the component mounting apparatus.

  First, the mounting control unit 141 determines a component 121 to be mounted based on the mounting data 144a stored in the storage unit 144, and controls the mounting head 105 to take out the component 121 from the tape feeder 102 (step S51). ).

  Next, the mounting control unit 141 causes the recognition cameras 106a and 106b to image the component 121 sucked and held by the nozzle 120 of the mounting head 105 (step S52).

  Finally, the mounting control unit 141 causes the mounting head 105 to transfer and mount the component 121 to be sucked and held on the substrate 104 (step S53).

  Next, the operation from the imaging to mounting of the component 121 (operation from step S52 to S53), that is, the component recognition operation will be described in detail. FIG. 6 is a flowchart showing the component recognition operation of the component mounting apparatus.

  First, the mounting control unit 141 causes the deviation amount calculation unit 145 to recognize the three-dimensional position of the component 121 from the two imaging results of the recognition cameras 106a and 106b, and further recognize the inclination of the component 121 (step S61). That is, the three-dimensional positions of the three vertices on the bottom surface of the component are recognized, the three-dimensional position of the center point where the rectangle having the three vertices and the diagonal of the rectangle intersect, and the inclination of the recognized rectangle are recognized. . At this time, the recognition of the three-dimensional position is performed by a stereo matching method based on the parallax between the two component images obtained from the imaging by the recognition cameras 106a and 106b, the distance between the recognition cameras 106a and 106b, and the focal length of the recognition cameras 106a and 106b. It is done using.

  Next, the mounting control unit 141 causes the deviation amount calculation unit 145 to calculate the component position deviation amount and the inclination deviation amount of the component 121 sucked and held by the nozzle 120 (step S62). Specifically, as described above, the positional deviation amount ΔP = (ΔX1, ΔY1, ΔZ1) of the center point of the component bottom surface and the inclination deviation amount Δω = (α, θ, γ) of the component bottom surface are calculated.

  Next, the mounting control unit 141 causes the deviation amount determination unit 147 to determine whether or not the calculated α is smaller than a predetermined threshold (step S63).

  Next, when α is smaller than a predetermined threshold (Yes in Step S63), the mounting control unit 141 causes the deviation amount determination unit 147 to determine whether or not the calculated θ is smaller than the predetermined threshold (Step S63). S64).

  Next, when θ is smaller than a predetermined threshold value (Yes in step S64), the mounting control unit 141 causes the deviation amount determination unit 147 to determine whether or not the calculated γ is smaller than the predetermined threshold value (step S41). S65).

  Next, when γ is smaller than a predetermined threshold value (Yes in step S65), the mounting control unit 141 causes the deviation amount determination unit 147 to determine whether or not the calculated ΔX1 is smaller than the predetermined threshold value (step). S66).

  Next, when ΔX1 is smaller than the predetermined threshold (Yes in step S66), the mounting control unit 141 causes the deviation amount determination unit 147 to determine whether or not the calculated ΔY1 is smaller than the predetermined threshold (step). S67).

  Next, when ΔY1 is smaller than the predetermined threshold value (Yes in step S67), the mounting control unit 141 causes the deviation amount determination unit 147 to determine whether or not the calculated ΔZ1 is smaller than the predetermined threshold value (step). S68).

  Finally, when ΔZ1 is smaller than the predetermined threshold (Yes in step S68), the mounting control unit 141 causes ΔX1, ΔY1, ΔZ1, α, θ, and γ to be transmitted to the correction amount calculation unit 146. The mounting control unit 141 causes the correction amount calculation unit 146 to calculate the correction amount of the mounting conditions such as the mounting point based on the transmitted ΔX1, ΔY1, ΔZ1, α, θ, and γ, and is loaded into the memory unit 149. The mounting data 144a is corrected (step S69). Thereafter, the mounting control unit 141 mounts the component 121 sucked and held by the nozzle 120 using the corrected mounting data 144a.

  On the other hand, when any of the calculated ΔX1, ΔY1, ΔZ1, α, θ, and γ is greater than a predetermined reference value (No in steps S63 to S68), the mounting control unit 141 recognizes that the suction is defective. Then, the imaged part 121 is discarded (step S70).

