CN109786299A - Microscope carrier and the wafer transport method and processing unit (plant) for using microscope carrier - Google Patents

Microscope carrier and the wafer transport method and processing unit (plant) for using microscope carrier Download PDF

Info

Publication number
CN109786299A
CN109786299A CN201810921659.9A CN201810921659A CN109786299A CN 109786299 A CN109786299 A CN 109786299A CN 201810921659 A CN201810921659 A CN 201810921659A CN 109786299 A CN109786299 A CN 109786299A
Authority
CN
China
Prior art keywords
microscope carrier
positioning disk
processed
supporting
hoistable platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810921659.9A
Other languages
Chinese (zh)
Other versions
CN109786299B (en
Inventor
江志祥
刘鉴德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
All Ring Tech Co Ltd
Original Assignee
All Ring Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by All Ring Tech Co Ltd filed Critical All Ring Tech Co Ltd
Publication of CN109786299A publication Critical patent/CN109786299A/en
Application granted granted Critical
Publication of CN109786299B publication Critical patent/CN109786299B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A kind of microscope carrier and wafer transport method and processing unit (plant) using microscope carrier;The microscope carrier includes: the positioning disk for carrying element to be processed;Positioning disk is used to support in the fixing seat of fixed height equipped with support frame;Lifting body in fixing seat comprising the hoistable platform of up and down displacements can be made by actuator driving;Hoistable platform sets several supporting elements, and one end is fixedly arranged on the hoistable platform, and the other end sets supporting pin, and supporting pin upper end sets supporting surface and one and extends the limiting unit of protrusion upward by supporting surface side;Hoistable platform shifts up rear support pin upper end higher than positioning disk upper surface, and hoistable platform is slightly below positioning disk upper surface to bottom offset rear support pin supporting surface, but limiting unit is still higher than positioning disk upper surface;Wafer transport method uses such as the microscope carrier.

