TWI611194B - Apparatus for inspecting loaded status of electronic components - Google Patents

Apparatus for inspecting loaded status of electronic components Download PDF

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TWI611194B
TWI611194B TW105143652A TW105143652A TWI611194B TW I611194 B TWI611194 B TW I611194B TW 105143652 A TW105143652 A TW 105143652A TW 105143652 A TW105143652 A TW 105143652A TW I611194 B TWI611194 B TW I611194B
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light
electronic components
electronic component
camera
loading state
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TW201732304A (en
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盧種基
李斗吉
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泰克元有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00Prospecting or detecting by optical means
    • G01V8/10Detecting, e.g. by using light barriers
    • G01V8/20Detecting, e.g. by using light barriers using multiple transmitters or receivers
    • G01V8/22Detecting, e.g. by using light barriers using multiple transmitters or receivers using reflectors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00Prospecting or detecting by optical means
    • G01V8/10Detecting, e.g. by using light barriers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00Measuring or testing not otherwise provided for
    • G01D21/02Measuring two or more variables by means not covered by a single other subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/39Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using tunable lasers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
    • G01N15/10Investigating individual particles
    • G01N15/14Electro-optical investigation, e.g. flow cytometers
    • G01N15/1434Electro-optical investigation, e.g. flow cytometers using an analyser being characterised by its optical arrangement
    • G01N2015/1438Using two lasers in succession

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Abstract

本發明係關於電子部件裝載狀態檢測裝置,包括:至少一個光照射器,對裝載於位於檢測位置的裝載托盤的複數個電子部件照射光;至少一個攝影機,對通過上述光照射器來照射光的複數個電子部件進行拍攝;分析器,對通過上述攝影機獲得的圖像內的光的形態進行分析來檢測電子部件的裝載狀態,從正面觀察時,連接反射點和上述攝影機的第一直線和連接上述反射點和上述光照射器的第二直線形成的角度大於0度小於180度,上述反射點為通過上述至少一個光照射器向複數個電子部件照射的光與複數個電子部件相接位置。並且公開了利用所照射的光的變化形態來檢測電子部件的裝載狀態,處理速度快並準確地確認電子部件的裝載狀態的技術。 The present invention relates to an electronic component loading state detection device, including: at least one light irradiator for irradiating light to a plurality of electronic components mounted on a loading tray located at a detection position; and at least one camera for irradiating light through the light irradiator. A plurality of electronic components are photographed; the analyzer analyzes the shape of the light in the image obtained by the camera to detect the loading state of the electronic component, and when viewed from the front, connects the reflection point with the first straight line of the camera and connects the above An angle formed by the reflection point and the second straight line of the light irradiator is greater than 0 degrees and less than 180 degrees, and the reflection point is a position where the light irradiated to the plurality of electronic components through the at least one light irradiator contacts the plurality of electronic components. In addition, a technology for detecting a loading state of an electronic component using a changed form of the irradiated light is disclosed, and a processing speed is fast and the loading state of the electronic component is accurately confirmed.

Description

電子部件裝載狀態檢測裝置 Electronic component loading state detecting device

本發明係關於用於對電子部件是否妥當地裝載於可裝載電子部件的裝載托盤進行檢測的電子部件裝載狀態檢測裝置。 The present invention relates to an electronic component loading state detection device for detecting whether an electronic component is properly loaded on a loading tray capable of loading electronic components.

如固態硬碟(SSD,Solid-state Drive)或記憶體等電子部件需要經過標籤附著作業、包殼作業、電特性測試作業後僅出廠優質品。 Electronic components such as solid-state drives (SSDs) or memories need to be shipped from the high-quality products only after they have been attached to the labeling industry, enclosure work, and electrical characteristics test operations.

為執行如上的作業,電子部件經常需要以裝載於裝載托盤的狀態來搬運。當然,通常複數個電子部件一同裝載在裝載托盤。 In order to perform the above operations, electronic components often need to be carried in a state of being loaded on a loading tray. Of course, a plurality of electronic components are usually loaded on a loading tray together.

但是,假如電子部件的裝載狀態不良,由於採樣機器人的把持也不良,因此此後標籤附著作業或包殼作業也可出現問題,而且與測試器的電接觸發生不良,使測試作業也可發生問題。 However, if the loading state of the electronic components is poor, since the sampling robot is also poorly held, problems such as labeling or enclosing work may occur thereafter, and electrical contact with the tester may be defective, which may cause problems in the test operation.

因此,需要確認電子部件是否妥當地裝載到裝載托盤的步驟。 Therefore, it is necessary to confirm whether the electronic components are properly loaded on the loading tray.

作為確認電子部件是否妥當地裝載到裝載托盤的技術,可參照韓國公開專利第10-2008-0013658號(以下稱 “現有技術1”)。 As a technique for confirming whether electronic components are properly loaded on a loading tray, refer to Korean Published Patent No. 10-2008-0013658 (hereinafter referred to as "Prior Art 1").

現有技術1公開了通過發光和受光來確認半導體器件是否裝載於托盤的技術。但是,根據現有技術1公開的技術,雖然可以檢測電子部件有無存在於托盤,但是對於檢測裝載狀態具有局限性。並且,要想適用現有技術1,電子部件必須以向光所照射的方向具有比較寬的面的方式來裝載。 The prior art 1 discloses a technique for confirming whether a semiconductor device is mounted on a tray by emitting and receiving light. However, according to the technology disclosed in the prior art 1, although the presence or absence of an electronic component can be detected in the tray, it has a limitation in detecting the loading state. In addition, in order to apply the conventional technology 1, the electronic component must be mounted so as to have a relatively wide surface in a direction in which light is irradiated.

並且,韓國公開專利第10-2011-0100403號(以下稱“現有技術2”)等,雖然公開了利用攝影機來檢測的技術,但是現有技術2的情況下通過攝影機而拍攝的面也需要比較寬。更為,根據現有技術2公開的技術,構成裝載托盤的結構的複數個線為複雜的情況下,通過攝影機而拍攝的圖像中有難以掌握裝載托盤的裝載狀態,即使掌握了也需要確認電子部件的線(Line)等而需要很長的分析時間。而且,由於為了拍攝清晰的圖像而使用高價的攝影機及高性能的分析器,導致生產成本也上升。 In addition, although Korean Published Patent No. 10-2011-0100403 (hereinafter referred to as "Prior Art 2") and the like disclose technologies for detecting using a camera, in the case of the prior art 2, the surface captured by the camera also needs to be relatively wide. . Furthermore, according to the technology disclosed in the prior art 2, when a plurality of lines constituting the structure of the loading tray are complicated, it is difficult to grasp the loading state of the loading tray in the image captured by the camera. The line of a part etc. requires a long analysis time. In addition, the use of expensive cameras and high-performance analyzers to capture clear images has resulted in increased production costs.