  Here, the predetermined threshold value used in the determination by the deviation amount determination unit 147 is set in consideration of the size of the component 121.

  As described above, according to the component mounting apparatus of the present embodiment, the component 121 held by suction is imaged by the two recognition cameras 106a and 106b, and the stereo points (features and extracted points) of the component 121 are detected. Then, the three-dimensional position and inclination of the part 121 are obtained. Then, based on the amount of deviation between the three-dimensional position and the reference position and the amount of deviation between the inclination and the reference inclination, it is determined whether or not the suction is defective. Accordingly, it is possible to detect a problem that is not detected by the recognition of the two-dimensional position of the component, such as the standing suction of the component and the reverse suction of the component.

  That is, even when the component 121 is held by the nozzle 120 in the standing suction state shown in FIG. 7A, the reference position E is the origin, and the bottom 2 of the component from the Z direction shown in FIG. A two-dimensional image (rectangular KLCD), a two-dimensional image (straight line CL) of the component bottom surface from the Y direction shown in FIG. 7C, and a two-dimensional image of the component bottom surface from the X direction shown in FIG. (Straight line DC) is obtained. Therefore, it is possible to recognize that the suction is defective by the large shift amount ΔZ1 in the Z direction.

  Further, according to the component mounting apparatus of the present embodiment, it is not necessary to perform component recognition in a special area surrounded by the reflection means, unlike the conventional component recognition device. Accordingly, the three-dimensional position of the component can be recognized without increasing the tact time.

  Further, according to the component mounting apparatus of the present embodiment, the three-dimensional position recognition of the component 121 is realized with a configuration in which a plurality of recognition cameras are provided without using a polygon mirror or a semiconductor laser. Therefore, it can be realized by a component mounting apparatus having an inexpensive and simple structure capable of recognizing the three-dimensional position of the component.

  When the component 121 is held by the nozzle 120 in the suction state shown in FIG. 8A, the component mounting apparatus follows the position registered in the component library indicated by the broken line when the positional deviation of the component 121 is not considered. Since the component 121 is mounted on the substrate 104, the component 121 is pushed too much into the substrate 104 (FIG. 8B), and when the lowest point (a in FIG. 8) of the component 121 is detected by the line sensor, the component 121 Since the mounting data 144a is corrected based on the position shift of the lowermost point, the component 121 is not pushed into the board 104 (FIG. 8C), and a mounting failure occurs. However, the component mounting apparatus according to the present embodiment calculates the positional deviation of the center point (b in FIG. 8) of the component bottom surface and corrects the mounting data 144a based on this, so that the component 121 is appropriately attached to the board 104. It can be mounted and mounting defects can be prevented.

  In addition, the component mounting apparatus according to the present embodiment recognizes the three-dimensional positions of the three vertices of the component bottom surface, and calculates the component position deviation amount and the inclination deviation amount based on these three-dimensional positions. Therefore, even when the deposit 150 is attached in the vicinity of the suction hole 151 of the nozzle 120 as shown in FIG. 9, the deposit 150 is not misidentified as the bottom surface of the article at the time of component recognition. The component position deviation amount and the inclination deviation amount can be calculated.

  In the component mounting apparatus according to the present embodiment, the component mounting apparatus includes a plurality of recognition cameras 106a and 106b. However, as illustrated in FIG. 10 or FIG. 11, the component mounting apparatus may include only one recognition camera 106 c arranged so that the component 121 falls within the viewing angle.

  In the case of FIG. 10, after the part 121 is imaged by the recognition camera 106c (FIG. 10A), the nozzle 120 holding the part 121 is moved and the part 121 is imaged again by the recognition camera 106c (FIG. 10). (B)). Thereby, the component 121 is imaged from the recognition camera at a predetermined position with respect to the component 121 and the recognition camera at a position different from the predetermined position, and when two recognition cameras are provided. Similar imaging results are obtained.

  In the case of FIG. 11, the recognition camera 106c is attached to the moving means 130 so as to be movable. After the part 121 is imaged by the recognition camera 106c (FIG. 11A), the recognition camera 106c is moved by the moving unit 130, and the part 121 is imaged again by the recognition camera 106c (FIG. 11B).

