JP2001050732A - Positioning state detecting device - Google Patents

Positioning state detecting device

Info

Publication number
JP2001050732A
JP2001050732A JP11223688A JP22368899A JP2001050732A JP 2001050732 A JP2001050732 A JP 2001050732A JP 11223688 A JP11223688 A JP 11223688A JP 22368899 A JP22368899 A JP 22368899A JP 2001050732 A JP2001050732 A JP 2001050732A
Authority
JP
Japan
Prior art keywords
board
substrate
suction
positioning
detecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP11223688A
Other languages
Japanese (ja)
Inventor
Haruo Noda
治男 野田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP11223688A priority Critical patent/JP2001050732A/en
Publication of JP2001050732A publication Critical patent/JP2001050732A/en
Abandoned legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a positioning state detecting device detecting a positioning state stably without restriction from the shape of a product, preventing a position displacement efficiently, and eliminating a manual correction and the like. SOLUTION: A board-engaging recessed part 14a which a board 11 with mounted electronic parts 12 engages is provided on a board-positioning block body 14. A boss part 14c is provided on each corner part of the board-engaging recessed part 14a, and has a flat top surface protruded upward from the bottom surface 14b. A suction opening 20a of a suction passage 20 sucked by a suction device 19 is opened on a center part of the individual boss parts 14c. A pressure sensor 21 detecting a pressure decrease in the suction passage 20 is provided. When the board 11 is engaged with the board-engaging recessed part 14a, and is positioned to a normal position on the individual boss parts 14c while the suction device 19 is under a suction operation, a bottom surface of the board 11 is sucked on a top surface of the individual boss parts 14c, the pressure in the suction passage 20 decreases, and the pressure sensor 21 detects the pressure decrease to report a set completion state of the board 11 to an operator or the like.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、製品の製造、検査
等において、位置決めが必要とされる設備における各種
部材の位置決め状態検出装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for detecting the positioning of various members in equipment that requires positioning in the manufacture and inspection of products.

【0002】[0002]

【従来の技術】例えば、図3および図4に示される如
く、上面側にリレーやコンデンサ等の各種の電子部品1
が実装された矩形板状の基板2の両側端縁部2aに、い
わゆるカードエッジタイプのコネクタ3をそれぞれ嵌合
装着する設備にあっては、基板2が所定位置に位置決め
載置される基板位置決めブロック体4を備えており、該
基板位置決めブロック体4の上面側には、上方より基板
2が嵌脱自在に嵌合されて前後左右方向の移動を規制す
る基板嵌合凹部4aが形成されている。
2. Description of the Related Art As shown in FIGS. 3 and 4, for example, various electronic components 1 such as relays and capacitors are provided on an upper surface side.
In a facility in which so-called card edge type connectors 3 are respectively fitted and mounted on both side edges 2a of a rectangular plate-shaped substrate 2 on which the substrate 2 is mounted, the substrate 2 is positioned and mounted at a predetermined position. A board fitting recess 4a is provided on the upper surface side of the board positioning block body 4. The board fitting recess 4a is formed on the upper surface side of the board positioning block body 4 to removably fit the board 2 from above and restricts movement in the front-rear and left-right directions. I have.

【0003】また、基板嵌合凹部4aの四隅コーナー部
に位置して、その底面4bより上方突出状に上面が平坦
に形成されたボス部4cが備えられており、各ボス部4
c上に基板2が載置されて支持されることにより、底面
4bより所定高さを有した状態で基板2が位置決め保持
されるように構成されている。
A boss 4c is provided at each of the four corners of the board fitting recess 4a, the boss 4c having a flat upper surface protruding above the bottom surface 4b.
The substrate 2 is configured to be positioned and held at a predetermined height from the bottom surface 4b by being placed and supported on the substrate c.

