JP7122456B2 - Measuring equipment and surface mounters - Google Patents

Description

The technology disclosed by this specification relates to a measuring device and a surface mounter.

For example, Japanese Unexamined Patent Application Publication No. 2001-217599 is known as a height measuring device for measuring the height of an object to be measured. This height measuring device captures an image of the linear light projected onto the object to be measured by the beam irradiating means, using imaging means such as a CCD camera, and measures the height of the object to be measured based on the deviation of the imaged light from a reference position and the brightness of the light. The height is measured by the so-called light section method.

JP-A-2001-217599

By the way, in the above measuring device, when the distance between the objects to be measured is short or the distance to another member is short, the light projected onto the object to be measured is reflected toward a member different from the object to be measured, Light reflected from a member other than the object to be measured is reflected in the captured image. As a result, it becomes impossible to accurately recognize the light of the measurement target, or it becomes impossible to accurately recognize the brightness of the light, thereby deteriorating the measurement accuracy of the measurement target.

This specification discloses a technique for suppressing a decrease in measurement accuracy of a measurement target.

The technology disclosed in this specification is a measuring device that measures the height dimension of a measurement target based on the light section method, and includes an imaging unit that captures an image of the measurement target while relatively moving the measurement target. a plurality of light source units arranged at least one at each of positions on both sides of an imaging area for imaging the measurement object, and projecting linear light toward the measurement object; and a control unit. The reflected light reflected from the measurement object includes first reflected light reflected from the measurement object toward the imaging unit and second reflected light different from the first reflected light, and the control unit and calculating data corresponding to the first reflected light based on the amount of the reflected light received by each of the light sources captured by the imaging section, and measuring the height dimension of the measurement object.

Further, the technology disclosed by the present specification is a surface mounter including the measurement device and a component mounting device that holds the measurement target and mounts it on a board.

According to the measuring apparatus having such a configuration, for example, the reflected light to be measured is reflected light other than the second reflected light (multiple reflected light) that is further reflected by another adjacent member, that is, the first reflected light. It is possible to calculate the corresponding data and obtain the height dimension of the object to be measured. That is, even when the second reflected light reflected by another member or the like enters the imaging unit, the height dimension of the measurement target can be accurately measured. As a result, it is possible to prevent the accuracy of the height measurement of the object to be measured from deteriorating.

By the way, as a method of projecting light from a plurality of light source units onto the measurement object, for example, a method of projecting light onto the measurement object only from one side of the imaging position is conceivable. However, when light is projected onto the measurement object from only one side of the imaging position, only one side of the measurement object is measured, so there is a concern that the measurement accuracy may be degraded.

However, according to such a configuration, light is projected onto the measurement object from both sides of the imaging position, the reflected light is imaged, and the height of the entire measurement object is measured. .

The measuring device disclosed by this specification may be configured as follows.
The control unit captures an image by projecting light onto the same measurement location of the measurement object using the plurality of light source units, and based on the lowest amount of received light among the received amounts of the reflected light at the same measurement location The data may be calculated according to the first reflected light.

According to such a configuration, the data corresponding to the first reflected light is calculated by a simple method of obtaining the lowest received light amount among the received light amounts of the respective reflected lights captured by the plurality of light source units. Then, by the light section method, data corresponding to the first reflected light can be created, and the height dimension of the entire measurement object can be obtained.
The control unit calculates height dimension data of the object to be measured based on the received amount of the reflected light, and calculates the lowest height dimension data among the calculated height dimension data at the same measurement point. It is good also as a structure which makes it the height dimension in the said measurement location.
According to such a configuration, first, data on the height dimension of the object to be measured is calculated from the amount of received reflected light. Then, the height dimension data corresponding to the first reflected light is obtained by taking the data of the lowest height dimension among the height dimension data calculated at the same measurement location as the height dimension at the measurement location. be able to. Thereby, the height measurement of the measurement target can be performed.

The control unit captures an image by projecting light onto the same measurement location of the measurement target by the plurality of light source units, and based on the overlapping received light amount among the received light amounts of the respective reflected light at the same measurement location may be configured to calculate data corresponding to the first reflected light.

