CN102147237A - Inspection device and inspection method - Google Patents

Inspection device and inspection method Download PDF

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Publication number
CN102147237A
CN102147237A CN2010106210005A CN201010621000A CN102147237A CN 102147237 A CN102147237 A CN 102147237A CN 2010106210005 A CN2010106210005 A CN 2010106210005A CN 201010621000 A CN201010621000 A CN 201010621000A CN 102147237 A CN102147237 A CN 102147237A
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laser
measuring
zone
laser measurement
measuring device
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CN102147237B (en
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角田阳
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Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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Abstract

The invention provides an inspection device and an inspection method. The inspection device (100) uses a laser measuring device to conduct an inspection on an object in a complicated shape and comprises a shooting part (31) for shooting the object (110), a laser measuring part (33, 34) which measures the height of the object (110) through irradiating laser on the measuring position of the object (110) and receiving reflection light from the object (11), and an operation processing part (41) which uses a shooting image of the object (110) shot by the shooting part (31) to determine an area (laser measurement exclude area) unsuitable for the laser measurement contained in the shooting image and exclude the laser measurement exclude area from the measuring objects of the laser measuring part (33, 34). In this case, even the shapes of the objects are complicated, a measurement of high precision can be conducted in a short time.

Description

Testing fixture and inspection method
Technical field
The present invention relates to testing fixture and inspection method, particularly check the testing fixture and the inspection method of the shape of thing by laser measurement.
Background technology
In the past, known have possess the testing fixture (for example: Jap.P. open communique spy open flat 9-196625 number, is designated hereinafter simply as patent documentation 1) of laser measuring device for measuring of checking the shape of thing by laser measurement.
Disclose a kind of coplanarity (coplanarity) pick-up unit in above-mentioned patent documentation 1, it comprises: with the spherical terminal (being called projection (bump)) of ball grid array IC chips such as (the Ball Grid Array:BGA) Lighting Division of irradiating illumination light from the side under the state of top mounting; Use illumination light to take the camera of projection from the top; The laser measuring device for measuring of the height of the apex portion of mensuration projection; And the control part that calculates the vertex position of projection according to the photographic images of camera.In this coplanarity pick-up unit, by to spherical terminal (projection) irradiating illumination light from the side, and the reflected light that reflects upward by camera, thereby take the image of circular bright portion with the apex of surrounding ball according to each projection of BGA.Control part is the vertex position of projection according to center of gravity (center) position of this circular bright portion, calculates the apex coordinate of each projection, and measures the height of this apex coordinate by laser measuring device for measuring, thereby determine the height of each projection of BGA.
Can consider that the disclosed technology of coplanarity pick-up unit with above-mentioned patent documentation 1 is applicable to that installation base plate that electronic component is installed on the substrate etc. checks the inspection of the installment state (solder shape and engagement state after the sclerosis of solder bonds portion) of the electronic component of thing.But, in the coplanarity pick-up unit of above-mentioned patent documentation 1, owing to have the same spherical shape and calculate apex coordinate according to the photographic images of projection based on the projection of BGA, measure bump height by laser measuring device for measuring, therefore to as harden after solder shape the shape of solder bonds portion of complexity when measuring, be difficult to calculate the coordinate of apex and measure according to photographic images.So, be difficult to the technology of above-mentioned patent documentation 1 is applicable to the inspection of the installment state of the electronic component of checking thing.
In addition, under the situation of checking aforesaid solder bonds portion with complicated shape by laser measuring device for measuring, when measuring solder bonds portion integral body by laser measuring device for measuring, need and measure all coordinate scan lasers of being contained in measured zone, therefore have the time-consuming problem of measuring.And have the part of complicated shape the hole portion at brave material junction surface and precipitous etc. this moment, owing to can't suitably receive the reflected light of the laser of laser measuring device for measuring irradiation sometimes, and the therefore problem that also exists measuring accuracy to be easy to descend.
Summary of the invention
In order to solve aforesaid problem, the object of the present invention is to provide a kind of testing fixture and inspection method, even when using laser measuring device for measuring to have the inspection of inspection thing of complicated shape, also can carry out high-precision mensuration at short notice.
In order to achieve the above object, one aspect of the present invention relates to testing fixture, and this testing fixture comprises: shoot part, and take and check thing; Laser measuring device for measuring, by the measuring position irradiating laser on the described inspection thing also being received reflected light from described inspection thing, measure the height of described inspection thing, described testing fixture is characterised in that also and comprises: control part, at least use the photographic images of the described inspection thing of taking by described shoot part, judge the zone that described laser measuring device for measuring is measured that is not suitable for that comprises in the described photographic images, and from the measuring object of described laser measuring device for measuring, get rid of the zone that is not suitable for described laser measuring device for measuring measurement.
In testing fixture involved in the present invention, as mentioned above, by the photographic images of use by the inspection thing of shoot part shooting is set, judge the zone that laser measuring device for measuring is measured that is not suitable for that comprises in the photographic images, and from the measuring object of laser measuring device for measuring, get rid of the control part be not suitable for the zone that laser measuring device for measuring measures, can use the photographic images of the inspection thing of taking by shoot part, the hole portions, precipitous etc. of getting rid of complex-shaped solder bonds portion are not suitable for carrying out the measurement of laser measuring device for measuring on the basis in the zone that laser measuring device for measuring measures.In view of the above, the situation of mensuration of carrying out laser measuring device for measuring with the regional integration that solder bonds portion etc. is had complicated shape as the measuring object zone of laser measuring device for measuring is different, can get rid of the area part that is not suitable for the laser measuring device for measuring measurement and dwindle the area of actual measured zone, therefore in fact the elevation measurement point of scan laser and measurement reduces, and can measure at short notice.And, owing to get rid of the zones that are not suitable for measuring that usefulness laser measuring device for measuring can't be measured or measuring accuracy may descend such as hole portion, precipitous of solder bonds portion in advance, so part or all of remaining areas (determination object zone) carried out the measurement of laser measuring device for measuring.Its result owing to can not mix the low measured value of precision in the measurement result and measure mistake, even therefore when using laser measuring device for measuring to carry out the inspection of installment state of electronic component, also can carry out high-precision measurement.
In described testing fixture, comparatively it is desirable to, described control part is carried out the measurement of described laser measuring device for measuring for got rid of described at least a portion that is not suitable for the zone behind the zone that laser measuring device for measuring measures from described photographic images.According to this structure, for example on the basis of having got rid of the zone that is not suitable for the laser measuring device for measuring measurement, also can realize the raising of measuring accuracy by measuring remaining Zone Full, and got rid of on the basis in the zone that is not suitable for the laser measuring device for measuring measurement, have the required minimal part of shape measure of the part of complicated shape by further only measuring solder bonds portion etc., thereby can also further dwindle the area of actual measured zone and realize the further shortening of Measuring Time.
In described testing fixture, comparatively it is desirable to, the described zone that is not suitable for the laser measuring device for measuring measurement comprises that at least being shaped as of described inspection thing is not suitable for the zone of the shape of described laser measuring device for measuring mensuration.According to this structure, might be not suitable for the shape that laser measuring device for measuring is measured to what measuring accuracy impacted by detecting, thereby can get rid of as being not suitable for the zone that laser measuring device for measuring measures according to photographic images.
In this case, comparatively it is desirable to, described control part uses the information about the shape that is not suitable for described laser measuring device for measuring mensuration, detects the described shape that is not suitable for laser measuring device for measuring mensuration that comprises in the described photographic images.According to this structure, for example as about being not suitable for the information of the shape that laser measuring device for measuring measures, the photographic images example of the shape that is not suitable for laser measuring device for measuring mensuration has been taken in use, just can easily detect the shape that laser measuring device for measuring is measured that is not suitable for that comprises in the photographic images of checking thing by the photographic images and the photographic images example of comparative control by the inspection thing of shoot part shooting.
In described testing fixture, comparatively it is desirable to, described control part is judged the described zone that laser measuring device for measuring is measured that is not suitable for according to the light intensity difference in the described photographic images.Zone such as hole portion of solder bonds portion, precipitous in photographic images, around the light intensity ratio low (secretly), and zone in the shade that is positioned at highly big electronic component (deepening), laser is blocked and can't measure by highly big electronic component sometimes when carrying out the measurement of laser measuring device for measuring, if therefore adopt the structure of judging the zone that is not suitable for the laser measuring device for measuring measurement according to the light intensity difference in the photographic images, then can easily judge to be not suitable for the zone that laser measuring device for measuring is measured.
In this case, comparatively it is desirable to, described testing fixture also comprises: Lighting Division, top irradiating illumination light from described inspection thing, wherein, described shoot part uses by the illumination light of described Lighting Division from the top irradiation of described inspection thing, takes from the top of described inspection thing.If adopt the structure of using from the illumination light photographic images of top, then can reduce the light intensity that (deepening) hole portion, precipitous etc. are not suitable for the zone that laser measuring device for measuring measures, and can improve the light intensity that (brightening) is fit to the par that laser measuring device for measuring measures.In view of the above, to be suitable for the zone that laser measuring device for measuring measures poor with the light intensity in unaccommodated zone owing to can enlarge, and therefore can easily judge the zone that is not suitable for the laser measuring device for measuring measurement more easily according to the light intensity difference in the photographic images.
