JP5421763B2 - Inspection apparatus and inspection method - Google Patents

Description

  The present invention relates to an inspection apparatus and an inspection method, and more particularly to an inspection apparatus and an inspection method for measuring the shape of an inspection object with a laser beam.

  2. Description of the Related Art Conventionally, an inspection apparatus including a laser measurement apparatus that measures the shape of an inspection object with laser light is known (see, for example, Patent Document 1).

  In Patent Document 1, an illumination unit that emits illumination light from the side in a state where ball-shaped terminals (called bumps) of an IC chip such as a BGA (Ball Grid Array) are placed upward, A coplanarity inspection apparatus comprising a camera for imaging a bump from above, a laser measuring device for measuring the height of the apex portion of the bump, and a control unit for calculating the apex position of the bump based on an image captured by the camera It is disclosed. In this coplanarity inspection device, a ball-shaped terminal (bump) is irradiated with illumination light from the side, and the reflected light reflected upward is imaged by a camera, whereby the apex of the ball is detected for each BGA bump. An image having an encircled bright portion is captured. The control unit calculates the vertex coordinates of each bump based on the fact that the center of gravity (center) position of the annular bright portion becomes the vertex position of the bump, and measures the height of the vertex coordinate by the laser measuring device. Thus, the bump height for each bump of the BGA is measured.

  The technology disclosed in the coplanarity inspection apparatus disclosed in Patent Document 1 above is a mounting state of an electronic component (a solder shape and a bonding state after curing of a solder joint) in an inspection object such as a mounted substrate on which the electronic component is mounted on a substrate. It can be applied to inspection. However, in the coplanarity inspection apparatus disclosed in Patent Document 1, vertex coordinates are calculated from the captured image of the bump based on the fact that the BGA bump has a uniform ball shape, and the bump height is measured by the laser measurement apparatus. Therefore, when measuring the shape of a complicated solder joint, such as the shape of the solder after curing, it is difficult to measure by calculating the coordinates of the vertex from the captured image. is there. Therefore, it is difficult to apply the technique of Patent Document 1 to the inspection of the mounting state of the electronic component in the inspection object.

JP-A-9-196625

  When inspecting a solder joint having a complicated shape as described above with a laser measuring device, when measuring the entire solder joint with a laser measuring device, laser light is applied to all the coordinates included in the measurement region. Since it is necessary to perform measurement by scanning, there is a problem that measurement takes time. Furthermore, in this case, the portion having a complicated shape such as a hole portion or a steeply inclined portion of the solder joint portion may not appropriately receive the reflected light of the laser irradiated by the laser measuring device, so that the measurement accuracy is likely to deteriorate. There is also a problem.

  The present invention has been made in order to solve the above-described problems, and one object of the present invention is to shorten the inspection time of an inspection object having a complicated shape using a laser measuring device. To provide an inspection apparatus and an inspection method capable of performing highly accurate measurement in time.

Means for Solving the Problems and Effects of the Invention

In order to achieve the above object, an inspection apparatus according to a first aspect of the present invention receives an reflected light from an inspection object by irradiating a laser beam to a measurement position on the inspection object and an imaging unit that images the inspection object. A laser measuring device that measures the shape of the inspection object, and a region that is unsuitable for measurement by the laser measuring device included in the captured image based on the captured image of the inspection object by the imaging unit; A control unit that excludes a region unsuitable for measurement by the laser measurement device from a measurement target, and a region unsuitable for measurement by the laser measurement device is a region in which the shape of the inspection object is unsuitable for measurement by the laser measurement device At least .

In the inspection apparatus according to the first aspect, as described above, based on the captured image of the inspection object by the imaging unit, a region unsuitable for measurement by the laser measurement apparatus included in the captured image is determined, and the laser measurement apparatus By providing a control unit that excludes areas unsuitable for measurement from the measurement target by the laser measurement device, such as holes and steeply inclined parts of solder joints with complicated shapes The measurement by the laser measurement device can be performed after excluding the region unsuitable for the measurement by the laser measurement device. As a result, unlike the case where the entire area having a complicated shape, such as a solder joint, is measured by the laser measurement device as the measurement target region by the laser measurement device, the actual measurement is performed by excluding the region inappropriate for measurement by the laser measurement device. Since the area of the measurement area can be reduced, the number of height measurement points actually measured by scanning the laser beam is reduced, and the measurement can be performed in a short time. In addition, since an area unsuitable for measurement that cannot be measured by a laser measuring device, such as a hole or a steeply inclined portion of a solder joint, or in which measurement accuracy may be reduced, is excluded in advance, one of the remaining areas (measurement target areas) Measurement by a laser measuring device is performed on some or all. As a result, since measurement values and measurement errors with low accuracy are not mixed with the measurement results, high-precision measurement can be performed even when the mounting state of the electronic component is inspected using the laser measurement device. Further, by detecting a shape unsuitable for measurement by the laser measuring device, which may affect the measurement accuracy, from the captured image, it can be excluded as a region unsuitable for measurement by the laser measuring device.

  In the inspection apparatus according to the first aspect, preferably, the control unit performs measurement by the laser measurement device by designating at least a part of the region other than the region unsuitable for measurement by the excluded laser measurement device. Is configured to do. With this configuration, for example, it is possible to improve the measurement accuracy by measuring all the remaining areas after excluding the areas unsuitable for the measurement by the laser measurement apparatus, and also unsuitable for the measurement by the laser measurement apparatus. In addition, the area of the actual measurement area can be reduced by measuring only the minimum part necessary for shape measurement among the parts with complicated shapes such as solder joints, etc. The time can be further shortened.

  In this case, preferably, the control unit is configured to detect a shape unsuitable for measurement by the laser measuring device included in the captured image of the inspection object, using information regarding the shape unsuitable for measurement by the laser measuring device. Has been. If comprised in this way, if the example of the captured image which imaged the shape unsuitable for a measurement by a laser measuring device is used as information about a shape unsuitable for a measurement by a laser measuring device, for example, a picked-up image of an inspection object by an image pick-up part will be imaged. By comparing and collating with the image example, it is possible to easily detect a shape unsuitable for measurement by the laser measuring device included in the captured image of the inspection object.

The inspection apparatus according to the first aspect preferably further includes an illuminating unit that irradiates the inspection object with illumination light, and the control unit performs laser processing based on a difference in light intensity (brightness and darkness) in a captured image of the inspection object. A region unsuitable for measurement by the measuring device is determined. In areas such as holes and steeply inclined parts in the captured image, the light intensity is lower (darker) than the surroundings, and in areas (darker) located in the shadow of electronic components with a large height, When measuring with a laser measuring device, the laser beam is blocked by a large electronic component and may not be able to be measured. Therefore, it is not suitable for measurement with the laser measuring device based on the difference in light intensity in the captured image. If the region is determined, it is possible to easily determine a region unsuitable for measurement by the laser measuring device.

In this case, preferably, the illumination unit is configured to be able to irradiate illumination light from above the inspection object, and the imaging unit uses the illumination light from above the inspection object by the illumination unit to be above the inspection object. It is comprised so that it may image from. If configured to take an image using illumination light from above as described above, the intensity of light in a region unsuitable for measurement by a laser measurement device such as a hole or a steeply inclined portion is lowered (darkened), and It is possible to increase (brighten) the light intensity of the flat portion suitable for measurement by the laser measuring device. As a result, the difference in light intensity between the region suitable for measurement by the laser measuring device and the unsuitable region can be increased, so that the laser measuring device can be more easily based on the difference in light intensity in the captured image. It is possible to easily determine a region unsuitable for measurement by the method.

  In the inspection apparatus according to the first aspect, preferably, the inspection object is a mounted substrate on which an electronic component is mounted on the substrate, and the control unit is a solder joint portion of at least the electronic component on the substrate of the inspection object. Is configured to determine a region unsuitable for measurement by the laser measurement device based on a captured image of the inspection object by the imaging unit. With this configuration, when inspecting the mounting state of the electronic component (the solder shape and the bonding state after the solder joint is cured) on the mounted substrate (inspection object), it is caused by bubbles that affect the measurement accuracy. For solder joints of electronic parts that are prone to holes, steep slopes, and cracks, areas that are inappropriate for measurement by a laser measuring device can be judged and excluded, reducing measurement time while improving measurement accuracy. can do.

  In this case, preferably, the region unsuitable for measurement by the laser measuring device includes at least a region where the shape of the inspection object is unsuitable for measurement by the laser measuring device, and the shape unsuitable for measurement by the laser measuring device is: It includes at least one of a hole or a steep slope formed in the solder joint. If comprised in this way, the area | region which has at least 1 shape among the hole part or steeply inclined part which is unsuitable especially for the measurement by a laser measuring device can be excluded.

  In the case where the mounted substrate on which the electronic component is mounted on the substrate is an inspection object, preferably, the control unit is further configured based on information on the shape of the electronic component mounted on the substrate from the laser measuring device. An area in which the incident path of the laser beam to the inspection object or the reflection path of the reflected light from the inspection object may be blocked by the electronic component is determined as an area unsuitable for measurement by the laser measuring device. . According to this configuration, the shape of the electronic component mounted on the board is measured when measurement cannot be performed due to being blocked by a large electronic component when performing measurement by the laser measuring device. Based on the information, it is possible to easily determine a region unsuitable for measurement by the laser measuring device, such as a region in the vicinity of a large electronic component.