According to such a configuration, the data corresponding to the first reflected light is calculated by a simple method of obtaining redundant data of the amount of light received by each of the reflected lights captured by the plurality of light source units, and the light section method is used to obtain the second reflected light. 1 Create data corresponding to the reflected light. Thereby, the height dimension of the entire measurement object can be obtained.
The control unit calculates data of the height dimension of the object to be measured based on the received amount of the reflected light, and calculates the height dimension data obtained by ANDing the data of the height dimension respectively calculated at the same measurement point. The data may be a height dimension at the measurement location.
According to such a configuration, first, data on the height dimension of the object to be measured is calculated from the amount of received reflected light. Then, the height dimension data corresponding to the first reflected light is obtained by using the height dimension data obtained by logical product of the height dimension data calculated at the same measurement location as the height dimension at the measurement location. Obtainable. Thereby, the height measurement of the measurement object can be performed.

According to the technique disclosed by this specification, it is possible to suppress the deterioration of the measurement accuracy of the measurement target.

Top view of surface mounter Front view of top of surface mounter including head unit Schematic diagram of part measuring unit Block diagram showing the electrical configuration of a surface mounter Flowchart of flatness measurement processing Schematic diagram showing a state in which light projected onto an electrode of an electronic component is reflected Conceptual diagram of creating a three-dimensional shape of the first reflected light from the three-dimensional shapes of two reflected lights Schematic diagram of part measuring unit in conventional measuring method Schematic diagram of an image captured by the light section method Conceptual diagram of centroid detection method Schematic diagram showing the state in which the light reflected from the electrode to be measured is further reflected from the adjacent electrode toward the component recognition camera. Schematic diagram of a captured image in which the reflected light from the adjacent electrode is incident on the captured image of the electrode Conceptual diagram of the center-of-gravity detection method in the state of FIG. FIG. 10 is a flowchart of flatness measurement processing according to the second embodiment;

<Embodiment>
Embodiment 1 of the technique disclosed in this specification will be described with reference to FIGS. 1 to 7. FIG.

This embodiment exemplifies a surface mounter 10 that mounts an electronic component (an example of a “measurement target”) E on a printed circuit board B. FIG. As shown in FIG. 1, the surface mounter 10 includes a base 11 having a substantially rectangular shape in plan view, a conveyer 12 for conveying a printed circuit board B onto the base 11, and an electronic component E mounted on the printed circuit board B. , a component supply device 14 for supplying an electronic component E to the component mounting device 13, and a component measurement section 20 for measuring the electronic component E. In the following description, the R direction in FIG. 1 is right, the L direction is left, the F direction is forward, the B direction is backward, and the U direction in FIG. 2 is upward and the D direction is downward.

As shown in FIG. 1, the base 11 can be arranged with a conveyor 12, a component mounting device 13, a component measuring unit 20, and the like.

As shown in FIG. 1, the conveyer 12 is arranged substantially in the center of the base 11 in the front-rear direction, and conveys the printed circuit board B from the right, which is upstream, to the left, which is downstream. A printed circuit board B is set on the conveyer 12 so as to be laid thereon. The printed circuit board B is conveyed from the upstream (right side) by the conveyer 12 to the component mounting position in the center of the base 11 in the left-right direction, and after the electronic components E are mounted, it is conveyed downstream (left side). .

As shown in FIG. 1, the component supply device 14 is of a feeder type, and is arranged at a total of four locations, two on each side in the vertical direction of the conveyer 12 in the horizontal direction. Each component supply device 14 supplies electronic components E from the end on the conveyer 12 side.

As shown in FIGS. 1 and 2, the component mounting apparatus 13 includes a head unit 17 supported by a plurality of frames 16 arranged on the base 11, and a plurality of driving devices 18 for moving the head unit 17. configured with.

A plurality of driving devices 18 are attached to a frame 16 extending in the front-rear direction and a frame 16 extending in the left-right direction. It is designed to move left and right.

As shown in FIGS. 1 and 2, the head unit 17 is equipped with a plurality of mounting heads 19 for holding and mounting the electronic components E arranged side by side in the horizontal direction. Each mounting head 19 sucks and holds the electronic component E supplied from the component supply device 14 and mounts it on the printed circuit board B. As shown in FIG.

