JP7271250B2 - Measuring equipment and surface mounters - Google Patents

Description

The technology disclosed in this specification relates to a height measuring device and a surface mounter.

For example, Japanese Unexamined Patent Publication No. 2001-60800 discloses a height measuring device that measures the height of an object to be measured. This height measuring device has a CCD camera that captures an image of an object to be measured, and a light projecting unit that projects linear line light inclined with respect to the optical axis of the CCD camera onto the object to be measured. The measurement device captures an image of the line light projected onto the measurement target with a CCD camera while moving the projection position of the line light relative to the measurement target, and obtains height data of the measurement target from the light cutting line by the line light. is measured by the so-called light section method.

Japanese Patent Application Laid-Open No. 2001-60800

By the way, in the light section method in this type of measuring device, when the angle of inclination of the line light with respect to the optical axis of the imaging unit such as a CCD camera is small, and when the angle of inclination of the line light with respect to the optical axis of the imaging unit is large, The larger the angle of inclination of the line light with respect to the optical axis of the imaging section, the wider the imaging range of the imaging section.

Therefore, a projection unit with a large angle of inclination of the line light with respect to the optical axis of the image pickup unit has better resolution in the height direction of the measurement target than a light projection unit with a small angle of inclination of the line light with respect to the optical axis of the image pickup unit. However, as the amount of captured data in the imaging unit increases, the frame rate decreases, and the imaging speed for capturing an image of the measurement target decreases.

On the other hand, a light projecting unit with a small angle of inclination θ1 of line light with respect to the optical axis of the imaging unit has a faster imaging speed than a light projecting unit with a large angle of inclination of line light with respect to the optical axis of the image pickup unit, but the measurement target resolution in the height direction is reduced.

This specification discloses a technique for performing height measurement according to the state of the object to be measured.

The technology disclosed in this specification is a measuring device that measures the height dimension of a measurement target based on the light section method, and includes an imaging unit that captures an image of the measurement target, and the measurement target that is relatively moved. a projection unit that projects linear projection light inclined with respect to the optical axis of the imaging unit onto the measurement object; and a control unit for measuring the height dimension.

Further, the technology disclosed in this specification is a surface mounter including the measurement device and a component mounting device that holds the measurement target and mounts it on a board.
The present inventor believes that the smaller the tilt angle of the projection light with respect to the optical axis of the imaging unit, the narrower the imaging range and the shorter the measurement time. We focused on improving the resolution in the height direction by increasing the width.

That is, according to the measuring apparatus having such a configuration, the inclination angle of the projection light is changed based on the state of the measurement target such as the shape of the measurement target, the distance between the measurement target and other members, and the measurement height of the measurement target. By increasing or decreasing the height, it is possible to perform height measurement with projection light having an appropriate tilt angle according to the state of the object to be measured.

The measuring device disclosed by this specification may be configured as follows.
The control unit may be configured to change the tilt angle of the projection light based on the measurement accuracy of the measurement object and the priority of the measurement time.

According to such a configuration, when it is necessary to measure the object to be measured with high accuracy, the measurement is performed by increasing the inclination angle of the projection light, and when it is necessary to shorten the measurement time of the object to be measured, Height measurement suitable for the state of the object to be measured can be performed by performing measurement with a small inclination angle of the projection light.

The projection unit has a plurality of light source units that project projection light beams having different angles of inclination with respect to the optical axis of the imaging unit onto the measurement target. The tilt angle of the projection light may be changed by switching the light source unit.

According to such a configuration, the object to be measured can be measured using the light source unit that projects the projection light of the optimum angle onto the object to be measured according to the state of the object to be measured. Thereby, height measurement suitable for the state of the object to be measured can be performed. Moreover, since the inclination angle of the projection light can be changed only by providing a plurality of light source units without providing a driving mechanism, for example, compared to a projection unit having a driving mechanism, the configuration of the projection unit can be suppressed from becoming complicated. At the same time, it is possible to suppress an increase in the manufacturing cost of the projection unit. In addition, compared to a projection unit having a driving mechanism, since the projection unit does not have a driving mechanism, the durability of the projection unit is improved, and the life of the projection unit can be extended.

