CN102147237B - Inspection device and inspection method - Google Patents

Abstract

The invention provides an inspection device and an inspection method. The inspection device (100) uses a laser measuring device to conduct an inspection on an object in a complicated shape and comprises a shooting part (31) for shooting the object (110), a laser measuring part (33, 34) which measures the height of the object (110) through irradiating laser on the measuring position of the object (110) and receiving reflection light from the object (11), and an operation processing part (41) which uses a shooting image of the object (110) shot by the shooting part (31) to determine an area (laser measurement exclude area) unsuitable for the laser measurement contained in the shooting image and exclude the laser measurement exclude area from the measuring objects of the laser measuring part (33, 34). In this case, even the shapes of the objects are complicated, a measurement of high precision can be conducted in a short time.

Description

Testing fixture and inspection method

Technical field

The present invention relates to testing fixture and inspection method, particularly by laser measurement, check testing fixture and the inspection method of the shape of thing.

Background technology

In the past, known have possess the testing fixture (for example: No. 9-196625, Japanese Patent Publication communique Unexamined Patent is designated hereinafter simply as patent documentation 1) of laser measuring device for measuring that checks the shape of thing by laser measurement.

In above-mentioned patent documentation 1, disclose a kind of coplanarity (coplanarity) pick-up unit, it comprises: at the spherical terminal (being called projection (bump)) by IC chips such as ball grid array (Ball Grid Array:BGA) towards the Lighting Division of irradiating illumination light from the side under the state of top mounting; Use illumination light from top, to take the camera of projection; The laser measuring device for measuring of the height of the apex portion of mensuration projection; And the control part that calculates the vertex position of projection according to the photographic images of camera.In this coplanarity pick-up unit, by to spherical terminal (projection) irradiating illumination light from the side, and the reflected light reflected upward by camera, thereby according to each projection of BGA, take the image of the circular bright section with the apex of surrounding ball.Control part is the vertex position of projection according to center of gravity (center) position of this circular bright section, calculates the apex coordinate of each projection, and by laser measuring device for measuring, measures the height of this apex coordinate, thereby determine the height of each projection of BGA.

Can consider the installation base plate etc. that the disclosed technology of coplanarity pick-up unit of above-mentioned patent documentation 1 is applicable on substrate to be equipped with electronic component is checked the inspection of the installment state (solder shape and engagement state after the sclerosis of solder bonds section) of the electronic component of thing.But, in the coplanarity pick-up unit of above-mentioned patent documentation 1, because the projection based on BGA has the same spherical shape and calculates apex coordinate according to the photographic images of projection, by laser measuring device for measuring, measure bump height, therefore to as harden after solder shape the shape of solder bonds section of complexity while measuring, be difficult to calculate the coordinate of apex and measure according to photographic images.So, be difficult to the technology of above-mentioned patent documentation 1 is applicable to check the inspection of installment state of the electronic component of thing.

In addition, in the situation that check the solder bonds section with complicated shape as above by laser measuring device for measuring, when by laser measuring device for measuring, measuring solder bonds section integral body, need to and measure all coordinate scan lasers of being contained in measured zone, therefore have the time-consuming problem of measuring.And, now the hole section at brave material junction surface and precipitous etc., have the part of complicated shape, due to the reflected light that sometimes can't suitably receive the laser that laser measuring device for measuring irradiates, the problem that therefore also exists measuring accuracy to be easy to descend.

Summary of the invention

In order to solve problem as above, the object of the present invention is to provide a kind of testing fixture and inspection method, even, when using laser measuring device for measuring to have the inspection of inspection thing of complicated shape, also can carry out at short notice high-precision mensuration.

In order to achieve the above object, one aspect of the present invention relates to testing fixture, and this testing fixture comprises: shoot part, and take and check thing; Laser measuring device for measuring, by the measuring position irradiating laser on described inspection thing, also receive the reflected light from described inspection thing, measure the height of described inspection thing, described testing fixture also is characterised in that and comprises: control part, at least use the photographic images of the described inspection thing of being taken by described shoot part, judge the zone that described laser measuring device for measuring is measured that is not suitable for comprised in described photographic images, and be not suitable for from the measuring object of described laser measuring device for measuring, getting rid of the zone that described laser measuring device for measuring is measured; Described laser measuring device for measuring comprises: the illuminating part that described inspection thing is penetrated to laser; And the catoptrical light accepting part that receives described inspection thing reflection, wherein, described control part, according to from the direction of described illuminating part towards described light accepting part, by the zone that the incident path of the laser from described illuminating part to described inspection thing or the catoptrical reflection paths from described inspection thing to described light accepting part likely are blocked, be judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.

In testing fixture involved in the present invention, as mentioned above, by the photographic images of setup and use by the inspection thing of shoot part shooting, judge the zone that laser measuring device for measuring is measured that is not suitable for comprised in photographic images, and from the measuring object of laser measuring device for measuring, getting rid of the control part in the zone that is not suitable for the laser measuring device for measuring measurement, can use the photographic images of the inspection thing of being taken by shoot part, the hole sections, precipitous etc. of getting rid of complex-shaped solder bonds section are not suitable for, on the basis in the zone that laser measuring device for measuring measures, carrying out the measurement of laser measuring device for measuring.Accordingly, the situation of mensuration of carrying out laser measuring device for measuring from the zone integral body that solder bonds section etc. is had to complicated shape as the measuring object zone of laser measuring device for measuring is different, can get rid of the area part that is not suitable for the laser measuring device for measuring measurement and dwindle the area of actual measured zone, therefore in fact the elevation measurement point of scan laser measurement reduces, and can measure at short notice.And, due to zones that is not suitable for measuring that the use laser measuring device for measuring can't be measured or measuring accuracy may descend such as the hole sections of getting rid of in advance solder bonds section, precipitous, therefore part or all of remaining zone (determination object zone) carried out to the measurement of laser measuring device for measuring.Therefore its result, owing in measurement result, can not mixing measured value and the measuring error that precision is low, even when using laser measuring device for measuring to carry out the inspection of installment state of electronic component, also can carry out high-precision measurement.

And in described testing fixture, described laser measuring device for measuring comprises: the illuminating part that described inspection thing is penetrated to laser; And the catoptrical light accepting part that receives described inspection thing reflection, wherein, described control part basis is from the direction of described illuminating part towards described light accepting part, by the zone that the incident path of the laser from described illuminating part to described inspection thing or the catoptrical reflection paths from described inspection thing to described light accepting part likely are blocked, be judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.According to this structure, consider can to judge and be not suitable for the zone that laser measuring device for measuring is measured from the illuminating part of the laser measuring device for measuring direction towards light accepting part.Namely, when from illuminating part towards the direction of light accepting part for example, perpendicular to checking that the step that thing has (: during the direction of the difference in height formed at the substrate installing electronic elements) extending, come the reflected light of self-check thing to be easy to be blocked by this step, on the other hand, when from illuminating part when the direction of light accepting part is parallel to the direction that described step extends, come the reflected light of self-check thing can not blocked by this step.So, according to illuminating part when the direction of light accepting part produces be not suitable for that laser measuring device for measuring measures regional, at this, check on the basis of photographic images of thing and can get rid of in advance and be not suitable for the zone that laser measuring device for measuring is measured also according to from the direction of illuminating part towards light accepting part.

In described testing fixture, comparatively it is desirable to, described control part, for from described photographic images, having got rid of described at least a portion that is not suitable for the zone behind zone that laser measuring device for measuring measures, is carried out the measurement of described laser measuring device for measuring.According to this structure, for example, on the basis of having got rid of the zone that is not suitable for the laser measuring device for measuring measurement, by measuring remaining Zone Full, also can realize the raising of measuring accuracy, and got rid of on the basis in the zone that is not suitable for the laser measuring device for measuring measurement, by further only measuring solder bonds section etc., have the required minimal part of shape measure of the part of complicated shape, thereby can also further dwindle the area of actual measured zone and realize the further shortening of Measuring Time.

In described testing fixture, comparatively it is desirable to, the described zone that is not suitable for the laser measuring device for measuring measurement comprises that at least being shaped as of described inspection thing is not suitable for the zone of the shape of described laser measuring device for measuring mensuration.According to this structure, by according to photographic images, detecting the shape that is not suitable for the laser measuring device for measuring measurement likely measuring accuracy impacted, thereby can get rid of as the zone that is not suitable for the laser measuring device for measuring measurement.

In this case, comparatively it is desirable to, described control part is used the information about the shape that is not suitable for described laser measuring device for measuring mensuration, detects the described shape that is not suitable for laser measuring device for measuring mensuration comprised in described photographic images.According to this structure, for example, as about being not suitable for the information of the shape that laser measuring device for measuring measures, the photographic images example of the shape that is not suitable for laser measuring device for measuring mensuration has been taken in use, just can, by relatively contrasting photographic images and the photographic images example of the inspection thing of being taken by shoot part, easily detect the shape that laser measuring device for measuring is measured that is not suitable for comprised in the photographic images that checks thing.

In described testing fixture, comparatively it is desirable to, described control part, according to the light intensity difference in described photographic images, is judged the described zone that laser measuring device for measuring is measured that is not suitable for.The zone such as hole section of solder bonds section, precipitous in photographic images, around the light intensity ratio low (secretly), and the zone in the shade that is positioned at highly large electronic component (dimmed), laser is sometimes blocked and can't measure by highly large electronic component when carrying out the measurement of laser measuring device for measuring, if therefore adopt the structure of judging the zone that is not suitable for the laser measuring device for measuring measurement according to the light intensity difference in photographic images, can easily judge and be not suitable for the zone that laser measuring device for measuring is measured.

