TWI776152B - Inspection apparatus for equipment of handling electronic components - Google Patents

Abstract

The present invention relates to an inspection device for electronic parts processing equipment. According to the present invention, in the captured image, the defectiveness of the electronic components is checked using the brightness data extracted from the predetermined sampling area, and the placement state of the electronic components is further checked using the brightness data extracted from the other sampling areas. According to the present invention, the defect of the electronic component itself can also be confirmed by the linear light. In particular, the two operations can be performed in parallel with the structure for judging the defect of the electronic component itself and the structure for judging the mounting state of the electronic component, so that the processing efficiency is improved. and productivity.

Description

Inspection device for electronic parts processing equipment

The present invention relates to an inspection device for electronic parts processing equipment that individually manages and processes electronic parts, and in particular, relates to a technique of photographing electronic parts and analyzing images obtained by photographing to confirm whether they are defective.

The produced electronic components are shipped after going through various steps such as testing steps and sorting steps. Electronic parts processing equipment for processing electronic parts is used in this program.

Electronic parts processing equipment can be manufactured in various forms according to the work function. A loading element capable of loading electronic components is used for the operation of supplying electronic components to and recovering electronic components from such electronic component processing equipment, and for moving electronic components. The mounting element can be manufactured in various forms depending on the type of electronic component, the type of work using the same, and the like.

When the loading element is used, it is possible to realize the processing work required for the electronic component to move the electronic component from the loading element to another loading element or in a state where the electronic component is mounted on the loading element. Therefore, in order to appropriately realize the movement of the electronic components or the handling work related to the electronic components, it is necessary to accurately place the electronic components on the loading element. Otherwise, when the electronic components are mounted on the loading element in a badly placed state, the moving work or the processing work may fail. Therefore, in order to confirm the placement state of electronic components, the applicant of the present invention has proposed Korean Patent Laid-Open Nos. 10-2016-0018211 and 10-2017-0093624 (hereinafter referred to as "cited technologies").

In the cited technique, after irradiating a laser, which is a type of linear light, and photographing with a camera, it is possible to confirm the placement state of electronic components by analyzing the pattern of the photographed laser.

In addition, electronic components may be broken, punctured, scratched, adhered to foreign matter, stained, stained, and other visually identifiable defects (hereinafter referred to as "" bad apperance"). Since the appearance defects of electronic components were not considered in the past, a separate inspection was not required, and it was difficult to see whether the defects were so fine as to be difficult to be seen with the naked eye. However, it has been found that such appearance defects may also lead to fatal defects in products, and therefore, the confirmation of appearance defects in electronic parts processing equipment has recently been demanded.

However, the cited technique performs analysis using a program for pattern comparison of linear light, in particular, only the brightest linear pattern is used, and there are problems of recognition due to scattering, diffraction, and high brightness of light, etc., so it is possible to confirm the appearance. Bad programs are not suitable.

The present invention is exported so that an inspection device equipped with a light irradiator for irradiating linear light and a camera for confirmation, which has been used only for the purpose of confirming poor placement of electronic components, can be used to confirm the appearance defects of electronic components themselves.

The inspection apparatus for electronic parts processing equipment according to the first aspect of the present invention includes a light irradiator that irradiates the electronic parts with linear light; The analyzer analyzes the lightness of a sampling area within a predetermined range on the basis of at least one spaced line that is parallel to the center line and spaced apart by a predetermined space in the image captured by the camera for confirmation. data to analyze whether the electronic part is defective or not, the center line is the line with the shortest distance of linear light reaching the electronic part and the highest brightness; and a controller to notify the defectiveness based on the information on the defectiveness from the analyzer , and control the photographing operation of the confirmation camera.

The inspection apparatus for electronic component processing equipment further includes a mover that moves either the light irradiator or the electronic component such that the light irradiator and the electronic component are moved relative to each other in a direction perpendicular to the center line , wherein the controller controls the mover and the camera for confirmation so that the light irradiator and the electronic components are moved relative to each other, and each column of electronic components is photographed multiple times, and the analyzer is Sampling areas are extracted from the multiple captured images and merged, and the defect of electronic parts is analyzed from the merged data.

The analyzer may, after binarizing each pixel into 0 and 1 with respect to the merged data based on the set lightness value, analyzes whether the electronic component is defective or not through the binarized data.

There are a plurality of the separation lines, the plurality of separation lines are respectively separated from each other, and the analyzer analyzes a plurality of sampling areas with each of the plurality of separation lines as a reference to analyze whether the electronic components are defective or not.

The analyzer identifies mutually different failure causes for each of the plurality of sampling regions.

The analyzer extracts and merges a sampling area within a predetermined range based on the center line from a plurality of images captured a plurality of times, and then analyzes the placement state of the electronic components mounted on the loading element from the merged data.

The analyzer extracts a sampling area within a predetermined range based on the center line, and further analyzes the placement state of the electronic components mounted on the mounting element from the extracted data.

