CN109786299B - Carrier, wafer conveying method using carrier, and processing apparatus - Google Patents
Carrier, wafer conveying method using carrier, and processing apparatus Download PDFInfo
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- CN109786299B CN109786299B CN201810921659.9A CN201810921659A CN109786299B CN 109786299 B CN109786299 B CN 109786299B CN 201810921659 A CN201810921659 A CN 201810921659A CN 109786299 B CN109786299 B CN 109786299B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
A carrier and a wafer conveying method and a processing device using the carrier; the carrier comprises: a positioning disk for bearing the element to be processed; a supporting frame is arranged for supporting the positioning disc at a fixed height; the lifting mechanism is arranged on the fixed seat and comprises a lifting platform which is driven by a driving piece and can move up and down; the lifting platform is provided with a plurality of supporting pieces, one end of each supporting piece is fixedly arranged on the lifting platform, the other end of each supporting piece is provided with a supporting pin, and the upper end of each supporting pin is provided with a supporting surface and a limiting part which extends upwards from one side of the supporting surface and protrudes; the upper end of the supporting pin is higher than the upper surface of the positioning disc after the lifting platform moves upwards, the supporting surface of the supporting pin is slightly lower than the upper surface of the positioning disc after the lifting platform moves downwards, and the limiting part is still higher than the upper surface of the positioning disc; the wafer conveying method uses the carrier.
Description
Technical Field
The present invention relates to a carrier, a wafer conveying method using the carrier, and a processing apparatus, and more particularly, to a carrier for carrying a wafer transferred by a robot and conveying the wafer to a processing area for processing, and a wafer conveying method using the carrier, and a processing apparatus.
Background
A known processing device for dispensing a Wafer (Wafer) uses a runner to convey a component to be processed to a working area such as preheating, dispensing, and tempering … for processing or waiting, and a material box is respectively arranged at two ends of the runner for feeding and receiving, wherein the component to be processed in the material box is stored in a form of a so-called Frame (Frame), even if the Wafer is kept on a glue film in the middle of a metal Frame (refer to the component W' to be processed in fig. 13); two sides of the runner are respectively provided with a conveying belt, and each working area is provided with a corresponding lifting carrying platform below the runner, and each lifting carrying platform has the functions of negative pressure adsorption and heating and can lift relative to the runner; when the element to be processed is pushed out onto the runner by the push rod from the material box, the element to be processed is conveyed by contacting the two parallel sides of the frame with the conveying belt; when the element to be processed reaches the preheating working area, the corresponding lifting carrier can lift and adsorb the element to be processed and lift the element to be processed at the same time to separate the frame from the conveying belt, preheat and heat the wafer on the element to be processed, and after the preset time, the lifting carrier can descend to enable the element to be processed to return to the runner and be continuously conveyed to the dispensing working area; when the element to be processed reaches the dispensing working area, the corresponding lifting carrier below is lifted to adsorb and lift the element to be processed and heat the wafer on the element to be processed, then the dispensing head positioned in the dispensing working area is used for coating and processing the liquid material on the surface of the wafer, and after the coating is finished, the lifting carrier is lowered to enable the element to be processed to return to the runner and be continuously conveyed to the temperature returning working area; when the element to be processed reaches the temperature-returning working area, the corresponding lifting carrier below is lifted to adsorb and lift the element to be processed and continuously heat the wafer on the element to be processed, so that the wafer is kept in a warm state, the coated liquid material can not lose fluidity due to cooling, after the preset time, the lifting carrier is lifted down, the element to be processed returns to the runner to be continuously conveyed to the end of the runner, and finally, the element to be processed enters the material receiving box to be collected.
Disclosure of Invention
In the conventional runner type conveying method, the element to be processed can be conveyed only in a frame form, and if a metal frame is not provided, and only a pure wafer is adopted, a round wafer (see the element to be processed W in fig. 9) is not only not easy to be conveyed on conveying belts at two sides of a runner, but also easy to directly rub with the runner without being protected by the frame so as to generate fragmentation; the to-be-processed element is conveyed to each working area by the runner, and is lifted by the lifting platform to be separated from the runner and then is lowered to the return runner, so that the position of the to-be-processed element is easily deviated in the lifting and lowering process, and the to-be-processed element for liquid material coating processing in the dispensing working area is caused to have a fall between the actual liquid material coating position and the expected liquid material coating position; in addition, the heating process is required when the element to be processed reaches each working area, so that the same number of carriers are required to be arranged according to the number of the working areas, and the cost is increased.