In this case, comparatively it is desirable to, described testing fixture also comprises: Lighting Division, top irradiating illumination light from described inspection thing, wherein, described shoot part is used the illumination light of being irradiated from the top of described inspection thing by described Lighting Division, takes from the top of described inspection thing.If adopt the structure of using from the illumination light photographic images of top, can reduce the light intensity that (dimmed) hole section, precipitous etc. are not suitable for the zone that laser measuring device for measuring measures, and can improve the light intensity that (brightening) is applicable to the par that laser measuring device for measuring measures.Accordingly, to be suitable for the zone that laser measuring device for measuring measures poor with the light intensity in unaccommodated zone owing to enlarging, and therefore can, more easily according to the light intensity difference in photographic images, easily judge the zone that is not suitable for the laser measuring device for measuring measurement.

In described testing fixture, comparatively it is desirable to, described inspection thing is the installation base plate that electronic component is installed on substrate, described control part is at least to being positioned at the solder bonds section of the electronic component on described substrate in described inspection thing, use described photographic images, judge the described zone that laser measuring device for measuring is measured that is not suitable for.According to this structure, while carrying out the inspection of the installment state of the electronic component of installation base plate (inspection thing) (solder shape and engagement state after the sclerosis of solder bonds section), for what affect measuring accuracy, be easy to produce the solder bonds section of the electronic component in hole section, precipitous and crack etc. because of bubble etc., can judge and be not suitable for zone the eliminating that laser measuring device for measuring is measured, therefore can improve measuring accuracy and shorten minute.

In this case, comparatively it is desirable to, describedly be not suitable for zone that laser measuring device for measuring measures and comprise that at least being shaped as of described inspection thing is not suitable for the zone of the shape that described laser measuring device for measuring measures, described be not suitable for shape that laser measuring device for measuring measures be included in formed hole section in solder bonds section and precipitous at least one of them.According to this structure, can get rid of and have the zone that is not suitable for one of them shape at least in hole section that laser measuring device for measuring measures and precipitous.

Electronic component is installed on described substrate installation base plate is while checking thing, comparatively it is desirable to, described control part is further according to the information about the shape that is arranged on the electronic component on described substrate, by the incident path of the laser from described laser measuring device for measuring to described inspection thing or from the zone that the catoptrical reflection paths of described inspection thing is likely blocked by described electronic component, be judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.According to this structure, when carrying out the measurement of laser measuring device for measuring, block can't measure the time etc. in situation because of the electronic component by highly large, according to the information of the shape about being arranged on the electronic component on substrate, can judge easily that the near zone etc. of highly large electronic component is not suitable for the zone that laser measuring device for measuring is measured.

Electronic component is installed on described substrate installation base plate is while checking thing, comparatively it is desirable to, described control part is according to described photographic images, calculate the installation site deviation of the design and installation position of the installation site that is arranged on the electronic component on described substrate and predefined electronic component, and, according to the described installation site deviation of the electronic component calculated, judge the described zone that laser measuring device for measuring is measured that is not suitable for.According to this structure, while for the installation site deviation because being arranged on the electronic component on substrate, causing carrying out the measurement of laser measuring device for measuring, laser is blocked by electronic component, and cause the zone that can't carry out the measurement of laser measuring device for measuring, also can from the measured zone of laser measuring device for measuring by its eliminating.

In described testing fixture, comparatively it is desirable to, described laser measuring device for measuring comprises: normal reflection type measurement mechanism receives from the normal reflection composition among the reflected light of described inspection thing reflection; And diffusion reflection pattern measurement mechanism, reception is from the scattered reflection composition among the reflected light of described inspection thing reflection, wherein, described control part is described normal reflection type measurement mechanism or described diffusion reflection pattern measurement mechanism according to the kind of the described laser measuring device for measuring of measuring, by the zone that the incident path of the laser from described illuminating part to described inspection thing or the catoptrical reflection paths from described inspection thing to described light accepting part likely are blocked, be judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.According to this structure, based on normal reflection type measurement mechanism and diffusion reflection pattern measurement mechanism, the incident path of laser and reflection paths different (incident light is different from the angle that reflected light forms), therefore consider the kind of laser measuring device for measuring, can judge and be not suitable for the zone that laser measuring device for measuring is measured.Generally speaking, compare incident light when receiving the scattered reflection composition owing to receiving the normal reflection composition and want large with the angle that reflected light forms, so the laser possibility of being blocked by barrier on every side is high, and (zone that is not suitable for measuring is wide.) therefore, when the kind according to laser measuring device for measuring, when being not suitable for zone that laser measuring device for measuring measures and producing difference, check on the basis of photographic images of thing also according to the kind of laser measuring device for measuring at this, can judge in advance and get rid of the zone that is not suitable for the laser measuring device for measuring measurement.

The present invention relates to inspection method on the other hand, and this inspection method is used testing fixture, and described testing fixture comprises: shoot part, and take and check thing; Laser measuring device for measuring, also receive the reflected light from described inspection thing by the measuring position irradiating laser on described inspection thing, measures the height of described inspection thing; And control part, at least use the photographic images of the described inspection thing of being taken by described shoot part, judge the zone that described laser measuring device for measuring is measured that is not suitable for comprised in described photographic images, and from the measuring object of described laser measuring device for measuring, getting rid of and be not suitable for the zone that described laser measuring device for measuring is measured, described laser measuring device for measuring comprises: the illuminating part that described inspection thing is penetrated to laser; And the catoptrical light accepting part that receives described inspection thing reflection, described inspection method comprises takes the step that checks thing, characterized by further comprising following steps: the photographic images that uses captured described inspection thing, judge the zone that is not suitable for laser measurement comprised in described photographic images, and from the measuring object of described laser, getting rid of the step in the zone that is not suitable for described laser measurement; And by the measuring position irradiating laser on described inspection thing is also received to the reflected light from described inspection thing, measure the step of the height of described inspection thing, from the measuring object of described laser, getting rid of in the step in the zone that is not suitable for described laser measurement, according to from the direction of described illuminating part towards described light accepting part, by the zone that the incident path of the laser from described illuminating part to described inspection thing or the catoptrical reflection paths from described inspection thing to described light accepting part likely are blocked, be judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.

In inspection method involved in the present invention, as mentioned above, by using the photographic images of captured inspection thing, judge the zone that is not suitable for laser measurement comprised in photographic images, and from the measuring object of laser, getting rid of the zone that is not suitable for laser measurement, thereby can use the photographic images of captured inspection thing, in the hole section of getting rid of complex-shaped solder bonds section, precipitous etc., be not suitable for carrying out laser measurement on the basis in zone of laser measurement.Accordingly, the situation of carrying out laser determination from the zone integral body that solder bonds section etc. is had to complicated shape as the measuring object zone is different, can get rid of the part in the zone that is not suitable for laser measurement and dwindle the area of actual measured zone, therefore can measure at short notice.And, because the use laser such as the hole section of getting rid of in advance solder bonds section, precipitous can't be measured and maybe may produce the zone that is not suitable for measuring that measuring accuracy descends, therefore part or all of remaining zone (determination object zone) carried out to laser measurement.Therefore its result, owing in measurement result, can not mixing measured value and the measuring error that precision is low, even when using laser to carry out the inspection of installment state of electronic component, also can carry out high-precision measurement.

The accompanying drawing explanation

Fig. 1 means the mode chart of the appearance inspection device that one embodiment of the present invention is related.

Fig. 2 means the stereographic map of installation base plate of the inspection object of the appearance inspection device that an embodiment shown in Figure 1 is related.

Fig. 3 is the figure be used to the state of the solder bonds section that installation base plate shown in Figure 2 is described.

Fig. 4 is the control block diagram be used to the appearance inspection device that an embodiment shown in Figure 1 is described.

Fig. 5 is be used to the shoot part of the appearance inspection device that an embodiment shown in Figure 1 is described and the figure of Lighting Division.

Fig. 6 is the figure be used to the 1st laser measurement section of the appearance inspection device that an embodiment shown in Figure 1 is described.

Fig. 7 is the figure be used to the 2nd laser measurement section of the appearance inspection device that an embodiment shown in Figure 1 is described.

Fig. 8 is the figure be used to the zone that is not suitable for laser measurement of the appearance inspection device that an embodiment shown in Figure 1 is described.

Fig. 9 is the figure be used to the shape that is not suitable for laser measurement of the appearance inspection device that an embodiment shown in Figure 1 is described.

Figure 10 is the figure be used to the shape that is not suitable for laser measurement of the appearance inspection device that an embodiment shown in Figure 1 is described.

Figure 11 is the figure of the difference in the zone that is not suitable for laser measurement that caused by the direction difference of the 2nd laser measurement section of the appearance inspection device of an embodiment shown in Figure 1 for explanation, wherein, (A) is side view outline, (B) for overlooking sketch map.

Figure 12 is the figure of the difference in the zone that is not suitable for laser measurement that caused by the direction difference of the 2nd laser measurement section of the appearance inspection device of an embodiment shown in Figure 1 for explanation, wherein, (A) is side view outline, (B) for overlooking sketch map.

Figure 13 is the process flow diagram be used to the action of the inspection to installation base plate of the appearance inspection device that an embodiment shown in Figure 1 is described.

Figure 14 is the process flow diagram be used to the computing that laser measurement exclusionary zone shown in Figure 13 is described.

Figure 15 is the figure be used to the computing of the laser measurement exclusionary zone of the appearance inspection device that one embodiment of the present invention is described.

Figure 16 is the figure be used to the computing of the laser measurement exclusionary zone of the appearance inspection device that one embodiment of the present invention is described, wherein, (A) for overlooking sketch map, (B) for the part of (A), amplifies and overlooks sketch map.

Figure 17 is the figure be used to the laser measurement subject area of the appearance inspection device that one embodiment of the present invention is described.

