CN202384308U - Carrier adapter used for semiconductor wafer disposition - Google Patents
Carrier adapter used for semiconductor wafer disposition Download PDFInfo
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- CN202384308U CN202384308U CN2011202481050U CN201120248105U CN202384308U CN 202384308 U CN202384308 U CN 202384308U CN 2011202481050 U CN2011202481050 U CN 2011202481050U CN 201120248105 U CN201120248105 U CN 201120248105U CN 202384308 U CN202384308 U CN 202384308U
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Abstract
The utility model relates to a carrier adapter used for the semiconductor wafer disposition. A carrier plate is provided, and the carrier plate is configured to dispose and process semiconductor substrate wafers which are small in diameter in a semiconductor processing device which is used for combining semiconductor substrate wafers which are big in diameter. The carrier plate can dispose five or fourteen wafers which are small in diameter in a 300mm wafer system at the same time. Some embodiments can further include a grip plate which is connected with the carrier plate. The substrate wafers are clamped between the two plates.
Description
Technical field
The utility model relates to semiconductor applications, more particularly, relates to and is used for the carrier adapter that semiconductor wafer is disposed.
Background technology
Usually semiconductor manufacturing facility is designed to handle the semiconductor wafer of 300mm or 200mm.Usually for example the first-class article of semiconductor processes chamber, disposal facility, gate valve and spray are designed to adapt to the wafer of nominal size for 300mm or 200mm.Diameter still can use this equipment to handle less than the substrate of 300mm or 200mm, but for example possibly reconfigure or change some assemblies such as disposal facility, to adapt to the less substrate of size.
For instance, in some special fabrication processes such as technology that for example is used for producing some light-emitting diode (LED), possibly use less substrate.
This type of replacing or to reconfigure to adapt to less substrate size possibly be expensive, and individually handle smaller substrate and possibly cause unwanted reactant waste, and the not full load operation of semiconductor manufacturing facility.This paper describes the equipment that allows to be used for 300mm or 200mm substrate design and comes to dispose simultaneously and handle the carrier adapter less than a plurality of substrate wafers of 300mm or 200mm.
Summary of the invention
Can be usually embodiment be described as being used for size has the semiconductor wafer of nominal diameter with processing through design the substrate carrier adapter of semiconductor processing equipment.Said substrate carrier adapter can comprise circular substantially base plate.Circular substantially base plate can comprise the circular dimple of a plurality of cardinal principles on a side, and can have roughly identical with nominal diameter diameter.In certain embodiments, nominal diameter can be 11.811 " (300mm).Substantially circular base plate can by about 99% or the aluminium oxide of 99% above purity process.Some embodiment also can comprise recess in the outward flange of circular substantially base plate.
The circular dimple of cardinal principle can center on the mode arrangement of the center of circular substantially base plate with one or more cardinal principle radial symmetric.In certain embodiments, circular substantially dimple also can comprise the molding centre hole, and it passes circular substantially base plate.In certain embodiments, each substantially can be positioned at apart from the center about 3.6 of circular substantially base plate at the center of circular dimple " distance.Some embodiment can comprise five circular substantially dimples, and diameter separately is about 4 ".In certain embodiments, the degree of depth of circular dimple is about 0.017 substantially ", and the thickness of circular base plate is about 0.08 substantially ".In some other embodiment, the carrier adapter can comprise five circular substantially dimples, and diameter separately is about 3.9 ".In certain embodiments, the degree of depth of circular dimple is about 0.007 substantially ", and the thickness of circular base plate is about 0.05 substantially ".
In certain embodiments; The carrier adapter also can comprise circular substantially grip block; The diameter of the grip block that wherein said cardinal principle is circular is roughly the same with the diameter of the base plate of cardinal principle circle; And substantially circular grip block comprises the circular through hole of a plurality of cardinal principles, corresponding in the dimple of the cardinal principle circle in each circular substantially through hole and the circular substantially base plate.
In some further embodiment, circular substantially grip block is through being configured to be installed to circular substantially base plate.Make that the base plate of circular substantially grip block and cardinal principle circle is concentric, and make circular substantially through hole concentric substantially with the dimple of the pairing cardinal principle circle of the through hole of said cardinal principle circle separately.Circular substantially grip block can further comprise a plurality of installation through holes separately with circular substantially base plate; The installation through holes that wherein is contained in the substantially circular base plate can be aimed at the installation through holes in being contained in circular substantially grip block, and be contained in the diameter of the installation through holes in the circular substantially base plate can be greater than the diameter of the installation through holes in the grip block that is contained in circle substantially.