因此,在電子部件以垂直立式狀態裝載於裝載托盤的情況下,難以適用現有技術1及現有技術2。 Therefore, when the electronic components are mounted on the loading tray in a vertical state, it is difficult to apply the related art 1 and the related art 2.

本發明的目的在於,提供利用光的圖案來檢測以垂直立式狀態所裝載的電子部件的裝載狀態的技術。 An object of the present invention is to provide a technique for detecting a loading state of an electronic component mounted in a vertical upright state using a pattern of light.

根據本發明的第一形態的電子部件裝載狀態檢測裝 置,包括:至少一個光照射器,對裝載於裝載托盤的複數個電子部件照射具有規定形態的檢測圖案的光;至少一個攝影機,對通過上述光照射器來照射光的複數個電子部件進行拍攝;分析器,分析對上述至少一個攝影機獲得的圖像內的檢測圖案進行分析來檢測電子部件的裝載狀態,從正面觀察時,連接反射點和上述攝影機的第一直線和連接上述反射點和上述光照射器的第二直線形成的角度大於0度小於180度,上述反射點為通過上述至少一個光照射器向複數個電子部件照射的光與複數個電子部件相接的位置。 According to the first aspect of the present invention, the electronic component loading state detecting device The device includes: at least one light irradiator for irradiating the plurality of electronic components mounted on the loading tray with light having a detection pattern of a predetermined shape; and at least one camera for photographing the plurality of electronic components irradiated with light by the light irradiator An analyzer that analyzes the detection pattern in the image obtained by the at least one camera to detect the loading state of the electronic component, and when viewed from the front, a first straight line connecting the reflection point and the camera and connecting the reflection point and the light The angle formed by the second straight line of the illuminator is greater than 0 degrees and less than 180 degrees, and the reflection point is a position where the light irradiated to the plurality of electronic components through the at least one light irradiator is in contact with the plurality of electronic components.

上述至少一個光照射器配置在上述反射點的一側上方,上述至少一個攝影機配置在上述反射點的另一側上方。 The at least one light irradiator is disposed above one side of the reflection point, and the at least one camera is disposed above the other side of the reflection point.

上述光照射器所照射的光是雷射。 The light irradiated by the light irradiator is a laser.

本發明還可包括調節器,上述調節器執行調節上述光照射器的高度或者調節上述光照射器的照射角中的至少一個功能。 The present invention may further include a regulator that performs at least one function of adjusting a height of the light irradiator or an irradiation angle of the light irradiator.

上述分析器根據通過上述攝影機所拍攝的圖像中在複數個電子部件產生的複數個反射點是否具有正常圖案來分析電子部件的裝載狀態。 The analyzer analyzes the loading state of the electronic component based on whether or not the plurality of reflection points generated in the plurality of electronic components in the images captured by the camera have a normal pattern.

通過上述光照射器所照射的光是在平面上以線性來表現的線性光。 The light irradiated by the light irradiator is linear light expressed linearly on a plane.

在平面上觀察,上述攝影機以脫離複數個電子部件的裝載區域的方式設置。 When viewed in a plane, the camera is installed so as to be separated from a loading area of a plurality of electronic components.

在平面上觀察,上述光照射器以脫離複數個電子部件 的裝載區域的方式設置。 When viewed in a plane, the light irradiator is separated from a plurality of electronic components. Way of loading area.

上述攝影機為網路攝影機。 The above cameras are web cameras.

根據本發明的第二形態的電子部件裝載狀態檢測裝置,包括:複數個光照射器,對裝載於裝載托盤的複數個電子部件照射具有規定形態的檢測圖案的光;至少一個攝影機,對通過上述光照射器來照射光的複數個電子部件進行拍攝;分析器,對通過上述至少一個攝影機獲得的圖像內的檢測圖案進行分析來檢測電子部件的裝載狀態,通過上述複數個光照射器所照射的複數個光在電子部件的寬度內具有相互隔開的間距,使通過上述複數個光照射器所照射的複數個光在一個電子部件產生複數個反射點。 An electronic component loading state detection device according to a second aspect of the present invention includes: a plurality of light irradiators that irradiate a plurality of electronic components mounted on a loading tray with light having a detection pattern of a predetermined shape; and at least one camera, A light irradiator to illuminate a plurality of electronic components for shooting; an analyzer analyzes a detection pattern in an image obtained by the at least one camera to detect a loading state of the electronic components, and is irradiated by the plurality of light irradiators The plurality of light has a spaced apart distance from each other within the width of the electronic component, so that the plurality of light irradiated by the plurality of light irradiators generates a plurality of reflection points on one electronic component.

上述至少一個光照射器配置在上述反射點的一側上方,上述至少一個攝影機配置在上述反射點的另一側上方。 The at least one light irradiator is disposed above one side of the reflection point, and the at least one camera is disposed above the other side of the reflection point.

上述光照射器所照射的光是雷射。 The light irradiated by the light irradiator is a laser.

本發明還包括調節器,上述調節器執行調節上述光照射器的高度或者調節上述光照射器的照射角中的至少一個功能。 The present invention further includes a regulator that performs at least one of a function of adjusting a height of the light irradiator or an irradiation angle of the light irradiator.

上述分析器通過上述攝影機所拍攝的圖像中產生在複數個電子部件的反射點是否具有正常圖案來分析電子部件的裝載狀態。 The analyzer analyzes the loading state of the electronic component based on whether the reflection points of the plurality of electronic components have a normal pattern in the images captured by the camera.

光照射器所照射的光是在平面上以線性來表現的線性光。 The light irradiated by the light irradiator is linear light expressed linearly on a plane.

在平面上觀察,上述攝影機以脫離複數個電子部件的裝載區域的方式設置。 When viewed in a plane, the camera is installed so as to be separated from a loading area of a plurality of electronic components.

在平面上觀察,上述光照射器以脫離複數個電子部件的裝載區域的方式設置。 When viewed in a plane, the light irradiator is provided so as to be separated from a loading area of a plurality of electronic components.

上述攝影機為網路攝影機。 The above cameras are web cameras.