In described testing fixture, comparatively it is desirable to, described laser measuring device for measuring comprises: the illuminating part that described inspection thing is penetrated laser; And the catoptrical light accepting part that receives described inspection thing reflection, wherein, described control part basis is from the direction of described illuminating part towards described light accepting part, the incident path of laser that will be from described illuminating part to described inspection thing or the zone that the catoptrical reflection paths from described inspection thing to described light accepting part might be blocked are judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.According to this structure, consider to judge to be not suitable for the zone that laser measuring device for measuring is measured from the illuminating part of laser measuring device for measuring direction towards light accepting part.Promptly, when from illuminating part towards the direction of light accepting part when checking the direction that the step that thing has (for example: electronic component is installed and the difference in height that forms at substrate) extends, come the reflected light of self-check thing to be easy to be blocked by this step, on the other hand, when from illuminating part when the direction of light accepting part is parallel to the direction that described step extends, come the reflected light of self-check thing can not blocked by this step.So, according to illuminating part when the direction of light accepting part produces be not suitable for that laser measuring device for measuring measures regional, check on the basis of photographic images of thing also according to from the direction of illuminating part at this, can get rid of in advance and be not suitable for the zone that laser measuring device for measuring is measured towards light accepting part.
In described testing fixture, comparatively it is desirable to, described inspection thing is the installation base plate that electronic component is installed on the substrate, described control part is at least to being positioned at the solder bonds portion of the electronic component on the described substrate in the described inspection thing, use described photographic images, judge the described zone that laser measuring device for measuring is measured that is not suitable for.According to this structure, when carrying out the inspection of the installment state of the electronic component of installation base plate (inspection thing) (solder shape and engagement state after the sclerosis of solder bonds portion), be easy to produce the solder bonds portion of the electronic component in hole portion, precipitous and crack etc. for what influence measuring accuracy because of bubble etc., can judge to be not suitable for zone and the eliminating that laser measuring device for measuring is measured, therefore can improve measuring accuracy and shorten minute.
In this case, comparatively it is desirable to, describedly be not suitable for zone that laser measuring device for measuring measures and comprise that at least being shaped as of described inspection thing is not suitable for the zone of the shape that described laser measuring device for measuring measures, described be not suitable for shape that laser measuring device for measuring measures be included among formed hole portion in the solder bonds portion and precipitous at least one of them.According to this structure, can get rid of and have the zone that is not suitable for one of them shape at least among hole portion that laser measuring device for measuring measures and precipitous.
The installation base plate that electronic component is installed on described substrate is when checking thing, comparatively it is desirable to, described control part is further according to the information about the shape that is installed in the electronic component on the described substrate, the incident path of laser that will be from described laser measuring device for measuring to described inspection thing or the zone that might be blocked by described electronic component from the catoptrical reflection paths of described inspection thing are judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.According to this structure, when carrying out the measurement of laser measuring device for measuring because of being blocked by highly big electronic component can't measure the time etc. under the situation, according to information, can judge easily that the near zone etc. of highly big electronic component is not suitable for the zone that laser measuring device for measuring is measured about the shape that is installed in the electronic component on the substrate.
The installation base plate that electronic component is installed on described substrate is when checking thing, comparatively it is desirable to, described control part is according to described photographic images, calculate the installation site deviation of the design and installation position of the installation site that is installed in the electronic component on the described substrate and predefined electronic component, and, judge the described zone that laser measuring device for measuring is measured that is not suitable for according to the described installation site deviation of the electronic component that is calculated.According to this structure, laser is blocked by electronic component when causing carrying out the measurement of laser measuring device for measuring because of the installation site deviation that is installed in the electronic component on the substrate, and cause the zone that can't carry out the measurement of laser measuring device for measuring, also can be with its eliminating from the measured zone of laser measuring device for measuring.
In described testing fixture, comparatively it is desirable to, described laser measuring device for measuring comprises: normal reflection type measurement mechanism receives the normal reflection composition among the reflected light of described inspection thing reflection; And diffusion reflection pattern measurement mechanism, the scattered reflection composition of reception among the reflected light of described inspection thing reflection, wherein, described control part is described normal reflection type measurement mechanism or described diffusion reflection pattern measurement mechanism according to the kind of the described laser measuring device for measuring of measuring, the incident path of laser that will be from described illuminating part to described inspection thing or the zone that the catoptrical reflection paths from described inspection thing to described light accepting part might be blocked are judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.According to this structure, based on normal reflection type measurement mechanism and diffusion reflection pattern measurement mechanism, the incident path of laser and reflection paths difference (angle that incident light and reflected light form is different) are therefore considered the kind of laser measuring device for measuring, can judge to be not suitable for the zone that laser measuring device for measuring is measured.Generally speaking, want big with the angle that reflected light forms owing to compare incident light when receiving the scattered reflection composition when receiving the normal reflection composition, thus laser by around the possibility height that blocks of barrier (zone that is not suitable for measuring extensively.) therefore, when kind according to laser measuring device for measuring, when being not suitable for zone that laser measuring device for measuring measures and producing difference, check on the basis of photographic images of thing also according to the kind of laser measuring device for measuring, can judge in advance and gets rid of the zone that is not suitable for the laser measuring device for measuring measurement at this.
The present invention relates to inspection method on the other hand, this inspection method may further comprise the steps: take the step of checking thing: the photographic images that uses captured described inspection thing, judge the zone that is not suitable for laser measurement that comprises in the described photographic images, and from the measuring object of described laser, get rid of the step in the zone that is not suitable for described laser measurement; And, measure the step of the height of described inspection thing by the measuring position irradiating laser on the described inspection thing also being received reflected light from described inspection thing.
In inspection method involved in the present invention, as mentioned above, by using the photographic images of captured inspection thing, judge the zone that is not suitable for laser measurement that comprises in the photographic images, and from the measuring object of laser, get rid of the zone be not suitable for laser measurement, thereby can use the photographic images of captured inspection thing, be not suitable in the hole portion of getting rid of complex-shaped solder bonds portion, precipitous etc. carrying out laser measurement on the basis in zone of laser measurement.In view of the above, the situation of carrying out laser determination with the regional integration that solder bonds portion etc. is had complicated shape as the measuring object zone is different, can get rid of the part in the zone that is not suitable for laser measurement and dwindle the area of actual measured zone, therefore can measure at short notice.And, can't measure and maybe may produce the zone that is not suitable for measuring that measuring accuracy descends owing to get rid of usefulness the laser such as hole portion, precipitous of solder bonds portion in advance, so part or all of remaining areas (determination object zone) carried out laser measurement.Its result owing to can not mix the low measured value of precision in the measurement result and measure mistake, even therefore when using laser to carry out the inspection of installment state of electronic component, also can carry out high-precision measurement.
Description of drawings
Fig. 1 is the mode chart of the related appearance inspection device of expression one embodiment of the present invention.
Fig. 2 is the stereographic map of installation base plate of the inspection object of the related appearance inspection device of an expression embodiment shown in Figure 1.
Fig. 3 is the figure of state that is used to illustrate the solder bonds portion of installation base plate shown in Figure 2.
Fig. 4 is the control block diagram that is used to illustrate the appearance inspection device of an embodiment shown in Figure 1.
Fig. 5 is used to illustrate the shoot part of appearance inspection device of an embodiment shown in Figure 1 and the figure of Lighting Division.
Fig. 6 is the figure of the 1st laser measurement portion that is used to illustrate the appearance inspection device of an embodiment shown in Figure 1.
Fig. 7 is the figure of the 2nd laser measurement portion that is used to illustrate the appearance inspection device of an embodiment shown in Figure 1.
Fig. 8 is the figure in the zone that is not suitable for laser measurement that is used to illustrate the appearance inspection device of an embodiment shown in Figure 1.
Fig. 9 is the figure of the shape that is not suitable for laser measurement that is used to illustrate the appearance inspection device of an embodiment shown in Figure 1.
Figure 10 is the figure of the shape that is not suitable for laser measurement that is used to illustrate the appearance inspection device of an embodiment shown in Figure 1.
Figure 11 is the figure that is used to illustrate the difference in the zone that is not suitable for laser measurement that the direction difference by the 2nd laser measurement portion of the appearance inspection device of an embodiment shown in Figure 1 causes, wherein, (A) is side view outline, (B) for overlooking sketch map.
Figure 12 is the figure that is used to illustrate the difference in the zone that is not suitable for laser measurement that the direction difference by the 2nd laser measurement portion of the appearance inspection device of an embodiment shown in Figure 1 causes, wherein, (A) is side view outline, (B) for overlooking sketch map.
Figure 13 be used to illustrate an embodiment shown in Figure 1 appearance inspection device to the process flow diagram of the inspection action of installation base plate.
Figure 14 is the process flow diagram that is used to illustrate the computing of laser measurement exclusionary zone shown in Figure 13.
Figure 15 is the figure of computing of laser measurement exclusionary zone that is used to illustrate the appearance inspection device of one embodiment of the present invention.
Figure 16 is the figure of computing of laser measurement exclusionary zone that is used to illustrate the appearance inspection device of one embodiment of the present invention, wherein, (A) for overlooking sketch map, (B) amplifies for the part of (A) and overlooks sketch map.
Figure 17 is the figure of laser measurement subject area that is used to illustrate the appearance inspection device of one embodiment of the present invention.
Embodiment
Embodiments of the present invention are described below with reference to the accompanying drawings.
At first, referring to figs. 1 through Figure 12, the structure of the appearance inspection device 100 of one embodiment of the present invention is described.In addition, in the present embodiment, the appearance inspection device 100 as the example of " testing fixture " is suitable for situations of the present invention describes.
