CN216311737U

CN216311737U - Wafer carrier compatible with 4 and 6-inch wafers

Info

Publication number: CN216311737U
Application number: CN202123210237.7U
Authority: CN
Inventors: 罗涛
Original assignee: Chengdu Hiwafer Technology Co Ltd
Current assignee: Chengdu Hiwafer Technology Co Ltd
Priority date: 2021-12-20
Filing date: 2021-12-20
Publication date: 2022-04-15
Anticipated expiration: 2031-12-20

Abstract

The utility model discloses a wafer carrier compatible with 4 and 6 inch wafers, which comprises a base and a plurality of groups of wafer bearing mechanisms with different heights, wherein each wafer bearing mechanism comprises a first wafer bearing mechanism and a second wafer bearing mechanism, the second wafer bearing mechanism is arranged at the outer side of the first wafer bearing mechanism, and the overall height of the second wafer bearing mechanism is higher than that of the first wafer bearing mechanism. The utility model can enable the wet single-wafer rotary processing equipment to carry wafers with two different sizes of 100mm and 150mm, improves the utilization rate of the equipment, reduces the production and manufacturing cost and reduces the abrasion to the equipment caused by long-term replacement of a wafer carrier; the wafer carrier is mainly made of SUS304 material which is high temperature resistant and strong organic matter resistant. The processing can be scaled up and down according to the size of a specific wafer to adapt to wafers with different sizes, and materials can be selected from different materials according to different processes.

Description

Wafer carrier compatible with 4 and 6-inch wafers

Technical Field

The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a wafer carrier compatible with 4 and 6 inch wafers.

Background

In some wet processes, a single wafer spin processing tool is used, and the wafer to be produced is transferred by the tool arm and placed on the wafer carrier of the tool into the process chamber to complete the corresponding process. Currently, in the integrated circuit manufacturing industry, the mainstream wafer size is 4 inches, 6 inches, 8 inches, 12 inches; for example, in the manufacturing process of 4-inch gallium arsenide and gallium nitride integrated circuits, 6-inch wafers need to be manufactured compatibly due to industrial upgrading, a 6-inch production line needs to be established, if two types of equipment capable of accommodating 100mm and 150 mm-sized wafers are purchased, the clamp needs to be replaced in the equipment processing cavity for a long time and frequently, great abrasion is caused to part of hardware of the equipment, the service life of the equipment is shortened, the utilization rate of the equipment is reduced, the cleanliness of the processing cavity is reduced, and the production and manufacturing cost and the use of human resources are greatly increased.

Therefore, if a carrier which is compatible with 100mm and 150mm wafers is available, the production and manufacturing cost is greatly reduced, the abrasion to equipment caused by long-term replacement of the wafer carrier is reduced, the use of human resources is reduced, and the utilization rate of the equipment can be effectively improved.

SUMMERY OF THE UTILITY MODEL

In the gan ic manufacturing process, due to the industrial upgrade, in order to avoid the long-term frequent replacement of wafer carriers with different sizes, which is required to be compatible with 4-inch and 6-inch wafers, the inventor applied for patent CN210607219U in 11 months in 2019, which discloses a wafer carrier capable of accommodating multiple sizes, which includes a base and multiple sets of wafer carrying mechanisms with different heights, and the multiple sets of wafer carrying mechanisms are diffusion-shaped axially outward from the axis of the base. However, the device carries wafers with two different sizes of 150mm and 156mm, so as to solve the problem that in the manufacturing process of the 6-inch gallium arsenide integrated circuit, in order to meet the production requirement, the equipment needs to be customized into 156mm wafer production equipment or a 150mm and 156mm wafer carrier needs to be provided, so that the clamp needs to be replaced for a long time and frequently. Currently, no wafer carrier is seen that is compatible with both 4 inch and 6 inch wafers.

The utility model aims to overcome the defects of the prior art, provides a wafer carrier compatible with 4 and 6 inches of wafers, can be compatible with 100mm and 150mm wafers, and solves the problem caused by the fact that the conventional carrier cannot be compatible with wafers of various sizes.