The projection unit includes a light source unit that outputs the projection light, an optical member that changes an optical path of the projection light output from the light source unit toward the measurement object, and a driving unit that changes the arrangement of the optical members. and the control unit may change the tilt angle of the projection light with respect to the optical axis of the imaging unit by driving the driving unit to change the arrangement of the optical members. .

According to such a configuration, it is possible to finely adjust the tilt angle of the projection light according to the state of the object to be measured and change the tilt angle of the projection light to an arbitrary angle. As a result, the object to be measured can be measured with projection light having an optimum tilt angle according to the state of the object to be measured, and height measurement suitable for the state of the object to be measured can be performed.

The control unit measures the height dimension of the measurement target using the projection light having a predetermined inclination angle, and if the height dimension of the measurement target exceeds a threshold, the projection light with respect to the optical axis of the imaging unit The height dimension of the object to be measured may be remeasured after changing the angle of inclination of the light to be larger.

According to such a configuration, for example, the maximum height dimension of the object to be measured is set as a threshold value, and if the measured height dimension exceeds the threshold value, it is assumed that a measurement error has occurred, and the inclination angle of the projection light is changed. to re-measure the object to be measured. That is, it is possible to prevent an object to be measured, which should be a non-defective product, from being over-determined as a defective product.

According to the technique disclosed by this specification, height measurement can be performed according to the state of the object to be measured.

Plan view of the surface mounter according to the first embodiment Front view of top of surface mounter including head unit Schematic diagram of part measuring unit Block diagram showing the electrical configuration of a surface mounter Schematic diagram of an image captured by the light section method Schematic diagram showing a state in which projection light with a different tilt angle is projected onto an electrode Schematic diagram of a captured image corresponding to projection light with a small tilt angle in FIG. Schematic diagram of a captured image corresponding to projection light with a large tilt angle in FIG. Flowchart of flatness measurement processing Schematic diagram of a component measuring unit according to the second embodiment Schematic diagram of a component measuring unit according to the third embodiment

<Embodiment 1>
Embodiment 1 of the technique disclosed in this specification will be described with reference to FIGS. 1 to 8. FIG.

This embodiment exemplifies a surface mounter 10 that mounts an electronic component (an example of a “measurement target”) E on a printed circuit board PR. As shown in FIG. 1, the surface mounter 10 includes a base 11 having a substantially rectangular shape in plan view, a conveyer 12 for conveying a printed circuit board PR onto the base 11, and an electronic component E mounted on the printed circuit board PR. , a component supply device 14 for supplying an electronic component E to the component mounting device 13, and a component measurement section 20 for measuring the electronic component E. In the following description, the R direction in FIG. 1 is right, the L direction is left, the F direction is forward, the B direction is backward, and the U direction in FIG. 2 is upward and the D direction is downward.

As shown in FIG. 1, the base 11 can be arranged with a conveyor 12, a component mounting device 13, a component measuring unit 20, and the like.

As shown in FIG. 1, the conveyer 12 is arranged substantially in the center of the base 11 in the front-rear direction, and conveys the printed circuit board PR from the upstream right to the downstream left. A printed circuit board PR is set on the transport conveyor 12 so as to be laid thereon. The printed circuit board PR is conveyed from the upstream (right side) by the conveyer 12 to a component mounting position approximately in the center in the left-right direction of the base 11. After the electronic components E are mounted, the printed circuit board PR is conveyed downstream (left side). .

As shown in FIG. 1, the component supply device 14 is of a feeder type, and is arranged at a total of four locations, two on each side in the vertical direction of the conveyer 12 in the horizontal direction. Each component supply device 14 supplies electronic components E from the end on the conveyer 12 side.

As shown in FIGS. 1 and 2, the component mounting apparatus 13 includes a head unit 17 supported by a plurality of frames 16 arranged on the base 11, and a plurality of driving devices 18 for moving the head unit 17. configured with.

A plurality of driving devices 18 are attached to a frame 16 extending in the front-rear direction and a frame 16 extending in the left-right direction. It is designed to move left and right.

As shown in FIGS. 1 and 2, the head unit 17 is equipped with a plurality of mounting heads 19 for holding and mounting the electronic components E arranged side by side in the horizontal direction. Each mounting head 19 sucks and holds the electronic component E supplied from the component supply device 14 and mounts it on the printed circuit board PR.