In the case where the mounted substrate on which the electronic component is mounted on the substrate is an inspection object, preferably, the control unit mounts the electronic component mounted on the substrate based on a captured image of the inspection object by the imaging unit. And a mounting position deviation from a preset design mounting position of the electronic component, and based on the mounting position deviation of the electronic component calculated in addition to the captured image of the inspection object, the result of the mounting position deviation, An area where the laser beam may be blocked by the electronic component is determined as an area unsuitable for measurement by the laser measuring device. With this configuration, the laser component is blocked by the electronic component when the measurement is performed by the laser measurement device due to a shift in the mounting position of the electronic component mounted on the substrate. An area that cannot be measured by the apparatus can also be excluded from the measurement area by the laser measuring apparatus.

  In the inspection apparatus according to the first aspect, preferably, the laser measurement apparatus includes a light emitting unit that emits laser light to the inspection object, and a light receiving unit that receives the reflected light reflected from the inspection object, and the control unit includes: Based on the direction from the light emitting unit to the light receiving unit of the laser measuring device, the incident path of the laser light from the light emitting unit to the inspection object or the reflection path of the reflected light from the inspection object to the light receiving unit may be blocked Is determined as a region unsuitable for measurement by the laser measuring device. If comprised in this way, the area | region unsuitable for the measurement by a laser measuring device can be determined in consideration of the direction which goes to the light-receiving part from the light emission part of a laser measuring device. That is, when the direction from the light emitting unit to the light receiving unit is a direction perpendicular to the extending direction of the step of the electronic component, the reflected light from the inspection object is easily blocked by the step, while the light emitting unit to the light receiving unit. When the direction toward is a direction parallel to the extending direction of the step, the reflected light from the inspection object is not blocked by the step. In this way, when an area unsuitable for measurement by the laser measuring device is generated depending on the direction from the light emitting unit to the light receiving unit, laser measurement is performed based on the direction from the light emitting unit to the light receiving unit in addition to the captured image of the inspection object. A region unsuitable for measurement by the apparatus can be excluded in advance.

  In the inspection apparatus according to the first aspect, preferably, the laser measurement apparatus includes a regular reflection type measurement apparatus that receives a regular reflection component of reflected light reflected from an inspection object, and a diffuse reflection that receives a diffuse reflection component. The control unit includes a type measuring device, and the control unit performs an inspection from the light emitting unit on the basis of the type of the laser measuring device whether the laser measuring device that performs the measurement is a regular reflection type measuring device or a diffuse reflection type measuring device. An area where the incident path of the laser beam on the reflection path of the reflected light from the inspection object to the light receiving unit may be blocked is determined as an area unsuitable for measurement by the laser measuring device. With this configuration, the laser light incident path and the reflection path are different between the specular reflection type measurement apparatus and the diffuse reflection type measurement apparatus (the angle between the incident light and the reflected light is different). In consideration of this type, it is possible to determine a region unsuitable for measurement by the laser measuring device. In general, the angle between the incident light and the reflected light is larger when the specular reflection component is received than when the diffuse reflection component is received, so there is a possibility that the surrounding obstacles block the laser light. High (large area unsuitable for measurement). As described above, when a difference occurs in a region unsuitable for measurement by the laser measuring device depending on the type of the laser measuring device, the measurement by the laser measuring device is performed based on the type of the laser measuring device in addition to the captured image of the inspection object. Unsuitable areas can be determined and excluded in advance.

The inspection method according to the second aspect of the present invention determines a region unsuitable for measurement by a laser beam included in a captured image based on a step of imaging the inspection object and a captured image of the captured inspection object, The step of excluding the region unsuitable for measurement with laser light from the object to be measured with laser light and irradiating the measurement position on the inspection object with laser light to receive the reflected light from the inspection object, thereby changing the shape of the inspection object. A region that is unsuitable for measurement with laser light includes at least a region in which the shape of the inspection object is unsuitable for measurement with laser light .

  In the inspection method according to the second aspect, as described above, based on the captured image of the captured inspection object, a region unsuitable for measurement by the laser light included in the captured image is determined, and measurement by the laser light is performed. By excluding unsuitable areas from the measurement target by laser light, it is inappropriate for measurement by laser light such as holes and steeply inclined parts of solder joints with complicated shapes based on the captured image of the inspected object. Measurement with a laser beam can be performed after excluding the region. As a result, unlike the case where the entire area having a complicated shape, such as a solder joint, is measured with the laser beam as the measurement target area, the area of the actual measurement area is reduced by the amount excluding the area unsuitable for the laser beam measurement. Since it can be made small, measurement can be performed in a short time. In addition, areas that are unsuitable for measurement that may not be measured with laser light such as holes or steeply inclined portions of solder joints or that may cause a decrease in measurement accuracy are excluded in advance, so the remaining areas (measurement target areas) Measurement with a laser beam is performed on part or all of the above. As a result, since measurement values and measurement errors with low accuracy are not mixed with the measurement results, high-precision measurement can be performed even when the mounting state of the electronic component is inspected using laser light.

It is a schematic diagram which shows the external appearance inspection apparatus by one Embodiment of this invention. It is a perspective view which shows the mounted board | substrate of the test object by the external appearance inspection apparatus by one Embodiment shown in FIG. It is a figure for demonstrating the state of the solder joint part of the mounted substrate shown in FIG. It is a block diagram for demonstrating the control structure of the external appearance inspection apparatus by one Embodiment shown in FIG. It is a figure for demonstrating the imaging part and illumination part of the external appearance inspection apparatus by one Embodiment shown in FIG. It is a figure for demonstrating the 1st laser measurement part of the external appearance inspection apparatus by one Embodiment shown in FIG. It is a figure for demonstrating the 2nd laser measurement part of the external appearance inspection apparatus by one Embodiment shown in FIG. It is a figure for demonstrating the area | region unsuitable for the laser measurement of the external appearance inspection apparatus by one Embodiment shown in FIG. It is a figure for demonstrating the shape unsuitable for the laser measurement of the external appearance inspection apparatus by one Embodiment shown in FIG. It is a figure for demonstrating the shape unsuitable for the laser measurement of the external appearance inspection apparatus by one Embodiment shown in FIG. It is a figure for demonstrating the difference of the area | region unsuitable for the laser measurement by the direction of the 2nd laser measurement part of the external appearance inspection apparatus by one Embodiment shown in FIG. It is a figure for demonstrating the difference of the area | region unsuitable for the laser measurement by the direction of the 2nd laser measurement part of the external appearance inspection apparatus by one Embodiment shown in FIG. It is a flowchart for demonstrating the test | inspection operation | movement of the mounted board | substrate of the external appearance inspection apparatus by one Embodiment shown in FIG. It is a flowchart for demonstrating the calculation process of the laser measurement exclusion area | region shown in FIG. It is a figure for demonstrating the calculation process of the laser measurement exclusion area | region of the external appearance inspection apparatus by one Embodiment of this invention. It is a figure for demonstrating the calculation process of the laser measurement exclusion area | region of the external appearance inspection apparatus by one Embodiment of this invention. It is a figure for demonstrating the laser measurement object area | region of the external appearance inspection apparatus by one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, with reference to FIGS. 1-12, the structure of the external appearance inspection apparatus 100 by one Embodiment of this invention is demonstrated. In the present embodiment, a case where the present invention is applied to an appearance inspection apparatus 100 which is an example of an “inspection apparatus” will be described.

  As shown in FIGS. 1 and 2, the appearance inspection apparatus 100 according to the present embodiment inspects the mounting state of the component 120 with respect to the inspection object (mounted substrate 110) on which the component 120 is mounted on the printed circuit board 130. It is a device for. On the mounted substrate 110, a large number of electronic components (components 120) such as integrated circuits are arranged at predetermined positions on a printed circuit board 130 on which a wiring pattern (not shown) is formed. These components 120 are mounted (mounted) so that the terminal portions 121 of the components 120 are arranged on the paste-like solder 140 (see FIG. 3) applied (printed) on the printed circuit board 130 in a predetermined pattern. The Thereafter, the terminal portion 121 of the component 120 is solder-bonded to the wiring of the printed circuit board 130 through the melting and hardening (cooling) process of the solder 140 (see FIG. 3), whereby the component 120 It is configured to be fixed on the printed circuit board 130 while being electrically connected to the wiring. In the appearance inspection apparatus 100, as the mounting state of the component 120, whether or not the mounting position and orientation of the component 120 are appropriate, whether the amount of displacement with respect to the design position of the component 120 is within an allowable range, or whether the solder joint portion of the terminal portion 121 is It is configured to inspect whether or not it is normal. The mounted substrate 110 is an example of the “inspection object” in the present invention. The component 120 and the printed circuit board 130 are examples of the “electronic component” and the “board” of the present invention, respectively.

