CN102867765B - Detector and detection method for wafer position - Google Patents
Detector and detection method for wafer position Download PDFInfo
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- CN102867765B CN102867765B CN201210369969.7A CN201210369969A CN102867765B CN 102867765 B CN102867765 B CN 102867765B CN 201210369969 A CN201210369969 A CN 201210369969A CN 102867765 B CN102867765 B CN 102867765B
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- 238000001514 detection method Methods 0.000 title claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 44
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 25
- 238000009434 installation Methods 0.000 claims description 16
- 229910052757 nitrogen Inorganic materials 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 6
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 238000007664 blowing Methods 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 121
- 238000000034 method Methods 0.000 description 24
- 238000004140 cleaning Methods 0.000 description 9
- 238000001035 drying Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a detector and a detection method for wafer position. The detector comprises a carrying platform, a driving device, a blowing device, a camera device and an image processing device. The carrying platform is used for carrying a wafer. The driving device is connected with the carrying platform and is used for driving the carrying platform to rotate. The blowing device is arranged above the carrying platform and blows toward peripheral edges of the wafer on the carrying platform so as to dry the peripheral edges of the wafer. The camera device is arranged above the carrying platform and is used for taking images of the wafer on the carrying platform and sending the taken images to the image processing device. After the image processing device receives the images taken by the camera device, images in a partial area on the peripheral edges of the wafer are converted into a pixel, and the pixel and an image reference pixel in the partial area are compared, if the pixel and the image reference pixel are consistent, the wafer is placed on the carrying platform correctly, and if not, position of the wafer on the carrying platform is judged to deviate from correct position.
Description
Technical field
The present invention relates to field of semiconductor manufacture, particularly relate to a kind of wafer position checkout gear and detection method.
Background technology
Semiconductor components and devices uses multiple different treatment step manufacture to form on a semiconductor wafer, each step may relate to different processing unit (plant)s, usually, wafer carries out the PROCESS FOR TREATMENT corresponding with each processing unit (plant) by Manipulator Transportation to each processing unit (plant), usually mounting table is provided with for loading wafer in each processing unit (plant), in order to carry out PROCESS FOR TREATMENT to the wafer in mounting table, need position can not be had to offset correct for wafer being placed in mounting table, once wafer departs from correct position, harmful effect will be caused to the reliability of technique and technological effect.Such as, in the manufacturing process of the metal interconnecting wires of semiconductor components and devices, after the metallic film being deposited on the non-sunk area of wafer upper dielectric material is removed by CMP (Chemical Mechanical Polishing) process, need to clean crystal column surface, thus remove the pollutants such as the particle of crystal column surface, usually, first adopt the mode cleaning wafer surface scrubbed, then, again wafer is put into cleaning chambers and carry out secondary cleaning and drying, after in the mounting table that wafer is placed on cleaning chambers by manipulator, before carrying out secondary cleaning and drying, whether correctly need first to detect the position of wafer in mounting table, if incorrect, secondary cleaning and drying process then cannot carry out.
At present, the method for known detection wafer position is the peripheral edge portion utilizing the shooting part shooting wafers such as camera, and whether the position detecting wafer according to the view data obtained departs from correct position.Still for the metal interconnecting wires of above-mentioned making semiconductor components and devices, before wafer carries out secondary cleaning and drying in the mounting table being placed on cleaning chambers, the surface of wafer may occur that some places have moisture film, and some places do not have the phenomenon of moisture film, this kind of state of crystal column surface can affect the collection of shooting part view data, thus whether correct, for secondary cleaning and drying process hide some dangers for if accurately can not detect the position of wafer in mounting table.
Summary of the invention
The defect that the object of the invention is to exist for above-mentioned background technology provides a kind of wafer position checkout gear, and whether this checkout gear can accurately detect wafer position correct.
Another object of the present invention is to provide a kind of wafer position detection method, and whether the method can accurately detect wafer position correct.