It is therefore an object of the present invention to provide a carrier that can carry different components to be processed.
Another object of the present invention is to provide a wafer conveying method in which a component to be processed is less likely to deviate during the conveying process.
Still another object of the present invention is to provide a processing apparatus that can stably convey a component to be processed to different work areas for processing and reduce the cost of mounting a stage.
A carrier according to the object of the invention comprises: the positioning disc is used for bearing an element to be processed; the fixed seat is provided with a supporting frame and is used for supporting the positioning disc at a fixed height; the jacking mechanism is arranged on the fixed seat and comprises a lifting platform which is driven by a driving piece and can move up and down; the lifting platform is provided with a plurality of supporting pieces, one end of each supporting piece is fixedly arranged on the lifting platform, the other end of each supporting piece is provided with a supporting pin, and the upper end of each supporting pin is provided with a supporting surface and a limiting part extending upwards from one side of the supporting surface; the upper end of the supporting pin is higher than the upper surface of the positioning plate after the lifting platform moves upwards, and the supporting surface of the supporting pin is slightly lower than the upper surface of the positioning plate after the lifting platform moves downwards, but the limiting part is still higher than the upper surface of the positioning plate.
According to another aspect of the present invention, a wafer transfer method using the carrier includes: the driving piece of the jacking mechanism drives the lifting platform to move upwards so that the upper end of the supporting pin is higher than the upper surface of the positioning disc; the carrying platform is translated to a first position on a rail seat, and after a manipulator moves into a to-be-processed element to a preset position above the carrying platform, the manipulator moves downwards to enable the bottom surface of the to-be-processed element to be abutted against the supporting surface and the limiting part to be located at the outer edge of the to-be-processed element; the mechanical arm moves out, and the driving piece drives the lifting platform to downwards displace, so that the supporting surface of the supporting pin is slightly lower than the upper surface of the positioning disc, and the bottom surface of the element to be processed is abutted against the upper surface of the positioning disc; the carrier is translated to a second position on the rail seat.
A processing apparatus according to still another object of the present invention includes: apparatus for performing the wafer handling method as described.
Another processing apparatus according to still another object of the present invention includes: a working table; the conveying mechanism is arranged on the workbench and is provided with a rail seat so that a carrying platform can translate on the rail seat; the carrier is provided with a positioning disk which can bear a to-be-processed element which is a wafer; the gantry mechanism is arranged on the workbench, consists of two gantry rail frames which are separated by a distance and are parallel to each other, and is provided with a cross beam with two ends respectively arranged on the two gantry rail frames; the beam is parallel to the rail seat, and can translate on the rails of the two gantry rail frames, and a moving plate is arranged on the beam and can translate on the beam rail in a direction parallel to the rail seat; the dispensing mechanism is arranged on the moving plate and can be driven to the upper part of the carrying platform by the gantry mechanism to perform dispensing processing on the element to be processed.
According to the carrier, the wafer conveying method using the carrier and the processing device, the ascending support pins bear the element to be processed which is moved in by the manipulator and then descend, so that the bottom surface of the element to be processed is attached to the upper surface of the positioning disc, and the carrier can bear the element to be processed which is only in a wafer shape; when the element to be processed is carried on the positioning disc, the limiting part of the supporting pin can limit the horizontal displacement of the element to be processed, so that the offset of the element to be processed caused by thermal warping or bouncing after the negative pressure of the positioning disc is relieved can be prevented, and the element to be processed can be prevented from shaking on the positioning disc to offset when the carrier translates and conveys the element to be processed on the rail seat; in addition, only one carrying table is required to move and convey the element to be processed to different positions on the rail seat for corresponding processing, a plurality of carrying tables are not required to be arranged, and the arrangement cost of the carrying tables can be reduced.
Drawings
Fig. 1 is a schematic perspective view of a stage according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a positioning disc and a jacking mechanism of a carrier according to an embodiment of the present invention.
FIG. 3 is a schematic diagram of air holes in grooves in an embodiment of the present invention.
