CN101770972A - Process plate - Google Patents
Process plate Download PDFInfo
- Publication number
- CN101770972A CN101770972A CN200810208081A CN200810208081A CN101770972A CN 101770972 A CN101770972 A CN 101770972A CN 200810208081 A CN200810208081 A CN 200810208081A CN 200810208081 A CN200810208081 A CN 200810208081A CN 101770972 A CN101770972 A CN 101770972A
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- wafer
- process plate
- guide card
- spacing guide
- carrying face
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention discloses a process plate, which comprises a process plate platform with a wafer bearing surface and a base. A wafer is supported on the wafer bearing surface. The process plate is characterized in that the wafer bearing surface is provided with a wafer limiting guide film which is used for limiting the wafer on the part of the wafer bearing surface within the range limited by the wafer limiting guide film. The invention provides various implementation structures of the wafer limiting guide film. When the process plate with the wafer limiting guide film is used, the position of the wafer can be fixed during the falling process of the wafer onto the wafer bearing surface before the vacuum absorption system acts, thereby effectively preventing the wafer from sliding out of the wafer bearing surface to be broken.
Description
Technical field
The present invention relates to the semiconductor fabrication techniques field, particularly a kind of process plate that carries wafer.
Background technology
At present, in the semiconductor integrated circuit processing procedure, heating or cool wafers are to be realized by the process plate that is installed in the processing procedure chamber, and the general technology dish has vacuum suction system, is used for fixing wafer.The end view of the process plate of carrying wafer as shown in Figure 1.Process plate platform 2 with wafer carrying face 1 is positioned on the process plate pedestal 3, and wafer 4 is positioned on the wafer carrying face 1, and process plate pedestal 3 is provided with set bolt 5, is used for fixing the process plate pedestal.But because the vacuum suction of process plate lags behind, in wafer 4 dropping process, in the time of will arriving wafer carrying face 1, can not adsorb wafer 4 at once, the surface of wafer 4 and wafer carrying face 1 all is smooth, when both are in contact with one another, both interbedded gas emptyings in time, making has gas to retain the formation air cushion layer between the two.At this moment, the air cushion layer that exists between wafer 4 and wafer carrying face 1 can cause wafer 4 to skid off wafer carrying face 1 and fragmentation.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of process plate, and this process plate can prevent that wafer from skidding off the wafer carrying face and fragmentation.
For achieving the above object, technical scheme of the present invention specifically is achieved in that
The invention provides a kind of process plate, comprise process plate platform and pedestal with wafer carrying face, wafer carrying is on described wafer carrying face, key is, described wafer carrying face is provided with the spacing guide card of wafer, is used for the wafer carrying face of described wafer restraint in the spacing guide card institute limited range by described wafer.
The spacing guide card of described wafer is arranged at least three projectioies on the described wafer carrying face.
Described projection is the inclined-plane in a side of oriented wafer.
Described projection is isogonism and distributes.
Described projection is the object that comprises angle body and arc body etc., is bonded in the edge on the described wafer carrying face.
The spacing guide card of described wafer comprises limiting section, support portion and installation portion, and described limiting section is positioned at the edge on the wafer carrying face, is the inclined-plane in a side of oriented wafer; Described support portion and limiting section intersect at the top edge of process plate platform; Intersect at the lower limb of process plate platform described installation portion and support portion, and described installation portion is fixed on the surface of process plate pedestal.
The spacing guide card of described wafer is at least three.
Described installation portion is provided with installing hole, has set bolt to pass this installing hole, and described installation portion is fixed on the described pedestal.
Described pedestal is provided with fixed bolt hole, and described installing hole overlaps with described fixed bolt hole.
The spacing guide card of described wafer is a stainless steel substrates.
As seen from the above technical solutions, a kind of process plate provided by the invention, the spacing guide card of wafer of projection is installed in the edge of the wafer carrying face of process plate, when wafer drops to the wafer carrying face, the fixing position of wafer just before vacuum suction system is not also had an effect has prevented that more effectively wafer from skidding off the wafer carrying face and fragmentation.