根據本發明的電子部件裝載狀態檢測裝置,由於確認所照射的光與電子部件相接的複數個反射點的配置形態來分析裝載於裝載托盤的複數個電子部件的裝載狀態,具有如下的效果。 According to the electronic component loading state detection device of the present invention, the arrangement status of the plurality of electronic components loaded on the loading tray can be analyzed by confirming the arrangement pattern of the plurality of reflection points where the irradiated light is in contact with the electronic component, and has the following effects.

第一,以垂直立式狀態裝載所要裝載的複數個電子部件後,分析複數個電子部件的裝載狀態的分析時間快。 First, after a plurality of electronic components to be loaded are loaded in a vertical state, the analysis time for analyzing the loading state of the plurality of electronic components is fast.

第二,由於可以準確地確認複數個反射點的位置,可準確地掌握複數個電子部件的裝載狀態。 Second, since the positions of the plurality of reflection points can be accurately confirmed, the loading status of the plurality of electronic components can be accurately grasped.

第三,更為,由於對每一個電子部件照射兩個線性光,進而提高檢測的準確度。 Thirdly, since two linear lights are irradiated to each electronic component, the accuracy of detection is improved.

第四,對有無裝載電子部件、是否有未完全裝載的情況、是否以前後方向傾斜、是否以左右方向所傾斜等均可進行確認。 Fourth, the presence or absence of electronic components, incomplete loading, tilting in the front-back direction, and tilting in the left-right direction can be checked.

第五,由於使用低像素的廉價網路攝影機和低性能的分析器也可在所拍攝的圖像中充分掌握電子部件的裝載狀態,可節省費用。 Fifth, because a low-cost inexpensive webcam and a low-performance analyzer can also fully grasp the loading state of electronic components in the captured image, it can save costs.

200‧‧‧檢測裝置 200‧‧‧testing device

210、210a-210d、 210, 210a-210d,

211、212‧‧‧光照射器 211, 212‧‧‧light irradiator

220、220a-220d‧‧‧攝影機 220、220a-220d‧‧‧Camera

230‧‧‧分析器 230‧‧‧ Analyzer

241‧‧‧高度調節部分 241‧‧‧Height adjustment section

242‧‧‧照射角調節部分 242‧‧‧irradiation angle adjustment section

L1‧‧‧第一直線 L 1 ‧‧‧ the first straight line

L2‧‧‧第二直線 L 2 ‧‧‧ second straight line

PL‧‧‧垂直線 PL‧‧‧ vertical line

RP、RP’、RP1、RP2RP, RP ', RP 1 , RP 2 ,

RP1’、RP2’‧‧‧反射點 RP 1 ', RP 2 ' ‧‧‧ reflection point

ED、ED’‧‧‧電子部件 ED 、 ED’‧‧‧Electronic components

LT‧‧‧裝載托盤 LT‧‧‧Loading tray

Γ‧‧‧角 Γ‧‧‧ corner

θ‧‧‧第一角 θ‧‧‧ the first angle

β‧‧‧第二角 β‧‧‧ second angle

GS1、GS2‧‧‧把持槽 GS 1 , GS 2 ‧‧‧ holding slot

LR、LR1、LR2‧‧‧線性雷射 LR, LR 1 , LR 2 ‧‧‧ linear laser

SL‧‧‧直線 SL‧‧‧Straight

W1‧‧‧寬度 W1‧‧‧Width

W2‧‧‧間距 W2‧‧‧Pitch

LIR‧‧‧左側設置台 LIR‧‧‧Setting table on the left

RIR‧‧‧右側設置台 RIR‧‧‧Right Setting Table

圖1為說明根據本發明的與檢測裝置相關的裝載托盤的參照圖。 FIG. 1 is a reference diagram illustrating a loading tray related to a detection device according to the present invention.

圖2為示出根據本發明的最基本結構的檢測裝置的結 構圖。 FIG. 2 shows the structure of a detection device according to the most basic structure of the present invention. Composition.

圖3及圖4為說明設置於圖2的檢測裝置的光照射器照射的線性雷射的參照圖。 3 and 4 are reference views illustrating a linear laser beam irradiated by a light irradiator provided in the detection device of FIG. 2.

圖5為說明圖2的檢測裝置中掌握電子部件的裝載不良的功能的參照圖。 FIG. 5 is a reference diagram illustrating a function of detecting a defective loading of an electronic component in the detection device of FIG. 2.

圖6至圖11為說明適用複數個光照射器的情況下掌握電子部件的裝載不良的功能的參照圖。 6 to 11 are reference views illustrating a function of grasping a defective loading of an electronic component when a plurality of light irradiators are applied.

圖12為示出根據本發明的較佳的實施例的檢測裝置的結構圖。 FIG. 12 is a block diagram showing a detection device according to a preferred embodiment of the present invention.

以下,將參照圖式對如上所述的本發明的較佳的實施例進行說明,為說明的簡練性對重複的說明盡可能地省略或壓縮。 Hereinafter, the preferred embodiments of the present invention described above will be described with reference to the drawings, and repeated descriptions are omitted or compressed as much as possible for the sake of brevity.

對裝載托盤的說明 Instructions for loading trays

圖1為示出根據本發明的與電子部件裝載狀態檢測裝置(以下,簡稱為“檢測裝置”)相關的裝載托盤LT的平面立體圖。 FIG. 1 is a plan perspective view showing a loading tray LT related to an electronic component loading state detection device (hereinafter, simply referred to as a “detection device”) according to the present invention.

十六個電子部件ED(例如固態硬碟(SSD)或記憶體)以8x2行列的形態和垂直立式狀態裝載於裝載托盤LT。電子部件ED能夠以通過相互相向的一對把持槽GS1、GS2兩端被把持的狀態裝載於裝載托盤LT。因此,裝載於裝載托盤LT的電子部件ED可維持垂直立式狀態。 Sixteen electronic components ED (such as a solid state drive (SSD) or a memory) are mounted on the loading tray LT in an 8x2 array and a vertical position. The electronic component ED can be loaded on the loading tray LT in a state where both ends of the pair of holding grooves GS 1 and GS 2 facing each other are held. Therefore, the electronic component ED loaded on the loading tray LT can maintain the vertical state.

對檢測裝置的基本結構的說明 Explanation of the basic structure of the detection device

圖2圖示在正面觀察的根據本發明的最基本結構的檢 測裝置200(實線部分)。 FIG. 2 illustrates an inspection of the most basic structure according to the present invention viewed from the front. 测 装置 200 (Solid line part).

