JP4795561B2 - Bump height inspection method and inspection apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a bump height inspection method and an inspection apparatus for inspecting the height of a bump formed on a substrate, a chip or the like. More specifically, the present invention relates to a bump height inspection method and an inspection apparatus that can perform a bump height inspection with high accuracy and efficiency.
[0002]
[Prior art]
Conventionally, in the mounting of an LSI chip or the like, electrical connection with a printed wiring board is performed by bumps. And in order to perform sufficient joining, it is necessary to maintain the height of a bump at an appropriate value. This is because when the height of the bump is lower than an appropriate value, sufficient bonding cannot be performed and the mounting reliability is lowered. On the contrary, if the height of the bump is higher than the appropriate value, there is a possibility of short-circuiting with an adjacent bump. Therefore, it is inspected whether the height of the bump formed on the wiring board or the like is appropriate. In the inspection equipment used for this inspection, a ring formed by reflection of ring illumination is measured, and the height of the bump is estimated from the measurement result. The height of the bump is inspected using a method for estimating the height.
[0003]
[Problems to be solved by the invention]
However, in the inspection apparatus using the former method, the size of the ring formed by reflection depends not only on the height of the bump but also on the surface state of the bump.
For this reason, for example, when the bump is not a perfect spherical surface, the height of the bump cannot be accurately estimated from the size of the ring formed by reflection. On the other hand, in the inspection apparatus using the latter method, there is no absolute position reference for the size of the shadow produced by oblique illumination and the position of the bump apex image, so the inspection is based on relative evaluation with neighboring bumps. End up. In addition, when judging the quality of the bump height based on the error from the ideal value of the shadow size and the position of the bump apex image, the error is very small, and this error is accurately detected. It is very difficult to do. For example, if the bump is not a perfect spherical surface, the error cannot be detected accurately. Therefore, the conventional bump height inspection method and inspection apparatus have a problem that the bump height cannot be inspected with high accuracy.
[0004]
On the other hand, as a method for accurately measuring the height of the bump, there are a triangulation method using a laser beam and a projection method, both of which require scanning with a laser beam. For this reason, since it takes time to measure only the height of one bump, it takes a considerable amount of time to inspect all the heights of bumps formed in large quantities on a substrate. The inspection tact cannot be satisfied. Therefore, it is not practical to apply such a method to an inspection apparatus.
[0005]
Accordingly, the present invention has been made to solve the above-described problems, and it is an object to provide a bump height inspection method and inspection apparatus capable of performing a bump height inspection with high accuracy and efficiency. And
[0006]
[Means for Solving the Problems]
The bump height inspection method according to the present invention, which has been made to solve the above-described problems, is configured such that the line-shaped light has an optical axis and a normal of the base surface on which the bump is formed. 30 degrees to 60 degrees The top of the bump is irradiated so as to form a predetermined angle, and in that state, the first line CCD camera receives the specularly reflected light reflected at the top of the bump, and images the top of the bump. By receiving specularly reflected light reflected from the base surface by a two-line CCD camera At two points across the bump Image the base surface, Each CCD camera when the position where the vertex of the bump is imaged by the first line CCD camera is the first imaging position and the position where the base surface is imaged by the second line CCD camera is the second imaging position. From the combination of the imaging data imaged in step 1, the imaging data of the apex of the bump is cut out at the first imaging position, and the imaging data of the base surface at the two points is cut out at the second imaging position. When there is no deviation between the imaging data of the base surface at the point, the data is taken as the imaging data of the base surface at the second imaging position, and when there is a deviation between the imaging data of the base surface at the two points, Bumps at the first imaging position are obtained by averaging both data as imaging data of the base surface at the second imaging position. Calculating a distance between the imaging data of the base surface in the imaging data and the second image pickup position of the vertex, The height of the bump with respect to the base surface is calculated based on the calculated distance. The “optical axis” means the center of the angular distribution of the irradiated light.