Description of drawings
Fig. 1 is the end view of prior art processes dish.
Fig. 2 A is furnished with the vertical view of the process plate of the spacing guide card of wafer for the present invention.
Fig. 2 B is a kind of end view of implementing structure of the spacing guide card of wafer of the present invention.
Fig. 3 A and 3B are respectively the vertical view and the cutaway view of the process plate of being furnished with the spacing film frequency device of wafer of the preferred embodiment of the present invention.
Fig. 4 A and 4B are respectively the vertical view and the end view of the spacing guide card of wafer of the preferred embodiment of the present invention.
Embodiment
For make purpose of the present invention, technical scheme, and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the present invention is described in more detail.
In order to prevent that wafer from skidding off the wafer carrying face owing to process plate can not adsorb the wafer that wafer causes at once when dropping to the wafer carrying face, the present invention is provided with the spacing guide card of wafer of projection in the edge of wafer carrying face, be used to limit the position of wafer, prevent that effectively wafer from skidding off the loading end of process plate at the wafer carrying face.
The vertical view of process plate of being furnished with the spacing guide card of wafer is shown in Fig. 2 A.The spacing guide card 200 of wafer of projection is positioned at the edge of wafer carrying face, and promptly the edge tangent line of the tangent line of the spacing guide card 200 of wafer and wafer carrying face overlaps, and perhaps has the distance of setting; The shape of the spacing guide card 200 of wafer of projection can be regular shape, also can be for irregularly shaped; The quantity of the spacing guide card 200 of wafer is at least 3, as long as can play the restricted effect of the wafer that drops to the wafer carrying face.
The spacing guide card 200 of wafer can be for being arranged on the annular solid on the wafer carrying face 1, and the external diameter of annular solid can be identical with the diameter of wafer carrying face 1, and internal diameter is slightly larger than the diameter of wafer, with wafer restraint on wafer carrying face 1.The center of circle of annular solid overlaps with the center of circle of wafer carrying face 1, and annular solid has groove.In the present embodiment, the spacing guide card 200 of wafer is the dihedral projection, also can be other as the protruding object of square, rectangle arc etc.Can utilize binding agent that the spacing guide card 200 of wafer is fixed on the edge of wafer carrying face 1, and the spacing guide card 200 of wafer is made as 4, be equal angles and distribute, with the pivot that guarantees wafer at its position of centre of gravity.Also to guarantee to be in the spacing of the spacing guide card 200 of two wafers on wafer carrying face 1 at diagonal angle greater than the diameter wafer that will place.
When wafer fell, if because source of error does not have to aim at just the center of wafer carrying face, and the side with spacing guide card 200 oriented wafers of the wafer of projection is made as the inclined-plane so, preferred bevel altitude was 3mm.Can play corrective action simultaneously to the wafer that drops to the wafer carrying face, off-centered a little wafer is slided from the inclined-plane, just in time drop on the center of wafer carrying face.The end view of the spacing guide card 200 of wafer is shown in Fig. 2 B.
The spacing guide card 200 of wafer also can not utilize binding agent the spacing guide card 200 of wafer to be fixed on the edge of wafer carrying face, but adopt the mode of on the process plate pedestal, installing the spacing guide card 200 of wafer to be arranged on the periphery of process plate, the spacing guide card 200 of wafer can adopt the structure as shown in Fig. 2 A and 3B, comprises limiting section 201, support portion 202, installation portion 203.Wherein, limiting section 201 is positioned at the edge on the wafer carrying face 1, is the inclined-plane in a side of oriented wafer; Intersect with the top edge of limiting section 201 at process plate platform 2 support portion 202; Installation portion 203 intersects with the lower limb of support portion 202 at process plate platform 2, and is fixed on the surface of process plate pedestal 3.In embodiments of the present invention,, then can directly place it on the process plate pedestal 3, need not use bolt if the spacing guide card 200 of wafer can enough stably be present on the process plate pedestal 3.In order to ensure stable, the preferred embodiments of the present invention are to be provided with an installing hole 204 on the installation portion 203 of the spacing guide card 200 of wafer, and bolt is fixed on the spacing guide card 200 of wafer on the process plate by this installing hole 204.Further, on process plate pedestal 3, be useful on the set bolt 5 and the corresponding fixed bolt hole of technique for fixing dish pedestal 3, so just the fixed bolt hole of installing hole 204 with technique for fixing dish pedestal 3 overlapped, makes set bolt 5 pass through the fixed bolt hole of installing hole 204 and technique for fixing dish pedestal 3 simultaneously.
