CN115954278B - Full-automatic chip cover planting equipment - Google Patents
Full-automatic chip cover planting equipment Download PDFInfo
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- CN115954278B CN115954278B CN202310244566.8A CN202310244566A CN115954278B CN 115954278 B CN115954278 B CN 115954278B CN 202310244566 A CN202310244566 A CN 202310244566A CN 115954278 B CN115954278 B CN 115954278B
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- 230000007246 mechanism Effects 0.000 claims abstract description 145
- 230000033001 locomotion Effects 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims description 71
- 239000003292 glue Substances 0.000 claims description 26
- 230000001681 protective effect Effects 0.000 claims description 25
- 230000000903 blocking effect Effects 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 abstract description 11
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- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 238000007731 hot pressing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/20—Reduction of greenhouse gas [GHG] emissions in agriculture, e.g. CO2
- Y02P60/21—Dinitrogen oxide [N2O], e.g. using aquaponics, hydroponics or efficiency measures
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Abstract
The invention discloses full-automatic chip cover planting equipment which comprises a feeding mechanism, a dispensing mechanism, a cover planting mechanism, a pressing mechanism and a discharging mechanism which are sequentially arranged. The dispensing mechanism comprises a first support and two dispensing modules, wherein in each dispensing module, the first moving frame can be connected with the first support in a relative movement manner along a first direction, the dispensing frame can be connected with the first moving frame in a relative movement manner along a second direction, and the dispensing head can be connected with the dispensing frame in a relative movement manner along an up-down direction. The cover planting mechanism comprises a second bracket and two cover planting modules, wherein in each cover planting module, the second moving frame can be connected with the second bracket in a relative movement manner along the first direction, the cover planting frame can be connected with the second moving frame in a relative movement manner along the second direction, and the cover planting head can be connected with the cover planting frame in a relative movement manner along the up-down direction. At least one computer is arranged on two sides of the shell along the first direction, and the computers on each side can control the dispensing modules on two sides and/or the cover planting modules on two sides.
Description
Technical Field
The invention relates to the technical field of electronic product processing, in particular to full-automatic chip cover planting equipment.
Background
In the production process of semiconductor devices such as chips, the chips themselves are very prone to brittle failure, and therefore, it is generally necessary to seal the chips in a material having a certain strength for protection. The general chip can be protected by plastic on the outer seal; for some chips with strong performance, the protection of the metal shell is needed, and the metal shell can play a role of heat dissipation at the same time. The device for placing and fixing the metal protective covers on the chips is called chip cover-planting device, in the prior art, a plurality of chips are placed on carriers such as a substrate, after the carriers are loaded in the chip cover-planting device, the chip cover-planting device firstly carries out integral preheating on the chips, secondly coats heat-dissipating glue on the back surfaces of the chips, thirdly places the protective covers on the chips, fourthly carries out hot pressing on the protective covers, and finally carries out blanking on the carriers and the chips. The above steps all need an independent device, so at least five devices of feeding, dispensing, cover planting, pressing and blanking are needed to be connected, and an automatic production line of the whole chip cover planting process is formed. In the existing chip cover-planting equipment, dispensing and cover-planting are two stations with more time consumption, and in order to improve the overall productivity of the equipment, the working efficiency of the two stations must be improved.
In the Chinese patent No. 218482208U, a fully automatic chip cover planting device is disclosed, wherein a plurality of glue dispensing heads are adopted for dispensing simultaneously, and a plurality of cover planting heads are adopted for cover planting simultaneously, so that the production efficiency is improved to a certain extent. However, in the device, a plurality of dispensing heads or a plurality of capping heads can only simultaneously perform dispensing or capping treatment on chips on a substrate, and the substrates still need to be transported one by one, so that improvement in efficiency improvement is still needed.
Disclosure of Invention
The utility model aims to provide full-automatic chip cover planting equipment with higher productivity aiming at the defects in the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the full-automatic chip cover planting equipment is used for placing a plant protection cover on a chip and comprises a shell, and a feeding mechanism, a glue dispensing mechanism, a cover planting mechanism, a pressing mechanism and a discharging mechanism which are sequentially arranged in the shell along the transmission direction of the chip, wherein the feeding mechanism is used for feeding the chip to be covered, the glue dispensing mechanism is used for dispensing glue on the chip, the cover planting mechanism is used for placing a protective cover on the chip, the pressing mechanism is used for pressing the protective cover on the chip, the discharging mechanism is used for discharging the chip after cover planting, the glue dispensing mechanism comprises a first bracket and two glue dispensing modules, the two glue dispensing modules are arranged at intervals along a first direction, each glue dispensing module comprises a first moving frame, a glue dispensing frame and a glue dispensing head, the first moving frame can be connected with the first bracket in a relative motion mode along the first direction, the first moving frame can be connected with the first bracket in a horizontal direction along the relative motion mode, and the second moving frame can be connected with the second glue dispensing frame in a horizontal direction along the relative motion mode along the first direction; the cover planting mechanism comprises a second bracket and two cover planting modules, the two cover planting modules are arranged at intervals along the first direction, each cover planting module comprises a second movable frame, a cover planting frame and a cover planting head, in each cover planting module, the second movable frame can be connected with the second bracket in a relative movement manner along the first direction, the cover planting frame can be connected with the second movable frame in a relative movement manner along the second direction, and the cover planting heads can be connected with the cover planting frame in a relative movement manner along the up-down direction; the chip cover planting device further comprises a control system, the control system comprises a computer, at least one computer is arranged on two sides of the shell along the first direction, the computers on each side can control the glue dispensing modules on two sides, and/or the computers on each side can control the cover planting modules on two sides.
In some embodiments, each side of the first direction of the housing is provided with a first computer, a second computer and a third computer, wherein the first computer on each side can control the feeding mechanism and the dispensing mechanism, and the first computer on each side can control the dispensing modules on both sides; the second computers on each side can control the cover planting mechanism, and the second computers on each side can control the cover planting modules on two sides; the third computer on each side can control the pressing mechanism and the blanking mechanism.