[0007]
In this bump height inspection method, first, the line-shaped light is applied to the top of the bump to be inspected, the optical axis thereof and the normal of the base surface on which the bump is formed. 30 degrees to 60 degrees Irradiate to form a predetermined angle. At this time, the line-shaped light illuminates the bump top and the base surface. In this state, the top of the bump is imaged by the first line CCD camera, and the second line CCD camera At two points across the bump The base surface is imaged.
[0008]
Here, the line-shaped light may be obtained by expanding the light irradiated from the laser light source with a beam expander. In this way, by spreading the laser light with the beam expander, it is possible to irradiate the line-shaped light having a width of about 10 μm and having few scattering components. Therefore, the width of the irradiation light is sufficiently smaller than the height of the bump (about 50 μm). For this reason, the influence on the inspection accuracy by the width of light and the irregular reflection component can be minimized. Further, by making the irradiation light in a line shape, it is possible to inspect the height of a plurality of bumps by one imaging. That is, the inspection can be performed efficiently.
[0009]
And the optical axis of the irradiated light and the normal of the base surface 30 degrees to 60 degrees Since the line-shaped light is irradiated to the top of the bump so as to form a predetermined angle, the position where the specular reflection light from the apex of the bump can be received and the position where the specular reflection light from the base surface can be received Is different. That is, in a state where the top of the bump is irradiated with light, the position where the top of the bump is imaged by the first line CCD camera is different from the position where the base surface is imaged by the second line CCD camera. Therefore, Image data captured by each CCD camera, with the position where the top of the bump is imaged by the first line CCD camera as the first image capture position and the position where the base surface is imaged by the second line CCD camera as the second image capture position The image data of the apex of the bump at the first image pickup position is cut out from the combination of the above, and the image data of the base surface at the two points is cut out at the second image pickup position to obtain the apex of the bump at the first image pickup position. Between the imaging data of and the imaging data of the base surface at the second imaging position Is calculated.
[0010]
The distance calculated here is a value proportional to the bump height relative to the base surface (see FIGS. 2, 6, and 7). However, depending on the arrangement positions of the first line CCD camera and the second line CCD camera, the position between the position where the vertex of the bump is imaged by the first line CCD camera and the position where the base surface is imaged by the second line CCD camera is determined. The proportional expression established between the distance and the height of the bump with respect to the base surface is different. Therefore, the height of the bump with respect to the base surface is calculated based on the calculated distance according to the proportional expression in each arrangement relationship.
[0011]
Here, in the bump height inspection method according to the present invention, it is preferable that the first line CCD camera and the second line CCD camera are arranged in the vertical direction. By arranging the first line CCD camera and the second line CCD camera in this way, the distance between the imaging position of the first line CCD camera and the imaging position of the second line CCD camera is based on the base surface. It is twice the height of the bump. This is because this relationship is always established regardless of the angle between the optical axis of the irradiation light and the normal of the base surface. The first line CCD camera and the second line CCD camera may be arranged in the horizontal direction in addition to the vertical direction, or may be arranged in parallel with the optical axis of the irradiation light. Good. With such an arrangement, the bump height can be calculated by a simple proportional expression.
[0012]
As described above, the present inspection method does not perform the height inspection by estimating the bump height as in the conventional inspection method, but performs the height inspection by measuring the bump height. Therefore, it is possible to carry out the inspection with an accuracy that cannot be obtained without using a measuring instrument. Furthermore, since the light applied to the bumps is in a line shape, the inspection can be performed efficiently in a short time. Further, by using two sets of line CCD cameras, the inspection can be performed in the same time as when the area CCD camera is used. This is because it is not necessary to move the line CCD camera in order to obtain imaging data required by this inspection method. From the above, according to the present inspection method, the bump height inspection is performed with high accuracy and efficiency.
[0013]
Further, in the bump height inspection method according to the present invention, it is determined whether or not the bump height is normal by comparing the calculated bump height with an appropriate value, and is determined to be abnormal. In such a case, it is preferable to notify that effect. This is because an operator or the like can easily remove a substrate or the like on which a bump has an abnormality in the production line. Note that examples of the notification method include a warning lamp and a warning buzzer.