Description

Microscope carrier and the wafer transport method and processing unit (plant) for using microscope carrier
Technical field
The present invention is espespecially a kind of for holding about a kind of microscope carrier and using the wafer transport method and processing unit (plant) of microscope carrier It carries the wafer moved by manipulator and transports the microscope carrier that the wafer to processing district is processed and the wafer conveying side using microscope carrier Method and processing unit (plant).
Background technique
It is known to wafer (Wafer) carry out processing unit (plant) for dispensing glue using runner transport element to be processed to preheating, dispensing, Rise again ... and workspaces waited to be processed or waited, and the both ends of runner be respectively provided with a magazine for being fed, rewinding, in magazine Element to be processed is saved in the form of so-called frame (Frame), even if wafer is maintained on the glue film among a metal framework (the element W' to be processed for please referring to Figure 13);The runner two sides are respectively provided with a conveyor belt and each workspace is equipped with below runner Corresponding lifting microscope carrier, each microscope carrier that goes up and down all have the function of negative-pressure adsorption and heating and can go up and down relative to runner;To be added Work element from feed magazine be pushed out on runner by push rod when, element to be processed is connect with the two sides of its frame parallel with conveyor belt It touches and is transported;When element to be processed reaches warm operation area, corresponding lifting microscope carrier can rise absorption while jack to be added Work element separates its frame with conveyor belt, and treats the wafer on machine component and carry out preheating heating, by pre- timing Between after lifting microscope carrier can decline and be returned to element to be processed on runner to continue conveying to dispensing workspace;It is arrived in element to be processed When up to dispensing workspace, beneath corresponding lifting microscope carrier, which rises to adsorb, simultaneously to be jacked element to be processed and adds to wafer thereon Heat, then liquid material coating waste water is carried out to crystal column surface with the Glue dripping head being located in dispensing workspace, it goes up and down and carries after the completion of coating Platform, which can decline, to be returned to element to be processed on runner to continue conveying to workspace of rising again;Work of rising again is reached in element to be processed Qu Shi, beneath corresponding lifting microscope carrier, which rises, to be adsorbed and jacks element to be processed and continue to heat wafer thereon, Purpose is to maintain wafer in tepid state, with ensure the liquid material after being coated with will not due to cooling lost flowability, by pre- Going up and down microscope carrier after fixing time and declining is returned to element to be processed on runner to continue conveying and finally enter rewinding to flow field end Magazine is collected.
Summary of the invention
The conveying mode of known flow channel type, element to be processed can only be transported with frame form, according to not having metal frame The form of frame only simple wafer, circular wafer (the element W to be processed for please referring to Fig. 9) are not only not easy the conveying in runner two sides Transported on belt and under not by frame protection, wafer be also easy directly with runner friction and generate fragmentation;And it is to be added It when work element is transported by runner to each workspace, all needs to be detached from after runner again that decentralization returns to runner by lifting microscope carrier jacking, is pushing up It rises, during decentralization, the position of element to be processed is easy to produce offset, causes to carry out liquid material coating waste water in dispensing workspace Element to be processed, practical liquid material application place and desired liquid material application place drop;In addition, element to be processed reaches The program heated is all needed when each workspace, therefore the microscope carrier of identical quantity is arranged in Ling Xu cooperating area quantity, causes cost Increase.
Therefore, the purpose of the present invention is to provide a kind of microscope carrier that can carry different elements to be processed.
It is not easy to generate the wafer of offset during conveying it is another object of the present invention to provide a kind of element to be processed Transport method.
Conveying element to be processed to different operating area processing can be stablized it is still a further object of the present invention is to provide one kind again can Reduce the processing unit (plant) of microscope carrier setup cost.
The microscope carrier of purpose according to the present invention, comprising: a positioning disk, for carrying an element to be processed;One fixing seat, sets There is a support frame, is used to support the positioning disk in a fixed height;One lifting body is set in the fixing seat comprising by One actuator drives the hoistable platform that can make up and down displacements;The hoistable platform is equipped with several supporting elements, and one end is fixedly arranged on On the hoistable platform, the other end be equipped with a supporting pin, the supporting pin upper end be equipped with a supporting surface and one by supporting surface side upward The limiting unit of Fang Yanshen protrusion;After the hoistable platform shifts up the supporting pin upper end be higher than the positioning disk upper surface, and The hoistable platform can about be slightly below the upper surface of the positioning disk to the supporting surface of the supporting pin after bottom offset, but the limiting unit is still Higher than the upper surface of the positioning disk.
The wafer transport method of another object according to the present invention, uses the microscope carrier, comprising: the actuator of lifting body drives Dynamic hoistable platform shifts up the upper surface for making supporting pin upper end be higher than positioning disk;Microscope carrier is set to be moved to one first on a rail chair Position moves into above an element to microscope carrier to be processed after predeterminated position in a manipulator, which keeps this to be added to bottom offset The bottom surface of work element is posted by supporting surface and restriction site is in the element outer rim to be processed;The manipulator removes and actuator drives Dynamic hoistable platform makes the supporting surface of supporting pin about be slightly below the upper surface of positioning disk to bottom offset, makes the element bottom surface patch to be processed It is against positioning disk upper surface;Microscope carrier is set to be moved to a second position on the rail chair.
The processing unit (plant) of a further object according to the present invention, comprising: to execute the device such as the wafer transport method.