  In the case of FIGS. 10 and 11, the component 121 is in a predetermined position with respect to the component 121, and is in a position different from the predetermined position with the recognition camera that images the component 121 at a predetermined angle with respect to the component 121. The image is picked up from the recognition camera that picks up the part 121 at an angle different from the predetermined angle with respect to the part 121, and the same imaging result as that obtained when two recognition cameras are provided is obtained.

  Further, in the component mounting apparatus of the present embodiment, the inclination deviation amount α calculated by the deviation amount calculation unit 145 is calculated, and the determination is performed based on the predetermined threshold value of the inclination deviation amount α. Depending on the size, the inclination deviation amount α can be reduced to 0 by the rotation of the nozzle 120 regardless of the size thereof, and therefore the determination may not be performed based on a predetermined threshold value of the inclination deviation amount α.

  Further, in the component mounting apparatus according to the present embodiment, the determination as to whether or not to discard the component 121 and the determination of the correction amount of the mounting data 144a are performed based on the positional deviation amount of the center point of the component bottom surface. However, the present invention is not limited to this. For example, it may be determined whether to discard the component 121 and determine the correction amount of the mounting data 144a based on the positional deviation amount of each vertex on the bottom surface of the component.

  Further, in the component mounting apparatus of the present embodiment, the component displacement amount is the displacement amount of the center point of the component bottom surface, but may be the displacement amount of the center of gravity of the component bottom surface.

  In the component mounting apparatus of the present embodiment, the mounting head 105 has one nozzle 120. However, the mounting head 105 may have a plurality of nozzles. In this case, as shown in FIG. 12, the imaging unit 106 is arranged so that the plurality of components 321 fall within the viewing angle, and recognizes cameras that simultaneously capture the plurality of components 321 sucked and held by the plurality of nozzles 320. 306a and 306b, and illuminations 322a and 322b that irradiate the plurality of components 321 with light.

  In the component mounting apparatus of the present embodiment, the three-dimensional position of the three vertices on the bottom surface of the component is recognized, and the three-dimensional position of the center point where the rectangle having the three vertices and the diagonal of the rectangle intersect is recognized. However, the three-dimensional position of the four vertices on the bottom surface of the component may be recognized, and the three-dimensional position of the center point where the rectangle having the four vertices and the diagonal of the rectangle intersect may be recognized.

  In the component mounting apparatus of the present embodiment, the three-dimensional position of the component 121 is recognized from the two imaging results of the recognition cameras 106a and 106b. However, the present invention is not limited to this, and the same part 121 may be imaged a plurality of times by the recognition cameras 106a and 106b, and the three-dimensional position of the part 121 may be recognized from three or more imaging results.

  Moreover, although the component mounting apparatus of this Embodiment was provided with the two recognition cameras 106a and 106b, you may provide many more recognition cameras. As a result, even if one of the recognition cameras receives regular reflection from the parts 121 of the lights 122a and 122b and cannot correctly capture the part 121, two imaging results can be obtained by the other recognition cameras. A three-dimensional position can be recognized.

  In the component mounting apparatus of the present embodiment, the deviation amount calculation unit 145 calculates the area of the component bottom surface from the two-dimensional image of the component bottom surface, and the component 121 included in the component library 144b is in a desired state. The difference from the area of the component bottom surface when held at 120 may be calculated, and the deviation amount determination unit 147 may determine whether the calculated difference is smaller than a predetermined threshold.

  Further, in the component mounting apparatus of the present embodiment, the deviation amount calculation unit 145 recognizes the electrode pattern from the luminance distribution of the two-dimensional image of the component bottom surface, and the component 121 included in the component library 144b is in a desired state. Then, the difference from the electrode pattern on the bottom surface of the component when held by the nozzle 120 may be calculated, and the deviation amount determination unit 147 may determine whether or not the calculated difference is smaller than a predetermined threshold.