[0014]
Further, the bump height inspection apparatus according to the present invention includes an irradiation means for irradiating the top of the bump with line-shaped light, a first line CCD camera for imaging the top of the bump, At two points across the bump In the state where the light from the second line CCD camera that images the base surface and the irradiation means irradiates the top of the bump, Each CCD camera when the position where the vertex of the bump is imaged by the first line CCD camera is the first imaging position and the position where the base surface is imaged by the second line CCD camera is the second imaging position. From the combination of the imaging data imaged in step 1, the imaging data of the apex of the bump is cut out at the first imaging position, and the imaging data of the base surface at the two points is cut out at the second imaging position. When there is no deviation between the imaging data of the base surface at the point, the data is taken as the imaging data of the base surface at the second imaging position, and when there is a deviation between the imaging data of the base surface at the two points, Bumps at the first imaging position are obtained by averaging both data as imaging data of the base surface at the second imaging position. Calculating the distance between the imaging data of the base surface in the imaging data and the second image pickup position of the vertex And a bump height calculating means for calculating the height of the bump with reference to the base surface based on the calculation result of the distance calculating means. Here, the first line CCD camera and the second line CCD camera may be arranged in the vertical direction, the horizontal direction, or parallel to the optical axis of the irradiation light.
[0015]
Then, in the bump height inspection apparatus according to the present invention, by comparing the value calculated by the bump height calculating means with the appropriate value of the bump height, it is determined whether or not the bump height is normal. It is desirable to further include a determination unit for determining, and a notification unit for notifying that when the determination unit determines that the abnormality is present.
[0016]
According to the bump height inspection apparatus having such a configuration, the bump height inspection can be performed with high accuracy and efficiency as described above. In addition, an operator or the like can easily remove a substrate or the like on which a bump has an abnormality in the production line.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a most preferred embodiment in which an inspection apparatus using a bump height inspection method according to the present invention is embodied will be described in detail with reference to the drawings.
[0018]
First, a schematic configuration of an inspection apparatus according to the present embodiment is shown in FIG. The bump height inspection apparatus includes an imaging unit 1, an image processing unit 2, a processing result determination unit 3, a table control unit 4, and a table 5. Here, the imaging unit 1 is fixed at a fixed position, and the height of the bumps is sequentially inspected by moving the table 5 on which the inspected object 7 on which the bumps are formed is moved. In addition, each part in the bump height inspection apparatus is connected to each other, and its operation is controlled based on each control signal.
[0019]
As shown in FIG. 2, the imaging unit 1 includes an illumination device 10 and a camera 30, and irradiates light onto a base 9 such as a substrate on which the apexes of the bumps 8 and the bumps 8 are formed. 9 is imaged. The illumination device 10 includes a laser light source 11 and a beam expander 12. Thereby, the illuminating device 10 can irradiate the top of the bump 8 with line light having a width of about 10 μm and a small scattering component. The illumination device 10 is arranged so that θ = 45 degrees, where θ is the angle formed by the optical axis of the irradiation light and the normal line of the base 9.
[0020]
On the other hand, the camera 30 includes two sets of line CCD cameras 31 and 33. The camera 30 receives the regular reflection light from the bump 8 with respect to the irradiation light irradiated from the irradiation device 10 by the line CCD camera 31 and the regular reflection light from the base 9 by the line CCD camera 33. The bump 8 and the base 9 are imaged. The line CCD cameras 31 and 33 are arranged below the line CCD camera 31 as shown in FIG. That is, the line CCD cameras 31 and 33 are arranged on the normal line of the base 9.