Another processing unit (plant) of a further object according to the present invention a, comprising: workbench;One transport mechanism is set to the work On platform, which, which is equipped with a rail chair, translate a microscope carrier can on the rail chair;The microscope carrier, which is equipped with a positioning disk, can carry one For the element to be processed of wafer;One gantry mechanism is set on the workbench, by the two gantry rail gantries for being separated by spacing and being parallel to each other It is constituted, and is equipped with a both ends and is respectively set to the crossbeam in two gantry rail gantries;The crossbeam is parallel with the rail chair, can be in two gantry rails It is translated on the track of frame, which is equipped with the direction translation that a movable plate can be parallel to rail chair on beam track;A bit Gluing mechanism is set on the movable plate, the glue applying mechanism can be driven by the gantry mechanism to above microscope carrier to the element to be processed into Row dispensing processing.
The microscope carrier of the embodiment of the present invention and the wafer transport method and processing unit (plant) for using microscope carrier, are held with the supporting pin of rising Decline the upper surface for making element bottom surface to be processed be posted by positioning disk again after carrying the element to be processed moved by manipulator, makes microscope carrier The element to be processed of simple only wafer form can be carried;And when element to be processed is carried on positioning disk, the limit of supporting pin Portion processed can limit the horizontal displacement of element to be processed, can not only prevent after the negative pressure of positioning disk releases element to be processed because being heated Offset caused by warpage or spring also can prevent element to be processed in microscope carrier when translation transports element to be processed on rail chair It shakes and deviates on positioning disk;Furthermore, it is only necessary to which dynamic conveying element to be processed is moved up to different location in rail chair with a microscope carrier Corresponding processing is carried out, is not required to that multiple microscope carriers are arranged again, the setup cost of microscope carrier can be reduced.
Detailed description of the invention
The stereoscopic schematic diagram of microscope carrier in Fig. 1 embodiment of the present invention.
The schematic diagram of the positioning disk of microscope carrier and lifting body configuration in Fig. 2 embodiment of the present invention.
The schematic diagram of chase inner air vent in Fig. 3 embodiment of the present invention.
The schematic diagram of supporting element clamp standoff pin in Fig. 4 embodiment of the present invention.
The upper end of supporting pin is higher than the schematic diagram of positioning disk upper surface in Fig. 5 embodiment of the present invention (jacking is upper).
The supporting surface of supporting pin is about slightly below the upper surface of positioning disk in Fig. 6 embodiment of the present invention and limiting unit is higher than positioning The schematic diagram of the upper surface of disk (jacking is the next).
The schematic diagram that positioning disk, heating plate, cover board, temperature sensibility decompose in Fig. 7 embodiment of the present invention.
The schematic diagram of temperature sensibility insertion temperature sensing hole in Fig. 8 embodiment of the present invention.
The schematic diagram that microscope carrier uses on dispensing processing unit (plant) in Fig. 9 embodiment of the present invention.
Manipulator moves into the schematic diagram above element to microscope carrier to be processed with its maintaining part in Figure 10 embodiment of the present invention.
Supporting pin decline and element bottom surface to be processed are posted by the signal of positioning disk upper surface in Figure 11 embodiment of the present invention Figure.
The schematic diagram of the positioning disk of microscope carrier and lifting body configuration in Figure 12 another embodiment of the present invention.
The schematic diagram of element to be processed and microscope carrier configuration in Figure 13 another embodiment of the present invention.
[symbol description]
A microscope carrier A1 positioning disk
A11 chase A111 stomata
A12 chase A13 gas nozzle
A14 hole A15 keeps to the side
The accommodating area A16 A161 temperature sensing hole
A162 sensing face A17 heating plate
A171 through-hole A18 cover board
A181 through-hole A19 temperature sensibility
A191 temperature-sensitive head the first fastener of A192
A193 the second fastener A2 fixing seat
A21 support frame A211 thermal insulator
A3 lifting body A31 actuator
A32 hoistable platform A33 elevating lever
A34 supporting element A341 clip slot
A35 supporting pin A351 supporting surface
A352 limiting unit A353 guiding face
B transport mechanism B1 rail chair
The gantry C gantry mechanism C1 rail gantry
C11 track C2 crossbeam
C21 movable plate C211 track
C22 beam track D glue applying mechanism
E work station F control unit
L1 First Line the second line of L2
M moving section R manipulator
R1 maintaining part S transfer section
T workbench W element to be processed
D1 distance d2 distance
A1' positioning disk A32' hoistable platform
A34' supporting element A35' supporting pin
A351' supporting surface A352' limiting unit
W' element to be processed
Specific embodiment
Fig. 1,2 are please referred to, the microscope carrier A of the embodiment of the present invention, which is equipped with, includes:
One positioning disk A1, the surface structure with rough octagon, the upper surface of positioning disk A1 are equipped with the number of annular A ring is separated by the concentric chase A11 of spacing, and is mutually in set in 90 degree of straight line chase A12, chase A11, A12 arranged in a crossed manner There are the several stomata A111 (Fig. 3) for leading to several negative pressure connector A13 positioned at the side positioning disk A1 respectively, several negative pressure connectors A13 can be operated stage by stage, make chase A11, A12 on positioning disk A1 that can gradually be segmented generation towards outside by the center positioning disk A1 negative Pressure, to be adsorbed to the carrier on positioning disk A1;Several hole A14 that quantity is three are offered on positioning disk A1, this three A hole A14 is distributed in the outboard peripheries of outermost concentric chase A11, adjacent far from another two with one of hole A14 Hole A14 and the equidistant mode of adjacent with another two hole A14 arrange, and the central point of two adjacent holes A14 is linked to be one First Line L1, with another hole A14 of a drawing-in and be parallel between the second line L2 of First Line L1 formed one have width The moving section M of d1;
One fixing seat A2, two sides are respectively provided with a support frame A21, are used to support positioning disk A1 in a fixed height;It should Support frame A21 is equipped with the thermal insulator A211 that a glass fibre is constituted, and the A15 that keeps to the side of the two sides of positioning disk A1 is pressed against respectively On thermal insulator A211;