As depicted in figs. 1 and 2, the appearance inspection device 100 of present embodiment is to be used for element 120 being installed in the device of inspection that inspection thing (installation base plate 110) on the printed base plate 130 carries out the installment state of element 120.At installation base plate 110, on the assigned address on the printed base plate 130 that is formed with Wiring pattern (not shown), dispose a plurality of electronic components (element 120) such as integrated circuit.On printed base plate 130, go up the portion of terminal 121 of configuration element 120, carry (installation) these elements 120 with this by the pasty state scolder 140 (with reference to Fig. 3) of appointed pattern coating (printing).Then, fusion and sclerosis (cooling) operation through scolder 140 (with reference to Fig. 3), portion of terminal 121 solder bonds (solder bonding) of element 120 on the distribution of printed base plate 130, thereby element 120 with state that the wired electric of the appointment of printed base plate 130 is connected under be fixed on the substrate 130.Appearance inspection device 100 with the installation site of element 120 and direction whether rationally, with respect to the position deviation amount of the design attitude of element 120 whether in permissible range, the solder bonds portion of portion of terminal 121 whether normal etc. as element 120 installment state and check.In addition, installation base plate 110 is an example of " inspection thing " of the present invention.In addition, element 120 and printed base plate 130 are respectively an example of " electronic component " of the present invention and " substrate ".
In addition, as shown in Figure 3, in installation base plate 110, the solder bonds portion of portion of terminal 121 according to the installation site precision of element 120 and all factors such as printing (coating) precision of scolder 140, roughly presents the state of A to H respectively.Particularly, state A be amount of solder slightly less but have the example of the state (certified products) of suitable solder shape.State B is the example of all suitable desirable state (certified products) of amount of solder and solder shape.State C is that amount of solder is few, the example of qualified boundary as whether.State D is that portion of terminal 121 is not by the not example of the state (defective) of welding of solder bonds.In addition, though state E is coated with scolder, the example of the state (defective) that does not weld because of the deviation of scolder position (the perhaps position of element 120).State F and state G are respectively the examples of the state (defective) that floats with respect to printed base plate 130 of portion of terminal 121 (lead).Whether qualified in addition, state H is the example of the state of amount of solder surplus, and be the example of boundary.The example of above-mentioned state C and state H is according to the degree of insufficient solder connection (surplus), the purposes etc. of installation base plate 110, and whether qualified its judgement be different.Appearance inspection device 100 is for the above-mentioned state A to H of solder bonds portion identification, and judgement solder bonds portion is whether qualified.
As shown in Figure 1, appearance inspection device 100 comprises: be used for the conveyance substrate transferring travelling belt 10 of installation base plate 110; Can be along the mobile XY mechanical arm 20 of XY direction (aspect horizontal) above substrate transferring travelling belt 10; And by the inspection assembly 30 and the control device 40 (with reference to Fig. 4) of 20 maintenances of XY mechanical arm.The following describes the concrete structure of appearance inspection device 100.
Substrate transferring travelling belt 10 can be along directions X conveyance installation base plate 110, and makes in the inspection position of appointment that installation base plate 110 stops and keeping.In addition, the installation base plate 110 that substrate transferring travelling belt 10 can finish to check along the directions X conveyance from the inspection position of appointment, and take out of installation base plate 110 from appearance inspection device 100.
In addition, XY mechanical arm 20 is arranged on the top (arrow Z1 direction) of substrate transferring travelling belt 10, for example is made of the Orthogonal Double axis robot of using ballscrew shaft and servomotor.That is, in the XY mechanical arm 20, along the two ends of the directions X of the inspection assembly support portion 21 that directions X extends, pair of guide rails portion (not shown) support that the mode that can move along the Y direction with this inspections assembly support portion 21 is extended along the Y direction.Particularly, drive by Y-axis motor 22 (with reference to Fig. 4) and to be arranged on the ballscrew shaft (Y-axis) (not shown) of rail portion, thereby the inspection assembly support portion 21 with the ball nut (not shown) that screws togather with ballscrew shaft (Y-axis) is moved along the Y direction.In addition, checking that assembly support portion 21 is provided with ballscrew shaft (X-axis) (not shown) and X-axis motor 23 (with reference to Fig. 4).And, drive ballscrew shaft (X-axis) (not shown) by X-axis motor 23, the inspection assembly 30 with the ball nut (not shown) that screws togather with ballscrew shaft (X-axis) can be moved along directions X.By this structure, XY mechanical arm 20 can make the inspection assembly 30 that remains on the inspection assembly support portion 21 move along XY direction (horizontal direction) in the top of substrate transferring travelling belt 10 (installation base plate 110) (arrow Z1 direction).
In addition, check that assembly 30 comprises shoot part 31, Lighting Division the 32, the 1st laser measurement portion 33 and the 2nd laser measurement portion 34 (with reference to Fig. 4).This inspection assembly 30 is moved to the assigned address of installation base plate 110 tops by XY mechanical arm 20, and, check that assembly 30 is used to check the shooting and the measurement of the installment state of the element 120 on the installation base plate 110 by using shoot part the 31, the 1st laser measurement portion 33 and the 2nd laser measurement portion 34 etc.In addition, the 1st laser measurement portion 33 is examples of " laser measuring device for measuring " of the present invention and " normal reflection type measurement mechanism ".In addition, the 2nd laser measurement portion 34 is examples of " laser measuring device for measuring " of the present invention and " diffusion reflection pattern measurement mechanism ".
Shoot part 31 is made of CCD camera that is provided with lens 31a etc.Shoot part 31 is arranged on the top of installation base plate 110 (substrate transferring transport tape 10) (arrow Z1 direction), and shoot part 31 is towards the below (arrow Z2 direction) and be provided with, so that it takes direction with respect to installation base plate 110 approximate vertical.In view of the above, shoot part 31 uses from Lighting Division 32 to the illumination light of installation base plate 110 irradiations, from directly over the position take the two dimension of the upper surface of installation base plate 110 (plane) image.By the shooting of this shoot part 31, under the illumination light of White LED described later, obtain each image with red R, green G, RGB that blue B is corresponding, under infrared illumination light, obtain infrared image.
In addition, as shown in Figure 5, Lighting Division 32 is and is formed with the dome-shaped of peristome 321 and a plurality of illuminations with the inner face side that is arranged on dome at the top.(arrow Z1 direction) disposes shoot part 31 above peristome 321, and shoot part 31 carries out the shooting of installation base plate 110 via this peristome 321.Inner face side at Lighting Division 32 is respectively arranged with a plurality of epimere illuminations 322, stage casing illumination 323 and hypomere illumination 324 successively from summit side (the arrow Z1 direction side) beginning that is provided with peristome 321.Particularly, the position of epimere illumination 322 the tops at Lighting Division 32 (arrow Z1 direction) is provided with a plurality of in the mode of the periphery of encirclement peristome 321.Stage casing illumination 323 is the position of (arrow Z1 direction) in the position of (arrow Z2 direction) below the epimere illumination 322 and above hypomere illumination 324, is provided with a plurality of in the mode of surrounding epimere illumination 322.And hypomere illumination 324 position of (arrow Z2 direction) below stage casing illumination 323 is provided with a plurality of in the mode of surrounding stage casing illumination 323.
In addition, because Lighting Division 32 is dome-shaped, as shown in Figure 5, along with throwing light on 322 towards the below (arrow Z2 direction) from epimere, the position of illumination is away from shoot part 31 (peristome 321).Therefore, 322 pairs of reference objects of epimere illumination (appointed area on the installation base plate 110) position irradiating illumination light of (arrow Z1 direction) directly over roughly.So the direction of illumination of epimere illumination 322 and the shooting direction of shoot part 31 are roughly same direction.In addition, stage casing illumination 323 from vergence direction (about 45 degree) to reference object irradiating illumination light.And 324 pairs of reference objects of hypomere illumination are with the irradiating angle irradiating illumination light of about 30 degree.In view of the above, shoot part 31 can use from the illumination light of differing heights (angle) irradiation same reference object and take.In addition, though not shown at Fig. 5, also be provided with the infrared illumination 325 (with reference to Fig. 4) that comprises infrared LED with the throw light on position of 322 roughly the same height of epimere.Epimere illumination 322, stage casing illumination 323 and hypomere illumination 324 comprise White LED etc. respectively, and infrared illumination 325 comprises infrared LED etc.
In addition, as shown in Figure 6, the 1st laser measurement portion 33 comprises illuminating part 33a with light-emitting components such as semiconductor lasers and the light accepting part 33b with optical position detecting element.33 pairs in the 1st laser measurement portion measuring position on the installation base plate 110 and is received in normal reflection composition in the reflected light of measuring position reflection from illuminating part 33a irradiating laser by light accepting part 33b.At this moment, on the optical position detecting element, form luminous point (focus) by the reflected light that light accepting part 33b receives, and detect this light spot position.According to the principle of triangulation can from detected light spot position calculate from the 1st laser measurement portion 33 to the measuring position apart from d1.In view of the above, according to the 1st laser measurement portion 33 and the known position relation of installation base plate 110, can measure the height H 1 in the measuring position of installation base plate 110.In addition, in the 1st laser measurement portion 33, be angle [alpha] with the angle that the catoptrical reflection paths that receives by light accepting part 33b forms from the incident path of the laser of illuminating part 33a irradiation.
As shown in Figure 7, the 2nd laser measurement portion 34 comprises illuminating part 34a with light-emitting components such as semiconductor lasers and the light accepting part 34b with optical position detecting element.34 pairs in the 2nd laser measurement portion measuring position on the installation base plate 110 and is received in scattered reflection composition in the reflected light of measuring position reflection from illuminating part 34a approximate vertical irradiating laser (arrow Z2 direction) by light accepting part 34b.Therefore, in the 2nd laser measurement portion 34, be angle beta with the angle that the catoptrical reflection paths that receives by light accepting part 34b forms from the incident path of the laser of illuminating part 34a irradiation.In addition, the height measurement method of the 2nd laser measurement portion 34 is the same with the 1st laser measurement portion 33.These laser measurement portions with reference to the surface state of the mensuration part on the installation base plate 110 (whether gloss few, whether be specular surface body or near minute surface), necessary measurement range and measuring accuracy etc. and suitably select.