As shown in FIG. 1, the component measurement units 20 are arranged on both sides of the base 11 in the front-rear direction. As shown in FIG. 3, each component measuring unit 20 includes a component recognition camera (an example of an “image capturing unit”) 22 for capturing an image of the electronic component E sucked and held at the tip of the mounting head 19, and a line sensor for the electronic component E. and a plurality of light source units 24 for projecting shaped light.

Further, each component measuring section 20 is controlled by a control section 110 which will be described later. The component recognition camera 22 captures an image of the electronic component E sucked and held by the mounting head 19 from below. The position of the electronic component E with respect to the mounting head 19 and the like are measured. In addition, in the present embodiment, the control unit 110 measures the height dimensions of the plurality of electrodes E2 provided on the electronic component E, and measures the flatness of the electrodes E2 on the electronic component E based on the height dimensions of the plurality of electrodes E2. measure degrees. The component measuring unit 20 and the control unit 110 correspond to the measuring device.
Note that the component recognition camera 22 may be provided with a function of measuring the height dimensions of the multiple electrodes E2 provided on the electronic component E. FIG.

The component recognition camera 22 is a camera having a plurality of light receiving elements such as CCD (Charge-Coupled Device) and CMOS (Complementary Metal-Oxide Semiconductor). The component recognition camera 22 is arranged with its imaging surface facing upward. The optical axis A1 of the component recognition camera 22 is arranged to extend vertically from the component recognition camera 22 to the electronic component E, as shown in FIG.

The component recognition camera 22 has a predetermined imaging area P along the optical axis A1 as shown in FIG. Since the electronic component E sucked and held by the mounting head 19 exists in the imaging area P, the electronic component E is imaged by the component recognition camera 22 .

As shown in FIG. 3, at least one of the plurality of light source units 24 is arranged on both sides in the left-right direction with reference to an imaging region P where the component recognition camera 22 images the electronic component E. As shown in FIG. In this embodiment, one light source unit 24 is arranged on each side in the left-right direction with reference to the imaging area P, and the two light source units 24 have a symmetrical positional relationship with respect to the optical axis A1 of the component recognition camera 22. .

Each light source unit 24 projects linear light inclined with respect to the optical axis A<b>1 of the component recognition camera 22 onto the imaging region P. The light source unit 24 of this embodiment has an inclination angle θ of 30 degrees to 60 degrees with respect to the optical axis A1 of the component recognition camera 22. are assumed to be the same.
That is, in the present embodiment, when the electronic component E is present in the imaging area P, light is projected onto the electronic component E by the light source unit 24, and the reflected light R reflected from the electronic component E is incident on the component recognition camera 22. It's becoming

Next, the electrical configuration of the surface mounter 10 will be described with reference to FIG.
The surface mounter 10 is entirely controlled by a control section 110 . The control unit 110 has an arithmetic processing unit 111, a storage unit 112, a drive control unit 113, an image processing unit 114, a component supply control unit 115, etc., which are configured by a CPU or the like.

The storage unit 112 includes a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. Various programs executed by the arithmetic processing unit 111 and various data are stored in the storage unit 112 . Specifically, the mounting program includes a mounting program for controlling the component mounting device 13, the transport conveyor 12, and the component supply device 14 to place the electronic component E on the printed circuit board B, and an electronic component sucked and held by the mounting head 19. A coplanarity measurement program for measuring the flatness of the electrode E2 on the part E and the like are stored.

The drive control unit 113 drives the conveyer 12, the driving device 18, and the like according to instructions from the arithmetic processing unit 111. FIG.
The image processing unit 114 generates image data by converting an electrical signal output from the component recognition camera 22 in the component measurement unit 20 according to a command from the arithmetic processing unit 111 .
The component supply control unit 115 controls the component supply device 14 according to commands from the arithmetic processing unit 111 .

The arithmetic processing section 111 controls each section of the surface mounter 10 by executing various control programs in the storage section 112 . The arithmetic processing unit 111 drives the conveyor 12 and the component mounting device 13 via the drive control unit 113 based on, for example, the mounting program in the storage unit 112 . It also controls the component supply device 14 via the component supply control unit 115 . Thus, the electronic component E is mounted on the printed circuit board B. FIG.