One lifting body A3 is set on fixing seat A2 comprising driven by the actuator A31 that a vapour pressure cylinder is constituted It can make the hoistable platform A32 of up and down displacements, hoistable platform A32 is supported by the upper four elevating lever A33 of fixing seat A2;Lifting Platform A32 is equipped with several horizontal support member A34 that quantity is three, and one end is fixedly arranged on hoistable platform A32, and the other end is equipped with One supporting pin A35, the arrangement mode of supporting pin A35 correspond to the hole A14 on positioning disk A1;Please refer to Fig. 4, supporting element One end of A34, which offers clip slot A341 and can clamp supporting pin A35, to be made to be mutually perpendicular, and the upper end supporting pin A35 is equipped with one Support face A351 and one is extended the limiting unit A352 of the rough semi-circular cylindrical of protrusion, the limiting unit by the side supporting surface A351 upward A352 is equipped with a guiding face A353 tilted down towards the direction supporting surface A351, offers a detection hole on supporting pin A35 A354, the detection piece A355 that the embeddable optical fiber of one end is constituted, appear optical signal can by supporting surface A351 for detecting It whether there is carrier thereon;When hoistable platform A32 is shifted up, hoistable platform A32 link support member A34 and supporting pin A35 is shifted up together, makes the upper end supporting pin A35 that can be pierced by and be higher than the upper surface of positioning disk A1 positioning disk A1 through hole A14 (Fig. 5), and when hoistable platform A32 is to bottom offset, it is interlocked and can not had to the supporting pin A35 of bottom offset, supporting surface A351 Enter in hole A14 and be about slightly below the upper surface of positioning disk A1, but limiting unit A352 still protrude be revealed in outside hole A14 be higher than it is fixed The upper surface (Fig. 6) of position disk A1.
Please refer to Fig. 7,8, the bottom surface positioning disk A1 is recessed with the accommodating area A16 of several rectangles, is equipped in each accommodating area A16 pair The heating plate A17 answered, and accommodating area A16 can be covered equipped with a cover board A18, it is sandwiched the heating plate A17 in the A16 of accommodating area Between positioning disk A1 and cover board A18;One is recessed with as the temperature-sensitive of blind hole close to the middle accommodating area A16 in each accommodating area A16 Hole A161, heating plate A17 be equipped with a through-hole A171, cover board A18 be equipped with several through-hole A181, and temperature sensing hole A161, Through-hole A171, through-hole A181 three correspond to each other, and make the temperature-sensitive of the upper end several thermojunction types (Thermocouple) temperature sensibility A19 Head A191 sequentially drawing-in through-hole A181, through-hole A171 finally can be embedded in the temperature sensing hole A161 of each accommodating area A16 and be resisted against sense The upper end warm hole A161 sense each temperature sensibility A19 can by each heating plate A17 close to the sensing face A162 of the upper surface positioning disk A1 It is transmitted to the temperature of positioning disk A1 different zones;Temperature sensibility A19 via the first fastener A192 of a such as screw and one for example Second fastener A193 of nut is fixed on the upper end in temperature sensing hole A161.
Referring to Fig. 9, the microscope carrier A of the embodiment of the present invention can be used on dispensing processing unit (plant) as shown in the figure, the processing Device is equipped with
One workbench T, which is provided with a housing H can cover the mechanism being arranged on workbench T, which opens up There is an inlet and outlet H1, has and keep an element W drawing-in height and the width therein to be processed for a manipulator R;
One transport mechanism B is set on workbench T, and transport mechanism B, which is equipped with a rail chair B1, makes microscope carrier A can be in rail chair B1 Upper translation, microscope carrier A can a first position (one end rail chair B1) carry moved by manipulator R drawing-in inlet and outlet H1 it is one to be added Work element W, and transport the element W to be processed and carry out dispensing processing to a second position (the rough middle rail chair B1);Wherein, should Element W to be processed is frameless wafer, and element W to be processed is protected by a maintaining part R1 with width d2 of manipulator R It holds, and the width d2 of maintaining part R1 is less than the width d1 of the moving section M of the upper surface positioning disk A1, makes maintaining part R1 can not be by The interference of three supporting pin A35 and (Figure 10) is freely moved in moving section M;
One gantry mechanism C is set on workbench T, by being separated by spacing and two gantry rail gantry C1 being parallel to each other are constituted, And it is equipped with a both ends and is respectively set to the crossbeam C2 on two gantry rail gantry C1;Crossbeam C2 is vertical with gantry rail gantry C1 and flat with rail chair B1 Row, can translate on the track C11 of two gantry rail gantry C1, and crossbeam C2 is equipped with a movable plate C21 can be on beam track C22 To be parallel to the direction translation of rail chair B1;Two gantry rail gantry C1 are respectively arranged between the both ends of rail chair B1 and the two sides of housing H, machine Tool hand R below by track C1 of the height positioned at gantry rail gantry C1 with above microscope carrier A between inlet and outlet H1 enter after drawing-in again Transfer section S below the rail gantry C1 of gantry makes element W to be processed into and out microscope carrier A, makes manipulator R into and out to be added The flow path that the transfer flow path of work element W and crossbeam C2 are translated on the rail gantry C1 of gantry because be located in different level heights without by To interference;Wherein, manipulator R into and out the parallel microscope carrier A of transfer the flow path flow path and movable plate that are translated on rail chair B1 The flow path that C21 is translated on beam track C22;
One glue applying mechanism D is set on movable plate C21, and can vertically move on a track C211 of movable plate C21; Glue applying mechanism D can be driven by gantry mechanism C to treat above the microscope carrier A for being located at the second position machine component W coating fluid material or Driven by gantry mechanism C to several waits work stations E temporarily to stop including Glue dripping head contraposition, Glue dripping head cleaning, liquid material weighing ...;Its In, which is set on the workbench T of the side rail chair B1, between two gantry rail gantry C1, and it is another in rail chair B1 The workbench T of side is equipped with control unit F, can control the gas on microscope carrier A (Fig. 2) including negative pressure connector A13 and actuator A31 Body pressure.
