CN106558519A - Whether wafer bearing device and inspection wafer place stable method - Google Patents
Whether wafer bearing device and inspection wafer place stable method Download PDFInfo
- Publication number
- CN106558519A CN106558519A CN201510621699.8A CN201510621699A CN106558519A CN 106558519 A CN106558519 A CN 106558519A CN 201510621699 A CN201510621699 A CN 201510621699A CN 106558519 A CN106558519 A CN 106558519A
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- Prior art keywords
- wafer
- bearing device
- carrier
- vacuum tube
- limiting structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Present invention is disclosed a kind of wafer bearing device, including：Carrier, carrier are used to support wafer；Position limiting structure, position limiting structure are arranged on carrier and are matchingly distributed in the outer of wafer；Vacuum tube, vacuum tube are connected with carrier by below card, and by evacuation between the card and wafer determining whether wafer is steadily placed.Disclosed wafer bearing device, can interpolate that out whether wafer is steadily placed, so as to avoid the accidental injury or crushing of wafer.Present invention further teaches whether a kind of inspection wafer places stable method.
Description
Technical field
The present invention relates to semiconductor production and manufacture field, more particularly, it relates to one kind bears and holds wafer
Wafer bearing device and inspection wafer whether place stable method.
Background technology
Wafer is when PROCESS FOR TREATMENT is received into semiconductor equipment, it is impossible to is simply placed, and is the need for special
Device is positioned to which and is held, to ensure technological effect.Such device, has various titles in the industry,
May be generally categorized as wafer bearing device.
By taking cmp (CMP) technique as an example, Fig. 1-Fig. 3 discloses a kind of for grinding wafer equipment
In wafer bearing device.Grinding wafer equipment shown in Fig. 1, including driving chamber 101, fixture 102, grinding
103, wafer bearing device 105 and accommodating chamber 108.Wherein, fixture 102 connects driving chamber 101 and grinds
Bistrique 103, driving chamber 101 can drive grinding head 103 to move, and be provided with motor or cylinder in driving chamber 101
As power source.Wafer bearing device 105 is placed in accommodating chamber 108, and wafer bearing device 105 is used to bear
With fixing wafer 104.The wafer bearing device 105 includes carrier 106 and position limiting structure 107, wafer 104
When being placed on carrier 106, its position is corrected and is limited by position limiting structure 107.Start it in grinding wafer technique
It is front or after terminating, need wafer 104 is adsorbed on grinding head 103 or by unloading on grinding head 103.If
The position suitable of wafer 104, the center of wafer 104 center alignment just with carrier 106, then grinding head
103 absorption or the process for unloading will be more smooth.
It is generally, if wafer 104 is normally unloaded on wafer bearing device 105, as shown in Figure 2,
Wafer 104 by horizontal rest on carrier 106, and due to the presence of position limiting structure 107, the position of wafer 104
Put and will be corrected, make the center of wafer 104 center alignment just with carrier 106, the edge of wafer 104
It is tangent with position limiting structure 107.
But, uninstall process is also possible to not smooth.As shown in figure 3, in some cases, wafer 104
When being offloaded to wafer bearing device 105 by grinding head 103, wafer 104 is not smoothly positioned over carrier
On 106, but one end tilts, obliquely across between position limiting structure 107 and carrier 106, under this state,
The center of wafer 104 naturally also cannot be with the center alignment of carrier 106.There is such case, will cause serious
Consequence, it is easy to wafer 104 is damaged.Because the grinding wafer equipment can not judge that wafer 104 is being carried
Whether level or centering on disk 106, in the running of next stage, grinding head 103 will adsorb wafer
When 104, can move downward in the presence of driving chamber 101 first, and pressure is produced to wafer 104.Due to crystalline substance
104 one end of circle tilt, and the pressure for now applying is easy to crush wafer 104, and the damage for being difficult to make up is brought to manufacturer
Lose.
As can be seen here, determine whether wafer is placed on wafer bearing device steadily, contribute to protecting wafer, together
When be also beneficial to more preferable implementing process.