The analyzer analyzes the placement state of the electronic components by analyzing the slope of the lightness data.

Furthermore, the inspection apparatus for electronic component processing equipment according to the second aspect of the present invention includes a light irradiator that irradiates the surface of the electronic component with light for causing a difference in brightness between the surface areas of the electronic component; The area irradiated with light by the light irradiator can confirm at least any one of the defectiveness of the electronic component and the placement state of the electronic component; and the analyzer, in the image captured by the confirmation camera, analyzes the lightness each of at least two sampling areas whose values are different from each other analyzes the lightness data, thereby analyzing at least any one of defectiveness and placement status of the electronic parts loaded on the loading element; The defectiveness of the electronic component or the defectiveness of the placement state is notified by the information on the defectiveness of the device, and the photographing operation of the confirmation camera is controlled.

The inspection apparatus for electronic parts processing equipment further includes a mover that moves either the light irradiator or the loading element so as to move the light irradiator and the electronic parts relative to each other, wherein the controller controls the A mover and the camera for confirmation move the light irradiator and the electronic components relative to each other, and take a plurality of shots for each column of the electronic components, and the analyzer extracts the plurality of images from the plurality of shots, respectively. Areas are sampled and merged, and the defective or placement status of electronic components is then analyzed from the merged data.

According to the third aspect of the present invention, the inspection device for electronic parts processing equipment includes a light irradiator that irradiates linear light to the electronic parts mounted on the mounting element; The placement state of electronic components can be confirmed; the analyzer analyzes the placement state of electronic components by analyzing lightness data for a sampling area within a predetermined range based on the center line in the image captured by the confirmation camera , the center line is the line with the shortest distance of linear light reaching the electronic component and the highest brightness; and the controller, based on the information on the placement state from the analyzer, notifies whether the loading is bad or not, and controls the camera for confirmation. Filming work.

It also includes: a mover that moves either the light irradiator or the loading element in such a way that the light irradiator and the electronic component move relative to each other, wherein the controller controls the mover and the confirmation device. a camera, so that the light irradiator and the electronic components are moved relative to each other, and multiple shots are taken for each column of the electronic components, and the analyzer extracts and merges sampling regions from the multiple images taken for multiple times, respectively, The placement status of the electronic components is then analyzed from the merged data.

According to the present invention, the following effects are obtained.

First, although linear light is used, the brightness data of the area with relatively low brightness separated from the center line is used, not the brightness data of the area with high brightness located on the center line, so it can be confirmed that if the brightness is higher It is difficult to confirm the appearance of the electronic components themselves.

Second, since a plurality of lightness data are combined to confirm the placement state of the electronic components or the appearance of the electronic components themselves, the reliability of inspection is improved.

Third, there is no need to go through a separate defect detection system or defect detection program for the appearance inspection of the electronic components themselves, and it is possible to carry out the inspection of the placement status of the electronic components at the same time. Therefore, it is possible to improve the efficiency and productivity of processing and realize cost savings.

The preferred embodiments according to the present invention will be described with reference to the drawings, and for the sake of brevity of description, the description of repeated or substantially the same configuration will be omitted or compressed as much as possible. <General description of the composition>

FIG. 1 is a schematic diagram of an inspection apparatus for electronic component processing equipment (hereinafter, simply referred to as “inspection apparatus”) 100 according to an embodiment of the present invention.

The inspection apparatus 100 includes a light irradiator 110 , a confirmation camera 120 , a mover 130 , an analyzer 140 , and a controller 150 .

The light irradiator 110 irradiates the electronic component D with linear light. The linear light can be preferably a laser with a good concentration rate, and is preferably irradiated perpendicular to the surface of the electronic component D so that the best data can be obtained. Then, as shown in FIG. 2 , the linear light L irradiated by the light irradiator 110 passes through all the rows of the electronic components D mounted on the mounting element LE.

In addition, since light propagates while moving, even a laser with a good focusing rate has a three-dimensional brightness map as shown in FIG. 3 . Figure 3 is a three-dimensional representation of the brightness level. The region near the center line _CL irradiated vertically by the laser has the highest brightness, and the farther from the center line _CL , the lower the brightness. One of the features of the present invention is to use the luminance data around the spaced lines S ₁ , S ₂ , and S ₃ that are spaced apart from the center line _CL by a predetermined distance.

