CN214672564U

CN214672564U - Supporting structure of wafer loading and unloading position

Info

Publication number: CN214672564U
Application number: CN202120818795.2U
Authority: CN
Inventors: 代勇; 曹春生; 阚保国; 栾剑峰
Original assignee: Hua Hong Semiconductor Wuxi Co Ltd
Current assignee: Hua Hong Semiconductor Wuxi Co Ltd
Priority date: 2021-04-21
Filing date: 2021-04-21
Publication date: 2021-11-09
Anticipated expiration: 2031-04-21

Abstract

The utility model discloses a bearing structure of position is carried in wafer loading and unloading, including the multiunit support frame, every group support frame comprises two backup pads that distribute in the wafer both sides, and one in two backup pads is the single-point backup pad, and another is the multiple spot backup pad, the single-point backup pad is formed with a supporting legs that extends towards the multiple spot backup pad, the multiple spot backup pad is formed with two at least supporting legss that extend towards the single spot backup pad, the supporting legs of single-point backup pad with all establish the packing ring on every supporting legs of multiple spot backup pad, the top surface of all packing rings on every group support frame all is in same horizontal plane and the packing ring top surface is higher than its place backup pad top surface. The utility model discloses the shape structure of the support frame to the metal material of support wafer changes, changes the contact site of wafer and support frame into the packing ring simultaneously, can improve the condition that the local position heat dissipation is too fast in loading and unloading year position like this, reduces the influence that wafer thermal stress caused, reduces the possibility that the wafer takes place the fragment.

Description

Supporting structure of wafer loading and unloading position

Technical Field

The utility model relates to a semiconductor integrated circuit manufacturing technology is relevant, the bearing structure of wafer loading and unloading position (loadlock) that concretely relates to is located the board, specially adapted Mattson board.

Background

Semiconductor technology refers to various techniques of semiconductor processing, including wafer production techniques, thin film deposition, photolithography, etching, doping, and process integration. During the whole production process of wafer processing, various process steps are carried out in the corresponding semiconductor equipment. The processes performed in semiconductor devices typically use wafers as product carriers, where a series of process operations are performed to form process blanks or finished products.

Typically, semiconductor equipment has a process chamber (PM) in which wafers are loaded and unloaded through a loadlock. The loading and unloading position is provided with a support frame (shelf) for supporting the wafer, the wafer is taken down from the support frame of the loading and unloading position and is sent into the process chamber by the mechanical arm, and after the process is finished, the wafer is taken out from the process chamber and is placed on the support frame of the loading and unloading position.

Taking Mattson machine as an example, the supporting frames of the loading and unloading stations are all metal components, i.e. the components contacting with the wafer are made of metal materials. As shown in fig. 1, each support frame is composed of two

support plates

21 and 22, when the wafer 1 is taken out by the robot arm and placed on the

support plates

21 and 22 of the loading/unloading position after the high temperature process is finished in the process chamber of the machine, the wafer 1 is in direct large-area contact with the support plates with low temperature (relative to the temperature of the wafer), and the loading/unloading chamber is inflated to the external atmospheric pressure by using unheated nitrogen gas to cause a large temperature difference.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a bearing structure of wafer loading and unloading position can solve the current problem that the loading and unloading position very easily caused the wafer breakage.

For solving the technical problem, the utility model provides a pair of supporting structure that position was carried in wafer loading and unloading, including the multiunit support frame, every group support frame comprises two backup pads that distribute in the wafer both sides, and one in two backup pads is the single-point backup pad, and another is the multiple spot backup pad, the single-point backup pad is formed with a orientation the supporting legs that the multiple spot backup pad extends, the multiple spot backup pad is formed with two at least orientations the supporting legs that the single-point backup pad extends, the supporting legs of single-point backup pad with all be equipped with the packing ring that is used for supporting the wafer on every supporting legs of multiple spot backup pad, the top surface of all packing rings on every group support frame all is in the top surface that the top surface of same horizontal plane and packing ring is higher than the top surface of its place backup pad.

Preferably, the gasket is a rubber gasket.

Optionally, a side of the multi-point support plate close to the wafer is in a "C" shape.

Optionally, the multi-point support plate is formed with two support legs, and the two support legs are connected through an arc-shaped side surface.

Optionally, the arc-shaped side surface uses the center of a circle of the wafer as the center of the circle, and the radius of the arc-shaped side surface is larger than that of the wafer.

Preferably, the positions of the single-point supporting plates and the multi-point supporting plates in the adjacent supporting frames are alternately arranged.

Preferably, the support plate is formed with a gasket mounting hole.

Preferably, the gasket has a double-layer structure.

Preferably, the gasket mounting hole is composed of an insertion circular hole, a connecting section and a fixing circular hole, the insertion circular hole and the fixing circular hole are communicated through the connecting section, and the diameter of the insertion circular hole is larger than that of the fixing circular hole.

The utility model discloses current bearing structure who carries the position is loaded in wafer loading and unloading in the semiconductor board improves, changes the shape structure of the support frame of the metal material of support wafer, changes the contact site of wafer and support frame into the packing ring simultaneously, can improve the too fast condition of the local position heat dissipation of the wafer of accomplishing the technology processing procedure in loading and unloading year position like this to reduce the influence that wafer thermal stress caused, reduce the possibility that the broken piece takes place for the wafer.

Drawings

FIG. 1 is a schematic view of a conventional wafer loading/unloading station support structure;

FIG. 2 is a schematic view of a supporting structure of a wafer loading/unloading station according to the present invention;

fig. 3 is a schematic view of a gasket mounting hole on a support plate according to the present invention;

fig. 4 is a schematic view of the middle washer of the present invention.

Wherein the reference numerals are as follows:

1 is a wafer; 21 is a first supporting plate; 22 is a second support plate; 23 is a gasket; 24 is a gasket mounting hole; 241 is an insertion round hole; 242 is a connecting segment; and 243 is a fixing circular hole.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and technical effects of the present invention will be fully apparent to those skilled in the art from the disclosure in the specification. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. The invention is capable of other embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the general spirit of the invention. It should be noted that, in the following embodiments, technical features may be combined with each other without conflict. The following exemplary embodiments of the present invention may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. It is to be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the technical solutions of these exemplary embodiments to those skilled in the art.

In the description of the present application, it is to be noted that the terms "toward", "near", "far", "vertical", "inner", "outer", "upper", "lower", "top", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present application.

In the description of the present application, it is to be noted that the terms "having," "forming," "providing," "connecting," and the like are to be construed broadly unless otherwise expressly specified or limited. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. Furthermore, the terms "first", "second" and "third" are used in the following embodiments to describe various elements and components, but these elements and components should not be limited by these terms, and these terms are only used to distinguish them, so that the first element and component discussed below can also be referred to as the second element and component without departing from the teaching of the embodiments according to the present invention.

The utility model discloses wafer loading and unloading carries bearing structure of position, including the multiunit support frame, every group support frame comprises two

backup pads

21, 22 that distribute in the wafer both sides. In an exemplary embodiment, the loading/unloading station is provided with four sets of supporting frames, the four sets of supporting frames are limited by bolts, that is, the supporting plate on one side of the wafer is fixed and limited by one set of bolts, the supporting plate on the other side of the wafer is fixed and limited by another set of bolts, and the top surfaces of the two supporting plates of the same set of supporting frames are on the same horizontal plane.

In this embodiment, one of two backup pads is the single-point backup pad, and the other is the multiple spot backup pad, the single-point backup pad is formed with one orientation the supporting legs that the multiple spot backup pad extends, the multiple spot backup pad is formed with two at least orientations the supporting legs that the single-point backup pad extends, all be equipped with the packing ring that is used for supporting the wafer on the supporting legs of single-point backup pad with each supporting legs of multiple spot backup pad, the top surface of all packing rings on every group support frame all is in same horizontal plane and the top surface of packing ring is a little higher than the top surface of its place backup pad, that is to say, the wafer only with the packing ring keeps contact.

As shown in fig. 2, the first support plate 21 is a multi-point support plate, and the second support plate 22 is a single-point support plate. For example, in a group of support frames shown in fig. 2, the first support plate 21 is located on the left side of the wafer 1, the second support plate 22 is located on the right side of the wafer 1, the adjacent group of support frames located above the group of support frames and the adjacent group of support frames located below the group of support frames are located, the second support plate 22 is located on the left side of the wafer 1, the first support plate 21 is located on the right side of the wafer 1, and so on, all support plates located on the left side of the wafer 1 are fixed and positioned by a group of bolts, and all support plates located on the right side of the wafer 1 are fixed and positioned by a group of bolts.

