JP5951532B2 - Deposition equipment - Google Patents

Description

  The present invention relates to a film forming apparatus.

  Conventionally, JP-A-2009-228050 is known as a technical document relating to a film forming apparatus. This publication describes a film forming apparatus for forming an object to be formed in a vacuum chamber. The film forming material is sublimated by a plasma beam to form a film on the object to be transported in the vacuum chamber. What to do is shown.

JP 2009-228050 A

  By the way, not all film forming materials sublimated in the vacuum chamber are formed on the film formation object, and there are some materials that adhere to the wall surface of the chamber before reaching the film formation object. If the film forming material adheres to the wall surface of the chamber, the use efficiency of the film forming material decreases, which is a problem.

  Accordingly, an object of the present invention is to provide a film forming apparatus capable of improving the utilization efficiency of film forming materials.

  In order to solve the above problems, the present invention is a film forming apparatus for forming a film on an object to be formed in a chamber, and the chamber is provided with a transfer unit for transferring the object to be formed and a film forming material. And a film forming unit between the conveying unit and the material installing unit. At least one of the pair of walls facing each other in the conveying direction of the film formation unit in the film forming unit includes a conveying unit. A first projecting portion is formed so that the end on the side projects outward, and the opening width on the transporting portion side of the film forming portion is larger than the opening width on the material installing portion side in the transporting direction of the film formation target. It is characterized by that.

  According to the film forming apparatus of the present invention, the overhanging portion is formed on the wall facing the conveying direction in the film forming portion, and the opening width on the conveying portion side of the film forming portion is larger than the opening width on the material installing portion side. Therefore, compared with the case where the chamber is configured as a rectangular parallelepiped and the opening widths on the transfer unit side and the material installation unit side are equal, even if the deposition material sublimated from the material installation unit of the chamber toward the transfer unit diffuses, The deposition material is less likely to adhere to the wall surface, and the utilization efficiency of the deposition material can be improved.

In the film forming unit of the film forming apparatus according to the present invention, overhang portions may be respectively formed on the pair of walls facing each other in the conveyance direction of the film formation target.
According to this film forming apparatus, it is possible to reduce the adhesion of the film forming material to both of the pair of walls facing each other in the transport direction, so that compared to the case where the overhang portion is formed only on one wall. Thus, it is possible to effectively improve the utilization efficiency of the film forming material.

In the film forming unit of the film forming apparatus according to the present invention, the second end of the transport unit side protrudes outward from at least one of the pair of walls facing each other in the width direction of the film formation orthogonal to the transport direction. An overhang is formed, and in the width direction of the film formation, the opening width on the conveyance section side of the film formation section is larger than the opening width on the material installation section side, and is perpendicular to the conveyance direction of the film formation object. In the film width direction, the opening width on the conveyance unit side may be larger than the opening width on the material installation unit side.
According to this film forming apparatus, it is possible to easily cope with the case where the deposition target is enlarged and widened, and the versatility of the film forming apparatus can be improved. Further, according to this film forming apparatus, it is possible to reduce the adhesion of the film forming material to the chamber wall surface in the width direction of the film to be formed, which contributes to improvement in the utilization efficiency of the film forming material.

In the film forming apparatus according to the present invention, the overhang portion may be formed in an L-shaped cross section including a first surface substantially parallel to the transport direction and a second surface substantially orthogonal to the transport direction.
According to this film forming apparatus, the overhanging portion is formed in an L-shaped cross section having a surface substantially parallel to the conveying direction, so that dust or the like that has entered the conveying portion following the film formation object overhangs. It is possible to avoid moving from the part to the material installation part and accumulating around the film forming material. This reduces the maintenance frequency of the equipment around the film forming material, thereby reducing the operating cost of the film forming apparatus.

In the film forming apparatus according to the present invention, an adhesion preventing plate may be attached to the wall of the chamber.
According to this film forming apparatus, the deposition plate suppresses the deposition / deposition of the film forming material on the wall of the chamber, so that the film forming material deposited on the wall of the chamber peels off and breaks into pieces. Can be prevented from colliding with the film formation surface of the object to be deposited and deteriorating the film quality. Further, in this film forming apparatus, cleaning of the inside of the chamber can be facilitated by periodically removing and removing the deposition plate from the chamber wall.