【0004】さらに、基板嵌合凹部4aに嵌合されて位
置決め載置された基板2のコネクタ3が嵌合装着される
端縁部2a位置に対応して、基板嵌合凹部4aを構成す
る基板位置決めブロック体4の周縁部両側が所定長さ切
欠状に構成されており、細長状のコネクタ3が位置決め
載置されるコネクタ載置部4dをそれぞれ構成してい
る。なお、この際、基板嵌合凹部4aの底面4bとコネ
クタ載置部4dの底面とは同一平面状態とされている。
[0004] Further, the board constituting the board fitting recess 4a corresponds to the position of the edge 2a where the connector 3 of the board 2 positioned and mounted in the board fitting recess 4a is fitted. Both sides of the peripheral edge portion of the positioning block 4 are formed into cutouts of a predetermined length, and each constitutes a connector mounting portion 4d on which the elongated connector 3 is positioned and mounted. At this time, the bottom surface 4b of the board fitting recess 4a and the bottom surface of the connector mounting portion 4d are in the same plane.

【0005】また、コネクタ載置部4dに位置決め載置
されたコネクタ3の基板位置決めブロック体4外側方に
対応して、それぞれエアシリンダ6により出退操作され
る押込操作体7が備えられ、押込操作体7の進出移動に
よりコネクタ3を基板2の端縁部2a方向に押動して嵌
合装着するように構成されている。
[0005] Further, corresponding to the outer side of the board positioning block body 4 of the connector 3 positioned and mounted on the connector mounting portion 4d, there are provided push operating bodies 7 which are respectively operated by an air cylinder 6 to be pushed out. The connector 3 is configured to be pushed in the direction of the edge 2a of the substrate 2 by the advancement movement of the operating body 7 and fitted and mounted.

【0006】さらに、図4に示される如く、投光器8a
と受光器8bとからなる位置決め検出センサ8が、基板
位置決めブロック体4上方の適宜高さ位置にそれぞれ配
置されており、基板嵌合凹部4aに嵌合されて載置され
た基板2上に実装された電子部品1等の構造物の最上端
を検出するかどうかで、基板2が所定位置に位置決め載
置されているかどうかを検出するように構成されてい
る。
[0006] Further, as shown in FIG.
And a photodetector 8b are arranged at appropriate heights above the board positioning block 4, and mounted on the board 2 fitted and mounted in the board fitting recess 4a. It is configured to detect whether or not the board 2 is positioned and mounted at a predetermined position by detecting whether or not the uppermost end of the structure such as the electronic component 1 is detected.

【0007】即ち、基板2が基板嵌合凹部4aの所定位
置に位置決め載置されていれば、位置決め検出センサ8
は電子部品1等の構造物を検出せず、また、基板2が浮
いた状態で基板嵌合凹部4aに嵌合されているセットミ
ス状態や、電子部品1の半田付け実装時の熱等により基
板2が僅かに(0.1〜0.2mm程度)反っている場
合等の位置決め載置不良状態にあっては、前記構造物を
検出すべく、前記所定位置の位置決め載置状態で前記構
造物の僅か上方を検出するように構成されており、位置
決め載置不良状態でのコネクタ3嵌合による基板2やコ
ネクタ3の破損等の損傷や、コネクタ3の半嵌合状態の
製品不良発生を有効に防止している。
That is, if the substrate 2 is positioned and mounted at a predetermined position in the substrate fitting recess 4a, the positioning detection sensor 8
Does not detect a structure such as the electronic component 1 or the like. Also, a mis-set state in which the substrate 2 is fitted in the board fitting concave portion 4a in a floating state, heat due to soldering and mounting of the electronic component 1, etc. In the case of the positioning / placement failure state where the substrate 2 is slightly warped (about 0.1 to 0.2 mm) or the like, the structure is placed in the positioning / placement state at the predetermined position in order to detect the structure. It is configured to detect a slightly upper part of the object, and to prevent damage such as breakage of the board 2 and the connector 3 due to the fitting of the connector 3 in the state of the poor positioning and placement, and occurrence of a product failure in the half-fitted state of the connector 3. Effectively prevent.