The microscope carrier of the embodiment of the present invention and using the microscope carrier wafer transport method and processing unit (plant) on the implementation, jack The actuator A31 driving hoistable platform A32 of structure A3, which is shifted up, is pierced by the upper end supporting pin A35 higher than the positioning through hole A14 The upper surface of disk A1 simultaneously makes microscope carrier A be moved to first position (one end rail chair B1) on rail chair B1, in manipulator R drawing-in housing H Inlet and outlet H1 and gantry rail gantry C1 below space S 1 move into predeterminated position (manipulator R above element W to be processed to microscope carrier A Maintaining part R1 in moving section M, and the outer rim of element W to be processed rough is aligned in the three supporting surface A351 in lower section and limitation Between portion A352) after, manipulator R is posted by the bottom surface of element W to be processed on supporting surface A351 and limiting unit to bottom offset A352 is located at element W outer rim to be processed for limiting the horizontal displacement (Figure 10) of element W to be processed;Detection piece A355 determine to After machine component W has been placed in supporting pin A35, manipulator R removes moving section M1 and actuator A31 drives hoistable platform A32 The supporting surface A351 of supporting pin A35 is submerged in hole A14 to bottom offset and is about slightly below the upper surface of positioning disk A1, but is limited Portion A352, which still protrudes, to be revealed in outside hole A14, and the bottom surface element W to be processed can be posted by the upper surface positioning disk A1 at this time, but limit Portion A352 can still limit horizontal displacement (Figure 11) of the element W to be processed on positioning disk A1;Element W to be processed is on positioning disk A1 By the negative-pressure adsorption gradually generated by the center positioning disk A1 towards outside, it can prevent the gross area absorption from having caused warping characteristics Element W to be processed it is damaged due to suction rapidly;Positioning disk A1 is made thereon by the uniform heat transmitting of several pieces of heating plate A17 Element W to be processed can be heated, and sense the temperature of corresponding region at any time with temperature sensibility A19, with feed back to heating plate A17 into Trip temperature adjustment;
Then transported that (rail chair B1 is rough to the second position by microscope carrier A with the element W to be processed heated by positioning disk A1 absorption Middle), it is moved to glue applying mechanism D above the second position and treats machine component W progress liquid material coating;After the completion of coating to Machine component W sends first position back to through microscope carrier A again, and the supporting pin A35 rising of lifting body A3, which is shored element W to be processed and is detached from, to be determined Position disk A1 upper surface makes the maintaining part R1 of manipulator R protrude into the moving section M between two separate supporting pin A35, and to upper Element W to be processed is kept to remove manipulator R again by manipulator R after moving manipulator R element W to be processed being made to be detached from supporting pin A35;
Wherein, in embodiments of the present invention, microscope carrier A is all moved into or is moved by manipulator R in first position (one end rail chair B1) Element W (ipsilateral disengaging) to be processed out, but two inlet and outlet H1 can be also opened up on housing H in corresponding two sides, microscope carrier A can at this time It is translated between first position (one end rail chair B1) and a third place (the rail chair B1 other end), and right respectively by two groups of manipulator R Two inlet and outlet H1 are answered to be responsible for the immigration and removal of element W to be processed, microscope carrier A is carried in first position and moved by corresponding manipulator R Manipulator is then answered by another pair to the third place by glue applying mechanism D coating fluid material to the second position after the element W to be processed entered R removes element W to be processed.
The microscope carrier of the embodiment of the present invention and the wafer transport method and processing unit (plant) for using microscope carrier, with the supporting pin of rising Declining again after the element W to be processed that A35 carrying is moved by manipulator R makes the bottom surface element W to be processed be posted by the upper of positioning disk A1 Surface makes microscope carrier A that can carry the element W to be processed of simple only wafer form;And positioning disk A1 is carried in element W to be processed When upper, the limiting unit A352 of supporting pin A35 can limit the horizontal displacement of element W to be processed, can not only prevent positioning disk A1's Element W to be processed can also be translated on rail chair B1 in microscope carrier A and be removed because of the offset caused by by warpage or spring after negative pressure releases When sending element W to be processed, prevent element W to be processed from shaking and deviating on positioning disk A1;Furthermore, it is only necessary to be existed with a microscope carrier A Mobile conveying element W to be processed carries out corresponding processing to different location on rail chair B1, is not required to that multiple microscope carrier A are arranged again, The setup cost of microscope carrier A can be reduced.
Please refer to Figure 12,13, the element W' to be processed of another embodiment of the present invention be frame (Frame) form, support Part A34', which need to only change its distributing position from supporting pin A35', can correspond to different element W' outer rims to be processed;Hoistable platform A32' is equipped with several supporting element A34' that quantity is four, and one end is respectively fixedly arranged on four corners of hoistable platform A32', separately One end can clamp standoff pin A35', the arrangement mode of supporting pin A35' makes supporting pin A35' that can be distributed in the outside of positioning disk A1' Periphery, make the bottom surface of element W' frame outer rim to be processed can be posted by supporting surface A351' and limiting unit A352' be located at it is to be processed Element W' outer rim;When hoistable platform A32' is shifted up, the upper end supporting pin A35' is higher than the upper surface of positioning disk A1', and is rising The supporting surface A351' of supporting pin A35' can about be slightly below the upper surface of positioning disk A1' when dropping platform A32' to bottom offset, but limit Portion A352' is still higher than the upper surface of positioning disk A1' to limit the horizontal displacement of element W' to be processed.
The foregoing is merely illustrative of the preferred embodiments of the present invention, when that cannot be limited the scope of implementation of the present invention with this, i.e., Generally according to simple equivalent changes and modifications made by scope of the present invention patent and invention description content, all still belong to the present invention In the range of patent covers.