In the film forming apparatus according to the present invention, a plasma gun may be provided on the wall of the film forming unit.
This film forming apparatus is particularly useful when the RPD method is used, in which the distance from the film forming material to the film formation object is longer and the scattering of the film forming material is larger than in the sputtering method.

  According to the film forming apparatus of the present invention, the utilization efficiency of the film forming material can be improved.

It is a sectional side view which shows the film-forming apparatus which concerns on 1st Embodiment. It is a sectional side view along the YZ plane which shows the film-forming apparatus which concerns on 1st Embodiment. It is a sectional side view which shows the film-forming apparatus which concerns on 2nd Embodiment. It is a sectional side view which shows the film-forming apparatus provided with the conventional rectangular parallelepiped vacuum chamber.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[First Embodiment]
As shown in FIG. 1, the film forming apparatus 1 according to the first embodiment is arranged in a vacuum chamber 10 in a horizontal state so that the thickness direction of a substrate (film formation target) 11 is a vertical direction. This is a horizontal film forming apparatus to be conveyed. In the film forming apparatus 1, the substrate 11 is formed by an RPD (Reactive Plasma Deposition) method in which the film forming material Ma is irradiated with the plasma beam P.

  In each drawing, for convenience of explanation, an XYZ orthogonal coordinate system is shown. The XYZ orthogonal coordinate system is used in the following description with the Z-axis direction as the vertical direction, the X-axis direction as the transport direction of the substrate 11 orthogonal to the Z-axis direction, and the Y-axis direction as the direction orthogonal to the Z-axis direction and the X-axis direction. . Moreover, in each figure, the same code | symbol is attached | subjected to the same or an equivalent part, and the overlapping description is abbreviate | omitted.

  The film forming apparatus 1 of this embodiment includes a hearth mechanism 2, a transport mechanism 3, a wheel hearth 6, a plasma gun 7, a pressure adjustment device 8, and a vacuum chamber 10.

  The vacuum chamber 10 is divided into a transfer unit 10a to which the substrate 11 is transferred, a material installation unit 10b in which the film forming material Ma is installed, and a film formation unit 10c between the transfer unit 10a and the material installation unit 10b. . The vacuum chamber 10 is made of a conductive material and connected to a ground potential.

  The transport unit 10a of the vacuum chamber 10 is set along a predetermined transport direction (the arrow A direction in the drawing, the X-axis direction). A transport mechanism 3 for sending the substrate 11 in the transport direction A in a horizontally placed state is provided in the transport unit 10a.

  The transport mechanism 3 includes a plurality of transport rollers 15. The conveyance rollers 15 are arranged at equal intervals along the conveyance direction A, and convey the substrate 11 in the conveyance direction A while supporting the substrate 11. Examples of the substrate 11 that is a film formation target include a glass substrate, a silicon substrate, and a plastic substrate.

  A plasma port 10 d for receiving the plasma beam P irradiated from the plasma gun 7 into the vacuum chamber 10 is formed on the wall surface of the film forming portion 10 c of the vacuum chamber 10. The plasma gun 7 is of a pressure gradient type, and its main body is connected to the film forming chamber 10c through a plasma port 10d provided on the side wall of the film forming chamber 10c. The plasma beam P generated in the plasma gun 7 is emitted from the plasma port 10d into the film forming chamber 10c. The emission direction of the plasma beam P is controlled by a steering coil (not shown) provided in the plasma port 10d.

  The pressure adjusting device 8 is connected to the vacuum chamber 10 and adjusts the pressure in the vacuum chamber 10. The pressure adjustment device 8 includes, for example, a decompression unit such as a turbo molecular pump or a cryopump, and a pressure measurement unit that measures the pressure in the vacuum chamber 10.

  A hearth mechanism 2 for holding the film forming material Ma is provided in the material setting portion 10 b of the vacuum chamber 10. The hearth mechanism 2 is disposed below the transport mechanism 3 and is located below the plasma port 10d of the film forming unit 10c. The hearth mechanism 2 has a main hearth 9 that is a main anode that guides the plasma beam P emitted from the plasma gun 7 to the film forming material Ma or a main anode that guides the plasma beam P emitted from the plasma gun 7. . Since the main hearth 9 is kept at a positive potential with respect to the ground potential of the vacuum chamber 10, the main hearth 9 sucks the plasma beam P.