[0021]
Here, since the two sets of line CCD cameras 31 and 33 are fixed, if an error occurs in the mounting position or the like of the imaging unit 1, the specularly reflected light from the bump 8 and the base 9 is applied to the line CCD cameras 31 and 33. May not be able to receive light. However, the line CCD cameras 31 and 33 are each provided with several lines of CCD pixels. For this reason, it is considered that the regular reflection light from the bumps 8 and the base 9 can be sufficiently received by the line CCD cameras 31 and 33 if the error is within a range that is considered to occur at the time of attachment.
[0022]
The angle formed between the optical axis of the specularly reflected light and the normal line of the base 9 is θ = 45 degrees. Further, the attachment angle θ with respect to the normal line of the base 9 of the imaging unit 1 is not limited to 45 degrees, and can be any angle as long as it is within a range of 30 to 60 degrees.
[0023]
Based on the imaging result of the camera 30, the image processing unit 2 captures the position where the vertex of the bump 8 is imaged by the line CCD camera 31 (hereinafter referred to as “first imaging position”) and the base 9 by the line CCD camera 33. The distance d1 between the first position and the second position (hereinafter referred to as “second imaging position”) is calculated to obtain the height h of the bump 8 with respect to the base 9. A method for obtaining the bump height h will be described later.
[0024]
The processing result determination unit 3 determines whether or not the bump height h obtained by the image processing unit 3 is normal. If there is an abnormality in the height h of the inspected bump, the processing result determination unit 3 notifies the abnormality by sound or light.
[0025]
The table 5 is for firmly fixing an object to be inspected 7 such as a substrate on which bumps are formed. The table 5 is provided with a moving mechanism 6 and moves based on a control signal from the table control unit 4. In the present embodiment, the table controller 4 moves the table 5 by the bump formation pitch p (see FIG. 3) every time one imaging by the imaging unit 1 is completed.
[0026]
Note that if the inspection is performed with the movement amount of one step of the table 5 being reduced, the inspection accuracy can be increased. However, in this case, the inspection time becomes long. For this reason, it is preferable to perform the inspection by reducing the movement amount of one step of the table 5 only near the apex of the bump 8 and increasing the other portions. This is because by setting the movement amount of the table 5 in this way, the inspection time can be made relatively short while increasing the inspection accuracy.
[0027]
Next, a bump height inspection method using the inspection apparatus configured as described above will be described. First, a test object 7 on which a plurality of bumps 8 as shown in FIG. 3 is formed is fixed at a predetermined position on the table 5. When the inspection object 7 is placed on the table 5, the table 5 is positioned at a position where the irradiation light from the illumination device 10 hits the vertices of the bumps 8 (for one line) based on the control signal from the table control unit 4. Moved. When the movement of the table 5 is completed, light is irradiated from the irradiation device 10 to each bump 8 (for one line). At this time, since line light is emitted from the irradiation device 10, a plurality of (one line) bumps 8 can be imaged by one imaging. Accordingly, since the height inspection of a plurality of (one line) bumps 8 can be performed from the result of one imaging, the inspection efficiency is very good.
[0028]
Then, in a state where light is irradiated to the apex of each bump 8 and the base 9 by the irradiation device 10, the imaging of each bump 8 and the base 9 is performed by the camera 30. That is, the reflected light is received by the line CCD cameras 31 and 33 provided in the camera 30, and image processing is performed based on the light amount data relating to the received light amount. Then, when the imaging result regarding each bump 8 and the base 9 is obtained by the camera 30, the data is input to the image processing unit 2. Then, the image processing unit 2 combines the imaging results of the line CCD cameras 31 and 33 with respect to a predetermined bump based on the imaging results of the line CCD cameras 31 and 33 to obtain an imaging result as shown in FIG. 4A and 4C show the imaging results of the line CCD camera 33, and FIG. 4B shows the imaging results of the line CCD camera 31.
[0029]
Next, in order to calculate the distance d1 between the first imaging position and the second imaging position necessary for calculating the bump height h, each imaging data is cut out in a predetermined range (constant width). As a result, imaging data as shown in FIG. 5 is obtained. Here, since light having a width of about 10 μm is irradiated from the irradiation device 10, the line width in the imaging result is 10 μm or more. Therefore, the camera 20 performs processing so that the result is output with the center of the line width as a reference.