Fig. 4 is a schematic view of a support member holding a support pin in an embodiment of the present invention.
Fig. 5 is a schematic view of the upper end of the supporting pin being higher than the upper surface of the positioning plate (lifting up position) in the embodiment of the present invention.
Fig. 6 is a schematic view (lifting-up position) showing that the supporting surface of the supporting pin is slightly lower than the upper surface of the positioning plate and the limiting portion is higher than the upper surface of the positioning plate in the embodiment of the invention.
FIG. 7 is a schematic diagram showing the positioning plate, the heating plate, the cover plate and the temperature sensing element exploded in the embodiment of the invention.
FIG. 8 is a schematic diagram of a temperature sensing element embedded in a temperature sensing hole according to an embodiment of the present invention.
Fig. 9 is a schematic diagram of a stage used on a dispensing apparatus according to an embodiment of the present invention.
Fig. 10 is a schematic view of the manipulator with its holding portion moving into the component to be processed above the stage in the embodiment of the invention.
FIG. 11 is a schematic view of the embodiment of the present invention in which the supporting pins are lowered and the bottom surface of the component to be processed is abutted against the upper surface of the positioning plate.
Fig. 12 is a schematic view of a positioning disc and lifting mechanism of a carrier according to another embodiment of the present invention.
FIG. 13 is a schematic view of an arrangement of a component to be processed and a stage according to another embodiment of the present invention.
[ symbolic description ]
A1 positioning disk of A carrying platform
A11 Air hole of groove A111
A12 Air tap of groove A13
A14 Hole A15 is close to edge
A16 Accommodating area A161 temperature sensing hole
A162 Sensing surface A17 heating plate
A171 Through hole A18 cover plate
A181 Through hole A19 temperature sensing piece
A191 First fastener of temperature sensing head A192
A193 Second fastening piece A2 fixing seat
A21 Support A211 heat insulation part
A3 Climbing mechanism A31 driving piece
A32 Lifting platform A33 lifting rod
A34 Support a341 clamping groove
A35 Supporting pin A351 supporting surface
A352 Guide surface of restriction A353
B1 rail seat of B conveying mechanism
C1 gantry rail frame of C gantry mechanism
C11 Rail C2 beam
C21 Moving plate C211 track
C22 Beam rail D dispensing mechanism
E workstation F control unit
L1 first line L2 second line
M moving interval R manipulator
R1 holding unit S transfer section
T workbench W to-be-processed element
d1 Distance d2 distance
A1 'positioning disk A32' lifting platform
A34 'support A35' support pin
A351 'support surface A352' restriction
W' element to be machined
Detailed Description
Referring to fig. 1 and 2, a carrier a according to an embodiment of the present invention includes:
a positioning plate A1 with a roughly octagonal appearance structure, wherein the upper surface of the positioning plate A1 is provided with a plurality of annular concentric grooves A11 with intervals and a plurality of straight grooves A12 which are mutually crossed at ninety degrees, the grooves A11 and A12 are internally provided with a plurality of air holes A111 (figure 3) which are respectively communicated with a plurality of negative pressure joints A13 positioned at one side of the positioning plate A1, the negative pressure joints A13 can operate in stages, so that the grooves A11 and A12 on the positioning plate A1 can gradually generate negative pressure in stages from the center of the positioning plate A1 to the outside so as to absorb the bearing on the positioning plate A1; the positioning plate A1 is provided with a plurality of holes A14 with three numbers, the three holes A14 are distributed on the outer periphery of the concentric groove A11 at the outermost side, one hole A14 is far away from the other two adjacent holes A14 and is arranged in an equidistant manner with the other two adjacent holes A14, the center points of the two adjacent holes A14 are connected into a first line L1, and a moving interval M with a width d1 is formed between the first line L2 which passes through the other hole A14 and is parallel to the first line L1;