In addition, as shown in Figure 4,, on the basis of above-mentioned inspection assembly 30, also be provided with X ray filming apparatus 35 and X ray illumination 35a at appearance inspection device 100.X ray filming apparatus 35 and X ray illumination 35a goes up across installation base plate 110 at above-below direction (Z direction) and disposes, and is set up opposed to each other.And, detect from X ray illumination 35a irradiation and see through the X ray of installation base plate 110 by X ray filming apparatus 35, thereby take the radioscopic image of installation base plate 110.By this radioscopic image, can obtain the state of scolder of the following side of the portion of terminal 121 that for example is positioned at element 120.
As shown in Figure 4, appearance inspection device 100 is by control device 40 Be Controlled.Control device 40 comprises arithmetic processing section 41, storage part 42, motor control part 43, outside input and output portion 44, image processing part 45, measures handling part 46 and lighting control section 47.In addition, control device 40 and display unit 50 are connected with not shown input equipment (touch-screen or keyboard etc.), receive the operation input from the user.In addition, arithmetic processing section 41 is examples of " control part " of the present invention.
Arithmetic processing section 41 comprises the ROM (Read Only Memory) of the CPU of actuating logic computing, the program of storage control CPU etc. and at the RAM (Random Access Memory) of device interim store various kinds of data in service etc.Arithmetic processing section 41 by motor control part 43, image processing part 45, measurement handling part 46 and lighting control section 47, is controlled each one of appearance inspection device 100 according to the program that is stored among the ROM.And, arithmetic processing section 41 is used shoot part the 31, the 1st laser measurement portion 33 and the 2nd laser measurement portion 34 etc., carry out the inspection of the installment state of element 120, for each state shown in the state A to H of identification Fig. 3 of solder bonds portion of the portion of terminal 121 of element 120 and whether qualifiedly judging etc. of carrying out solder bonds portion.
In addition, in the present embodiment, arithmetic processing section 41 is used the photographic images of the installation base plate 110 of shoot part 31, the zone (laser measurement exclusionary zone) that the 1st laser measurement portion 33 that is not suitable for that comprises in the judgement photographic images or the 2nd laser measurement portion 34 measure.And arithmetic processing section 41 is got rid of this laser measurement exclusionary zone from the measuring object (zone) of the 1st laser measurement portion 33 or the 2nd laser measurement portion 34.In addition, " laser measurement exclusionary zone " is an example of " being not suitable for the zone that laser measuring device for measuring is measured " of the present invention.
At this, the zone (laser measurement exclusionary zone) that is not suitable for the 1st laser measurement portion 33 or 34 measurements of the 2nd laser measurement portion is described.Describe in this example that is measured as with the 2nd laser measurement portion 34.As shown in Figure 7, the laser that shines from illuminating part 34a is reflected in the measuring position, and reflected light (scattered reflection light) quilt carries out laser measurement by light accepting part 34b reception with this.Therefore, when having veil on the incident path of laser or reflection paths, energy measurement or measuring accuracy descend.Particularly, situation of blocking of the F2 of hole portion (recess) on the laser shown in Figure 8 situation of being blocked by veil F1 such as elements that installed, the scolder 140 that laser shown in Figure 9 is formed on solder bonds portion etc. belongs to this situation.When measuring these veils F1 and the F2 of hole portion (recess), all owing to being blocked halfway with specified angle (angle beta) laser light reflected or, might can't measuring or measuring accuracy decline in reasons such as veil F1 and the F2 of hole portion reflection unwanted diffuse.In addition, the F2 of hole portion (recess) is an example of " being not suitable for the shape that laser measuring device for measuring is measured " of the present invention.
But, under the situation of veil F1, shown in Figure 11 (A), (B) and Figure 12 (A), (B), even equating from the measuring position to veil F1 apart from d3, according to the direction (from the direction of illuminating part 34a) of the 2nd laser measurement portion 34, there are the measurable situation and the situation of energy measurement (perhaps measuring accuracy decline) not towards light accepting part 34b.Just, shown in Figure 12 (B), in the near zone of veil F 1, the limit E1 and the E2 side of extending towards the direction A of light accepting part 34b from illuminating part 34a on the edge, laser can not be blocked and can measure.On the other hand, shown in Figure 11 (B), along and the limit E3 side of extending towards the direction of the direction A of light accepting part 34b quadrature from illuminating part 34a, thereby laser crested thing F1 blocks and can't measure or measuring accuracy descends.At this moment, near the E3 of limit, can't measure angle (angle beta or angle [alpha]) that the scope in the zone of (measuring accuracy decline) forms according to the incident path of the height of veil F1 (element 120 etc.) and laser and reflection paths and different.In addition, under the situation of the 2nd laser measurement portion 34 of diffusion reflection pattern, because in limit E4 side, do not exist veil therefore can measure on the incident path and on the reflection paths, but under the situation of the 1st laser measurement portion 33 of normal reflection type, all there is the zone that to measure in limit E3 side and limit E4 side.
In addition, as shown in figure 10, when the measuring position when being formed at precipitous the F3 etc. of solder bonds portion (scolder 140), the measuring position can be indeterminate and cause measuring accuracy to descend.In addition, can't measure when the angle of inclination of precipitous F3 and incident path almost parallel.In addition, at this precipitous F3, (direction of the 2nd laser measurement portion 34 is when the depth direction of Figure 10) also can carry out laser measurement sometimes when the vergence direction on the direction of the 2nd laser measurement portion 34 and inclined-plane is vertical.In the present embodiment, arithmetic processing section 41 is also considered the direction of laser measurement portion (the 1st laser measurement portion 33 and the 2nd laser measurement portion 34) etc., near the zone above-mentioned veil F1 of identification on 110, the zone etc. that has the zone of the F2 of hole portion (recess) and have precipitous F3 are got rid of as the laser measurement exclusionary zone these zones from laser measurement object (zone) on installation base plate.In addition, precipitous example that F3 is " being not suitable for the shape that laser measuring device for measuring is measured " of the present invention.
Storage part 42 is by the storage that can carry out various data and can being made of the Nonvolatile memory devices that arithmetic processing section 41 is read.In storage part 42, construct and be useful on the database that uses photographic images to determine " laser measurement exclusionary zone ".Data base logic ground possess the control master meter group (master tables) that preserves as information of required data and will carry out when controlling obtain, transaction table group (transaction tables) that generation, data updated are preserved as information.Each table group is array (tuple, the storage area of the information that the table of single or multiple matrix forms OK) (entity) is corresponding that the logical relation (contact) according to appointment will be set with project (field or row) and set by each field.
In the master meter group, be set with substrate data, the decision of preserving the mount message (position and direction etc.) in the design determine installation base plate 110 and to be installed in the element 120 on the substrate 130 be installed in the component shape data of the shape of the element 120 on the installation base plate 110, about the data of the parameter (direction and incident path and the reflection paths etc. that comprise the 1st laser measurement portion 33 and the 2nd laser measurement portion 34) of each controlling element and the zone that is used to calculate the sample data of laser measurement exclusionary zone, each data is stored in the The corresponding area.As sample data, for example store many cases respectively and take example, take view data such as example as precipitous shape of the shooting example of precipitous F3 as the hole portion (recess) of the shooting example of the F2 of hole portion (recess).
On the other hand, in the transaction table group, be set with captured image data that storage taken by shoot part 31, by the image inspection to the inspection area (laser measurement position) had in mind judge the shape of this element 120 that (with reference to the step S8 of the process flow diagram of Figure 13) generated, highly, processing result image data such as position and direction, never the motor position data (mount message of shoot part 31) that obtain of illustrated scrambler and the zone of discerning the measuring point data at the laser measurement position of having in mind in the captured captured image data (inspection area).
Arithmetic processing section 41 is passed through captured image data and hole portion (recess) shape shooting example and precipitous shape shooting example that contrast is taken by shoot part 31, the laser measurement exclusionary zone ((recess) F2 of hole portion and precipitous F3) that comprises in the identification photographic images.In addition, arithmetic processing section 41 is by using substrate data and component shape data, and carry out image recognition according to captured image data, thereby identification is installed in the element 120 on the installation base plate 110, and obtain the shape of this element 120, highly, installation site and direction etc.And, arithmetic processing section 41 according to the shape of obtained element 120, highly, data such as installation site and direction, known the 1st laser measurement portion 33 and direction and the incident path and the reflection paths of the 2nd laser measurement portion 34, calculate near the laser measurement exclusionary zone the veil F 1.In addition, " hole portion (recess) shape take example " and " precipitous shape taken example " is respectively an example of " about the information of the shape that is not suitable for laser measuring device for measuring mensuration " of the present invention.In addition, " component shape data " are examples of " about the information of the shape that is installed in the electronic component on the substrate " of the present invention.
Motor control part 43 is according to the control signal from arithmetic processing section 41 outputs, each servomotor of control appearance inspection device 100 (be used for along the Y direction move XY mechanical arm 20 Y-axis motor 22, be used for along directions X move XY mechanical arm 20 X-axis motor 23, be used for the motor (not shown) of driving substrate conveyance travelling belt 10) etc. driving.In addition, motor control part 43 is according to the signal from the scrambler (not shown) of each servomotor, obtains and checks the assembly 30 (each measuring position of the camera site of shoot part 31, the 1st laser measurement portion 33 and the 2nd laser measurement portion 34) and the position of installation base plate 110 etc.