檢測裝置200包括光照射器210、攝影機220及分析器230。 The detection device 200 includes a light irradiator 210, a camera 220, and an analyzer 230.

如圖3所示的俯視圖,光照射器210用於向位於下方的裝載托盤LT的複數個電子部件ED照射線性雷射。其中,較佳地,線性雷射LR在沒有凹凸或彎曲的平面上如圖4的(a)部分所示,以連續性直線來表現。但是,也能夠以如圖4的(b)部分和(c)部分所示的連續性圓弧或規定的圖案及點光等來表現。即,只要是以可以發現除了在規定的線上所設定的正常的檢測圖案以外的不規則的不良圖案條件來照射線性雷射LR,則可進行任何變形。而且,如果可以滿足光能夠在平面上以線性來所表現的條件,也可使用除了雷射以外的其他光。 As shown in the plan view shown in FIG. 3, the light irradiator 210 is used to irradiate a plurality of electronic components ED of the lower loading tray LT with a linear laser. Among them, it is preferable that the linear laser LR is represented by a continuous straight line as shown in part (a) of FIG. 4 on a plane having no unevenness or curvature. However, it can also be expressed as a continuous arc or a predetermined pattern, spot light, etc. as shown in parts (b) and (c) of FIG. 4. That is, as long as the linear laser LR is irradiated under a poor pattern condition where irregular irregularities other than the normal detection pattern set on a predetermined line can be found, any deformation can be performed. Moreover, if the condition that light can be expressed linearly on a plane can be satisfied, other light than laser can also be used.

攝影機220對裝載托盤LT的複數個電子部件ED進行拍攝。通過這種攝影機220所拍攝的圖像來表現如圖1及3所示的線性雷射LR與電子部件ED相接而反射的反射點RP。 The camera 220 captures a plurality of electronic components ED on the loading tray LT. The image captured by the camera 220 represents a reflection point RP in which the linear laser LR shown in FIGS. 1 and 3 is in contact with the electronic component ED and is reflected.

分析器230對通過攝影機220來獲得的圖像內的雷射形態進行分析來檢測電子部件ED的裝載狀態。更詳細地說明,分析器230對通過光照射器210向複數個電子部件ED照射的線性雷射LR與複數個電子部件ED相接而反射的複數個反射點RP的圖案進行分析來檢測電子部件ED的裝載狀態。 The analyzer 230 analyzes the laser morphology in the image obtained by the camera 220 to detect the loading state of the electronic component ED. To explain in more detail, the analyzer 230 analyzes the pattern of the plurality of reflection points RP which are reflected by the linear laser LR irradiated to the plurality of electronic components ED through the light irradiator 210 and the plurality of electronic components ED and reflected, and detects the electronic component. Loading status of ED.

另一方面,從正面觀察,攝影機220以連接反射點RP 與攝影機220的第一直線L1和垂直線PL構成小於0度大於-90度的第一角θ的方式來配置。而且,從正面觀察,光照射器210以連接反射點RP與光照射器210的第二直線L2和垂直線PL構成大於0度小於90度的第二角β的方式來配置。其中,第一直線L1為攝影機220的拍攝線,第二直線L2為通過光照射器210向裝載托盤LT照射的線性雷射LR的照射線。因此,第一直線L1和第二直線L2構成的角Γ(Γ=θ+β)大於0度小於180度。具有這種配置的理由是為明確地確認此後將要說明的因複數個反射點RP的高度差而以不規則的圖案所表現的複數個反射點RP的排列錯誤。因此,較佳地,為了使複數個反射點RP的位移差極大化而可使第一直線L1和第二直線L2構成盡可能大的角Γ。因此,第二直線L2和垂直線PL可構成大於0度小於90度範圍內的角,但是為極其明確地觀察複數個電子部件ED的裝載狀態正常時和不良時的複數個反射點RP的位移差,而第二直線L2與垂直線PL構成的角越接近90度越好。而且,對應於此,光的入射角和反射角相同,因此攝影機220位於具有與入射角相對應的反射角位置才可以清楚地表示反射點RP,所以第一直線L1和垂直線實現的角越接近-90度越較佳。但是,在狹小的空間上配置設計的局限和光的散射等綜合考慮並通過多次的實驗來確認的結果,發現第一直線L1和第二直線L2實現的角Γ越接近90度,檢測功能越妥當。 On the other hand, when viewed from the front, the camera 220 is arranged so that the first straight line L 1 and the vertical line PL connecting the reflection point RP and the camera 220 form a first angle θ less than 0 degrees and greater than -90 degrees. When viewed from the front, the light irradiator 210 is arranged so that the second straight line L 2 and the vertical line PL connecting the reflection point RP and the light irradiator 210 form a second angle β greater than 0 degrees and less than 90 degrees. The first straight line L 1 is an imaging line of the camera 220, and the second straight line L 2 is an irradiation line of the linear laser LR that is irradiated to the loading tray LT through the light irradiator 210. Therefore, the angle Γ (Γ = θ + β) formed by the first straight line L 1 and the second straight line L 2 is larger than 0 degrees and smaller than 180 degrees. The reason for having such an arrangement is to clearly confirm that the arrangement of the plurality of reflection points RP in an irregular pattern due to the height difference of the plurality of reflection points RP will be described later. Therefore, it is preferable that the first straight line L 1 and the second straight line L 2 form an angle Γ as large as possible in order to maximize the difference in displacement between the plurality of reflection points RP. Therefore, the second straight line L 2 and the vertical line PL may constitute an angle in the range of more than 0 degrees and less than 90 degrees, but in order to clearly observe the plurality of reflection points RP when the loading state of the plurality of electronic components ED is normal and when they are defective. The difference in displacement is, and the closer the angle formed by the second straight line L 2 and the vertical line PL is to 90 degrees, the better. Moreover, corresponding to this, the incident angle and reflection angle of light are the same, so that the camera 220 can clearly indicate the reflection point RP at a position having a reflection angle corresponding to the angle of incidence, so the angle between the first straight line L 1 and the vertical line becomes The closer to -90 degrees, the better. However, as a result of comprehensive consideration of design constraints and light scattering in a small space and confirmation through multiple experiments, it was found that the closer the angle Γ achieved by the first straight line L 1 and the second straight line L 2 is to 90 degrees, the detection function The more appropriate.