a fixing seat A2, two sides of which are respectively provided with a supporting frame A21 for supporting the positioning disk A1 at a fixed height; the support frame A21 is provided with a heat insulating piece A211 formed by glass fibers, and the leaning edges A15 at two sides of the positioning disk A1 are respectively pressed against the heat insulating piece A211;
the jacking mechanism A3 is arranged on the fixed seat A2 and comprises a lifting platform A32 which is driven by a driving piece A31 formed by a pneumatic cylinder and can move up and down, and the lifting platform A32 is supported by four lifting rods A33 on the fixed seat A2; the lifting platform A32 is provided with a plurality of horizontal supporting pieces A34 with the number of three, one end of each horizontal supporting piece A34 is fixedly arranged on the lifting platform A32, the other end of each horizontal supporting piece A is provided with a supporting pin A35, and the arrangement mode of the supporting pins A35 corresponds to the holes A14 on the positioning disc A1; referring to fig. 4, a clamping groove a341 is formed at one end of the supporting member a34, so as to clamp the supporting pin a35 to be perpendicular to each other, a supporting surface a351 and a substantially semi-cylindrical limiting portion a352 extending upward from one side of the supporting surface a351 are disposed at the upper end of the supporting pin a35, a guiding surface a353 inclined downward is disposed at the limiting portion a352 toward the supporting surface a351, a detecting hole a354 is formed on the supporting pin a35, and a detecting member a355 formed by an optical fiber is embedded at one end of the detecting hole a so that the optical signal can be transmitted from the supporting surface a351 for detecting whether the carrier exists thereon; when the lifting platform a32 moves upwards, the lifting platform a32 moves the supporting member a34 and the supporting pin a35 upwards together, so that the upper end of the supporting pin a35 can pass through the hole a14 and be higher than the upper surface of the positioning disk A1 (fig. 5), and when the lifting platform a32 moves downwards, the supporting surface a351 of the supporting pin a35 which moves downwards in a linkage manner is immersed into the hole a14 and is slightly lower than the upper surface of the positioning disk A1, but the limiting part a352 still protrudes and is exposed outside the hole a14 and is higher than the upper surface of the positioning disk A1 (fig. 6).
Referring to fig. 7 and 8, a plurality of rectangular accommodating areas a16 are concavely arranged on the bottom surface of the positioning plate A1, corresponding heating plates a17 are arranged in each accommodating area a16, and a cover plate a18 is arranged to cover the accommodating areas a16, so that the heating plates a17 in the accommodating areas a16 are clamped between the positioning plate A1 and the cover plate a 18; a temperature sensing hole A161 which is a blind hole is concavely arranged in each accommodating area A16 and is close to the middle of the accommodating area A16, a through hole A171 is arranged on the heating plate A17, a plurality of through holes A181 are arranged on the cover plate A18, the temperature sensing hole A161, the through hole A171 and the through hole A181 correspond to each other, so that a temperature sensing head A191 at the upper end of a plurality of Thermocouple temperature sensing pieces A19 can sequentially pass through the through hole A181 and the through hole A171, finally be embedded into the temperature sensing hole A161 of each accommodating area A16 and be abutted against a sensing surface A162, close to the upper surface of the positioning plate A1, of the upper end of the temperature sensing hole A161, and the temperature sensing pieces A19 can sense the temperature transmitted to different areas of the positioning plate A1 by the heating plates A17; the temperature sensing element a19 is fixed at its upper end in the temperature sensing hole a161 via a first fastener a192 such as a screw and a second fastener a193 such as a nut.