  As shown in FIG. 3, in the mounted substrate 110, the solder joint portion of the terminal portion 121 is roughly classified according to various factors such as the mounting position accuracy of the component 120 and the printing (application) accuracy of the solder 140. Presents an H state. Specifically, the state A is an example of a state (non-defective product) having an appropriate solder shape although the amount of solder is slightly small. State B is an example of an ideal state (non-defective product) where both the solder amount and the solder shape are appropriate. State C is an example where the amount of solder is small and becomes a boundary between good and bad. The state D is an example of an unsoldered state (defect) in which the terminal portion 121 is not soldered. The state E is an example of a state (defect) in which solder is applied but is not soldered due to a shift in the solder position (or the position of the component 120). The state F and the state G are examples of a state where the terminal portion 121 (lead) is floating with respect to the printed board 130 (defect). Further, the state H is an example of a state where the amount of solder is excessive, and is an example of a boundary between good and bad. In the above-described examples of the state C and the state H, whether the solder is insufficient (excessive), the use of the mounted substrate 110, and the like are determined. The appearance inspection apparatus 100 is configured to determine the quality of the solder joint by determining the above states A to H for the solder joint.

  As shown in FIG. 1, the appearance inspection apparatus 100 includes a substrate transport conveyor 10 for transporting a mounted substrate 110, an XY robot 20 that can move in the XY direction (horizontal direction) above the substrate transport conveyor 10, An inspection unit 30 held by the XY robot 20 and a control device 40 (see FIG. 4) are provided. Hereinafter, a specific structure of the appearance inspection apparatus 100 will be described.

  The substrate transport conveyor 10 is configured to transport the mounted substrate 110 in the X direction and to stop and hold the mounted substrate 110 at a predetermined inspection position. The substrate transport conveyor 10 is configured so that the mounted substrate 110 that has been inspected can be transported in the X direction from a predetermined inspection position, and the mounted substrate 110 can be unloaded from the appearance inspection apparatus 100. Yes.

  The XY robot 20 is provided above the substrate transfer conveyor 10 (in the direction of the arrow Z1), and is composed of, for example, an orthogonal two-axis robot using a ball screw shaft and a servo motor. That is, the XY robot 20 has a configuration in which both ends in the X direction of the inspection unit support portion 21 extending in the X direction are supported so as to be movable in the Y direction by a pair of rail portions (not shown) extending in the Y direction. Specifically, a ball nut that is screwed onto the ball screw shaft (Y axis) by driving a ball screw shaft (Y axis) (not shown) provided on the rail portion by a Y axis motor 22 (see FIG. 4). The inspection unit support portion 21 having (not shown) is configured to move in the Y direction. Further, the inspection unit support portion 21 is provided with a ball screw shaft (X axis) (not shown) and an X axis motor 23 (see FIG. 4). Then, by driving the ball screw shaft (X axis) (not shown) by the X axis motor 23, the inspection unit 30 having a ball nut (not shown) screwed to the ball screw shaft (X axis) is moved in the X direction. It is configured to be movable. With such a configuration, the XY robot 20 moves the inspection unit 30 held by the inspection unit support unit 21 in the XY direction (horizontal direction) above the substrate transfer conveyor 10 (mounted substrate 110) (in the direction of arrow Z1). It is configured to be movable.

  The inspection unit 30 includes an imaging unit 31, an illumination unit 32, a first laser measurement unit 33, and a second laser measurement unit 34 (see FIG. 4). The inspection unit 30 is moved to a predetermined position above the mounted substrate 110 by the XY robot 20, and the inspection unit 30 is used by using the imaging unit 31, the first laser measurement unit 33, the second laser measurement unit 34, and the like. Are configured to perform imaging and measurement for inspection of the mounting state of the component 120 on the mounted substrate 110. The first laser measurement unit 33 is an example of the “laser measurement device” and “regular reflection measurement device” of the present invention. The second laser measurement unit 34 is an example of the “laser measurement device” and “diffuse reflection measurement device” of the present invention.

  The imaging unit 31 includes a CCD camera provided with a lens 31a. The imaging unit 31 is provided above (on the direction of the arrow Z1) with respect to the mounted substrate 110 (substrate transport conveyor 10), and below (the arrow Z2) so that the imaging direction is substantially perpendicular to the mounted substrate 110. Direction). Thus, the imaging unit 31 uses the illumination light emitted from the illumination unit 32 to the mounted substrate 110 so as to capture a two-dimensional (planar) image of the upper surface of the mounted substrate 110 from a position immediately above. It is configured. In the photographing by the imaging unit 31, RGB images corresponding to red R, green G, and blue B are obtained under illumination light by a white LED described later, and an infrared image is obtained under infrared illumination light.

  Moreover, as shown in FIG. 5, the illumination part 32 has a dome shape with an opening 321 formed at the top, and has a plurality of illuminations provided on the inner surface side of the dome. The imaging unit 31 is disposed above the opening 321 (in the direction of the arrow Z1), and the imaging unit 31 is configured to capture the mounted substrate 110 through the opening 321. On the inner surface side of the illumination unit 32, a plurality of upper illuminations 322, middle illuminations 323, and lower illuminations 324 are provided in order from the apex side (arrow Z1 direction side) where the openings 321 are provided. Specifically, a plurality of upper stage illuminations 322 are provided at the uppermost position (in the direction of arrow Z1) in the illumination unit 32 so as to surround the outer periphery of the opening 321. A plurality of middle-stage illuminations 323 are provided so as to surround the upper-stage illumination 322 at a position below the upper-stage illumination 322 (in the arrow Z2 direction) and above the lower-stage illumination 324 (in the arrow Z1 direction). A plurality of lower stage illuminations 324 are provided so as to surround the middle stage illumination 323 at a position below the middle stage illumination 323 (in the direction of arrow Z2).

  In addition, since the illumination part 32 has a dome shape, as shown in FIG. 5, the position of illumination is separated from the imaging part 31 (opening part 321) as it goes below from the upper stage illumination 322 (arrow Z2 direction). For this reason, the upper stage illumination 322 is configured to irradiate illumination light from a position substantially directly above (in the arrow Z1 direction) with respect to the imaging target (a predetermined region on the mounted substrate 110). Therefore, the irradiation direction of the upper stage illumination 322 and the imaging direction of the imaging unit 31 are configured to be substantially the same direction. Moreover, the middle stage illumination 323 is configured to irradiate the imaging target with illumination light from an oblique direction (about 45 degrees). And the lower stage illumination 324 is comprised so that illumination light may be irradiated with respect to an imaging target at an irradiation angle of about 30 degrees. Thereby, the imaging part 31 is comprised so that it can image using the illumination light irradiated from different height (angle) with respect to the same imaging target. Although omitted in FIG. 5, a plurality of infrared illuminations 325 (see FIG. 4) using infrared LEDs are provided at substantially the same height as the upper stage illumination 322. These upper stage illumination 322 and infrared illumination 325, middle stage illumination 323, and lower stage illumination 324 are each comprised of white LEDs or the like.

  As shown in FIG. 6, the first laser measurement unit 33 includes a light emitting unit 33a having a light emitting element such as a semiconductor laser, and a light receiving unit 33b having an optical position detecting element. The first laser measurement unit 33 irradiates the measurement position on the mounted substrate 110 with laser light from the light emitting unit 33a, and receives the regular reflection component of the reflected light reflected at the measurement position by the light receiving unit 33b. Is configured to do. At this time, the reflected light received by the light receiving unit 33b forms a spot (focal point) on the optical position detection element, and the spot position is detected. Based on the principle of triangulation from the detected spot position, the distance d1 from the first laser measurement unit 33 to the measurement position can be calculated. Accordingly, the height H1 at the measurement position of the mounted substrate 110 can be measured based on the known positional relationship between the first laser measurement unit 33 and the mounted substrate 110. In the first laser measurement unit 33, an angle formed between the incident path of the laser emitted from the light emitting unit 33a and the reflection path of the reflected light received by the light receiving unit 33b is an angle α.

  As shown in FIG. 7, the second laser measuring unit 34 includes a light emitting unit 34a having a light emitting element such as a semiconductor laser, and a light receiving unit 34b having an optical position detecting element. The second laser measurement unit 34 irradiates the laser beam substantially perpendicularly (in the direction of the arrow Z2) from the light emitting unit 34a to the measurement position on the mounted substrate 110, and diffuses the reflected light reflected at the measurement position. The reflection component is configured to be received by the light receiving unit 34b. Therefore, in the second laser measurement unit 34, an angle formed by the incident path of the laser irradiated from the light emitting unit 34a and the reflection path of the reflected light received by the light receiving unit 34b is an angle β. The height measurement method by the second laser measurement unit 34 is the same as that of the first laser measurement unit 33. These laser measurement units take into account the surface condition of the measurement portion on the mounted substrate 110 (whether it is less glossy, mirror surface or close to a mirror surface), the required measurement range, measurement accuracy, etc. It is selected appropriately.

  As shown in FIG. 4, the appearance inspection apparatus 100 is provided with an X-ray imaging device 35 and an X-ray illumination 35 a in addition to the inspection unit 30 described above. The X-ray imaging device 35 and the X-ray illumination 35a are arranged so as to sandwich the mounted substrate 110 in the vertical direction (Z direction) and are provided so as to face each other. An X-ray image of the mounted substrate 110 is captured by detecting the X-rays emitted from the X-ray illumination 35 a and transmitted through the mounted substrate 110 by the X-ray imaging device 35. With this X-ray image, for example, the state of solder on the lower surface side of the terminal portion 121 of the component 120 can be acquired.