  The ring hearth 6 is an auxiliary anode having an electromagnet for guiding the plasma beam P. The ring hearth 6 is disposed around the main hearth 9 that holds the film forming material Ma. The ring hearth 6 has a coil 6a and a permanent magnet 6b, and enters the direction of the plasma beam P incident on the film forming material Ma or the main hearth 9 according to the magnitude of the current flowing through the coil 6a. The direction of the plasma beam P is controlled.

  Examples of the film forming material Ma include transparent conductive materials such as ITO and ZnO, and insulating sealing materials such as SiON. When the film forming material Ma is made of an insulating material, when the main hearth 9 is irradiated with the plasma beam P, the main hearth 9 is heated by the current from the plasma beam P, and the tip portion of the film forming material Ma evaporates. The film forming material particles Mb ionized by the plasma beam P diffuse into the film forming part 10 c of the vacuum chamber 10.

  When the film forming material Ma is made of a conductive material, when the main hearth 9 is irradiated with the plasma beam P, the plasma beam P is directly incident on the film forming material Ma, and the tip portion of the film forming material Ma is heated. The film-forming material particles Mb evaporated and ionized by the plasma beam P diffuse into the film-forming part 10 c of the vacuum chamber 10. The film forming material particles Mb diffused into the film forming unit 10c rise in the film forming unit 10c of the vacuum chamber 10 and adhere to the surface of the substrate 11 in the transport unit 10a.

  The film forming material Ma is a solid material formed into a cylindrical shape having a predetermined length, and a plurality of film forming materials Ma are filled into the hearth mechanism 2 at a time. Then, the film forming material Ma is placed under the hearth mechanism 2 according to the consumption of the film forming material Ma so that the front end portion of the film forming material Ma on the most advanced side maintains a predetermined positional relationship with the upper end of the main hearth 9. Extruded sequentially from side to side.

  In the vacuum chamber 10, a deposition preventing plate 20 is provided for preventing ionized film forming material particles Mb from adhering to the wall of the vacuum chamber 10. The deposition preventing plate 20 is made of, for example, a steel plate, and fine irregularities are formed on the surface by shot blasting or the like.

  The adhesion preventing plate 20 is attached to the inner surface of the wall of the vacuum chamber 10 with a bolt or the like. Although the deposition material particles Mb also adhere to the deposition preventive plate 20, the interior of the vacuum chamber 10 can be easily cleaned by periodically removing the deposition preventive plate 20 from the wall of the vacuum chamber 10 and replacing or cleaning it. can do.

  Next, the configuration of the vacuum chamber 10 will be described in detail. FIG. 2 is a side sectional view along the YZ plane of the film forming apparatus 1 according to the first embodiment. That is, FIG. 2 shows a side cross section of the film forming apparatus 1 as seen from a direction 90 degrees different from that in FIG.

  As shown in FIG. 1 and FIG. 2, the transfer unit 10 a of the vacuum chamber 10 is the uppermost part of the vacuum chamber 10. The transport unit 10 a has an internal space extending along the transport direction A, and the substrate 11 is transported through the internal space. Both ends in the transport direction A of the transport unit 10a are connected to a substrate take-in chamber and a substrate take-out chamber (both not shown) via gates, and the substrate 11 is carried in while maintaining the vacuum state in the vacuum chamber 10. Alternatively, it is configured so that it can be carried out.

  The material setting part 10 b is located at the lowest position in the vacuum chamber 10 and is a part including the bottom of the vacuum chamber 10. The upper end side of the material installation unit 10b communicates with the film forming unit 10c. The material installation part 10b includes, for example, a wall from the bottom of the vacuum chamber 10 to the upper end of the hearth mechanism 2.

  The film forming unit 10 c is a part between the transport unit 10 a and the material setting unit 10 b in the vacuum chamber 10. A plasma port 10d communicating with the plasma gun 7 is formed on the wall of the film forming unit 10c. 10 d of plasma openings are located in the material installation part 10b side (lower side) of the film-forming part 10c.

  On the wall of the film forming unit 10c, an overhanging part 21 is formed to project outward at the end (upper end) on the transport unit 10a side. The overhanging portion 21 has a tapered surface 21a that protrudes outward from the material installation portion 10b side toward the conveying portion 10a side.