因此,較佳地,若攝影機220位於反射點RP的一側 上方(圖2中左側上方),則光照射器210位於反射點RP的另一側上方(圖2中右側上方)。 Therefore, preferably, if the camera 220 is located on one side of the reflection point RP Above (upper left side in FIG. 2), the light irradiator 210 is located above the other side of the reflection point RP (upper right side in FIG. 2).

隨著第二直線L2和垂直線PL構成第二角β,若對裝載電子部件ED的裝載托盤LT照射雷射,則通過攝影機220所拍攝的複數個反射點RP如圖3所示。圖3所示的虛線意味著無視位於複數個反射點RP的下側的裝載托盤LT的複雜的結構而假設為平面來圖示的線性雷射LR As the second straight line L 2 and the vertical line PL constitute a second angle β, when a laser is irradiated to the loading tray LT on which the electronic components ED are mounted, a plurality of reflection points RP captured by the camera 220 are shown in FIG. 3. The dotted line shown in FIG. 3 means a linear laser LR that is assumed to be a flat surface regardless of the complicated structure of the loading tray LT located under the plurality of reflection points RP.

但是,如圖5的(a)部分的主視圖所示,在任一個電子部件ED’向上方突出的情況下,線性雷射LR優先與比其他複數個電子部件ED的上端更突出的電子部件ED’的上端相接。因此,因突出的電子部件ED’而產生的反射點RP’與因其他電子部件ED而產生的複數個反射點RP相比位於更高處。這種情況下,因第一直線L1和第二直線L2構成大於0度的角,所以如圖5的(b)部分所示,通過攝影機220所拍攝的圖像中複數個反射點RP、RP’的排列發生錯誤。即,因突出的電子部件ED’而產生的反射點RP’可脫離連接因其他複數個電子部件ED而產生的複數個反射點RP的直線SL。由此,分析器230對通過攝影機220所拍攝的圖像中複數個反射點RP、RP’的圖案進行分析來確認一個反射點RP’脫離直線SL並判斷突出的電子部件ED’的裝載狀態有錯誤。 However, as shown in the front view of part (a) of FIG. 5, when any one of the electronic components ED ′ protrudes upward, the linear laser LR has priority over the electronic component ED protruding more than the upper end of the other plurality of electronic components ED. 'The upper ends meet. Therefore, the reflection point RP 'generated by the protruding electronic component ED' is located higher than the plurality of reflection points RP generated by other electronic components ED. In this case, since the first straight line L 1 and the second straight line L 2 form an angle greater than 0 degrees, as shown in part (b) of FIG. 5, a plurality of reflection points RP, The alignment of RP 'is wrong. That is, the reflection point RP ′ generated by the protruding electronic component ED ′ may be separated from the straight line SL connecting the plurality of reflection points RP generated by the other plurality of electronic components ED. As a result, the analyzer 230 analyzes the patterns of the plurality of reflection points RP, RP 'in the image captured by the camera 220 to confirm that one reflection point RP' deviates from the straight line SL and determines whether the protruding electronic component ED 'has a loading state. error.

如上所述,因複數個反射點RP、RP’的高低差需要明確地表現在攝影機220的圖像中,而第一直線L1和垂直線PL構成的第一角θ的絕對值越大越較佳。當然,第二直線 L2和垂直線PL構成的第二角β的絕對值越大,則複數個反射點RP、RP’的高低差也越大。但是,第二直線L2和垂直線PL構成的第二角β越小,則複數個反射點RP、RP’越窄且越清楚。因此,第二直線L2和垂直線PL構成的第二角β需要一同考慮適當的清楚性和複數個反射點RP、RP’的高低差。 As described above, because the plurality of reflection points RP, RP 'height difference need to clearly manifested in the camera image 220, and the absolute value of L and the vertical line PL constituting a first angle θ greater the more preferred first linear. Of course, the larger the absolute value of the second angle β formed by the second straight line L 2 and the vertical line PL, the larger the difference in height between the plurality of reflection points RP, RP ′. However, the smaller the second angle β formed by the second straight line L 2 and the vertical line PL, the narrower and clearer the plurality of reflection points RP, RP ′. Therefore, the second angle β formed by the second straight line L 2 and the vertical line PL needs to consider appropriate clarity and the height difference of the plurality of reflection points RP and RP ′ together.

作為參考,圖2中圖示攝影機220位於左側,光照射器210位於右側,在以如上所述的垂直線PL為基準的相反的兩側分別具備攝影機220和光照射器210即可。而且,攝影機220和光照射器210如圖2所示地配置,則與電子部件ED以電子部件ED的寬面朝向前後方向的方式裝載於裝載托盤的情況相比,可更加明確且正確地測定。 For reference, the camera 220 shown in FIG. 2 is located on the left side, and the light irradiator 210 is located on the right side. The camera 220 and the light irradiator 210 may be provided on opposite sides based on the vertical line PL as described above. In addition, the camera 220 and the light irradiator 210 are arranged as shown in FIG. 2, and the measurement can be performed more clearly and accurately than when the electronic component ED is mounted on the loading tray with the wide surface of the electronic component ED facing the front-back direction.

根據如上所述的本發明,分析器230只要是能夠確認反射點RP的即可,因此適用像素低且廉價的網路攝影機作為攝影機220也充分。通常,最近出現的手機適用1500萬像素的攝影機,但是適用於本發明的網路攝影機為200萬像素,鏡片的直徑在1mm至3mm即可。例如,網路攝影機為3萬元左右,與10萬元以上的產業用攝影機相比便宜,而且非常薄且小而可用於筆記本電腦、廉價的手機、內窺鏡,從而也可適用在狹小的空間。因此,可以是非常小的小型攝影機,從而設置性好且提高設計的自由度。當然,分析器230也是具備能夠妥當地檢測電子部件ED的裝載狀態的程度的低性能即可。 According to the present invention as described above, the analyzer 230 only needs to be able to confirm the reflection point RP. Therefore, it is sufficient to apply the low-cost and low-cost network camera as the camera 220. Generally, a recently appeared mobile phone is suitable for a 15 megapixel camera, but a web camera suitable for the present invention is 2 megapixels, and the diameter of the lens may be 1 mm to 3 mm. For example, the network camera is about 30,000 yuan, which is cheaper than the industrial camera above 100,000 yuan, and it is very thin and small, and can be used in notebook computers, cheap mobile phones, and endoscopes. space. Therefore, it can be a very small compact camera, so the installation is good and the freedom of design is improved. Of course, the analyzer 230 may be provided with low performance to the extent that it can properly detect the loading state of the electronic component ED.

