CN112014410A - Inspection device for electronic component handling equipment - Google Patents
Inspection device for electronic component handling equipment Download PDFInfo
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- CN112014410A CN112014410A CN202010392119.3A CN202010392119A CN112014410A CN 112014410 A CN112014410 A CN 112014410A CN 202010392119 A CN202010392119 A CN 202010392119A CN 112014410 A CN112014410 A CN 112014410A
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- 238000007689 inspection Methods 0.000 title claims abstract description 45
- 238000005070 sampling Methods 0.000 claims abstract description 104
- 230000007547 defect Effects 0.000 claims abstract description 53
- 238000012790 confirmation Methods 0.000 claims description 32
- 230000002950 deficient Effects 0.000 claims description 29
- 238000000926 separation method Methods 0.000 claims description 25
- 239000000284 extract Substances 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 26
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/8914—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the material examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/8901—Optical details; Scanning details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/8901—Optical details; Scanning details
- G01N2021/8908—Strip illuminator, e.g. light tube
Abstract
The present invention relates to an inspection apparatus for an electronic component handling apparatus. According to the present invention, in a captured image, the presence or absence of a failure of an electronic component is checked using brightness data extracted from a predetermined sampling region, and further, the placement state of the electronic component is checked using brightness data extracted from other sampling regions. According to the present invention, the defect of the electronic component itself can be confirmed by the line light, and particularly, the two operations can be performed in parallel by combining the configuration of determining the defect of the electronic component itself and the configuration of determining the mounting state of the electronic component, so that the efficiency of the process and the productivity are improved.
Description
Technical Field
The present invention relates to an inspection apparatus for an electronic component handling apparatus that individually manages and handles electronic components, and more particularly, to a technique for analyzing an image obtained by imaging an electronic component after imaging to check whether or not a defect is present.
Background
The produced electronic components are shipped after going through various types of processes such as a test process and a sorting process. In which an electronic component handling apparatus for handling electronic components is used.
The electronic component handling apparatus can be manufactured in various forms according to the work function. A loading element capable of loading electronic components is used to perform operations of supplying electronic components to and collecting electronic components from such an electronic component processing apparatus and operations of moving electronic components. The mounting element can be manufactured in various forms according to the type of the electronic component, the type of the work using the mounting element, and the like.
In the case of using the mounting element, it is possible to realize a processing operation necessary for moving the electronic component from the mounting element to another mounting element or for the electronic component in a state where the electronic component is mounted on the mounting element. Therefore, in order to appropriately move the electronic components or perform processing operations on the electronic components, the electronic components need to be accurately mounted on the mounting elements. Otherwise, when the electronic component is mounted on the mounting element in a defective mounting state, a failure occurs in the movement work or the processing work. Therefore, in order to confirm the mounting state of the electronic parts, the applicant of the present invention has proposed Korean laid-open patents No. 10-2016 & 0018211 and No. 10-2017 & 0093624 (hereinafter referred to as "cited art").
The cited technique can confirm the placement state of the electronic component by analyzing the pattern of the photographed laser light after irradiating laser light, which is one of linear lights, and photographing with a camera.
Further, when the electronic component is subjected to various processing operations or other various operations including a conveying operation, the electronic component may be broken, stabbed, scratched, attached with foreign matter, contaminated, or stained, and a defect recognizable in appearance (hereinafter referred to as "appearance defect") may occur. In the past, the appearance defect of the electronic component was not regarded as important, so that a separate inspection was not required, and it was difficult to visually recognize whether or not the defect was detected in a fine manner. However, it has been found that such appearance defects may also cause fatal defects to products, and thus, recently, confirmation of appearance defects is also required in electronic component processing equipment.
However, the cited technique is not suitable as a program capable of confirming appearance defects because analysis is performed using a program for pattern comparison of linear light, and particularly, only the brightest linear pattern is used, and there are recognition defects due to diffuse reflection, diffraction, and high brightness of light.
Disclosure of Invention
The invention is to confirm the bad appearance of the electronic component by using the light irradiator used only for confirming the bad arrangement of the electronic component and the checking device provided with the camera for confirming.
An inspection device for an electronic component handling apparatus according to a first aspect of the present invention includes: a light irradiator for irradiating the electronic component with linear light; a confirmation camera for shooting the area irradiated by the light irradiator with linear light so as to confirm whether the electronic component is defective or not; an analyzer that analyzes whether or not an electronic component is defective by analyzing brightness data for a sampling area within a predetermined range with reference to at least one separation line separated in parallel at a predetermined interval from a center line, which is a line having the shortest distance that linear light reaches the electronic component and the highest brightness, in an image captured by the confirmation camera; and a controller that notifies a failure according to the information on the failure or not from the analyzer and controls a shooting job of the confirmation camera.
The inspection apparatus for an electronic component handling apparatus further includes: and a shifter moving any one of the light irradiator and the electronic component so that the light irradiator and the electronic component are moved relative to each other in a direction perpendicular to the center line, wherein the controller controls the shifter and the confirmation camera so that the light irradiator and the electronic component are moved relative to each other and performs shooting a plurality of times for each column of the electronic component, and the analyzer extracts and combines sampling regions from a plurality of images shot a plurality of times, respectively, and then analyzes whether the electronic component is defective or not from the combined data.