Outside input and output portion 44 is by the interface formations such as (interface) that is used to construct networks such as wired or wireless LAN.Other devices (not shown) on outside input and output portion 44 and the production line that carries out installation base plate 110 and the main frame (not shown) of the control of production line integral body etc. are connected by network, have the function of carrying out information communication.
Image processing part 45 is according to the control signal from arithmetic processing section 41 outputs, read the shooting signal from shoot part 31 and X ray filming apparatus 35 by time in appointment, and the Flame Image Process that the shooting signal of reading is carried out appointment is suitable for identification (image recognition) element 120 of installation base plate 110 and the captured image data of solder bonds portion (scolder 140) thereby generate.
Measure handling part 46 bases by the 1st laser measurement portion 33 or the 2nd laser measurement portion 34 detected light spot positions, calculate from the 1st laser measurement portion 33 to the measuring position apart from d1 or from the 2nd laser treatment portion 34 to the measuring position apart from d2, obtain the height H 1 of the measuring position on installation base plate 110.
Lighting control section 47 makes each epimere illumination 322, infrared illumination 325, stage casing illumination 323 and the hypomere illumination 324 of Lighting Division 32 and X ray illumination 35a light in the time of appointment according to the control signal from arithmetic processing section 41 outputs.
Below, with reference to Fig. 2, Fig. 3, Fig. 5 and Figure 13 to Figure 17, the inspection action of the installation base plate 110 of the appearance inspection device 100 of one embodiment of the present invention is described.In addition, inspection shown below action is undertaken by each one of the arithmetic processing section 41 control appearance inspection devices 100 of control device 40.In addition, the main laser measurement to the 1st laser measurement portion 33 or the 2nd laser measurement portion 34 below (highly measuring) and the computing of laser measurement exclusionary zone describe.
At first, as shown in figure 13, at step S1, installation base plate 110 by substrate transferring travelling belt 10 by conveyance to the inspection position of appointment and be fixed.Then, at step S2, by arithmetic processing section 41, XY mechanical arm 20 is driven, and shoot part 31 is moved to the top of reference mark (fiducial mark) position of the appointment on the installation base plate 110.Then, take the not shown reference mark that is formed at assigned address by shoot part 31.At step S3, the captured image data by 41 pairs of reference marks of arithmetic processing section carries out image recognition, thereby carries out the position correction of installation base plate 110.In view of the above, the position coordinates of appearance inspection device 100 is corresponding with the position on the installation base plate 110 (substrate data), finishes the preparation of checking processing.Below, to step S9, use the inspection of installment state of the photographic images of the installation base plate 110 that shoot part 31 takes to handle at step S4.
At step S4, judge the zone (not shooting area) that on installation base plate 110, whether has the shooting of not carrying out shoot part 31 by arithmetic processing section 41.That is, because the coverage (visual field) of shoot part 31 is limited to certain limit, therefore the shooting of installation base plate 110 is divided into a plurality of appointed areas and separately repeatedly takes and carry out.Therefore, judge whether to exist not shooting area, when having not shooting area, advance to step S5 at step S4.On the other hand, when the Zone Full on the installation base plate 110 has been taken when shooting area (do not exist not), be transferred to step S10.
When having not shooting area, at step S5, by arithmetic processing section 41, XY mechanical arm 20 is driven, and according to the substrate data in the database that is stored in storage part 42, shoot part 31 is moved to the camera site of the appointment that is used to take next shooting area.
Then, at step S6, take appointed area (inspection area) on the installation base plate 110 by shoot part 31.Epimere illumination 322, infrared illumination 325, stage casing illumination 323 and the hypomere illumination 324 of Lighting Division 32 used in the shooting of shoot part 31 respectively, same shooting area added up to carry out four times.Photographic images is treated to the captured image data that is suitable for discerning (image recognition) by image processing part 45, and is output to arithmetic processing section 41.
Below, at step S7, arithmetic processing section 41 is carried out the image recognition of captured image data, thus identification is photographed the position (inspection area) that interior element 120 of captured image data (shooting area) and solder bonds portion etc. check object.Then, to each inspection area,, detect the installation site deviation (installation site is with respect to the deviation of design attitude) of element 120 and direction and portion of terminal 121 and have or not crooked and erect etc. according to the substrate data that is stored in the storage part 42.In addition, detect the position and the shape of solder bonds portion.When image recognition was finished, captured image data was stored in the storage part 42.
Then, at step S8,,, check judgement (whether qualified judgement) according to the position of the position deviation of detected element 120 and direction, solder bonds portion and shape etc. to the inspection area in the shooting area.For solder bonds portion, by image recognition, the defective state defective states such as (not welding, scolder position deviation, lead) floating shown in state D, state E, state F and the state G of identification Fig. 3.On the other hand, each state shown in the state A of Fig. 3, state B, state C and the state H is difficult to discern according to the captured image data that installation base plate 110 is taken from approximate vertical top (arrow Z1 direction).Therefore, for the inspection area that is equivalent to each state shown in state A, state B, state C and the state H (solder bonds portion), be judged to be certified products and as the object of the later laser measurement of step S10 described later.Therefore, judge by this image inspection, whether qualified carrying out to inspection area judged the first time, and, generate the positional information (position, direction and position deviation amount etc.) of the element 120 that is judged to be certified products and the positional information of solder bonds portion etc. as processing result image for laser measurement described later.
Then, at step S9, judge whether there is not inspection area by the inspection area in 41 pairs of shooting areas of arithmetic processing section (captured image data).When in the shooting area (captured image data) during the residual inspection area of finish checking, turn back to step S7, this inspection area is carried out image recognition and checks and judge.When all inspection areas in the shooting area (captured image data) are finished to check when inspection area (do not exist not), be transferred to step S4, judge whether there is not shooting area once more.By carrying out step S4 so repeatedly, thereby each shooting area on the installation base plate 110 is taken, each inspection area in the shooting area is carried out inspection based on captured image data to step S9.Its result, be judged to be (when advancing to step S10) when not having not shooting area at step S4, at installation base plate 110 on the whole, determine to be used as processing result image (with reference to step S8) as the positional information of the solder bonds portion of the element 120 of the object of laser measurement and this element 120.Step S10 to S15 afterwards carries out laser measurement to each inspection area that is judged to be certified products by the image inspection.
Therefore, at step S10, judge the element 120 (solder bonds portion) that whether has the laser measurement object by arithmetic processing section 41.When the element 120 that has the laser measurement object (solder bonds portion), advance to step S11.
At step S11, among the element 120 of laser measurement object, be conceived to an element 120, judge whether there is the inspection area (not carrying out the position of laser measurement) that does not carry out laser measurement.That is, as shown in Figure 2, when having a plurality of portion of terminal 121 in the element 120, the solder bonds portion (inspection area) of each portion of terminal 121 is carried out laser measurement.When the position of laser measurement is not carried out in existence, advance to step S12, among laser measurement position (carrying out the position of laser measurement), be not conceived to a laser measurement position once more, carry out the calculating of the laser measurement exclusionary zone in this laser measurement position.At this,, the computing (subroutine) of laser measurement exclusionary zone is elaborated with reference to Figure 14.
As shown in figure 14, at first,, obtain the positional information at laser measurement position by arithmetic processing section 41 at step S21.Particularly, use transaction table group's processing result image data, motor position data (mount message of shoot part 31) and the captured image data of taking the laser measurement position of having in mind (inspection area), calculate the mount message accurately that is used to carry out laser measurement.At this moment, for example shown in Figure 15, even the position of the element in substrate data 120 (design attitude of element 120 is with reference to dotted line) situation about can't measure also can occur for carrying out the position of laser measurement when the installation site deviation takes place element 120.Therefore, according to the positional information accurately of the installation site deviation that comprises the element 120 that calculates (the perhaps deviation of the coating position of scolder), carry out the calculating of laser measurement exclusionary zone.
Then, at step S22,, light and shade (the light intensity value difference is different) is carried out at the laser measurement position of having in mind (inspection area) judge by arithmetic processing section 41.At this moment, each captured image data of the RGB of use epimere illumination 322 shootings is used to the judgement of light and shade.As shown in Figure 5, when using epimere to throw light on 322 the time, from be configured in reference object directly over the roughly the same direction irradiating illumination light of shooting direction of shoot part 31, therefore the reflected light in smooth regional reflex is easy to arrive shoot part 31 most, and the illumination light of uneven area illumination such as hole portion, precipitous is easy to reflect to the side.Therefore, be used to the captured image data taken from the illumination light of the top of epimere illumination 322 by use, the light intensity in zones such as hole portion, precipitous reduces (deepening), and the light intensity of par improves (brightening).At step S22, light intensity difference (contrast) according to the laser measurement position in this photographic images, detect light intensity difference for certain above zone, it is judged to be zone (zone that light intensity is low) that might be not suitable for laser measurement and the zone (zone that light intensity is high) that is suitable for laser measurement.In the present embodiment, for the captured image data that uses this epimere illumination 322 to take, use utilizes each captured image datas that stage casing illumination 323 and hypomere illumination 324 take and makes up captured image data and obtains difference etc. and further carry out Flame Image Process, thereby each regional light and shade (light intensity difference) is clearer.
At this, as shown in figure 16, in the laser measurement position that comprises in the captured image data, the situation that is conceived to the J1 of solder bonds portion describes.Judge by light and shade (the light intensity value difference is different), from the J1 of solder bonds portion, obtain the low dark areas D1 to D4 of high bright area R1 of intensity level and R2 and intensity level the J1 of solder bonds portion of step S22.In addition, in Figure 15 to Figure 17, with white (plain color) expression bright area, with oblique line (hachure) expression dark areas, but actual photographic images for example has the intensity distributions of 256 gray scales.Therefore, in the photographic images of reality, also there is intensity distributions separately in bright area and in the dark areas, in the judgement of step S23 to S28 afterwards, judges according to the intensity distributions in the zone.