(Second Embodiment)
The component mounting apparatus according to the present embodiment calculates the positional displacement amount of the electrode formed on the component in addition to the component positional displacement amount, and determines whether or not the suction is defective based on the positional displacement amount of the electrode. This is different from the component mounting apparatus of the first embodiment. The following description will focus on differences from the component mounting apparatus according to the first embodiment.

FIG. 13 is a functional block diagram showing the configuration of the component mounting apparatus according to the present embodiment.
The component mounting apparatus includes a mechanism unit 140, a mounting control unit 241, a display unit 142, an input unit 143, a storage unit 144, a deviation amount calculation unit 245, a correction amount calculation unit 246, a deviation amount determination unit 247, and a communication I / F unit. 148 and a memory unit 149.

  The mounting control unit 241 loads and executes NC data (mounting data) from the storage unit 144 to the memory unit 149 according to an instruction from the operator, and controls the mechanism unit 140 according to the execution result.

  The deviation amount calculation unit 245 recognizes the three-dimensional position of the component 121 based on the two image data obtained by the imaging of the recognition cameras 106a and 106b, and calculates the component position deviation amount and the inclination deviation amount. Further, the deviation amount calculation unit 245 calculates the deviation amount of the electrode of the component 121 from the reference position, that is, the electrode position deviation amount, based on the two image data.

  The reference position of the electrode is the position of the electrode when the component 121 is held by the nozzle 120 in a desired state, specifically, the three-dimensional position of the tip of the electrode, and is included in the component library 144b.

  At this time, when the part 121 in the state shown in FIG. 14 is imaged by the recognition cameras 106a and 106b, the amount of electrode position deviation is the actual electrode tip from the reference position (in FIG. 14) for each of the electrodes P11 to P22. It is obtained by calculating the deviation amount of the three-dimensional position of A). That is, for each of the electrodes P11 to 22, it is obtained by calculating the deviation amount ΔX2 in the X direction, the deviation amount ΔY2 in the Y direction, and the deviation amount ΔZ2 in the Z direction.

  The deviation amount determination unit 247 determines whether or not the component position deviation amount, the electrode position deviation amount, and the tilt deviation amount calculated by the deviation amount calculation unit 245 are smaller than a predetermined reference value. The positional deviation amount, the electrode positional deviation amount, and the inclination deviation amount are transmitted to the correction amount calculation unit 246. On the other hand, when it is larger than the predetermined reference value, the imaged component 121 is discarded.

  The correction amount calculation unit 246 calculates the correction amount of the mounting condition such as the mounting point based on the component position deviation amount, the electrode position deviation amount, and the tilt deviation amount transmitted from the deviation amount determination unit 247 and loads the correction amount into the memory unit 149. The mounted data 144a is corrected.

  Next, the component recognition operation of the component mounting apparatus having the above configuration will be described in detail. FIG. 15 is a flowchart showing the component recognition operation of the component mounting apparatus.

  First, the mounting control unit 241 causes the deviation amount calculation unit 245 to recognize the three-dimensional positions of the component 121 and the electrode of the component 121 from the imaging results of the recognition cameras 106a and 106b, and further recognize the inclination of the component 121 (step S71). ). That is, the three-dimensional positions of the three vertices on the bottom surface of the component are recognized, the three-dimensional positions of the rectangle having these three vertices and the center point of the rectangle are recognized, and the inclination of the recognized rectangle is recognized. Further, the three-dimensional position of the electrode tip is recognized for each electrode of the component 121. Here, when the electrode is not a lead or the like and is a solder bump or the like whose tip cannot be recognized from the two-dimensional image, the center of the electrode in the two-dimensional image is recognized as the tip of the electrode.

  Next, the mounting control unit 241 causes the deviation amount calculation unit 245 to calculate the component position deviation amount and the inclination deviation amount of the component 121 sucked and held by the nozzle 120 (step S72). Specifically, the positional deviation amount ΔP = (ΔX1, ΔY1, ΔZ1) of the center point of the component bottom surface and the inclination deviation amount Δω = (α, θ, γ) of the component bottom surface are calculated.