Claims (18)

1. a kind of microscope carrier, comprising:
One positioning disk, for carrying an element to be processed;
One fixing seat is equipped with a support frame, is used to support the positioning disk in a fixed height;
One lifting body is set in the fixing seat comprising the hoistable platform that can make up and down displacements is driven by an actuator;
The hoistable platform is equipped with several supporting elements, and one end is fixedly arranged on the hoistable platform, and the other end is equipped with a supporting pin, should Supporting pin upper end is equipped with a supporting surface and one and extends the limiting unit of protrusion upward by supporting surface side;The hoistable platform is to upper The supporting pin upper end is higher than the upper surface of the positioning disk, and support in the hoistable platform to the supporting pin after bottom offset after shifting Face can about be slightly below the upper surface of the positioning disk, but the limiting unit is still higher than the upper surface of the positioning disk.
2. microscope carrier as described in claim 1, wherein several rings that the upper surface of the positioning disk is equipped with annular are separated by the same of spacing Heart chase, it is interior to be equipped with the several stomatas for leading to several negative pressure connectors positioned at the positioning disk side respectively;It is opened on the positioning disk Equipped with several holes, which is distributed in the outboard peripheries of outermost concentric chase.
3. microscope carrier as claimed in claim 2, wherein the supporting pin is corresponding with the hole on the positioning disk, in the lifting The supporting pin upper end can be pierced by the positioning disk through the hole when platform shifts up, and the branch when the hoistable platform is to bottom offset The supporting surface of support pin can submerge in the hole, but the limiting unit is still protruded and is revealed in outside the hole.
4. microscope carrier as described in claim 1, wherein one end of each supporting element is fixedly arranged on four corners of the hoistable platform respectively On, make each supporting pin that can be distributed in the outboard peripheries of positioning disk.
5. microscope carrier as described in claim 1, wherein offer a detection hole, the embeddable detection of one end in the supporting pin Part appear signal can by the supporting surface for detecting the element to be processed on supporting surface.
6. microscope carrier as described in claim 1, wherein the bottom surface of the positioning disk is recessed with the accommodating area of several rectangles, each to accommodate It is equipped with corresponding heating plate in area, and be equipped with a cover board to cover the accommodating area, is located in the heating plate in the accommodating area Between the positioning disk and the cover board.
7. microscope carrier as claimed in claim 6, wherein the support frame is equipped with a thermal insulator, which is set to the fixing seat Two sides, which keeps to the side to be pressed against respectively in the thermal insulator.
8. microscope carrier as claimed in claim 6, wherein be recessed with a temperature sensing hole in each accommodating area, it is logical that each heating plate is equipped with one Hole, the cover board are equipped with several through-holes, three correspond to each other make several temperature sensibility upper ends temperature-sensitive head can sequentially drawing-in cover board it is logical Hole, heating plate through-hole be finally embedded in the temperature sensing hole of each accommodating area.
9. microscope carrier as claimed in claim 8, wherein each temperature-sensitive head is resisted against each temperature sensing hole upper end close to the positioning disk upper surface Sensing face.
10. a kind of wafer transport method, uses the microscope carrier as described in any claim in claim 1 to 9, comprising:
The actuator driving hoistable platform of lifting body shifts up the upper surface for making supporting pin upper end be higher than positioning disk;
So that microscope carrier is moved to a first position on a rail chair, moves into above an element to microscope carrier to be processed and preset in a manipulator Behind position, which makes that the bottom surface of the element to be processed is posted by supporting surface and restriction site is to be processed in this to bottom offset Element outer rim;
The manipulator removes and actuator drives hoistable platform so that the supporting surface of supporting pin is about slightly below positioning disk to bottom offset Upper surface makes the element bottom surface to be processed be posted by positioning disk upper surface;
Microscope carrier is set to be moved to a second position on the rail chair.
11. wafer transport method as claimed in claim 10, wherein the second position is to make to be added below a glue applying mechanism Work element is coated with by the liquid material of the glue applying mechanism.
12. a kind of processing unit (plant), comprising: to execute the wafer conveying as described in any claim in claim 10 to 11 The device of method.
13. a kind of processing unit (plant), comprising:
One workbench;
One transport mechanism is set on the workbench, which, which is equipped with a rail chair, translate a microscope carrier can on the rail chair;It should Microscope carrier is equipped with the element to be processed that a positioning disk can carry one as wafer;
One gantry mechanism is set on the workbench, by being separated by spacing and two gantry rail gantries being parallel to each other are constituted, and equipped with one Both ends are respectively set to the crossbeam in two gantry rail gantries;The crossbeam is parallel with the rail chair, can translate on the track of two gantry rail gantries, The crossbeam is equipped with the direction translation that a movable plate can be parallel to rail chair on beam track;
One glue applying mechanism is set on the movable plate, which can be driven to be added to this to microscope carrier top by the gantry mechanism Work element carries out dispensing processing.
14. processing unit (plant) as claimed in claim 13, wherein the workbench can be covered equipped with a housing and be set on the workbench The mechanism set, the housing side offer an inlet and outlet, keep the element drawing-in to be processed wherein for a manipulator.
15. processing unit (plant) as claimed in claim 14, wherein gantry rail gantry is respectively arranged on both ends and housing of the rail chair Two sides between, manipulator by height be located at gantry rail gantry track below with the microscope carrier above between the inlet and outlet into After entering, the transfer section below the rail gantry of drawing-in gantry makes the element to be processed into and out microscope carrier.
16. processing unit (plant) as claimed in claim 15, wherein the element to be processed by the manipulator into and out transfer The flow path that the flow path and the movable plate that the parallel microscope carrier of flow path translates on the rail chair translate on the beam track.
17. processing unit (plant) as claimed in claim 14, wherein the microscope carrier can be carried in a first position by the manipulator drawing-in The element to be processed that the inlet and outlet move into, and transport the element to be processed a to second position and carry out dispensing processing.
18. processing unit (plant) as claimed in claim 17, wherein the first position is one end of the rail chair, which is The rough middle of the rail chair.
CN201810921659.9A 2017-11-13 2018-08-14 Carrier, wafer conveying method using carrier, and processing apparatus Active CN109786299B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW106139212 2017-11-13
TW106139212A TWI660444B (en) 2017-11-13 2017-11-13 Carrier and wafer transfer method and processing device using carrier