Referring to fig. 9, a carrier a according to an embodiment of the present invention may be used in a dispensing processing apparatus as shown in the drawings, where the processing apparatus includes:
a workbench T provided with a cover shell H which can cover the mechanism arranged on the workbench T, wherein one side of the cover shell H is provided with an inlet and outlet H1 which has a height and a width for a manipulator R to keep a to-be-processed element W to pass through;
a carrying mechanism B arranged on the workbench T, wherein the carrying mechanism B is provided with a rail seat B1 so that the carrying platform A can translate on the rail seat B1, the carrying platform A can bear a to-be-processed element W which is moved in by the manipulator R through the inlet and outlet H1 at a first position (one end of the rail seat B1) and carries the to-be-processed element W to a second position (approximately middle of the rail seat B1) for dispensing processing; wherein the component W to be processed is a frameless wafer, the component W to be processed is held by a holding portion R1 of the robot R having a width d2, and the width d2 of the holding portion R1 is smaller than the width d1 of the moving section M of the upper surface of the puck A1, so that the holding portion R1 can freely move in the moving section M without interference of three support pins a35 (fig. 10);
the gantry mechanism C is arranged on the workbench T and consists of two gantry rail frames C1 which are separated by a distance and are parallel to each other, and a cross beam C2 with two ends respectively arranged on the two gantry rail frames C1 is arranged; the cross beam C2 is perpendicular to the gantry rail frame C1 and parallel to the rail seat B1, and can translate on the rails C11 of the two gantry rail frames C1, and a moving plate C21 is arranged on the cross beam C2 and can translate on the cross beam rail C22 in a direction parallel to the rail seat B1; the two gantry rail frames C1 are respectively arranged between two ends of the rail seat B1 and two sides of the housing H, and the mechanical arm R passes through a transfer section S below the gantry rail frame C1 after entering from an inlet and outlet H1 with the height between the lower part of the rail C1 of the gantry rail frame C1 and the upper part of the carrier A, so that a transfer flow path for moving the mechanical arm R into or out of the to-be-processed element W and a flow path for translating the cross beam C2 on the gantry rail frame C1 are not interfered because the transfer flow path is positioned at different horizontal heights; wherein, the transfer flow path in which the manipulator R moves in or out is parallel to the flow path in which the carriage A translates on the rail seat B1 and the flow path in which the moving plate C21 translates on the beam track C22;
a dispensing mechanism D which is arranged on the moving plate C21 and can vertically move on a track C211 of the moving plate C21; the dispensing mechanism D can be driven by the gantry mechanism C to be temporarily stopped by a plurality of work stations E including dispensing head alignment, dispensing head cleaning, liquid material weighing … and the like above the carrying platform A positioned at the second position; the workstations E are disposed on the workbench T on one side of the rail seat B1 and between the two gantry rail frames C1, and a control unit F is disposed on the workbench T on the other side of the rail seat B1, which can control the gas pressure on the carrier a (fig. 2) including the negative pressure joint a13 and the driving member a 31.
In the implementation of the carrier and the wafer conveying method using the carrier and the processing device, after the driving member a31 of the lifting mechanism A3 drives the lifting platform a32 to move upwards to enable the upper end of the supporting pin a35 to pass through the hole a14 and be higher than the upper surface of the positioning plate A1 and enable the carrier a to translate on the rail seat B1 to a first position (one end of the rail seat B1), the manipulator R moves into the to-be-processed element W to a preset position above the carrier a through the inlet H1 of the housing H and the space S1 below the gantry rail frame C1 (the holding part R1 of the manipulator R is in the moving section M, and the outer edge of the to-be-processed element W is approximately aligned between the lower three supporting surfaces a351 and the limiting part a 352), and then the manipulator R moves downwards to enable the bottom surface of the to-be-processed element W to be abutted against the supporting surface a351 and the limiting part a352 to be located at the outer edge of the to-be-processed element W for limiting the horizontal displacement of the to-be-processed element W (fig. 10); after the detecting member a355 determines that the component W to be processed has been placed on the supporting pin a35, the manipulator R moves out of the movement section M1 and the driving member a31 drives the lifting platform a32 to move downward, so that the supporting surface a351 of the supporting pin a35 is immersed into the hole a14 and slightly lower than the upper surface of the positioning plate A1, but the limiting portion a352 is still protruding and exposed out of the hole a14, at this time, the bottom surface of the component W to be processed will be abutted against the upper surface of the positioning plate A1, but the limiting portion a352 can still limit the horizontal displacement of the component W to be processed on the positioning plate A1 (fig. 11); the element W to be processed is adsorbed by negative pressure gradually generated from the center of the positioning disk A1 to the outer side on the positioning disk A1, so that the element W to be processed with warping characteristic can be prevented from being damaged due to rapid suction caused by one-time full-area adsorption; the positioning disk A1 is subjected to uniform heat transfer of a plurality of heating plates A17, so that an element W to be processed on the positioning disk A1 can be heated, and the temperature of a corresponding area is sensed at any time by a temperature sensing element A19 so as to feed back to the heating plates A17 for temperature adjustment;
the element W to be processed, which is absorbed and heated by the positioning disc A1, is then conveyed to a second position (approximately in the middle of the rail seat B1) by the carrier A, so that the dispensing mechanism D moves to the position above the second position to perform liquid coating on the element W to be processed; the element W to be processed after coating is sent back to the first position through the carrying platform A, the supporting pin A35 of the jacking mechanism A3 is lifted to prop the element W to be processed to be separated from the upper surface of the positioning disk A1, the holding part R1 of the manipulator R stretches into the moving interval M between the two far supporting pins A35, the manipulator R is upwards displaced to enable the element W to be processed to be separated from the supporting pin A35, and then the element W to be processed is held by the manipulator R and is moved out of the manipulator R;
in the embodiment of the invention, the carrier a is moved into or out of the to-be-processed element W (in-side in-out) by the manipulator R at the first position (one end of the rail seat B1), but two inlets and outlets H1 may be opened on the housing H at two corresponding sides, at this time, the carrier a may translate between the first position (one end of the rail seat B1) and a third position (the other end of the rail seat B1), and the two groups of manipulators R respectively correspond to the two inlets and outlets H1 to be responsible for the movement of the to-be-processed element W, and the carrier a is applied with the liquid material by the dispensing mechanism D from the second position to the third position after carrying the to-be-processed element W moved by the manipulator R at the first position, and then moves out of the to-be-processed element W by the other manipulator R.