The analyzer may analyze whether the electronic component is defective or not by binarized data after binarizing each pixel into 0 and 1 for the merged data with reference to a set brightness value.
The analyzer analyzes the plurality of sampling regions with reference to each of the plurality of separation lines to analyze whether the electronic component is defective or not.
The analyzer identifies a different cause of failure for each of the plurality of sampling regions.
The analyzer extracts sampling regions within a predetermined range with respect to the center line from a plurality of images captured a plurality of times, and combines the extracted sampling regions, and then analyzes the placement state of the electronic component mounted on the mounting element from the combined data.
The analyzer extracts a sampling region within a predetermined range with reference to the center line, and analyzes the placement state of the electronic component mounted on the mounting element from the extracted data.
The analyzer analyzes a placement state of the electronic component by analyzing a slope of the lightness data.
Further, an inspection device for an electronic component handling apparatus according to a second aspect of the present invention includes: a light irradiator that irradiates light for causing brightness differences between surface regions of the electronic component to occur to a surface of the electronic component; a confirmation camera for shooting the area irradiated by the light irradiator so as to confirm at least one of the defect of the electronic component and the arrangement state of the electronic component; an analyzer that analyzes at least one of a failure and a placement state of the electronic component mounted on the mounting element by analyzing brightness data for each of at least two sampling regions having brightness values different from each other in the image captured by the camera for confirmation; and a controller which notifies the failure of the electronic component or the failure of the placement state according to the information on the failure or not from the analyzer and controls the photographing operation of the camera for confirmation.
The inspection apparatus for an electronic component handling apparatus further includes: and a shifter moving any one of the light irradiator and the mounting element so that the light irradiator and the electronic component are moved relative to each other, wherein the controller controls the shifter and the confirmation camera so that the light irradiator and the electronic component are moved relative to each other and performs photographing for each column of the electronic component a plurality of times, and the analyzer extracts and combines sampling regions from a plurality of images photographed a plurality of times, respectively, and then analyzes a defective or mounted state of the electronic component from the combined data.
An inspection device for an electronic component handling apparatus according to a third aspect of the present invention includes: a light irradiator for irradiating linear light to the electronic component mounted on the mounting element; a confirmation camera for photographing a region irradiated with the linear light by the light irradiator so as to confirm a placement state of the electronic component; an analyzer analyzing a placement state of the electronic component by analyzing lightness data with respect to a sampling area within a predetermined range with reference to a center line, which is a line where a distance from the linear light to the electronic component is shortest and lightness is highest, in the image taken by the confirmation camera; and a controller that notifies whether or not loading is defective according to the information on the placement state from the analyzer, and controls a photographing operation of the confirmation camera.
Further comprising: and a mover that moves either the light irradiator or the mounting element so as to move the light irradiator and the electronic components relative to each other, wherein the controller controls the mover and the confirmation camera so that the light irradiator and the electronic components move relative to each other and performs shooting a plurality of times for each column of the electronic components, and the analyzer extracts and combines sampling regions from a plurality of images shot a plurality of times, respectively, and then analyzes a placement state of the electronic components from the combined data.
According to the present invention, the following effects are obtained.
First, although linear light is used, it is possible to confirm that the appearance of the electronic component itself is poor, which is difficult to confirm when light having high brightness is used, by using brightness data of a region having relatively low brightness spaced apart from the center line, rather than brightness data of a region having high brightness located on the center line.
Second, since the arrangement state of the electronic component or the appearance defect of the electronic component itself is confirmed by combining the plurality of lightness data, the reliability of the inspection is improved.
Third, since it is possible to simultaneously perform inspection of a plurality of types of appearance defects of the electronic component itself without a separate defect inspection system or a defect inspection process for the appearance inspection of the electronic component itself and the process of inspecting the mounting state of the electronic component, it is possible to improve the efficiency and the productivity of the process and to realize the economical efficiency.
Drawings
Fig. 1 is a schematic view of an inspection apparatus for an electronic component processing apparatus according to an embodiment of the present invention.
Fig. 2 to 4 are reference diagrams for explaining the functions of the inspection device for an electronic component handling apparatus of fig. 1.
Fig. 5 is a flowchart regarding the operation of the inspection apparatus for electronic component processing equipment of fig. 1.
Fig. 6 to 13 are reference diagrams for explaining a processing and analysis method of brightness data implemented in the inspection apparatus for an electronic component processing device of fig. 1.
Description of the symbols
100: inspection apparatus for electronic component handling equipment 110: light irradiator
120: the confirmation camera 130: moving device
140: the analyzer 150: controller
Detailed Description
Preferred embodiments according to the present invention are described with reference to the accompanying drawings, and descriptions of overlapping or substantially identical structures are omitted or compressed as much as possible for the sake of simplicity of description.