  As shown in FIG. 4, the appearance inspection apparatus 100 is configured to be controlled by the control device 40. The control device 40 includes an arithmetic processing unit 41, a storage unit 42, a motor control unit 43, an external input / output unit 44, an image processing unit 45, a measurement processing unit 46, and an illumination control unit 47. . The control device 40 is connected to a display unit 50 and an input device (not shown) such as a touch panel and a keyboard, and is configured to accept an operation input from a user. The arithmetic processing unit 41 is an example of the “control unit” in the present invention.

  The arithmetic processing unit 41 includes a CPU that executes logical operations, a ROM (Read Only Memory) that stores programs for controlling the CPU, a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus, and the like. It is composed of The arithmetic processing unit 41 is configured to control each unit of the appearance inspection apparatus 100 via the motor control unit 43, the image processing unit 45, the measurement processing unit 46, and the illumination control unit 47 in accordance with a program stored in the ROM. Has been. The arithmetic processing unit 41 uses the imaging unit 31, the first laser measurement unit 33, the second laser measurement unit 34, and the like to inspect the mounting state of the component 120 and to solder the joint portion of the terminal portion 121 of the component 120. 3 is configured to determine each state shown in states A to H in FIG.

  In the present embodiment, the arithmetic processing unit 41 performs measurement by the first laser measurement unit 33 or the second laser measurement unit 34 included in the captured image based on the captured image of the mounted substrate 110 by the imaging unit 31. An unsuitable area (laser measurement exclusion area) is determined. The arithmetic processing unit 41 is configured to exclude the laser measurement exclusion region from the measurement target (region) by the first laser measurement unit 33 or the second laser measurement unit 34. The “laser measurement exclusion region” is an example of the “region unsuitable for measurement by the laser measurement device” of the present invention.

  Here, an area (laser measurement exclusion area) unsuitable for measurement by the first laser measurement unit 33 or the second laser measurement unit 34 will be described. Here, the measurement by the second laser measurement unit 34 will be described as an example. As shown in FIG. 7, laser measurement is performed by reflecting the laser light emitted from the light emitting unit 34a at the measurement position and receiving the reflected light (diffuse reflected light) by the light receiving unit 34b. For this reason, when a shielding object exists on the incident path or reflection path of the laser beam, measurement becomes impossible or the measurement accuracy decreases. Specifically, as shown in FIG. 8, when the laser beam is blocked by a shield F1 such as a mounted component, or as shown in FIG. A case where the laser beam is blocked by the concave portion F2 is applicable. When measuring these shielding object F1 and hole part (concave part) F2, laser light reflected at a predetermined angle (angle β) is interrupted in the middle, or reflected by shielding object F1 and hole part F2. Unnecessary irregularly reflected light or the like may cause inability to measure or decrease measurement accuracy. The hole (recessed portion) F2 is an example of the “shape unsuitable for measurement by a laser measuring device” in the present invention.

  However, in the case of the shielding object F1, even when the distance d3 from the measurement position to the shielding object F1 is equal, as shown in FIGS. 11 and 12, the direction of the second laser measurement unit 34 (receives light from the light emitting unit 34a). Depending on the direction toward the unit 34b, there are cases where measurement is possible and measurement is impossible (or measurement accuracy is reduced). That is, as shown in FIG. 12, in the region near the shield F1, the measurement is performed without blocking the laser beam on the sides E1 and E2 extending in the direction along the direction A from the light emitting unit 34a to the light receiving unit 34b. It is possible. On the other hand, as shown in FIG. 11, on the side E3 extending in the direction orthogonal to the direction A from the light emitting unit 34a to the light receiving unit 34b, measurement is impossible due to the laser beam being blocked by the shielding object F1, or measurement is performed. Accuracy is reduced. At this time, the range of the region in which measurement is impossible in the vicinity of the side E3 (measurement accuracy is reduced) is the height of the shielding object F1 (the component 120 or the like) and the angle formed between the incident path of the laser beam and the reflection path ( Depending on angle β or angle α). In the case of the diffuse reflection type second laser measurement unit 34, since there is no shielding on the incident path and the reflection path on the side E4 side, measurement is possible, but the regular reflection type first laser measurement is performed. In the case of the portion 33, there are areas that cannot be measured on both the side E3 side and the side E4 side.

  In addition, as shown in FIG. 10, in the case of a steeply inclined portion F3 formed at the solder joint (solder 140) or the like, the measurement position becomes unclear and the measurement accuracy decreases. Further, when the inclination angle of the steeply inclined portion F3 is substantially parallel to the incident path, measurement is impossible. Even in the steeply inclined portion F3, when the direction of the second laser measurement unit 34 is orthogonal to the inclination direction of the slope (when the direction of the second laser measurement unit 34 is in the depth direction of FIG. 10), the laser Measurement may be possible. In the present embodiment, the arithmetic processing unit 41 takes into account the orientation of the laser measurement units (the first laser measurement unit 33 and the second laser measurement unit 34) and the like on the mounted substrate 110 in the vicinity of the shielding object F1. , A region where the hole (concave portion) F2 is present, a region where the steeply inclined portion F3 is present, and the like are discriminated and excluded from the laser measurement target (region) as a laser measurement exclusion region. The steeply inclined portion F3 is an example of the “shape unsuitable for measurement by a laser measuring device” in the present invention.

  The storage unit 42 includes a non-volatile storage device that can store various data and can be read by the arithmetic processing unit 41. The storage unit 42 includes captured image data captured by the imaging unit 31, substrate data that defines design position information (such as position and orientation) of the component 120 mounted on the mounted substrate 110, and the mounted substrate 110. A part shape database that defines the shape of the part 120 to be mounted on the surface, a hole (concave) shape imaging example for calculating a laser measurement exclusion region, a steeply inclined part shape imaging example, and the like are stored. The arithmetic processing unit 41 collates the captured image data captured by the imaging unit 31 with the hole (concave) shape imaging example and the steeply inclined portion shape imaging example, whereby a laser measurement exclusion region ( A hole (concave portion) F2 and a steeply inclined portion F3) are discriminated. Further, the arithmetic processing unit 41 recognizes the component 120 mounted on the mounted substrate 110 by performing image recognition from the captured image data using the substrate data and the component shape database, and the shape of the component 120, Get height, position and orientation. Then, the arithmetic processing unit 41 acquires the acquired data such as the shape, height, mounting position, and orientation of the component 120, and the known orientations, incident paths, and reflection paths of the first laser measuring unit 33 and the second laser measuring unit 34. Based on the above, the laser measurement exclusion region in the vicinity of the shielding object F1 is calculated. The “hole (concave portion) shape imaging example” and the “steeply inclined portion shape imaging example” are examples of “information relating to a shape unsuitable for measurement by the laser measurement device” of the present invention, respectively. The “component shape database” is an example of “information on the shape of an electronic component mounted on a substrate” in the present invention.

  Based on the control signal output from the arithmetic processing unit 41, the motor control unit 43 converts each servo motor of the appearance inspection apparatus 100 (the Y-axis motor 22 for moving the XY robot 20 in the Y direction, the XY robot 20 to X The motor control unit 43 is configured to control driving of an X-axis motor 23 for moving in the direction, a motor (not shown) for driving the substrate transporting conveyor 10, and the like. The inspection unit 30 (the imaging position of the imaging unit 31, the measurement positions of the first laser measurement unit 33 and the second laser measurement unit 34), the mounted substrate 110, and the like based on the signal from the encoder (not shown) Is configured to obtain the position of.

  The external input / output unit 44 includes an interface for constructing a network such as a wired or wireless LAN. The external input / output unit 44 is connected to a network with other devices (not shown) on the production line of the mounted substrate 110 and a host computer (not shown) that controls the entire production line, and performs information communication. Have

  Based on the control signal output from the arithmetic processing unit 41, the image processing unit 45 reads out the imaging signal from the imaging unit 31 and the X-ray imaging device 35 at a predetermined timing, and outputs a predetermined image to the read imaging signal. By performing the processing, image data suitable for recognizing (image recognition) the component 120 and the solder joint (solder 140) of the mounted substrate 110 is generated.

  The measurement processing unit 46 measures the distance d1 from the first laser measurement unit 33 to the measurement position from the spot position detected by the first laser measurement unit 33 or the second laser measurement unit 34 or the measurement position from the second laser measurement unit 34. The distance d2 is calculated, and the height H1 at the measurement position on the mounted substrate 110 is obtained.

  Based on the control signal output from the arithmetic processing unit 41, the illumination control unit 47 applies each of the upper illumination 322, the infrared illumination 325, the middle illumination 323, the lower illumination 324, and the X-ray illumination 35a to the illumination unit 32. It is configured to light up at the timing of.