In some embodiments, each dispensing module includes a dispensing transfer rail, where the dispensing transfer rail is used to transfer the chip along the second direction, and the dispensing transfer rail is disposed below the dispensing head; each cover planting module comprises a cover planting transmission track, wherein the cover planting transmission track is used for transmitting the chips along the second direction, and the cover planting transmission track is arranged below the cover planting head.
In some embodiments, the dispensing mechanism is connected with the cover planting mechanism along the second direction, two groups of the dispensing transmission tracks are connected with two groups of the cover planting transmission tracks in a one-to-one correspondence manner, and the corresponding dispensing transmission tracks and the cover planting transmission tracks extend in a collinear manner in the transmission direction.
In some embodiments, in the dispensing mechanism, the first supports have two spaced apart along the second direction, each first support includes a first leg and a first cross beam, the first legs have at least three spaced apart along the first direction, the first cross beams extend along the first direction, the three first legs are supported on the same horizontal plane, the three first legs are supported under the first cross beams together, two ends of each first moving frame in the second direction are respectively connected with the first cross beams on the same side in a sliding manner, and each group of dispensing transmission rails sequentially passes through between two first legs of each first support; in the cover planting mechanism, the second support has two that set up along the second direction interval, every the second support all includes along second landing leg and second crossbeam, the second landing leg has along at least three that the first direction interval set up, the second crossbeam is followed the first direction extends, and three the second landing leg supports on same horizontal plane, three the second landing leg supports jointly in the below of second crossbeam, every the second direction both ends of second movable frame respectively with homonymy second crossbeam sliding connection, every group the cover planting transmission track is followed in proper order two of every between the second landing leg of second support.
In some embodiments, the chip cover mounting apparatus further includes a transfer rail for transferring the chips, each of the dispensing modules and each of the cover mounting modules includes a set of transfer rails, each set of transfer rails includes a first side rail and a second side rail, the first side rail and the second side rail respectively extend along the second direction, the first side rail and the second side rail are disposed at intervals along the first direction, the first side rail is disposed so as to be capable of moving relatively along the first direction, and each set of transfer rails further includes a spacing adjustment mechanism for driving the first side rail to move relatively along the first direction.
In some embodiments, each set of the transfer rails includes a side pusher and a stop, the side pusher being relatively movably connected to the first side rail in the first direction, the stop being relatively movably connected to the second side rail in the up-down direction, the stop being located between the first side rail and the second side rail in the first direction, the side pusher having a pushing position and a retracted position, at least a portion of the side pusher being located between the first side rail and the second side rail in the first direction when the side pusher is in the pushing position; the side pushers exit from between the first side rail and the second side rail in the first direction when the side pushers are in the retracted position.
In some embodiments, the chips are transported while stored in a carrier, the carrier having perforations over which the chips can be supported; each group of the conveying rails is provided with a lifting table between the first side rail and the second side rail, the lifting tables can be arranged in a relative motion along the up-down direction, the tops of the lifting tables are provided with bosses, the bosses can pass through the perforation holes along the up-down direction and move, the upper surfaces of the bosses are positioned in a horizontal plane, and the bosses are provided with vacuum adsorption structures.
In some embodiments, the cover planting mechanism comprises a cover planting workbench, the cover planting modules are arranged on the cover planting workbench, each cover planting module comprises a height detection assembly, the height detection assemblies comprise a first sensor and a second sensor, the first sensor is fixedly connected with the cover planting workbench, and the first sensor is used for upwards detecting the height difference H1 between a protective cover adsorbed by the cover planting head and the first sensor; the second sensor is fixedly connected with the cover planting frame, the second sensor is used for downwards detecting the height difference H2 between the chip and the second sensor, the control system calculates the height difference H3 between the protective cover and the chip according to the H1 and the H2, and the height of the cover planting head is adjusted according to the H3.
In some embodiments, the dispensing mechanism has two dispensing mechanisms disposed in sequence along a direction of transport of the chip.
In some embodiments, the cover planting mechanism has two cover planting mechanisms arranged in sequence along the transmission direction of the chip.
Due to the application of the technical scheme, the full-automatic chip cover planting device provided by the invention has the key improvement in the dispensing mechanism and the cover planting mechanism, and the two mechanisms adopt double-shaft structures: the two dispensing modules can independently operate, and the two dispensing heads can respectively dispense the chips at different positions; the two cover planting modules can independently operate, and the two cover planting heads can respectively plant the covers of the chips at different positions, so that the working efficiency of dispensing and cover planting is at least doubled. And, two point gum modules, two cover-planting modules compact structure, arrange the optimization, can not show the occupation space who increases equipment.
In addition, the full-automatic chip cover planting device is matched with an automatic control system, computers for operators to operate are arranged on two sides of the shell, the two dispensing modules and the two cover planting modules can share one set of control system respectively, the operators are only required to be arranged on one side of the device, the dispensing modules and/or the cover planting modules on two sides can be controlled simultaneously, the personnel requirements are saved, the control program is simplified, the production and operation cost is effectively saved, and the device can be flexibly placed according to the actual field conditions.
Further, the full-automatic chip cover planting device is suitable for a double-rail transmission mode, and a dispensing module and a cover planting module are correspondingly connected to process chips transmitted in a group of transmission tracks together; and two groups of transmission tracks arranged side by side can synchronously transmit two groups of chips. The whole equipment is smoothly connected in front and back, so that the serial connection of different mechanisms is facilitated, and the working efficiency is further improved. Through practical verification, the chip cover planting equipment can obviously improve the capacity of chip cover planting from 650UPH to 1200UPH and has great market application value.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description of the embodiments will be briefly described.