<General description of the composition>
Fig. 1 is a schematic view of an inspection apparatus (hereinafter, simply referred to as "inspection apparatus") 100 for an electronic component handling apparatus according to an embodiment of the present invention.
The inspection apparatus 100 includes a light irradiator 110, a confirmation camera 120, a mover 130, an analyzer 140, and a controller 150.
The light irradiator 110 irradiates the electronic component D with linear light. The linear light may be preferably a laser light with a good bundling ratio, and is preferably irradiated in a perpendicular manner to the surface of the electronic component D so that the best data can be obtained. As shown in fig. 2, the linear light L emitted from the light irradiator 110 passes through all the electronic components D mounted on the mounting element LE in one row.
Since light propagates while traveling, even laser light having a good bundling ratio has a three-dimensional brightness map as shown in fig. 3. FIG. 3 is a three-dimensional representation of lightness, and the center line C of laser light vertical irradiationLThe area nearby has the highest lightness and is away from the central line CLThe farther away, the lower the lightness. One of the features of the invention is to use a center line CLSeparation lines S separated by a predetermined distance1、S2、S3Brightness data in the vicinity.
For example, in the present invention, as shown in the plan view with reference to fig. 4, when considering the center line CLA first separation line S separating the first space1A second separation line S for separating the second space2A third separation line S for separating a third space3At the center line CLA first separation line S1A second separation line S2And a third separation line S3The interval in which the brightness data is sampled. Here, due to the center line CLSince the linear light L is linearly irradiated from directly above, the distance from the linear light L to the electronic component D is shortest. And, the first separation line S1A second separation line S2And a third separation line S3Relative to the center line CLParallel and spaced apart from each other. Of course, although the first separation lines S are shown in the present embodiment1A second separation line S2And a third separation line S3Located at the center line CLBut may also be located at the centre line C according to embodimentsLFront of (see S)1'、S2'、S3'and 1S', 2S ', 3S'). I.e. about the centre line CLThe brightness data is sampled in a central sampling region CS within a predetermined width range on the left and right sides as a reference, and similarly, the brightness data is sampled by a first separation line S1A second separation line S2And a third separation line S3The lightness data is sampled in the first sampling region 1S, the second sampling region 2S, and the third sampling region 3S within a predetermined width range on the left and right sides as a reference. Of course, although the brightness data is sampled in the central sampling region CS, the first sampling region 1S, the second sampling region 2S, and the third sampling region 3S in the present embodiment, it is also possible to fully consider that only one sampling region is sampled or four or more sampling regions are sampled in addition to the central sampling region CS according to the embodiment. For reference, since it is necessary to use the optimum brightness data depending on which type of failure is detected, the width of each sampling region CS, 1S, 2S, 3S (or CS, 1S ', 2S ', 3S ') or each partition line S1、S2、S3(or S)1'、S2'、S3') may be the same or different. That is, it is preferable to set an area in which the corresponding object can be best grasped, depending on what the object of the appearance inspection (stain, foreign matter adhesion, chipping, scratch, etc.) is, and to perform sampling of the brightness data in the corresponding area.
The confirmation camera 120 can confirm the placement state of the electronic component D and the failure of the electronic component D itself by photographing the region irradiated with the linear light L by the light irradiator 110. Such a confirmation-use camera 120 is preferably equipped as an area camera to perform appropriate brightness data sampling, and its shooting direction has a predetermined angle θ (0 degrees < θ < 90 degrees) with respect to the irradiation direction of the light irradiator 110.
The analyzer 140 analyzes the brightness data extracted from the above-mentioned respective sampling regions CS, 1S, 2S, 3S in the image photographed by the confirmation camera 120, thereby determining the placement state of the electronic component D or the defect or non-defect of the electronic component D itself. In particular, according to the present embodiment, the mover 130 moves the loading element LE, thereby enabling a plurality of times (for example, four to eight times) of photographing for each of the electronic components D (more precisely, enabling a plurality of times of photographing for a column of electronic components). Accordingly, the analyzer 140 is implemented to analyze the placement state of the electronic component D or the defect or non-defect of the electronic component D itself from the merged data after merging the brightness data sampled from the images photographed a plurality of times. Of course, the analysis performed by the analyzer 140 is performed for each of the central sampling region CS, the first sampling region 1S, the second sampling region 2S, and the third sampling region 3S, and the causes of failures to be confirmed in the respective sampling regions CS, 1S, 2S, and 3S are different from each other. This will be described in detail item by item hereinafter.
The controller 150 notifies the failure in such a manner that a jam (jam) event or the like occurs according to the information about whether the failure is from the analyzer 140, and controls the shooting job of the confirmation-use camera 120 and the moving job of the mover 130. That is, the controller 150 controls the confirmation camera 120 and the mover 130 to move the electronic components D together with the loading element LE, thereby performing a plurality of times of photographing for each of the electronic components D.
<General flow sheet description>
The overall operation of the inspection apparatus 100 will be generally described with reference to the flowchart of fig. 5.