  Next, the mounting control unit 241 causes the deviation amount determination unit 247 to determine whether or not the calculated component position deviation amount and inclination deviation amount are smaller than a predetermined threshold (step S73). That is, it is determined whether or not ΔX1, ΔY1, ΔZ1, α, θ, and γ are smaller than a predetermined threshold value.

  Next, when the component displacement amount and the inclination displacement amount are smaller than the predetermined threshold (Yes in step S73), the mounting control unit 241 sets the electrode position displacement amount to the displacement amount calculation unit 245 for each electrode of the component 121. Calculate (step S74). Specifically, for each electrode of the component 121, the positional deviation amount ΔQ = (ΔX2, ΔY2, ΔZ2) of the electrode tip is calculated.

  Next, the mounting control unit 241 causes the deviation amount determination unit 247 to determine whether or not the calculated ΔX2 is smaller than a predetermined threshold (step S75).

  Next, when ΔX2 is smaller than the predetermined threshold (Yes in step S75), the mounting control unit 241 causes the deviation amount determination unit 247 to determine whether or not the calculated ΔY2 is smaller than the predetermined threshold (step). S76).

  Next, when ΔY2 is smaller than the predetermined threshold (Yes in step S76), the mounting control unit 241 causes the deviation amount determination unit 247 to determine whether or not the calculated ΔZ2 is smaller than the predetermined threshold (step). S77).

  Finally, when ΔZ2 is smaller than the predetermined threshold (Yes in step S77), the mounting control unit 241 transmits ΔX1, ΔY1, ΔZ1, ΔX2, ΔY2, ΔZ2, α, θ, and γ to the correction amount calculation unit 246. Let The mounting control unit 241 causes the correction amount calculation unit 246 to calculate a correction amount of mounting conditions such as mounting points based on the transmitted ΔX1, ΔY1, ΔZ1, ΔX2, ΔY2, ΔZ2, α, θ, and γ, and the memory The mounting data 144a loaded in the unit 149 is corrected (step S78). Thereafter, the component 121 sucked and held by the nozzle 120 is mounted using the corrected mounting data 144a.

  On the other hand, when any of the calculated ΔX1, ΔY1, ΔZ1, ΔX2, ΔY2, ΔZ2, α, θ, and γ is greater than a predetermined threshold (No in steps S73 and S75 to S77), the mounting control unit 241 Then, the part 121 imaged by recognizing that the suction is defective is discarded (step S79).

  As described above, the component mounting apparatus according to the present embodiment determines whether or not there is a suction failure based on the electrode position deviation amount in addition to the component position deviation amount and the inclination deviation amount. Therefore, it is possible to detect electrode defects such as lead floating.

  As mentioned above, although the component recognition method of this invention was demonstrated based on embodiment, this invention is not limited to this embodiment. The present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention.

  For example, in the above embodiment, when the nozzle repeatedly makes a suction error, the component mounting apparatus may enter the inspection mode and recognize the nozzle. In other words, nozzle abnormality detection such as nozzle chipping, nozzle clogging, or nozzle setting error in which a desired nozzle is not set may be performed based on the three-dimensional shape of the nozzle. At this time, the recognition of the three-dimensional shape of the nozzle is similar to the recognition of the three-dimensional position of the component. This is done by calculating the three-dimensional position of the feature point. Then, the abnormality detection is performed by matching with the nozzle shape included in the component library 144b. Thereby, it is possible to detect an abnormality that is not detected by the abnormality detection based on the two-dimensional shape, and to prevent an abnormality that is erroneously detected. For example, in the case where the tip surface of the nozzle is peeled off and the peeled portion is shining, when nozzle abnormality detection based on a two-dimensional shape is performed, it is detected that the nozzle is abnormal. However, if nozzle abnormality detection based on a three-dimensional shape is performed, it is not detected that the nozzle is abnormal.

  In the invention of the present application, the suction nozzle is described with the content of picking up a component. However, the suction nozzle can also be applied to a chuck that grips a component with a mechanical mechanism. Shall also be included. In this case, the component is not sucked, but is mounted on the substrate after the component is gripped by the closing operation of the chuck.

  The present invention can be used for a component recognition method, and in particular, for a three-dimensional recognition method for a component held on a mounting head of a component mounting apparatus.