In the present embodiment, because will establish an installing hole 204 on the installation portion 203 of the spacing guide card 200 of wafer, the set bolt 5 of technique for fixing dish pedestal 3 is by this installing hole, as long as guarantee the diameter of the length of installation portion 203 greater than set bolt 5.Preferably, installing hole is made as U-shaped, does not need in advance to determine according to the position of the set bolt 5 of technique for fixing dish pedestal 3 position of the installing hole 204 of the spacing guide card 200 of wafer.The internal diameter width of U-shaped installing hole is the width of bolt, is 5mm in the present embodiment.
In the present embodiment, the cross section of the spacing guide card 200 of wafer can be multiple shape, and as triangle, cylindrical, trapezoidal etc., used cross section figure is a rectangle in the present embodiment, and rectangular width is 2mm.
Fig. 3 A and 3B promptly are respectively the vertical view and the cutaway view of the process plate of being furnished with the spacing guide card of wafer of the preferred embodiment of the present invention as mentioned above.Fig. 4 A and 4B are respectively the vertical view and the end view of the spacing guide card of wafer of the preferred embodiment of the present invention.The width of spacing guide card 200 each parts of wafer can equate, also can be unequal.In the present embodiment, in order to save the technology cost, the cross section of the spacing guide card 200 of wafer is set to rectangle and length is 10mm, and the cross section of support portion 202 and installation portion 203 is set to rectangle and length is made as 5mm.
In the present embodiment, the quantity of the spacing guide card 200 of wafer is at least three, can equal angles distribute or not equal angles distribution, only needs to guarantee that wafer limit the wafer carrying face that skids off when dropping to the wafer carrying face.
The material of the spacing guide card 200 of wafer adopts stainless steel material, is convenient to polishing, reduce friction, and stainless steel material is cheap, can save the technology cost.
The present invention can make wafer no longer because the vacuum suction system of process plate can not adsorb wafer at once, and skid off the wafer carrying face of process plate, and, through experiment test, the present invention is provided with the spacing guide card 200 of wafer at the wafer carrying face, does not influence the processing procedure of wafer, under the prerequisite that does not produce negative effect, fixing wafer has more effectively reduced owing to wafer skids off the unnecessary waste that the wafer carrying face of process plate causes.Further, can play corrective action, off-centered a little wafer is slided from the inclined-plane of oriented wafer one side of the spacing guide card 200 of wafer on wafer carrying face 1, just in time drop on the center of wafer carrying face the wafer that drops to the wafer carrying face.
Though the present invention is with preferred embodiment, especially with preferable digital scope openly as above, it is not to be used for limiting the present invention, and any those skilled in the art can make possible change and modification without departing from the spirit and scope of the present invention.
Claims (10)
1. process plate, comprise process plate platform and pedestal with wafer carrying face, wafer carrying is on described wafer carrying face, it is characterized in that, described wafer carrying face is provided with the spacing guide card of wafer, is used for the wafer carrying face of described wafer restraint in the spacing guide card institute limited range by described wafer.
2. process plate as claimed in claim 1 is characterized in that, the spacing guide card of described wafer is arranged at least three projectioies on the described wafer carrying face.
3. process plate as claimed in claim 2 is characterized in that, described projection is the inclined-plane in a side of oriented wafer.
4. process plate as claimed in claim 3 is characterized in that, described projection is isogonism and distributes.
5. as claim 2,3 or 4 described process plates, it is characterized in that described projection is the object that comprises angle body and arc body etc., is bonded in the edge on the described wafer carrying face.