  The overhang portion 21 is formed over the outer periphery of the film forming portion 10c. That is, the overhanging portion 21 is formed on each of the pair of walls facing each other in the transport direction A (X-axis direction) shown in FIG. 1 in the film forming portion 10c, and the substrate width direction B shown in FIG. It is formed in each of a pair of wall which opposes (Y-axis direction). The overhang portion 21 constitutes both the first overhang portion and the second overhang portion described in the claims. Further, the substrate width direction B corresponds to the film formation width direction described in the claims.

  In the film-forming part 10c in which the overhang part 21 is formed, the opening defined by the deposition preventing plate 20 attached to the end part (upper edge part) on the transport part 10a side is the end part on the material installation part 10b side. It is larger than the opening which the adhesion prevention board 20 attached to (the edge part of a lower end) defines. That is, as shown in FIG. 1, the opening width L1 on the transport unit 10a side in the transport direction A of the film forming unit 10c is formed larger than the opening width L2 on the material installation unit 10b side. 2, the opening width H1 on the transport unit 10a side in the substrate width direction B of the film forming unit 10c is formed larger than the opening width H2 on the material installation unit 10b side.

  The opening width L1 corresponds to the interval between the adhesion preventing plates 20 attached to the ends of the pair of walls facing in the transport direction A on the transport unit 10a side in the film forming unit 10c. The opening width H1 corresponds to the interval between the adhesion preventing plates 20 attached to the end portions of the pair of walls facing each other in the substrate width direction B on the transport unit 10a side in the film forming unit 10c. Similarly, the opening width L2 corresponds to the interval between the deposition prevention plates 20 attached to the end portions on the material installation portion 10b side of the pair of walls facing each other in the transport direction A in the film forming portion 10c. The opening width H <b> 2 corresponds to the interval between the deposition preventing plates 20 attached to the end portions of the pair of walls facing in the substrate width direction B on the material placement portion 10 b side in the film forming portion 10 c.

  In addition, when the deposition preventing plate 20 is not provided and the wall of the film forming unit 10c is exposed to the inside, the opening width L1 is equal to the transfer unit 10a side of the pair of walls facing in the transport direction A in the film forming unit 10c. This corresponds to the interval between the ends. The opening width H1 corresponds to the interval between the ends on the transport unit 10a side of the pair of walls facing each other in the substrate width direction B in the film forming unit 10c.

  The enlargement ratio of the opening width L1 to the opening width L2 can be set to 1.2 to 1.25, for example. It is desirable that the enlargement ratio of the opening width L1 with respect to the opening width L2 is larger. The enlargement ratio of the opening width H1 to the opening width H2 can be set to 1.2 to 1.25, for example. The film-forming material sublimates radially, and the concentration of particles is higher at the radial center side and lower at the outer side. Therefore, the enlargement ratio of the opening width H1 to the opening width H2 is appropriate from the viewpoint of ensuring film uniformity It is desirable to be within such a range.

  Next, the operation and effect of the film forming apparatus 1 according to the first embodiment configured as described above will be described.

  According to the film forming apparatus 1 according to the first embodiment, in the film forming unit 10c of the vacuum chamber 10, the opening widths L1 and H1 on the transfer unit 10a side are formed larger than the opening widths L2 and H2 on the material setting unit 10b side. Therefore, even if the ionized film forming material particles Mb rise while diffusing toward the transport unit 10a, adhesion of the film forming material particles Mb to the deposition preventing plate 20 can be reduced.

  Here, FIG. 4 is a side sectional view showing a film forming apparatus 51 having a conventional rectangular parallelepiped vacuum chamber 52. In the conventional film forming apparatus 51 shown in FIG. 4, since the vacuum chamber 52 is configured as a rectangular parallelepiped, the opening width Lz1 on the transport unit 52a side and the opening width Lz2 on the material setting unit 52b side in the film forming unit 52c are equal. . On the other hand, film-forming material particles Mb ionized by the plasma beam P rise from the film-forming material Ma installed in the material installation unit 52b while diffusing toward the substrate 11 of the transport unit 52a. Rz shown in FIG. 4 is a range (effective diffusion range) in which the film forming material particles Mb can reach the substrate 11 without being blocked by the wall surface (the deposition plate 20) of the vacuum chamber 52. Part of the film forming material particles Mb that have moved to the wall side beyond the effective diffusion range Rz adheres to the deposition preventing plate 20.