The mover 130 moves the mounted element LE backward (S100), and at this time, the light irradiator 110 irradiates a long linear light L directly downward in the left-right direction perpendicular to the moving direction of the mounted element LE.
The confirmation camera 120 performs a plurality of times of photographing for each electronic component D while the loading element LE moves. For this purpose, the mounting element LE is moved backward, and the electronic components D are photographed at predetermined time intervals from when the rear end upper surface of the mounting element LE is positioned directly below the light irradiator 110 until when the front end upper surface of the mounting element LE is positioned directly below the light irradiator 110 (S200), and the time intervals of photographing are set so that the electronic components D are photographed a plurality of times while passing through the middle of at least one specific electronic component D directly below the light irradiator 110. However, in the present embodiment, in order to compare and grasp the electronic component D and the peripheral structure of the mounting element LE adjacent to the electronic component D, not only the electronic component D but also the structure of the mounting element LE around the electronic component D are imaged together. That is, according to the present embodiment, the imaging is started before the end portion on the electronic component D side is positioned directly below the light irradiator 110.
The analyzer 140 extracts the brightness data of the sampling regions CS, 1S, 2S, and 3S from the image from the confirmation camera 120, merges the brightness data extracted for a column of the electronic components D, and analyzes the merged data to analyze the placement state of the electronic components D or the failure of the electronic components D themselves (S300). In this case, the luminance data is merged only with the luminance data of the respective sampling regions CS, 1S, 2S, and 3S. For reference, one or more electronic components D may be mounted in a row according to the mounting element LE.
The analyzer 140 transmits the analyzed information to the controller 150, and the controller 150 generates a warning for notifying a failure when a failure occurs based on the received information (S400). In this manner, the inspection of the electronic components D for each column is performed in sequence, and the inspection of the electronic components D for all columns is performed.
Next, the processing and analysis process (S300) of the brightness data of each of the sampling regions CS1S, 2S, and 3S in the above-described generalized flow will be described. The reason why the processing and analysis process (S300) of the brightness data is described by dividing the sample areas CS, 1S, 2S, and 3S in this way is that the reasons for the failure that needs to be confirmed by the brightness data obtained from the sample areas are different, and thus there is a difference in the specific processing and analysis process (S300) of the brightness data.
<Method for processing and analyzing brightness data of central sampling area>
The central sampling region CS directly faces the linear light L irradiated from the light irradiator 110 in the vertical direction, and has a center line C with the shortest distance from the linear light L to the electronic component D and the highest brightnessLThe width of the predetermined range before and after is set as a reference. The brightness data of the central sampling region CS is used to analyze the mounting state of the electronic component D. Such a flow will be described with reference to the flowchart of fig. 6.
According to the present embodiment, as shown in fig. 7, in order to inspect a column of electronic components D, the loading element LE is photographed six times in the processes of (a) to (f) during movement, thereby obtaining six images. Therefore, the brightness data of the central sampling region CS is extracted from each of the images acquired by taking six shots of a row of the electronic components D and the surrounding structures in front of and behind the electronic components D. That is, when the electronic component D or the mounting element LE is observed as a reference (not the light irradiator 110 as a reference), the central sampling region CS is different in all of the six images. Therefore, the central sampling region CS is set by sequentially passing through six regions from the rear end to the front end in the order of photographing with the electronic component D and the mounting element LE as references, and the analyzer 140 extracts brightness data of the central sampling region CS from the corresponding image (S311).
Next, as schematically shown in fig. 8 (a) and (b), the brightness data D1, D2, D3, D4, D5, and D6 extracted from the image as shown in fig. 8 (a) are combined as shown in fig. 8 (b) (S312), and brightness data of the entire image of the electronic component D and its surroundings can be obtained. The lightness data thus obtained refers to a lightness value of each pixel, based on which a three-dimensional height data map 3M is created that expresses the height of lightness with color, as shown in the excerpted example of fig. 9 (a) (S313). Such height data fig. 3M is suitable for confirming the slope (change rate) of lightness by a change in color. In the present embodiment, all electronic components D and the mounting elements LE in one row are captured at a time, and capture and brightness data are extracted, and brightness data are expressed using the height data map based on the captured image. For reference, the excerpted example of (b) of fig. 9 is an image on the electronic component D for an actually corresponding site that can be compared with (a) of fig. 9. Comparing (a) and (b) of fig. 9, it can be seen that the normal placement of the electronic component D and the absence of the electronic component D are accurately confirmed in the three-dimensional height data map 3M. That is, the normal situation and the abnormal situation can be accurately distinguished from each other by the three-dimensional height data map 3M.
And, the analyzer 140 analyzes the seating state of the electronic part D through the height data fig. 3M (S314). For example, in the case where the electronic component D is normally placed, the height of the lightness is constant within a desired range (color is constant) in the entire area of the electronic component D, but in the case where it is inclined, there is a variation in the height of the lightness (color variation), and in the case of double loading, the height of the lightness is higher than the desired range, and in the case where it is left empty, the height of the lightness is lower. In this way, the analyzer 140 analyzes the placement state of the electronic component D using the height data fig. 3M created by the brightness data of the central sampling region CS, and as mentioned above, sends the result of such analysis (which may include a determination of whether or not it is bad) to the controller 150. Accordingly, the controller 150 generates jam (jam) in case of a bad placement according to the analysis result from the analyzer 140, and notifies it to the manager.