The content of the invention
It is an object of the present invention to provide a kind of wafer bearing device, can make to wafer state in which and sentencing
Disconnected and early warning, to guarantee that wafer is steadily placed, will not offset and tilt, so as to avoid wafer crushed.
For achieving the above object, the invention provides following technical scheme：
According to one embodiment of present invention, a kind of wafer bearing device is proposed, including：
Carrier, carrier are used to support wafer；
Position limiting structure, the position limiting structure are arranged on carrier, for the wafer limit being pointed in the card
Position；
Vacuum tube, vacuum tube are connected with carrier by below card, and by taking out between the card and wafer
Vacuum is determining whether wafer is steadily placed.
In one embodiment, vacuum tube is connected to air pump.
In one embodiment, switch valve is provided between vacuum tube and air pump.
In one embodiment, boss of the position limiting structure for the column or annular of circular distribution.
In one embodiment, upper surface of the position limiting structure beyond wafer.
In one embodiment, detection of negative pressure device is provided with vacuum tube.
Another object of the present invention is to, there is provided whether a kind of inspection wafer places stable method.
According to one embodiment of present invention, propose whether a kind of inspection wafer places stable method, including：
Wafer is positioned on wafer bearing device, the wafer is located in the card of carrier；
By vacuum tube to evacuation between the card and wafer；
Judge whether wafer is placed steadily according to the negative pressure in the vacuum tube.
In sum, disclosed wafer bearing device and method, using detection of negative pressure principle, to crystalline substance
Circle state in which is judged, so as to can ensure that wafer is steadily positioned on wafer bearing device.
Description of the drawings
Fig. 1 discloses a kind of structural representation of the wafer bearing device used by existing grinding wafer equipment；
Fig. 2 discloses the schematic diagram during wafer bearing device that wafer is successfully steadily positioned in Fig. 1；
Fig. 3 discloses the wafer bearing device is not steadily positioned in Fig. 1 by wafer and signal during run-off the straight
Figure；
Fig. 4 a-4b disclose the structural representation of the wafer bearing device of the present invention；
Fig. 5 discloses the structural representation when wafer bearing device of the present invention is applied to grinding wafer equipment；
Fig. 6 discloses the wafer bearing device of the present invention in the case where wafer is normally positioned state and wafer is improper
The negative pressure curve chart measured under laying state.
Specific embodiment
The specific embodiment of the present invention is discussed in detail below in conjunction with accompanying drawing.
Fig. 4-Fig. 6 is related to the specific embodiment of wafer bearing device of the present invention.As shown in Fig. 4 a-4b, should
Wafer bearing device 405 includes carrier 406, position limiting structure 407 and vacuum tube 409.In Fig. 4 a
Wafer 404 is placed with wafer bearing device 405.Wherein, the support of carrier 406 wafer 404, and
In the state of wafer 404 is normally positioned, card and the wafer 404 of carrier 406 are completely attached to.It is spacing
Structure 407 is used for the wafer 404 that is pointed on carrier 406 to be carried out spacing, and position limiting structure 407 can set
It is placed on carrier 406 and is matchingly distributed in the outer of wafer 404.Vacuum tube 409 is by under card
Side is connected with carrier 406, and evacuation is determining whether wafer 404 is steadily placed.
Position limiting structure 407 usually is out the upper surface of wafer 404, plays correction and limits 404 position of wafer
Effect.If wafer 404 is steadily positioned on carrier 406, the edge of wafer 404 will prop up limit
Bit architecture 407, so as to horizontal displacement, position of the wafer 404 on carrier 406 will not be produced because rocking
Put and fixed.The shape of position limiting structure 407 is not specific, wherein in one embodiment, position limiting structure
407 is the column of circular arrangement, and column can be cylindric, can also be coniform.In another embodiment
In, position limiting structure 407 is the boss of annular, and wafer 404 is enclosed in boss.The column of circular arrangement
Or the boss of annular is matchingly distributed in the outer of wafer 404, radius is consistent with wafer 404.
