CN102867765A - Detector and detection method for wafer position - Google Patents
Detector and detection method for wafer position Download PDFInfo
- Publication number
- CN102867765A CN102867765A CN2012103699697A CN201210369969A CN102867765A CN 102867765 A CN102867765 A CN 102867765A CN 2012103699697 A CN2012103699697 A CN 2012103699697A CN 201210369969 A CN201210369969 A CN 201210369969A CN 102867765 A CN102867765 A CN 102867765A
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- mounting table
- edge portion
- peripheral edge
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- 238000001514 detection method Methods 0.000 title claims abstract description 15
- 230000002093 peripheral effect Effects 0.000 claims abstract description 44
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 26
- 238000009434 installation Methods 0.000 claims description 16
- 229910052757 nitrogen Inorganic materials 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 6
- 238000007664 blowing Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 24
- 238000004140 cleaning Methods 0.000 description 9
- 238000001035 drying Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a detector and a detection method for wafer position. The detector comprises a carrying platform, a driving device, a blowing device, a camera device and an image processing device. The carrying platform is used for carrying a wafer. The driving device is connected with the carrying platform and is used for driving the carrying platform to rotate. The blowing device is arranged above the carrying platform and blows toward peripheral edges of the wafer on the carrying platform so as to dry the peripheral edges of the wafer. The camera device is arranged above the carrying platform and is used for taking images of the wafer on the carrying platform and sending the taken images to the image processing device. After the image processing device receives the images taken by the camera device, images in a partial area on the peripheral edges of the wafer are converted into a pixel, and the pixel and an image reference pixel in the partial area are compared, if the pixel and the image reference pixel are consistent, the wafer is placed on the carrying platform correctly, and if not, position of the wafer on the carrying platform is judged to deviate from correct position.
Description
Technical field
The present invention relates to field of semiconductor manufacture, relate in particular to a kind of wafer position checkout gear and detection method.
Background technology
Semiconductor components and devices is to use a plurality of different treatment step manufacturings to form at semiconductor crystal wafer, each step may relate to different processing unit (plant)s, usually, wafer carries out the PROCESS FOR TREATMENT corresponding with each processing unit (plant) by Manipulator Transportation to each processing unit (plant), in each processing unit (plant), usually be provided with mounting table and be used for the mounting wafer, for the wafer on the mounting table is carried out PROCESS FOR TREATMENT, correct being placed on of wafer can not need to there be the position skew on the mounting table, in case wafer departs from correct position, will cause harmful effect to reliability and the technological effect of technique.For example, in the manufacturing process of the metal interconnecting wires of semiconductor components and devices, after the metallic film that is deposited on the non-sunk area of dielectric substance on the wafer is removed by CMP (Chemical Mechanical Polishing) process, need to clean crystal column surface, thereby remove the pollutants such as particle of crystal column surface, usually, adopt first the mode cleaning wafer surface of scrubbing, then, again wafer is put into cleaning chambers and carry out secondary cleaning and drying, after manipulator is placed on wafer on the mounting table of cleaning chambers, before carrying out secondary cleaning and drying, whether correctly need to detect first the position of wafer on mounting table, if incorrect, secondary cleaning and drying process then can't carry out.
At present, the method for known detection wafer position is to utilize the shooting part such as camera to take the peripheral edge portion of wafer, detects the position of wafer according to the view data that obtains and whether departs from correct position.Still take the metal interconnecting wires of above-mentioned making semiconductor components and devices as example, wafer is before the mounting table that is placed on cleaning chambers is carried out secondary cleaning and drying, some places may appear in the surface of wafer moisture film, and some places do not have the phenomenon of moisture film, this of crystal column surface kind of state can affect the collection of shooting part view data, whether thereby it is correct accurately to detect the position of wafer on mounting table, for secondary cleaning and drying process hide some dangers for.
Summary of the invention
The objective of the invention is provides a kind of wafer position checkout gear for the defective that the above-mentioned background technology exists, and whether this checkout gear can accurately detect wafer position correct.
Another purpose of the present invention provides a kind of wafer position detection method, and whether the method can accurately detect wafer position correct.