  Next, with reference to FIG. 2, FIG. 3, FIG. 5 and FIG. 13 to FIG. 17, the inspection operation of the mounted substrate 110 by the appearance inspection apparatus 100 of one embodiment of the present invention will be described. In the inspection operation described below, the calculation processing unit 41 of the control device 40 controls each part of the appearance inspection device 100. In the following, laser measurement (height measurement) and laser measurement exclusion area calculation processing by the first laser measurement unit 33 or the second laser measurement unit 34 will be mainly described.

  First, as shown in FIG. 13, in step S <b> 1, the mounted substrate 110 is transported to a predetermined inspection position by the substrate transport conveyor 10 and fixed. Next, in step S2, the XY robot 20 is driven by the arithmetic processing unit 41, and the imaging unit 31 is moved above a predetermined fiducial mark (reference mark) position on the mounted substrate 110. Then, a fiducial mark (not shown) formed at a predetermined position is imaged by the imaging unit 31. In step S <b> 3, the captured image data of the fiducial mark (reference mark) is image-recognized by the arithmetic processing unit 41, thereby correcting the position of the mounted substrate 110. Thereby, the position coordinate of the appearance inspection apparatus 100 and the position on the mounted substrate 110 (substrate data) are associated with each other, and the preparation for performing the inspection process is completed. Hereinafter, in steps S4 to S9, the mounting state inspection process using the captured image of the mounted substrate 110 by the imaging unit 31 is performed.

  In step S <b> 4, the arithmetic processing unit 41 determines whether or not there is an area on the mounted substrate 110 that has not been imaged by the imaging unit 31 (an unimaged area). That is, since the imaging range (field of view) of the imaging unit 31 is limited to a certain range, imaging of the mounted substrate 110 is performed for each predetermined region and divided into a plurality of times. Therefore, it is determined in step S4 whether or not an unimaged area exists. If an unimaged area exists, the process proceeds to step S5. On the other hand, when the entire region on the mounted substrate 110 has been imaged (when there is no unimaged region), the process proceeds to step S10.

  If there is an unimaged area, in step S5, the arithmetic processing unit 41 drives the XY robot 20 based on the substrate data stored in the storage unit 42, and the imaging unit 31 images the next imaging area. Is moved to a predetermined imaging position.

  In step S6, a predetermined area (inspection area) on the mounted substrate 110 is imaged by the imaging unit 31. Imaging by the imaging unit 31 is performed a total of four times for the same imaging region using each of the upper illumination 322, the infrared illumination 325, the middle illumination 323, and the lower illumination 324 of the illumination unit 32. The captured image is processed by the image processing unit 45 so as to be image data suitable for recognition (image recognition), and is output to the arithmetic processing unit 41.

  Next, in step S7, when the arithmetic processing unit 41 performs image recognition of the image data, a part (inspection part) to be inspected, such as the component 120 or the solder joint part, which is captured in the captured image data (imaging region). Is recognized. For each inspection site, based on the board data stored in the storage unit 42, the mounting position deviation of the component 120 (position deviation from the design position of the mounting position) and direction, and the presence or absence of bending or rising of the terminal part 121 Are detected. Further, the position and shape of the solder joint are detected. When the image recognition is completed, the captured image data is stored in the storage unit 42.

  In step S8, inspection determination (determination of pass / fail) is performed on the inspection site in the imaging region based on the detected positional deviation and orientation of the component 120, the position and shape of the solder joint, and the like. With respect to the solder joint portion, the defective state shown in the state D, state E, state F, and state G in FIG. 3 (defective state such as unsolder, solder misalignment, lead floating) is determined by image recognition. On the other hand, it is difficult to discriminate each state shown in state A, state B, state C, and state H in FIG. 3 from captured image data captured from substantially vertically above (in the arrow Z1 direction) with respect to the mounted substrate 110. It is. For this reason, about the test | inspection site | part (solder joint part) corresponded to each state shown in the state A, the state B, the state C, and the state H, it determines with a non-defective product and becomes the object of the laser measurement after step S10 mentioned later. Therefore, by this image inspection determination, primary determination as to whether the inspection site is good or not is made, position information (position, orientation, misalignment amount, etc.) of the component 120 determined to be non-defective, position information of the solder joint, etc. Are generated as image processing results for subsequent laser measurements.

  Thereafter, in step S9, the arithmetic processing unit 41 determines whether or not there is an unexamined part for the examination part in the imaging region (captured image data). If there is an inspection part that has not been inspected in the imaging region (captured image data), the process returns to step S7, and image recognition and inspection determination are performed for the inspection part. When the inspection has been completed for all the inspection regions in the imaging region (captured image data) (when there is no unexamined region), the process proceeds to step S4 to determine whether or not there is an unimaged region again. Is done. By repeating steps S4 to S9 in this way, imaging is performed for each imaging region on the mounted substrate 110, and inspection based on the captured image data is performed for each inspection region in the imaging region. As a result, when it is determined in step S4 that there is no unimaged area (procedure proceeds to step S10), the entire mounted substrate 110 and the solder joint of the component 120 and the component 120 to be laser-measured are measured. Is specified as the image processing result (see step S8). In subsequent steps S <b> 10 to S <b> 15, laser measurement is performed on each inspection site determined to be a non-defective product by image inspection.

  Therefore, in step S10, the arithmetic processing unit 41 determines whether or not the component 120 (solder joint) to be measured is present. When the laser measurement target component 120 (solder joint) exists, the process proceeds to step S11.

  In step S <b> 11, focusing on one component 120 among the components 120 to be laser-measured, it is determined whether or not there is an examination site (unlased measurement site) where laser measurement is not performed. That is, as shown in FIG. 2, when there are a large number of terminal portions 121 in the component 120, laser measurement is performed on the solder joint portions (inspection sites) of the respective terminal portions 121. If there is an unlased measurement part, the process proceeds to step S12, and attention is paid to one more laser measurement part from among the laser measurement parts (non-laser measurement part) to calculate a laser measurement exclusion region in the laser measurement part. Is done. Here, with reference to FIG. 14, the calculation process (subroutine) of the laser measurement exclusion region will be described in detail.

  As shown in FIG. 14, first, in step S <b> 21, the position information of the laser measurement site is acquired by the arithmetic processing unit 41. Specifically, information on the image processing result generated by the image inspection determination (see step S8) for the target inspection region (laser measurement region), and motor position information (imaging unit 31) acquired from an encoder (not shown). Accurate position information for laser measurement is calculated based on the captured image data obtained by imaging the laser measurement region (inspection region) of interest. At this time, for example, as shown in FIG. 15, even if the position of the component 120 in the board data (the design position of the component 120, see the broken line) is a position where laser measurement is possible, the mounting position shift occurs in the component 120. In some cases, measurement may not be possible. Therefore, the laser measurement exclusion region is calculated based on accurate position information including the calculated mounting position shift of the component 120 (or solder application position shift).

  Next, in step S <b> 22, the arithmetic processing unit 41 determines light and dark (difference in light intensity value) for the laser measurement region (inspection region) of interest. In this case, the RGB image data captured using the upper stage illumination 322 is used for light / dark determination. As shown in FIG. 5, when the upper stage illumination 322 is used, the illumination light is emitted from substantially the same direction as the imaging direction of the imaging unit 31 arranged immediately above the imaging target, so that the reflected light is reflected in a flat region. Light is most likely to reach the imaging unit 31, and the illumination light irradiated to a non-flat region such as a hole or a steeply inclined portion is likely to be reflected sideways. For this reason, by using the image data imaged using the illumination light from above by the upper stage illumination 322, the intensity of light in a region such as a hole or a steeply inclined portion is reduced (darkened), and the light of the flat portion The strength of is higher (brighter). In step S22, based on the difference in light intensity (contrast) at the laser measurement site in such a captured image, an area where the difference in light intensity is greater than or equal to a certain value is detected, and is an area unsuitable for laser measurement. A possible region (region with low light intensity) and a region suitable for laser measurement (region with high light intensity) are determined. In the present embodiment, the image data captured using the upper illumination 322 is combined with the image data using the respective image data captured using the middle illumination 323 and the lower illumination 324, and a difference is obtained. By performing this image processing, the brightness (difference in light intensity) of each region becomes clearer.

  Here, as shown in FIG. 16, a case where attention is paid to the solder joint portion J1 among the laser measurement parts included in the captured image data will be described. By determining the brightness (difference in light intensity value) of the solder joint portion J1 in step S22, bright regions R1 and R2 having high intensity values and dark regions D1 to D4 having low intensity values are selected from the solder joint portion J1. And are acquired. In FIGS. 15 to 17, the bright area is indicated by white (solid color) and the dark area is indicated by hatching (hatching), but an actual captured image has, for example, an intensity distribution of 256 gradations. For this reason, in the actual captured image, there are intensity distributions in the bright region and the dark region, respectively, and in the subsequent determinations in steps S23 to S28, the determination is made based on the intensity distribution in the region. .

  Next, in step S23, paying attention to one of the determined areas (bright areas R1 and R2 and dark areas D1 to D4), it is determined whether the area is darker than the surrounding area (dark area) or not. Determined. When the focused area (for example, the bright area R1) is not an area darker than the surrounding area (dark area) (bright area), the process proceeds to step S24 and is determined to be a laser measurable area. On the other hand, when the focused area (for example, the dark area D1) is an area darker than the surrounding area (dark area), the process proceeds to step S25.

