CN114334789A - Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine - Google Patents
Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine Download PDFInfo
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- CN114334789A CN114334789A CN202210243690.8A CN202210243690A CN114334789A CN 114334789 A CN114334789 A CN 114334789A CN 202210243690 A CN202210243690 A CN 202210243690A CN 114334789 A CN114334789 A CN 114334789A
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Abstract
The invention discloses a fixed chuck, a photoresist removing platform, a photoresist removing cavity and a photoresist removing machine. The fixing chuck includes: mounting a platform; a plurality of stationary components circumferentially distributed on the mounting platform, including: a load bearing column; the limiting column is arranged on one side, away from the mounting platform, of the bearing column, and the upper bottom surface of the limiting column is larger than the lower bottom surface of the bearing column; wherein the load-bearing columns in the plurality of fixed components form wafer mounting locations; the limiting columns in the plurality of fixing assemblies form wafer limiting parts. The invention effectively solves the problem that the wafer is separated due to larger centrifugal force, and can be suitable for wafers with various sizes.
Description
Technical Field
The invention relates to the field of wafer processing, in particular to a fixed chuck, a photoresist removing platform, a photoresist removing cavity and a photoresist removing machine.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. At present, in the process of a wafer gold tearing and glue removing process, the wafer needs to be subjected to gold tearing and glue removing on a rotary platform through a high-pressure glue removing solution. At present, in the wafer gold tearing and glue removing process, most fixing devices of a rotating platform are truncated cone-shaped limiting columns or limiting columns with small top and large bottom, although the fixing modes of the two limiting columns are convenient for placing a wafer, the fixing modes are not firm, and the wafer is easy to separate due to large centrifugal force.
Disclosure of Invention
Therefore, the embodiment of the invention provides a fixed chuck, which effectively solves the problem that a wafer is separated due to a larger centrifugal force.
In one aspect, an embodiment of the present invention provides a fixing chuck, including: mounting a platform; a plurality of stationary components circumferentially distributed on the mounting platform, including: a load bearing column; the limiting column is arranged on one side, away from the mounting platform, of the bearing column, and the upper bottom surface of the limiting column is larger than the lower bottom surface of the bearing column; wherein the load-bearing columns in the plurality of fixed components form wafer mounting locations; the limiting columns in the plurality of fixing assemblies form wafer limiting parts.
The technical effect achieved after the technical scheme is adopted is as follows: through the spacing post that the bottom surface is greater than down, fix the wafer better on fixed chuck, when rotatory, can prevent to break away from because of the great wafer that leads to of centrifugal force through the spacing post that the bottom surface is greater than down.
In one embodiment of the present invention, the plurality of fixing assemblies further includes: the leading-in piece is located spacing post is kept away from one side of mounting platform, and for the bottom with the last bottom surface of spacing post equals, and upper portion is cylindrical circular cone or round platform. The lead-in piece can enable the wafer to enter the wafer mounting position along the inclined surface.
The technical effect achieved after the technical scheme is adopted is as follows: in the process of mounting the wafer to the fixed chuck, the wafer can be guided into the fixed chuck along the inclined plane of the guide-in piece, and the wafer is convenient to mount and fix.
In one embodiment of the present invention, the bearing columns of the plurality of fixing assemblies are columns with different heights; wherein, the fixing component with higher height is arranged on the outer ring of the mounting platform; and the fixing component with lower height is arranged on the inner ring of the mounting platform and can be suitable for wafers with different diameters.
The technical effect achieved after the technical scheme is adopted is as follows: the lower fixing components are arranged on the inner side of the mounting platform, the higher fixing components are arranged on the outer side of the mounting platform, the higher fixing components can be suitable for wafers with larger diameters, and the lower fixing components can be suitable for wafers with smaller diameters.
In one embodiment of the present invention, the mounting platform includes: and the motor connecting positions are circumferentially distributed on the mounting platform.
The technical effect achieved after the technical scheme is adopted is as follows: through a plurality of motor connection positions, the fixed chuck is fixed on the motor, so that the chuck can rotate along with the motor.
On the other hand, the photoresist removing platform provided by the embodiment of the invention comprises: the fixed chuck is the fixed chuck in any one embodiment; a motor having a drive shaft that drives the fixed chuck to rotate.