For achieving the above object, a kind of wafer position checkout gear provided by the invention comprises: mounting table, drive unit, blowning installation, camera head and image processing apparatus.Wherein, described mounting table is used for the mounting wafer; Described drive unit links to each other with described mounting table, is used for driving the mounting table rotation; Described blowning installation is arranged on the peripheral edge portion of the top of described mounting table and the wafer on the mounting table and blows, and makes the peripheral edge portion of wafer dry; Described camera head is arranged on the top of described mounting table, is used for to the wafer photographic images on the mounting table, and the image of taking is sent to described image processing apparatus; After described image processing apparatus receives the image of described camera head shooting, image transitions in the last subregion of wafer peripheral edge portion in the image is become pixel, and with the image reference pixel in this pixel and this subregion relatively, if the two is consistent, then wafer is by correct being positioned on the mounting table, if the two is inconsistent, then the position deviation of wafer on mounting table the tram.
For achieving the above object, a kind of wafer position detection method provided by the invention comprises the steps:
Selected wafer image surveyed area also obtains the interior wafer image reference pixel of this surveyed area;
Wafer is placed on the mounting table;
The low speed rotation mounting table, and blow the peripheral edge portion of dry wafer to the peripheral edge portion of wafer;
Take the image of wafer, and the image of wafer is sent to image processing apparatus;
Convert the wafer image in the surveyed area to pixel;
With the wafer image reference pixel in pixel and the surveyed area relatively, if the two is consistent, then wafer is by correct being positioned on the mounting table, if the two is inconsistent, then the position deviation of wafer on mounting table the tram.
In sum, wafer position checkout gear of the present invention and detection method are blown by the peripheral edge portion to wafer, give again the wafer photographic images behind the peripheral edge portion of dry wafer, therefore, whether these apparatus and method can detect the position of wafer on mounting table accurately correct, flase drop can not occur, improve the reliability of technique.
Description of drawings
Fig. 1 is the cross-sectional view of an embodiment of wafer position checkout gear of the present invention.
Fig. 2 is the stereogram of an embodiment of wafer position checkout gear of the present invention.
Fig. 3 is the stereogram of another embodiment of wafer position checkout gear of the present invention.
Fig. 4 is the flow chart of wafer position detection method of the present invention.
Embodiment
By describing technology contents of the present invention, structural feature in detail, being reached purpose and effect, below in conjunction with embodiment and cooperate graphic detailed description the in detail.
See also Fig. 1 and Fig. 2, be the schematic diagram of an embodiment of wafer position checkout gear of the present invention.Wafer position checkout gear of the present invention comprises process cavity 10, mounting table 20, drive unit 30, blowning installation 40, camera head 50 and image processing apparatus (not shown).
The detailed process that wafer position checkout gear of the present invention detects on the supporting part 21 whether wafer W correctly be positioned over mounting table 20 is as follows: first manual wafer W is placed on the tram of supporting part 21, inflatable mouth 41 and the vertical range between the wafer W of adjusting blowning installation 40 are 2 to 6 centimetres, drive unit 30 drives mounting table 20 low speed rotation, and by the peripheral edge portion nitrogen blowing of blowning installation 40 to wafer W, until the peripheral edge portion bone dry of wafer W, the speed that drive unit 30 drives mounting table 20 rotations is 20～100rpm, even this rotating speed can guarantee wafer W and not be placed correctly under on the supporting part 21, wafer W can be owing to supporting part 21 is left in the effect of centrifugal force yet, blowning installation 40 is 40～100psi to the pressure of the nitrogen that the peripheral edge portion of wafer W blows, and the time is 10～25 seconds.Then, camera head 50 is given the wafer W photographic images that is positioned on the supporting part 21, and the image of taking is sent to image processing apparatus, after image processing apparatus receives the image of camera head 50 transmissions, choose in the image the last subregion of wafer W peripheral edge portion as surveyed area, then the image transitions with wafer W in this surveyed area becomes pixel, and this pixel is stored as the image reference pixel in the surveyed area.
Wafer W on the supporting part 21 takes away through after the corresponding PROCESS FOR TREATMENT, and then another wafer W is positioned on the supporting part 21, at this moment, can be manually to place or place by manipulator, drive unit 30 drives mounting table 20 low speed rotation with identical rotating speed, and simultaneously, blowning installation 40 is to the peripheral edge portion nitrogen blowing of wafer W, the pressure of the nitrogen that blows is 40～100psi, and the time is 10～25 seconds.Then, camera head 50 is given wafer W photographic images, and the image of taking is sent to image processing apparatus, after image processing apparatus receives image, the image transitions of wafer W in the surveyed area is become pixel, and with the image reference pixel in the surveyed area of this pixel and storage relatively, if both are consistent, namely show wafer W by correct being positioned on the supporting part 21, the PROCESS FOR TREATMENT in the process cavity 10 can begin; If both are inconsistent, the tram that namely shown the position deviation of wafer W on supporting part 21, the PROCESS FOR TREATMENT in process cavity 10 need stop.