FIG. 1 is a schematic perspective view of a chip cover mounting apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a chip cover mounting apparatus according to the present embodiment;
fig. 3 is a schematic front view of the internal structure of the chip cover mounting apparatus in this embodiment;
fig. 4 is a schematic partial perspective view of a carrier carrying a chip after a cover is planted in the embodiment;
FIG. 5 is a schematic partial perspective view of the carrier according to the present embodiment;
FIG. 6 is a schematic partial perspective view of the dispensing mechanism of the present embodiment;
FIG. 7 is another schematic partial perspective view of the dispensing mechanism of the present embodiment;
FIG. 8 is a schematic partial perspective view of the cover planting mechanism in the present embodiment;
FIG. 9 is another partial perspective view of the cover planting mechanism according to the present embodiment;
FIG. 10 is a schematic perspective view of a cover mounting frame and a cover mounting head according to the present embodiment;
fig. 11 is a schematic perspective view of a first bracket in the present embodiment;
fig. 12 is a schematic perspective view of the first moving frame in the present embodiment;
fig. 13 is a schematic perspective view of a second bracket in the present embodiment;
fig. 14 is a schematic perspective view of a second movable frame in the present embodiment;
FIG. 15 is a schematic perspective view of the conveying track and the lifting platform in the present embodiment;
fig. 16 is a schematic perspective view of a transmission track in the present embodiment;
fig. 17 is a schematic perspective view of the lifting platform in the present embodiment;
wherein: 100. a feeding mechanism; 200. a dispensing mechanism; 300. a cover planting mechanism; 400. a pressing mechanism; 500 blanking mechanism; 600. a transmission track; 1. a carrier; 11. perforating; 12. a limiting piece; 2. a chip; 3. a protective cover; x, a first direction; y, second direction; z, up and down direction;
201. dispensing workbench; 210. a first bracket; 211. a first track; 212. a first movable seat; 213. a first leg; 214. a first cross beam; 220. a dispensing module; 221. a first moving frame; 222. a dispensing frame; 223. dispensing heads; 224. dispensing a movable seat; 230. a weighing balance;
301. A cover-planting workbench; 310. a second bracket; 311. a second wire rail; 312. a second movable seat; 313. a second leg; 314. a second cross beam; 320. a cover planting module; 321. a second moving frame; 322. a cover planting frame; 323. a cover planting head; 324. a movable seat for planting the cover; 330. a protective cover feeding mechanism;
610. a first side rail; 620. a second side rail; 630. a spacing adjustment mechanism; 631. a connecting rod; 632. adjusting the track; 640. a side pushing member; 641. a side pushing cylinder; 650. a blocking member; 660. a lifting table; 661. a boss; 662. a vacuum adsorption structure; 663. a vacuum generator; 664. a lifting driving motor; 665. a lifting bracket;
700. a housing; 710. a feeding side; 720. a blanking side;
810. a first computer; 820. a second computer; 830. a third computer;
910. a first sensor; 920. and a second sensor.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art.
Referring to fig. 1 to 5, the present embodiment provides a full-automatic chip cover mounting apparatus for mounting a plant protection cover 3 on a chip 2, wherein the protection cover 3 is made of a metal material, and can protect and dissipate heat of the high-precision chip 2. The chip cover planting device comprises a shell 700, and comprises a feeding mechanism 100, a dispensing mechanism 200, a cover planting mechanism 300, a pressing mechanism 400 and a discharging mechanism 500 which are sequentially arranged in the shell 700 along the transmission direction of a chip 2, wherein the chip 2 can sequentially pass through the mechanisms along the transmission direction. The feeding mechanism 100 is used for feeding the chip 2 to be covered, the dispensing mechanism 200 is used for dispensing on the chip 2, the cover planting mechanism 300 is used for placing the protective cover 3 on the chip 2, the pressing mechanism 400 is used for pressing the protective cover 3 and the chip 2, and the discharging mechanism 500 is used for discharging the chip 2 after cover planting.
In this embodiment, the housing 700 is substantially rectangular and extends along the second horizontal direction Y, and the feeding mechanism 100, the dispensing mechanism 200, the cover-planting mechanism 300, the pressing mechanism 400, and the discharging mechanism 500 are sequentially disposed along the second direction Y. Further, a horizontal direction perpendicular to the second direction Y is defined as a first direction X, and a direction perpendicular to the horizontal plane is defined as an up-down direction Z, so that an XYZ three-dimensional coordinate system can be constructed with reference to the housing 700, so as to facilitate description of a specific structure of the chip capping device. The two different sides of the housing 700 along the second direction Y are respectively a feeding side 710 and a discharging side 720.
In this embodiment, the chip 2 is integrally transferred along the second direction Y, along the transfer direction of the chip 2, the dispensing mechanism 200 has two sequentially arranged devices, the cover planting mechanism 300 has two sequentially arranged devices, according to actual needs, the two dispensing mechanisms 200 can be used to sequentially coat different types of glue on the chip 2, and the two cover planting mechanisms 300 can simultaneously plant the front and rear different chips 2, thereby improving the cover planting efficiency. In other embodiments, the specific number of the dispensing mechanism 200 and the cover planting mechanism 300 can be increased or decreased according to the actual requirement, which is not limited to the case of the present embodiment.
Referring to fig. 4 and 5, in the present embodiment, the chip 2 is substantially rectangular and sheet-shaped, and the chip 2 is stored in the carrier 1 and transported. The carrier 1 is flat disc-shaped, the carrier 1 is provided with through holes 11, the through holes 11 are rectangular similar to the chips 2, and the length and width dimensions of the through holes 11 are slightly smaller than those of the chips 2, so that the chips 2 can be supported above the through holes 11 by the carrier 1, and the periphery of each through hole 11 is also provided with a plurality of limiting pieces 12 for limiting each chip 2 above the corresponding through hole 11. In order to improve the transmission efficiency, each carrier 1 has a plurality of through holes 11 arranged at intervals, and the plurality of through holes 11 are preferably arranged in an array, for example, in fig. 15, 2×4 through holes 11 arranged in an array are shown, and one chip 2 can be placed above each through hole 11, so that the carrier 1 can simultaneously transmit eight chips 2. In other embodiments, the shape, number and arrangement of the through holes 11 on each carrier 1 are not limited to the above.