目前為止,說明了通過一個光照射器210來檢測電子 部件ED的裝載狀態的情況。但是,如誇張的圖6所示,特定電子部件ED’的反射點RP’能夠以高度與其他電子部件ED的反射點RP的高度相同且歪曲的方式裝載。那麽,利用圖3中的分析器230無法掌握其錯誤。如圖7所示,適用兩個光照射器211、212來可解決這種問題。 So far, the detection of electrons by a light irradiator 210 has been described. The loading status of the component ED. However, as shown in FIG. 6 which is exaggerated, the reflection point RP 'of the specific electronic component ED' can be mounted so that its height is the same as the height of the reflection point RP of the other electronic component ED and is distorted. Then, the analyzer 230 in FIG. 3 cannot grasp the error. As shown in FIG. 7, two light irradiators 211 and 212 are applied to solve this problem.

根據圖7所示,通過兩個光照射器211、212在一個電子部件ED產生兩個反射點RP1、RP2。即,如圖8所示,通過兩個光照射器211、212使兩個線性雷射LR1、LR2在電子部件ED的寬度w1內以具有相互隔開的間距w2而照射。根據這個例子,在存在如圖6所示的狀態的裝載不良的情況下,通過攝影機220所拍攝的圖像中如圖9的(a)部分及(b)部分所示的複數個反射點RP1、RP2的兩個圖案表現為不良,因此分析器230也可確認在電子部件ED的裝載狀態存在錯誤。其中可看出,RP1、RP2為不良圖案的例子。而且,如誇張的圖10的(a)部分所示,以一側(圖10中為左側)的反射點RP1、RP1’良好表現的方式存在裝載不良的情況下,如圖10的(b)部分所示,一側的1圖案根據情況會無法區分正常時和不良時。儘管如此,另一側(圖10中為右側)的2圖案表現為不良,因此無論任何情況下,分析器230都可判斷電子部件ED的裝載不良。而且,電子部件以如圖10所示的方式裝載的狀態下,也可通過光照射器的照射位置確認到兩個圖案都為不良。這是根據檢測人員的意圖可使雷射的照射位置向左側方或右側方移動來補償。 As shown in FIG. 7, two reflection points RP 1 and RP 2 are generated on one electronic component ED by the two light irradiators 211 and 212. That is, as shown in FIG. 8, the two linear lasers LR 1 and LR 2 are irradiated with a distance w 2 spaced apart from each other within the width w 1 of the electronic component ED by the two light irradiators 211 and 212. According to this example, when there is a loading failure in the state shown in FIG. 6, the plurality of reflection points RP shown in parts (a) and (b) of FIG. 9 in the image captured by the camera 220 1. The two patterns of RP 2 are defective, so the analyzer 230 can confirm that there is an error in the loading state of the electronic component ED. It can be seen that RP 1 and RP 2 are examples of bad patterns. Further, as shown exaggerated in FIG. 10 (a) portion to one side (left side in FIG. 10) of the reflection point RP 1, RP good performance in the presence of Embodiment 1 'is loaded in the case of failure, as shown in FIG. 10 ( As shown in part b), the 1 pattern on one side cannot distinguish between normal time and bad time depending on the situation. In spite of this, the 2 pattern on the other side (the right side in FIG. 10) appears to be defective, so the analyzer 230 can determine that the electronic component ED is defective in any case. In addition, in a state where the electronic component is mounted as shown in FIG. 10, it can be confirmed from the irradiation position of the light irradiator that both patterns are defective. This is compensated by moving the laser irradiation position to the left or right according to the intention of the inspector.

當然,較佳地,通過電子部件ED的上端形態變化等多樣的變數而可具備3個以上光照射器210。 Of course, it is preferable that three or more light irradiators 210 may be provided by various variables such as a change in the shape of the upper end of the electronic component ED.

作為參考,如圖11的(a)部分所示,特定電子部件ED’沿著前後方向傾斜的情況下,分析器230以確認通過攝影機220所拍攝的圖像中複數個反射點RP、RP’之間的間距或者相互比較確認與正常時的圖案的差異及線的形態等,而可確認電子部件ED’的裝載不良。 For reference, as shown in part (a) of FIG. 11, when the specific electronic component ED ′ is tilted in the front-rear direction, the analyzer 230 confirms that a plurality of reflection points RP, RP ′ are in the image captured by the camera 220. The distance between them or the mutual comparison confirms the difference from the normal pattern, the shape of the line, etc., and it can be confirmed that the electronic component ED ′ is defectively loaded.

實施例 Examples

如圖12所示,根據本實施例的檢測裝置200(實線部分)包括四個光照射器210a至210d、四個攝影機220a至220d、分析器230及兩個調節器。 As shown in FIG. 12, the detection device 200 (solid line portion) according to the present embodiment includes four light irradiators 210a to 210d, four cameras 220a to 220d, an analyzer 230, and two regulators.

四個光照射器210a至210d用於對位於下方的裝載托盤LT的電子部件ED照射線性雷射。其中,裝載托盤LT如根據圖1的實施例,由十六個電子部件以8x2行列的形態和垂直立式狀態的方式裝載。 The four light irradiators 210a to 210d are used to irradiate a linear laser on the electronic component ED of the loading tray LT located below. Wherein, the loading tray LT is loaded by sixteen electronic components in a form of 8 × 2 rows and columns and in a vertical state as in the embodiment of FIG. 1.

四個光照射器210a至210d中右側兩個光照射器210a及210b用於對左側列的複數個電子部件ED照射雷射,左側兩個光照射器210c及210d用於對右側列的複數個電子部件ED照射雷射。像這樣,右側的光照射器210a及210b不是對右側列,而是對左側列的複數個電子部件ED照射雷射,左側的光照射器210c及210d對右側列的電子部件ED照射雷射,這是為了可在狹小的設備得內部僅用更小的空間而使雷射反射的複數個反射點位移量極大化。 Among the four light irradiators 210a to 210d, the two right light irradiators 210a and 210b are used to irradiate a plurality of electronic components ED in the left column with laser light, and the two left light irradiators 210c and 210d are used to irradiate a plurality of right column. The electronic component ED irradiates a laser. In this way, the light irradiators 210a and 210b on the right side irradiate lasers to the plurality of electronic components ED in the left column, instead of the right column, and the light irradiators 210c and 210d on the left radiate laser to the electronic components ED in the right column. This is to maximize the displacement of the plurality of reflection points of the laser reflection by using only a smaller space inside a narrow device.

