CN210607219U

CN210607219U - Wafer carrier capable of accommodating wafers of various sizes

Info

Publication number: CN210607219U
Application number: CN201922106915.1U
Authority: CN
Inventors: 罗涛
Original assignee: Chengdu Hiwafer Technology Co Ltd
Current assignee: Chengdu Hiwafer Technology Co Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-05-22
Anticipated expiration: 2029-11-29

Abstract

The utility model discloses a can hold wafer carrier of multiple size, it includes that base and the high different wafer of multiunit bear the mechanism, and multiunit wafer bears the mechanism and uses the axle center of base to form the diffusion setting outward as the axial. The wafer carrier can enable wet single-wafer rotary processing equipment to carry wafers with two different sizes of 150mm and 156mm, improves the utilization rate of the equipment, reduces the production and manufacturing cost, and reduces the abrasion to the equipment caused by long-term replacement of the wafer carrier; the wafer carrier is mainly made of PTFE materials resistant to high temperature, strong acid and strong alkali. The processing can be scaled up and down according to the size of a specific wafer to adapt to wafers with different sizes, and materials can be selected from different materials according to different processes.

Description

Wafer carrier capable of accommodating wafers of various sizes

Technical Field

The utility model relates to a semiconductor manufacturing equipment technical field especially relates to a can hold wafer carrier of multiple size.

Background

In some wet processes, a single wafer spin processing tool is used, and the wafer to be produced is transferred by the tool arm and placed on the wafer carrier of the tool into the process chamber to complete the corresponding process. Currently, in the integrated circuit manufacturing industry, the mainstream wafer size is 4 inches, 6 inches, 8 inches, 12 inches; for example, in a 6-inch gallium arsenide integrated circuit manufacturing process, a 150mm gallium arsenide wafer needs to be bonded (bonding) to a 156mm sapphire substrate, and the bonded wafer is changed from 150mm to 156 mm. In order to meet the production requirement of 156mm gallium arsenide wafers, part of equipment manufacturers customize equipment into 156mm wafer production equipment or provide 150mm and 156mm wafer carriers, and perform the same process processing on the 150mm and 156mm wafers, if two types of equipment capable of respectively accommodating the 150mm and 156mm wafers are purchased, the production and manufacturing cost and the use of human resources are greatly increased; if 150mm and 156mm wafer carriers are purchased, the clamp can be frequently replaced in the equipment processing cavity for a long time, the hardware of the equipment is greatly abraded, the service life of the equipment is shortened, the use of human resources is increased, the utilization rate of the equipment is reduced, and the cleanliness of the processing cavity is reduced.

Therefore, if a carrier which is compatible with 150mm and 156mm wafers can be provided, the production and manufacturing cost can be greatly reduced, the abrasion to equipment caused by long-term replacement of the wafer carrier can be reduced, the use of human resources can be reduced, and the utilization rate of the equipment can be effectively improved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's is not enough, provides a wafer carrier that can hold multiple size, the wafer that can compatible multiple size, has solved present carrier can not compatible multiple size wafer and the problem that leads to.

The purpose of the utility model is realized through the following technical scheme: a wafer carrier capable of accommodating wafers of various sizes comprises a base and a plurality of groups of wafer bearing mechanisms with different heights, wherein the plurality of groups of wafer bearing mechanisms are arranged in a diffusion mode by taking the axis of the base as the axial direction.

Furthermore, the wafer bearing mechanism comprises a first wafer bearing mechanism and a second wafer bearing mechanism; the second wafer carrying mechanism is arranged outside the first wafer carrying mechanism.

Further, the first wafer bearing structure comprises a plurality of first screws and a plurality of second screws, the first screws and the second screws are both installed on the base, and the second screws are installed on the outer side of the first screws which are farther away from the axis of the base.

Further, the first screws enclose a circular structure with a diameter smaller than that of the first-size wafer to serve as a supporting structure for the bottom of the first-size wafer.

Furthermore, the second screws form a circular structure with the diameter larger than that of the first-size wafer to serve as a fixing structure of the edge of the first-size wafer.

Further, the second wafer bearing mechanism comprises a plurality of second screws and a plurality of third screws, the second screws and the third screws are both installed on the base, and the third screws are installed on the outer side of the second screws which are farther away from the axis of the base.

Further, the second screws form a circular structure with the diameter smaller than that of the second-size wafer to serve as a supporting structure for the bottom of the second-size wafer.