For achieving the above object, a kind of wafer position checkout gear provided by the invention, comprising: mounting table, drive unit, blowning installation, camera head and image processing apparatus.Wherein, described mounting table is for loading wafer; Described drive unit is connected with described mounting table, rotates for driving mounting table; Described blowning installation is arranged on the top of described mounting table and the peripheral edge portion to the wafer in mounting table is blown, and makes the peripheral edge portion of wafer dry; Described camera head is arranged on the top of described mounting table, for the wafer photographic images in mounting table, and the image of shooting is sent to described image processing apparatus; After described image processing apparatus receives the image of described camera head shooting, convert the image in the last subregion of wafer peripheral edge portion in image to pixel, and this pixel is compared with the image reference pixel in this subregion, if the two is consistent, then wafer is positioned in mounting table by correct, if the two is inconsistent, then the position deviation of wafer in mounting table tram.
For achieving the above object, a kind of wafer position detection method provided by the invention, comprises the steps:
Select wafer image surveyed area and the wafer image reference pixel obtained in this surveyed area;
Wafer is placed in mounting table;
Low speed rotation mounting table, and blow to the peripheral edge portion of wafer, the peripheral edge portion of dry wafer;
The image of shooting wafer, and the image of wafer is sent to image processing apparatus;
Convert the wafer image in surveyed area to pixel;
Pixel compared with the wafer image reference pixel in surveyed area, if the two is consistent, then wafer is positioned in mounting table by correct, if the two is inconsistent, then and the position deviation of wafer in mounting table tram.
In sum, wafer position checkout gear of the present invention and detection method are blown by the peripheral edge portion to wafer, wafer photographic images is given again after the peripheral edge portion of dry wafer, therefore, whether these apparatus and method can detect the position of wafer in mounting table accurately correct, there will not be flase drop, improve the reliability of technique.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of an embodiment of wafer position checkout gear of the present invention.
Fig. 2 is the stereogram of an embodiment of wafer position checkout gear of the present invention.
Fig. 3 is the stereogram of another embodiment of wafer position checkout gear of the present invention.
Fig. 4 is the flow chart of wafer position detection method of the present invention.
Embodiment
By describing technology contents of the present invention, structural feature in detail, reached object and effect, coordinate graphic being described in detail below in conjunction with embodiment.
Referring to Fig. 1 and Fig. 2, is the schematic diagram of an embodiment of wafer position checkout gear of the present invention.Wafer position checkout gear of the present invention comprises process cavity 10, mounting table 20, drive unit 30, blowning installation 40, camera head 50 and image processing apparatus (not shown).
Process cavity 10 is for carrying out corresponding PROCESS FOR TREATMENT to wafer W, and in the present invention, process cavity 10 may be used for carrying out wet-cleaned and dry process to wafer W.Mounting table 20 has the circular support portion 22 that the other end is connected with drive unit 30 through process cavity 10 for the supporting part 21 placing wafer W is connected with supporting part 21 center with one end, supporting part 21 is contained in process cavity 10, and supporting part 21 is provided with several alignment pin 23 for fixing wafer W at supporting part 21.Alignment pin 23 is usually set to more than 3 or 3 and fixes effect preferably to reach.Drive unit 30 rotates for driving mounting table 20, and drive unit 30 can be a motor.Blowning installation 40 is arranged on the top of mounting table 20, for to the peripheral edge portion nitrogen blowing of the wafer W on supporting part 21 or other dry gas, thus make the peripheral edge portion of wafer W dry, blowning installation 40 has the inflatable mouth 41 be arranged at above wafer W peripheral edge portion and the gas piping 42 be connected with inflatable mouth 41, and the diameter of inflatable mouth 41 is 2 to 4 millimeters.Camera head 50 is arranged on the top of mounting table 20, and for giving the wafer W photographic images on supporting part 21, and the image of shooting is sent to image processing apparatus, camera head 50 can be a camera or video camera.