According to the carrying platform, the wafer carrying method using the carrying platform and the processing device, the lifting supporting pin A35 is used for carrying the element W to be processed which is moved in by the manipulator R and then descends, so that the bottom surface of the element W to be processed is attached to the upper surface of the positioning disc A1, and the carrying platform A can carry the element W to be processed which is only in the form of a wafer; when the element W to be processed is carried on the positioning disk A1, the limiting part A352 of the supporting pin A35 can limit the horizontal displacement of the element W to be processed, so that not only can the deflection of the element W to be processed caused by thermal warping or bouncing after the negative pressure of the positioning disk A1 is relieved be prevented, but also the deflection of the element W to be processed caused by shaking on the positioning disk A1 can be prevented when the carrier A translates and conveys the element W to be processed on the rail seat B1; in addition, only one carrying platform A is required to move and convey the element W to be processed on the rail seat B1 to different positions for corresponding processing, and a plurality of carrying platforms A are not required to be arranged, so that the arrangement cost of the carrying platforms A can be reduced.
Referring to fig. 12 and 13, in another embodiment of the present invention, the to-be-processed element W 'is in the form of a Frame, and the distribution positions of the supporting member a34' and the supporting pin a35 'are changed only to correspond to the outer edges of different to-be-processed elements W'; the lifting platform A32' is provided with a plurality of four supporting pieces A34', one ends of the four supporting pieces A34' are respectively fixedly arranged on four corners of the lifting platform A32', the other ends of the four supporting pieces A35' can clamp the supporting pins A35', the supporting pins A35' are arranged in a mode that the supporting pins A35' can be distributed on the periphery of the outer side of the positioning disk A1', the bottom surface of the outer edge of the frame of the element W ' to be processed can be attached to the supporting surface A351', and the limiting part A352' is positioned on the outer edge of the element W ' to be processed; the upper end of the supporting pin a35 'is higher than the upper surface of the positioning plate A1' when the elevating platform a32 'is upwardly displaced, and the supporting surface a351' of the supporting pin a35 'is slightly lower than the upper surface of the positioning plate A1' when the elevating platform a32 'is downwardly displaced, but the restriction portion a352' is still higher than the upper surface of the positioning plate A1 'to restrict the horizontal displacement of the component W' to be processed.
The foregoing description of the preferred embodiments of the invention should not be taken as limiting the scope of the invention, which is defined by the appended claims and their description, but rather by the description of the invention, as long as they are defined by the claims.
Claims (18)
1. A carrier, comprising:
the positioning disc is used for bearing an element to be processed;
the fixed seat is provided with a supporting frame and is used for supporting the positioning disc at a fixed height;
the jacking mechanism is arranged on the fixed seat and comprises a lifting platform which is driven by a driving piece and can move up and down;
the lifting platform is provided with a plurality of supporting pieces, one end of each supporting piece is fixedly arranged on the lifting platform, the other end of each supporting piece is provided with a supporting pin, and the upper end of each supporting pin is provided with a supporting surface for placing the element to be processed and a limiting part which extends upwards from one side of the supporting surface and protrudes and is positioned at the outer edge of the element to be processed; the supporting pin can move upwards along with the lifting platform until the upper end of the supporting pin is higher than the upper surface of the positioning disc; the supporting pin can move downwards along with the lifting platform until the supporting surface is lower than the upper surface of the positioning disk and the limiting part is still higher than the upper surface of the positioning disk, so that the horizontal displacement of the element to be processed loaded on the positioning disk can be limited.