Furthermore, a round structure with the diameter larger than that of the second-size wafer is defined by the third screws to serve as a fixing structure of the edge of the second-size wafer.

Further, the height of the first screw is smaller than that of the second screw, and the height of the second screw is smaller than that of the third screw.

Further, the center of the base is designed to be a hollow frame structure.

The utility model has the advantages that: a wafer carrier capable of accommodating wafers of various sizes can enable wet single-wafer rotary processing equipment to carry wafers of various sizes (such as 150mm and 156mm disclosed in the embodiment), improve the utilization rate of the equipment, reduce the production and manufacturing cost and reduce the abrasion of the equipment caused by long-term replacement of the wafer carrier; the processing can be scaled up and down according to the size of a specific wafer to adapt to wafers with different sizes, and materials can be selected from different materials according to different processes. In addition, the wafer carrier is mainly made of PTFE materials resistant to high temperature, strong acid and strong alkali.

Drawings

FIG. 1 is a block diagram of the present invention;

FIG. 2 is a diagram of the position distribution of the screws of the present invention;

in the figure, 1-base, 2-first screw, 3-second screw, 4-third screw, 5-screw hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the utility model is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element to which the term refers must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The technical solution of the present invention is described in further detail below with reference to the accompanying drawings, but the scope of the present invention is not limited to the following description.

As shown in FIG. 1, a wafer carrier capable of accommodating wafers of various sizes comprises a base 1 and a plurality of groups of wafer carrying mechanisms with different heights, wherein the groups of wafer carrying mechanisms are arranged in a diffusion manner by taking the axis of the base 1 as the axial outside.

Further, the center of the base 1 is designed to be a hollow frame structure, which can ensure that the nozzles in the process chamber can effectively spray, clean or etch the front and back of the wafer.

The wafer bearing mechanism comprises a first wafer bearing mechanism and a second wafer bearing mechanism; the second wafer carrying mechanism is arranged outside the first wafer carrying mechanism.

The first wafer bearing structure comprises a plurality of first screws 2 and a plurality of second screws 3, wherein the first screws 2 and the second screws 3 are both arranged on the base 1, and the second screws 3 are arranged on the outer side of the first screws 2 which are farther away from the axis of the base 1.

The first screws 2 enclose a circular structure with a diameter smaller than that of the first-size wafer to serve as a supporting structure for the bottom of the first-size wafer.

The second screws 3 enclose a circular structure with a diameter larger than that of the first-size wafer to serve as a fixing structure of the edge of the first-size wafer.

The second wafer bearing mechanism comprises a plurality of second screws 3 and a plurality of third screws 4, the second screws 3 and the third screws 4 are both installed on the base 1, and the third screws 4 are installed on the outer side of the second screws 3 which are farther away from the axis of the base 1.

The second screws 3 enclose a circular structure with the diameter equal to or smaller than that of the second-size wafer to serve as a supporting structure for the bottom of the second-size wafer.

And a plurality of third screws 4 surround a circular structure with the diameter larger than that of the second-size wafer to be used as a fixing structure of the edge of the second-size wafer.

The height of the first screw 2 is smaller than that of the second screw 3, and the height of the second screw 3 is smaller than that of the third screw 4.

Further, the wafer carrier base 1 has a diameter of 225mm ± 0.5mm, a height: 80mm plus or minus 0.5 mm. The three sets of screw threads are of the same size and are matched with threaded holes in the wafer carrier base.

The first screw 2 has a length of 14.5mm ± 0.2mm, and a maximum diameter: 7mm +/-0.2 mm. The length of the second screw 3 is 20mm +/-0.2 mm, and the maximum diameter: 7mm +/-0.2 mm. The length of the third screw 4 is 26mm +/-0.2 mm, and the maximum diameter: 7mm +/-0.2 mm.

As shown in fig. 2, three screw positions on the wafer carrier base disc are symmetrical up and down and left and right, 8 first screws 2 can be distributed on a circle with a diameter of 143mm, and the angle positions are respectively 35 °, 65 °, 115 °, 145 °, 215 °, 245 °, 295 °, 325 °, and the tolerance is ± 0.1 °; 12 second screws 3 are distributed on a circle with the diameter of 152.5mm, the angle positions are respectively 30 degrees, 45 degrees, 60 degrees, 120 degrees, 135 degrees, 150 degrees, 210 degrees, 225 degrees, 240 degrees, 300 degrees, 315 degrees and 330 degrees, the tolerance is +/-0.1 degrees, 8 third screws 4 are distributed on a circle with the diameter of 158.5mm, the angle positions are respectively 35 degrees, 65 degrees, 115 degrees, 145 degrees, 215 degrees, 245 degrees, 295 degrees and 325 degrees, and the tolerance is +/-0.1 degrees; the positions of the three screws may be 30 °, 60 ° or 90 °, specifically, the number of screws is uniformly distributed within 360 °, which is only described as an example and is not limited to a position distribution.

