JP4877100B2 - Mounting board inspection apparatus and inspection method - Google Patents

Description

  The present invention relates to a mounting board inspection apparatus and inspection method for inspecting the external shape of a solder fillet. More specifically, the present invention relates to a mounting board inspection apparatus and inspection method for measuring the height of a solder fillet with high accuracy.

  Conventionally, after an electronic component such as a semiconductor chip is joined to a substrate with solder, a mounting state inspection is performed in which the quality of the soldered state is determined by the appearance of the solder fillet. As a general inspection procedure, laser light is applied to the solder fillet, the solder fillet is imaged by a CCD camera, and the external shape of the solder fillet is measured from the image data to determine whether the soldering state is good or bad. .

  Specifically, for example, Patent Document 1 discloses a mounting board inspection apparatus using a general principle of a laser displacement meter as an inspection apparatus that realizes an inspection of a soldered state. In this mounting board inspection device, a plurality of sheet-like laser beams (line lasers) are irradiated so as to straddle the electronic parts and solder fillets that are the subject, and line laser lines (shape lines) reflected on the solder fillets are emitted. Images are taken by a plurality of CCDs, and the height of the electronic component is measured by triangulation based on the shape line and the line laser line (reference line) reflected on the substrate.

  For example, in the inspection apparatus disclosed in Patent Document 2, two types of line lasers are irradiated at different angles, and scattered light reflected from the subject and regular reflection light are received by two CCDs, and the light reception is performed. Based on the data, the height of the bump of the wafer as the object is measured. Specifically, a pair of measurement systems (a combination of a light source and a camera) for measuring the position of a plane mirror surface (wafer) and a pair of measurement systems (a light source and a camera) for measuring the position of a non-planar surface (bump). 2), and the height of the bump apex is measured based on the position of the bump and the position of the wafer.

Further, for example, in the appearance state inspection device disclosed in Patent Document 3, annular multi-stage illumination devices having different irradiation angles are arranged, and the colors of the illumination devices are different. Then, the subject illuminated by the illumination light is imaged with a camera, and angle information of the solder fillet that is the subject is obtained based on the image. Then, the shape of the subject is estimated based on the angle information.
JP 2002-107311 A JP 2000-195886 A JP-A-6-201338

  However, the above-described conventional mounting board inspection apparatus has the following problems. That is, the surface of the solder fillet is generally a mirror surface, and most of the incident light is regularly reflected. Therefore, the reflected light does not enter the CCD depending on the inclination of the irradiated part. That is, in a pair of measurement systems (combination of the laser light source 8 and the camera 11) as shown in FIG. 20, only the portion of the entire surface of the solder fillet 5 where the specularly reflected light from the laser light source 8 enters the camera 11 is inclined. It cannot be measured. In particular, in determining whether the soldering state is good or not, the height of the solder fillet 5 is an important factor, but if the data at the top is not obtained, the determination becomes ambiguous.

  In order to solve this problem, it is conceivable to increase the amount of light of the line laser L and capture scattered light as much as possible. However, depending on the inclination of the solder fillet 5, the regular reflection light of the line laser L enters the CCD 11. At this time, if the amount of light is too large, the CCD 11 will cause halation and cannot be measured. That is, there is a tradeoff between receiving scattered light and suppressing halation, and as a result, the shape of the solder fillet 5 cannot be specified well.

  In the inspection apparatus disclosed in Patent Document 1, a plurality of laser light sources and CCDs are arranged so as to be shifted in the direction of the reference line, and each laser beam is emitted from different positions, so that a blind spot can be avoided. However, in this inspection apparatus, a portion that becomes a blind spot is irradiated with another laser beam, and the entire shape is judged by combining the image with the image of the laser beam irradiated from the front. That is, each laser beam is selected for each region of the subject. Therefore, the number of lasers irradiated on each area is basically one. Therefore, the above-mentioned problem occurs when focusing on the measurement of the entire solder shape.

  In the inspection apparatus of Patent Document 2, the position of the bump is estimated based on the scattered light received by one CCD, but as described above, the scattered light may be hardly obtained depending on the shape of the solder fillet. . In addition, since the height is measured by two systems, that is, a system for measuring the position of the reference wafer and a system for measuring the position of the bump as the object, two measurement systems (laser light source and camera) are inevitably required. More than one is required.

  In the inspection apparatus of Patent Document 3, each color illumination corresponds to a predetermined inclination range of the subject, and a rough appearance shape of the solder fillet can be estimated. For example, if the illumination has three colors, three-stage angle information can be acquired. However, with this inspection device, only the inclination is acquired, and the height of the solder fillet cannot be obtained directly. In addition, various shapes can be considered for good solder fillets, and the resolution is low only with the three-stage angle information, and the relationship between the pass / fail judgment threshold and the angle information tends to be unclear. At present, pass / fail standards are set based on samples, but it takes a lot of manpower to prepare high-precision standards. In addition, even if a pass / fail criterion is created, a sufficient percentage of correct answers cannot be obtained, and all subjects with a possibility of failure are determined to be defective. Ensures accuracy.

  The present invention has been made to solve the problems of the conventional mounting board inspection apparatus described above. That is, an object of the present invention is to provide a mounting board inspection apparatus and inspection method for measuring the external shape of a solder fillet with high accuracy.