For example, in the present invention, as shown in the plan view with reference to FIG. 4 , when considering a first separation line S ₁ spaced apart from the centerline _CL by a first interval, and a second separation line S ₂ spaced apart by a second interval , When the third spaced line S3 is separated by the _third interval, the brightness is realized in the interval where the center line _CL , the _first spaced line S1, the _second spaced line S2 and the _third spaced line S3 are located sampling of data. Here, since the center line CL is a line in which the linear light _L is irradiated from directly above, the distance that the linear light L reaches the electronic component D is the shortest. Also, the first separation line S ₁ , the second separation line S ₂ , and the third separation line S ₃ are parallel to the center line _CL and spaced apart from each other. Of course, although the first separation line S ₁ , the second separation line S ₂ and the third separation line S ₃ are located behind the center line _CL in this embodiment, they may also be located on the center line _CL according to the embodiment. the front (refer to S ₁ ', S ₂ ', S ₃ '). That is, with the center line _CL as a reference, the sampling of the luminance data is performed in the center sampling area CS within the left and right predetermined width range, and similarly, the first separation line S ₁ , the second separation line S ₂ and the third separation line S 2 are The lightness data is sampled in the first sampling area 1S, the second sampling area 2S, and the _third sampling area 3S within a predetermined width range on the left and right with the open line S3 as a reference. Of course, although the sampling of luminance data is performed in the central sampling area CS, the first sampling area 1S, the second sampling area 2S, and the third sampling area 3S in this embodiment, according to the embodiment, it is also possible to fully consider that only the central sampling area CS is only Sampling one sampling area or sampling more than four sampling areas. In addition, for reference, since it is necessary to use optimum brightness data depending on which defect is detected, the width of each sampling area CS, 1S, 2S, and 3S or the width of each partition line S ₁ , S ₂ , and S ₃ The interval can be the same or different. That is, it is preferable to set a region that can best grasp the corresponding object according to the object (contamination, foreign matter adhesion, breakage, scratch, etc.) to be inspected by appearance, and then perform sampling on the brightness data in the corresponding region.

It is possible to confirm the placement state of the electronic component D or the defect of the electronic component D itself by photographing the area irradiated with the linear light L by the light irradiator 110 with the camera 120 for confirmation. Such a confirmation camera 120 is preferably equipped as an area camera for proper luminance data sampling, and its photographing direction has a predetermined angle θ (0 degree<θ<90 degree) with respect to the irradiation direction of the light illuminator 110 .

The mover 130 moves the loading element LE in the horizontal direction (the front-rear direction in the present embodiment) perpendicular to the center line _CL . Such a mover 130 is used to allow the electronic component D mounted on the mounting element LE to be photographed in the moving program, and therefore, depending on the embodiment, a structure in which the mounting element LE is stationary and the light irradiator 110 is moved may be adopted. That is, according to the present invention, as long as the light irradiator 110 and the electronic component D move relative to each other, the question of which object is moved by the mover 130 can be arbitrarily selected according to the structure allowed by the applied processing device. In addition, the mover 130 may be mixed in the processing device as a moving means for moving the loading element LE for work unrelated to the photographing work (for example, work for moving the loading element for processing electronic components, etc.).

The analyzer 140 analyzes the lightness data extracted from the respective sampling areas CS, 1S, 2S, 3S mentioned above in the image captured by the camera 120 by confirming, thereby judging the placement state of the electronic component D or the electronic component D itself. Bad or not. In particular, according to the present embodiment, the mover 130 moves the loading element LE, thereby realizing that each electronic component D is photographed a plurality of times (for example, four to eight times) (more precisely, it is realized that the photographing is performed for one column of electronic components). multiple shots). Accordingly, the analyzer 140 is realized to analyze the placement state of the electronic component D or the defect of the electronic component D itself from the merged data after merging the lightness data sampled from the multiple-shot images. Of course, the analysis performed by the analyzer 140 is performed for each of the central sampling area CS, the first sampling area 1S, the second sampling area 2S and the third sampling area 3S, in the respective sampling areas CS, 1S, 2S, 3S The causes of failure to be confirmed are different from each other. This point will be explained in detail in the following paragraphs.

The controller 150 notifies the failure by the occurrence of a jam event or the like based on the information on the failure or not from the analyzer 140 , and controls the photographing operation of the camera 120 for confirmation and the moving operation of the mobile device 130 . That is, the controller 150 controls the camera 120 for confirmation and the mover 130 so that the electronic component D moves together with the loading element LE, so that each electronic component D is photographed a plurality of times. <Overview of the process flow>

The overall operation of the inspection apparatus 100 will be briefly described with reference to the flowchart of FIG. 5 .

The mover 130 moves the loading element LE backward ( S100 ), and at this time, the light irradiator 110 irradiates the long linear light L directly downward in the left-right direction perpendicular to the moving direction of the loading element LE.

In addition, the camera 120 for confirmation executes a plurality of images for each electronic component D in the process of moving the loading element LE. To this end, the loading element LE is moved backward, and from the time when the upper surface of the rear end of the loading element LE is positioned directly under the light irradiator 110, the electronic component D is photographed at predetermined time intervals until the front end of the loading element LE is placed on the front end of the loading element LE. Until the surface is located directly under the light irradiator 110 ( S200 ), and the imaging time interval is set so that a plurality of shots are taken while at least one specific electronic component D passes directly under the light irradiator 110 . However, in the present embodiment, in order to compare and grasp the surrounding structure of the electronic component D and the mounting element LE adjacent to the electronic component D, not only the electronic component D but also the structure of the mounting element LE surrounding the electronic component D are captured. Shoot together. That is, according to this embodiment, imaging is started from before the electronic component D-side end portion is positioned directly below the light irradiator 110 .