2. The carrier of claim 1, wherein the upper surface of the positioning plate is provided with a plurality of concentric grooves with annular rings at intervals, and a plurality of air holes respectively leading to a plurality of negative pressure connectors at one side of the positioning plate are arranged in the concentric grooves; the locating plate is provided with a plurality of holes which are distributed on the outer periphery of the outermost concentric groove.
3. The carrier of claim 2, wherein the support pins correspond to the holes on the positioning plate, the upper ends of the support pins can pass through the holes to protrude out of the positioning plate when the lifting platform is displaced upwards, and the support surfaces of the support pins can be immersed into the holes when the lifting platform is displaced downwards, but the limiting parts still protrude and are exposed out of the holes.
4. The carrier of claim 1, wherein one end of each supporting member is respectively fixed on four corners of the lifting platform, so that each supporting pin can be distributed on the outer periphery of the positioning plate.
5. The carrier of claim 1, wherein the support pin has a test hole therein, and one end of the test hole is embedded in a test piece, so that signals can be transmitted from the support surface for testing the component to be processed on the support surface.
6. The carrier of claim 1, wherein the bottom surface of the positioning plate is concavely provided with a plurality of rectangular accommodating areas, each accommodating area is internally provided with a corresponding heating plate, and a cover plate is arranged to cover the accommodating area, so that the heating plate in the accommodating area is clamped between the positioning plate and the cover plate.
7. The carrier of claim 6, wherein the support frame is provided with a heat insulating member, the support frame is arranged at two sides of the fixing seat, and the leaning edges at two sides of the positioning plate are respectively pressed against the heat insulating member.
8. The carrier of claim 6, wherein each of the accommodating areas is concavely provided with a temperature sensing hole, each of the heating plates is provided with a through hole, the cover plate is provided with a plurality of through holes, and the three through holes correspond to each other so that the temperature sensing heads at the upper ends of the plurality of temperature sensing pieces can sequentially pass through the through holes of the cover plate and the through holes of the heating plates and finally are embedded into the temperature sensing holes of each of the accommodating areas.
9. The carrier of claim 8, wherein each of the temperature sensing heads abuts against a sensing surface of an upper end of each of the temperature sensing holes near an upper surface of the puck.
10. A wafer transfer method using the stage according to any one of claims 1 to 9, comprising:
the driving piece of the jacking mechanism drives the lifting platform to upwards displace until the upper end of the supporting pin is higher than the upper surface of the positioning disc;
moving a manipulator into the element to be processed until the bottom surface of the element to be processed is abutted against the supporting surface and the limiting part is positioned at the outer edge of the element to be processed;
the driving piece drives the lifting platform to downwards move until the supporting surface of the supporting pin is lower than the upper surface of the positioning plate and the limiting part is still higher than the upper surface of the positioning plate, so that the bottom surface of the element to be processed is abutted against the upper surface of the positioning plate and the limiting part limits the horizontal movement of the element to be processed.
11. The wafer handling method of claim 10, wherein the carrier translates from a first position to a second position on a rail seat; the carrying platform can carry the element to be processed which is moved in by the manipulator at the first position and convey the element to be processed to the second position for dispensing processing, and the second position is below a dispensing mechanism, so that the element to be processed is coated by liquid materials of the dispensing mechanism.
12. A processing apparatus comprising: apparatus for performing the wafer handling method of any one of claims 10 to 11.
13. A processing apparatus using the stage according to any one of claims 1 to 9; the processing device comprises:
a working table;
the conveying mechanism is arranged on the workbench and is provided with a rail seat so that the carrier can translate on the rail seat;
the gantry mechanism is arranged on the workbench and provided with a cross beam; the beam is parallel to the rail seat and can translate on the rails of the two gantry rail frames, and a moving plate is arranged on the beam and can translate on the beam rail in a direction parallel to the rail seat;
the dispensing mechanism is arranged on the moving plate and can be driven to the upper part of the carrying platform by the gantry mechanism to perform dispensing processing on the element to be processed.