  In step S25, the arithmetic processing unit 41 determines whether or not the focused area (dark area D1) is a hole (concave). Specifically, the arithmetic processing unit 41 compares the image data of the region of interest (dark region D1) with the hole (concave) shape imaging example (imaging data) stored in the storage unit 42 to compare and collate the hole. It is determined whether or not the focused region (dark region D1) is a hole (concave) by determining whether or not it matches or approximates the (concave) shape imaging example. For example, in a hole formed by bubbles or the like in a solder joint, typically, an image is captured as a substantially circular dark region. Therefore, such a dark region is determined as a hole. When it is determined that the focused region (dark region D1) is a hole (concave portion), the process proceeds to step S28, and is determined to be a laser measurement exclusion region. On the other hand, if it is determined that the focused region (dark region D1) is not a hole (concave portion), the process proceeds to step S26.

  In step S26, the arithmetic processing unit 41 determines whether or not the focused region (dark region D1) is a steeply inclined portion. Specifically, the arithmetic processing unit 41 compares and compares the image data of the region of interest (dark region D1) with the steep slope shape imaging example (imaging data) stored in the storage unit 42, thereby steep slope shape. By determining whether or not the image capturing example matches or approximates, it is determined whether or not the focused region (dark region D1) is a steeply inclined portion. For example, in a steeply inclined portion formed in a solder joint, a dark region in which the intensity value gradually increases from a portion having a low strength value (steeply inclined portion) toward a predetermined direction (downward direction of the slope). Since the image is taken, such a dark region is determined as a steeply inclined portion. Further, it is possible to determine whether or not laser measurement is possible based on the inclination direction of such a steeply inclined portion and the directions of the first laser measurement unit 33 and the second laser measurement unit 34. When it is determined that the focused region (dark region D1) is a steeply inclined portion, the process proceeds to step S28 and is determined to be a laser measurement exclusion region. On the other hand, when it is determined that the focused region (dark region D1) is not a steeply inclined portion (or when it is determined that the measurable steeply inclined portion), the process proceeds to step S27.

  In step S <b> 27, the arithmetic processing unit 41 determines whether there is a shielding object in the vicinity of the focused area (dark area D <b> 1). At this time, the arithmetic processing unit 41 refers to the positional deviation of the component 120, the image processing result, the component shape database, and the board data acquired in step S21. Based on these data, the orientation of the first laser measurement unit 33 or the second laser measurement unit 34, and the angle (α or β) between the incident path and the reflection path, the laser measurement exclusion region near the shield is determined. Determined. For example, as shown in FIG. 16, it can be seen that the bright region R2 of the solder joint portion J1 is a part of the component 120. Therefore, in the region near the bright region R2, measurement may not be possible depending on the height of the component 120 and the type and orientation of the laser measurement unit used. In such a case, it is determined that there is a shielding object in the vicinity, and the process proceeds to step S28, where it is determined as a laser measurement exclusion region. On the other hand, when there is no shielding object in the vicinity, although it is a dark region, it is determined in steps S25 to S27 that it is not a hole (concave part), a steeply inclined part, and that there is no obstacle in the vicinity. Thereby, it transfers to step S24 and it determines with a laser measurable area | region.

  As described above, if the focused region (for example, the dark region D1) is determined to be a laser measurable region in step S24 or is determined to be a laser measurement exclusion region in step S28, the process proceeds to step S29. move on. In step S29, the arithmetic processing unit 41 determines whether or not the determination has been made for all the regions (the bright regions R1 and R2 and the dark regions D1 to D4) in the laser measurement site (solder joint portion J1) of interest. The If there is an undetermined area, the process proceeds to step S23, and the process from step S23 to S28 is performed focusing on the next area (for example, dark area D2) (whether it is a laser measurable area or laser measurement). It is determined whether it is an excluded area). On the other hand, when the determination is made for all of the bright regions R1 and R2 of the solder joint portion J1 and the dark regions D1 to D4, the laser for the laser measurement site (solder joint portion J1) of interest. The calculation process of the measurement exclusion region ends, and the process returns to step S13 and subsequent steps in FIG.

  As shown in FIG. 13, in step S13, the XY robot 20 is driven by the arithmetic processing unit 41, and the first laser measurement unit 33 or the second laser measurement unit 34 is moved to a laser measurement site for performing laser measurement. . Note that which of the first laser measurement unit 33 and the second laser measurement unit 34 is used is set in advance according to the type of the component 120 and the like. Therefore, for example, when the second laser measurement unit 34 is set to perform measurement for the laser measurement region (solder joint portion J1) of interest, the second laser measurement unit 34 is of interest. It is moved to the laser measurement site (solder joint J1).

  Next, in step S14, for example, the second laser measurement unit 34 measures the laser measurement site (solder joint J1) of interest. At this time, the actual measurement target is the area excluding the laser measurement exclusion area calculated in step S12. Therefore, as shown in FIG. 17, when all the dark regions D1 to D4 of the solder joint portion J1 are determined as the laser measurement exclusion regions, the bright regions excluding these dark regions D1 to D4 (laser measurement exclusion regions). The entire region R1 is the laser measurement target region. The dots displayed in the bright region R1 schematically indicate the laser measurement position. Further, since the bright region R2 is a part of the component 120, it is excluded from the measurement target of the laser measurement site (solder joint J1) of interest. As described above, by removing the laser measurement exclusion region calculated in step S12 from the laser measurement target, the area of the laser measurement target region in the laser measurement region of interest (solder joint J1) is substantially halved. ing. By this laser measurement, the maximum height of the measurement target region (bright region) of the solder joint portion J1 is acquired. Further, the solder volume of the solder joint portion J1 is estimated based on the height information (outer shape) of each measurement position of the measurement target region (bright region) acquired by laser measurement.

  When the laser measurement is completed in step S14, a determination process based on the measurement value is performed by the arithmetic processing unit 41 in step S15. That is, based on the maximum height of the measurement target area (bright area) and the estimated solder volume for the laser measurement site (solder joint J1) of interest, the state A in FIG. ), State B (appropriate shape, appropriate amount of solder), state C (low amount of solder), and state H (high amount of solder) are determined. As a result, the solder joints that are determined to be non-defective in the inspection determination based on the captured image data (see step S8) are determined in more detail for each of the states A, B, C, and H by laser measurement. It becomes possible to do. Further, it is possible to detect the state C (low amount of solder) and the state H (high amount of solder), which are boundaries between good and bad, and determine the quality respectively.

  Then, it returns to step S11 and it is determined whether the non-laser measurement site | part exists about the focused component 120 (refer FIG. 15). Accordingly, when laser measurement is not performed on the solder joint portion J2 in the component 120 shown in FIG. 15, the processing from step S12 to step S15 is performed by paying attention to the solder joint portion J2. On the other hand, if there is no non-laser measurement site for the component 120 of interest, the process returns to step S10.

  In step S10, the arithmetic processing unit 41 determines whether there is another laser measurement target component 120 (solder joint). When the laser measurement target component 120 (solder joint) exists, the process proceeds to step S11. In this way, for all laser measurement target parts 120 (solder joints), laser measurement exclusion regions are calculated for each laser measurement region, and laser measurement is performed. On the other hand, when laser measurement is completed for all laser measurement target components 120 (solder joints), it is determined in step S10 that there are no laser measurement target components, and the inspection operation of the mounted substrate 110 by the appearance inspection apparatus 100 is performed. finish. Then, the mounted substrate 110 that has been inspected is carried out by the substrate transfer conveyor 10, and the next inspection object (mounted substrate 110) is carried in. In this way, the inspection operation of the inspection object (mounted substrate 110) by the appearance inspection apparatus 100 is performed.

  In the present embodiment, as described above, the laser measurement exclusion region in the captured image is determined based on the captured image of the inspection object (mounted substrate 110) by the imaging unit 31, and the laser measurement exclusion region is the first laser measurement. By excluding from the measurement object by the part 33 or the second laser measurement part 34, the hole part F2 of the solder joint part, the steeply inclined part F3, etc. based on the picked-up image of the inspection object (mounted substrate 110) by the image pickup part 31 The measurement by the first laser measurement unit 33 or the second laser measurement unit 34 can be performed after excluding the laser measurement exclusion region. Thus, unlike the case where the entire laser measurement site such as the solder joints (J1 and J2) is measured by the first laser measurement unit 33 or the second laser measurement unit 34, the actual laser measurement exclusion region is excluded. Since the area of the measurement region can be reduced, the number of height measurement points that are actually measured by scanning the laser beam is reduced, and measurement can be performed in a short time. Further, an area unsuitable for measurement (laser measurement exclusion area) that cannot be measured by laser measurement such as the hole F2 and the steeply inclined portion F3 of the solder joint (J1 and J2) or that may reduce measurement accuracy is excluded in advance. Therefore, the measurement by the first laser measurement unit 33 or the second laser measurement unit 34 is performed only in the remaining region (laser measurement target region, bright region R1). As a result, measurement values and measurement errors with low accuracy are not mixed with the measurement results, so the mounting state of the electronic component (component 120) is inspected using the first laser measurement unit 33 or the second laser measurement unit 34. In particular, highly accurate measurement can be performed.