The technical effect achieved after the technical scheme is adopted is as follows: and connecting the fixed chuck with a motor, so that the motor can drive the fixed chuck to rotate.
The shaft sleeve is in transmission connection with the driving shaft and is arranged eccentrically to the driving shaft.
The technical effect achieved after the technical scheme is adopted is as follows: through the axle sleeve makes fixed chuck and motor keep the decentraction, when fixed chuck made rotatory, the wafer can not carry out relative slip, increases centripetal force, makes the rotation more stable.
In one embodiment of the invention, the shaft sleeve further comprises a plurality of chuck mounting positions; the connecting pieces are fixed on the corresponding chuck mounting positions; the plurality of connecting pieces are used for connecting the plurality of corresponding chuck mounting positions with the plurality of motor connecting positions, and the fixed chuck is mounted on the motor.
The technical effect achieved after the technical scheme is adopted is as follows: through a plurality of connecting pieces, will fixed chuck with the axle sleeve is connected, the motor passes through the axle sleeve drive fixed chuck rotates, stability when improving the rotation.
In one embodiment of the present invention, further comprising: and the waterproof cover is arranged at one end, close to the fixed chuck, of the driving shaft.
The technical effect achieved after the technical scheme is adopted is as follows: through the waterproof cover, prevent that the degumming liquid from getting into the motor, right the motor causes the corruption, improves the life of motor.
In another aspect, an embodiment of the invention provides a photoresist stripping chamber, which includes: the photoresist removing cavity shell is provided with a photoresist removing working space; the nozzle is arranged in the photoresist removing working space and is arranged at the upper end of the photoresist removing cavity shell; the photoresist removing platform is the photoresist removing platform in any one of the embodiments and is arranged in the photoresist removing working space.
The technical effect achieved after the technical scheme is adopted is as follows: the wafer is better fixed on the photoresist removing cavity through the limiting column with the upper bottom surface larger than the lower bottom surface, so that the wafer is prevented from being separated due to larger centrifugal force during rotation; through eccentric setting, improve the stability of the cavity of removing glue.
In another aspect, in a photoresist stripper provided in an embodiment of the present invention, the photoresist stripper is provided with the photoresist stripping cavity described in the above embodiment.
The technical effect achieved after the technical scheme is adopted is as follows: the wafer is better fixed on the degumming machine through the limiting columns with the upper bottom surfaces larger than the lower bottom surfaces, so that the wafer is prevented from being separated due to larger centrifugal force during rotation; through eccentric setting, improve the stability of degumming machine.
In summary, the above embodiments of the present application may have one or more of the following advantages or benefits: i) the wafer is better fixed on the fixed chuck through the limiting columns with the upper bottom surfaces larger than the lower bottom surfaces, so that the wafer is prevented from being separated due to larger centrifugal force during rotation; ii) the wafer may be fixed on the fixed chuck along the inclined surface of the lead-in during mounting to the fixed chuck; iii) the multi-layer chuck design can be adapted to wafers of different diameter sizes; iv) the fixed chuck and the motor are eccentrically arranged, so that the wafers are prevented from sliding relatively, the centripetal force is increased, and the stability is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a fixing chuck 100 according to an embodiment of the present invention.
Fig. 2 is a schematic structural view of the fixing assembly 20 in fig. 1.
Fig. 3 is a schematic structural view of another fixing assembly 20 shown in fig. 1.
Fig. 4 is a schematic structural view of the mounting platform 10 in fig. 1.
Fig. 5 is a schematic structural diagram of a photoresist stripping platform 200 according to an embodiment of the present invention.
Fig. 6 is a schematic structural view of the bushing 230 of fig. 4.
Fig. 7 is a schematic structural diagram of a photoresist stripping chamber 300 according to an embodiment of the invention.