Referring to fig. 6 and 8, in the present embodiment, each dispensing mechanism 200 includes a first bracket 210 and two dispensing modules 220, the two dispensing modules 220 are disposed at intervals along a first direction X, and the two dispensing modules 220 can work independently. Similarly, each cover planting mechanism 300 includes a second bracket 310 and two cover planting modules 320, where the two cover planting modules 320 are disposed at intervals along the first direction X, and the two cover planting modules 320 can work independently. Referring to fig. 1 and 2, the chip cover planting device further includes a control system, where the control system includes a computer, at least one computer is respectively disposed on two sides of the housing 700 along the first direction X, and each computer on each side can control the dispensing modules 220 on two sides of the same dispensing mechanism 200, and/or each computer on each side can control the cover planting modules 320 on two sides of the same cover planting mechanism 300.
In this embodiment, each side of the first direction X of the housing 700 is provided with a first computer 810, a second computer 820 and a third computer 830, and three computers on each side are sequentially disposed outside the housing 700 along the second direction Y, so that a worker can monitor the operation condition of the chip planting cover device from the outside, and set or adjust operation parameters. Specifically, the first computer 810 on each side can control the feeding mechanism 100 and the dispensing mechanism 200, and the first computer 810 on each side can control the dispensing modules 220 on both sides of each dispensing mechanism 200; the second computer 820 on each side can control the cover planting mechanisms 300, and the second computer 820 on each side can control the cover planting modules 320 on both sides of each cover planting mechanism 300; the third computer 830 on each side can control the pressing mechanism 400 and the blanking mechanism 500. Therefore, each computer is clear in labor division, all mechanisms in the chip cover planting device can be completely controlled by three computers on any side, personnel configuration is effectively simplified, and the placement layout of the device is convenient.
Referring to fig. 6 and 7, in the present embodiment, each dispensing mechanism 200 includes a dispensing table 201, and a dispensing module 220 is disposed on the dispensing table 201. Each dispensing module 220 includes a first moving frame 221, a dispensing frame 222, and a dispensing head 223. In each dispensing module 220, the first moving frame 221 is connected to the first bracket 210 in a manner of relatively moving along the first direction X, the dispensing frame 222 is connected to the first moving frame 221 in a manner of relatively moving along the second direction Y, and the dispensing head 223 is connected to the dispensing frame 222 in a manner of relatively moving along the up-down direction Z. With further reference to fig. 11 and 12, in the present embodiment, the first brackets 210 have two spaced apart along the second direction Y, each first bracket 210 includes a first leg 213 and a first beam 214, the first leg 213 has at least three spaced apart along the first direction X, and the first beam 214 extends along the first direction X. The three first supporting legs 213 are supported on the same horizontal plane, specifically, fixedly supported on the dispensing table 201, and the three first supporting legs 213 are supported below the first cross beam 214, and two ends of each first moving frame 221 in the second direction Y are respectively connected with the first cross beams 214 on the same side in a sliding manner. In this embodiment, three first supporting legs 213 in each first bracket 210 are equidistantly arranged at intervals, each first cross beam 214 is fixedly provided with a first wire rail 211 extending along the first direction X, and each first wire rail 211 is slidably provided with two first moving bases 212, so that one end of each first moving frame 221 can be connected with a corresponding first moving base 212, and stable sliding of the first moving frame 221 on the first wire rails 211 on two sides is realized. In this embodiment, each first moving frame 221 extends along the second direction Y, and a dispensing moving seat 224 capable of sliding relatively along the second direction Y is further provided thereon, and the dispensing frame 222 is fixedly connected with the dispensing moving seat 224, so as to realize sliding of the dispensing frame 222 on the first moving frame 221. In the embodiment, the dispensing frames 222 in the two dispensing modules 220 are respectively disposed at two different sides of the first direction X, and the two dispensing modules 220 are symmetrically disposed along the first direction X, so that the two first moving frames 221 can be as close as possible along the first direction X, and the dispensing head 223 can move within a larger range. Thus, the two dispensing modules 220 can move independently in different areas on the dispensing table 201, and dispense the chips 2 at different positions, so that the two dispensing modules 220 do not affect each other. The dispensing efficiency is at least doubled.
In addition, referring to fig. 6, in the present embodiment, each dispensing module 220 includes a weighing balance 230, and along the first direction X, the weighing balance 230 is disposed on the outer side of the first bracket 210, for weighing the mass of the glue solution ejected from the dispensing head 223. Before the chip cover planting device runs each time, the control system can control the glue dispensing head 223 to move to the upper side of the corresponding weighing balance 230, spray glue solution with preset mass to the weighing balance 230, detect whether the single glue dispensing amount of the glue dispensing head 223 meets the requirement through weighing, and if deviation exists, repeatedly debug the glue dispensing head above the weighing balance 230 until the glue dispensing amount meeting the requirement is obtained, and then the glue dispensing mechanism 200 can be put into operation to ensure the glue dispensing quality.
Referring to fig. 8 to 9, in the present embodiment, the structure of the cover planting mechanism 300 is substantially the same as that of the dispensing mechanism 200. The cover planting mechanism 300 comprises a cover planting workbench 301, and cover planting modules 320 are arranged on the cover planting workbench 301, wherein each cover planting module 320 comprises a second movable frame 321, a cover planting frame 322 and a cover planting head 323. In each of the cover planting modules 320, the second movable frame 321 is connected to the second bracket 310 so as to be capable of moving relatively in the first direction X, the cover planting frame 322 is connected to the second movable frame 321 so as to be capable of moving relatively in the second direction Y, and the cover planting head 323 is connected to the cover planting frame 322 so as to be capable of moving relatively in the up-down direction Z. The main difference between the cap planting mechanism 300 and the dispensing mechanism 200 is that the cap planting head 323 and the dispensing head 223 are different in structure and function, the dispensing head 223 is used for quantitatively applying the glue solution to the designated position of the chip 2, and the cap planting head 323 can absorb the protective cover 3 and move and place the protective cover on the chip 2.
Referring to fig. 13-14, in other respects, the cover planting mechanism 300 is configured similarly to the dispensing mechanism 200: the second brackets 310 have two spaced apart along the second direction Y, each second bracket 310 including a second leg 313 and a second cross member 314, the second leg 313 having at least three spaced apart along the first direction X, the second cross member 314 extending along the first direction X. The three second leg supports 313 are on the same horizontal plane, specifically, are fixedly supported on the cover planting workbench 301, the three second leg supports 313 are jointly supported below the second cross beam 314, and two ends of each second movable frame 321 in the second direction Y are respectively connected with the second cross beams 314 on the same side in a sliding manner. In this embodiment, three second supporting legs 313 in each second bracket 310 are equidistantly arranged at intervals, each second cross beam 314 is fixedly provided with a second wire rail 311 extending along the first direction X, each second wire rail 311 is slidably provided with two second movable seats 312, and each second movable seat 312 is connected with one end of one second movable frame 321. Further, each second moving frame 321 extends along the second direction Y, and a cover moving seat 324 capable of sliding relatively along the second direction Y is further provided thereon, and the cover planting frame 322 is fixedly connected with the cover planting moving seat 324 so as to realize sliding of the cover planting frame 322 on the second moving frame 321.
In addition, referring to fig. 8, in this embodiment, each of the cover planting modules 320 includes a cover feeding mechanism 330, and the cover feeding mechanism 330 is disposed on the outer side of the cover planting table 301 along the first direction X, so as to perform feeding of the protective cover 3, which may specifically be a clip feeding mechanism or a disc feeding mechanism in the prior art, and the present invention is not limited thereto.
Referring to fig. 6 to 8, in the present embodiment, the chip cover mounting apparatus further includes a transmission track 600 for transmitting the chips 2, and each of the dispensing modules 220 and each of the cover mounting modules 320 includes a set of transmission tracks 600. For convenience of distinction, the transfer rail 600 in each dispensing module 220 is referred to as a dispensing transfer rail, and the transfer rail 600 in each cap-planting module 320 is referred to as a cap-planting transfer rail. The dispensing transmission track is used for transmitting the chip 2 along the second direction Y, and is specifically used for transmitting the carrier 1, and the dispensing transmission track is arranged below the corresponding dispensing head 223; the cover-planting transmission track is used for transmitting the chips 2 along the second direction Y, and is specifically used for transmitting the carriers 1, and is arranged below the cover-planting head 323. In this embodiment, along the second direction Y, each set of dispensing transmission tracks sequentially passes between two first legs 213 of each first bracket 210, so that the carrier 1 on the dispensing transmission track can be completely located in the moving range of the dispensing head 223; similarly, each set of the cover conveying rails sequentially passes between two second legs 313 of each second bracket 310, so that the carrier 1 on the cover conveying rail can be completely located in the movable range of the cover head 323. In this embodiment, at least one dispensing mechanism 200 is connected to one cover-planting mechanism 300 along the second direction Y, two sets of dispensing transmission tracks are connected to two sets of cover-planting transmission tracks in a one-to-one correspondence, and the corresponding dispensing transmission tracks and the cover-planting transmission tracks extend in a collinear manner. Further, in the two dispensing mechanisms 200 connected along the second direction Y, two groups of dispensing transmission tracks located at the front side and two groups of dispensing transmission tracks located at the rear side can also be connected in a one-to-one correspondence manner; in the two cover planting mechanisms 300 connected along the second direction Y, two groups of cover planting transmission rails positioned at the front side and two groups of cover planting transmission rails positioned at the rear side can also be connected in a one-to-one correspondence manner, so that the adhesive applying mechanism 200 and the cover planting mechanism 300 can both directly support the carrier 1 conveyed upstream. Furthermore, the feeding mechanism 100, the pressing mechanism 400 and the discharging mechanism 500 in the chip cover mounting apparatus may also be provided with two sets of rails disposed along the first direction X at intervals, so that the carrier 1 can always move along the second direction Y during the transmission process, and the connection is smooth. In other embodiments, since the processing speed in the feeding mechanism 100, the pressing mechanism 400 and the discharging mechanism 500 is faster, only one group of transmission tracks may be provided, and the carrier 1 may be distributed to two groups of dispensing transmission tracks before entering the dispensing mechanism 200 after being fed from the feeding mechanism 100; similarly, after the carrier 1 flows out from the two sets of cover-planting transmission tracks of the cover-planting mechanism 300, the carrier 1 can be summarized into the single-wire transmission track of the pressing mechanism 400, so that the structure of the chip cover-planting device is simplified, and the operation and maintenance cost is reduced.
As can be seen from the above, the structural arrangement of each set of dispensing and capping transfer tracks is substantially the same, and the structure of one set of transfer tracks 600 is specifically described below. Referring to fig. 15 to 17, each of the plurality of transfer rails 600 includes a first side rail 610 and a second side rail 620, the first side rail 610 and the second side rail 620 extending along a second direction Y, respectively, and the first side rail 610 and the second side rail 620 being spaced apart along a first direction X. Wherein the first side rails 610 are disposed to be capable of relative movement in the first direction X, each set of transfer rails 600 further includes a spacing adjustment mechanism 630 for driving the first side rails 610 to move relative to each other in the first direction X, so as to be adaptable to carriers 1 of different width dimensions. In this embodiment, the spacing adjustment mechanism 630 includes a link 631 and an adjustment rail 632, the link 631 and the adjustment rail 632 respectively extend along the first direction X, the link 631 can be relatively telescopically connected between the first side rail 610 and the second side rail 620, and the bottom of the first side rail 610 can be relatively slidably connected to the adjustment rail 632. Generally, the same batch of carriers 1 are the same size, so the operator need only adjust the spacing between the first side rail 610 and the second side rail 620 prior to the start-up of the apparatus, i.e., no readjustment is required during operation of the apparatus. It should be noted that, to ensure smooth transmission of the carrier 1 and reduce friction, the distance between the first side rail 610 and the second side rail 620 should be slightly larger than the width of the carrier 1.
Referring to fig. 15 to 17, in the present embodiment, each set of the transmission tracks 600 includes a side pushing member 640 and a blocking member 650. Wherein the side pushing member 640 is connected to the first side rail 610 so as to be relatively movable in the first direction X, the blocking member 650 is connected to the second side rail 620 so as to be relatively movable in the up-down direction Z, and the blocking member 650 is located between the first side rail 610 and the second side rail 620 in the first direction X. Further, the side pushing member 640 has a pushing position and a retracted position, and when the side pushing member 640 is located at the pushing position, at least a portion of the side pushing member 640 is located between the first side rail 610 and the second side rail 620 along the first direction X, so as to push the carrier 1 between the first side rail 610 and the second side rail 620 to the other side of the side pushing member 640; when the side pushers 640 are in the retracted position, the side pushers 640 exit from between the first side rail 610 and the second side rail 620 in the first direction X without affecting the transport of the carrier 1 in the second direction Y. In this embodiment, the outside of the first side rail 610 is further provided with side pushing cylinders 641 for driving the side pushing members 640 to move along the first direction X, the side pushing members 640 have two side pushing cylinders 641 arranged at intervals along the second direction Y, and the two side pushing cylinders 641 are correspondingly arranged.
Referring to fig. 15 to 17, in the present embodiment, a lifting table 660 is provided between the first side rail 610 and the second side rail 620 of each group of the conveying rails 600. The blocking member 650 is located downstream of the elevating stage 660 in the transport direction of the carrier 1. The elevating platform 660 can be arranged in a relative motion along the up-down direction Z, the top of the elevating platform 660 is provided with a boss 661, the boss 661 is rectangular and matched with the perforation 11 of the carrier 1, and the side length of the boss 661 is slightly smaller than the side length of the perforation 11, so that the boss 661 can move along the up-down direction Z through the perforation 11. The upper surface of the boss 661 is located in a horizontal plane, and the boss 661 further has a vacuum adsorption structure 662. In this embodiment, the lifting platform 660 has a plurality of bosses 661 arranged at intervals, the upper surfaces of the plurality of bosses 661 are located in the same horizontal plane, the plurality of bosses 661 are in one-to-one correspondence with the plurality of through holes 11, and the plurality of bosses 661 also have eight arranged in an array, so that when the lifting platform 660 is lifted, the eight bosses 661 can simultaneously pass through the eight through holes 11 of the carrier 1, and then simultaneously jack up the eight chips 2 above the through holes 11, so that the chips 2 are separated from the carrier 1. In this embodiment, the transmission track 600 further includes a vacuum generator 663, the vacuum generator 663 is connected with the vacuum adsorption structure 662 of each boss 661, the vacuum adsorption structure 662 is specifically an adsorption hole, and the vacuum generator 663 pumps air from the adsorption hole, so that each boss 661 can vacuum adsorb the chip 2 above the boss 661, stably lift the chip 2, and provide a standard horizontal plane support for the chip 2, so as to meet the technological requirements of dispensing and cover planting.
Referring to fig. 15 to 17, in this embodiment, each set of the transmission rails 600 includes a lifting frame 665, the lifting platform 660 is connected to the lifting frame 665 in a manner capable of moving relatively, the transmission rails 600 further include a lifting driving motor 664 for driving the lifting platform 660 to lift, and the lifting driving motor 664 and the vacuum generator 663 are connected to the lifting frame 665. In this embodiment, the carrier 1 is made of a thin plate material such as a stainless steel plate, and generates a certain bending deformation when bearing an external pressure, so that the requirement of the dispensing or capping process on the flatness cannot be met, and therefore, the dispensing or capping cannot be directly performed on the carrier 1, and a rigid standard plane needs to be provided by means of the lifting platform 660.
Referring to fig. 8 and 10, in this embodiment, in order to further improve the accuracy of the capping, each capping module 320 includes a height detection assembly, and the height detection assembly includes a first sensor 910 and a second sensor 920. The first sensor 910 is fixedly connected to the capping table 301, and the first sensor 910 is located below a movement path of the capping head 323, when the capping head 323 absorbs the protective cap 3 and moves to a position right above the first sensor 910, the first sensor 910 is configured to detect a height difference H1 between the protective cap 3 absorbed by the capping head 323 and the first sensor 910, where H1 specifically refers to a height difference between a lower surface of the protective cap 3 and a position before a calibration position of the first sensor 910. The second sensor 920 is fixedly connected with the cover planting frame 322, specifically, is fixedly arranged on the back surface of the cover planting frame 322, so that the second sensor 920 can translate in a horizontal plane along with the cover planting frame 322, but cannot lift along with the cover planting head 323, when the cover planting frame 322 moves to a position right above the chip 2, the second sensor 920 is used for downward detecting the height difference H2 between the chip 2 and the second sensor 920, and the H2 specifically refers to the height difference between the upper surface of the chip 2 lifted by the lifting platform 660 and the position before the calibration position of the second sensor 920. The control system calculates the height difference H3 between the protective cover 3 and the chip 2 according to H1 and H2, and adjusts the height of the cover planting head 323 according to H3. Specifically, given that the height of the calibration position of the first sensor 910 is H1 and the height of the calibration position of the second sensor 920 is H2, h3= (h1+h1) - (H2-H2), it should be noted that each of H1, H2 and H2 refers to a distance in the up-down direction Z. After the actual height difference H3 between the protective cover 3 and the chip 2 is calculated, the control system compares the H3 with the preset optimal height difference H3, and further performs height compensation by driving the cover planting head 323 to lift, so as to obtain an ideal cover planting effect.