On the other hand, according to the film forming apparatus 1 shown in FIGS. 1 and 2, the overhang portions 21 are respectively formed on the pair of walls facing in the transport direction A in the film forming portion 10 c of the vacuum chamber 10. Since the opening width L1 on the transport unit 10a side is larger than the opening width L2 on the material installation unit 10b side, the effective diffusion range R is wider than the effective diffusion range Rz of the conventional film forming apparatus 51 shown in FIG. _A can be secured. Therefore, according to the film forming apparatus 1, it is possible to reduce the adhesion of the film forming material particles Mb to the wall (the deposition preventing plate 20) of the vacuum chamber 10 by securing a wider effective diffusion range _RA . Further, the utilization efficiency of the film forming material can be improved.

Further, according to the film forming apparatus 1, since the overhang portions 21 are formed on each of the pair of walls facing each other in the transport direction A in the film forming portion 10c, the overhang portions are formed only on one of the pair of walls. Compared with the case where 21 is formed, the effective diffusion range _RA can be efficiently expanded, and the utilization efficiency of the film forming material can be improved.

Further, according to the film forming apparatus 1, the overhang portions 21 are formed on the pair of walls facing each other in the substrate width direction B orthogonal to the transport direction A in the film forming portion 10c. compared with film-forming apparatus 51 comprising a rectangular vacuum chamber 52, it is possible to ensure a wider effective diffusion range R _B. Therefore, according to the film forming apparatus 1, by securing a wider effective diffusion range R _B, it is possible to reduce the adhesion of the film forming material particles Mb for the wall of the vacuum chamber 10 (deposition preventing plate 20) Further, the utilization efficiency of the film forming material can be improved. Moreover, according to the film forming apparatus 1, it is possible to widen the effective diffusion range R _B in the board width direction B, it is possible to the substrate 11 is also easily accommodate a case where a wide in size, formed The versatility of the membrane device can be improved.

  Further, in this film forming apparatus 1, by attaching the deposition preventing plate 20 to the wall of the vacuum chamber 10, the deposition preventing plate 20 suppresses the deposition / deposition of the deposition material on the wall of the vacuum chamber 10. The film-forming material deposited on the wall of the substrate is peeled off and broken into pieces, and it is possible to prevent the broken powder particles from colliding with the film-forming surface of the substrate 11 and deteriorating the film quality. In addition, in the film forming apparatus 1, the inside of the vacuum chamber 10 can be easily cleaned by periodically removing the deposition preventing plate 20 from the wall of the vacuum chamber 10 and replacing or cleaning it.

[Second Embodiment]
The film deposition apparatus 31 according to the second embodiment shown in FIG. 3 differs from the film deposition apparatus 1 according to the first embodiment in the shape of the overhang portion 41.

  Specifically, the film forming unit 10c of the film forming apparatus 31 according to the second embodiment includes an overhanging portion 41 that protrudes in an L-shaped cross section. The overhang part 41 is formed over the outer periphery of the film forming part 10c. That is, the overhanging portion 41 is formed on each of the pair of walls facing each other in the transport direction A in the film forming portion 10c, and each of the pair of walls facing each other in the substrate width direction B among the film forming portions 10c. Is formed. The overhang portion 41 constitutes both the first overhang portion and the second overhang portion described in the claims.

  The overhanging portion 41 has a cross-section L having a bottom surface (first surface) 41a substantially parallel to the transport direction A of the substrate 11 and a side surface (second surface) 41b substantially orthogonal to the transport direction A of the substrate 11. It is configured in a letter shape. Here, “substantially parallel to the transport direction A” means that it is not necessary to be strictly parallel to the transport direction A of the substrate 11, for example, and may be slightly larger or smaller. Further, “substantially orthogonal to the transport direction A” means, for example, that it does not have to be strictly orthogonal to the transport direction A of the substrate 11 and may be slightly larger or smaller.

An adhesion prevention plate 40 is attached to the bottom surface 41 a and the side surface 41 b of the overhang portion 41. In the vacuum chamber 10, the deposition plate 40 may not be attached to the bottom surface 41 a and the side surface 41 b that are the dead angle of the effective diffusion range _{RA because} the film forming material particles Mb are unlikely to adhere. In this case, the cost can be reduced by reducing the area of the deposition preventing plate 40.