The analyzer 140 extracts the lightness data of each sampling area CS, 1S, 2S, 3S from the image from the camera 120 for verification, and further combines the lightness data extracted for one column of electronic components D, and analyzes the combined data after the merger. The placement state of the electronic component D or the defectiveness of the electronic component D itself ( S300 ). At this time, the merging of the lightness data is realized only by using the lightness data of each sampling area CS, 1S, 2S, and 3S. For reference, one or more electronic components D may be loaded in a row according to the loading element LE.

The analyzer 140 sends the analyzed information to the controller 150 , and the controller 150 generates a notification for notifying the defect when a defect occurs based on the received information ( S400 ). In this way, the inspection for the electronic components D of each column is sequentially performed, so that the inspection of the electronic components D of all columns is performed.

Next, the processing and analysis procedure ( S300 ) of the luminance data of each sampling area CS, 1S, 2S, and 3S in the above-described general flow will be described. The reason why the lightness data processing and analysis procedure ( S300 ) is described for each sampling area CS, 1S, 2S, and 3S is that the causes of defects that need to be confirmed using the lightness data obtained from each sampling area are different. There are differences in the specific lightness data processing and analysis procedures (S300).

<Processing and Analysis Method of Lightness Data in the Center Sampling Area>

The central sampling area CS directly faces the linear light L irradiated by the light irradiator 110 in the up-down direction, and is set as a predetermined range before and after the center line CL with the shortest distance and the highest brightness from the linear light _L to the electronic component D as a reference width. Such brightness data of the center sampling area CS is used to analyze the placement state of the electronic component D. FIG. Such a flow will be described with reference to the flow chart of FIG. 6 .

According to the present embodiment, as shown in FIG. 7 , for inspection of a row of electronic components D, the loading element LE is photographed six times in the procedure of (a) to (f) in the moving procedure, thereby obtaining six images. Therefore, the lightness data of the center sampling area CS is extracted from images obtained by photographing one column of electronic components D and their front and rear surrounding structures six times, respectively. That is, when observed with the electronic component D or the mounting element LE as a reference (not with the light irradiator 110 as a reference), the center sampling regions CS are all different in the six images. Therefore, based on the electronic component D and the loading element LE, the center sampling area CS is set by passing through six areas in order from the rear end to the front end in the photographing order, and the analyzer 140 extracts the brightness of the center sampling area CS from the corresponding image. data (S311).

Next, as schematically shown in (a) and (b) of FIG. 8 , the respective lightness data D1 , D2 , D3 , D4 , D5 , D6 shown in ( a ) of FIG. 8 extracted from the image By performing integration ( S312 ) as shown in FIG. 8( b ), it is possible to acquire lightness data on the entire image of the electronic component D and its surroundings. The lightness data obtained in this way refers to the lightness value of each pixel, and based on this, as shown in the excerpt example of FIG. 9( a ), the three-dimensional height data FIG. 3M expressing the level of lightness by color is established ( S313 ). Such height data Fig. 3M is suitable for confirming the slope (rate of change) of lightness by the change of color. In this embodiment, all the electronic components D and the loading elements LE in one row captured at one time are included to perform imaging and extraction of lightness data, and based on this, the lightness data is represented by a height data map. For reference, the excerpt example of FIG. 9( b ) is an image on the electronic component D for the actually corresponding portion that can be compared with FIG. 9( a ). Comparing (a) and (b) of FIG. 9 , it can be seen that in the three-dimensional height data FIG. 3M , the case where the electronic component D is normally placed and the case where the electronic component D is not loaded and vacant can be accurately confirmed. That is, a normal situation and an abnormal situation can be accurately distinguished by the three-dimensional height data map 3M.

And, the analyzer 140 analyzes the placement state of the electronic component D through the height data map 3M ( S314 ). For example, in the case where the electronic component D is normally placed, the height of the lightness is constant within a desired range (the color is constant) in the entire area of the electronic component D, but when it is inclined, the height of the lightness varies ( Color change), and the height of lightness is higher than the desired range in the case of double loading and lower in the case of vacant. In this way, the analyzer 140 analyzes the placement state of the electronic component D using the height data map 3M established by the lightness data of the central sampling area CS, and as mentioned above, converts such an analysis result (which may include a judgment of whether it is bad) sent to the controller 150 . According to this, the controller 150 generates jam in the case of poor placement according to the analysis result from the analyzer 140, and notifies the manager of it.

For reference, the analyzer 140 or the controller 150 may also be equipped with a display, through which the three-dimensional height data FIG. 3M may be output. In this case, the administrator can check the height data map 3M, and visually recognize whether jamming has occurred, where the placement defect of the electronic component D has occurred, or has not occurred at which position of the loading element LE.