As shown in FIG. 1, the component measurement units 20 are arranged on both sides of the base 11 in the front-rear direction. As shown in FIG. 3, each component measuring unit 20 includes a component recognition camera (an example of an “image capturing unit”) 22 for capturing an image of the electronic component E sucked and held at the tip of the mounting head 19, and a line sensor for the electronic component E. and a projection unit 30 for projecting a shaped light.

Further, each component measuring section 20 is controlled by a control section 110 which will be described later. The component recognition camera 22 captures an image of the electronic component E sucked and held by the mounting head 19 from below. The position of the electronic component E with respect to the mounting head 19 and the like are measured. In addition, in the present embodiment, the control unit 110 measures the height dimensions of the plurality of electrodes E2 provided on the electronic component E, and measures the flatness of the electrodes E2 on the electronic component E based on the height dimensions of the plurality of electrodes E2. measure degrees. The component measuring unit 20 and the control unit 110 correspond to the measuring device.
Note that the component recognition camera 22 may be provided with a function of measuring the height dimensions of the multiple electrodes E2 provided on the electronic component E. FIG.

The component recognition camera 22 is a camera having a plurality of light receiving elements such as CCD (Charge-Coupled Device) and CMOS (Complementary Metal-Oxide Semiconductor). The component recognition camera 22 is arranged with the imaging surface facing upward. The optical axis A1 of the component recognition camera 22 is arranged to extend vertically from the component recognition camera 22 to the electronic component E, as shown in FIG.

The component recognition camera 22 has a predetermined imaging area P along the optical axis A1 as shown in FIG. Since the electronic component E sucked and held by the mounting head 19 exists in the imaging area P, the electronic component E is imaged by the component recognition camera 22 .

The projection unit 30 has a plurality of light source units 32 that project linear projection light L inclined with respect to the optical axis A1 of the component recognition camera 22 onto the imaging region P, as shown in FIG. In this embodiment, one light source unit 32 is arranged on both sides in the left-right direction with the imaging region P as a reference.

The projection light L projected by the light source unit 32 is set at an arbitrary angle θ with respect to the optical axis A1 of the component recognition camera 22. Preferably, the angle θ is 30 degrees to 70 degrees. range of degrees.

One light source unit (light source unit 32 on the left side in FIG. 3) 32L of the light source units 32 of the present embodiment has an inclination angle θ1 of 30 degrees of the projection light L with respect to the optical axis A1. A portion (light source portion 32 on the right side of FIG. 3) 32R has an inclination angle θ2 of projection light L with respect to the optical axis A1 of 55 degrees.

That is, in the present embodiment, when the electronic component E is present in the imaging area P, the projection light L is projected onto the electronic component E by each light source section 32 , and the projection light L projected onto the electronic component E is projected onto the component recognition camera 22 . is designed to be incident on

Next, the electrical configuration of the surface mounter 10 will be described with reference to FIG.

The surface mounter 10 is entirely controlled by a control section 110 . The control unit 110 includes an arithmetic processing unit 111, a storage unit 112, a drive control unit 113, a measurement processing unit 114, a component supply control unit 115, an external input/output terminal 116, and the like.

The storage unit 112 includes a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. Various programs executed by the arithmetic processing unit 111 and various data are stored in the storage unit 112 . Specifically, the mounting program includes a mounting program for controlling the component mounting device 13, the transport conveyor 12, and the component supply device 14 to place the electronic component E on the printed circuit board PR, and an electronic component sucked and held by the mounting head 19. A coplanarity measurement program for measuring the flatness of the electrode E2 on the part E and the like are stored. Various data such as the angle of projection light for each component type (for example, the optimum angle for measurement) and the maximum height dimension of electrodes in various electronic components are stored.

The drive control unit 113 drives the conveyer 12, the driving device 18, and the like according to instructions from the arithmetic processing unit 111. FIG.
The measurement processing unit 114 irradiates the projection light L from the light source unit 32 in the component measurement unit 20 according to a command from the arithmetic processing unit 111, and converts the electric signal output from the component recognition camera 22 to generate image data. .

The component supply control unit 115 controls the component supply device 14 according to commands from the arithmetic processing unit 111 .
The external input/output terminal 116 includes an input device such as a touch panel, a keyboard, and a mouse, and an output device such as a display. Input of various information such as type and various settings can be performed by operating the external input/output terminal 116 .