A mounting board inspection apparatus for the purpose of solving this problem is a mounting board inspection apparatus for inspecting the external shape of a solder fillet, and includes a table for mounting a board on which electronic components are mounted, and a solder fillet. An image pickup unit that picks up an image from above and a plurality of laser light sources that emit line lasers. The line lasers output from the laser light sources are printed on a predetermined area across the electronic component and the solder fillet. The first laser light source group in which the laser light sources are arranged so as to be incident at different angles as viewed from the first direction, which is the direction of the reference line drawn in FIG. And a height measuring unit for measuring the surface height of the solder fillet within a range where the line laser is projected.

The mounting board inspection apparatus of the present invention irradiates a predetermined region straddling an electronic component and a solder fillet with a line laser. Each laser light source is arranged so that each line laser is incident on the solder fillet at a different angle when viewed from the direction of the reference line (first direction) drawn on the substrate. That is, in the mounting board inspection apparatus of the present invention, a plurality of line lasers are irradiated at different angles into the same region in the first direction. Then, each line laser imaged on the solder fillet is imaged by the imaging unit.

  When each line laser is incident on a solder fillet that is a mirror surface, most of it is regularly reflected. Therefore, when there is an imaging unit at the regular reflection destination, the image is displayed on the imaging unit. That is, the line laser is not projected on the entire area of the solder fillet, but is projected on a portion of the solder fillet surface within a specific inclination range. In this inspection apparatus, since the line lasers are incident from different angles, the range of the line lasers projected on the imaging unit is different.

  Then, the height measurement unit measures the surface height of the solder fillet within the range in which the line laser is projected for each line laser. That is, the height of the solder fillet is partially measured for each line laser. The total height of the solder fillet can be obtained by combining the measurement results. That is, the entire region irradiated with the line laser is covered by compensating the range that cannot be imaged by one line laser with the line laser irradiated from different angles. As a result, the shape of the entire area of the solder fillet can be obtained without increasing the light quantity of the line laser. Therefore, the external shape of the solder fillet can be measured with high accuracy without causing halation.

  In addition, it is better that the line laser emitted from the first laser light source group of the inspection apparatus has a different color for each line laser.

  That is, when the line laser is color-coded and irradiated, the shape line projected on the solder fillet is also color-coded. Therefore, even if a plurality of line lasers are imaged in a state where they are emitted simultaneously, it is possible to distinguish which line laser corresponds to each shape line. Therefore, it is possible to perform height measurement using a plurality of line lasers simultaneously with one imaging. Therefore, the inspection time can be shortened.

  The inspection apparatus includes a plurality of laser light sources that emit line lasers, and the line laser group output from each laser light source is a line laser group from the first laser light source group when viewed from the first direction. On the other hand, it is better to provide a second laser light source group in which the respective laser light sources are arranged so as to be symmetric with respect to the imaging unit.

  That is, by switching the laser light sources of the second laser light source group symmetrically with the laser light sources of the first laser light source group across the imaging unit, the line laser to be used can be switched depending on the state of the curved surface of the solder fillet. it can. Since it is possible to cope with the left and right inclined surfaces of the solder fillet by switching the line laser, it is possible to deal with various solder fillet layouts without rotating the first laser light source group. Therefore, the inspection time can be shortened.

  The inspection apparatus includes a plurality of laser light sources that emit line lasers, and each line laser includes a third laser light source group that draws a reference line in a second direction orthogonal to the first direction on the substrate plane. It is better to prepare.

  That is, each line laser from the third laser light source group that draws a reference line in a second direction orthogonal to the first direction is irradiated to an electronic component to be joined to the solder fillet. Thus, the shape of the solder fillet is measured by the line laser from the first laser light source group in the first direction. Furthermore, the height of the electronic component and the position in the first direction are measured. Further, the height of the electronic component and the position in the second direction are measured by the line laser from the third laser light source group. That is, by providing at least two line lasers in the second direction in addition to the line laser in the first direction, in addition to the external shape of the solder fillet, the external shape of the electronic component and the position on the substrate plane coordinates can be measured. it can. Therefore, more information can be obtained and the inspection can be made multifunctional.

Further, another mounting board inspection apparatus of the present invention is a mounting board inspection apparatus for inspecting the external shape of a solder fillet, a table on which a board on which an electronic component is mounted, the electronic component and the solder are mounted. A laser light source that emits a line laser to a predetermined region straddling the fillet and a plurality of imaging units that image the solder fillet. Each imaging unit has a line laser on the substrate for the predetermined region of the solder fillet. Within a range in which image data is acquired from each imaging unit group that captures images from different angles when viewed from the first direction that is the direction of the reference line to be drawn, and a line laser is projected for each image data And a height measuring unit for measuring the surface height of the solder fillet.

The mounting board inspection apparatus of the present invention irradiates a predetermined region straddling the electronic component and the solder fillet with one line laser, and acquires image data by a plurality of imaging units. Each imaging unit of the imaging unit group is arranged so as to image the solder fillet from different angles as viewed from the first direction. That is, in the mounting board inspection apparatus according to the present invention, the plurality of imaging units image the same region in the first direction from different angles.