四個攝影機220a至220d在左側設置台LIR和右側設 置台RIR分別設置有兩個。四個攝影機220a至220d中左側兩個攝影機220a、220b用於拍攝左側列的複數個電子部件ED,右側兩個攝影機220c、220d用於拍攝右側列的複數個電子部件ED。其中,各個攝影機220a至220d分別拍攝4個電子部件ED。當然,根據實施情況,若使用可以拍攝全部八個電子部件ED的拍攝角度大的攝影機,則左側及右側分別具備一個攝影機即可。 Four cameras 220a to 220d have a LIR on the left and a LIR on the right Set up two RIRs. Of the four cameras 220a to 220d, the two left cameras 220a and 220b are used to capture the plurality of electronic components ED in the left column, and the two right cameras 220c and 220d are used to capture the plurality of electronic components ED in the right column. Among them, each of the cameras 220a to 220d captures four electronic components ED. Of course, depending on the implementation, if a camera with a large shooting angle capable of shooting all eight electronic components ED is used, one camera may be provided on each of the left and right sides.

並且,本實施例中複數個電子部件ED以兩列裝載於在裝載托盤LT,在使用電子部件以一列裝載的裝載托盤的情況下,光照射器或攝影機的數量相會比以往有所減少。 Furthermore, in the present embodiment, a plurality of electronic components ED are mounted on the loading tray LT in two rows. When using a loading tray loaded with electronic components in one row, the number of light irradiators or cameras is reduced compared to the past.

分析器230對通過攝影機220a至220d獲得的圖像內的雷射形態進行分析而檢測電子部件ED的裝載狀態。 The analyzer 230 analyzes the laser morphology in the images obtained by the cameras 220a to 220d to detect the loading state of the electronic component ED.

調節器240以調節光照射器210a至210d的高度來可專用於具有不同的高度規格的複數個電子部件ED,調節光照射器210a至210d照射角來可專用於不同寬度的複數個電子部件ED。這種調節器240能夠以分為用於調節光照射器210a至210d的高度的高度調節部分241和用於調節光照射器210a至210d的照射角的照射角調節部分242的方式具備。當然,調節器能夠以手動或自動方式調節光照射器的高度或照射角。並且,調節器240能夠具備高度調節部分241或照射角調節部分242中的一種。進一步,根據實施方式,一同具備具有互不相同的高度或照射角的複數個光照射器,並根據半導體器件的垂直長度或寬度也可實施使與其對應的光照射器選擇性地啟動的例子。 The adjuster 240 may be dedicated to a plurality of electronic components ED having different height specifications by adjusting the height of the light irradiators 210a to 210d, and may be dedicated to a plurality of electronic components ED having different widths by adjusting the irradiation angles of the light irradiators 210a to 210d. . Such an adjuster 240 can be provided so as to be divided into a height adjustment section 241 for adjusting the height of the light irradiators 210a to 210d and an irradiation angle adjustment section 242 for adjusting the irradiation angle of the light irradiators 210a to 210d. Of course, the adjuster can adjust the height or irradiation angle of the light irradiator manually or automatically. In addition, the adjuster 240 can include one of a height adjustment portion 241 and an irradiation angle adjustment portion 242. Furthermore, according to the embodiment, a plurality of light irradiators having mutually different heights or irradiation angles are provided together, and an example in which the corresponding light irradiators can be selectively activated depending on the vertical length or width of the semiconductor device can be implemented.

根據本實施例,可以迅速而準確地檢測以8x2行列的方式裝載於裝載托盤LT的全部十六個電子部件ED的裝載狀態。 According to this embodiment, it is possible to quickly and accurately detect the loading state of all sixteen electronic components ED loaded on the loading tray LT in an 8 × 2 row and column manner.

另一方面,通過根據本發明的檢測裝置200來進行檢測的位置,根據設備的不同而可以與電子部件ED向裝載托盤LT加載或從裝載托盤LT卸載的位置相同。這種情況下,由於採樣機器人需要在裝載托盤LT的上方執行加載或者卸載作業,不可干涉採樣機器人和檢測裝置200的光照射器210或攝影機220。因此,為了防止如採樣機器人的其他結構的干涉,較佳地,從平面上觀察時光照射器210和攝影機220以脫離複數個電子部件ED的裝載區域的方式設置。這些反映在圖12的實施例中。即,參照圖12,左側的攝影機220a、220b和右側的攝影機220c、220d之間的距離比裝載托盤LT的左右方向的寬度更長,光照射器210a至210d設置於後方牆壁,從平面上觀察,可確認複數個攝影機220a至220d和複數個光照射器210a至210d都以脫離電子部件ED所裝載的區域的方式設置。 On the other hand, the position to be detected by the detection device 200 according to the present invention may be the same as the position at which the electronic component ED is loaded into or unloaded from the loading tray LT depending on the equipment. In this case, since the sampling robot needs to perform a loading or unloading operation above the loading tray LT, the sampling robot and the light irradiator 210 or the camera 220 of the detection device 200 cannot be interfered with. Therefore, in order to prevent the interference of other structures such as the sampling robot, it is preferable that the time light illuminator 210 and the camera 220 are disposed so as to be separated from the loading area of the plurality of electronic components ED when viewed from a plane. These are reflected in the embodiment of FIG. 12. That is, referring to FIG. 12, the distance between the cameras 220a and 220b on the left and the cameras 220c and 220d on the right is longer than the width in the left-right direction of the loading tray LT. The light illuminators 210a to 210d are disposed on the rear wall and viewed from a plane. It can be confirmed that the plurality of cameras 220a to 220d and the plurality of light irradiators 210a to 210d are provided so as to be separated from the area where the electronic component ED is mounted.

並且,由於攝影機220脫離電子部件ED所裝載的區域,因此攝影機220的視角變寬可使一個攝影機220可檢測更多數量的複數個電子部件ED。 In addition, since the camera 220 is separated from the area on which the electronic component ED is mounted, a wider viewing angle of the camera 220 allows one camera 220 to detect a larger number of multiple electronic components ED.

如上所述的根據本發明的檢測裝置可妥當適用於電子部件需要以垂直立式狀態的方式裝載的裝載托盤的任何設備。即,例如,根據本發明的檢測裝置可儘管妥當適用於對以垂直狀態裝載於裝載托盤的如固態硬碟(SSD)或記憶 體等板狀的電子部件執行標籤作業、包殼作業及測試作業的設備等。 The detection device according to the present invention as described above can be suitably applied to any device for loading a pallet on which electronic components need to be loaded in a vertical upright state. That is, for example, the detection device according to the present invention can be suitably applied to, for example, a solid state drive (SSD) or a memory loaded on a loading tray in a vertical state. Equipment such as plate-shaped electronic components that perform labeling, cladding, and testing operations.