For reference, a display may be further provided at the analyzer 140 or the controller 150, and the three-dimensional height data fig. 3M may be output through the display. In this case, the manager can visually confirm whether or not the jamming has occurred, and at which position of the mounting element LE the poor placement of the electronic component D has occurred, by checking the height data fig. 3M.
Of course, even if the three-dimensional height data fig. 3M representing the slope (rate of change) of the lightness data is not created, the analyzer 140 can grasp its slope only with the lightness data to know whether the electronic component D is properly seated on the loading element LE, obliquely seated, unseated, doubly loaded, exceeded or crossed over the normal position, or the like. For example, the electronic component D has a height of lightness 2 when normally placed, and a height of lightness 0 when empty. The average value of the heights of the electronic components D and the average value of the heights of the electronic components D existing on the mounting element LE are compared with each other to determine whether or not a failure occurs, and whether or not a failure occurs can be stably checked using the standard deviation value. Also, in the case where the electronic components are arranged in a staggered manner or arranged obliquely, the analysis may also be performed by confirming the degree of standard deviation or inclination from the height data of the lightness, and the analysis may also be performed by comparing the height value of the lightness that can be highest with the information of the height value of the lightness that needs to be lowest, and likewise, the analysis may also be performed by comparison with the information obtained from the electronic components D existing in the surroundings, and therefore a more stable analysis result may be obtained by mixing these manners.
In addition, when the electronic component D itself is analyzed for appearance defects (chipping, stabbing, stain, etc.) due to diffraction, diffuse reflection, high brightness values, etc., the brightness data obtained in the central sampling region CS cannot be ensured with accuracy. Therefore, the appearance defect of the electronic component D itself is analyzed using the brightness data of the first sampling region 1S, the second sampling region 2S, and the third sampling region 3S located outside the central sampling region CS. The processing and analysis of the brightness data for inspecting the appearance defect of the electronic component D itself will be described below.
<Lightness data processing and analyzing method of first sampling area>
The first sampling region 1S is set as a region closest to the central sampling region CS by a first dividing line S1A width of a predetermined range before and after the reference. The brightness data of the first sampling region 1S is used to analyze the apparent defect which is relatively obvious in the electronic component D itselfChipping, stabbing (denting), cracking (Crack), and the like. This is explained with reference to fig. 10.
Likewise, the brightness data of the first sampling region 1S is obtained from all six images in the same manner as in fig. 7.
The analyzer 140 extracts the brightness data of the first sampling region 1S from the respective images (S321), and combines the brightness data in the same manner as in fig. 8 (S322), so that the brightness data of the entire image with respect to one specific electronic component can be obtained. However, the first separation line S1Brightness in the vicinity compared to the center line CLThe vicinity has very low lightness, and therefore the value of the lightness data may be greatly distorted even under external weak light. Therefore, a noise removal (noise elimination) operation is performed to compensate the brightness value exceeding a desired predetermined range (for example, a desired brightness range in a normal state, a brightness range in a crushing state, a brightness range of the mounted elements, and the like) to be within the desired predetermined range (S323).
A brightness data image appearing to be free of color is created based on the brightness data after the noise removal (S324). Here, the brightness data image refers to an image having no color or chroma and representing brightness only by a brightness value.
Next, a region of interest in which the electronic component is located is selected in the lightness data image. Although the region where the electronic component D is located is the region of interest in the present embodiment, other structures than the electronic component D may be the region of interest. Then, the lower lightness is processed to 0 (black) and the higher lightness is processed to 1 (white) based on the specific lightness value by the binarization method (S325). After the image is processed by the binarization method, the remaining brightness data except for the region of interest (e.g., the region corresponding to the electronic component and its surrounding parts) is removed to extract data of the region of interest (S326), and then whether or not the electronic component D is defective (which may include whether or not the electronic component is defective and the cause of the defect) is analyzed in comparison with the inputted information values (e.g., the values of the length of the electronic component in the horizontal and vertical directions, the number of terminals, the arrangement form and the size thereof, the plane form of the electronic component, the external specification of the electronic component, and the like) (S327). For example, if the middle end of the electronic component D is broken and cracked, the size, appearance, and the like thereof are different from the inputted information value, if one corner of the electronic component D is broken, the outline, and the like thereof are different from the inputted information value, and if the electronic component D has a groove formed by stabbing, the groove is processed to be black (processed to be 0), and the appearance is expressed.
For reference, the excerpted examples of (a) and (b) of fig. 12 are taken as the lightness data image and the actual photograph for the portion corresponding thereto, and the normal electronic component D and the cracked electronic component D can be clearly confirmed by the lightness data image of (a).
The brightness data of the first sampling area 1S as described above is used for comparison of the size of the electronic component D, the form of the electronic component D, the contour line of the electronic component D, and the like, and can be checked for defects.