  As described above, the line laser is displayed on the imaging unit when the imaging unit is at the regular reflection destination. That is, in each imaging unit, line laser imaging can be performed at a portion within a specific inclination range on the surface of the solder fillet. Since the imaging units capture images from different angles, the range of line lasers projected on the imaging unit is different.

  Then, the surface height of the solder fillet within the range where the line laser is projected is measured for each image data by the height measuring unit. That is, the height of the solder fillet is partially measured for each image data. The total height of the solder fillet can be obtained by combining the measurement results. In other words, the entire area captured by the imaging unit is covered by image data captured from different angles in a range that cannot be captured by one imaging unit. As a result, the shape of the entire area of the solder fillet can be obtained without increasing the light quantity of the line laser. Therefore, the external shape of the solder fillet can be measured with high accuracy.

  Further, the inspection apparatus reflects a line laser from a laser light source, and controls a galvanometer for controlling the reflection angle, and a lens system for changing the direction of the line laser reflected from the galvanometer to a constant angle toward the table. (For example, a cylindrical lens).

  That is, the irradiation position of the line laser in the second direction is controlled by adjusting the reflection angle of the line laser with a galvanometer. As a result, there is no need to move the substrate in the second direction, and the substrate positioning time is greatly reduced. As a result, the inspection time can be greatly shortened.

The present invention is a mounting board inspection method for inspecting the appearance shape of a solder fillet, wherein a plurality of line lasers are applied to a predetermined region straddling the electronic component and the solder fillet, and a reference line drawn on the board by the line laser A laser emission step of irradiating at different angles as viewed from the first direction, an imaging step of imaging a solder fillet on which at least one of the line lasers is incident, and an image from the imaging unit And a height measurement step for detecting the surface height of the solder fillet within a range in which the line laser is projected for each line laser.

Further, the present invention provides a mounting substrate inspection method for inspecting the external shape of a solder fillet, a laser emission step of emitting a line laser to a predetermined region straddling the electronic component and the solder fillet, and a plurality of imaging units, An imaging step for imaging a predetermined region of the solder fillet from different angles when viewed from a first direction, which is a direction of a reference line drawn by the line laser on the substrate, and acquiring image data captured at the imaging step. And a height measuring step of detecting the surface height of the solder fillet within the range where the line laser is projected for each data.

  According to the present invention, a mounting board inspection device and an inspection method for measuring the appearance shape of a solder fillet with high accuracy are realized.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a mounting board inspection apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. In this embodiment, the present invention is applied to an inspection device for soldering state inspection in which an electronic component is mounted by soldering and then the quality of the soldering state is determined by the appearance of the solder fillet.

[First embodiment]
[Configuration of inspection equipment]
As shown in FIG. 1, the inspection apparatus 100 according to the first embodiment includes a table 3, a light source group (laser light sources 8, 9, 10), a camera 11, a laser control unit 12, a camera control unit 13, The image processing apparatus 14 includes a determination unit 15, a table drive control unit 16, and a main control unit 17. The inspection apparatus 100 measures the external shape of the subject (in this embodiment, the solder fillet 5 that joins the electronic component 7 to the substrate 4) and determines whether the soldered state is good or bad.

  The table 3 includes an X-axis drive source 1 for moving the table 3 in the X-axis direction in FIG. 1 (hereinafter simply referred to as “X-axis direction”), and the table 3 in the Y-axis direction in FIG. And a Y-axis drive source 2 that is moved in the “Y-axis direction”. On the table 3, a substrate 4 as a mounting substrate is placed. The inspection apparatus 100 controls the X-axis drive source 1 and the Y-axis drive source 2 by the table drive control unit 16 to horizontally move the table 3 in the X-axis direction and the Y-axis direction, thereby adjusting the position of the substrate 4.

  The camera 11 is disposed above the table 3 and images in a direction perpendicular to the table 3 (Z-axis direction in FIG. 1). As the camera 11, a CCD, a C-MOS, or the like can be applied. The substrate 4 is positioned so that the electronic component 7 is disposed below the camera 11. The imaging timing of the camera 11 is controlled by the camera control unit 13. The captured image data is sent to the image processing device 14.

  The laser light sources 8, 9, and 10 constituting the light source group emit line lasers L1, L2, and L3, respectively. The laser light sources 8, 9, 10 irradiate the line lasers L 1, L 2, L 3 so as to straddle the electronic component 7 and the solder fillets 5, 6. Further, as shown in FIG. 2, the laser light sources 8, 9, and 10 are arranged so that their positions on the Y axis overlap when viewed from the X axis direction. Further, as shown in FIG. 3, the laser light sources 8, 9, and 10 are disposed on the same side with respect to the camera 11 when viewed from the Y-axis direction.

  Further, in the inspection apparatus 100, the irradiation directions of the laser light sources 8, 9, and 10 are adjusted so that the lines of the line lasers L1, L2, and L3 projected on the substrate 4 (reference lines at the time of height measurement) overlap. The Note that “overlapping” here does not necessarily require strict identity, and some variation is allowed depending on the required accuracy of inspection. That is, the inspection apparatus 100 irradiates all three line lasers L1, L2, and L3 within a predetermined inspection region in the Y-axis direction.