The purpose of the utility model is realized by the following technical scheme: a wafer carrier compatible with 4 and 6 inch wafers comprises a base and a plurality of groups of wafer bearing mechanisms with different heights, wherein each wafer bearing mechanism comprises a first wafer bearing mechanism and a second wafer bearing mechanism, the second wafer bearing mechanism is arranged on the outer side of the first wafer bearing mechanism, and the overall height of the second wafer bearing mechanism is higher than that of the first wafer bearing mechanism.

Further, the second wafer bearing mechanism comprises a plurality of third screws and a plurality of fourth screws, the third screws and the fourth screws are both installed on the base, and the fourth screws are installed on the outer side of the third screws which are farther away from the axis of the base.

Further, the third screws form a circular structure with the diameter smaller than that of the second-size wafer to serve as a supporting structure for the bottom of the second-size wafer.

Furthermore, a round structure with the diameter larger than that of the second-size wafer is surrounded by the plurality of fourth screws and used as a fixing structure of the edge of the second-size wafer.

Furthermore, the multiple groups of wafer bearing mechanisms with different heights are arranged in a diffusion mode by taking the axis of the base as the axial direction.

Further, the first wafer bearing structure comprises a plurality of first screws and a plurality of second screws, the first screws and the second screws are both installed on the base, and the second screws are installed on the outer side of the first screws which are farther away from the axis of the base.

Further, the first screws enclose a circular structure with a diameter smaller than that of the first-size wafer to serve as a supporting structure for the bottom of the first-size wafer.

Furthermore, the second screws form a circular structure with the diameter larger than that of the first-size wafer to serve as a fixing structure of the edge of the first-size wafer.

The first screw and the third screw are respectively used for supporting 4-inch wafers and 6-inch wafers, the angle of the first screw and the third screw is set to enable the wafer to be uniformly supported, and the wafers cannot be tilted when being subjected to stamping force from each angle above.

The second screw (3) and the fourth screw (5) have the functions of fixing 4 inches and 6 inches of wafers respectively, the semi-cone structure at the top of the semi-cone structure can offset the movement error generated in the process of transmitting the wafers by a mechanical arm, when the movement error is generated, the vacuum adsorption is closed, and the wafers slide downwards to the correct positions along the cone structure at the tops of the screws under the action of gravity.

The angle setting purpose of the first screw, the second screw, the third screw and the fourth screw is that enough width needs to be reserved in four directions, so that the mechanical arm can normally take and place the wafer. The first screw is lower in height than the second screw, and the third screw is lower in height than the fourth screw.

Furthermore, the center of the base is designed into a hollow frame structure, and the center of the base and the base is designed into the hollow frame structure, so that the overall quality is reduced and the motor movement load is reduced on the premise of not influencing the stability of the overall structure.

Further, the inner side edge of the base is concave-convex or circular.

In the utility model, the fact that the overall height of the second wafer bearing mechanism is higher than that of the first wafer bearing mechanism means that a third screw in the second wafer bearing mechanism is higher than a second screw in the first wafer bearing mechanism.

The utility model has the beneficial effects that: a wafer carrier compatible with 4 and 6-inch wafers can enable wet single-wafer rotary processing equipment to carry various wafers with different sizes, such as 100mm and 150mm disclosed in the embodiment, the utilization rate of the equipment is improved, the production and manufacturing cost is reduced, and the abrasion to the equipment caused by long-term replacement of the wafer carrier is reduced; the processing can be scaled up and down according to the size of a specific wafer to adapt to wafers with different sizes, and materials can be selected from different materials according to different processes. In addition, the wafer carrier is mainly made of PTFE materials resistant to high temperature, strong acid and strong alkali.

Drawings

FIG. 1 is a block diagram of the present invention;

FIG. 2 is a dimensional view of the screw of the present invention;

FIG. 3 is a position distribution diagram of the screw according to the present invention;

FIG. 4 is a schematic view of the placement of a 6-inch wafer according to the present invention.

In fig. 1, 1-base, 2-first screw, 3-second screw, 4-third screw, 5-fourth screw, 6-screw hole; in FIG. 4, 8-6 inches wafer;

in FIG. 2, A is a first screw, B is a second screw, C: third screw, D: fourth screw, E: fifth screw, F: a base.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings or orientations or positional relationships that are conventionally placed when the products of the present invention are used, and are only used for convenience of description and simplification of description, but do not indicate or imply that the devices or elements indicated must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The technical solutions of the present invention are further described in detail below with reference to the accompanying drawings, but the scope of the present invention is not limited to the following.