The dimensional analysis of the electronic component D may be performed by: the horizontal and vertical lengths obtained by counting the number of pixels present in the extracted region are compared with the size information of the normal electronic component (for example, when 10 × 10 is normal, if it is smaller or larger, it is determined to be defective).
The morphological analysis of the electronic component D can be realized by grasping the morphology of the electronic component D at the location where the electronic component D is located and the brightness of the location around the electronic component D.
The contour analysis of the electronic component D can be performed by collectively reading regions corresponding to the contour lines of the electronic component D and checking the linearity (in the case of a square shape) of the pixels that are present in the contour and are continuous. In this case, if the electronic component contour is not linear enough or has a slope although it is linear, it is read as a poor mounting.
<Lightness data processing and analyzing method of second sampling area>
The second sampling region 2S is a region farther from the central sampling region CS than the first sampling region 1S, and is set to be a second separation line S2A width of a predetermined range before and after the reference. The brightness data of the second sampling region 2S can be analyzed fromScratches, foreign matter adhesion, and the like on the electronic component D itself, which are accurately checked for brightness lower than that of the first sampling region 1S, are used. This is explained with reference to fig. 12.
Likewise, the brightness data of the second sampling area 2S is also obtained from all six images in the same manner as fig. 7, and the analyzer 140 extracts the brightness data of the second sampling area 2S from the respective images (S331), and then merges them in the same manner as fig. 8 (S332), thereby obtaining the brightness data of the entire image with respect to one specific electronic component D. At this time, the analyzer 140 creates a lightness data image appearing to be achromatic after the noise-removal job (S333) (S334), and selects a region of interest (S335). Then, brightness data of a region of interest other than the region of interest where the electronic component is located is removed from the brightness data image to extract data of the region of interest (S336), pixels exceeding a required brightness value are grasped to detect a defect, and the defect is analyzed to confirm the size of the defect (the size of a foreign object, the size of a scratch, or the like) (S337). Here, the reason for checking the size of the defect is that the normal determination may be defective due to noise, and therefore this process may be performed in order to determine only a size equal to or larger than a predetermined size as a defect, and may also be omitted.
For reference, since the cause of the failure to be confirmed in the second sampling region 2S is less conspicuous than the cause of the failure to be confirmed in the first sampling region 1S, the difference in brightness between the portion where the cause of the failure is located and the normal portion is not large, so that an erroneous result may be obtained in the case where the binarization operation is performed. Therefore, the binary job is not performed during the processing of the brightness data of the second sampling area 2S.
The brightness data of the second sampling region 2S can be used to check whether or not there is a failure by comparing the luminance, the size, and the like of the failure.
For reference, even in the case of shooting with the same kind of illumination and the same camera, there are cases where it looks different depending on the surrounding situation, and therefore a poor brightness (brightness) check is preferably performed by: with the overall luminance confirmed throughout the electronic component D as a reference, if the luminance is uniform, it is not defective, and if the luminance is non-uniform, it is determined to be defective.
The defective size inspection may be performed after the defective brightness inspection, or may be performed separately, and only a predetermined value or more is defined as a defect. For example, a determination corresponding to one pixel level is made as noise rather than being defective. The purpose is to prevent confusion due to noisy data, and the value as a reference is preferably adjusted by an administrator.
<Lightness data processing and analyzing method of third sampling area>
The third sampling region 3S is a region farther from the central sampling region CS than the second sampling region 2S, and is set to be a third separation line S3A width of a predetermined range before and after the reference. The use of the brightness data of the third sampling region 3S is also the same as the use of the brightness data of the second sampling region 2S above. However, the brightness data of the third sampling area 3S is used to determine whether or not there is a defect such as various stains or stains, such as fingerprints, that have the weakest degree of visibility. Similarly, the binarization job is not performed in the process of the lightness data of the third sampling area 3S.
For reference, the analysis of the defective items performed in the third sampling region 3S may be performed by a brightness check of the pixels, a defective size check, a defective distribution check, a brightness change check, or the like. Here, for example, there may be small defects in the form of very small dots as if sprayed by a sprayer, and in this case, since the size of the defects is small and it may be determined as noise, in order to prevent such erroneous determination, a distribution degree check is implemented that determines that defects are present if they are distributed over a wide area.
Here, the poor brightness and size check is the same as the analysis of the second sampling region 2S above.
However, as briefly mentioned above, the poor distribution degree check is performed when it is desired to know where the stain is present, mainly on which side. For example, stains are often sprayed in the form of droplets to cause a plurality of defects, and not a single defect in which a droplet of water drops to cause contamination. Therefore, in the case where programming is such that only one defect is recognized, it is also possible to erroneously determine a defect that is too small as noise data. For example, if a size of three pixels or less is regarded as noise, an error occurs in the inspection. Therefore, the purpose of applying the defective distribution degree inspection is to determine that the defect is not a noise as long as there is a distribution in a predetermined region even if the distribution is three pixels or less.