Preferably, above-mentioned camera head 50 continues the peripheral edge portion nitrogen blowing to wafer W in the image of taking wafer W, the peripheral edge portion of wafer W is kept dry.
In addition, because the speed of rotating when mounting table 20 crosses when low, the water droplet on the wafer W can't be by drying removal, and when the hypotony of the nitrogen that blows (less than 50psi), the water droplet on the wafer W can gather together again after being blown open by nitrogen again.For head it off, as shown in Figure 3, preferably the inflatable mouth 41 with blowning installation 40 is arranged on the place apart from the corresponding wafer W of surveyed area peripheral edge portion 1-3cm, the direction of air-flow and the direction of wafer W rotation are consistent, can carry out position probing to wafer W photographic images when having guaranteed the corresponding wafer W of surveyed area peripheral edge portion drying, and then save the process time.
See also Fig. 4, the present invention has also disclosed a kind of wafer position detection method, comprises the steps:
S110: selected wafer image surveyed area also obtains the interior wafer image reference pixel of this surveyed area;
S120: wafer W is placed on the supporting part 21 of mounting table 20;
S130: low speed rotation mounting table 20, and to the peripheral edge portion of the dry wafer W of the peripheral edge portion nitrogen blowing of wafer W;
S140: take the image of wafer W, and image is sent to image processing apparatus;
S150: convert the wafer image in the surveyed area to pixel;
S160: with the wafer image reference pixel in pixel and the surveyed area relatively, whether the position of judging wafer W according to comparative result is correct, particularly, if pixel is consistent with the wafer image reference pixel in the surveyed area, show that namely wafer W is by correct being positioned on the supporting part 21; If the wafer image reference pixel in pixel and the surveyed area is inconsistent, the tram that namely shown the position deviation of wafer W on supporting part 21.
Further, selected wafer image surveyed area also obtains the interior wafer image reference pixel of this surveyed area, comprises the steps:
At first, wafer W is placed on the tram of supporting part 21 of mounting table 20;
Secondly, low speed rotation mounting table 20, and to the peripheral edge portion of the dry wafer W of peripheral edge portion nitrogen blowing of wafer W;
Then, take the image of wafer W, and the image of wafer W is sent to image processing apparatus;
At last, choose in the image the last subregion of wafer W peripheral edge portion as surveyed area, and the image transitions of wafer W in the surveyed area is become pixel, this pixel is the wafer image reference pixel.
Preferably, lasting peripheral edge portion nitrogen blowing to wafer W in the image of taking wafer W.
From the above, wafer position checkout gear of the present invention and detection method are by giving wafer W photographic images again behind the peripheral edge portion of the dry wafer W of the peripheral edge portion nitrogen blowing of wafer W, therefore, whether these apparatus and method can detect the position of wafer W on supporting part 21 exactly correct, flase drop can not occur, improve the reliability of technique.
In sum, wafer position checkout gear of the present invention and detection method be by the explanation of above-mentioned execution mode and correlative type, concrete, full and accurate exposure correlation technique, those skilled in the art can be implemented according to this.And the above embodiment just is used for illustrating the present invention, rather than is used for limiting of the present invention, and interest field of the present invention should be defined by claim of the present invention.Still all should belong to interest field of the present invention as for the change of described component number or the replacement of equivalence element etc. herein.
Claims (12)
1. wafer position checkout gear, it is characterized in that, comprise: mounting table, drive unit, blowning installation, camera head and image processing apparatus, wherein, described mounting table is used for the mounting wafer, described drive unit links to each other with described mounting table, be used for driving the mounting table rotation, described blowning installation is arranged on the peripheral edge portion of the top of described mounting table and the wafer on the mounting table and blows, make the peripheral edge portion of wafer dry, described camera head is arranged on the top of described mounting table, be used for to the wafer photographic images on the mounting table, and the image of taking is sent to described image processing apparatus, after described image processing apparatus receives the image of described camera head shooting, image transitions in the last subregion of wafer peripheral edge portion in the image is become pixel, and with the image reference pixel in this pixel and this subregion relatively, if the two is consistent, then wafer is by correct being positioned on the mounting table, if the two is inconsistent, then the position deviation of wafer on mounting table the tram.