In the depression on the side of the base plate of the cardinal principle circle that the side that comprises circular substantially dimple of the base plate that in certain embodiments, each installation through holes in said a plurality of installation through holes can end at and cardinal principle is circular is relative.Each depression can have circular substantially profile, and it has from circular one or more the outstanding anti-rotational features of profile of said cardinal principle.In certain embodiments; The diameter of the profile that said cardinal principle is circular is about 0.25 "; and said one or more anti-rotational features can comprise the slit that the length with semi-circular ends is about 0.36 " and width is about 0.1 "; and in the heart, the diameter of each installation through holes in the circular substantially base plate is about 0.16 in circular substantially profile at the center of wherein said slit ", and the degree of depth of each depression is 0.02 ".
In some other embodiment; Installation through holes can be placed between each dimple to adjacent cardinal principle circle in the circular substantially base plate; And center about 4.5 apart from circular substantially base plate ", and installation through holes can roughly be placed in the center of circular substantially base plate.
In certain embodiments; The carrier adapter can comprise a plurality of installation pads, and wherein said installation pad comprises the first with first thickness and first diameter, and the second portion with second thickness and second diameter; Said second diameter is concentric and greater than first diameter with first diameter; Said first and said second portion are contiguous, and said installation pad comprises cardinal principle semi-circular cut-out relative on two diameters in second portion, and the installation pad comprises with threaded hole.In certain embodiments; First thickness is about 0.02 ", first diameter is about 0.15 ", second thickness is about 0.025 "; second diameter is about 0.24 "; Cardinal principle semi-circular cut-out diameter separately relative on the diameter is about 0.1 ", and with the Center Gap of second portion about 0.125 ", and the said 000-120UNF through hole concentric with first that can be with threaded hole.The carrier adapter also can comprise a plurality of screws, and the thread size of wherein said screw is corresponding with thread size with threaded hole.
In certain embodiments, circular substantially grip block can be made of aluminum with the installation pad.For instance, circular substantially grip block can be processed by 5052 aluminium, and pad is installed can be processed by 7075 aluminium.Screw can be processed by stainless steel.
In some other embodiment, the diameter of circular dimple is about 2.45 substantially ", and the substrate carrier adapter can comprise 14 circular substantially dimples.In certain embodiments, the degree of depth of circular dimple is about 0.01 substantially ", and the thickness of circular base plate is about 0.6 substantially ".In certain embodiments, in the circular dimple of said cardinal principle ten can with the center of circular substantially base plate roughly at interval 4.5 ", and in the circular dimple of said cardinal principle four can with the center of circular substantially base plate roughly at interval 1.85 ".
Description of drawings
Figure 1A describes the plane graph through an embodiment of the carrier board that is configured to admit five substrates.
Figure 1B describes the close up view of the recess in the outward flange of carrier board of Figure 1A.
Fig. 1 C describes the isometric view of the carrier board of Figure 1A.
Fig. 1 D describes to combine the plane graph of the sectional fixture that the carrier board of Figure 1A uses.
Fig. 1 E describes to combine the end view of the sectional fixture that the carrier board of Figure 1A uses.
Fig. 1 F describes to combine the isometric view of the sectional fixture that the carrier board of Figure 1A uses.
The end view of the sectional fixture of Fig. 1 G depiction 1D and the carrier board of Figure 1A, wherein carrier board squints from sectional fixture.
The isometric view of the sectional fixture of Fig. 1 H depiction 1D and the carrier board of Figure 1A, wherein carrier board squints from sectional fixture.
The end view of the sectional fixture of Fig. 1 I depiction 1D and the carrier board of Figure 1A, wherein carrier board is held on the sectional fixture, and wafer is risen by stripper pin and leaves.
The isometric view of the sectional fixture of Fig. 1 J depiction 1D and the carrier board of Figure 1A, wherein carrier board is held on the sectional fixture, and wafer is risen by stripper pin and leaves.
Fig. 2 A describes the plane graph through an embodiment of the carrier board that is configured to admit five substrates.
The rear side of the carrier board of being described among Fig. 2 B depiction 2A.
The isometric view of the carrier board of being described among Fig. 2 C depiction 2A.
Fig. 2 D describes the isometric view like the rear side of the carrier board of being described among Fig. 2 B.
Fig. 2 E describes the plane graph through the grip block that is configured to be coupled to the carrier board of being described among Fig. 2 A.