  Further, as shown in FIGS. 1 to 3, the laser light sources 8, 9, and 10 irradiate the line lasers L1, L2, and L3 to the solder fillet 5 at different angles, respectively. In this embodiment, the laser light source 8, the laser light source 9, and the laser light source 10 are used in order from the laser light source adjacent to the camera 11, and the line laser emitted from the laser light source 8 is emitted from the line laser L 1 and the laser light source 9. The line laser L2 is a line laser L2, and the line laser irradiated from the laser light source 10 is a line laser L3.

  Further, the light emission timing of each laser light source 8, 9, 10 is controlled by the laser controller 12. In this embodiment, when all the laser light sources are made to emit light at once, it is impossible to know which laser light source the shape line imaged by the camera 11 is from. Therefore, each laser light source 8, 9, 10 emits light at a different timing. And the shape line of each line laser L1, L2, L3 is imaged with the camera 11, respectively.

  The image processing device 14 acquires image data of the line lasers L1, L2, and L3 from the camera 11, and uses the general image processing technology such as binarization processing to form the line lasers L1, L2, and L3 shape lines. And a baseline is extracted. The data after image processing is sent to the determination unit 15.

  The determination unit 15 estimates the height by using a general triangulation technique based on the shape line data. That is, the height of the shape line portion is estimated based on the amount of deviation in the X-axis direction between the line laser (reference line) projected on the substrate 4 and the line laser (shape line) projected on the solder fillet 5. . Thereby, the external shape of the solder fillet 5 is obtained. Then, the quality of the solder mounting state is determined based on the extracted external shape.

  Specifically, the external shape of the solder fillet 5 is measured as follows. FIG. 4 shows an example of image data 18 imaged at the time of irradiation with the line laser L1, FIG. 5 shows an example of image data 19 imaged at the time of irradiation with the line laser L2, and FIG. An example of the image data 20 imaged at the time of irradiation is shown.

  The solder fillet 5 that is the subject has a curved surface and a substantially mirror surface. For this reason, even if one line laser is irradiated, only a part of the shape line Lf of the solder fillet 5 is reflected on the camera 11 as shown in FIGS. That is, only a portion of the surface of the solder fillet 5 that is inclined within a predetermined range is shown. However, since the three line lasers L1, L2, and L3 have different incident angles on the solder fillet 5, the camera 11 displays different inclined shape lines L1f, L2f, and L3f. The determination unit 15 can measure from the image data 18, 19, and 20 based on the shape lines L1f, L2f, and L3f and the reference lines L1m, L2m, and L3m reflected on the non-specular substrate 4. Measure the height of the part. And the external appearance shape of the solder fillet 5 whole is measured by combining them.

  In this embodiment, the line lasers L1, L2, and L3 are irradiated to the same position with respect to the mounting substrate 4 (that is, the positions of the reference lines L1m, L2m, and L3m when measuring the height are the same). However, they do not necessarily need to match, and even if they are slightly deviated, there is no problem in measuring the external shape of the solder fillet 5 as a whole.

[Inspection procedure]
The inspection processing procedure of the inspection apparatus 100 will be described based on the flowchart of FIG. The inspection procedure will be described below based on the inspection of the solder fillet 5 of the substrate 4 shown in FIG.

  First, the substrate 4 is placed on the table 3, and the X-axis drive source 1 to the Y-axis drive source 2 are controlled to position the substrate 4 (S1). In the present embodiment, the table 3 is moved horizontally so that the solder fillet 5 or the electronic component 7 is positioned directly below the camera 11.

  Next, the height of the solder fillet 5 is acquired using the line laser L1 (S2). Specifically, the laser light source 8 is turned on, and the line laser L1 is applied to the solder fillet 5. Then, the surface of the solder fillet 5 in this state is imaged. The laser light source 8 is disposed adjacent to the camera 11, and the line laser L1 incident on the surface of the solder fillet 5 that is relatively close to the horizontal plane is projected. The imaging data is sent to the image processing device 14, and the shape line L1f and the reference line L1m are extracted (see FIG. 4). Based on the shape line L1f on the solder fillet 5 and the reference line L1m on the substrate 4, the height of the shape line L1f portion is estimated by triangulation. After imaging, the laser light source 8 is turned off and the line laser L1 is erased.

  Next, the height of the solder fillet 5 is acquired using the line laser L2 (S3). Next, the height of the solder fillet 5 is acquired using the line laser L3 (S4). Thereby, the height of the place where each inclination differs among the solder fillets 5 is acquired. Then, by combining these height estimation results, a cross-sectional shape of the entire solder fillet 5 in the Y-axis direction can be obtained as shown in FIG.

  Note that the height data of the solder fillet 5 does not necessarily need to cover the entire area. In addition, the measurement range can be expanded by increasing the amount of light to the extent that halation does not occur, or by increasing the range of tilt that can be measured by increasing the number of laser light sources.

  Further, the order of the line lasers to be lit is not limited to the above order. That is, the line laser L2 or the line laser L3 may be used first. While one laser light source is turned on, the other laser light sources are not turned on.

  Next, the quality of the mounting state of the solder fillet 5 is determined (S5). That is, it is determined whether or not the acquired external shape of the solder fillet 5 is within an allowable range. As a determination criterion, for example, it is determined whether or not the height of the solder fillet 5 near the joint portion with the electronic component 7 is within the threshold range.