Further, the arithmetic processing unit 111 drives the component recognition camera 22 via the image processing unit 114 according to the coplanarity measurement program stored in the storage unit 112 . The arithmetic processing unit 111 takes in image data captured by the component recognition camera 22 via the image processing unit 114, and based on the image data, the coplanarity ( flatness).

By the way, the electronic component E mounted on the printed circuit board B by the surface mounter 10 includes, for example, an electronic component such as a DIP (Dual inline Package) having a large number of electrodes protruding downward from the lower surface of the package portion, There is an electronic component such as a BGA (Ball Grid Allay) in which spherical or hemispherical electrodes protrude downward from the bottom surface of a package portion.

In this embodiment, as shown in FIGS. 3 and 6, an electronic component E including a component body E1 having a rectangular parallelepiped shape and an electrode E2 protruding downward in a hemispherical shape from the bottom surface of the component body E1 is exemplified. there is Here, if there is variation in the height of the lowest end of each electrode E2, there is concern that when the electronic component E is mounted on the printed circuit board B, some of the electrodes E2 do not come into contact with the printed circuit board B, resulting in mounting defects. be done.

Therefore, as shown in FIG. 3, the control unit 110 moves the electronic component E in the X direction with respect to the component recognition camera 22 while projecting the light of the light source unit 24 onto the electronic component E. The so-called coplanarity, which is the flatness of the height of the lowermost end of each electrode E2, is measured by a light section method in which the electronic component E is imaged continuously a plurality of times. If the coplanarity is worse than the reference value (that is, if the height of the electrode E2 varies greatly), the control unit 110 discards the electronic component E as a defective component.

A method for measuring the height dimension of the electrode E2 in the electronic component E by the light section method will be briefly described below.
First, a conventional measurement method using the light section method will be described with reference to FIGS. 8 to 10. FIG.

Generally, in the conventional measurement method using the light section method, as shown in FIG. Linear light inclined with respect to the optical axis A1 is projected from one light source unit 24 onto an imaging region P predetermined along the line.

Next, in a state in which light is projected onto the imaging region P, the electronic component E is moved in the X direction as shown in FIG. Then, the overall height dimension of the electrode E2 is measured based on the light shift position h in each captured image 60 .

Specifically, the control unit 110 causes the component measurement unit 20 to first move the electronic component E along the movement path C, continuously image the electronic component E in the imaging region P a plurality of times, A shift position h of light is obtained in each captured image 60 .

Here, light is projected onto the imaging region P before the electronic component E enters the imaging region P. As shown in FIG. The position of the light Re1 projected onto the imaging area P is defined as a reference position S. As shown in FIG. When the electronic component E enters the imaging region P, as shown in FIG. 9, light is projected onto the electronic component E, and the light Re2 projected onto the electronic component E according to the height dimension of the electronic component E is positioned at the reference position. It is projected out of S.

The deviation position h (see FIG. 9) of the light projected onto the electronic component E from the reference position S is determined based on the position of the light Re2 projected onto the electronic component E and the brightness L of the light, based on the centroid detection method. decide.

FIG. 10 shows the luminance L of the light projected on the electronic component E at the Y coordinate surrounded by a square in the captured image 60 shown in FIG. 9 at the X coordinate. In FIG. 10, the horizontal axis indicates the distance from the reference position S of the light projected onto the electrode E2 in X coordinates, and the vertical axis indicates the luminance L at each X coordinate.

そして、式（１）で求められた重心位置ＣＰのＸ座標が電極Ｅ２に投影される光の基準位置Ｓからのずれ位置ｈとして決定される。The center-of-gravity position CP of the Y coordinate in the captured image 60 is obtained by the following formula (1) based on the coordinates of the light Re2 projected onto the electronic component E and the brightness L of the light Re2. In equation (1), xi is the distance (X coordinate) from the reference position S, and L is the brightness of each X coordinate.

Then, the X-coordinate of the center-of-gravity position CP obtained by Equation (1) is determined as the shift position h from the reference position S of the light projected onto the electrode E2.

Next, the control unit 110 determines the deviation position h of each Y-coordinate light from the reference position S in the captured image 60, and connects the deviation position h of the light at each Y-coordinate in the Y direction to project the light. A cross-sectional shape (height dimension in the cross section) of the electronic component E at the position where the cross section is set is obtained.