Embodiment

Embodiments of the present invention below are described with reference to the accompanying drawings.

At first, referring to figs. 1 through Figure 12, the structure of the appearance inspection device 100 of one embodiment of the present invention is described.In addition, in the present embodiment, the applicable situation of the present invention of appearance inspection device 100 as the example of " testing fixture " is described.

As depicted in figs. 1 and 2, the appearance inspection device 100 of present embodiment is for to element 120 being arranged on to inspection thing (installation base plate 110) on printed base plate 130, carrying out the device of inspection of the installment state of element 120.At installation base plate 110, on the assigned address on the printed base plate 130 that is formed with Wiring pattern (not shown), dispose a plurality of electronic components (element 120) such as integrated circuit.On printed base plate 130 by the pasty state scolder 140(of the pattern of appointment coating (printing) with reference to Fig. 3) the upper portion of terminal 121 that configures element 120, with this, carry (installation) these elements 120.Then, through scolder 140(with reference to Fig. 3) melting and sclerosis (cooling) operation, portion of terminal 121 solder bonds (solder bonding) of element 120 are on the distribution of printed base plate 130, thereby element 120 is fixed on substrate 130 under the state that the wired electric of the appointment with printed base plate 130 is connected.Appearance inspection device 100 using the installation site of element 120 and direction whether rationally, with respect to the position deviation amount of the design attitude of element 120 whether in permissible range, the solder bonds section of portion of terminal 121 installment state as element 120 such as normal and checking whether.In addition, installation base plate 110 is an example of " inspection thing " of the present invention.In addition, element 120 and printed base plate 130 are respectively an example of " electronic component " of the present invention and " substrate ".

In addition, as shown in Figure 3, in installation base plate 110, the solder bonds section of portion of terminal 121, according to the installation site precision of element 120 and all factors such as printing (coating) precision of scolder 140, roughly present respectively the state of A to H.Particularly, state A be amount of solder slightly less but have the example of the state (certified products) of suitable solder shape.State B is all examples of suitable desirable state (certified products) of amount of solder and solder shape.State C is that amount of solder is few, the example of qualified boundary as whether.State D is the not example of the state (defective) of welding that portion of terminal 121 is not engaged by scolder.In addition, although state E is coated with scolder, the example of the state (defective) do not welded because of the deviation of scolder position (or position of element 120).State F and state G are respectively portion of terminal 121(wires) example of the state (defective) that floats with respect to printed base plate 130.Whether qualified in addition, state H is the example of the state of amount of solder surplus, and be the example of boundary.The example of above-mentioned state C and state H is according to the degree of insufficient solder connection (surplus), the purposes etc. of installation base plate 110, and whether qualified its judgement be different.Appearance inspection device 100 is for the above-mentioned state A to H of solder bonds section identification, and judgement solder bonds section is whether qualified.

As shown in Figure 1, appearance inspection device 100 comprises: for the substrate transferring travelling belt 10 of conveyance installation base plate 110; Can be along the mobile XY mechanical arm 20 of XY direction (aspect horizontal) above substrate transferring travelling belt 10; And the inspection assembly 30 kept by XY mechanical arm 20 and control device 40(are with reference to Fig. 4).The following describes the concrete structure of appearance inspection device 100.

Substrate transferring travelling belt 10 can be along directions X conveyance installation base plate 110, and makes installation base plate 110 stop and keeping in the inspection position of appointment.In addition, the installation base plate 110 that substrate transferring travelling belt 10 can finish to check along the directions X conveyance from the inspection position of appointment, and take out of installation base plate 110 from appearance inspection device 100.

In addition, XY mechanical arm 20 is arranged on the top (arrow Z1 direction) of substrate transferring travelling belt 10, for example the orthogonal double axle mechanical arm that uses ballscrew shaft and servomotor, consists of.That is, in XY mechanical arm 20, along the two ends of the directions X of the inspection assembly support portion 21 that directions X extends, pair of guide rails section (not shown) support that the mode that can move along Y-direction with this inspections assembly support portion 21 is extended along Y-direction.Particularly, by Y-axis motor 22(with reference to Fig. 4) drive and to be arranged on the ballscrew shaft (Y-axis) (not shown) of rail portion, thereby move along Y-direction the inspection assembly support portion 21 that makes to have the ball nut (not shown) screwed togather with ballscrew shaft (Y-axis).In addition, in inspection assembly support portion 21, be provided with ballscrew shaft (X-axis) (not shown) and X-axis motor 23(with reference to Fig. 4).And, by X-axis motor 23, driving ballscrew shaft (X-axis) (not shown), the inspection assembly 30 that makes to have the ball nut (not shown) screwed togather with ballscrew shaft (X-axis) can move along directions X.By this structure, XY mechanical arm 20 can make to remain on the inspection assembly 30 that checks on assembly support portion 21 at substrate transferring travelling belt 10(installation base plate 110) top (arrow Z1 direction) mobile along XY direction (horizontal direction).

In addition, check that assembly 30 comprises that shoot part 31, Lighting Division 32, the 1st laser measurement section 33 and the 2nd 34(of laser measurement section are with reference to Fig. 4).This inspection assembly 30 is moved to the assigned address of installation base plate 110 tops by XY mechanical arm 20, and, by using shoot part 31, the 1st laser measurement section 33 and the 2nd laser measurement section 34 etc., check that assembly 30 carries out shooting and the measurement be used to the installment state that checks the element 120 on installation base plate 110.In addition, the 1st laser measurement section 33 is examples of " laser measuring device for measuring " of the present invention and " normal reflection type measurement mechanism ".In addition, the 2nd laser measurement section 34 is examples of " laser measuring device for measuring " of the present invention and " diffusion reflection pattern measurement mechanism ".

Shoot part 31 consists of CCD camera that is provided with lens 31a etc.Shoot part 31 is arranged on installation base plate 110(substrate transferring transport tape 10) top (arrow Z1 direction), and shoot part 31 is towards below (arrow Z2 direction) and arrange, so that it takes direction with respect to installation base plate 110 is substantially vertical.Accordingly, shoot part 31 is used the illumination light of irradiating from Lighting Division 32 to installation base plate 110, from directly over position take the two dimension of the upper surface of installation base plate 110 (plane) image.By the shooting of this shoot part 31, under the illumination light of White LED described later, obtain each image with red R, green G, RGB that blue B is corresponding, under infrared illumination light, obtain infrared image.

In addition, as shown in Figure 5, Lighting Division 32 is and at top, is formed with the dome-shaped of peristome 321, and has a plurality of illuminations of the inner face side that is arranged on dome.(arrow Z1 direction) disposes shoot part 31 above peristome 321, and shoot part 31 carries out the shooting of installation base plate 110 via this peristome 321.Inner face side at Lighting Division 32 starts to be respectively arranged with successively a plurality of epimere illuminations 322, stage casing illumination 323 and hypomere illumination 324 from the summit side (arrow Z1 direction side) that is provided with peristome 321.Particularly, the position of epimere illumination 322 the tops at Lighting Division 32 (arrow Z1 direction) is provided with a plurality of in the mode of the periphery of encirclement peristome 321.Stage casing illumination 323 is the position of (arrow Z1 direction) in the positions of (arrow Z2 direction) below epimere illumination 322 and above hypomere illumination 324, is provided with a plurality of in the mode of surrounding epimere illumination 322.And hypomere illumination 324 position of (arrow Z2 direction) below stage casing illumination 323, be provided with a plurality of in the mode of surrounding stage casing illumination 323.

In addition, because Lighting Division 32 is dome-shaped, as shown in Figure 5, along with from epimere illumination 322 downward (arrow Z2 direction), the position of illumination is away from shoot part 31(peristome 321).Therefore, 322 pairs of reference objects of epimere illumination (appointed area on installation base plate 110) are from the position irradiating illumination light of (arrow Z1 direction) directly over roughly.So the direction of illumination of epimere illumination 322 and the shooting direction of shoot part 31 are roughly same direction.In addition, stage casing illumination 323 from vergence direction (approximately 45 degree) to reference object irradiating illumination light.And 324 pairs of reference objects of hypomere illumination are with the about irradiating angle irradiating illumination light of 30 degree.Accordingly, shoot part 31 can be used from the illumination light of differing heights (angle) irradiation and take same reference object.In addition, although not shown at Fig. 5, in the position with epimere illumination 322 roughly the same height, also be provided with comprise infrared LED infrared illumination 325(with reference to Fig. 4).Epimere illumination 322, stage casing illumination 323 and hypomere illumination 324 comprise respectively White LED etc., and infrared illumination 325 comprises infrared LED etc.

In addition, as shown in Figure 6, the 1st laser measurement section 33 comprises the illuminating part 33a with light-emitting components such as semiconductor lasers and the light accepting part 33b with optical position detecting element.The 1st 33 pairs, the laser measurement section measuring position on installation base plate 110, from illuminating part 33a irradiating laser, and is received in the normal reflection composition in the reflected light of measuring position reflection by light accepting part 33b.Now, by the reflected light that light accepting part 33b receives, on the optical position detecting element, form luminous point (focus), and detect this light spot position.According to the principle of triangulation can from detected light spot position calculate from the 1st laser measurement section 33 to measuring position apart from d1.Accordingly, according to the 1st laser measurement section 33 and the known position relationship of installation base plate 110, can measure the height H in measuring position 1 of installation base plate 110.In addition, in the 1st laser measurement section 33, the incident path of the laser irradiated from illuminating part 33a is angle [alpha] with the angle that the catoptrical reflection paths received by light accepting part 33b forms.