The arithmetic processing unit 111 controls each unit of the surface mounter 10 by executing various control programs in the storage unit 112 . The arithmetic processing unit 111 drives the conveyor 12 and the component mounting device 13 via the drive control unit 113 based on, for example, the mounting program in the storage unit 112 . It also controls the component supply device 14 via the component supply control unit 115 . Thus, the electronic component E is mounted on the printed circuit board PR.

Further, the arithmetic processing unit 111 determines the coplanarity of the surface formed by the positions of the lower ends of the plurality of electrodes E2 in the electronic component E according to the coplanarity measurement program stored in the storage unit 112. FIG.

The electronic component E for coplanarity determination is, for example, an electronic component such as a DIP (Dual inline Package) in which a large number of electrodes protrude downward from the lower surface of the package portion, or a package such as a QFP (Quad Flat Package). Spherical or hemispherical electrodes protrude downward from the bottom surface of the package part, such as BGA (Ball Grid Allay), an electronic component in which a large number of electrodes extend laterally from the package part and are then bent downward. electronic parts, etc.

In this embodiment, as shown in FIG. 3, an electronic component E including a component body E1 having a rectangular parallelepiped shape and a plurality of electrodes E2 protruding downward in a hemispherical shape from the bottom surface of the component body E1 is exemplified. .

In determining the coplanarity, the arithmetic processing unit 111 first moves the mounting head 19 sucking and holding the electronic component E to the imaging area P via the drive control unit 113, as shown in FIG. Next, as shown in FIG. 5, projection light L from the light source unit 32 is projected onto the electrode E2 of the electronic component E via the measurement processing unit 114 to form a light cutting line on the electrode E2.

Here, in state 1 before the electronic component E enters the imaging area P, the projection light L is projected onto the imaging area P. As shown in FIG. A reference position S is the position of the projection light L1 projected onto the imaging region P. As shown in FIG. When the electronic component E enters the imaging region P, as shown in FIG. is projected at a distance of h from the reference position S.

Therefore, the projection light L projected onto the electronic component E is imaged by the component recognition camera 22 . In addition, FIG. 5 shows the shape of the electrode E2 as a rectangular parallelepiped in order to make it easier to understand the projection state with respect to the electrode E2.
Then, based on the imaging data, the height dimension of the electrode E2 in the electronic component E is measured, and the coplanarity (flatness) is determined.

As a result of the coplanarity determination, the electronic component E determined to have variations in the height of the lowermost end of each electrode E2 has a part of the electrodes E2 that do not adhere to the printed circuit board PR when the electronic component E is mounted on the printed circuit board PR. It is discarded because there is a risk of mounting failure due to non-contact.

Specifically, as shown in FIG. 3, the arithmetic processing unit 111 in the control unit 110 projects the projection light L of the light source unit 32 onto the electronic component E, and moves the electronic component E toward the component recognition camera 22 in the X-axis direction. , and the height dimension of the lowermost end of each electrode E2 is measured by a light section method in which the electronic component E is continuously imaged a plurality of times.

Measurement of the height dimension of the electrode E2 of the electronic component E by the light section method is performed by the arithmetic processing unit 111 projecting linear light onto the electrode E2 of the electronic component E adsorbed and held by the mounting head 19 by the light source unit 32. , forming a light-section line on the electrode E2, as shown in FIG. Then, the arithmetic processing unit 111 causes the mounting head 19 to move the electronic component E in the X direction, and the component recognition camera 22 continuously captures the projection light L projected onto the electrode E2 a plurality of times.

When the imaging of the electronic component E is completed, the arithmetic processing unit 111 creates three-dimensional data of the electronic component E by connecting the cross-sectional shapes of the electronic component E in the respective captured images in the X direction.

The height dimension of each electrode E2 of the electronic component E is measured as described above, and the coplanarity is determined based on the height dimension of the lowest end of each electrode E2.
In determining coplanarity, for example, when the electrode structure of an electronic component is simple or when the number of electrodes of an electronic component is large, the resolution in the height direction of the electrodes is lowered to reduce the measurement time rather than the measurement accuracy. It may be preferable to give priority to shortening.