[0030]
Subsequently, the bump height h is calculated based on the imaging data of FIG. That is, the distance d1 between the first imaging position and the second imaging position is calculated, and the bump height h is obtained based on the calculation result. As is apparent from FIG. 2, the distance d1 between the first imaging position and the second imaging position is d1 = h × 2. That is, the distance d1 is twice the bump height h. Thus, by arranging the line CCD cameras 31 and 33 provided in the camera 30 up and down, regardless of the incident angle of the light irradiated from the irradiation device 10, between the distance d1 and the bump height h, A relationship that always satisfies d1 = h × 2 can be established. Accordingly, since the relative positions of the line CCD cameras 31 and 33 are always the same, the position adjustment when the camera 30 is arranged can be performed very easily.
[0031]
Thus, since the distance d1 is d1 = h × 2, the bump height h is h = d1 / 2. As described above, the present inspection apparatus can measure the bump height h that cannot be measured by the conventional inspection apparatus. When the distance d1 is calculated, when the image data of the base 9 cut out as shown in FIGS. 5A and 5C is misaligned (for example, there is an unevenness such as wiring on the base) The average value of the two data may be used.
[0032]
When the bump height h is calculated in the image processing unit 2, the result is input to the processing result determination unit 3. Then, the processing result determination unit 3 determines whether or not the height of the bump 8 is normal by comparing the appropriate value of the bump height stored in advance with the calculated value h. When the processing result determination unit 3 determines that the height of the bump 8 is abnormal, the processing result determination unit 3 notifies the fact. By this notification, the defective product is removed from the production line by the operator. It is also possible to automatically remove defective products from the production line by installing a removal device for removing defective products from the production line and inputting a notification signal from the processing result determination unit 3 to the removal device. is there.
[0033]
If at least one of the line CCD cameras 31 and 33 cannot receive regular reflection light, the bump is clearly a defective product. Therefore, also in this case, the processing result determination unit 3 notifies the fact that it is abnormal.
[0034]
When the height inspection of the bumps 8 for one line is completed as described above, a control signal is transmitted from the table control unit 4 to the moving mechanism 6 in order to perform the height inspection of the bumps 8 of the next line. . The moving mechanism 6 is driven based on the control signal from the table control unit 4 to move the table 5 by the bump formation pitch p (see FIG. 3). Then, the height inspection of the bump 8 in the next line is performed by repeating the above-described operation. Thereafter, in the inspection apparatus, the above-described operations are sequentially repeated, and the bump height inspection on the inspection object 7 is completed.
[0035]
Thus, in this inspection apparatus, the height of the bump can be measured. Therefore, it is possible to perform an inspection with an accuracy that cannot be obtained without using a height measuring instrument. In addition, a plurality of (one line) bump height inspections can be performed by one imaging. That is, according to the present inspection apparatus, the bump height inspection can be performed with high accuracy and efficiency.
[0036]
Next, a modification according to the above embodiment will be described. This modification is different from the above embodiment in the arrangement position of the camera. Other configurations are basically the same. Therefore, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted.
[0037]
The camera 30a in the first modification includes two sets of line CCD cameras 31a and 33a as shown in FIG. They are arranged in the horizontal direction, that is, parallel to the base 9.
[0038]
Even in this case, the imaging results as shown in FIGS. 4 and 5 are obtained as a result. Because θ = 45 degrees, even if two sets of line CCD cameras are arranged in the horizontal direction as shown in FIG. 6, two sets of line CCD cameras are arranged in the vertical direction as shown in FIG. This is because the proportional expression established between the bump height h and the distance between the first imaging position and the second imaging position is the same. Then, the bump height h is calculated based on the imaging data of FIG. 5 obtained by the camera 30a. That is, the distance d2 between the first imaging position and the second imaging position is calculated, and the bump height h is obtained based on the calculation result. The processing after the bump height h is measured is the same as that in the above embodiment.