As shown in Figure 7, the 2nd laser measurement section 34 comprises the illuminating part 34a with light-emitting components such as semiconductor lasers and the light accepting part 34b with optical position detecting element.The 2nd 34 pairs, the laser measurement section measuring position on installation base plate 110, from the substantially vertical irradiating laser (arrow Z2 direction) of illuminating part 34a, and is received in the scattered reflection composition in the reflected light of measuring position reflection by light accepting part 34b.Therefore, in the 2nd laser measurement section 34, the incident path of the laser irradiated from illuminating part 34a is angle beta with the angle that the catoptrical reflection paths received by light accepting part 34b forms.In addition, the height measurement method of the 2nd laser measurement section 34 is the same with the 1st laser measurement section 33.These laser measurement sections with reference to the surface state of the mensuration part on installation base plate 110 (whether gloss few, whether be specular surface body or near minute surface), necessary measurement range and measuring accuracy etc. and suitably select.

In addition, as shown in Figure 4, at appearance inspection device 100, on the basis of above-mentioned inspection assembly 30, also be provided with X ray filming apparatus 35 and X ray illumination 35a.X ray filming apparatus 35 and X ray illumination 35a configures across installation base plate 110 above-below direction (Z direction) is upper, and is set up opposed to each other.And, by X ray filming apparatus 35, detect from X ray illumination 35a and irradiate and see through the X ray of installation base plate 110, thereby take the radioscopic image of installation base plate 110.By this radioscopic image, can obtain the state of scolder of the following side of the portion of terminal 121 that for example is positioned at element 120.

As shown in Figure 4, appearance inspection device 100 is controlled by control device 40.Control device 40 comprises arithmetic processing section 41, storage part 42, motor control part 43, outside input and output section 44, image processing part 45, measures handling part 46 and lighting control section 47.In addition, control device 40 is connected with not shown input equipment (touch-screen or keyboard etc.) with display unit 50, receives the operation input from the user.In addition, arithmetic processing section 41 is examples of " control part " of the present invention.

Arithmetic processing section 41 comprises the ROM(Read Only Memory of the CPU of actuating logic computing, the program that CPU is controlled in storage etc.) and at the RAM(Random Access Memory that installs interim store various kinds of data in service) etc.Arithmetic processing section 41, according to the program be stored in ROM, by motor control part 43, image processing part 45, measurement handling part 46 and lighting control section 47, is controlled each one of appearance inspection device 100.And, arithmetic processing section 41 is used shoot part 31, the 1st laser measurement section 33 and the 2nd laser measurement section 34 etc., carry out the inspection of the installment state of element 120, for each state shown in the state A to H of identification Fig. 3 of solder bonds section of the portion of terminal 121 of element 120 whether qualifiedly judging etc. of carrying out solder bonds section.

In addition, in the present embodiment, arithmetic processing section 41 is used the photographic images of the installation base plate 110 of shoot part 31, the zone (laser measurement exclusionary zone) that the 1st laser measurement section 33 that is not suitable for comprised in the judgement photographic images or the 2nd laser measurement section 34 measure.And arithmetic processing section 41 is from getting rid of this laser measurement exclusionary zone the measuring object (zone) of the 1st laser measurement section 33 or the 2nd laser measurement section 34.In addition, " laser measurement exclusionary zone " is an example of " being not suitable for the zone that laser measuring device for measuring is measured " of the present invention.

At this, the zone (laser measurement exclusionary zone) that is not suitable for the 1st laser measurement section 33 or 34 measurements of the 2nd laser measurement section is described.In this example that is measured as with the 2nd laser measurement section 34, describe.As shown in Figure 7, the laser irradiated from illuminating part 34a is reflected in measuring position, and reflected light (scattered reflection light) received by light accepting part 34b, carries out laser measurement with this.Therefore, while on the incident path of laser or reflection paths, having veil, can not measure or measuring accuracy descends.Particularly, situation of blocking of the F2 of hole section (recess) on the laser shown in Figure 8 situation of being blocked by veil F1 such as elements that installed, scolder 140 that laser shown in Figure 9 is formed on solder bonds section etc. belongs to this situation.When measuring these veils F1 and the F2 of hole section (recess), all due to the laser with specified angle (angle beta) reflection, be blocked halfway or in reasons such as veil F1 and the F2 of hole section reflection unwanted diffuse, likely can't measure or measuring accuracy descends.In addition, the F2 of hole section (recess) is an example of " being not suitable for the shape that laser measuring device for measuring is measured " of the present invention.

But, in the situation that veil F1, as shown in Figure 11 (A), (B) and Figure 12 (A), (B), even equating apart from d3 from measuring position to veil F1, according to the direction (from the direction of illuminating part 34a towards light accepting part 34b) of the 2nd laser measurement section 34, there is measurable situation and can not measure the situation of (or measuring accuracy decline).Namely, as shown in Figure 12 (B), in the near zone of veil F1, in limit E1 and E2 side along from illuminating part 34a, extending towards the direction A of light accepting part 34b, laser can not be blocked and can measure.On the other hand, as shown in Figure 11 (B), along and the limit E3 side of extending towards the direction of the direction A of light accepting part 34b quadrature from illuminating part 34a, thereby laser crested thing F1 blocks and can't measure or measuring accuracy descends.Now, near can't measure (measuring accuracy decline) E3 of limit the scope in zone is according to veil F1(element 120 etc.) height and the angle (angle beta or angle [alpha]) that forms of the incident path of laser and reflection paths and different.In addition, in the situation that the 2nd laser measurement section 34 of diffusion reflection pattern, due in limit E4 side, on incident path and on reflection paths, do not exist veil therefore can measure, but in the situation that the 1st laser measurement section 33 of normal reflection type, all there is the zone that can't measure in the E4 side on E3Ce He limit, limit.

In addition, as shown in figure 10, when being formed at precipitous the F3 etc. of solder bonds section (scolder 140), measuring position can be indefinite and cause measuring accuracy to descend when measuring position.In addition, can't measure when the angle of inclination of precipitous F3 and incident path almost parallel.In addition, at this precipitous F3, (direction of the 2nd laser measurement section 34 is when the depth direction of Figure 10) also can carry out laser measurement sometimes when the vergence direction on the direction of the 2nd laser measurement section 34 and inclined-plane is vertical.In the present embodiment, arithmetic processing section 41 is also considered the direction of laser measurement section (the 1st laser measurement section 33 and the 2nd laser measurement section 34) etc., near the zone the above-mentioned veil F1 of identification on 110, the zone etc. that has the zone of the F2 of hole section (recess) and have precipitous F3 on installation base plate, using these zones as the laser measurement exclusionary zone from eliminating laser measurement object (zone).In addition, precipitous example that F3 is " being not suitable for the shape that laser measuring device for measuring is measured " of the present invention.

Storage part 42 is by the storage that can carry out various data and can consisting of the Nonvolatile memory devices that arithmetic processing section 41 is read.In storage part 42, construct and be useful on the database of determining " laser measurement exclusionary zone " with photographic images.Data base logic ground possesses the transaction table group (transaction tables) that the data that obtain, generate, upgrade when controlling the master meter group (master tables) that required data preserve as information and will carry out control are preserved as information.Each table group is array (tuple, the storage area of the information that the table of single or multiple matrix forms OK) (entity) is corresponding that the logical relation (contact) according to appointment will be set with project (field or row) and set by each field.

In the master meter group, be set with the substrate data of preserving the mount message (position and direction etc.) in the design determine installation base plate 110 and to be arranged on the element 120 on substrate 130, determine to be arranged on the component shape data of the shape of the element 120 on installation base plate 110, about the data of the parameter (direction and incident path and the reflection paths etc. that comprise the 1st laser measurement section 33 and the 2nd laser measurement section 34) of each controlling element and be used to the zone of the sample data that calculates the laser measurement exclusionary zone, each data are stored in corresponding zone.As sample data, take example, take the view data such as example as precipitous shape of the shooting example of precipitous F3 as the hole section (recess) of the shooting example of the F2 of hole section (recess) such as storing respectively many cases.

On the other hand, in the transaction table group, being set with captured image data that storage taken by shoot part 31, by the image inspection of the inspection area to having in mind (laser measurement position), judge the shape of this element 120 that (with reference to the step S8 of the process flow diagram of Figure 13) generates, highly, the processing result image data such as position and direction, never the motor position data (mount message of shoot part 31) that obtain of illustrated scrambler and identify captured captured image data in the zone of measuring point data at the laser measurement position (inspection area) had in mind.

Arithmetic processing section 41 is passed through captured image data and hole section (recess) shape shooting example and precipitous shape shooting example that contrast is taken by shoot part 31, the laser measurement exclusionary zone ((recess) F2 of hole section and precipitous F3) comprised in the identification photographic images.In addition, arithmetic processing section 41 is by being used substrate data and component shape data, and according to captured image data, carry out image recognition, thereby identification is arranged on the element 120 on installation base plate 110, and obtain the shape of this element 120, highly, installation site and direction etc.And, arithmetic processing section 41 according to the shape of obtained element 120, highly, the data such as installation site and direction, known the 1st laser measurement section 33 and direction and incident path and the reflection paths of the 2nd laser measurement section 34, calculate near the laser measurement exclusionary zone veil F1.In addition, " hole section (recess) shape take example " and " precipitous shape taken example " is respectively an example of " about the information of the shape that is not suitable for laser measuring device for measuring mensuration " of the present invention.In addition, " component shape data " are examples of " about the information of the shape that is arranged on the electronic component on substrate " of the present invention.

Motor control part 43 bases are from the control signal of arithmetic processing section 41 outputs, the driving of each servomotor (for the Y-axis motor 22 that moves XY mechanical arm 20 along Y-direction, the X-axis motor 23 for move XY mechanical arm 20 along directions X, the motor (not shown) be used to driving substrate transferring travelling belt 10) of control appearance inspection device 100 etc.In addition, motor control part 43, according to the signal of the scrambler (not shown) from each servomotor, obtains each measuring position of the camera site, the 1st laser measurement section 33 and the 2nd laser measurement section 34 that check assembly 30(shoot part 31) and the position of installation base plate 110 etc.