As shown in fig. 1, a wafer carrier capable of accommodating wafers of various sizes includes a base 1 and a plurality of groups of wafer carrying mechanisms with different heights, where the wafer carrying mechanism includes a first wafer carrying mechanism and a second wafer carrying mechanism, the second wafer carrying mechanism is disposed outside the first wafer carrying mechanism, and the overall height of the second wafer carrying mechanism is higher than that of the first wafer carrying mechanism.

The second wafer bearing mechanism comprises a plurality of third screws 4 and a plurality of fourth screws 5, wherein the third screws 4 and the fourth screws 5 are both arranged on the base 1, and the fourth screws 5 are arranged on the outer side of the third screws 4 which are farther away from the axis of the base 1.

In the utility model, a round structure with the diameter smaller than that of the second-size wafer is formed by a plurality of third screws 4 in a surrounding mode and serves as a supporting structure of the bottom of the second-size wafer, and a round structure with the diameter larger than that of the second-size wafer is formed by a plurality of fourth screws 5 in a surrounding mode and serves as a fixing structure of the edge of the second-size wafer.

The multiple groups of wafer bearing mechanisms with different heights are arranged in a diffusion mode by taking the axis of the base 1 as the axial direction.

The first wafer bearing structure comprises a plurality of first screws 2 and a plurality of second screws 3, wherein the first screws 2 and the second screws 3 are both arranged on a base 1, and the second screws 3 are arranged on the outer side of the first screws 2 which are farther away from the axis of the base 1.

A plurality of first screws 2 form a circular structure with the diameter smaller than that of the first-size wafer in a surrounding mode and serve as a supporting structure for the bottom of the first-size wafer; the second screws 3 enclose a circular structure with a diameter larger than that of the first-size wafer to serve as a fixing structure of the edge of the first-size wafer.

The first screw 2 and the third screw 4 are respectively used for supporting 4-inch wafers and 6-inch wafers, the angle setting aims to enable the wafer supporting stress to be uniform, and the wafers cannot be tilted when being subjected to stamping force from each angle above.

The second screw 3 and the fourth screw 5 have the functions of fixing 4-inch and 6-inch wafers respectively, the semi-cone structure at the top of the semi-cone structure can offset the movement error generated in the process of transmitting the wafers by a mechanical arm, when the movement error is generated, the vacuum adsorption is closed, and the wafers slide downwards to the correct positions along the cone structure at the tops of the screws under the action of gravity.

The angles of the first screw 2, the second screw 3, the third screw 4 and the fourth screw 5 are set to reserve enough width in four directions, so that the robot arm can normally pick and place the wafer.

As shown in fig. 4, when the wafer 8 is placed on the second wafer carrying mechanism, the third screws 4 serve as supports for the 6-inch wafer 8, and the fourth screws 5 serve to fix the 6-inch wafer 8.

Further, the center of the base 1 is designed to be a hollow frame structure, so that the overall quality can be reduced on the premise of not influencing the stability of the overall structure, and the motion load of the motor is reduced.

Further, the inner side edge of the base 1 is concave-convex.

As shown in FIG. 2, the diameter of the wafer carrier base 1 of the present invention is 222mm + -0.1 mm, and the height: 80mm plus or minus 0.1 mm. The three sets of screw threads are of the same size and are matched with threaded holes in the wafer carrier base.

The length of the first screw 2 is 13mm +/-0.1 mm, and the maximum diameter: 4.5mm + -0.1 mm. The length of the second screw 3 is 17mm +/-0.1 mm, and the maximum diameter: 5mm +/-0.1 mm. The length of the third screw 4 is 18mm +/-0.1 mm, and the maximum diameter: 4.5mm + -0.1 mm. The length of the fourth screw 5 is 23mm +/-0.1 mm, and the maximum diameter: 5mm +/-0.1 mm.