The detailed process whether wafer position checkout gear detection wafer W of the present invention is properly positioned on the supporting part 21 of mounting table 20 is as follows: what elder generation was manual is placed on the tram of supporting part 21 by wafer W, vertical range between the inflatable mouth 41 of adjustment blowning installation 40 and wafer W is 2 to 6 centimetres, drive unit 30 drives mounting table 20 low speed rotation, and by the peripheral edge portion nitrogen blowing of blowning installation 40 to wafer W, until the peripheral edge portion bone dry of wafer W, the speed that drive unit 30 drives mounting table 20 to rotate is 20 ~ 100rpm, even if this rotating speed can ensure that wafer W is not placed correctly under on supporting part 21, wafer W also can not leave supporting part 21 due to the effect of centrifugal force, blowning installation 40 is 40 ~ 100psi to the pressure of the nitrogen that the peripheral edge portion of wafer W blows, time is 10 ~ 25 seconds.Then, camera head 50 is to the wafer W photographic images be positioned on supporting part 21, and the image of shooting is sent to image processing apparatus, after image processing apparatus receives the image of camera head 50 transmission, to choose in image the last subregion of wafer W peripheral edge portion as surveyed area, then convert the image of wafer W in this surveyed area to pixel, and this pixel is saved as the image reference pixel in surveyed area.
Wafer W on supporting part 21 takes away after corresponding PROCESS FOR TREATMENT, and then another wafer W is positioned on supporting part 21, now, can be manually place or placed by manipulator, drive unit 30 drives mounting table 20 low speed rotation with identical rotating speed, and meanwhile, blowning installation 40 is to the peripheral edge portion nitrogen blowing of wafer W, the pressure of the nitrogen blown is 40 ~ 100psi, and the time is 10 ~ 25 seconds.Then, wafer W photographic images given by camera head 50, and the image of shooting is sent to image processing apparatus, after image processing apparatus receives image, convert the image of the wafer W in surveyed area to pixel, and this pixel is compared with the image reference pixel in the surveyed area of storage, if both are consistent, namely show that wafer W is positioned on supporting part 21 by correct, the PROCESS FOR TREATMENT in process cavity 10 can start; If both are inconsistent, namely show the position deviation of wafer W on supporting part 21 tram, the PROCESS FOR TREATMENT in process cavity 10 needs to stop.
Preferably, above-mentioned camera head 50 continues the peripheral edge portion nitrogen blowing to wafer W while the image of shooting wafer W, and the peripheral edge portion of wafer W is kept dry.
In addition, due to when the speed that mounting table 20 is rotated is too low, the water droplet on wafer W cannot be removed by drying, and (is less than 50psi) when the hypotony of the nitrogen blown, and the water droplet on wafer W can gather together again after being blown open by nitrogen again.In order to head it off, as shown in Figure 3, preferably the inflatable mouth 41 of blowning installation 40 is arranged on the wafer W peripheral edge portion 1-3cm place of distance corresponding to surveyed area, the direction simultaneously making the direction of air-flow and wafer W rotate is consistent, position probing can be carried out to wafer W photographic images while ensure that the wafer W peripheral edge portion drying corresponding to surveyed area, and then save the process time.
Refer to Fig. 4, present invention further teaches a kind of wafer position detection method, comprise the steps:
S110: select wafer image surveyed area and the wafer image reference pixel obtained in this surveyed area;
S120: wafer W is placed on the supporting part 21 of mounting table 20;
S130: low speed rotation mounting table 20, and the peripheral edge portion of the dry wafer W of peripheral edge portion nitrogen blowing to wafer W;
S140: the image of shooting wafer W, and image is sent to image processing apparatus;
S150: convert the wafer image in surveyed area to pixel;
S160: pixel is compared with the wafer image reference pixel in surveyed area, judge that whether the position of wafer W is correct according to comparative result, particularly, if pixel is consistent with the wafer image reference pixel in surveyed area, namely show that wafer W is positioned on supporting part 21 by correct; If the wafer image reference pixel in pixel and surveyed area is inconsistent, namely show the position deviation of wafer W on supporting part 21 tram.
Further, select wafer image surveyed area and the wafer image reference pixel obtained in this surveyed area, comprise the steps:
First, wafer W is placed on the tram of supporting part 21 of mounting table 20;
Secondly, low speed rotation mounting table 20, and the peripheral edge portion of the dry wafer W of peripheral edge portion nitrogen blowing to wafer W;
Then, the image of shooting wafer W, and the image of wafer W is sent to image processing apparatus;
Finally, to choose in image the last subregion of wafer W peripheral edge portion as surveyed area, and convert the image of wafer W in surveyed area to pixel, this pixel is wafer image reference pixel.