Then, the control unit 110 obtains the cross-sectional shape of the electronic component E in each captured image 60, and connects the cross-sectional shapes of the electronic component E in each captured image 60 in the X direction, thereby obtaining the three-dimensional shape of the electronic component E. create.

As described above, in the conventional measurement method, the reflected light R of light projected from one light source unit 24 is imaged by the component recognition camera 22, and the electrode E2 of the electronic component E is detected based on the received amount of the reflected light R. Measure the height dimension. Then, the coplanarity of the height of the lowest end of each electrode E2 is determined.

By the way, for example, when the distance between the electrodes E2 in the electronic component E is short, as shown in FIG. The light RA reflected on the captured image 60 from an electrode E2 different from the electrode E2 to be measured enters the component recognition camera 22 . Then, as shown in FIG. 12, in the captured image 60, the light R0 reflected by the electrode E2 to be measured and the light RA reflected by the adjacent electrode E2 are captured.

Therefore, in the conventional measurement method, when the center of gravity position CP is determined by the light section method, the center of gravity position CP is determined at a position shifted in the direction of being larger than the original center of gravity position CP0, as shown in FIG. , the height dimension of the electrode E2 is measured higher than it should be.

Therefore, in the present embodiment, the two light source units 24 in the component measurement unit 20 are used to execute flatness measurement processing.
The flatness measurement process according to this embodiment will be described below with reference to the flowchart shown in FIG.

When the component measurement unit 20 measures the height dimension of the electrode E2 of the electronic component E present in the imaging region P, the control unit 110 of the present embodiment firstly selects one of the two light source units 24 ( As shown in FIG. 6, the light source unit 24) 24L on the left side of FIG. 3 emits linear light Li1 (three light beams Li1 in FIG. 6 for explanation) inclined from the left side with respect to the electrode E2 to be measured. , the light is continuously projected onto the electrode E2) (S11). Then, a three-dimensional shape M1 of the electrode E2 to be measured is created by a light section method similar to the conventional one (S12).

Here, when light is projected obliquely to the left of the electrode E2, the projected light Li1 is reflected by the electrode E2, and the reflected light R enters the component recognition camera 22. FIG. However, some light projected on the left side of electrode E2 is reflected toward the left.

The light reflected toward the left side is further reflected by the electrode E2L arranged on the left side of the electrode E2 to be measured, and is reflected in multiple ways different from the light reflected from the electrode E2 to be measured toward the component recognition camera 22. Light enters the component recognition camera 22 .

That is, the reflected light R of the electrode E2 imaged by the component recognition camera 22 is divided into the first reflected light R1 reflected from the electrode E2 toward the component recognition camera 22 and the first reflected light R1 reflected from the electrode E2 and further reflected from other members for component recognition. It contains the second reflected light R2 that is reflected toward the camera 22 .

Therefore, when determining the center-of-gravity position CP in the light-section method, the height dimension of the left end of the electrode E2 is measured to be high, and as shown in the upper part of FIG. A three-dimensional shape M1 with high dimensions is created. The three-dimensional shape M1 is stored in the storage unit 112 together with the XY coordinates in the imaging region P. FIG.

Next, the control unit 110 controls the light source unit 24R of the other of the two light source units 24 (the light source unit 24 on the right side of the drawing in FIG. 3) to cause the electrode E2 projected by the light Li1 of the one light source unit 24L. A linear light Li2 inclined from the right side of the measurement point is projected (S13). Therefore, in the present embodiment, one light source unit 24R and the other light source unit 24L project light onto the electrode E2 at different timings, but the one light source unit 24R and the other light source unit 24L project the imaging region P , the light is projected onto the same measurement point of the electrode E2.
One light source unit 24R and the other light source unit 24L may project light onto the same measurement point of the electrode E2 at different locations in the imaging region P in the horizontal direction with different projection timings. Also, the light source unit 24R and the light source unit 24L may project light onto the electrode E2 at the same time, and when the light is projected at the same time, the imaging time can be shortened.
Then, a three-dimensional shape M2 of the electrode E2 to be measured is created by a light section method similar to the conventional one (S14).

Here, when light is projected obliquely to the right of the electrode E2, the projected light is reflected by the electrode E2, and the reflected light R is incident on the component recognition camera 22. FIG. However, some of the light projected onto the right side of electrode E2 is reflected toward the right.