With reference to Fig. 5, it is that the wafer bearing device 405 in the present invention is applied to the knot among grinding wafer equipment
Structure schematic diagram.The grinding wafer equipment, including driving chamber 401, fixture 402, grinding head 403, wafer hold
Carry and put 405 and accommodating chamber 408.Wherein, the connection driving chamber 401 of fixture 402 and grinding head 403,
Driving chamber 401 can drive grinding head 403 to move, and be provided with motor or cylinder as dynamic in driving chamber 401
Power source.Wafer bearing device 405 is placed in accommodating chamber 408, wafer bearing device 405 be used for bear and
Fixing wafer 404.
With reference to Fig. 6, in order to reach the purpose of evacuation, vacuum tube 409 is connected on air pump 411,
Persistently it is evacuated by air pump 411.Switch valve 410 is provided between vacuum tube 409 and air pump 411, is used
In the break-make of control vacuum tube 409.When needing pumping, switch valve 410 is opened；When need not be evacuated, open
Close valve 410 to turn off.In figure 6, give wafer bearing device 405 shape is normally positioned in wafer 404
Under state and the negative pressure curve chart that measured under improper laying state of wafer 404.Arrange in vacuum tube 409
There is detection of negative pressure device 412, the negative pressure value in vacuum tube 409 can be detected.Normally put when wafer 404 is in
When under configuration state, 404 holding level of wafer and it is close to carrier 406, falls into just 407 institute of position limiting structure
In the range of restriction, the edge of wafer 404 props up position limiting structure 407.Under normal laying state, wafer
404 mouths of pipe for having sealed vacuum tube 409, thus in the presence of air pump 411 continues evacuation, vacuum
The negative pressure of 1～2psi or so will be produced in pipe 409, can be detected by detection of negative pressure device 412.Contrary,
When wafer 404 is in the state of improper placement, certain part of wafer 404 may limited structure 407
Jack-up, in the low heeling condition of higher end, wafer 404 cannot be complete with the card of carrier 406
Contact, so as to the mouth of pipe that also cannot seal vacuum tube 409, causes the mouth of pipe and ambient atmosphere of vacuum tube 409
It is connected.Under the improper laying state of here, although air pump 411 is still in lasting evacuation, but vacuum
Negative pressure can't be produced in pipe 409, thus the negative pressure detected by detection of negative pressure device 412 is 0.By this
Plant the mode of detection negative pressure, it can be determined that whether wafer 404 is steadily placed, so as to avoid 404 quilt of wafer
It is unexpected to crush.
With reference to wafer bearing device, the invention allows for whether a kind of inspection wafer places stable method,
Including：
Step 1：Wafer is positioned on wafer bearing device, the wafer is located in the card of carrier；
Step 2：By vacuum tube to evacuation between the card and wafer；
Step 3：Judge whether wafer is placed steadily according to negative pressure.
Vacuum pipe end connects air pump with lasting evacuation.In vacuum tube, the value of negative pressure can be examined by negative pressure
Survey device to be detected.
Above example is intended to the principle and effect of the exemplary explanation present invention, is not intended to limit the present invention
Technical scheme, the working technical staff of this area and association area can be in the spirit and model without prejudice to the present invention
Under farmland, modifications and changes are carried out to above-described embodiment, but still is belonged within inventive concept of the invention.
Claims (7)
1. a kind of wafer bearing device, it is characterised in that include：
Carrier, the carrier are used to support wafer；
Position limiting structure, the position limiting structure are arranged on carrier and are matchingly distributed in the outer of the wafer；
Vacuum tube, the vacuum tube are connected with the carrier by below card, and by the card and crystalline substance
Between circle, evacuation is determining whether wafer is steadily placed.
2. wafer bearing device according to claim 1, it is characterised in that the vacuum tube is connected to pumping
Pump.
3. wafer bearing device according to claim 2, it is characterised in that the vacuum tube and air pump it
Between be provided with switch valve.
4. wafer bearing device according to claim 1, it is characterised in that the position limiting structure is circular point
The boss of the column or annular of cloth.