Publications (2)

Publication Number Publication Date
CN109786299A true CN109786299A (en) 2019-05-21
CN109786299B CN109786299B (en) 2023-08-22

Family

ID=66496256

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810921659.9A Active CN109786299B (en) 2017-11-13 2018-08-14 Carrier, wafer conveying method using carrier, and processing apparatus

Country Status (2)

Country Link
CN (1) CN109786299B (en)
TW (1) TWI660444B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110817391A (en) * 2019-11-24 2020-02-21 湖南凯通电子有限公司 Substrate loading and unloading machine
CN111774248A (en) * 2020-07-17 2020-10-16 常州铭赛机器人科技股份有限公司 Wafer preheating mechanism and multi-station glue dispenser with same
CN112157407A (en) * 2020-09-30 2021-01-01 靖江先锋半导体科技有限公司 Wafer transmission device and base processing method
CN113814114A (en) * 2020-07-17 2021-12-21 常州铭赛机器人科技股份有限公司 Multi-station glue dispenser and glue dispensing method thereof
CN113828477A (en) * 2020-07-17 2021-12-24 常州铭赛机器人科技股份有限公司 Wafer operation platform and have its point gum machine
CN114334789A (en) * 2022-03-14 2022-04-12 宁波润华全芯微电子设备有限公司 Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101101887A (en) * 2006-07-06 2008-01-09 通用电气公司 Corrosion resistant wafer processing apparatus and method for making thereof
CN101499411A (en) * 2008-02-01 2009-08-05 东京毅力科创株式会社 Plasma processing apparatus
TW201214615A (en) * 2010-03-25 2012-04-01 Tokyo Electron Ltd Substrate mounting table
US20140302676A1 (en) * 2008-06-04 2014-10-09 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US20150258553A1 (en) * 2014-03-17 2015-09-17 SCREEN Holdings Co., Ltd. Substrate treatment method and substrate treatment apparatus
CN206301759U (en) * 2017-01-03 2017-07-04 江苏新智达新能源设备有限公司 A kind of dispensing Qu Jing die bonds mechanism of diode package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5006053B2 (en) * 2005-04-19 2012-08-22 株式会社荏原製作所 Substrate processing equipment
JP5009101B2 (en) * 2006-10-06 2012-08-22 株式会社荏原製作所 Substrate polishing equipment
KR101680751B1 (en) * 2009-02-11 2016-12-12 어플라이드 머티어리얼스, 인코포레이티드 Non-contact substrate processing