Of course, even if the three-dimensional height data FIG. 3M representing the slope (rate of change) of the lightness data is not created, the analyzer 140 can grasp the slope using only the lightness data, so as to know whether the electronic component D is properly placed on the loading element LE, Whether it is placed obliquely, whether it is not placed, whether it is double loaded, whether it is beyond or straddling the normal position, etc. For example, the electronic component D has a height of lightness 2 when it is normally installed, and has a height of lightness 0 when it is vacant. Defectiveness can be determined by comparing the average value of the heights of the electronic components D and the heights of the electronic components D existing on the mounting element LE with each other, and the standard deviation value can be used to stably confirm the defectiveness. In addition, in the case of staggered arrangement or inclined arrangement of electronic components, the analysis can also be performed by confirming the standard deviation or the degree of inclination from the height data of lightness, and it is also possible to compare the height value of the highest possible lightness with the minimum required lightness. The analysis can also be performed based on the information of the height value of the lightness, and similarly, the analysis can be performed by comparison with the information obtained from the electronic components D existing in the surroundings. Therefore, these methods can be mixed to obtain a more stable analysis result.

In addition, due to diffraction, scattering and high brightness value, etc., when analyzing the appearance of the electronic component D itself (broken, punctured, stain, etc.), the brightness data obtained in the central sampling area CS cannot guarantee accuracy. Therefore, the appearance defect of the electronic component D itself is analyzed using the luminance data of the first sampling area 1S, the second sampling area 2S, and the third sampling area 3S located outside the center sampling area CS. Hereinafter, the processing and analysis of the lightness data for inspecting the appearance defect of the electronic component D itself will be described. <Processing and Analysis Method of Lightness Data of the First Sampling Area>

The first sampling area 1S is the area closest to the center sampling area CS, and is set to have a width of a predetermined range before and after the first separation line S1 as _a reference. Such lightness data of the first sampling region 1S is used to analyze cracks, dents (dents), cracks (cracks), etc., which are relatively obvious appearance defects of the electronic component D itself. This will be described with reference to FIG. 10 .

Likewise, the luminance data of the first sampling area 1S is obtained from all six images in the same manner as in FIG. 7 .

The analyzer 140 extracts the lightness data of the first sampling area 1S from the corresponding image ( S321 ), and combines the lightness data in the same manner as in FIG. 8 ( S322 ), thereby being able to obtain an overall picture about one specific electronic component image brightness data. However, the lightness near the first separation line S1 has _a very low lightness compared to near the center line _CL , so even under weak external light, the value of the lightness data may be greatly distorted. Therefore, a noise reduction (noise removal) operation is performed to compensate the lightness value exceeding the desired predetermined range (eg, the desired lightness range when normal, the lightness range when broken, the lightness range of the loaded element, etc.) to be within the desired predetermined range. (S323).

Based on the denoised luminance data, an image of luminance data showing no color is created ( S324 ). Here, the lightness data image refers to an image in which luminance is expressed only by lightness values without color or chromaticity.

Next, a region of interest where electronic components are located is selected in the lightness data image. Although the region where the electronic component D is located is the region of interest in this embodiment, other structures that are not the electronic component D may also be the region of interest. Then, based on the specific lightness value, the lower lightness is treated as 0 (black) and the higher lightness is treated as 1 (white) by the binarization method ( S325 ). After the image is processed by the binarization method, the remaining luminance data except the region of interest (for example, the region corresponding to the electronic component and its surrounding parts) is removed to extract the data of the region of interest ( S326 ). The input information values (for example, the plane area of the electronic component or the horizontal and vertical length values, the number of terminals and their arrangement shape and size value, the plane shape of the electronic component, the outline specification of the electronic component, etc.) are compared and analyzed whether the electronic component D is Bad (may include whether there is a bad and the cause of the bad) (S327). For example, if the middle end of the electronic component D is broken and cracked, its size, appearance, etc. are different from the entered information values. The values are different, and if the electronic component D has a groove formed by being stabbed, the groove is treated as black (treated as 0) and expressed.

For reference, the excerpt example of FIG. 11 (a) and (b) is a lightness data image and an actual photograph of a part corresponding to the lightness data image, and a normal electronic component D can be clearly confirmed by the lightness data image of (a) and cracked electronic parts D.

The brightness data of the first sampling area 1S as described above is used to compare the size of the electronic component D, the shape of the electronic component D, the outline of the electronic component D, and the like, thereby enabling inspection of defectiveness.

The size analysis of the electronic part D can be performed by comparing the size information of the normal electronic part with the size information of the normal electronic part (for example, when 10 When ×10 is normal, if it is less than or more than this, it is judged as defective).

In addition, the shape analysis of the electronic component D can be realized by grasping the shape of the part where the electronic component D is located and the lightness of the parts around the electronic component D.

Further, the contour analysis of the electronic component D can be performed by concentratingly reading regions corresponding to the contour lines of the electronic component D and confirming the linearity of continuous pixels present in the contour (in the case of a quadrilateral shape). In this case, if the linearity of the outline of the electronic component is insufficient, or if it has a linearity but has a slope, it will be read as poor placement.