The supporting legs formed on all the supporting plates extend towards the circle center of the wafer, and the gaskets on the supporting legs are made of nonmetal materials, preferably rubber gaskets.

The support frame of the present embodiment takes a combination of a two-point support plate and a single-point support plate as an example, and those skilled in the art can implement combinations of multi-point support plates and single-point support plates in other forms on the basis of the principle of the present embodiment.

As shown in fig. 2, a side of the multi-point support plate, which is a first support plate 21, near the wafer is "C" shaped, and the first support plate 21 is formed with two support legs, and the two support legs are connected through an arc-shaped side surface. The arc-shaped side surface takes the circle center of the wafer as the circle center, and the radius of the arc-shaped side surface is larger than that of the wafer, so that the contact between the wafer and the supporting plate can be further reduced.

In the present embodiment, the support plate is formed with a gasket mounting hole 24, and as shown in fig. 3, preferably, the gasket mounting hole 24 is formed by an insertion circular hole 241, a connection section 242 and a fixing circular hole 243, the insertion circular hole 241 and the fixing circular hole 243 are communicated through the connection section 242, and the diameter of the insertion circular hole 241 is larger than that of the fixing circular hole 243.

The gasket 23 has a double-layer structure, as shown in fig. 4, the maximum outer diameter (the outer diameter of the top gasket and the bottom gasket) of the gasket 23 is the same as the diameter of the insertion circular hole 241, the minimum outer diameter (the outer diameter of the middle recess) is the same as the diameter of the fixing circular hole 243, and the gasket 23 is engaged with the support plate. When the washer 23 is installed, the washer 23 is first placed in the insertion circular hole 241, and then the washer 23 is pushed toward the fixing circular hole 243 along the connecting section 242, so that the washer 23 is finally positioned in the fixing circular hole 243.

The present invention has been described in detail with reference to the specific embodiments, which are merely preferred embodiments of the present invention, and the present invention is not limited to the above embodiments. Equivalent substitutions and modifications made by those skilled in the art without departing from the principles of the present invention should be considered to be within the technical scope of the present invention.

Claims

1. The utility model provides a bearing structure that wafer loading and unloading carried position, includes the multiunit support frame, and every group support frame comprises two backup pads that distribute in the wafer both sides, and its characterized in that, one of two backup pads is the single-point backup pad, and another is the multiple spot backup pad, the single-point backup pad is formed with a orientation the supporting legs that the multiple spot backup pad extends, the multiple spot backup pad is formed with two at least orientations the supporting legs that the single-point backup pad extends, the supporting legs of single-point backup pad with all be equipped with the packing ring that is used for supporting the wafer on every supporting legs of multiple spot backup pad, the top surface of all packing rings on every group support frame all is in the top surface that same horizontal plane and packing ring are higher than the top surface of its place backup pad.

2. The wafer handler support structure of claim 1, wherein the gasket is a rubber gasket.

3. The wafer handler support structure of claim 1, wherein the side of the multi-point support plate adjacent to the wafer is "C" shaped.

4. The wafer handler support structure of claim 3, wherein the multi-point support plate is formed with two support legs, the two support legs being connected by an arcuate side surface.

5. The wafer handler support structure of claim 4, wherein the arcuate side surface is centered at a center of the wafer and has a radius greater than a radius of the wafer.

6. The support structure of claim 1, wherein the positions of the single-point support plates and the multi-point support plates in adjacent support frames are alternately arranged.

7. The wafer handler support structure of claim 1, wherein the support plate has a gasket mounting hole formed therein.

8. The wafer handler support structure of claim 7, wherein the gasket is a double layer structure.

9. The wafer loading/unloading station support structure of claim 7, wherein the gasket mounting hole is formed by an insertion circular hole, a connection section, and a fixing circular hole, the insertion circular hole and the fixing circular hole are communicated through the connection section, and the diameter of the insertion circular hole is larger than that of the fixing circular hole.