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101101887A (en) * 2006-07-06 2008-01-09 通用电气公司 Corrosion resistant wafer processing apparatus and method for making thereof
CN101499411A (en) * 2008-02-01 2009-08-05 东京毅力科创株式会社 Plasma processing apparatus
US20140302676A1 (en) * 2008-06-04 2014-10-09 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
TW201214615A (en) * 2010-03-25 2012-04-01 Tokyo Electron Ltd Substrate mounting table
US20150258553A1 (en) * 2014-03-17 2015-09-17 SCREEN Holdings Co., Ltd. Substrate treatment method and substrate treatment apparatus
CN206301759U (en) * 2017-01-03 2017-07-04 江苏新智达新能源设备有限公司 A kind of dispensing Qu Jing die bonds mechanism of diode package

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110817391A (en) * 2019-11-24 2020-02-21 湖南凯通电子有限公司 Substrate loading and unloading machine
CN111774248A (en) * 2020-07-17 2020-10-16 常州铭赛机器人科技股份有限公司 Wafer preheating mechanism and multi-station glue dispenser with same
CN113814114A (en) * 2020-07-17 2021-12-21 常州铭赛机器人科技股份有限公司 Multi-station glue dispenser and glue dispensing method thereof
CN113828477A (en) * 2020-07-17 2021-12-24 常州铭赛机器人科技股份有限公司 Wafer operation platform and have its point gum machine
WO2022012146A1 (en) * 2020-07-17 2022-01-20 常州铭赛机器人科技股份有限公司 Multi-station glue dispenser and glue dispensing method thereof
CN113814114B (en) * 2020-07-17 2024-08-09 常州铭赛机器人科技股份有限公司 Multi-station glue dispenser and glue dispensing method thereof
JP7550241B2 (en) 2020-07-17 2024-09-12 常州銘賽机器人科技股▲フン▼有限公司 Multi-position dispenser and dispensing method thereof
CN112157407A (en) * 2020-09-30 2021-01-01 靖江先锋半导体科技有限公司 Wafer transmission device and base processing method
CN114334789A (en) * 2022-03-14 2022-04-12 宁波润华全芯微电子设备有限公司 Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine

Also Published As

Publication number Publication date
CN109786299B (en) 2023-08-22
TW201919140A (en) 2019-05-16
TWI660444B (en) 2019-05-21

Similar Documents

Publication Publication Date Title
CN109786299A (en) Microscope carrier and the wafer transport method and processing unit (plant) for using microscope carrier
KR101483904B1 (en) A substrate treating method
KR101953659B1 (en) Glass plate working device and glass plate working method
CN100573818C (en) The control method of transfer mechanism in vertical heat processing apparatus and the vertical heat processing apparatus
KR101331067B1 (en) Conveyor having vertical supplying loader for brittle material substrate
JP2009126779A (en) Apparatus for laser cutting of glass substrate
KR101503119B1 (en) Transfer system
TWI688033B (en) Carrier
CN104551587A (en) Battery mounting device
CN103847216A (en) Applying jig and using method thereof
WO1996012682A1 (en) A method and apparatus in bending and tempering of a glass sheet
KR20140011472A (en) Substrate transportation device
KR930009889A (en) Device for transferring substrate
JP6327367B2 (en) Substrate transfer system
US8989899B2 (en) Transfer system
KR102371101B1 (en) Deposition apparatus
CN203046420U (en) Gluing fixture
KR20190023556A (en) Panel breaking device of brittle material substrate and panel breaking method using the same
KR101380993B1 (en) Panel mounting rack
KR101732061B1 (en) Horizontality packing apparatus
KR20180044547A (en) Vaccum suction member and lasor cutting device having the same
CN104553248B (en) adhesive tape protective layer removal device
JP5731779B2 (en) Laser processing equipment
KR101496444B1 (en) Transportation Method of Glass Substrate and Heat Treatment Apparatus using the Same
KR20170008003A (en) Suction pad

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant