CN219066791U - Wafer fixing device - Google Patents
Wafer fixing device Download PDFInfo
- Publication number
- CN219066791U CN219066791U CN202223414676.4U CN202223414676U CN219066791U CN 219066791 U CN219066791 U CN 219066791U CN 202223414676 U CN202223414676 U CN 202223414676U CN 219066791 U CN219066791 U CN 219066791U
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- China
- Prior art keywords
- rotating shaft
- air inlet
- inlet channel
- bearing
- annular sealing
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- 238000007789 sealing Methods 0.000 claims abstract description 54
- 230000005540 biological transmission Effects 0.000 claims abstract description 7
- 125000006850 spacer group Chemical group 0.000 claims description 22
- 239000011553 magnetic fluid Substances 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011554 ferrofluid Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a wafer fixing device. The support column is provided with a through hole and a first air inlet channel, the rotating shaft is arranged at the through hole through a first bearing and a second bearing, the sucker is arranged at the upper end of the rotating shaft, the lower end of the rotating shaft is in transmission connection with the driver, the driver can drive the sucker to rotate through the rotating shaft, the rotating shaft is provided with a second air inlet channel communicated with the first air inlet channel, and the first annular sealing piece is arranged between the first air inlet channel and the first bearing; the second annular sealing piece is arranged between the first air inlet channel and the second bearing, and then when the rotating shaft rotates, the first annular sealing piece and the second annular sealing piece can be in sealing contact with the outer wall of the rotating shaft and the inner wall of the supporting column, so that gas is effectively prevented from leaking through a gap between the rotating shaft and the supporting column, tightness of a gas path communicated with the sucker is guaranteed, the sucker can be guaranteed to firmly adsorb a wafer, and the wafer is prevented from falling and being damaged.
Description
Technical Field
The utility model relates to the field of wafer manufacturing, in particular to a wafer fixing device.
Background
The wafer fixing device is a device for fixing a wafer, and can fix the wafer in the processes of cleaning, cutting and the like. The wafer fixing device is generally composed of a supporting column, a sucker, a rotating shaft, a motor and other components, the rotating shaft is arranged in a cavity of the supporting column through an upper bearing and a lower bearing, the sucker is arranged at one end of the rotating shaft, the motor is in transmission connection with the rotating shaft, a channel communicated with the sucker is formed in the rotating shaft, and then after the sucker contacts with a wafer, the channel is exhausted, so that the sucker can firmly adsorb the wafer and can be driven to rotate through the motor in a cleaning or cutting stage.
Disclosure of Invention
Therefore, the embodiment of the utility model provides a wafer fixing device, which solves the problem that the wafer cannot be firmly fixed in the cleaning, cutting and other engineering due to the fact that the sealing effect of the bearing is poor in the conventional wafer fixing device.
In order to achieve the above object, the embodiment of the present utility model provides the following technical solutions:
a wafer holding apparatus, comprising: the device comprises a support column, a sucker, a rotating shaft, a first annular sealing piece, a second annular sealing piece, a first bearing and a second bearing;
a through hole is longitudinally formed along the support column;
the side wall of the support column is provided with a first air inlet channel communicated with the through hole;
the upper part of the rotating shaft is arranged at the upper part of the through hole through a first bearing, and the lower part of the rotating shaft is arranged at the lower part of the through hole through a second bearing;
the sucker is arranged at the upper end of the rotating shaft, and the lower end of the rotating shaft is in transmission connection with the driver;
the second air inlet channel is formed in the rotating shaft, the first end of the second air inlet channel is communicated with the first air inlet channel, and the second end of the second air inlet channel is positioned at the first end of the rotating shaft;
the first annular sealing piece is arranged between the first air inlet channel and the first bearing;
the second annular seal is disposed between the first intake passage and the second bearing.
Preferably, the through holes are of cylindrical structure.
Preferably, a radial channel is formed along the radial direction of the rotating shaft;
an axial channel communicated with the radial channel is formed along the axial direction of the rotating shaft;
the radial passage and the axial passage form a second air intake passage.
Preferably, the radial passage is at the same level as the first intake passage.
Preferably, the second air inlet channel has an L-shaped structure.
Preferably, the method further comprises: a spacer ring;
the spacer ring is sleeved on the rotating shaft and is positioned between the first annular sealing piece and the second annular sealing piece;
and a connecting channel used for communicating the first air inlet channel and the second air inlet channel is formed along the radial direction of the partition ring.
Preferably, the first annular seal and/or the second annular seal is/are constituted by a magnetic fluid.
Preferably, the upper portion of the first annular seal is in contact with the first bearing and the lower portion is in contact with the spacer ring;
the upper portion of the second annular seal member is in contact with the spacer ring and the lower portion is in contact with the second bearing.
Preferably, the inner diameter of the spacer ring is the same as the inner diameter of the first annular seal, and the outer diameter of the spacer ring is the same as the outer diameter of the first annular seal.
The utility model discloses a wafer fixing device, which is characterized in that a through hole is formed along the longitudinal direction of a support column, and a first air inlet channel communicated with the through hole is formed in the side wall of the support column; the upper part of the rotating shaft is arranged at the upper part of the through hole through a first bearing, and the lower part of the rotating shaft is arranged at the lower part of the through hole through a second bearing; the sucker is arranged at the upper end of the rotating shaft, the lower end of the rotating shaft is in transmission connection with the driver, the driver can drive the sucker to rotate through the rotating shaft, the second air inlet channel is formed in the rotating shaft, the first end of the second air inlet channel is communicated with the first air inlet channel, and the second end of the second air inlet channel is positioned at the first end of the rotating shaft; and disposing a first annular seal between the first air intake passage and the first bearing; the second annular sealing piece is arranged between the first air inlet channel and the second bearing, and then when the rotating shaft rotates, the first annular sealing piece and the second annular sealing piece can be in sealing contact with the outer wall of the rotating shaft and the inner wall of the supporting column, so that gas is effectively prevented from leaking through a gap between the rotating shaft and the supporting column.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a wafer fixing apparatus according to an embodiment of the present utility model;
fig. 2 is a schematic partial structure of a wafer fixing apparatus according to an embodiment of the present utility model.
The device comprises a support column 1, a first air inlet channel 11, a sucker 2, a rotating shaft 3, a radial channel 31, an axial channel 32, a first annular sealing piece 4, a second annular sealing piece 5, magnetic fluid 51, a first bearing 6, a second bearing 7 and a spacer ring 8.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The embodiment of the utility model provides a wafer fixing device, which can be used as a cutting mechanism and a cleaning mechanism of a wafer cutting machine to bear and fix a wafer as a wafer carrying platform. FIG. 1 is a schematic view of a structure in which a wafer holding apparatus according to the present utility model is used for a cleaning mechanism; fig. 2 is a schematic structural diagram of a wafer fixing apparatus according to an embodiment of the present utility model. Referring to fig. 1 and 2, the wafer fixing apparatus includes: the device comprises a support column 1, a sucker 2, a rotating shaft 3, a first annular sealing piece 4, a second annular sealing piece 5, a first bearing 6 and a second bearing 7;
a through hole is longitudinally formed along the support column 1;
the side wall of the support column 1 is provided with a first air inlet channel 11 communicated with the through hole;
the upper part of the rotating shaft 3 is arranged at the upper part of the through hole through a first bearing 6, and the lower part of the rotating shaft 3 is arranged at the lower part of the through hole through a second bearing 7;
the sucker 2 is arranged at the upper end of the rotating shaft 3, and the lower end of the rotating shaft 3 is in transmission connection with the driver;
the inside of the rotating shaft 3 is provided with a second air inlet channel, the first end of the second air inlet channel is communicated with the first air inlet channel 11, and the second end of the second air inlet channel is positioned at the first end of the rotating shaft 3;
the first annular seal 4 is arranged between the first air inlet channel 11 and the first bearing 6;
the second annular seal 5 is provided between the first intake passage 11 and the second bearing 7.
It should be noted that, a through hole is longitudinally formed along the support column 1, and a first air inlet channel 11 communicated with the through hole is formed on the side wall of the support column 1; and the upper part of the rotating shaft 3 is arranged at the upper part of the through hole through a first bearing 6, and the lower part of the rotating shaft 3 is arranged at the lower part of the through hole through a second bearing 7; the sucker 2 is arranged at the upper end of the rotating shaft 3, the lower end of the rotating shaft 3 is in transmission connection with a driver, the driver can drive the sucker 2 to rotate through the rotating shaft 3, and a second air inlet channel is formed in the rotating shaft 3, the first end of the second air inlet channel is communicated with the first air inlet channel 11, and the second end of the second air inlet channel is positioned at the first end of the rotating shaft 3; and disposing the first annular seal 4 between the first air intake passage 11 and the first bearing 6; the second annular sealing piece 5 sets up between first inlet channel 11 and second bearing 7, and then when pivot 3 rotates, first annular sealing piece 4, second annular sealing piece 5 homoenergetic and pivot 3's outer wall to and the inner wall sealing contact with support column 1, effectively prevent gas leakage through the clearance between pivot 3 and the support column 1, through above-mentioned disclosed wafer fixing device, owing to set up first annular sealing piece 4 and second annular sealing piece 5 between first bearing 6 and second bearing 7, can guarantee the seal of the gas circuit with sucking disc 2 intercommunication through first annular sealing piece 4 and second annular sealing piece 5, and then can guarantee that sucking disc 2 firmly adsorbs the wafer, prevent that the wafer from droing the damage.
Specifically, the through hole is of a cylindrical structure.
The through hole is configured to have a cylindrical structure, so that the outer wall of the first annular seal member 4 can be in sealing contact with the inner wall of the support column 1, and the outer wall of the second annular seal member 5 can be in sealing contact with the inner wall of the support column 1.
It should be further noted that the through holes in the support columns 1 may be cylindrical structures, or may be other structures, such as polygonal structures, and those skilled in the art may select the structures according to requirements.
Further, a radial passage 31 is provided along the radial direction of the rotating shaft 3;
an axial channel 32 communicated with the radial channel 31 is formed along the axial direction of the rotating shaft 3;
the radial passage 31 and the axial passage 32 constitute a second intake passage.
It should be noted that one radial channel 31 may be formed in the radial direction of the rotating shaft 3, or a plurality of radial channels 31 may be formed along the radial direction of the rotating shaft 3, which may be selected by those skilled in the art according to the requirements, and the present utility model is not limited in particular.
Specifically, the radial passage 31 is at the same level as the first intake passage 11.
It should be noted that the radial channel 31 may be disposed at the same height as the first air intake channel 11, or may be disposed at a different height, which may be selected by those skilled in the art according to requirements.
Further, the second air inlet channel is of an L-shaped structure.
It should be noted that the second air intake passage may have an L-shaped structure, a T-shaped structure, or other structures, which may be selected by those skilled in the art according to requirements.
Further, the wafer fixing device further includes: a spacer ring 8;
the spacer ring 8 is sleeved on the rotating shaft 3 and is positioned between the first annular sealing piece 4 and the second annular sealing piece 5;
a connecting passage for communicating the first air intake passage 11 and the second air intake passage is provided along the radial direction of the spacer ring 8.
It should be noted that, the spacer ring 8 is sleeved on the rotating shaft 3, the spacer ring 8 is arranged between the first annular sealing element 4 and the second annular sealing element 5, and a connecting channel for communicating the first air inlet channel 11 and the second air inlet channel is arranged along the radial direction of the spacer ring 8, so that the first annular sealing element 4 can be prevented from falling downwards to block the outlet of the radial channel 31, and the radial channel 31 is ensured to be communicated with the first air inlet channel 11.
In particular, the first annular seal 4 and/or the second annular seal 5 are constituted by magnetic fluid.
The magnetic fluid is also called magnetic liquid, ferrofluid or magnetic liquid, is a novel functional material, and has the fluidity of liquid and the magnetism of solid magnetic materials. Is a stable colloidal liquid which is formed by mixing magnetic solid particles with the diameter of nanometer magnitude (below 10 nanometers), a base carrier liquid (also called medium) and a surfactant. The fluid has no magnetic attraction force in a static state, shows magnetism when an external magnetic field acts, has excellent magnetic fluid performance produced by nano metal and alloy powder, can be widely applied to the fields of magnetic fluid sealing, shock absorption, medical equipment, sound adjustment, light display, magnetic fluid mineral separation and the like under various harsh conditions, and can further improve the sealing performance of the first annular sealing element 4 and the second annular sealing element 5 by taking the first annular sealing element 4 and the second annular sealing element 5 as magnetic fluid.
Specifically, the upper part of the first annular seal 4 is in contact with the first bearing 6, and the lower part is in contact with the spacer ring 8;
the upper part of the second annular seal 5 is in contact with the spacer ring 8 and the lower part is in contact with the second bearing 7.