It is a top view which shows the structure of the component mounting apparatus of the 1st Embodiment of this invention. It is a figure which shows the structure of the imaging means of the embodiment. It is a functional block diagram which shows the structure of the component mounting apparatus of the embodiment. (A) It is a figure which shows the holding state of components. (B) It is a figure which shows the two-dimensional image of components bottom face. (C) It is a figure which shows the two-dimensional image of a component bottom face. (D) It is a figure which shows the two-dimensional image of a component bottom face. It is a flowchart which shows mounting operation | movement of the component mounting apparatus of the embodiment. It is a flowchart which shows the component recognition operation | movement of the component mounting apparatus of the embodiment. (A) It is a figure which shows the holding state of components. (B) It is a figure which shows the two-dimensional image of components bottom face. (C) It is a figure which shows the two-dimensional image of a component bottom face. (D) It is a figure which shows the two-dimensional image of a component bottom face. (A) It is a figure which shows the holding state of components. (B) It is a figure which shows the mounting state to the board | substrate of components. (C) It is a figure which shows the mounting state to the board | substrate of components. (D) It is a figure which shows the mounting state to the board | substrate of components. It is a figure which shows the nozzle with a deposit | attachment. (A) It is a figure which shows the recognition method of the components by a recognition camera. (B) It is a figure which shows the recognition method of the components by a recognition camera. (A) It is a figure which shows the recognition method of the components by a recognition camera. (B) It is a figure which shows the recognition method of the components by a recognition camera. It is a figure which shows the structure of the modification of the imaging means of the embodiment. It is a functional block diagram which shows the structure of the component mounting apparatus of the 2nd Embodiment of this invention. It is a figure which shows the holding state of components. It is a flowchart which shows the component recognition operation | movement of the component mounting apparatus of the embodiment. It is an external view of the conventional component mounting apparatus. (A) It is a front view which shows the structure of the conventional component recognition apparatus. (B) It is a side view which shows the structure of the conventional component recognition apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Base 101,502 Conveyance path 102 Tape feeder 103 Component supply part 104,502a Board | substrate 105,505 Mounting head 106 Imaging means 106a, 106b, 106c, 306a, 306b Recognition camera 107 X-axis table 108 Y-axis table 120, 320 Nozzle 121, 321, 503a, 603a Component 122a, 122b, 322a, 322b Illumination 140 Mechanism unit 141, 241 Mounting control unit 142 Display unit 143 Input unit 144 Storage unit 144a Mounting data 144b Component library 145, 245 Deviation amount calculation unit 146, 246 Correction amount calculation unit 147, 247 Deviation amount determination unit 148 Communication I / F unit 149 Memory unit 150 Adherent 151 Adsorption hole 501 Component mounting device 503 Tray 504 Tray supply unit 506 X-axis movement Means 507a, 507b Y axis moving means 508 Recognition means 508a Height sensor 508b Luminance sensor 601a, 601b, 601c, 601d Reflection means 602 Adsorption nozzle 604 Camera 605 Lens 606 Illumination means

Claims (15)