Further, since there may be contamination covering the entire electronic component D, an inspection for a luminance change of the electronic component D is performed. For example, when the entire electronic component D is contaminated, it is difficult to confirm whether the electronic component D is defective or not by another inspection method. Therefore, whether or not the image is defective is checked by at least one of a method of comparing the brightness with other electronic components D in the periphery and a method of comparing the brightness with the brightness of the stored image.
Finally, if the above-described analysis in all the sampling areas CS, 1S, 2S, and 3S is completed, the analyzer 140 finally determines whether or not there is a failure, and notifies the controller 150 of the failure, and the controller 150 causes a jam or a reminder when there is a failure.
<Reference item>
1. About linear light
Although the above embodiments have described the case where the light irradiator 110 irradiates laser linear light with a high bundling ratio, a light source such as a fluorescent lamp of a long shape or an LED arranged in one direction may be considered.
Further, although the light irradiator 110 has been described as irradiating only one linear light, a case where a linear light having a low luminance and a linear light having a high luminance are arranged adjacent to each other in this order may be considered, and a configuration where a surface light source having a high luminance and a surface light source having a low luminance are attached to each other may be considered.
That is, it is understood that the present invention can be extended to a method of inspecting the cause of a failure different from each other using the brightness data of each region in the case where the light irradiator 110 irradiates light so that at least two regions have a brightness difference.
2. About an analyzer
Although the analyzer 140 is not more specifically divided in the above description to be described, the analyzer 140 may include a storage unit, an extraction unit, a merging unit, an analysis unit, and the like according to its functions.
The storage unit is a recording medium that stores a photographed image or stores various setting values necessary for analysis input from a manager or a server.
The extraction unit extracts brightness data of each sampling region.
The merging unit merges the luminance data as described above.
The analysis unit analyzes a placement state of the electronic component or a defect in an appearance of the electronic component itself using the merged lightness data.
In addition, the storage unit also stores a program for executing the processing and analysis described above, and it is apparent that the program can execute the storage function, the extraction function, the merging function, and the analysis function on a computer.
3. Regarding brightness data
Although the above embodiment is configured to grasp the placement state of the electronic component D and the failure of the electronic component D itself together, it may be configured to grasp only the placement state of the electronic component D using only the brightness data of the center sampling region CS or grasp only the breakage failure using only the brightness data of the first sampling region 1S, depending on the case. That is, it can be realized to alternatively select execution of the above-mentioned analysis method in order to check the defects required for the electronic component processing apparatus.
4. Examples of brightness data images
As described above, when the brightness data image is created from the brightness data acquired from the first sampling region 1S, the second sampling region 2S, and the third sampling region 3S, respectively, the form of each electronic component D visible from the brightness data image is as shown in fig. 13.
Fig. 13 shows an actual photograph and a brightness data image which can be obtained by comparing (a) a normal electronic component D, (b) a surface of the electronic component D contaminated with stains, (c) a surface of the electronic component D scratched, (D) a foreign substance attached to the electronic component D, and (e) a corner of the electronic component D broken.
5. Differentiation of causes of failure
In the above description, the points most suitable for confirming the appearance of the defect are described as the appearance of the defect, but the sampling region may be specified in consideration of the classification of the defect by the size thereof.
For example, a size on the order of approximately 0.1mm to 0.5mm can be best confirmed in the lightness data obtained from the first sampling region 1S, a larger-size failure can be best confirmed in the central sampling region CS, and a smaller-size failure can be best confirmed in the second sampling region 2S or the third sampling region 3S. In this way, the smaller the size of the defect causing the region having the lower lightness can be better checked.
As described above, the above description has been made only by way of example of the causes of failures identified in the respective sampling regions CS, 1S, 2S, and 3S, and the differentiation thereof, or the numerical values and the like exemplified, and therefore the present invention can be sufficiently implemented such that the positions of the sampling regions can be determined according to which criteria the causes of failures are differentiated, and which adopted regions can be best identified in consideration of the original hue and material of the electronic component, the type or function of the camera and the illumination, and the like.
Further, it should be considered that the center line C needs to be better grasped from the characteristics of lightLThe brightness at the degree of separation of the two sets of the sampling region. For example, fig. 3 shows lightness change in the case of laser light, in fig. 3, when the center line C is locatedLWhen the brightness of (2) is 100%, the brightness of the region very close to the center line is 90%, and gradually decreases to 50% and 30% as it goes sideways. Of course, when the light characteristics and the like are different, the amount of brightness reduction varies depending on the form and distance of the graph.
Although the present invention has been described in detail with reference to the embodiments illustrated in the drawings, the above-described embodiments are merely illustrative of the preferred embodiments of the present invention and therefore should not be construed as limiting the present invention to the above-described embodiments, and the scope of the present invention should be construed as being defined in the appended claims and their equivalents.