Description of the main element symbols:
100 is a fixed chuck; 10 is a mounting platform; 11 is a motor connecting position; 12 is a fixed component mounting position; 20 is a fixed component; 21 is a bearing column; 22 is a limit column; 23 is a leading-in part; 24 is a mounting hole;
200 is a photoresist removing platform; 210 is a motor; 211 is a driving shaft; 220 is a reducer; 230 is a shaft sleeve; 231 is a chuck mounting position; 232 is a driving shaft mounting position; 233 is a support column; 240 is a waterproof cover;
300 is a photoresist removing cavity; 310 is a nozzle; 320 is a high pressure nozzle mount; 330 is a stripping chamber housing.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
[ first embodiment ] A method for manufacturing a semiconductor device
Referring to fig. 1, a fixing chuck 100 is provided for an embodiment of the present invention, and includes: a mounting platform 10 and a plurality of stationary assemblies 20; wherein a plurality of stationary assemblies 20 are circumferentially distributed on the mounting platform.
Specifically, referring to fig. 2, the fixing member 20, for example, includes: the mounting platform comprises a bearing column 21 and a limiting column 22, wherein the limiting column 22 is arranged on one side of a bearing column 32 far away from the mounting platform 10; wherein, the bearing columns 21 in the plurality of fixing components 20 form wafer mounting positions; the posts 22 in the plurality of fixed components 20 form wafer stops.
Preferably, the load post 21 is a cylindrical structure having a diameter slightly larger than the restraint post 22. For example, when a wafer is placed in the fixed chuck 100, the wafer may be mounted to the wafer mounting site through the plurality of retaining posts 22.
Preferably, the fixing assembly 20, for example, further comprises: an introduction member 23; the guiding-in part 23 is disposed on a side of the limiting column 22 away from the mounting platform 10, and is a cone or a truncated cone with a bottom surface equal to an upper bottom surface of the limiting column 22. For example, when the wafer is required to be mounted on the fixed chuck 100 and is not located at the center of the fixed chuck 100, the wafer may be mounted to the wafer mounting position along the side of the guide 23.
Specifically, the fixing member 20 is further provided with a mounting hole 24 for mounting the fixing member 20 to the mounting platform 10, where the fixing member can be connected by bolts. Preferably, two mounting holes 24 are provided for better mounting the fixing assembly 20 to the mounting platform 10, although a plurality of mounting holes 24 may be provided, which is not limited herein.
Specifically, referring to fig. 3, the limiting column 22 is a circular truncated cone with an upper bottom surface larger than a lower bottom surface. For example, the diameter of the upper bottom surface of the position-limiting post 22 is D1, and the diameter of the lower bottom surface is D2; the diameter of the upper bottom surface D1 is larger than the diameter of the lower bottom surface D2, so that the diameter of the limiting column 22 gradually decreases from the diameter of the upper bottom surface to the diameter of the lower bottom surface, the side surface of the limiting column is inclined, the wafer can be limited, and the wafer is prevented from falling off when rotating at a high speed.
Specifically, referring to fig. 4, the mounting platform 10, for example, includes: a plurality of fixed component mounting locations 12 and a plurality of motor connection locations 11; wherein, a plurality of fixed component installation positions 12 and a plurality of motor connection positions 11 all distribute around mounting platform 10.
Preferably, the plurality of motor connection positions may be three motor connection positions 11, and the three motor connection positions 11 may better fix the fixing chuck 100 on the motor, and of course, the plurality of motor connection positions may also be two or four, which is not limited herein.
Preferably, the plurality of fixing component mounting locations may be six fixing component mounting locations 12, and the six fixing component mounting locations 12 may preferably fix the wafer on the fixing chuck 100, although the plurality of fixing component mounting locations may also be three or four, which is not limited herein.
Preferably, the plurality of fixing component mounting positions 12 may be respectively distributed on an inner ring and an outer ring of the mounting platform 10, and the fixing component 20 with a higher height is mounted on the fixing component mounting position 12 of the outer ring; the fixing member 20 having a small height is mounted on the fixing member mounting portion 12 of the inner ring, and is applicable to wafers having different diameters.
For example, a general fixed chuck is only suitable for a wafer of a certain size, which is poor in applicability, and if a wafer of another size is to be processed, the fixed chuck matched with the wafer in size needs to be replaced, which reduces the working efficiency; the fixing assembly 20 with the inner and outer rings at different heights can be suitable for wafers with different sizes, and the fixing chuck 100 is prevented from being replaced when the wafers with different sizes are processed, so that the working efficiency is improved. Of course, the fixed component mounting positions 12 may be arranged in multiple layers to be suitable for wafers of different sizes, or the positions of the fixed component mounting positions 12 may be changed to be suitable for wafers of different sizes according to the wafers of different sizes.