Then,, among each zone (bright area R1 and R2 and dark areas D1 to D4) of judging, be conceived to a zone, take a decision as to whether than dark on every side zone (dark areas) at step S23.When the zone of having in mind (for example, bright area R1) is not (bright area) during than dark on every side zone (dark areas), advance to step S24, be judged to be the zone that can carry out laser measurement.On the other hand, when the zone of having in mind (for example, dark areas D1) is during than dark zone (dark areas), advance to step S25 on every side.
At step S25,, judge whether the zone of having in mind (dark areas D1) is hole portion (recess) by arithmetic processing section 41.Particularly, by arithmetic processing section 41, hole portion (recess) shape among the captured image data in the zone that comparative control is had in mind (dark areas D1) and the master meter group who is stored in storage part 42 is taken example (sample data) and whether is judged that to take example consistent or approximate with hole portion (recess) shape, thereby whether the zone (dark areas D1) that judgement is had in mind is hole portion (recess).For example, the hole portion that forms in solder bonds portion because of bubble etc. etc., typically being taken is the dark areas of circular, therefore this dark areas is judged as hole portion.When the zone (dark areas D1) that judgement is had in mind is hole portion (recess), advance to step S28, be judged to be the laser measurement exclusionary zone.On the other hand, when the zone (dark areas D1) that judgement is had in mind is not hole portion (recess), advance to step S26.
At step S26,, judge whether the zone of having in mind (dark areas D1) is precipitous portion by arithmetic processing section 41.Particularly, by arithmetic processing section 41, the captured image data in the zone that comparative control is had in mind (dark areas D1) takes example (sample data) with precipitous shape among the master meter group who is stored in storage part 42 and whether judgement is consistent or approximate with precipitous shape shooting example, thereby judges whether the zone of having in mind (dark areas D1) is precipitous portion.For example, in the precipitous portion that solder bonds portion forms,, therefore judge that this dark areas is precipitous portion owing to the dark areas that is taken and improves gradually towards assigned direction (direction of fall on inclined-plane) intensity level for from the low part of intensity level (precipitous part).In addition, according to the vergence direction of this precipitous portion and the direction of the 1st laser measurement portion 33 and the 2nd laser measurement portion 34, can judge and whether can carry out laser measurement.When the zone (dark areas D1) that judgement is had in mind is precipitous, advance to step S28, be judged to be the laser measurement exclusionary zone.On the other hand, (when perhaps being judged to be measurable precipitous) do not advance to step S27 when the zone (dark areas D1) that judgement is had in mind is not precipitous.
At step S27,, judge near the veil that whether exists in the zone of having in mind (dark areas D1) by arithmetic processing section 41.At this moment, by arithmetic processing section 41, with reference to position deviation, processing result image, component shape data and the substrate data of the element of obtaining at step S21 120.Then, according to the direction of these data, the 1st laser measurement portion 33 or the 2nd laser measurement portion 34 and the angle (α or β) of incident path and reflection paths formation, judge near the laser measurement exclusionary zone that veil is.For example shown in Figure 16, the bright area R2 of the J1 of solder bonds portion is the part of element 120 as can be known.Therefore, at the near zone of this bright area R2, can't measure sometimes according to the kind and the direction of the laser measurement portion of the height of element 120, use.In this case, near being judged to be veil is arranged, advance to step S28, be judged to be the laser measurement exclusionary zone.On the other hand, when neighbouring when not having veil, though be dark areas, but not hole portion (recess) by being judged to be at step S25 to S27, neither precipitous portion, and neighbouringly do not have a barrier yet, thereby be transferred to step S24, be judged to be the zone that to carry out laser measurement.
As mentioned above, (for example: dark areas D1),, perhaps when step S28 is judged to be the laser measurement exclusionary zone, then advance to step S29 when be judged to be the zone that to carry out laser measurement at step S24 for the zone of having in mind.At step S29,, judge whether the Zone Full (bright area R1 and R2, dark areas D1 to D4) in the laser measurement position of having in mind (J1 of solder bonds portion) is finished judgement by arithmetic processing section 41.When having do not judge regional, advance to step S23, (for example: dark areas D2) carry out the processing (whether being to carry out the zone of laser measurement or the judgement of laser measurement exclusionary zone) of step S23 to S28 be conceived to next zone.On the other hand, when the All Ranges to the bright area R1 of scolder junction surface J1 and R2 and dark areas D1 to D4 has carried out judgement, end turns back to the later processing of step S13 of Figure 13 to the computing of the laser measurement exclusionary zone at the laser measurement position (J1 of solder bonds portion) had in mind.
As shown in figure 13, at step S13, be moved to the laser measurement position that is used to carry out laser measurement by arithmetic processing section 41 driving XY mechanical arm 20, the 1 laser measurement portions 33 or the 2nd laser measurement portion 34.In addition, use in the 1st laser measurement portion 33 or the 2nd laser measurement portion 34 which, preestablish according to the kind of element 120.Therefore, for example when being set at the laser measurement position (J1 of solder bonds portion) had in mind when measuring by the 2nd laser measurement portion 34, the 2nd laser measurement portion 34 is moved to the laser measurement position of having in mind (J1 of solder bonds portion).
Then, at step S14, for example measurement of the laser measurement position of having in mind by the 2nd laser measurement portion 34 (J1 of solder bonds portion).At this moment, actual is the zone of removing the laser measurement exclusionary zone that calculates at step S12 as measuring object.Therefore, as shown in figure 17, when the dark areas D1 to D4 of the J1 of solder bonds portion all was judged as the laser measurement exclusionary zone, the Zone Full of removing the bright area R1 of these dark areas D1 to D4 (laser measurement exclusionary zone) became the laser measurement subject area.In addition, the expression laser measurement position, dot pattern ground that shows among the bright area R1.In addition, because bright area R2 is the part of element 120, therefore from the measuring object at the laser measurement position (J1 of solder bonds portion) had in mind, get rid of.So, by removing the laser measurement exclusionary zone that calculates at step S12 from the laser measurement object, thereby the area of laser measurement subject area becomes roughly half among the laser measurement position of having in mind (J1 of solder bonds portion).By this laser measurement, obtain the maximum height in the measuring object zone (bright area) of the J1 of solder bonds portion.In addition, according to the elevation information (outer shape) of each measuring position in the measuring object zone of obtaining by laser measurement (bright area), the scolder volume of inferring the J1 of solder bonds portion.
When step S14 finishes laser measurement, at step S15, the determination processing of being undertaken based on measured value by arithmetic processing section 41.Promptly, for the laser measurement position of having in mind (J1 of solder bonds portion), according to the maximum height of measuring object zone (bright area), the scolder volume of inferring, judge which of the state A meet Fig. 3 (suitably shape, amount of solder few slightly), state B (suitably shape, amount of solder suitable), state C (amount of solder is few) and state H (amount of solder is many).In view of the above, for by be judged to be the solder bonds portion of certified products based on the inspection judgement (with reference to step S8) of captured image data, can judge each state A, state B, state C and state H in more detail by laser measurement.In addition, in view of the above, can detect state C (amount of solder is few) and state H (amount of solder is many) as whether qualified boundary, and differentiate respectively whether qualified.
Then, turn back to step S11, the element of having in mind 120 (with reference to Figure 15) is judged whether there is the position of not carrying out laser measurement.In view of the above, when in element shown in Figure 15 120, scolder junction surface J2 not being carried out laser measurement, then be conceived to the J2 of solder bonds portion, carry out the processing of step S12 to S15.On the other hand, when there is not the position of not carrying out laser measurement in the element of having in mind 120, turn back to step S10.
Then, at step S10, judge the element 120 (solder bonds portion) that whether has other laser measurement objects by arithmetic processing section 41.When the element 120 that has the laser measurement object (solder bonds portion), advance to step S11.So, the element 120 (solder bonds portion) for all laser measurement objects calculates the laser measurement exclusionary zone respectively to each laser measurement position, and carries out laser measurement.On the other hand, element 120 (solder bonds portion) for all laser measurement objects, when laser measurement finishes, be judged as the element that does not have the laser measurement object at step S10, thereby finish the inspection action of the installation base plate 110 of appearance inspection device 100.Then, the installation base plate 110 that finishes to check is taken out of by substrate transferring travelling belt 10, and moves into the next thing (installation base plate 110) of checking.In view of the above, the inspection to checking thing (installation base plate 110) of carrying out appearance inspection device 100 is moved.
In the present embodiment, as mentioned above, by using the photographic images of the inspection thing of taking by shoot part 31 (installation base plate 110), judge the laser measurement exclusionary zone in the photographic images, from the measuring object of the 1st laser measurement portion 33 or the 2nd laser measurement portion 34, get rid of the laser measurement exclusionary zone, thereby can use the photographic images of the inspection thing of taking by shoot part 31 (installation base plate 110), at the F2 of hole portion that gets rid of solder bonds portion, on the basis of precipitous laser measurement exclusionary zone such as F3, carry out the measurement of the 1st laser measurement portion 33 or the 2nd laser measurement portion 34.In view of the above, different when measuring solder bonds portion integral body such as (J1 and J2) laser measurement positions with the 1st laser measurement portion 33 of passing through or the 2nd laser measurement portion 34, owing to got rid of the laser measurement exclusionary zone, can make the area of actual measured zone dwindle the degree of laser measurement exclusionary zone, therefore in fact the elevation measurement point of scan laser and measurement reduces, and can measure at short notice.In addition, because in the F2 of hole portion of solder bonds portion (J1 and J2), precipitous the laser measurement such as F3, get rid of the zone that is not suitable for measuring (laser measurement exclusionary zone) that energy measurement not or measuring accuracy may descend in advance, therefore only remaining areas (laser measurement subject area, bright area R1) is carried out the measurement of the 1st laser measurement portion 33 or the 2nd laser measurement portion 34.Its result owing to can not mix the low measured value of precision in the measurement result and measure mistake, when therefore using the 1st laser measurement portion 33 or the 2nd laser measurement portion 34 to carry out the inspection of installment state of electronic component (element 120), also can carry out high-precision measurement.