The light reflected toward the right side is further reflected by the electrode E2R arranged on the right side of the electrode E2 to be measured, and is reflected in multiple ways different from the light reflected from the electrode E2 to be measured toward the component recognition camera 22. Light enters the component recognition camera 22 .

That is, even in the measurement based on the other light source unit 24R, the reflected light R of the electrode E2 imaged by the component recognition camera 22 is the first reflected light R1 reflected from the electrode E2 toward the component recognition camera 22 and the electrode E2 It includes the second reflected light R2 that is reflected from another member and reflected toward the component recognition camera 22 from another member.

Therefore, when determining the center-of-gravity position CP in the light-section method, the height dimension of the right end of the electrode E2 is measured to be high, and as shown in the middle of FIG. A three-dimensional shape M2 with high dimensions is created. The three-dimensional shape M2 is stored in the storage unit 112 together with the XY coordinates in the imaging region P. FIG.

Next, the control unit 110 determines the height at the same measurement point (XY coordinates) of the three-dimensional shape M1 obtained by the projection of one light source unit 24L and the three-dimensional shape M2 obtained by the other light source unit 24R. The dimension data are compared (S15).
As a result of comparing the height dimension data at the same measurement points (XY coordinates) of the three-dimensional shape M1 and the three-dimensional shape M2, the height dimension data with the lowest height is used as the height of each measurement point (XY coordinates), A new three-dimensional shape M3 as shown in the lower part of FIG. 7 is created (S16).
Specifically, at the coordinates on the left side of X1 and the right side of X3 in FIG. is selected as the height dimension data of At coordinates on the right side of X2 and the left side of X4 in FIG. is selected as

In other words, the first reflected light R1 reflected from the electrode E2 toward the component recognition camera 22 is calculated based on the lowest amount of light received among the reflected lights R at the same measurement point (XY coordinates), and a new 3 Create a dimensional shape M3.

In other words, the newly created three-dimensional shape M3 is in a state where the light incident on the component recognition camera 22 from a location different from the electrode E2 to be measured is removed, and the light from the electrode E2 to be measured to the component recognition camera 22 is removed. It is created based only on the first reflected light R1 reflected toward it. Thereby, an accurate height dimension of each electrode E2 in the electronic component E can be obtained.

That is, even when the second reflected light R2 reflected by the adjacent electrode E2 or another member enters the component recognition camera 22, it is possible to accurately measure the height dimension of the electrode E2 to be measured. As a result, it is possible to prevent the height measurement accuracy of the electrode E2, which is the measurement target, from being lowered.
Then, the height dimension of each electrode E2 in the electronic component E is measured (S17), and the coplanarity in the electronic component E is determined (S18).

That is, since the deterioration of the measurement accuracy of the height dimension of each electrode E2 in the electronic component E is suppressed, the deterioration of the coplanarity measurement accuracy in the electronic component E can be suppressed.

As described above, the component measuring unit (measuring device) 20 of the present embodiment measures the height dimension of the object to be measured based on the light section method. At least one component recognition camera (imaging unit) 22 that captures an image of the electrode E2 to be measured while being relatively moved, and at least one component recognition camera 22 are arranged at positions on both sides of the imaging region P that captures the electrode E2, A control unit 110 and a plurality of light source units 24 that project linear light toward the electrodes E2 to be measured are provided.

The reflected light R reflected from the electrode E2 includes a first reflected light R1 reflected from the electrode E2 toward the component recognition camera 22 and a second reflected light R2 different from the first reflected light R1. Based on the amount of reflected light R received by each light source unit 24 captured by the component recognition camera 22, the control unit 110 generates a three-dimensional shape ( Data) M3 is calculated, and the height dimension of the electrode E2 to be measured is measured.

Therefore, according to the present embodiment, reflected light excluding the second reflected light R2 reflected from the electrode E2 to be measured and further reflected by another member, that is, the second reflected light reflected from the electrode E2 toward the component recognition camera 22 The height dimension of the object to be measured can be obtained by calculating data according to one reflected light R1. That is, even when the second reflected light R2 is incident on the component recognition camera 22 due to another member or the like, it is possible to accurately measure the height dimension of the electrode E2, which is the measurement target. As a result, it is possible to suppress the accuracy of measuring the height of the electrode E2, which is the object to be measured, and the accuracy of measuring the coplanarity of the electronic component E from deteriorating.