<Processing and Analysis Method of Lightness Data of Second Sampling Area>

The second sampling area 2S is set as an area farther from the center sampling area CS than the first sampling area 1S, and is set to a width of a predetermined range before and after the _second separation line S2 as a reference. Such lightness data of the second sampling area 2S is used for analyzing scratches, foreign matter adhesion, etc. of the electronic component D itself, which can be accurately confirmed from the lightness lower than the lightness of the first sampling area 1S. This will be described with reference to FIG. 12 .

Likewise, the lightness data of the second sampling area 2S is also obtained from all six images in the same manner as in FIG. 7 , the analyzer 140 extracts the lightness data of the second sampling area 2S from the corresponding images ( S331 ), and then Merging is performed in the same manner as in FIG. 8 ( S332 ), thereby obtaining lightness data on the entire image of one specific electronic component D. FIG. At this time, the analyzer 140 creates a luminance data image (S334) that appears colorless after the noise removal operation (S333), and selects a region of interest (S335). Then, the brightness data of the region other than the region of interest where the electronic components are located is removed from the brightness data image to extract the data of the region of interest ( S336 ), and then the pixels exceeding the required brightness value are detected to detect failure, and An analysis of the defect, such as confirming the defect size (the size of foreign matter, the size of scratches, etc.), is performed ( S337 ). Here, the reason for checking the defective size is that the normal determination may be determined as defective due to noise, so this procedure may be performed to determine only the size larger than a predetermined size as defective, or may be omitted.

For reference, since the cause of the defect to be confirmed in the second sampling area 2S is less obvious than the cause of the defect to be confirmed in the first sampling area 1S, the difference in brightness between the part where the cause of the defect is located and the normal part is not large. , and thus may get wrong results in the case of performing a binarization job. Therefore, no binary operation is performed in the processing program of the luminance data of the second sampling area 2S.

Such brightness data of the second sampling area 2S can be used to check whether it is defective by comparison of defective luminance, size, or the like.

For reference, even in the case of shooting with the same lighting and the same camera, there are cases where it looks different depending on the surrounding conditions, so a poor brightness (brightness) check is preferably performed by: The overall brightness confirmed by the part D is used as a reference. If the brightness is uniform, it is not defective, and if the brightness is not uniform, it is judged as defective.

In addition, the defective dimensional inspection may be performed after the defective luminance inspection, or may be performed independently, and only those with a predetermined numerical value or more are limited to be defective. For example, what corresponds to one pixel is judged to be noise and not defective. The purpose is to prevent confusion due to noisy data, and it is preferable to adjust the value as a reference by an administrator. <Processing and Analysis Method of Lightness Data in the Third Sampling Area>

The third sampling area 3S is set as an area farther from the center sampling area CS than the second sampling area 2S, and is set to a width of a predetermined range before and after the _third separation line S3 as a reference. The use of the brightness data of the third sampling area 3S is also the same as the use of the brightness data of the second sampling area 2S above. However, the lightness data of the third sampling area 3S is used to judge whether various stains or contaminations such as fingerprints, which have the weakest conspicuousness, are defective or not. Likewise, the binarization operation is not performed in the processing of the luminance data of the third sampling area 3S.

For reference, the analysis of the defect in the third sampling area 3S can be performed by pixel brightness inspection, defect size inspection, defect distribution inspection, brightness change inspection, and the like. Here, for example, there may be many small defects in the form of very small dots like spraying with a sprayer. In this case, the defects may be judged as noise due to their small size. Therefore, in order to In order to prevent such a misjudgment, the degree of distribution check is realized, and it is realized that if it is distributed in a wide area, it is judged as defective.

Here, the inspection of poor brightness and size is the same as the analysis of the second sampling area 2S above.

However, as briefly mentioned above, poor distribution checks are performed when trying to find out where stains exist, and mainly on which side. For example, for stains, most of them are multiple defects caused by spraying in the form of droplets, rather than a single defect caused by a drop of water falling. Therefore, in the case where the program is designed to identify only one defect, the defect that is too small may be misjudged as noise data. For example, if the size of three pixels or less is regarded as noise, an error will occur in the inspection. Therefore, the purpose of applying the defect distribution degree inspection is that even if it is three pixels or less, as long as it has a distribution in a predetermined area, it is determined as a defect, not as noise.

In addition, since there may be contamination covering the entire electronic component D, an inspection of the luminance change of the electronic component D is performed. For example, when the entire electronic component D is contaminated, it is difficult to confirm whether or not the electronic component D is defective by other inspection methods. Therefore, at least one of a method of comparing the brightness with other surrounding electronic components D and a method of comparing with the brightness of a stored image is used to check for defects.