6. process plate as claimed in claim 1 is characterized in that, the spacing guide card of described wafer comprises limiting section, support portion and installation portion, and described limiting section is positioned at the edge on the wafer carrying face, is the inclined-plane in a side of oriented wafer; Described support portion and limiting section intersect at the top edge of process plate platform; Intersect at the lower limb of process plate platform described installation portion and support portion, and described installation portion is fixed on the surface of process plate pedestal.
7. process plate as claimed in claim 6 is characterized in that, the spacing guide card of described wafer is at least three.
8. process plate as claimed in claim 6 is characterized in that described installation portion is provided with installing hole, has set bolt to pass this installing hole, and described installation portion is fixed on the described pedestal.
9. process plate as claimed in claim 8 is characterized in that described pedestal is provided with fixed bolt hole, and described installing hole overlaps with described fixed bolt hole.
10. process plate as claimed in claim 1 is characterized in that, the spacing guide card of described wafer is a stainless steel substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102080819A CN101770972B (en) | 2008-12-29 | 2008-12-29 | Process plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102080819A CN101770972B (en) | 2008-12-29 | 2008-12-29 | Process plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101770972A true CN101770972A (en) | 2010-07-07 |
| CN101770972B CN101770972B (en) | 2012-05-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102080819A Active CN101770972B (en) | 2008-12-29 | 2008-12-29 | Process plate |
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| Country | Link |
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| CN (1) | CN101770972B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103276363A (en) * | 2013-06-13 | 2013-09-04 | 电子科技大学 | Multi-sheet double-side film rapid deposition device |
| CN103811401A (en) * | 2014-03-11 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Wafer bracket and process cavity comprising wafer bracket |
| CN103943546A (en) * | 2014-04-28 | 2014-07-23 | 北京七星华创电子股份有限公司 | Silicon slice supporting device |
| CN104681472A (en) * | 2013-12-02 | 2015-06-03 | 有研新材料股份有限公司 | Slide glass ring |
| CN106033738A (en) * | 2015-02-12 | 2016-10-19 | 汉民科技股份有限公司 | Wafer holder |
| CN106558519A (en) * | 2015-09-25 | 2017-04-05 | 盛美半导体设备（上海）有限公司 | Whether wafer bearing device and inspection wafer place stable method |
| CN111183248A (en) * | 2019-05-20 | 2020-05-19 | 厦门三安光电有限公司 | Bearing disc for growing thin film on substrate, growing device and growing method |
| CN114334789A (en) * | 2022-03-14 | 2022-04-12 | 宁波润华全芯微电子设备有限公司 | Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine |
-
2008
- 2008-12-29 CN CN2008102080819A patent/CN101770972B/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103276363A (en) * | 2013-06-13 | 2013-09-04 | 电子科技大学 | Multi-sheet double-side film rapid deposition device |
| CN103276363B (en) * | 2013-06-13 | 2016-05-25 | 电子科技大学 | Multi-disc two-side film membrane fast deposition device |
| CN104681472A (en) * | 2013-12-02 | 2015-06-03 | 有研新材料股份有限公司 | Slide glass ring |
| CN103811401A (en) * | 2014-03-11 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Wafer bracket and process cavity comprising wafer bracket |
| CN103943546A (en) * | 2014-04-28 | 2014-07-23 | 北京七星华创电子股份有限公司 | Silicon slice supporting device |
| CN106033738A (en) * | 2015-02-12 | 2016-10-19 | 汉民科技股份有限公司 | Wafer holder |
| CN106558519A (en) * | 2015-09-25 | 2017-04-05 | 盛美半导体设备（上海）有限公司 | Whether wafer bearing device and inspection wafer place stable method |
| CN111183248A (en) * | 2019-05-20 | 2020-05-19 | 厦门三安光电有限公司 | Bearing disc for growing thin film on substrate, growing device and growing method |
| WO2020232602A1 (en) * | 2019-05-20 | 2020-11-26 | 厦门三安光电有限公司 | Carrier plate, growth device and growth method for growing thin film on substrate |
| CN114334789A (en) * | 2022-03-14 | 2022-04-12 | 宁波润华全芯微电子设备有限公司 | Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101770972B (en) | 2012-05-30 |
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