The isometric view of the grip block of being described among Fig. 2 F depiction 2E.
Fig. 2 G describes the isometric view like the rear side of the grip block of being described among Fig. 2 F.
Fig. 2 H describes to combine the plane graph of the installation pad that the carrier board described among Fig. 2 A uses.
Fig. 2 I describes to combine the end view of the installation pad that the carrier board described among Fig. 2 A uses.
Fig. 2 J describes to combine the isometric view of the installation pad that the carrier board described among Fig. 2 A uses.
Fig. 2 K describes the isometric view like the rear side of the installation pad of being described among Fig. 2 J.
Fig. 2 L describes through the carrier board of combination and the isometric view of grip block.
Fig. 2 M is with the carrier board of the warp combination of decomposed form depiction 2L and the isometric view of grip block.
Fig. 2 N describe to be installed to anchor clamps Fig. 2 L through the carrier board of combination and the isometric view of grip block.
Fig. 2 O describe to be installed to anchor clamps Fig. 2 L through the carrier board of combination and the equidistance decomposition view of grip block.
The isometric view of the anchor clamps of Fig. 2 P depiction 2N.
Fig. 2 Q describes to have the isometric view of Fig. 2 H to the anchor clamps of Fig. 2 P of the installation pad of Fig. 2 K.
Fig. 2 R describes to have the isometric view of Fig. 2 A to the anchor clamps of Fig. 2 N of the carrier board of Fig. 2 D.
Fig. 2 S describes to have Fig. 2 A to the carrier board of Fig. 2 D and the isometric view of anchor clamps of Fig. 2 N of five substrate wafers is installed.
Fig. 2 T describes to be equipped with the isometric view of Fig. 2 A to the carrier board of Fig. 2 D, five substrate wafers and Fig. 2 E to the anchor clamps of Fig. 2 N of the grip block of Fig. 2 G.
Fig. 2 U describes to be installed in the equidistance detail view of the installation pad on the anchor clamps of Fig. 2 N.
Fig. 3 A describes through being configured to combine the plane graph of the carrier adapter that 14 small chips use.
The isometric view of the carrier adapter of Fig. 3 B depiction 3A.
Fig. 4 A describes through being configured to combine the plane graph of the carrier adapter that 14 small chips use.
The detail view of the part of the circular dimple of the cardinal principle of the carrier adapter of Fig. 4 B depiction 4A.
The isometric view of the carrier adapter of Fig. 4 C depiction 4A.
Embodiment
The instance of various embodiment is explained in the accompanying drawings and is further described hereinafter.To understand, the argumentation of this paper is limited to described specific embodiment with appended claims unintentionally.On the contrary, the argumentation of this paper is intended to contain and can be contained in like substituting in the spirit and scope of the present invention that defined by appended claims, modification and equipollent.In following description content, state that a large amount of details are so that provide complete understanding of the present invention.Can under the situation of the some or all of details in not having these details, put into practice the present invention.In other cases, do not describe well-known technological operation as yet in detail, so that can blur the present invention necessarily.
It should be understood that in this document and use a technical term that " circular substantially " indicate shape to be roughly circular structure.This can comprise the polygon with a plurality of limits, for example has 16,20 or the regular polygon of other number face.Substantially circular structure also can comprise and depart from the characteristic of circular contour substantially, for example recess, platform, outstanding etc.Should be understood that use " circular substantially " refers to the structure that can comprise this slightly little non-circular character or aspect, and refer to positive circular configuration.
Figure 1A describes through being configured to combine an embodiment of the carrier adapter that five small-sized substrates use to Fig. 1 C.As can see in Figure 1A and Fig. 1 C that carrier adapter 100 comprises circular substantially base plate 110, its size design becomes to have the diameter roughly the same with the 300mm wafer.Circular substantially base plate 110 can be processed by aluminium oxide (aluminium oxide that for example has 99.5% purity).Circular substantially base plate 110 can comprise the circular dimple 120 of a plurality of cardinal principles in a side.But circular substantially base plate 110 also comprises recess 140 on its outer edges, to be used for that carrier adapter 100 is positioned at clamping plate (seeing that Fig. 1 D is to Fig. 1 F and Fig. 1 J); Figure 1B describes the detail view of recess 140.Each circular substantially dimple 120 can comprise stripper pin hole 130, and it passes completely through circular substantially base plate 110.