Finally, if the aforementioned analysis in all sampling areas CS, 1S, 2S, and 3S ends, the analyzer 140 finally determines whether it is defective, and notifies the controller 150 of it, and the controller 150 jams in the case of defectiveness. and reminders. ＜References＞ 1. About linear light

Although the above embodiment has described the case where the light irradiator 110 irradiates the laser-type light with a high concentration rate, a light source such as a long-shaped fluorescent lamp or an LED arranged in one direction can be considered.

In addition, although the case where the light irradiator 110 only irradiates one kind of linear light has been described, the case where the linear light with low brightness and the linear light with high brightness are arranged adjacent to each other in order can be considered, and the surface light source with high brightness can also be considered. Structures attached to adjacent low surface light sources.

That is, it can be understood that the present invention can be extended to a method of inspecting the causes of failures that are different from each other using the brightness data of each region when the light irradiator 110 irradiates light so that at least two regions have a difference in brightness. 2. About the analyzer

Although the analyzer 140 is not described in more detail in the above description, the analyzer 140 may include a storage unit, an extraction unit, a merge unit, an analysis unit, and the like according to its functions.

The storage unit is a recording medium that stores captured images or various setting values required for analysis input from a manager or a server.

The extraction unit extracts luminance data of each sampling area.

The merging unit merges the luminance data as described above.

The analyzing unit analyzes the placement state of the electronic components or the defectiveness of the appearance of the electronic components themselves using the combined brightness data.

In addition, the storage unit also stores a program for performing the aforementioned processing and analysis, and the program can obviously run the storage function, the extraction function, the merge function and the analysis function on the computer. 3. About brightness data

Although the above embodiment is configured to grasp both the placement state of the electronic component D and the defect of the electronic component D itself, it may be configured to grasp only the placement state of the electronic component D using only the brightness data of the center sampling area CS depending on the situation , or only the lightness data of the first sampling area 1S is used to grasp only the fragmentation defect. That is, it can be realized that the above-mentioned analysis method is selectively executed in order to check the defectiveness required by the electronic component processing apparatus. 4. Example of lightness data image

As described above, when a lightness data image is created from lightness data acquired from the first sampling area 1S, the second sampling area 2S, and the third sampling area 3S, respectively, the form of each electronic component D visible from the lightness data image As shown in Figure 13.

FIG. 13 shows (a) a normal electronic component D, (b) a case where the surface of the electronic component D is stained, (c) a case where the surface of the electronic component D is scratched, and (d) an electronic component The case where the foreign matter is attached to D, and (e) the case where the corner of the electronic component D is broken is shown by comparing the actual photograph and the brightness data image. 5. Discrimination of bad causes

In the above description, the most suitable point for confirming the corresponding form has been exemplified according to the form of poor appearance. However, it is also possible to designate the sampling area in consideration of the classification of the defect by its size.

For example, a size of about 0.1 mm to 0.5 mm can be best confirmed in the lightness data obtained from the first sampling area 1S, a larger size defect can be best confirmed in the center sampling area CS, and a smaller size defect It can be confirmed best in the second sampling area 2S or the third sampling area 3S. In this way, the smaller the size of the defect, the smaller the size of which the cause of the defect can be identified in the region with lower lightness.

As mentioned above, the causes of failures confirmed in each sampling area CS, 1S, 2S, and 3S mentioned in the above description and their distinction or exemplified values are only examples. Therefore, the present invention can also be fully realized as follows: The position of the sampling area is determined based on which reference distinguishes the cause of the defect and which sampling area can best identify the cause of the defect in consideration of the primary color and material of electronic components, the type and function of the camera and lighting, and the like.

In addition, it should also be taken into consideration that it is necessary to set the sampling area by better grasping the brightness at the level of separation from the center line _CL in accordance with the characteristics of light. For example, Fig. 3 shows the brightness change in the case of laser. In Fig. 3, when the brightness of the center line _CL is 100%, the brightness of the area very close to the center line is 90%, and it gradually decreases as it goes to the side 50%, 30%. Of course, when the characteristics of light and the like are different, the amount of decrease in brightness varies depending on the shape of the graph and distance.

Although the present invention has been specifically described based on the embodiments with reference to the drawings as described above, the above-mentioned embodiments merely describe the preferred embodiments of the present invention, so it should not be construed that the present invention is limited to the above-mentioned embodiments. The right scope of the invention should be understood according to the scope of the patent application scope and its equivalent scope.

100: Inspection devices for electronic parts processing equipment 110: Light illuminator 120: Confirm the camera 130: Mover 140: Analyzer 150: Controller

FIG. 1 is a schematic diagram concerning an inspection apparatus for an electronic component processing apparatus according to an embodiment of the present invention.

2 to 4 are reference diagrams for explaining the function of the inspection apparatus for electronic component processing equipment of FIG. 1 .

FIG. 5 is a flowchart regarding the operation of the inspection apparatus for electronic component processing equipment of FIG. 1 .

6 to 13 are reference diagrams for explaining the processing and analysis method of lightness data realized in the inspection apparatus for electronic component processing equipment of FIG. 1 .