By the way, as a method of projecting light from a plurality of light source units onto the measurement object, for example, a method of projecting light onto the measurement object only from one side of the imaging position is conceivable.
However, when light is projected onto the measurement target from only one side of the imaging region P, only one side of the measurement target is measured, and there is a concern that the measurement accuracy may deteriorate.

However, according to the present embodiment, light is projected onto the electrode E2 from both sides of the imaging region P, the reflected light R is imaged, and the height of the electrode E2 is measured. .

Further, according to the present embodiment, as shown in FIG. 6, the control unit 110 projects light onto the same location of the electrode E2 by the plurality of light source units 24 to capture an image. A three-dimensional shape (data) corresponding to the first reflected light R1 shown in the lower part of FIG. 7 is calculated based on the lowest amount of received light.
Specifically, height data (three-dimensional shapes M1 and M2) of the object to be measured is calculated based on the amount of light received by the reflected light R, and at the same measurement point, among the calculated height data, Let the data of the lowest height dimension be the height dimension at the measurement point.
That is, according to the present embodiment, it is simple to calculate only the first reflected light R1, excluding the reflected light R that is incident on the component recognition camera 22 from a location different from the electrode E2 to be measured and has a high received light amount. A three-dimensional shape M3 can be created and the height dimension of the electrode E2 can be measured by such a method.

<Embodiment 2>
Next, Embodiment 2 will be described with reference to the flowchart of FIG.
The flatness measurement process of the second embodiment is a modification of S16 of the first embodiment, and since the configurations, actions, and effects common to those of the first embodiment overlap, the description thereof will be omitted. Moreover, the same code|symbol shall be used about the same structure as Embodiment 1. FIG.

In the flatness measurement process of the second embodiment, as shown in the flow chart of FIG. 14, the control unit 110 has created each three-dimensional shape in S12 and S14, and in S15, the same measurement points (same XY coordinates ) to compare the height dimensions of the three-dimensional shapes. Then, overlapping height dimension data (data based on overlapping amounts of received light) in the two three-dimensional shapes is determined as the height dimension of each measurement point, and a new three-dimensional shape (data) is created.

In other words, among the height dimensions of the reflected light beams R at the same measurement point (same XY coordinates), the height dimension data calculated based on the overlapping amount of received light, that is, the height dimension data at the same measurement point The logical product of the height dimension of the reflected light R is calculated as the height dimension of the first reflected light R1, and determined as the height dimension of the electrode E2 (S26). Thereby, the three-dimensional shape (data) of the first reflected light R1 can be created, and the height dimension of the electrode E2 can be measured.
Specifically, referring to FIG. 7, at coordinates on the left side of X1 and on the right side of X3, the height dimension data M2A of the three-dimensional shape M2 is the height dimension data of the three-dimensional shape M1 (see FIG. 7). A part of the three-dimensional shape M1), and the height dimension data M2A, which is the overlapping data, is selected as the height dimension data of the new three-dimensional shape. At the coordinates to the right of X2 and to the left of X4, the height dimension data M1A of the three-dimensional shape M1 overlaps the height dimension data of the three-dimensional shape M2 (part of the three-dimensional shape M2 in FIG. 7), and overlaps. The height dimension data M1A, which is the data having the height dimension data, is selected as the height dimension data of the new three-dimensional shape.

Therefore, in the three-dimensional shape newly created in this embodiment, as in the first embodiment, the light incident on the component recognition camera 22 from a location different from the electrode E2 to be measured is removed, and the electrode E2 to be measured is removed. It will be created based on only the light directly reflected from E2. Thereby, the height dimension of each electrode E2 in the electronic component E can be calculated|required, and it can suppress that the precision of height measurement of a measuring object falls.

Then, similarly to the first embodiment, the height dimension of each electrode E2 in the electronic component E is measured (S17), and the coplanarity in the electronic component E is determined (S18).
That is, since the deterioration of the measurement accuracy of the height dimension of each electrode E2 in the electronic component E is suppressed, the deterioration of the coplanarity measurement accuracy in the electronic component E can be suppressed.