In certain embodiments, the thickness of circular base plate 110 can be 0.080 substantially ", and diameter can be 11.811 " (300mm).Circular substantially base plate 110 can comprise (for example) five circular substantially dimples 120.Said five circular substantially dimples 120 can be centered in apart from the center 3.600 of circular substantially base plate 110 separately " to be located, and arranges with the radial manner of equi-spaced apart.The diameter of the dimple 120 that each cardinal principle is circular is about 3.980 ", and the degree of depth is 0.017 ".The diameter in stripper pin hole 130 is about 0.080 ", be centered in apart from the center about 1.700 of circular substantially base plate 110 and " locate, and be positioned at identical position, angle with circular substantially dimple 120.
In some other embodiment, the thickness of circular base plate 110 can be 0.080 substantially ", and diameter can be 11.811 " (300mm).Circular substantially base plate 110 can comprise (for example) five circular substantially dimples 120.Said five circular substantially dimples 120 can be centered in apart from the center 3.600 of circular substantially base plate 110 separately " to be located, and arranges with the radial manner of equi-spaced apart.The diameter of the dimple 120 that each cardinal principle is circular is about 3.952 ", and the degree of depth is 0.028 ".The diameter in stripper pin hole 130 is about 0.080 ", be centered in apart from the center about 1.700 of circular substantially base plate 110 and " locate, and be positioned at identical position, angle with circular substantially dimple 120.
Figure 1A can combine Fig. 1 D to use to the anchor clamps shown in Fig. 1 F 150 to the carrier adapter 100 shown in Fig. 1 C.Anchor clamps 150 can comprise smooth substantially installation surface, and it at one end has from its outstanding crooked shoulder 170.The big I of crooked shoulder 170 is designed to the radius that radius is a bit larger tham circular substantially carrier board 110.Locator push rod 160 can be situated between with the recess 140 on the circular carrier board 110 of cardinal principle and connect, and is used to guarantee that carrier adapter 100 is in the position, correct angle on the anchor clamps 150.Stripper pin 180 can be outstanding from anchor clamps 150.Like Fig. 1 G to shown in Fig. 1 J; When carrier adapter 100 being positioned over 150 last times of anchor clamps; Stripper pin 180 can pass stripper pin hole 130; And with substrate wafer 190 engagements that are positioned in the substantially circular dimple 120, and substrate wafer 190 is tilted at an angle with respect to the bottom of circular substantially dimple 120.This allow vacuum rods disposal facilities such as (not shown) for example insert substrate wafer 120 below, to remove/to install substrate wafer 190.Carrier adapter 100 is removed from anchor clamps 150, and simultaneously substrate wafer 190 is in the appropriate location, causes stripper pin 180 to pass stripper pin hole 130 and withdraws, and cause substrate wafer 190 to slope downwardly in the circular substantially dimple 120.
For example Figure 1A can be highly suitable for disposing sapphire (the being aluminium oxide) backing material that at high temperature has good dimensional stability to the carrier adapters such as carrier adapter shown in Fig. 1 C.
Fig. 2 A describes through being configured to combine another embodiment of the carrier adapter that five small-sized substrates use to Fig. 2 T.Fig. 2 A and Fig. 2 C describe circular substantially base plate 210, and its size design is to have the diameter roughly the same with the 300mm wafer.Circular substantially base plate 210 can be processed by aluminium oxide (being aluminium oxide).Circular substantially base plate 210 can comprise the circular dimple 220 of a plurality of cardinal principles in a side.But circular substantially base plate 210 also comprises recess 240 on its outer edges, to be used for that carrier adapter 200 is positioned at clamping plate (seeing that Fig. 2 D is to Fig. 1 F and Fig. 2 J).Circular substantially base plate 210 can comprise a plurality of clamping through holes 230, and it passes completely through circular substantially base plate 210.Clamping through hole 230 can the radial hole mode arrangement, and wherein clamping through hole 230 is between the circular dimple 220 of adjacent cardinal principle.Extra clamping through hole 230 can be positioned at the center of circular substantially base plate 210.
Circular substantially base plate 210 also can comprise the stripper pin hole that is similar to the stripper pin hole shown in Figure 1A and Fig. 1 C.Though do not show this a little characteristics in the specific embodiment shown in Fig. 2 A and Fig. 2 C, the those skilled in the art can understand easily, can how in the embodiment shown in Fig. 2 A and Fig. 2 C, to implement these a little characteristics.