Outside input and output section 44 is by be used to constructing the formations such as interface (interface) of the networks such as wired or wireless LAN.Other devices (not shown) on outside input and output section 44 and the production line that carries out installation base plate 110 and the main frame (not shown) of the control of production line integral body etc. are connected by network, have the function of carrying out information communication.

Image processing part 45 is according to the control signal from arithmetic processing section 41 outputs, from shoot part 31 and X ray filming apparatus 35, read the shooting signal by the time in appointment, and the image that the shooting signal of reading is carried out to appointment is processed, be suitable for identification (image recognition) element 120 of installation base plate 110 and the captured image data of solder bonds section (scolder 140) thereby generate.

Measure handling part 46 bases by the 1st laser measurement section 33 or the 2nd detected light spot position of laser measurement section 34, calculate from the 1st laser measurement section 33 to measuring position apart from d1 or from the 2nd laser treatment section 34 to measuring position apart from d2, obtain the height H 1 of the measuring position on installation base plate 110.

Lighting control section 47, according to the control signal from arithmetic processing section 41 outputs, makes each epimere illumination 322, infrared illumination 325, stage casing illumination 323 and the hypomere illumination 324 of Lighting Division 32 and X ray illumination 35a light in the time of appointment.

Below, with reference to Fig. 2, Fig. 3, Fig. 5 and Figure 13 to Figure 17, the inspection action of the installation base plate 110 of the appearance inspection device 100 of one embodiment of the present invention is described.In addition, inspection action shown below is undertaken by each one of the arithmetic processing section 41 control appearance inspection devices 100 of control device 40.In addition, main laser measurement to the 1st laser measurement section 33 or the 2nd laser measurement section 34 below (highly measuring) and the computing of laser measurement exclusionary zone describe.

At first, as shown in figure 13, at step S1, installation base plate 110 by substrate transferring travelling belt 10 by conveyance to the inspection position of appointment and be fixed.Then, at step S2, by arithmetic processing section 41, XY mechanical arm 20 is driven, and shoot part 31 is moved to the top of reference mark (fiducial mark) position of the appointment on installation base plate 110.Then, by shoot part 31, take the not shown reference mark that is formed at assigned address.At step S3, the captured image data by 41 pairs of reference marks of arithmetic processing section carries out image recognition, thereby carries out the position correction of installation base plate 110.Accordingly, the position coordinates of appearance inspection device 100 and installation base plate 110(substrate data) on position corresponding, complete the preparation that checks processing.Below, at step S4, to step S9, use the inspection of installment state of the photographic images of the installation base plate 110 that shoot part 31 takes to process.

At step S4, by arithmetic processing section 41 judgement, whether there is the zone (not shooting area) of the shooting of not carrying out shoot part 31 on installation base plate 110.That is, because the coverage (visual field) of shoot part 31 is limited to certain limit, therefore the shooting of installation base plate 110 is divided into a plurality of appointed areas and separately repeatedly takes and carry out.Therefore, judge whether to exist not shooting area at step S4, when having not shooting area, advance to step S5.On the other hand, when the Zone Full on installation base plate 110 has been taken when shooting area (do not exist not), be transferred to step S10.

When having not shooting area, at step S5, by arithmetic processing section 41, XY mechanical arm 20 is driven, and according to the substrate data in the database that is stored in storage part 42, shoot part 31 is moved to the camera site be used to the appointment of taking next shooting area.

Then, at step S6, take the appointed area (inspection area) on installation base plate 110 by shoot part 31.Epimere illumination 322, infrared illumination 325, stage casing illumination 323 and the hypomere illumination 324 of Lighting Division 32 used respectively in the shooting of shoot part 31, and same shooting area is added up to and carries out four times.Photographic images is treated to the captured image data that is suitable for identifying (image recognition) by image processing part 45, and is output to arithmetic processing section 41.

Below, at step S7, arithmetic processing section 41 is carried out the image recognition of captured image data, thus identification is photographed the position (inspection area) that the interior element 120 of captured image data (shooting area) and solder bonds section etc. check object.Then, to each inspection area, according to the substrate data be stored in storage part 42, detect the installation site deviation (installation site is with respect to the deviation of design attitude) of element 120 and direction and portion of terminal 121 and have or not crooked and erect etc.In addition, detect position and the shape of solder bonds section.When image recognition completed, captured image data was stored in storage part 42.

Then, at step S8, to the inspection area in shooting area, according to the position of the position deviation of detected element 120 and direction, solder bonds section and shape etc., check judgement (whether qualified judgement).For solder bonds section, by image recognition, the defective state defective states such as (not welding, scolder position deviation, wire) floating shown in state D, state E, state F and the state G of identification Fig. 3.On the other hand, each state shown in the state A of Fig. 3, state B, state C and state H, be difficult to identify according to the captured image data to installation base plate 110 (arrow Z1 direction) shooting from substantially vertical top.Therefore, for the inspection area that is equivalent to each state shown in state A, state B, state C and state H (solder bonds section), be judged to be certified products and as the object of the later laser measurement of step S10 described later.Therefore, by this image inspection, judge, the whether qualified of inspection area judged for the first time, and, for laser measurement described later, generate the positional information (position, direction and position deviation amount etc.) of the element 120 that is judged to be certified products and the positional information of solder bonds section etc. as processing result image.

Then, at step S9, determine whether and have not inspection area by the inspection area in 41 pairs of shooting areas of arithmetic processing section (captured image data).When in shooting area (captured image data) during the residual inspection area finish checked, turn back to step S7, this inspection area is carried out image recognition and checks judging.When all inspection areas in shooting area (captured image data) finish to check when inspection area (do not exist not), be transferred to step S4, again determine whether and have not shooting area.By so repeatedly carrying out step S4 to step S9, thereby each shooting area on installation base plate 110 is taken, each inspection area in shooting area is carried out to the inspection based on captured image data.Its result, at step S4, be judged to be (while advancing to step S10) while not having not shooting area, at installation base plate 110 on the whole, determine that the positional information as the solder bonds section of the element 120 of the object of laser measurement and this element 120 is used as processing result image (with reference to step S8).Step S10 to S15 afterwards, carry out laser measurement to each inspection area that is judged to be certified products by image inspection.

Therefore, at step S10, by arithmetic processing section 41, determine whether the element 120(solder bonds section that has the laser measurement object).When the element 120(solder bonds section that has the laser measurement object) time, advance to step S11.

At step S11, among the element 120 of laser measurement object, be conceived to an element 120, determine whether that existence do not carry out the inspection area of laser measurement (not carrying out the position of laser measurement).That is, as shown in Figure 2, when in element 120, having a plurality of portion of terminal 121, the solder bonds section (inspection area) of each portion of terminal 121 is carried out to laser measurement.When the position of laser measurement is not carried out in existence, advance to step S12, among laser measurement position (carrying out the position of laser measurement), again be not conceived to a laser measurement position, carry out the calculating of the laser measurement exclusionary zone in this laser measurement position.At this, with reference to Figure 14, the computing (subroutine) of laser measurement exclusionary zone is elaborated.

As shown in figure 14, at first, at step S21, by arithmetic processing section 41, obtain the positional information at laser measurement position.Particularly, use transaction table group's processing result image data, motor position data (mount message of shoot part 31) and the captured image data of taking the laser measurement position (inspection area) of having in mind, calculate be used to carrying out the mount message accurately of laser measurement.Now, for example shown in Figure 15, even the position of the element in substrate data 120 (design attitude of element 120, with reference to dotted line), for carrying out the position of laser measurement, also there will be situation about can't measure when the installation site deviation occurs element 120.Therefore, according to the positional information accurately of the installation site deviation that comprises the element 120 calculated (or deviation of the coating position of scolder), carry out the calculating of laser measurement exclusionary zone.

Then, at step S22, by arithmetic processing section 41, light and shade (the light intensity value difference is different) is carried out in the laser measurement position (inspection area) of having in mind and judge.Now, each captured image data of the RGB of use epimere illumination 322 shootings is used to the judgement of light and shade.As shown in Figure 5, when using epimere illumination 322, from be configured in reference object directly over the roughly the same direction irradiating illumination light of the shooting direction of shoot part 31, therefore the reflected light in smooth regional reflex is easy to arrive shoot part 31 most, and the illumination light of the uneven area illumination such as hole section, precipitous is easy to reflect to side.Therefore, by use, be used to the captured image data of taking from the illumination light of the top of epimere illumination 322, the light intensity in the zones such as hole section, precipitous reduces (dimmed), and the light intensity of par improves (brightening).At step S22, light intensity difference (contrast) according to the laser measurement position in this photographic images, detect light intensity difference for certain above zone, it is judged to be to the zone (zone that light intensity is low) that likely is not suitable for laser measurement and the zone (zone that light intensity is high) that is suitable for laser measurement.In the present embodiment, for the captured image data that uses this epimere illumination 322 to take, use utilizes each captured image datas that stage casing illumination 323 and hypomere illumination 324 take and combines captured image data and obtains difference etc. and further carry out the image processing, thereby each regional light and shade (light intensity difference) is clearer.

At this, as shown in figure 16, in the laser measurement position comprised in captured image data, the situation that is conceived to the J1 of solder bonds section describes.Light and shade (the light intensity value difference is different) by the J1 of solder bonds section to step S22 is judged, from the J1 of solder bonds section, obtaining bright area R1 and R2 and the low dark areas D1 to D4 of intensity level that intensity level is high.In addition, in Figure 15 to Figure 17, mean bright area with white (plain color), with oblique line (hachure), mean dark areas, but actual photographic images for example has the intensity distributions of 256 gray scales.Therefore, in actual photographic images, in bright area and in dark areas, also there is intensity distributions separately, in the judgement of step S23 to S28 afterwards, judge according to the intensity distributions in zone.