On the other hand, for example, when the electrode has a complicated shape, such as an electrode for a DIP electronic component or a QFA electronic component, by increasing the resolution in the height direction of the electrode, priority is given to measurement accuracy over measurement time. It may be preferable to increase the height to prevent over-judgment of a good product as a bad product and over-judgment of a bad product as a good product.

Therefore, in the light section method, as shown in FIG. 6, when the inclination angle θ1 of the projection light L1 of the light source unit 32 with respect to the optical axis A1 of the component recognition camera 22 is small, the imaging range R1 becomes narrow. , the imaging range R2 is widened when the inclination angle θ2 of the projection light L2 is large.

Further, as shown in FIG. 6, when the inclination angle θ1 of the projection light L1 with respect to the optical axis A1 of the component recognition camera 22 is small, the inventors found that the inclination angle θ2 of the projection light L2 with respect to the optical axis A1 of the component recognition camera 22 is As shown in FIG. 7A, although the resolution in the height direction of the electrode E2 is lower than when .DELTA..DELTA..DELTA.

On the other hand, as shown in FIG. 6, when the inclination angle θ2 of the projection light L2 with respect to the optical axis A1 of the component recognition camera 22 is large, compared to the case where the inclination angle θ1 of the projection light L1 with respect to the optical axis A1 of the component recognition camera 22 is small. As a result, although the measurement speed decreases, the resolution in the height direction of the electrode E2 can be improved as shown in FIG. 7B.
Then, the inventors came up with the idea of using a plurality of light source units 32 in the projection unit 30 of the component measurement unit 20 to determine coplanarity.

The flatness measurement process of this embodiment for determining coplanarity will be described below with reference to the flowchart shown in FIG.

In the flat watch-side processing, first, the arithmetic processing unit 111 of the control unit 110 selects which light source unit 32 should project the projection light L onto the electrode E2 of the electronic component E (S11).

Specifically, the selection of the light source unit 32 is performed based on, for example, the component type and the measurement time input from the external input/output terminal 116 .

The arithmetic processing unit 111 selects the light source unit 32 by referring to the optimum angle of the projection light L for each component type in the storage unit 112 based on the inputted component type. Alternatively, the arithmetic processing unit 111 selects the light source unit 32 based on the input measurement time.

Here, for the selection of the light source unit 32, when the measurement time of the electrode E2 is given priority, one light source unit (light source unit 32 on the left side in FIG. 3) 32L is selected, and the resolution in the height direction of the electrode E2 is determined. is to be improved, the selection of the other light source unit (light source unit 32 on the right side in FIG. 3) 32R is selected.

Then, as shown in FIG. 3, the selected light source unit 32 projects linear projection light L onto the electrode E2 to be measured (S12). Three-dimensional data of the electrode E2 to be measured is created by the light section method, and the height dimension of the electrode E2 in the electronic component E is measured (S13).

By the way, when creating three-dimensional data of the electrodes E2 and obtaining the height dimension of each electrode E2, the height dimension of the electrode E2 may be measured higher than the maximum height dimension of the electrode E2. In such a case, for example, it is considered that one of the causes is that light from other than the electrode E2 to be measured enters the component recognition camera 22 . Therefore, when the height dimension of the electrode E2 is measured higher than the maximum height dimension of the electrode E2, it is determined that there is variation in the height of the lowest end of each electrode E2 in coplanarity determination. There is concern that the electronic component E, which is a non-defective product, may be determined (over-determined) as a defective product.

Therefore, in the flatness measurement process of the present embodiment, the arithmetic processing unit 111 first sets the maximum height dimension of the electrode E2 in each component stored in the storage unit 112 as a threshold value (S14).

Then, in the measurement of the height dimension of the electrode E2 in S13, if the measured height dimension of the electrode E2 exceeds the threshold value, the arithmetic processing unit 111 determines that the light source unit 32 relative to the optical axis A1 of the component recognition camera 22 The height dimension of the electrode E2 is remeasured using the light source unit 32 in which the projection light L has a large inclination angle θ.

Specifically, in the measurement of the height dimension of the electrode E2 in S13, it is determined whether the measured height dimension of the electrode E2 exceeds a threshold (S15).
When the measured height dimension of the electrode E2 does not exceed the threshold value (S15: YES), the height dimension of the next electrode E2 is measured on the assumption that there is no over-judgment.