2. wafer position checkout gear according to claim 1 is characterized in that, the speed that described drive unit drives the mounting table rotation is 20～100rpm.
3. wafer position checkout gear according to claim 1 is characterized in that, described blowning installation has the inflatable mouth that is arranged at wafer peripheral edge portion top and the gas piping that is connected with described inflatable mouth.
4. wafer position checkout gear according to claim 3 is characterized in that, the diameter of described inflatable mouth is 2 to 4 millimeters.
5. wafer position checkout gear according to claim 3 is characterized in that, the vertical range between described inflatable mouth and the wafer is 2 to 6 centimetres.
6. wafer position checkout gear according to claim 1 is characterized in that, the gas that the peripheral edge portion of the wafer of described blowning installation on the mounting table blows is nitrogen or dry gas.
7. wafer position checkout gear according to claim 1 is characterized in that, the pressure of the gas that the peripheral edge portion of the wafer of described blowning installation on the mounting table blows is 40～100psi, and the time is 5～25 seconds.
8. wafer position checkout gear according to claim 1 is characterized in that, described blowning installation is arranged on the corresponding wafer peripheral edge portion 1-3cm place, subregion that distance is chosen, and the direction of air-flow is consistent with the direction of wafer rotation simultaneously.
9. wafer position checkout gear according to claim 1 is characterized in that, described camera head is a camera or video camera.
10. a wafer position detection method is characterized in that, comprising:
Selected wafer image surveyed area also obtains the interior wafer image reference pixel of this surveyed area;
Wafer is placed on the mounting table;
The low speed rotation mounting table, and blow the peripheral edge portion of dry wafer to the peripheral edge portion of wafer;
Take the image of wafer, and the image of wafer is sent to image processing apparatus;
Convert the wafer image in the surveyed area to pixel;
With the wafer image reference pixel in pixel and the surveyed area relatively, if the two is consistent, then wafer is by correct being positioned on the mounting table, if the two is inconsistent, then the position deviation of wafer on mounting table the tram.
11. wafer position detection method according to claim 10 is characterized in that, described selected wafer image surveyed area and the step of obtaining the wafer image reference pixel in this surveyed area further comprise:
At first, wafer is placed on the tram of mounting table;
Secondly, the low speed rotation mounting table, and blow the peripheral edge portion of dry wafer to the peripheral edge portion of wafer;
Then, take the image of wafer, and the image of wafer is sent to image processing apparatus;
At last, choose in the image the last subregion of wafer peripheral edge portion as surveyed area, and the image transitions of wafer in the surveyed area is become pixel, this pixel is the wafer image reference pixel.
12. according to claim 10 or 11 described wafer position detection methods, it is characterized in that, in the image of taking wafer, continue to blow to the peripheral edge portion of wafer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210369969.7A CN102867765B (en) | 2012-09-27 | 2012-09-27 | Detector and detection method for wafer position |
| TW102134805A TWI596695B (en) | 2012-09-27 | 2013-09-26 | Wafer position detection device and detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210369969.7A CN102867765B (en) | 2012-09-27 | 2012-09-27 | Detector and detection method for wafer position |
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| Publication Number | Publication Date |
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| CN102867765A true CN102867765A (en) | 2013-01-09 |
| CN102867765B CN102867765B (en) | 2015-04-15 |
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| CN201210369969.7A Active CN102867765B (en) | 2012-09-27 | 2012-09-27 | Detector and detection method for wafer position |
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| TW (1) | TWI596695B (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103415159A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | PCB welding rotating and sucking fixture |
| CN103415160A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | PCB welding rotating and limiting fixture |