Fig. 2 B and Fig. 2 D describe the rear side of circular substantially base plate 210.As can see that the rear side of circular base plate 210 does not have circular substantially dimple 220 substantially, but has the depression 235 that is centered on the clamping through hole 230.Each depression can seem to be similar to for example crosses the characteristics such as circular port actinal surface that its milling has slit, but the base plate 210 of circle can form under the situation of not using milling machine operation with depression 235 substantially, for example can be netted sintering part.
In certain embodiments, the thickness of circular base plate 210 can be about 0.048 substantially ", and diameter can be 11.811 " (300mm).Circular substantially base plate 210 can comprise (for example) five circular substantially dimples 220.Said five circular substantially dimples 220 can be centered in apart from the center 3.600 of circular substantially base plate 210 separately " to be located, and arranges with the radial manner of equi-spaced apart.The diameter of the dimple 220 that each cardinal principle is circular is about 3.868 ", and the degree of depth is 0.007 ".The diameter of clamping through hole 230 is about 0.160 ", be centered in apart from the center about 4.500 of circular substantially base plate 210 " locate, and separately between the circular dimple 220 of adjacent cardinal principle.
Fig. 2 E describes circular substantially grip block 211 to Fig. 2 G.Circular substantially grip block 211 can comprise circular substantially through hole 221, and it is corresponding to each the circular substantially dimple 220 in the circular substantially base plate 210.Circular substantially grip block 211 can make circular substantially through hole 221 aim at circular substantially dimple 220 through being configured to be installed to circular substantially base plate 210.Substantially circular grip block 211 can comprise a plurality of clamping through holes 236, and wherein the through hole 230 on the base plate 210 of each clamping through hole 236 and circle substantially is corresponding.
But each is one or two internal edge sphering of circular through hole 221 substantially.In certain embodiments, when combination carrier adapter 200, be adjacent to the circularity of the internal edge of circular substantially base plate 210 can be substantially less than the circularity of all the other internal edges of the circular through hole 221 of given cardinal principle.Circular substantially grip block 211 can be processed by aluminium alloy (for example 5052 aluminium).
In certain embodiments, the thickness of circular grip block 211 can be about 0.032 substantially ", and diameter can be 11.811 " (300mm).Circular substantially grip block 211 can comprise (for example) five circular substantially through holes 221.Said five circular substantially through holes 221 can be centered in apart from the center 3.600 of circular substantially grip block 211 separately " to be located, and arranges with the radial manner of equi-spaced apart.The diameter of the through hole 221 that each cardinal principle is circular is about 3.809 ".The diameter of clamping through hole 236 is about 0.036 ", and substantially circular grip block 211 at combination carrier adapter 200 time be the aperture face on the side of circular base plate 210 substantially dorsad.Clamping through hole 236 also can be centered in apart from the center about 4.500 of circular substantially base plate 210 " locate, and separately between the circular through hole 221 of adjacent cardinal principle.
Fig. 2 H describes to install pad 215 to Fig. 2 K.Pad 215 is installed is comprised first 217 and contiguous second portion 216.The shape of first 217 and second portion 216 can be general cylindrical, and coaxial each other.Second portion 216 also can comprise the semicircular otch 219 of cardinal principle relative on the diameter in the outward flange of second portion 216.With threaded hole 218 can be positioned at the center of first 217 and second portion 216.
The diameter that in certain embodiments, first 217 can have 0.148 " diameter, and second portion 216 can have 0.240 ".Substantially semicircular otch 219 can have 0.100 " diameter, and be centered in apart from the center 0.125 of first 217 and " locate.The thickness of first 217 can be 0.025 ", and the thickness of second portion 216 is about 0.20 ".With threaded hole 218 can be the 000-120UNF threaded through hole.
Fig. 2 L describes the isometric view through the carrier adapter 200 of combination; Fig. 2 M describes the decomposition view of carrier adapter 200.It is not shown for example can be screwed to other assemblies such as screw of installing in threaded hole 218 on the pad 215.These a little screws can be CARBURIZING FURNACE FOR STAINLESS FASTENER, for example the 000-120UNF screw.Also show substrate wafer 212, it is clipped between the grip block 211 of circular substantially base plate 210 and cardinal principle circle.