When the measured height dimension of the electrode E2 exceeds the threshold value (S15: NO), the arithmetic processing unit 111 determines the optical axis A1 of the component recognition camera 22 rather than the previously selected light source unit 32. It is checked whether there is a light source unit 32 having a large inclination angle θ of the projection light L of the light source unit 32 with respect to (S16).

When there is no light source unit 32 having a larger inclination angle θ of the projection light L than the previously selected light source unit 32 (S16: NO), the external input/output terminal 116 determines that the height dimension of the electrode E2 cannot be remeasured. is displayed as a measurement error (S17).

If there is a light source unit 32 having a larger inclination angle θ of the projection light L than the previously selected light source unit 32 (S16: YES), the light source unit 32 having a larger inclination angle θ of the projection light L is selected. (S18), and the height dimension of the electrode E2 is re-measured (S12, S13).

In this way, the height dimension of each electrode E2 in the electronic component E is measured (S19), and the coplanarity in the electronic component E is determined (S18).

That is, according to this embodiment, the priority of the measurement accuracy and measurement time of the electronic component E is determined based on the component type of the electronic component E and the measurement time of the electronic component E input from the external input/output terminal 116 . Three-dimensional data is created by selecting the light source unit 32 based on this priority and changing the inclination angle θ of the projection light L to an optimum angle.

As a result, height measurement can be performed with the projection light L having an appropriate tilt angle θ according to the state of the electronic component E, and the coplanarity of the electronic component E can be determined according to the state of the electronic component E. .

Further, according to the present embodiment, when the measured height dimension of the electrode E2 exceeds the maximum height dimension (threshold value) of the electrode E2, the inclination angle θ of the projection light L toward the electrode E2 is changed. Re-measure electrode E2. That is, by changing the tilt angle θ of the projection light L and re-measuring the electrode E2, it is possible to prevent the electronic component E, which should be a non-defective product, from being over-determined as a defective product.

As described above, the surface mounter of the present embodiment has a component measuring section (measuring device) 20 that measures the height dimension of the electrode E2 (measurement object) of the electronic component E based on the light section method. A component recognition camera (imaging unit) 22 for capturing an image of the electrode E2 of the component E, and a linear projection light L inclined with respect to the optical axis A1 of the component recognition camera 22 is projected onto the electrode E2 while the electrode E2 is relatively moved. A projection unit 30 for projection and a control unit 110 for measuring the height dimension of the electrode E2 by changing the tilt angle θ of the projection light L based on the state of the electrode E2 are provided.

Therefore, according to the present embodiment, the inclination angle of the projection light L is determined based on the state of each type of measurement object, such as the shape of the electrode E2 of the electronic component E, the distance between the electrodes E2 of the electronic component E, and the measured height of the electrode E2. θ can be changed. That is, by increasing or decreasing the tilt angle θ of the projection light L, height measurement can be performed with the projection light L having an appropriate tilt angle θ according to the state of the electrode E2.

Further, according to the present embodiment, the arithmetic processing unit 111 of the control unit 110 changes the tilt angle θ of the projection light L based on the measurement accuracy of the electrode E2 and the priority of the measurement time.

That is, when it is necessary to measure the electrode E2 of the electronic component E with high accuracy, the measurement is performed by increasing the inclination angle θ of the projection light L, and when it is necessary to shorten the measurement time of the electrode E2, , the height measurement suitable for the state of the electrode E2 can be performed by performing the measurement with the inclination angle .theta. of the projection light L small.

Further, the projection unit 30 of the present embodiment has a plurality of light source units 32 that project the projection light beams L having different inclination angles θ with respect to the optical axis A1 of the component recognition camera 22 onto the electrode E2. Then, the arithmetic processing unit 111 changes the tilt angle θ of the projection light L by switching the light source unit 32 based on the state of the electrode E2. Therefore, according to the present embodiment, the electrode E2 can be measured using the projection light L having the optimum tilt angle θ with respect to the electrode E2. Thereby, height measurement suitable for the state of the electrode E2 can be performed.