  As described in detail above, the mounting board inspection apparatus 100 according to the present embodiment irradiates a predetermined region of the solder fillet 5 with the three line lasers L1, L2, and L3. The laser light sources 8, 9, and 10 are arranged so that the line lasers L1, L2, and L3 are incident on the solder fillet 5 at different angles when viewed from the Y-axis direction (first direction). That is, in the inspection apparatus 100 of this embodiment, the line lasers L1, L2, and L3 are irradiated at different angles in the same region in the Y-axis direction. Then, the line lasers L1, L2, and L3 projected on the solder fillet 5 are imaged by the camera 11, respectively.

  Most of the line lasers L1, L2, L3 are regularly reflected when they enter the solder fillet 5 which is a mirror surface. Therefore, when the camera 11 is at the regular reflection destination, the image is displayed on the camera 11. That is, the line lasers L1, L2, and L3 are not projected on the entire range of the solder fillet 5, but are projected on a portion of the surface of the solder fillet 5 within a specific inclination range. In the inspection apparatus 100, the line lasers L1, L2, and L3 are incident from different angles, and therefore the range of the line lasers L1, L2, and L3 projected on the camera 11 is different.

  Then, the determination unit 15 measures the surface height of the solder fillet 5 within the range where the line laser is projected for each of the line lasers L1, L2, and L3. That is, the height of the solder fillet 5 is partially measured for each of the line lasers L1, L2, and L3. And the height of the solder fillet 5 whole is obtained by combining each measurement result. That is, the entire region irradiated with the line lasers L1, L2, and L3 is covered by compensating the range that cannot be imaged by one line laser with the line lasers irradiated from different angles. Thus, the shape of the entire area of the solder fillet 5 can be obtained without increasing the light amount of the line laser. Therefore, the external shape of the solder fillet 5 can be measured with high accuracy without causing halation.

[Second form]
The inspection apparatus 200 according to the second embodiment uses different colors for the line lasers L1r, L2g, and L3b. For example, as shown in FIG. 9, the line laser L1r is set to “red”, the line laser L2g is set to “green”, and the line laser L3b is set to “blue”. This is different from the first embodiment in which the line lasers L1, L2, and L3 are not color-coded.

  In the inspection apparatus 200 of this embodiment, the line lasers L1r, L2g, and L3b are color-coded and irradiated, so that the shape lines L1fr, L2fg, and L3fb projected on the solder fillet 5 are also color-coded as shown in FIG. The Therefore, even if all the line lasers L1r, L2g, and L3b are imaged in a state where they are emitted simultaneously, it is distinguished which line laser L1r, L2g, and L3b each shape line L1fr, L2fg, and L3fb corresponds to. be able to. Therefore, height measurement using three line lasers L1, L2, and L3 is performed simultaneously with one imaging.

  Since the inspection apparatus 200 can measure the heights of the shape lines L1fr, L2fg, and L3fb with one imaging, the first embodiment requires three steps (S2 to S4 in FIG. 7). The existing inspection step is performed in one step. Therefore, the inspection method of this embodiment can shorten the inspection time as compared with the first embodiment.

  In the present embodiment, for simplification of description, the positions of the reference lines L1mr, L2mg, and L3mb are shifted and displayed (see FIG. 10), but the reference lines L1mr, L2mg, and L3mb are the same as in the first embodiment. May be superimposed. In addition, when colors overlap, they are projected in a color different from the original color. Therefore, the line lasers L1r, L2g, and L3b may be intentionally irradiated to slightly different positions with respect to the substrate 4.

[Third embodiment]
As shown in FIG. 11, the inspection apparatus of the third embodiment has laser light sources 38, 39, and 40 in addition to the laser light sources 8, 9, and 10. Laser light sources 38, 39, and 40 emit line lasers L31, L32, and L33, respectively. The laser light sources 38, 39, and 40 are arranged symmetrically with respect to the laser light sources 8, 9, and 10 with the camera 11 in between. This is different from the first embodiment in which the light source group is arranged only on one side.

  When the line laser is irradiated from the left side of the camera 11 as shown in FIG. 3, specularly reflected light is obtained at a location where the surface of the solder fillet 5 is inclined to the left, and measurement is possible. On the other hand, as shown in FIG. 12, measurement is not possible because the line lasers L 1, L 2, and L 3 are reflected away from the camera 11 when the surface of the solder fillet 5 is inclined to the right.

  Usually, it is considered to avoid such an arrangement at the stage of positioning the substrate 4, but there are cases where positioning is difficult in consideration of the arrangement of other electronic components. In this regard, as shown in FIG. 13, it is conceivable to solve the problem by rotating the positions of the laser light sources 8, 9, and 10 about the camera 11 by 180 degrees, but a step for rotating is necessary. This hinders shortening of inspection time.

  Therefore, in this embodiment, as shown in FIG. 11, the laser light sources 38, 39, 40 are arranged symmetrically with the laser light sources 8, 9, 10 across the camera 11. As a result, the line lasers L31, L32, and L33 are irradiated at symmetrical angles with the line lasers L1, L2, and L3. Therefore, line lasers L1, L2, and L3 are used when irradiating the surface of the left inclined solder fillet 5 with the line lasers L1, L2, and L3, and line lasers L31 and L32 are used when irradiating the line inclined laser fillet 5 with the line laser. , L33 is used. That is, the laser light source group to be used is switched depending on the curved surface state of the solder fillet 5.

  Since the laser light source group can be switched to correspond to the left and right inclined surfaces of the solder fillet 5, it is not necessary to rotate the laser light sources 8, 9, and 10. Therefore, the inspection method of this embodiment can shorten the inspection time as compared with the first embodiment.

[Fourth form]
In the inspection apparatus of the fourth embodiment, as shown in FIG. 14, the substrate 4 is positioned so that the positions of the camera 11 and the laser light source group on the Y axis do not overlap with the electronic component 7 joined to the solder fillet 5. The camera 11 is arranged to be inclined toward the solder fillet 5. This is different from the first embodiment in which the positions of the camera 11 and the laser light source group on the Y axis overlap with the electronic component 7.

  The height of the solder fillet 5 is generally lower than the height of the electronic component 7. Therefore, when the camera 11 and the laser light sources 8, 9, 10 are on the electronic component 7 side as viewed from the solder fillet 5, the line lasers L 1, L 2, L 3 and the reflected light thereof may be transmitted to the electronic component 7 itself depending on the shape of the electronic component 7. May block. That is, a blind spot may occur in the solder fillet 5.

  Therefore, in this embodiment, the camera 11 and the laser light source group are arranged in front of the electronic component 7. Thereby, the blind spot resulting from the electronic component 7 is eliminated. For this reason, the inspection method of this embodiment can improve the accuracy of the inspection as compared with the first embodiment.

[Fifth embodiment]
As shown in FIG. 15, the inspection apparatus 500 according to the fifth embodiment includes a line that draws a reference line in the X-axis direction separately from the line laser group (line lasers L1, L2, and L3) that draws a reference line in the Y-axis direction. Laser light sources 58 and 59 for emitting laser groups (line lasers L54 and L55) are provided. This is different from the first embodiment in which the line laser is emitted only in the Y-axis direction.

  The inspection apparatus 500 of this embodiment measures the shape of the solder fillet 5 by the line laser group in the Y-axis direction (first direction) as in the fourth embodiment. Further, by moving the substrate 4 in the Y-axis direction, the height of the electronic component 7 and the position in the Y-axis direction are measured by the line laser group in the Y-axis direction.

  Furthermore, the inspection apparatus 500 according to the present embodiment measures the height of the electronic component 7 and the position in the X-axis direction with a line laser group in the X-axis direction (second direction). Since the surface of the electronic component 7 generates more scattered light than the surface of the solder fillet 5, the height can be measured relatively well even with a single line laser. Then, the line lasers L54 and L55 are irradiated to portions having different positions in the Y-axis direction. Thereby, the position on the X-axis direction of the electronic component 7 can be measured. That is, by providing a line laser in the X-axis direction in addition to the line laser in the Y-axis direction, the external shape of the electronic component 7 and the position on the substrate plane coordinate can be measured.

  Furthermore, by providing at least two line lasers in the X-axis direction, it is possible to measure the amount of deviation θ in the direction of the electronic component 7. Specifically, FIG. 16 is a view of the electronic component 7 as viewed from the Z-axis direction. In this inspection apparatus, it is assumed that the external shape and position of the electronic component 7 can be measured, and data such as a frame Fd drawn by a solid line in FIG. 16 is obtained. On the other hand, a frame Fm drawn by a broken line in FIG. 16 is set as a reference position for setting. When the directions of the center lines Fld and Flm of the two frames Fd and Fm are compared, the angle θ formed by the center lines Fld and Flm becomes the amount of deviation θ of the direction of the electrical component 7.

  That is, in the inspection apparatus 500 of this embodiment, the position (X, Y, θ) of the electronic component 7 is added to the appearance shape of the solder fillet 5 by the line laser group in the Y axis direction and the line laser group in the X axis direction. Can be measured. Therefore, the inspection of this embodiment can obtain more information compared to the first embodiment, and the inspection can be made multifunctional.

[Sixth embodiment]
As shown in FIG. 17, the inspection apparatus 600 of the sixth embodiment includes a table 3, a laser light source 68, cameras 61, 62, 63, a laser control unit 12, a camera control unit 13, and an image processing device 14. A determination unit 15, a table drive control unit 16, and a main control unit 17. That is, the inspection apparatus 600 includes one laser light source and a plurality of cameras. This is different from the first embodiment including a plurality of laser light sources and one camera.

  The laser light source 68 emits the line laser L61. The laser light source 68 irradiates the line laser L61 so as to straddle the electronic component 7 and the solder fillet 5. The laser light source 68 emits the line laser L61 in a direction in which the optical axis is orthogonal to the table 3 (Z-axis direction in FIG. 1). The substrate 4 is positioned so that the electronic component 7 is disposed immediately below the laser light source 68.

  Cameras 61, 62, and 63 are arranged on the table 3 and are configured by a CCD, a C-MOS, or the like, and image the substrate 4 on the table 3. Further, the cameras 61, 62, and 63 have different positions on the X-axis and the Z-axis as viewed from the Y-axis direction. The cameras 61, 62, and 63 capture images at different angles with respect to the solder fillet 5. That is, in the inspection apparatus 600 according to the present embodiment, the cameras 61, 62, and 63 image the same area in the Y-axis direction from different angles. In this embodiment, the camera 61, the camera 62, and the camera 63 are sequentially arranged from the camera close to the laser light source 68.

  The inspection apparatus 600 of this embodiment irradiates the solder fillet 5 with the line laser L61, and images the solder fillet 5 with the cameras 61, 62, and 63 having different imaging directions. And the height of the solder fillet 5 is estimated based on each imaging data. The method for estimating the height of the solder fillet 5 uses the triangulation method as in the first embodiment.

  The surface of the solder fillet 5 as the subject is a curved surface, and the line laser L61 is regularly reflected in various directions depending on the inclination angle. Each camera 61, 62, 63 partially receives the reflected light of the line laser L61 reflected at a wide range of angles. That is, imaging data of a shape line reflected on a part having a predetermined inclination angle is obtained by one imaging.

  The determination unit 15 of the inspection apparatus 600 measures the height of the measurable part from the captured data of the cameras 61, 62, and 63. That is, the height of the solder fillet 5 is partially measured for each image data. And the external appearance shape of the solder fillet 5 whole is measured by combining each measurement result. Thereby, the exact height of the solder fillet 5 can be acquired similarly to the first embodiment, and the accuracy of the inspection can be improved.

  In the inspection apparatus 600 of this embodiment, the camera group is disposed only on one side with respect to the line laser L61. However, as shown in FIG. 18, the cameras 64, 65, 66 are sandwiched by the line laser L61. You may arrange | position symmetrically with 61,62,63. Thereby, imaging from the opposite side with the line laser L61 interposed therebetween is also possible, and various curved surfaces of the solder fillet 5 can be imaged without rotating the cameras 61, 62, 63. Therefore, the inspection time can be shortened as in the third embodiment.

[Seventh form]
As shown in FIG. 19, the inspection apparatus of the seventh embodiment includes a laser light source 78 that irradiates a line laser L71 in the X-axis direction, a galvanometer 79 that reflects the line laser L71 and controls the reflection direction, and a galvanometer 79. A cylindrical lens 77 that changes the direction of the line laser L71 reflected from the laser beam to a direction orthogonal to the table 3, and cameras 71, 72, 73, 74, 75, and 76.

  As in the sixth embodiment, the inspection apparatus of the present embodiment irradiates the solder fillet 5 with the line laser L71 from the Z-axis direction and applies to the camera groups 71, 72, 73 or the camera groups 74, 75, 76 having different imaging directions. Then, the solder fillet 5 is imaged, and the height of the solder fillet 5 is estimated based on each imaging data.

  In the inspection of the external shape of the solder fillet 5, the shape of one Y-axis direction cross section of the solder fillet 5 is acquired by one inspection. Then, the entire surface shape of the solder fillet 5 is obtained by obtaining a plurality of such cross-sectional shapes in the Y-axis direction in the X-axis direction. At this time, when the laser light source 68 of the line laser L61 is fixed as in the sixth embodiment, the table 3 is moved in the X-axis direction to position the substrate 4. Since the movement of the table 3 takes time, it causes a long inspection time.

  On the other hand, in the inspection apparatus of this embodiment, the irradiation position of the line laser L71 is controlled by the galvanometer 79. In other words, the irradiation position of the line laser L71 in the X-axis direction is controlled by adjusting the inclination angle of the reflector of the galvanometer 79. Thereby, there is no trouble of moving the table 3 in the X-axis direction, and the positioning time of the substrate 4 is greatly shortened. As a result, the inspection time can be greatly shortened.

  Note that this embodiment is merely an example, and does not limit the present invention. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, the second mode and the third mode may be combined so that line laser groups having different colors are irradiated symmetrically with respect to the camera. Moreover, you may irradiate the line laser group from which a color differs from the outer side of an electronic component combining the 2nd form and the 4th form. Further, the shape of the solder fillet and the electronic component may be measured by five line lasers having different colors by combining the second and fifth embodiments.

It is a perspective lineblock diagram showing the composition of the inspection device of the mounting board concerning the 1st form. It is a side view (X-axis direction) block diagram which shows the structure of the mounting board inspection apparatus concerning a 1st form. It is a side view (Y-axis direction) block diagram which shows the structure of the inspection apparatus of the mounting board | substrate concerning a 1st form. It is a figure which shows an example of the image data imaged at the time of irradiation of the line laser L1. It is a figure which shows an example of the image data imaged at the time of irradiation of the line laser L2. It is a figure which shows an example of the image data imaged at the time of irradiation of the line laser L3. It is a flowchart which shows the test | inspection procedure of the inspection apparatus of the mounting board | substrate concerning a 1st form. It is a figure which shows the state which combined the height information obtained from each image data, and measured the cross section of the solder fillet. It is a side view (Y-axis direction) block diagram which shows the structure of the mounting board test | inspection apparatus concerning a 2nd form. It is a figure which shows an example of the image data imaged at the time of irradiation of line laser L1, L2, L3. It is a side view (Y-axis direction) block diagram which shows the structure of the inspection apparatus of the mounting board | substrate concerning a 3rd form. It is a figure which shows the concept which light-emits a line laser group from the left side of the camera 11, and irradiates a right inclination part. It is a figure which shows the concept which rotates a line laser group 180 degree | times. It is a side view (X-axis direction) block diagram which shows the structure of the inspection apparatus of the mounting board | substrate concerning a 4th form. It is a perspective block diagram which shows the structure of the inspection apparatus of the mounting board | substrate concerning a 5th form. It is a figure which shows the concept of deviation | shift amount (theta) of direction of an electronic component. It is a perspective block diagram which shows the structure of the inspection apparatus of the mounting board | substrate concerning a 6th form. It is a side view (Y-axis direction) block diagram which shows the structure which has arrange | positioned the camera of the inspection apparatus shown in FIG. 17 left-right symmetrically. It is a perspective block diagram which shows the structure of the inspection apparatus of the mounting board | substrate concerning a 7th form. It is a schematic block diagram which shows the structure of the inspection apparatus of the mounting board | substrate concerning the conventional form.

Explanation of symbols

3 Table 4 Substrate 5, 6 Solder fillet 7 Electronic component 8, 9, 10 Laser light source 11 Camera 14 Image processing device 15 Determination unit 17 Main control unit 100 Inspection device

Claims (10)

In mounting board inspection equipment that inspects the appearance of solder fillets,
A table for mounting a substrate on which electronic components are mounted;
An imaging unit for imaging the solder fillet from above;
There are a plurality of laser light sources that emit line lasers, and the line laser output from each laser light source is in the direction of a reference line drawn on the substrate by the line laser with respect to a predetermined region straddling the electronic component and the solder fillet. A first laser light source group in which the respective laser light sources are arranged so as to be incident at different angles when viewed from the first direction;
A mounting board inspection apparatus comprising: a height measuring unit that acquires image data from the imaging unit and measures a surface height of a solder fillet within a range in which the line laser is projected for each line laser. . In the mounting board inspection apparatus according to claim 1,
The line laser emitted from the first laser light source group has a different color for each line laser. In the mounting board inspection apparatus according to claim 1 or 2,
A plurality of laser light sources that emit line lasers, and the line lasers output from the laser light sources are incident on the predetermined region of the solder fillet at different angles as viewed from the first direction. Comprises a second laser light source group in which the respective laser light sources are arranged so as to be symmetrical with respect to the line laser group from the first laser light source group as viewed from the first direction with the imaging unit interposed therebetween. A mounting board inspection device. In the mounting board inspection apparatus according to any one of claims 1 to 3,
A mounting substrate having a plurality of laser light sources that emit line lasers, each line laser having a third laser light source group that draws a reference line in a second direction orthogonal to the first direction on the substrate plane Inspection equipment. In mounting board inspection equipment that inspects the appearance of solder fillets,
A table for mounting a substrate on which electronic components are mounted;
A laser light source that emits a line laser to a predetermined region straddling the electronic component and the solder fillet ;
There are a plurality of imaging units for imaging the solder fillet, and each imaging unit has a predetermined area of the solder fillet from different angles when viewed from a first direction which is a direction of a reference line drawn on the substrate by the line laser. An imaging unit group for imaging;
A height measuring unit that acquires image data from each imaging unit of the imaging unit group and measures the surface height of the solder fillet within a range where a line laser is projected for each image data. Board inspection equipment. In the mounting board inspection apparatus according to claim 5,
A galvanometer for reflecting the line laser from the laser light source and controlling the reflection angle;
A mounting board inspection apparatus comprising: a lens system that changes a direction of a line laser reflected from the galvanometer to a certain angle toward the table. In the mounting board inspection method for inspecting the external shape of the solder fillet,
A laser emission step of irradiating a plurality of line lasers at a different angle as viewed from a first direction which is a direction of a reference line drawn by the line laser on a substrate with respect to a predetermined region straddling the electronic component and the solder fillet ;
An imaging step of imaging from above the solder fillet on which at least one of the line lasers is incident;
A mounting board inspection method comprising: acquiring image data from the imaging unit; and detecting a surface height of a solder fillet within a range in which the line laser is projected for each line laser. . In the mounting substrate inspection method according to claim 7,
A mounting board inspection method, wherein an electronic component to be joined to a solder fillet is arranged in the first direction so as not to overlap the imaging unit when imaging a solder fillet. In the mounting board inspection method for inspecting the external shape of the solder fillet,
A laser emission step of emitting a line laser to the solder fillet for a predetermined region straddling the electronic component and the solder fillet ;
An imaging step of imaging a predetermined area of the solder fillet from a plurality of imaging units at different angles when viewed from a first direction that is a direction of a reference line drawn on the substrate by the line laser;
A mounting board comprising: a height measurement step of acquiring image data captured in the imaging step and detecting a surface height of a solder fillet within a range in which a line laser is projected for each image data Inspection method. In the mounting substrate inspection method according to claim 9,
A mounting board inspection method, wherein an electronic component to be joined to a solder fillet is arranged in the first direction so as not to overlap the imaging unit when imaging a solder fillet.

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