Fig. 2 N describes to be installed in the isometric view through combination carrier adapter 200 on the anchor clamps 250.Fig. 2 O describes the equidistance decomposition view of carrier adapter 200 and anchor clamps 250.Fig. 2 P describes to use the various stages of carrier adapter 200 assemblings of anchor clamps 250 to Fig. 2 T.In Fig. 2 P, display fixture 250, and locator push rod 260, crooked shoulder 270 and many to pad push rod 213.In Fig. 2 Q, pad 215 is installed is installed on each between the pad push rod 213, make each pad push rod 213 be adjacent to the semicircular otch of installing on the pad 215 219 of cardinal principle.Fig. 2 U provides a detail view that pad 215 is installed that is installed on a pair of pad push rod 213.Fig. 2 R describes to be installed on the circular base plate 210 of cardinal principle on the anchor clamps 250.Each depression 235 places on corresponding the installation pad 215 and a pair of pad push rod 213.Fig. 2 S describes to be equipped with the carrier adapter 200 of the part combination of substrate wafer 212.A substrate wafer 212 is placed in each circular substantially dimple 220.Fig. 2 T describes to be installed on the circular mounting panel 211 of cardinal principle on the substrate wafer 212.Can installation screw (not shown) be screwed and pass clamping through hole 236, and be screwed in threaded hole 218 in the installation pad 215.When being retained on carrier adapter 200 in the anchor clamps 250, each prevents to install pad 215 to pad push rod 213 and when tightening the installation screw, rotates.
For example Fig. 2 A can be fit to bond substrate (that is, non-ceramic substrate) use to carrier adapters such as carrier adapters shown in Fig. 2 U very much, and metal substrate at high temperature possibly represent warpage or other change in size.Grip block 211 can be at peripheral each substrate wafer 212 of clamping of wafer, and stops substrate wafer 212 warpage during handling.
Fig. 3 A and Fig. 3 B describe carrier adapter 300, and it comprises circular substantially base plate 310 and 14 circular substantially dimples 320.Circular substantially dimple 320 can be arranged to two radial arrays.For instance, an array can comprise four circular substantially dimples 320, and another array can comprise ten circular substantially dimples 320.
In certain embodiments, the thickness of circular base plate 310 is about 0.060 substantially ", and diameter is about 11.811 ".The degree of depth of the dimple 320 that each cardinal principle is circular is about 0.010 ", and diameter is about 2.445 ".Four circular substantially dimples 320 can be located such that its centre-to-centre spacing center 1.850 of circular base plate 310 substantially separately ".Ten circular substantially dimples 320 can be located such that its centre-to-centre spacing center 4.500 of circular base plate 310 substantially separately ".
Fig. 4 A describes carrier adapter 400 to Fig. 4 C, and it comprises circular substantially base plate 410 and 14 circular substantially dimples 420.Circular substantially dimple 420 can be arranged to two radial arrays.For instance, an array can comprise four circular substantially dimples 420, and another array can comprise ten circular substantially dimples 420.
As describing among Fig. 4 B, circular substantially dimple 420 can comprise the deviation with positive circular contour.For instance, circular substantially dimple 420 can comprise the platform 430 that is used for the position substrate wafer.
In certain embodiments, the thickness of circular base plate 410 is about 0.040 substantially ", and diameter is about 11.811 ".The degree of depth of the dimple 420 that each cardinal principle is circular is about 0.019 ", and diameter is about 2.445 ".Four circular substantially dimples 420 can be located such that its centre-to-centre spacing center about 1.850 of circular base plate 410 substantially separately ".Ten circular substantially dimples 420 can be located such that its centre-to-centre spacing center 4.500 of circular base plate 410 substantially separately ".Platform 430 can be from the off-centring about 1.186 of substantially circular dimple 420 ".
Although this paper has been described in detail with reference to the attached drawings some embodiment of the present invention; But will understand; The invention is not restricted to these accurate embodiment, and the those skilled in the art can realize various changes and modification therein under the situation of the scope that does not break away from the defined spirit of the present invention of appended claims.The various characteristics of the carrier adapter that for instance, this paper discussed are capable of being combined.As another instance, for example grip block such as employed grip block can combine 14 dimple carrier adapters 300 to use in the carrier adapter 200, and prerequisite is to implement in carrier adapter 300 from the additional features of carrier adapter 200." the carrier adapter of nominal diameter (300mm) is similar to geometry as herein described and characteristic also applicable to 200mm carrier adapter in addition, to have 11.811 though the embodiment that this paper discussed mainly concentrates on.This is modified in those skilled in the art's the ability a bit, and will understand, this a little modification within the scope of the invention.
Claims (30)
1. substrate carrier adapter that is used for semiconductor processing equipment, its size has the semiconductor wafer of nominal diameter through design with processing, and said substrate carrier adapter comprises:
Circular substantially base plate, the circular base plate of wherein said cardinal principle comprises the circular dimple of a plurality of cardinal principles in a side, and has the diameter roughly the same with said nominal diameter.