<Other embodiments>
The technology disclosed in this specification is not limited to the embodiments described by the above description and drawings, and includes various aspects such as the following, for example.
(1) In the above embodiment, measurement of the hemispherical electrode E2 in the component measurement unit 20 is shown as an example. However, it is not limited to this, and electronic components such as DIP (Dual inline Package) in which a large number of electrodes protrude downward from the package portion, and QFP (Quad Flat Package) in which a large number of electrodes protrude from the package portion. It may be applied to the measurement of an electronic component that extends laterally of the package portion and then bends downward.

(2) In the above embodiment, the surface mounter 10 including the component measuring section 20 is shown as an example. However, the component measurement unit disclosed in this specification may be applied to an inspection device or the like without being limited to this.
(3) In the above embodiment, the shift position of the light projected onto the electrode E2 by the light source unit 24 is determined by the centroid detection method. However, the present invention is not limited to this, and a configuration may be adopted in which a curve approximation method is used to determine the shift position of the light.

(4) In the above embodiment, one light source unit 24 is arranged on each side of the imaging area P of the component recognition camera 22 . However, not limited to this, a plurality of light source units may be arranged on both sides of the imaging area of the component recognition camera.
(5) In the above embodiment, the light from the two light source units 24 is projected at the same angle with respect to the optical axis A1 of the component recognition camera 22 . However, the present invention is not limited to this, and a configuration may be adopted in which the light from the light source section is projected at different angles and the difference in angles is corrected.

10: Surface mounter 13: Component mounting device 20: Component measuring unit (an example of "measuring device")
22: Component recognition camera (an example of an “imaging unit”)
24: Light source unit 110: Control unit B: Printed circuit board (an example of a “board”)
E: Electronic parts (an example of "measurement target")
E2: Electrode (an example of "measurement target")
M3: 3D shape (an example of "data")
P: imaging region R: reflected light R1: first reflected light R2: second reflected light

Claims (5)

A measuring device for measuring the height dimension of an object to be measured based on the light section method,
an imaging unit that captures an image of the measurement target while relatively moving the measurement target;
a plurality of light source units, each of which has at least one imaging unit arranged at each of positions on both sides of an imaging region for imaging the measurement object, and projects linear light toward the measurement object;
a control unit;
The reflected light reflected from the measurement target includes first reflected light reflected from the measurement target toward the imaging unit and second reflected light different from the first reflected light,
The control unit calculates data corresponding to the first reflected light based on the amount of the reflected light received by each of the light sources captured by the imaging unit, and measures the height dimension of the measurement object. ,
The control unit captures an image by projecting light onto the same measurement location of the measurement object using the plurality of light source units, and based on the lowest amount of received light among the received amounts of the reflected light at the same measurement location A measuring device that calculates data according to the first reflected light . The control unit calculates height dimension data of the object to be measured based on the received amount of the reflected light, and calculates the lowest height dimension data among the calculated height dimension data at the same measurement point. 2. The measuring device according to claim 1 , wherein the height dimension is the measurement location. A measuring device for measuring the height dimension of an object to be measured based on the light section method,
an imaging unit that captures an image of the measurement target while relatively moving the measurement target;
a plurality of light source units, each of which has at least one imaging unit arranged at each of positions on both sides of an imaging region for imaging the measurement object, and projects linear light toward the measurement object;
a control unit;
The reflected light reflected from the measurement target includes first reflected light reflected from the measurement target toward the imaging unit and second reflected light different from the first reflected light,
The control unit calculates data corresponding to the first reflected light based on the amount of the reflected light received by each of the light sources captured by the imaging unit, and measures the height dimension of the measurement object. ,
The control unit captures an image by projecting light onto the same measurement location of the measurement target by the plurality of light source units, and based on the overlapping received light amount among the received light amounts of the respective reflected light at the same measurement location to calculate data corresponding to the first reflected light . The control unit calculates data of the height dimension of the object to be measured based on the received amount of the reflected light, and calculates the height dimension data obtained by ANDing the data of the height dimension respectively calculated at the same measurement point. 4. The measuring device according to claim 3 , wherein the data is the height dimension at the measurement point. A measuring device according to any one of claims 1 to 4 ;
and a component mounting device that holds the object to be measured and mounts it on a substrate.

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