Then, at step S23, be conceived to a zone among each zone (bright area R1 and R2 and dark areas D1 to D4) of judging, take a decision as to whether than dark on every side zone (dark areas).For example, when the zone of having in mind (, bright area R1) is not (bright area) during than dark on every side zone (dark areas), advance to step S24, be judged to be the zone that can carry out laser measurement.On the other hand, for example, when the zone of having in mind (, dark areas D1) is during than dark zone (dark areas), advance to step S25 on every side.

At step S25, by arithmetic processing section 41, judge whether the zone (dark areas D1) of having in mind is hole section (recess).Particularly, by arithmetic processing section 41, relatively the captured image data in the zone (dark areas D1) had in mind of contrast is taken example (sample data) with hole section (recess) shape in the master meter group who is stored in storage part 42 and is determined whether that to take example consistent or be similar to hole section (recess) shape, thereby judges whether the zone (dark areas D1) of having in mind is hole section (recess).For example, the hole section formed in solder bonds section because of bubble etc. etc., typically be taken as the dark areas of circular, and therefore this dark areas is judged as hole section.When judging that the zone (dark areas D1) had in mind is as hole section (recess), advance to step S28, be judged to be the laser measurement exclusionary zone.On the other hand, when the zone (dark areas D1) that judgement is had in mind is not hole section (recess), advance to step S26.

At step S26, by arithmetic processing section 41, judge whether the zone (dark areas D1) of having in mind is precipitous section.Particularly, by arithmetic processing section 41, relatively the captured image data in the zone (dark areas D1) had in mind of contrast is taken example (sample data) with precipitous shape in the master meter group who is stored in storage part 42 and is determined whether that to take example consistent or be similar to precipitous shape, thereby judges whether the zone (dark areas D1) of having in mind is precipitous section.For example, in the precipitous section that solder bonds section forms, owing to being taken as the dark areas improved gradually towards assigned direction (direction of fall on inclined-plane) intensity level from the low part of intensity level (precipitous part), therefore judge that this dark areas is precipitous section.In addition, according to the vergence direction of this precipitous section and the direction of the 1st laser measurement section 33 and the 2nd laser measurement section 34, can determine whether and can carry out laser measurement.When judging that the zone (dark areas D1) had in mind is as precipitous, advance to step S28, be judged to be the laser measurement exclusionary zone.On the other hand, when the zone (dark areas D1) that judgement is had in mind is not precipitous while being judged to be measurable precipitous (or), advance to step S27.

At step S27, by arithmetic processing section 41, judge near the veil that whether exists in the zone (dark areas D1) of having in mind.Now, by arithmetic processing section 41, with reference to position deviation, processing result image, component shape data and the substrate data of the element 120 of obtaining at step S21.Then, according to the direction of these data, the 1st laser measurement section 33 or the 2nd laser measurement section 34 and the angle (α or β) of incident path and reflection paths formation, judge near the laser measurement exclusionary zone that veil is.For example shown in Figure 16, the bright area R2 of the solder bonds J1 of section as can be known is the part of element 120.Therefore, at the near zone of this bright area R2, sometimes can't measure according to kind and the direction of the laser measurement section of the height of element 120, use.In this case, near being judged to be, veil is arranged, advance to step S28, be judged to be the laser measurement exclusionary zone.On the other hand, when neighbouring while not having veil, although be dark areas, but by step S25 to S27, being judged to be, not hole section (recess), neither precipitous section, and neighbouringly there is no a barrier yet, thereby be transferred to step S24, be judged to be the zone that can carry out laser measurement.

As mentioned above, for the zone of having in mind (for example: dark areas D1), when at step S24, being judged to be the zone that can carry out laser measurement, or, when step S28 is judged to be the laser measurement exclusionary zone, then advance to step S29.At step S29, by arithmetic processing section 41, judge whether the Zone Full (bright area R1 and R2, dark areas D1 to D4) in the laser measurement position (J1 of solder bonds section) of having in mind is completed to judgement.When having do not judge regional, advance to step S23, (for example: dark areas D2) carry out the processing (whether being to carry out the zone of laser measurement or the judgement of laser measurement exclusionary zone) of step S23 to S28 be conceived to next zone.On the other hand, when the All Ranges of the bright area R1 to scolder junction surface J1 and R2 and dark areas D1 to D4 has carried out judgement, the computing of end to the laser measurement exclusionary zone at the laser measurement position (J1 of solder bonds section) had in mind, turn back to the later processing of step S13 of Figure 13.

As shown in figure 13, at step S13, be moved to be used to carrying out the laser measurement position of laser measurement by arithmetic processing section 41 driving XY mechanical arm 20, the 1 laser measurement sections 33 or the 2nd laser measurement section 34.In addition, use which in the 1st laser measurement section 33 or the 2nd laser measurement section 34, preset according to the kind of element 120.Therefore, for example when being set as the laser measurement position (J1 of solder bonds section) had in mind while by the 2nd laser measurement section 34, measuring, the 2nd laser measurement section 34 is moved to the laser measurement position (J1 of solder bonds section) of having in mind.

Then, at step S14, the measurement of the laser measurement position of for example having in mind by the 2nd laser measurement section 34 (J1 of solder bonds section).Now, actual is the zone of removing the laser measurement exclusionary zone calculated at step S12 as measuring object.Therefore, as shown in figure 17, when the dark areas D1 to D4 of the J1 of solder bonds section all is judged as the laser measurement exclusionary zone, remove these dark areas D1 to D4(laser measurement exclusionary zone) the Zone Full of bright area R1 become the laser measurement subject area.In addition, the dot pattern ground shown in bright area R1 means the laser measurement position.Therefore in addition, due to bright area R2, be the part of element 120, from the measuring object at the laser measurement position (J1 of solder bonds section) had in mind, getting rid of.So, by from the laser measurement object, removing the laser measurement exclusionary zone calculated at step S12, thereby the area of laser measurement subject area becomes roughly half among the laser measurement position of having in mind (J1 of solder bonds section).By this laser measurement, obtain the maximum height in the measuring object zone (bright area) of the J1 of solder bonds section.In addition, according to the elevation information (outer shape) of each measuring position in the measuring object obtained by laser measurement zone (bright area), the scolder volume of inferring the J1 of solder bonds section.

When step S14 finishes laser measurement, at step S15, the determination processing of being undertaken based on measured value by arithmetic processing section 41.Namely, for the laser measurement position of having in mind (J1 of solder bonds section), according to the maximum height of measuring object zone (bright area), the scolder volume of inferring, judge that the suitable shape of state A(, the amount of solder that meet Fig. 3 are slightly few), the suitable shape of state B(, amount of solder be suitable), state C(amount of solder is few) and state H(amount of solder many) which.Accordingly, for the inspection by based on captured image data, judge that (with reference to step S8) is judged to be the solder bonds section of certified products, can judge each state A, state B, state C and state H in more detail by laser measurement.In addition, accordingly, can detect as the state C(amount of solder of whether qualified boundary few) and state H(amount of solder many), and differentiate respectively whether qualified.

Then, turn back to step S11, to the element 120(that has in mind with reference to Figure 15) determine whether that existence do not carry out the position of laser measurement.Accordingly, when in the element 120 shown in Figure 15, scolder junction surface J2 not being carried out to laser measurement, then be conceived to the J2 of solder bonds section, carry out the processing of step S12 to S15.On the other hand, when there is not the position of not carrying out laser measurement in the element 120 of having in mind, turn back to step S10.

Then, at step S10, by arithmetic processing section 41, determine whether the element 120(solder bonds section that has other laser measurement objects).When the element 120(solder bonds section that has the laser measurement object) time, advance to step S11.So, for the element 120(solder bonds section of all laser measurement objects), each laser measurement position is calculated respectively to the laser measurement exclusionary zone, and carry out laser measurement.On the other hand, element 120(solder bonds section for all laser measurement objects), when laser measurement finishes, at step S10, be judged as the element that does not have the laser measurement object, thereby finish the inspection action of the installation base plate 110 of appearance inspection device 100.Then, the installation base plate 110 that finishes to check is taken out of by substrate transferring travelling belt 10, and moves into the next thing (installation base plate 110) that checks.Accordingly, the inspection to checking thing (installation base plate 110) of carrying out appearance inspection device 100 is moved.

In the present embodiment, as mentioned above, by using the photographic images of the inspection thing (installation base plate 110) of being taken by shoot part 31, judge the laser measurement exclusionary zone in photographic images, from the measuring object of the 1st laser measurement section 33 or the 2nd laser measurement section 34, getting rid of the laser measurement exclusionary zone, thereby can use the photographic images of the inspection thing (installation base plate 110) of being taken by shoot part 31, at the F2 of hole section that gets rid of solder bonds section, on the basis of precipitous the laser measurement exclusionary zone such as F3, carry out the measurement of the 1st laser measurement section 33 or the 2nd laser measurement section 34.Accordingly, different when whole from laser measurement positions such as the 1st laser measurement section 33 of passing through or the 2nd 34 mensuration solder bonds sections (J1 and J2) of laser measurement section, owing to having got rid of the laser measurement exclusionary zone, can make the degree of the area reducing laser measurement exclusionary zone of actual measured zone, therefore in fact the elevation measurement point of scan laser measurement reduces, and can measure at short notice.In addition, in the F2 of hole section of solder bonds section (J1 and J2), precipitous laser measurement such as F3, the zone that is not suitable for measuring (laser measurement exclusionary zone) that eliminating can not be measured or measuring accuracy may descend in advance, therefore only carry out the measurement of the 1st laser measurement section 33 or the 2nd laser measurement section 34 to remaining zone (laser measurement subject area, bright area R1).Its result, owing in measurement result, can not mixing measured value and the measuring error that precision is low, therefore, while using the 1st laser measurement section 33 or the 2nd laser measurement section 34 to carry out the inspection of installment state of electronic component (element 120), also can carry out high-precision measurement.