14. The processing apparatus of claim 13, wherein the table is provided with a housing for covering the mechanism provided on the table, and an access opening is provided on one side of the housing for a robot to hold the component to be processed therethrough.
15. The processing apparatus of claim 14, wherein the gantry rail is disposed between two ends of the rail seat and two sides of the housing, respectively, and the robot moves the component to be processed into or out of the carrier through a transfer area under the gantry rail after entering from the entrance/exit located between a lower side of the rail of the gantry rail and an upper side of the carrier.
16. The processing apparatus according to claim 15, wherein the transfer path in which the component to be processed is moved in or out by the robot is parallel to the path in which the stage is translated on the rail seat and the path in which the moving plate is translated on the beam rail.
17. The processing apparatus of claim 14, wherein the carrier is configured to carry the component to be processed moved in by the robot through the access opening at a first location and to carry the component to be processed to a second location for dispensing.
18. The processing apparatus of claim 17, wherein the first position is one end of the rail seat and the second position is approximately midway of the rail seat.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106139212 | 2017-11-13 | ||
| TW106139212A TWI660444B (en) | 2017-11-13 | 2017-11-13 | Carrier and wafer transfer method and processing device using carrier |
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| CN109786299A CN109786299A (en) | 2019-05-21 |
| CN109786299B true CN109786299B (en) | 2023-08-22 |
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| CN110817391B (en) * | 2019-11-24 | 2021-09-07 | 湖南凯通电子有限公司 | Substrate loading and unloading machine |
| CN113814114A (en) * | 2020-07-17 | 2021-12-21 | 常州铭赛机器人科技股份有限公司 | Multi-station glue dispenser and glue dispensing method thereof |
| CN112157407B (en) * | 2020-09-30 | 2021-12-21 | 靖江先锋半导体科技有限公司 | Wafer transmission device and base processing method |
| CN114334789A (en) * | 2022-03-14 | 2022-04-12 | 宁波润华全芯微电子设备有限公司 | Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101101887A (en) * | 2006-07-06 | 2008-01-09 | 通用电气公司 | Corrosion resistant wafer processing apparatus and method for making thereof |
| CN101499411A (en) * | 2008-02-01 | 2009-08-05 | 东京毅力科创株式会社 | Plasma processing apparatus |
| TW201214615A (en) * | 2010-03-25 | 2012-04-01 | Tokyo Electron Ltd | Substrate mounting table |
| CN206301759U (en) * | 2017-01-03 | 2017-07-04 | 江苏新智达新能源设备有限公司 | A kind of dispensing Qu Jing die bonds mechanism of diode package |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5006053B2 (en) * | 2005-04-19 | 2012-08-22 | 株式会社荏原製作所 | Substrate processing equipment |
| JP5009101B2 (en) * | 2006-10-06 | 2012-08-22 | 株式会社荏原製作所 | Substrate polishing equipment |
| KR101958874B1 (en) * | 2008-06-04 | 2019-03-15 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
| WO2010093568A2 (en) * | 2009-02-11 | 2010-08-19 | Applied Materials, Inc. | Non-contact substrate processing |
| JP6270270B2 (en) * | 2014-03-17 | 2018-01-31 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing method and substrate processing apparatus |
-
2017
- 2017-11-13 TW TW106139212A patent/TWI660444B/en active
-
2018
- 2018-08-14 CN CN201810921659.9A patent/CN109786299B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101101887A (en) * | 2006-07-06 | 2008-01-09 | 通用电气公司 | Corrosion resistant wafer processing apparatus and method for making thereof |
| CN101499411A (en) * | 2008-02-01 | 2009-08-05 | 东京毅力科创株式会社 | Plasma processing apparatus |
| TW201214615A (en) * | 2010-03-25 | 2012-04-01 | Tokyo Electron Ltd | Substrate mounting table |
| CN206301759U (en) * | 2017-01-03 | 2017-07-04 | 江苏新智达新能源设备有限公司 | A kind of dispensing Qu Jing die bonds mechanism of diode package |
Also Published As
| Publication number | Publication date |
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| CN109786299A (en) | 2019-05-21 |
| TW201919140A (en) | 2019-05-16 |
| TWI660444B (en) | 2019-05-21 |
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