A method for recognizing a three-dimensional position of a component in a component mounting apparatus comprising a mounting head and an imaging means for imaging a component held by the mounting head,
The part is imaged at a first angle with respect to the part by the imaging means in a first position with respect to the part, and further the part with respect to the part by the imaging means in a second position with respect to the part. An imaging step of imaging the part at two angles;
And a component position recognition step of recognizing a three-dimensional position of the imaged component from the two imaging results. The component recognition method further includes:
A component displacement calculation step of calculating a displacement between the recognized three-dimensional position of the component and the three-dimensional position of the component when the recognized component is held in a nozzle in a desired state;
The component recognition method according to claim 1, further comprising: a component displacement determination step for determining whether or not the calculated displacement is smaller than a predetermined threshold value. The component recognition method according to claim 1, further comprising an inclination recognition step of recognizing an inclination of the component from the two imaging results. The component recognition method further includes:
An inclination deviation calculating step for calculating an inclination deviation between the recognized inclination of the component and the inclination of the component when the component is held in the nozzle in a desired state;
The component recognition method according to claim 3, further comprising: an inclination deviation determination step for determining whether or not the calculated inclination deviation is smaller than a predetermined threshold value. In the component position recognition step, after the imaging of the component is completed by the imaging unit at the first position, the imaging unit at the first position is moved to the second position to perform imaging of the component. The component recognition method according to claim 1. In the component position recognizing step, after the imaging of the component is finished by the recognition unit at the first position, the component is moved and the imaging unit is moved to the second position with respect to the component. The component recognition method according to claim 1, wherein: The component recognition method further includes:
An electrode position recognition step for recognizing a three-dimensional position of an electrode formed on the imaged part from the two imaging results;
An electrode displacement calculation step for calculating a displacement between the recognized three-dimensional position of the electrode and the three-dimensional position of the electrode when the recognized component is held by the nozzle in a desired state; ,
The component recognition method according to claim 1, further comprising: an electrode position deviation determination step for determining whether or not the calculated electrode position deviation is smaller than a predetermined threshold value. A mounting head for holding a component and mounting the held component on a substrate;
Imaging means for imaging the component held by the mounting head;
The imaging result of the component at a first angle with respect to the component by the imaging means in a first position relative to the component, and the component by the imaging means at a second position relative to the component A component mounting apparatus comprising: position recognition means for recognizing a three-dimensional position of a component that has been imaged from the imaging result of the component at a second angle. The component mounting apparatus according to claim 8, wherein the imaging unit is configured by a movable camera arranged so that the component enters a viewing angle. The component mounting apparatus according to claim 8, wherein the imaging unit includes a plurality of cameras arranged so that the component enters a viewing angle. A component mounting method in a component mounting apparatus, comprising: a mounting head that mounts a component on a substrate; and an imaging unit that images the component held by the mounting head,
The part is imaged at a first angle with respect to the part by the imaging means in a first position with respect to the part, and further the part with respect to the part by the imaging means in a second position with respect to the part. An imaging step of imaging the part at two angles;
And a component position recognition step of recognizing a three-dimensional position of the imaged component from the two imaging results. The component mounting method further includes:
A component displacement calculation step for calculating a displacement between the recognized three-dimensional position of the component and the three-dimensional position of the component when the recognized component is held by the nozzle in a desired state; ,
A component misalignment determination step for determining whether the calculated misalignment is smaller than a predetermined threshold;
When it is determined that the positional deviation is larger than a predetermined threshold, a correction step for correcting the mounting condition of the component by the mounting head;
The component mounting method according to claim 11, further comprising a mounting step of mounting the component for which the recognition has been performed under the corrected mounting condition. The component mounting method further includes:
An inclination recognition step for recognizing the inclination of the component from the two imaging results;
An inclination deviation calculating step for calculating an inclination deviation between the recognized inclination of the component and the inclination of the component when the component is held in the nozzle in a desired state;
An inclination deviation determination step for determining whether or not the calculated inclination deviation is smaller than a predetermined threshold;
When it is determined that the tilt deviation is larger than a predetermined threshold, a correction step for correcting the mounting condition of the component by the mounting head;
The component mounting method according to claim 11, further comprising a mounting step of mounting the component for which the recognition has been performed under the corrected mounting condition. A program for a component mounting apparatus comprising: a mounting head; and an imaging unit that images a component held by the mounting head,
The part is imaged at a first angle with respect to the part by the imaging means in a first position with respect to the part, and further the part with respect to the part by the imaging means in a second position with respect to the part. An imaging step of imaging the part at two angles;
A program that causes a computer in a component mounting apparatus to execute a component position recognition step of recognizing a three-dimensional position of a component that has been imaged from the two imaging results. A method for recognizing a three-dimensional position of a nozzle in a component mounting apparatus comprising a mounting head having a nozzle for holding a component and an imaging means for imaging the nozzle,
The imaging means in a first position with respect to the nozzle images the nozzle at a first angle with respect to the component, and the imaging means in a second position with respect to the nozzle further An imaging step of imaging the nozzle at two angles;
A nozzle position recognizing step of recognizing a three-dimensional position of the imaged nozzle from the two imaging results.

Images