Preferably, while the image of shooting wafer W, continue the peripheral edge portion nitrogen blowing to wafer W.
From the above, wafer position checkout gear of the present invention and detection method are by giving wafer W photographic images again after the peripheral edge portion of the dry wafer W of peripheral edge portion nitrogen blowing to wafer W, therefore, whether these apparatus and method can detect the position of wafer W on supporting part 21 exactly correct, there will not be flase drop, improve the reliability of technique.
In sum, wafer position checkout gear of the present invention and detection method are illustrated by above-mentioned execution mode and correlative type, specifically, full and accurate disclose correlation technique, those skilled in the art can be implemented according to this.And the above embodiment be only used to illustrate the present invention, instead of be used for restriction of the present invention, interest field of the present invention, should be defined by claim of the present invention.Still all interest field of the present invention should be belonged to as the change of described component number herein or the replacement etc. of equivalence element.
Claims (11)
1. a wafer position checkout gear, it is characterized in that, comprise: mounting table, drive unit, blowning installation, camera head and image processing apparatus, wherein, described mounting table is for loading wafer, described drive unit is connected with described mounting table, rotate for driving mounting table, described blowning installation is arranged on the top of described mounting table and the peripheral edge portion to the wafer in mounting table is blown, make the peripheral edge portion of wafer dry, described camera head is arranged on the top of described mounting table, for to the wafer photographic images in mounting table, and the image of shooting is sent to described image processing apparatus, after described image processing apparatus receives the image of described camera head shooting, convert the image in the last subregion of wafer peripheral edge portion in image to pixel, and this pixel is compared with the image reference pixel in this subregion, if the two is consistent, then wafer is positioned in mounting table by correct, if the two is inconsistent, the then position deviation of wafer in mounting table tram, the speed that wherein said drive unit drives mounting table to rotate is 20 ~ 100rpm.
2. wafer position checkout gear according to claim 1, is characterized in that, described blowning installation has the inflatable mouth be arranged at above wafer peripheral edge portion and the gas piping be connected with described inflatable mouth.
3. wafer position checkout gear according to claim 2, is characterized in that, the diameter of described inflatable mouth is 2 to 4 millimeters.
4. wafer position checkout gear according to claim 2, is characterized in that, the vertical range between described inflatable mouth and wafer is 2 to 6 centimetres.
5. wafer position checkout gear according to claim 1, is characterized in that, the gas that described blowning installation blows to the peripheral edge portion of the wafer in mounting table is nitrogen or dry gas.
6. wafer position checkout gear according to claim 1, is characterized in that, described blowning installation is 40 ~ 100psi to the pressure of the gas that the peripheral edge portion of the wafer in mounting table blows, and the time is 5 ~ 25 seconds.
7. wafer position checkout gear according to claim 1, is characterized in that, described blowning installation is arranged on the wafer peripheral edge portion 1-3cm place corresponding to subregion that distance is chosen, and the direction of air-flow is consistent with the direction that wafer rotates simultaneously.
8. wafer position checkout gear according to claim 1, is characterized in that, described camera head is a camera or video camera.
9. a wafer position detection method, is characterized in that, comprising:
Select wafer image surveyed area and the wafer image reference pixel obtained in this surveyed area;
Wafer is placed in mounting table;
Low speed rotation mounting table, and blow to the peripheral edge portion of wafer, the peripheral edge portion of dry wafer;
The image of shooting wafer, and the image of wafer is sent to image processing apparatus;
Convert the wafer image in surveyed area to pixel;
Pixel compared with the wafer image reference pixel in surveyed area, if the two is consistent, then wafer is positioned in mounting table by correct, if the two is inconsistent, then and the position deviation of wafer in mounting table tram.
10. wafer position detection method according to claim 9, is characterized in that, described selected wafer image surveyed area the step obtaining the wafer image reference pixel in this surveyed area comprise further:
First, wafer is placed on the tram of mounting table;
Secondly, low speed rotation mounting table, and blow to the peripheral edge portion of wafer, the peripheral edge portion of dry wafer;
Then, the image of shooting wafer, and the image of wafer is sent to image processing apparatus;
Finally, to choose in image the last subregion of wafer peripheral edge portion as surveyed area, and convert the image of wafer in surveyed area to pixel, this pixel is wafer image reference pixel.