In addition, in the present embodiment, as mentioned above, remove zone (bright area R1) integral body of laser measurement exclusionary zone by appointment, and carry out the measurement of the 1st laser measurement portion 33 or the 2nd laser measurement portion 34, thereby on the basis of having got rid of the laser measurement exclusionary zone, by measuring remaining Zone Full (bright area R1) thus can improve measuring accuracy.
In addition, in the present embodiment, as mentioned above, by at least for the J1 of solder bonds portion (J2) of the element 120 on the printed base plate of checking among the thing (installation base plate 110) 130, use the photographic images of the installation base plate 110 of shoot part 31 shootings, judge the laser measurement exclusionary zone, thereby the J1 of solder bonds portion (J2) of the element 120 in the F2 of hole portion that causes because of bubble etc. that measuring accuracy is impacted for easy generation, precipitous F3 and crack etc., can judge and get rid of the laser measurement exclusionary zone, therefore can improve measuring accuracy and shorten minute.
In addition, in the present embodiment, as mentioned above, at least comprise the zone of the shape (F2 of hole portion and precipitous F3) that is shaped as the 1st laser measurement portion 33 that is not suitable for or the 2nd laser measurement portion 34 mensuration of the measuring point of installation base plate 110 (J1 of solder bonds portion) by the laser measurement exclusionary zone, thereby detect the shape (F2 of hole portion and precipitous F3) that might impact measuring accuracy, be not suitable for the 1st laser measurement portion 33 or 34 measurements of the 2nd laser measurement portion according to photographic images, and can get rid of as the laser measurement exclusionary zone.
In addition, in the present embodiment, as mentioned above, use hole portion (recess) shape to take example and precipitous shape shooting example by making arithmetic processing section 41, detect the shape that the 1st laser measurement portion 33 that is not suitable for that comprises in the photographic images of installation base plate 110 or the 2nd laser measurement portion 34 measure, thereby with the captured image data of the installation base plate 110 of shoot part 31 and sample data comparative control and whether judge, thereby can easily detect the 1st laser measurement portion 33 that is not suitable for that comprises in the photographic images of installation base plate 110 or the shape of the 2nd laser measurement portion 34 mensuration with to take example (hole portion (recess) shape takes example and precipitous shape taken example) consistent or be similar to.
In addition, in the present embodiment, as mentioned above, by making photographic images and the substrate data of arithmetic processing section 41 according to the installation base plate 110 (inspection area) of shoot part 31, calculate the installation site deviation of element 120, installation site deviation according to the element 120 that calculates, judge the laser measurement exclusionary zone, even thereby because of being installed in the installation site deviation of the element 120 on the printed base plate 130, laser is blocked by element 120 (veil) and the zone that can't carry out the measurement of the 1st laser measurement portion 33 or the 2nd laser measurement portion 34 when carrying out laser measurement, also it can be got rid of as the laser measurement exclusionary zone.
In addition, in the present embodiment, as mentioned above, by the basis light intensity difference (contrast) of the photographic images of installation base plate 110, judge the laser measurement exclusionary zone, thereby the F2 of hole portion in the solder bonds portion of photographic images, zone such as precipitous F3, around the strength ratio low (deepening) and be arranged in zone under the shade (deepening) of highly big element 120, owing to also can be blocked and can't measure sometimes when carrying out laser measurement by highly big element 120, therefore judge the laser measurement exclusionary zone according to the strength difference in the photographic images, thereby can easily judge the laser measurement exclusionary zone.
In addition, in the present embodiment, as mentioned above, by making shoot part 31 use the illumination light of epimere illumination 322, take from the top of installation base plate 110, be not suitable for the intensity in the zone of laser measurement thereby can reduce (deepening) hole F2 of portion, precipitous F3 etc., and can improve the intensity that (brightening) is suitable for the par of laser measurement.In view of the above, owing to can enlarge the zone that is suitable for laser measurement and the intensity difference (contrast) in unaccommodated zone, so can more easily judge the laser measurement exclusionary zone according to the strength difference in the photographic images.
In addition, in the present embodiment, as mentioned above, the F2 of hole portion and precipitous F3 of being formed at solder bonds portion are got rid of as the shape that is not suitable for laser measurement, thereby, the zone with shape of the F2 of hole portion that is not suitable for laser measurement and precipitous F3 can be got rid of as the laser measurement exclusionary zone especially for the solder bonds portion (J1 and J2) of the element 120 that is easy to form the shape that is not suitable for laser measurement, measuring accuracy is easy to impact.
In addition, in the present embodiment, as mentioned above, by according to being stored in component shape data in the storage part 42, the zone (near the zone the veil F1) that the incident path of the laser that locates on will be from the 1st laser measurement portion 33 or the 2nd laser measurement portion 34 to installation base plate 110 or reflection paths might be blocked by veil F1 such as elements 120, be judged to be the laser measurement exclusionary zone, thereby when for example carrying out laser measurement because of being blocked by highly big element 120 can not check the time etc., according to the component shape data, easily near zone of decision element 120 etc. is not suitable for the zone (laser measurement exclusionary zone) of laser measurement.
In addition, in the present embodiment, as mentioned above, according to from the illuminating part 34a (33a) of the 2nd laser measurement portion 34 (the 1st laser measurement portion 33) towards the direction A of light accepting part 34b (33b) (direction of the 2nd laser measurement portion 34 (the 1st laser measurement portion 33)), the regional determination that the incident path or the reflection paths of laser might be blocked is the zone (laser measurement exclusionary zone) that is not suitable for laser measurement, thereby can consider to judge the laser measurement exclusionary zone from the illuminating part 34a (33a) of appearance inspection device 100 towards the basis of the direction A of light accepting part 34b (33b).Promptly, as Figure 11 and shown in Figure 12, according to producing when being not suitable for laser measurement regional towards the direction A of light accepting part 34b (33b) (direction of the 2nd laser measurement portion 34 (the 1st laser measurement portion 33)) from illuminating part 34a (33a), this on the basis of the photographic images of installation base plate 110 also according to the 1st known laser measurement portion 33 or the direction of the 2nd laser measurement portion 34, can get rid of the zone (laser measurement exclusionary zone) that is not suitable for laser measurement in advance.
In addition, in the present embodiment, as mentioned above, kind according to the laser measurement portion of measuring is normal reflection type the 1st laser measurement portion 33 or diffusion reflection pattern the 2nd laser measurement portion 34, and the regional determination that the incident path or the reflection paths of laser might be blocked is the zone (laser measurement exclusionary zone) that is not suitable for laser measurement.By this structure, as shown in Figure 6 and Figure 7, because according to the 1st laser measurement portion 33 (the angle α that incident path and reflection paths form) and the 2nd laser measurement portion 34 (the angle β that incident path and reflection paths form), therefore the incident path of laser is different with reflection paths, can consider the kind of laser measurement portion and judges the zone (laser measurement exclusionary zone) that is not suitable for laser measurement.In view of the above, when the zone that the kind according to laser measurement portion is not suitable for laser measurement produces difference (when measuring near the limit E4 of veil F1, with reference to Figure 11), on the basis of the photographic images of installation base plate 110,, can judge and get rid of the zone (laser measurement exclusionary zone) that is not suitable for laser measurement in advance also according to the kind of laser measurement portion.
In addition, will be understood that the disclosed embodiment of this instructions is example, does not limit the present invention.The present invention's interest field required for protection is not the explanation of above-mentioned embodiment but represents by claims, and then comprises all changes in the scope of purport of claims.
For example, in the above-described embodiment, show the example that the solder bonds portion of the element 120 of installation base plate 110 (J1 and J2) is carried out the judgement of laser measurement exclusionary zone, but the present invention is not limited to this.For example, also can when being carried out laser measurement, the coating states such as warpage, fluctuating, binding resin and sealant of the portion of terminal 121 beyond the scolder junction surface, element 120, substrate 110 self etc. carry out the judgement of laser measurement exclusionary zone.Also can carry out the judgement of laser measurement exclusionary zone for all sites as the measuring object of checking thing (installation base plate 110).
In addition, in the above-described embodiment, show the example that element 120 is checked as the inspection thing by the installation base plate 110 of solder bonds on printed base plate 130, but the present invention is not limited to this.For example, the substrate for the state of element before by solder bonds also can carry out the inspection of the installment state of element.
In addition, in the above-described embodiment, show the shooting direction of shoot part 31 and the example of installation base plate 110 approximate vertical, but the present invention is not limited to this.In the present invention, shoot part also can be taken from the vergence direction beyond the approximate vertical direction and check thing.
In addition, in the above-described embodiment, show the example that normal reflection type the 1st laser measurement portion 33 and 34 two kinds of laser measurement portions of diffusion reflection pattern the 2nd laser measurement portion are set at appearance inspection device 100, but the present invention is not limited to this.In the present invention, also can on appearance inspection device, only be provided with in normal reflection type the 1st laser measurement portion 33 and diffusion reflection pattern the 2nd laser measurement portion 34 any one of them.