Preferably, the plurality of fixing assembly mounting positions 12 provided on the inner ring may be protrusions on the mounting platform 10, which may reduce the material required for manufacturing the mounting platform 10.
Preferably, the fixing chuck 100 is made of a corrosion-resistant material, such as teflon, carbon fiber, or copper oxide, etc., which is not limited herein. For example, the existing glue solution has high corrosivity during processing, and the use of the corrosion-resistant material can prolong the service life of the fixed chuck 100 and reduce the replacement frequency, thereby improving the production efficiency.
Preferably, the plane of the side of the bearing column 21 close to the limiting column 22 is inclined towards the inner side of the mounting platform. For example, since the limiting posts 22 are configured to have a structure with a large top and a small bottom, after the wafer is placed between the limiting posts 22, there is a gap between the wafer and the limiting posts 22, so that the wafer will move back and forth between the gaps when the wafer rotates at a high speed and the rotation speed changes, therefore, in order to prevent the wafer from moving back and forth between the gaps, the plane of the side of the supporting post 21 close to the limiting posts 22 is inclined toward the inner side of the mounting platform, so that the wafer can be fixed on the plane inclined toward the inner side when rotating, and the wafer is prevented from being separated from the mounting platform 10 due to large deflection.
[ second embodiment ]
Referring to fig. 5, a photoresist stripping platform 200 according to an embodiment of the present invention includes: the fixing chuck 100 and the motor 210 according to the first embodiment; wherein, the motor 210 is provided with a driving shaft 211, and the driving shaft 211 can drive the fixing chuck 100 to rotate.
Preferably, a decelerator 220 is installed between the motor 210 and the driving shaft 211. For example, a general motor has a problem of insufficient driving force due to a high rotation speed, and the installation of the reducer 220 between the motor 210 and the driving shaft 211 allows more options for selection of a type and provides a more stable driving force to the fixing chuck 100.
Preferably, a bushing 230 is installed between the driving shaft 211 and the fixing chuck 100; the shaft sleeve 230 is in transmission connection with the driving shaft 211 and is eccentrically arranged with the driving shaft 211. For example, when the fixed chuck 100 rotates at a high speed, the wafer may slide relative to the fixed chuck 100, which may cause the wafer to be detached; when the shaft sleeve 230 is eccentrically disposed, the relative sliding of the wafers can be prevented, the centripetal force can be increased, and the stability during rotation can be improved.
Preferably, a waterproof cover 240 is further provided on the driving shaft 211. For example, the existing glue solution has high corrosivity during processing, and leaks into the motor 210 during the processing process to corrode the motor, so that the waterproof cover 240 is arranged to play a role in sealing, the glue solution is prevented from leaking into the motor during processing, the service life of the motor is prolonged, and the cost is reduced.
Preferably, the stripping platform 200 further comprises: air curtains (not shown); the air curtain is arranged around the driving shaft 211. For example, when the stripping platform 200 is in operation, the stripping solution may leak from the gap around the driving shaft 211 to the inside of the motor 210; at this time, the air curtain can spray air to spray the photoresist removing liquid leaked into the gap, so that the corrosion of the inside of the motor 210 is prevented, and the service life of the motor is prolonged.
Specifically, referring to fig. 5 and 6, the sleeve 230 is further provided with a driving shaft mounting position 232, a plurality of chuck mounting positions 231, and a plurality of support columns 233. The driving shaft installation position 232 is used for installing the driving shaft 211 and is arranged eccentrically to the shaft sleeve 230, so that the driving shaft 211 and the shaft sleeve 230 are arranged eccentrically.
Furthermore, the plurality of chuck mounting positions 231 are provided with corresponding support columns 233; the chuck mounting position 231 and the support column 233 may be connected by bolts or other connection methods, which are not limited herein.
Furthermore, the plurality of support columns 233 are further connected to the corresponding motor connecting positions 11 on the fixing chuck 100, and the plurality of support columns 233 and the motor connecting positions 11 may be connected by bolts or other connection methods, which are not limited herein.