Further, according to the present embodiment, by simply providing a plurality of light source units 32, projection light L having different angles of inclination θ with respect to the optical axis A1 of the component recognition camera 22 can be set for the electrode E2. That is, for example, the configuration of the projection unit 30 can be simplified and the manufacturing cost of the projection unit 30 can be reduced, compared to the case where the tilt angle of the projection light of the light source unit is changed by the driving unit or the like. Further, since the parts to be driven in the projection section 30 can be reduced, the durability of the projection section 30 can be improved. As a result, the life of the projection unit 30 can be extended.

Further, the control unit 110 of the present embodiment measures the height dimension of the electrode E2 using the projection light L (projection light with a predetermined tilt angle) from one light source unit 32, and the height dimension of the electrode E2 exceeds the threshold. of the projection light L with respect to the optical axis A1 of the component recognition camera 22 is increased, and the height dimension of the electrode E2 is measured again.

That is, by changing the inclination angle θ of the projection light L with respect to the electrode E2 and re-measuring the electrode E2, it is possible to prevent the electronic component E, which is originally a non-defective product, from being over-determined as a defective product.

<Embodiment 2>
Next, Embodiment 2 will be described with reference to FIG.
The projection unit 130 of the component measurement unit 120 in the second embodiment changes the number of the light source units 32 in the first embodiment, and includes a reflector (an example of an “optical member”) 133 that changes the inclination angle θ of the projection light L. Since the configurations, actions, and effects that are common to those of the first embodiment are duplicated, descriptions thereof will be omitted. Moreover, the same code|symbol shall be used about the same structure as Embodiment 1. FIG.

The projection unit 130 of the second embodiment includes a light source unit 132 that outputs linear projection light L, and a reflector that reflects the optical path C of the projection light L output from the light source unit 132 toward the electrode E2 of the electronic component E. (an example of an “optical member”) 133 and a driving unit 134 for changing the arrangement of the reflector 133 .

As shown in FIG. 9, the light source unit 132 is arranged on the side of the component recognition camera 22 (on the left side in the drawing). The light source unit 132 is arranged so as to be able to output projection light L in a direction perpendicular to the optical axis A1 of the component recognition camera 22 .

The reflector 133 is a mirror, and the reflector 133 reflects the projection light L output from the light source section 132 toward the electrode E2 of the electronic component E existing in the imaging region P. FIG.
The drive unit 134 is a rotary servomotor fixed to the reflector 133, and the drive unit 134 rotates the reflector 133 by being controlled to be energized.

In other words, in the present embodiment, the drive unit 134 rotates the reflector 133 to change the arrangement of the reflector 133, thereby changing the angle of reflection from the light source unit 132 to the imaging region P as shown in FIG. . As a result, the inclination angle θ of the projection light L with respect to the optical axis A1 of the component recognition camera 22 can be changed to any angle.

That is, according to this embodiment, the tilt angle θ of the projection light L can be finely adjusted based on the priority of measurement accuracy and measurement time. Accordingly, the inclination angle θ of the projection light L that optimizes the measurement accuracy and the measurement time can be determined according to the type of the electronic component E, and the electrode E2 can be measured.

<Embodiment 3>
Next, Embodiment 3 will be described with reference to FIG.
The projection unit 230 of the component measurement unit 120 in the third embodiment has a configuration in which the projection unit 30 of the first embodiment and the projection unit 130 of the second embodiment are combined, and has the same configuration, action, and effect as those of the first embodiment. Since it overlaps, the description is omitted. Moreover, the same code|symbol shall be used about the same structure as Embodiment 1. FIG.

The projection unit 230 of the third embodiment includes a plurality of light source units 132 that output linear projection light L, and reflects the optical path C of the projection light L output from the light source units 132 toward the electrode E2 of the electronic component E. It includes a plurality of reflectors (an example of an “optical member”) 133 and a plurality of driving units 134 for changing the arrangement of each reflector 133 .

The light source section 132 , the reflector 133 and the driving section 134 constitute one set of three projection units 140 . In this embodiment, one projection unit 140 is arranged on each side in the X direction with the optical axis A1 of the component recognition camera 22 as a reference. The two projection units 140 are arranged with different distances of the reflectors 133 in the X direction. Of the two projection units 140, as shown in FIG. 10, the reflector 133 of the first projection unit 140A on the left side in the drawing is arranged farther from the optical axis A1 than the reflector 133 of the second projection unit 140B on the right side in the drawing. It has become.