In addition, in the above-described embodiment, showing photographic images, hole portion (recess) shape according to installation base plate 110 takes example and precipitous shape and takes the direction of example, the 1st laser measurement portion 33 or the 2nd laser measurement portion 34 and incident path and the angle of reflection paths formation, the various data such as position deviation, processing result image, component shape data and substrate data of element 120, judge the example of laser measurement exclusionary zone, but the present invention is not limited to this.In the present invention, use the photographic images of checking thing (installation base plate) to judge that the laser measurement exclusionary zone gets final product at least.Therefore, for example the laser measurement exclusionary zone can be do not judged yet, the laser measurement exclusionary zone can be do not judged yet according to the installation site deviation of element 120 according to the direction of laser measurement portion and the angle of incident path and reflection paths formation.
In addition, in the above-described embodiment, show in the laser measurement position of having in mind (J1 of solder bonds portion), only will remove the example of the bright area R1 of dark areas D1 to D4 (laser measurement exclusionary zone), but the present invention is not limited to this as the laser measurement object.In the present invention, also can on the basis of removing dark areas D1 to D4 (laser measurement exclusionary zone), further only carry out laser measurement for the part of bright area R1.At this moment, owing to can further dwindle the area of laser measurement subject area, therefore can in shorter time, carry out laser measurement.
In addition, in the above-described embodiment, show (recess) F2 of hole portion of solder bonds portion and precipitous F3 are got rid of the example of (being judged to be the laser measurement exclusionary zone) as the shape that is not suitable for laser measurement, but the present invention is not limited to this.In the present invention, also can be only with among the hole portion (recess) of solder bonds portion and precipitous any one of them be judged to be the laser measurement exclusionary zone.In addition, the shape decision that also can these be not suitable for laser measurement is the laser measurement exclusionary zone.
In addition, in the above-described embodiment, show and take example and precipitous shape according to hole portion (recess) shape and take routinely, (recess) F2 of hole portion of solder bonds portion and precipitous F3 are judged to be the example of the shape that is not suitable for laser measurement, but the present invention is not limited to this.For example, also can with take hole portion (recess), light intensity distribution patterns precipitous the time as information registration in the master meter group, and based on this information, whether the intensity distributions according to the zone of having in mind in the photographic images is consistent with the pattern of the information of logining or approximate, judges the shape that is not suitable for laser measurement.
In addition, in the above-described embodiment, show in the mensuration of the light and shade when carrying out the judgement of laser measurement exclusionary zone, for the captured image data that uses epimere illumination 322 to take, also use to utilize each captured image datas that stage casing illumination 323 and hypomere illumination 324 take and to make up captured image data and obtain difference etc. and carry out Flame Image Process, thereby make more clearly example of each regional light and shade (light intensity difference), but the present invention is not limited to this.In the present invention, also can only use the captured image data that utilizes the epimere illumination to take, carry out the judgement of light and shade.In addition, also can only use the captured image data that utilizes stage casing illumination, hypomere illumination or infrared illumination to take, carry out the judgement of light and shade.In addition, also can judge according to the tone of the coloured image of taking.
In addition, in the above-described embodiment, show the example that epimere illumination 322, stage casing illumination 323 and hypomere illumination 324 are set at Lighting Division 32, but the present invention is not limited to this.For example, also can only constitute the illumination of Lighting Division by the epimere illumination.
In addition, in the above-described embodiment, show and substrate data, component shape data, hole portion (recess) shape are taken example and precipitous shape take the various data storage of judgement that example etc. is used for the laser measurement exclusionary zone, but the present invention is not limited to this at the example of storage part 42.For example, also can will be used for the various data of the judgement of laser measurement exclusionary zone, be stored in the main frame that network connects etc. via outside input and output portion 44, and obtain as required.
In addition, in the above-described embodiment, show and make the inspection assembly 30 that comprises shoot part 31, Lighting Division the 32, the 1st laser measurement portion 33 and the 2nd laser measurement portion 34 etc., along the mobile example of XY direction (horizontal direction), but the present invention is not limited to this by XY mechanical arm 20.For example, inspection group's part is only moved along directions X, and on the substrate platform that can move, make that installation base plate moves along the Y direction along the Y direction.In addition, can check that also assembly be fixedly installed on the position of installation base plate top, and can installation base plate moves along the XY direction along making on the mobile substrate platform of XY direction (horizontal direction).
In addition, in the above-described embodiment, show the example that constitutes the 1st laser measurement portion 33 and the 2nd laser measurement portion 34 by the laser measuring device for measuring that uses some laser, but the present invention is not limited to this.For example, also can constitute by the laser measuring device for measuring that uses line laser.At this moment, judge that not existing laser measurement exclusionary zone or the few zone of laser measurement exclusionary zone also to measure on line highly gets final product.In addition, extract data out if remove the determination data of laser measurement exclusionary zone from the line data of measuring height, then data processing becomes rapidly, and can obtain the high data of reliability.

Claims (13)

1. testing fixture comprises:
Shoot part is taken and is checked thing;
Laser measuring device for measuring by the measuring position irradiating laser on the described inspection thing also being received the reflected light from described inspection thing, is measured the height of described inspection thing, and described testing fixture is characterised in that also and comprises:
Control part, at least use the photographic images of the described inspection thing of taking by described shoot part, judge the zone that described laser measuring device for measuring is measured that is not suitable for that comprises in the described photographic images, and from the measuring object of described laser measuring device for measuring, get rid of the zone that is not suitable for described laser measuring device for measuring measurement.
2. testing fixture according to claim 1 is characterized in that:
Described control part for got rid of described at least a portion that is not suitable for the zone behind the zone that laser measuring device for measuring measures from described photographic images, is carried out the measurement of described laser measuring device for measuring.
3. testing fixture according to claim 1 is characterized in that:
The described zone that is not suitable for the laser measuring device for measuring measurement comprises that at least being shaped as of described inspection thing is not suitable for the zone of the shape of described laser measuring device for measuring mensuration.
4. testing fixture according to claim 3 is characterized in that:
Described control part uses the information about the shape that is not suitable for described laser measuring device for measuring mensuration, detects the described shape that is not suitable for laser measuring device for measuring mensuration that comprises in the described photographic images.
5. testing fixture according to claim 1 is characterized in that:
Described control part according to the light intensity difference in the described photographic images, is judged the described zone that laser measuring device for measuring is measured that is not suitable for.
6. testing fixture according to claim 5 is characterized in that also comprising:
Lighting Division, from the top irradiating illumination light of described inspection thing, wherein,
Described shoot part uses by the illumination light of described Lighting Division from the top irradiation of described inspection thing, takes from the top of described inspection thing.
7. testing fixture according to claim 1 is characterized in that:
Described laser measuring device for measuring comprises: the illuminating part that described inspection thing is penetrated laser; And the catoptrical light accepting part that receives described inspection thing reflection, wherein,
Described control part, according to from the direction of described illuminating part towards described light accepting part, the incident path of laser that will be from described illuminating part to described inspection thing or the zone that the catoptrical reflection paths from described inspection thing to described light accepting part might be blocked are judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.
8. testing fixture according to claim 1 is characterized in that:
Described inspection thing is the installation base plate that electronic component is installed on the substrate,
Described control part to being positioned at the solder bonds portion of the electronic component on the described substrate in the described inspection thing, uses described photographic images at least, judges the described zone that laser measuring device for measuring is measured that is not suitable for.
9. testing fixture according to claim 8 is characterized in that:
The described zone that is not suitable for the laser measuring device for measuring measurement comprises that at least being shaped as of described inspection thing is not suitable for the zone of the shape of described laser measuring device for measuring mensuration,
Described be not suitable for shape that laser measuring device for measuring measures be included among formed hole portion in the solder bonds portion and precipitous at least one of them.
10. testing fixture according to claim 8 is characterized in that:
Described control part, further according to information about the shape that is installed in the electronic component on the described substrate, the incident path of laser that will be from described laser measuring device for measuring to described inspection thing or the zone that might be blocked by described electronic component from the catoptrical reflection paths of described inspection thing are judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.
11. testing fixture according to claim 8 is characterized in that:
Described control part, according to described photographic images, calculate the installation site deviation of the design and installation position of the installation site that is installed in the electronic component on the described substrate and predefined electronic component, and, judge the described zone that laser measuring device for measuring is measured that is not suitable for according to the described installation site deviation of the electronic component that is calculated.
12. testing fixture according to claim 7 is characterized in that:
Described laser measuring device for measuring comprises:
Normal reflection type measurement mechanism receives the normal reflection composition among the reflected light of described inspection thing reflection; And
The diffusion reflection pattern measurement mechanism receives the scattered reflection composition among the reflected light of described inspection thing reflection, wherein,
Described control part, kind according to the described laser measuring device for measuring of measuring is described normal reflection type measurement mechanism or described diffusion reflection pattern measurement mechanism, the incident path of laser that will be from described illuminating part to described inspection thing or the zone that the catoptrical reflection paths from described inspection thing to described light accepting part might be blocked are judged to be the described zone that laser measuring device for measuring is measured that is not suitable for.
13. an inspection method comprises and takes the step of checking thing, it is characterized in that further comprising the steps of:
Use the photographic images of captured described inspection thing, judge the zone that is not suitable for laser measurement that comprises in the described photographic images, and from the measuring object of described laser, get rid of the step in the zone that is not suitable for described laser measurement; And
By the measuring position irradiating laser on the described inspection thing also being received reflected light, measure the step of the height of described inspection thing from described inspection thing.
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