In addition, in the present embodiment, as mentioned above, by appointment, remove zone (bright area R1) integral body of laser measurement exclusionary zone, and carry out the measurement of the 1st laser measurement section 33 or the 2nd laser measurement section 34, thereby on the basis of having got rid of the laser measurement exclusionary zone, by measuring remaining Zone Full (bright area R1) thus can improve measuring accuracy.

In addition, in the present embodiment, as mentioned above, by at least for the J1(J2 of solder bonds section of the element 120 on the printed base plate 130 checked among thing (installation base plate 110)), use the photographic images of the installation base plate 110 of shoot part 31 shootings, judge the laser measurement exclusionary zone, thereby the F2 of hole section caused because of bubble etc. measuring accuracy impacted for easy generation, the J1(J2 of solder bonds section of the element 120 in precipitous F3 and crack etc.), can judge and get rid of the laser measurement exclusionary zone, therefore can improve measuring accuracy and shorten minute.

In addition, in the present embodiment, as mentioned above, by the laser measurement exclusionary zone, comprise at least the zone of the shape (F2 of hole section and precipitous F3) that is shaped as the 1st laser measurement section 33 that is not suitable for or the 2nd laser measurement section 34 mensuration of the measuring point of installation base plate 110 (J1 of solder bonds section), thereby according to photographic images, detect the shape (F2 of hole section and precipitous F3) likely measuring accuracy impacted, be not suitable for the 1st laser measurement section 33 or 34 measurements of the 2nd laser measurement section, and can get rid of as the laser measurement exclusionary zone.

In addition, in the present embodiment, as mentioned above, by making arithmetic processing section 41, use hole section (recess) shape to take example and precipitous shape shooting example, detect the shape that the 1st laser measurement section 33 that is not suitable for that comprises in the photographic images of installation base plate 110 or the 2nd laser measurement section 34 measure, thereby the captured image data of the installation base plate 110 of shoot part 31 is relatively contrasted with sample data and determine whether with to take example (hole section (recess) shape takes example and precipitous shape taken example) consistent or be similar to, thereby can easily detect the shape that the 1st laser measurement section 33 that is not suitable for that comprises in the photographic images of installation base plate 110 or the 2nd laser measurement section 34 measure.

In addition, in the present embodiment, as mentioned above, by making the installation base plate 110(inspection area of arithmetic processing section 41 according to shoot part 31) photographic images and substrate data, calculate the installation site deviation of element 120, installation site deviation according to the element 120 calculated, judge the laser measurement exclusionary zone, even thereby because being arranged on the installation site deviation of the element 120 on printed base plate 130, laser is by element 120(veil when carrying out laser measurement) block and the zone that can't carry out the measurement of the 1st laser measurement section 33 or the 2nd laser measurement section 34, also it can be got rid of.

In addition, in the present embodiment, as mentioned above, by the basis light intensity difference (contrast) of the photographic images of installation base plate 110, judge the laser measurement exclusionary zone, thereby the F2 of hole section in the solder bonds section of photographic images, the zone such as precipitous F3, around strength ratio low (dimmed) and be arranged in the zone under the shade (dimmed) of highly large element 120, sometimes also can be blocked and can't measure by highly large element 120 owing to carrying out laser measurement, therefore according to the strength difference in photographic images, judge the laser measurement exclusionary zone, thereby can easily judge the laser measurement exclusionary zone.

In addition, in the present embodiment, as mentioned above, by making shoot part 31 use the illumination light of epimere illumination 322, from the top of installation base plate 110, take, thereby can reduce (dimmed) hole F2 of section, precipitous F3 etc., be not suitable for the intensity in the zone of laser measurement, and can improve the intensity that (brightening) is suitable for the par of laser measurement.Accordingly, owing to can enlarging the zone that is suitable for laser measurement and the intensity difference (contrast) in unaccommodated zone, therefore can, according to the strength difference in photographic images, more easily judge the laser measurement exclusionary zone.

In addition, in the present embodiment, as mentioned above, the F2 of hole section and precipitous F3 of being formed at solder bonds section are got rid of as the shape that is not suitable for laser measurement, thereby, especially for the solder bonds section (J1 and J2) of the element 120 that is easy to form the shape that is not suitable for laser measurement, measuring accuracy is easy to impact, the zone with shape of the F2 of hole section that is not suitable for laser measurement and precipitous F3 can be got rid of as the laser measurement exclusionary zone.

In addition, in the present embodiment, as mentioned above, by basis, be stored in the component shape data in storage part 42, the incident path of the laser located on will be from the 1st laser measurement section 33 or the 2nd laser measurement section 34 to installation base plate 110 or the zone (near the zone veil F1) that reflection paths is likely blocked by veil F1 such as elements 120, be judged to be the laser measurement exclusionary zone, thereby because of the element 120 by highly large, block can not check the time etc. when carrying out laser measurement, according to the component shape data, easily near zone of decision element 120 etc. is not suitable for the zone (laser measurement exclusionary zone) of laser measurement.

In addition, in the present embodiment, as mentioned above, according to from the 2nd 34(of laser measurement section the 1st laser measurement section 33) illuminating part 34a(33a) towards light accepting part 34b(33b) and direction A(the 2nd 34(of laser measurement section the 1st laser measurement section 33) direction), the regional determination that the incident path of laser or reflection paths likely are blocked is the zone (laser measurement exclusionary zone) that is not suitable for laser measurement, thereby can consider the illuminating part 34a(33a from appearance inspection device 100) towards light accepting part 34b(33b) the basis of direction A judge the laser measurement exclusionary zone.Namely, as Figure 11 and shown in Figure 12, according to from illuminating part 34a(33a) towards light accepting part 34b(33b) direction A(the 2nd 34(of laser measurement section the 1st laser measurement section 33) direction) produce while being not suitable for laser measurement regional, this on the basis of the photographic images of installation base plate 110 also according to the 1st known laser measurement section 33 or the direction of the 2nd laser measurement section 34, can get rid of in advance the zone (laser measurement exclusionary zone) that is not suitable for laser measurement.

In addition, in the present embodiment, as mentioned above, according to the kind of the laser measurement section of measuring, be normal reflection type the 1st laser measurement section 33 or diffusion reflection pattern the 2nd laser measurement section 34, the regional determination that the incident path of laser or reflection paths likely are blocked is the zone (laser measurement exclusionary zone) that is not suitable for laser measurement.By this structure, as shown in Figure 6 and Figure 7, due to the angle α formed according to the 1st 33(of laser measurement section incident path and reflection paths) with the angle β of the 2nd 34(of laser measurement section incident path with reflection paths formation), therefore the incident path of laser is different with reflection paths, can consider the kind of laser measurement section and judges the zone (laser measurement exclusionary zone) that is not suitable for laser measurement.Accordingly, when the zone that the kind according to laser measurement section is not suitable for laser measurement produces difference (while measuring near the limit E4 of veil F1, with reference to Figure 11), on the basis of the photographic images of installation base plate 110, also according to the kind of laser measurement section, can judge in advance and get rid of the zone (laser measurement exclusionary zone) that is not suitable for laser measurement.

In addition, will be understood that the disclosed embodiment of this instructions is example, does not limit the present invention.The present invention's interest field required for protection is not the explanation of above-mentioned embodiment but means by claims, and then comprises all changes in the scope of purport of claims.

For example, in the above-described embodiment, show the example that the solder bonds section of the element 120 of installation base plate 110 (J1 and J2) is carried out to the judgement of laser measurement exclusionary zone, but the present invention is not limited to this.For example, also can, when the coating states such as warpage, fluctuating, binding resin and sealant of the portion of terminal 121 to beyond the scolder junction surface, element 120, substrate 110 self etc. carry out laser measurement, carry out the judgement of laser measurement exclusionary zone.Also can, for all sites of the measuring object as checking thing (installation base plate 110), carry out the judgement of laser measurement exclusionary zone.

In addition, in the above-described embodiment, show element 120 is bonded on to the example that the installation base plate 110 on printed base plate 130 checks as the inspection thing by scolder, but the present invention is not limited to this.For example, the substrate of the state before being engaged by scolder for element, also can carry out the inspection of the installment state of element.

In addition, in the above-described embodiment, show the shooting direction of shoot part 31 example substantially vertical with installation base plate 110, but the present invention is not limited to this.In the present invention, shoot part also can be taken and check thing from substantially vertical direction vergence direction in addition.

In addition, in the above-described embodiment, show the example that normal reflection type the 1st laser measurement section 33 and diffusion reflection pattern the 2nd 34 two kinds of laser measurement sections of laser measurement section are set at appearance inspection device 100, but the present invention is not limited to this.In the present invention, also can on appearance inspection device, only arrange in normal reflection type the 1st laser measurement section 33 and diffusion reflection pattern the 2nd laser measurement section 34 any one of them.

In addition, in the above-described embodiment, showing photographic images, hole section (recess) shape according to installation base plate 110 takes example and precipitous shape and takes the direction of example, the 1st laser measurement section 33 or the 2nd laser measurement section 34 and incident path and the angle of reflection paths formation, the various data such as position deviation, processing result image, component shape data and substrate data of element 120, judge the example of laser measurement exclusionary zone, but the present invention is not limited to this.In the present invention, use at least the photographic images that checks thing (installation base plate) to judge that the laser measurement exclusionary zone gets final product.Therefore, for example according to the direction of laser measurement section and the angle of incident path and reflection paths formation, the laser measurement exclusionary zone can be do not judged yet, according to the installation site deviation of element 120, the laser measurement exclusionary zone can be do not judged yet.