In another embodiment of the present invention, a plurality of screw holes 5 are further provided on the base 1, the screw holes 5 are provided at the periphery of the third screws 4, and fourth screws are installed on the screw holes 5; the height of the fourth screw is greater than that of the third screw 4, and the third round bearing mechanism is formed by a plurality of fourth screws and a plurality of third screws 4. Through the arrangement of the third wafer bearing mechanism, the wafer carrier can simultaneously and compatibly bear the wafer with larger size.

Further, the diameter of the first size wafer is 150mm, and the diameter of the second size wafer is 156 mm; the wafer carrier may also be scaled to accommodate different sized wafers according to the size of the particular wafer.

Further, the base 1, the first screw 2, the second screw 3, the third screw 4 and the fourth screw are all made of PTFE materials, and the PTFE materials are smooth and low in hardness, so that the edge of the wafer can be effectively protected from being lost; and the PTFE material has the advantages of high temperature resistance, low temperature resistance, weather resistance, high smoothness, strong plasticity, no adhesion, no toxicity and good electrical insulation. The PTFE material can be used at-190-250 ℃, allows quick cooling and heating or alternate cooling and heating operation, has high stability and is not easy to generate dirt particles.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A wafer carrier capable of accommodating a plurality of sizes, comprising: the wafer bearing device comprises a base (1) and a plurality of groups of wafer bearing mechanisms with different heights, wherein the plurality of groups of wafer bearing mechanisms are arranged in a diffusion mode by taking the axis of the base (1) as the axial direction.

2. A wafer carrier as claimed in claim 1 capable of accommodating a plurality of sizes of wafers, wherein: the wafer bearing mechanism comprises a first wafer bearing mechanism and a second wafer bearing mechanism; the second wafer carrying mechanism is arranged outside the first wafer carrying mechanism.

3. A wafer carrier as claimed in claim 2 capable of accommodating a plurality of sizes of wafers, wherein: the first wafer bearing structure comprises a plurality of first screws (2) and a plurality of second screws (3), wherein the first screws (2) and the second screws (3) are both installed on the base (1), and the second screws (3) are installed on the outer side of the first screws (2) farther away from the axis of the base (1).

4. A wafer carrier as claimed in claim 3 capable of accommodating multiple sizes of wafers, wherein: the first screws (2) form a circular structure with the diameter smaller than that of the first-size wafer in a surrounding mode and serve as a supporting structure for the bottom of the first-size wafer.

5. A wafer carrier as claimed in claim 3 capable of accommodating multiple sizes of wafers, wherein: the second screws (3) form a circular structure with the diameter larger than that of the first-size wafer in a surrounding mode and serve as a fixing structure of the edge of the first-size wafer.

6. A wafer carrier as claimed in claim 3 capable of accommodating multiple sizes of wafers, wherein: the second wafer bearing mechanism comprises a plurality of second screws (3) and a plurality of third screws (4), the second screws (3) and the third screws (4) are both installed on the base (1), and the third screws (4) are installed on the outer side of the second screws (3) farther away from the axis of the base (1).

7. A wafer carrier as claimed in claim 6, capable of accommodating a plurality of sizes of wafers, wherein: the second screws (3) form a circular structure with the diameter smaller than that of the second-size wafer in a surrounding mode and serve as a supporting structure for the bottom of the second-size wafer.

8. A wafer carrier as claimed in claim 6, capable of accommodating a plurality of sizes of wafers, wherein: and a plurality of third screws (4) surround to form a circular structure with the diameter larger than that of the second-size wafer to serve as a fixing structure of the edge of the second-size wafer.

9. A wafer carrier as claimed in claim 6, capable of accommodating a plurality of sizes of wafers, wherein: the height of the first screw (2) is smaller than that of the second screw (3), and the height of the second screw (3) is smaller than that of the third screw (4).

10. A wafer carrier as claimed in any one of claims 1 to 9 capable of accommodating a plurality of sizes of wafers, wherein: the center of the base (1) is designed into a hollow frame structure.