11. wafer position detection methods according to claim 9 or 10, is characterized in that, while the image of shooting wafer, the peripheral edge portion continued to wafer is blown.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210369969.7A CN102867765B (en) | 2012-09-27 | 2012-09-27 | Detector and detection method for wafer position |
| TW102134805A TWI596695B (en) | 2012-09-27 | 2013-09-26 | Wafer position detection device and detection method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210369969.7A CN102867765B (en) | 2012-09-27 | 2012-09-27 | Detector and detection method for wafer position |
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| CN102867765A CN102867765A (en) | 2013-01-09 |
| CN102867765B true CN102867765B (en) | 2015-04-15 |
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| CN103415154B (en) * | 2013-07-24 | 2017-04-26 | 昆山迈致治具科技有限公司 | PCB welding rotating and blowing fixture |
| CN103415160A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | PCB welding rotating and limiting fixture |
| CN103415159A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | PCB welding rotating and sucking fixture |
| CN105990203B (en) * | 2015-02-15 | 2019-12-24 | 盛美半导体设备（上海）有限公司 | Coaxial adjusting device and coaxial adjusting method using same |
| CN106558519A (en) * | 2015-09-25 | 2017-04-05 | 盛美半导体设备（上海）有限公司 | Whether wafer bearing device and inspection wafer place stable method |
| KR102522899B1 (en) * | 2016-02-05 | 2023-04-19 | (주)테크윙 | Apparatus for inspecting loaded status of electronic components |
| CN106653640B (en) * | 2017-01-06 | 2019-06-14 | 西安紫光国芯半导体有限公司 | Wafer chip time parameter method of adjustment based on wafer position |
| US10957566B2 (en) * | 2018-04-12 | 2021-03-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer-level inspection using on-valve inspection detectors |
| CN110459499B (en) * | 2019-08-16 | 2021-09-17 | 上海知昊电子科技有限公司 | Wafer position detecting system |
| CN111403318B (en) * | 2020-03-19 | 2023-05-16 | 北京北方华创微电子装备有限公司 | Method and device for detecting wafer state in process chamber |
| US11263755B2 (en) * | 2020-07-17 | 2022-03-01 | Nanya Technology Corporation | Alert device and alert method thereof |
| CN114612474B (en) * | 2022-05-11 | 2023-12-19 | 杭州众硅电子科技有限公司 | Method and device for detecting state of wafer cleaning and drying module and flattening equipment |
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| CN101368786A (en) * | 2007-08-17 | 2009-02-18 | 中芯国际集成电路制造(上海)有限公司 | Drying apparatus |
| CN101794721A (en) * | 2009-01-08 | 2010-08-04 | 日东电工株式会社 | Alignment apparatus for semiconductor wafer |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04333253A (en) * | 1991-05-09 | 1992-11-20 | Nec Yamaguchi Ltd | Defect checking device for semiconductor wafer |
| US7067763B2 (en) * | 2002-05-17 | 2006-06-27 | Gsi Group Corporation | High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
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2013
- 2013-09-26 TW TW102134805A patent/TWI596695B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101368786A (en) * | 2007-08-17 | 2009-02-18 | 中芯国际集成电路制造(上海)有限公司 | Drying apparatus |
| CN101794721A (en) * | 2009-01-08 | 2010-08-04 | 日东电工株式会社 | Alignment apparatus for semiconductor wafer |
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| Publication number | Publication date |
|---|---|
| CN102867765A (en) | 2013-01-09 |
| TWI596695B (en) | 2017-08-21 |
| TW201417210A (en) | 2014-05-01 |
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Address after: 201203 building 4, No. 1690, Cailun Road, free trade zone, Pudong New Area, Shanghai Patentee after: Shengmei semiconductor equipment (Shanghai) Co., Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Cailun Road No. 4 1690 Patentee before: ACM (SHANGHAI) Inc. |
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