As shown in fig. 3, four screw positions on the wafer carrier base disc are symmetrical up and down and left and right, 4 first screws 2 can be distributed on a circle with the diameter of 92mm, and the angle positions are respectively 0 °, 90 °, 180 ° and 270 °, and the tolerance is +/-0.1 °; the 4 second screws 3 are distributed on a circle with the diameter of 106mm, the angle positions are respectively 0 degrees, 90 degrees, 180 degrees and 270 degrees, and the tolerance is +/-0.1 degree, the 8 third screws 4 are distributed on a circle with the diameter of 142mm, the angle positions are respectively 20 degrees, 70 degrees, 110 degrees, 160 degrees, 200 degrees, 250 degrees, 290 degrees, 340 degrees, the tolerance is +/-0.1 degree, the 8 fourth screws 5 are distributed on a circle with the diameter of 156mm, and the angle positions are respectively 20 degrees, 70 degrees, 110 degrees, 160 degrees, 200 degrees, 250 degrees, 290 degrees, 340 degrees, and the tolerance is +/-0.1 degree; the positions of the four screws may be 30 °, 60 ° or 90 °, specifically, the number of screws is uniformly distributed within 360 °, which is only described as an example and is not limited to a position distribution.

In another embodiment of the present invention, a plurality of screw holes 6 are further disposed on the base 1, the screw holes 6 are disposed on the periphery of the fourth screw 5, and a fifth screw is mounted on the screw holes 6; the height of the fifth screw is greater than that of the fourth screw 5, and the fifth screws are connected with the fixed base 1 and the base 7, so that the whole assembly of the wafer carrier is realized.

Further, the diameter of the first size wafer is 100mm, and the diameter of the second size wafer is 150 mm; the wafer carrier may also be scaled to accommodate different sized wafers depending on the size of the particular wafer.

Further, the base 1, the first screw 2, the second screw 3, the third screw 4, the fourth screw 5, the fifth screw 6 and the base 7 are all made of PTFE materials, and the PTFE materials are smooth and have low hardness, so that the edge of the wafer can be effectively protected from being lost; and the PTFE material has the advantages of high temperature resistance, low temperature resistance, weather resistance, high smoothness, strong plasticity, no adhesion, no toxicity and good electrical insulation. The PTFE material can be used at-190-250 ℃, allows quick cooling and heating or alternate cooling and heating operation, has high stability and is not easy to generate dirt particles.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A wafer carrier compatible with 4, 6-inch wafers comprises a base (1) and a plurality of groups of wafer bearing mechanisms with different heights, wherein each wafer bearing mechanism comprises a first wafer bearing mechanism and a second wafer bearing mechanism, and is characterized in that: the second wafer bearing mechanism is arranged at the outer side of the first wafer bearing mechanism, and the overall height of the second wafer bearing mechanism is higher than that of the first wafer bearing mechanism.

2. The wafer carrier of claim 1, wherein: the second wafer bearing mechanism comprises a plurality of third screws (4) and a plurality of fourth screws (5), the third screws (4) and the fourth screws (5) are both installed on the base (1), and the fourth screws (5) are installed on the outer side of the third screws (4) farther away from the axis of the base (1).

3. A wafer carrier as claimed in claim 2 wherein: and a plurality of third screws (4) surround to form a circular structure with the diameter smaller than that of the second-size wafer to serve as a supporting structure of the bottom of the second-size wafer.

4. A wafer carrier as claimed in claim 2 wherein: and a plurality of fourth screws (5) surround to form a circular structure with the diameter larger than that of the second-size wafer to serve as a fixing structure of the edge of the second-size wafer.

5. The wafer carrier of claim 1, wherein: the multiple groups of wafer bearing mechanisms with different heights are arranged in a diffusion mode by taking the axis of the base (1) as the axial direction.

6. The wafer carrier of claim 1, wherein: the first wafer bearing structure comprises a plurality of first screws (2) and a plurality of second screws (3), wherein the first screws (2) and the second screws (3) are both installed on the base (1), and the second screws (3) are installed on the outer side of the first screws (2) farther away from the axis of the base (1).

7. A wafer carrier as claimed in claim 6, wherein: the first screws (2) form a circular structure with the diameter smaller than that of the first-size wafer in a surrounding mode and serve as a supporting structure for the bottom of the first-size wafer.

8. A wafer carrier as claimed in claim 6, wherein: the second screws (3) form a circular structure with the diameter larger than that of the first-size wafer in a surrounding mode and serve as a fixing structure of the edge of the first-size wafer.

9. The wafer carrier of claim 1, wherein: the center of the base (1) is designed to be a hollow frame structure.

10. The wafer carrier of claim 1, wherein: the inner side edge of the base (1) is concave-convex or circular.