Claims (12)
1. An inspection apparatus for an electronic component handling apparatus, comprising:
a light irradiator for irradiating the electronic component with linear light;
a confirmation camera for shooting the area irradiated by the light irradiator with linear light so as to confirm whether the electronic component is defective or not;
an analyzer that analyzes whether or not an electronic component is defective by analyzing brightness data for a sampling area within a predetermined range with reference to at least one separation line separated in parallel at a predetermined interval from a center line, which is a line having the shortest distance that linear light reaches the electronic component and the highest brightness, in an image captured by the confirmation camera; and
and a controller for notifying the failure according to the information about the failure from the analyzer and controlling the shooting operation of the camera for confirmation.
2. The inspection apparatus for an electronic component processing apparatus according to claim 1, further comprising:
a mover that moves either the light irradiator or the electronic component so that the light irradiator and the electronic component move relative to each other in a direction perpendicular to the center line,
wherein the controller controls the mover and the confirmation camera such that the light irradiator and the electronic components are moved relative to each other and a plurality of shots are taken for each column of the electronic components,
the analyzer extracts and combines sampling regions from a plurality of images taken a plurality of times, and then analyzes whether the electronic component is defective or not from the combined data.
3. The inspection device for electronic component handling apparatuses according to claim 2,
the analyzer binarizes each pixel into 0 and 1 for the merged data with reference to a set brightness value, and then analyzes whether the electronic component is defective or not by the binarized data.
4. The inspection device for electronic component handling apparatuses according to claim 2,
the separation lines are a plurality of lines which are respectively separated from each other,
the analyzer analyzes the plurality of sampling regions with reference to each of the plurality of separation lines to analyze whether the electronic component is defective or not.
5. The inspection apparatus for electronic component handling equipment according to claim 4,
the analyzer identifies a different cause of failure for each of the plurality of sampling regions.
6. The inspection device for electronic component handling apparatuses according to claim 2,
the analyzer extracts sampling regions within a predetermined range with respect to the center line from a plurality of images captured a plurality of times, and combines the extracted sampling regions, and then analyzes the placement state of the electronic component mounted on the mounting element from the combined data.
7. The inspection apparatus for electronic component handling equipment according to claim 1,
the analyzer extracts a sampling region within a predetermined range with reference to the center line, and analyzes the placement state of the electronic component mounted on the mounting element from the extracted data.
8. The inspection device for electronic component handling apparatuses according to claim 6 or 7,
the analyzer analyzes a placement state of the electronic component by analyzing a slope of the lightness data.
9. An inspection apparatus for an electronic component handling apparatus, comprising:
a light irradiator that irradiates light for causing brightness differences between surface regions of the electronic component to occur to a surface of the electronic component;
a confirmation camera for shooting the area irradiated by the light irradiator so as to confirm at least one of the defect of the electronic component and the arrangement state of the electronic component;
an analyzer that analyzes at least one of a failure and a placement state of the electronic component mounted on the mounting element by analyzing brightness data for each of at least two sampling regions having brightness values different from each other in the image captured by the camera for confirmation; and
a controller for notifying the defect of the electronic component or the defect of the arrangement state according to the information about the defect or the defect from the analyzer and controlling the shooting operation of the camera for confirmation.
10. The inspection apparatus for an electronic component processing apparatus according to claim 9, further comprising:
a mover that moves either the light irradiator or the mounting element so as to move the light irradiator and the electronic component relative to each other,
wherein the controller controls the mover and the confirmation camera such that the light irradiator and the electronic components are moved relative to each other and a plurality of shots are taken for each column of the electronic components,
the analyzer extracts and combines sampling regions from a plurality of images taken a plurality of times, respectively, and then analyzes the defective or mounted state of the electronic component from the combined data.
11. An inspection apparatus for an electronic component handling apparatus, comprising:
a light irradiator for irradiating linear light to the electronic component mounted on the mounting element;
a confirmation camera for photographing a region irradiated with the linear light by the light irradiator so as to confirm a placement state of the electronic component;
an analyzer analyzing a placement state of the electronic component by analyzing lightness data with respect to a sampling area within a predetermined range with reference to a center line, which is a line where a distance from the linear light to the electronic component is shortest and lightness is highest, in the image taken by the confirmation camera; and
and a controller for notifying whether the loading is bad or not according to the information about the arrangement state from the analyzer and controlling the shooting operation of the camera for confirmation.
12. The inspection apparatus for an electronic component handling apparatus according to claim 11, further comprising:
a mover that moves either the light irradiator or the mounting element so as to move the light irradiator and the electronic component relative to each other,
wherein the controller controls the mover and the confirmation camera such that the light irradiator and the electronic components are moved relative to each other and a plurality of shots are taken for each column of the electronic components,
the analyzer extracts and combines sampling regions from a plurality of images taken a plurality of times, respectively, and then analyzes the placement state of the electronic components from the combined data.
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| KR10-2019-0064910 | 2019-05-31 | ||
| KR20190064910 | 2019-05-31 | ||
| KR1020200037748A KR20200138654A (en) | 2019-05-31 | 2020-03-27 | Inspection apparatus for equipment of handling electronic components |
| KR10-2020-0037748 | 2020-03-27 |
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| CN112014410A true CN112014410A (en) | 2020-12-01 |
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