如上所述,參照圖式的實施例對本發明進行了具體說明。但是,上述實施例僅用於例示本發明的較佳實施例。因此,本發明不局限於上述實施例,本發明的範圍應根據後述的申請專利範圍及其等同概念理解。 As described above, the present invention has been specifically described with reference to the embodiments of the drawings. However, the above embodiments are only used to illustrate the preferred embodiments of the present invention. Therefore, the present invention is not limited to the above-mentioned embodiments, and the scope of the present invention should be understood based on the scope of patent application and its equivalent concepts described later.

200‧‧‧檢測裝置 200‧‧‧testing device

210‧‧‧光照射器 210‧‧‧light irradiator

220‧‧‧攝影機 220‧‧‧Camera

230‧‧‧分析器 230‧‧‧ Analyzer

L1‧‧‧第一直線 L 1 ‧‧‧ the first straight line

L2‧‧‧第二直線 L 2 ‧‧‧ second straight line

PL‧‧‧垂直線 PL‧‧‧ vertical line

RP‧‧‧反射點 RP‧‧‧Reflection point

ED‧‧‧電子部件 ED‧‧‧Electronic components

LT‧‧‧裝載托盤 LT‧‧‧Loading tray

Γ‧‧‧角 Γ‧‧‧ corner

θ‧‧‧第一角 θ‧‧‧ the first angle

β‧‧‧第二角 β‧‧‧ second angle

Claims (9)

一種電子部件裝載狀態檢測裝置,包括:至少一光照射器,對裝載於裝載托盤的複數個電子部件照射具有規定形態的檢測圖案的光;至少一攝影機,對通過該光照射器來照射光的複數個電子部件進行拍攝;分析器,對通過該至少一攝影機獲得的圖像內的檢測圖案進行分析來檢測電子部件的裝載狀態;從正面觀察時,連接反射點和該攝影機的第一直線和連接該反射點和該光照射器的第二直線形成的角度大於0度小於180度,該反射點為通過該至少一光照射器向該複數個電子部件照射的光與該複數個電子部件相接的位置。 An electronic component loading state detection device includes: at least one light irradiator for irradiating a plurality of electronic components mounted on a loading tray with light having a detection pattern of a predetermined form; and at least one camera for irradiating light through the light irradiator. A plurality of electronic components are photographed; an analyzer analyzes a detection pattern in an image obtained by the at least one camera to detect a loading state of the electronic components; when viewed from the front, a reflection line is connected to a first line and a connection of the camera An angle formed by the reflection point and a second straight line of the light irradiator is greater than 0 degrees and less than 180 degrees, and the reflection point is that the light irradiated to the plurality of electronic components through the at least one light irradiator is connected to the plurality of electronic components. s position. 如請求項1所記載的電子部件裝載狀態檢測裝置,其中該至少一光照射器配置在該反射點的一側上方;以及該至少一攝影機配置在該反射點的另一側上方。 The electronic component loading state detecting device according to claim 1, wherein the at least one light irradiator is disposed above one side of the reflection point; and the at least one camera is disposed above the other side of the reflection point. 一種電子部件裝載狀態檢測裝置,包括:複數個光照射器,對裝載於裝載托盤的複數個電子部件照射具有規定形態的檢測圖案的光;至少一攝影機,對通過該光照射器來照射光的複數個電子部件進行拍攝;分析器,對通過該至少一攝影機獲得的圖像內的檢測圖案進行分析來檢測電子部件的裝載狀態; 通過該複數個光照射器所照射的複數個光在電子部件的寬度內具有相互隔開的間距,使通過該複數個光照射器所照射的複數個光在一個電子部件產生複數個反射點。 An electronic component loading state detection device includes: a plurality of light irradiators that irradiate a plurality of electronic components mounted on a loading tray with light having a detection pattern of a predetermined form; and at least one camera that irradiates light through the light irradiators. A plurality of electronic components are photographed; an analyzer analyzes a detection pattern in an image obtained by the at least one camera to detect a loading state of the electronic components; The plurality of lights irradiated by the plurality of light irradiators have a distance from each other within the width of the electronic component, so that the plurality of lights irradiated by the plurality of light irradiators generate a plurality of reflection points on one electronic component. 如請求項1或3所記載的電子部件裝載狀態檢測裝置,其中通過該光照射器所照射的光是雷射。 The electronic component loading state detection device according to claim 1 or 3, wherein the light irradiated by the light irradiator is a laser. 如請求項1或3所記載的電子部件裝載狀態檢測裝置,其中還包括調節器,該調節器執行調節該光照射器的高度或者調節該光照射器的照射角的至少一者。 The electronic component loading state detection device according to claim 1 or 3, further comprising a regulator that performs at least one of adjusting a height of the light irradiator or adjusting an irradiation angle of the light irradiator. 如請求項1或3所記載的電子部件裝載狀態檢測裝置,其中該分析器根據通過該至少一攝影機所拍攝的圖像中在複數個電子部件產生的複數個反射點是否具有正常圖案來分析電子部件的裝載狀態。 The electronic component loading state detecting device according to claim 1 or 3, wherein the analyzer analyzes the electrons based on whether or not the plurality of reflection points generated in the plurality of electronic components in the images captured by the at least one camera have a normal pattern. The loading status of the part. 如請求項1或3所記載的電子部件裝載狀態檢測裝置,其中通過該光照射器所照射的光是在平面上以線性來表現的線性光。 The electronic component loading state detection device according to claim 1 or 3, wherein the light irradiated by the light irradiator is linear light expressed linearly on a plane. 如請求項1或3所記載的電子部件裝載狀態檢測裝置,其中在俯視圖上觀察,該攝影機以脫離複數個電子部件的裝載區域的方式設置。 The electronic component loading state detection device according to claim 1 or 3, wherein the camera is provided so as to be separated from a loading area of a plurality of electronic components when viewed from a top view. 如請求項1或3所記載的電子部件裝載狀態檢測裝置,其中在俯視圖上觀察,該光照射器以脫離複數個電子部件的裝載區域的方式設置。 The electronic component loading state detection device according to claim 1 or 3, wherein the light irradiator is provided so as to be separated from a loading area of a plurality of electronic components when viewed in a plan view.
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