  In the present embodiment, as described above, the entire region (bright region R1) excluding the laser measurement exclusion region is specified, and measurement by the first laser measurement unit 33 or the second laser measurement unit 34 is performed. Thus, the measurement accuracy can be improved by measuring the entire remaining region (bright region R1) after excluding the laser measurement exclusion region.

  In the present embodiment, as described above, imaging of the mounted substrate 110 by the imaging unit 31 is performed on at least the solder joint portion J1 (J2) of the component 120 on the printed circuit board 130 in the inspection object (mounted substrate 110). By determining the laser measurement exclusion region based on the image, the solder joint J1 (J2) of the component 120 in which holes F2 due to bubbles or the like, steeply inclined portions F3, cracks, etc. are likely to occur by determining the laser measurement exclusion region. Since the laser measurement exclusion region can be determined and excluded, the measurement time can be shortened while increasing the measurement accuracy.

  Further, in the present embodiment, as described above, the laser measurement exclusion region is measured by the first laser measurement unit 33 or the second laser measurement unit 34 so that the shape of the measurement site (solder joint J1) of the mounted substrate 110 is measured. It is unsuitable for measurement by the first laser measurement unit 33 or the second laser measurement unit 34, which may affect the measurement accuracy by including at least a region having an inappropriate shape (the hole F2 and the steeply inclined portion F3). By detecting the shape (hole portion F2 and steeply inclined portion F3) from the captured image, it can be excluded as a laser measurement exclusion region.

  In the present embodiment, as described above, the arithmetic processing unit 41 is included in the captured image of the mounted substrate 110 using the hole (concave) shape imaging example and the steep slope shape imaging example. By configuring so as to detect a shape unsuitable for measurement by the laser measurement unit 33 or the second laser measurement unit 34, the captured image data of the mounted substrate 110 by the imaging unit 31 is compared and collated with the captured image example. By determining whether or not it matches or approximates (a hole (concave) shape imaging example and a steeply inclined shape imaging example), the first laser measurement unit 33 or the first laser measurement unit 33 included in the captured image of the mounted substrate 110 is determined. A shape unsuitable for measurement by the two-laser measurement unit 34 can be easily detected.

Further, in the present embodiment, as described above, the arithmetic processing unit 41, based on a captured image and board data loaded-board 110 (inspection site) by the imaging unit 31 calculates the mounting position deviation of the part 120 The laser measurement exclusion region is determined based on the calculated mounting position deviation of the component 120, and the laser measurement is performed by shifting the mounting position of the component 120 mounted on the printed circuit board 130. Laser measurement is also excluded from the area where measurement by the first laser measurement unit 33 or the second laser measurement unit 34 cannot be performed due to the laser beam being blocked by the component 120 (shielding object). It can be excluded as a region.

  Further, in the present embodiment, as described above, by determining the laser measurement exclusion region based on the difference in light intensity (contrast) in the captured image of the mounted substrate 110, the hole in the solder joint portion in the captured image. In areas such as the part F2 and the steeply inclined part F3, the intensity is lower (darker) than the surroundings, and the area located in the shadow (darker) of the part 120 having a large height is high when performing laser measurement. Therefore, the laser measurement exclusion region can be easily determined by determining the laser measurement exclusion region based on the difference in intensity in the captured image.

  Further, in the present embodiment, as described above, the imaging unit 31 is configured to perform imaging from above the mounted substrate 110 using the illumination light of the upper stage illumination 322, so that the hole F2 or the steep inclination is obtained. In addition to reducing (darkening) the intensity of a region unsuitable for laser measurement, such as the part F3, it is possible to increase (brighten) the intensity of a flat part suitable for laser measurement. Thereby, the intensity difference (contrast) between the region suitable for laser measurement and the unsuitable region can be increased, so that the laser measurement exclusion region is more easily determined based on the difference in intensity in the captured image. be able to.

  Further, in the present embodiment, as described above, the hole F2 and the steeply inclined portion F3 formed in the solder joint portion are excluded as shapes inappropriate for laser measurement, thereby forming a shape particularly unsuitable for laser measurement. For the solder joints (J1 and J2) of the component 120 that easily affect the measurement accuracy, the region having the shape of the hole F2 and the steeply inclined portion F3 that are inappropriate for laser measurement may be excluded as a laser measurement exclusion region. it can.

  Further, in the present embodiment, as described above, based on the component shape database stored in the storage unit 42, the measurement position on the mounted substrate 110 from the first laser measurement unit 33 or the second laser measurement unit 34 is set. When laser measurement is performed, for example, by determining an area (an area in the vicinity of the shield F1) where the incident path or the reflection path of the laser beam may be blocked by the shield F1 such as the component 120 as a laser measurement exclusion area Area that is not suitable for laser measurement, such as the area near the part 120, based on the part shape database. Area) can be easily determined.

  In the present embodiment, as described above, the direction A (second laser measurement unit) from the light emitting unit 34a (33a) to the light receiving unit 34b (33b) of the second laser measurement unit 34 (first laser measurement unit 33). 34 (the direction of the first laser measurement unit 33)), an area where the laser light incident path or reflection path may be blocked is determined as an area unsuitable for laser measurement (laser measurement exclusion area). Thus, the laser measurement exclusion region can be determined in consideration of the direction A from the light emitting unit 34a (33a) to the light receiving unit 34b (33b) in the appearance inspection apparatus 100. That is, as shown in FIG. 11 and FIG. 12, the laser is changed in the direction A (direction of the second laser measuring unit 34 (first laser measuring unit 33)) from the light emitting unit 34 a (33 a) to the light receiving unit 34 b (33 b). When a region unsuitable for measurement occurs, a region unsuitable for laser measurement (laser based on the orientation of the known first laser measurement unit 33 or second laser measurement unit 34 in addition to the captured image of the mounted substrate 110) The measurement exclusion region) can be excluded in advance.

  Further, in the present embodiment, as described above, the laser measurement unit that determines whether the laser measurement unit that performs measurement is the regular reflection type first laser measurement unit 33 or the diffuse reflection type second laser measurement unit 34. Based on the type, the area where the laser light incident path or reflection path may be blocked is determined as an area unsuitable for laser measurement (laser measurement exclusion area). With this configuration, as shown in FIGS. 6 and 7, the first laser measurement unit 33 (the angle α formed by the incident path and the reflection path) and the second laser measurement unit 34 (the incident path and the reflection path Since the incident path and the reflection path of the laser light differ depending on the angle β) formed, it is possible to determine a region (laser measurement exclusion region) that is inappropriate for laser measurement in consideration of the type of the laser measurement unit. As a result, when there is a difference in the region unsuitable for laser measurement depending on the type of the laser measurement unit (when measuring the vicinity of the side E4 of the shielding object F1, refer to FIG. 11), the laser is added to the captured image of the mounted substrate 110. Based on the type of measurement unit, an area unsuitable for laser measurement (laser measurement exclusion area) can be determined and excluded in advance.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, the example in which the laser measurement exclusion region is determined for the solder joint portion (J1 and J2) of the component 120 of the mounted substrate 110 has been described, but the present invention is not limited thereto. For example, the laser measurement exclusion region may be determined when laser measurement is performed on the warpage or undulation of the terminal portion 121 other than the solder joint portion, the component 120, the substrate 110 itself, the application state of an adhesive resin, a sealing agent, or the like. . The determination of the laser measurement exclusion region may be performed for all the parts to be measured of the inspection object (mounted substrate 110).

  Further, in the above-described embodiment, an example in which the mounted substrate 110 in which the component 120 is solder-bonded to the printed circuit board 130 is inspected as an inspection object is shown, but the present invention is not limited to this. For example, the mounting state of the component may be inspected with respect to the substrate before the component is soldered.

  In the above-described embodiment, an example in which the imaging direction of the imaging unit 31 is configured to be substantially perpendicular to the mounted substrate 110 has been described, but the present invention is not limited to this. In the present invention, the imaging unit may image the inspection object from an oblique direction other than the substantially vertical direction.

  In the above-described embodiment, the example in which the two laser measurement units of the regular reflection type first laser measurement unit 33 and the diffuse reflection type second laser measurement unit 34 are provided in the appearance inspection apparatus 100 has been described. The invention is not limited to this. In the present invention, only one of the regular reflection type first laser measurement unit 33 and the diffuse reflection type second laser measurement unit 34 may be provided in the appearance inspection apparatus.

  Moreover, in the said embodiment, the picked-up image of the mounted board | substrate 110, the example of a hole (concave part) shape imaging, the example of a steeply inclined part shape imaging, and the direction and incidence of the 1st laser measurement part 33 or the 2nd laser measurement part 34 An example is shown in which the laser measurement exclusion region is determined based on the angle formed by the path and the reflection path, the positional deviation of the component 120, the image processing result, the various data such as the component shape database and the board data. However, the present invention is not limited to this. In the present invention, the laser measurement exclusion region may be determined based on at least the captured image of the inspection object (mounted substrate). Therefore, for example, the laser measurement exclusion region may be determined without being based on the direction of the laser measurement unit and the angle between the incident path and the reflection path, or the laser measurement exclusion region may be determined without being based on the mounting position deviation of the component 120. May be.