【0008】なお、基板位置決めブロック体4の基板嵌
合凹部4aを構成する四隅コーナー部の一部に向き決め
突部4eが備えられており、基板2の嵌合装着時の装着
向きの誤りを有効に防止するように構成されている。
[0008] Note that the projections 4e are provided at a part of the four corners of the board positioning recess 4a of the board positioning block 4, so that the mounting orientation of the board 2 at the time of fitting can be corrected. It is configured to prevent it effectively.

【0009】[0009]

【発明が解決しようとする課題】しかしながら、上記従
来の透過センサ方式による位置決め載置不良状態の検出
方法によれば、基板2上に、安定した形状、明らかに良
否が判定できる形状の適当な構造物がない場合には位置
決め検出センサ8により有効に検出できないという問題
があった。
However, according to the above-mentioned conventional method for detecting a positioning and mounting failure state using a transmission sensor system, an appropriate structure having a stable shape on the substrate 2 and a shape capable of clearly judging the quality. When there is no object, there is a problem that the positioning detection sensor 8 cannot effectively detect the object.

【0010】また、上記のような基板2の浮いた状態で
の位置決め載置不良状態を検出した場合には、その修正
を人手もしくは押し下げ設備等に頼っており、人件費や
設備費が余分にかさむという欠点もあった。
[0010] Further, when the positioning and placement failure state in the floating state of the substrate 2 as described above is detected, the correction is relied on manual or pushing down equipment or the like, resulting in additional labor and equipment costs. There was also the disadvantage of bulking.

【0011】そこで、本発明の課題は、製品の形状に制
約されず安定して位置決め状態の検出が可能で、位置ズ
レをも有効に防止し、人手による手直し等も不要とした
位置決め状態検出装置を提供することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a positioning state detecting device which can stably detect a positioning state without being limited by the shape of a product, effectively prevent a positional deviation, and does not require manual rework. The purpose is to provide.

【0012】[0012]

【課題を解決するための手段】上記の課題を解決するた
めの技術的手段は、載置部材が所定の位置に位置決め載
置されているかどうかを検出する位置決め状態検出装置
において、前記載置部材が面接触状態で位置決め載置さ
れる載置部に対応して、吸引装置により吸引される吸引
路の吸引口が備えられると共に、吸引路内における圧力
低下を検出する圧力センサが備えられてなる点にある。
According to another aspect of the present invention, there is provided a positioning state detecting device for detecting whether a mounting member is positioned and mounted at a predetermined position. Is provided with a suction port of a suction path to be suctioned by a suction device, and a pressure sensor for detecting a pressure drop in the suction path is provided corresponding to a mounting portion positioned and mounted in a surface contact state. On the point.

【0013】また、前記載置部材は電子部品が実装され
た基板からなり、前記載置部は、前記基板の底面側を複
数位置で支持する複数のボス部からなり、各ボス部の中
心部に前記吸引路の吸引口が開口形成されてなる構造と
してもよい。
The mounting member may include a substrate on which electronic components are mounted, and the mounting portion may include a plurality of bosses that support a bottom surface of the substrate at a plurality of positions, and a central portion of each boss. The suction port of the suction path may be formed with an opening.

【0014】[0014]

【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて説明すると、図1および図2において、11は
載置部材の一例としての矩形板状の基板で、前述同様、
上面側にリレーやコンデンサ等の各種の電子部品12が
適宜、実装された構造とされている。また、13は前記
基板11の両側端縁部11aに、それぞれ嵌合装着され
るいわゆるカードエッジタイプの細長状のコネクタ13
である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIGS. 1 and 2, reference numeral 11 denotes a rectangular plate-like substrate as an example of a mounting member.
Various electronic components 12 such as a relay and a capacitor are appropriately mounted on the upper surface side. Reference numeral 13 denotes a so-called card edge type elongated connector 13 which is fitted and mounted on both side edge portions 11a of the substrate 11, respectively.
It is.