5. wafer bearing device according to claim 1, it is characterised in that the position limiting structure exceeds wafer
Upper surface.
6. wafer bearing device according to claim 1, it is characterised in that be provided with the vacuum tube negative
Pressure detector.
7. whether a kind of inspection wafer places stable method, it is characterised in that include：
Wafer is positioned on wafer bearing device, the wafer is located in the card of carrier；
By vacuum tube to evacuation between the card and wafer；
Judge whether wafer is placed steadily according to the negative pressure in the vacuum tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510621699.8A CN106558519A (en) | 2015-09-25 | 2015-09-25 | Whether wafer bearing device and inspection wafer place stable method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510621699.8A CN106558519A (en) | 2015-09-25 | 2015-09-25 | Whether wafer bearing device and inspection wafer place stable method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106558519A true CN106558519A (en) | 2017-04-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510621699.8A Pending CN106558519A (en) | 2015-09-25 | 2015-09-25 | Whether wafer bearing device and inspection wafer place stable method |
Country Status (1)
| Country | Link |
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| CN (1) | CN106558519A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109637928A (en) * | 2018-12-05 | 2019-04-16 | 中国电子科技集团公司第十三研究所 | Remove the ancillary equipment and method of crystal column surface indigo plant film |
| CN111276428A (en) * | 2020-01-02 | 2020-06-12 | 长江存储科技有限责任公司 | Wafer bearing device |
| CN114905408A (en) * | 2022-05-09 | 2022-08-16 | 北京烁科精微电子装备有限公司 | Wafer temporary storage device and chemical mechanical polishing equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001050732A (en) * | 1999-08-06 | 2001-02-23 | Sumitomo Wiring Syst Ltd | Positioning state detecting device |
| CN101770972A (en) * | 2008-12-29 | 2010-07-07 | 中芯国际集成电路制造(上海)有限公司 | Process plate |
| CN102867765A (en) * | 2012-09-27 | 2013-01-09 | 盛美半导体设备（上海）有限公司 | Detector and detection method for wafer position |
| CN103515264A (en) * | 2012-06-26 | 2014-01-15 | 盛美半导体设备（上海）有限公司 | Detection apparatus and detection method for wafer position |
-
2015
- 2015-09-25 CN CN201510621699.8A patent/CN106558519A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001050732A (en) * | 1999-08-06 | 2001-02-23 | Sumitomo Wiring Syst Ltd | Positioning state detecting device |
| CN101770972A (en) * | 2008-12-29 | 2010-07-07 | 中芯国际集成电路制造(上海)有限公司 | Process plate |
| CN103515264A (en) * | 2012-06-26 | 2014-01-15 | 盛美半导体设备（上海）有限公司 | Detection apparatus and detection method for wafer position |
| CN102867765A (en) * | 2012-09-27 | 2013-01-09 | 盛美半导体设备（上海）有限公司 | Detector and detection method for wafer position |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109637928A (en) * | 2018-12-05 | 2019-04-16 | 中国电子科技集团公司第十三研究所 | Remove the ancillary equipment and method of crystal column surface indigo plant film |
| CN109637928B (en) * | 2018-12-05 | 2021-04-06 | 中国电子科技集团公司第十三研究所 | Auxiliary equipment and method for removing blue film on surface of wafer |
| CN111276428A (en) * | 2020-01-02 | 2020-06-12 | 长江存储科技有限责任公司 | Wafer bearing device |
| CN111276428B (en) * | 2020-01-02 | 2021-07-06 | 长江存储科技有限责任公司 | Wafer bearing device |
| CN114905408A (en) * | 2022-05-09 | 2022-08-16 | 北京烁科精微电子装备有限公司 | Wafer temporary storage device and chemical mechanical polishing equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 201203 building 4, No. 1690, Cailun Road, free trade zone, Pudong New Area, Shanghai Applicant after: Shengmei semiconductor equipment (Shanghai) Co., Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Cailun Road No. fourth 1690 Applicant before: ACM (SHANGHAI) Inc. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170405 |
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| RJ01 | Rejection of invention patent application after publication |