  Moreover, in the said embodiment, the example comprised so that only the bright area | region R1 except the dark area | regions D1-D4 (laser measurement exclusion area | region) may become a laser measurement object in the laser measurement site | part (solder joint part J1) which is paying attention. However, the present invention is not limited to this. In the present invention, after the dark regions D1 to D4 (laser measurement exclusion region) are excluded, laser measurement may be performed only for a part of the bright region R1. In this case, since the area of the laser measurement target region can be further reduced, laser measurement can be performed in a shorter time.

  In the above-described embodiment, the example in which the hole portion (concave portion) F2 and the steeply inclined portion F3 of the solder joint portion are excluded as shapes inappropriate for laser measurement (determined as a laser measurement exclusion region) has been shown. The present invention is not limited to this. In the present invention, only one of the hole portion (concave portion) and the steeply inclined portion of the solder joint portion may be determined as the laser measurement exclusion region. Moreover, you may comprise so that the shape unsuitable for these laser measurements may not be determined as a laser measurement exclusion area.

  In the above embodiment, the hole (concave) F2 and the steeply inclined portion F3 of the solder joint are determined as shapes inappropriate for laser measurement based on the hole (concave) shape imaging example and the steeply inclined shape imaging example. Although an example of the configuration is shown, the present invention is not limited to this. For example, depending on whether or not the intensity distribution of the region of interest in the captured image matches or approximates the database pattern, based on a database of light intensity distribution patterns when a hole (concave part) or steeply inclined part is imaged You may comprise so that the shape unsuitable for laser measurement may be determined.

  Further, in the above-described embodiment, the image data captured using the upper illumination 322 is further imaged using the middle illumination 323 and the lower illumination 324 in the brightness measurement when determining the laser measurement exclusion region. An example was given in which the brightness and darkness (difference in light intensity) of each region became clearer by performing image processing such as taking differences by combining image data using each image data. The invention is not limited to this. In the present invention, it may be configured such that light / dark determination is performed using only image data captured using upper illumination. Further, it may be configured to perform light / dark determination using only image data captured using middle-stage illumination, lower-stage illumination, or infrared illumination. Moreover, you may comprise so that determination may be performed based on the color tone of the imaged color image.

  Moreover, although the said embodiment provided the example which provided the upper stage illumination 322, the middle stage illumination 323, and the lower stage illumination 324 in the illumination part 32, this invention is not limited to this. For example, you may comprise the illumination of an illumination part only by upper stage illumination.

  In the above-described embodiment, various data used for determination of the laser measurement exclusion region such as board data, component shape database, hole (concave) shape imaging example, and steeply inclined shape imaging example are stored in the storage unit 42. Although the example which comprised was shown, this invention is not limited to this. For example, various data used for determination of the laser measurement exclusion region may be stored in a host computer or the like connected to the network via the external input / output unit 44 and acquired as necessary.

  In the above embodiment, the inspection unit 30 including the imaging unit 31, the illumination unit 32, the first laser measurement unit 33, the second laser measurement unit 34, and the like is moved by the XY robot 20 in the XY direction (horizontal direction). However, the present invention is not limited to this. For example, the inspection unit may be configured to be movable only in the X direction, and the mounted substrate may be configured to move in the Y direction on a substrate table that is movable in the Y direction. Further, the inspection unit may be fixedly provided at a position above the mounted substrate, and the mounted substrate may be moved in the XY direction on a substrate table movable in the XY direction (horizontal direction).

  In the above-described embodiment, an example in which the first laser measurement unit 33 and the second laser measurement unit 34 are configured by a laser measurement device using a spot laser has been described, but the present invention is not limited to this. For example, you may comprise by the laser measuring device which uses a line laser. In this case, the height may be measured by determining an area where the laser measurement exclusion area does not exist on the line or the area where the laser measurement exclusion area is small. Further, if data is extracted from the line data of which the height has been measured, excluding the measurement data in the laser measurement exclusion region, the data processing can be accelerated and highly reliable data can be obtained.

31 Image pickup unit 32 Illumination unit 33 First laser measurement unit (laser measurement device, specular reflection type measurement device)
33a Light emitting unit 33b Light receiving unit 34 Second laser measurement unit (laser measurement device, diffuse reflection type measurement device)
34a Light emitting unit 34b Light receiving unit 41 Arithmetic processing unit (control unit)
100 Appearance inspection device (inspection device)
110 Mounted board (inspection object)
120 parts (electronic parts)
130 Printed circuit board (board)
F2 hole (shape unsuitable for measurement by laser measuring device)
F3 Steeply inclined part (shape unsuitable for measurement with a laser measuring device)

Claims (12)

An imaging unit for imaging an inspection object;
A laser measuring device that measures the shape of the inspection object by irradiating the measurement position on the inspection object with a laser beam and receiving reflected light from the inspection object;
Based on a captured image of the inspection object by the imaging unit, a region unsuitable for measurement by the laser measurement device included in the captured image is determined, and a region unsuitable for measurement by the laser measurement device is determined by the laser measurement device. And a control unit to be excluded from the measurement target by
The region unsuitable for measurement by the laser measuring device includes at least a region where the shape of the inspection object is a shape unsuitable for measurement by the laser measuring device.   The control unit is configured to perform measurement by the laser measurement device by designating at least a part of a region other than the excluded region unsuitable for measurement by the laser measurement device. The inspection apparatus according to 1.   The control unit is configured to detect a shape unsuitable for measurement by the laser measurement device included in a captured image of the inspection object, using information regarding a shape unsuitable for measurement by the laser measurement device. The inspection apparatus according to claim 2. An illumination unit that illuminates the inspection object with illumination light;
The said control part is comprised so that the area | region unsuitable for the measurement by the said laser measuring device may be determined based on the difference in the intensity | strength of the light in the captured image of the said test | inspection object. Inspection device according to item. The illumination unit is configured to be able to irradiate illumination light from above the inspection object,
The inspection apparatus according to claim 4, wherein the imaging unit is configured to perform imaging from above the inspection object using illumination light from above the inspection object by the illumination unit. The inspection object is a mounted substrate in which an electronic component is mounted on a substrate,
The control unit determines an unsuitable region for measurement by the laser measurement device based on a captured image of the inspection object by the imaging unit for at least a solder joint portion of the electronic component on the substrate of the inspection object. The inspection apparatus according to claim 1, configured as described above. The region unsuitable for measurement by the laser measurement device includes at least a region in which the shape of the inspection object is a shape unsuitable for measurement by the laser measurement device,
The inspection apparatus according to claim 6, wherein the shape unsuitable for measurement by the laser measurement apparatus includes at least one of a hole part or a steeply inclined part formed in a solder joint part.   The control unit further includes an incident path of laser light from the laser measuring device to the inspection object or a reflection path of reflected light from the inspection object based on information on the shape of the electronic component mounted on the substrate. The inspection apparatus according to claim 6, wherein an area that may be blocked by the electronic component is determined as an area unsuitable for measurement by the laser measurement apparatus. The control unit calculates a mounting position deviation between a mounting position of the electronic component mounted on the substrate and a preset design mounting position of the electronic component based on a captured image of the inspection object by the imaging unit. Then, based on the mounting position shift of the electronic component calculated in addition to the captured image of the inspection object , a region in which laser light may be blocked by the electronic component as a result of the mounting position shift, It is configured to determine as unsuitable area measurement by a laser measuring device, the inspection device according to any one of claims 6-8. The laser measuring device includes a light emitting unit that emits laser light to the inspection object, and a light receiving unit that receives reflected light reflected from the inspection object,
The control unit is configured such that an incident path of laser light from the light emitting unit to the inspection object or reflected light from the inspection object to the light receiving unit based on a direction from the light emitting unit to the light receiving unit of the laser measurement device. The inspection apparatus according to any one of claims 1 to 9, wherein the inspection apparatus is configured to determine an area where the reflection path may be blocked as an area unsuitable for measurement by the laser measurement apparatus. The laser measurement device includes a regular reflection type measurement device that receives a regular reflection component of reflected light reflected from the inspection object, and a diffuse reflection type measurement device that receives a diffuse reflection component,
The control unit moves from the light emitting unit to the inspection object based on the type of the laser measurement device, which is whether the laser measurement device to be measured is a regular reflection type measurement device or the diffuse reflection type measurement device. An area where the incident path of the laser beam or the reflected path of the reflected light from the inspection object to the light receiving unit may be blocked is determined as an area unsuitable for measurement by the laser measuring device. The inspection apparatus according to any one of claims 1 to 10. Imaging the inspection object;
Based on a captured image of the inspection object, a region unsuitable for measurement by the laser light included in the captured image is determined, and an unsuitable region for measurement by the laser light is excluded from the measurement target by the laser light. And steps to
Measuring the shape of the inspection object by irradiating the measurement position on the inspection object with laser light and receiving the reflected light from the inspection object,
The region unsuitable for measurement by the laser beam includes at least a region in which the shape of the inspection object is unsuitable for the measurement by the laser beam.

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