[0039]
Next, the camera 30b according to the second modification includes two sets of line CCD cameras 31b and 33b as shown in FIG. And they are arranged so as to be parallel to the optical axis of the irradiation light from the irradiation device 10.
[0040]
In this case, when the imaging result regarding each bump 8 and the base 9 is obtained by the camera 30b, the data is input to the image processing unit 2. Then, the image processing unit 2 combines the imaging results of the line CCD cameras 31b and 33b with respect to a predetermined bump based on the imaging results of the line CCD cameras 31b and 33b to obtain an imaging result as shown in FIG. 8A and 8C show the imaging results of the line CCD camera 33b, and FIG. 8B shows the imaging results of the line CCD camera 31b.
[0041]
Next, in order to calculate the distance d3 between the first imaging position and the second imaging position necessary for calculating the bump height h, each imaging data is cut out in a predetermined range (constant width). As a result, imaging data as shown in FIG. 9 is obtained. The processing so far is basically the same as in the above embodiment.
[0042]
Then, a distance d3 between the first imaging position and the second imaging position is calculated based on the imaging data of FIG. 9, and the bump height h is obtained based on the calculation result. The processing for calculating the bump height h is slightly different from that of the above embodiment. That is, since θ shown in FIG. 7 is 45 degrees, the distance d3 between the first imaging position and the second imaging position is d3 = h / cos45 ° = h × √2. That is, the distance d3 is √2 times the bump height h. Accordingly, the bump height h is h = d3 / √2. In this way, the processing after the bump height h is measured is the same as in the above embodiment.
[0043]
As described in detail above, the bump height inspection apparatus according to the present embodiment includes the irradiation device 10 that irradiates light from the upper side to the apex of the bump 8 and the bump by receiving the regular reflection light. 8 and a camera 30 that images the base 9. Therefore, in the camera 30, the first imaging position where the vertex of the bump 9 is imaged by the line CCD camera 31 is different from the second imaging position where the base 9 is imaged by the line CCD camera 33. Then, the image processing unit 2 calculates a distance d1 between the first imaging position and the second imaging position, and calculates the height h of the bump 8 with reference to the base 9 based on the distance d1. Thereafter, the processing result determination unit 3 determines whether or not the bump height is normal based on the calculated value of the bump height h. As described above, according to the bump height inspection apparatus according to the present embodiment, since the height inspection is performed by calculating the value of the bump height h, an inspection result with an accuracy that cannot be obtained without using a height measuring instrument. Is obtained.
[0044]
The light emitted from the illumination device 10 to the apexes of the bumps is spread in a line shape by the beam expander 12. For this reason, the camera 30 can inspect the height of a plurality of (one line) bumps by one imaging. Therefore, according to the bump height inspection apparatus according to the present embodiment, the bump height inspection can be efficiently performed.
[0045]
Furthermore, by using two sets of line CCD cameras, it is not necessary to move the line CCD cameras in order to obtain imaging data required in this inspection method, and it is not necessary to use an area CCD camera. Thereby, an inspection apparatus can be provided at a lower cost.
[0046]
In addition, this Embodiment is only a mere illustration and does not limit this invention at all. Accordingly, the present invention can be variously improved and modified without departing from the scope of the invention. For example, in the above embodiment, the case where the present invention is used for the height inspection of the bump formed on the substrate has been described. However, the present invention is not limited to this, and the bump formed on the IC chip, the LSI chip, or the like. The present invention can also be applied to a height inspection of a bump, a height inspection of a bump formed for interlayer connection, and the like. In the above embodiment, only the bump height inspection is performed alone, but the wiring pattern inspection and the bump height inspection can be performed simultaneously.
[0047]
【The invention's effect】
As is apparent from the above description, according to the bump height inspection method and inspection apparatus according to the present invention, the bump height inspection can be performed with high accuracy and efficiency.
[Brief description of the drawings]
FIG. 1 is a block diagram showing a schematic configuration of an inspection apparatus according to an embodiment.