That is, the inclination angle of the projection light L of the first projection unit 140A with respect to the optical axis A1 is smaller than the inclination angle of the projection light L of the second projection unit 140B with respect to the optical axis A1.
Therefore, in this embodiment, when the inclination angle θ of the projection light L is decreased to shorten the measurement time, the first projection unit 140A is used and the inclination angle θ of the projection light L is increased to reduce the measurement time. The second projection unit 140B is used to increase the resolution in the height direction.

Further, each projection unit 140 rotates the reflector 133 by the drive unit 134 and changes the inclination angle θ of the projection light L with respect to the optical axis A1 to an arbitrary angle, thereby changing the inclination angle θ of the projection light L to It can be fine-tuned.

That is, according to this embodiment, the electrode E2 can be measured with the projection light L having the optimum tilt angle θ by finely adjusting the tilt angle θ of the projection light L based on the priority of measurement accuracy and measurement time. In addition, the load of each projection unit 140 can be distributed to extend the life of each projection unit 140 .

<Other embodiments>
The technology disclosed in this specification is not limited to the embodiments described by the above description and drawings, and includes various aspects such as the following, for example.

(1) In the above embodiment, the surface mounter 10 including the component measuring section 20 is shown as an example. However, the component measurement unit disclosed in this specification may be applied to an inspection device or the like without being limited to this.

(2) In Embodiments 2 and 3, the projection light L is reflected by the reflector 133 to change the optical path C of the light source section 132 . However, the configuration is not limited to this, and a configuration in which projection light is changed by a prism may be employed.

(3) In the above embodiment, the electronic component E is moved with respect to the component recognition camera 22 and the light source units 32 and 132 . However, the configuration is not limited to this, and in the configuration of the first embodiment, a configuration in which the light source unit is moved with respect to the electronic component E may be employed. Also, in the configurations of the second and third embodiments, the reflector and the driving section may be moved with respect to the electronic component.

10: Surface mounter 13: Component mounting device 20: Component measuring unit (an example of "measuring device")
22: Component recognition camera (an example of an “imaging unit”)
30: projection unit 32, 132: light source unit 110: control unit 111: arithmetic processing unit (an example of a “control unit”)
133: Reflector (an example of "optical member")
134: Drive unit A1: Optical axis C: Optical path E: Electronic component (an example of "measurement object")
E2: Electrode (an example of "measurement target")
L: projection light θ: tilt angle

Claims (6)

A measuring device for measuring the height dimension of an object to be measured based on the light section method,
an imaging unit that captures an image of the measurement target;
a projection unit that projects linear projection light inclined with respect to an optical axis of the imaging unit onto the measurement target while relatively moving the measurement target;
a control unit that measures the height dimension of the measurement object by changing the tilt angle of the projection light according to the resolution in the height direction of the measurement object;
The object to be measured is an electronic component,
The control unit measures a height dimension of the electrode of the electronic component by the projection light having a predetermined tilt angle, and if the height dimension of the electrode exceeds a maximum height dimension of the electrode , the imaging is performed. a measuring device for re-measuring the height dimension of the electrode of the electronic component with high resolution by changing the angle of inclination of the projection light with respect to the optical axis of the part so as to increase. 2. The measuring apparatus according to claim 1, wherein the tilt angle of said projection light when measuring said electronic component with low resolution is smaller than the tilt angle of said projection light when measuring said electronic component with high resolution. 3. The measuring apparatus according to claim 1, wherein the control unit changes the tilt angle of the projection light based on the resolution of the height dimension of the electrode of the electronic component and the priority of measurement time. The projection unit has a plurality of light source units that project projection light beams having different angles of inclination with respect to the optical axis of the imaging unit onto the measurement target,
3. The measuring apparatus according to claim 1, wherein the control section switches the light source section based on the state of the electronic component to change the tilt angle of the projection light. The projection unit includes a light source unit that outputs the projection light, an optical member that changes an optical path of the projection light output from the light source unit toward the measurement object, and a driving unit that changes the arrangement of the optical members. and
3. The measurement according to claim 1, wherein the control section drives the driving section to change the arrangement of the optical members, thereby changing the tilt angle of the projection light with respect to the optical axis of the imaging section. Device. a measuring device according to any one of claims 1 to 5 ;
and a component mounting device that holds and mounts the electronic component on a substrate.

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