It should be noted that, the upper portion of the first annular sealing element 4 is contacted with the first bearing 6, and the lower portion is contacted with the spacer ring 8, so that the contact area between the inner wall of the first annular sealing element 4 and the outer wall of the rotating shaft 3 and the contact area between the first annular sealing element 4 and the inner wall of the supporting column 1 can be increased, and the sealing performance of the first annular sealing element 4 is further improved; the upper part of the second annular sealing element 5 is contacted with the spacer ring 8, and the lower part is contacted with the second bearing 7, so that the contact area between the inner wall of the second annular sealing element 5 and the outer wall of the rotating shaft 3 and the contact area between the second annular sealing element 5 and the inner wall of the supporting column 1 can be increased, and the sealing performance of the first annular sealing element 4 is further improved.
Preferably, the driver is a motor.
It should be noted that the driver may be a motor, or may be a motor, which may be selected by those skilled in the art according to requirements.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A wafer holding apparatus, comprising: the device comprises a support column, a sucker, a rotating shaft, a first annular sealing piece, a second annular sealing piece, a first bearing and a second bearing;
a through hole is longitudinally formed along the support column;
the side wall of the support column is provided with a first air inlet channel communicated with the through hole;
the upper part of the rotating shaft is arranged at the upper part of the through hole through the first bearing, and the lower part of the rotating shaft is arranged at the lower part of the through hole through the second bearing;
the sucker is arranged at the upper end of the rotating shaft, and the lower end of the rotating shaft is in transmission connection with the driver;
a second air inlet channel is formed in the rotating shaft, a first end of the second air inlet channel is communicated with the first air inlet channel, and a second end of the second air inlet channel is positioned at the first end of the rotating shaft;
the first annular seal is disposed between the first air intake passage and the first bearing;
the second annular seal is disposed between the first air intake passage and the second bearing.
2. The wafer holding apparatus of claim 1, wherein the through-hole is of cylindrical configuration.
3. The wafer holding apparatus according to claim 1, wherein a radial passage is provided along a radial direction of the rotation shaft;
an axial channel communicated with the radial channel is formed along the axial direction of the rotating shaft;
the radial passage and the axial passage constitute the second intake passage.
4. The wafer holding device of claim 3, wherein said radial channel is at the same elevation as said first air inlet channel.
5. The wafer holding apparatus of claim 1, wherein the second air inlet channel is L-shaped.
6. The wafer holding apparatus according to claim 1, further comprising: a spacer ring;
the spacer ring is sleeved on the rotating shaft and is positioned between the first annular sealing piece and the second annular sealing piece;
and a connecting channel used for communicating the first air inlet channel and the second air inlet channel is formed along the radial direction of the partition ring.
7. The wafer fixture of claim 6 wherein the first annular seal and/or the second annular seal is comprised of a magnetic fluid.
8. The wafer fixture of claim 6 wherein an upper portion of the first annular seal is in contact with the first bearing and a lower portion is in contact with the spacer ring;
the upper portion of the second annular seal member is in contact with the spacer ring, and the lower portion is in contact with the second bearing.
9. The wafer fixture of claim 6 wherein the spacer ring has an inner diameter that is the same as an inner diameter of the first annular seal and an outer diameter that is the same as an outer diameter of the first annular seal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223414676.4U CN219066791U (en) | 2022-12-20 | 2022-12-20 | Wafer fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223414676.4U CN219066791U (en) | 2022-12-20 | 2022-12-20 | Wafer fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219066791U true CN219066791U (en) | 2023-05-23 |
Family
ID=86374380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223414676.4U Active CN219066791U (en) | 2022-12-20 | 2022-12-20 | Wafer fixing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219066791U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117457562A (en) * | 2023-12-22 | 2024-01-26 | 苏州赛腾精密电子股份有限公司 | Automatic wafer positioning equipment |
-
2022
- 2022-12-20 CN CN202223414676.4U patent/CN219066791U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117457562A (en) * | 2023-12-22 | 2024-01-26 | 苏州赛腾精密电子股份有限公司 | Automatic wafer positioning equipment |
| CN117457562B (en) * | 2023-12-22 | 2024-02-23 | 苏州赛腾精密电子股份有限公司 | Automatic wafer positioning equipment |
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