In this embodiment, the working principle of each dispensing module 220 is as follows: carrier 1 carrying chip 2 enters from one side of the dispensing transfer rail and is transferred in the second direction Y until it is blocked by the raised blocking member 650, and carrier 1 is parked at a predetermined position. Then, the two side pushing members 640 simultaneously move from the avoiding position to the pushing position, so as to push the carrier 1 towards the second side rail 620, so that the carrier 1 abuts against the inner side wall of the second side rail 620, and positioning is achieved. Subsequently, the lifting platform 660 is lifted, the bosses 661 simultaneously penetrate through the through holes 11 and jack up the chips 2, and the control system can control the dispensing head 223 to sequentially dispense the glue to the chips 2 on the carrier 1. After dispensing is completed, the lifting platform 660 descends, the chip 2 falls onto the carrier 1 again, the blocking piece 650 descends, the two side pushing pieces 640 return to the avoiding position, and the dispensing transmission rail can continue to transmit the carrier 1 along the second direction Y.
Similarly, in the present embodiment, the operation principle of each capping module 320 is as follows: carrier 1 carrying chip 2 enters from one side of the cover transfer track and is transferred in the second direction Y until it is blocked by the raised blocking member 650, and carrier 1 is parked at a predetermined position. Then, the two side pushing members 640 simultaneously move from the avoiding position to the pushing position, so as to push the carrier 1 towards the second side rail 620, so that the carrier 1 abuts against the inner side wall of the second side rail 620, and positioning is achieved. Subsequently, the elevating platform 660 is raised, and the plurality of bosses 661 simultaneously pass through the through-holes 11 and jack up the plurality of chips 2. Meanwhile, the cover planting head 323 takes the material from the protective cover feeding mechanism 330, then the height detection assembly accurately measures the height difference between the protective cover 3 and the chip 2, height compensation is carried out through lifting of the cover planting head 323, the cover planting head 323 is controlled to sequentially plant the cover to the chip 2 on the carrier 1, and after the protective cover 3 is placed on the chip 2 at a specified position, the cover planting head 323 can also carry out attaching pre-pressing, so that positioning of the protective cover 3 and the chip 2 is facilitated. In this embodiment, each of the implanting heads 323 is provided with a pressure sensor (not shown in the drawings), and can detect and record the pressing force of each of the protecting caps 3 against the chip 2. If the abnormal condition exists, the alarm can be timely processed. After the cover is planted, the lifting platform 660 descends, the chip 2 falls onto the carrier 1 again, the blocking piece 650 descends, the two side pushing pieces 640 return to the avoiding position, and the dispensing transmission rail can continue to transmit the carrier 1 along the second direction Y.
In this embodiment, the operation modes of the dispensing modules 220 at two sides in the first direction X are identical, the operation modes of the cover-planting modules 320 at two sides are identical, and the dispensing modules 220 and the cover-planting modules 320 can operate independently and are not interfered with each other, and are controlled by the same control system. Two groups of transmission tracks 600 are respectively arranged in each dispensing mechanism 200 and the cover planting mechanism 300 side by side, so that the two groups of transmission tracks are conveniently connected with different upstream and downstream mechanisms in series, and the condition that one set of control system controls a plurality of dispensing mechanisms 200 and cover planting mechanisms 300 is satisfied. In the chip cover-planting equipment, actions among different modules and different mechanisms are more coordinated, and the arrangement of a control system, a height detection assembly and the like is more conducive to improving cover-planting precision, and meanwhile, the working efficiency is remarkably improved, so that the production benefit is improved.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (9)
1. The utility model provides a full-automatic chip plants lid equipment for put plant protection lid on the chip, the chip plants lid equipment includes the casing, and follows the direction of transmission of chip sets gradually feed mechanism in the casing, point gum machine constructs, plants lid mechanism, pressing mechanism and unloading mechanism, wherein, feed mechanism is used for treating to plant the lid the chip carries out the material loading, point gum machine constructs is used for the chip is last to be glued, plant lid machine constructs be used for with the visor is put on the chip, pressing mechanism is used for with the visor with the chip pressfitting, unloading mechanism is used for to plant behind the lid the chip carries out unloading, its characterized in that:
The dispensing mechanism comprises a first bracket and two dispensing modules, wherein the two dispensing modules are arranged at intervals along a first direction, each dispensing module comprises a first moving frame, a dispensing frame and a dispensing head, each dispensing module is connected with the first bracket in a manner of relative movement along the first direction, the dispensing frame can be connected with the first moving frame in a manner of relative movement along a second direction, the dispensing heads can be connected with the dispensing frame in a manner of relative movement along the up-down direction, each dispensing module comprises a dispensing transmission track, the dispensing transmission track is used for transmitting the chip along the second direction, and the dispensing transmission tracks are arranged below the dispensing heads, wherein the first direction and the second direction extend along the horizontal direction respectively, and the first direction and the second direction are mutually perpendicular;
the cover planting mechanism comprises a second bracket and two cover planting modules, the two cover planting modules are arranged at intervals along the first direction, each cover planting module comprises a second movable frame, a cover planting frame and a cover planting head, in each cover planting module, the second movable frame can be connected with the second bracket in a relative movement manner along the first direction, the cover planting frame can be connected with the second movable frame in a relative movement manner along the second direction, and the cover planting heads can be connected with the cover planting frame in a relative movement manner along the up-down direction; each cover planting module comprises a cover planting transmission track, wherein the cover planting transmission tracks are used for transmitting the chips along the second direction, and the cover planting transmission tracks are arranged below the cover planting heads;
The chip cover planting device further comprises a control system, the control system comprises a computer, at least one computer is arranged on two sides of the shell along the first direction, the computers on each side can control the glue dispensing modules on two sides, and/or the computers on each side can control the cover planting modules on two sides.