2. substrate carrier adapter according to claim 1, wherein said nominal diameter are 11.811 ".
3. substrate carrier adapter according to claim 1 comprises recess in the further its outer edges of base plate of wherein said cardinal principle circle.
4. substrate carrier adapter according to claim 1, the circular base plate of wherein said cardinal principle is to be processed by aluminium oxide.
5. substrate carrier adapter according to claim 1, the circular dimple of wherein said cardinal principle center on the mode arrangement of the center of the circular base plate of said cardinal principle with one or more cardinal principle radial symmetric.
6. substrate carrier adapter according to claim 1, wherein each circular substantially dimple comprises a molding jogger hole, and it passes the circular base plate of said cardinal principle.
7. substrate carrier adapter according to claim 1, wherein each substantially circular dimple is centrally located in apart from the said center about 3.6 of the circular base plate of said cardinal principle " distance.
8. substrate carrier adapter according to claim 1, wherein:
The diameter of the dimple that said cardinal principle is circular is about 4 ", and
Said substrate carrier adapter comprises five circular substantially dimples.
9. according to claim 1,2,3,4,5,6,7 or 8 described substrate carrier adapters, the degree of depth of the dimple that wherein said cardinal principle is circular is about 0.017 ".
10. according to claim 1,2,3,4,5,6,7 or 8 described substrate carrier adapters, the thickness of the base plate that wherein said cardinal principle is circular is about 0.08 ".
11. substrate carrier adapter according to claim 1, wherein:
The diameter of the dimple that said cardinal principle is circular is about 3.87 ", and
Said substrate carrier adapter comprises five circular substantially dimples.
12. substrate carrier adapter according to claim 11, the degree of depth of the dimple that wherein said cardinal principle is circular is about 0.007 ".
13. substrate carrier adapter according to claim 11, the thickness of the base plate that wherein said cardinal principle is circular is about 0.05 ".
14. according to claim 1,2,3,4,5,6,7,8,11,12 or 13 described substrate carrier adapters, it further comprises circular substantially grip block, wherein:
The circular grip block of said cardinal principle has the base plate roughly the same diameter circular with said cardinal principle, and
The circular grip block of said cardinal principle comprises the circular through hole of a plurality of cardinal principles, corresponding in the dimple of the said cardinal principle circle in each circular substantially through hole and the circular base plate of said cardinal principle.
15. substrate carrier adapter according to claim 14; The grip block of wherein said cardinal principle circle is through being configured to be installed to the circular base plate of said cardinal principle; Make that the circular base plate of circular grip block of said cardinal principle and said cardinal principle is concentric, and make the circular through hole of said cardinal principle concentric with the dimple of the corresponding with it said cardinal principle circle of the circular through hole of said cardinal principle substantially separately.
16. substrate carrier adapter according to claim 15, the circular base plate of grip block that wherein said cardinal principle is circular and said cardinal principle further comprises a plurality of installation through holes separately, wherein:
The said installation through holes that is contained in the circular base plate of said cardinal principle is aimed at the said installation through holes in the grip block that is contained in said cardinal principle circle, and
The diameter that is contained in the said installation through holes in the circular base plate of said cardinal principle is greater than the diameter that is contained in the said installation through holes in the circular grip block of said cardinal principle.
17. substrate carrier adapter according to claim 16, each installation through holes in wherein said a plurality of installation through holes end in the depression on the side of the circular base plate of the said cardinal principle relative with the side that comprises the circular dimple of said cardinal principle of the circular base plate of said cardinal principle.
18. substrate carrier adapter according to claim 17, wherein each depression has circular substantially profile, and it has from circular one or more the outstanding anti-rotational features of profile of said cardinal principle.
19. substrate carrier adapter according to claim 18; The diameter of the profile that wherein said cardinal principle is circular is about 0.25 "; and said one or more anti-rotational features comprise the slit that the length with semi-circular ends is about 0.36 " and width is about 0.1 ", wherein:
The center of said slit in the circular profile of said cardinal principle in the heart,
The diameter of each installation through holes in the base plate of said cardinal principle circle is about 0.16 ", and the degree of depth of each depression is 0.02 ".
20. substrate carrier adapter according to claim 16, wherein:
Installation through holes is placed between each dimple to adjacent cardinal principle circle in the circular base plate of said cardinal principle, and the said center about 4.5 of the base plate of the said cardinal principle circle of distance ", and
Installation through holes roughly is placed in the said center of the circular base plate of said cardinal principle.