For example, by coupling the fixing chuck 100 through a plurality of chuck installation sites 231 spaced apart from the driving shaft 211, stability of the fixing chuck 100 during rotation can be improved. Further, if the driving shaft 211 is directly connected to the fixed chuck 100, when the driving shaft 211 drives the fixed chuck 100 to rotate, a large centrifugal force is generated, which makes the rotation unstable, and causes the wafer to be pulled out.
[ third embodiment ]
Referring to fig. 7, a photoresist stripping chamber 300 according to an embodiment of the present invention includes: a stripping chamber housing 330, a nozzle 310, and a stripping platform 200 according to the second embodiment. Wherein, be equipped with the working space that strips in the cavity casing 330 that strips, nozzle 310 and strip platform 200 all locate in the space that strips.
Further, the photoresist stripping chamber 300 further includes: the high pressure nozzle mount 320, the high pressure nozzle mount 320 may drive the nozzle 310 to rotate horizontally in the photoresist stripping chamber 300. For example, when a wafer is mounted on the fixed chuck 100, the fixed chuck 100 rotates the wafer at a high speed, and the high pressure nozzle mounting member 320 reciprocates the upper end of the fixed chuck 100 on the nozzle 310, so that the entire surface of the wafer can be washed by the photoresist stripper.
[ fourth example ] A
The fourth embodiment of the present invention further provides a photoresist stripper, where the photoresist stripper (not shown in the figure) may be a full-automatic photoresist stripper or a semi-automatic photoresist stripper, and is not limited herein.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A fixing chuck, comprising:
mounting a platform;
a plurality of stationary assemblies circumferentially distributed on the mounting platform, each stationary assembly comprising:
a load bearing column;
the limiting column is arranged on one side, away from the mounting platform, of the bearing column, and the upper bottom surface of the limiting column is larger than the lower bottom surface of the bearing column;
wherein the load-bearing columns in the plurality of fixed components form wafer mounting locations; the limiting columns in the plurality of fixing assemblies form wafer limiting parts.
2. The fixing chuck according to claim 1, wherein each of the fixing assemblies further comprises:
the guiding piece is arranged on one side, away from the mounting platform, of the limiting column, and is a cone or a circular truncated cone, the bottom of the guiding piece is equal to the upper bottom surface of the limiting column, and the upper portion of the guiding piece is columnar;
the lead-in piece can enable the wafer to enter the wafer mounting position along the inclined surface.
3. The fixing chuck according to claim 1 or 2, wherein the bearing columns of the plurality of fixing assemblies are columns of different heights;
wherein, the fixing component with higher height is arranged on the outer ring of the mounting platform; and the fixing component with lower height is arranged on the inner ring of the mounting platform and can be suitable for wafers with different diameters.
4. The fixed chuck according to claim 1, wherein the mounting platform comprises:
and the motor connecting positions are circumferentially distributed on the mounting platform.
5. A photoresist stripping platform, comprising:
the fixing chuck according to any one of claims 1 to 4;
a motor having a drive shaft that drives the fixed chuck to rotate.
6. The stripping platform as claimed in claim 5, further comprising:
the shaft sleeve is in transmission connection with the driving shaft and is eccentrically arranged with the driving shaft.
7. The desmear platform of claim 6, wherein said shaft sleeve further comprises:
a plurality of chuck mounting locations;
the connecting pieces are fixed on the corresponding chuck mounting positions;
the plurality of connecting pieces are used for connecting the plurality of corresponding chuck mounting positions with the plurality of motor connecting positions, and the fixed chuck is mounted on the motor.
8. The stripping platform as claimed in claim 5, further comprising:
and the waterproof cover is arranged at one end, close to the fixed chuck, of the driving shaft.
9. A photoresist stripping chamber, comprising:
the photoresist removing cavity shell is provided with a photoresist removing working space;
the nozzle is arranged in the photoresist removing working space;
the strip platform of any one of claims 5 to 8, disposed in the strip workspace.
10. A photoresist stripper, wherein the photoresist stripper is provided with the photoresist stripping cavity according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210243690.8A CN114334789A (en) | 2022-03-14 | 2022-03-14 | Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210243690.8A CN114334789A (en) | 2022-03-14 | 2022-03-14 | Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114334789A true CN114334789A (en) | 2022-04-12 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210243690.8A Pending CN114334789A (en) | 2022-03-14 | 2022-03-14 | Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114334789A (en) |
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Application publication date: 20220412 |
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