【0015】そして、基板11の端縁部11aの各コネ
クタ13をそれぞれ嵌合装着する設備は、従来同様、基
板11が所定位置に位置決め載置される基板位置決めブ
ロック体14を備え、基板位置決めブロック体14の上
面側には、上方より基板11が嵌脱自在に嵌合されて前
後左右方向の移動を規制する基板嵌合凹部14aが形成
されている。
The equipment for fitting and mounting each connector 13 at the edge 11a of the substrate 11 includes a substrate positioning block 14 for positioning and mounting the substrate 11 at a predetermined position, as in the conventional case. On the upper surface side of the body 14, there is formed a substrate fitting recess 14a into which the substrate 11 is removably fitted from above and restricts movement in the front-rear and left-right directions.

【0016】また、基板嵌合凹部14aの四隅コーナー
部に位置して、その底面14bより上方突出状に上面が
平坦に形成された載置部としてのボス部14cがそれぞ
れ備えられており、各ボス部14c上に基板11が載置
されて支持されることにより、底面14bより所定高さ
を有した状態で基板11が位置決め保持されるように構
成されている。
Further, boss portions 14c are provided at four corners of the board fitting concave portion 14a as mounting portions each having a flat upper surface protruding upward from the bottom surface 14b. The substrate 11 is placed and supported on the boss 14c so that the substrate 11 is positioned and held at a predetermined height from the bottom surface 14b.

【0017】さらに、基板嵌合凹部14aに嵌合されて
位置決め載置された基板11のコネクタ13が嵌合装着
される端縁部11a位置に対応して、基板嵌合凹部14
aを構成する基板位置決めブロック体14の周縁部両側
が所定長さ切欠状に構成されており、コネクタ13が位
置決め載置されるコネクタ載置部14dをそれぞれ構成
している。なお、この際、基板嵌合凹部14aの底面1
4bとコネクタ載置部14dの底面とは同一平面状態と
されている。また、この際、基板嵌合凹部14aを構成
する平面視コ字状の部材は、基板位置決めブロック体1
4に一体に備えられた構造を示しているが、別体で構成
し、着脱自在に装着する構造であってもよい。
Further, the board fitting recess 14 corresponds to the position of the edge 11a where the connector 13 of the board 11 positioned and mounted by fitting into the board fitting recess 14a is fitted.
The both sides of the peripheral portion of the board positioning block body 14 that constitutes a are formed to have notches of a predetermined length, and each constitutes a connector mounting portion 14d on which the connector 13 is positioned and mounted. At this time, the bottom surface 1 of the board fitting concave portion 14a is
4b and the bottom surface of the connector mounting portion 14d are in the same plane state. At this time, the U-shaped member constituting the substrate fitting concave portion 14a is
4 shows a structure integrally provided, however, it may be configured as a separate body and detachably mounted.

【0018】さらに、コネクタ載置部14dに位置決め
載置されたコネクタ13の基板位置決めブロック体14
外側方に対応して、それぞれアクチュエータの一例とし
てのエアシリンダ16により出退操作される押込操作体
17が備えられ、押込操作体17の進出移動によりコネ
クタ13を基板11方向に押動して嵌合装着するように
構成されている。
Further, the board positioning block 14 of the connector 13 positioned and mounted on the connector mounting portion 14d.
A push operation body 17 is provided corresponding to the outer side, and is pushed and retracted by an air cylinder 16 as an example of an actuator, and the connector 13 is pushed toward the substrate 11 by the advance movement of the push operation body 17 to be fitted. It is configured to be attached together.

【0019】そして、本実施形態にあっては、特に、基
板位置決めブロック体14に、真空ポンプ等からなる吸
引装置19の吸引部に接続状態とされる吸引路20が形
成されており、吸引路20の吸引口20aは各ボス部1
4cの中心部にそれぞれ開口形成されている。
In this embodiment, in particular, the substrate positioning block 14 is provided with a suction path 20 which is connected to a suction section of a suction device 19 such as a vacuum pump. The suction port 20a of each boss 1
An opening is formed at the center of 4c.