In addition, in the above-described embodiment, show in the laser measurement position of having in mind (J1 of solder bonds section), only will remove dark areas D1 to D4(laser measurement exclusionary zone) bright area R1 as the example of laser measurement object, but the present invention is not limited to this.In the present invention, also can remove dark areas D1 to D4(laser measurement exclusionary zone) basis on, further only for the part of bright area R1, carry out laser measurement.Now, owing to can further dwindling the area of laser measurement subject area, therefore can in shorter time, carry out laser measurement.

In addition, in the above-described embodiment, show the example of (recess) F2 of hole section of solder bonds section and precipitous F3 being got rid of to (being judged to be the laser measurement exclusionary zone), but the present invention is not limited to this.In the present invention, also can be only by the hole section (recess) of solder bonds section and precipitous any one of them be judged to be the laser measurement exclusionary zone.The shape decision that in addition, also can these be not suitable for to laser measurement is the laser measurement exclusionary zone.

In addition, in the above-described embodiment, show and according to hole section (recess) shape, take example and precipitous shape and take routinely, (recess) F2 of hole section of solder bonds section and precipitous F3 are judged to be to the example of the shape that is not suitable for laser measurement, but the present invention is not limited to this.For example, also can using take hole section (recess), light intensity distribution patterns precipitous the time as information registration in the master meter group, and based on this information, whether consistent with the pattern of the information of logining or approximate according to the intensity distributions in the zone of having in mind in photographic images, judge the shape that is not suitable for laser measurement.

In addition, in the above-described embodiment, show in the mensuration of the light and shade when carrying out the judgement of laser measurement exclusionary zone, for the captured image data that uses epimere illumination 322 to take, also use to utilize each captured image datas that stage casing illumination 323 and hypomere illumination 324 take and to combine captured image data and obtain difference etc. and carry out the image processing, thereby make more clearly example of each regional light and shade (light intensity difference), but the present invention is not limited to this.In the present invention, also can only use the captured image data that utilizes the epimere lighting shooting, carry out the judgement of light and shade.In addition, also can only use the captured image data that utilizes stage casing illumination, hypomere illumination or infrared illumination to take, carry out the judgement of light and shade.In addition, also can judge according to the tone of the coloured image of taking.

In addition, in the above-described embodiment, show the example that epimere illumination 322, stage casing illumination 323 and hypomere illumination 324 are set at Lighting Division 32, but the present invention is not limited to this.For example, also can only by the epimere illumination, be formed the illumination of Lighting Division.

In addition, in the above-described embodiment, show and substrate data, component shape data, hole section (recess) shape shooting example and precipitous shape shooting example etc. are stored in to the example of storage part 42 for the various data of the judgement of laser measurement exclusionary zone, but the present invention is not limited to this.For example, also can be by the various data of the judgement for the laser measurement exclusionary zone, via outside input and output section 44, be stored in main frame that network connects etc., and obtain as required.

In addition, in the above-described embodiment, show the inspection assembly 30 that makes to comprise shoot part 31, Lighting Division 32, the 1st laser measurement section 33 and the 2nd laser measurement section 34 etc., by the example of XY mechanical arm 20 along XY direction (horizontal direction) movement, but the present invention is not limited to this.For example, inspection group's part is only moved along directions X, and on the Substrate table that can move along Y-direction, installation base plate is moved along Y-direction.In addition, also can check that assembly is fixedly installed on the position of installation base plate top, and on the Substrate table that can move along XY direction (horizontal direction), installation base plate be moved along the XY direction.

In addition, in the above-described embodiment, show the example that is formed the 1st laser measurement section 33 and the 2nd laser measurement section 34 by the laser measuring device for measuring that uses some laser, but the present invention is not limited to this.For example, also can be formed by the laser measuring device for measuring that uses line laser.Now, judge and do not exist on line laser measurement exclusionary zone or few zone the mensuration of laser measurement exclusionary zone highly to get final product.In addition, if extract data out from the line data of measuring height, removing the determination data of laser measurement exclusionary zone, data are processed and are become rapidly, and can obtain the data that reliability is high.

Claims (12)

1. testing fixture comprises:

Shoot part, take and check thing;

Laser measuring device for measuring, also receive the reflected light from described inspection thing by the measuring position irradiating laser on described inspection thing, measures the height of described inspection thing, and described testing fixture also is characterised in that and comprises:

Control part, at least use the photographic images of the described inspection thing of being taken by described shoot part, judge the zone that described laser measuring device for measuring is measured that is not suitable for comprised in described photographic images, and be not suitable for from the measuring object of described laser measuring device for measuring, getting rid of the zone that described laser measuring device for measuring is measured

Described laser measuring device for measuring comprises: the illuminating part that described inspection thing is penetrated to laser; And the catoptrical light accepting part that receives described inspection thing reflection, wherein,

Described control part, according to from the direction of described illuminating part towards described light accepting part, by the zone that the incident path of the laser from described illuminating part to described inspection thing or the catoptrical reflection paths from described inspection thing to described light accepting part likely are blocked, be judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.

2. testing fixture according to claim 1 is characterized in that:

Described control part, for from described photographic images, having got rid of described at least a portion that is not suitable for the zone behind zone that laser measuring device for measuring measures, carry out the measurement of described laser measuring device for measuring.

3. testing fixture according to claim 1 is characterized in that:

The described zone that is not suitable for the laser measuring device for measuring measurement comprises that at least being shaped as of described inspection thing is not suitable for the zone of the shape of described laser measuring device for measuring mensuration.

4. testing fixture according to claim 3 is characterized in that:

Described control part, used the information about the shape that is not suitable for described laser measuring device for measuring mensuration, detects the described shape that is not suitable for laser measuring device for measuring mensuration comprised in described photographic images.

5. testing fixture according to claim 1 is characterized in that:

Described control part, according to the light intensity difference in described photographic images, judge the described zone that laser measuring device for measuring is measured that is not suitable for.

6. testing fixture according to claim 5 characterized by further comprising:

Lighting Division, from the top irradiating illumination light of described inspection thing, wherein,

Described shoot part, used the illumination light of being irradiated from the top of described inspection thing by described Lighting Division, takes from the top of described inspection thing.

7. testing fixture according to claim 1 is characterized in that:

Described inspection thing is the installation base plate that electronic component is installed on substrate,

Described control part, in described inspection thing, being positioned at the solder bonds section of the electronic component on described substrate, used described photographic images at least, judges the described zone that laser measuring device for measuring is measured that is not suitable for.

8. testing fixture according to claim 7 is characterized in that:

The described zone that is not suitable for the laser measuring device for measuring measurement comprises that at least being shaped as of described inspection thing is not suitable for the zone of the shape of described laser measuring device for measuring mensuration,

Described be not suitable for shape that laser measuring device for measuring measures be included in formed hole section in solder bonds section and precipitous at least one of them.

9. testing fixture according to claim 7 is characterized in that:

Described control part, further according to the information about the shape that is arranged on the electronic component on described substrate, by the incident path of the laser from described laser measuring device for measuring to described inspection thing or from the zone that the catoptrical reflection paths of described inspection thing is likely blocked by described electronic component, be judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.

10. testing fixture according to claim 7 is characterized in that:

Described control part, according to described photographic images, calculate the installation site deviation of the design and installation position of the installation site that is arranged on the electronic component on described substrate and predefined electronic component, and, according to the described installation site deviation of the electronic component calculated, judge the described zone that laser measuring device for measuring is measured that is not suitable for.

11., according to the described testing fixture of any one in claim 1 to 10, it is characterized in that:

Described laser measuring device for measuring comprises:

Normal reflection type measurement mechanism, receive from the normal reflection composition among the reflected light of described inspection thing reflection; And

The diffusion reflection pattern measurement mechanism, receive from the scattered reflection composition among the reflected light of described inspection thing reflection, wherein,

Described control part, according to the kind of the described laser measuring device for measuring of measuring, be described normal reflection type measurement mechanism or described diffusion reflection pattern measurement mechanism, by the zone that the incident path of the laser from described illuminating part to described inspection thing or the catoptrical reflection paths from described inspection thing to described light accepting part likely are blocked, be judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.

12. an inspection method, used testing fixture, described testing fixture comprises: shoot part, and take and check thing; Laser measuring device for measuring, also receive the reflected light from described inspection thing by the measuring position irradiating laser on described inspection thing, measures the height of described inspection thing; And control part, at least use the photographic images of the described inspection thing of being taken by described shoot part, judge the zone that described laser measuring device for measuring is measured that is not suitable for comprised in described photographic images, and from the measuring object of described laser measuring device for measuring, getting rid of and be not suitable for the zone that described laser measuring device for measuring is measured, described laser measuring device for measuring comprises: the illuminating part that described inspection thing is penetrated to laser; And the catoptrical light accepting part that receives described inspection thing reflection, described inspection method comprises takes the step that checks thing, characterized by further comprising following steps:

Use the photographic images of captured described inspection thing, judge the zone that is not suitable for laser measurement comprised in described photographic images, and from the measuring object of described laser, getting rid of the step in the zone that is not suitable for described laser measurement; And

By the measuring position irradiating laser on described inspection thing, also receive the reflected light from described inspection thing, measure the step of the height of described inspection thing,

From the measuring object of described laser, getting rid of in the step in the zone that is not suitable for described laser measurement, according to from the direction of described illuminating part towards described light accepting part, by the zone that the incident path of the laser from described illuminating part to described inspection thing or the catoptrical reflection paths from described inspection thing to described light accepting part likely are blocked, be judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.

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