| CN103415154A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | PCB welding rotating and blowing fixture |
| CN104183518A (en) * | 2013-05-27 | 2014-12-03 | 东京毅力科创株式会社 | Ready for rotation state detection device, method of detecting ready for rotation state and substrate processing apparatus using same |
| CN105990203A (en) * | 2015-02-15 | 2016-10-05 | 盛美半导体设备（上海）有限公司 | Coaxial adjusting device and coaxial adjusting method using the same |
| CN106558519A (en) * | 2015-09-25 | 2017-04-05 | 盛美半导体设备（上海）有限公司 | Whether wafer bearing device and inspection wafer place stable method |
| CN106653640A (en) * | 2017-01-06 | 2017-05-10 | 西安紫光国芯半导体有限公司 | Wafer position based wafer chip time parameter adjustment method |
| CN107045151A (en) * | 2016-02-05 | 2017-08-15 | 泰克元有限公司 | Electronic unit loading condition detection means |
| CN110379723A (en) * | 2018-04-12 | 2019-10-25 | 台湾积体电路制造股份有限公司 | The method and wafer scale checking system of wafer level testing |
| CN110459499A (en) * | 2019-08-16 | 2019-11-15 | 上海知昊电子科技有限公司 | A kind of completely new wafer position detecting system |
| CN111403318A (en) * | 2020-03-19 | 2020-07-10 | 北京北方华创微电子装备有限公司 | Method and device for detecting state of wafer in process chamber |
| CN113947871A (en) * | 2020-07-17 | 2022-01-18 | 南亚科技股份有限公司 | Alarm device and alarm method thereof |
| WO2023216643A1 (en) * | 2022-05-11 | 2023-11-16 | 杭州众硅电子科技有限公司 | Wafer cleaning and drying module state detection method and apparatus and planarization device |
| CN118212234A (en) * | 2024-05-20 | 2024-06-18 | 北京中电科电子装备有限公司 | Wafer cleaning method and system |
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| CN101368786A (en) * | 2007-08-17 | 2009-02-18 | 中芯国际集成电路制造(上海)有限公司 | Drying apparatus |
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Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183518A (en) * | 2013-05-27 | 2014-12-03 | 东京毅力科创株式会社 | Ready for rotation state detection device, method of detecting ready for rotation state and substrate processing apparatus using same |
| CN103415160A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | PCB welding rotating and limiting fixture |
| CN103415154A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | PCB welding rotating and blowing fixture |
| CN103415154B (en) * | 2013-07-24 | 2017-04-26 | 昆山迈致治具科技有限公司 | PCB welding rotating and blowing fixture |
| CN103415159A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | PCB welding rotating and sucking fixture |
| CN105990203B (en) * | 2015-02-15 | 2019-12-24 | 盛美半导体设备（上海）有限公司 | Coaxial adjusting device and coaxial adjusting method using same |
| CN105990203A (en) * | 2015-02-15 | 2016-10-05 | 盛美半导体设备（上海）有限公司 | Coaxial adjusting device and coaxial adjusting method using the same |
| CN106558519A (en) * | 2015-09-25 | 2017-04-05 | 盛美半导体设备（上海）有限公司 | Whether wafer bearing device and inspection wafer place stable method |
| CN107045151A (en) * | 2016-02-05 | 2017-08-15 | 泰克元有限公司 | Electronic unit loading condition detection means |
| CN107045151B (en) * | 2016-02-05 | 2020-03-13 | 泰克元有限公司 | Electronic component mounting state detection device |
| CN106653640A (en) * | 2017-01-06 | 2017-05-10 | 西安紫光国芯半导体有限公司 | Wafer position based wafer chip time parameter adjustment method |
| CN106653640B (en) * | 2017-01-06 | 2019-06-14 | 西安紫光国芯半导体有限公司 | Wafer chip time parameter method of adjustment based on wafer position |
| CN110379723A (en) * | 2018-04-12 | 2019-10-25 | 台湾积体电路制造股份有限公司 | The method and wafer scale checking system of wafer level testing |
| CN110459499A (en) * | 2019-08-16 | 2019-11-15 | 上海知昊电子科技有限公司 | A kind of completely new wafer position detecting system |
| CN111403318A (en) * | 2020-03-19 | 2020-07-10 | 北京北方华创微电子装备有限公司 | Method and device for detecting state of wafer in process chamber |
| CN111403318B (en) * | 2020-03-19 | 2023-05-16 | 北京北方华创微电子装备有限公司 | Method and device for detecting wafer state in process chamber |
| CN113947871A (en) * | 2020-07-17 | 2022-01-18 | 南亚科技股份有限公司 | Alarm device and alarm method thereof |
| WO2023216643A1 (en) * | 2022-05-11 | 2023-11-16 | 杭州众硅电子科技有限公司 | Wafer cleaning and drying module state detection method and apparatus and planarization device |
| CN118212234A (en) * | 2024-05-20 | 2024-06-18 | 北京中电科电子装备有限公司 | Wafer cleaning method and system |
| CN118212234B (en) * | 2024-05-20 | 2024-07-12 | 北京中电科电子装备有限公司 | Wafer cleaning method and system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102867765B (en) | 2015-04-15 |
| TW201417210A (en) | 2014-05-01 |
| TWI596695B (en) | 2017-08-21 |
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