【0020】また、吸引路20の途中には、吸引路20
内の圧力低下を検出するダイアフラム圧力計等の圧力セ
ンサ21が備えられており、圧力センサ21により吸引
路20内において所定の圧力低下を検出すれば、その検
出信号の出力を受けて正常の位置決め載置状態と判断
し、作業者等にセット完了状態をランプの点灯やセット
完了音の発音等により報知するように構成されている。
In the middle of the suction path 20, the suction path 20
A pressure sensor 21 such as a diaphragm pressure gauge for detecting a pressure drop in the inside is provided. If a predetermined pressure drop is detected in the suction passage 20 by the pressure sensor 21, a detection signal is output and normal positioning is performed. It is configured to determine the mounted state and notify the worker or the like of the set completion state by turning on a lamp, generating a set completion sound, or the like.

【0021】なお、従来同様、基板位置決めブロック体
14の基板嵌合凹部14aを構成する四隅コーナー部の
一部に向き決め突部14eが備えられており、基板11
の嵌合装着時の装着向きの誤りを有効に防止するように
構成されている。
As in the prior art, the projections 14e are provided at a part of the four corners of the board positioning recess 14a of the board positioning block 14, and the board 11 has
It is configured to effectively prevent a wrong mounting direction at the time of fitting mounting.

【0022】本実施形態は以上のように構成されてお
り、吸引装置19の吸引作動状態で、基板11が基板嵌
合凹部14aに嵌合されて各ボス部14c上の正規位置
に位置決め載置されると、基板11下面が各ボス部14
c上面に吸着状態とされて、吸引路20内に圧力低下が
生じ、この圧力低下を圧力センサ21が検出して基板1
1のセット完了状態を作業者等に報知する。そして、そ
の後のコネクタ13の嵌合装着工程が引き続き行われ
る。
In this embodiment, the substrate 11 is fitted into the substrate fitting recess 14a and positioned and placed at a regular position on each boss 14c in the suction operation state of the suction device 19 as described above. Then, the lower surface of the substrate 11 is
c, the surface of the substrate 1 is adsorbed, and a pressure drop occurs in the suction passage 20. The pressure sensor 21 detects the pressure drop and
The setting completion state of 1 is notified to an operator or the like. Then, the subsequent fitting and attaching process of the connector 13 is performed.

【0023】また、この位置決め載置状態において、基
板11が各ボス部14c上に吸引状態で保持されている
ため、基板11の位置ズレも有効に防止できる。
In this positioning and mounting state, since the substrate 11 is held in a sucked state on each boss portion 14c, the displacement of the substrate 11 can be effectively prevented.

【0024】さらに、この基板11の基板嵌合凹部14
a嵌合に際して、基板11がボス部14cより僅かに浮
き上がった状態や、基板11に僅かの反りが生じている
場合であっても、各ボス部14cの吸引口20aを通じ
た吸引装置19による吸引作用により基板11が強制的
に吸引されて吸着され、強制的に正規位置に位置決め載
置される力が作用し、人手による手直し等も不要とな
り、余分な人手配置や設備が不要となり、コスト低減が
図れる。
Further, the board fitting recess 14 of the board 11
a) Even when the board 11 is slightly lifted from the boss 14c or when the board 11 is slightly warped at the time of fitting, suction by the suction device 19 through the suction port 20a of each boss 14c. By the action, the substrate 11 is forcibly sucked and sucked, and a force for forcibly positioning and placing the board at the proper position is applied, thereby eliminating the need for manual reworking and the like, eliminating the need for extra manual arrangement and equipment, thereby reducing costs. Can be achieved.

【0025】一方、基板11が正規位置に位置決め載置
されていない場合、即ち、ボス部14cに当接せずに浮
いている状態にある場合には、吸引路20内の圧力低下
が所定値に達せず、圧力センサ21は圧力低下を検出せ
ず、セット完了状態を報知しない。
On the other hand, when the substrate 11 is not positioned and mounted at the proper position, that is, when the substrate 11 is in a floating state without contacting the boss portion 14c, the pressure drop in the suction passage 20 is reduced to a predetermined value. , The pressure sensor 21 does not detect a pressure drop and does not notify the set completion state.