2. The fully automatic chip cover mounting apparatus according to claim 1, wherein: each side of the shell in the first direction is provided with a first computer, a second computer and a third computer, wherein the first computer on each side can control the feeding mechanism and the dispensing mechanism, and the first computer on each side can control the dispensing modules on both sides; the second computers on each side can control the cover planting mechanism, and the second computers on each side can control the cover planting modules on two sides; the third computer on each side can control the pressing mechanism and the blanking mechanism.
3. The fully automatic chip cover mounting apparatus according to claim 1, wherein: the dispensing mechanism is connected with the cover planting mechanism along the second direction, two groups of dispensing transmission tracks are connected with two groups of cover planting transmission tracks in one-to-one correspondence, and the corresponding dispensing transmission tracks and the transmission directions of the cover planting transmission tracks extend in a collinear manner.
4. The fully automatic chip cover mounting apparatus according to claim 1, wherein: in the dispensing mechanism, the first brackets are provided with two first support legs and a first cross beam, wherein the two first support legs are arranged at intervals along the second direction, each first support leg is provided with at least three first support legs which are arranged at intervals along the first direction, the first cross beams extend along the first direction, the three first support legs are supported on the same horizontal plane, the three first support legs are supported below the first cross beams together, two end parts of each first movable frame in the second direction are respectively connected with the first cross beams on the same side in a sliding manner, and each group of dispensing transmission rails sequentially pass through between two first support legs of each first bracket;
in the cover planting mechanism, the second support has two that set up along the second direction interval, every the second support all includes along second landing leg and second crossbeam, the second landing leg has along at least three that the first direction interval set up, the second crossbeam is followed the first direction extends, and three the second landing leg supports on same horizontal plane, three the second landing leg supports jointly in the below of second crossbeam, every the second direction both ends of second movable frame respectively with homonymy second crossbeam sliding connection, every group the cover planting transmission track is followed in proper order two of every between the second landing leg of second support.
5. The fully automatic chip cover mounting apparatus according to claim 1, wherein: the dispensing transmission tracks and the cover planting transmission tracks are transmission tracks, each group of transmission tracks comprises a first side rail and a second side rail, the first side rail and the second side rail respectively extend along the second direction, the first side rail and the second side rail are arranged at intervals along the first direction, the first side rail can be arranged along the first direction in a relative motion manner, and each group of transmission tracks further comprises a spacing adjustment mechanism for driving the first side rail to move along the first direction in a relative motion manner.
6. The fully automatic chip cover mounting apparatus according to claim 5, wherein: each group of the transmission rails comprises a side pushing member and a blocking member, the side pushing members are connected with the first side rail in a relatively movable manner along the first direction, the blocking members are connected with the second side rail in a relatively movable manner along the up-down direction, the blocking members are positioned between the first side rail and the second side rail along the first direction, the side pushing members have pushing positions and avoiding positions, and when the side pushing members are positioned at the pushing positions, at least part of the side pushing members are positioned between the first side rail and the second side rail along the first direction; the side pushers exit from between the first side rail and the second side rail in the first direction when the side pushers are in the retracted position.
7. The fully automatic chip cover mounting apparatus according to claim 5, wherein: the chips are stored and transported in a carrier, the carrier is provided with a through hole, and the chips can be supported above the through hole; each group of the conveying rails is provided with a lifting table between the first side rail and the second side rail, the lifting tables can be arranged in a relative motion along the up-down direction, the tops of the lifting tables are provided with bosses, the bosses can pass through the perforation holes along the up-down direction and move, the upper surfaces of the bosses are positioned in a horizontal plane, and the bosses are provided with vacuum adsorption structures.
8. The fully automatic chip cover mounting apparatus according to claim 1, wherein: the cover planting mechanism comprises a cover planting workbench, cover planting modules are arranged on the cover planting workbench, each cover planting module comprises a height detection assembly, each height detection assembly comprises a first sensor and a second sensor, the first sensors are fixedly connected with the cover planting workbench, and the first sensors are used for upwards detecting the height difference H1 between a protective cover adsorbed by a cover planting head and the first sensors; the second sensor is fixedly connected with the cover planting frame, the second sensor is used for downwards detecting the height difference H2 between the chip and the second sensor, the control system calculates the height difference H3 between the protective cover and the chip according to the H1 and the H2, and the height of the cover planting head is adjusted according to the H3.
9. The fully automatic chip capping device according to any one of claims 1 to 8, wherein: the dispensing mechanism is provided with two sequentially arranged dispensing mechanisms along the transmission direction of the chip; and/or, along the transmission direction of the chip, the cover planting mechanism is provided with two cover planting mechanisms which are sequentially arranged.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310244566.8A CN115954278B (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
| CN202310850174.6A CN116798881A (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310244566.8A CN115954278B (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
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| CN202310850174.6A Division CN116798881A (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
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| CN115954278A CN115954278A (en) | 2023-04-11 |
| CN115954278B true CN115954278B (en) | 2023-06-13 |
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| CN202310850174.6A Pending CN116798881A (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
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| CN110013946A (en) * | 2019-04-29 | 2019-07-16 | 佛山隆深机器人有限公司 | A kind of double-station automatic gluing production line |
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| CN107961951A (en) * | 2017-12-30 | 2018-04-27 | 昆山希盟自动化科技有限公司 | Semi-automatic boss double-station dispenser |
| CN208627695U (en) * | 2018-05-29 | 2019-03-22 | 深圳市倍斯特科技股份有限公司 | Point glue equipment with two point rubber moulding group |
| CN109482430A (en) * | 2019-01-22 | 2019-03-19 | 深圳市诺峰光电设备有限公司 | A kind of full-automatic double track dispenser and its gluing process |
| CN218482208U (en) * | 2022-10-31 | 2023-02-14 | 昆山鸿仕达智能科技股份有限公司 | Full-automatic chip cap planting equipment |
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| CN110013946A (en) * | 2019-04-29 | 2019-07-16 | 佛山隆深机器人有限公司 | A kind of double-station automatic gluing production line |
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