Domestic storage information (please note in the order of storage institution, date and number) none Foreign deposit information (please note in the order of deposit country, institution, date and number) none

S300: Program

S321, S322, S323, S324, S325, S326, S327: Jobs

Claims (12)

An inspection device for electronic component processing equipment, comprising: Light irradiator, which irradiates linear light to electronic components; Confirmation camera, photographing the area irradiated with linear light by the light irradiator, so as to be able to confirm whether the electronic parts are defective or not; An analyzer that analyzes the lightness data with respect to a sampling area within a predetermined range with respect to at least one spaced line spaced in parallel from the center line at a predetermined interval in the image captured by the camera for confirmation, thereby analyzing the electrons Whether the component is defective or not, the centerline is the line where the linear light reaches the electronic component with the shortest distance and the highest brightness; and The controller notifies the failure based on the information on the failure or not from the analyzer, and controls the imaging operation of the confirmation camera. The inspection device for electronic component processing equipment according to claim 1, further comprising: a mover that moves either the light irradiator or the electronic part so that the light irradiator and the electronic part are moved relative to each other in a direction perpendicular to the center line, wherein the controller controls the mover and the camera for confirmation, so that the light irradiator and the electronic components are moved relative to each other, and each column of electronic components is photographed multiple times, The analyzer extracts sampling regions from a plurality of images captured multiple times and combines them, and then analyzes whether the electronic components are defective or not from the combined data. The inspection apparatus for electronic parts processing equipment according to claim 2, wherein The analyzer binarizes each pixel into 0 and 1 for the merged data based on the set lightness value, and analyzes whether the electronic components are defective or not based on the binarized data. The inspection apparatus for electronic parts processing equipment according to claim 2, wherein There are a plurality of the separation lines, and the plurality of separation lines are respectively separated from each other, The analyzer analyzes a plurality of sampling areas with each of the plurality of spaced lines as a reference to analyze the defectiveness of the electronic components. The inspection apparatus for electronic parts processing equipment according to claim 4, wherein The analyzer identifies mutually different failure causes for each of the plurality of sampling regions. The inspection apparatus for electronic parts processing equipment according to claim 2, wherein The analyzer extracts and merges a sampling area within a predetermined range based on the center line from a plurality of images captured a plurality of times, and then analyzes the placement state of the electronic components mounted on the loading element from the merged data. The inspection apparatus for electronic parts processing equipment according to claim 1, wherein The analyzer extracts a sampling area within a predetermined range based on the center line, and further analyzes the placement state of the electronic components mounted on the mounting element from the extracted data. The inspection apparatus for electronic parts processing equipment according to claim 6 or 7, wherein The analyzer analyzes the placement state of the electronic components by analyzing the slope of the lightness data. An inspection device for electronic component processing equipment, comprising: a light irradiator for irradiating the surface of the electronic component with light for causing a difference in lightness between surface areas of the electronic component; A confirmation camera, which photographs the area irradiated with light by the light irradiator, so as to be able to confirm at least any one of whether the electronic components are defective or not and the placement state of the electronic components; an analyzer that analyzes lightness data for each of at least two sampling regions whose lightness values are different from each other in the image captured by the verification camera, thereby analyzing the defectiveness of the electronic components mounted on the mounting element and at least any of the placement status; and The controller notifies the defectiveness of the electronic components or the defectiveness of the placement state based on the defectiveness information from the analyzer, and controls the photographing operation of the confirmation camera. The inspection device for electronic component processing equipment according to claim 9, further comprising: a mover that moves either the light irradiator or the loading element so as to move the light irradiator and the electronic component relative to each other, wherein the controller controls the mover and the camera for confirmation, so that the light irradiator and the electronic components are moved relative to each other, and each column of electronic components is photographed multiple times, The analyzer extracts sampling regions from a plurality of images captured a plurality of times and combines them, and then analyzes the defectiveness or placement state of electronic components from the combined data. An inspection device for electronic component processing equipment, comprising: The light irradiator irradiates linear light to the electronic components mounted on the mounting element; confirming the camera to photograph the area irradiated with linear light by the light irradiator, so that the placement state of the electronic components can be confirmed; An analyzer that analyzes the lightness data with respect to a sampling area within a predetermined range with respect to the image captured by the confirmation camera, and analyzes the placement state of the electronic components, the center line being the arrival of the linear light The line with the shortest distance and highest lightness of the electronic component; and The controller notifies whether the loading is defective or not based on the information on the placement state from the analyzer, and controls the photographing operation of the confirmation camera. The inspection device for electronic component processing equipment according to claim 11, further comprising: a mover that moves either the light irradiator or the loading element so as to move the light irradiator and the electronic component relative to each other, wherein the controller controls the mover and the camera for confirmation, so that the light irradiator and the electronic components are moved relative to each other, and each column of electronic components is photographed multiple times, The analyzer extracts sampling regions from a plurality of images captured multiple times and combines them, and then analyzes the placement state of the electronic components from the combined data.

Images