【0026】以上のように、基板11下面がボス部14
c上面に吸着されているかどうかを圧力センサ21によ
り検出することにより位置決め状態を検出する方式であ
り、基板11に実装される電子部品1の形状に何ら左右
されることなく位置決め状態の検出が行える。
As described above, the lower surface of the substrate 11 is
(c) This is a method of detecting the positioning state by detecting whether or not the electronic component 1 is adsorbed on the upper surface by the pressure sensor 21. The positioning state can be detected regardless of the shape of the electronic component 1 mounted on the substrate 11. .

【0027】なお、上記実施形態において、基板11を
位置決め載置する場合を示しているが、基板11に限ら
ず、その他の各種製品や検査等における位置決め載置の
検出にも同様に適用できる。
In the above-described embodiment, the case where the substrate 11 is positioned and mounted is shown. However, the present invention is not limited to the substrate 11 and can be similarly applied to the detection of the positioning and mounting in other various products and inspections.

【0028】また、載置部としてのボス部14cを周囲
4個所に配置した構造を示しているが、載置部の数も周
囲4個所に限らず、さらには中央部に配置する構造であ
ってもよく、必要に応じて適宜、増減配置すればよい。
Further, although the structure in which the boss portions 14c as the mounting portions are arranged at four surrounding portions is shown, the number of the mounting portions is not limited to the four surrounding portions, and furthermore, the structure is arranged at the center portion. The number may be increased or decreased as needed.

【0029】[0029]

【発明の効果】以上のように、本発明の位置決め状態検
出装置によれば、載置部材が面接触状態で位置決め載置
される載置部に対応して、吸引装置により吸引される吸
引路の吸引口が備えられると共に、吸引路内における圧
力低下を検出する圧力センサが備えられてなるものであ
り、製品の形状に制約されず安定して位置決め状態の検
出が可能で、吸引作用により位置ズレを有効に防止する
と共に、人手による手直し等も不要となり、コスト低減
が図れるという利点がある。
As described above, according to the positioning state detecting device of the present invention, the suction path suctioned by the suction device corresponds to the mounting portion where the mounting member is positioned and mounted in a surface contact state. And a pressure sensor for detecting a pressure drop in the suction path, so that the positioning state can be detected stably without being restricted by the shape of the product, and the position is determined by the suction action. There is an advantage that the displacement can be effectively prevented, manual rework is not required, and the cost can be reduced.

【0030】また、載置部材は電子部品が実装された基
板からなり、載置部は、基板の底面側を複数位置で指示
する複数のボス部からなり、各ボス部の中心部に吸引路
の吸引口が開口形成されてなる構造とすれば、基板に僅
かの反りが生じている場合であっても強制的に吸着して
所定の位置に位置決め載置することができるという利点
がある。
The mounting member is composed of a substrate on which electronic components are mounted, and the mounting portion is composed of a plurality of bosses for pointing the bottom surface of the substrate at a plurality of positions. The structure in which the suction port is formed with an opening has an advantage that even if the substrate is slightly warped, the substrate can be forcibly sucked and positioned and placed at a predetermined position.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施形態を示す平面説明図である。FIG. 1 is an explanatory plan view showing an embodiment of the present invention.

【図2】同一部断面正面説明図である。FIG. 2 is a sectional front view of the same part.

【図3】従来例を示す平面説明図である。FIG. 3 is an explanatory plan view showing a conventional example.

【図4】同一部断面正面説明図である。FIG. 4 is a sectional front view of the same part.

【符号の説明】[Explanation of symbols]

11 基板 12 電子部品 13 コネクタ 14 基板位置決めブロック体 14a 基板嵌合凹部 14b 底面 14c ボス部 16 エアシリンダ 17 押込操作体 19 吸引装置 20 吸引路 20a 吸引口 21 圧力センサ DESCRIPTION OF SYMBOLS 11 Substrate 12 Electronic component 13 Connector 14 Substrate positioning block body 14a Substrate fitting recess 14b Bottom surface 14c Boss 16 Air cylinder 17 Push-in operation body 19 Suction device 20 Suction path 20a Suction port 21 Pressure sensor