21. substrate carrier adapter according to claim 17, it further comprises for each depression:
Pad is installed, wherein:
Said installation pad comprises the first with first thickness and first diameter and has second thickness and the second portion of second diameter, and said second diameter is concentric and greater than said first diameter with said first diameter,
Said first and said second portion are contiguous,
Said installation pad comprises the semicircular otch of cardinal principle relative on two diameters in said second portion, and
Said installation pad comprises with threaded hole; And
Screw, the thread size of wherein said screw is corresponding with said thread size with threaded hole.
22. substrate carrier adapter according to claim 21, the circular grip block of wherein said cardinal principle fills up made of aluminum with installation.
23. substrate carrier adapter according to claim 21, the circular grip block of wherein said cardinal principle is processed by 5052 aluminium.
24. substrate carrier adapter according to claim 21, wherein said installation pad is processed by 7075 aluminium.
25. substrate carrier adapter according to claim 21, wherein said screw is processed by stainless steel.
26. substrate carrier adapter according to claim 21; Wherein said first thickness is about 0.02 ", said first diameter is about 0.15 ", said second thickness is about 0.025 "; said second diameter is about 0.24 "; Cardinal principle semi-circular cut-out diameter separately relative on the said diameter is about 0.1 ", and with the Center Gap of said second portion about 0.125 ", and said with threaded hole be the 000-120UNF through hole concentric with said first.
27. substrate carrier adapter according to claim 1, wherein:
The diameter of the dimple that said cardinal principle is circular is about 2.45 ", and
Said substrate carrier adapter comprises 14 circular substantially dimples.
28. substrate carrier adapter according to claim 27, the degree of depth of the dimple that wherein said cardinal principle is circular is about 0.01 ".
29. substrate carrier adapter according to claim 27, the thickness of the base plate that wherein said cardinal principle is circular is about 0.6 ".
30. according to claim 1,2,3,4,5,6,27,28 or 29 described substrate carrier adapters, wherein:
In the circular dimple of said cardinal principle ten with interval 4.5 roughly, the said center of the circular base plate of said cardinal principle ", and
In the circular dimple of said cardinal principle four with interval 1.85 roughly, the said center of the circular base plate of said cardinal principle ".
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202481050U CN202384308U (en) | 2011-07-11 | 2011-07-11 | Carrier adapter used for semiconductor wafer disposition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202481050U CN202384308U (en) | 2011-07-11 | 2011-07-11 | Carrier adapter used for semiconductor wafer disposition |
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| Publication Number | Publication Date |
|---|---|
| CN202384308U true CN202384308U (en) | 2012-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202481050U Expired - Lifetime CN202384308U (en) | 2011-07-11 | 2011-07-11 | Carrier adapter used for semiconductor wafer disposition |
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| Country | Link |
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| CN (1) | CN202384308U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104743201A (en) * | 2013-12-30 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Tray structure compatible with wafers of various dimensions |
| CN104851828A (en) * | 2014-02-13 | 2015-08-19 | 苹果公司 | Universal process carrier for substrates |
| CN106252264A (en) * | 2015-06-10 | 2016-12-21 | 苹果公司 | For keeping the carrier with locking mechanism of substrate |
| WO2020154238A1 (en) * | 2019-01-21 | 2020-07-30 | Applied Materials, Inc. | Substrate carrier |
| JP2021526237A (en) * | 2018-05-31 | 2021-09-30 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Multi-board processing in digital lithography system |
-
2011
- 2011-07-11 CN CN2011202481050U patent/CN202384308U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104743201A (en) * | 2013-12-30 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Tray structure compatible with wafers of various dimensions |
| CN104851828A (en) * | 2014-02-13 | 2015-08-19 | 苹果公司 | Universal process carrier for substrates |
| CN106252264A (en) * | 2015-06-10 | 2016-12-21 | 苹果公司 | For keeping the carrier with locking mechanism of substrate |
| JP2021526237A (en) * | 2018-05-31 | 2021-09-30 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Multi-board processing in digital lithography system |
| JP7212701B2 (en) | 2018-05-31 | 2023-01-25 | アプライド マテリアルズ インコーポレイテッド | Multi-substrate processing in digital lithography systems |
| WO2020154238A1 (en) * | 2019-01-21 | 2020-07-30 | Applied Materials, Inc. | Substrate carrier |
| CN113366625A (en) * | 2019-01-21 | 2021-09-07 | 应用材料公司 | Substrate carrier |
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