FIG. 2 is a diagram schematically illustrating an arrangement position of an imaging unit.
FIG. 3 is a diagram for explaining an imaging method at the time of inspection;
FIG. 4 is a diagram showing an imaging result.
FIG. 5 is a diagram illustrating a result of cutting out the imaging result of FIG. 4 in a specific area.
FIG. 6 is a diagram schematically illustrating an arrangement position of an imaging unit in a first modification.
FIG. 7 is a diagram schematically illustrating an arrangement position of an imaging unit in a second modification.
FIG. 8 is a diagram illustrating an imaging result in a second modified example.
9 is a diagram illustrating a result of cutting out the imaging result of FIG. 8 in a specific region.
[Explanation of symbols]
1 Imaging unit
2 Image processing section
3 Processing result judgment part
7 Inspected object
8 Bump
9 base
10 Irradiation device
11 Laser light source
12 Beam expander
30 cameras
31,33 line CCD camera

Claims (5)

Irradiate the top of the bump with line-shaped light so that the optical axis and the normal of the base surface on which the bump is formed form a predetermined angle of 30 degrees to 60 degrees ,
In this state, the first line CCD camera receives the specularly reflected light reflected at the apex of the bump to image the apex of the bump, and the second line CCD camera reflects the specularly reflected light reflected from the base surface. Capture the base surface at the two points that sandwich the bump by receiving light,
Each CCD camera when the position where the vertex of the bump is imaged by the first line CCD camera is the first imaging position and the position where the base surface is imaged by the second line CCD camera is the second imaging position. From the combination of the imaging data imaged at, the imaging data of the apex of the bump at the first imaging position, and the imaging data of the base surface at the two points at the second imaging position,
When there is no gap between the imaging data of the base surface at the two points, the data is the imaging data of the base surface at the second imaging position,
When there is a gap between the imaging data of the base surface at the two points, the average of both data is taken as the imaging data of the base surface at the second imaging position,
Calculating the distance between the imaging data of the apex of the bump at the first imaging position and the imaging data of the base surface at the second imaging position;
A bump height inspection method, wherein the height of the bump is calculated with reference to the base surface based on the calculated distance. In the bump height inspection method according to claim 1,
The bump height inspection method, wherein the first line CCD camera and the second line CCD sensor are arranged in a vertical direction. In any one bump height inspection method of Claim 1 or Claim 2,
By comparing the calculated bump height with an appropriate value, it is determined whether the bump height is normal,
A bump height inspection method characterized by notifying that if it is determined to be abnormal. An irradiation means for irradiating the top of the bump with a line of light;
A first line CCD camera that images the top of the bump;
A second line CCD camera that images the base surface at two points across the bump ;
In a state where the light from the irradiation means irradiates the top of the bump, the position at which the vertex of the bump is imaged by the first line CCD camera is defined as the first imaging position, and the base surface by the second line CCD camera. Is taken as the second imaging position, the imaging data of the vertices of the bumps are cut out at the first imaging position from the combination of the imaging data captured by the CCD cameras, and the first When the imaging data of the base surface at the two points is cut out at two imaging positions and there is no deviation between the imaging data of the base surface at the two points, the data is used as the imaging data of the base surface at the second imaging position. If there is a gap between the image data of the base surface at the two points, the average of the two data is used as the basis at the second image pickup position. As the imaging data of the scan surface, and distance calculating means for calculating the distance between the imaging data of the base surface in the imaging data and the second image pickup position of the apex of the bump in the first imaging position,
A bump height inspection apparatus comprising: a bump height calculation unit that calculates a bump height with reference to a base surface based on a calculation result of the distance calculation unit. In the bump height inspection apparatus according to claim 4,
A determination means for determining whether or not the height of the bump is normal by comparing the value calculated by the bump height calculation means with an appropriate value of the bump height;
A bump height inspection apparatus, further comprising: an informing means for informing that the abnormality is determined by the determining means.

Images