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 載置部材が所定の位置に位置決め載置さ
れているかどうかを検出する位置決め状態検出装置にお
いて、 前記載置部材が面接触状態で位置決め載置される載置部
に対応して、吸引装置により吸引される吸引路の吸引口
が備えられると共に、吸引路内における圧力低下を検出
する圧力センサが備えられてなることを特徴とする位置
決め状態検出装置。
1. A positioning state detecting device for detecting whether or not a mounting member is positioned and mounted at a predetermined position, wherein the mounting member corresponds to a mounting portion on which the mounting member is positioned and mounted in a surface contact state. And a suction port for a suction path to be sucked by the suction device, and a pressure sensor for detecting a pressure drop in the suction path.
【請求項2】 前記載置部材は電子部品が実装された基
板からなり、前記載置部は、前記基板の底面側を複数位
置で支持する複数のボス部からなり、各ボス部の中心部
に前記吸引路の吸引口が開口形成されてなることを特徴
とする請求項1記載の位置決め状態検出装置。
2. The mounting member includes a substrate on which electronic components are mounted, and the mounting portion includes a plurality of bosses supporting a bottom surface of the substrate at a plurality of positions, and a central portion of each boss. 2. The positioning state detecting device according to claim 1, wherein a suction port of the suction path is formed in the opening.
JP11223688A 1999-08-06 1999-08-06 Positioning state detecting device Abandoned JP2001050732A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11223688A JP2001050732A (en) 1999-08-06 1999-08-06 Positioning state detecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11223688A JP2001050732A (en) 1999-08-06 1999-08-06 Positioning state detecting device

Publications (1)

Publication Number Publication Date
JP2001050732A true JP2001050732A (en) 2001-02-23

Family

ID=16802100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11223688A Abandoned JP2001050732A (en) 1999-08-06 1999-08-06 Positioning state detecting device

Country Status (1)

Country Link
JP (1) JP2001050732A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007035212A2 (en) * 2005-09-20 2007-03-29 Applied Materials, Inc. Substrate placement determination using substrate backside pressure measurement
JP2013033771A (en) * 2012-11-21 2013-02-14 Japan Automat Mach Co Ltd Terminal insertion device, wire harness manufacturing apparatus, goods detector, terminal insertion method, wire harness manufacturing method, and goods detection method
CN106558519A (en) * 2015-09-25 2017-04-05 盛美半导体设备(上海)有限公司 Whether wafer bearing device and inspection wafer place stable method
CN109830838A (en) * 2019-01-23 2019-05-31 嘉兴永瑞电子科技有限公司 Connector plug-in and pull-off device and electronic equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10203648A (en) * 1997-01-17 1998-08-04 Nikon Corp Conveyer and conveying method
JPH10270535A (en) * 1997-03-25 1998-10-09 Nikon Corp Moving stage device and circuit-device manufacture using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10203648A (en) * 1997-01-17 1998-08-04 Nikon Corp Conveyer and conveying method
JPH10270535A (en) * 1997-03-25 1998-10-09 Nikon Corp Moving stage device and circuit-device manufacture using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007035212A2 (en) * 2005-09-20 2007-03-29 Applied Materials, Inc. Substrate placement determination using substrate backside pressure measurement
WO2007035212A3 (en) * 2005-09-20 2009-05-07 Applied Materials Inc Substrate placement determination using substrate backside pressure measurement
JP2013033771A (en) * 2012-11-21 2013-02-14 Japan Automat Mach Co Ltd Terminal insertion device, wire harness manufacturing apparatus, goods detector, terminal insertion method, wire harness manufacturing method, and goods detection method
CN106558519A (en) * 2015-09-25 2017-04-05 盛美半导体设备(上海)有限公司 Whether wafer bearing device and inspection wafer place stable method
CN109830838A (en) * 2019-01-23 2019-05-31 嘉兴永瑞电子科技有限公司 Connector plug-in and pull-off device and electronic equipment

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Legal Events

Date Code Title Description
A762 Written abandonment of application

Free format text: JAPANESE INTERMEDIATE CODE: A762

Effective date: 20031226