  According to the film forming apparatus 31 according to the second embodiment configured as described above, the overhanging portion 41 is formed in an L-shaped cross section having a bottom surface 41 a substantially parallel to the transport direction A of the substrate 11. Thus, it is possible to avoid dust or the like that has entered the transfer unit 10a following the substrate 11 from the overhanging portion 41 and falling onto the material setting portion 10b and being accumulated around the film forming material Ma. This reduces the maintenance frequency around the hearth mechanism 2, so that the operating cost of the film forming apparatus 31 can be reduced.

  As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to embodiment mentioned above. For example, the film forming apparatus according to the present invention is not limited to the one used for the RPD method, and can be used for other ion plating methods and various film forming methods. Further, the chamber is not limited to a vacuum inside.

  Further, in the above embodiment, a so-called horizontal film forming apparatus in which the thickness direction of the substrate is a vertical direction has been described, but the present invention can also be applied to a so-called vertical film forming apparatus. In the vertical film forming apparatus, the substrate is transported in a state where the thickness direction of the substrate is the horizontal direction and the longitudinal direction or the width direction of the substrate is the vertical direction, and the film forming material is installed in the horizontal direction with respect to the substrate. .

  Moreover, the overhang | projection part may be formed only in one side of a pair of wall which opposes in the conveyance direction of a film-forming part. Similarly, the overhanging part may be formed only on one of the pair of walls facing each other in the substrate width direction of the film forming part. In addition, no overhanging part may be formed on each of the pair of walls facing each other in the substrate width direction of the film forming part. Further, in the first embodiment, an adhesion preventing plate may not be provided on the tapered surface of the overhanging portion, and an aspect in which no adhesion preventing plate is provided may be employed.

  DESCRIPTION OF SYMBOLS 1,31,51 ... Film-forming apparatus 2 ... Hearth mechanism 3 ... Conveyance mechanism 6 ... Wheel hearth 6a ... Coil 6b ... Permanent magnet 7 ... Plasma gun 8 ... Pressure regulator 9 ... Main hearth 10,52 ... Vacuum chamber 10a, 52a ... Conveying section 10b, 52b ... Material setting section 10c, 52c ... Film forming section 10d, 52d ... Plasma port 11 ... Substrate (film formation object) 15 ... Conveying roller 20 ... Casting plate 21, 41 ... Overhanging section (No. 1) 1 overhanging portion, second overhanging portion) 21a... Tapered surface 31... Film forming apparatus 40... Anti-adhesion plate 41a ... Bottom surface (first surface) 41b ... Side surface (second surface) A. ... substrate width direction (film formation object width direction) L1, H1, Lz1 ... opening width on transport side L2, H2, Lz2 ... opening width on material installation side Ma ... film formation material Mb ... film formation material particle P ... Plasma beam RA ... Effective expansion Range RB ... effective diffusion range Rz ... effective diffusion range

Claims (5)

A film forming apparatus for forming a film on an object to be formed in a chamber,
The chamber is
A transport unit for transporting the film-forming object;
A material installation part where a film forming material is installed;
The film forming unit between the transfer unit and the material installation unit,
At least one of the pair of walls facing each other in the transport direction of the film-forming object in the film-forming unit is formed with a first projecting portion in which an end on the transport unit side projects outward,
In the transport direction, wherein the opening width of the conveying portion of the film forming section rather larger than the opening width of the material placed side,
At least one of the pair of walls facing each other in the film formation width direction orthogonal to the transport direction in the film formation unit is formed with a second overhanging portion in which the end on the transport unit side projects outward. And
The film forming apparatus in which the opening width of the film forming unit on the transport unit side is larger than the opening width on the material installation unit side in the film forming object width direction .   2. The film forming apparatus according to claim 1, wherein the first projecting portion is formed on each of a pair of walls facing each other in the transport direction of the deposition object in the film forming portion. The component according to claim 1 or 2 , wherein the projecting portion is formed in an L-shaped cross section having a first surface substantially parallel to the transport direction and a second surface substantially orthogonal to the transport direction. Membrane device. The film-forming apparatus as described in any one of Claims 1-3 with which the deposition prevention board is attached to the wall of the said chamber. The film-forming apparatus as described in any one of Claims 1-4 with which the plasma gun is provided in the wall of the said film-forming part.

Images